WO2020200464A1 - Procédé de fabrication d'un élément d'antenne - Google Patents

Procédé de fabrication d'un élément d'antenne Download PDF

Info

Publication number
WO2020200464A1
WO2020200464A1 PCT/EP2019/058546 EP2019058546W WO2020200464A1 WO 2020200464 A1 WO2020200464 A1 WO 2020200464A1 EP 2019058546 W EP2019058546 W EP 2019058546W WO 2020200464 A1 WO2020200464 A1 WO 2020200464A1
Authority
WO
WIPO (PCT)
Prior art keywords
support element
contact portion
electrical conduction
metallized
antenna
Prior art date
Application number
PCT/EP2019/058546
Other languages
English (en)
Inventor
Christian Helbig
Qiangguo Zhou
Dieter Zierhut
Original Assignee
Huawei Technologies Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co., Ltd. filed Critical Huawei Technologies Co., Ltd.
Priority to PCT/EP2019/058546 priority Critical patent/WO2020200464A1/fr
Publication of WO2020200464A1 publication Critical patent/WO2020200464A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/246—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for base stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/04—Fixed joints
    • H01P1/047—Strip line joints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
    • H01P5/028—Transitions between lines of the same kind and shape, but with different dimensions between strip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/0087—Apparatus or processes specially adapted for manufacturing antenna arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/16—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
    • H01Q9/28—Conical, cylindrical, cage, strip, gauze, or like elements having an extended radiating surface; Elements comprising two conical surfaces having collinear axes and adjacent apices and fed by two-conductor transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/048—Second PCB mounted on first PCB by inserting in window or holes of the first PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas

Definitions

  • the present disclosure relates to equipment for wireless communication systems. More specifically, the disclosure relates to a method for manufacturing an antenna element of an antenna for a base station for wireless communication in a communication network, in particular a 5G communication network.
  • FIGS 1 a and 1 b illustrate a conventional dipole 100 comprising a sheet metal body 101 , plastic supports and a printed circuit board (PCB) 1 1 1 (figure 1 b shows a more detailed view of a portion shown in figure 1 a).
  • PCB printed circuit board
  • these conductive connections are provided by a soldering process.
  • soldering process for providing a soldered conductive connection between different parts of the dipole 100 generally high temperatures of the order of 200 °C and above are required, which will heat at least portions of the respective parts of the dipole 100 being soldered to comparable temperatures.
  • the respective parts of the dipole 100 being soldered have to be made from materials that can withstand these high temperatures.
  • plastic parts such as plastic foils covered with metal signal lines and ground lines.
  • the invention relates to a method for manufacturing an antenna element for transmitting or receiving a RF signal.
  • the method comprises: providing a metallized electrical conduction line on a non-conductive surface of a first support element, wherein the metallized electrical conduction line extends into a contact portion of the surface of the first support element; providing a metallized electrical conduction line on a non-conducting surface of a second support element, wherein the metallized electrical conduction line extends into a contact portion of the surface of the second support element; bringing the contact portion of the first support element at least partially into contact with the contact portion of the second support element; and applying a conductive adhesive to the contact portion of the first support element and/or the contact portion of the second support element for fastening the first support element to the second support element and conductively connecting the metallized electrical conduction line on the surface of the first support element to the metallized electrical conduction line on the surface of the second support element.
  • the present invention allows providing a PIM free conductive connection between metallized electrical conduction lines on dipole support elements with a process, which includes applying a conductive adhesive/glue and uses smaller temperatures, such as temperatures of about 150 °C, than conventional soldering processes.
  • the conductive adhesive/glue is filled with metal particles.
  • the first support element further comprises a radiator element, wherein the metallized electrical conduction line on the surface of the first support element conductively connects to the radiator element and wherein the radiator element is configured to transmit a RF signal, when supplied with an electric current via the metallized electrical conduction line on the surface of the first support element.
  • the radiator element is a metallized patch located on the surface of the first support element.
  • the radiator element can be provided by a simple cost-efficient manufacturing process.
  • the second support element comprises one or more solderable connection pins for connecting the antenna element to a power source, wherein the metallized electrical conduction line on the surface of the second support element is conductively connected to the one or more solderable connection pins and wherein the power source is configured to supply an electric current to the metallized electrical conduction line on the surface of the second support element.
  • the antenna element can be easily connected to further components of an antenna or antenna array.
  • the method further comprises the step of curing the conductive adhesive.
  • the step of curing the conductive adhesive comprises the step of heating the conductive adhesive to a temperature of about 150° Celsius.
  • the contact portion of the second support element comprises one or more projections, in particular studs, and the contact portion of the first support element comprises one or more recesses, in particular holes, wherein the step of bringing the contact portion of the first support element into contact with the contact portion of the second support element comprises inserting the one or more projections of the contact portion of the second support element into the one or more recesses of the contact portion of the first support element.
  • the one or more projections may be defined by the contact portion of the first support element, while the one or more corresponding recesses are defined by the contact portion of the second support element. Thereby, the contact portions of the first and second support element can be brought easily into contact.
  • the first support element and/or the second support element comprise or consist of a metallized plastic foil.
  • the first and/or second support element can be provided by a cost-efficient manufacturing process.
  • the first support element and/or the second support element are a metallized solid plastic part.
  • the first and/or second support element can be provided by a cost-efficient manufacturing process.
  • the second support element is a printed circuit board.
  • the second support element can be provided by a cost- efficient manufacturing process.
  • the step of applying the conductive adhesive to the contact portion of the first support element and/or the contact portion of the second support element precedes the step of bringing the contact portion of the first support element into contact with the contact portion of the second support element.
  • the step of bringing the contact portion of the first support element into contact with the contact portion of the second support element precedes the step of applying the conductive adhesive to the contact portion of the first support element and/or the contact portion of the second support element.
  • the invention relates to an antenna element provided by a manufacturing method according to the first aspect of the invention.
  • the invention relates to an antenna comprising a plurality of antenna elements, wherein each antenna element of the antenna is provided by a manufacturing method according to the first aspect of the invention.
  • Figs. 1 a and 1 b are perspective views of an example of conventional antenna element
  • Figs. 2a-d are perspective views of an example of antenna element manufactured according to a manufacturing method according to an embodiment of the invention.
  • Fig. 3 is a flow diagram illustrating steps of an example of method for manufacturing an antenna element according to an embodiment of the invention.
  • Figs. 4a and b are perspective views of an example of an antenna element manufactured using a manufacturing method according to a further embodiment of the invention.
  • a disclosure in connection with a described method may also hold true for a corresponding device or system configured to perform the method and vice versa.
  • a corresponding device may include one or a plurality of units, e.g. functional units, to perform the described one or plurality of method steps (e.g. one unit performing the one or plurality of steps, or a plurality of units each performing one or more of the plurality of steps), even if such one or more units are not explicitly described or illustrated in the figures.
  • a specific apparatus is described based on one or a plurality of units, e.g.
  • a corresponding method may include one step to perform the functionality of the one or plurality of units (e.g. one step performing the functionality of the one or plurality of units, or a plurality of steps each performing the functionality of one or more of the plurality of units), even if such one or plurality of steps are not explicitly described or illustrated in the figures. Further, it is understood that the features of the various exemplary embodiments and/or aspects described herein may be combined with each other, unless specifically noted otherwise.
  • FIGS 2a-d show perspective views of an antenna element 200 manufactured according to a manufacturing method according to a first embodiment of the invention.
  • the antenna element 200 which can be a component of a larger antenna or antenna array, is configured to transmit and/or receive an RF signal.
  • one or more metallized electrical conduction lines 203 are provided on a non-conductive surface of a first support element 201 in such a way that the one or more metallized electrical conduction lines 203 extend into a contact portion of the surface of the first support element 201.
  • one or more further metallized electrical conduction lines 213 are provided on a non conducting surface of a separate second support element 21 1 in such a way that the one or more metallized electrical conduction lines 213 extend into a contact portion of the surface of the second support element 21 1.
  • the first support element 201 can comprise or consist of a non-solderable plastic material, such as polyoxymethylene (POM), polystyrene (PS), polypropylene (PP) or polycarbonate (PC).
  • the second support element 21 1 can comprise or consist of a solderable plastic material, such as liquid cristal polymers (LCP), polyphenylene sulfide (PPS), polyimide or polyether ether ketone, and/or a solderable metal material, such as tin, silver, copper or gold.
  • the first support element 201 and the second support element 21 1 may be provided by different manufacturing processes.
  • the first support element 201 may be provided by an injection moulding process, while the second support element 21 1 may be provided by a deep-drawing process.
  • the first support element 201 and/or the second support element 21 1 comprise or consist of a metallized plastic foil.
  • the first support element 201 and/or the second support element 21 1 are a metallized solid plastic part.
  • the second support element 21 1 is a printed circuit board (PCB).
  • the one or more metallized electrical conduction lines 203 on the non-conducive surface of the first support element 201 can be provided by one or more of the following processes: plasma coating, jet printing, or applying a conductive ink or paste to the surface of the first support element 201.
  • the one or more metallized electrical conduction lines 213 on the non-conducive surface of the second support element 21 1 can be provided by one or more of the following processes: plasma coating, jet printing, or applying a conductive ink or paste to the surface of the second support element 21 1.
  • the contact portion of the first support element 201 is brought at least partially into contact with the contact portion of the second support element 21 1.
  • the contact portion of the first support element 201 comprises one or more recesses, in particular holes 201 a and the contact portion of the second support element 21 1 comprises one or more projections, in particular studs 21 1 a.
  • the contact portion of the first support element 201 is brought into contact with the contact portion of the second support element 21 1 by inserting the one or more studs 21 1 a of the contact portion of the second support element 21 1 into the one or more holes 201 a defined by the contact portion of the first support element 201.
  • the one or more projections may be defined by the contact portion of the first support element 201 , while the one or more corresponding recesses are defined by the contact portion of the second support element 21 1.
  • a conductive adhesive or glue 209 is applied to the contact portion of the first support element 201 and/or the contact portion of the second support element in such a way that the conductive adhesive 209 fastens the first support element 201 to the second support element 21 1 and conductively connects the one or more metallized electrical conduction lines 203 on the surface of the first support element 201 to the one or more metallized electrical conduction lines 213 on the surface of the second support element 21 1.
  • this can comprise the further step of curing the conductive adhesive 209, for instance, by heating the conductive adhesive 209 to a temperature of about 150° Celsius for about 15 minutes.
  • the conductive adhesive 209 which is preferably filled with metal particles, allows providing a PIM free conductive connection between the metallized electrical conduction lines 203, 213 of the first and second support element 201 , 21 1 using smaller
  • temperatures such as temperatures of about 150 °C, than conventional soldering processes.
  • the first support element 201 may further comprise a radiator element, wherein the one or more metallized electrical conduction lines 203 on the surface of the first support element 201 conductively connect to the radiator element and wherein the radiator element is configured to transmit a RF signal, when supplied with an electric current via the one or more metallized electrical conduction lines 203 on the surface of the first support element 201 .
  • the radiator element may be a metallized patch located on the surface of the first support element 201.
  • the second support element 21 1 may comprise one or more solderable connection pins for connecting the antenna element 200 to a power source or other components of an antenna or antenna array, wherein the one or more metallized electrical conduction lines 213 on the surface of the second support element 21 1 are conductively connected to the one or more solderable connection pins and wherein the power source is configured to supply an electric current to the one or more metallized electrical conduction lines on the surface of the second support element 21 1.
  • Figure 3 is a flow diagram illustrating the steps of a method 300 for manufacturing the antenna element 200 configured to transmit and/or receive a RF signal.
  • the method 300 comprises the steps of: providing 301 the one or more metallized electrical conduction lines 203 on the non-conductive surface of the first support element 201 , wherein the one or more metallized electrical conduction lines 203 extend into a contact portion of the surface of the first support element 201 ; providing 303 the one or more metallized electrical conduction lines 213 on the non-conducting surface of the second support element 21 1 , wherein the one or more metallized electrical conduction lines 213 extend into a contact portion of the surface of the second support element 21 1 ; bringing 305 the contact portion of the first support element 201 at least partially into contact with the contact portion of the second support element 21 1 ; and applying 307 a conductive adhesive 209 to the contact portion of the first support element 201 and/or the contact portion of the second support element 21 1 for fastening the first support element 201 to the
  • the step of bringing the contact portion of the first support element 201 into contact with the contact portion of the second support element 21 1 precedes the step of applying the conductive adhesive 209 to the contact portion of the first support element 201 and/or the contact portion of the second support element 21 1.
  • the step of applying the conductive adhesive 209 to the contact portion of the first support element 201 and/or the contact portion of the second support element 21 1 may precede the step of bringing the contact portion of the first support element 201 into contact with the contact portion of the second support element 21 1 , as illustrated by the embodiment shown in figures 4a and 4b.
  • both the first support element 201 and the second support element 21 1 are a metallized plastic foil, i.e. a plastic foil with the respective electrical conduction line 203, 213 metallized thereon.
  • the adhesive glue 209 is applied, by way of example, to the contact portion of the second support element 21 1 , before the first support element 201 and the second support element 21 1 are brought into contact.
  • embodiments of the invention allow conductively connecting metallized conduction lines, such as signal lines or ground lines of metallized foils, PCBs, flexible PCBs, metallized plastic parts and metal sheets/foils in all combinations.
  • the disclosed system, apparatus, and method may be implemented in other manners.
  • the described apparatus embodiment is merely exemplary.
  • the unit division is merely logical function division and may be other division in actual implementation.
  • a plurality of units or components may be combined or integrated into another system, or some features may be ignored or not performed.
  • the displayed or discussed mutual couplings or direct couplings or communication connections may be implemented by using some interfaces.
  • the indirect couplings or communication connections between the apparatuses or units may be implemented in electronic, mechanical, or other forms.
  • the units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one position, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the objectives of the solutions of the embodiments.
  • functional units in the embodiments of the invention may be integrated into one processing unit, or each of the units may exist alone physically, or two or more units are integrated into one unit.

Abstract

Selon la présente invention, un procédé (300) de fabrication d'un élément d'antenne permettant d'émettre ou de recevoir un signal RF consiste : à fournir (301) une ligne de conduction électrique métallisée sur une surface non conductrice d'un premier élément de support ; à mettre (305) une partie de contact du premier élément de support au moins partiellement en contact avec une partie de contact du second élément de support ; et à appliquer (307) un adhésif conducteur sur la partie de contact du premier élément de support et/ou la partie de contact du second élément de support afin de fixer le premier élément de support au second élément de support et de connecter de manière conductrice la ligne de conduction électrique métallisée sur la surface du premier élément de support avec la ligne de conduction électrique métallisée sur la surface du second élément de support.
PCT/EP2019/058546 2019-04-04 2019-04-04 Procédé de fabrication d'un élément d'antenne WO2020200464A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/EP2019/058546 WO2020200464A1 (fr) 2019-04-04 2019-04-04 Procédé de fabrication d'un élément d'antenne

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2019/058546 WO2020200464A1 (fr) 2019-04-04 2019-04-04 Procédé de fabrication d'un élément d'antenne

Publications (1)

Publication Number Publication Date
WO2020200464A1 true WO2020200464A1 (fr) 2020-10-08

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ID=66092350

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2019/058546 WO2020200464A1 (fr) 2019-04-04 2019-04-04 Procédé de fabrication d'un élément d'antenne

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WO (1) WO2020200464A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022258130A1 (fr) * 2021-06-07 2022-12-15 Huawei Technologies Co., Ltd. Réseau de distribution de signaux et procédé d'installation d'un réseau de distribution de signaux dans une antenne
WO2022258127A1 (fr) * 2021-06-07 2022-12-15 Huawei Technologies Co., Ltd. Réseau de distribution de signaux partiellement flexibles
US11664615B2 (en) * 2018-08-07 2023-05-30 Tyco Electronics Japan G.K. Circuit board having terminal, and circuit board assembly

Citations (5)

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US20140218253A1 (en) * 2010-06-01 2014-08-07 Raytheon Company Stacked bowtie radiator with integrated balun
US20150138032A1 (en) * 2012-03-26 2015-05-21 Galtronics Corporation Ltd. Isolation structures for dual-polarized antennas
US20150200460A1 (en) * 2014-01-15 2015-07-16 Raytheon Company Dual Polarized Array Antenna With Modular Multi-Balun Board and Associated Methods
EP3232504A1 (fr) * 2016-04-12 2017-10-18 Huawei Technologies Co., Ltd. Élément rayonnant à double polarisation et bande ultra large pour antenne de station de base
WO2018202304A1 (fr) * 2017-05-04 2018-11-08 Huawei Technologies Co., Ltd. Élément rayonnant à double polarisation et antenne

Patent Citations (5)

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Publication number Priority date Publication date Assignee Title
US20140218253A1 (en) * 2010-06-01 2014-08-07 Raytheon Company Stacked bowtie radiator with integrated balun
US20150138032A1 (en) * 2012-03-26 2015-05-21 Galtronics Corporation Ltd. Isolation structures for dual-polarized antennas
US20150200460A1 (en) * 2014-01-15 2015-07-16 Raytheon Company Dual Polarized Array Antenna With Modular Multi-Balun Board and Associated Methods
EP3232504A1 (fr) * 2016-04-12 2017-10-18 Huawei Technologies Co., Ltd. Élément rayonnant à double polarisation et bande ultra large pour antenne de station de base
WO2018202304A1 (fr) * 2017-05-04 2018-11-08 Huawei Technologies Co., Ltd. Élément rayonnant à double polarisation et antenne

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Title
ZHUO LI ET AL: "Highly Conductive, Flexible, Polyurethane-Based Adhesives for Flexible and Printed Electronics", ADVANCED FUNCTIONAL MATERIALS, WILEY - V C H VERLAG GMBH & CO. KGAA, DE, vol. 23, no. 11, 20 March 2013 (2013-03-20), pages 1459 - 1465, XP001582371, ISSN: 1616-301X, [retrieved on 20121019], DOI: 10.1002/ADFM.201202249 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11664615B2 (en) * 2018-08-07 2023-05-30 Tyco Electronics Japan G.K. Circuit board having terminal, and circuit board assembly
WO2022258130A1 (fr) * 2021-06-07 2022-12-15 Huawei Technologies Co., Ltd. Réseau de distribution de signaux et procédé d'installation d'un réseau de distribution de signaux dans une antenne
WO2022258127A1 (fr) * 2021-06-07 2022-12-15 Huawei Technologies Co., Ltd. Réseau de distribution de signaux partiellement flexibles

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