WO2021000916A1 - 一种棱台基板led车灯 - Google Patents

一种棱台基板led车灯 Download PDF

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Publication number
WO2021000916A1
WO2021000916A1 PCT/CN2020/099927 CN2020099927W WO2021000916A1 WO 2021000916 A1 WO2021000916 A1 WO 2021000916A1 CN 2020099927 W CN2020099927 W CN 2020099927W WO 2021000916 A1 WO2021000916 A1 WO 2021000916A1
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WO
WIPO (PCT)
Prior art keywords
substrate
led
fluorescent glue
circuit board
led chip
Prior art date
Application number
PCT/CN2020/099927
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English (en)
French (fr)
Inventor
李宗涛
宋存江
汤勇
颜才满
赵启良
饶龙石
余彬海
Original Assignee
华南理工大学
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Application filed by 华南理工大学 filed Critical 华南理工大学
Priority to US17/613,855 priority Critical patent/US11808420B2/en
Publication of WO2021000916A1 publication Critical patent/WO2021000916A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/19—Attachment of light sources or lamp holders
    • F21S41/192—Details of lamp holders, terminals or connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/147—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device
    • F21S41/148—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device the main emission direction of the LED being perpendicular to the optical axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/151—Light emitting diodes [LED] arranged in one or more lines
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/176—Light sources where the light is generated by photoluminescent material spaced from a primary light generating element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/90—Light sources with three-dimensionally disposed light-generating elements on two opposite sides of supports or substrates

Definitions

  • the invention relates to the field of vehicle lighting, in particular to an LED vehicle lamp with a prism base substrate.
  • LED lamps have quickly replaced traditional lamps with the advantages of low power consumption, long life, high brightness, low heat, and environmental protection, becoming the most widely used modern lighting tools in the world.
  • LED lights have been widely used in the automotive industry, and a variety of LED automotive lights emerge in endlessly on the market.
  • Traditional LED car lights use a rectangular parallelepiped substrate to be installed at the lamp installation location.
  • the axis of the rectangular parallelepiped substrate is perpendicular to the direction of the car lights.
  • the circuit board is installed on the upper surface of the rectangular parallelepiped substrate.
  • the LED lamp beads include the LED chip and the substrate on the back of the chip. , Several LED chips are mounted on the circuit board on one side.
  • the light emitted from the LED chip to the lower side of the substrate is easily blocked by the upper surface of the rectangular parallelepiped substrate, and cannot be emitted to the side space below the rectangular parallelepiped substrate, which reduces the illumination range of the LED chip and the light distribution is not uniform. Affect the overall lighting effect of LED car lights.
  • the purpose of the present invention is to provide an LED car lamp with a prism base substrate, the light emitted from the LED chip to the lower side of the prism base substrate will not be blocked by the prism base substrate, and can be emitted to the edge.
  • the lighting range of the LED chip is large, the light distribution is relatively uniform, and the overall lighting effect of the LED car lamp is good.
  • An LED car lamp with an edge table substrate comprising a substrate, a circuit board and a number of LED chips.
  • the substrate is an edge table substrate, which is arranged on the axis of the LED lamp.
  • the width of the upper bottom surface of the edge table substrate is smaller than the width of the lower bottom surface.
  • the circuit board The axis is parallel to the axis of the table base plate, the width of the circuit board is smaller than the width of the upper bottom surface of the table base plate, the circuit board is mounted on the bottom surface of the table base plate, and a plurality of LED chips are mounted on the circuit board.
  • the circuit board includes a first circuit board and a second circuit board.
  • the first circuit board is mounted on the upper bottom surface of the ridge base substrate
  • the second circuit board is mounted on the lower bottom surface of the ridge base substrate
  • the plurality of LED chips includes a plurality of first LED chips.
  • a plurality of second LED chips, the plurality of first LED chips are respectively flip-mounted on the first circuit board, the back of the first LED chip is provided with a transparent first substrate, the first substrate is provided with a first phosphor, the first phosphor
  • the body covers the first LED chip and the first substrate; a plurality of second LED chips are respectively flip-mounted on the second circuit board, the back of the second LED chip is provided with a transparent second substrate, and the second substrate is provided with a second substrate.
  • the phosphor, the second phosphor encapsulates the second LED chip and the second substrate.
  • the first fluorescent body includes a first fluorescent glue, the first fluorescent glue covers the side of the first LED chip and the first substrate; the second fluorescent body includes a second fluorescent glue, and the second fluorescent glue covers the second LED chip Side and second substrate.
  • the first phosphor includes a first fluorescent glue lens and a first fluorescent glue, the first fluorescent glue covers the first substrate, and the first fluorescent glue lens covers the side of the first LED chip and the first fluorescent glue;
  • second The phosphor includes a second fluorescent glue and a second fluorescent glue lens, the second fluorescent glue covers the second substrate, the second fluorescent glue lens covers the side of the second LED chip and the second fluorescent glue, the first fluorescent glue lens and
  • the second fluorescent cement lenses are all spherical structures.
  • the first phosphor includes a first fluorescent cement lens, the first fluorescent cement lens covers the side of the first LED chip and the first substrate; the second phosphor includes a second fluorescent cement lens, and the second fluorescent cement lens covers The side of the second LED chip and the second substrate, the first fluorescent glue lens and the second fluorescent glue lens are all spherical structures.
  • a clamping position is provided on the upper part of the prism table substrate, the first fluorescent rubber lens is provided with a clamp, and the clamping position and the clamp are matched to connect the first fluorescent rubber lens and the prism table substrate.
  • the included angle between the side surface of the frustum substrate and the bottom surface of the frustum substrate is ⁇ , 25° ⁇ 75°.
  • first substrate and the second substrate are both sapphire substrates or silicon carbide substrates, and the prism table substrate is made of a high thermal conductivity substrate.
  • the axis of the prism base board coincides with the axis of the LED car lamp, and a plurality of LED chips are mounted on the circuit board in a single row.
  • a heat sink is connected to one end of the prism base substrate, the heat sink is arranged on one side of the LED chip, and a fan is arranged on one side of the heat sink.
  • the present invention has the following advantages:
  • the circuit board Since the width of the upper bottom surface of the prism table substrate is smaller than the width of the lower bottom surface, and the width of the circuit board is smaller than the width of the upper bottom surface of the prism table substrate, the circuit board is mounted on the upper bottom surface of the prism table substrate, and a number of LED chips are mounted on the circuit board.
  • the light emitted from the bottom side of the substrate will not be blocked by the prism base substrate and can be emitted to the side space below the prism base substrate.
  • the illumination range of the LED chip is large, the light distribution is relatively uniform, and the overall lighting effect of the LED car lamp is good.
  • FIG. 1 is a schematic diagram of the three-dimensional structure of Embodiment 1 of the present invention.
  • Fig. 2 is a schematic diagram of the planar structure of Embodiment 1 of the present invention.
  • FIG. 3 is a schematic diagram of the principle of Embodiment 1 of the present invention.
  • Fig. 4 is a schematic diagram of a planar structure of Embodiment 2 of the present invention.
  • FIG. 5 is a schematic diagram of a planar structure of Embodiment 3 of the present invention.
  • FIG. 6 is a schematic diagram of a planar structure of Embodiment 4 of the present invention.
  • FIG. 7 is a schematic diagram of the principle of the LED car lamp with a rectangular parallelepiped substrate in the prior art.
  • Figures 1 to 7 include:
  • an LED car lamp with a prismatic base plate includes a substrate, a circuit board and a number of LED chips.
  • the base plate is a prismatic table substrate 11, which is arranged on the axis of the LED lamp.
  • the width of the upper bottom surface of 11 is smaller than the width of the lower bottom surface
  • the axis of the circuit board is parallel to the axis of the bevel base plate 11, and the width of the circuit board is smaller than the width of the upper bottom surface of the bevel base plate 11.
  • the circuit board is mounted (such as soldered) on the upper bottom surface of the bevel base plate 11 (ie On the top surface of the prism table substrate 11), a number of LED chips are mounted on the circuit board.
  • the width of the upper bottom surface of the prism base substrate 11 is 1 mm larger than the width of the circuit board.
  • the circuit board is a high thermal conductivity circuit board.
  • the light emitted from the substrate LED chip 21 to the lower side of the rectangular parallelepiped substrate 2 is easily blocked by the upper surface of the rectangular parallelepiped substrate 2 after passing through the chip fluorescent glue 22, and cannot be emitted to the lower side of the rectangular parallelepiped substrate 2.
  • the partial space such as the space position shown by the circle in the figure, reduces the lighting range of the substrate LED chip 21, resulting in insufficient light distribution and affecting the overall lighting effect of the LED car light.
  • the light emitted from the LED chip to the bottom of the frustum substrate 11 side can be obliquely downward from the narrow upper bottom surface of the frustum substrate 11 Passing through, it will not be blocked by the prism base substrate 11, and can be emitted to the side space below the prism base substrate 11, such as the space shown by the circle in the figure.
  • the lighting range of the LED chip is larger and the light distribution is relatively uniform. The overall lighting effect is good.
  • the circuit board includes a first circuit board 12 and a second circuit board 14.
  • the first circuit board 12 is mounted on the upper bottom surface of the ridge base substrate 11, and the second circuit board 14 is mounted on the lower bottom surface of the ridge base substrate 11.
  • the LED chips include several A first LED chip 131 and a plurality of second LED chips 151. A plurality of first LED chips 131 are flip-chip mounted on the first circuit board 12 respectively.
  • the back of the first LED chip 131 is provided with a transparent first substrate, and the first substrate is provided with There is a first phosphor that covers the first LED chip 131 and the first substrate; a plurality of second LED chips 151 are flip-mounted on the second circuit board 14, and the back of the second LED chip 151 is provided with a transparent first substrate Two substrates, a second phosphor is provided on the second substrate, and the second phosphor covers the second LED chip 151 and the second substrate.
  • the first LED chip 131 on the upper bottom surface of the prism table substrate 11 is the main light source of the LED car lamp
  • the second LED chip 151 on the bottom bottom surface of the prism table substrate 11 is the secondary light source of the LED car lamp.
  • the brightness of the secondary light source is less than that of the main light source.
  • LED lamp beads usually include an LED chip and a substrate.
  • the flip-chip LED chip is used, that is, the first LED chip 131 is mounted on the first circuit board 12 with the electrode facing down, the first substrate is facing up, and the second LED chip 151 is mounted on the second circuit with the electrode facing up.
  • Board 14 the second substrate faces downwards, the light emitted by the LED chip can reach a wider space through the transparent substrate, thereby further enhancing the backward light output capability of the LED chip; Mounting the LED chip effectively supplements the light at the bottom of the prism base substrate 11, and makes the LED car light have a clear cut-off line of light and dark, and the lighting effect is better.
  • the first fluorescent body includes a first fluorescent glue 132, which covers the side of the first LED chip 131 and the first substrate; the second fluorescent body includes a second fluorescent glue 152, which covers the second fluorescent glue 152. Two sides of the LED chip 151 and the second substrate.
  • the first fluorescent glue 132 is sprayed on the top and side surfaces of the first LED chip 131, and the width of the first fluorescent glue 132 is slightly larger than the width of the first circuit board 12. Specifically, the first fluorescent glue 132 covers the ridge On the top of the substrate 11, the color temperature after white light packaging is 5500K.
  • the second fluorescent glue 152 is sprayed on the bottom and side surfaces of the second LED chip 151, and the width of the second fluorescent glue 152 is slightly larger than the width of the second circuit board 14. Specifically, the second fluorescent glue 152 covers the second circuit board 14.
  • the color temperature after white light packaging is 6500K. This arrangement can make the light path of the LED chip in all directions in the fluorescent glue layer consistent, with better spatial color uniformity, and the LED color temperature obtained in each direction is as close as possible.
  • the cone angle of the frustum substrate 11, that is, the angle between the side surface of the frustum substrate 11 and the bottom surface of the frustum substrate 11 is ⁇ , 25° ⁇ 75°.
  • the cone angle of the prism base substrate 11 mainly affects the rearward light emission of the top LED chip, and the increase of the cone angle is beneficial to strengthen the backward light emission ability.
  • the cone angle ⁇ 45°.
  • Both the first substrate and the second substrate are sapphire substrates or silicon carbide substrates, and the prism table substrate 11 is made of a high thermal conductivity substrate.
  • the thermal conductivity of aluminum alloy is only 200W/(m ⁇ K).
  • the thickness and thermal conductivity of the aluminum alloy in contact with the light source are both low, which causes the temperature and The temperature difference of the radiator 16 is large, and the temperature difference is generally 40-70° C., which cannot well dissipate heat, thereby affecting the use effect and service life of the LED car light.
  • the high thermal conductivity substrate is copper
  • the prism base substrate 11 is made of an all-copper base.
  • the thermal conductivity of copper is about 400W/(m ⁇ K), which has better heat transfer performance, can well dissipate heat, and prolong the service life of LED car lights.
  • the axis of the table base plate 11 coincides with the axis of the LED lamp, that is, the axis of the table base plate 11 coincides with the illumination direction of the LED lamp, the axis of the circuit board coincides with the axis of the table base plate 11, and a number of LED chips are mounted on the circuit board at intervals.
  • the axis of the rectangular parallelepiped substrate 2 is perpendicular to the illumination direction of the car lights, and the circuit board is mounted on the upper surface of the rectangular parallelepiped substrate 2.
  • a number of substrate LED chips 21 are mounted on the circuit board on one side. 21.
  • the positions of 21 on the rectangular parallelepiped substrate 2 are different.
  • the light they emit to the front of the car cannot be formed into the same straight beam, resulting in poor focusing effect of the car lights.
  • the center point of the light source is located in the middle of the LED lamp. If the thickness of the substrate is reduced, the heat dissipation effect of the LED lamp will be greatly reduced.
  • the axis of the prism table substrate 11 coincides with the axis of the LED car lamp
  • the circuit board axis coincides with the axis of the prism table substrate 11
  • a number of LED chips are mounted on the circuit board in a single row, which overcomes the inability of LED car lights in the prior art to realize LED
  • the center of the chip light source coincides with the focus of the LED car light, which leads to the shortcoming of inaccurate light control.
  • the center point of each LED chip light source is located on the axis of the LED car light. The light they emit to the front of the car is formed as a beam on the same straight line. The focusing effect is good, so that the LED car lights have a clear cut-off line.
  • a radiator 16 is connected to one end of the frustum substrate 11, and the radiator 16 is arranged on the side of the LED chip, so that the heat generated by the LED chip is quickly transferred to the radiator 16 through the frustum substrate 11.
  • a fan is provided on one side of the radiator 16 to enhance the heat dissipation effect.
  • the heat sink 16 is made of an all-copper base.
  • the first phosphor includes a first fluorescent glue lens 133 and a first fluorescent glue 132.
  • the first fluorescent glue 132 covers the first substrate, and the first fluorescent glue lens 133 covers the side of the first LED chip 131.
  • the second fluorescent body includes a second fluorescent glue 152 and a second fluorescent glue lens 153, the second fluorescent glue 152 covers the second substrate, and the second fluorescent glue lens 153 covers the second LED chip
  • the side of 151 and the second fluorescent glue 152, the first fluorescent glue lens 133 and the second fluorescent glue lens 153 are all spherical structures.
  • the first fluorescent glue 132 is sprayed on the top surface of the first LED chip 131, and the first fluorescent glue lens 133 is dot-coated on the first fluorescent glue 132, and the width of the first fluorescent glue lens 133 is slightly larger than the upper part of the mesa substrate 11. width. Specifically, the first fluorescent glue 132 covers the top of the mesa substrate 11, and the color temperature after white light packaging is 5500K.
  • a second fluorescent glue 152 is sprayed on the bottom and side surfaces of the second LED chip 151, and a second fluorescent glue lens 153 is dot-coated on the second fluorescent glue 152.
  • the width of the second fluorescent glue lens 153 is slightly larger than the width of the second circuit board 14.
  • the second fluorescent glue lens 153 covers the second circuit board 14, and the color temperature after white light packaging is 6500K.
  • the arrangement of the first fluorescent glue lens 133 and the second fluorescent glue lens 153 can save the amount of fluorescent glue, and the first fluorescent glue lens 133 and the second fluorescent glue lens 153 have a spherical structure, which can reduce the light on the interface between the fluorescent glue and the air.
  • the total reflection effect improves the light extraction rate of the LED chip and enhances the lighting effect of the LED car light.
  • the frustum substrate 11 is made of aluminum-based anisotropic heat pipe, the cone angle of the frustum substrate 11 is 37.5°, and the width of the upper bottom surface of the frustum substrate 11 is 1.5 mm larger than the width of the circuit board.
  • the radiator 16 is made of all aluminum base.
  • the first phosphor includes a first fluorescent cement lens 133, which covers the side of the first LED chip 131 and the first substrate; the second phosphor includes a second fluorescent cement lens 153
  • the second fluorescent glue lens 153 covers the side of the second LED chip 151 and the second substrate, and the first fluorescent glue lens 133 and the second fluorescent glue lens 153 are both spherical structures.
  • the first fluorescent glue lens 133 is sprayed on the top surface of the first LED chip 131, and the width of the first fluorescent glue lens 133 is slightly larger than the width of the upper part of the mesa substrate 11. Specifically, the first fluorescent glue lens 133 covers the top of the prism table substrate 11, and the color temperature after white light packaging is 5500K.
  • a second fluorescent glue lens 153 is sprayed on the bottom and side surfaces of the second LED chip 151, and the width of the second fluorescent glue lens 153 is slightly larger than the width of the second circuit board 14. Specifically, the second fluorescent glue lens 153 covers the second circuit board 14, and the color temperature after white light packaging is 6500K.
  • the arrangement of the first fluorescent glue lens 133 and the second fluorescent glue lens 153 can save the amount of fluorescent glue, and the first fluorescent glue lens 133 and the second fluorescent glue lens 153 have a spherical structure, which is beneficial to reduce the total reflection effect and increase the light output rate. Enhance the lighting effect of LED car lights, and the scattered fluorescent glue is not easy to concentrate, and the heat dissipation effect is good.
  • the frustum substrate 11 is made of all silver base, the cone angle of the frustum substrate 11 is 30°, and the width of the upper bottom surface of the frustum substrate 11 is 2 mm larger than the width of the circuit board.
  • the upper part of the prism table substrate 11 is provided with a clamping position
  • the first fluorescent glue lens 133 is provided with a clamp
  • the clamping position and the clamp are matched to connect the first fluorescent rubber lens 133 and the prismatic table substrate 11.
  • the clamping position and the clamping clip Through the arrangement of the clamping position and the clamping clip, the connection between the first phosphor and the prism base substrate 11 is more stable, and the first phosphor is not easy to fall off.
  • the clamping position on the upper part of the prism base substrate 11 is a step, and the clip of the first phosphor is clamped on the step.

Abstract

本发明涉及一种棱台基板LED车灯，包括基板、线路板和若干LED芯片，基板为棱台基板，棱台基板设于LED车灯轴线上，棱台基板的上底面宽度小于下底面宽度，线路板轴线与棱台基板轴线平行，线路板宽度小于棱台基板的上底面宽度，线路板安装于棱台基板上底面，若干LED芯片安装于线路板上。LED芯片向棱台基板侧下方射出的光线不会被棱台基板阻挡，能够出射到棱台基板以下侧部空间，LED芯片的照明范围较大，出光分布比较均匀，LED车灯的整体照明效果好。

Description

一种棱台基板LED车灯 技术领域
本发明涉及车用照明领域，特别是涉及一种棱台基板LED车灯。
背景技术
随着照明技术的发展，LED灯以其耗电小、寿命长、高亮度、低热量、环保等优点迅速取代传统灯具成为全球应用范围最广的现代照明工具。现在，LED灯已经普及应用到汽车行业，市场上各种各样的LED汽车灯层出不穷。
传统的LED车灯采用的是长方体基板设在车灯安装处，长方体基板轴线垂直于车灯的照射方向，线路板安装在长方体基板的上表面，LED灯珠包括LED芯片和芯片背面的衬底，若干个LED芯片单面贴装于线路板上。
其往往存在以下的技术问题：LED芯片向基板侧下方射出的光线容易被长方体基板的上表面阻挡，无法出射到长方体基板以下侧部空间，导致缩小了LED芯片的照明范围，出光分布不够均匀，影响了LED车灯的整体照明效果。
发明内容
针对现有技术中存在的技术问题，本发明的目的是：提供一种棱台基板LED车灯，其LED芯片向棱台基板侧下方射出的光线不会被棱台基板阻挡，能够出射到棱台基板以下侧部空间，LED芯片的照明范围较大，出光分布比较均匀，LED车灯的整体照明效果好。
为了达到上述目的，本发明采用如下技术方案：
一种棱台基板LED车灯，包括基板、线路板和若干LED芯片，基板为棱台基板，棱台基板设于LED车灯轴线上，棱台基板的上底面宽度小于下底面宽度，线路板轴线与棱台基板轴线平行，线路板宽度小于棱台基板的上底面宽度，线路板安装于棱台基板上底面，若干LED芯片安装于线路板上。
进一步，线路板包括第一线路板和第二线路板，第一线路板安装于棱 台基板的上底面，第二线路板安装于棱台基板的下底面，若干LED芯片包括若干第一LED芯片和若干第二LED芯片，若干第一LED芯片分别倒装于第一线路板，第一LED芯片背部设有透明的第一衬底，第一衬底上设有第一荧光体，第一荧光体包覆第一LED芯片和第一衬底；若干第二LED芯片分别倒装于第二线路板，第二LED芯片背部设有透明的第二衬底，第二衬底上设有第二荧光体，第二荧光体包覆第二LED芯片和第二衬底。
进一步，第一荧光体包括第一荧光胶，第一荧光胶包覆第一LED芯片侧部和第一衬底；第二荧光体包括第二荧光胶，第二荧光胶包覆第二LED芯片侧部和第二衬底。
进一步，第一荧光体包括第一荧光胶透镜和第一荧光胶，第一荧光胶包覆第一衬底，第一荧光胶透镜包覆第一LED芯片侧部和第一荧光胶；第二荧光体包括第二荧光胶和第二荧光胶透镜，第二荧光胶包覆第二衬底，第二荧光胶透镜包覆第二LED芯片侧部和第二荧光胶，第一荧光胶透镜和第二荧光胶透镜均为球形结构。
进一步，第一荧光体包括第一荧光胶透镜，第一荧光胶透镜包覆第一LED芯片侧部和第一衬底；第二荧光体包括第二荧光胶透镜，第二荧光胶透镜包覆第二LED芯片侧部和第二衬底，第一荧光胶透镜和第二荧光胶透镜均为球形结构。
进一步，棱台基板上部设有卡位，第一荧光胶透镜设有卡夹，卡位与卡夹配合连接第一荧光胶透镜与棱台基板。
进一步，棱台基板的侧面与棱台基板的下底面的夹角为α，25°≤α≤75°。
进一步，第一衬底和第二衬底均为蓝宝石衬底或碳化硅衬底，棱台基板由高导热基材制成。
进一步，棱台基板轴线与LED车灯轴线重合，若干LED芯片单列安装于线路板。
进一步，棱台基板的一端连接有散热器，散热器设于LED芯片一侧，散热器一侧设有风扇。
总的说来，本发明具有如下优点：
由于棱台基板的上底面宽度小于下底面宽度，线路板宽度小于棱台基 板的上底面宽度，线路板安装于棱台基板上底面，若干LED芯片安装于线路板上，因此LED芯片向棱台基板侧下方射出的光线不会被棱台基板阻挡，能够出射到棱台基板以下侧部空间，LED芯片的照明范围较大，出光分布比较均匀，LED车灯的整体照明效果好。
附图说明
图1为本发明实施例1的立体结构示意图。
图2为本发明实施例1的平面结构示意图。
图3为本发明实施例1的原理示意图。
图4为本发明实施例2的平面结构示意图。
图5为本发明实施例3的平面结构示意图。
图6为本发明实施例4的平面结构示意图。
图7为现有技术长方体基板LED车灯的原理示意图。
其中图1～图7中包括有：
11——棱台基板、12——第一线路板、131——第一LED芯片、132——第一荧光胶、133——第一荧光胶透镜、14——第二线路板、151——第二LED芯片、152——第二荧光胶、153——第二荧光胶透镜、16——散热器、2——长方体基板、21——基板LED芯片、22——芯片荧光胶。
具体实施方式
参见图1、图2和图3，下面来对本发明做进一步详细的说明。
实施例1
如图1～图2所示，一种棱台基板LED车灯，包括基板、线路板和若干LED芯片，基板为棱台基板11，棱台基板11设于LED车灯轴线上，棱台基板11的上底面宽度小于下底面宽度，线路板轴线与棱台基板11轴线平行，线路板宽度小于棱台基板11的上底面宽度，线路板安装(比如焊接)于棱台基板11上底面(即棱台基板11顶面)，若干LED芯片安装于线路板上。本实施例中，棱台基板11的上底面宽度比线路板宽度大1mm。线路板为高导热线路板。
现有技术中，如图7箭头所示，基板LED芯片21向长方体基板2侧下方射出的光线，经过芯片荧光胶22后容易被长方体基板2的上表面阻挡，无法出射到长方体基板2以下侧部空间，比如图示圆圈所示 空间位置，从而缩小了基板LED芯片21的照明范围，导致出光分布不够均匀，影响了LED车灯的整体照明效果。
本实施例中，由于棱台基板11上底面小于下底面，如图3箭头所示，LED芯片向棱台基板11侧下方射出的光线，能够从棱台基板11较窄的上底面斜向下穿过，不会被棱台基板11阻挡，能够出射到棱台基板11以下侧部空间，比如图示圆圈所示空间位置，LED芯片的照明范围较大，出光分布比较均匀，LED车灯的整体照明效果好。
线路板包括第一线路板12和第二线路板14，第一线路板12安装于棱台基板11的上底面，第二线路板14安装于棱台基板11的下底面，若干LED芯片包括若干第一LED芯片131和若干第二LED芯片151，若干第一LED芯片131分别倒装于第一线路板12，第一LED芯片131背部设有透明的第一衬底，第一衬底上设有第一荧光体，第一荧光体包覆第一LED芯片131和第一衬底；若干第二LED芯片151分别倒装于第二线路板14，第二LED芯片151背部设有透明的第二衬底，第二衬底上设有第二荧光体，第二荧光体包覆第二LED芯片151和第二衬底。
本实施例中，棱台基板11上底面的第一LED芯片131为LED车灯的主要光源，棱台基板11下底面的第二LED芯片151为LED车灯的次要光源。LED车灯工作时，次要光源的亮度小于主要光源亮度。
LED灯珠通常包括LED芯片和衬底。本实施例采用倒装LED芯片的方式，即第一LED芯片131电极朝下贴装在第一线路板12，第一衬底朝上，第二LED芯片151电极朝上贴装在第二线路板14，第二衬底朝下，LED芯片出射的光线通过透明衬底能够到达更宽的空间范围，从而进一步加强了LED芯片的后向出光能力；通过在棱台基板11上下两个底面分别贴装LED芯片，有效地补充了棱台基板11底部光线，并且使LED车灯有明显的明暗截止线，照明效果更好。
第一荧光体包括第一荧光胶132，第一荧光胶132包覆第一LED芯片131侧部和第一衬底；第二荧光体包括第二荧光胶152，第二荧光胶152包覆第二LED芯片151侧部和第二衬底。
本实施例中在第一LED芯片131顶面及侧面喷涂第一荧光胶 132，且第一荧光胶132宽度略大于第一线路板12宽度，具体地，第一荧光胶132包覆了棱台基板11顶部，白光封装后色温为5500K。在第二LED芯片151底面及侧面喷涂第二荧光胶152，且第二荧光胶152的宽度略大于第二线路板14宽度，具体地，第二荧光胶152包覆了第二线路板14，白光封装后色温为6500K。这样设置可以使得LED芯片各个方向的光线在荧光胶层光程一致，具有较佳的空间颜色均匀性，各个方向得到的LED色温尽量接近。
棱台基板11的锥角，即棱台基板11的侧面与棱台基板11的下底面的夹角为α，25°≤α≤75°。棱台基板11的锥角主要影响着顶部LED芯片的后向出光，锥角增大有利于强化后向出光能力。本发明实施例中，锥角α＝45°。
第一衬底和第二衬底均为蓝宝石衬底或碳化硅衬底，棱台基板11由高导热基材制成。
传统LED车灯基板多为铝基板，而铝合金的导热系数仅为200W/(m·K)，在实际应用中由于与光源接触的铝合金厚度和导热系数都偏低，造成了光源温度与散热器16温差大，温差一般为40-70℃，不能很好地将热量导出，从而影响LED车灯的使用效果与使用寿命。本实施例中，高导热基材为铜，棱台基板11为全铜基制成。铜的导热系数大约为400W/(m·K)，具有更好的传热性能，能够很好地将热量导出，延长了LED车灯的使用寿命。
棱台基板11轴线与LED车灯轴线重合，即棱台基板11轴线与LED车灯的照射方向重合，线路板轴线与棱台基板11轴线重合，若干LED芯片单列间隔安装于线路板。
现有技术中，长方体基板2轴线垂直于车灯的照射方向，将线路板安装在长方体基板2的上表面，若干个基板LED芯片21单面贴装于线路板上，由于每个基板LED芯片21在长方体基板2上的位置各不相同，它们向车前方发射的光线无法形成为同一条直线上的光束，导致车灯的聚焦效果不佳，即使缩小基板厚度也无法使各基板LED芯片21光源中心点位于LED车灯正中，如果缩小基板厚度还会大大降低LED车灯散热效果。
本实施例采用棱台基板11轴线与LED车灯轴线重合，线路板轴线与棱台基板11轴线重合，若干LED芯片单列安装于线路板的方式，克服了现有技术中LED车灯无法实现LED芯片光源中心与LED车灯焦点重合导致无法准确控光的缺点，使得各LED芯片光源中心点位于LED车灯轴线上，它们向车前方发射的光线形成为同一条直线上的光束，车灯的聚焦效果良好，使LED车灯有明显的明暗截止线。
棱台基板11的一端连接有散热器16，散热器16设于LED芯片一侧，使LED芯片产生的热量通过棱台基板11迅速传到散热器16。散热器16一侧设有风扇，以加强散热效果。本发明实施例中，散热器16为全铜基制成。
实施例2
本实施例与实施例1结构大致相同，不同之处在于：
如图4所示，第一荧光体包括第一荧光胶透镜133和第一荧光胶132，第一荧光胶132包覆第一衬底，第一荧光胶透镜133包覆第一LED芯片131侧部和第一荧光胶132；第二荧光体包括第二荧光胶152和第二荧光胶透镜153，第二荧光胶152包覆第二衬底，第二荧光胶透镜153包覆第二LED芯片151侧部和第二荧光胶152，第一荧光胶透镜133和第二荧光胶透镜153均为球形结构。
本实施例中，在第一LED芯片131顶面喷涂第一荧光胶132，第一荧光胶132上点涂第一荧光胶透镜133，且第一荧光胶透镜133宽度略大于棱台基板11上部宽度。具体地，第一荧光胶132包覆了棱台基板11顶部，白光封装后色温为5500K。在第二LED芯片151底面及侧面喷涂第二荧光胶152，第二荧光胶152上点涂第二荧光胶透镜153，且第二荧光胶透镜153的宽度略大于第二线路板14宽度。具体地，第二荧光胶透镜153包覆了第二线路板14，白光封装后色温为6500K。第一荧光胶透镜133和第二荧光胶透镜153的设置，可以节省荧光胶用量，并且第一荧光胶透镜133和第二荧光胶透镜153为球形结构，可以降低光线在荧光胶与空气界面的全反射效应，提高LED芯片出光率，增强LED车灯的照明效果。
本发明实施例中，棱台基板11为铝基异性热管制成，棱台基板11 锥角为37.5°，棱台基板11的上底面宽度比线路板宽度大1.5mm。散热器16为全铝基制成。
实施例3
本实施例与实施例1结构大致相同，不同之处在于：
如图5所示，第一荧光体包括第一荧光胶透镜133，第一荧光胶透镜133包覆第一LED芯片131侧部和第一衬底；第二荧光体包括第二荧光胶透镜153，第二荧光胶透镜153包覆第二LED芯片151侧部和第二衬底，第一荧光胶透镜133和第二荧光胶透镜153均为球形结构。
本实施例中，在第一LED芯片131顶面喷涂第一荧光胶透镜133，且第一荧光胶透镜133宽度略大于棱台基板11上部宽度。具体地，第一荧光胶透镜133包覆了棱台基板11顶部，白光封装后色温为5500K。在第二LED芯片151底面及侧面喷涂第二荧光胶透镜153，且第二荧光胶透镜153的宽度略大于第二线路板14宽度。具体地，第二荧光胶透镜153包覆了第二线路板14，白光封装后色温为6500K。
第一荧光胶透镜133和第二荧光胶透镜153的设置，可以节省荧光胶用量，并且第一荧光胶透镜133和第二荧光胶透镜153为球形结构，有利于降低全反射效应提高出光率，增强LED车灯的照明效果，且分散的荧光胶热量不易集中，散热效果好。
本实施例中，棱台基板11为全银基制成，棱台基板11锥角为30°，棱台基板11的上底面宽度比线路板宽度大2mm。
实施例4
本实施例与实施例3结构大致相同，不同之处在于：
如图6所示，棱台基板11上部设有卡位，第一荧光胶透镜133设有卡夹，卡位与卡夹配合连接第一荧光胶透镜133与棱台基板11。
通过卡位与卡夹的设置，使得第一荧光体与棱台基板11的连接更加稳固，第一荧光体不容易脱落。具体地，棱台基板11上部的卡位为台阶，第一荧光体的卡夹卡在台阶上。
上述实施例为本发明较佳的实施方式，但本发明的实施方式并不受上述实施例的限制，其他的任何未背离本发明的精神实质与原理下所作的改变、修饰、替代、组合、简化，均应为等效的置换方式，都包含在本发明 的保护范围之内。

Claims (10)

  1. 一种棱台基板LED车灯，包括基板、线路板和若干LED芯片，其特征在于：基板为棱台基板，棱台基板设于LED车灯轴线上，棱台基板的上底面宽度小于下底面宽度，线路板轴线与棱台基板轴线平行，线路板宽度小于棱台基板的上底面宽度，线路板安装于棱台基板上底面，若干LED芯片安装于线路板上。
  2. 按照权利要求1述的一种棱台基板LED车灯，其特征在于：线路板包括第一线路板和第二线路板，第一线路板安装于棱台基板的上底面，第二线路板安装于棱台基板的下底面，若干LED芯片包括若干第一LED芯片和若干第二LED芯片，若干第一LED芯片分别倒装于第一线路板，第一LED芯片背部设有透明的第一衬底，第一衬底上设有第一荧光体，第一荧光体包覆第一LED芯片和第一衬底；若干第二LED芯片分别倒装于第二线路板，第二LED芯片背部设有透明的第二衬底，第二衬底上设有第二荧光体，第二荧光体包覆第二LED芯片和第二衬底。
  3. 按照权利要求2所述的一种棱台基板LED车灯，其特征在于：第一荧光体包括第一荧光胶，第一荧光胶包覆第一LED芯片侧部和第一衬底；第二荧光体包括第二荧光胶，第二荧光胶包覆第二LED芯片侧部和第二衬底。
  4. 按照权利要求2所述的一种棱台基板LED车灯，其特征在于：第一荧光体包括第一荧光胶透镜和第一荧光胶，第一荧光胶包覆第一衬底，第一荧光胶透镜包覆第一LED芯片侧部和第一荧光胶；第二荧光体包括第二荧光胶和第二荧光胶透镜，第二荧光胶包覆第二衬底，第二荧光胶透镜包覆第二LED芯片侧部和第二荧光胶，第一荧光胶透镜和第二荧光胶透镜均为球形结构。
  5. 按照权利要求2所述的一种棱台基板LED车灯，其特征在于：第一荧光体包括第一荧光胶透镜，第一荧光胶透镜包覆第一LED芯片侧部和第一衬底；第二荧光体包括第二荧光胶透镜，第二荧光胶透镜包覆第二LED芯片侧部和第二衬底，第一荧光胶透镜和第二荧光胶透镜均为球形结构。
  6. 按照权利要求5所述的一种棱台基板LED车灯，其特征在于：棱台基板上部设有卡位，第一荧光胶透镜设有卡夹，卡位与卡夹配合连接第一荧光胶透镜与棱台基板。
  7. 按照权利要求2所述的一种棱台基板LED车灯，其特征在于：棱台基板的侧面与棱台基板的下底面的夹角为α，25°≤α≤75°。
  8. 按照权利要求2所述的一种棱台基板LED车灯，其特征在于：第一衬底和第二衬底均为蓝宝石衬底或碳化硅衬底，棱台基板由高导热基材制成。
  9. 按照权利要求1所述的一种棱台基板LED车灯，其特征在于：棱台基板轴线与LED车灯轴线重合，若干LED芯片单列安装于线路板。
  10. 按照权利要求1～9中任意一项所述的一种棱台基板LED车灯，其特征在于：棱台基板的一端连接有散热器，散热器设于LED芯片一侧，散热器一侧设有风扇。
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