WO2020256501A1

WO2020256501A1 - Electronic device including display

Info

Publication number: WO2020256501A1
Application number: PCT/KR2020/008016
Authority: WO
Inventors: 신성영; 신현창; 양병덕; 정송희; 허용구; 김광태; 염동현
Original assignee: 삼성전자 주식회사
Priority date: 2019-06-19
Filing date: 2020-06-19
Publication date: 2020-12-24
Also published as: KR102644174B1; KR20200144760A

Abstract

Disclosed according to various embodiments is an electronic device comprising: a display including a first display region where a first screen is displayed; and a sensor module placed under the first display region of the display, wherein the first display region comprises one or more transparent regions and one or more opaque regions, and the transparent regions and the opaque regions are coded. Various other embodiments recognizable from the specification are also possible.

Description

Electronic device with display

Various embodiments of the present document relate to an electronic device including a display.

An electronic device (eg, a smartphone) may include a display in which arrangement elements (eg, sub-pixels, data lines, gate lines, wirings, electronic elements, and electrodes) are disposed in at least some areas. According to an embodiment, in the electronic device, a sensor (eg, a camera) may be disposed in a non-display area in which an arrangement element is not disposed. For example, the electronic device may acquire an image of a subject through a camera disposed in the non-display area.

The electronic device may have a display in which the entire front surface is used as a display area of the screen. For example, when the entire front surface of the electronic device is used as the display area, a sensor may be disposed on the rear surface of the display corresponding to the display area.

However, when the sensor corresponds to the position of the display area, the electronic device is caused by diffraction generated between the elements of the display area (e.g., sub-pixels, data lines, gate lines, wiring, electronic elements, and electrodes). Performance (eg resolution) may be degraded.

Furthermore, in the electronic device, when the sensor is disposed to correspond to the position of the display area, light (or signal) reaching the sensor may be attenuated by the placement elements.

Various embodiments disclosed in this document are intended to provide an electronic device including a display.

In the electronic device according to an embodiment disclosed in the present document, a display in which a first display area on which a first screen is displayed is formed, and a first surface and a second surface in opposite directions are formed on the first surface. And a printed circuit board on which the display is located and a sensor module is disposed between the display and the first surface, and in the first display area, at least one transparent area and at least one opaque area are formed of the sensor module. It can be arranged to correspond to the position.

In addition, the electronic device according to an exemplary embodiment disclosed in this document includes a display having a first display area on which a first screen is displayed, and a first surface and a second surface opposite to each other, and the first The display is positioned on a surface, and includes a printed circuit board having a sensor module disposed between the display and the first surface, and in the first display area, at least one transparent area and at least one opaque area are provided with the sensor. It is arranged to correspond to the position of the module, and the transparent area and the opaque area may be regularly coded.

According to various embodiments disclosed in this document, at least a part of a sensor is disposed to correspond to a display area, but between elements of the display area (eg, subpixels, data lines, gate lines, wirings, electronic devices, and electrodes) It is possible to minimize the interference of light (or signal) caused by diffraction of

In addition, according to various embodiments disclosed in this document, at least a part of the sensor is disposed to correspond to the display area, and the amount of light (or signal) reaching the sensor may be maintained above a certain level.

In addition to this, various effects that can be directly or indirectly identified through this document can be provided.

1 is a diagram illustrating a front surface of an electronic device according to an exemplary embodiment.

2 is a diagram illustrating a rear surface of an electronic device according to an exemplary embodiment.

3 is a diagram illustrating an electronic device according to an exemplary embodiment.

4A is a cross-sectional view illustrating an area of an electronic device according to an exemplary embodiment.

4B is an enlarged view of a portion “A1” according to the embodiment of FIG. 3.

FIG. 5 is a diagram illustrating a cut plane B-B' according to the embodiment of FIG. 4B.

6 is a diagram illustrating a cut plane B-B' according to another embodiment of FIG. 4B.

FIG. 7A is a view showing a cut plane B-B' according to another embodiment of FIG. 4B.

FIG. 7B is a diagram illustrating a cut plane B-B' according to another embodiment of FIG. 4B.

FIG. 8 is a diagram illustrating a cut plane B-B' according to various embodiments of FIG. 4B.

9 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

Hereinafter, various embodiments of the present invention will be described with reference to the accompanying drawings. However, this is not intended to limit the present invention to a specific embodiment, it should be understood to include various modifications, equivalents, and/or alternatives of the embodiments of the present invention.

1 is a diagram illustrating a front surface of an electronic device according to an exemplary embodiment. 2 is a diagram illustrating a rear surface of an electronic device according to an exemplary embodiment.

1 and 2, the electronic device 100 according to an embodiment includes a first surface (or front surface) 110A, a second surface (or rear surface) 110B, and a first surface 110A, and It may include a housing 110 including a side surface 110C surrounding the space between the second surfaces 110B. According to another embodiment (not shown), the housing may refer to a structure forming some of the first surface 110A, the second surface 110B, and the side surface 110C of FIG. 1. According to an embodiment, at least a portion of the first surface 110A may be formed by a substantially transparent front plate 102 (eg, a glass plate including various coating layers or a polymer plate). The second surface 110B may be formed by a substantially opaque rear plate 111. The back plate 111 is formed by, for example, coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. Can be. The side surface 110C is coupled to the front plate 102 and the rear plate 111 and may be formed by a side bezel structure (or “side member”) 118 including metal and/or polymer. In some embodiments, the back plate 111 and the side bezel structure 118 are integrally formed and may include the same material (eg, a metal material such as aluminum).

In the illustrated embodiment, the front plate 102 includes two first regions 110D that are curved toward the rear plate 111 from the first surface 110A and extend seamlessly, the front plate It may be included at both ends of the long edge (102). In the illustrated embodiment (see FIG. 2), the rear plate 111 is curved toward the front plate 102 from the second surface 110B to seamlessly extend two second regions 110E with a long edge. Can be included at both ends. According to some embodiments, the front plate 102 (or the rear plate 111) may include only one of the first regions 110D (or the second regions 110E). According to another embodiment, some of the first regions 110D or the second regions 110E may not be included. In the above embodiments, when viewed from the side of the electronic device 100, the side bezel structure 118 is a side surface that does not include the first regions 110D or the second regions 110E. It may have one thickness (or width), and may have a second thickness that is thinner than the first thickness on a side surface including the first regions 110D or the second regions 110E.

According to an embodiment, the electronic device 100 includes a display 101, an

audio module

103, 107, 114, a

sensor module

104, 116, 119, a

camera module

105, 112, 113, and a key input. It may include at least one or more of the device 117, the light emitting element 106, and the

connector holes

108, 109. According to some embodiments, the electronic device 100 may omit at least one of the components (for example, the key input device 117 or the light emitting device 106) or additionally include other components.

Display 101 may be exposed through a substantial portion of front plate 102, for example. According to some embodiments, at least a portion of the display 101 may be exposed through the front plate 102 forming the first surface 110A and the first regions 110D of the side surface 110C. . According to some embodiments, the edge of the display 101 may be formed to have substantially the same shape as an adjacent outer shape of the front plate 102. According to another embodiment (not shown), in order to expand the area to which the display 101 is exposed, the distance between the outer periphery of the display 101 and the outer periphery of the front plate 102 may be formed substantially the same.

According to an embodiment, the display 101 includes at least one of the audio module 114, the sensor module 104, the camera module 105, the fingerprint sensor 116, and the light emitting element 106 on the rear surface of the screen display area. It may contain more than one. According to another embodiment (not shown), the display 101 forms a recess or opening in a part of the screen display area, and the audio module 114 is aligned with the recess or the opening. , The sensor module 104, the camera module 105, and may include at least one or more of the light emitting device 106. According to another embodiment (not shown), the display 101 is coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field type stylus pen. Can be placed According to some embodiments, at least a part of the

sensor modules

104 and 119 and/or at least a part of the key input device 117 may include the first regions 110D and/or the second regions 110E. ) Can be placed in.

The

audio modules

103, 107, and 114 may include microphone holes 103 and speaker holes 107 and 114. In the microphone hole 103, a microphone for acquiring external sound may be disposed inside, and in some embodiments, a plurality of microphones may be disposed to detect the direction of sound. The speaker holes 107 and 114 may include an external speaker hole 107 and a call receiver hole 114. According to some embodiments, the speaker holes 107 and 114 and the microphone hole 103 may be implemented as one hole, or a speaker (eg, piezo speaker) may be included without the speaker holes 107 and 114.

The

sensor modules

104, 116, and 119 may generate electrical signals or data values corresponding to an internal operating state of the electronic device 100 or an external environmental state. The

sensor modules

104, 116, 119 are, for example, a first sensor module 104 (for example, a proximity sensor) disposed on the first surface 110A of the housing 110 and/or a second sensor module ( Not shown) (for example, a fingerprint sensor), and/or a third sensor module 119 (for example, an HRM sensor) and/or a fourth sensor module 116 disposed on the second side 110B of the housing 110 ) (E.g. fingerprint sensor). The fingerprint sensor may be disposed on the first surface 110A of the housing 110 (eg, not only the display 101 but also the second surface 110B. The electronic device 100 is a sensor module, not shown, for example, For example, at least one of a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor 104 is further included. Can include.

The

camera modules

105, 112, and 113 include a first camera device 105 disposed on the first surface 110A of the electronic device 100, and a second camera device 112 disposed on the second surface 110B. ), and/or a flash 113. The

camera devices

105 and 112 may include one or more lenses, an image sensor, and/or an image signal processor. The flash 113 may include, for example, a light emitting diode or a xenon lamp. According to some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one surface of the electronic device 100.

The key input device 117 may be disposed on the side surface 110C of the housing 110. According to another embodiment, the electronic device 100 may not include some or all of the aforementioned key input devices 117, and the key input device 117 that is not included may be soft on the display 101. It can be implemented in other forms such as keys. According to some embodiments, the key input device 117 may include a sensor module 116 disposed on the second surface 110B of the housing 110.

The light emitting device 106 may be disposed on the first surface 110A of the housing 110, for example. The light-emitting element 106 may provide state information of the electronic device 100 in the form of light, for example. According to another embodiment, the light emitting device 106 may provide a light source that is interlocked with the operation of the camera module 105, for example. The light-emitting element 106 may include, for example, an LED, an IR LED, and a xenon lamp.

The connector holes 108 and 109 are a first connector hole 108 capable of receiving a connector (eg, a USB connector) for transmitting and receiving power and/or data with an external electronic device, and/or an external electronic device. And a second connector hole (eg, an earphone jack) 109 capable of accommodating a connector for transmitting and receiving an audio signal.

Referring to FIG. 3, the electronic device 300 includes a side bezel structure 310, a first support member 311 (eg, a bracket), a front plate 320, a display 330, and a printed circuit board 340. , A battery 350, a second support member 360 (eg, a rear case), an antenna 370, and a rear plate 380. According to some embodiments, the electronic device 300 may omit at least one of the components (for example, the first support member 311 or the second support member 360), or additionally include other components. have. At least one of the components of the electronic device 300 may be the same as or similar to at least one of the components of the electronic device 100 of FIG. 1 or 2, and redundant descriptions will be omitted below.

The first support member 311 may be disposed inside the electronic device 300 and connected to the side bezel structure 310, or may be integrally formed with the side bezel structure 310. The first support member 311 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material. In the first support member 311, the display 330 may be coupled to one surface and the printed circuit board 340 may be coupled to the other surface. A processor, memory, and/or interface may be mounted on the printed circuit board 340. The processor may include, for example, one or more of a central processing unit, an application processor, a graphic processing unit, an image signal processor, a sensor hub processor, or a communication processor.

The memory may include, for example, volatile memory or nonvolatile memory.

The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. The interface may electrically or physically connect the electronic device 300 to an external electronic device, for example, and may include a USB connector, an SD card/MMC connector, or an audio connector.

The display 330 may be coupled to correspond to the first surface (eg, the front surface) of the printed circuit board 340. According to an embodiment, the display 330 may include a first display area A1 and a second display area A2 (eg, the screen display area of FIG. 1 ). The first display area A1 and the second display area A2 may include a plurality of pixels to display an image. The first display area A1 may extend from the second display area A2. For example, in the first display area A1, a first screen (remaining part of the screen) extending from the second display area A2 on which the second screen (eg, some screens) is displayed may be displayed. . For example, image data corresponding to image data of the second screen or image data different from image data of the second screen may be displayed on the first screen. According to various embodiments, the display 330 is located at a position corresponding to at least one of the

sensor modules

104, 116, 119, the

camera modules

105, 112, 113, and the light emitting element 106 shown in FIG. 1. The first display area A1 may be formed.

The printed circuit board 340 may be positioned so that the display 330 corresponds to the first surface (eg, the front surface). According to an embodiment, in the printed circuit board 340, a sensor module 341 (eg, an image sensor, a proximity sensor, an illuminance sensor, and a biometric sensor) may be disposed on a first surface (eg, a front surface). For example, the sensor module 341 may be disposed on the printed circuit board 340 to correspond to the position of the first display area A1.

The battery 350 is a device for supplying power to at least one component of the electronic device 300, and may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell. . At least a portion of the battery 350 may be disposed substantially on the same plane as the printed circuit board 340, for example. The battery 350 may be integrally disposed inside the electronic device 300 or may be disposed detachably from the electronic device 300.

The antenna 370 may be disposed between the rear plate 380 and the battery 350. The antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. The antenna 370 may perform short-range communication with an external device or wirelessly transmit/receive power required for charging. In another embodiment, an antenna structure may be formed by a side bezel structure 310 and/or a part of the first support member 311 or a combination thereof.

4A is a cross-sectional view illustrating an area of an electronic device according to an exemplary embodiment. Specifically, FIG. 4A is a cross-sectional view illustrating a first display area of FIG. 3 and a peripheral area thereof in an electronic device according to an exemplary embodiment.

The electronic device 400 according to an embodiment may include a display 330, a cover panel 410, a front plate 320, a sensor module 341, and a printed circuit board 340.

The display 330 may include a first display area A1 and a second display area A2 surrounding the first display area A1. The first display area A1 may be positioned to correspond to a field of view (FOV) of the sensor module 341. The first display area A1 and the second display area A2 of the display 330 may display a screen including a plurality of pixels and a plurality of signal lines transmitting signals to the plurality of pixels.

The front plate 320 may be positioned on the display 330. The front plate 320 may include a transparent material to transmit light. The display 330 may display a screen through the front plate 320. For example, the front plate 320 may include at least one of tempered glass, tempered plastic, or a flexible polymer material. The front plate 320 may be attached to the display 330 by a transparent adhesive layer (not shown).

The cover panel 410 may be located under the display 330. The cover panel 410 may be a layer protecting one surface of the display 330. The cover panel 410 may include at least one of a metal layer (eg, a copper sheet) or a light shielding layer (eg, a black embo layer).

The sensor module 341 may be located under the display 330 and the cover panel 410. The sensor module 341 may be located under the first display area A1 of the display 330. The cover panel 410 may include a light blocking layer so that light may not be transmitted. An opening 411 may be positioned in at least a part of the cover panel 410 disposed above the sensor module 341 so that the sensor module 341 can detect external light. The opening 411 of the cover panel 410 may be formed in a position and size corresponding to the field of view (FOV) of the sensor module 341.

The printed circuit board 340 may include a processor (eg, the processor 920 of FIG. 9 ). The printed circuit board 340 is electrically connected to the sensor module 341 to obtain and process information sensed by the sensor module 341.

Referring to FIG. 4B, the first display area A1 according to an exemplary embodiment may include at least one opaque area 501 and at least one transparent area 502. The opaque region 501 may be a region through which light does not pass. The transparent region 502 may be an area through which light passes. The first display area A1 may display an image through a plurality of pixels located in the opaque area 501. The transparent region 502 may be a region from which pixels have been removed. In the first display area A1, a plurality of pixels may be located in the opaque area 501 and may not be located in the transparent area 502.

In the first display area A1, at least one opaque area 501 and at least one transparent area 502 may be coded. Coding may mean calculating (or determining) a pattern of transparent and opaque regions (eg, a grid pattern) that allows diffraction of light to be reduced. According to an embodiment, coding may be performed in units of pixels. In other words, a pattern of a transparent area and an opaque area may be calculated using the area of one pixel as a minimum unit. The electronic device according to an exemplary embodiment includes a transparent region and an opaque region based on a coded pattern (eg, a coded aperture), and pixels are located in the opaque region, so that diffraction of light reaching the sensor module may be reduced.

According to an embodiment, in the first display area A1, at least one opaque area 501 and at least one transparent area 502 may be regularly coded.

According to an embodiment, in the first display area A1, at least one opaque area 501 and at least one transparent area 502 may be irregularly coded.

According to some embodiments, the first display area A1 may be disposed to correspond to at least a portion of a sensor module (eg, an image sensor, a proximity sensor, an illuminance sensor, and a biometric sensor). For example, some of the sensor modules may be disposed in the opaque area 501. In addition, the remaining part of the sensor module may be disposed in the transparent area 502. For example, at least one pixel for displaying a screen of the display may be disposed on a display corresponding to the opaque area 501 (eg, the display 330 of FIG. 3 ).

Referring to FIG. 5, a display 500 (eg, the display 330 of FIG. 3) according to an embodiment includes

organic material layers

510a and 510b that are separated from each other according to an opaque region 501 and a transparent region 502. It may include

substrate layers

521 and 523.

According to an embodiment, the display 500 corresponding to the opaque region 501 may include an opaque organic material layer 510a and an opaque substrate layer 521. For example, in the opaque organic material layer 510a, at least two

arrangement elements

515a and 515b (eg, subpixels, data lines, gate lines, wirings, electronic devices, and electrodes) may be disposed. The two

arrangement elements

515a and 515b may be spaced apart by, for example, a first length S1. For example, the opaque substrate layer 521 may be disposed on the rear surface (or under) of the opaque organic material layer 510a.

According to some embodiments, the opaque substrate layer 521 may include a first layer 521a, a second layer 521b, and a cover layer 525a. The first layer 521a may be disposed on the entire surface of the opaque substrate layer 521. Also, the second layer 521b may be disposed on the rear surface of the opaque substrate layer 521. For example, a cover layer 525a may be disposed between the first layer 521a and the second layer 521b. The cover layer 525a may be disposed in the opaque region 501 so as to correspond to, for example, the

arrangement elements

515a and 515b (eg, subpixels, data lines, gate lines, wirings, electronic devices, and electrodes). Depending on the embodiment, the cover layer 525a may be positioned extending to the periphery of the opaque region 501. According to another embodiment, the cover layer 525a may be located in a region of the opaque region 501 excluding an edge of the opaque region 501. In addition, the cover layer 525a includes a sensor module (eg, an image sensor, a proximity sensor, an illuminance sensor, and a living body) in which light (or signal) passing through the space in which the first length S1 is formed is disposed on the rear surface of the display 500 The sensor module can be covered so that it does not reach the recognition sensor. The cover layer 525a may include a material that does not transmit light. According to various embodiments, the cover layer 525a may be formed of a photosensitive material capable of patterning.

According to an embodiment, the display 500 corresponding to the transparent region 502 may include a transparent organic material layer 510b and a transparent substrate layer 523. For example, the transparent organic material layer 510b may be distinguished from the opaque organic material layer 510a depending on the presence or absence of the

arrangement elements

515a and 515b (eg, subpixels, data lines, gate lines, wirings, electronic devices, and electrodes). have. For example, the

arrangement elements

515a and 515b may not be disposed on the transparent organic material layer 510b. For example, the transparent region 502 may be a region from which pixels have been removed. The first length S1 may be sufficiently small compared to the width of the transparent region 502. The transparent substrate layer 523 may be disposed on the rear surface of the transparent organic material layer 510b. Also, the transparent substrate layer 523 may be distinguished from the opaque substrate layer 521 according to the presence or absence of the cover layer 525a. According to various embodiments of the present disclosure, in the display 500, the opaque organic material layer 510a and the transparent organic material layer 510b may be formed of materials having the same properties according to a semiconductor process. In addition, in the display 500, the opaque substrate layer 521 and the transparent substrate layer 523 may be formed of materials having the same properties according to a semiconductor process. For example, the first layer 521a and the second layer 521b may include the same material as the transparent substrate layer 523. For example, the first layer 521a, the second layer 521b, and the transparent substrate layer 523 may include polyimide (PI).

According to various embodiments, the display 500 may include a structure of not only organic light emitting diodes (OLEDs) but also liquid crystal displays (LCDs).

6 is a diagram illustrating a cut plane B-B' according to another embodiment of FIG. 4B. At least one of the components of the display 500 shown in FIG. 6 may be the same as or similar to at least one of the components of the

display

330 or 500 shown in FIG. 3 and/or 5, and overlap Description will be omitted below.

Referring to FIG. 6, a display 500 (eg, the display 330 of FIG. 3) according to an embodiment includes

organic material layers

substrate layers

521 and 523.

arrangement elements

515a and 515b may be spaced apart by, for example, a first length S1.

According to some embodiments, the opaque substrate layer 521 may include a first layer 521a, a second layer 521b, an inorganic material layer 527a, and a cover layer 525b. For example, an inorganic material layer 527a may be disposed between the first layer 521a and the second layer 521b. In addition, the cover layer 525b may be disposed on the front surface or the rear surface of the inorganic material layer 527a.

arrangement elements

515a and 515b (eg, subpixels, data lines, gate lines, wirings, electronic devices, and electrodes). have. For example, the transparent substrate layer 523 may be disposed on the rear surface of the transparent organic material layer 510b. In addition, the transparent substrate layer 523 may be distinguished from the opaque substrate layer 521 according to the presence or absence of the cover layer 525b or the inorganic material layer 527a.

FIG. 7A is a view showing a cut plane B-B' according to another embodiment of FIG. 4B. At least one of the components of the display 500 shown in FIG. 7A may be the same as or similar to at least one of the components of the

display

Referring to FIG. 7A, the display 500 (for example, the display 330 of FIG. 3) according to an embodiment includes

organic material layers

substrate layers

521 and 523.

arrangement elements

515a and 515b may be spaced apart by, for example, a first length S1.

According to some embodiments, the opaque substrate layer 521 may include a third layer 521c and a cover layer 525c. For example, a cover layer 525c may be disposed on the third layer 521c. According to some embodiments, when viewed from the organic material layer 510a toward the substrate layer 521, the third layer 521c is in the form of a dot, and has two

arrangement elements

515a and 515b (eg: It may be disposed between subpixels, data lines, gate lines, wirings, electronic devices and electrodes).

arrangement elements

515a and 515b (eg, subpixels, data lines, gate lines, wirings, electronic devices, and electrodes). have. For example, the transparent substrate layer 523 may be disposed on the rear surface of the transparent organic material layer 510b. In addition, the transparent substrate layer 523 may be distinguished from the opaque substrate layer 521 according to the presence or absence of the cover layer 525c.

FIG. 7B is a diagram illustrating a cut plane B-B' according to another embodiment of FIG. 4B. At least one of the components of the display 500 shown in FIG. 7B may be the same as or similar to at least one of the components of the

display

Referring to FIG. 7B, the display 500 (for example, the display 330 of FIG. 3) according to an embodiment includes

organic material layers

substrate layers

521 and 523.

arrangement elements

515a and 515b may be spaced apart by, for example, a first length S1.

According to some embodiments, the opaque substrate layer 521 may include a third layer 521c and a cover layer 525c. For example, a cover layer 525c may be disposed under the third layer 521c. According to some embodiments, when viewed from the organic material layer 510a toward the substrate layer 521, the third layer 521c is in the form of a dot, and has two

arrangement elements

FIG. 8 is a diagram illustrating a cut plane B-B' according to various embodiments of FIG. 4B. At least one of the components of the display 500 shown in FIG. 8 may be the same as or similar to at least one of the components of the

display

Referring to FIG. 8, a display 500 (eg, the display 330 of FIG. 3) according to an embodiment includes a polarizing layer 530, a first base layer 540, and a second base layer 550. can do. In addition, in the display 500 according to an exemplary embodiment,

organic material layers

510a and 510b and

substrate layers

521 and 523 that are separated from each other are disposed between the first base layer 540 and the second base layer 550. I can.

According to an embodiment, the polarizing layer 530 may include a linearly polarized layer (not shown) and a circularly polarized layer (not shown). For example, the linear polarization layer may polarize the vibration direction of light (or signal) passing through the linear polarization layer in a set polarization direction (eg, a direction parallel to the X axis (or Y axis) of the spatial coordinate system). In addition, the circularly polarized layer may be disposed on the front or rear surface of the linearly polarized layer. For example, the circularly polarized layer may have a phase difference generation direction that differs by a set angle (eg, 45 degrees) from a vibration surface corresponding to a vibration direction of light (or signal) passing through the circularly polarized layer.

According to an embodiment, the first base layer 540 may be disposed on the rear surface of the polarization layer 530. For example, the first base layer 540 may maintain a certain rigidity to prevent the

organic material layers

510a and 510b and the substrate layers 521 and 523 from bent. For example, the first base layer 540 may include at least one of glass, an inorganic material, and an organic material.

According to an embodiment, the display 500 corresponding to the opaque region 501 may include an opaque organic material layer 510a and an opaque substrate layer 521. For example, in the opaque organic material layer 510a, arrangement elements W1, W2, R, G, and B (eg, subpixels, data lines, gate lines, wirings, electronic devices, and electrodes) may be disposed. The first arrangement element R and the second arrangement element G may be spaced apart by, for example, a second length S2. The second length S2 may be sufficiently small compared to the width of the transparent region 502. In addition, the second arrangement element G and the third arrangement element B may be spaced apart by a second length S2. According to various embodiments, the first arrangement element R, the second arrangement element G, and the third arrangement element B may be included in one pixel. According to an embodiment, between at least two of the first arrangement element (R), the second arrangement element (G), and the third arrangement element (B), a fourth arrangement element (W1) (e.g., Data Line, Gate Lines, wirings, electronic devices and electrodes) and/or the fifth arrangement element W2 (eg, Data Line, Gate Line, wiring, electronic devices and electrodes) may be disposed. The arrangement elements W1, W2, R, G, and B may act as diffraction elements that cause diffraction to occur.

According to some embodiments, the opaque substrate layer 521 may include a first layer 521a, a second layer 521b, and a cover layer 525d. For example, the cover layer 525d may be formed at various positions of the opaque substrate layer 521 according to the embodiment of FIGS. 5 to 7A.

According to an embodiment, the display 500 corresponding to the transparent region 502 may include a transparent organic material layer 510b and a transparent substrate layer 523.

According to an embodiment, the second base layer 550 may be disposed on the rear surfaces of the substrate layers 521 and 523. For example, the second base layer 550 may maintain a certain rigidity to prevent the

organic material layers

510a and 510b and the substrate layers 521 and 523 from bending. For example, the second base layer 550 may include at least one of glass, an inorganic material, and an organic material. According to various embodiments, the second base layer 550 may be removed during a semiconductor process so that the display 500 may flexibly bend.

The electronic device (eg, the electronic device 300 of FIG. 3) according to the various embodiments described above includes a display on which a first display area (eg, the first display area A1 of FIG. 3) on which a first screen is displayed is formed ( Example: The display 330 of FIG. 3 and a first surface and a second surface in opposite directions are formed, the display is positioned on the first surface, and a sensor module between the display and the first surface (E.g., the sensor module 341 of FIG. 3) includes a printed circuit board (eg, the printed circuit board 340 of FIG. 3), and in the first display area, at least one transparent area (eg: The transparent region 502 of FIG. 4B and at least one opaque region (eg, the opaque region 501 of FIG. 4B) may be arranged to correspond to the position of the sensor module.

According to various embodiments, the opaque region (for example, the opaque region 501 of FIG. 5) is an opaque organic material layer (for example, FIG. 5) on which at least two arrangement elements (eg,

arrangement elements

515a and 515b of FIG. 5) are disposed. The opaque organic material layer 510a of 5) and an opaque substrate layer (eg, the opaque substrate layer 521 of FIG. 5) disposed on the rear surface of the opaque organic material layer in a direction facing the second surface may be included.

According to various embodiments, the at least two arrangement elements (eg,

arrangement elements

515a and 515b of FIG. 5) may be spaced apart from each other by a first length (eg, the first length S1 of FIG. 5 ).

According to various embodiments, the opaque substrate layer (eg, the opaque substrate layer 521 of FIG. 5) is a first layer formed on the entire surface of the opaque substrate layer in a direction facing the first surface (eg, in FIG. 5 ). A first layer 521a) and a second layer (eg, the second layer 521b of FIG. 5) formed on the rear surface of the opaque substrate layer in a direction facing the second surface may be included.

According to various embodiments, the opaque substrate layer (for example, the opaque substrate layer 521 in FIG. 5) is the first layer (for example, the first layer 521a in FIG. 5) and the second layer (for example, A cover layer (eg, the cover layer 525a of FIG. 5) disposed between the second layer 521b of FIG. 5 may be included.

According to various embodiments, the cover layer (eg, the cover layer 525a of FIG. 5) may be formed of a photosensitive material.

According to various embodiments, the opaque substrate layer (for example, the opaque substrate layer 521 in FIG. 6) is the first layer (for example, the first layer 521a in FIG. 6) and the second layer (for example, The inorganic material layer (e.g., the inorganic material layer 527a of FIG. 6) disposed between the second layer 521b of FIG. 6, and the first surface may be disposed on the entire surface of the inorganic material layer, or the second surface A cover layer (eg, the cover layer 525b of FIG. 6) disposed on the rear surface of the inorganic material layer in this direction may be included.

According to various embodiments, the opaque substrate layer (eg, the opaque substrate layer 521 of FIG. 7A) is formed on the entire surface of the opaque substrate layer in a direction toward the first surface, or a direction toward the second surface. As a result, a cover layer (eg, a cover layer 525c of FIG. 7A) formed on the rear surface of the opaque substrate layer may be included.

According to various embodiments of the present disclosure, at least one pixel (eg, the

arrangement elements

515a and 515b of FIG. 5) for displaying the first screen may be disposed.

According to various embodiments, the display (eg, the display 330 of FIG. 3) extends from the first display area (eg, the first display area A1 of FIG. 3) to display a second screen. A second display area (eg, the second display area A2 of FIG. 3) may be formed, and image data corresponding to the second screen may be displayed in the first display area.

According to various embodiments, the display (eg, the display 330 of FIG. 3) extends from the first display area (eg, the first display area A1 of FIG. 3) to display a second screen. A second display area (eg, the screen display area of FIG. 1) may be formed, and image data different from the second screen may be displayed in the first display area.

According to various embodiments, in the first display area (eg, the first display area A1 of FIG. 4B ), the transparent area (eg, the transparent area 502 of FIG. 4B) and the opaque area (eg, FIG. The opaque region 501 of 4b can be regularly coded.

According to various embodiments, in the first display area (eg, the first display area A1 of FIG. 4B ), the transparent area (eg, the transparent area 502 of FIG. 4B) and the opaque area (eg, FIG. The opaque region 501 of 4b may be irregularly coded.

According to various embodiments, the transparent region (for example, the transparent region 502 in FIG. 5) includes a transparent organic material layer (for example, the transparent organic material layer 510b in FIG. 5), and the transparent organic material layer in a direction facing the second surface. It may include a transparent substrate layer (eg, the transparent substrate layer 523 of FIG. 5) disposed on the rear surface of the.

According to various embodiments, the sensor module (eg, the sensor module 341 of FIG. 3) may be at least one of an image sensor, a proximity sensor, an illumination sensor, and a biometric sensor.

An electronic device (eg, the electronic device 300 of FIG. 3) according to the various embodiments described above is a display in which a first display area (eg, the first display area A1 of FIG. 3) on which a first screen is displayed is formed. (Example: display 330 of FIG. 3), and a first surface and a second surface in opposite directions are formed, the display is positioned on the first surface, and a sensor between the display and the first surface Includes a printed circuit board on which a module (eg, the sensor module 341 of FIG. 3) is disposed, eg: the printed circuit board 340 of FIG. 3), and in the first display area, at least one transparent area (eg: The transparent region 502 of FIG. 4B and at least one opaque region (eg, the opaque region 501 of FIG. 4B) are arranged to correspond to the position of the sensor module, and the transparent region and the opaque region are regularly It can be coded.

According to various embodiments, the opaque region (for example, the opaque region 501 in FIG. 4B) is an opaque organic material layer (for example, in which at least two arrangement elements (for example,

arrangement elements

515a and 515b in FIG. 5) are disposed). It may include an opaque organic material layer 510a of FIG. 5 and an opaque substrate layer (eg, opaque substrate layer 521 of FIG. 5) disposed on a rear surface of the opaque organic material layer in a direction facing the second surface.

9 is a block diagram of an electronic device 901 in a network environment 900 according to various embodiments.

Referring to FIG. 9, in a network environment 900, an electronic device 901 (eg, the electronic device 100 of FIG. 1) is connected to an electronic device 902 through a first network 998 (eg, a short-range wireless communication network). ), or the electronic device 904 or the server 908 through the second network 999 (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 901 may communicate with the electronic device 904 through the server 908. According to an embodiment, the electronic device 901 includes a processor 920, a memory 930, an input device 950, an audio output device 955, a display device 960, an audio module 970, and a sensor module ( 976), interface 977, haptic module 979, camera module 980, power management module 988, battery 989, communication module 990, subscriber identification module 996, or antenna module 997 ) Can be included. In some embodiments, at least one of these components (for example, the display device 960 or the camera module 980) may be omitted or one or more other components may be added to the electronic device 901. In some embodiments, some of these components may be implemented as one integrated circuit. For example, the sensor module 976 (eg, a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented while being embedded in the display device 960 (eg, a display).

The processor 920, for example, executes software (eg, a program 940) to perform at least one other component (eg, a hardware or software component) of the electronic device 901 connected to the processor 920. It can be controlled and can perform various data processing or operations. According to an embodiment, as at least part of data processing or operation, the processor 920 may transfer commands or data received from other components (eg, the sensor module 976 or the communication module 990) to the volatile memory 932 Load into, process commands or data stored in volatile memory 932, and store result data in non-volatile memory 934. According to an embodiment, the processor 920 is a main processor 921 (eg, a central processing unit or an application processor), and a secondary processor 923 (eg, a graphics processing unit, an image signal processor) that can be operated independently or together , A sensor hub processor, or a communication processor). Additionally or alternatively, the coprocessor 923 may be configured to use lower power than the main processor 921 or to be specialized for a designated function. The secondary processor 923 may be implemented separately from the main processor 921 or as a part thereof.

The coprocessor 923 is, for example, on behalf of the main processor 921 while the main processor 921 is in an inactive (eg, sleep) state, or the main processor 921 is active (eg, an application is executed). ), together with the main processor 921 while in the state, at least one of the components of the electronic device 901 (for example, the display device 960, the sensor module 976, or the communication module 990) It is possible to control at least some of the functions or states related to. According to an embodiment, the coprocessor 923 (eg, an image signal processor or a communication processor) may be implemented as part of another functionally related component (eg, a camera module 980 or a communication module 990). have.

The memory 930 may store various data used by at least one component of the electronic device 901 (for example, the processor 920 or the sensor module 976 ). The data may include, for example, software (eg, the program 940) and input data or output data for commands related thereto. The memory 930 may include a volatile memory 932 or a nonvolatile memory 934.

The program 940 may be stored as software in the memory 930, and may include, for example, an operating system 942, middleware 944, or an application 946.

The input device 950 may receive a command or data to be used for a component of the electronic device 901 (eg, the processor 920) from outside (eg, a user) of the electronic device 901. The input device 950 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (eg, a stylus pen).

The sound output device 955 may output an sound signal to the outside of the electronic device 901. The sound output device 955 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback, and the receiver can be used to receive incoming calls. According to an embodiment, the receiver may be implemented separately from or as a part of the speaker.

The display device 960 may visually provide information to the outside of the electronic device 901 (eg, a user). The display device 960 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device. According to an embodiment, the display device 960 may include a touch circuitry set to sense a touch, or a sensor circuit (eg, a pressure sensor) set to measure the strength of a force generated by the touch. have.

The audio module 970 may convert sound into an electric signal, or conversely, convert an electric signal into sound. According to an embodiment, the audio module 970 acquires sound through the input device 950, the sound output device 955, or an external electronic device (for example, an external electronic device directly or wirelessly connected to the electronic device 901). Sound may be output through the electronic device 902) (for example, a speaker or headphones).

The sensor module 976 detects an operating state (eg, power or temperature) of the electronic device 901 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state. can do. According to an embodiment, the sensor module 976 includes, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 977 may support one or more designated protocols that may be used for the electronic device 901 to connect directly or wirelessly to an external electronic device (eg, the electronic device 902 ). According to an embodiment, the interface 977 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 978 may include a connector through which the electronic device 901 can be physically connected to an external electronic device (eg, the electronic device 902 ). According to an embodiment, the connection terminal 978 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 979 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that a user can perceive through a tactile or motor sense. According to an embodiment, the haptic module 979 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 980 may capture a still image and a video. According to an embodiment, the camera module 980 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 988 may manage power supplied to the electronic device 901. According to an embodiment, the power management module 988 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

The battery 989 may supply power to at least one component of the electronic device 901. According to an embodiment, the battery 989 may include a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 990 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 901 and an external electronic device (eg, electronic device 902, electronic device 904, or server 908). It is possible to support establishment and communication through the established communication channel. The communication module 990 operates independently of the processor 920 (eg, an application processor) and may include one or more communication processors that support direct (eg, wired) communication or wireless communication. According to an embodiment, the communication module 990 is a wireless communication module 992 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 994 (eg : A LAN (local area network) communication module, or a power line communication module) may be included. Among these communication modules, a corresponding communication module is a first network 998 (for example, a short-range communication network such as Bluetooth, WiFi direct or IrDA (infrared data association)) or a second network 999 (for example, a cellular network, the Internet, or It can communicate with external electronic devices through a computer network (for example, a telecommunication network such as a LAN or WAN). These various types of communication modules may be integrated into one component (eg, a single chip), or may be implemented as a plurality of separate components (eg, multiple chips). The wireless communication module 992 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 996 within a communication network such as the first network 998 or the second network 999. The electronic device 901 can be checked and authenticated.

The antenna module 997 may transmit a signal or power to the outside (eg, an external electronic device) or receive from the outside. According to an embodiment, the antenna module may include one antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern. According to an embodiment, the antenna module 997 may include a plurality of antennas. In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 998 or the second network 999 is, for example, provided by the communication module 990 from the plurality of antennas. Can be chosen. A signal or power may be transmitted or received between the communication module 990 and an external electronic device through the at least one selected antenna. According to some embodiments, other components (eg, RFIC) other than the radiator may be additionally formed as part of the antenna module 797.

At least some of the components are connected to each other through a communication method (e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI))) between peripheral devices and signals ( E.g. commands or data) can be exchanged with each other.

According to an embodiment, the command or data may be transmitted or received between the electronic device 901 and the external electronic device 904 through the server 908 connected to the second network 999. Each of the

electronic devices

902 and 904 may be a device of the same or different type as the electronic device 901. According to an embodiment, all or part of the operations executed by the electronic device 901 may be executed by one or more of the external

electronic devices

902, 904, or 908. For example, when the electronic device 901 needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device 901 does not execute the function or service by itself. In addition or in addition, one or more external electronic devices may be requested to perform the function or at least part of the service. One or more external electronic devices receiving the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit the execution result to the electronic device 901. The electronic device 901 may process the result as it is or additionally and provide it as at least a part of a response to the request. To this end, for example, cloud computing, distributed computing, or client-server computing technology may be used.

Electronic devices according to various embodiments disclosed in this document may be devices of various types. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. The electronic device according to the exemplary embodiment of the present document is not limited to the above-described devices.

Various embodiments of the present document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutes of the corresponding embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or a plurality of the items unless clearly indicated otherwise in a related context. In this document, “A or B”, “at least one of A and B”, “at least one of A or B,” “A, B or C,” “at least one of A, B and C,” and “A Each of phrases such as "at least one of, B, or C" may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish the component from other corresponding components, and the components may be referred to in other aspects (eg, importance or Order) is not limited. Some (eg, first) component is referred to as “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively”. When mentioned, it means that any of the above components can be connected to the other components directly (eg by wire), wirelessly, or via a third component.

The term "module" used in this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic blocks, parts, or circuits. The module may be an integrally configured component or a minimum unit of the component or a part thereof that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document include one or more commands stored in a storage medium (eg, internal memory 936 or external memory 938) that can be read by a machine (eg, electronic device 100). It may be implemented as software (eg, a program 940) including them. For example, the processor (eg, the processor 920) of the device (eg, the electronic device 100) may call and execute at least one command among one or more commands stored from a storage medium. This makes it possible for the device to be operated to perform at least one function according to the at least one command invoked. The one or more instructions may include code generated by a compiler or code executable by an interpreter. A storage medium that can be read by a device may be provided in the form of a non-transitory storage medium. Here,'non-transient' only means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic wave), and this term refers to the case where data is semi-permanently stored in the storage medium. It does not distinguish between temporary storage cases.

According to an embodiment, a method according to various embodiments disclosed in this document may be provided by being included in a computer program product (computer pro memory product). Computer program products can be traded between sellers and buyers as commodities. Computer program products are distributed in the form of a device-readable storage medium (e.g. compact disc read only memory (CD-ROM)), or via an application store (e.g. Play Store ^TM ) or on two user devices (e.g. : It can be distributed (e.g., downloaded or uploaded) between directly or online. In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a storage medium that can be read by a device such as a server of a manufacturer, a server of an application store, or a memory of a relay server.

According to various embodiments, each component (eg, module or program) of the above-described components may include a singular number or a plurality of entities. According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components in the same or similar to that performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component may be sequentially, parallel, repeatedly, or heuristically executed, or one or more of the operations may be executed in a different order or omitted. , Or one or more other actions may be added.

Claims

In the electronic device,

A display including a first display area on which a first screen is displayed; And

Including; a sensor module positioned under the first display area of the display,

The first display area includes at least one transparent area and at least one opaque area,

The electronic device, wherein the transparent region and the opaque region are coded.
The method according to claim 1,

The opaque zone,

An opaque organic material layer on which at least two arrangement elements are disposed; And

And an opaque substrate layer disposed under the opaque organic material layer.
The method according to claim 2,

Said at least two arrangement elements,

Electronic devices spaced apart from each other by a first length.
The method according to claim 2,

The opaque substrate layer,

A first layer formed on the entire surface of the opaque substrate layer; And

And a second layer formed on the rear surface of the opaque substrate layer.
The method of claim 4,

The opaque substrate layer,

And a cover layer disposed between the first layer and the second layer.
The method of claim 5,

The cover layer,

An electronic device formed of a photosensitive material.
The method according to claim 2,

The opaque substrate layer,

And a cover layer formed on the front surface of the opaque substrate layer or on the rear surface of the opaque substrate layer.
The method of claim 4,

The opaque substrate layer,

An inorganic material layer disposed between the first layer and the second layer; And

And a cover layer disposed on the front surface of the inorganic material layer or on the rear surface of the inorganic material layer.
The method according to claim 1,

In the opaque zone,

An electronic device in which at least one pixel for displaying the first screen is disposed.
The method according to claim 1,

The display includes a second display area extending from the first display area and displaying a second screen,

Image data corresponding to the second screen is displayed in the first display area.
The method according to claim 1,

The display includes a second display area extending from the first display area and displaying a second screen,

An electronic device displaying image data different from that of the second screen in the first display area.
The method according to claim 1,

In the first display area,

The electronic device in which the transparent region and the opaque region are regularly coded.
The method according to claim 1,

In the first display area,

The electronic device in which the transparent region and the opaque region are irregularly coded.
The method according to claim 1,

The transparent zone,

A transparent organic material layer; And

And a transparent substrate layer disposed on the rear surface of the transparent organic material layer.
The method according to claim 1,

The sensor module,

An electronic device that is at least one of an image sensor, a proximity sensor, an illuminance sensor, and a biometric sensor.