WO2020211750A1 - 一种基于空间光束整形的飞秒激光加工阵列微孔的系统 - Google Patents

一种基于空间光束整形的飞秒激光加工阵列微孔的系统 Download PDF

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WO2020211750A1
WO2020211750A1 PCT/CN2020/084700 CN2020084700W WO2020211750A1 WO 2020211750 A1 WO2020211750 A1 WO 2020211750A1 CN 2020084700 W CN2020084700 W CN 2020084700W WO 2020211750 A1 WO2020211750 A1 WO 2020211750A1
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femtosecond laser
convex lens
plano
lens
processing
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PCT/CN2020/084700
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English (en)
French (fr)
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姜澜
闫剑锋
李佳群
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清华大学
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Priority to US17/489,275 priority Critical patent/US20220016729A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B23K26/0861—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane in at least in three axial directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/384—Removing material by boring or cutting by boring of specially shaped holes

Definitions

  • the present disclosure relates to a femtosecond laser processing array micro-hole system based on spatial beam shaping, and belongs to the technical field of laser applications.
  • micro-holes have extremely high requirements on the precision and quality of the micro-holes, such as size, morphology, depth-to-diameter ratio, etc., and also require high overall processing efficiency. How to achieve high-quality, low-cost, high-efficiency and large-area micro-hole Processing has become a problem in modern manufacturing.
  • Traditional machining methods such as micro-EDM, electrochemistry, micro-drilling and other technologies have certain defects in all aspects.
  • Femtosecond laser has certain reliability due to its no tool loss, high power, high precision, no heat-affected zone and recasting. It is suitable for various materials and can meet the above requirements in combination with parallel processing.
  • the existing laser beam splitting means include laser beam splitter beam splitting, prism beam splitting, diffractive element beam splitting, etc.
  • the laser beam splitter is likely to cause uneven sub-laser energy distribution after beam splitting due to the Gaussian distribution of the laser itself, which affects the uniformity of the subsequent array micro holes.
  • prism beam splitting and diffractive element beam splitting can solve the uniformity problem, it is not universal for array micro-holes of different numbers and distributions, and a variety of elements need to be configured to meet different requirements in the processing process.
  • the purpose of the present disclosure is to propose a femtosecond laser processing array micro-hole system based on spatial beam shaping.
  • array micro-holes with different numbers and structures, by designing the phase diagram loaded on the liquid crystal spatial light modulator, adjust The focal light field distribution obtained after focusing meets the different needs of array micro-hole processing.
  • the femtosecond laser processing array micro-hole system based on spatial beam shaping proposed in the present disclosure includes a femtosecond laser, half-wave plate, polarizer, concave lens, convex lens, diaphragm, mechanical shutter, phase spatial light modulator, first Plano-convex lens, reflector, second plano-convex lens, dichroic mirror, camera, processing objective lens, six-dimensional translation stage and transmission white light source; said femtosecond laser, half-wave plate, polarizer, concave lens, convex lens, diaphragm ,
  • the mechanical shutter is sequentially arranged on the first optical axis, and the femtosecond laser is controlled by the mechanical shutter to be incident on the phase-type spatial light modulator to generate spatially shaped femtosecond laser pulses; the spatially shaped femtosecond laser pulses sequentially pass through the first plano-convex lens
  • the half-wave plate and the polarizer together constitute an energy adjustment system, which freely adjusts the energy of the femtosecond laser and makes the polarization direction of the femtosecond laser emitted horizontal.
  • the phase spatial light modulator is based on the array to be processed on the sample to be processed. Phase diagram of the micro-hole, phase modulation of the femtosecond laser;
  • the concave lens, the convex lens and the diaphragm together constitute a beam expansion system of the spatial beam, which adjusts the beam waist radius of the laser spot, wherein the front focus of the concave lens and the front focus of the convex lens coincide with each other;
  • the dichroic mirror, the camera on one side of the dichroic mirror, and the transmission white light source constitute a front imaging unit, and the front imaging unit obtains a photo of the array microholes processed by the femtosecond laser;
  • the phase-type spatial light modulator, the first plano-convex lens, the second plano-convex lens and the processed objective lens together constitute a 4F system, that is: the focal length f of the first plano-convex lens is the same as the focal length f of the second plano-convex lens, and the first plano-convex lens The distance between the convex lens and the second plano-convex lens is equal to twice the focal length f, and the distance between the first plano-convex lens and the liquid crystal screen of the phase spatial light modulator is the focal length f, so that the second plano-convex lens and the processed objective lens The distance between the two is also the focal length f.
  • the light field modulated by the phase spatial light modulator 8 has no diffraction effect before reaching the processing objective lens.
  • the femtosecond laser processing array micro-hole system based on spatial beam shaping of the present disclosure can effectively avoid beam splitting inhomogeneity caused by the Gaussian distribution of the laser itself when applied to the array micro-hole processing, and realize the improvement of array micro-holes. Uniformity and quality of holes.
  • the femtosecond laser processing array micro-hole system based on spatial beam shaping of the present disclosure can freely control the number and distribution of array micro-holes by changing the phase loaded by the spatial light modulator, without the need to configure multiple components, and has a height Adjustability.
  • the femtosecond laser processing array micro-hole system of the present disclosure is based on spatial beam shaping. Through spatial light shaping, high-precision array micro-holes can be processed at one time, which improves efficiency while avoiding mechanical structures. Positioning error between micro holes.
  • FIG. 1 is a schematic structural diagram of a femtosecond laser processing array micro-hole system based on spatial beam shaping proposed in the present disclosure
  • FIG. 3 is a schematic diagram of the processing results of Example 1;
  • Example 5 is a schematic diagram of the processing result of Example 2.
  • 1 is a femtosecond laser
  • 2 is a half-wave plate
  • 3 is a polarizer
  • 4 is a concave lens
  • 5 is a convex lens
  • 6 is an aperture
  • 7 is a mechanical shutter
  • 8 is a phase spatial light modulator
  • 9 is The first plano-convex lens
  • 10 is a mirror
  • 11 is a second plano-convex lens
  • 12 is a dichroic mirror
  • 13 is an industrial-grade CCD
  • 14 is a processing objective lens
  • 15 is a sample to be processed
  • 16 is a six-dimensional translation stage
  • 17 is Transmits white light source.
  • the system of femtosecond laser processing array micro-holes based on spatial beam shaping proposed in the present disclosure has a schematic diagram of its structure as shown in Figure 1. It includes femtosecond laser 1, half-wave plate 2, polarizer 3, concave lens 4, convex lens 5, light Stop 6, mechanical shutter 7, phase spatial light modulator 8, first plano-convex lens 9, reflecting mirror 10, second plano-convex lens 11, dichroic mirror 12, camera 13, processing objective lens 14, sample to be processed 15, 6
  • the dimensional translation stage 16 and the transmitted white light source 17; the femtosecond laser 1, the half-wave plate 2, the polarizing plate 3, the concave lens 4, the convex lens 5, the diaphragm 6, and the mechanical shutter 7 are sequentially arranged on the first optical axis, passing
  • the mechanical shutter 7 controls the femtosecond laser to be incident on the phase spatial light modulator 8 to generate spatially shaped femtosecond laser pulses; the spatially shaped femtosecond laser pulses sequentially pass through
  • the half-wave plate 2 and the polarizer 3 jointly constitute an energy adjustment system, which freely adjusts the energy of the femtosecond laser 1 and makes the polarization direction of the emitted femtosecond laser horizontal.
  • the phase spatial light modulator 8 is based on the sample to be processed Phase diagram of the array microholes to be processed on 15 to perform phase modulation on the femtosecond laser;
  • the concave lens 4, the convex lens 5 and the diaphragm 6 together constitute a beam expansion and shaping system of the spatial beam, wherein the front focus of the concave lens 4 and the front focus of the convex lens 5 coincide with each other;
  • the dichroic mirror 12, the camera 13 on the side of the dichroic mirror 12, and the transmission white light source 17 constitute a front imaging unit, and the front imaging unit obtains a photo of the array microholes processed by a femtosecond laser;
  • the phase spatial light modulator 8, the first plano-convex lens 9, the second plano-convex lens 11, and the processed objective lens 14 together constitute a 4F system, that is, the focal length f of the first plano-convex lens 9 and the focal length f of the second plano-convex lens 11
  • the distance between the first plano-convex lens 9 and the second plano-convex lens 11 is equal to twice the focal length f
  • the distance between the first plano-convex lens 9 and the liquid crystal screen of the phase spatial light modulator 8 is the focal length f
  • the distance between the second plano-convex lens 11 and the processing objective lens 14 is also the focal length f.
  • the parameters of the femtosecond laser are: the femtosecond laser pulse repetition frequency is 10-1000 Hz, the single pulse energy is controlled at 20-200 ⁇ J, and the beam waist diameter before laser focusing is controlled at 4-12 mm.
  • the working principle of the femtosecond laser processing array micro-hole system based on spatial beam shaping proposed in the present disclosure is: according to the phase of the array micro-hole, the phase-type spatial light modulator 8 is phase set.
  • the loading phase of the spatial light modulator is set to a specific phase that splits a single laser beam into multiple beams.
  • the number of pulses can be easily adjusted by setting the laser pulse repetition frequency and the control of the mechanical shutter to control the processing of micro-holes.
  • the range of single pulse energy is set to ensure that the laser energy density does not exceed the threshold of the spatial light modulator and can reach the threshold of the processed material. By adjusting the beam waist before focusing, it is easy to adjust the size of the single hole of the array micro-hole.
  • the femtosecond laser used is a Coherent Ti:Sapphire laser, with a center wavelength of 800 nm, a pulse width of 35 fs, a repetition frequency of up to 1000 Hz, a maximum single pulse energy of 7 mJ, and a Gaussian optical field distribution.
  • the spatial light modulator (SLM) used is the Pluto-2 model of Holoeye.
  • the repeat positioning accuracy of the x, y, and z axes are ⁇ 0.5 ⁇ m, ⁇ 0.5 ⁇ m and ⁇ 0.2 ⁇ m, respectively).
  • the camera used is an industrial-grade CCD.
  • Example 1 Femtosecond laser space shaping is used to obtain regular hexagonal array microholes.
  • the specific processing steps of this embodiment 1 are as follows: turn on the femtosecond laser 1, wait for 20-30 minutes, and then the light output of the femtosecond laser is stable, put the optical path components into the optical platform in the order of Figure 1, and then collimate the femtosecond laser Adjust so that it can finally illuminate the sample without focusing.
  • the focal plane of the processed objective lens 14 is determined at the end of the processing optical path, and then the phase spatial light modulator 8 is loaded with the phase of the array micro-holes corresponding to the regular hexagonal distribution, as shown in Figure 2 Shown. Then use the combination of half-wave plate 2 and polarizer 3 to adjust the energy of the femtosecond laser to 100 ⁇ J, and then transport the light field to the processing objective lens 14 through the "4F system" without diffraction, and focus it on the six-dimensional translation stage. 16 on the surface of the sample 15 to be processed. At the same time, with the aid of the transmission light source 17, the camera 13 performs imaging observation.
  • Example 2 Using femtosecond laser space shaping to obtain regular octagonal array microholes
  • the specific processing steps of this embodiment 2 are as follows: Turn on the femtosecond laser 1, wait for 20-30 minutes, and then the femtosecond laser emits stable light, put the optical path components into the optical platform in the order shown in Figure 1, and then collimate the femtosecond laser Adjust so that it can finally illuminate the sample without focusing. Set the femtosecond laser pulse repetition frequency of the femtosecond laser 1 to 200 Hz, and control the beam waist diameter before laser focusing to 7 mm.
  • the focal plane of the processed objective lens 14 is determined at the end of the processing optical path, and then the phase spatial light modulator 8 is loaded with the phase of the array micro-holes corresponding to the regular octagonal distribution, as shown in Figure 4 Shown. Then use the combination of half-wave plate 2 and polarizer 3 to adjust the femtosecond laser energy to 100 ⁇ J, and then transport the light field through the "4F system" without diffraction to the top of the processing objective lens 14, and focus it on the six-dimensional translation stage 16. 15 surface of the sample to be processed. At the same time, with the aid of the transmission light source 17, the camera 13 performs imaging observation.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
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Abstract

一种基于空间光束整形的飞秒激光加工阵列微孔的系统。该系统利用空间光调制器，通过设计不同的相位，将单束飞秒激光整形成为具有特定空间分布的多光束阵列光场，调整激光重复频率、激光束腰直径和激光脉冲能量，最后通过光学器件搭建光路将整形完的飞秒激光聚焦到样品表面，实现在多种材料上的高质量、无接触、高效率、大面积的阵列微孔加工，具有高度可重复性与灵活性；应用于阵列微孔加工时，有效避免由于激光本身高斯分布所引起的分束不均一性，提高阵列微孔的均一性与质量；通过空间光调制器所加载相位的变化可以自由调控阵列微孔的数量与分布，无需配置多种元件，具有高度可调节性。

Description

一种基于空间光束整形的飞秒激光加工阵列微孔的系统
相关申请的交叉引用
本申请要求清华大学、北京理工大学于2019年04月15日提交的、申请名称为“一种基于空间光束整形的飞秒激光加工阵列微孔的系统”的、中国专利申请号“201910299942.7”的优先权。
技术领域
本公开涉及一种基于空间光束整形的飞秒激光加工阵列微孔的系统，属于激光应用技术领域。
背景技术
近年来将激光应用到微型传感器制造，微型芯片封装等领域中时，经常需要加工各种形状与数量的阵列微孔。这些阵列微孔对微孔的精度与质量如尺寸形貌，深径比等要求极高，同时也需要较高的整体加工效率，如何实现阵列微孔高质量、低成本、高效率大面积的加工成为了现代制造的一个难题。传统的加工方法如微细电火花、电化学、微钻等技术在各方面都有一定缺陷。而飞秒激光因其无工具损耗，高功率，高精度，无热影响区与重铸等特点具有一定的可靠性，且适用于各种材料，结合并行加工的方式可以达到上述要求。
但是在现有加工技术条件下，并行加工大多通过将激光分束来实现，现有激光分束手段包括激光分束器分束、棱镜分束、衍射元件分束等。其中激光分束器由于激光本身的高斯分布容易导致分束后的子激光能量分布不均匀，影响后续阵列微孔的均一性。而棱镜分束与衍射元件分束虽然可以解决均一性问题，但是针对于不同数量与分布的阵列微孔不具有普适性，需要配置多种元件来应对加工过程中的不同需求。
公开内容
本公开的目的是提出一种基于空间光束整形的飞秒激光加工阵列微孔的系统，对多种不同数量与结构的阵列微孔，通过设计加载在液晶空间光调制器上的相位图，调整聚焦后所得到的焦点光场分布，实现阵列微孔加工的不同需求。
本公开提出的基于空间光束整形的飞秒激光加工阵列微孔的系统，包括飞秒激光器、半波片、偏振片、凹透镜、凸透镜、光阑、机械快门、相位型空间光调制器、第一平凸透镜、反射镜、第二平凸透镜、二向色镜、照相机、加工物镜、六维平移台和透射白光光源； 所述的飞秒激光器、半波片、偏振片、凹透镜、凸透镜、光阑、机械快门依次设置在第一光轴上，通过机械快门控制飞秒激光入射到相位型空间光调制器上，产生空间整形飞秒激光脉冲；该空间整形飞秒激光脉冲依次经过第一平凸透镜、反射镜、第二平凸透镜、二向色镜后入射到加工物镜上方，经由加工物镜聚焦后照射在位于六维平移台的待加工样品上，在待加工样品上加工阵列微孔；其中：
所述的半波片与偏振片共同构成能量调节系统，对飞秒激光器的能量进行自由调节，并使出射飞秒激光的偏振方向水平，相位型空间光调制器根据待加工样品上待加工阵列微孔的相位图，对飞秒激光进行相位调制；
所述的凹透镜、凸透镜和光阑共同构成空间光束的扩束系统，对激光光斑束腰半径进行调整，其中凹透镜的前焦点与凸透镜的前焦点互相重合；
所述的二向色镜，以及位于二向色镜一侧的照相机和透射白光光源构成正面成像单元，由正面成像单元得到飞秒激光加工的阵列微孔照片；
所述的相位型空间光调制器、第一平凸透镜、第二平凸透镜和加工物镜一起构成4F系统，即：第一平凸透镜的焦距f与第二平凸透镜的焦距f相同，且第一平凸透镜与第二平凸透镜之间的间距等于该焦距f的两倍，并使第一平凸透镜与相位型空间光调制器液晶屏之间的距离为焦距f，使第二平凸透镜与加工物镜之间的距离也为焦距f，通过该4F系统，使经过相位型空间光调制器8调制的光场在到达加工物镜之前无衍射效应。
本公开提出的基于空间光束整形的飞秒激光加工阵列微孔的系统，其优点是：
1、本公开的基于空间光束整形的飞秒激光加工阵列微孔的系统，在应用于阵列微孔加工时，可以有效避免由于激光本身高斯分布所引起的分束不均一性，实现提高阵列微孔的均一性与质量。
2、本公开的基于空间光束整形的飞秒激光加工阵列微孔的系统，通过空间光调制器所加载相位的变化，可以自由调控阵列微孔的数量与分布，无需配置多种元件，具有高度可调节性。
3、本公开基于空间光束整形的飞秒激光加工阵列微孔的系统，通过空间光整形，可以一次性加工出高精度的阵列微孔，提高效率的同时，也可避免由于机械结构带来的微孔之间的定位误差。
本公开附加的方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本公开的实践了解到。
附图说明
本公开上述的和/或附加的方面和优点从下面结合附图对实施例的描述中将变得明显 和容易理解，其中：
图1为本公开提出的基于空间光束整形的飞秒激光加工阵列微孔的系统的结构示意图；
图2为本公开实施例1中在空间光调制器上所加载的相位图；
图3为实施例1加工结果的示意图；
图4为本公开实施例2中在空间光调制器上所加载的相位图；
图5为实施例2加工结果的示意图。
图1中，1是飞秒激光器，2是半波片，3是偏振片，4是凹透镜，5是凸透镜，6是光阑，7是机械快门，8是相位型空间光调制器，9是第一平凸透镜，10是反射镜，11是第二平凸透镜，12是二向色镜，13是工业级CCD，14是加工物镜，15是待加工样品，16是六维平移台，17是透射白光光源。
具体实施方式
下面详细描述本公开的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，旨在用于解释本公开，而不能理解为对本公开的限制。
下面参考附图描述本公开实施例的基于空间光束整形的飞秒激光加工阵列微孔的系统。
本公开提出的基于空间光束整形的飞秒激光加工阵列微孔的系统，其结构示意图如图1所示，包括飞秒激光器1、半波片2、偏振片3、凹透镜4、凸透镜5、光阑6、机械快门7、相位型空间光调制器8、第一平凸透镜9、反射镜10、第二平凸透镜11、二向色镜12、照相机13、加工物镜14、待加工样品15、六维平移台16和透射白光光源17；所述的飞秒激光器1、半波片2、偏振片3、凹透镜4、凸透镜5、光阑6、机械快门7依次设置在第一光轴上，通过机械快门7控制飞秒激光入射到相位型空间光调制器8上，产生空间整形飞秒激光脉冲；该空间整形飞秒激光脉冲依次经过第一平凸透镜9、反射镜10、第二平凸透镜11、二向色镜12后入射到加工物镜14上方，经由加工物镜14聚焦后照射在位于六维平移台16的待加工样品15上，在待加工样品15上加工阵列微孔；其中：
所述的半波片2与偏振片3共同构成能量调节系统，对飞秒激光器1的能量进行自由调节，并使出射飞秒激光的偏振方向水平，相位型空间光调制器8根据待加工样品15上待加工阵列微孔的相位图，对飞秒激光进行相位调制；
所述的凹透镜4、凸透镜5和光阑6共同构成空间光束的扩束整形系统，其中凹透镜4的前焦点与凸透镜5的前焦点互相重合；
所述的二向色镜12，以及位于二向色镜12一侧的照相机13和透射白光光源17构成正面成像单元，由正面成像单元得到飞秒激光加工的阵列微孔照片；
所述的相位型空间光调制器8、第一平凸透镜9、第二平凸透镜11和加工物镜14一起构成4F系统，即：第一平凸透镜9的焦距f与第二平凸透镜11的焦距f相同，且第一平凸透镜9与第二平凸透镜11之间的间距等于该焦距f的两倍，并使第一平凸透镜9与相位型空间光调制器8液晶屏之间的距离为焦距f，使第二平凸透镜11与加工物镜14之间的距离也为焦距f，通过该4F系统，使经过相位型空间光调制器8调制的光场在到达加工物镜14之前无衍射效应。
上述系统中，所述的飞秒激光器的各参数为：飞秒激光脉冲重复频率为10-1000Hz，单个脉冲能量控制在20-200μJ，激光聚焦前束腰直径控制在4-12mm。
本公开提出的基于空间光束整形的飞秒激光加工阵列微孔的系统，其工作原理是：根据阵列微孔的相位，对相位型空间光调制器8进行相位设置。其中，设定空间光调制器加载相位为将单束激光分束成多束光束的特定相位，通过设置的激光脉冲重复频率结合机械快门的控制可以方便调节脉冲个数，以此控制加工微孔的深度等参数。通过设置单脉冲能量的范围来保证激光能量密度不超过空间光调制器阈值的同时能够达到加工材料的阈值。通过调节聚焦前的光束束腰以便于调整阵列微孔单孔的尺寸大小。利用设定的参数产生空间整形加工阵列微孔用飞秒激光光场，将飞秒激光光场聚焦在待加工样品表面，控制机械快门时间实现阵列微孔的加工。
下面结合附图以及实例对本公开作进一步的说明。
本公开的实施例中，使用的飞秒激光器为相干公司(Coherent)的钛蓝宝石激光器，中心波长800nm，脉冲宽度35fs，重复频率最高1000Hz，最大单脉冲能量为7mJ，光场分布为高斯分布。使用的空间光调制器(SLM)为Holoeye公司的Pluto-2型号。使用的六维平移台，其中的x、y和z轴的重复定位精度分别为±0.5μm、±0.5μm和±0.2μm)。使用的照相机为工业级CCD。
实施例1：以飞秒激光空间整形加工获得正六边形分布的阵列微孔。
本实施例1的具体加工步骤如下：打开飞秒激光器1，等待20-30分钟后飞秒激光器出光稳定，将各光路元件依按图1顺序置入光学平台，之后将飞秒激光进行准直调节使其在未聚焦情况下最后能照射在样品上。设定飞秒激光器1的飞秒激光脉冲重复频率为100Hz，激光聚焦前束腰直径控制在7mm。在六维平移台16的控制程序运行下，在加工光路末端确定完加工物镜14的焦平面，再在相位型空间光调制器8上加载对应正六边形分布的阵列微孔相位，如图2所示。接着利用半波片2和偏振片3组合，将飞秒激光的能量调节为100μJ，之后将该光场通过“4F系统”无衍射地搬运到加工物镜14上方，聚焦到固定在六维平移 台16上的待加工样品15表面。同时借助透射光源17，照相机13进行成像观察。通过控制机械快门7设置开启时间为1000ms，即每个位置加工100个脉冲，之后开启机械快门即可实现该处阵列微孔的加工，所得到的阵列微孔加工结果的示意图如图3所示。然后操作六维平移台16实现待加工样品位置的变动，进行后续阵列微孔的加工。
实施例2以飞秒激光空间整形加工获得正八边形分布的阵列微孔
本实施例2的具体加工步骤如下：打开飞秒激光器1，等待20-30分钟后飞秒激光器出光稳定，将各光路元件依按图1顺序置入光学平台，之后将飞秒激光进行准直调节使其在未聚焦情况下最后能照射在样品上。设定飞秒激光器1的飞秒激光脉冲重复频率为200Hz，激光聚焦前束腰直径控制在7mm。在六维平移台16的控制程序运行下，在加工光路末端确定完加工物镜14的焦平面，再在相位型空间光调制器8上加载对应正八边形分布的阵列微孔相位，如图4所示。接着利用半波片2和偏振片3组合，将飞秒激光能量调节为100μJ，之后将该光场通过“4F系统”无衍射地搬运到加工物镜14上方，聚焦到固定在六维平移台16上的待加工样品15表面。同时借助透射光源17，照相机13进行成像观察。通过控制机械快门设置开启时间为500ms，即每个位置加工100个脉冲，之后开启机械快门7，即可实现该处阵列微孔的加工，所得到的阵列微孔加工结果的示意图如图5所示。然后操作六维平移台16实现待加工样品位置的变动，进行后续阵列微孔的加工。
上述实施例为本公开较佳的实施方式，但本公开的实施方式并不受上述实施例的限制，其他的任何未背离本公开的精神实质与原理下所作的改变、修饰、替代、组合、简化，均应为等效的置换方式，都包含在本公开的保护范围之内。

Claims (2)

  1. 一种基于空间光束整形的飞秒激光加工阵列微孔的系统，其特征在于，所述系统包括：飞秒激光器、半波片、偏振片、凹透镜、凸透镜、光阑、机械快门、相位型空间光调制器、第一平凸透镜、反射镜、第二平凸透镜、二向色镜、照相机、加工物镜、六维平移台和透射白光光源；所述的飞秒激光器、半波片、偏振片、凹透镜、凸透镜、光阑、机械快门依次设置在第一光轴上，通过所述机械快门控制飞秒激光入射到所述相位型空间光调制器上，产生空间整形飞秒激光脉冲；所述空间整形飞秒激光脉冲依次经过所述第一平凸透镜、反射镜、第二平凸透镜、二向色镜后入射到所述加工物镜上方，经由所述加工物镜聚焦后照射在位于所述六维平移台的待加工样品上，在所述待加工样品上加工阵列微孔；其中：
    所述的半波片与偏振片共同构成能量调节系统，对飞秒激光器的能量进行自由调节，并使出射飞秒激光的偏振方向水平，所述相位型空间光调制器根据所述待加工样品上待加工阵列微孔的相位图，对飞秒激光进行相位调制；
    所述的凹透镜、凸透镜和光阑共同构成空间光束的扩束系统，对激光光斑束腰半径进行调整，其中所述凹透镜的前焦点与所述凸透镜的前焦点互相重合；
    所述的二向色镜，以及位于所述二向色镜一侧的所述照相机和所述透射白光光源构成正面成像单元，由所述正面成像单元得到飞秒激光加工的阵列微孔照片；
    所述的相位型空间光调制器、第一平凸透镜、第二平凸透镜和加工物镜一起构成4F系统，即：所述第一平凸透镜的焦距f与所述第二平凸透镜的焦距f相同，且所述第一平凸透镜与所述第二平凸透镜之间的间距等于该焦距f的两倍，并使所述第一平凸透镜与相位型空间光调制器液晶屏之间的距离为焦距f，使所述第二平凸透镜与所述加工物镜之间的距离也为焦距f，通过所述4F系统，使经过所述相位型空间光调制器调制的光场在到达所述加工物镜之前无衍射效应。
  2. 如权利要求1所述的基于空间光束整形的飞秒激光加工阵列微孔的系统，其特征在于，所述的飞秒激光器的各参数为：飞秒激光脉冲重复频率为10-1000Hz，单个脉冲能量控制在20-200μJ，激光聚焦前束腰直径控制在4-12mm。
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