WO2020187561A3 - Abdeckung für ein optoelektronisches bauteil, optoelektronisches bauteil, verwendung eines optoelektronischen bauteils und verfahren zur herstellung einer abdeckung für ein optoelektronisches bauteil - Google Patents

Abdeckung für ein optoelektronisches bauteil, optoelektronisches bauteil, verwendung eines optoelektronischen bauteils und verfahren zur herstellung einer abdeckung für ein optoelektronisches bauteil Download PDF

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Publication number
WO2020187561A3
WO2020187561A3 PCT/EP2020/055559 EP2020055559W WO2020187561A3 WO 2020187561 A3 WO2020187561 A3 WO 2020187561A3 EP 2020055559 W EP2020055559 W EP 2020055559W WO 2020187561 A3 WO2020187561 A3 WO 2020187561A3
Authority
WO
WIPO (PCT)
Prior art keywords
optoelectronic component
cover
housing frame
producing
glass sheet
Prior art date
Application number
PCT/EP2020/055559
Other languages
English (en)
French (fr)
Other versions
WO2020187561A2 (de
Inventor
Christian Hugel
Markus Boss
Original Assignee
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Publication of WO2020187561A2 publication Critical patent/WO2020187561A2/de
Publication of WO2020187561A3 publication Critical patent/WO2020187561A3/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B32B27/322—Layered products comprising a layer of synthetic resin comprising polyolefins comprising halogenated polyolefins, e.g. PTFE
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements
    • G01S7/4811—Constructional features, e.g. arrangements of optical elements common to transmitter and receiver
    • G01S7/4813—Housing arrangements
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/14—Coupling media or elements to improve sensor contact with skin or tissue
    • A61B2562/146—Coupling media or elements to improve sensor contact with skin or tissue for optical coupling
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/16—Details of sensor housings or probes; Details of structural supports for sensors
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/02—Detecting, measuring or recording pulse, heart rate, blood pressure or blood flow; Combined pulse/heart-rate/blood pressure determination; Evaluating a cardiovascular condition not otherwise provided for, e.g. using combinations of techniques provided for in this group with electrocardiography or electroauscultation; Heart catheters for measuring blood pressure
    • A61B5/024—Detecting, measuring or recording pulse rate or heart rate
    • A61B5/02416—Detecting, measuring or recording pulse rate or heart rate using photoplethysmograph signals, e.g. generated by infrared radiation
    • A61B5/02427—Details of sensor
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/145—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue
    • A61B5/1455—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue using optical sensors, e.g. spectral photometrical oximeters
    • A61B5/14551—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue using optical sensors, e.g. spectral photometrical oximeters for measuring blood gases
    • A61B5/14552—Details of sensors specially adapted therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
    • B32B2379/08—Polyimides
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/26—Windows; Cover glasses; Sealings therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing

Abstract

Es wird eine Abdeckung für ein optoelektronisches Bauteil angegeben mit -einer Glasplatte (1), die durchlässig für elektromagnetische Strahlung ist, und -einem Gehäuserahmen (3), der undurchlässig für elektromagnetische Strahlung ist, wobei -der Gehäuserahmen (3) mit einem Kunststoffmaterial gebildet ist, -der Gehäuserahmen (3) Kanten (11) der Glasplatte (1) bedeckt, und -der Gehäuserahmen (3) und die Glasplatte (1) eine Kavität (4) stellenweise umschließen.
PCT/EP2020/055559 2019-03-19 2020-03-03 Abdeckung für ein optoelektronisches bauteil, optoelektronisches bauteil, verwendung eines optoelektronischen bauteils und verfahren zur herstellung einer abdeckung für ein optoelektronisches bauteil WO2020187561A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102019107003.1 2019-03-19
DE102019107003.1A DE102019107003A1 (de) 2019-03-19 2019-03-19 Abdeckung für ein optoelektronisches Bauteil, optoelektronisches Bauteil, Verwendung eines optoelektronischen Bauteils und Verfahren zur Herstellung einer Abdeckung für ein optoelektronisches Bauteil

Publications (2)

Publication Number Publication Date
WO2020187561A2 WO2020187561A2 (de) 2020-09-24
WO2020187561A3 true WO2020187561A3 (de) 2021-03-25

Family

ID=69804845

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2020/055559 WO2020187561A2 (de) 2019-03-19 2020-03-03 Abdeckung für ein optoelektronisches bauteil, optoelektronisches bauteil, verwendung eines optoelektronischen bauteils und verfahren zur herstellung einer abdeckung für ein optoelektronisches bauteil

Country Status (2)

Country Link
DE (1) DE102019107003A1 (de)
WO (1) WO2020187561A2 (de)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4168102A (en) * 1976-10-12 1979-09-18 Tokyo Shibaura Electric Co., Ltd. Light-emitting display device including a light diffusing bonding layer
US20020093026A1 (en) * 2001-01-17 2002-07-18 Chien-Ping Huang Image sensor of a quad flat package
US20110032409A1 (en) * 2007-12-19 2011-02-10 Heptagon Oy Optical module for a camera device, baffle substrate, wafer scale package, and manufacturing methods therefor
US20110260176A1 (en) * 2008-05-12 2011-10-27 Pioneer Corporation Light-emitting sensor device and method for manufacturing the same
US20140218340A1 (en) * 2013-02-05 2014-08-07 Apple Inc. Optical proximity sensor system having reduced sensitivity to distinct near-field optical effects
WO2015076750A1 (en) * 2013-11-22 2015-05-28 Heptagon Micro Optics Pte. Ltd. Compact optoelectronic modules
US20160268770A1 (en) * 2015-03-09 2016-09-15 Stanley Electric Co., Ltd. Laser light-emitting apparatus
DE102017110317A1 (de) * 2017-05-12 2018-11-15 Osram Opto Semiconductors Gmbh Abdeckung für ein optoelektronisches Bauelement und optoelektronisches Bauteil

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6995462B2 (en) * 2003-09-17 2006-02-07 Micron Technology, Inc. Image sensor packages

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4168102A (en) * 1976-10-12 1979-09-18 Tokyo Shibaura Electric Co., Ltd. Light-emitting display device including a light diffusing bonding layer
US20020093026A1 (en) * 2001-01-17 2002-07-18 Chien-Ping Huang Image sensor of a quad flat package
US20110032409A1 (en) * 2007-12-19 2011-02-10 Heptagon Oy Optical module for a camera device, baffle substrate, wafer scale package, and manufacturing methods therefor
US20110260176A1 (en) * 2008-05-12 2011-10-27 Pioneer Corporation Light-emitting sensor device and method for manufacturing the same
US20140218340A1 (en) * 2013-02-05 2014-08-07 Apple Inc. Optical proximity sensor system having reduced sensitivity to distinct near-field optical effects
WO2015076750A1 (en) * 2013-11-22 2015-05-28 Heptagon Micro Optics Pte. Ltd. Compact optoelectronic modules
US20160268770A1 (en) * 2015-03-09 2016-09-15 Stanley Electric Co., Ltd. Laser light-emitting apparatus
DE102017110317A1 (de) * 2017-05-12 2018-11-15 Osram Opto Semiconductors Gmbh Abdeckung für ein optoelektronisches Bauelement und optoelektronisches Bauteil

Also Published As

Publication number Publication date
WO2020187561A2 (de) 2020-09-24
DE102019107003A1 (de) 2020-09-24

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