WO2020197777A1 - Ensemble optique comprenant des caractéristiques de diffusion de sous-surface - Google Patents

Ensemble optique comprenant des caractéristiques de diffusion de sous-surface Download PDF

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Publication number
WO2020197777A1
WO2020197777A1 PCT/US2020/022215 US2020022215W WO2020197777A1 WO 2020197777 A1 WO2020197777 A1 WO 2020197777A1 US 2020022215 W US2020022215 W US 2020022215W WO 2020197777 A1 WO2020197777 A1 WO 2020197777A1
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WO
WIPO (PCT)
Prior art keywords
major surface
substrate
optical assembly
color conversion
damage tracks
Prior art date
Application number
PCT/US2020/022215
Other languages
English (en)
Inventor
Ellen Marie Kosik Williams
James Andrew West
Original Assignee
Corning Incorporated
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Incorporated filed Critical Corning Incorporated
Priority to CN202080030484.8A priority Critical patent/CN113710956A/zh
Priority to JP2021556783A priority patent/JP2022527698A/ja
Priority to KR1020217034452A priority patent/KR20210132230A/ko
Publication of WO2020197777A1 publication Critical patent/WO2020197777A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
    • H01L27/14605—Structural or functional details relating to the position of the pixel elements, e.g. smaller pixel elements in the center of the imager compared to pixel elements at the periphery
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033—Means for improving the coupling-out of light from the light guide
    • G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
    • G02B6/0051—Diffusing sheet or layer
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/02—Diffusing elements; Afocal elements
    • G02B5/0205—Diffusing elements; Afocal elements characterised by the diffusing properties
    • G02B5/0236—Diffusing elements; Afocal elements characterised by the diffusing properties the diffusion taking place within the volume of the element
    • G02B5/0247—Diffusing elements; Afocal elements characterised by the diffusing properties the diffusion taking place within the volume of the element by means of voids or pores
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/875—Arrangements for extracting light from the devices
    • H10K59/877—Arrangements for extracting light from the devices comprising scattering means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels

Definitions

  • LED displays e.g., organic light emitting diode - OLED, and micro-LED displays
  • OLED organic light emitting diode
  • micro-LED displays can comprise arrays of individually packaged LED chips.
  • micro-LEDs To enable close packing of micro-LEDs required to create high resolution displays, multiple LEDs need to be placed on a single substrate, for example a glass substrate.
  • LED emission can be Lambertian, and for bottom-emission configurations particularly, a significant amount of the light emitted from a single LED can be trapped in the substrate due to total internal reflection (TIR) of the light intercepting a surface of the substrate at a large angle relative to a surface normal. This phenomenon can be at least partially overcome by roughing the substrate surface. Light extraction enhancements on the order of 50-80% have been reported through such surface modifications.
  • Embodiments of the present disclosure describe an optical assembly configured to direct light from an apparent source of light such that to an observer the light appears to come from an appropriate location on the substrate.
  • display devices can be comprised of a plurality of electroluminescent elements.
  • the electroluminescent elements are turned on and off in a sequence and pattern that forms an image to an observer.
  • the various pixels are configured to produce a particular wavelength of light (color) at and appropriate time and position. Since the light sources that generate light are typically Lambertian emitters, light can spread from the electroluminescent element over a broad angular range.
  • Some of that light can appear, through various mechanisms, to come from a location on the display panel (e.g., optical assembly) inconsistent with the color of the light. That is, while the light from that particular location may be designed to be green according to the image displayed, light from that location may appear blue because light from a neighboring blue electroluminescent element leaked to the green location.
  • single color electroluminescent elements may emit light that passes through color conversion layers, e.g., filters, that provide the color information.
  • light from the underlying electroluminescent elements may illuminate multiple color conversion layers of different colors. That is, the light emitted by an electroluminescent element, while intended to illuminate a conversion layer of a specific color, instead, illuminates several color conversion layers, thereby producing additional colors.
  • an optical assembly comprising a transparent substrate comprising a first major surface and a second major surface opposite the first major surface, the transparent substrate further comprising a damaged layer disposed between a first non- damaged layer including the first major surface and a second non-damaged layer including the second major surface, the transparent substrate still further comprising a pixel comprising a plurality of electroluminescent elements positioned on the first major surface, the pixel defining a pixel volume extending through the damaged layer.
  • a plurality of damage tracks is disposed around the pixel volume within the damaged layer.
  • the first plurality of damage tracks can comprise a plurality of substantially parallel rows of damage tracks orthogonal to and crossing a plurality of substantially parallel columns of damage tracks.
  • electroluminescent elements defines a subpixel volume, and a second plurality of damage tracks can be disposed adjacent each subpixel volume defined by the plurality of
  • the second plurality of damage tracks can comprise a plurality of substantially parallel rows of damage tracks orthogonal to and crossing a plurality of substantially parallel columns of damage tracks.
  • electroluminescent elements can be configured to emit a wavelength of light the same as a wavelength of light of another electroluminescent element of the plurality of
  • each damage track of the plurality of damage tracks positioned adjacent a pixel volume or a subpixel volume can comprise a longitudinal axis forming a non-zero angle relative to a normal to one of the first major surface or the second major surface.
  • the damaged layer can comprise a plurality of damaged layers stacked between the first non-damaged layer and the second non-damaged layer.
  • each damage track can comprise a plurality of damage tracks stacked vertically and arranged within the plurality of damaged layers.
  • the transparent substrate can be selected from a group of substrates including glass, fused silica, sapphire, polymers, and glass ceramics.
  • the plurality of electroluminescent elements can comprise microLEDs or organic light emitting diodes.
  • an optical assembly comprising a transparent substrate comprising a first major surface and a second major surface opposite the first major surface, the transparent substrate further comprising a damaged layer disposed between a first non-damaged layer including the first major surface and a second non-damaged layer including the second major surface, the transparent substrate still further comprising a pixel defined by a plurality of electroluminescent elements deposited on the first major surface, each electroluminescent element of the plurality of electroluminescent elements defining a subpixel volume extending through the damaged layer.
  • a plurality of damage tracks can be disposed adjacent each subpixel volume, for example around each subpixel volume.
  • electroluminescent elements can be configured to emit a wavelength of light the same as a wavelength of light of another electroluminescent element of the plurality of
  • the plurality of damage tracks can comprise a plurality of substantially parallel rows of damage tracks orthogonal to and crossing a plurality of substantially parallel columns of damage tracks.
  • each damage track of the plurality of damage tracks can comprise a longitudinal axis forming a non-zero angle relative to a normal to one of the first major surface or the second major surface.
  • the plurality of electroluminescent elements can comprise microLEDs or organic light emitting diodes.
  • an optical assembly comprising a first substrate comprising a first major surface and a second major surface opposite the first major surface, the first substrate comprising a pixel defined by a plurality of electroluminescent elements deposited on the second major surface of the first substrate.
  • the plurality of damage tracks can comprise a plurality of substantially parallel rows of damage tracks orthogonal to and crossing a plurality of substantially parallel columns of damage tracks.
  • the transparent second substrate can be selected from a group of substrates including glass, fused silica, sapphire, polymers, and glass ceramics.
  • the transparent second substrate can be selected from a group of substrates including glass, fused silica, sapphire, polymers, and glass ceramics
  • the damaged layer can comprise a plurality of damaged layers stacked between the first non-damaged layer and the second non-damaged layer.
  • each damage track of the plurality of damage tracks can comprise more than one damage track, the more than one damage tracks stacked vertically within the plurality of damaged layers.
  • FIGS. 1 A and IB are schematic depictions of an apparatus for making a component of an optical assembly in accordance with exemplary embodiments
  • FIG. 2 is a diagrammatic depiction of the optical system used in the apparatus depicted in Figures 1 A and IB;
  • FIG. 3 is a flow chart illustrating a method for making a component of an optical assembly in accordance with exemplary embodiments
  • FIG. 4 is a cross-sectional edge view of a substrate with integral damage tracks in accordance with exemplary embodiments
  • FIG. 5 is a cross-sectional view of another substrate with integral damage tracks in accordance with exemplary embodiments
  • FIG. 6 is a cross-sectional view of substrate comprising an electroluminescent element in accordance with exemplary embodiments illustrating potential light paths;
  • FIG. 7 is a plan view of an exemplary optical assembly in accordance with exemplary embodiments described herein, the optical assembly comprising substrate with a plurality of pixels and pixel volumes, and a plurality of damage tracks extending adjacent the pixel volumes;
  • FIG. 8 is a cross-sectional edge view of an optical assembly comprising a substrate with a plurality of pixels and pixel volumes, without a plurality of damage tracks extending adjacent the pixel volumes, and potential light paths without the damage tracks;
  • FIG. 9 is a cross-sectional edge view of an optical assembly illustrating pixels and pixel volumes, and damage tracks
  • FIG. 10 is a plan view of a portion of a substrate showing an area pattern of damage tracks in the substrate;
  • FIG. 11 is a plan view of a portion of another substrate showing an area pattern of damage tracks in the substrate
  • FIG. 12 is a plan view of a portion of still another substrate showing an area pattern of damage tracks in the substrate, the damage tracks extending adjacent subpixel volumes related to subpixels on the substrate;
  • FIG. 14 is a cross-sectional edge view of a substrate with integral damage tracks, the damage tracks extending at an angle relative the major surfaces of the substrate;
  • FIG. 15 is cross-sectional edge view of an optical assembly comprising a substrate with a plurality of subpixels disposed on a first major surface of the substrate, the subpixels defining a plurality of pixel volumes, and a plurality of color conversion layers disposed on a second major surface of the substrate, and a plurality of damage tracks;
  • FIG. 16A is cross-sectional edge view of an optical assembly comprising a first substrate and a second substrate, the first substrate comprising a plurality of electroluminescent element and the second substrate comprising a plurality of color conversion layers;
  • FIG. 16B is a close-up view of a portion of the optical assembly of FIG. 16A illustrating color conversion volumes in the second substrate and damage tracks.
  • the term“about” means that amounts, sizes, formulations, parameters, and other quantities and characteristics are not and need not be exact, but may be approximate and/or larger or smaller, as desired, reflecting tolerances, conversion factors, rounding off, measurement error and the like, and other factors known to those of skill in the art.
  • a“substantially planar” surface is intended to denote a surface that is planar or approximately planar.
  • “substantially” is intended to denote that two values are equal or approximately equal.
  • “substantially” may denote values within about 10% of each other, such as within about 5% of each other, or within about 2% of each other.
  • micro-LED refers to a light emitting diode with a light emission area with dimensions on the order of less than about 100 micrometers (pm) x about 100 pm (10,000 pm 2 ), such as less than about 50 pm x about 50 pm (2,500 pm 2 ), for example, less than about 10 pm x about 10 pm (100 pm 2 ).
  • FIGS. 1A and IB are diagrammatic depictions of an exemplary apparatus 10 for making subsurface defects in a transparent substrate 12.
  • substrate 12 may be glass, fused silica, sapphire, a polymer, or any other suitable material.
  • Figures 1 A-1B show substrate 12 disposed on platform 14.
  • imaging assembly 16 can be employed to generate a focal line to provide laser-induced scattering features within substrate 12 with a pulsed line-focus laser beam under the direction of controller 18.
  • Substrate 12 is essentially transparent with respect to single photon absorption of the pulsed line-focus laser beam when propagating through substrate 12.
  • Imaging assembly 16 can include laser light source 20 providing a pulsed laser beam, and optical system 22 that guides the pulsed laser beam from laser light source 20 to substrate 12 and forms a line focus within the substrate.
  • Platform 14 may, in some embodiments, be employed as a translation mechanism for positioning substrate 12 relative to the focal line formed by optical system 22, although, as described below, other alternate embodiments are possible.
  • the modified regions of the substrate can incorporate micro cracks, substrate material that has melted and re-solidified, substrate material that has undergone a phase change, substrate material that has undergone a compositional change, substrate material that has changed amorphous or crystalline structure, substrate material that has undergone a change in refractive index, or combinations thereof.
  • a modified region can comprise a tube-like region (when viewed in plane with or parallel to the substrate surrounded by radial micro cracks.
  • modified regions in the substrate e.g., scattering features
  • Damage tracks can be described as having a diameter L (see FIG.
  • filamentation It is also possible to form a long thin damage track through a process known as “filamentation”.
  • a very short laser pulse of sufficient intensity is directed into a material to produce an optical Kerr effect, wherein the refractive index of the substrate material is locally modified by the high electric field strength of the laser pulse.
  • This makes the beam self-focus and can create beams that propagate in long thin channels through many millimeters of substrate material.
  • This process requires power in the laser pulse to exceed a threshold, Pcmicai (which for glass is typically about 5 MW).
  • Pcmicai which for glass is typically about 5 MW.
  • line-focus optics and Bessel-like beams with short-pulse lasers may be a preferred method to fabricate defect lines in the substrate.
  • the above-mentioned other methods can also be used to generate long thin defect lines, for example inside glass, albeit with trade-offs in either increased system cost or decreased reliability (from very short pulse and high energy lasers) or overall processing time (with Gaussian beams and many focus passes).
  • a series of short-length closely spaced features can approximate a line defect and can be made by a series of translations of the optical focus along the optical beam path.
  • controller 18 can be configured as a highly automated apparatus substantially controlled by a computer-aided manufacturing program 24.
  • computer-aided manufacturing program 24 can use an executable file that directs relative motion between platform 14 and imaging assembly 16.
  • Figure 1A illustrates relative movement between imaging assembly 16 and substrate 12 in the x-y plane, represented by double arrows 26 and 28, respectively.
  • Figure IB is a side view illustrating relative movement between imaging assembly 16 and substrate 12 in the z-direction, orthogonal to the x-y plane, and represented by double arrow 30, and optionally in angular direction (Q).
  • apparatus 10 can feature a stationary imaging assembly 16.
  • platform 14 can be configured to move beneath imaging assembly 16.
  • Platform 14 may comprise, for example, a programmable numerical control (CNC) apparatus.
  • CNC programmable numerical control
  • platform 14 can be configured to move in one axial direction, whereas imaging assembly 16 can move in the remaining axes.
  • the present disclosure also contemplates the use of a stationary platform 14, and an imaging assembly 16 configured to move in three-dimensional space over substrate 12 as dictated by computer-aided manufacturing program 24.
  • An embodiment of computer-aided manufacturing program 24 is shown at FIG. 3 and described in the related text.
  • the computer- aided manufacturing program 24 can also be configured to control laser and other optical parameters of imaging assembly 16.
  • the wavelength of laser light source 20 can be selected such that substrate 12 is substantially transparent at the selected wavelength (e.g., absorption less than about 15% per millimeter (mm) of material depth > g « 1/centimeter (1/cm), where g is the Lambert-Beer absorption coefficient).
  • the pulse duration of laser light source 20 can be selected such that no significant heat transport (e.g., heat diffusion) out of the zone of interaction can take place within the time of interaction (for example: t « d 2 /a, where d is the focus diameter of the laser beam, t is the laser pulse duration, and a is the heat diffusion constant of the substrate material).
  • the pulse energy of laser light source 20 can be selected such that the intensity of the laser beam in the zone of interaction, e.g., along the focal line, produces an induced absorption that leads to formation of a damage track corresponding to the focal line location.
  • the polarization state of the laser beam produced by laser light source 20 may influence both interaction between the laser beam and the substrate at the surface of the substrate (e.g., reflectivity) and the type of interaction within the substrate (e.g., induced absorption). Induced absorption may take place by way of induced, free-charge carriers (typically electrons), either after thermal excitation, or by way of multiphoton absorption and internal photoionization, or by way of direct field ionization (where field strength of the light breaks electron bonding directly).
  • induced, free-charge carriers typically electrons
  • the polarization by way of suitable optics (e.g., phase plates), should be selected by the user to be conducive for modifying the respective substrate material. Therefore, if the substrate material is not optically isotropic, but for example birefringent, propagation of laser light in the substrate can be also influenced by polarization. Thus, laser beam polarization and orientation of the polarization vector may be selected such that one focal line is formed, not two (e.g., ordinary and extraordinary rays). In the case of optically isotropic substrate materials, this does not play any role.
  • optical intensity of the laser beam should be selected based on pulse duration, pulse energy, and focal line diameter such that there is preferably no significant ablation or significant melting of the substrate material, but rather damage track formation in the microstructure of the substrate.
  • pulse duration for typical substrate materials such as glass or transparent crystals, this requirement can be most easily satisfied with pulsed lasers in the sub-nanosecond range, for example with pulse durations of between about 0.1 picoseconds (ps) and 100 ps, and preferably less than 15 ps.
  • t, d, and the heat diffusion constant a of the substrate material can be set according to t « d 2 /a and/or t can be selected to be less than about 10 nanoseconds (ns), for example less than about 100 ps, and/or in that the pulse repetition rate of laser light source 20 is between about 10 kHz and about 1000 kHz (e.g., about 100 kHz), and/or in that laser light source 20 is operated as a single-pulse laser or as a burst-pulse laser, with energies per burst pulse between about 40 microJoules (pJ) and about 1000 pj, and/or in that the average laser power, measured directly on the output side of the beam of laser light source 20, is in a range from about 10 watts to about 100 watts (e.g., in a range from about 30 watts to about 50 watts).
  • ns nanoseconds
  • the pulse repetition rate of laser light source 20 is between about 10 kHz and about 1000
  • wavelength l of laser light source 20 can be selected such that the material of substrate 12 is transparent or substantially transparent to the selected wavelength, the latter meaning that any decrease in intensity of the laser beam taking place along the direction of the laser beam in the material of substrate 12 per millimeter of the depth of penetration of the laser beam is about 15% or less.
  • laser light source 20 can be, for example, an Nd:YAG laser with a wavelength l of 1064 nm or a Yb: YAG laser with a wavelength l of 1030 nm.
  • laser light source 20 can be, for example, an EnYAG laser with a wavelength l in a range from about 1.5 pm to about 1.8 pm.
  • the distance of the plano convex collimation lens 42 from optical element 36 is denoted by zla
  • the distance of focusing lens 44 from collimation lens 42 is denoted by zl b
  • the distance of focal line 2b produced by focusing lens 44 is denoted by z2 (seen in each case in the direction of the beam).
  • the annular transformation of laser beam 38 by optical element 36 is shown with the reference sign SR.
  • the annular radiation SR formed by optical element 36 and incident on collimation lens 42 in a divergent manner, and with a ring diameter dr, has the ring diameter dr remaining at least approximately constant along distance zl b and is set to the desired ring width br at the location of focusing lens 44.
  • a short focal line 2b is produced so that the ring width br of about 4.0 mm at the location of collimation lens 42 is reduced by the focusing properties of the latter at the location of focusing lens 44 to about 0.5 mm.
  • substrate 12 is selected.
  • substrate 12 may be glass, fused silica, sapphire, a polymer, or any suitable transparent substrate.
  • Suitable glass materials can include various glass substrates such as quartz, borosilicate, aluminosilicate, aluminoborosilicate, sapphire or soda-lime glass, sodium- containing glass, hardened glass or unhardened glass.
  • the area pattern map to be formed in substrate 12 is provided to controller 18.
  • the area pattern map may specify display device viewing angles and the size and position of pixel locations.
  • the focal length and the position of the focal length within the substrate may also be provided to controller 18. Determination of the x-y area pattern map, the focal line length, and other laser parameters described herein specify the formation and positioning of the damage tracks within substrate 12.
  • the angle Q for damage tracks (e.g., longitudinal axes thereof) is selected. If the damage tracks are designed to be normal to a first major surface 32 (10-1), of substrate 12, e.g., the major surface on which the laser beam is incident, then angle Q of imaging assembly 16 relative to substrate 12 selected in step 110 should be zero.
  • imaging assembly 16 laser-induces damage tracks within substrate 12 in accordance with the predetermined plan specified in steps 102-110.
  • the predetermined plan may call for multiple layers of tracks, in which case, decision diamond 116 would redirect the process flow to step 106.
  • the process may be terminated (step 118).
  • the fabricated substrate can be strengthened in subsequent steps using thermal or chemical methods.
  • FIG. 4 is a cross-sectional view of an exemplary substrate 12 comprising first major surface 32 and second major surface 34, and a plurality of damage tracks 50 produced by the method 100 described above disposed between the first and second major surfaces.
  • the integral damage tracks 50 can be implemented by multiple parallel transverse rows of damage tracks 50 periodically spaced and disposed in at least one vertical layer, i.e., a layer extending in a thickness direction of substrate 12.
  • Damage tracks 50 extend over a thickness TL in the substrate and are disposed within a damage layer in the interior of substrate 12 between a top layer 46 of undamaged material with a thickness TGT and a bottom layer 48 of undamaged substrate material with a thickness TGB.
  • the length TL of the damage tracks substantially corresponds to the focal line length generated by imaging assembly 16.
  • the thickness of top and bottom layers 46, 48, where the glass is unmodified by the damage tracks, is selected to prevent cracks that might extend from a damage track from propagating to the major surfaces of the glass, and to provide substrate 12 with enough structural integrity to resist shear forces. Ensuring damage tracks 50 do not extend all the way to the glass surface can be preferred. When a crack reaches the glass surface, it creates a path for water or humidity ingress, which can promote rapid crack growth and cause failure of the part. In practice, keeping the thicknesses TGT and TGB > 50 pm, and more preferably > 100 pm, has been found sufficient to prevent part failure.
  • the rows of damage tracks 50 can be separated by a row spacing D. Additionally, as previously described, individual damage tracks 50 can have a diameter L. As described in more detail following, rows, and columns, of damage tracks can be produced in a substrate such that damage tracks surround an electroluminescent picture elements (pixels) comprising an electroluminescent display panel. Such electroluminescent display panels can include, but are not limited to, micro-LED display panels or organic light emitting LED display panels. The region of substrate 12 that can be laser processed can be selected to include all or a portion of substrate 12.
  • the damage tracks can feature a row (column) spacing D of about 50 pm to about 2000 pm, a pitch between individual damage tracks of about 3.0 microns to about 50 microns, and a damage track depth TL of about 0.2 mm to about 10 mm.
  • diameter A and damage track thickness TL is determined at least by the spot diameter and the line-focus parameters of imaging assembly 16.
  • FIG. 6 depicts a cross-sectional side view of an exemplary optical assembly 200 comprising transparent substrate 202 including first major surface 204 and second major surface 206 opposite first major surface 204, and an electroluminescent element 208 (e.g., micro-LED, organic light emitting diode, or the like) deposited on first major surface 204.
  • First major surface 204 may be parallel or substantially parallel to second major surface 206.
  • Substrate 202 further comprises a thickness defined between first major surface 204 and second major surface 206.
  • deposited or positioned“on” refers to being coupled to substrate 202, but not necessarily in direct intimate contact with substrate 202.
  • Substrate 202 may comprise any suitable material for the manufacture of an optical assembly, but in exemplary embodiments, may comprise a glass material, for example a borosilicate glass, an alumino-borosilicate glass, an alkali borosilicate glass, or the like. In other embodiments, substrate 12 may comprise fused silica, sapphire, a polymer, or any other suitable material.
  • a glass material for example a borosilicate glass, an alumino-borosilicate glass, an alkali borosilicate glass, or the like.
  • substrate 12 may comprise fused silica, sapphire, a polymer, or any other suitable material.
  • Optical assembly 200 may further include one or more electrode and/or semiconductor layers 210, such as transparent electrodes (e.g., transparent conductive oxides such as indium tin oxide, conductive polymers, carbon nanotubes, graphene, nanowire meshes, ultrathin metal films, and so forth), disposed on electroluminescent element 208, and/or between substrate 202 and the electroluminescent element 208.
  • transparent electrodes e.g., transparent conductive oxides such as indium tin oxide, conductive polymers, carbon nanotubes, graphene, nanowire meshes, ultrathin metal films, and so forth
  • electroluminescent element 208 may comprise an electrode in contact with an“upper” surface of the electroluminescent element, and another electrode in contact with an opposing“lower” surface of the electroluminescent element. Electrodes may be positioned in contact with electroluminescent element 208 in any location or position necessary for the operation of the electroluminescent element
  • one or more additional layers may be disposed on substrate 202, for example a planarization layer or encapsulation layer 212 disposed over first major surface 204.
  • FIG. 6 illustrates an electroluminescent element 208 configured for bottom-emission, wherein light is directed from electroluminescent element 208 through first major surface 204, propagates through substrate 202, and is emitted from second major surface 206.
  • Some light rays like light ray 220, propagate through substrate 202 and are refracted at second surface 206, for example the substrate - air interface.
  • the light rays are incident at second major surface 206 perpendicularly and experience little or no refraction.
  • TIR total internal reflection
  • optical assembly 200 may comprise, for example, a display device, wherein substrate 202 comprises a plurality of electroluminescent elements 208 disposed thereon, wherein substrate 202 and components disposed thereon comprise a display panel.
  • electroluminescent elements 208 can be arranged as picture elements (pixels) 232 of the display panel, wherein individual subpixels, of different emission wavelengths (e.g., colors) may comprise a given pixel 232, each sub-pixel comprising an individual electroluminescent element 208.
  • Commercially-available display panels may comprise many millions of pixels, and the illustrated optical assembly 200 shown in FIG. 7 is for purposes of explanation and not limitation.
  • light rays emitted from a given pixel that intercept the interface at second major surface 206 at a large angle relative to normal 226, such as light ray 224 that undergoes TIR at the substrate-air interface, can propagate laterally within the substrate, but may intercept a scattering location positioned away from the originating pixel such that the scattered light exits the substrate through second major surface 206 at a location of an adjacent pixel (e.g., at pixel coordinate C2, Rl), or a pixel positioned even farther from the originating pixel.
  • an adjacent pixel e.g., at pixel coordinate C2, Rl
  • damage tracks 50 may be formed in substrate 202 as previously described, in an area pattern such that damage tracks 50 are formed adjacent, for example around, individual pixel volumes 240 of optical assembly 200.
  • pixel volume refers to the volume of a footprint of a pixel 232 extended through the substrate
  • a pixel footprint refers to the outline of a pixel periphery on the substrate, e.g., an outline of the light emitting area of a pixel on first surface 204 of substrate 12.
  • a pixel volume is the volume of the substrate resulting from a projection of that footprint through the substrate in a direction of the thickness of the substrate, e.g., orthogonal to the first and/or second major surface.
  • lines of damage tracks can be arranged in a grid pattern comprising rows 234 of damage tracks and columns 236 of damage tracks that extend adjacent and/or between individual pixels 232.
  • rows 234 and columns 236 of damage tracks 50 are shown as dashed lines in FIG. 7.
  • rows 234 and columns 236 of damage tracks 50 can be arranged orthogonal to each other, mimicking the arrangement of pixels 232.
  • Such lines of damage tracks can comprise a single line of damage tracks per row 234 or column 236 of damage tracks, or damage tracks can comprise multiple lines of damage tracks arranged in geometric patterns (e.g., FIG. 10) or as randomly distributed damage tracks along a line (FIG. 11).
  • FIG. 12 is a plan view of substrate 12 illustrating placement of individual subpixels (e.g., electroluminescent elements 208) and damage tracks arranged in crossing (e.g., intersecting) rows 234 and columns 236 of damage tracks such that rows and/or columns of damage tracks are adjacent individual subpixels (e.g., electroluminescent elements 208).
  • the individual subpixels may be surrounded by rows and columns of damage tracks.
  • angularly-extending damage tracks can be positioned around, such as surrounding, individual subpixel volumes.
  • light rays 220 emitted by a pixel 232 e.g., emitted from an electroluminescent element 208 comprising a subpixel of the pixel
  • optical assembly 200 can comprise a plurality of electroluminescent elements 208 positioned on first major surface 204 of substrate 12, wherein each electroluminescent element 208 emits light of the same wavelength (e.g., color) as other electroluminescent elements 208 of the plurality of electroluminescent elements.
  • the plurality of electroluminescent elements 208 may emit a bluish light.
  • a color conversion layer 242 may be positioned on second major surface 206 such that light emitted from the plurality of electroluminescent elements 208 is transformed by the color conversion layer 242 into light of a different color, e.g., white light.
  • color conversion layer 242 may comprise a plurality of discrete (e.g., separated) layers, wherein each discrete color conversion layer 242 is positioned opposite a corresponding electroluminescent element 208.
  • Color conversion layers 242 can be segregated into blue color conversion layers, green color conversion layers, and red color conversion layers.
  • the blue, green, and red color conversion layers 242 can be incorporated into pixels 232, each pixel 232 comprising a plurality of electroluminescent elements 208 and a plurality of corresponding color conversion layers 242.
  • a color conversion layer 242 of one color can represent one subpixel.
  • a pixel 232 in accordance with the present embodiment can comprise three electroluminescent elements 208 of a single color positioned on first major surface 204, and three color-conversion layers 242 of different colors positioned on second major surface 206: e.g., a blue color conversion layer, a green color conversion layer, and a red color conversion layer, each color conversion layer paired with a corresponding electroluminescent element 208.
  • Color conversion layers 242 can comprise, for example, a phosphor material (e.g., cerium- doped YAG) or a semiconductor material (e.g., quantum dot).
  • light emitted from one electroluminescent element 208 in one pixel 232, in the absence of damage tracks 50, may intersect the color conversion layer of an adjacent pixel, or even the color conversion layer of an adjacent electroluminescent element (e.g., subpixel) within the same pixel.
  • light emitted from one electroluminescent element 208 intended for the corresponding color conversion layer may instead at least partially illuminate an adjacent color conversion layer, thereby emitting a color light toward the viewer different than what was intended by the apparatus designer.
  • an electroluminescent element 208 of a pixel in column Cl of FIG. 15 is activated and intended to direct light toward the green color conversion layer 242G.
  • damage tracks positioned in rows 234 and columns 236 between individual subpixel volumes and/or pixel volumes can mitigate crosstalk between individual subpixels and/or pixels.
  • the optical assembly may comprise a first substrate 302 and a transparent second substrate 304.
  • First substrate 302 comprises a first major surface 306 and a second major surface 308.
  • a plurality of electroluminescent elements 208 can be disposed on second major surface 308, the plurality of electroluminescent elements 208 defining a pixel 232.
  • pixels 232 can be arranged in specific patterns, for example an array of rows and/or columns (a single row of columns Cl - C4 is shown in FIG. 16A).
  • Transparent second substrate 304 comprises a third major surface 310 (see FIG. 16B) and a fourth major surface 312.
  • the color conversion layers 314 may, in some embodiments, be distributed in an area pattern, e.g., array, corresponding to an area pattern of electroluminescent elements 208 on second major surface 308 of first substrate 302. That is, if the electroluminescent elements 208 are arranged on second major surface 308 of first substrate 302 in a rectangular array of rows and columns of electroluminescent elements, color conversion layers 314 can also be arranged in a rectangular array of rows and columns, wherein individual color conversion layers 314 are positioned directly opposite a corresponding electroluminescent element 208. Such rectangular arrays of rows and columns can apply to either one or both of pixels or individual electroluminescent elements (e.g., subpixels).
  • each color conversion layer 314 can define a color conversion volume 318 extending through a thickness (e.g., through a damaged layer 320) of transparent second substrate 302.
  • color conversion volume refers to the volume of a footprint of a color conversion layer extended through transparent second substrate 304. That is, a color conversion layer footprint refers to the outline of a color conversion layer as projected onto transparent second substrate 304, e.g., an outline of the color conversion layer on third major surface 310 of transparent second substrate 304.
  • a color conversion volume 318 is the volume within transparent second substrate 304 represented when a color conversion footprint is projected through transparent second substrate 304 in a direction of a thickness of the second substrate, e.g., orthogonal to the third or fourth major surface of the second substrate.
  • a black matrix material 322, for example an opaque polymer material, may be deposited on third major surface 310 to optically isolate each color conversion layer from other color conversion layers in the array of color conversion layers at third major surface 310.
  • an electroluminescent element 208 of a pixel in column C 1 can be activated and intended to direct light toward, for example, blue color conversion layer 314B.
  • Some light rays, like light ray 324, may propagate through transparent second substrate 304 and be refracted at fourth surface 312, for example the substrate - air interface. In certain instances, best seen at detail A of FIG.
  • light from the electroluminescent element 208 directly opposite a blue color conversion layer 314B may propagate through transparent second substrate 304 at such an angle that blue light emitted from blue color conversion layer 314B may exit fourth major surface 312 in the general location of, for example, a red color conversion layer 314R, such as a red color conversion layer corresponding to an adjacent pixel.
  • a red color conversion layer 314R such as a red color conversion layer corresponding to an adjacent pixel.
  • damage tracks 50 may be formed in transparent second substrate 304 in an area pattern, e.g., orthogonal rows and/or columns, such that damage tracks 50 are formed adjacent individual color conversion volumes 318 of transparent second substrate 304, or groups of color conversion volumes.
  • damage tracks 50 may be formed in transparent second substrate 304 in an area pattern such that damage tracks 50 are formed between and around individual color conversion volumes 318 of transparent second substrate 304, or groups of color conversion volumes.
  • blue light emitted from blue color conversion layer 314B can intercept damage tracks 50 and be scattered by damage tracks 50 in a direction toward and through fourth major surface 312. Accordingly, blue light from blue color conversion layer 314B can exit fourth major surface 312 in the general location of blue color conversion layer 314B and not appear to an observer to be emitted from the location of green color conversion layer 314R.
  • damage tracks 50 can be arranged adjacent, for example around, groups of color conversion volumes, for example a group of three color-conversion volumes directly opposite a corresponding pixel comprised of three electroluminescent elements 208, although it should be noted that the group of color conversion volumes may include fewer than three color conversion volumes or more than three color conversion volumes.
  • damage tracks 50 could be arranged adjacent the color conversion layers corresponding to any one or more of the color conversion volumes corresponding to the pixels Cl - C4.
  • damage tracks 50 could be arranged around the color conversion layers corresponding to any one or more of the color conversion volumes corresponding to the pixels Cl - C4.
  • color mixing at the pixeldevel may be beneficial.
  • damage tracks 50 may be arranged adjacent, for example around, groups of color conversion volumes corresponding to individual pixels, and not individual color conversion volumes.
  • damage tracks 50 disposed within damaged layer 320 of transparent second substrate 304 can be tilted by an angle f relative to a normal to either one or both of third or fourth major surfaces 310 or 312, respectively.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Power Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Optical Filters (AREA)

Abstract

La présente invention concerne un ensemble optique comprenant un substrat transparent comportant une première surface principale et une seconde surface principale. Le substrat transparent comprend une couche endommagée disposée en son sein. Un pixel défini par une pluralité d'éléments électroluminescents est disposé sur la première surface principale, le pixel délimitant en outre un volume de pixel s'étendant à travers la couche endommagée. Des traces d'une première pluralité de traces d'endommagement induites par laser sont disposées à l'intérieur de la couche endommagée adjacente au volume de pixel. Selon d'autres modes de réalisation, des traces d'une seconde pluralité de traces d'endommagement induites par laser peuvent être disposées de manière adjacente à des volumes de sous-pixels délimités par des éléments électroluminescents individuels du pixel. Selon encore d'autres modes de réalisation, un premier substrat comprenant une pluralité d'éléments électroluminescents est positionné à l'opposé d'un second substrat transparent comprenant une pluralité de couches de conversion de couleur, et des traces d'une pluralité de traces d'endommagement sont disposées adjacentes à des volumes de conversion de couleur délimités par les couches de conversion de couleur.
PCT/US2020/022215 2019-03-22 2020-03-12 Ensemble optique comprenant des caractéristiques de diffusion de sous-surface WO2020197777A1 (fr)

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CN202080030484.8A CN113710956A (zh) 2019-03-22 2020-03-12 包含次表面散射特征的光学组件
JP2021556783A JP2022527698A (ja) 2019-03-22 2020-03-12 表面下の散乱特徴を含む光学アセンブリ
KR1020217034452A KR20210132230A (ko) 2019-03-22 2020-03-12 서브-표면 산란 피쳐들을 포함하는 광학 어셈블리

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US62/822,378 2019-03-22

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
WO2022261275A1 (fr) * 2021-06-11 2022-12-15 Corning Incorporated Article de transformation optique

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JP2009110873A (ja) * 2007-10-31 2009-05-21 Toppan Printing Co Ltd 表示装置
US20100141116A1 (en) * 2008-12-05 2010-06-10 Sony Corporation Color filter, method of manufacturing the same, and light-emitting device
KR20150051602A (ko) * 2013-11-05 2015-05-13 엘지디스플레이 주식회사 유기전계발광표시장치 및 그 제조방법
US20150188092A1 (en) * 2013-12-27 2015-07-02 Lg Display Co., Ltd. Organic light emitting diode display device
US20180045863A1 (en) * 2015-02-27 2018-02-15 Corning Incorporated Optical assembly having microlouvers

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Publication number Priority date Publication date Assignee Title
JP2009110873A (ja) * 2007-10-31 2009-05-21 Toppan Printing Co Ltd 表示装置
US20100141116A1 (en) * 2008-12-05 2010-06-10 Sony Corporation Color filter, method of manufacturing the same, and light-emitting device
KR20150051602A (ko) * 2013-11-05 2015-05-13 엘지디스플레이 주식회사 유기전계발광표시장치 및 그 제조방법
US20150188092A1 (en) * 2013-12-27 2015-07-02 Lg Display Co., Ltd. Organic light emitting diode display device
US20180045863A1 (en) * 2015-02-27 2018-02-15 Corning Incorporated Optical assembly having microlouvers

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022261275A1 (fr) * 2021-06-11 2022-12-15 Corning Incorporated Article de transformation optique

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TW202107427A (zh) 2021-02-16
CN113710956A (zh) 2021-11-26
KR20210132230A (ko) 2021-11-03

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