WO2020220250A1 - 显示装置 - Google Patents

显示装置 Download PDF

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Publication number
WO2020220250A1
WO2020220250A1 PCT/CN2019/085153 CN2019085153W WO2020220250A1 WO 2020220250 A1 WO2020220250 A1 WO 2020220250A1 CN 2019085153 W CN2019085153 W CN 2019085153W WO 2020220250 A1 WO2020220250 A1 WO 2020220250A1
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WO
WIPO (PCT)
Prior art keywords
substrate
sensor
display device
infrared cut
camera module
Prior art date
Application number
PCT/CN2019/085153
Other languages
English (en)
French (fr)
Inventor
李中华
王世鹏
桑建
郭少飞
郝东佳
乔春英
Original Assignee
京东方科技集团股份有限公司
北京京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 北京京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to CN201980000576.9A priority Critical patent/CN112313568B/zh
Priority to EP19927173.5A priority patent/EP3964886A4/en
Priority to PCT/CN2019/085153 priority patent/WO2020220250A1/zh
Priority to US16/963,317 priority patent/US11315915B2/en
Publication of WO2020220250A1 publication Critical patent/WO2020220250A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate

Definitions

  • the present invention generally relates to the field of display technology, and particularly relates to a display device with a reduced thickness and capable of effectively increasing the screen-to-body ratio.
  • FIG. 1a and Figure 1b respectively show the traditional camera structure of the zoom type and the fixed focus type, which includes a camera module and a (mobile phone) middle shell 1'for fixing the camera module, which is used to wire the sensor 2'
  • the flexible printed circuit board 3', the bracket 6'for supporting the infrared cut filter 4'and the lens 5' is arranged above the flexible printed circuit board. Due to the existence of flexible printed circuit boards, (mobile phone) middle shells and brackets, the camera module as an independent unit greatly hinders the trend of thinning and full-screen display devices such as mobile phones.
  • the purpose of the present invention is to provide an improved camera module configuration, which effectively utilizes the Z-direction space in the display module structure, reduces the overall thickness of the display device, and increases the energy efficiency of the screen-to-body ratio.
  • the present invention provides a display device, a display device, comprising: a cover plate; a backlight unit; a display module arranged between the backlight unit and the cover plate, the display module including a display module close to the backlight unit A first substrate on the light-emitting side and a second substrate close to the cover plate; and a camera module arranged on the first substrate, the camera module including an infrared cut filter; wherein the first substrate extends horizontally beyond the The second substrate and the backlight unit constitute an installation section for the camera module, and the infrared cut filter is arranged in the installation section.
  • the camera module further includes a lens for collecting light and a sensor for receiving light from the lens and forming sensing information, and the infrared cut filter is located between the lens and the sensor .
  • the infrared cut filter is configured as an infrared cut filter film coated on the first substrate in the installation section.
  • the first substrate includes a first side facing the cover plate and an opposite second side facing the backlight unit, and the infrared cut filter film may be coated on the second side and/or the first side of the first substrate .
  • the infrared cut filter film may be a reflective infrared cut filter film or an absorptive infrared cut filter film.
  • the reflective infrared cut-off filter film may be, for example, a metal or metal alloy material film; the absorptive infrared cut-off filter film may be, for example, a blue glass film layer.
  • the senor in the installation section, may be arranged on the first side of the first substrate, and the lens may be arranged on the second side of the first substrate.
  • the lens can be a rear dual lens.
  • the lens in the mounting section, the lens may be arranged on the first side of the first substrate, and the sensor may be arranged on the second side of the first substrate.
  • the lens can be a front dual camera.
  • the installation section is provided with an opening, and the infrared cut filter is configured as an infrared cut filter embedded in the opening, wherein the lens is provided in the installation section.
  • the second side of the first substrate, and the sensor is arranged on the infrared cut filter.
  • the infrared cut filter is an optical filter that allows visible light to pass through but cuts or reflects infrared light.
  • the display device includes an integrated circuit provided on the first side of the first substrate, and the integrated circuit is electrically connected to the sensor through a wire to drive the sensor.
  • the trace can be an indium tin oxide trace. It should be understood by those skilled in the art that wires made of other suitable materials can also be used instead of indium tin oxide wires.
  • the display device further includes a main flexible printed circuit board arranged between the lens and the first substrate
  • the camera module further includes a sensor flexible printed circuit board for the sensor
  • the main flexible printed circuit board The printed circuit board is electrically connected to the sensor flexible printed circuit board to drive the sensor.
  • the display device further includes a main flexible printed circuit board arranged between the lens and the first substrate
  • the camera module further includes a backlight unit flexible printed circuit board shared by the sensor and the backlight unit, the main flexible printed circuit board
  • the printed circuit board is electrically connected to the sensor flexible printed circuit board to drive the sensor.
  • the display device further includes an upper polarizer disposed between the cover plate and the second substrate, and a lower polarizer disposed between the first substrate and the backlight unit.
  • the first substrate may be a thin film transistor substrate
  • the second substrate may be a color filter substrate
  • the first substrate such as a thin film transistor (TFT) substrate is coated with an infrared cut-off filter film in the single layer area of the display module, so that the first substrate such as a TFT substrate is used as the infrared cut-off filter of the camera module And the support plate, can remove the infrared cut filter and the middle shell in the traditional camera module.
  • TFT thin film transistor
  • the flexible printed circuit board that plays the role of wiring in the traditional camera module is removed, and the thickness of the camera module is significantly reduced, thereby reducing The thickness of a mobile phone or tablet using this camera module.
  • the screen-to-body ratio can be effectively increased.
  • the sensor of the camera module can share integrated circuit (IC) drive with the display module; the sensor of the camera module can share the main flexible printed circuit board drive with the display module; and the sensor of the camera module can be driven with the backlight
  • the units share the backlight unit flexible circuit board drive; through the above three driving methods, the flexible printed circuit board dedicated to the sensor that functions as a wiring connection of the traditional camera module is removed, and the thickness of the display device can be significantly reduced.
  • the Z-direction space in the module structure can be effectively used to reduce the overall thickness.
  • the camera module such as dual cameras, is placed in a single-layer area, and the X-direction space can be used to effectively increase the display ratio.
  • the invention is particularly suitable for the field of mobile phone display integrated with camera modules, but is not limited to this field.
  • FIGS. 1a and 1b are schematic diagrams of the structure of a camera module in the prior art
  • Fig. 2 shows a schematic structural diagram of a first embodiment of a display device according to the present invention
  • FIG. 3 shows a schematic diagram of the camera module and the display module in FIG. 2 sharing integrated circuit driving
  • FIG. 4 shows a schematic structural diagram of a second embodiment of a display device according to the present invention.
  • FIG. 5 shows a schematic diagram of the camera module and the display module in FIG. 4 sharing integrated circuit driving
  • Figure 6 shows a schematic structural diagram of a third embodiment of a display device according to the present invention.
  • Fig. 7 shows a schematic structural diagram of a fourth embodiment of a display device according to the present invention.
  • Fig. 2 shows a schematic structural diagram of a first embodiment of a display device according to the present invention.
  • the display device 1 includes a cover plate 2, a backlight unit 3, and a display module 4 arranged between the cover plate 2 and the backlight unit 3, wherein the display module 4 includes a light emitting device close to the backlight unit
  • the display device 1 also includes a camera module 7 arranged on the first substrate 5.
  • the camera module 7 includes a lens 71 for collecting light, a sensor 72 capable of receiving light from the lens and forming sensing information, and For driving the voice coil motor 75 of the lens 71.
  • the display device 1 further includes an upper polarizer 11 provided between the cover plate 2 and the second substrate 6 and a lower polarizer 12 provided between the first substrate 5 and the backlight unit 3.
  • the first substrate 5 is, for example, a thin film transistor (TFT) substrate
  • the second substrate 6 is, for example, a color filter (CF) substrate.
  • the lens 71 is arranged in the voice coil motor and fixed to the second side of the first substrate 5 by glue through the voice coil motor in the mounting section, and the sensor 72 is arranged on the second side of the first substrate 5 opposite to the lens.
  • the infrared cut filter 73 for filtering infrared light is an infrared cut filter film coated (for example, electroplated) on the first side of the first substrate 5, and the infrared cut filter film may be a reflective film.
  • the reflective infrared cut-off filter film can be a metal, metal alloy or metal compound material film, and the absorptive infrared cut-off filter film can be, for example, a blue glass film.
  • the infrared cut filter film may also be coated on the second side of the first substrate 5 or on both sides of the first substrate 5.
  • the display device 1 includes an integrated circuit 8 disposed on the first side of the first substrate 5, and the integrated circuit 8 is electrically connected to a sensor 72 through an indium tin oxide wiring 10 to drive the sensor.
  • the camera module 7 is, for example, a dual rear camera, so two sensors 72 are shown.
  • the indium tin oxide traces can also be replaced with other suitable materials, which also fall within the scope of the present invention.
  • the infrared cut-off filter film is used to replace the infrared cut-off filter in the existing camera module, and the integrated circuit 8 is shared by the display module 4 and the sensor 72 of the camera module 7, eliminating the traditional camera
  • the flexible printed circuit board dedicated to the sensor that functions as a wiring connection of the module reduces the thickness of the display module and the camera module.
  • Fig. 4 shows a schematic structural diagram of a second embodiment of a display device according to the present invention.
  • the second substrate and the backlight unit 3 that the first substrate 5 extends horizontally beyond constitute an installation section for the camera module.
  • the difference between this embodiment and the first embodiment is only that the mounting section of the first substrate 5 is provided with openings, the first substrate 5 is not coated with an infrared cut filter film, and the infrared cut filter
  • the piece 73 is replaced by an infrared cut filter embedded in the opening.
  • the infrared cut filter can be bonded to the hole wall by double-sided tape.
  • the lens 71 is arranged in the voice coil motor and fixed to the second side of the first substrate 5 by glue through the voice coil motor in the mounting section, and the sensor 72 is arranged opposite to the lens to the infrared cut filter on.
  • the display device 1 includes an integrated circuit 8 disposed on the first side of the first substrate 5.
  • the integrated circuit 8 is electrically connected to the sensor 72 through, for example, indium tin oxide wiring 10 Drive the sensor.
  • the camera module 7 is, for example, a dual rear camera, so two sensors 72 are shown.
  • the infrared cut filter in the first substrate and sharing the integrated circuit 8 with the sensor 72 of the display module 4 and the camera module 7, the wiring connection function of the traditional camera module is eliminated
  • the flexible printed circuit board dedicated to the sensor reduces the thickness of the display module.
  • Fig. 6 shows a schematic structural diagram of a third embodiment of a display device according to the present invention.
  • the second substrate and the backlight unit 3 that the first substrate 5 extends horizontally beyond constitute an installation section for the camera module.
  • the difference from the first embodiment is that the lens 71 is fixed to the first side of the first substrate 5 in the mounting section, and the sensor 72 is arranged on the second side of the first substrate 5 opposite to the lens.
  • the infrared cut filter 73 for filtering out infrared light may be an infrared cut filter film coated (eg, electroplated) on the second side of the first substrate 5.
  • the infrared cut filter film may also be coated on the first side of the first substrate 5 or on both sides of the first substrate 5.
  • the display module includes a main flexible printed circuit board 9 arranged between the lens 71 and the first substrate 5.
  • the camera module 7 also includes a sensor flexible printed circuit board 74 for the sensor 72, the main The flexible printed circuit board 9 is electrically connected to the sensor flexible printed circuit board 74 through, for example, indium tin oxide wiring to drive the sensor.
  • the infrared cut filter film is used to replace the infrared cut filter in the existing camera module, and the main flexible printed circuit board is shared by the display module 4 and the sensor 72 of the camera module 7, eliminating The flexible printed circuit board dedicated to the sensor that functions as the wiring connection of the traditional camera module reduces the thickness of the camera module and the display module, thereby reducing the thickness of the display device.
  • Fig. 7 shows a schematic structural diagram of a fourth embodiment of a display device according to the present invention.
  • the display device in this embodiment has a structure similar to that of the third embodiment shown in FIG. 6.
  • the display device 1 includes a main flexible printed circuit board 9 provided between the lens 71 and the first substrate 5, and the camera module 7 also includes The backlight unit flexible printed circuit board 76 shared by the sensor 72 and the backlight unit 3, and the main flexible printed circuit board 9 is electrically connected to the sensor flexible printed circuit board 76 through, for example, indium tin oxide wiring to drive the sensor 72.
  • the infrared cut-off filter film is used to replace the infrared cut-off filter in the existing camera module, and the backlight unit and the sensor 72 of the camera module 7 share the backlight unit flexible printed circuit board, and the main flexible The printed circuit boards are connected, and the flexible printed circuit board dedicated to sensors that functions as a wiring connection of the traditional camera module is eliminated, thereby reducing the thickness of the display device.
  • the display device may include, but is not limited to, a mobile phone, a tablet computer, a navigation display device or a wearable electronic device.

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Abstract

一种显示装置（1），其包括盖板（2）；背光单元（3）；设置在背光单元（3）和盖板（2）之间的显示模组（4），显示模组（4）包括靠近背光单元（3）的出光侧的第一基板（5）和靠近盖板（2）的第二基板（6）；和设置在第一基板（5）上的摄像模组（7），摄像模组（7）包括红外截止滤光件（73）；其中第一基板（5）水平延伸超出第二基板（6）和背光单元（3），以构成用于摄像模组（7）的安装区段，红外截止滤光件（73）设置在安装区段内。

Description

显示装置 技术领域
本发明总体涉及显示技术领域，尤其涉及具有减小的厚度、并能有效增大屏占比的显示装置。
背景技术
随着电子信息技术的不断发展，显示装置例如智能手机、平板电脑等的应用越来越广泛，在人们的工作以及生活中均扮演着不可或缺的角色
随着显示装置的普及性不断提高，显示装置的超窄边框化、薄型化、全屏化已成为主流趋势。由于传统摄像头作为独立单元存在于整机中，占有较大空间，不利于超薄化、全屏化。图1a和图1b分别示出了变焦类型和定焦类型的传统摄像头结构，其包括摄像模组以及用于固定摄像模组的(手机)中壳1’,用于对传感器2’进行线路连接的柔性印刷电路板3’，用于支承红外截止滤光片4’和镜头5’的托架6’布置在柔性印刷电路板上方。由于柔性印刷电路板、(手机)中壳以及托架的存在，摄像头模组作为独立单元大大阻碍了显示装置例如手机的薄型化、全屏化趋势。
发明内容
本发明的目的是提供一种改进的摄像模组配置，其有效利用显示模组结构中的Z向空间，减小了显示装置的整体厚度，并且能效增加屏占比。
因此，本发明提供一种显示装置，一种显示装置，包括：盖板；背光单元；设置在该背光单元和该盖板之间的显示模组，该 显示模组包括靠近所述背光单元的出光侧的第一基板和靠近该盖板的第二基板；以及设置在所述第一基板上的摄像模组，该摄像模组包括红外截止滤光件；其中该第一基板水平延伸超出该第二基板和该背光单元，以构成用于该摄像模组的安装区段，所述红外截止滤光件设置在该安装区段内。
根据本发明的一个方案，所述摄像模组还包括用于采集光线的镜头和接收来自所述镜头的光线并形成感应信息的传感器，所述红外截止滤光件位于该镜头和该传感器之间。
根据本发明的一个方案，所述红外截止滤光件构造为在所述安装区段涂覆到该第一基板的红外截止滤光膜。该第一基板包括面向该盖板的第一侧和面向该背光单元的相反的第二侧，所述红外截止滤光膜可涂覆到该第一基板的第二侧和/或第一侧。在这里，红外截止滤光膜可以为反射式红外截止滤光膜或吸收式红外截止滤光膜。反射式红外截止滤光膜可以为例如金属、金属合金材料膜；吸收式红外截止滤光膜可以为例如蓝玻璃膜层。
根据一个优选方案，在该安装区段，传感器可以设置在第一基板的第一侧，镜头可以设置在第一基板的第二侧。在这种情况下，镜头可以为后置双镜头。
根据本发明的一个方案，在该安装区段，镜头可设置该第一基板的第一侧，所述传感器可设置在该第一基板的第二侧。在这种情况下，镜头可以为前置双摄像头。
在本发明的一个方案中，安装区段设有开孔，红外截止滤光件构造为嵌设在所述开孔内的红外截止滤光片，其中，镜头在该安装区段中设置在该第一基板的第二侧，而传感器设置在该红外截止滤光片上。在这里，红外截止滤光片是一种允许可见光透过而截止或反射红外光的光学滤光片。
在本发明的一个方案中，所述显示装置包括设置在该第一基 板的第一侧的集成电路，该集成电路通过走线电连接到传感器以驱动所述传感器。例如，走线可以为氧化铟锡走线。本领域技术人员应当理解，也可以采用其它合适材料的走线来替代氧化铟锡走线。
在本发明的一个方案中，显示装置还包括设置在所述镜头和第一基板之间的主柔性印刷电路板，摄像模组还包括用于该传感器的传感器柔性印刷电路板，所述主柔性印刷电路板电连接到所述传感器柔性印刷电路板以驱动所述传感器。
在本发明的一个方案中，显示装置还包括设置在镜头和第一基板之间的主柔性印刷电路板，摄像模组还包括传感器和背光单元共用的背光单元柔性印刷电路板，所述主柔性印刷电路板电连接到传感器柔性印刷电路板以驱动传感器。
在本发明的一个方案中，显示装置还包括设置在盖板和第二基板之间的上偏光片以及设置在第一基板和背光单元之间的下偏光片。
在本发明的上述显示装置中，所述第一基板可以为薄膜晶体管基板，而所述第二基板可以为彩色滤光基板
在本发明中，通过在显示模组的单层区对第一基板如薄膜晶体管(TFT)基板涂覆红外截止滤光膜，使第一基板如TFT基板作为摄像模组的红外截止滤光件和支承板，可以去除传统摄像模组中的红外截止滤光片和中壳。或者，通过在第一基板如TFT基板中开孔，将红外截止滤光片嵌设在该开孔内，也可以达到上述效果。另外，通过将摄像模组的传感器直接结合到显示模组的单层区上，去除了传统摄像模组中起走线作用的柔性印刷电路板，明显降低了摄像模组的厚度，从而降低了使用这种摄像模组的手机或平板电脑的厚度。同时，由于利用了显示模组的单层区上端的空间，能有效的增大屏占比。
在本发明中，摄像模组的传感器可以与显示模组共用集成电路(IC)驱动；摄像模组的传感器可以与显示模组共用主柔性印刷电路板驱动；和摄像模组的传感器可以与背光单元共用背光单元柔性电路板驱动；通过以上三种驱动方式，去除了传统摄像模组的起走线连接作用的专用于传感器的柔性印刷电路板，可明显降低显示装置的厚度。
在根据本发明的显示装置中，能够有效的利用模组结构中Z向空间，减少整体厚度，同时，摄像模组例如双摄像头放置在单层区，利用X向空间，能有效增加显示比例。
本发明尤其适用于摄像模组一体化的手机显示领域，但不局限于该领域。
附图说明
下面参照附图描述本发明的示例性实施例。
图1a和图1b是现有技术中的摄像模组的结构示意图
图2示出了根据本发明的显示装置的第一实施例的结构示意图；
图3示出了图2中的摄像模组与显示模组共用集成电路驱动的示意图；
图4示出了根据本发明的显示装置的第二实施例的结构示意图；
图5示出了图4中的摄像模组与显示模组共用集成电路驱动的示意图；
图6示出了根据本发明的显示装置的第三实施例的结构示意图；和
图7示出了根据本发明的显示装置的第四实施例的结构示意图。
具体实施方式
下面详细描述本发明的示例性实施例。下文描述的和附图示出的示例性实施例旨在教导本发明的原理，使本领域技术人员能够在若干不同环境中和对于若干不同应用实施和使用本发明。
图2示出了根据本发明的显示装置的第一实施例的结构示意图。从图中可以看出，显示装置1包括盖板2，背光单元3以及设置在盖板2和背光单元3之间的显示模组4，其中该显示模组4包括靠近所述背光单元的出光侧的第一基板5和靠近所述盖板的第二基板6，并且该第一基板5具有面向该第二基板6的第一侧和面向该背光单元3的第二侧。显示装置1还包括设置在该第一基板5上的摄像模组7，摄像模组7包括用于采集光线的镜头71、能够接收来自所述镜头的光线并形成感应信息的传感器72、以及用于驱动镜头71的音圈马达75。显示装置1还包括设置在盖板2和第二基板6之间的上偏光片11以及设置在第一基板5和背光单元3之间的下偏光片12。在该实施例中，第一基板5例如为薄膜晶体管(TFT)基板，该第二基板6例如为彩色滤光(CF)基板。
如图2所示，第一基板5水平延伸超出的第二基板6和背光单元3，延伸超出的部分构成用于摄像模组的安装区段。镜头71布置在该音圈马达内并通过该音圈马达由胶在所述安装区段固定到第一基板5的第二侧，而传感器72与所述镜头对置地布置在第一基板5的第一侧。在该实施例中，用于过滤掉红外光线的红外截止滤光件73为涂覆(例如电镀)到第一基板5的第一侧的红外截止滤光膜，红外截止滤光膜可以为反射式或吸收式红外截止滤光膜，反射式红外截止滤光膜可以是例如金属、金属合金或金属化合物材料膜，吸收式红外截止滤光膜可以是例如蓝玻璃 膜。作为替代，红外截止滤光膜也可以涂覆到第一基板5第二侧，或者第一基板5的两侧。
如图3所示，显示装置1包括设置在第一基板5的第一侧的集成电路8，该集成电路8通过氧化铟锡走线10电连接到传感器72以驱动所述传感器。在该实施例中，摄像模组7例如为双后摄像头，因此示出了两个传感器72。本领域技术人员应当理解，氧化铟锡走线也可以替换为其它合适的材料，这也涵盖在本发明的范围内。
在上述实施例中，通过使用红外截止滤光膜代替现有摄像模组中的红外截止滤光片，并且通过显示模组4与摄像模组7的传感器72共用集成电路8，去除了传统摄像模组的起走线连接作用的专用于传感器的柔性印刷电路板，从而减小了显示模组和摄像模组的厚度。
图4示出了根据本发明的显示装置的第二实施例的结构示意图。第一基板5水平延伸超出的第二基板和背光单元3，延伸超出的部分构成用于摄像模组的安装区段。从图中可以看出，该实施例与第一实施例的区别仅在于第一基板5的安装区段设有开孔，第一基板5没有涂覆红外截止滤光膜，而红外截止滤光件73替代为嵌设在所述开孔内的红外截止滤光片。例如，红外截止滤光片可通过双面胶粘接至孔壁。镜头71布置在该音圈马达内并通过该音圈马达由胶在所述安装区段固定到第一基板5的第二侧，而传感器72与所述镜头对置地布置该红外截止滤光片上。
如图5所示，与第一实施例相同，显示装置1包括设置在第一基板5的第一侧的集成电路8，该集成电路8通过例如氧化铟锡走线10电连接到传感器72以驱动所述传感器。在该实施例中，摄像模组7例如为双后摄像头，因此示出了两个传感器72。
在该实施例中，通过将红外截止滤光片嵌入第一基板中，并且通过显示模组4与摄像模组7的传感器72共用集成电路8，去除了传统摄像模组的起走线连接作用的专用于传感器的柔性印刷电路板，从而减小了显示模组的厚度。
图6示出了根据本发明的显示装置的第三实施例的结构示意图。第一基板5水平延伸超出的第二基板和背光单元3，延伸超出的部分构成用于摄像模组的安装区段。与第一实施例的区别在于，镜头71在所述安装区段固定到第一基板5的第一侧，而传感器72与所述镜头对置地布置在第一基板5的第二侧。用于过滤掉红外光线的红外截止滤光件73可以为涂覆(例如电镀)到第一基板5第二侧的红外截止滤光膜。作为替代，红外截止滤光膜也可以涂覆到第一基板5的第一侧，或者第一基板5的两侧。
在该第三实施例中，显示模组包括设置在镜头71和第一基板5之间的主柔性印刷电路板9，摄像模组7还包括用于传感器72的传感器柔性印刷电路板74，主柔性印刷电路板9通过例如氧化铟锡走线电连接到传感器柔性印刷电路板74以驱动所述传感器。
在该实施例中，通过使用红外截止滤光膜代替现有摄像模组中的红外截止滤光片，并且通过显示模组4与摄像模组7的传感器72共用主柔性印刷电路板，去除了传统摄像模组的起走线连接作用的专用于传感器的柔性印刷电路板，从而减小了摄像模组和显示模组的厚度，进而减小了显示装置的厚度。
图7示出了根据本发明的显示装置的第四实施例的结构示意图。该实施例中的显示装置与图6所示的第三实施例的结构类似，显示装置1包括设置在镜头71和第一基板5之间的主柔性印刷电路板9，摄像模组7还包括传感器72和背光单元3共用的背光单元柔性印刷电路板76，所述主柔性印刷电路板9通过 例如氧化铟锡走线电连接到传感器柔性印刷电路板76以驱动传感器72。
在该实施例中，通过使用红外截止滤光膜代替现有摄像模组中的红外截止滤光片，并且通过背光单元与摄像模组7的传感器72共用背光单元柔性印刷电路板，与主柔性印刷电路板相连接，去除了传统摄像模组的起走线连接作用的专用于传感器的柔性印刷电路板，从而减小了显示装置的厚度。
在本发明中，显示装置可包括但不限于手机、平板电脑、导航显示设备或者可穿戴电子设备。
除非另外定义，本公开使用的技术术语或者科学术语应当为本发明所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
可以理解，当诸如层、膜、区域或基板之类的元件被称作位于另一元件“上”或“下”时，该元件可以“直接”位于另一元件“上”或“下”，或者可以存在中间元件。
应当指出，上面的说明仅是示例性的，本领域技术人员可以根据上述说明对本发明实施例做出各种修改和变型，这些修改和变型均在本发明的保护范围之内。

Claims (12)

  1. 一种显示装置，包括：
    盖板；
    背光单元；
    设置在该背光单元和所述盖板之间的显示模组，该显示模组包括靠近所述背光单元的出光侧的第一基板和靠近所述盖板的第二基板；
    设置在所述第一基板上的摄像模组，该摄像模组包括红外截止滤光件，其中该第一基板水平延伸超出该第二基板和该背光单元，以构成用于该摄像模组的安装区段，其中所述红外截止滤光件设置在该安装区段内。
  2. 根据权利要求1所述的显示装置，其中，所述摄像模组还包括用于采集光线的镜头和接收来自所述镜头的光线并形成感应信息的传感器，所述红外截止滤光件位于该镜头和该传感器之间。
  3. 根据权利要求2所述的显示装置，其中，所述红外截止滤光件构造为在所述安装区段涂覆到该第一基板的红外截止滤光膜。
  4. 根据权利要求3所述的显示装置，其中，该第一基板包括面向该盖板的第一侧和面向该背光单元的相反的第二侧，所述红外截止滤光膜涂覆到该第一基板的所述第二侧和/或所述第一侧。
  5. 根据权利要求4所述的显示装置，其中，在该安装区段，所述传感器设置在该第一基板的第一侧，所述镜头设置在该第一基板的第二侧。
  6. 根据权利要求4所述的显示装置，其中，在该安装区段，所述镜头设置该第一基板的第一侧，所述传感器设置在该第一基 板的第二侧。
  7. 根据权利要求2所述的显示装置，其中，所述安装区段设有开孔，所述红外截止滤光件构造为嵌设在所述开孔内的红外截止滤光片，其中所述镜头在该安装区段设置在该第一基板的第二侧，所述传感器设置在该红外截止滤光片上。
  8. 根据权利要求2至6中任一项所述的显示装置，其中，所述显示装置包括设置在该第一基板的第一侧的集成电路，该集成电路通过走线电连接到该传感器以驱动所述传感器。
  9. 根据权利要求5或6所述的显示装置，其中，所述显示装置包括设置在所述镜头和该第一基板之间的主柔性印刷电路板，所述摄像模组还包括用于所述传感器的传感器柔性印刷电路板，所述主柔性印刷电路板电连接到所述传感器柔性印刷电路板以驱动该传感器。
  10. 根据权利要求5或6所述的显示装置，其中，所述显示装置包括设置在该镜头和该第一基板之间的主柔性印刷电路板，所述摄像模组还包括所述传感器和所述背光单元共用的背光单元柔性印刷电路板，所述主柔性印刷电路板电连接到所述传感器柔性印刷电路板以驱动所述传感器。
  11. 根据权利要求1至5中任一项所述的显示装置，其中，还包括设置在所述盖板和所述第二基板之间的上偏光片以及设置在所述第一基板和所述背光单元之间的下偏光片。
  12. 根据权利要求1至5中任一项所述的显示装置，其中，所述第一基板为薄膜晶体管基板，所述第二基板为彩色滤光基板。
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EP3964886A4 (en) 2022-11-23
CN112313568A (zh) 2021-02-02
CN112313568B (zh) 2022-06-17
EP3964886A1 (en) 2022-03-09
US20210366890A1 (en) 2021-11-25

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