WO2020258648A1 - 一种透明导电膜及其制作方法 - Google Patents

一种透明导电膜及其制作方法 Download PDF

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WO2020258648A1
WO2020258648A1 PCT/CN2019/117167 CN2019117167W WO2020258648A1 WO 2020258648 A1 WO2020258648 A1 WO 2020258648A1 CN 2019117167 W CN2019117167 W CN 2019117167W WO 2020258648 A1 WO2020258648 A1 WO 2020258648A1
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optical adhesive
layer
film
transparent conductive
adhesive layer
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English (en)
French (fr)
Inventor
基亮亮
刘麟跃
周小红
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Ivtouch Co Ltd
Suzhou University
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Ivtouch Co Ltd
Suzhou University
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means

Definitions

  • the present invention relates to the technical field of conductive films, in particular to a transparent conductive film and a manufacturing method thereof.
  • the existing metal mesh conductive film generally needs to be processed on a layer of substrate, and the substrate is generally glass, polymer polyester (PET, PC, PMMA, etc.).
  • a conductive film is prepared by embossing a groove on a substrate and then filled with a conductive material, and a conductive film is also prepared by ink-jet printing a conductive material on the substrate.
  • These conductive films almost always need to be laminated with optical glue during the use process, so bubbles are likely to appear between the conductive film and the bonded product during the bonding process, the bonding effect is not good, and the product quality is not high; At the same time, it is more difficult to fit, resulting in increased costs.
  • the purpose of the present invention is to provide a transparent conductive film that can be easily attached and a manufacturing method thereof.
  • the present invention provides a transparent conductive film, comprising a photoresist layer, a base film and an optical adhesive layer.
  • the photoresist layer is arranged on the surface of the optical adhesive layer, and the base film is arranged on the optical adhesive layer away from the optical adhesive layer.
  • On the other side surface of the photoresist layer a groove is formed on the surface of the photoresist layer away from the optical adhesive layer, and a conductive layer is arranged in the groove.
  • the groove has a width of 1-20 ⁇ m and a depth of 1-15 ⁇ m.
  • the thickness of the optical adhesive layer is 50-250 ⁇ m, and the light transmittance of the optical adhesive layer is more than 95%.
  • the present invention also provides a manufacturing method of the transparent conductive film, the method including:
  • An optical adhesive film including an optical adhesive layer and a base film, and a photo adhesive layer with grooves is prepared on the optical adhesive film;
  • a conductive material is filled in the groove to form a conductive layer.
  • the base film in the step of providing an optical adhesive film, is pressed on the surface of one side of the optical adhesive layer, so that the base film and the optical adhesive layer are bonded together Forming the optical adhesive film.
  • a photoresist layer is coated on the surface of the optical adhesive layer away from the base film, and a mold is used to imprint the photoresist The groove is formed on the layer, and the mold is released after curing, and the photoresist layer with grooves is formed on the optical adhesive film.
  • the present invention also provides a manufacturing method of the transparent conductive film, the method including:
  • an optical adhesive film including an optical adhesive layer and a base film, and pressing the optical adhesive film on the optical adhesive layer;
  • a conductive material is filled in the groove to form a conductive layer.
  • the base film in the step of providing an optical adhesive film, is pressed on the surface of one side of the optical adhesive layer, so that the base film and the optical adhesive layer are bonded together Forming the optical adhesive film.
  • the process of forming the groove is: forming the groove on the photoresist layer by using a mold; in the step, pressing the optical adhesive film on the photoresist layer After the mounting, before filling the conductive material in the groove to form the conductive layer, a demolding step is further included, and the demolding step is specifically: manually removing the mold from the photoresist layer.
  • the photoresist layer in the step of pressing the optical adhesive film on the photoresist layer, the photoresist layer carries the mold.
  • the method for manufacturing the transparent conductive film greatly facilitates the bonding of the transparent conductive film through the optical adhesive layer, and effectively solves the problem that the existing transparent conductive film has a better bonding effect when it is bonded to the touch screen.
  • the problem of poor and difficult bonding at the same time, by making grooves and filling conductive materials in the grooves to form a conductive layer, while ensuring the flexibility of the transparent conductive film, it greatly improves the conductivity, transmittance and Anti-bending performance, and reduce the thickness of the transparent conductive film and the difficulty of processing technology, and reduce the cost.
  • Figure 1 is a schematic diagram of the structure of the transparent conductive film of the present invention.
  • FIG. 2 is a flow chart of the steps of a method for manufacturing a transparent conductive film in the first embodiment of the present invention
  • FIG. 3 is a process flow diagram of a method for manufacturing a transparent conductive film according to the first embodiment of the present invention
  • FIG. 4 is a flow chart of the steps of a method for manufacturing a transparent conductive film according to a second embodiment of the present invention.
  • the transparent conductive film provided by the present invention includes a photoresist layer 3, a base film 1, and an optical adhesive layer 2.
  • the photoresist layer 3 is arranged on the surface of the optical adhesive layer 2, and the base film 1 is arranged on the optical adhesive layer 2. Keep away from the other side surface of the photoresist layer 3.
  • the surface of the optical adhesive layer 3 away from the optical adhesive layer 2 is provided with a groove 31, and a conductive layer 4 is provided in the groove 31.
  • the base film 1 is a release film 1, and its material is PET (Polyethylene terephthalate, polyethylene terephthalate).
  • the release film 1 can be physically separated from the optical adhesive layer 2 and does not foam when the conductive material in the conductive layer 4 is cured at a low temperature. By designing the release film 1, it is convenient to use and store the transparent conductive film.
  • Optical glue is the best adhesive for bonding to touch screen as conductive film. It is required to be colorless and transparent, light transmittance above 90%, good bonding strength, curing at room temperature or medium temperature, and low curing shrinkage, etc. Features. Therefore, the material of the optical adhesive layer is usually acrylic or siloxane.
  • the material of the optical adhesive layer 2 is OCA (Optically Clear Adhesive) optical adhesive; OCA optical adhesive is a double-sided adhesive tape without a matrix material.
  • the thickness of the optical adhesive layer 2 is 50-250 ⁇ m, and its light transmittance is above 95%.
  • the photoresist layer 3 is made of UV photoresist, and the photoresist layer 3 is obtained by curing with ultraviolet light.
  • the groove 31 has a width of 1-20 ⁇ m and a depth of 1-15 ⁇ m.
  • the conductive layer 4 is made of any one of silver, copper, graphene, or other conductive materials. It should be noted that the conductive material forming the conductive layer 4 can be cured at a low temperature, and the curing temperature must be lower than the upper limit of the optical glue withstand temperature.
  • the method for manufacturing the transparent conductive film provided in the first embodiment of the present invention is used for manufacturing the above-mentioned transparent conductive film, and the method includes:
  • S1 Provide a substrate 5, coat a layer of photoresist on the substrate 5, and form a groove 31 on the photoresist layer 3;
  • S3 Provide an optical adhesive film, including an optical adhesive layer 2 and a base film 1, and press the optical adhesive film on the optical adhesive layer 3;
  • the photoresist is UV photoresist.
  • step S1 using the mold 6 to imprint on the photoresist, so that the mold 6 and the photoresist are pasted together. After being cured by UV light, a photoresist layer 3 with grooves 31 is formed.
  • step S2 the substrate 5 is separated from the photoresist layer 3 manually, and during this process, the mold 6 is always adhered to the photoresist layer 3.
  • the optical adhesive film needs to be processed.
  • step S3 the optical adhesive film is pressed on the photoresist layer with the mold 6 by pressing to remove the surface of the substrate 5 side, so that the base film 1 and the optical adhesive layer 2 are bonded together to form an optical Glue film.
  • laser cutting of the optical adhesive film is also required to meet the shape and size of the required conductive film.
  • a demolding step S4 is also included. Due to the relatively high optical adhesiveness, the adhesiveness between the optical adhesive layer 2 and the photo adhesive layer 3 is greater than the adhesiveness between the photo adhesive layer 3 and the mold 6. Therefore, the demolding step S4 specifically includes: manually separating the mold 6 from the photoresist layer 3.
  • the difference between the transparent conductive film method provided by the second embodiment of the present invention and the above-mentioned first embodiment lies in that, in this embodiment, the photoresist is directly coated on the optical adhesive film in this embodiment.
  • the transparent conductive film method provided by the second embodiment of the present invention is used to manufacture the above transparent conductive film, and the method includes:
  • S7 Provide an optical glue film, including an optical glue layer and a base film, and prepare a photo glue layer with grooves on the optical glue film;
  • step S7 first adopt a coating method to coat a layer of photoresist on the surface of the optical adhesive layer away from the base film to form a photoresist layer. Then the mold is used to imprint on the photoresist layer, and after curing, the mold is manually demolded to form grooves on the photoresist layer.
  • the photo glue is UV photo glue.
  • an etching method may be used to form grooves on the photoresist layer.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Laminated Bodies (AREA)

Abstract

一种透明导电膜，包括光胶层（3）、基膜（1）和光学胶层（2），所述光胶层（3）设置在所述光学胶层（2）的表面，所述基膜（1）设置在所述光学胶层（2）远离所述光胶层（3）的另一侧表面，所述光胶层（3）远离所述光学胶层（2）的表面开设有凹槽（31），凹槽（31）内设有导电层（4）。还公开一种透明导电膜的制作方法，用于制作上述透明导电膜。通过光学胶层（2），极大地方便了透明导电膜的贴合，有效地解决了现有透明导电膜在贴合时，贴合效果较差、贴合难度大的问题；同时通过制作凹槽（31）并在凹槽（31）内填充导电材料形成导电层（4），保证透明导电膜柔性的同时，极高的改善了透明导电膜的电导率、透过率和抗弯折性能，并降低了其厚度和加工工艺难度，降低了成本。

Description

一种透明导电膜及其制作方法
本申请要求了申请日为2019年6月24日，申请号为201910549041.9的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及导电膜技术领域，特别是涉及一种透明导电膜及其制作方法。
背景技术
现有金属网格导电膜一般都需要在一层衬底上加工，衬底一般为玻璃、高分子聚酯(PET，PC，PMMA等)。采用在衬底上压印凹槽后填充导电材料制备导电膜，亦有采用在衬底上喷墨打印导电材料制备导电膜。这些导电膜在使用过程中几乎都需要使用光学胶将其贴合，如此在贴合过程中容易使导电膜与被贴合产品之间出现气泡，贴合效果不好，影响产品质量不高；同时贴合难度较大，造成成本增加。
前面的叙述在于提供一般的背景信息，并不一定构成现有技术。
发明内容
本发明的目的在于提供一种方便贴合的透明导电膜及其制作方法。
本发明提供一种透明导电膜，包括光胶层、基膜和光学胶层，所述光胶层设置在所述光学胶层的表面，所述基膜设置在所述光学胶层远离所述光胶层的另一侧表面，所述光胶层远离所述光学胶层的表面开设有凹槽，凹槽内设有导电层。
在其中一实施例中，所述凹槽宽度1～20μm，深度1～15μm。
在其中一实施例中，所述光学胶层厚度为50～250μm，所述光学胶层的透光率为95％以上。
本发明还提供一种透明导电膜的制作方法，该方法包括：
提供一光学胶膜，包括光学胶层和基膜，在所述光学胶膜上制备具有凹槽的光胶层；
在所述凹槽内填充导电材料形成导电层。
在其中一实施例中，在所述提供一光学胶膜的步骤中，将基膜压合在所述光学胶层一侧的表面，使所述基膜和所述光学胶层贴合在一起形成所述光学胶膜。
在其中一实施例中，在所述制备具有凹槽的光胶层的过程中：在所述光学胶层上远离基膜的表面涂布一光胶层，利用模具压印在所述光胶层上形成所述凹槽，固化后进行脱模，在所述光学胶膜上形成所述具有凹槽的光胶层。
本发明还提供一种透明导电膜的制作方法，该方法包括：
提供一衬底，在所述衬底上涂布一光胶层，在所述光胶层形成凹槽；
清除所述衬底；
提供一光学胶膜，包括光学胶层和基膜，将所述光学胶膜压合在所述光胶层上；
在所述凹槽内填充导电材料形成导电层。
在其中一实施例中，在所述提供一光学胶膜的步骤中，将基膜压合在所述光学胶层一侧的表面，使所述基膜和所述光学胶层贴合在一起形成所述光学胶膜。
在其中一实施例中，所述凹槽形成的过程为：利用模具压印在所述光胶层上形成所述凹槽；在所述将所述光学胶膜压合在所述光胶层上后，所述在所述凹槽内填充导电材料形成导电层前，还包括脱模步骤，所述脱模步骤具体为：采用手动的方式将所述模具脱离所述光胶层。
在其中一实施例中，在所述将所述光学胶膜压合在所述光胶层上的步骤中，所述光胶层上携带所述模具。
本发明提供的透明导电膜的制作方法，通过光学胶层，极大地方便了透明导电膜的贴合，有效地解决了现有透明导电膜在贴合到触控屏上时，贴合效果较差、贴合难度大的问题；同时通过制作凹槽并在凹槽内填充导电材料形成导电层，保证透明导电膜柔性的同时，极高的改善了透明导电膜的电导 率、透过率和抗弯折性能，并降低了透明导电膜的厚度和加工工艺难度，降低了成本。
附图说明
图1为本发明透明导电膜的结构示意图；
图2为本发明第一实施例中透明导电膜的制作方法的步骤流程图；
图3为本发明第一实施例透明导电膜的制作方法的工艺流程图；
图4为本发明第二实施例透明导电膜的制作方法的步骤流程图。
具体实施方式
下面结合附图和实施例，对本发明的具体实施方式作进一步详细描述。以下实施例用于说明本发明，但不用来限制本发明的范围。
请参考图1，本发明提供的透明导电膜，包括光胶层3、基膜1和光学胶层2，光胶层3设置在光学胶层2的表面，基膜1设置在光学胶层2远离光胶层3的另一侧表面。光胶层3远离光学胶层2的表面开设有凹槽31，凹槽31内设有导电层4。
基膜1为离型膜1，其材质为PET(Polyethylene terephthalate，聚对苯二甲酸乙二酯)。离型膜1可以与光学胶层2物理分离，且在对导电层4中的导电材料进行低温固化时不起泡。通过设计离型膜1，方便透明导电膜的使用及储存。
光学胶是作为导电膜贴合到触控屏上较佳胶粘剂，要求具有无色透明、光透过率在90％以上、胶结强度良好，可在室温或中温下固化，且有固化收缩小等特点。因此，光学胶层材质通常采用用亚克力材质或硅氧烷材质。
在本实施例中，光学胶层2材质为OCA(Optically Clear Adhesive)光学胶；OCA光学胶是一种无基体材料的双面贴合胶带。光学胶层2的厚度为50～250μm，其透光率为95％以上。
光胶层3材质为UV光胶，光胶层3通过紫外光固化得到。
凹槽31的宽度为1～20μm，深度为1～15μm。
导电层4材质为银或铜或石墨烯或其它导电材料中的任一一种。需要注意的是，形成导电层4的导电材料可以低温固化，且固化温度须低于光学胶耐受温度上限。
第一实施例
请参图2至图3，本发明第一实施例中提供的透明导电膜的制作方法，用于制作上述透明导电膜，该方法包括：
S1：提供一衬底5，在衬底5上涂布一层光胶，在光胶层3上形成凹槽31；
S2：清除衬底5；
S3：提供一光学胶膜，包括光学胶层2和基膜1，将光学胶膜压合在光胶层3上；
S5：在凹槽31内填充导电材料形成导电层4。
在本方法中，光胶为UV光胶。
在步骤S1中：利用模具6压印在光胶上，使模具6与光胶粘贴在一起。经UV光固化后形成具有凹槽31的光胶层3。
在步骤S2中：采用手动的方式将衬底5与光胶层3分离，在此过程中，模具6一直与光胶层3粘合在一起。
在实际应用时，需要对光学胶膜进行处理。在步骤S3中，采用压合的方式将光学胶膜压合在带有模具6的光胶层清除了衬底5一侧的表面，使基膜1和光学胶层2贴合在一起形成光学胶膜。同时，还需要对光学胶膜进行激光裁剪，以满足所需导电膜的形状和大小。
在步骤S3后，还包括脱模步骤S4。由于光学胶粘性较大，光学胶层2与光胶层3之间的粘性大于光胶层3与模具6之间的粘性。因此，脱模步骤S4具体为：采用手动的方式将模具6与光胶层3分离。
第二实施例
本发明第二实施例提供的透明导电膜方法与上述第一实施例的区别在于，在本实施例中，本实施例将光胶直接涂布在光学胶膜上。
具体地，请参考图4，本发明第二实施例提供的透明导电膜方法，用于制作上述透明导电膜，该方法包括：
S7：提供一光学胶膜，包括光学胶层和基膜，在光学胶膜上制备具有凹槽的光胶层；
S8：在凹槽内填充导电材料形成导电层；
在步骤S7中：先采用涂布的方式，在光学胶层远离基膜的一侧表面上涂布一层光胶，形成光胶层。再利用模具压印在光胶层上，固化后进行手动脱模，在光胶层上形成凹槽。其中，光胶为UV光胶。
在其它实施例中，可以采用蚀刻的方法在光胶层上形成凹槽。
在附图中，为了清晰起见，会夸大层和区域的尺寸和相对尺寸。应当理解的是，当元件例如层、区域或衬底被称作“形成在”、“设置在”或“位于”另一元件上时，该元件可以直接设置在所述另一元件上，或者也可以存在中间元件。相反，当元件被称作“直接形成在”或“直接设置在”另一元件上时，不存在中间元件。
在本文中，术语“上”、“下”、“前”、“后”、“左”、“右”、“顶”、“底”、“内”、“外”、“竖直”、“水平”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了表达技术方案的清楚及描述方便，因此不能理解为对本发明的限制。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
在本文中，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，除了包含所列的那些要素，而且还可包含没有明确列出的其他要素。
以上所述，仅为本发明的具体实施方式，但本发明的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本发明揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本发明的保护范围之内。因此，本发明的保护范围应以所述权利要求的保护范围为准。

Claims (10)

  1. 一种透明导电膜，其特征在于，包括光胶层、基膜和光学胶层，所述光胶层设置在所述光学胶层的表面，所述基膜设置在所述光学胶层远离所述光胶层的另一侧表面，所述光胶层远离所述光学胶层的表面开设有凹槽，凹槽内设有导电层。
  2. 如权利要求1所述的透明导电膜，其特征在于，所述凹槽宽度1～20μm，深度1～15μm。
  3. 如权利要求1所述的透明导电膜，其特征在于，所述光学胶层厚度为50～250μm，所述光学胶层的透光率为95％以上。
  4. 一种透明导电膜的制作方法，其特征在于，该方法包括：
    提供一光学胶膜，包括光学胶层和基膜，在所述光学胶膜上制备具有凹槽的光胶层；
    在所述凹槽内填充导电材料形成导电层。
  5. 如权利要求4所述的透明导电膜的制作方法，其特征在于，在所述提供一光学胶膜的步骤中，将基膜压合在所述光学胶层一侧的表面，使所述基膜和所述光学胶层贴合在一起形成所述光学胶膜。
  6. 如权利要求4所述的透明导电膜的制作方法，其特征在于，在所述制备具有凹槽的光胶层的过程中：在所述光学胶层上远离基膜的表面涂布一光胶层，利用模具压印在所述光胶层上形成所述凹槽，固化后进行脱模，在所述光学胶膜上形成所述具有凹槽的光胶层。
  7. 一种透明导电膜的制作方法，其特征在于，该方法包括：
    提供一衬底，在所述衬底上涂布一光胶层，在所述光胶层形成凹槽；
    清除所述衬底；
    提供一光学胶膜，包括光学胶层和基膜，将所述光学胶膜压合在所述光胶层上；
    在所述凹槽内填充导电材料形成导电层。
  8. 如权利要求7所述的透明导电膜的制作方法，其特征在于，在所述提 供一光学胶膜的步骤中，将基膜压合在所述光学胶层一侧的表面，使所述基膜和所述光学胶层贴合在一起形成所述光学胶膜。
  9. 如权利要求7所述的透明导电膜的制作方法，其特征在于，所述凹槽形成的过程为：利用模具压印在所述光胶层上形成所述凹槽；在所述将所述光学胶膜压合在所述光胶层上后，所述在所述凹槽内填充导电材料形成导电层前，还包括脱模步骤，所述脱模步骤具体为：采用手动的方式将所述模具脱离所述光胶层。
  10. 如权利要求9所述的透明导电膜的制作方法，其特征在于，在所述将所述光学胶膜压合在所述光胶层上的步骤中，所述光胶层上携带所述模具。
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CN115426867A (zh) * 2022-10-21 2022-12-02 安徽精卓光显技术有限责任公司 一种无基材屏蔽膜及其制造方法
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120132273A1 (en) * 2009-05-26 2012-05-31 Lg Chem, Ltd. Method for preparation of front electrode for solar cell of high efficiency
CN103827783A (zh) * 2011-07-21 2014-05-28 未来奈米科技股份有限公司 用于制造触控屏幕面板的装置和方法
CN104009124A (zh) * 2014-06-13 2014-08-27 苏州苏大维格光电科技股份有限公司 太阳能电池超精细电极转移薄膜、制备方法及其应用方法
CN106448825A (zh) * 2016-10-21 2017-02-22 苏州苏大维格光电科技股份有限公司 一种图形化精细导电薄膜及其制作方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103744571A (zh) * 2014-01-26 2014-04-23 苏州维业达触控科技有限公司 超薄触控传感器及其制作方法
CN203706189U (zh) * 2014-02-21 2014-07-09 南昌欧菲光科技有限公司 电容式触摸屏
KR102238788B1 (ko) * 2014-04-23 2021-04-09 미래나노텍(주) 터치스크린 패널 및 그 제조방법
CN204028878U (zh) * 2014-07-23 2014-12-17 南昌欧菲光科技有限公司 电容式触控屏
CN106956530B (zh) * 2015-01-18 2019-06-21 昇印光电（昆山）股份有限公司 一种印刷薄膜
CN205365001U (zh) * 2015-12-17 2016-07-06 昇印光电（昆山）股份有限公司 一种具有装饰图案的装置
CN108376042A (zh) * 2018-05-04 2018-08-07 蓝思科技（长沙）有限公司 金属网格传感器和触摸屏及其制备方法与设备
CN209895783U (zh) * 2019-06-24 2020-01-03 苏州维业达触控科技有限公司 一种透明导电膜

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120132273A1 (en) * 2009-05-26 2012-05-31 Lg Chem, Ltd. Method for preparation of front electrode for solar cell of high efficiency
CN103827783A (zh) * 2011-07-21 2014-05-28 未来奈米科技股份有限公司 用于制造触控屏幕面板的装置和方法
CN104009124A (zh) * 2014-06-13 2014-08-27 苏州苏大维格光电科技股份有限公司 太阳能电池超精细电极转移薄膜、制备方法及其应用方法
CN106448825A (zh) * 2016-10-21 2017-02-22 苏州苏大维格光电科技股份有限公司 一种图形化精细导电薄膜及其制作方法

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