WO2020252864A1 - 掩膜板、掩膜装置及其应用方法 - Google Patents

掩膜板、掩膜装置及其应用方法 Download PDF

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Publication number
WO2020252864A1
WO2020252864A1 PCT/CN2019/099638 CN2019099638W WO2020252864A1 WO 2020252864 A1 WO2020252864 A1 WO 2020252864A1 CN 2019099638 W CN2019099638 W CN 2019099638W WO 2020252864 A1 WO2020252864 A1 WO 2020252864A1
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WIPO (PCT)
Prior art keywords
substrate
mask
area
film layer
opening area
Prior art date
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Ceased
Application number
PCT/CN2019/099638
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English (en)
French (fr)
Inventor
肖世艳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Publication of WO2020252864A1 publication Critical patent/WO2020252864A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Definitions

  • the invention relates to the field of display, in particular to a mask plate, a mask device and an application method thereof.
  • OLED Organic electroluminescent diode Light-Emitting Diode
  • the display panel has evolved from a special-shaped screen to a full-scale screen today. "Full screen” has gradually become the mainstream of smart terminals. Smart terminals have a display panel.
  • the display panel includes an opening area for placing the front camera, amplifier components, light metering components, and light-filling components on the display panel. On the component.
  • OLED manufacturing the biggest difference from general liquid crystal display panels is that a vacuum evaporation process is required. During the evaporation process, the mask is accurately attached to the substrate, and then the evaporation material is vacuum-evaporated onto the substrate through the mask to form an organic material layer. Evaporation materials include red (R), green (G), and blue (B) organic light-emitting materials. OLED display panels emit red, green and blue primary colors through self-luminous organic materials to form different colors.
  • the mask includes a shading area and an opening area.
  • the position of the substrate and the opening area will be deposited with organic material, and the position of the substrate and the light-shielding area will not be deposited with the organic material, thereby forming a unique pattern.
  • the substrate is masked through the mask, and the substrate is evaporated by the evaporation source, and the sub-pixels on the substrate corresponding to the opening area of the mask are evaporated.
  • the use of mask evaporation method can easily produce shadow effects (shadow effect), that is, when the first seed pixel is evaporated, the organic material may diffuse beyond the specified area of the first seed pixel, that is, diffuse to the second seed pixel area or the third seed pixel area to cause color mixing or color shift
  • shadow effect affects the luminous display effect of OLED.
  • the mask plate also includes at least one separation line for separating the shading area from the opening area, but in the prior art, the direction and angle of the separation line are not clearly specified. Therefore, after the film is formed, the position of the separation line of the mask corresponding to the substrate is prone to display abnormalities.
  • the display panel generally adopts LCD technology to realize the camera under the screen (Camera Under Panel, CUP), and no one has yet adopted OLED technology to achieve CUP.
  • the present invention provides a mask, a mask device and an application method thereof, to solve the problem that the mask in the prior art causes the organic material to easily produce color mixing or color shift in the peripheral area of the opening area, and on the substrate The technical problem of uneven surface film.
  • the present invention provides a mask for film formation on a substrate.
  • the substrate includes a predetermined opening area.
  • the mask is divided into two parts: a light shielding area and an opening area by a dividing line.
  • the mask includes a shielding area protruding from one side of the light shielding area, the side is connected to the opening area at the separation line, when the mask and the substrate are opposed When the position is set, the projection of the shielding area on the surface of the substrate is located in the opening area.
  • the shielding area is semicircular, the opening area is circular, and the radius of the shielding area is the same as the radius of the opening area.
  • the substrate includes a substrate separation line, which partially overlaps with the projection of the separation line on the surface of the substrate.
  • the mask is rectangular or rounded rectangle; and/or, both ends of the separation line are respectively provided on two adjacent sides of the mask; the separation line and the Two adjacent sides of the mask plate respectively form an included angle, and the angle of the included angle is 40°-50°.
  • the present invention also provides a mask device, including any one of the aforementioned mask plates, which are respectively a first mask plate and a second mask plate; wherein, the first mask plate The mask is divided into a first light-shielding area and a first opening area by a first separation line, and the area of the first light-shielding area is larger than that of the first opening area; the second mask is divided by a second separation line Are the second shading area and the second opening area, the area of the second shading area is smaller than the second opening area; the size of the first mask is the same as the size of the second mask; the first partition The projection of the line on the surface of the substrate partially overlaps the projection of the second dividing line on the surface of the substrate.
  • the first dividing line includes a first straight portion and a first arc portion; the second dividing line includes a second straight portion and a second arc portion; the first straight portion is in the The projection of the surface of the substrate coincides with the projection of the second linear portion on the surface of the substrate; the projection of the first arc portion on the surface of the substrate is the same as the projection of the second arc portion on the surface of the substrate.
  • the projection forms a circle, which coincides with the marginal line of the opening area.
  • the present invention also provides an application method of a mask device, which includes the following steps: a substrate setting step, placing a substrate in an evaporation chamber, the substrate including a predetermined opening area;
  • the alignment step is to perform a first alignment treatment on the substrate and the first mask;
  • the first deposition step is to deposit organic materials on one surface of the substrate to form a first film layer, the first film layer It has a first notch;
  • a second alignment process which performs a second alignment process on the substrate and a second mask;
  • a second deposition step which deposits an organic material on one surface of the substrate to form a second film Layer connected to the first film layer;
  • the second film layer has a second gap; wherein the first gap and the second gap form a through hole on the surface of the substrate, and the opening Relative setting of zone.
  • the substrate in the first deposition step, in a vacuum evaporation environment, an organic material is deposited on the substrate, and the first film layer is formed on the surface of the substrate; in the second deposition step, In a vacuum evaporation environment, an organic material is deposited on the substrate, and the second film layer is formed on the surface of the substrate.
  • the substrate includes a substrate separation line; the connection between the first film layer and the second film layer is opposite to the substrate separation line.
  • the first film layer includes more than two first pixels
  • the second film layer includes more than two second pixels; the first pixels and the second pixels are arranged in a matrix; A pixel and the second pixel are respectively located on two sides of the substrate separation line.
  • the technical effect of the present invention is to provide a mask, a mask device and an application method thereof.
  • Two different masks are used to sequentially perform secondary deposition on the surface of the same substrate, so that the upper surface of the substrate except for the opening area Each position is coated into a film, and there is no overlap of the film, which can improve the uniformity of the film formation of organic materials in the peripheral area of the opening area, and prevent multiple sub-pixels of different colors at the same position on the substrate surface Therefore, the phenomenon of color mixing or color shift can be prevented, and the quality of the display panel can be improved.
  • FIG. 1 is a schematic diagram of the structure of the first mask
  • FIG. 2 is a schematic diagram of the structure of the second mask
  • Figure 3 is a schematic diagram of the structure of the substrate
  • Figure 4 is a flow chart of the application method of the mask
  • FIG. 5 is a schematic diagram of the structure of the first mask plate forming a film on the substrate
  • FIG. 6 is a schematic diagram of the structure of forming a film on the substrate by the second mask
  • FIG. 7 is a schematic diagram of the structure of pixels located on both sides of the substrate separation line.
  • this embodiment provides a mask device, including a first mask plate 100 and a second mask plate 200.
  • the two types of mask plates are generally rectangular or rounded rectangle, but are not limited to Other shapes.
  • the mask device is used to form a film on the substrate 300 to form a desired pattern.
  • the size of the first mask plate 100 is the same as the size of the second mask plate 200.
  • the first mask 100 is divided into a first light-shielding area 11 and a first opening area 12 by a first dividing line 10.
  • the area of the first light-shielding area 11 is larger than that of the first opening area 12.
  • Two ends of the first dividing line 10 are respectively arranged on two adjacent sides of the first mask plate 100, and the first dividing line 10 and the two adjacent sides of the first mask plate 100 respectively form an included angle, They are the first included angle 1 and the second included angle 2, and the first included angle 1 and the second included angle 2 are 40°-50°, preferably 45°.
  • the first dividing line 10 includes a first straight line portion 101 and a first arc line portion 102. The projection of the first dividing line 10 on the surface of the substrate partially overlaps the substrate dividing line, and the projection of the first linear portion 101 on the surface of the substrate partially overlaps the substrate dividing line.
  • the first mask 100 includes a first shielding area 111 protruding from one side of the first light shielding area 11, and the side is connected to the first opening area 12 at the first dividing line 10.
  • the projection of the first shielding area 111 on the surface of the substrate is located in the opening area.
  • the first shielding area 111 is semicircular, the opening area is circular, and the radius of the first shielding area 111 is the same as the radius of the opening area.
  • the second mask 200 is divided into a second light-shielding area 21 and a second opening area 22 by a second dividing line 20.
  • the area of the second light-shielding area 21 is smaller than that of the second opening area 22.
  • Two ends of the second separation line 20 are respectively provided on two adjacent sides of the second mask 200, and the second separation line 20 and the two adjacent sides of the second mask 200 respectively form an included angle, They are the third included angle 3 and the fourth included angle 4, respectively.
  • the third included angle 3 and the fourth included angle 4 are 40°-50°, preferably 45°.
  • the angle of the included angle is 40°-50°.
  • the second dividing line 20 includes a second straight line portion 201 and a second arc line portion 202. The projection of the second separation line 20 on the surface of the substrate partially overlaps the substrate separation line, and the projection of the second straight portion 201 on the surface of the substrate partially overlaps the substrate separation line.
  • the second mask 200 includes a second shielding area 211 protruding from one side of the second light shielding area 21, and the side is connected to the second opening area 22 at the second dividing line 20.
  • the projection of the second shielding area 211 on the surface of the substrate is located in the opening area.
  • the second shielding area 211 is semicircular, the opening area is circular, and the radius of the second shielding area 211 is the same as the radius of the opening area.
  • the substrate 300 includes a predetermined opening area 30 and a substrate separation line 31.
  • the substrate 300 is divided into a first area 301 and a second area 302 by the substrate separation line 31.
  • the substrate separation line 31 and the adjacent side of the substrate 300 respectively form an included angle, which is a fifth included angle 5 and a sixth included angle 6, wherein the fifth included angle 5 and the sixth included angle 6 are 40° ⁇ 50°, preferably 45°.
  • the projection of the first mask on the surface of the substrate is mostly overlapped with the projection of the second mask on the surface of the substrate, which can reduce the The shadow effect produced by the second mask on the same substrate makes the exposed position on the substrate more accurate.
  • the projection of the first dividing line on the surface of the substrate overlaps with the projection of the second dividing line on the surface of the substrate;
  • the projection of the first straight line on the surface of the substrate is the same as The projections of the second straight portion on the surface of the substrate coincide;
  • the angle of the first included angle is the same as the angle of the third included angle, and the angle of the third included angle is greater than that of the fourth included angle
  • the angle is the same;
  • the projection of the first arc on the surface of the substrate and the projection of the second arc on the surface of the substrate form a circle, which coincides with the marginal line of the opening area.
  • this embodiment also provides an application method of a mask device, which is the first mask plate and the second mask plate described above.
  • the application method of the mask device includes the following steps S11 to S15.
  • the user places a substrate in an evaporation chamber, and the substrate includes a predetermined opening area.
  • S12 In the first alignment step, the user performs a first alignment process on the substrate and the first mask, so that the substrate is masked by the first mask.
  • the first mask 100 is divided into two parts, a first light-shielding area and a first opening area by a first dividing line.
  • the first area corresponds to the first shading area
  • the second area corresponds to the first opening area.
  • the substrate separation line overlaps with the projection of the first separation line on the surface of the substrate, and the substrate separation line completely coincides with the projection of the first linear portion on the substrate surface.
  • the projection of a shielding area on the surface of the substrate is located in the opening area, the angle of the fifth included angle is the same as the angle of the first included angle, and the angle of the sixth included angle is the same as that of the second included angle.
  • the angle of the included angle is the same. Therefore, the precise alignment of the substrate and the first mask is beneficial to the uniformity of subsequent film formation on one side of the substrate.
  • S13 In the first deposition step, an organic material is deposited on one surface of the substrate to form a first film layer, the first film layer having a first notch.
  • the first film layer includes more than two first pixels, and the first pixels are arranged in a matrix.
  • the first area 301 is shielded by the first light-shielding area 11
  • the second area 302 is arranged opposite to the first opening area 12
  • the projection of the first shielding area 111 on the surface of the substrate 300 is located in the open area. ⁇ 30 ⁇ .
  • an organic material is deposited on the substrate 300.
  • the organic material is deposited from the upper right of the second area 302 to the right boundary of the substrate separation line, so that the second area 302 is deposited with organic material, and the first area 301 Without organic material deposited, a first film layer is formed on the surface of the substrate 300, the first film layer is provided with a first notch, and the position of the first notch corresponds to the first shielding area 111.
  • the second alignment process is to perform a second alignment process on the substrate and the second mask, so that the substrate is masked by the second mask.
  • the second mask is divided into two parts, a second shading area and a second opening area, by a second dividing line.
  • the first area corresponds to the second opening area
  • the second area corresponds to the second shading area.
  • the substrate separation line overlaps with the projection of the second separation line on the surface of the substrate, the substrate separation line completely coincides with the projection of the second linear portion on the substrate surface, and the second The projection of the shielding area on the surface of the substrate is located in the opening area, the angle of the fifth included angle is the same as the angle of the third included angle, and the angle of the sixth included angle is the same as that of the fourth included angle.
  • the angles of the corners are the same. Therefore, the precise alignment of the substrate and the second mask is beneficial to the uniformity of subsequent film formation on one side of the substrate.
  • an organic material is deposited on one surface of the substrate to form a second film layer, which is connected to the first film layer; the second film layer has a second gap; wherein, the first film layer
  • the notch and the second notch enclose a through hole on the surface of the substrate and are arranged opposite to the opening area.
  • the second film layer includes more than two second pixels, and the second pixels are arranged in a matrix.
  • the first area 301 corresponds to the second opening area 22
  • the second area 302 is shielded by the second light shielding area 21, and the projection of the second shielding area 211 on the surface of the substrate 300 is located in the opening Within district 30.
  • the organic material is sputtered on the substrate 300, and the organic material is deposited from the bottom left of the first region 301 to the left boundary of the substrate separation line 31, so that the first region 301 is deposited with organic material, and the second region 302 is not deposited with organic material.
  • a second film layer is formed on the surface of the substrate 300 and is connected to the first film layer.
  • first film layer and the second film layer are located on the same side of the substrate 300, the connection between the first film layer and the second film layer is disposed opposite to the substrate separation line 31, and the second film layer
  • the film layer is provided with a second notch, and the position of the second notch corresponds to the second shielding area 211.
  • This embodiment provides an application method of a mask device, which performs the above steps in sequence in the order of S11 to S15.
  • the order of use of the first mask and the second mask can be changed, and the present invention is not particularly limited.
  • Another embodiment of the present invention provides an application method of a mask device, which sequentially executes the above steps in the order of S11, S14, S15, S12, and S13, and its technical effect is consistent with this embodiment.
  • the first film layer and the second film layer are located on the same side surface of the substrate, and the first notch and the second notch enclose a through hole on the surface of the substrate, which is connected to the The opening areas are arranged relatively.
  • the first pixels are evenly arranged in the first area; in the second deposition step, the second pixels are evenly arranged in all The second area.
  • every position on the upper surface of the substrate except the opening area is coated into a film, and each position is only coated once, so that the pixel structure of the film layer on the entire substrate surface is uniformly distributed.
  • the first film layer and the second film layer mentioned above may be light-emitting film layers, which are provided with sub-pixels.
  • the two depositions are respectively formed on both sides of the separation line, and two films are not formed at a certain position on the substrate. Secondly, there will be no overlap of pixels, which can prevent color mixing or color shift after the substrate is formed, and improve the quality of the display panel.
  • the first film layer and the second film layer mentioned above can be non-luminescent film layers, including the electron transport layer, the cathode layer, and the flat layer.
  • the two depositions are respectively formed on both sides of the separation line, and will not
  • the film is formed twice at a certain position on the substrate, so that the entire film layer is evenly coated, preventing color mixing or color shift due to uneven film thickness, and improving the quality of the display panel.
  • the aperture area is used to place components such as cameras and is located in the non-display area.
  • the aperture area is set at the corner of the substrate.
  • the substrate separation line passes through the center of the opening area, which can improve the accuracy of the alignment of the substrate and the mask device (the first mask plate, the second mask plate), thereby preventing the substrate Color mixing or color shift occurs after the film is formed, which improves the quality of the display panel.
  • the first pixel 401 and the second pixel 402 are respectively located on both sides of the substrate separation line 31.
  • the first pixel 401 and the second pixel 402 both include red, green, and blue (R, G, B) sub-pixels arranged in a matrix.
  • the size of each sub-pixel is different, but it can also be the same.
  • the size of the sub-pixels in this embodiment is preferably different .
  • the pitch of every two adjacent sub-pixels is also different, and the pitch of two adjacent sub-pixels is 23um ⁇ 37um.
  • the distance between R sub-pixel and G sub-pixel is 23um ⁇ 25um; the distance between G sub-pixel and B sub-pixel is 26um ⁇ 29um; the distance between R sub-pixel and B sub-pixel is 30um ⁇ 37um; therefore every two adjacent The pitch of the sub-pixels varies.
  • the substrate separation line 31 is provided in the middle of the distance between two adjacent sub-pixels, or the substrate separation line 31 passes through a row of sub-pixels, and the substrate separation line 31 passes through the middle of each sub-pixel.
  • the substrate separation line 31 of the present embodiment is set in the middle of the gap between the widest two adjacent sub-pixels, which can reduce color mixing or color shift.
  • the substrate separation line 31 and the adjacent sides of the substrate 300 respectively form an included angle of 40°-50°, the substrate separation line 31 is set in the middle of the widest two adjacent sub-pixels.
  • adjacent sub-pixels of different colors on both sides of the substrate separation line 31 may also constitute a pixel unit, the structure of which is the same as or similar to the structure of the pixel unit in the first area and the second area, so that the substrate
  • the display effect of the area near the dividing line 30 is the same as the first area and the second area, and the overall display effect of the entire panel is the same.
  • This embodiment provides a mask, a mask device and an application method thereof.
  • Two different masks are used to sequentially perform secondary deposition on the surface of the same substrate, so that every part of the upper surface of the substrate except the holed area The positions are coated to form a film, and there is no overlap of the film, which can improve the uniformity of the film formation of the organic material in the peripheral area of the opening area, and prevent the presence of multiple sub-pixels of different colors at the same position on the substrate surface, thereby It can prevent the phenomenon of color mixing or color shift, and improve the quality of the display panel.
  • the above embodiments provide a mask, a mask device and an application method thereof, which can be used to implement OLED CUP (Camera Under Panel) technology, which can be used in mobile phones, tablet computers, televisions, monitors, laptops, and digital photo frames Or any product or component with display function such as navigator.
  • OLED CUP Organic LED Under Panel

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  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
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  • Mechanical Engineering (AREA)
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Abstract

一种掩膜板(100，200)，掩膜板(100，200)用于基板（300）成膜，基板（300）包括一预设的开孔区（30），掩膜板(100，200)被一分隔线（10，20）分为遮光区（11，21）和开口区（12，22）两部分；掩膜板(100，200)包括一遮挡区（111，211）；当掩膜板(100，200)与基板（300）被对位设置时，遮挡区（111，211）在基板（300）表面的投影位于开孔区（30）内。还公开了一种掩膜装置和一种掩膜装置的应用方法。

Description

掩膜板、掩膜装置及其应用方法 技术领域
本发明涉及显示领域，尤其涉及一种掩膜板、掩膜装置及其应用方法。
 背景技术
随着智慧终端的迅速发展，对于显示面板的显示品质、耗能效率以及应用场合的要求越来越高。有机电致发光二极管（Organic Light-Emitting Diode， OLED）显示器因具有色彩鲜艳、对比度高、功耗低、延展性佳等诸多优点，成为了显示领域的开发重点。随着OLED显示器制作工艺的日趋成熟，应用领域也越来越广。
目前，显示面板从异形屏发展到如今的全面屏。“全面屏”逐渐成为智慧终端的主流，智慧终端具有显示面板，显示面板包括一开孔区，是用来放置前置摄像头、扩音元件、测光元件、补光元件等需要设置于显示面板上的元件。
OLED生产制造中，与一般液晶显示面板最大的不同的是，需要利用真空蒸镀工艺。蒸镀过程中会将掩膜板（Mask）与基板精确贴合，然后将蒸镀材料通过掩膜板真空蒸镀至基板上，形成有机材料层。蒸镀材料包括红（R）、绿（G）、蓝（B）三色的有机发光材料，OLED显示面板即是通过能自发光的有机材料发出红绿蓝三原色，组成不同色彩。
现有技术中，掩膜板包括遮光区与开口区。基板与开口区对应的位置会被沉积有机材料，基板与遮光区对应的位置不被沉积有机材料，进而形成特有的图案。在蒸镀的过程中，通过掩膜板对基板进行掩膜处理，并使用蒸镀源对基板进行蒸镀处理，掩膜板开口区对应的基板上的子像素被蒸镀。但采用掩膜板蒸镀的方法，容易产生阴影效应（shadow effect），也就是对第一种子像素蒸镀时，有机材料可能扩散到第一种子像素规定区域之外，即扩散至第二种子像素区域、或第三种子像素区域而造成混色或者色偏的现象，影响OLED的发光显示效果。当有机材料被扩散到其他区域时，容易导致某一位置被镀膜多次，进而导致该位置的膜层偏厚，影响膜层的均匀性。另外，掩膜板还包括至少一分隔线，用以分隔遮光区与开口区，但现有技术中，没有明确规定分隔线的方向、角度。因此，成膜后，掩膜板分隔线对应基板的位置，容易出现显示异常的现象。
现有技术中，显示面板一般采用LCD技术实现屏下摄像头（Camera Under Panel ,CUP），而尚未有人采用OLED技术实现CUP。
 技术问题
本发明提供一种掩膜板、掩膜装置及其应用方法，以解决现有技术中存在的掩膜板导致有机材料在开孔区周边区域容易产生混色或者色偏的现象，以及在基板上表面的膜层不均匀的技术问题。
 技术解决方案
为实现上述目的，本发明提供一种掩膜板，用于基板成膜，所述基板包括一预设的开孔区，所述掩膜板被一分隔线分为遮光区和开口区两部分；所述掩膜板包括一遮挡区，突出于所述遮光区的一侧边，该侧边在所述分隔线处连接至所述开口区，当所述掩膜板与所述基板被对位设置时，所述遮挡区在所述基板表面的投影位于所述开孔区内。
进一步地，所述遮挡区为半圆形，所述开孔区为圆形，所述遮挡区的半径与所述开孔区的半径相同。
进一步地，所述基板包括一基板分隔线，与所述分隔线在所述基板表面的投影部分地重合。
进一步地，所述掩膜板为矩形或圆角矩形；和/或，所述分隔线的两端分别设于所述掩膜板两条相邻的侧边上；所述分隔线与所述掩膜板两条相邻侧边分别形成一夹角，所述夹角的角度为40°~50°。
为实现上述目的，本发明还提供一种掩膜装置，包括前文所述的任一项所述的掩膜板，分别为第一掩膜板及第二掩膜板；其中，所述第一掩膜板被第一分隔线分为第一遮光区和第一开口区，所述第一遮光区面积大于所述第一开口区的面积；所述第二掩膜板被第二分隔线分为第二遮光区和第二开口区，所述第二遮光区面积小于所述第二开口区；所述第一掩膜板的尺寸与第二掩膜板的尺寸相同；所述第一分隔线在所述基板表面的投影，与所述第二分隔线在所述基板表面的投影部分地重合。
进一步地，所述第一分隔线包括第一直线部和第一弧线部；所述第二分隔线包括第二直线部和第二弧线部；所述第一直线部在所述基板表面的投影，与所述第二直线部在所述基板表面的投影重合；所述第一弧线部在所述基板表面的投影，与所述第二弧线部在所述基板表面的投影围成一圆形，与所述开孔区的边际线重合。
为实现上述目的，本发明还提供一种掩膜装置的应用方法，包括如下步骤：基板设置步骤，将一基板放置一蒸镀腔体内，所述基板包括一预设的开孔区；第一对位步骤，将所述基板与第一掩膜板进行第一对位处理；第一沉积步骤，在所述基板一侧表面沉积有机材料，形成一第一膜层，所述第一膜层具有第一缺口；第二对位处理，将所述基板与第二掩膜板进行第二对位处理；以及第二沉积步骤，在所述基板一侧表面沉积有机材料，形成一第二膜层，连接至所述第一膜层；所述第二膜层具有第二缺口；其中，所述第一缺口和所述第二缺口在所述基板表面围成一通孔，与所述开孔区相对设置。
进一步地，在所述第一沉积步骤中，在真空蒸镀的环境下，对所述基板沉积有机材料，在所述基板表面形成所述第一膜层；在所述第二沉积步骤中，在真空蒸镀的环境下，对所述基板沉积有机材料，在所述基板表面形成所述第二膜层。进一步地，所述基板包括一基板分隔线；所述第一膜层与所述第二膜层的连接处与所述基板分隔线相对设置。
进一步地，所述第一膜层包括两个以上第一像素，所述第二膜层包括两个以上第二像素；所述第一像素、所述第二像素被排列为矩阵；所述第一像素、所述第二像素分别位于所述基板分隔线的两侧。
 有益效果
本发明的技术效果在于，提供一种掩膜板、掩膜装置及其应用方法，使用两种不同的掩膜板对同一基板表面先后进行二次沉积处理，使得基板上表面除开孔区外的每处位置都被涂覆成膜，且不会产生附膜重叠的现象，可以提高有机材料在开孔区周边区域成膜的均匀性，防止基板表面的同一位置存在多个不同色的子像素，从而可以防止混色或者色偏的现象产生，提高显示面板的质量。
 附图说明
图1为所述第一掩膜板的结构示意图；
图2为所述第二掩膜板的结构示意图；
图3为所述基板的结构示意图；
图4为所述掩膜板的应用方法的流程图；
图5为所述第一掩膜板在所述基板成膜的结构示意图；
图6为所述第二掩膜板在所述基板成膜的结构示意图；
图7为像素位于所述基板分隔线两侧的结构示意图。
附图中部分标识如下：
100第一掩膜板；10第一分隔线；11第一遮光区；12第一开口区；
101第一直线部；102第一弧线部；111第一遮挡区；
200第二掩膜板；20第二分隔线；21第二遮光区；22第二开口区；
201第二直线部；202第二弧线部；211第二遮挡区；
300基板；30开孔区；31基板分隔线；
301第一区；302第二区；
401第一像素；402第二像素；
1第一夹角；2第二夹角；3第三夹角；4第四夹角；5第五夹角；6第六夹角。
 本发明的实施方式
以下参考说明书附图介绍本发明的优选实施例，用以举例证明本发明可以实施，这些实施例可以向本领域中的技术人员完整介绍本发明的技术内容，使得本发明的技术内容更加清楚和便于理解。然而本发明可以通过许多不同形式的实施例来得以体现，本发明的保护范围并非仅限于文中提到的实施例。
本发明的说明书和权利要求书以及上述附图中的术语“第一”、“第二”等（如果存在）是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。应当理解，这样描述的对象在适当情况下可以互换。此外，术语“包括”和“具有”以及他们的任何变形，意图在于覆盖不排他的包含。
如图1~3所示，本实施例提供一种掩膜装置，包括第一掩膜板100及第二掩膜板200，这两种掩膜板一般为矩形或圆角矩形，但不限于其他形状。该掩膜装置用于基板300成膜，形成所需的图案。其中，第一掩膜板100的尺寸与第二掩膜板200的尺寸相同。
如图1所示，第一掩膜板100被第一分隔线10分为第一遮光区11和第一开口区12两部分，第一遮光区11面积大于第一开口区12的面积。第一分隔线10的两端分别设于第一掩膜板100两条相邻的侧边上，第一分隔线10与第一掩膜板100两条相邻侧边分别形成一夹角，分别为第一夹角1、第二夹角2，第一夹角1、第二夹角2为40°~50°，优选为45°。第一分隔线10包括第一直线部101和第一弧线部102。第一分隔线10在所述基板表面的投影与所述基板分隔线部分地重合，第一直线部101在所述基板表面的投影与所述基板分隔线部分地重合。
第一掩膜板100包括一第一遮挡区111，突出于第一遮光区11的一侧边，该侧边在第一分隔线10处连接至第一开口区12。当第一掩膜板100与所述基板被对位设置时，第一遮挡区111在所述基板表面的投影位于所述开孔区内。第一遮挡区111为半圆形，所述开孔区为圆形，第一遮挡区111的半径与所述开孔区的半径相同。
如图2所示，第二掩膜板200被第二分隔线20分为第二遮光区21和第二开口区22两部分，第二遮光区21面积小于第二开口区22的面积。第二分隔线20的两端分别设于第二掩膜板200两条相邻的侧边上，第二分隔线20与第二掩膜板200两条相邻侧边分别形成一夹角，分别为第三夹角3、第四夹角4，第三夹角3、第四夹角4的为40°~50°，优选为45°。所述夹角的角度为40°~50°。第二分隔线20包括第二直线部201和第二弧线部202。第二分隔线20在所述基板表面的投影与所述基板分隔线部分地重合，第二直线部201在所述基板表面的投影与所述基板分隔线部分地重合。
第二掩膜板200包括一第二遮挡区211，突出于第二遮光区21的一侧边，该侧边在第二分隔线20处连接至第二开口区22。当第二掩膜板200与所述基板被对位设置时，第二遮挡区211在所述基板表面的投影位于所述开孔区内。第二遮挡区211为半圆形，所述开孔区为圆形，第二遮挡区211的半径与所述开孔区的半径相同。
如图3所示，基板300包括一预设的开孔区30及基板分隔线31，基板300被基板分隔线31分成第一区301及第二区302。其中，基板分隔线31与基板300相邻侧边分别形成一夹角，分别为第五夹角5、第六夹角6，其中，第五夹角5、第六夹角6为40°~50°，优选为45°。
本实施例中，所述第一掩膜板在所述基板表面的投影，与所述第二掩膜板在所述基板表面的投影大部分重合，可以减少所述第一掩膜板、所述第二掩膜板在同一基板上产生的遮影（shadow）效应，使得基板上被曝光的位置更加精确。具体地，所述第一分隔线在所述基板表面的投影，与所述第二分隔线在所述基板表面的投影部分重合；所述第一直线部在所述基板表面的投影，与所述第二直线部在所述基板表面的投影重合；所述第一夹角的角度与所述第三夹角的角度相同，所述第三夹角的角度与所述第四夹角的角度相同；所述第一弧线部在所述基板表面的投影，与所述第二弧线部在所述基板表面的投影围成一圆形，与所述开孔区的边际线重合。
如图4所示，本实施例还提供一种掩膜装置的应用方法，该掩膜装置为前文所述的第一掩膜板及第二掩膜板。所述掩膜装置的应用方法，包括如下步骤S11~S15。
S11基板设置步骤，用户将一基板放置一蒸镀腔体内，所述基板包括一预设的开孔区。
S12第一对位步骤，用户将所述基板与所述第一掩膜板进行第一对位处理，使得所述基板被所述第一掩膜板进行掩膜处理。
如图5所示，第一掩膜板100被第一分隔线分为第一遮光区和第一开口区两部分。所述第一区对应所述第一遮光区，所述第二区对应所述第一开口区。其中，所述基板分隔线与所述第一分隔线在所述基板表面的投影部分重合，所述基板分隔线与所述第一直线部在所述基板表面的投影完全重合，所述第一遮挡区在所述基板表面的投影位于所述开孔区内，所述第五夹角的角度与所述第一夹角的角度相同，所述第六夹角的角度与所述第二夹角的角度相同。因此，所述基板与所述第一掩膜板对位精准，有利于后续在基板一侧表面成膜的均匀性。
S13第一沉积步骤，在所述基板一侧表面沉积有机材料，形成一第一膜层，所述第一膜层具有第一缺口。所述第一膜层包括两个以上第一像素，所述第一像素呈矩阵排布。
如图5所示，在沉积的过程中，第一区301被第一遮光区11遮蔽，第二区302与第一开口区12相对设置，第一遮挡区111在基板300表面的投影位于开孔区30内。在真空蒸镀的环境下，对基板300沉积有机材料，有机材料从第二区302的右上方沉积至所述基板分隔线右侧边界，使得第二区302被沉积有机材料，第一区301未被沉积有机材料，在基板300表面形成第一膜层，所述第一膜层设有第一缺口，所述第一缺口的位置与第一遮挡区111对应。
S14第二对位处理，将所述基板与第二掩膜板进行第二对位处理，使得所述基板被所述第二掩膜进行掩膜处理。所述第二掩膜板被第二分隔线分为第二遮光区和第二开口区两部分。所述第一区对应所述第二开口区，所述第二区对应所述第二遮光区。其中，所述基板分隔线与所述第二分隔线在所述基板表面的投影部分重合，所述基板分隔线与所述第二直线部在所述基板表面的投影完全重合，所述第二遮挡区在所述基板表面的投影位于所述开孔区内，所述第五夹角的角度与所述第三夹角的角度相同，所述第六夹角的角度与所述第四夹角的角度相同。因此，所述基板与所述第二掩膜板对位精准，有利于后续在基板一侧表面成膜的均匀性。
S15第二沉积步骤，在所述基板一侧表面沉积有机材料，形成一第二膜层，连接至所述第一膜层；所述第二膜层具有第二缺口；其中，所述第一缺口和所述第二缺口在所述基板表面围成一通孔，与所述开孔区相对设置。所述第二膜层包括两个以上第二像素，所述第二像素呈矩阵排布。
如图6所示，在沉积的过程中，第一区301与第二开口区22对应，第二区302被第二遮光区21遮蔽，第二遮挡区211在基板300表面的投影位于开孔区30内。有机材料对基板300进行溅射处理，有机材料从第一区301的左下方沉积至基板分隔线31左侧边界，使得第一区301被沉积有机材料，第二区302未被沉积有机材料，在基板300表面形成第二膜层，连接至所述第一膜层。其中，所述第一膜层与所述第二膜层位于基板300的同一侧面，所述第一膜层与所述第二膜层的连接处与基板分隔线31相对设置，所述第二膜层设有第二缺口，所述第二缺口的位置与第二遮挡区211对应。
本实施例提供一种掩膜装置的应用方法，按照S11~S15的顺序，依次执行上述步骤。所述第一掩膜板及所述第二掩膜板的使用顺序可调换，本发明不作特别的限定。本发明的另一实施例提供一种掩膜装置的应用方法，按照S11、S14、S15、S12、S13的顺序，依次执行上述步骤，其技术效果与本实施例一致。
本实施例中，所述第一膜层与所述第二膜层位于所述基板的同一侧面，所述第一缺口和所述第二缺口在所述基板表面围成一通孔，与所述开孔区相对设置。
在所述第一次沉积步骤中，所述第一像素被均匀地排布于所述第一区内；在所述第二次沉积步骤中，所述第二像素被均匀地排布于所述第二区内。其中，两次沉积后，基板上表面除开孔区外的每处位置都被涂覆成膜，且每处位置都仅被附膜一次，使得整个基板表面膜层的像素结构分布均匀。
前文所述第一膜层与所述第二膜层可以为发光膜层，其内设有子像素，两次沉积分别在分隔线两侧成膜，不会在基板上某一位置成膜两次，不会出现像素叠加的情况，可以防止基板在成膜后出现混色或者色偏的现象，提高显示面板的质量。
前文所述第一膜层与所述第二膜层可以为非发光膜层，包括电子传输层、阴极层及平坦层等膜层，两次沉积分别在分隔线两侧成膜，不会在基板上某一位置成膜两次，使得整个膜层均匀涂布，防止因膜层厚度不均导致混色或者色偏，提高显示面板的质量。
本实施例中，所述开孔区是用以放置摄像头等元件，位于非显示区，本实施例将所述开孔区设于所述基板的角落处，当用户在显示面板操作时，可以提升用户的观感效果，提高用户体验。另外，所述基板分隔线穿过所述开孔区的中心处，可以提高所述基板与掩膜装置（第一掩膜板、第二掩膜板）对位的精确度，从而可以防止基板在成膜后出现混色或者色偏的现象，提高显示面板的质量。
如图7所示，第一像素401、第二像素402分别位于基板分隔线31的两侧。第一像素401、第二像素402皆包括排列成矩阵的红绿蓝（R、G、B）子像素，每个子像素的大小不同，但也可以相同，本实施例的子像素大小优选为不同。当每个子像素的大小不同时，每两个相邻的子像素的间距也不同，其中相邻的两个子像素的间距为23um~37um。例如，R子像素到G子像素的间距为23um~25um； G子像素到B子像素的间距为26um~29um；R子像素到B子像素的间距为30um~37um；因此每两个相邻的子像素的间距各不相同。在蒸镀的过程中，相邻的两个子像素极容易发生混色或者色偏的现象。本实施例中，基板分隔线31设于相邻的两个子像素的间距中间，或者，基板分隔线31穿过一排子像素，且该基板分隔线31穿过每个子像素的中部。优选地，本实施例基板分隔线31设于最宽的两个相邻子像素的间距中间，这样可以减少混色或色偏的现象。具体地，当基板分隔线31与基板300相邻侧边分别形成一夹角40°~50°时，基板分隔线31设于最宽的两个相邻子像素的间距中间。
进一步地，在基板分隔线31两侧的不同颜色的相邻子像素也可以构成像素单元，其结构与所述第一区、所述第二区的像素单元的结构相同或近似，从而使得基板分隔线30附近的区域的显示效果与所述第一区、所述第二区相同，整个面板整体显示效果一致。
本实施例提供一种掩膜板、掩膜装置及其应用方法，使用两种不同的掩膜板对同一基板表面先后进行二次沉积处理，使得基板上表面除被开孔区外的每处位置都被涂覆成膜，且不会产生附膜重叠的现象，可以提高有机材料在开孔区周边区域成膜的均匀性，防止基板表面的同一位置存在多个不同色的子像素，从而可以防止混色或者色偏的现象产生，提高显示面板的质量。
以上实施例提供一种掩膜板、掩膜装置及其应用方法，可用以实现OLED CUP（Camera Under Panel）技术，该技术可以用于手机、平板电脑、电视机、显示器、笔记本电脑、数码相框或导航仪等任何具有显示功能的产品或部件。
以上所述仅是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。

Claims (10)

  1. 一种掩膜板，用于基板成膜，其中，
    所述基板包括一预设的开孔区，
    所述掩膜板被一分隔线分为遮光区和开口区两部分；所述掩膜板包括一遮挡区，突出于所述遮光区的一侧边，该侧边在所述分隔线处连接至所述开口区，
    当所述掩膜板与所述基板被对位设置时，
    所述遮挡区在所述基板表面的投影位于所述开孔区内。
  2. 如权利要求1所述的掩膜板，其中，
    所述遮挡区为半圆形，所述开孔区为圆形，所述遮挡区的半径与所述开孔区的半径相同。
  3. 如权利要求1所述的掩膜板，其中，
    所述基板包括一基板分隔线，与所述分隔线在所述基板表面的投影部分地重合。
  4. 如权利要求1所述的掩膜板，其中，
    所述掩膜板为矩形或圆角矩形；和/或，
    所述分隔线的两端分别设于所述掩膜板两条相邻的侧边上；
    所述分隔线与所述掩膜板两条相邻侧边分别形成一夹角，所述夹角的角度为40°~50°。
  5. 一种掩膜装置，其包括
    两个如权利要求1所述的掩膜板，分别为第一掩膜板及第二掩膜板；
    其中，所述第一掩膜板被第一分隔线分为第一遮光区和第一开口区；
    所述第二掩膜板被第二分隔线分为第二遮光区和第二开口区；
    所述第一掩膜板的尺寸与第二掩膜板的尺寸相同；
    所述第一分隔线在所述基板表面的投影，与所述第二分隔线在所述基板表面的投影部分地重合。
  6. 如权利要求5所述的掩膜装置，其中，
    所述第一分隔线包括第一直线部和第一弧线部；
    所述第二分隔线包括第二直线部和第二弧线部；
    所述第一直线部在所述基板表面的投影，与所述第二直线部在所述基板表面的投影重合；
    所述第一弧线部在所述基板表面的投影，与所述第二弧线部在所述基板表面的投影围成一圆形，与所述开孔区的边际线重合。
  7. 一种掩膜装置的应用方法，其中，包括如下步骤：
    基板设置步骤，将一基板放置一蒸镀腔体内，所述基板包括一预设的开孔区；
    第一对位步骤，将所述基板与第一掩膜板进行第一对位处理；
    第一沉积步骤，在所述基板一侧表面沉积有机材料，形成一第一膜层，所述第一膜层具有第一缺口；
    第二对位处理，将所述基板与第二掩膜板进行第二对位处理；以及
    第二沉积步骤，在所述基板一侧表面沉积有机材料，形成一第二膜层，连接至所述第一膜层；所述第二膜层具有第二缺口；
    其中，所述第一缺口和所述第二缺口在所述基板表面围成一通孔，与所述开孔区相对设置。
  8. 如权利要求7所述的掩膜装置的应用方法，其中，
    在所述第一沉积步骤中，
    在真空蒸镀的环境下，对所述基板沉积有机材料，在所述基板表面形成所述第一膜层；
    在所述第二沉积步骤中，
    在真空蒸镀的环境下，对所述基板沉积有机材料，在所述基板表面形成所述第二膜层。
  9. 如权利要求7所述的掩膜装置的应用方法，其中，
    所述基板包括一基板分隔线；
    所述第一膜层与所述第二膜层的连接处与所述基板分隔线相对设置。
  10. 如权利要求9所述的掩膜装置的应用方法，其中，
    所述第一膜层包括两个以上第一像素；
    所述第二膜层包括两个以上第二像素；
    所述第一像素、所述第二像素被排列为矩阵；
    所述第一像素、所述第二像素分别位于所述基板分隔线的两侧。
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