WO2020256501A1 - Dispositif électronique comprenant un dispositif d'affichage - Google Patents

Dispositif électronique comprenant un dispositif d'affichage Download PDF

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Publication number
WO2020256501A1
WO2020256501A1 PCT/KR2020/008016 KR2020008016W WO2020256501A1 WO 2020256501 A1 WO2020256501 A1 WO 2020256501A1 KR 2020008016 W KR2020008016 W KR 2020008016W WO 2020256501 A1 WO2020256501 A1 WO 2020256501A1
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WIPO (PCT)
Prior art keywords
layer
opaque
electronic device
display
display area
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Application number
PCT/KR2020/008016
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English (en)
Korean (ko)
Inventor
신성영
신현창
양병덕
정송희
허용구
김광태
염동현
Original Assignee
삼성전자 주식회사
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Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Publication of WO2020256501A1 publication Critical patent/WO2020256501A1/fr

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0249—Details of the mechanical connection between the housing parts or relating to the method of assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly

Definitions

  • Various embodiments of the present document relate to an electronic device including a display.
  • An electronic device may include a display in which arrangement elements (eg, sub-pixels, data lines, gate lines, wirings, electronic elements, and electrodes) are disposed in at least some areas.
  • arrangement elements eg, sub-pixels, data lines, gate lines, wirings, electronic elements, and electrodes
  • a sensor eg, a camera
  • the electronic device may acquire an image of a subject through a camera disposed in the non-display area.
  • the electronic device may have a display in which the entire front surface is used as a display area of the screen.
  • a sensor may be disposed on the rear surface of the display corresponding to the display area.
  • the electronic device is caused by diffraction generated between the elements of the display area (e.g., sub-pixels, data lines, gate lines, wiring, electronic elements, and electrodes). Performance (eg resolution) may be degraded.
  • the sensor when the sensor is disposed to correspond to the position of the display area, light (or signal) reaching the sensor may be attenuated by the placement elements.
  • Various embodiments disclosed in this document are intended to provide an electronic device including a display.
  • a display in which a first display area on which a first screen is displayed is formed, and a first surface and a second surface in opposite directions are formed on the first surface. And a printed circuit board on which the display is located and a sensor module is disposed between the display and the first surface, and in the first display area, at least one transparent area and at least one opaque area are formed of the sensor module. It can be arranged to correspond to the position.
  • the electronic device includes a display having a first display area on which a first screen is displayed, and a first surface and a second surface opposite to each other, and the first
  • the display is positioned on a surface, and includes a printed circuit board having a sensor module disposed between the display and the first surface, and in the first display area, at least one transparent area and at least one opaque area are provided with the sensor. It is arranged to correspond to the position of the module, and the transparent area and the opaque area may be regularly coded.
  • At least a part of a sensor is disposed to correspond to a display area, but between elements of the display area (eg, subpixels, data lines, gate lines, wirings, electronic devices, and electrodes) It is possible to minimize the interference of light (or signal) caused by diffraction of
  • At least a part of the sensor is disposed to correspond to the display area, and the amount of light (or signal) reaching the sensor may be maintained above a certain level.
  • FIG. 1 is a diagram illustrating a front surface of an electronic device according to an exemplary embodiment.
  • FIG. 2 is a diagram illustrating a rear surface of an electronic device according to an exemplary embodiment.
  • FIG. 3 is a diagram illustrating an electronic device according to an exemplary embodiment.
  • 4A is a cross-sectional view illustrating an area of an electronic device according to an exemplary embodiment.
  • 4B is an enlarged view of a portion “A1” according to the embodiment of FIG. 3.
  • FIG. 5 is a diagram illustrating a cut plane B-B' according to the embodiment of FIG. 4B.
  • FIG. 6 is a diagram illustrating a cut plane B-B' according to another embodiment of FIG. 4B.
  • FIG. 7A is a view showing a cut plane B-B' according to another embodiment of FIG. 4B.
  • FIG. 7B is a diagram illustrating a cut plane B-B' according to another embodiment of FIG. 4B.
  • FIG. 8 is a diagram illustrating a cut plane B-B' according to various embodiments of FIG. 4B.
  • FIG. 9 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.
  • 1 is a diagram illustrating a front surface of an electronic device according to an exemplary embodiment.
  • 2 is a diagram illustrating a rear surface of an electronic device according to an exemplary embodiment.
  • the electronic device 100 includes a first surface (or front surface) 110A, a second surface (or rear surface) 110B, and a first surface 110A, and It may include a housing 110 including a side surface 110C surrounding the space between the second surfaces 110B.
  • the housing may refer to a structure forming some of the first surface 110A, the second surface 110B, and the side surface 110C of FIG. 1.
  • at least a portion of the first surface 110A may be formed by a substantially transparent front plate 102 (eg, a glass plate including various coating layers or a polymer plate).
  • the second surface 110B may be formed by a substantially opaque rear plate 111.
  • the back plate 111 is formed by, for example, coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. Can be.
  • the side surface 110C is coupled to the front plate 102 and the rear plate 111 and may be formed by a side bezel structure (or “side member”) 118 including metal and/or polymer.
  • the back plate 111 and the side bezel structure 118 are integrally formed and may include the same material (eg, a metal material such as aluminum).
  • the front plate 102 includes two first regions 110D that are curved toward the rear plate 111 from the first surface 110A and extend seamlessly, the front plate It may be included at both ends of the long edge (102).
  • the rear plate 111 is curved toward the front plate 102 from the second surface 110B to seamlessly extend two second regions 110E with a long edge. Can be included at both ends.
  • the front plate 102 (or the rear plate 111) may include only one of the first regions 110D (or the second regions 110E). According to another embodiment, some of the first regions 110D or the second regions 110E may not be included.
  • the side bezel structure 118 when viewed from the side of the electronic device 100, is a side surface that does not include the first regions 110D or the second regions 110E. It may have one thickness (or width), and may have a second thickness that is thinner than the first thickness on a side surface including the first regions 110D or the second regions 110E.
  • the electronic device 100 includes a display 101, an audio module 103, 107, 114, a sensor module 104, 116, 119, a camera module 105, 112, 113, and a key input. It may include at least one or more of the device 117, the light emitting element 106, and the connector holes 108, 109. According to some embodiments, the electronic device 100 may omit at least one of the components (for example, the key input device 117 or the light emitting device 106) or additionally include other components.
  • Display 101 may be exposed through a substantial portion of front plate 102, for example. According to some embodiments, at least a portion of the display 101 may be exposed through the front plate 102 forming the first surface 110A and the first regions 110D of the side surface 110C. . According to some embodiments, the edge of the display 101 may be formed to have substantially the same shape as an adjacent outer shape of the front plate 102. According to another embodiment (not shown), in order to expand the area to which the display 101 is exposed, the distance between the outer periphery of the display 101 and the outer periphery of the front plate 102 may be formed substantially the same.
  • the display 101 includes at least one of the audio module 114, the sensor module 104, the camera module 105, the fingerprint sensor 116, and the light emitting element 106 on the rear surface of the screen display area. It may contain more than one. According to another embodiment (not shown), the display 101 forms a recess or opening in a part of the screen display area, and the audio module 114 is aligned with the recess or the opening. , The sensor module 104, the camera module 105, and may include at least one or more of the light emitting device 106.
  • the display 101 is coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field type stylus pen.
  • a touch sensing circuit capable of measuring the intensity (pressure) of a touch
  • a digitizer capable of measuring the intensity (pressure) of a touch
  • a digitizer that detects a magnetic field type stylus pen.
  • at least a part of the sensor modules 104 and 119 and/or at least a part of the key input device 117 may include the first regions 110D and/or the second regions 110E. ) Can be placed in.
  • the audio modules 103, 107, and 114 may include microphone holes 103 and speaker holes 107 and 114.
  • a microphone for acquiring external sound may be disposed inside, and in some embodiments, a plurality of microphones may be disposed to detect the direction of sound.
  • the speaker holes 107 and 114 may include an external speaker hole 107 and a call receiver hole 114.
  • the speaker holes 107 and 114 and the microphone hole 103 may be implemented as one hole, or a speaker (eg, piezo speaker) may be included without the speaker holes 107 and 114.
  • the sensor modules 104, 116, and 119 may generate electrical signals or data values corresponding to an internal operating state of the electronic device 100 or an external environmental state.
  • the sensor modules 104, 116, 119 are, for example, a first sensor module 104 (for example, a proximity sensor) disposed on the first surface 110A of the housing 110 and/or a second sensor module ( Not shown) (for example, a fingerprint sensor), and/or a third sensor module 119 (for example, an HRM sensor) and/or a fourth sensor module 116 disposed on the second side 110B of the housing 110 ) (E.g. fingerprint sensor).
  • the fingerprint sensor may be disposed on the first surface 110A of the housing 110 (eg, not only the display 101 but also the second surface 110B.
  • the electronic device 100 is a sensor module, not shown, for example, for example, at least one of a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor 104 is further included.
  • a gesture sensor e.g., a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor 104 is further included.
  • IR infrared
  • the camera modules 105, 112, and 113 include a first camera device 105 disposed on the first surface 110A of the electronic device 100, and a second camera device 112 disposed on the second surface 110B. ), and/or a flash 113.
  • the camera devices 105 and 112 may include one or more lenses, an image sensor, and/or an image signal processor.
  • the flash 113 may include, for example, a light emitting diode or a xenon lamp. According to some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one surface of the electronic device 100.
  • the key input device 117 may be disposed on the side surface 110C of the housing 110. According to another embodiment, the electronic device 100 may not include some or all of the aforementioned key input devices 117, and the key input device 117 that is not included may be soft on the display 101. It can be implemented in other forms such as keys. According to some embodiments, the key input device 117 may include a sensor module 116 disposed on the second surface 110B of the housing 110.
  • the light emitting device 106 may be disposed on the first surface 110A of the housing 110, for example.
  • the light-emitting element 106 may provide state information of the electronic device 100 in the form of light, for example.
  • the light emitting device 106 may provide a light source that is interlocked with the operation of the camera module 105, for example.
  • the light-emitting element 106 may include, for example, an LED, an IR LED, and a xenon lamp.
  • the connector holes 108 and 109 are a first connector hole 108 capable of receiving a connector (eg, a USB connector) for transmitting and receiving power and/or data with an external electronic device, and/or an external electronic device. And a second connector hole (eg, an earphone jack) 109 capable of accommodating a connector for transmitting and receiving an audio signal.
  • a connector eg, a USB connector
  • a second connector hole eg, an earphone jack
  • FIG. 3 is a diagram illustrating an electronic device according to an exemplary embodiment.
  • the electronic device 300 includes a side bezel structure 310, a first support member 311 (eg, a bracket), a front plate 320, a display 330, and a printed circuit board 340. , A battery 350, a second support member 360 (eg, a rear case), an antenna 370, and a rear plate 380.
  • the electronic device 300 may omit at least one of the components (for example, the first support member 311 or the second support member 360), or additionally include other components. have.
  • At least one of the components of the electronic device 300 may be the same as or similar to at least one of the components of the electronic device 100 of FIG. 1 or 2, and redundant descriptions will be omitted below.
  • the first support member 311 may be disposed inside the electronic device 300 and connected to the side bezel structure 310, or may be integrally formed with the side bezel structure 310.
  • the first support member 311 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material.
  • the display 330 may be coupled to one surface and the printed circuit board 340 may be coupled to the other surface.
  • a processor, memory, and/or interface may be mounted on the printed circuit board 340.
  • the processor may include, for example, one or more of a central processing unit, an application processor, a graphic processing unit, an image signal processor, a sensor hub processor, or a communication processor.
  • the memory may include, for example, volatile memory or nonvolatile memory.
  • the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • the interface may electrically or physically connect the electronic device 300 to an external electronic device, for example, and may include a USB connector, an SD card/MMC connector, or an audio connector.
  • the display 330 may be coupled to correspond to the first surface (eg, the front surface) of the printed circuit board 340.
  • the display 330 may include a first display area A1 and a second display area A2 (eg, the screen display area of FIG. 1 ).
  • the first display area A1 and the second display area A2 may include a plurality of pixels to display an image.
  • the first display area A1 may extend from the second display area A2.
  • a first screen maining part of the screen
  • the second display area A2 on which the second screen (eg, some screens) is displayed may be displayed. .
  • image data corresponding to image data of the second screen or image data different from image data of the second screen may be displayed on the first screen.
  • the display 330 is located at a position corresponding to at least one of the sensor modules 104, 116, 119, the camera modules 105, 112, 113, and the light emitting element 106 shown in FIG. 1.
  • the first display area A1 may be formed.
  • the printed circuit board 340 may be positioned so that the display 330 corresponds to the first surface (eg, the front surface).
  • a sensor module 341 eg, an image sensor, a proximity sensor, an illuminance sensor, and a biometric sensor
  • the sensor module 341 may be disposed on the printed circuit board 340 to correspond to the position of the first display area A1.
  • the battery 350 is a device for supplying power to at least one component of the electronic device 300, and may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell. . At least a portion of the battery 350 may be disposed substantially on the same plane as the printed circuit board 340, for example. The battery 350 may be integrally disposed inside the electronic device 300 or may be disposed detachably from the electronic device 300.
  • the antenna 370 may be disposed between the rear plate 380 and the battery 350.
  • the antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
  • the antenna 370 may perform short-range communication with an external device or wirelessly transmit/receive power required for charging.
  • an antenna structure may be formed by a side bezel structure 310 and/or a part of the first support member 311 or a combination thereof.
  • FIG. 4A is a cross-sectional view illustrating an area of an electronic device according to an exemplary embodiment. Specifically, FIG. 4A is a cross-sectional view illustrating a first display area of FIG. 3 and a peripheral area thereof in an electronic device according to an exemplary embodiment.
  • the electronic device 400 may include a display 330, a cover panel 410, a front plate 320, a sensor module 341, and a printed circuit board 340.
  • the display 330 may include a first display area A1 and a second display area A2 surrounding the first display area A1.
  • the first display area A1 may be positioned to correspond to a field of view (FOV) of the sensor module 341.
  • the first display area A1 and the second display area A2 of the display 330 may display a screen including a plurality of pixels and a plurality of signal lines transmitting signals to the plurality of pixels.
  • the front plate 320 may be positioned on the display 330.
  • the front plate 320 may include a transparent material to transmit light.
  • the display 330 may display a screen through the front plate 320.
  • the front plate 320 may include at least one of tempered glass, tempered plastic, or a flexible polymer material.
  • the front plate 320 may be attached to the display 330 by a transparent adhesive layer (not shown).
  • the cover panel 410 may be located under the display 330.
  • the cover panel 410 may be a layer protecting one surface of the display 330.
  • the cover panel 410 may include at least one of a metal layer (eg, a copper sheet) or a light shielding layer (eg, a black embo layer).
  • the sensor module 341 may be located under the display 330 and the cover panel 410.
  • the sensor module 341 may be located under the first display area A1 of the display 330.
  • the cover panel 410 may include a light blocking layer so that light may not be transmitted.
  • An opening 411 may be positioned in at least a part of the cover panel 410 disposed above the sensor module 341 so that the sensor module 341 can detect external light.
  • the opening 411 of the cover panel 410 may be formed in a position and size corresponding to the field of view (FOV) of the sensor module 341.
  • FOV field of view
  • the printed circuit board 340 may include a processor (eg, the processor 920 of FIG. 9 ).
  • the printed circuit board 340 is electrically connected to the sensor module 341 to obtain and process information sensed by the sensor module 341.
  • 4B is an enlarged view of a portion “A1” according to the embodiment of FIG. 3.
  • the first display area A1 may include at least one opaque area 501 and at least one transparent area 502.
  • the opaque region 501 may be a region through which light does not pass.
  • the transparent region 502 may be an area through which light passes.
  • the first display area A1 may display an image through a plurality of pixels located in the opaque area 501.
  • the transparent region 502 may be a region from which pixels have been removed.
  • a plurality of pixels may be located in the opaque area 501 and may not be located in the transparent area 502.
  • At least one opaque area 501 and at least one transparent area 502 may be coded. Coding may mean calculating (or determining) a pattern of transparent and opaque regions (eg, a grid pattern) that allows diffraction of light to be reduced. According to an embodiment, coding may be performed in units of pixels. In other words, a pattern of a transparent area and an opaque area may be calculated using the area of one pixel as a minimum unit.
  • the electronic device includes a transparent region and an opaque region based on a coded pattern (eg, a coded aperture), and pixels are located in the opaque region, so that diffraction of light reaching the sensor module may be reduced.
  • At least one opaque area 501 and at least one transparent area 502 may be regularly coded.
  • At least one opaque area 501 and at least one transparent area 502 may be irregularly coded.
  • the first display area A1 may be disposed to correspond to at least a portion of a sensor module (eg, an image sensor, a proximity sensor, an illuminance sensor, and a biometric sensor).
  • a sensor module eg, an image sensor, a proximity sensor, an illuminance sensor, and a biometric sensor.
  • some of the sensor modules may be disposed in the opaque area 501.
  • the remaining part of the sensor module may be disposed in the transparent area 502.
  • at least one pixel for displaying a screen of the display may be disposed on a display corresponding to the opaque area 501 (eg, the display 330 of FIG. 3 ).
  • FIG. 5 is a diagram illustrating a cut plane B-B' according to the embodiment of FIG. 4B.
  • a display 500 (eg, the display 330 of FIG. 3) according to an embodiment includes organic material layers 510a and 510b that are separated from each other according to an opaque region 501 and a transparent region 502. It may include substrate layers 521 and 523.
  • the display 500 corresponding to the opaque region 501 may include an opaque organic material layer 510a and an opaque substrate layer 521.
  • the opaque organic material layer 510a at least two arrangement elements 515a and 515b (eg, subpixels, data lines, gate lines, wirings, electronic devices, and electrodes) may be disposed.
  • the two arrangement elements 515a and 515b may be spaced apart by, for example, a first length S1.
  • the opaque substrate layer 521 may be disposed on the rear surface (or under) of the opaque organic material layer 510a.
  • the opaque substrate layer 521 may include a first layer 521a, a second layer 521b, and a cover layer 525a.
  • the first layer 521a may be disposed on the entire surface of the opaque substrate layer 521.
  • the second layer 521b may be disposed on the rear surface of the opaque substrate layer 521.
  • a cover layer 525a may be disposed between the first layer 521a and the second layer 521b.
  • the cover layer 525a may be disposed in the opaque region 501 so as to correspond to, for example, the arrangement elements 515a and 515b (eg, subpixels, data lines, gate lines, wirings, electronic devices, and electrodes).
  • the cover layer 525a may be positioned extending to the periphery of the opaque region 501. According to another embodiment, the cover layer 525a may be located in a region of the opaque region 501 excluding an edge of the opaque region 501.
  • the cover layer 525a includes a sensor module (eg, an image sensor, a proximity sensor, an illuminance sensor, and a living body) in which light (or signal) passing through the space in which the first length S1 is formed is disposed on the rear surface of the display 500 The sensor module can be covered so that it does not reach the recognition sensor.
  • the cover layer 525a may include a material that does not transmit light. According to various embodiments, the cover layer 525a may be formed of a photosensitive material capable of patterning.
  • the display 500 corresponding to the transparent region 502 may include a transparent organic material layer 510b and a transparent substrate layer 523.
  • the transparent organic material layer 510b may be distinguished from the opaque organic material layer 510a depending on the presence or absence of the arrangement elements 515a and 515b (eg, subpixels, data lines, gate lines, wirings, electronic devices, and electrodes). have.
  • the arrangement elements 515a and 515b may not be disposed on the transparent organic material layer 510b.
  • the transparent region 502 may be a region from which pixels have been removed.
  • the first length S1 may be sufficiently small compared to the width of the transparent region 502.
  • the transparent substrate layer 523 may be disposed on the rear surface of the transparent organic material layer 510b. Also, the transparent substrate layer 523 may be distinguished from the opaque substrate layer 521 according to the presence or absence of the cover layer 525a. According to various embodiments of the present disclosure, in the display 500, the opaque organic material layer 510a and the transparent organic material layer 510b may be formed of materials having the same properties according to a semiconductor process. In addition, in the display 500, the opaque substrate layer 521 and the transparent substrate layer 523 may be formed of materials having the same properties according to a semiconductor process. For example, the first layer 521a and the second layer 521b may include the same material as the transparent substrate layer 523. For example, the first layer 521a, the second layer 521b, and the transparent substrate layer 523 may include polyimide (PI).
  • PI polyimide
  • the display 500 may include a structure of not only organic light emitting diodes (OLEDs) but also liquid crystal displays (LCDs).
  • OLEDs organic light emitting diodes
  • LCDs liquid crystal displays
  • FIG. 6 is a diagram illustrating a cut plane B-B' according to another embodiment of FIG. 4B. At least one of the components of the display 500 shown in FIG. 6 may be the same as or similar to at least one of the components of the display 330 or 500 shown in FIG. 3 and/or 5, and overlap Description will be omitted below.
  • a display 500 (eg, the display 330 of FIG. 3) according to an embodiment includes organic material layers 510a and 510b that are separated from each other according to an opaque region 501 and a transparent region 502. It may include substrate layers 521 and 523.
  • the display 500 corresponding to the opaque region 501 may include an opaque organic material layer 510a and an opaque substrate layer 521.
  • an opaque organic material layer 510a at least two arrangement elements 515a and 515b (eg, subpixels, data lines, gate lines, wirings, electronic devices, and electrodes) may be disposed.
  • the two arrangement elements 515a and 515b may be spaced apart by, for example, a first length S1.
  • the opaque substrate layer 521 may include a first layer 521a, a second layer 521b, an inorganic material layer 527a, and a cover layer 525b.
  • an inorganic material layer 527a may be disposed between the first layer 521a and the second layer 521b.
  • the cover layer 525b may be disposed on the front surface or the rear surface of the inorganic material layer 527a.
  • the display 500 corresponding to the transparent region 502 may include a transparent organic material layer 510b and a transparent substrate layer 523.
  • the transparent organic material layer 510b may be distinguished from the opaque organic material layer 510a depending on the presence or absence of the arrangement elements 515a and 515b (eg, subpixels, data lines, gate lines, wirings, electronic devices, and electrodes).
  • the transparent substrate layer 523 may be disposed on the rear surface of the transparent organic material layer 510b.
  • the transparent substrate layer 523 may be distinguished from the opaque substrate layer 521 according to the presence or absence of the cover layer 525b or the inorganic material layer 527a.
  • FIG. 7A is a view showing a cut plane B-B' according to another embodiment of FIG. 4B. At least one of the components of the display 500 shown in FIG. 7A may be the same as or similar to at least one of the components of the display 330 or 500 shown in FIG. 3 and/or 5, and overlap Description will be omitted below.
  • the display 500 (for example, the display 330 of FIG. 3) according to an embodiment includes organic material layers 510a and 510b that are separated from each other according to an opaque region 501 and a transparent region 502. It may include substrate layers 521 and 523.
  • the display 500 corresponding to the opaque region 501 may include an opaque organic material layer 510a and an opaque substrate layer 521.
  • an opaque organic material layer 510a at least two arrangement elements 515a and 515b (eg, subpixels, data lines, gate lines, wirings, electronic devices, and electrodes) may be disposed.
  • the two arrangement elements 515a and 515b may be spaced apart by, for example, a first length S1.
  • the opaque substrate layer 521 may include a third layer 521c and a cover layer 525c.
  • a cover layer 525c may be disposed on the third layer 521c.
  • the third layer 521c when viewed from the organic material layer 510a toward the substrate layer 521, the third layer 521c is in the form of a dot, and has two arrangement elements 515a and 515b (eg: It may be disposed between subpixels, data lines, gate lines, wirings, electronic devices and electrodes).
  • the display 500 corresponding to the transparent region 502 may include a transparent organic material layer 510b and a transparent substrate layer 523.
  • the transparent organic material layer 510b may be distinguished from the opaque organic material layer 510a depending on the presence or absence of the arrangement elements 515a and 515b (eg, subpixels, data lines, gate lines, wirings, electronic devices, and electrodes).
  • the transparent substrate layer 523 may be disposed on the rear surface of the transparent organic material layer 510b.
  • the transparent substrate layer 523 may be distinguished from the opaque substrate layer 521 according to the presence or absence of the cover layer 525c.
  • FIG. 7B is a diagram illustrating a cut plane B-B' according to another embodiment of FIG. 4B. At least one of the components of the display 500 shown in FIG. 7B may be the same as or similar to at least one of the components of the display 330 or 500 shown in FIG. 3 and/or 5, and overlap Description will be omitted below.
  • the display 500 (for example, the display 330 of FIG. 3) according to an embodiment includes organic material layers 510a and 510b that are separated from each other according to an opaque region 501 and a transparent region 502. It may include substrate layers 521 and 523.
  • the display 500 corresponding to the opaque region 501 may include an opaque organic material layer 510a and an opaque substrate layer 521.
  • an opaque organic material layer 510a at least two arrangement elements 515a and 515b (eg, subpixels, data lines, gate lines, wirings, electronic devices, and electrodes) may be disposed.
  • the two arrangement elements 515a and 515b may be spaced apart by, for example, a first length S1.
  • the opaque substrate layer 521 may include a third layer 521c and a cover layer 525c.
  • a cover layer 525c may be disposed under the third layer 521c.
  • the third layer 521c when viewed from the organic material layer 510a toward the substrate layer 521, the third layer 521c is in the form of a dot, and has two arrangement elements 515a and 515b (eg: It may be disposed between subpixels, data lines, gate lines, wirings, electronic devices and electrodes).
  • the display 500 corresponding to the transparent region 502 may include a transparent organic material layer 510b and a transparent substrate layer 523.
  • the transparent organic material layer 510b may be distinguished from the opaque organic material layer 510a depending on the presence or absence of the arrangement elements 515a and 515b (eg, subpixels, data lines, gate lines, wirings, electronic devices, and electrodes).
  • the transparent substrate layer 523 may be disposed on the rear surface of the transparent organic material layer 510b.
  • the transparent substrate layer 523 may be distinguished from the opaque substrate layer 521 according to the presence or absence of the cover layer 525c.
  • FIG. 8 is a diagram illustrating a cut plane B-B' according to various embodiments of FIG. 4B. At least one of the components of the display 500 shown in FIG. 8 may be the same as or similar to at least one of the components of the display 330 or 500 shown in FIG. 3 and/or 5, and overlap Description will be omitted below.
  • a display 500 (eg, the display 330 of FIG. 3) according to an embodiment includes a polarizing layer 530, a first base layer 540, and a second base layer 550. can do.
  • organic material layers 510a and 510b and substrate layers 521 and 523 that are separated from each other are disposed between the first base layer 540 and the second base layer 550. I can.
  • the polarizing layer 530 may include a linearly polarized layer (not shown) and a circularly polarized layer (not shown).
  • the linear polarization layer may polarize the vibration direction of light (or signal) passing through the linear polarization layer in a set polarization direction (eg, a direction parallel to the X axis (or Y axis) of the spatial coordinate system).
  • the circularly polarized layer may be disposed on the front or rear surface of the linearly polarized layer.
  • the circularly polarized layer may have a phase difference generation direction that differs by a set angle (eg, 45 degrees) from a vibration surface corresponding to a vibration direction of light (or signal) passing through the circularly polarized layer.
  • the first base layer 540 may be disposed on the rear surface of the polarization layer 530.
  • the first base layer 540 may maintain a certain rigidity to prevent the organic material layers 510a and 510b and the substrate layers 521 and 523 from bent.
  • the first base layer 540 may include at least one of glass, an inorganic material, and an organic material.
  • the display 500 corresponding to the opaque region 501 may include an opaque organic material layer 510a and an opaque substrate layer 521.
  • arrangement elements W1, W2, R, G, and B eg, subpixels, data lines, gate lines, wirings, electronic devices, and electrodes
  • the first arrangement element R and the second arrangement element G may be spaced apart by, for example, a second length S2.
  • the second length S2 may be sufficiently small compared to the width of the transparent region 502.
  • the second arrangement element G and the third arrangement element B may be spaced apart by a second length S2.
  • the first arrangement element R, the second arrangement element G, and the third arrangement element B may be included in one pixel.
  • a fourth arrangement element (W1) e.g., Data Line, Gate Lines, wirings, electronic devices and electrodes
  • W2 e.g., Data Line, Gate Line, wiring, electronic devices and electrodes
  • the arrangement elements W1, W2, R, G, and B may act as diffraction elements that cause diffraction to occur.
  • the opaque substrate layer 521 may include a first layer 521a, a second layer 521b, and a cover layer 525d.
  • the cover layer 525d may be formed at various positions of the opaque substrate layer 521 according to the embodiment of FIGS. 5 to 7A.
  • the display 500 corresponding to the transparent region 502 may include a transparent organic material layer 510b and a transparent substrate layer 523.
  • the second base layer 550 may be disposed on the rear surfaces of the substrate layers 521 and 523.
  • the second base layer 550 may maintain a certain rigidity to prevent the organic material layers 510a and 510b and the substrate layers 521 and 523 from bending.
  • the second base layer 550 may include at least one of glass, an inorganic material, and an organic material.
  • the second base layer 550 may be removed during a semiconductor process so that the display 500 may flexibly bend.
  • the electronic device (eg, the electronic device 300 of FIG. 3) according to the various embodiments described above includes a display on which a first display area (eg, the first display area A1 of FIG. 3) on which a first screen is displayed is formed ( Example: The display 330 of FIG. 3 and a first surface and a second surface in opposite directions are formed, the display is positioned on the first surface, and a sensor module between the display and the first surface (E.g., the sensor module 341 of FIG. 3) includes a printed circuit board (eg, the printed circuit board 340 of FIG. 3), and in the first display area, at least one transparent area (eg: The transparent region 502 of FIG. 4B and at least one opaque region (eg, the opaque region 501 of FIG. 4B) may be arranged to correspond to the position of the sensor module.
  • a first display area eg, the first display area A1 of FIG. 3
  • a first screen e.g., the first screen is displayed
  • the opaque region (for example, the opaque region 501 of FIG. 5) is an opaque organic material layer (for example, FIG. 5) on which at least two arrangement elements (eg, arrangement elements 515a and 515b of FIG. 5) are disposed.
  • the opaque organic material layer 510a of 5) and an opaque substrate layer (eg, the opaque substrate layer 521 of FIG. 5) disposed on the rear surface of the opaque organic material layer in a direction facing the second surface may be included.
  • the at least two arrangement elements may be spaced apart from each other by a first length (eg, the first length S1 of FIG. 5 ).
  • the opaque substrate layer (eg, the opaque substrate layer 521 of FIG. 5) is a first layer formed on the entire surface of the opaque substrate layer in a direction facing the first surface (eg, in FIG. 5 ).
  • a first layer 521a) and a second layer (eg, the second layer 521b of FIG. 5) formed on the rear surface of the opaque substrate layer in a direction facing the second surface may be included.
  • the opaque substrate layer (for example, the opaque substrate layer 521 in FIG. 5) is the first layer (for example, the first layer 521a in FIG. 5) and the second layer (for example, A cover layer (eg, the cover layer 525a of FIG. 5) disposed between the second layer 521b of FIG. 5 may be included.
  • the cover layer (eg, the cover layer 525a of FIG. 5) may be formed of a photosensitive material.
  • the opaque substrate layer (for example, the opaque substrate layer 521 in FIG. 6) is the first layer (for example, the first layer 521a in FIG. 6) and the second layer (for example,
  • the inorganic material layer e.g., the inorganic material layer 527a of FIG. 6) disposed between the second layer 521b of FIG. 6, and the first surface may be disposed on the entire surface of the inorganic material layer, or the second surface A cover layer (eg, the cover layer 525b of FIG. 6) disposed on the rear surface of the inorganic material layer in this direction may be included.
  • the opaque substrate layer (eg, the opaque substrate layer 521 of FIG. 7A) is formed on the entire surface of the opaque substrate layer in a direction toward the first surface, or a direction toward the second surface.
  • a cover layer (eg, a cover layer 525c of FIG. 7A) formed on the rear surface of the opaque substrate layer may be included.
  • At least one pixel (eg, the arrangement elements 515a and 515b of FIG. 5) for displaying the first screen may be disposed.
  • the display extends from the first display area (eg, the first display area A1 of FIG. 3) to display a second screen.
  • a second display area eg, the second display area A2 of FIG. 3 may be formed, and image data corresponding to the second screen may be displayed in the first display area.
  • the display extends from the first display area (eg, the first display area A1 of FIG. 3) to display a second screen.
  • a second display area eg, the screen display area of FIG. 1 may be formed, and image data different from the second screen may be displayed in the first display area.
  • the transparent area eg, the transparent area 502 of FIG. 4B
  • the opaque area eg, FIG.
  • the opaque region 501 of 4b can be regularly coded.
  • the transparent area eg, the transparent area 502 of FIG. 4B
  • the opaque area eg, FIG.
  • the opaque region 501 of 4b may be irregularly coded.
  • the transparent region (for example, the transparent region 502 in FIG. 5) includes a transparent organic material layer (for example, the transparent organic material layer 510b in FIG. 5), and the transparent organic material layer in a direction facing the second surface. It may include a transparent substrate layer (eg, the transparent substrate layer 523 of FIG. 5) disposed on the rear surface of the.
  • the sensor module (eg, the sensor module 341 of FIG. 3) may be at least one of an image sensor, a proximity sensor, an illumination sensor, and a biometric sensor.
  • An electronic device (eg, the electronic device 300 of FIG. 3) according to the various embodiments described above is a display in which a first display area (eg, the first display area A1 of FIG. 3) on which a first screen is displayed is formed.
  • a first display area eg, the first display area A1 of FIG. 3
  • the display is positioned on the first surface, and a sensor between the display and the first surface
  • a printed circuit board on which a module (eg, the sensor module 341 of FIG. 3) is disposed, eg: the printed circuit board 340 of FIG. 3)
  • at least one transparent area eg: The transparent region 502 of FIG. 4B and at least one opaque region (eg, the opaque region 501 of FIG. 4B) are arranged to correspond to the position of the sensor module, and the transparent region and the opaque region are regularly It can be coded.
  • the opaque region (for example, the opaque region 501 in FIG. 4B) is an opaque organic material layer (for example, in which at least two arrangement elements (for example, arrangement elements 515a and 515b in FIG. 5) are disposed). It may include an opaque organic material layer 510a of FIG. 5 and an opaque substrate layer (eg, opaque substrate layer 521 of FIG. 5) disposed on a rear surface of the opaque organic material layer in a direction facing the second surface.
  • an opaque organic material layer 510a of FIG. 5 and an opaque substrate layer (eg, opaque substrate layer 521 of FIG. 5) disposed on a rear surface of the opaque organic material layer in a direction facing the second surface.
  • the opaque substrate layer (eg, the opaque substrate layer 521 of FIG. 5) is a first layer formed on the entire surface of the opaque substrate layer in a direction facing the first surface (eg, in FIG. 5 ).
  • a first layer 521a) and a second layer (eg, the second layer 521b of FIG. 5) formed on the rear surface of the opaque substrate layer in a direction facing the second surface may be included.
  • the opaque substrate layer (for example, the opaque substrate layer 521 in FIG. 5) is the first layer (for example, the first layer 521a in FIG. 5) and the second layer (for example, A cover layer (eg, the cover layer 525a of FIG. 5) disposed between the second layer 521b of FIG. 5 may be included.
  • the opaque substrate layer (eg, the opaque substrate layer 521 of FIG. 7A) is formed on the entire surface of the opaque substrate layer in a direction toward the first surface, or a direction toward the second surface.
  • a cover layer (eg, a cover layer 525c of FIG. 7A) formed on the rear surface of the opaque substrate layer may be included.
  • FIG. 9 is a block diagram of an electronic device 901 in a network environment 900 according to various embodiments.
  • an electronic device 901 (eg, the electronic device 100 of FIG. 1) is connected to an electronic device 902 through a first network 998 (eg, a short-range wireless communication network). ), or the electronic device 904 or the server 908 through the second network 999 (eg, a long-distance wireless communication network).
  • the electronic device 901 may communicate with the electronic device 904 through the server 908.
  • the electronic device 901 includes a processor 920, a memory 930, an input device 950, an audio output device 955, a display device 960, an audio module 970, and a sensor module ( 976), interface 977, haptic module 979, camera module 980, power management module 988, battery 989, communication module 990, subscriber identification module 996, or antenna module 997 ) Can be included.
  • at least one of these components (for example, the display device 960 or the camera module 980) may be omitted or one or more other components may be added to the electronic device 901.
  • some of these components may be implemented as one integrated circuit.
  • the sensor module 976 eg, a fingerprint sensor, an iris sensor, or an illuminance sensor
  • the display device 960 eg, a display.
  • the processor 920 for example, executes software (eg, a program 940) to perform at least one other component (eg, a hardware or software component) of the electronic device 901 connected to the processor 920. It can be controlled and can perform various data processing or operations. According to an embodiment, as at least part of data processing or operation, the processor 920 may transfer commands or data received from other components (eg, the sensor module 976 or the communication module 990) to the volatile memory 932 Load into, process commands or data stored in volatile memory 932, and store result data in non-volatile memory 934.
  • software eg, a program 940
  • the processor 920 may transfer commands or data received from other components (eg, the sensor module 976 or the communication module 990) to the volatile memory 932 Load into, process commands or data stored in volatile memory 932, and store result data in non-volatile memory 934.
  • the processor 920 is a main processor 921 (eg, a central processing unit or an application processor), and a secondary processor 923 (eg, a graphics processing unit, an image signal processor) that can be operated independently or together , A sensor hub processor, or a communication processor). Additionally or alternatively, the coprocessor 923 may be configured to use lower power than the main processor 921 or to be specialized for a designated function. The secondary processor 923 may be implemented separately from the main processor 921 or as a part thereof.
  • the coprocessor 923 is, for example, on behalf of the main processor 921 while the main processor 921 is in an inactive (eg, sleep) state, or the main processor 921 is active (eg, an application is executed). ), together with the main processor 921 while in the state, at least one of the components of the electronic device 901 (for example, the display device 960, the sensor module 976, or the communication module 990) It is possible to control at least some of the functions or states related to.
  • the coprocessor 923 eg, an image signal processor or a communication processor
  • may be implemented as part of another functionally related component eg, a camera module 980 or a communication module 990. have.
  • the memory 930 may store various data used by at least one component of the electronic device 901 (for example, the processor 920 or the sensor module 976 ).
  • the data may include, for example, software (eg, the program 940) and input data or output data for commands related thereto.
  • the memory 930 may include a volatile memory 932 or a nonvolatile memory 934.
  • the program 940 may be stored as software in the memory 930, and may include, for example, an operating system 942, middleware 944, or an application 946.
  • the input device 950 may receive a command or data to be used for a component of the electronic device 901 (eg, the processor 920) from outside (eg, a user) of the electronic device 901.
  • the input device 950 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (eg, a stylus pen).
  • the sound output device 955 may output an sound signal to the outside of the electronic device 901.
  • the sound output device 955 may include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback, and the receiver can be used to receive incoming calls.
  • the receiver may be implemented separately from or as a part of the speaker.
  • the display device 960 may visually provide information to the outside of the electronic device 901 (eg, a user).
  • the display device 960 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device.
  • the display device 960 may include a touch circuitry set to sense a touch, or a sensor circuit (eg, a pressure sensor) set to measure the strength of a force generated by the touch. have.
  • the audio module 970 may convert sound into an electric signal, or conversely, convert an electric signal into sound. According to an embodiment, the audio module 970 acquires sound through the input device 950, the sound output device 955, or an external electronic device (for example, an external electronic device directly or wirelessly connected to the electronic device 901). Sound may be output through the electronic device 902) (for example, a speaker or headphones).
  • the sensor module 976 detects an operating state (eg, power or temperature) of the electronic device 901 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state. can do.
  • the sensor module 976 includes, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface 977 may support one or more designated protocols that may be used for the electronic device 901 to connect directly or wirelessly to an external electronic device (eg, the electronic device 902 ).
  • the interface 977 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card
  • connection terminal 978 may include a connector through which the electronic device 901 can be physically connected to an external electronic device (eg, the electronic device 902 ).
  • the connection terminal 978 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 979 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that a user can perceive through a tactile or motor sense.
  • the haptic module 979 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 980 may capture a still image and a video.
  • the camera module 980 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 988 may manage power supplied to the electronic device 901. According to an embodiment, the power management module 988 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 989 may supply power to at least one component of the electronic device 901.
  • the battery 989 may include a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • the communication module 990 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 901 and an external electronic device (eg, electronic device 902, electronic device 904, or server 908). It is possible to support establishment and communication through the established communication channel.
  • the communication module 990 operates independently of the processor 920 (eg, an application processor) and may include one or more communication processors that support direct (eg, wired) communication or wireless communication.
  • the communication module 990 is a wireless communication module 992 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 994 (eg : A LAN (local area network) communication module, or a power line communication module) may be included.
  • a corresponding communication module is a first network 998 (for example, a short-range communication network such as Bluetooth, WiFi direct or IrDA (infrared data association)) or a second network 999 (for example, a cellular network, the Internet, or It can communicate with external electronic devices through a computer network (for example, a telecommunication network such as a LAN or WAN).
  • the wireless communication module 992 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 996 within a communication network such as the first network 998 or the second network 999.
  • subscriber information eg, International Mobile Subscriber Identifier (IMSI)
  • IMSI International Mobile Subscriber Identifier
  • the antenna module 997 may transmit a signal or power to the outside (eg, an external electronic device) or receive from the outside.
  • the antenna module may include one antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern.
  • the antenna module 997 may include a plurality of antennas. In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 998 or the second network 999 is, for example, provided by the communication module 990 from the plurality of antennas. Can be chosen.
  • a signal or power may be transmitted or received between the communication module 990 and an external electronic device through the at least one selected antenna.
  • other components eg, RFIC
  • other than the radiator may be additionally formed as part of the antenna module 797.
  • At least some of the components are connected to each other through a communication method (e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI))) between peripheral devices and signals ( E.g. commands or data) can be exchanged with each other.
  • a communication method e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • GPIO general purpose input and output
  • SPI serial peripheral interface
  • MIPI mobile industry processor interface
  • the command or data may be transmitted or received between the electronic device 901 and the external electronic device 904 through the server 908 connected to the second network 999.
  • Each of the electronic devices 902 and 904 may be a device of the same or different type as the electronic device 901.
  • all or part of the operations executed by the electronic device 901 may be executed by one or more of the external electronic devices 902, 904, or 908.
  • the electronic device 901 needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device 901 does not execute the function or service by itself.
  • one or more external electronic devices may be requested to perform the function or at least part of the service.
  • One or more external electronic devices receiving the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit the execution result to the electronic device 901.
  • the electronic device 901 may process the result as it is or additionally and provide it as at least a part of a response to the request.
  • cloud computing, distributed computing, or client-server computing technology may be used.
  • Electronic devices may be devices of various types.
  • the electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance.
  • a portable communication device eg, a smart phone
  • a computer device e.g., a smart phone
  • a portable multimedia device e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a wearable device e.g., a portable medical device
  • a home appliance e.g., a smart bracelet
  • phrases such as “at least one of, B, or C” may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof.
  • Terms such as “first”, “second”, or “first” or “second” may be used simply to distinguish the component from other corresponding components, and the components may be referred to in other aspects (eg, importance or Order) is not limited.
  • Some (eg, first) component is referred to as “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively”. When mentioned, it means that any of the above components can be connected to the other components directly (eg by wire), wirelessly, or via a third component.
  • module used in this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic blocks, parts, or circuits.
  • the module may be an integrally configured component or a minimum unit of the component or a part thereof that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • Various embodiments of the present document include one or more commands stored in a storage medium (eg, internal memory 936 or external memory 938) that can be read by a machine (eg, electronic device 100). It may be implemented as software (eg, a program 940) including them.
  • the processor eg, the processor 920
  • the device eg, the electronic device 100
  • the one or more instructions may include code generated by a compiler or code executable by an interpreter.
  • a storage medium that can be read by a device may be provided in the form of a non-transitory storage medium.
  • non-transient only means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic wave), and this term refers to the case where data is semi-permanently stored in the storage medium. It does not distinguish between temporary storage cases.
  • a signal e.g., electromagnetic wave
  • a method according to various embodiments disclosed in this document may be provided by being included in a computer program product (computer pro memory product).
  • Computer program products can be traded between sellers and buyers as commodities.
  • Computer program products are distributed in the form of a device-readable storage medium (e.g. compact disc read only memory (CD-ROM)), or via an application store (e.g. Play Store TM ) or on two user devices (e.g. : It can be distributed (e.g., downloaded or uploaded) between directly or online.
  • a portion of the computer program product may be temporarily stored or temporarily generated in a storage medium that can be read by a device such as a server of a manufacturer, a server of an application store, or a memory of a relay server.
  • each component (eg, module or program) of the above-described components may include a singular number or a plurality of entities.
  • one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added.
  • a plurality of components eg, a module or a program
  • the integrated component may perform one or more functions of each component of the plurality of components in the same or similar to that performed by the corresponding component among the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component may be sequentially, parallel, repeatedly, or heuristically executed, or one or more of the operations may be executed in a different order or omitted. , Or one or more other actions may be added.

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Abstract

Selon divers modes de réalisation, l'invention concerne un dispositif électronique comprenant: un dispositif d'affichage comprenant une première région d'affichage dans laquelle un premier écran est affiché; et un module de capteur placé sous la première région d'affichage du dispositif d'affichage, la première région d'affichage comprenant une ou plusieurs régions transparentes et une ou plusieurs régions opaques, lesdites régions transparentes et lesdites régions opaques étant codées. Divers autres modes de réalisation qui découlent de la présente invention sont également possibles.
PCT/KR2020/008016 2019-06-19 2020-06-19 Dispositif électronique comprenant un dispositif d'affichage WO2020256501A1 (fr)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101096706B1 (ko) * 2004-11-30 2011-12-22 엘지디스플레이 주식회사 액정표시소자의 제조방법
KR20170024182A (ko) * 2015-08-24 2017-03-07 엘지디스플레이 주식회사 표시장치 및 표시패널
KR20170113066A (ko) * 2016-03-24 2017-10-12 삼성전자주식회사 디스플레이를 가진 전자 장치 및 그의 이미지 표시 방법
WO2018196149A1 (fr) * 2017-04-25 2018-11-01 华为技术有限公司 Écran d'affichage à cristaux liquides, dispositif électronique, procédé de fabrication pour écran d'affichage à cristaux liquides
JP2019503500A (ja) * 2015-10-30 2019-02-07 エッセンシャル プロダクツ インコーポレイテッドＥｓｓｅｎｔｉａｌ Ｐｒｏｄｕｃｔｓ， Ｉｎｃ． デュアルモードディスプレイ下方の光センサ

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102487063B1 (ko) * 2017-09-27 2023-01-11 삼성전자주식회사 광학 지문 센서를 구비한 전자 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101096706B1 (ko) * 2004-11-30 2011-12-22 엘지디스플레이 주식회사 액정표시소자의 제조방법
KR20170024182A (ko) * 2015-08-24 2017-03-07 엘지디스플레이 주식회사 표시장치 및 표시패널
JP2019503500A (ja) * 2015-10-30 2019-02-07 エッセンシャル プロダクツ インコーポレイテッドＥｓｓｅｎｔｉａｌ Ｐｒｏｄｕｃｔｓ， Ｉｎｃ． デュアルモードディスプレイ下方の光センサ
KR20170113066A (ko) * 2016-03-24 2017-10-12 삼성전자주식회사 디스플레이를 가진 전자 장치 및 그의 이미지 표시 방법
WO2018196149A1 (fr) * 2017-04-25 2018-11-01 华为技术有限公司 Écran d'affichage à cristaux liquides, dispositif électronique, procédé de fabrication pour écran d'affichage à cristaux liquides

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