WO2020200814A1 - Procédé pour l'agencement d'un dispositif optique et d'un dispositif de caméra - Google Patents

Procédé pour l'agencement d'un dispositif optique et d'un dispositif de caméra Download PDF

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Publication number
WO2020200814A1
WO2020200814A1 PCT/EP2020/057625 EP2020057625W WO2020200814A1 WO 2020200814 A1 WO2020200814 A1 WO 2020200814A1 EP 2020057625 W EP2020057625 W EP 2020057625W WO 2020200814 A1 WO2020200814 A1 WO 2020200814A1
Authority
WO
WIPO (PCT)
Prior art keywords
image
optical device
target position
devices
recording device
Prior art date
Application number
PCT/EP2020/057625
Other languages
German (de)
English (en)
Inventor
Andreas Kugler
Martin Winkler
Alexander Fischer
Istvan Denes
Ulrich Seger
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO2020200814A1 publication Critical patent/WO2020200814A1/fr

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/62—Optical apparatus specially adapted for adjusting optical elements during the assembly of optical systems
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/023—Mountings, adjusting means, or light-tight connections, for optical elements for lenses permitting adjustment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue

Definitions

  • the invention relates to a method for arranging an optical device to form an image-recording device that interacts with the optical device, as can be used in particular as a component of a driver assistance system in a vehicle.
  • the invention also relates to a method for producing a printed circuit board with a plurality of circuit carriers and a camera device with an optical device and an image-recording device.
  • the optical device is a lens system and the image recording device is an imager, which together form a component of a camera, for example a camera in a driver assistance system in a vehicle.
  • the optical device When assembling the image-generating parts of the camera, it is essential that the optical device is in a defined position for the image-taking
  • Position facility The defined position is important because the recorded images should have a certain quality so that their image data can be processed, for example, in the context of a driver assistance system. For this purpose, it is necessary to move the lens system in relation to the light-sensitive surface of the imager both in the three spatial axes and in relation to three tilt axes which are spatially perpendicular to one another to position. This is done with the one known in the cited document
  • the method providing for the quality of the image generated by the lean to be compared with a test image or image data of a test image.
  • the optical device is positioned or fixed in relation to the image-receiving device, in particular, by means of a UV-curing adhesive, for example, although not yet
  • the lens system can be moved to the required target position.
  • the device for the image-recording device is required because of the different tolerances or properties of the imager and the lens system, which are largely production-related.
  • a further method with the features of the preamble of claim 1 is also known from DE 10 2016 221 664 A1. Although it is mentioned there that production-related tolerances of the components are taken into account, these production-related tolerances only cause a
  • Pre-positioning of a component is adapted to its existing tolerances.
  • an active setting process of the devices (with evaluation of image data) to one another is also provided.
  • the method according to the invention for arranging an optical device to form an image-recording device interacting with the optical device and having the features of claim 1 has the advantage that it can be used without the active alignment process provided in the production line when the optical device is assembled with the image-recording device which requires an active evaluation of data from the imager. As a result, the positioning and fixing method according to the invention takes place particularly quickly and therefore inexpensively.
  • the invention is based on the idea of reducing production-related tolerances of both the optical device and the image-recording device
  • the method according to the invention also makes it possible in principle to be able to make pairings between the individual devices with knowledge of the production-related tolerances of both the optical device and the image-recording device, for example in such a way that the production-related tolerances of the respective device are at least partially equalized.
  • This has the advantage that the target positions of the optical device in relation to the image-recording device change only relatively little during the ongoing production.
  • this also has the advantage that, for example, the amount of auxiliary materials, in particular adhesives, which on the one hand serves to fix the two devices to one another in the cured state and on the other hand enables the desired tolerance compensation to achieve the target position, can be reduced.
  • the teaching of the invention according to claim 1 therefore proposes that the target position of the two devices is determined using an algorithm taking into account the first and second manufacturing tolerances of the two devices, and that an actual position of the Optical device for the image-recording device is detected by means of a measuring system in order to set the target position by means of a handling device.
  • the measuring system thus serves to control or ensure the desired position of the optical device in relation to the image-recording device determined by means of the algorithm on the basis of the recorded actual position.
  • the target position is a position defined by three perpendicular spatial axes and three perpendicular tilting axes .
  • An auxiliary material in particular a heat-conducting adhesive or a solder, is preferably used to fix the optical device to the image-recording device in the desired position, the auxiliary material not yet being used
  • cured state allows a positioning of the two devices to each other within certain tolerances. This makes it possible, in particular, to use one and the same amount of auxiliary material to enable different positioning of the optical device in relation to the image-recording device in order to compensate for the manufacturing-related tolerances. There are also no, for example, a certain thickness or the like due to the auxiliary. having spacer elements or the like. required. There is also no mechanical connection process in the sense of a screw connection or the like. required between facilities. In particular, if a thermally conductive adhesive is used as an auxiliary material or a solder, an improved heat transfer of the elements of the devices for
  • Allows circuit carrier which on the one hand reduces thermal stresses, and on the other hand also counteracts expansion of the components through temperature compensation, which could possibly deteriorate the quality of recorded images due to the changed geometry.
  • auxiliary material which, on the one hand, enables the components or devices to be aligned with one another in the not yet hardened state of the auxiliary substance, and which, on the other hand, ensures the required firm connection. It can also be provided in a further development of the fixation, in addition to the auxiliary substance, solid particles or elements or the like. to be used to set the target position. This is particularly advantageous if the auxiliary would otherwise have to be applied in a relatively large layer thickness or in order to optimize other specific properties, for example heat transfer.
  • the method according to the invention which has basically been described so far, assumes that the algorithm uses the tolerances of the two devices to determine an optimal target position.
  • other circumstances can possibly also influence the quality of the images of the image-recording device, for example the accuracy with which the desired position can be maintained by appropriate devices. For example, results in a
  • a further preferred method provides that the optical device and the image recording device after their positioning and fixing to a camera unit or the like. be completed that preferably randomly the quality of the images generated by the image recording unit is assessed, and that based on the assessed quality of the images generated and taking into account the first and second tolerances of the two devices and the actual position of the two devices to each other of the camera unit examined or similar the algorithm for determining the target position is adapted in the case of devices that are not yet arranged in relation to one another.
  • the invention also comprises a method for producing a printed circuit board panel with a plurality of circuit carriers, each circuit carrier having at least one optical device and one
  • Such a circuit board benefit has the advantage that under a production-engineering perspective, without having to evaluate the data from the image-recording devices, they may not even be in this state are connected to corresponding components, the positioning of the optical device to the image receiving device is made possible.
  • image-receiving device is connected to the circuit carrier, preferably using a further adhesive or solder layer, that the image-receiving device is then connected to an electrically conductive structure of the circuit carrier, and that the optical device is then positioned and fixed to the image-receiving device.
  • the invention further comprises a camera device comprising an optical device and an image-recording device, the two devices being positioned and fixed to one another according to a method according to the invention.
  • the optical device comprises a lens system with at least one lens, which is connected to a circuit carrier by means of a lens holder connected to the at least one lens with the interposition of an auxiliary material, as well as with an image-recording device designed as an imager, which is also connected to the
  • Circuit carrier is connected.
  • FIG. 1 shows a partial area of a circuit carrier with an image-recording device and optical device arranged thereon in a simplified longitudinal section.
  • FIG. 2 shows a flowchart to explain the essential method steps for positioning and fixing the optical device for the image-recording device on the circuit carrier according to FIG. 1,
  • FIG. 3 shows a schematic representation of a plurality of
  • Circuit carriers having printed circuit board panels
  • FIG. 4 shows a further flow chart to explain the essential steps in the production of the printed circuit board panel according to FIG. 3.
  • a circuit carrier 10 is a detail in the form of a
  • the circuit carrier 10 On the upper side of the circuit carrier 10, the latter has an imager 12 as an image-recording device 14 and an electrically conductive structure 16, for example in the form of conductor tracks or the like.
  • the electrically conductive structure 16 is preferably also provided on the underside and, if necessary, in intermediate layers of the circuit carrier 10, the individual structures 16 using vias or the like in a known manner. can be connected.
  • the imager 12 is connected to the circuit carrier 10 in the area of the electrically conductive structure 16 with an auxiliary material 18 interposed, in particular in the form of an adhesive or solder layer. Furthermore, the imager 12 is exemplarily above
  • Wire bond connections 20 are connected to other regions of the electrically conductive structure 16.
  • the imager 12 is in operative connection with an electronic circuit or the like via the electrically conductive structure 16. connected, which the electrical pulses generated by the imager 12 due to the incidence of light in images or
  • Image data transformed (not shown). As this process is known per se and is not essential to the invention, will not be discussed further in this regard.
  • imager 12 is an optical one in operative connection therewith
  • the optical device 22 comprises, for example, a one-part or multi-part lens holder 24 which is designed to attach at least one lens 25, in the illustrated embodiment three lenses 25, of a lens system 26.
  • the at least one lens 25 or the lens system 26 can, for example, have been connected to the lens holder 24 by overmolding when the lens holder 24 is designed as a plastic injection-molded part.
  • the exemplary cup-shaped lens holder 24 has on the side facing the circuit carrier 10 a contact surface 30 that runs radially around a longitudinal axis 28 and is connected to the top of the circuit carrier 10 with an auxiliary material 32 with a thickness d in between.
  • the auxiliary material 32 which is preferably designed as a UV-curing adhesive or as a solder layer, enables positioning or relative movement of the optical device 22 or the lens system 26 to the surface of the imager 12 in a not yet cured or solid state, and on the other hand serves in the cured state of the auxiliary material 32 of the fixation of the optical
  • the nominal position SP of the optical device 22 to the imager 12 or to the image recording device 14 is characterized by nominal positions in three perpendicular spatial axes x, y and z and about three tilting axes k x , k y and k z arranged perpendicular to one another.
  • the target position SP of the optical device 22 relative to the imager 12 results from the fact that the imager 12 or the image-recording device 14
  • Image data are to be generated which, for example, map the images of the surroundings projected by the lens system 26 onto the imager 12 as truthfully as possible or must have a certain minimum quality.
  • This against the background that the elements described so far are preferably part of a camera 35, which can be used, for example, in a driver assistance system of a vehicle to record the environment.
  • Device 22 have manufacturing-related tolerances Ti 2 or T22, which occur during the manufacture of optical device 22 or imager 12
  • these tolerances T12 and T22 can be geometric deviations from the ideal dimensions of the components, or, for example, functional tolerances, e.g. with regard to the focal position of the lens system 26.
  • Device 14 or for imager 12 has a manufacturing device in addition to a handling device 34, shown only schematically, which is used for this purpose
  • the manufacturing apparatus comprises a control device 38, or the measurement system 36 is disposed in operative connection with the handling device 34 to the target position SP of the optical device 22 to the image receiving means 14 on the basis of which is the present position detected by the measuring system 36 P the optical device 22 to set.
  • the control device 38 includes an algorithm 40 which, in particular, knowing the tolerances T12 and T22 of the image recording device 12 or the optical device 22, which are fed to the control device 38 or the algorithm 40 as input variable, the required target position SP of the optical Device 22 for image-recording device 14 is calculated in order to ensure the desired quality of the image data or images that are generated by imager 12.
  • the control device 38 thus calculates the target position SP and controls the handling device 34 in accordance with the detected actual position P ist in order to control the optical device 22 or the
  • the control device 38 controls a Dosing device 42 for dosing a certain amount of auxiliary material 32.
  • the handling device 34 can use the optical
  • Position device 22 in target position SP Compliance with the target position SP must be guaranteed until the auxiliary material 32 has hardened.
  • the algorithm 40 can also modify this via a correction value KW that not only the tolerances Ti 2 and T22 of current optical devices 22 or image recording devices 12 are taken into account when calculating the target position SP, but also other influences that lead to a deviation in the quality of the image data generated in cameras 50 that have already been manufactured have led.
  • the tolerances Ti 2 and T 22 are fed to the algorithm 40 as an input variable.
  • the algorithm 40 possibly taking into account a correction value KW, calculates the target position SP of a special optical device 22 for a special image-recording device 14 on the basis of the tolerances Ti 2 and T 22 and possibly the
  • Metering device 42 is controlled in order to meter a certain amount of auxiliary material 32, as well as the handling device 34 for positioning the optical device 22 in the desired position SP.
  • the measuring device 36 is switched into operative connection with the handling device 34 such that the target position SP between the devices 14, 22 can be maintained with the desired tolerances.
  • 3 shows a printed circuit board 50 which comprises a plurality of circuit carriers 10 as described above, which are arranged next to one another without gaps within the printed circuit board 50, and which, after their manufacture, are separated or isolated from one another, in particular by cutting or sawing will.
  • an image-recording device 14 or an imager 12 as well as an optical device 22 can already be seen in the area of each circuit carrier 10.
  • a first step 201 the image-recording device 14 or the imager 12 is interposed with the auxiliary material 18 or solder with the respective
  • Circuit carrier 10 are connected. Then, in a second step 202, the connections between the respective imager 12 or the respective image-recording device 14 and the respective
  • a fourth step 204 the individual circuit carriers 10 are separated from the printed circuit board 50.
  • a fifth step 205 further equipping or assembly of the takes place
  • Circuit carrier 10 to a camera 50.
  • circuit carrier 10 and the image-recording device 14 and the optical device 22 can be modified or modified in many ways without deviating from the inventive concept.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Studio Devices (AREA)

Abstract

L'invention concerne un procédé pour l'agencement d'un dispositif optique (22) par rapport à un dispositif récepteur d'image (14) coopérant avec le dispositif optique (22) sur un support de circuit (10), dans lequel le dispositif optique (22) est positionné dans une position de consigne (SP) par rapport au dispositif récepteur d'image (14) et les deux dispositifs (14, 22) sont ensuite fixés l'un par rapport à l'autre dans la position de consigne (SP), le dispositif optique (22) présentant des premières tolérances liées à la fabrication (T22) et le dispositif de réception d'image (14) présentant des deuxièmes tolérances liées à la fabrication (T14), lesquelles sont prises en compte lors du positionnement des deux dispositifs (14, 22) dans la position de consigne (SP).
PCT/EP2020/057625 2019-04-03 2020-03-19 Procédé pour l'agencement d'un dispositif optique et d'un dispositif de caméra WO2020200814A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102019204761.0A DE102019204761A1 (de) 2019-04-03 2019-04-03 Verfahren zur Anordnung einer optischen Einrichtung und Kameraeinrichtung
DE102019204761.0 2019-04-03

Publications (1)

Publication Number Publication Date
WO2020200814A1 true WO2020200814A1 (fr) 2020-10-08

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Application Number Title Priority Date Filing Date
PCT/EP2020/057625 WO2020200814A1 (fr) 2019-04-03 2020-03-19 Procédé pour l'agencement d'un dispositif optique et d'un dispositif de caméra

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Country Link
DE (1) DE102019204761A1 (fr)
WO (1) WO2020200814A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220388094A1 (en) * 2021-06-03 2022-12-08 Ii-Vi Delaware, Inc. Mechanical Mount for Stationary, Actively-Cooled Lenses in High Power Laser Material Processing Head

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Publication number Priority date Publication date Assignee Title
KR20100013908A (ko) * 2008-08-01 2010-02-10 삼성전자주식회사 카메라 모듈 조립 장치 및 방법
DE102014220519A1 (de) 2014-10-09 2016-04-14 Robert Bosch Gmbh Verfahren zur Positionierung eines bildaufnehmenden Elements zu optischen Einrichtung und Verwendung des Verfahrens
JP2017107083A (ja) * 2015-12-10 2017-06-15 アキム株式会社 塗布装置、レンズ駆動モジュール組み立て装置、塗布方法
WO2017198395A1 (fr) * 2016-05-18 2017-11-23 Robert Bosch Gmbh Module de caméra pour un véhicule
DE102016221664A1 (de) 2016-11-04 2018-05-09 Siemens Aktiengesellschaft Gehäuseanordnung für eine Turbomaschine, sowie Verfahren zur Montage einer derartigen Gehäuseanordnung

Family Cites Families (5)

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Publication number Priority date Publication date Assignee Title
DE102005006756A1 (de) * 2005-02-15 2006-08-17 Robert Bosch Gmbh Bildaufnahmesystem
DE102010030960B4 (de) * 2010-07-06 2020-12-10 Robert Bosch Gmbh Verfahren zur Herstellung eines schwingungsgedämpften Bauteils
DE102014221757A1 (de) * 2014-10-27 2016-04-28 Robert Bosch Gmbh Verfahren und Vorrichtung zum Positionieren einer optischen Einrichtung zu einem bildaufnehmenden Element
DE102016221464A1 (de) * 2016-11-02 2018-05-03 Karlsruher Institut für Technologie Verfahren zur Herstellung eines optischen Systems und optisches System
DE102017214072A1 (de) * 2017-08-11 2019-02-14 Robert Bosch Gmbh Verfahren zur Ausrichtung eines Bildsensors zu einem Objektiv

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100013908A (ko) * 2008-08-01 2010-02-10 삼성전자주식회사 카메라 모듈 조립 장치 및 방법
DE102014220519A1 (de) 2014-10-09 2016-04-14 Robert Bosch Gmbh Verfahren zur Positionierung eines bildaufnehmenden Elements zu optischen Einrichtung und Verwendung des Verfahrens
JP2017107083A (ja) * 2015-12-10 2017-06-15 アキム株式会社 塗布装置、レンズ駆動モジュール組み立て装置、塗布方法
WO2017198395A1 (fr) * 2016-05-18 2017-11-23 Robert Bosch Gmbh Module de caméra pour un véhicule
DE102016221664A1 (de) 2016-11-04 2018-05-09 Siemens Aktiengesellschaft Gehäuseanordnung für eine Turbomaschine, sowie Verfahren zur Montage einer derartigen Gehäuseanordnung

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220388094A1 (en) * 2021-06-03 2022-12-08 Ii-Vi Delaware, Inc. Mechanical Mount for Stationary, Actively-Cooled Lenses in High Power Laser Material Processing Head

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Publication number Publication date
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