WO2020248845A1 - 电路板组件及电子设备 - Google Patents

电路板组件及电子设备 Download PDF

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Publication number
WO2020248845A1
WO2020248845A1 PCT/CN2020/093400 CN2020093400W WO2020248845A1 WO 2020248845 A1 WO2020248845 A1 WO 2020248845A1 CN 2020093400 W CN2020093400 W CN 2020093400W WO 2020248845 A1 WO2020248845 A1 WO 2020248845A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
board assembly
electronic device
assembly
application
Prior art date
Application number
PCT/CN2020/093400
Other languages
English (en)
French (fr)
Inventor
徐庆山
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2020248845A1 publication Critical patent/WO2020248845A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly

Definitions

  • This application relates to the field of electronic technology, and in particular to a circuit board assembly and electronic equipment.
  • the printed circuit board is an important electronic component in electronic equipment. It is the support of the electronic components in the electronic equipment and the carrier of the electrical connection of the electronic components. As electronic equipment becomes more sophisticated, the weak printed circuit board will directly interfere with the working state of the electronic components on the printed circuit board, thereby making the entire electronic equipment unable to operate stably. Therefore, improving the printed circuit board becomes an urgent problem to be solved.
  • the application provides a circuit board assembly and electronic equipment.
  • the circuit board assembly is strong and firm. Circuit board components in electronic equipment are not easy to loosen.
  • the circuit board assembly provided by the present application includes a first circuit board, a connecting board, and a second circuit board.
  • the first circuit board, the connecting board and the second circuit board are stacked in sequence.
  • the connecting board is electrically connected to the first circuit board and the second circuit board.
  • the connecting plate includes a connecting body and a reinforcing part provided on the connecting body, and the reinforcing part is used to enhance the strength of the connecting plate.
  • the reinforcing portion increases the strength of the connecting board, the strength of the circuit board assembly formed by connecting the connecting board to the first circuit board and the second circuit board is improved, so that the circuit board assembly is stronger , Avoiding that the circuit board assembly is easy to loosen and cannot be used normally. Since the first circuit board, the connecting board, and the second circuit board are stacked in sequence, the electronic devices arranged on the first circuit board and the electronic devices arranged on the second circuit board are reduced Interference between electromagnetic wave signals. Since the connecting board is electrically connected to the first circuit board and the second circuit board, the first circuit board and the second circuit board can transmit electrical signals to each other, which is convenient to be installed on the first circuit board The electrical signal is transmitted between the electronic device and the electronic device arranged on the second circuit board.
  • this application also provides an electronic device.
  • the electronic device includes a middle frame and the circuit board assembly, and the middle frame is used to support the circuit board assembly. As the strength of the circuit board assembly is improved, the circuit board assembly is stronger, so that the electronic devices on the circuit board assembly work stably, thereby improving the stability of the operation of the electronic device.
  • FIG. 1 is a schematic diagram of a three-dimensional structure of a circuit board assembly provided by the first embodiment of the application.
  • FIG. 2 is a schematic front view of the structure of the circuit board assembly provided by the first embodiment of the application.
  • FIG. 3 is a schematic diagram of an exploded structure of the circuit board assembly provided by the first embodiment of the application.
  • FIG. 4 is a schematic diagram of the three-dimensional structure of the circuit board assembly provided by the second embodiment of this application.
  • FIG. 5 is a schematic diagram of an exploded structure of the circuit board assembly provided by the second embodiment of this application.
  • FIG. 6 is a schematic diagram of the three-dimensional structure of the connecting board in the circuit board assembly provided by the second embodiment of this application.
  • FIG. 7 is a schematic diagram of the three-dimensional structure of the circuit board assembly provided by the third embodiment of the application.
  • FIG. 8 is a schematic diagram of an exploded structure of the circuit board assembly provided by the third embodiment of the application.
  • FIG. 9 is a schematic diagram of the three-dimensional structure of the connecting board in the circuit board assembly provided by the third embodiment of this application.
  • FIG. 10 is a schematic diagram of the three-dimensional structure of the circuit board assembly provided by the fourth embodiment of this application.
  • FIG. 11 is a schematic diagram of the three-dimensional structure of the connecting board in the circuit board assembly provided by the fourth embodiment of this application.
  • FIG. 12 is a schematic diagram of a three-dimensional structure of a circuit board assembly provided by a fifth embodiment of this application.
  • FIG. 13 is a schematic diagram of an exploded structure of the circuit board assembly provided by the fifth embodiment of this application.
  • FIG. 14 is a schematic diagram of the three-dimensional structure of the connecting board in the circuit board assembly provided by the fifth embodiment of this application.
  • 15 is a schematic diagram of the three-dimensional structure of the circuit board assembly provided by the sixth embodiment of the application.
  • FIG. 16 is a schematic diagram of an exploded structure of the circuit board assembly provided by the sixth embodiment of this application.
  • FIG. 17 is a schematic diagram of the three-dimensional structure of the connecting board in the circuit board assembly provided by the sixth embodiment of this application.
  • Fig. 18 is a schematic partial sectional view of the enlarged structure taken along the line I-I of Fig. 15;
  • FIG. 19 is a schematic diagram of a three-dimensional structure of a circuit board assembly provided by a seventh embodiment of this application.
  • Fig. 20 is an enlarged schematic diagram of the partial cross-sectional view of Fig. 19 along the line II-II.
  • FIG. 21 is a schematic diagram of a three-dimensional structure of a circuit board assembly provided by an eighth embodiment of this application.
  • Fig. 22 is an enlarged schematic diagram of the partial cross-sectional view of Fig. 21 along the line III-III.
  • FIG. 23 is a schematic diagram of the three-dimensional structure of the circuit board assembly provided by the ninth embodiment of this application.
  • FIG. 24 is a schematic diagram of an exploded structure of the circuit board assembly provided by the ninth embodiment of this application.
  • FIG. 25 is a schematic diagram of a three-dimensional structure of a circuit board assembly provided by a tenth embodiment of this application.
  • FIG. 26 is a schematic diagram of an exploded structure of the circuit board assembly provided by the tenth embodiment of this application.
  • FIG. 27 is a schematic diagram of an enlarged structure at IV in FIG. 26.
  • FIG. 28 is a schematic diagram of the three-dimensional structure of the circuit board assembly provided by the eleventh embodiment of this application.
  • Fig. 29 is an enlarged schematic view of the partial cross-section of Fig. 28 along the line V-V.
  • FIG. 30 is a schematic diagram of the three-dimensional structure of the electronic device provided by this application.
  • FIG. 31 is a schematic diagram of the explosive structure of the electronic device provided by this application.
  • FIG. 1 is a schematic diagram of the three-dimensional structure of the circuit board assembly provided by the first embodiment of the application.
  • 2 is a schematic front view of the structure of the circuit board assembly provided by the first embodiment of the application.
  • 3 is a schematic diagram of an exploded structure of the circuit board assembly provided by the first embodiment of the application.
  • the circuit board assembly 10 includes a first circuit board 11, a connecting board 12, and a second circuit board 13.
  • the first circuit board 11, the connecting board 12, and the second circuit board 13 are stacked in sequence.
  • the connecting board 12 is electrically connected to the first circuit board 11 and the second circuit board 13.
  • the connecting plate 12 includes a connecting body 121 and a reinforcing portion 122 provided on the connecting body 121.
  • the reinforcing portion 122 is used to increase the strength of the connecting plate 12.
  • the reinforcing portion 122 is provided on the connecting body 121. Since the reinforcing portion 122 supports the connecting body 121, the strength of the connecting plate 12 is improved.
  • the first circuit board 11, the connecting board 12 and the second circuit board 13 are stacked in sequence.
  • the connecting board 12 is electrically connected to the first circuit board 11 and the second circuit board 13.
  • the reinforcing portion 122 increases the strength of the connecting board 12, thereby increasing the strength of the circuit board assembly 10, making the circuit board assembly 10 stronger, and preventing the circuit board assembly 10 from being easily loosened. Further, since the first circuit board 11, the connecting board 12, and the second circuit board 13 are stacked and arranged in sequence, the electronic devices arranged on the first circuit board 11 and the electronic devices arranged on the first circuit board 11 are reduced.
  • the multiple electronic devices may also be respectively disposed on one surface of the second circuit board 13 capable of carrying electronic devices or on two opposite surfaces capable of carrying electronic devices.
  • the electrical signals are transmitted between the electronic devices arranged on the first circuit board 11 through the lines in the first circuit board 11.
  • the electrical signals are transmitted between the electronic devices arranged on the second circuit board 13 through the lines on the second circuit board 13.
  • the electrical signal is transmitted between the electronic devices arranged on the first circuit board 11 and the electronic devices arranged on the second circuit board 13 through the connecting board 12.
  • electronic devices are arranged on the first circuit board 11 and the second circuit board 13.
  • electronic devices are arranged on the first circuit board 11, the second circuit board 13 and the connecting board 12. Therefore, the area of the circuit board assembly 10 for mounting electronic devices is increased, and the number of electronic components contained in the circuit board assembly 10 is increased.
  • the circuit board assembly 10 may be, but is not limited to, a component used to carry electronic devices in an electronic device and to achieve electrical connection between the electronic devices.
  • the electronic device may be a mobile phone, a tablet computer, a notebook computer, an ultra-mobile personal computer (UMPC), a netbook, a personal digital assistant (Personal Digital Assistant, PDA), and other electronic products with a circuit board assembly 10.
  • the first circuit board 11 may be, but is not limited to, a printed circuit board (PCB), a ceramic circuit board, an ultra-thin circuit board, or the like.
  • the second circuit board 13 may be, but is not limited to, a printed circuit board, a ceramic circuit board, an ultra-thin circuit board, or the like.
  • the material of the connecting plate 12 may be, but not limited to, one or more of aluminum alloy, stainless steel, and titanium alloy.
  • the connecting board 12 may be, but is not limited to, a printed circuit board, a ceramic circuit board, an ultra-thin circuit board, etc., a circuit board that can realize electrical signal transmission and can play a supporting role.
  • the connecting board 12 is made of a conductive material that is connected to the first circuit board 11 and the second circuit board 13 through a connecting portion 124 provided on the connecting board 12.
  • the connecting portion 124 fixes the first circuit board 11, the connecting board 12, and the second circuit board 13 together, and electrically connects the first circuit board 11, the connecting board 12, and the The second circuit board 13.
  • the connecting board 12 is electrically connected to the first circuit board 11 and the second circuit board 13.
  • the connecting portion 124 may be, but is not limited to, a pad, a copper pillar, and other components that can conduct electrical signals.
  • the plurality of connecting portions 124 are arranged on the connecting body 121 at intervals.
  • FIG. 4 is a schematic diagram of the three-dimensional structure of the circuit board assembly provided by the second embodiment of this application.
  • FIG. 5 is a schematic diagram of an exploded structure of the circuit board assembly provided by the second embodiment of this application.
  • FIG. 6 is a schematic diagram of the three-dimensional structure of the connecting board in the circuit board assembly provided by the second embodiment of this application.
  • the circuit board assembly 10 provided in this embodiment is basically the same as the circuit board assembly 10 provided in the first embodiment of the present application. The difference is that in this embodiment, the connecting body 121 includes a plurality of connecting branches that are connected end to end in sequence. 1211.
  • the connecting branch 1211 is surrounded by a through hole 1212.
  • the reinforcing part 122 connects two different connecting branches 1211.
  • the reinforcing portion 122 connects two different connecting branches 1211, it supports the connecting branches 1211, and strengthens the strength of the connecting branches 1211, thereby increasing the strength of the connecting body 121 and improving The strength of the connecting plate 12.
  • the first circuit board 11, the connecting board 12 including the connecting body 121 and the reinforcing portion 122, and the second circuit board 13 are stacked in sequence. Since the reinforcing portion 122 increases the strength of the connecting board 12, the strength of the circuit board assembly 10 formed by the connecting board 12 connecting the first circuit board 11 and the second circuit board 13 is improved, so that The circuit board assembly 10 is stronger, which prevents the circuit board assembly 10 from being easily loosened and unable to be used normally. Further, since the plurality of connecting branches 1211 of the connecting body 121 surround the through holes 1212, the weight of the connecting body 121 is reduced, and the material of the connecting body 121 is saved.
  • the through hole 1212 includes a first through hole 1212a and a second through hole 1212b.
  • the connecting body 121 includes a first connecting branch 1211a, a second connecting branch 1211b, a third connecting branch 1211c, and a fourth connecting branch 1211d that are connected end to end in sequence.
  • the first connecting branch 1211a, a part of the third connecting branch 1211c, a part of the fourth connecting branch 1211d, and the reinforcing portion 122 enclose the first through hole 1212a.
  • the second connecting branch 1211b, a part of the third connecting branch 1211c, a part of the fourth connecting branch 1211d, and the reinforcing portion 122 enclose the second through hole 1212b.
  • the reinforcing portion 122 supports the third connection branch 1211c and the fourth connection branch 1211d, and improves the strength of the third connection branch 1211c and the fourth connection branch 1211d, thereby improving
  • the strength of the connecting body 121 improves the strength of the connecting plate 12. It is understandable that the shape formed by the plurality of connecting branches 1211 that are connected end to end in turn is not limited to that shown in FIG. 5, the number of the connecting branches 1211 and the shape formed by the plurality of connecting branches 1211 that are connected end to end may be Designed according to actual needs.
  • FIG. 7 is a schematic diagram of the three-dimensional structure of the circuit board assembly provided by the third embodiment of this application.
  • FIG. 8 is a schematic diagram of an exploded structure of the circuit board assembly provided by the third embodiment of the application.
  • FIG. 9 is a schematic diagram of the three-dimensional structure of the connecting board in the circuit board assembly provided by the third embodiment of this application.
  • the circuit board assembly 10 in this embodiment can also be combined with any one of the circuit board assembly 10 provided in the first embodiment and the second embodiment described above.
  • the reinforcing portion 122 includes a first end 1221, a second end 1222, and a middle portion 1223 connecting the first end 1221 and the second end 1222.
  • the first end 1221 and the second end 1222 are connected to the connecting branch 1211 respectively.
  • the size of the reinforcing portion 122 gradually increases from the middle portion 1223 to the first end 1221, and the size of the reinforcing portion 122 gradually increases from the middle portion 1223 to the second end 1222.
  • the reinforcing portion 122 supports the connecting body 121, the strength of the connecting body 121 is improved, and the strength of the connecting plate 12 is improved. Since the size of the reinforcing portion 122 gradually increases from the middle portion 1223 to the first end 1221, the supporting effect of the reinforcing portion 122 on the connecting body 121 is further improved, thereby improving the connection The strength of the main body 121 improves the strength of the connecting plate 12. Correspondingly, since the size of the reinforcing portion 122 gradually increases from the middle portion 1223 to the second end 1222, the supporting effect of the reinforcing portion 122 on the connecting body 121 is further improved, thereby increasing The strength of the connecting body 121 improves the strength of the connecting plate 12.
  • the reinforcing portion 122 increases the strength of the connecting board 12, the strength of the circuit board assembly 10 formed by the connecting board 12 connecting the first circuit board 11 and the second circuit board 13 is improved, so that The circuit board assembly 10 is stronger, which prevents the circuit board assembly 10 from being easily loosened and unable to be used normally.
  • the first end 1221 refers to an end surface of the reinforcing portion 122 that intersects the main body connecting body 121; the second end 1222 refers to the reinforcing portion 122 opposite to the connecting body 121 The other end face that intersects.
  • FIG. 10 is a schematic diagram of the three-dimensional structure of the circuit board assembly provided by the fourth embodiment of this application.
  • FIG. 11 is a schematic diagram of the three-dimensional structure of the connecting board in the circuit board assembly provided by the fourth embodiment of this application.
  • the circuit board assembly 10 provided in this embodiment is basically the same as the circuit board assembly 10 provided in the third embodiment. The difference is that in this embodiment, the reinforcing portion 122 extends from the middle portion 1223 to the second One end 1221 has a smooth transition. The portion of the reinforcing portion 122 that smoothly transitions from the middle portion 1223 to the first end 1221 does not overlap the projections in the direction perpendicular to the first end 1221.
  • the reinforcing portion 122 smoothly transitions from the middle portion 1223 to the second end 1222.
  • the projections of the reinforcing portion 122 smoothly transitioning from the middle portion 1223 to the second end 1222 in the direction perpendicular to the second end 1222 do not overlap. Since the reinforcing portion 122 smoothly transitions from the middle portion 1223 to the first end 1221, stress concentration in the transition portion of the reinforcing portion 122 from the middle portion 1223 to the first end 1221 is avoided . Correspondingly, since the reinforcing portion 122 smoothly transitions from the middle portion 1223 to the second end 1222, the transition of the reinforcing portion 122 from the middle portion 1223 to the second end 1222 is avoided Produce stress concentration.
  • FIG. 12 is a schematic diagram of the three-dimensional structure of the circuit board assembly according to the fifth embodiment of this application.
  • FIG. 13 is a schematic diagram of an exploded structure of the circuit board assembly provided by the fifth embodiment of this application.
  • FIG. 14 is a schematic diagram of the three-dimensional structure of the connecting board in the circuit board assembly provided by the fifth embodiment of this application.
  • the circuit board assembly 10 in this embodiment can also be combined with any one of the circuit board assemblies 10 provided in the first to fourth embodiments described above.
  • the reinforcing part 122 includes a plurality of intersecting sub-reinforcing parts 1224. The intersections of the plurality of sub-reinforcing parts 1224 are smoothly connected.
  • the reinforcing portion 122 supports the connecting body 121, the strength of the connecting body 121 is improved, and the strength of the connecting plate 12 is improved.
  • the reinforcing portion 122 includes a plurality of intersecting sub-reinforcing portions 1224, and each of the sub-reinforcing portions 1224 supports the connecting body 121 and further improves the strength of the connecting body 121. Further, the intersections of the multiple sub-reinforcing parts 1224 are smoothly connected, which avoids stress concentration at the intersection of each of the sub-reinforcing parts 1224. In addition, the size of the intersection of the plurality of sub-reinforcing parts 1224 is increased, thereby increasing the supporting effect of the reinforcing part 122. The strength of the connecting board 12 is further increased, so that the circuit board assembly 10 is stronger, and the circuit board assembly 10 is prevented from being easily loosened and thus unable to be used normally.
  • FIG. 15 is a schematic diagram of a three-dimensional structure of a circuit board assembly according to a sixth embodiment of this application.
  • FIG. 16 is a schematic diagram of an exploded structure of the circuit board assembly provided by the sixth embodiment of this application.
  • FIG. 17 is a schematic diagram of the three-dimensional structure of the connecting board in the circuit board assembly provided by the sixth embodiment of this application.
  • Fig. 18 is a schematic partial sectional view of the enlarged structure taken along the line I-I of Fig. 15;
  • the circuit board assembly 10 in this embodiment can also be combined with any one of the circuit board assembly 10 provided in the first to fifth embodiments described above.
  • a groove 1225 is provided on the surface of the reinforcing portion 122 facing the second circuit board 13.
  • the opening of the groove 1225 faces the second circuit board 13.
  • the second circuit board 13 seals the opening and forms a sealed space with the groove 1225.
  • an electronic device 30 is provided on the second circuit board. Since the surface of the reinforcing portion 122 facing the second circuit board 13 is provided with a groove 1225, the second circuit board 13 seals the opening, so that the second circuit board 13 corresponds to the groove 1225
  • the provided electronic device 30 is accommodated in the sealed space, thereby shielding the electronic device 30 accommodated in the sealed space.
  • the electromagnetic wave signal outside the sealed space cannot enter the sealed space, which prevents the electromagnetic wave signal outside the sealed space from interfering with the operation of the electronic device 30 in the sealed space, and ensures the electronic device 30 in the sealed space. Stable operation.
  • the electromagnetic wave signal generated by the electronic device 30 in the sealed space cannot be radiated to the outside of the sealed space, which reduces the interference of the electronic device 30 in the sealed space to the electronic device 30 outside the sealed space.
  • the electronic device 30 provided on the second circuit board 13 corresponding to the groove 1225 refers to the electronic device 30 covered by the orthographic projection of the groove 1225 on the second circuit board 13.
  • FIG. 19 is a schematic diagram of the three-dimensional structure of the circuit board assembly according to the seventh embodiment of this application.
  • Fig. 20 is an enlarged schematic diagram of the partial cross-sectional view of Fig. 19 along the line II-II.
  • the circuit board assembly 10 in this embodiment can also be combined with any one of the circuit board assemblies 10 provided in the first to sixth embodiments described above. In this embodiment, the projection of the first circuit board 11 in a direction perpendicular to the connecting board 12 falls into the connecting board 12.
  • the circuit board assembly 10 further includes a first adhesive member 14a.
  • the first adhesive member 14a covers the gap between the peripheral edge of the first circuit board 11 and the peripheral edge of the connecting plate 12, and the first adhesive member 14a covers the peripheral edge of the connecting plate 12 and the second The gap between the periphery of the circuit board 13.
  • the first bonding member 14a has a bonding effect. Because the first bonding member 14a covers the gap between the peripheral edge of the first circuit board 11 and the peripheral edge of the connecting plate 12, the first circuit board 11 and the connecting board 12 are glued together, which improves the firmness between the first circuit board 11 and the connecting board 12, thereby making the circuit board assembly 10 stronger and avoiding the circuit board The component 10 is easy to loosen and cannot be used normally.
  • the projection of the first circuit board 11 in a direction perpendicular to the connecting board 12 falls into the connecting board 12, so that the size of the first circuit board 11 is smaller than the size of the connecting board 12, It is convenient to cover the first adhesive member 14a in the gap between the periphery of the first circuit board 11 and the periphery of the connecting board 12.
  • the first bonding member 14a covers the gap between the peripheral edge of the connecting plate 12 and the peripheral edge of the second circuit board 13, the connecting plate 12 and the second circuit board 13 are adhered to each other.
  • the reliability between the connecting board 12 and the second circuit board 13 is improved, so that the circuit board assembly 10 is stronger, and the circuit board assembly 10 is prevented from being easily loosened and causing abnormalities. use.
  • the projection of the first circuit board 11 in a direction perpendicular to the connecting board 12 falls into the connecting board 12.
  • the projection of the connecting board 12 in a direction perpendicular to the second circuit board 13 falls into the second circuit board 13.
  • the projection of the first circuit board 11 in a direction perpendicular to the connecting board 12 falls into the connecting board 12; and the second circuit board 13 is in the vertical direction.
  • the projection in the direction of the connecting plate 12 falls into the connecting plate 12. It is understandable that the size of the first circuit board 11 refers to the projected area of the first circuit board 11 in a direction perpendicular to the second circuit board 13.
  • the size of the connecting board 12 refers to the projected area of the connecting board 12 in a direction perpendicular to the second circuit board 13. After the first circuit board 11 is connected to the connecting board 12 through the connecting portion 124, due to the volume of the connecting portion 124, the first circuit board 11 and the connecting board 12 There will be gaps between.
  • the first adhesive 14a can be used to seal the gap.
  • the connecting portion 124 may be, but is not limited to, a pad, a copper pillar, and other components that can conduct electrical signals.
  • the first bonding member 14a may be composed of, but not limited to, one or more materials with bonding effects such as organic silica gel, acrylic resin, unsaturated polyester, epoxy resin, and the like.
  • FIG. 21 is a schematic diagram of a three-dimensional structure of a circuit board assembly according to an eighth embodiment of this application.
  • Fig. 22 is an enlarged schematic diagram of the partial cross-sectional view of Fig. 21 along the line III-III.
  • the circuit board assembly 10 in this embodiment can also be combined with any one of the circuit board assembly 10 provided in the first to seventh embodiments described above.
  • a second bonding member 14b is provided between the first circuit board 11 and the connecting board 12.
  • the connecting board 12 and the second circuit board 13 are provided with a third bonding member 14c.
  • the second bonding member 14b has a bonding effect.
  • the first circuit board 11 is The connection boards 12 are glued together to improve the firmness between the first circuit board 11 and the connection board 12, thereby making the circuit board assembly 10 stronger and avoiding the circuit board assembly 10 It is easy to loosen and can not be used normally.
  • the third bonding member 14c has a bonding effect. Since the three bonding members 14c are arranged between the second circuit board 13 and the connecting board 12, the second The degree of firmness between the circuit board 13 and the connecting board 12 makes the circuit board assembly 10 stronger, and prevents the circuit board assembly 10 from being easily loosened and unable to be used normally.
  • the second bonding member 14b may be composed of, but not limited to, one or more materials with bonding effects such as organic silica gel, acrylic resin, unsaturated polyester, and epoxy resin.
  • the third bonding member 14c may be composed of, but not limited to, one or more materials with bonding effect such as organic silica gel, acrylic resin, unsaturated polyester, epoxy resin and the like.
  • FIG. 23 is a schematic diagram of a three-dimensional structure of a circuit board assembly according to a ninth embodiment of this application.
  • FIG. 24 is a schematic diagram of an exploded structure of the circuit board assembly provided by the ninth embodiment of this application.
  • the circuit board assembly 10 in this embodiment can also be combined with any one of the circuit board assembly 10 provided in the first embodiment to the eighth embodiment described above.
  • the circuit board assembly 10 further includes at least one connector 15.
  • the first circuit board 11 is provided with a first mounting portion 111.
  • the connecting plate 12 is provided with a second mounting portion 123.
  • the second circuit board 13 is provided with a third mounting portion 131.
  • the first mounting portion 111 is disposed opposite to the second mounting portion 123 and the third mounting portion 131.
  • the connecting member 15 passes through the first mounting portion 111, the second mounting portion 123, and the third mounting portion 131 to connect the first circuit board 11, the connecting board 12, and the second circuit Board 13.
  • the connecting member 15 passes through the first mounting portion 111, the second mounting portion 123, and the third mounting portion 131, thereby connecting the first circuit board 11, the connecting board 12, and the The second circuit board 13 is fixed, so that the first circuit board 11 is firmly connected to the connecting board 12 and the second circuit board 13, which improves the strength of the circuit board assembly 10 and avoids the circuit board
  • the component 10 is easy to loosen and cannot be used normally.
  • the material of the connecting member 15 may be, but is not limited to, metal materials or alloy materials such as carbon steel, stainless steel, copper, etc.
  • the number of the connecting members 15 can be set according to needs. In this embodiment, the number of the connecting members 15 is four.
  • FIG. 25 is a schematic diagram of a three-dimensional structure of a circuit board assembly provided by a tenth embodiment of this application.
  • FIG. 26 is a schematic diagram of an exploded structure of the circuit board assembly provided by the tenth embodiment of this application.
  • FIG. 27 is a schematic diagram of an enlarged structure at IV in FIG. 26.
  • the circuit board assembly 10 in this embodiment can also be combined with any one of the circuit board assemblies 10 provided in the first to ninth embodiments described above.
  • the circuit board assembly 10 further includes a buffer 16, and the buffer 16 at least partially exposes the first mounting portion 111.
  • the buffer 16 has a through hole 161.
  • the connecting member 15 passes through the through hole 161 to connect the first circuit board 11, the connecting board 12, and the second circuit board 13.
  • the buffer member 16 is used to buffer the force transmitted from the connecting member 15 to the first circuit board 11. Since the buffer member 16 can buffer the force transmitted from the connecting member 15 to the first circuit board 11, the force transmitted from the connecting member 15 to the first circuit board 11 is reduced. The function of the circuit board 11 prevents the connection member 15 and the first circuit board 11 from loosening and falling off due to the excessive force transmitted from the connecting member 15 to the first circuit board 11. It is understandable that the buffer member 16 may be, but is not limited to, a component with buffer force such as solder, washer, or the like.
  • FIG. 28 is a schematic diagram of the three-dimensional structure of the circuit board assembly provided by the eleventh embodiment of this application.
  • Fig. 29 is an enlarged schematic view of the partial cross-section of Fig. 28 along the line V-V.
  • the circuit board assembly 10 in this embodiment can also be combined with any one of the above-described embodiments of the circuit board assembly 10 provided in the first to tenth embodiments.
  • the circuit board assembly 10 further includes a shielding cover 17.
  • the shielding cover 17 is arranged on the second circuit board 13 and has a gap with the connecting board 12.
  • the circuit board assembly 10 further includes a fourth bonding member 14 d, and the fourth bonding member 14 d is disposed in the gap between the shielding cover 17 and the connecting plate 12.
  • the fourth bonding member 14d is disposed in the gap between the shielding cover 17 and the connecting plate 12, and the fourth bonding member 14d can buffer the shielding cover 17 from being transmitted to the connecting plate
  • the force of the shielding cover 17 reduces the force that the shielding cover 17 transmits to the connecting plate 12 on the connecting plate 12, making the circuit board assembly 10 stronger, and preventing the shielding cover 17.
  • the force transmitted to the connecting plate 12 is too large to damage the connecting plate 12. It can be understood that the projection of the first circuit board 11 in a direction perpendicular to the second circuit board 13 falls on the second circuit board 13, so that the size of the first circuit board 11 is smaller than The size of the second connecting plate 13.
  • the fourth bonding member 14d may be composed of, but not limited to, one or more materials with bonding effects such as organic silica gel, acrylic resin, unsaturated polyester, epoxy resin, and the like.
  • the fourth bonding member 14d may be, but is not limited to, a component having a buffering effect such as an encapsulant.
  • FIG. 30 is a schematic diagram of the three-dimensional structure of the electronic device provided by this application.
  • FIG. 31 is a schematic diagram of the explosive structure of the electronic device provided by this application.
  • the electronic device 1 includes a middle frame 20 and the circuit board assembly 10.
  • the middle frame 20 is used to support the circuit board assembly 10. As the strength of the circuit board assembly 10 is improved, the circuit board assembly 10 is stronger, so that the electronic devices on the circuit board assembly 10 work stably, thereby improving the stability of the operation of the electronic device 1.
  • the circuit board assembly 10 further includes at least one connector 15.
  • the connecting member 15 is used to fix the first circuit board 11, the connecting board 12 and the second circuit board 13 to the middle frame 20. Since the first circuit board 11, the connecting board 12, and the second circuit board 13 are fixed to the middle frame 20 through the connecting member 15, the circuit board assembly 10 can be firmly fixed to The middle frame 20 is on. As the strength of the circuit board assembly 10 is improved, the circuit board assembly 10 is stronger, so that the electronic devices on the circuit board assembly 10 work stably, thereby improving the stability of the operation of the electronic device 1.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

本申请提供一种电路板组件及电子设备。电路板组件包括第一电路板、连接板、第二电路板。第一电路板、连接板及第二电路板依次层叠设置。连接板电连接第一电路板及第二电路板。连接板包括连接本体以及设置在连接本体上的补强部，补强部用于增强连接板的强度。电子设备包括中框和电路板组件。中框用于支撑电路板组件。

Description

电路板组件及电子设备 技术领域
本申请涉及电子技术领域，尤其涉及一种电路板组件及电子设备。
背景技术
印刷电路板是电子设备中重要的电子部件，它是电子设备中电子元器件的支撑体，也是电子元器件电气连接的载体。随着电子设备趋向精密化，不牢固的印刷电路板会直接干扰到印刷电路板上的电子元器件的工作状态，从而使整个电子设备无法稳定运作。因此，改进印刷电路板成为亟待解决的问题。
发明内容
本申请提供一种电路板组件及电子设备。电路板组件的强度较高且牢固。电子设备中的电路板组件不容易松脱。
一方面，本申请提供的电路板组件包括第一电路板、连接板、第二电路板。所述第一电路板、所述连接板及所述第二电路板依次层叠设置。所述连接板电连接所述第一电路板及所述第二电路板。所述连接板包括连接本体以及设置在所述连接本体上的补强部，所述补强部用于增强所述连接板的强度。
由于所述补强部提高了连接板的强度，从而提高了所述连接板连接所述第一电路板及第二电路板形成的所述电路板组件的强度，使得所述电路板组件更加牢固，避免了所述电路板组件容易松脱而导致无法正常使用。由于所述第一电路板、所述连接板及所述第二电路板依次层叠设置，减少了设置在所述第一电路板上的电子器件与设置在所述第二电路板上的电子器件之间电磁波信号的干扰。由于所述连接板电连接所述第一电路板及所述第二电路板，使得第一电路板及第二电路板上之间能够互相传输电信号，便于设置在所述第一电路板上的电子器件与设置在所述第二电路板上的电子器件之间传输电信号。
另一方面，本申请还提供一种电子设备。所述电子设备包括中框和所述电路板组件，所述中框用于支撑所述电路板组件。由于提高了所述电路板组件的强度，所述电路板组件更加牢固，使得所述电路板组件上的电子器件稳定工作， 进而提高了所述电子设备运行的稳定性。
附图说明
图1为本申请第一实施方式提供的电路板组件的立体结构示意图。
图2为本申请第一实施方式提供的电路板组件的主视结构示意图。
图3为本申请第一实施方式提供的电路板组件的爆炸结构示意图。
图4为本申请第二实施方式提供的电路板组件的立体结构示意图。
图5为本申请第二实施方式提供的电路板组件的爆炸结构示意图。
图6为本申请第二实施方式提供的电路板组件中的连接板的立体结构示意图。
图7为本申请第三实施方式提供的电路板组件的立体结构示意图。
图8为本申请第三实施方式提供的电路板组件的爆炸结构示意图。
图9为本申请第三实施方式提供的电路板组件中的连接板的立体结构示意图。
图10为本申请第四实施方式提供的电路板组件的立体结构示意图。
图11为本申请第四实施方式提供的电路板组件中的连接板的立体结构示意图。
图12为本申请第五实施方式提供的电路板组件的立体结构示意图。
图13为本申请第五实施方式提供的电路板组件的爆炸结构示意图。
图14为本申请第五实施方式提供的电路板组件中的连接板的立体结构示意图。
图15为本申请第六实施方式提供的电路板组件的立体结构示意图。
图16为本申请第六实施方式提供的电路板组件的爆炸结构示意图。
图17为本申请第六实施方式提供的电路板组件中的连接板的立体结构示意图。
图18图15沿I-I线的局部剖视的放大结构示意图。
图19为本申请第七实施方式提供的电路板组件的立体结构示意图。
图20为图19沿II-II线的局部剖视的放大结构示意图。
图21为本申请第八实施方式提供的电路板组件的立体结构示意图。
图22为图21沿III-III线的局部剖视的放大结构示意图。
图23为本申请第九实施方式提供的电路板组件的立体结构示意图。
图24为本申请第九实施方式提供的电路板组件的爆炸结构示意图。
图25为本申请第十实施方式提供的电路板组件的立体结构示意图。
图26为本申请第十实施方式提供的电路板组件的爆炸结构示意图。
图27为图26中IV处的放大结构示意图。
图28为本申请第十一实施方式提供的电路板组件的立体结构示意图。
图29为图28沿V-V线的局部剖面的放大结构示意图。
图30为本申请提供的电子设备的立体结构示意图。
图31为本申请提供的电子设备的爆炸结构示意图。
具体实施方式
下面将结合本申请实施方式中的附图，对本申请实施方式中的技术方案进行描述，显然，所描述的实施方式仅仅是本申请一部分实施方式，而不是全部的实施方式。基于本申请中的实施方式，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施方式，都属于本申请保护的范围。
请一并参阅图1至图3，图1为本申请第一实施方式提供的电路板组件的立体结构示意图。图2为本申请第一实施方式提供的电路板组件的主视结构示意图。图3为本申请第一实施方式提供的电路板组件的爆炸结构示意图。在本实施方式中，所述电路板组件10包括第一电路板11、连接板12、第二电路板13。所述第一电路板11、所述连接板12及所述第二电路板13依次层叠设置。所述连接板12电连接所述第一电路板11及所述第二电路板13。所述连接板12包括连接本体121以及设置在所述连接本体121上的补强部122。所述补强部122用于增强所述连接板12的强度。
所述补强部122设置在所述连接本体121上。由于所述补强部122对所述连接本体121起到支撑作用，从而提高了所述连接板12的强度。所述第一电路板11、连接板12及第二电路板13依次层叠设置。所述连接板12电连接所述第一电路板11及所述第二电路板13。由于所述补强部122提高了连接板12的强度，从而提高了所述电路板组件10的强度，使得所述电路板组件10更加 牢固，避免了所述电路板组件10容易松脱。进一步地，由于所述第一电路板11、所述连接板12及所述第二电路板13依次层叠设置，减少了设置在所述第一电路板11上的电子器件与设置在所述第二电路板13上的电子器件之间电磁波信号的干扰。由于所述连接板12电连接所述第一电路板11及所述第二电路板13，使得第一电路板11及第二电路板13上之间能够互相传输电信号，便于设置在所述第一电路板11上的电子器件与设置在所述第二电路板13上的电子器件之间传输电信号。可以理解的，所述电路板组件10用于承载多个电子器件。所述多个电子器件分别设置在所述第一电路板11及所述第二电路板13上。其中，所述多个电子器件分别设置在所述第一电路板11中能够承载电子器件一个表面或者能够承载电子器件的两个相对的表面。所述多个电子器件也可分别设置在所述第二电路板13中能够承载电子器件一个表面或者能够承载电子器件的两个相对的表面。其中，设置在所述第一电路板11上的电子器件之间通过所述第一电路板11内的线路进行电信号的传输。设置在第二电路板13上的电子器件之间通过所述第二电路板13上的线路进行电信号的传输。设置在所述第一电路板11上的电子器件与设置在所述第二电路板13上的电子器件之间通过所述连接板12进行电信号的传输。在本实施方式中，电子器件设置在所述第一电路板11和第二电路板13上。在另一种实施方式中，电子器件设置在所述第一电路板11、第二电路板13及所述连接板12上。从而提高所述电路板组件10安装电子器件的面积，及提高所述电路板组件10容纳电子元器件的数量。
具体的，所述电路板组件10可以为但不限于为电子设备中用于承载电子器件，并使所述电子器件之间实现电连接的部件。所述电子设备可以为手机、平板电脑、笔记本电脑，超级移动个人计算机(Ultra-mobilie Personal Computer，UMPC)、上网本、个人数字助理(Personal Digital Assistant，PDA)等具有电路板组件10的电子产品。所述第一电路板11可以为但不限于为印刷电路板(printed circuit board,PCB)、陶瓷电路板、超薄电路板等的线路板。所述第二电路板13可以为但不限于为印刷电路板、陶瓷电路板、超薄电路板等的线路板。所述连接板12的材料可以为但不限于为铝合金、不锈钢、钛合金中的一种或者多种。所述连接板12可以为但不限于为印刷电路板、陶瓷电路板、超 薄电路板等的能够实现电信号传输且能够起到支撑作用的线路板。所述连接板12通过设置在所述连接板12上连接部124与所述第一电路板11、所述第二电路板13连接所述连接部124为导电材质。所述连接部124将所述第一电路板11、所述连接板12及所述第二电路板13固定在一起，且电连接所述第一电路板11、所述连接板12及所述第二电路板13。从而使得所述连接板12电连接所述第一电路板11及所述第二电路板13。其中，所述连接部124可以为但不限于为焊盘、铜柱等具有传导电信号作用的部件。所述多个连接部124间隔设于所述连接本体121上。
请一并参阅图4至图6，图4为本申请第二实施方式提供的电路板组件的立体结构示意图。图5为本申请第二实施方式提供的电路板组件的爆炸结构示意图。图6为本申请第二实施方式提供的电路板组件中的连接板的立体结构示意图。本实施方式提供的电路板组件10与本申请第一实施方式提供的电路板组件10基本相同，不同之处在于，在本实施方式中，所述连接本体121包括多个依次首尾相连的连接分支1211。所述连接分支1211围设成通孔1212。所述补强部122连接不同的两个连接分支1211。由于所述补强部122连接不同的两个连接分支1211，对所述连接分支1211起到支撑作用，加强了所述连接分支1211的强度，从而提高了所述连接本体121的强度，提高了所述连接板12的强度。所述第一电路板11、与包括所述连接本体121及所述补强部122的连接板12、及所述第二电路板13依次层叠设置。由于所述补强部122提高了连接板12的强度，从而提高了所述连接板12连接所述第一电路板11及第二电路板13形成的所述电路板组件10的强度，使得所述电路板组件10更加牢固，避免了所述电路板组件10容易松脱而导致无法正常使用。进一步地，由于所述连接本体121的多个所述连接分支1211围成通孔1212，减少了所述连接本体121的重量、节约了所述连接本体121的材料。
请再次参阅图4至图6，所述通孔1212包括第一通孔1212a和第二通孔1212b。在本实施方式中，所述连接本体121包括依次首尾相连的第一连接分支1211a、第二连接分支1211b、第三连接分支1211c及第四连接分支1211d。所述第一连接分支1211a、部分所述第三连接分支1211c、部分所述第四连接分支1211d及所述补强部122围成所述第一通孔1212a。所述第二连接分支 1211b、部分所述第三连接分支1211c、部分所述第四连接分支1211d及所述补强部122围成所述第二通孔1212b。所述补强部122对所述第三连接分支1211c及所述第四连接分支1211d起到支撑作用，提高了所述第三连接分支1211c及所述第四连接分支1211d的强度，从而提高了所述连接本体121的强度，提高了所述连接板12的强度。可以理解地，所述多个依次首尾相连的连接分支1211形成的形状不限于为图5中所示，所述连接分支1211的数量以及所述多个依次首尾相连的连接分支1211形成的形状可以根据实际需要而设计。
请一并参阅图7至图9，图7为本申请第三实施方式提供的电路板组件的立体结构示意图。图8为本申请第三实施方式提供的电路板组件的爆炸结构示意图。图9为本申请第三实施方式提供的电路板组件中的连接板的立体结构示意图。本实施方式中的电路板组件10也可以结合前面描述的第一实施方式与第二实施方式提供的电路板组件10中的任意一个实施方式。在本实施方式中，所述补强部122包括第一端1221、第二端1222以及连接所述第一端1221和第二端1222的中间部1223。所述第一端1221和所述第二端1222分别连接所述连接分支1211。所述补强部122的尺寸自所述中间部1223向所述第一端1221逐渐增加，且所述补强部122的尺寸自所述中间部1223向所述第二端1222逐渐增加。
由于所述补强部122对所述连接本体121起到支撑作用，从而提高了所述连接本体121的强度，提高了所述连接板12的强度。由于所述补强部122的尺寸自所述中间部1223向所述第一端1221逐渐增加，进一步提高了所述补强部122对所述连接本体121的支撑作用，从而提高了所述连接本体121的强度，提高了所述连接板12的强度。相应地，由于所述补强部122的尺寸自所述中间部1223向所述第二端1222逐渐增加，进一步提高了所述补强部122对所述连接本体121的支撑作用，从而提高了所述连接本体121的强度，提高了所述连接板12的强度。由于所述补强部122提高了连接板12的强度，从而提高了所述连接板12连接所述第一电路板11及第二电路板13形成的所述电路板组件10的强度，使得所述电路板组件10更加牢固，避免了所述电路板组件10容易松脱而导致无法正常使用。可以理解地，所述第一端1221指所述补强部122中与所述本体连接本体121相交的一个端面；所述第二端1222指所述补 强部122相对与所述连接本体121相交的另一个端面。
请参阅图10和图11，图10为本申请第四实施方式提供的电路板组件的立体结构示意图。图11为本申请第四实施方式提供的电路板组件中的连接板的立体结构示意图。本实施方式提供的电路板组件10与第三实施方式提供的电路板组件10基本相同，不同之处在于，在本实施方式中，所述补强部122自所述中间部1223向所述第一端1221圆滑过渡。所述补强部122自所述中间部1223向所述第一端1221圆滑过渡的部分沿垂直于所述第一端1221方向上的投影不重合。所述补强部122自所述中间部1223向所述第二端1222圆滑过渡。所述补强部122自所述中间部1223向所述第二端1222圆滑过渡的部分沿垂直于所述第二端1222方向上的投影不重合。由于所述补强部122自所述中间部1223向所述第一端1221圆滑过渡，避免了所述补强部122自所述中间部1223向所述第一端1221过渡的部分产生应力集中。相应地，由于所述补强部122自所述中间部1223向所述第二端1222圆滑过渡，避免了所述补强部122自所述中间部1223向所述第二端1222过渡的部分产生应力集中。
请一并参阅图12至图14，图12为本申请第五实施方式提供的电路板组件的立体结构示意图。图13为本申请第五实施方式提供的电路板组件的爆炸结构示意图。图14为本申请第五实施方式提供的电路板组件中的连接板的立体结构示意图。本实施方式中的电路板组件10也可以结合前面描述的第一实施方式至第四实施方式提供的电路板组件10中的任意一个实施方式。在本实施方式中，所述补强部122包括多个相交的子补强部1224。所述多个子补强部1224的相交处圆滑连接。由于所述补强部122对所述连接本体121起到支撑作用，从而提高了所述连接本体121的强度，提高了所述连接板12的强度。所述补强部122包括多个相交的子补强部1224，所述每个子补强部1224对所述连接本体121起到支撑作用，进一步提高了所述连接本体121的强度。进一步地，所述多个子补强部1224的相交处圆滑连接，避免了所述每个子补强部1224的相交处的应力集中。此外，所述多个子补强部1224相交处的尺寸增大，从而增加了所述补强部122的支撑作用。进一步增加了所述连接板12的强度，使得所述电路板组件10更加牢固，避免了所述电路板组件10容易松脱而导致无法正常使用。
请一并参阅图15至图18，图15为本申请第六实施方式提供的电路板组件的立体结构示意图。图16为本申请第六实施方式提供的电路板组件的爆炸结构示意图。图17为本申请第六实施方式提供的电路板组件中的连接板的立体结构示意图。图18图15沿I-I线的局部剖视的放大结构示意图。本实施方式中的电路板组件10也可以结合前面描述的第一实施方式至第五实施方式提供的电路板组件10中的任意一个实施方式。在本实施方式中，所述补强部122面对所述第二电路板13的表面设有凹槽1225。所述凹槽1225的开口朝向所述第二电路板13。所述第二电路板13密封所述开口，且与所述凹槽1225形成密封空间。可以理解的，所述第二电路板上设置有电子器件30。由于所述补强部122面对所述第二电路板13的表面设有凹槽1225，所述第二电路板13密封所述开口，使得所述第二电路板13对应所述凹槽1225设置的电子器件30收容在所述密封空间内，从而屏蔽了收容在所述密封空间的电子器件30。密封空间外部的电磁波信号无法进入到所述密封空间内，避免了所述密封空间外部的电磁波信号干扰所述密封空间内的电子器件30的运作，保证了所述密封空间内的电子器件30的稳定运作。同时所述密封空间内的电子器件30产生的电磁波信号无法辐射到所述密闭空间外部，减少了所述密封空间内的电子器件30对所述密封空间外部的电子器件30的干扰。可以理解的，所述第二电路板13对应所述凹槽1225设置的电子器件30指的是所述凹槽1225在第二电路板13上的正投影所覆盖的电子器件30。
请一并参阅图19至图20，图19为本申请第七实施方式提供的电路板组件的立体结构示意图。图20为图19沿II-II线的局部剖视的放大结构示意图。本实施方式中的电路板组件10也可以结合前面描述的第一实施方式至第六实施方式提供的电路板组件10中的任意一个实施方式。在本实施方式中，所述第一电路板11在沿垂直于所述连接板12的方向上的投影落入到所述连接板12内。所述电路板组件10还包括第一粘结件14a。所述第一粘结件14a覆盖所述第一电路板11周缘与所述连接板12周缘之间的缝隙，且所述第一粘结件14a覆盖所述连接板12周缘与所述第二电路板13周缘之间的缝隙。所述第一粘结件14a具有粘结作用，由于所述第一粘结件14a覆盖所述第一电路板11周缘与所述连接板12周缘之间的缝隙，使所述第一电路板11和所述连接板 12粘合在一起，提高了所述第一电路板11和所述连接板12之间的牢靠程度，从而使得所述电路板组件10更加牢固，避免了所述电路板组件10容易松脱而导致无法正常使用。所述第一电路板11在沿垂直于所述连接板12的方向上的投影落入到所述连接板12内，使得所述第一电路板11的尺寸小于所述连接板12的尺寸，便于在所述第一电路板11周缘和连接板12周缘之间缝隙的覆盖所述第一粘结件14a。相应地，由于所述第一粘结件14a覆盖所述连接板12周缘与所述第二电路板13周缘之间的缝隙，使所述连接板12与所述第二电路板13粘合在一起，提高了所述连接板12与所述第二电路板板13之间的牢靠程度，从而使得所述电路板组件10更加牢固，避免了所述电路板组件10容易松脱而导致无法正常使用。
在本实施方式中，所述第一电路板11在沿垂直于所述连接板12的方向上的投影落入到所述连接板12内。在一种实施方中，所述连接板12在垂直于所述第二电路板13的方向上的投影落入到所述第二电路板13内。在另一种实施方式中，所述第一电路板11在沿垂直于所述连接板12的方向上的投影落入到所述连接板12内；且所述第二电路板13在沿垂直于所述连接板12的方向上的投影落入到所述连接板12内。可以理解的，所述第一电路板11的尺寸指所述第一电路板11沿垂直于所述第二电路板13方向上的投影的面积。所述连接板12的尺寸指所述连接板12沿垂直于所述第二电路板13方向上的投影的面积。在通过所述连接部124将所述第一电路板11与所述连接板12连接之后，由于所述连接部124自身体积的作用，使所述第一电路板11与所述连接板12之间会存在缝隙。所述第一粘结件14a则可以用于密封所述缝隙。其中，所述连接部124可以为但不限于为焊盘、铜柱等具有传导电信号作用的部件。所述第一粘结件14a可以由但不限于由有机硅胶、丙烯酸型树脂及不饱和聚酯、环氧树脂等的一种或者多种具有粘结作用的材料组成。
请一并参阅图21至图22，图21为本申请第八实施方式提供的电路板组件的立体结构示意图。图22为图21沿III-III线的局部剖视的放大结构示意图。本实施方式中的电路板组件10也可以结合前面描述的第一实施方式至第七实施方式提供的电路板组件10中的任意一个实施方式。在本实施方式中，所述第一电路板11与所述连接板12之间设置有第二粘结件14b。所述连接板12 与第二电路板13设置有第三粘结件14c。所述第二粘结件14b具有粘结作用，由于所述第一电路板11之间与所述连接板12之间设置有所述二粘结件14b，使所述第一电路板11与所述连接板12粘合在一起，提高了所述第一电路板11和所述连接板12之间的牢固程度，从而使得所述电路板组件10更加牢固，避免了所述电路板组件10容易松脱而导致无法正常使用。相应地，所述第三粘结件14c具有粘结作用，由于所述第二电路板13之间与所述连接板12之间设置有所述三粘结件14c，提高了所述第二电路板13和所述连接板12之间的牢固程度，从而使得所述电路板组件10更加牢固，避免了所述电路板组件10容易松脱而导致无法正常使用。可以理解地，所述第二粘结件14b可以由但不限于由有机硅胶、丙烯酸型树脂及不饱和聚酯、环氧树脂等的一种或者多种具有粘结作用的材料组成。所述第三粘结件14c可以由但不限于由有机硅胶、丙烯酸型树脂及不饱和聚酯、环氧树脂等的一种或者多种具有粘结作用的材料组成。
请参阅图23和图24，图23为本申请第九实施方式提供的电路板组件的立体结构示意图。图24为本申请第九实施方式提供的电路板组件的爆炸结构示意图。本实施方式中的电路板组件10也可以结合前面描述的第一实施方式至第八实施方式提供的电路板组件10中的任意一个实施方式。在本实施方式中，所述电路板组件10还包括至少一个连接件15。所述第一电路板11开设有第一安装部111。所述连接板12开设有第二安装部123。所述第二电路板13开设有第三安装部131。所述第一安装部111与所述第二安装部123以及第三安装部131相对设置。所述连接件15穿过所述第一安装部111、第二安装部123、及第三安装部131，以连接所述第一电路板11、所述连接板12、及所述第二电路板13。所述连接件15穿过所述第一安装部111、所述第二安装部123、及所述第三安装部131，从而将所第一电路板11、所述连接板12、及所述第二电路板13固定，使所述第一电路板11与所述连接板12以及第二电路板13牢固地连接在一起，提高了所述电路板组件10的强度，避免了所述电路板组件10容易松脱而导致无法正常使用。可以理解的，所述连接件15的材料可以为但不限于为碳钢、不锈钢、铜等的金属材料或者合金材料。所述连接件15的数量根据需要进行设置，本实施方式中所述连接件15的数量为四个。
请一并参阅图25至图27。图25为本申请第十实施方式提供的电路板组件的立体结构示意图。图26为本申请第十实施方式提供的电路板组件的爆炸结构示意图。图27为图26中IV处的放大结构示意图。本实施方式中的电路板组件10也可以结合前面描述的第一实施方式至第九实施方式提供的电路板组件10中的任意一个实施方式。在本实施方式中，所述电路板组件10还包括缓冲件16，所述缓冲件16至少部分露出所述第一安装部111。所述缓冲件16具有贯孔161。所述连接件15穿过所述贯孔161连接所述第一电路板11、所述连接板12、及所述第二电路板13。所述缓冲件16用于缓冲所述连接件15传输至所述第一电路板11的作用力。由于所述缓冲件16能够缓冲所述连接件15传至所述第一电路板11的作用力，减少了所述连接件15传输至所述第一电路板11的作用力对所述第一电路板11的作用，防止了由于所述连接件15传至所述第一电路板11的作用力太大而使所述连接件15与所述第一电路板11之间产生松动而脱落。可以理解的，所述缓冲件16可以为但不限于为焊锡、垫圈等的具有缓冲作用力的部件。
请参阅图28和图29，图28为本申请第十一实施方式提供的电路板组件的立体结构示意图。图29为图28沿V-V线的局部剖面的放大结构示意图。本实施方式中的电路板组件10也可以结合前面描述的第一实施方式至第十实施方式提供的电路板组件10中的任意一个实施方式。在本实施方式中，所述电路板组件10还包括屏蔽罩17。所述屏蔽罩17设置在所述第二电路板13上且与所述连接板12之间设置有间隙。具体的，所述连接板12的一边沿相对于所述第二电路板13的一边沿内缩，所述屏蔽罩17设于所述第二电路板13上且位于所述连接板12的一边沿与所述第二电路板13的一边沿之间。所述电路板组件10还包括第四粘结件14d，所述第四粘结件14d设置在所述屏蔽罩17与所述连接板12之间的间隙内。由于所述第四粘结件14d设置在所述屏蔽罩17与所述连接板12之间的间隙内，且所述第四粘结件14d能缓冲所述屏蔽罩17传至所述连接板12的作用力，减少了所述屏蔽罩17传至所述连接板12的作用力对所述连接板12的作用力，使得所述电路板组件10更加牢固，防止了由于所述屏蔽罩17传至所述连接板12的作用力太大而使所述连接板12损坏。可以理解的，所述第一电路板11在沿垂直于所述第二电路板13的方向上的投 影落入到所述第二电路板13上，使得所述第一电路板11的尺寸小于所述第二连接板13的尺寸。所述连接板12在沿垂直于所述第二电路板13的方向上的投影落入到所述第二电路板13上，使得所述连接板12的尺寸小于所述第二电路板13的尺寸。所述第四粘结件14d可以由但不限于由有机硅胶、丙烯酸型树脂及不饱和聚酯、环氧树脂等的一种或者多种具有粘结作用的材料组成。所述第四粘结件14d可以为但不限于为包封胶等具有缓冲作用的部件。
请参阅图30和图31，图30为本申请提供的电子设备的立体结构示意图。图31为本申请提供的电子设备的爆炸结构示意图。所述电子设备1包括中框20和所述电路板组件10。所述中框20用于支撑所述电路板组件10。由于提高了所述电路板组件10的强度，所述电路板组件10更加牢固，使得所述电路板组件10上的电子器件稳定工作，进而提高了所述电子设备1运行的稳定性。
进一步地，请再次参阅图30和图31，所述电路板组件10还包括至少一个连接件15。所述连接件15用于将所述第一电路板11、所述连接板12及所述第二电路板13固定至所述中框20。由于通过所述连接件15将所述第一电路板11、所述连接板12及所述第二电路板13固定至所述中框20，从而能够将所述电路板组件10牢固地固定在所述中框20上。由于提高了所述电路板组件10的强度，所述电路板组件10更加牢固，使得所述电路板组件10上的电子器件稳定工作，进而提高了所述电子设备1运行的稳定性。
以上对本申请实施例进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的一般技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种电路板组件，其特征在于，所述电路板组件包括第一电路板、连接板、第二电路板，所述第一电路板、所述连接板及所述第二电路板依次层叠设置，且所述连接板电连接所述第一电路板及所述第二电路板，所述连接板包括连接本体以及设置在所述连接本体上的补强部，所述补强部用于增强所述连接板的强度。
  2. 如权利要求1所述的电路板组件，其特征在于，所述连接本体包括多个依次首尾相连的连接分支，所述连接分支围设成通孔，所述补强部连接不同的两个连接分支。
  3. 如权利要求2所述的电路板组件，其特征在于，所述补强部包括第一端、第二端以及连接所述第一端和第二端的中间部，所述第一端和所述第二端分别连接所述连接分支，所述补强部的尺寸自所述中间部向所述第一端逐渐增加，且所述补强部的尺寸自所述中间部向所述第二端逐渐增加。
  4. 如权利要求3所述的电路板组件，其特征在于，所述中间部与所述第一端之间圆滑连接；且所述中间部与所述第二端之间圆滑连接。
  5. 如权利要求1所述的电路板组件，其特征在于，所述连接板上设有多个连接部，所述连接板通过所述连接部与所述第一电路板、所述第二电路板连接。
  6. 如权利要求5所述的电路板组件，其特征在于，所述多个连接部间隔设于所述连接本体上。
  7. 如权利要求6所述的电路板组件，其特征在于，所述连接部为导电材质，所述连接部用于电连接所述第一电路板、所述连接板及所述第二电路板。
  8. 如权利要求1所述的电路板组件，其特征在于，所述电路板组件还包括多个电子器件，所述多个电子器件设于所述第一电路板中的一个表面和/或所述第二电路板中的一个表面；或者，所述电子器件设于所述第一电路板中两个相对的表面和/或所述第二电路板中两个相对的表面。
  9. 如权利要求8所述的电路板组件，其特征在于，所述电路板组件还包 括设于所述补强部上的凹槽，所述凹槽的开口朝向所述第二电路板，当所述电子器件至少部分设于所述第二电路板上时，至少部分设于所述第二电路板上的所述电子器件收容于所述凹槽内。
  10. 如权利要求9所述的电路板组件，其特征在于，所述第二电路板密封所述开口，所述第二电路板与所述凹槽形成密封空间。
  11. 如权利要求1至10任意一项所述的电路板组件，其特征在于，所述补强部包括多个相交的子补强部，所述多个子补强部的相交处圆滑连接。
  12. 如权利要求1至10任意一项所述的电路板组件，其特征在于，所述第一电路板在沿垂直于所述连接板的方向上的投影落入到所述连接板内，所述电路板组件还包括第一粘结件，所述第一粘结件覆盖所述第一电路板周缘与所述连接板周缘之间的缝隙，且所述第一粘结件覆盖所述连接板周缘与所述第二电路板周缘之间的缝隙。
  13. 如权利要求1至10任意一项所述的电路板组件，其特征在于，所述第一电路板与所述连接板之间设置有第二粘结件，所述连接板与所述第二电路板之间设置有第三粘结件。
  14. 如权利要求13所述的电路板组件，其特征在于，所述第二粘结件设置在所述第一电路板与所述补强部之间，所述第三粘结件设置在所述补强部与所述第二电路板之间。
  15. 如权利要求1至10任意一项所述的电路板组件，其特征在于，所述电路板组件还包括至少一个连接件，所述第一电路板开设有第一安装部，所述连接板开设有第二安装部，所述第二电路板开设有第三安装部，所述第一安装部与所述第二安装部以及第三安装部相对设置，所述连接件穿过所述第一安装部、第二安装部、及第三安装部，以连接所第一电路板、连接板、及第二电路板。
  16. 如权利要求15所述的电路板组件，其特征在于，所述电路板组件还包括缓冲件，所述缓冲件至少部分露出所述第一安装部，所述缓冲件具有贯孔，所述连接件穿过所述贯孔连接所述第一电路板、所述连接板、及所述第二电路板，所述缓冲件用于缓冲所述连接件传输至所述第一电路板的作用力。
  17. 如权利要求1至10任意一项所述的电路板组件，其特征在于，所述 电路板组件还包括屏蔽罩，所述屏蔽罩设置在所述第二电路板上且与所述连接板之间设置有间隙，所述电路板组件还包括第四粘结件，所述第四粘结件设置在所述屏蔽罩与所述连接板之间的间隙内。
  18. 如权利要求17所述的电路板组件，其特征在于，所述连接板的一边沿相对于所述第二电路板的一边沿内缩，所述屏蔽罩设于所述第二电路板上且位于所述连接板的一边沿与所述第二电路板的一边沿之间。
  19. 一种电子设备，其特征在于，所述电子设备包括中框和权利要求1-18任一项所述的电路板组件，所述中框用于支撑所述电路板组件。
  20. 如权利要求19所述的电子设备，其特征在于，所述电路板组件还包括至少一个连接件，所述连接件用于将所述第一电路板、所述连接板及所述第二电路板固定至所述中框。
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