WO2021167373A1 - Dispositif électronique comprenant une unité d'affichage - Google Patents

Dispositif électronique comprenant une unité d'affichage Download PDF

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Publication number
WO2021167373A1
WO2021167373A1 PCT/KR2021/002075 KR2021002075W WO2021167373A1 WO 2021167373 A1 WO2021167373 A1 WO 2021167373A1 KR 2021002075 W KR2021002075 W KR 2021002075W WO 2021167373 A1 WO2021167373 A1 WO 2021167373A1
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WO
WIPO (PCT)
Prior art keywords
light
layer
electronic device
area
display
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Application number
PCT/KR2021/002075
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English (en)
Korean (ko)
Inventor
신성영
엄민석
신현창
Original Assignee
삼성전자 주식회사
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Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Publication of WO2021167373A1 publication Critical patent/WO2021167373A1/fr

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K59/8792—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. black layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/302—Details of OLEDs of OLED structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/88—Dummy elements, i.e. elements having non-functional features

Definitions

  • Embodiments disclosed in this document relate to an electronic device including a display.
  • Display panels such as liquid crystal display panels and organic light emitting display panels are widely used.
  • the display panel may display an image using a plurality of pixels.
  • the display panel may include a dead space in which drivers for driving pixels, signal wires, or a camera module are positioned to not display an image.
  • the dead space of the display panel is large, the dead space may be easily recognized by a user, and an area for displaying an image on the display panel may be limited. Accordingly, there is an increasing demand for various methods for reducing the area of the dead space included in the display panel.
  • Embodiments are to provide an electronic device having a small dead space.
  • an electronic device includes: the display panel including a display area displaying an image through a plurality of pixels and a light transmitting area through which external light passing through the window is transmitted; the window positioned above the display panel and through which light emitted from the display panel is transmitted; and a camera module positioned under the display panel and overlapping the light transmitting area, wherein the display panel includes: a plurality of organic light emitting elements positioned in the display area to express the plurality of pixels; an encapsulation layer covering the plurality of organic light emitting devices; and a light blocking layer including the display area and the light transmitting area on an upper portion of the encapsulation layer, wherein the light blocking layer includes: a plurality of color filters arranged to overlap the plurality of organic light emitting devices; and a light blocking member positioned between the color filters to block light, the light blocking member including an opening positioned in the light transmitting region through which external light is transmitted, the light blocking member being arranged to overlap the camera module An edge of the opening of the light
  • An electronic device surrounds a display area displaying an image through a plurality of pixels, a light transmitting area through which external light passing through the window is transmitted, and the light transmitting area, a display panel including a blocking area for blocking light; the window positioned above the display panel and through which light emitted from the display panel is transmitted; and a camera module positioned under the display panel and overlapping the light transmitting area, wherein the display panel includes: a plurality of organic light emitting elements positioned in the display area to express the plurality of pixels; an encapsulation layer covering the plurality of organic light emitting devices; and a light blocking layer positioned on the encapsulation layer, wherein the light blocking layer includes: a light blocking member blocking light; and a plurality of color filters arranged to overlap the plurality of organic light emitting diodes, wherein the light blocking member includes: a first light blocking unit positioned in the blocking area; and a second light blocking portion positioned in the display area, wherein the first light blocking portion extend
  • the area of the dead space in the electronic device may be reduced.
  • FIG. 1 is a front perspective view of an electronic device according to an exemplary embodiment
  • FIG. 2 is a rear perspective view of an electronic device according to an exemplary embodiment
  • FIG. 3 is an exploded perspective view of an electronic device according to an exemplary embodiment
  • FIG. 4 is an exploded perspective view of a display included in an electronic device according to an exemplary embodiment.
  • FIG. 5 is a cross-sectional view taken along line A-A' of FIG. 1 in an electronic device according to an exemplary embodiment.
  • FIG. 6 is an enlarged cross-sectional view of a region B of FIG. 5 in an electronic device according to an exemplary embodiment.
  • FIG. 7 is a block diagram illustrating an electronic device according to an exemplary embodiment.
  • FIG. 8 is a plan view illustrating a light blocking member of an electronic device according to an exemplary embodiment.
  • FIG. 9 is an enlarged view illustrating a region C of FIG. 7 in an electronic device according to an exemplary embodiment.
  • FIG. 10 is a cross-sectional view taken along line D-D' of FIG. 9 in an electronic device according to an exemplary embodiment.
  • FIG. 11 is a plan view illustrating a portion including a light transmission region in an electronic device according to an exemplary embodiment.
  • FIG. 12 is a cross-sectional view illustrating a display area of an electronic device according to an exemplary embodiment.
  • FIG. 13 is an equivalent circuit diagram of one pixel included in an electronic device according to an exemplary embodiment.
  • FIG. 14 is a cross-sectional view illustrating a display area of an electronic device according to an exemplary embodiment.
  • 15 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.
  • 16 is a block diagram of a display device according to various embodiments of the present disclosure.
  • FIGS. 1 and 2 are front perspective views of an electronic device according to an exemplary embodiment
  • 2 is a rear perspective view of an electronic device according to an exemplary embodiment
  • an electronic device 100 includes a first surface (eg, a front surface) 110A, a second surface (eg, a rear surface) 110B, and a first surface ( 110A) and a housing 110 including a side surface 110C surrounding a space between the second surface 110B.
  • the housing may refer to a structure forming a part of the first surface 110A, the second surface 110B, and the side surface 110C of FIG. 1 .
  • the first surface 110A may be formed by the front plate 102 (eg, a glass plate including various coating layers, or a polymer plate) at least a portion of which is substantially transparent.
  • the second surface 110B may be formed by the substantially opaque back plate 111 .
  • the back plate 111 may be formed by, for example, coated or tinted glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the materials. have.
  • the side surface 110C is coupled to the front plate 102 and the rear plate 111 and may be formed by a side bezel structure 118 (or “side member”) comprising a metal and/or a polymer.
  • the back plate 111 and the side bezel structure 118 are integrally formed and may include the same material (eg, a metal material such as aluminum).
  • the front plate 102 has a first region 110D that extends seamlessly by bending from the first surface 110A toward the rear plate at both ends of the long edge of the front plate.
  • the rear plate 111 may include a second region 110E that extends seamlessly from the second surface 110B toward the front plate at both ends of the long edge.
  • the front plate 102 or the back plate 111 may include only one of the first region 110D or the second region 110E.
  • the front plate 102 may not include the first region and the second region, but may include only a flat plane disposed parallel to the second surface 110B.
  • the side bezel structure 118 when viewed from the side of the electronic device, may have a first thickness (or width) on the side side where the first region 110D or the second region 110E as described above is not included. ), and may have a second thickness that is thinner than the first thickness in the first region or the side surface including the second region.
  • the electronic device 100 includes the display 101 , the input device 103 , the sound output devices 107 and 114 , the sensor modules 104 , 119 , and the camera modules 105 , 112 , 113 . , a key input device 117 , an indicator (not shown), and at least one of connectors 108 and 109 .
  • the electronic device 100 may omit at least one of the components (eg, the key input device 117 or an indicator) or additionally include other components.
  • the display 101 can be viewed through the top portion of the front plate 102 .
  • at least a portion of the display 101 may be visible through the front plate 102 forming the first area 110D of the first surface 110A and the side surface 110C.
  • the display 101 may be disposed adjacent to or coupled to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field type stylus pen.
  • at least a portion of the sensor modules 104 , 119 , and/or at least a portion of the key input device 117 may be disposed in the first area 110D, and/or the second area 110E. have.
  • the input device 103 may include a microphone 103 .
  • the input device 103 may include a plurality of microphones 103 arranged to sense the direction of the sound.
  • the sound output devices 107 and 114 may include speakers 107 and 114 .
  • the speakers 107 and 114 may include an external speaker 107 and a receiver 114 for a call.
  • the microphone 103 , the speakers 107 , 114 , and the connectors 108 , 109 are disposed in the space of the electronic device 100 , and pass through at least one hole formed in the housing 110 to the external environment. may be exposed to In some embodiments, a hole formed in the housing 110 may be commonly used for the microphone 103 and the speakers 107 and 114 .
  • the sound output devices 107 and 114 may include a speaker (eg, a piezo speaker) that operates while excluding a hole formed in the housing 110 .
  • the sensor modules 104 and 119 may generate electrical signals or data values corresponding to an internal operating state of the electronic device 100 or an external environmental state.
  • the sensor modules 104 and 119 may include a first sensor module 104 (eg, a proximity sensor) and/or a second sensor module (not shown) disposed on the first surface 110A of the housing 110 . (eg, a fingerprint sensor) and/or a third sensor module 119 (eg, an HRM sensor) disposed on the second surface 110B of the housing 110 .
  • the fingerprint sensor may be disposed on the first surface 110A (eg, the home key button 115 ) of the housing 110 , a portion of the second surface 110B, or under the display 101 .
  • the electronic device 100 includes a sensor module not shown, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, At least one of a humidity sensor and an illuminance sensor 104 may be further included.
  • a sensor module not shown, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, At least one of a humidity sensor and an illuminance sensor 104 may be further included.
  • the camera modules 105 , 112 , and 113 include a first camera device 105 disposed on the first surface 110A of the electronic device 100 , and a second camera device 112 disposed on the second surface 110B of the electronic device 100 . , and/or flash 113 .
  • the camera modules 105 , 112 may include one or more lenses, an image sensor, and/or an image signal processor.
  • the flash 113 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (a wide-angle lens, an ultra-wide-angle lens, or a telephoto lens) and image sensors may be disposed on one side of the electronic device 100 .
  • the key input device 117 may be disposed on the side surface 110C of the housing 110 .
  • the electronic device 100 may not include some or all of the mentioned key input devices 117 and the not included key input devices 117 may be displayed on the display 101 as soft keys, etc. It can be implemented in the form In another embodiment, the key input device 117 may be implemented using a pressure sensor included in the display 101 .
  • the indicator may be disposed on the first surface 110A of the housing 110 .
  • the indicator may provide status information of the electronic device 100 in the form of light.
  • the light emitting device may provide, for example, a light source that is interlocked with the operation of the camera module 105 .
  • Indicators may include, for example, LEDs, IR LEDs and xenon lamps.
  • the connector holes 108 and 109 include a first connector hole 108 capable of accommodating a connector (eg, a USB connector) for transmitting and receiving power and/or data to and from an external electronic device, and/or an external electronic device and an external electronic device.
  • a second connector hole (or earphone jack) 109 capable of accommodating a connector for transmitting and receiving an audio signal may be included.
  • Some of the camera modules 105 and 112 , some of the camera modules 105 , some of the sensor modules 104 and 119 , or some of the sensor modules 104 or indicators may be arranged to be visible through the display 101 . Some sensor modules 104 may be arranged to perform their functions without being visually exposed through the front plate 102 in the internal space of the electronic device.
  • FIG. 3 is an exploded perspective view of an electronic device according to an exemplary embodiment;
  • the electronic device 300 of FIG. 3 may be at least partially similar to the electronic device 100 of FIGS. 1 and 2 , or may further include another embodiment of the electronic device.
  • the electronic device 300 (eg, the electronic device 100 of FIG. 1 or FIG. 2 ) includes a side member 310 (eg, a side bezel structure), a first support member 311 (for example, a bracket or support structure), a front plate 320 (for example, a front cover or window), a display 400 , a printed circuit board 340 , a battery 350 , a second support member 360 (for example, the rear case), an antenna 370 , and a rear plate 380 (eg, a rear cover).
  • the electronic device 300 may omit at least one of the components (eg, the first support member 311 or the second support member 360 ) or additionally include other components. .
  • At least one of the components of the electronic device 300 may be the same as or similar to at least one of the components of the electronic device 100 of FIG. 1 or 2 , and overlapping descriptions will be omitted below.
  • the first support member 311 may be disposed inside the electronic device 300 and connected to the side member 310 , or may be integrally formed with the side member 310 .
  • the first support member 311 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material.
  • the first support member 311 may have a display 330 coupled to one surface and a printed circuit board 340 coupled to the other surface.
  • the printed circuit board 340 may be equipped with a processor, memory, and/or an interface.
  • the processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.
  • the memory may include volatile memory or non-volatile memory.
  • the interface may include a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • the interface may electrically or physically connect the electronic device 300 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.
  • the battery 350 is a device for supplying power to at least one component of the electronic device 300 and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. . At least a portion of the battery 350 may be disposed substantially on the same plane as the printed circuit board 340 , for example. The battery 350 may be integrally disposed inside the electronic device 300 . In another embodiment, the battery 350 may be detachably disposed from the electronic device 300 .
  • the antenna 370 may be disposed between the rear plate 380 and the battery 350 .
  • the antenna 370 may include a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
  • NFC near field communication
  • MST magnetic secure transmission
  • the antenna 370 may perform short-range communication with an external device or wirelessly transmit/receive power required for charging.
  • the antenna structure may be formed by a part of the side bezel structure 310 and/or the first support member 311 or a combination thereof.
  • the first support member 311 of the side member 310 has a first side 3101 facing the front plate 320 and a second side facing in a direction opposite to the first side 3101 (eg, a rear plate direction) ( 3102).
  • the camera module 500 (eg, the camera module 105 of FIG. 1 ) may be disposed between the first support member 311 and the rear plate 380 .
  • the camera module 500 may be disposed to protrude or be visible in the direction of the front plate 320 through the through hole 301 connected from the first surface 3101 to the second surface 3102 of the first support member 311 . have.
  • a portion protruding through the through hole 301 of the camera module 500 may be disposed to detect an external environment at a corresponding position of the display 400 .
  • the through hole 301 may be unnecessary.
  • FIG. 4 is an exploded perspective view of a display included in an electronic device according to an exemplary embodiment.
  • the display 400 of FIG. 4 may be at least partially similar to the display 101 of FIG. 1 , or may further include another embodiment of the display.
  • the display 400 includes an adhesive member (eg, the adhesive member 410 of FIG. 5 ) on the rear surface of the front cover 320 (eg, a front plate, a glass plate, a first cover member, or a cover member). It may include a display panel 431 disposed through the display panel 431 and at least one auxiliary material layer 440 attached to the rear surface of the display panel 431 .
  • the adhesive member may include an optical clear adhesive (OCA), a pressure sensitive adhesive (PSA), a heat-responsive adhesive, a general adhesive, or a double-sided tape.
  • the display 400 may include a control circuit (not shown).
  • the control circuit is a flexible printed circuit board (FPCB) that electrically connects the main printed circuit board (eg, the printed circuit board 340 of FIG. 3 ) and the display panel 431 of the electronic device (eg, the electronic device 300 of FIG. 3 ). circuit board) and a display driver IC (DDI) mounted on the FPCB.
  • the display 400 may additionally include a touch panel 433 .
  • the display 400 is an in-cell method or a display panel, which is a case in which a touch panel capable of recognizing a touch is included in the display panel according to the arrangement position of the touch panel 433 .
  • the control circuit may include a touch display driver IC (TDDI).
  • the display 400 may include a fingerprint sensor (not shown) disposed around the control circuit.
  • the fingerprint sensor is in contact with the outer surface of the front cover 320 through a hole at least partially formed in some of the components of the display 400, or a fingerprint of a nearby finger to a separate ultrasonic sensor.
  • An ultrasonic method capable of recognizing the shape of a fingerprint by ultrasonic waves transmitted by It may include an optical fingerprint sensor capable of acquiring and recognizing a fingerprint based on the acquired image.
  • the at least one auxiliary material layer 440 is disposed on the rear surface of the at least one polymer member 441 and 442 and the at least one polymer member 441 and 442 disposed on the rear surface of the display panel 431 .
  • the at least one functional member 443 may include a conductive member 444 disposed on a rear surface of the at least one functional member 443 .
  • the at least one polymer member 441 and 442 removes air bubbles that may be generated between the display panel 431 and its lower attachments and blocks light generated by the display panel 431 or light incident from the outside. It may include a layer 441 (eg, a black layer including an uneven pattern) and/or a buffer layer 442 (eg, a sponge layer) disposed for impact mitigation.
  • the at least one functional member 443 may include a heat dissipation sheet (eg, a graphite sheet) for dissipating heat, an added display, a poster touch FPCB, a fingerprint sensor FPCB, an antenna radiator for communication, a conductive / non-conductive tape Or it may include an open cell sponge.
  • the conductive member 444 is a metal plate, which may help to reinforce rigidity of an electronic device (eg, the electronic device 300 of FIG. 3 ), shield ambient noise, and reduce heat emitted from surrounding heat dissipating components. It can be used to disperse.
  • the conductive member 444 may include Cu, Al, Mg, SUS, or CLAD (eg, a stacked member in which SUS and Al are alternately disposed).
  • the display 400 may further include a detection member 445 for detecting an input by an electromagnetic induction type writing member (eg, an electronic pen).
  • the detection member 445 may include a digitizer.
  • the detection member 445 may be disposed between the at least one polymer member 442 and the functional member 443 .
  • the detection member 445 may be disposed between the display panel 431 and the at least one polymer member 441 .
  • the display 400 may include a light blocking member (eg, the light blocking member 460 of FIG. 6 ) positioned inside the display panel 431 and serving as an aperture.
  • the light blocking member 460 is disposed closer to the camera module (eg, the camera module 500 of FIG. 5 ) than the existing printing area, and thus the front surface through the light blocking member 460 serving as an diaphragm.
  • the size of the camera exposure area (eg, the circular BM area) viewed from the outside of the cover 320 may be reduced.
  • the subsidiary material layer 440 may include openings 4411 , 4421 , 4451 , and 4441 formed at positions corresponding to the camera module (eg, the camera module 500 of FIG. 5 ).
  • the camera module 500 may be disposed to be adjacent to the rear surface of the display panel 431 through the openings 4411 , 4421 , 4451 , and 4441 .
  • at least one of the openings 4411 , 4421 , 4451 , and 4441 of the auxiliary material layer 440 may be omitted.
  • the display panel 431 may include a light transmitting area 4311 at a position corresponding to the camera module 500 .
  • the light-transmitting area 4311 of the display panel 431 is processed to be transparent, so that external light can pass through it even if it does not include a through hole.
  • the touch panel 433 disposed on the display panel 431 has an opening 4331 at a corresponding position of the camera module 500 in order to prevent deterioration of the performance of the camera module 500 due to the refractive index.
  • the corresponding position of the touch panel 433 with the camera module 500 may be processed transparently or the polarization characteristic may be removed.
  • the layers without openings eg, the display panel 431 or the touch panel 433
  • the light transmitting area 321 of the front cover 320 may be an area through which external light is transmitted at a position corresponding to the camera module 500 .
  • FIG. 5 is a cross-sectional view taken along line A-A' of FIG. 1 in an electronic device according to an exemplary embodiment.
  • a UB (unbreakable) type OLED display eg, curved display
  • the present invention is not limited thereto.
  • it may be applied to a flat type display of an on cell touch AMOLED (Active Matrix Organic Light-Emitting Diode) (OCTA) method.
  • AMOLED Active Matrix Organic Light-Emitting Diode
  • the electronic device 300 has a front cover 320 (eg, a cover member, a front plate, a front window, or a first plate) that faces in a first direction Dr1 and the front cover 320 is opposite to the front cover 320 .
  • a side member 310 surrounding the space 3001 between the front cover 320 and the rear cover 380 and the rear cover 380 eg, a rear cover member, a rear plate, a rear window, or a second plate facing in the direction
  • the electronic device 300 may include a first waterproof member 3201 disposed between the auxiliary material layer 440 and the side member 310 of the display 400 .
  • the electronic device 300 may include a second waterproof member 3801 disposed between the side member 310 and the rear plate 380 .
  • the first waterproof member 3201 and the second waterproof member 3801 may prevent foreign substances or moisture from flowing into the internal space 3001 of the electronic device 300 .
  • the waterproof member may be disposed on at least a portion of the mounting support structure between the camera module 500 and the side member 310 .
  • the first waterproof member 3201 and/or the second waterproof member 3801 may be replaced with an adhesive member.
  • the side member 310 may further include a first support member 311 extending at least partially in the inner space 3001 of the electronic device 300 .
  • the first support member 311 may be formed by structural coupling with the side member 310 .
  • the first support member 311 is arranged near the rear surface of the display panel 431 through the opening (eg, the opening OP of FIG. 6 ) of the auxiliary material layer 440 of the display 400 by the camera module 500 , , may support the camera module 500 to be disposed.
  • the camera module 500 is disposed in the camera housing 510, the inner space 5101 of the camera housing 510, and at least partially protrudes in the display direction (eg, the first direction Dr1). And in the inner space 5201 of the lens housing 520, a plurality of lenses (530: 531, 532, 533, 534) arranged at regular intervals and in the inner space 5101 of the camera housing 510, a plurality of At least one image sensor 540 arranged to acquire at least a portion of the light passing through the lenses 530 may be included.
  • the camera module 500 may not include an aperture.
  • the camera module 500 may include an auto focus (AF) function.
  • the lens housing 520 may flow from the camera housing 510 to the display panel 431 through a predetermined driving unit so that the distance to the display panel 431 is variable.
  • a separate driving unit may be disposed to change the position of at least one of the plurality of lenses 530 in order for the camera module to perform an AF function.
  • the camera housing 510 may be omitted, and the lens housing 520 may be directly disposed on the first support member 311 through a predetermined alignment process.
  • the camera housing 510 When the lens housing 520 is disposed directly on the first support member 311 , the camera housing 510 may be omitted in order to reduce the camera arrangement space, and the lens housing 520 may be disposed on the first support member 311 . It may be arranged to be attached to one side. After the camera module 500 is aligned through the through hole 301 of the first supporting member 311 , the rear surface of the first supporting member 311 is arranged through the adhesive member 312 (eg, a bonding member or a tape member). can be attached to
  • the display 400 includes a touch panel (eg, the touch panel 433 of FIG. 4 ), a display panel 431 , a light blocking layer 441 , a buffer layer (eg, the buffer layer 442 of FIG. 4 ), and a digitizer (eg, FIG. 4 ), a functional member (eg, the functional member 443 of FIG. 4 ), and/or a conductive member (eg, the conductive member 444 of FIG. 4 ).
  • the display panel 431 may include a color filter 1070 (refer to FIG. 10 ) and a light blocking member 800 (refer to FIG. 10 ) to perform color correction on light emitted from the display panel 431 .
  • the polarizer may be omitted from the display 400 .
  • the electronic device may not include a polarization layer between the display panel 431 and the front cover 320 .
  • the camera module 500 may be supported by a second support member 360 (eg, a rear case) that is additionally disposed in the internal space of the electronic device.
  • the electronic device 300 may include an adhesive layer 410 , a display panel 431 , an auxiliary material layer 440 , and a camera module 500 positioned on the rear surface of the front cover 320 .
  • the electronic device 300 may include a camera area NA1 in which the camera module 500 is located.
  • the camera area NA1 may not display an image.
  • the camera area NA1 may include a light transmitting area AD through which light is transmitted and incident to the camera module 500 and a blocking area DS surrounding the light transmitting area AD and blocking light.
  • the auxiliary material layer 440 may include an opening OP formed to correspond to an area overlapping the plurality of lenses 530 .
  • the opening OP formed in the auxiliary material layer 440 may include an opening formed in the light blocking layer 441 (eg, the opening 4411 in FIG. 4 ) and an opening formed in the buffer layer 442 (eg, the opening 4421 in FIG. 4 ).
  • one opening ( OP) can be formed.
  • each of the openings may have different sizes corresponding to the shape of the camera module. At least a portion of the camera housing 510 (refer to FIG. 5 ) or the lens housing 520 may be located in the opening OP of the subsidiary material layer 440 .
  • the camera area NA1 may be located in the opening OP of the subsidiary material layer 440 . In some embodiments, at least a portion of an edge of the camera area NA1 may coincide with at least a portion of an edge of the opening OP of the auxiliary material layer 440 . In another embodiment, the opening OP of the auxiliary material layer 440 may be located in the camera area NA1 .
  • the light transmitting area AD may be located in the opening OP of the subsidiary material layer 440 .
  • the diameter of the light transmitting area AD may be smaller than the diameter of the opening OP of the auxiliary material layer 440 .
  • a diameter of the light transmitting area AD may be smaller than a diameter of the lens housing 520 .
  • the lens housing 520 may not overlap the light transmission area AD and may not be located in the light transmission area AD. Accordingly, the lens housing 520 may not be viewed from the outside of the electronic device.
  • the display 400 may include a light blocking member 460 (eg, an aperture) disposed in the display panel 431 .
  • the light blocking member 460 may include an opening corresponding to an area overlapping the effective diameter of the lens 530 .
  • the light transmitting area AD may be formed as an opening of the light blocking member 460 .
  • the light blocking member 460 may block unnecessary light flowing into the vicinity of the light transmitting area AD of the display panel 431 from the outside and may prevent light leakage.
  • Light from the outside of the electronic device may be introduced through the light transmission area AD and may be transmitted to the image sensor 540 through the lens 530 .
  • the amount of light introduced into the image sensor may be determined by the light blocking member 460 serving as an diaphragm.
  • the size of the light transmission area AD may be determined based on a preset angle of view ⁇ of the lens 530 of the camera module 500 .
  • the diameter of the light transmission area AD may be determined based on the effective aperture of the lenses 530 of the camera module 500 .
  • the diameter of the light transmission area AD may be the same as the effective aperture of the lenses 530 of the camera module 500 .
  • the display panel 431 may be configured such that pixels and/or wires are not disposed in an area overlapping the light transmitting area AD to improve optical transmittance.
  • the display panel 431 has an area overlapping the light transmitting area AD lower than the surrounding active area (eg, active area) in order to improve optical transmittance. It may be configured to have a pixel density and/or a low interconnect density.
  • the area overlapping the light transmitting area AD is made of a material having high transmittance to improve optical transmittance. can be
  • FIGS. 7 to 9 An electronic device 700 according to an exemplary embodiment will be described with reference to FIGS. 7 to 9 .
  • 7 is a block diagram illustrating an electronic device according to an exemplary embodiment.
  • 8 is a plan view illustrating a light blocking member of an electronic device according to an exemplary embodiment.
  • 9 is an enlarged view illustrating a region C of FIG. 7 in an electronic device according to an exemplary embodiment.
  • an electronic device 700 may include a display panel 710 and a display driver IC (DDI) 760 .
  • the display panel 710 includes a display area DA displaying an image, a camera area NA1 surrounded by the display area DA, and a non-display area NA2 positioned at the periphery of the display area DA.
  • the display panel 710 may include a plurality of pixels PX and a plurality of signal lines 720 and 730 positioned in the display area DA.
  • the display panel 710 may include the light transmission area AD positioned in the camera area NA1 and the gate driver 750 positioned in the non-display area NA2 .
  • the display area DA may display an image through the plurality of pixels PX.
  • the pixel PX may be a minimum unit for displaying an image.
  • the plurality of signal lines 720 and 730 may include a gate line 720 and a data line 730 . Although only one gate line 720 and one data line 730 are illustrated in FIG. 7 , the number of gate lines 720 and the number of data lines 730 are not limited to those illustrated in FIG. 7 .
  • the display panel 710 may include a plurality of gate lines 720 and a plurality of data lines 730 .
  • the gate line 720 may be electrically connected to the gate driver 750 and may transmit a gate signal.
  • the gate line 720 may extend in the third direction DR3 from the display area DA.
  • the data line 730 may be electrically connected to the display driver IC (DDI) 760 and may transmit a data voltage.
  • the data line 730 may extend in the second direction DR2 perpendicular to the third direction DR3 in the display area DA.
  • the extending directions of the gate line 720 and the data line 730 are not limited to those shown in FIG. 7 . That is, in some embodiments, the gate line 720 may extend in the second direction DR2 , and the data line 730 may extend in the third direction DR3 .
  • the camera area NA1 is surrounded by the display area DA and may be an area that does not display an image.
  • a camera module (eg, the camera module 500 of FIG. 5 ) may be disposed in an area corresponding to the light transmission area AD located in the camera area NA1 .
  • the camera module may be located on the rear surface of the light transmission area AD of the display panel 710 .
  • the light transmitting area AD may include a transparent member, and light may pass through the light transmitting area AD of the display panel.
  • the light passing through the light transmission area AD may be incident on the camera module.
  • the camera area NA1 is illustrated in a circular shape in FIG. 7 , the shape of the camera area NA1 is not limited thereto.
  • the electronic device according to an embodiment may include a plurality of camera areas NA1 spaced apart from each other.
  • Devices or wires for generating and transmitting various signals applied to the display area DA may be positioned in the non-display area NA2 .
  • the non-display area NA2 may be positioned to surround the display area DA.
  • the gate driver 750 located in the non-display area NA2 may generate a gate signal in response to driving power and control signals supplied from the outside, and may supply the gate signal to the gate line 720 .
  • the plurality of pixels PX may be selected by the gate signal and sequentially supplied with the data voltage.
  • the dead space of the display panel 710 may be a camera area NA1 that does not display an image and a non-display area NA2 .
  • the gate driver 750 may be provided in the form of a thin film transistor on the substrate together with the pixel circuits included in the plurality of pixels PX, or may be mounted on the substrate in the form of a chip.
  • the gate driver 750 may include a first gate driver 751 and a second gate driver 752 positioned with the display area DA interposed therebetween.
  • Each of the first gate driver 751 and the second gate driver 752 may include a plurality of stages connected to each other. The plurality of stages may be electrically connected to each of the plurality of gate lines 720 to sequentially output gate signals.
  • the gate driver 750 has been described as including the first gate driver 751 and the second gate driver 752 , the gate driver 750 is not located on both sides of the display panel 710 , but only on one side. may be
  • the display driver IC (DDI) 760 may generate a data voltage in response to data and control signals supplied from the outside, and may supply the data voltage to the data line 730 .
  • the display panel 710 may include a flexible substrate.
  • the electronic device 700 may include a deformable display such as a foldable display, a rollable display, an extendable display, and a flexible display. .
  • a light blocking member 800 included in an electronic device according to an exemplary embodiment will be described with reference to FIG. 8 .
  • the light blocking member 800 included in the electronic device according to an embodiment surrounds the first light blocking unit 810 and the first light blocking unit 810 positioned in an area corresponding to the camera area NA1 (refer to FIG. 7 ). It may include a second light blocking part 820 , a first opening 801 , and a plurality of second openings 803 positioned in an area corresponding to the display area DA (refer to FIG. 7 ).
  • the first light blocking part 810 (eg, the light blocking member 460 of FIG. 6 ) is located in the camera area NA1 (refer to FIG. 7 ), and prevents the wiring, etc. located in the camera area NA1 from being viewed from the outside.
  • the first opening 801 may be located in an area corresponding to the light transmitting area AD (refer to FIG. 7 ).
  • the second light blocking part 820 may be positioned in the display area DA to prevent color mixing of light emitted from a plurality of pixels.
  • a color filter to be described later may be positioned in the plurality of second openings 803 positioned in the second light blocking part 820 .
  • Light emitted from the display panel may pass through the color filters of the plurality of second openings 803 and travel to the outside.
  • the plurality of second openings 803 are shown to be rectangular.
  • the shape of the second opening 803 is not limited thereto.
  • the second opening 803 may be a rhombus or may have a shape elongated in one direction from the display area DA.
  • an electronic device may include a plurality of bypass wires 910 and a light blocking member 800 extending along the circumference of the light transmitting area AD.
  • the plurality of bypass wires 910 include a data bypass wire 730a connected to the data line 730 to transfer a data voltage, and a gate bypass wire 720a connected to the gate line 720 to transfer a gate signal. may include. However, the plurality of bypass wirings 910 is not limited to that illustrated in FIG. 8 .
  • the plurality of bypass wires 910 may further include a bypass wire connected to a signal line that transmits another signal (eg, a light emission control signal).
  • the plurality of bypass wirings 910 may include only the data bypass wiring 730a or only the gate bypass wiring 720a.
  • the electronic device may not include the gate bypass wiring 720a and the gate line 720 may be disconnected in the light transmitting area AD. In this case, the electronic device may include a first gate driver 751 (refer to FIG. 7 ) and a second gate driver 752 (refer to FIG. 7 ) positioned with the display area DA interposed therebetween.
  • the light blocking member 800 includes the first light blocking part 810 positioned in the blocking area DS of the camera area NA1 , and the second light blocking part surrounding the first light blocking part 810 and positioned in the display area DA. 820 , a first opening 801 positioned in the light transmitting area AD, and a plurality of second openings 803 (refer to FIG. 8 ) positioned in the display area DA may be included.
  • the first light blocking part 810 may extend from the second light blocking part 820 to the edge of the light transmitting area AD.
  • the first light blocking part 810 and the second light blocking part 820 may include the same material and may be located on the same layer.
  • the first light blocking part 810 and the second light blocking part 820 may be integrally formed.
  • the first light blocking part 810 is located in the camera area NA1 and may overlap the plurality of bypass wires 910 in the first direction Dr1 .
  • the first light blocking unit 810 overlaps at least a portion of the plurality of bypass wirings 910 in the first direction Dr1
  • the first light blocking unit 810 includes the plurality of bypass wirings 910 . It may not overlap with at least a part of it in the first direction Dr1 .
  • the first light blocking part 810 may not overlap with at least some of the plurality of bypass wirings 910 located outside in the first direction Dr1 .
  • the electronic device may further include dummy pixels.
  • the plurality of pixels may emit light according to a current output from the thin film transistor to express grayscale.
  • the thin film transistor and signal wirings of the pixel may be formed through an etching process.
  • a line width of a pattern positioned at an edge of a region having a high pattern density may be formed non-uniformly due to a loading effect. If the line width of the pattern is not uniform, a difference in luminance may occur due to a difference in current output from the transistor. Accordingly, it may be difficult to accurately realize the desired luminance for pixels located at the edge among the plurality of pixels.
  • a pixel located in a pattern area having a non-uniform line width may be used as a dummy pixel. That is, the electronic device according to an embodiment may include a plurality of dummy pixels positioned at an edge among the plurality of pixels.
  • the dummy pixels are located in the camera area NA1 and may not emit light.
  • the dummy pixels may be positioned in the display area DA and emit light.
  • the dummy pixels may emit light according to a dimming signal to smoothly express the edge of the display area DA.
  • the dummy pixels may emit light to display a specific color according to a preset signal. When the dummy pixels emit light, it is possible to prevent a dead space from being generated by the dummy pixels.
  • the dummy pixels may include a dummy pixel circuit including at least one transistor and a dummy organic light emitting diode connected to the dummy pixel circuit.
  • the dummy pixels may be positioned along the edge of the camera area NA1 .
  • the first light blocking part 810 may overlap the dummy pixel in the first direction Dr1 .
  • the first light blocking part 810 may block the wiring and the dummy pixel located in the camera area NA1 from being visually recognized to the outside.
  • the dummy pixel circuits of the dummy pixels may overlap at least a portion of the plurality of bypass wirings 910 in the first direction Dr1 .
  • the diameter of the camera area NA1 , the width W1 of the first light blocking part 810 , and the blocking area DS may be reduced. That is, the dead space of the electronic device may be reduced.
  • the first light blocking unit 810 may determine the light transmitting area AD. An edge of the first light blocking part 810 may coincide with an edge of the light transmitting area AD. In other words, the first opening 801 of the first light blocking part 810 may be located in the same area as the light transmitting area AD.
  • the width W1 of the first light blocking part 810 may be greater than the width W2 of the second light blocking part 820 .
  • the width W1 of the first light blocking portion 810 extends from the first opening 801 (or the light transmitting area AD) of the first light blocking portion 810 to the second light blocking portion 820 . It can mean the shortest distance.
  • the width W2 of the second light blocking part 820 may mean the shortest distance between the plurality of second openings 802 .
  • FIG. 10 is a cross-sectional view taken along line D-D' of FIG. 9 in an electronic device according to an exemplary embodiment.
  • some components positioned in the display area DA are omitted in FIG. 10 , and this will be described in detail with reference to FIGS. 12 to 14 .
  • the electronic device 1000 may include a display panel 431 , an adhesive layer 410 , a front cover 320 (hereinafter also referred to as a window), and a camera module 500 .
  • the display panel 431 of the electronic device 1000 according to an embodiment includes a substrate 1010 , an insulating layer 1020 , a bypass wiring 910 , a pixel definition layer 1030 (pixel definition layer, PDL), and an encapsulation layer.
  • 1040 , spacers 1090 , planarization layer 1050 , touch sensing layer 1060 , light blocking layers 1070 and 800 including a color filter layer 1070 and a light blocking member 800 , and a passivation layer 1080 are formed.
  • the substrate 1010 may be an insulating substrate made of glass, quartz, ceramic, polymer, or the like. According to an embodiment, the substrate 1010 may include a plurality of layers. In other words, the substrate 1010 may include a first polymer layer and a second polymer layer facing each other, and an inorganic layer positioned between the first polymer layer and the second polymer layer.
  • the insulating layer 1020 may be positioned on the substrate 1010 .
  • the insulating layer 1020 may include a first insulating layer 1021 , a second insulating layer 1022 , a third insulating layer 1023 , a fourth insulating layer 1024 , and a fifth insulating layer 1025 .
  • the insulating layer 1020 shown in FIG. 10 is exemplary, and the insulating layer 1020 further includes an additional insulating layer, or the first insulating layer 1021, the second insulating layer 1022, and the third insulating layer ( 1023 ), some of the fourth insulating layer 1024 , and the fifth insulating layer 1025 may be omitted.
  • a first gate conductive layer may be positioned between the first insulating layer 1021 and the second insulating layer 1022 , and a second gate conductive layer may be positioned between the second insulating layer 1022 and the third insulating layer 1023 . This can be located A first data conductive layer may be positioned between the third insulating layer 1023 and the fourth insulating layer 1024 , and a second data conductive layer may be positioned between the fourth insulating layer 1024 and the fifth insulating layer 1025 . This can be located
  • the bypass wiring 910 may be positioned in the first gate conductive layer, the second gate conductive layer, the first data conductive layer, and the second data conductive layer in the blocking region DS. Each of the bypass wirings 910 may be electrically connected to the gate line 720 or the data line 730 . 10 , the bypass wiring 910 may not be positioned in at least one of the first gate conductive layer, the second gate conductive layer, the first data conductive layer, and the second data conductive layer.
  • the pixel defining layer 1030 may be positioned on the insulating layer 1020 .
  • the pixel defining layer 1030 may include a pixel opening 1031 (refer to FIG. 12 ) exposing the pixel electrode 1230 .
  • the pixel defining layer 1030 may partition the organic emission layer 1221 (refer to FIG. 12 ) for each pixel.
  • the pixel defining layer 1030 may include a third opening 1030a positioned in an area including the light transmitting area AD. An edge of the pixel defining layer 1030 at the side of the third opening 1030a may be positioned outside the light transmitting area AD to surround the light transmitting area AD.
  • the pixel defining layer 1030 may include a barrier rib 1030 surrounding the light transmitting area AD, and an edge 1030a of the barrier rib 1030 of the pixel defining layer 1030 has a third opening. (1030a) can be achieved.
  • the edge 1030a of the barrier rib of the pixel defining layer 1030 may be positioned outside the light transmitting area AD to surround the light transmitting area AD.
  • the pixel defining layer 1030 may include an organic material such as polyacrylates resin or polyimides resin, or a silica-based inorganic material.
  • the pixel defining layer 1030 may include a light blocking material to block light.
  • the encapsulation layer 1040 may be positioned on the pixel defining layer 1030 and the organic light emitting diode OLED.
  • the encapsulation layer 1040 may cover both the top and side surfaces of the display panel to seal the display panel, and may block the inflow of external moisture and oxygen.
  • the encapsulation layer 1040 may include a plurality of layers.
  • the encapsulation layer 1040 may include a triple layer in which the first inorganic layer 1041 , the organic layer 1042 , and the second inorganic layer 1043 are sequentially positioned.
  • the organic layer 1042 of the encapsulation layer 1040 may include a fourth opening 1042a positioned in an area including the light transmitting area AD.
  • the organic layer 1042 of the encapsulation layer 1040 includes the fourth opening 1042a, light transmittance may not decrease in the light transmitting area AD.
  • An edge at the side of the fourth opening 1042a of the organic layer 1042 of the encapsulation layer 1040 may be positioned outside the light transmitting area AD to surround the light transmitting area AD.
  • the spacer 1090 (or dam) may be positioned along the edge of the encapsulation layer 1040 to prevent the encapsulation layer 1040 from overflowing into the light transmitting area AD.
  • the spacer 1090 may be positioned outside the light transmitting area AD to surround the light transmitting area AD.
  • the spacer 1090 may include a structure in which an insulating layer 1020 and a pixel defining layer 1030 are stacked. According to an embodiment, a separate layer may be further stacked on the spacer 1090 to have a predetermined height or more.
  • the spacer 1090 may include a material different from that of the insulating layer 1020 and the pixel defining layer 1030 .
  • the planarization layer 1050 is positioned on the encapsulation layer 1040 , and may planarize an upper portion of the encapsulation layer 1040 .
  • the touch sensing layer 1060 may be positioned on the planarization layer 1050 .
  • the touch sensing layer 1060 may include at least one touch electrode to detect whether a touch has been made and a touch position.
  • the touch electrode may not be located in the light transmitting area AD.
  • the position of the touch sensing layer 1060 is not limited to that shown in FIG. 10 . 10 , the touch sensing layer 1060 may be replaced with a touch panel (eg, the touch panel 433 of FIG. 4 ) positioned outside the display panel.
  • the light blocking member 800 may be positioned on the touch sensing layer 1060 .
  • the light blocking member 800 includes the first light blocking part 810 positioned in the blocking area DS of the camera area NA1 and the second light blocking part surrounding the first light blocking part 810 and positioned in the display area DA. 820 may be included.
  • the light blocking member 800 may include a first opening 801 positioned in the light transmitting area AD and a plurality of second openings 803 positioned to correspond to each pixel in the display area DA. .
  • the touch sensing layer 1060 is omitted, the light blocking member 800 may be positioned on the planarization layer 1050 .
  • the first opening 801 of the light blocking member 800 may determine the light transmitting area AD.
  • the first opening 801 of the light blocking member 800 may coincide with the light transmitting area AD. That is, the edge of the first opening 801 of the light blocking member 800 may coincide with the edge of the light transmitting area AD in plan view.
  • the first light blocking portion 810 of the light blocking member 800 may overlap at least a portion of the third opening 1030a of the pixel defining layer 1030 in the first direction Dr1 .
  • the first light blocking part 810 of the light blocking member 800 may overlap the edge of the third opening 1030a of the pixel defining layer 1030 in the first direction Dr1 .
  • the first light blocking portion 810 of the light blocking member 800 may overlap at least a portion of the fourth opening 1042a of the organic layer 1042 of the encapsulation layer 1040 in the first direction Dr1 .
  • the first light blocking portion 810 of the light blocking member 800 may overlap the edge of the fourth opening 1042a of the organic layer 1042 of the encapsulation layer 1040 in the first direction Dr1 .
  • the first light blocking portion 810 of the light blocking member 800 may overlap the spacer 1090 in the first direction Dr1 .
  • the first light blocking portion 810 of the light blocking member 800 may overlap the bypass wiring 910 in the first direction Dr1 .
  • the color filter layer 1070 may be positioned on the light blocking member 800 and the touch sensing layer 1060 .
  • the color filter layer 1070 may be positioned in the plurality of second openings 803 of the light blocking member 800 .
  • the color filter layer 1070 may transmit light having a predetermined wavelength band and block light having other wavelength bands.
  • the color filter layer 1070 includes a first color filter 1070a that transmits light of a first wavelength band, a second color filter 1070b that transmits light of a second wavelength band, and a second color filter 1070b that transmits light of a third wavelength band.
  • a three-color filter 1070c may be included.
  • the first wavelength band may be a wavelength band representing red
  • the second wavelength band may be a wavelength band representing green
  • the third wavelength band may be a wavelength band representing blue
  • the first wavelength band may be a wavelength band representing magenta
  • the second wavelength band may be a wavelength band representing cyan
  • the third wavelength band may be a wavelength band representing yellow.
  • the first color filter 1070a, the second color filter 1070b, and the third color filter 1070c include a first organic emission layer 1221a (refer to FIG. 12), a second organic emission layer 1221b (refer to FIG. 12), and a second color filter 1070c, respectively. 3
  • color purity may be improved.
  • the electronic device may include a color filter layer 1070 to correct a color, and is positioned between the first color filter 1070a, the second color filter 1070b, and the third color filter 1070c. It is possible to prevent reflection of external light by including the light blocking member 800 . As a result, in the electronic device according to an embodiment, a polarizer may be omitted.
  • the electronic device according to the comparative example may include a polarization layer including at least one of a linear polarization layer and a retardation polarization layer. In the case of the electronic device according to the comparative example, the polarization layer may be removed from the light transmitting area AD in order to prevent a decrease in light transmittance.
  • the dead space may be widened by a tolerance according to a processing process of removing a partial region of the polarization layer or a tolerance occurring when the region from which the polarization layer is removed is disposed in the light transmitting area AD of the display. Since the electronic device according to an exemplary embodiment includes the color filter layer 1070 and the light blocking member 800 , the polarization layer may be omitted, and thus the dead space may be prevented from increasing by the polarization layer removal process.
  • the passivation layer 1080 may be positioned on the color filter layer 1070 .
  • the passivation layer 1080 may include an organic material and may planarize an upper portion of the color filter layer 1070 .
  • An adhesive layer 410 and a front cover 320 may be positioned on the passivation layer 1080 . That is, the front cover 320 may be located on the display panel 431 . Light emitted from the display panel 431 may pass through the front cover 320 . Since the electronic device 1000 according to an embodiment includes the first light blocking part 810 positioned in the blocking area DS, the front cover 320 may not include the light blocking printing area.
  • the camera module 500 may be located below the display panel 431 . Since the electronic device 1000 according to an embodiment includes the first light blocking unit 810 serving as an iris inside the display panel 431 , the camera module 500 may not separately include an iris. That is, the aperture of the camera module 500 may be replaced with the first light blocking unit 810 . According to an embodiment, the diameter of the light transmission area AD may be determined based on an effective aperture of the lens 531 of the camera module 500 . For example, the diameter of the light transmission area AD may be the same as the effective aperture of the lens 531 of the camera module 500 .
  • FIG. 11 is a plan view illustrating a portion including a light transmission area AD in an electronic device according to an exemplary embodiment.
  • the first opening 801 of the light blocking member 800 may coincide with the light transmitting area AD.
  • the spacer 1090 may be positioned outside the first opening 801 of the light blocking member 800 to surround the first opening 801 of the light blocking member 800 .
  • the edge of the third opening 1030a of the pixel defining layer 1030 surrounds the first opening 801 of the light blocking member 800 outside the first opening 801 of the light blocking member 800 , can be located
  • the edge of the fourth opening 1042a of the encapsulation layer 1040 (refer to FIG. 10 ) is positioned outside the first opening 801 of the light blocking member 800 to surround the first opening 801 of the light blocking member 800 . can do.
  • a diameter 2R 1 of the first opening 801 of the light blocking member 800 may be smaller than a diameter 2R 3 of the third opening 1030a of the pixel defining layer 1030 .
  • a diameter 2R 1 of the first opening 801 of the light blocking member 800 may be smaller than a diameter 2R 2 of the fourth opening 1042a of the encapsulation layer 1040 .
  • FIG. 12 is a cross-sectional view illustrating a display area of an electronic device according to an exemplary embodiment.
  • the electronic device 1200 includes a substrate 1010 , a pixel circuit layer 1210 , an organic light emitting diode (OLED), a pixel defining layer 1030 , an encapsulation layer 1040 , and planarization in the display area DA. It may include a film 1050 , a touch sensing layer 1060 , a second light blocking part 820 , a color filter layer 1070 , an adhesive layer 410 , and a front cover 320 .
  • OLED organic light emitting diode
  • the pixel circuit layer 1210 may include at least one transistor to supply a current for driving a pixel to the pixel electrode 1230 of the organic light emitting diode OLED.
  • the pixel circuit layer 1210 includes at least one conductive layer (eg, a first gate conductive layer, a second gate conductive layer, a first data conductive layer, and a second data conductive layer) and an insulating layer (eg, a conductive layer) disposed between the conductive layers. 1020 (refer to FIG. 10).
  • the pixel circuit layer 1210 will be described in detail with reference to FIGS. 13 and 14 .
  • a pixel electrode 1230 may be positioned on the pixel circuit layer 1210 .
  • a pixel defining layer 1030 may be positioned on the pixel circuit layer 1210 and the pixel electrode 1230 .
  • the pixel defining layer 1030 may include a pixel opening 1031 exposing the pixel electrode 1230 .
  • the pixel defining layer 1030 may include a light blocking material. When the pixel defining layer 1030 includes a light blocking material, it is possible to prevent color mixing of the light generated from the organic emission layer 1221 of one pixel and the light generated from the organic emission layer 1221 of an adjacent pixel.
  • An organic emission layer 1221 and a common electrode 1240 may be positioned on the pixel electrode 1230 exposed by the pixel opening 1031 .
  • the common electrode 1240 may also be formed on the pixel defining layer 1030 to span the plurality of pixels PX.
  • the pixel electrode 1230 , the organic emission layer 1221 , and the common electrode 1240 may form an organic light emitting diode (OLED).
  • the pixel electrode 1230 may be an anode that is a hole injection electrode
  • the common electrode 1240 may be a cathode that is an electron injection electrode.
  • the organic emission layer 1221 may include a first organic emission layer 1221a emitting a first color, a second organic emission layer 1221b emitting a second color, and a third organic emission layer 1221c emitting a third color.
  • the first organic emission layer 1221a may be a red organic emission layer emitting red light
  • the second organic emission layer 1221b may be a green organic emission layer emitting green light
  • the third organic emission layer 1221c may be It may be a blue organic light emitting layer emitting blue light.
  • the red organic light emitting layer, the green organic light emitting layer, and the blue organic light emitting layer are respectively formed in the red pixel, the green pixel, and the blue pixel to implement a color image.
  • the organic emission layer 1221 may include a white organic emission layer emitting white light.
  • An encapsulation layer 1040 for sealing the organic light emitting diode OLED may be positioned on the common electrode 1240 .
  • a planarization layer 1050 and a touch sensing layer 1060 may be positioned on the encapsulation layer 1040 .
  • a second light blocking unit 820 may be positioned on the touch sensing layer 1060 .
  • the second light blocking part 820 may include a plurality of second openings 803 in a region overlapping the first organic emission layer 1221a, the second organic emission layer 1221b, and the third organic emission layer 1221c.
  • the color filter layer 1070 may be positioned in the second opening 803 of the second light blocking part 820 .
  • the color filter layer 1070 may overlap the organic light emitting diode (OLED).
  • the first color filter 1070a, the second color filter 1070b, and the third color filter 1070c of the color filter layer 1070 have a first organic emission layer 1221a, a second organic emission layer 1221b, and a third organic emission layer, respectively. It may overlap the emission layer 1221c.
  • An adhesive layer 410 and a front cover 320 may be positioned on the color filter layer 1070 .
  • FIG. 13 is an equivalent circuit diagram of one pixel included in an electronic device according to an exemplary embodiment.
  • one pixel PX includes a plurality of transistors T1 , T2 , T3 , T4 , T5 , T6 , and T7 , a plurality of signal lines 720 , 730 , 1321 , 1323 , 1324 , 1325 , 1372 , 1390), a storage capacitor (Cst), and an organic light emitting diode (OLED).
  • transistors T1 , T2 , T3 , T4 , T5 , T6 , and T7 a plurality of signal lines 720 , 730 , 1321 , 1323 , 1324 , 1325 , 1372 , 1390
  • Cst storage capacitor
  • OLED organic light emitting diode
  • the plurality of transistors T1, T2, T3, T4, T5, T6, and T7 include a first transistor (eg, a driving transistor) T1 and a second transistor (eg, a switching transistor) (T2). , third transistor (eg compensation transistor) (T3), fourth transistor (eg initialization transistor) (T4), fifth transistor (eg operation control transistor) (T5) , a sixth transistor (eg, a light emission control transistor) T6 and a seventh transistor (eg, a bypass transistor) T7.
  • a first transistor eg, a driving transistor
  • T2 eg, a switching transistor
  • T3 third transistor
  • fourth transistor eg initialization transistor
  • T5 eg operation control transistor
  • T6 eg, a light emission control transistor
  • a seventh transistor eg, a bypass transistor
  • the plurality of signal lines 720 , 730 , 1321 , 1323 , 1324 , 1325 , 1372 , and 1390 cross the gate line 720 and the gate line 720 that transmit the gate signal Sn and transmit the data voltage Dm.
  • data line 730, the previous gate line 1321 that transmits the previous gate signal Sn-1 to the fourth transistor T4, and the light emission control signal ( A light emission control line 1323 that transmits EM), an initialization voltage line 1324 that transmits an initialization voltage Vint that initializes the first transistor T1 , and a bypass signal BP are transmitted to the seventh transistor T7 .
  • It may include a bypass control line 1325 that transmits the driving voltage ELVDD, a driving voltage line 1372 that transmits the driving voltage ELVDD, and a common voltage line 1390 that transmits the common voltage ELVSS.
  • the gate electrode G1 of the first transistor T1 may be connected to the first storage electrode Cst1 of the storage capacitor Cst.
  • the source electrode S1 of the first transistor T1 may be connected to the driving voltage line 1372 via the fifth transistor T5 .
  • the drain electrode D1 of the first transistor T1 may be electrically connected to the anode of the organic light emitting diode OLED via the sixth transistor T6 .
  • the first transistor T1 may receive the data voltage Dm according to the switching operation of the second transistor T2 to supply the driving current I d to the organic light emitting diode OLED.
  • the gate electrode G2 of the second transistor T2 may be connected to the gate line 720 .
  • the source electrode S2 of the second transistor T2 may be connected to the data line 730 .
  • the drain electrode D2 of the second transistor T2 may be connected to the source electrode S1 of the first transistor T1 , and may also be connected to the driving voltage line 1372 via the fifth transistor T5 .
  • the second transistor T2 is turned on according to the gate signal Sn received through the gate line 720 to transmit the data voltage Dm from the data line 730 to the source electrode S1 of the first transistor T1. It is possible to perform a switching operation to transfer
  • the gate electrode G3 of the third transistor T3 may be connected to the gate line 720 .
  • the source electrode S3 of the third transistor T3 may be connected to the drain electrode D1 of the first transistor T1, and the anode of the organic light emitting diode OLED via the sixth transistor T6. can also be connected with
  • the drain electrode D3 of the third transistor T3 includes the drain electrode D4 of the fourth transistor T4, the first storage electrode Cst1 of the storage capacitor Cst, and the gate electrode D of the first transistor T1. G1) can be connected together.
  • the third transistor T3 is turned on according to the gate signal Sn received through the gate line 720 to connect the gate electrode G1 and the drain electrode D1 of the first transistor T1 to each other to form the first first transistor T3.
  • the transistor T1 may be diode-connected.
  • the gate electrode G4 of the fourth transistor T4 may be connected to the previous gate line 1321 .
  • the source electrode S4 of the fourth transistor T4 may be connected to the initialization voltage line 1324 .
  • the drain electrode D4 of the fourth transistor T4 includes the drain electrode D3 of the third transistor T3, the first storage electrode Cst1 of the storage capacitor Cst, and the gate electrode D3 of the first transistor T1. G1) can be connected together.
  • the fourth transistor T4 is turned on according to the previous gate signal Sn-1 received through the previous gate line 1321 to transmit the initialization voltage Vint to the gate electrode G1 of the first transistor T1.
  • an initialization operation for initializing the voltage of the gate electrode G1 of the first transistor T1 may be performed.
  • the gate electrode G5 of the fifth transistor T5 may be connected to the emission control line 1323 .
  • the source electrode S5 of the fifth transistor T5 may be connected to the driving voltage line 1372 .
  • the drain electrode D5 of the fifth transistor T5 may be connected to the source electrode S1 of the first transistor T1 and the drain electrode S2 of the second transistor T2 .
  • the gate electrode G6 of the sixth transistor T6 may be connected to the emission control line 1323 .
  • the source electrode S6 of the sixth transistor T6 may be connected to the drain electrode D1 of the first transistor T1 and the source electrode S3 of the third transistor T3 .
  • the drain electrode D6 of the sixth transistor T6 may be electrically connected to the anode of the organic light emitting diode OLED.
  • the fifth transistor T5 and the sixth transistor T6 are simultaneously turned on according to the light emission control signal EM transmitted through the light emission control line 1323 to transmit the driving current I d to the organic light emitting diode (OLED). can be supplied to
  • the gate electrode G7 of the seventh transistor T7 may be connected to the bypass control line 1325 .
  • the source electrode S7 of the seventh transistor T7 may be connected together to the drain electrode D6 of the sixth transistor T6 and the anode of the organic light emitting diode OLED.
  • the drain electrode D7 of the seventh transistor T7 may be connected together to the initialization voltage line 1324 and the source electrode S4 of the fourth transistor T4 .
  • a portion of the driving current I d may escape through the seventh transistor T7 as the bypass current I bp .
  • the light emitting current I oled which is reduced by the amount of the bypass current I bp , may be supplied to the organic light emitting diode OLED.
  • the bypass control line 1325 is illustrated as being connected to the previous gate line 1321 in FIG. 4 , the present invention is not limited thereto.
  • the second storage electrode Cst2 of the storage capacitor Cst is connected to the driving voltage line 1372 , and the cathode of the organic light emitting diode OLED is connected to the common voltage line 1390 transmitting the common voltage ELVSS and can be connected
  • the organic light emitting diode OLED includes a first electrode connected to the drain electrode D1 of the first transistor T1 through a sixth transistor T6 and a second electrode to which the common voltage ELVSS is applied.
  • the first electrode of the organic light emitting device OLED may be an anode
  • the second electrode of the organic light emitting device OLED may be a cathode.
  • the organic light emitting diode OLED may emit light according to the driving current I d output from the first transistor T1 to express grayscale.
  • FIG. 13 shows a structure of seven transistors and one capacitor, the number of transistors and capacitors is not limited thereto, and the number of transistors and the number of capacitors may be variously modified.
  • FIGS. 13 and 14 is a cross-sectional view illustrating a display area of an electronic device according to an exemplary embodiment.
  • a semiconductor 1410 may be positioned on the substrate 1010 .
  • the semiconductor 1410 is a channel doped with an N-type impurity or a P-type impurity and is located on both sides of the channel and channels CH1, CH2, and CH6, and is a source electrode having a higher doping concentration than the doping impurity doped in the channel. ( S1 , S2 , S6 ) and drain electrodes D1 , D2 , and D6 may be included.
  • the semiconductor 1410 includes a first channel CH1 overlapping the first gate electrode G1 , a second channel CH2 overlapping the second gate electrode G2 , and a second channel CH2 overlapping the sixth gate electrode G6 . It may include 6 channels (CH6).
  • the semiconductor 1410 includes a first source electrode S1 and a first drain electrode D1 positioned on both sides of the first channel CH1, and is positioned on both sides of the second channel CH2.
  • the second source electrode S2 and the second drain electrode D2 may be included, and a sixth source electrode S6 and a sixth drain electrode D6 positioned on both sides of the sixth channel CH6 may be included. have.
  • a first insulating layer 1021 may be positioned on the semiconductor 1410 .
  • the first insulating layer 1021 may include silicon nitride (SiN x ) or silicon oxide (SiO 2 ).
  • the electronic device may further include a buffer layer positioned between the substrate 1010 and the semiconductor 1410 .
  • the first gate conductive layers G1 , G2 , and G6 may be positioned on the first insulating layer 1021 .
  • the first gate conductive layers G1 , G2 , and G6 may include a first gate electrode G1 , a second gate electrode G2 , and a sixth gate electrode G6 .
  • a second insulating layer 1022 may be positioned on the gate conductive layers G1 , G2 , and G6 and the first insulating layer 1021 .
  • a second gate conductive layer including the second storage electrode Cst2 may be positioned on the second insulating layer 1022 .
  • a third insulating layer 1023 may be positioned on the second storage electrode Cst2 and the second insulating layer 1022 .
  • First data conductive layers 1372 and 1421 may be positioned on the third insulating layer 1023 .
  • the first data conductive layers 1372 and 1421 may include a driving voltage line 1372 and a connection member 1421 .
  • the connection member 1421 may be connected to the sixth drain electrode D6 of the sixth transistor T6 through the contact hole 41 .
  • a fourth insulating layer 1024 is positioned on the first data conductive layers 1372 and 1421 and the third insulating layer 1023 , and a second data conductive layer including a data line 730 is positioned on the fourth insulating layer 1024 . 730 may be located.
  • a fifth insulating layer 1025 may be positioned on the second data conductive layer 730 and the fourth insulating layer 1024 .
  • a pixel electrode 1230 , an organic emission layer 1221 , a common electrode 1240 , and a pixel defining layer 1030 may be positioned on the fifth insulating layer 1025 .
  • the pixel electrode 1230 may be connected to the connection member 1421 through the contact hole 43 .
  • An encapsulation layer 1040 may be positioned on the common electrode 1240 .
  • the electronic device 1501 communicates with the electronic device 1502 through a first network 1598 (eg, a short-range wireless communication network) or a second network 1599 . It may communicate with the electronic device 1504 or the server 1508 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 1501 may communicate with the electronic device 1504 through the server 1508 .
  • a first network 1598 eg, a short-range wireless communication network
  • a second network 1599 e.g., a second network 1599
  • the electronic device 1504 or the server 1508 eg, a long-distance wireless communication network
  • the electronic device 1501 may communicate with the electronic device 1504 through the server 1508 .
  • the electronic device 1501 includes a processor 1520 , a memory 1530 , an input device 1550 , a sound output device 1555 , a display device 1560 , an audio module 1570 , and a sensor module ( 1576 , interface 1577 , haptic module 1579 , camera module 1580 , power management module 1588 , battery 1589 , communication module 1590 , subscriber identification module 1596 , or antenna module 1597 . ) may be included. In some embodiments, at least one of these components (eg, the display device 1560 or the camera module 1580 ) may be omitted or one or more other components may be added to the electronic device 1501 . In some embodiments, some of these components may be implemented as one integrated circuit. For example, the sensor module 1576 (eg, a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented while being embedded in the display device 1560 (eg, a display).
  • the sensor module 1576 eg, a fingerprint sensor, an
  • the processor 1520 for example, executes software (eg, a program 1540) to execute at least one other component (eg, hardware or software component) of the electronic device 1501 connected to the processor 1520. It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or computation, the processor 1520 converts commands or data received from other components (eg, the sensor module 1576 or the communication module 1590 ) to the volatile memory 1532 . may be loaded into the volatile memory 1532 , process commands or data stored in the volatile memory 1532 , and store the resulting data in the non-volatile memory 1534 .
  • software eg, a program 1540
  • the processor 1520 converts commands or data received from other components (eg, the sensor module 1576 or the communication module 1590 ) to the volatile memory 1532 .
  • the volatile memory 1532 may be loaded into the volatile memory 1532 , process commands or data stored in the volatile memory 1532 , and store the resulting data in the non-volatile memory 1534
  • the processor 1520 includes a main processor 1521 (eg, a central processing unit or an application processor), and a secondary processor 1523 (eg, a graphics processing unit, an image signal processor) that can operate independently or in conjunction with the main processor 1521 (eg, a graphics processing unit or an image signal processor). , a sensor hub processor, or a communication processor). Additionally or alternatively, the auxiliary processor 1523 may be configured to use less power than the main processor 1521 or to specialize in a designated function. The coprocessor 1523 may be implemented separately from or as part of the main processor 1521 .
  • a main processor 1521 eg, a central processing unit or an application processor
  • a secondary processor 1523 eg, a graphics processing unit, an image signal processor
  • the auxiliary processor 1523 may be configured to use less power than the main processor 1521 or to specialize in a designated function.
  • the coprocessor 1523 may be implemented separately from or as part of the main processor 1521 .
  • the coprocessor 1523 may be, for example, on behalf of the main processor 1521 while the main processor 1521 is in an inactive (eg, sleep) state, or when the main processor 1521 is active (eg, executing an application). ), together with the main processor 1521, at least one of the components of the electronic device 1501 (eg, the display device 1560, the sensor module 1576, or the communication module 1590) It is possible to control at least some of the related functions or states.
  • the co-processor 1523 eg, image signal processor or communication processor
  • may be implemented as part of another functionally related component eg, camera module 1580 or communication module 1590. have.
  • the memory 1530 may store various data used by at least one component (eg, the processor 1520 or the sensor module 1576) of the electronic device 1501 .
  • the data may include, for example, input data or output data for software (eg, a program 1540 ) and instructions related thereto.
  • the memory 1530 may include a volatile memory 1532 or a non-volatile memory 1534 .
  • the program 1540 may be stored as software in the memory 1530 , and may include, for example, an operating system 1542 , middleware 1544 , or an application 1546 .
  • the input device 1550 may receive a command or data to be used in a component (eg, the processor 1520 ) of the electronic device 1501 from the outside (eg, a user) of the electronic device 1501 .
  • the input device 1550 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (eg, a stylus pen).
  • the sound output device 1555 may output a sound signal to the outside of the electronic device 1501 .
  • the sound output device 1555 may include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback, and the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.
  • the display device 1560 may visually provide information to the outside (eg, a user) of the electronic device 1501 .
  • the display device 1560 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the corresponding device.
  • the display device 1560 may include a touch circuitry configured to sense a touch or a sensor circuit (eg, a pressure sensor) configured to measure the intensity of a force generated by the touch. have.
  • the audio module 1570 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 1570 acquires a sound through the input device 1550 or an external electronic device (eg, a sound output device 1555 ) directly or wirelessly connected to the electronic device 1501 .
  • the electronic device 1502) eg, a speaker or headphones
  • the sensor module 1576 detects an operating state (eg, power or temperature) of the electronic device 1501 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the sensed state. can do.
  • the sensor module 1576 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface 1577 may support one or more specified protocols that may be used for the electronic device 1501 to directly or wirelessly connect with an external electronic device (eg, the electronic device 1502 ).
  • the interface 1577 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card
  • connection terminal 1578 may include a connector through which the electronic device 1501 can be physically connected to an external electronic device (eg, the electronic device 1502 ).
  • the connection terminal 1578 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 1579 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense.
  • the haptic module 1579 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 1580 may capture still images and moving images. According to one embodiment, the camera module 1580 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 1588 may manage power supplied to the electronic device 1501 .
  • the power management module 1588 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 1589 may supply power to at least one component of the electronic device 1501 .
  • battery 1589 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • the communication module 1590 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 1501 and an external electronic device (eg, the electronic device 1502, the electronic device 1504, or the server 1508). It can support establishment and communication through the established communication channel.
  • the communication module 1590 operates independently of the processor 1520 (eg, an application processor) and may include one or more communication processors supporting direct (eg, wired) communication or wireless communication.
  • the communication module 1590 is a wireless communication module 1592 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 1594 (eg, : LAN (local area network) communication module, or a power line communication module) may be included.
  • a wireless communication module 1592 eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 1594 eg, : LAN (local area network) communication module, or a power line communication module
  • a corresponding communication module among these communication modules is a first network 1598 (eg, a short-range communication network such as Bluetooth, WiFi direct or IrDA (infrared data association)) or a second network 1599 (eg, a cellular network, the Internet, Alternatively, it may communicate with the external electronic device 1504 through a computer network (eg, a telecommunication network such as a LAN or WAN).
  • a first network 1598 eg, a short-range communication network such as Bluetooth, WiFi direct or IrDA (infrared data association)
  • a second network 1599 eg, a cellular network, the Internet
  • a computer network eg, a telecommunication network such as a LAN or WAN.
  • These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other.
  • the wireless communication module 1592 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 1596 within a communication network, such as the first network 1598 or the second network 1599 .
  • subscriber information eg, International Mobile Subscriber Identifier (IMSI)
  • IMSI International Mobile Subscriber Identifier
  • the electronic device 1501 may be identified and authenticated.
  • the antenna module 1597 may transmit or receive a signal or power to the outside (eg, an external electronic device).
  • the antenna module 1597 may include one antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern.
  • the antenna module 1597 may include a plurality of antennas. In this case, at least one antenna suitable for a communication scheme used in a communication network such as the first network 1598 or the second network 1599 is connected from the plurality of antennas by, for example, the communication module 1590 . can be selected. A signal or power may be transmitted or received between the communication module 1590 and an external electronic device through the selected at least one antenna.
  • other components eg, RFIC
  • other than the radiator may be additionally formed as a part of the antenna module 1597 .
  • peripheral devices eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • GPIO general purpose input and output
  • SPI serial peripheral interface
  • MIPI mobile industry processor interface
  • the command or data may be transmitted or received between the electronic device 1501 and the external electronic device 1504 through the server 1508 connected to the second network 1599 .
  • Each of the external electronic devices 1502 and 1504 may be the same as or different from the electronic device 1501 .
  • all or a part of operations executed in the electronic device 1501 may be executed in one or more of the external electronic devices 1502 , 1504 , or 1508 .
  • the electronic device 1501 may instead of executing the function or service itself.
  • one or more external electronic devices may be requested to perform at least a part of the function or the service.
  • the one or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 1501 .
  • the electronic device 1501 may process the result as it is or additionally and provide it as at least a part of a response to the request.
  • cloud computing, distributed computing, or client-server computing technology may be used.
  • a display device 1560 may include a display 1610 and a display driver IC (DDI) 1630 for controlling the display 1610 .
  • the DDI 1630 may include an interface module 1631 , a memory 1633 (eg, a buffer memory), an image processing module 1635 , or a mapping module 1637 .
  • the DDI 1630 receives, for example, image data or image information including an image control signal corresponding to a command for controlling the image data from another component of the electronic device 1501 through the interface module 1631 . can do.
  • the image information is provided by the processor 1520 (eg, the main processor 1521 (eg, an application processor) or the auxiliary processor 1523 ( For example: a graphic processing device)
  • the DDI 1630 may communicate with the touch circuit 1650 or the sensor module 1576 through the interface module 1631.
  • the DDI 1630 At least a portion of the received image information may be stored in the memory 1633, for example, in units of frames.
  • Pre-processing or post-processing eg, resolution, brightness, or size adjustment
  • the mapping module 1637 may perform pre-processing or post-processing through the image processing module 1535.
  • a voltage value or a current value corresponding to the image data may be generated.
  • the generation of the voltage value or the current value may include, for example, a property of pixels of the display 1610 (eg, an arrangement of pixels ( RGB stripe or pentile structure), or the size of each sub-pixel) At least some pixels of the display 1610 are, for example, based at least in part on the voltage value or the current value.
  • visual information eg, text, image, or icon
  • corresponding to the image data may be displayed through the display 1610 .
  • the display device 1560 may further include a touch circuit 1650 .
  • the touch circuit 1650 may include a touch sensor 1651 and a touch sensor IC 1653 for controlling the touch sensor 1651 .
  • the touch sensor IC 1653 may control the touch sensor 1651 to sense, for example, a touch input or a hovering input for a specific location of the display 1610 .
  • the touch sensor IC 1653 may detect a touch input or a hovering input by measuring a change in a signal (eg, voltage, light amount, resistance, or electric charge amount) for a specific position of the display 1610 .
  • a signal eg, voltage, light amount, resistance, or electric charge amount
  • the touch sensor IC 1653 may provide information (eg, location, area, pressure, or time) regarding the sensed touch input or hovering input to the processor 1520 .
  • information eg, location, area, pressure, or time
  • at least a part of the touch circuit 1650 eg, the touch sensor IC 1653
  • the display driver IC 1630 the display 1610 , or outside the display device 1560 .
  • the display device 1560 may further include at least one sensor (eg, a fingerprint sensor, an iris sensor, a pressure sensor, or an illuminance sensor) of the sensor module 1576 or a control circuit therefor.
  • the at least one sensor or a control circuit therefor may be embedded in a part of the display device 1560 (eg, the display 1610 or the DDI 1630 ) or a part of the touch circuit 1650 .
  • the sensor module 1576 embedded in the display device 1560 includes a biometric sensor (eg, a fingerprint sensor)
  • the biometric sensor provides biometric information related to a touch input through a partial area of the display 1610 . (eg, fingerprint image) can be acquired.
  • the pressure sensor may acquire pressure information related to a touch input through a part or the entire area of the display 1610 .
  • the touch sensor 1651 or the sensor module 1576 may be disposed between pixels of a pixel layer of the display 1610 , or above or below the pixel layer.
  • the electronic device may have various types of devices.
  • the electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device.
  • a portable communication device eg, a smart phone
  • a computer device e.g., a smart phone
  • a portable multimedia device e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a wearable device e.g., a smart bracelet
  • a home appliance device e.g., a home appliance
  • a or B at least one of A and B, “at least one of A or B”, “A, B or C”, “at least one of A, B and C” and “A;
  • Each of the phrases “at least one of B, or C” may include any one of, or all possible combinations of, items listed together in the corresponding one of the phrases.
  • Terms such as “first”, “second”, or “first” or “second” may simply be used to distinguish the component from other components in question, and may refer to components in other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively”. When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.
  • module may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as, for example, logic, logic block, component, or circuit.
  • a module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • Various embodiments of the present document include one or more instructions stored in a storage medium (eg, internal memory 1536 or external memory 1538) readable by a machine (eg, electronic device 1501). may be implemented as software (eg, a program 1540) including
  • a processor eg, processor 1520
  • a device eg, electronic device 1501
  • the one or more instructions may include code generated by a compiler or code executable by an interpreter.
  • the device-readable storage medium may be provided in the form of a non-transitory storage medium.
  • 'non-transitory storage medium' is a tangible device and only means that it does not contain a signal (eg, electromagnetic wave). It does not distinguish the case where it is stored as
  • the 'non-transitory storage medium' may include a buffer in which data is temporarily stored.
  • the method according to various embodiments disclosed in this document may be provided as included in a computer program product.
  • Computer program products may be traded between sellers and buyers as commodities.
  • the computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg Play Store TM ) or on two user devices ( It can be distributed (eg downloaded or uploaded) directly, online between smartphones (eg: smartphones).
  • a portion of a computer program product eg, a downloadable app
  • a machine-readable storage medium such as a memory of a manufacturer's server, a server of an application store, or a relay server. It may be temporarily stored or temporarily created.
  • each component eg, a module or a program of the above-described components may include a singular or a plurality of entities.
  • one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added.
  • a plurality of components eg, a module or a program
  • the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. or one or more other operations may be added.

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  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

L'invention concerne un dispositif électronique comprenant : un panneau d'affichage comprenant une région d'affichage pour afficher une image à travers une pluralité de pixels et une région de transmission de lumière qui transmet une lumière externe qui a été transmise à travers une fenêtre ; la fenêtre qui est située sur une partie supérieure du panneau d'affichage et à travers laquelle la lumière émise par le panneau d'affichage est transmise ; et un module de caméra situé sous le panneau d'affichage et chevauchant la région de transmission de lumière, le panneau d'affichage comprenant : une pluralité de diodes électroluminescentes organiques qui sont situées dans la région d'affichage et expriment la pluralité de pixels ; une couche d'encapsulation recouvrant la pluralité de diodes électroluminescentes organiques ; et une couche de blocage de lumière comprenant la région d'affichage et la région de transmission de lumière, sur une partie supérieure de la couche d'encapsulation, la couche de blocage de lumière comprenant : une pluralité de filtres colorés alignés pour chevaucher la pluralité de diodes électroluminescentes organiques ; et un élément de blocage de lumière qui est situé entre les filtres colorés pour bloquer la lumière et comprend une ouverture située dans la région de transmission de lumière de telle sorte que la lumière externe est transmise à travers l'ouverture et le bord de l'ouverture de l'élément de blocage de lumière, aligné pour chevaucher le module de caméra, correspond au bord de la région de transmission de lumière. Divers autres modes de réalisation de la présente spécification sont également possibles.
PCT/KR2021/002075 2020-02-19 2021-02-18 Dispositif électronique comprenant une unité d'affichage WO2021167373A1 (fr)

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CN114267685A (zh) * 2021-12-14 2022-04-01 武汉华星光电半导体显示技术有限公司 显示面板及显示装置
WO2023184102A1 (fr) * 2022-03-28 2023-10-05 京东方科技集团股份有限公司 Panneau d'affichage et appareil d'affichage
WO2023201800A1 (fr) * 2022-04-20 2023-10-26 武汉华星光电半导体显示技术有限公司 Module d'affichage et appareil d'affichage

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