WO2020252947A1 - 显示面板 - Google Patents

显示面板 Download PDF

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Publication number
WO2020252947A1
WO2020252947A1 PCT/CN2019/105468 CN2019105468W WO2020252947A1 WO 2020252947 A1 WO2020252947 A1 WO 2020252947A1 CN 2019105468 W CN2019105468 W CN 2019105468W WO 2020252947 A1 WO2020252947 A1 WO 2020252947A1
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WO
WIPO (PCT)
Prior art keywords
display panel
layer
conductive film
rough structure
anode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/105468
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English (en)
French (fr)
Inventor
倪晶
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Application filed by Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Publication of WO2020252947A1 publication Critical patent/WO2020252947A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/81—Anodes
    • H10K50/813—Anodes characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/81—Anodes
    • H10K50/814—Anodes combined with auxiliary electrodes, e.g. ITO layer combined with metal lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations

Definitions

  • This application relates to the technical field of display panels, and in particular to a display panel.
  • OLED Organic Light-Emitting Diode
  • a conventional OLED panel includes an array layer, a flat layer, an OLED device, and a flexible packaging layer.
  • the anode of the OLED device includes a bottom ITO (Indium-Tin Oxide) layer, a silver metal layer, and a top ITO layer.
  • the anode of the panel frame is prone to peeling, that is, the two interfaces of the top ITO layer/silver metal layer/bottom ITO layer are split, or the flexible packaging layer and the top
  • the film split between the ITO layers seriously affects the performance and service life of the display panel.
  • the present application provides a display panel.
  • a display panel By providing a rough structure on the surface of each film layer of the anode located in the frame area of the display panel, and the thin film encapsulating layer covers at least part of the rough structure, the anode and the thin film encapsulating layer in the frame area of the display panel are solved
  • the problem of film layer separation is likely to occur between the film layers of the anode and the film layers of the anode, which seriously affects the performance and service life of the display panel.
  • the present application provides a display panel, which includes an organic light-emitting device and a thin film encapsulation layer disposed on the organic light-emitting device; the organic light-emitting device includes an anode, and the display panel includes a frame area located at the anode of the frame area. A rough structure is formed on the surface, and the thin film encapsulation layer covers at least part of the rough structure.
  • the anode includes a first conductive film, a metal layer, and a second conductive film, the metal layer covers the second conductive film, and the first conductive film covers On the metal layer; the rough structure is formed on the surface of the first conductive film located in the frame area, and the thin film encapsulation layer covers at least part of the rough structure.
  • the rough structure is formed on the surface of the metal layer and the second conductive film located in the frame area.
  • the thin film encapsulation layer includes a first inorganic layer, an organic layer, and a second inorganic layer sequentially disposed on the organic light-emitting device, and the first inorganic layer covers at least part of the The rough structure.
  • the display panel further includes a plurality of barrier layers arranged on the rough structure at intervals, and the first inorganic layer further covers the plurality of barrier layers.
  • the rough structure includes a plurality of protrusions, and a plurality of protrusions on the first conductive film, a plurality of protrusions on the metal layer, and a The multiple protrusions on the second conductive film are arranged correspondingly or staggered.
  • the rough structure includes a plurality of grooves, a plurality of grooves on the first conductive film, a plurality of grooves on the metal layer, and a The multiple grooves on the conductive film are arranged correspondingly or staggered.
  • the rough structure includes a plurality of protrusions or a plurality of grooves.
  • the protrusion includes an arc-shaped protrusion or a square protrusion
  • the groove includes an arc-shaped groove or a square groove.
  • the plurality of protrusions or the plurality of grooves are arranged in an array.
  • the rough structure is formed through exposure, development and etching processes.
  • the display panel further includes a thin film transistor array substrate and a flat layer provided on the thin film transistor array substrate, and the anode is provided on the flat layer;
  • the organic light-emitting device further includes a pixel defining layer, a light-emitting function layer, and a cathode arranged on the pixel defining layer and the light-emitting function layer sequentially arranged on the anode; the thin film encapsulation layer also covers the cathode And the pixel definition layer.
  • the material of the first conductive film and the second conductive film includes indium tin oxide, and the material of the metal layer includes metallic silver.
  • the material of the first inorganic layer and the second inorganic layer includes aluminum oxide, titanium dioxide, silicon nitride, silicon carbonitride, silicon dioxide, or zirconium dioxide .
  • the material of the organic layer includes hexamethyldisiloxane, acrylic, polyacrylate, polycarbonate or polystyrene.
  • the present application also provides a display panel, including an organic light-emitting device and a thin film encapsulation layer disposed on the organic light-emitting device;
  • the organic light-emitting device includes an anode, and the anode includes a first conductive film, a metal layer, and a second conductive film.
  • a thin film, the metal layer covers the second conductive film, and the first conductive film covers the metal layer;
  • the display panel includes a frame area, the surfaces of the first conductive film, the metal layer, and the second conductive film located in the frame area are formed with rough structures, and the film encapsulation layer covers at least part of the first conductive film Rough structure.
  • the beneficial effect of the present application is that a rough structure is formed on the surface of the anode located in the frame area of the display panel, and the thin film encapsulation layer covers at least part of the rough structure, which effectively increases the contact area between the anode and the thin film encapsulation layer, Enhances the adhesion of the contact interface between the two, greatly reduces the probability of film split between the anode and the film encapsulation layer, and prevents external water and oxygen from intruding into the display panel from the contact interface of the anode and the film encapsulation layer to damage the organic
  • the light emitting device improves the performance of the display panel and prolongs the service life of the display panel; the surface of the first conductive film, the metal layer and the second conductive film of the anode located in the frame area of the display panel are all formed with rough structures, so that the film The contact area between the packaging layer and the first conductive film is increased, the contact area between the first conductive film and the metal layer is increased, and the contact area between the metal
  • FIG. 1 is a schematic block diagram of a partial structure of a display panel provided by an embodiment of the application
  • FIG. 2 is a schematic diagram of a partial structure of an anode and a first inorganic layer located in a frame area provided by an embodiment of the application;
  • FIG. 3 is a partial structural diagram of another anode located in the frame area and the first inorganic layer according to an embodiment of the application;
  • FIG. 4 is a schematic diagram of a partial structure of another anode located in the frame area and the first inorganic layer according to an embodiment of the application;
  • FIG. 5 is a partial structural diagram of another anode located in the frame area and the first inorganic layer according to an embodiment of the application;
  • FIG. 6 is a partial structural diagram of another anode located in the frame area and the first inorganic layer according to an embodiment of the application.
  • connection should be interpreted broadly unless otherwise clearly specified and limited.
  • it can be a fixed connection or a detachable connection. Connected or integrally connected; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication between two components.
  • connection should be interpreted broadly unless otherwise clearly specified and limited.
  • it can be a fixed connection or a detachable connection. Connected or integrally connected; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication between two components.
  • an embodiment of the present application provides a display panel 1, including an organic light emitting device 2 and a thin film encapsulation layer 3 disposed on the organic light emitting device 2.
  • the organic light emitting device 2 includes an anode 4, and the display panel 1 includes a frame In area 5, a rough structure 6 is formed on the surface of the anode 4 located in the frame area 5, and the thin film encapsulation layer 3 covers at least part of the rough structure 6.
  • the display panel 1 further includes a display area
  • the frame area 5 is arranged around the display area
  • the organic light-emitting device 2 is arranged corresponding to the display area
  • the thin film encapsulation layer 3 protects the organic light-emitting device 2, on the one hand, prevents the organic light-emitting device 2 from being exposed to external forces. The effect causes structural damage. On the other hand, it prevents external water and oxygen from entering the display area of the display panel 1 from the side of the frame area 5 of the display panel 1 and affects the performance of the organic light-emitting material in the organic light-emitting device 2.
  • a rough structure 6 is formed on the surface of the anode 4 located in the frame area 5 of the display panel 1, and the thin film encapsulation layer 3 covers at least part of the rough structure 6, which effectively enlarges the anode 4 and the thin film encapsulation layer 3.
  • the contact area between the two enhances the adhesion of the contact interface between the two, greatly reduces the probability of film split between the anode 4 and the thin film encapsulation layer 3, and prevents external water and oxygen from the anode 4 and the thin film encapsulation layer 3.
  • the contact interface invades the inside of the display panel 1 and damages the organic light emitting device 2, which improves the use performance of the display panel 1 and prolongs the service life of the display panel 1.
  • an embodiment of the present application also provides a display panel 1.
  • the anode 4 includes a first conductive film 7, a metal layer 8, and a second conductive film 9, and the metal layer 8 is covered on the second conductive film 9, the first conductive film 7 is covered on the metal layer 8; the surface of the first conductive film 7 in the frame area 5 is formed with a rough structure 6, and the film encapsulation layer 3 covers at least part of the roughness Structure 6.
  • the material of the first conductive film 7 and the second conductive film 9 includes indium tin oxide, and the material of the metal layer 8 includes metallic silver.
  • the materials of the first conductive film 7, the second conductive film 9 and the metal layer 8 The material is not limited to this.
  • a rough structure 6 is formed on the surface of the first conductive film 7 located in the frame area 5 of the display panel 1, and the film encapsulation layer 3 covers at least part of the rough structure 6, which effectively enlarges the first conductive film 7 and the film of the anode 4
  • the contact area between the encapsulation layer 3 enhances the adhesion between the two contact interfaces, greatly reduces the probability of film split between the anode 4 and the film encapsulation layer 3, and prevents water and oxygen from the outside from the first conductive film 7
  • the contact interface with the thin film encapsulation layer 3 invades the inside of the display panel 1 and damages the organic light emitting device 2, which improves the usability of the display panel 1 and prolongs the service life of the display panel 1.
  • the surface of the metal layer 8 and the second conductive film 9 in the frame area 5 is also formed with a rough structure 6.
  • the surface of the metal layer 8 of the anode 4 and the second conductive film 9 located in the frame area 5 are also formed with a rough structure 6, so that the first conductive film 7 and the metal layer 8, the metal layer 8 and the second conductive film The contact area between the films 9 is increased, which enhances the adhesion between the first conductive film 7 and the metal layer 8 and the adhesion between the metal layer 8 and the second conductive film 9, and greatly reduces the first conductive film 7 and the metal layer 8.
  • the probability of film splitting between the metal layer 8 and the second conductive film 9 can prevent water and oxygen from entering the display panel 1 from the contact interface of each film layer in the anode 4, and can also avoid the anode
  • the film layers of 4 are split to cause structural damage to the anode 4, which ensures the normal transmission of internal signals of the display panel 1, improves the performance of the display panel 1, and prolongs the service life of the display panel 1.
  • the thin film encapsulation layer 3 includes a first inorganic layer 10, an organic layer 11 and a second inorganic layer 12 sequentially disposed on the organic light emitting device 2, and the first inorganic layer 10 covers at least part of the rough structure 6.
  • the first inorganic layer 10 and the second inorganic layer 12 can be made by chemical vapor deposition, pulsed laser deposition or sputtering deposition processes.
  • the materials of the first inorganic layer 10 and the second inorganic layer 12 include but are not limited to trioxide.
  • the material of the organic layer 11 includes, but is not limited to, hexamethyldisiloxane, acrylates, polyacrylates, polycarbonates, poly With materials such as styrene, the organic layer 11 serves as a buffer and can protect the organic light-emitting device 2.
  • the first inorganic layer 10 of the thin film encapsulation layer 3 covers at least part of the rough structure 6, which effectively increases the contact area between the anode 4 and the first inorganic layer 10, and enhances the contact interface between the two
  • the adhesion force greatly reduces the probability of film split between the anode 4 and the first inorganic layer 10; because the first inorganic layer 10 functions to prevent water and oxygen from outside the display panel 1 from invading the organic light-emitting device 2, the first inorganic layer 10
  • the enhanced adhesion between the layer 10 and the anode 4 can further prevent the intrusion of water and oxygen, improve the performance of the display panel 1 and extend the service life of the display panel 1.
  • the display panel 1 further includes a plurality of barrier layers 13 arranged on the rough structure 6 at intervals, and the first inorganic layer 10 also covers the plurality of barrier layers 13.
  • a plurality of barrier layers 13 are arranged around the organic light emitting device 2 to prevent water and oxygen from outside from entering the interior of the display panel 1 and affecting the performance of the display panel 1; and the organic layer 11 of the thin film encapsulation layer 3 is also blocked by a plurality of
  • the first inorganic layer 10 covers the multiple barrier layers 13, and the second inorganic layer 12 covers the organic layer 11 and the first inorganic layer 10, preventing the organic layer 11 from overflowing the first inorganic layer 10 and the second inorganic layer.
  • the edges of the inorganic layer 12 ensure the packaging effect of the thin film packaging layer 3.
  • the barrier layer 13 is provided on the rough structure 6, which effectively increases the contact area between the barrier layer 13 and the anode 4, enhances the adhesion between the two contact interfaces, and greatly reduces the anode 4 and the barrier layer.
  • the probability of film splitting between 13 strengthens the function of the barrier layer 13 to block water and oxygen from outside.
  • the rough structure 6 includes a plurality of protrusions 14, and a plurality of protrusions 14 on the first conductive film 7 and a plurality of protrusions on the metal layer 8. 14 and the plurality of protrusions 14 on the second conductive film 9 are arranged correspondingly or staggered; or, as shown in FIGS. 5 and 6, the rough structure 6 includes a plurality of grooves 15 and is located on the first conductive film The multiple grooves 15 on the 7, the multiple grooves 15 on the metal layer 8 and the multiple grooves 15 on the second conductive film 9 are arranged correspondingly or staggered.
  • the surface of the anode 4 may be formed with a plurality of protrusions 14 to form a rough structure 6, or a plurality of grooves 15 to form a rough structure 6.
  • the protrusions 14 or the grooves 15 between the layers of the anode 4 can be arranged correspondingly or staggered, which is not limited here. Both the protrusion 14 or the groove 15 can increase the contact area between two adjacent film layers, increase the adhesion of the contact surface, and prevent the two adjacent film layers from splitting.
  • the protrusion 14 includes an arc-shaped protrusion 14 or a square protrusion 14; as shown in FIGS. 5 and 6, the groove 15 includes an arc-shaped groove 15 or a square Groove 15.
  • the specific shapes of the protrusion 14 and the groove 15 are not limited to the shapes listed in this embodiment.
  • the plurality of protrusions 14 or the plurality of grooves 15 are arranged in an array.
  • the plurality of protrusions 14 are arranged in an array, or the plurality of grooves 15 are arranged in an array, which reduces the manufacturing process difficulty of the rough structure 6 on the basis of increasing the contact area of adjacent film layers.
  • the rough structure 6 can be formed through exposure, development and etching processes.
  • the display panel 1 further includes a thin film transistor array substrate 16 and a flat layer 17 provided on the thin film transistor (Thin Film Transistor, TFT) array substrate 16.
  • the anode 4 is provided on the flat layer 17; an organic light emitting device 2 It also includes a pixel defining layer 18, a light emitting function layer 19, and a cathode 20 arranged on the pixel defining layer 18 and the light emitting function layer 19 in sequence on the anode 4; the thin film encapsulation layer 3 also covers the cathode 20 and the pixel defining layer 18 on.
  • the light-emitting functional layer 19 includes a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and an electron injection layer, which are sequentially arranged on the anode 4; the light-emitting layer and the cathode 20 are both made by an evaporation process , The thickness of the cathode 20 is within 30 nanometers.
  • the materials of the flat layer 17 and the pixel definition layer 18 are both organic materials.
  • the barrier layer 13 and the pixel definition layer 18 are made of the same material and formed in the same manufacturing process.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种显示面板（1），包括有机发光器件（2）和设置在所述有机发光器件（2）上的薄膜封装层（3）；所述有机发光器件（2）包括阳极（4），所述显示面板（1）包括边框区（5），位于所述边框区（5）的阳极（4）的表面形成有粗糙结构（6），且所述薄膜封装层（3）覆盖在至少部分所述粗糙结构（6）上。

Description

显示面板 技术领域
本申请涉及显示面板技术领域，尤其涉及一种显示面板。
 背景技术
这里的陈述仅提供与本申请有关的背景信息，而不必然地构成现有技术。
有机发光二极管（Organic Light-Emitting Diode，OLED）因其在固态照明和平板显示的方向拥有巨大的发展潜力而得到了学术界和产业界的极大关注。OLED面板可以做的更轻更薄，而越来越多的手机厂商选择了OLED面板作为显示屏。窄边框(Narrow Border)成为近年来手机屏幕比较热门的设计。
OLED面板需要在高温高湿环境(如85℃/85%湿度)进行存储或点亮状态放置一段时间，用于可靠性检测。常规的OLED面板包括阵列层、平坦层、OLED器件和柔性封装层，OLED器件的阳极包括底ITO（Indium-Tin Oxide，氧化铟锡）层、银金属层和顶ITO层。OLED 面板在高温高湿条件下放置一段时间后，发现面板边框的阳极容易出现剥离现象，即顶ITO层/银金属层/底ITO层的两个界面出现膜层分裂，或柔性封装层与顶ITO层之间出现膜层分裂，严重影响显示面板的使用性能和使用寿命。
 技术问题
本申请提供一种显示面板，通过在位于显示面板边框区的阳极的各膜层表面设置粗糙结构，且薄膜封装层覆盖在至少部分粗糙结构上，解决了显示面板边框区的阳极与薄膜封装层之间、阳极的各膜层之间易出现膜层分离而严重影响显示面板的使用性能和使用寿命的问题。
 技术解决方案
为解决上述问题，本申请提供的技术方案如下：
本申请提供一种显示面板，包括有机发光器件和设置在所述有机发光器件上的薄膜封装层；所述有机发光器件包括阳极，所述显示面板包括边框区，位于所述边框区的阳极的表面形成有粗糙结构，且所述薄膜封装层覆盖在至少部分所述粗糙结构上。
在本申请实施例提供的显示面板中，所述阳极包括第一导电薄膜、金属层和第二导电薄膜，所述金属层覆盖在所述第二导电薄膜上，所述第一导电薄膜覆盖在所述金属层上；位于所述边框区的第一导电薄膜的表面形成有所述粗糙结构，且所述薄膜封装层覆盖在至少部分所述粗糙结构上。
在本申请实施例提供的显示面板中，位于所述边框区的金属层和第二导电薄膜的表面形成有所述粗糙结构。
在本申请实施例提供的显示面板中，所述薄膜封装层包括依次设置在所述有机发光器件上的第一无机层、有机层和第二无机层，所述第一无机层覆盖在至少部分所述粗糙结构上。
在本申请实施例提供的显示面板中，所述显示面板还包括多个间隔设置在所述粗糙结构上的阻挡层，所述第一无机层还覆盖在多个所述阻挡层上。
在本申请实施例提供的显示面板中，所述粗糙结构包括多个凸起，且位于所述第一导电薄膜上的多个凸起、位于所述金属层上的多个凸起和位于第二导电薄膜上的多个凸起对应排布或者交错排布。
在本申请实施例提供的显示面板中，所述粗糙结构包括多个凹槽，且位于所述第一导电薄膜上的多个凹槽、位于所述金属层上的多个凹槽和位于第二导电薄膜上的多个凹槽对应排布或者交错排布。
在本申请实施例提供的显示面板中，所述粗糙结构包括多个凸起或者多个凹槽。
在本申请实施例提供的显示面板中，所述凸起包括弧形凸起或者方形凸起；所述凹槽包括弧形凹槽或者方形凹槽。
在本申请实施例提供的显示面板中，所述多个凸起或者所述多个凹槽呈阵列排布。
在本申请实施例提供的显示面板中，所述粗糙结构通过曝光显影以及刻蚀工艺形成。
在本申请实施例提供的显示面板中，所述显示面板还包括薄膜晶体管阵列基板和设置在所述薄膜晶体管阵列基板上的平坦层，所述阳极设置在所述平坦层上；
所述有机发光器件还包括依次设置在所述阳极上的像素定义层、发光功能层，以及设置在所述像素定义层和发光功能层上的阴极；所述薄膜封装层还覆盖在所述阴极和所述像素定义层上。
在本申请实施例提供的显示面板中，所述第一导电薄膜和所述第二导电薄膜的材料包括氧化铟锡，所述金属层的材料包括金属银。
在本申请实施例提供的显示面板中，所述第一无机层和所述第二无机层的材料包括三氧化二铝、二氧化钛、氮化硅、碳氮化硅、二氧化硅或二氧化锆。
在本申请实施例提供的显示面板中，所述有机层的材料包括六甲基二硅醚、丙烯酸酯类、聚丙烯酸酯类、聚碳酸脂类或聚苯乙烯。
本申请还提供一种显示面板，包括有机发光器件和设置在所述有机发光器件上的薄膜封装层；所述有机发光器件包括阳极，所述阳极包括第一导电薄膜、金属层和第二导电薄膜，所述金属层覆盖在所述第二导电薄膜上，所述第一导电薄膜覆盖在所述金属层上；
所述显示面板包括边框区，位于所述边框区的第一导电薄膜、金属层和第二导电薄膜的表面形成有粗糙结构，且所述薄膜封装层覆盖在至少部分所述第一导电薄膜的粗糙结构上。
 有益效果
本申请的有益效果为：位于显示面板的边框区的阳极的表面形成有粗糙结构，且薄膜封装层覆盖在至少部分粗糙结构上，有效的增大了阳极与薄膜封装层之间的接触面积，增强了二者接触界面的粘附力，大大降低了阳极与薄膜封装层之间发生膜层分裂的概率，避免外界的水氧从阳极与薄膜封装层的接触界面处入侵到显示面板内部损坏有机发光器件，提高了显示面板的使用性能，延长了显示面板的使用寿命；位于显示面板的边框区的阳极的第一导电薄膜、金属层和第二导电薄膜的表面都形成有粗糙结构，使得薄膜封装层与第一导电薄膜之间的接触面积增大、第一导电薄膜与金属层之间的接触面积增大、金属层与第二导电薄膜之间的接触面积增大，增强了薄膜封装层、第一导电薄膜、金属层以及第二导电薄膜中任意相邻两层之间的粘附力，大大降低了薄膜封装层与第一导电薄膜之间、第一导电薄膜与金属层之间以及金属层与第二导电薄膜之间发生膜层分裂的概率，既可以避免外界的水氧入侵到显示面板内部，也可以避免阳极各膜层之间分裂导致阳极结构损坏，从而保证了显示面板内部信号的正常传输，提高了显示面板的使用性能，延长了显示面板的使用寿命。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的一种显示面板的局部结构示意框图；
图2为本申请实施例提供的位于边框区的阳极和第一无机层的局部结构示意图；
图3为本申请实施例提供的另一位于边框区的阳极和第一无机层的局部结构示意图；
图4为本申请实施例提供的另一位于边框区的阳极和第一无机层的局部结构示意图；
图5为本申请实施例提供的另一位于边框区的阳极和第一无机层的局部结构示意图；
图6为本申请实施例提供的另一位于边框区的阳极和第一无机层的局部结构示意图。
 本发明的实施方式
这里所公开的具体结构和功能细节仅仅是代表性的，并且是用来描述本申请的示例性实施例的目的。但是本申请可以通过许多替换形式来具体实现，并且不应当被解释成仅仅受限于这里所阐述的实施例。
在本申请的描述中，需要理解的是，术语“中心”、“横向”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。此外，术语“第一”、“第二”仅用来描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，除非另有说明，“多个”的含义是两个或两个以上。另外，术语“包括”及其任何变形，意图在于覆盖不排他的包含。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本申请中的具体含义。
这里所使用的术语仅仅是为了描述具体实施例而不意图限制示例性实施例。除非上下文明确地另有所指，否则这里所使用的单数形式“一个”、“一项”还意图包括复数。还应当理解的是，这里所使用的术语“包括”和/或“包含”规定所陈述的特征、整数、步骤、操作、单元和/或组件的存在，而不排除存在或添加一个或更多其他特征、整数、步骤、操作、单元、组件和/或其组合。
下面结合附图和实施例对本申请作进一步说明。
如图1所示，本申请实施例提供了一种显示面板1，包括有机发光器件2和设置在有机发光器件2上的薄膜封装层3；有机发光器件2包括阳极4，显示面板1包括边框区5，位于边框区5的阳极4的表面形成有粗糙结构6，且薄膜封装层3覆盖在至少部分粗糙结构6上。
具体的，显示面板1还包括显示区，边框区5围绕显示区设置，有机发光器件2对应显示区设置，薄膜封装层3的作用是保护有机发光器件2，一方面避免有机发光器件2受外力作用造成结构破坏，另一方面，防止外界的水氧从显示面板1的边框区5的侧面进入显示面板1的显示区影响有机发光器件2中的有机发光材料的性能。
本实施例中，位于显示面板1的边框区5的阳极4的表面形成有粗糙结构6，且薄膜封装层3覆盖在至少部分粗糙结构6上，有效的增大了阳极4与薄膜封装层3之间的接触面积，增强了二者接触界面的粘附力，大大降低了阳极4与薄膜封装层3之间发生膜层分裂的概率，避免外界的水氧从阳极4与薄膜封装层3的接触界面处入侵到显示面板1内部损坏有机发光器件2，提高了显示面板1的使用性能，延长了显示面板1的使用寿命。
如图1和2所示，本申请实施例还提供了一种显示面板1，与上述实施例不同的在于，阳极4包括第一导电薄膜7、金属层8和第二导电薄膜9，金属层8覆盖在第二导电薄膜9上，第一导电薄膜7覆盖在金属层8上；位于边框区5的第一导电薄膜7的表面形成有粗糙结构6，且薄膜封装层3覆盖在至少部分粗糙结构6上。
本实施例中，第一导电薄膜7和第二导电薄膜9的材料包括氧化铟锡，金属层8的材料包括金属银，当然，第一导电薄膜7、第二导电薄膜9和金属层8的材料不限于此。位于显示面板1边框区5的第一导电薄膜7的表面形成有粗糙结构6，且薄膜封装层3覆盖在至少部分粗糙结构6上，有效的增大了阳极4的第一导电薄膜7与薄膜封装层3之间的接触面积，增强了二者接触界面的粘附力，大大降低了阳极4与薄膜封装层3之间发生膜层分裂的概率，避免外界的水氧从第一导电薄膜7与薄膜封装层3的接触界面处入侵到显示面板1内部损坏有机发光器件2，提高了显示面板1的使用性能，延长了显示面板1的使用寿命。
在一实施例中，位于边框区5的金属层8和第二导电薄膜9的表面也形成有粗糙结构6。本实施例中，位于边框区5的阳极4的金属层8和第二导电薄膜9的表面也都形成有粗糙结构6，使得第一导电薄膜7与金属层8、金属层8与第二导电薄膜9之间的接触面积增大，增强了第一导电薄膜7与金属层8以及金属层8与第二导电薄膜9之间的粘附力，大大降低了第一导电薄膜7与金属层8之间以及金属层8与第二导电薄膜9之间发生膜层分裂的概率，既可以避免外界的水氧从阳极4中各膜层的接触界面处入侵到显示面板1内部，也可以避免阳极4的各膜层分裂而导致阳极4的结构损坏，保证了显示面板1内部信号的正常传输，提高了显示面板1的性能，延长了显示面板1的使用寿命。
在一实施例中，薄膜封装层3包括依次设置在有机发光器件2上的第一无机层10、有机层11和第二无机层12，第一无机层10覆盖在至少部分粗糙结构6上。
具体的，第一无机层10和第二无机层12可以通过化学气相沉积、脉冲激光沉积或溅射沉积工艺制得，第一无机层10和第二无机层12的材料包括但不限于三氧化二铝、二氧化钛、氮化硅、碳氮化硅、二氧化硅、二氧化锆等用于增加阻隔水氧功能的无机功能材料，第一无机层10和第二无机层12的厚度在0.01微米至1微米；有机层11可以采用喷墨打印技术或沉积工艺制得，有机层11的材料包括但不限于六甲基二硅醚、丙烯酸酯类、聚丙烯酸酯类、聚碳酸脂类、聚苯乙烯等材料，有机层11起到缓冲作用，可以保护有机发光器件2。
本实施例中，薄膜封装层3的第一无机层10覆盖在至少部分粗糙结构6上，有效的增大了阳极4与第一无机层10之间的接触面积，增强了二者接触界面的粘附力，大大降低了阳极4与第一无机层10之间发生膜层分裂的概率；由于第一无机层10的作用是阻挡显示面板1外界的水氧入侵有机发光器件2，第一无机层10与阳极4之间粘附力增强可以进一步防止水氧入侵，提高了显示面板1的使用性能，延长了显示面板1的使用寿命。
在一实施例中，显示面板1还包括多个间隔设置在粗糙结构6上的阻挡层13，第一无机层10还覆盖在多个阻挡层13上。
具体的，多个阻挡层13围绕有机发光器件2设置，用于防止外界的水氧入侵到显示面板1的内部影响显示面板1的性能；且薄膜封装层3的有机层11也被多个阻挡层13围绕，第一无机层10覆盖在多个阻挡层13上，第二无机层12覆盖在有机层11和第一无机层10上，避免了有机层11溢出第一无机层10和第二无机层12的边缘，保证了薄膜封装层3的封装效果。
本实施例中，阻挡层13设在在粗糙结构6上，有效的增大了阻挡层13与阳极4的接触面积，增强了二者接触界面的粘附力，大大降低了阳极4与阻挡层13之间发生膜层分裂的概率，加强了阻挡层13阻隔外界水氧入侵的作用。
在一实施例中，如图2至图4所示，粗糙结构6包括多个凸起14，且位于第一导电薄膜7上的多个凸起14、位于金属层8上的多个凸起14和位于第二导电薄膜9上的多个凸起14对应排布或者交错排布；或者，如图5和图6所示，粗糙结构6包括多个凹槽15，且位于第一导电薄膜7上的多个凹槽15、位于金属层8上的多个凹槽15和位于第二导电薄膜9上的多个凹槽15对应排布或者交错排布。
本实施例中，阳极4（包括第一导电薄膜7、金属层8和第二导电薄膜9）的表面可以由多个凸起14形成粗糙结构6，也可以由多个凹槽15形成粗糙结构6。具体的，阳极4的各层之间的凸起14或者凹槽15即可以对应排布，也可以交错排布，此处不做限制。凸起14或凹槽15都能增加相邻两膜层之间的接触面积，增大接触面的粘附力，避免相邻两膜层分裂。
在一实施例中，如图2至图4所示，凸起14包括弧形凸起14或者方形凸起14；如图5和图6所示，凹槽15包括弧形凹槽15或者方形凹槽15。本实施例中，凸起14和凹槽15的具体形状不限于本实施例所列举的形状。
在一实施例中，多个凸起14或者多个凹槽15呈阵列排布。本实施例中，多个凸起14呈阵列排布，或者多个凹槽15成阵列排布，在增加相邻膜层的接触面积的基础上降低了粗糙结构6的制作工艺难度。具体的，粗糙结构6可以通过曝光显影以及刻蚀工艺形成。
在一实施例中，显示面板1还包括薄膜晶体管阵列基板16和设置在薄膜晶体管（Thin Film Transistor，TFT）阵列基板16上的平坦层17，阳极4设置在平坦层17上；有机发光器件2还包括依次设置在阳极4上的像素定义层18、发光功能层19，以及设置在像素定义层18和发光功能层19上的阴极20；薄膜封装层3还覆盖在阴极20和像素定义层18上。
本实施例中，发光功能层19包括依次设置在阳极4上的空穴注入层、空穴传输层、发光层、电子传输层和电子注入层；发光层和阴极20都采用蒸镀工艺制得，阴极20的厚度在30纳米以内。平坦层17与像素定义层18的材料都为有机材料。阻挡层13与像素定义层18的材料相同，且在同一制程中形成。
综上所述，虽然本申请已以优选实施例揭露如上，但上述优选实施例并非用以限制本申请，本领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为准。

Claims (16)

  1. 一种显示面板，包括有机发光器件和设置在所述有机发光器件上的薄膜封装层；所述有机发光器件包括阳极，所述显示面板包括边框区，位于所述边框区的阳极的表面形成有粗糙结构，且所述薄膜封装层覆盖在至少部分所述粗糙结构上。
  2. 如权利要求1所述的显示面板，其中，所述阳极包括第一导电薄膜、金属层和第二导电薄膜，所述金属层覆盖在所述第二导电薄膜上，所述第一导电薄膜覆盖在所述金属层上；位于所述边框区的第一导电薄膜的表面形成有所述粗糙结构，且所述薄膜封装层覆盖在至少部分所述粗糙结构上。
  3. 如权利要求2所述的显示面板，其中，位于所述边框区的金属层和第二导电薄膜的表面形成有所述粗糙结构。
  4. 如权利要求1所述的显示面板，其中，所述薄膜封装层包括依次设置在所述有机发光器件上的第一无机层、有机层和第二无机层，所述第一无机层覆盖在至少部分所述粗糙结构上。
  5. 如权利要求4所述的显示面板，其中，所述显示面板还包括多个间隔设置在所述粗糙结构上的阻挡层，所述第一无机层还覆盖在多个所述阻挡层上。
  6. 如权利要求3所述的显示面板，其中，所述粗糙结构包括多个凸起，且位于所述第一导电薄膜上的多个凸起、位于所述金属层上的多个凸起和位于第二导电薄膜上的多个凸起对应排布或者交错排布。
  7. 如权利要求3所述的显示面板，其中，所述粗糙结构包括多个凹槽，且位于所述第一导电薄膜上的多个凹槽、位于所述金属层上的多个凹槽和位于第二导电薄膜上的多个凹槽对应排布或者交错排布。
  8. 如权利要求1所述的显示面板，其中，所述粗糙结构包括多个凸起或者多个凹槽。
  9. 如权利要求8所述的显示面板，其中，所述凸起包括弧形凸起或者方形凸起；所述凹槽包括弧形凹槽或者方形凹槽。
  10. 如权利要求8所述的显示面板，其中，所述多个凸起或者所述多个凹槽呈阵列排布。
  11. 如权利要求1所述的显示面板，其中，所述粗糙结构通过曝光显影以及刻蚀工艺形成。
  12. 如权利要求1所述的显示面板，其中，所述显示面板还包括薄膜晶体管阵列基板和设置在所述薄膜晶体管阵列基板上的平坦层，所述阳极设置在所述平坦层上；
    所述有机发光器件还包括依次设置在所述阳极上的像素定义层、发光功能层，以及设置在所述像素定义层和发光功能层上的阴极；所述薄膜封装层还覆盖在所述阴极和所述像素定义层上。
  13. 如权利要求2所述的显示面板，其中，所述第一导电薄膜和所述第二导电薄膜的材料包括氧化铟锡，所述金属层的材料包括金属银。
  14. 如权利要求4所述的显示面板，其中，所述第一无机层和所述第二无机层的材料包括三氧化二铝、二氧化钛、氮化硅、碳氮化硅、二氧化硅或二氧化锆。
  15. 如权利要求4所述的显示面板，其中，所述有机层的材料包括六甲基二硅醚、丙烯酸酯类、聚丙烯酸酯类、聚碳酸脂类或聚苯乙烯。
  16. 一种显示面板，包括有机发光器件和设置在所述有机发光器件上的薄膜封装层；所述有机发光器件包括阳极，所述阳极包括第一导电薄膜、金属层和第二导电薄膜，所述金属层覆盖在所述第二导电薄膜上，所述第一导电薄膜覆盖在所述金属层上；
    所述显示面板包括边框区，位于所述边框区的第一导电薄膜、金属层和第二导电薄膜的表面形成有粗糙结构，且所述薄膜封装层覆盖在至少部分所述第一导电薄膜的粗糙结构上。
PCT/CN2019/105468 2019-06-18 2019-09-11 显示面板 Ceased WO2020252947A1 (zh)

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CN110993828A (zh) 2020-01-03 2020-04-10 武汉华星光电半导体显示技术有限公司 Oled显示面板
CN111769080B (zh) * 2020-06-24 2022-07-12 武汉华星光电半导体显示技术有限公司 显示面板
CN114695781A (zh) * 2020-12-31 2022-07-01 Tcl科技集团股份有限公司 显示基板及其制备方法、电致发光器件及其制备方法
CN112885878B (zh) * 2021-01-19 2024-10-15 京东方科技集团股份有限公司 显示基板及其制作方法、显示装置
CN113380961B (zh) * 2021-06-03 2022-09-20 昆山国显光电有限公司 显示面板及显示装置
CN114171570A (zh) * 2021-12-07 2022-03-11 Tcl华星光电技术有限公司 阵列基板及阵列基板的制作方法
CN114582938B (zh) * 2022-02-18 2026-01-02 深圳市华星光电半导体显示技术有限公司 一种oled显示面板及oled显示面板的制备方法

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