WO2020186538A1 - Edid读取系统及edid读取方法 - Google Patents

Edid读取系统及edid读取方法 Download PDF

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Publication number
WO2020186538A1
WO2020186538A1 PCT/CN2019/079435 CN2019079435W WO2020186538A1 WO 2020186538 A1 WO2020186538 A1 WO 2020186538A1 CN 2019079435 W CN2019079435 W CN 2019079435W WO 2020186538 A1 WO2020186538 A1 WO 2020186538A1
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WIPO (PCT)
Prior art keywords
interface
edid
electrically connected
external device
control unit
Prior art date
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Ceased
Application number
PCT/CN2019/079435
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English (en)
French (fr)
Inventor
谢剑军
周明忠
韩东锋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Application filed by Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Publication of WO2020186538A1 publication Critical patent/WO2020186538A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F15/00—Digital computers in general; Data processing equipment in general
    • G06F15/76—Architectures of general purpose stored program computers
    • G06F15/78—Architectures of general purpose stored program computers comprising a single central processing unit
    • G06F15/7807—System on chip, i.e. computer system on a single chip; System in package, i.e. computer system on one or more chips in a single package
    • G06F15/781—On-chip cache; Off-chip memory

Definitions

  • the invention relates to the field of display technology, in particular to an EDID reading system and an EDID reading method.
  • CTR Ray Tube
  • liquid crystal displays which include a liquid crystal display panel and a backlight module.
  • the working principle of the liquid crystal display panel is based on the thin film transistor array substrate (Thin Film Transistor Array Substrate, TFT Array Substrate) and the color filter (Color Filter (CF) liquid crystal molecules are filled between the substrates, and a driving voltage is applied to the two substrates to control the rotation direction of the liquid crystal molecules to refract the light from the backlight module to produce a picture.
  • TFT Array Substrate Thin Film Transistor Array Substrate
  • CF Color Filter
  • the existing liquid crystal display device is generally provided with a data processing chip, such as a system chip (SoC) or a scaler chip (scaler).
  • SoC system chip
  • scaler scaler chip
  • the data processing chip is connected to the externally transmitted image data, processed and transmitted to the display panel of the display device .
  • SoC system chip
  • HDMI high-definition multimedia interface
  • the display device usually records the extended display identification data (Extended Display Identification Data Standard, EDID) of the display device by setting a memory electrically connected to the data processing chip.
  • the extended display identification data of the display device describes the basic parameters of the display device and its performance. For example, information such as manufacturer identification code, product identification code, manufacturing time, maximum display size, color settings, frequency limits, and supported resolutions.
  • the data processing chip When the data processing chip is connected to an external device such as a computer to receive image data, the external device obtains the extended display identification data stored in the memory through the data processing chip to obtain the ability of the display device to support the video source to output the extended display identification data The matched image data is given to the display device to display the video normally.
  • the existing EDID reading system is also provided with a video graphics array
  • the data processing chip 100 of the interface 110 and the high-definition multimedia interface 120 needs to be provided with two independent first memory 200 and a second memory 300 respectively connected to the video graphics array interface 110 and the high-definition multimedia interface 120.
  • the first memory 200 stores The first extended display identification data corresponding to the video graphics array interface 110
  • the second memory 300 stores the second extended display identification data corresponding to the high-definition multimedia structure 120. As shown in FIG.
  • the purpose of the present invention is to provide an EDID reading system with high integration and low cost.
  • Another object of the present invention is to provide an EDID reading method, which can improve the integration of the chip of the display device and reduce the product cost.
  • the present invention first provides an EDID reading system, including a reading chip, an external memory, and an external device;
  • the reading chip includes a control module, an internal memory and multiple interfaces;
  • the control module includes a control unit A transmission unit electrically connected to the control unit and a hot plug detection unit electrically connected to the control unit;
  • the control unit is electrically connected to an external memory and an internal memory, respectively;
  • the transmission unit is electrically connected to multiple interfaces;
  • the hot plug detection unit is electrically connected to a plurality of interfaces respectively; one of the plurality of interfaces is electrically connected to an external device; a plurality of EDIDs corresponding to the plurality of interfaces are stored in the external memory;
  • the control unit is used to read multiple EDIDs from an external memory and store them in the internal memory; the hot plug detection unit is used to detect multiple interfaces, identify the interfaces electrically connected to the external device, and generate and The sensing signal corresponding to the interface electrically connected to the external device is transmitted to the control unit. After receiving the sensing signal, the control unit reads the EDID corresponding to the interface electrically connected to the external device from the internal memory and transmits it to the transmission unit. After receiving the EDID corresponding to the interface electrically connected to the external device, the EDID corresponding to the interface electrically connected to the external device is transmitted to the external device via the interface electrically connected to the external device.
  • the multiple interfaces include a first interface and a second interface; the multiple EDIDs include a first EDID and a second EDID corresponding to the first interface and the second interface, respectively.
  • the first interface is a video graphics array interface
  • the second interface is a high-definition multimedia interface.
  • the external device includes a hot-plug signal line and a reading unit; the interface electrically connected to the external device electrically connects the hot-plug signal line with the hot-plug detection unit and electrically connects the reading unit with the transmission unit;
  • the hot plug detection unit detects a plurality of interfaces to detect hot plug signal lines, and identifies the interface that electrically connects the hot plug detection unit and the hot plug signal line as an electrical connection to the outside
  • the transmission unit After receiving the EDID corresponding to the interface electrically connected to the external device, transmits the EDID corresponding to the interface electrically connected to the external device to the reading unit via the interface electrically connected to the external device.
  • the external device is a computer
  • the external memory is an electrically erasable programmable read-only memory;
  • the internal memory is a random access memory;
  • the reading chip is a system chip or a zoom chip.
  • the present invention also provides an EDID reading method, which includes the following steps:
  • Step S1 Provide an EDID reading system
  • the EDID reading system includes a reading chip, an external memory, and external equipment; the reading chip includes a control module, an internal memory, and multiple interfaces; the control module includes a control unit, and a transmission unit electrically connected to the control unit And a hot plug detection unit electrically connected to the control unit; the control unit is electrically connected to an external memory and an internal memory, respectively; the transmission unit is electrically connected to a plurality of interfaces; the hot plug detection unit is electrically connected to Multiple interfaces are electrically connected; one of the multiple interfaces is electrically connected to an external device; the external memory stores multiple EDIDs corresponding to the multiple interfaces;
  • Step S2 the control unit reads multiple EDIDs from the external memory and stores them in the internal memory;
  • Step S3 The hot plug detection unit detects multiple interfaces, identifies the interface electrically connected to the external device, generates a sensing signal corresponding to the interface electrically connected to the external device, and transmits it to the control unit;
  • Step S4 The control unit reads the EDID corresponding to the interface electrically connected to the external device from the internal memory and transmits it to the transmission unit; the transmission unit electrically connects the EDID corresponding to the interface electrically connected to the external device to the external The interface of the device is transmitted to the external device.
  • the multiple interfaces include a first interface and a second interface; the multiple EDIDs include a first EDID and a second EDID corresponding to the first interface and the second interface, respectively;
  • the external device is a computer
  • the external memory is an electrically erasable programmable read-only memory;
  • the internal memory is a random access memory;
  • the reading chip is a system chip or a zoom chip.
  • the first interface is a video graphics array interface
  • the second interface is a high-definition multimedia interface.
  • the external device includes a hot-swappable signal line and a reading unit; both the hot-swappable signal line and the reading unit are electrically connected to the same one of the multiple interfaces, so that the external device is connected to one of the multiple interfaces. Electrical connection
  • the hot plug detection unit detects multiple interfaces, identifies the interface electrically connected with the hot plug signal line, and generates a sensing signal transmission corresponding to the interface electrically connected to the external device
  • the transmission unit transmits the EDID corresponding to the interface electrically connected to the external device to the reading unit via the interface electrically connected to the external device.
  • Each EDID includes multiple sub-parts
  • the step S4 specifically includes:
  • Step S41 The control unit reads the EDID corresponding to the interface electrically connected to the external device from the internal memory;
  • Step S42 The control unit selects one of the multiple sub-parts of the EDID corresponding to the interface electrically connected to the external device as the sub-part to be transmitted;
  • Step S43 The control unit transmits the sub-part to be transmitted to the transmission unit;
  • Step S44 The transmission unit buffers the sub-part to be transmitted
  • Step S45 The transmission unit transmits the buffered sub-part to be transmitted to the external device via the interface electrically connected to the external device;
  • Step S46 The transmission unit transmits an interrupt signal to the control unit
  • Step S47 The control unit determines whether there are sub-parts of the EDID corresponding to the interface electrically connected to the external device that have not been transmitted to the transmission unit, if otherwise, the transmission is terminated, and if so, the sub-parts that have not been transmitted to the transmission unit are selected One of them is the sub-part to be transmitted and returns to step S43.
  • an EDID reading system provided by the present invention includes a reading chip, an external memory and an external device.
  • the reading chip includes a control module, an internal memory and multiple interfaces.
  • the control module includes a control unit, a transmission unit and Hot-plug detection unit.
  • the control unit reads multiple EDIDs from the external memory and stores them in the internal memory.
  • the hot-plug detection unit detects multiple interfaces, identifies the interfaces that are electrically connected to external devices, and Generate a sensing signal corresponding to the interface and transmit it to the control unit.
  • the control unit reads the EDID corresponding to the interface from the internal memory and transmits it to the transmission unit.
  • the transmission unit transmits the EDID corresponding to the interface to the external device via the interface, There is no need to set multiple memories outside the reading chip, which effectively improves the integration of the product and reduces the cost of the product.
  • the EDID reading method provided by the present invention can improve the integration of the chip of the display device and reduce the product cost.
  • Fig. 1 is a schematic structural diagram of an existing EDID reading system
  • FIG. 2 is a schematic diagram of the structure of the EDID reading system of the present invention.
  • FIG. 3 is a schematic diagram of the structure of the external memory of the EDID reading system of the present invention.
  • Fig. 4 is a flowchart of the EDID reading method of the present invention.
  • the present invention provides a EDID Reading system, including reading chip 10 , External memory 20 And external equipment 30 .
  • the reading chip 10 Includes control module 11 , Internal memory 12 And multiple interfaces 13 .
  • the control module 11 Including control unit 111 , And control unit 111 Electrically connected transmission unit 112 And control unit 111 Hot plug detection unit electrically connected 113 .
  • the control unit 111 Electrically connect external storage 20 And internal memory 12 .
  • the transmission unit 112 Electrically connect multiple interfaces 13 .
  • the hot plug detection unit 113 Electrically connect multiple interfaces separately 13 . Multiple interfaces 13 One of the external devices 30 Electrical connection.
  • the external memory 20 Internal storage has multiple interfaces 13 Corresponding multiple EDID .
  • the control unit 111 Used from external storage 20 Read multiple EDID And store in internal memory 12 .
  • the hot plug detection unit 113 For multiple interfaces 13 Perform detection, identification and external equipment 30 Electrical connection interface 13 And generate electrical connection with external equipment 30 Interface 13
  • the corresponding sensing signal is transmitted to the control unit 111 ,control unit 111 From the internal memory after receiving the sensing signal 12 Read and electrically connect external devices 30 Interface 13 corresponding EDID And transfer to the transmission unit 112 , Transmission unit 112 After receiving the electrical connection with the external device 30 Interface 13 corresponding EDID Then it will be electrically connected to external equipment 30 Interface 13 corresponding EDID Connect external devices electrically 30 Interface 13 Transfer to external device 30 .
  • the external memory 20 Chip setting data is also stored, and the control unit 111 In multiple EDID Store in internal memory 12 Later, also read the external memory 20 Chip setting data stored in and stored in internal memory 12 Medium, used to read the chip 10 Settings.
  • multiple interfaces 13 Including the first interface 131 And the second interface 132 , which is the interface 13 The number is two.
  • Said multiple EDID Including the first interface 131 And the second interface 132 Corresponding first EDID And second EDID .
  • the interface 13 The number can also be greater than two.
  • the first interface 131 Is a video graphics array interface
  • the second interface 132 It is a high-definition multimedia interface.
  • the first interface 131 And the second interface 132 It may also be other commonly used interfaces in the prior art, and will not affect the implementation of the present invention.
  • the external device 30 Includes hot-swappable signal cable 31 And reading unit 32 . Electrically connect external devices 30 Interface 13 Hot-swappable signal line 31 And hot plug detection unit 113 Electrical connection and reading unit 32 And transmission unit 112 Electrical connection.
  • the hot plug detection unit 113 For multiple interfaces 13 Detect to hot-plug the signal line 31 Perform detection, identify hot plug detection unit 113 With hot-swappable signal line 31 Electrical connection interface 13 As an electrical connection to external equipment 30 Interface, transmission unit 12 After receiving the electrical connection with the external device 30 Interface 13 corresponding EDID Then connect the external device electrically 30 Interface 13 corresponding EDID Connect external devices electrically 30 Interface 13 Transfer to reading unit 32 .
  • the reading unit 32 And transmission unit 12 Can constitute I2C Master-slave structure to read the unit 32 As I2C Transmission unit 12 As I2C Slave, and then the transmission unit 12 able to pass I2C Bus and multiple interfaces 13 Electrical connection, reading unit 32 through I2C Bus and connecting external devices 30 Interface 13 Electrical connection.
  • the external device 30 For the computer.
  • the external memory 20 It is an electrically erasable programmable read-only memory.
  • the internal memory 12 For random access memory.
  • the reading chip 10 For system chip or zoom chip.
  • the hot plug detection unit 113 For multiple interfaces 13 After detection, identify with external equipment 30 Electrical connection interface 13 First interface 131 , Produced with the first interface 131 The corresponding sensing signal is transmitted to the control unit 111 ,control unit 111 From the internal memory after receiving the sensing signal 12 Read and first interface 131 corresponding EDID And transfer to the transmission unit 112 , Transmission unit 112 After receiving the first interface 131 corresponding EDID The first interface 131 corresponding EDID Via the first interface 131 Transfer to external device 30 .
  • the hot plug detection unit 113 For multiple interfaces 13 After detection, identify with external equipment 30 Electrical connection interface 13 Second interface 132 , Generate and second interface 132 The corresponding sensing signal is transmitted to the control unit 111 ,control unit 111 From the internal memory after receiving the sensing signal 12 Read and second interface 132 corresponding EDID And transfer to the transmission unit 112 , Transmission unit 112 After receiving the second interface 132 corresponding EDID Second interface 132 corresponding EDID Via the second interface 132 Transfer to external device 30 .
  • the external memory 20 Can include independent first storage areas twenty one , The second storage area twenty two , The third storage area twenty three And the fourth storage area twenty four , The first storage area twenty one Used to store the first EDID , The second storage area twenty two Used to store the second EDID , The third storage area twenty three Used to store chip setting data, the fourth storage area twenty four Used to read the chip 10 Other data needed.
  • each EDID Both include multiple subsections.
  • the control unit 111 From the internal memory after receiving the sensing signal 12 Read and electrically connect external devices 30 Interface 13 corresponding EDID After that, the control unit 111 Will be electrically connected to external equipment 30 Interface 13 corresponding EDID Transfer to transfer unit 112 And transmission unit 112 After receiving the electrical connection with the external device 30 Interface 13 corresponding EDID Then it will be electrically connected to external equipment 30 Interface 13 corresponding EDID Connect external devices electrically 30 Interface 13 Transfer to external device 30
  • the specific process is: First, the control unit 111 Select electrical connection to external equipment 30 Interface 13 corresponding EDID One of the multiple sub-parts is the sub-part to be transmitted and the sub-part to be transmitted is transmitted to the transmission unit 112 , And then the transmission unit 112 Buffer the sub-part to be transmitted, and then the transmission unit 112 Electrically connect the buffered sub-part to be transmitted to the external device 30 Interface 13 Transfer to external device 30 , After the transmission is completed, the transmission unit 112 To control unit
  • each sub-part and the transmission unit 112 Match the cache capacity, which can be 1 Bytes ( byte ) Or more than one byte.
  • control unit 111 From external storage 20 Read multiple EDID Before you need to set up the reading chip 10 Power on and read the chip 10 Carry out the steps of initialization to ensure the normal operation of the system.
  • the EDID Reading system just reading the chip 10
  • An external storage 20 Use this external memory 20 Store multiple at the same time EDID
  • Use the control unit at work 111 From external storage 20 Read multiple EDID And store in internal memory 12 , Using hot plug detection unit 113 For multiple interfaces 13 Perform detection, identification and external equipment 30 Electrical connection interface 13 And generate the interface 13
  • the corresponding sensing signal is transmitted to the control unit 111 ,control unit 111 From internal memory 12 Read the interface 13 corresponding EDID And transfer to the transmission unit 112 , Transmission unit 112 Will interface with that 13 corresponding EDID Via the interface 13 Transfer to external device 30
  • the present invention greatly reduces the number of memories, effectively improves product integration, and reduces product cost.
  • the present invention also provides a EDID
  • the reading method includes the following steps:
  • step S1 provide EDID Read the system.
  • Said EDID Reading system includes reading chip 10 , External memory 20 And external equipment 30 .
  • the reading chip 10 Includes control module 11 , Internal memory 12 And multiple interfaces 13 .
  • the control module 11 Including control unit 111 , And control unit 111 Electrically connected transmission unit 112 And control unit 111 Hot plug detection unit electrically connected 113 .
  • the control unit 111 Electrically connect external storage 20 And internal memory 12 .
  • the transmission unit 112 Electrically connect multiple interfaces 13 .
  • the hot plug detection unit 113 Electrically connect multiple interfaces separately 13 . Multiple interfaces 13 One of the external devices 30 Electrical connection.
  • the external memory 20 Internal storage has multiple interfaces 13 Corresponding multiple EDID .
  • multiple interfaces 13 Including the first interface 131 And the second interface 132 , which is the interface 13 The number is two.
  • Said multiple EDID Including the first interface 131 And the second interface 132 Corresponding first EDID And second EDID .
  • the interface 13 The number can also be greater than two.
  • the first interface 131 With external equipment 30 The electrical connection, of course, in other embodiments, can also be the second interface 132 With external equipment 30 Electrical connection.
  • the first interface 131 Is a video graphics array interface
  • the second interface 132 It is a high-definition multimedia interface.
  • the first interface 131 And the second interface 132 It may also be other commonly used interfaces in the prior art, and will not affect the implementation of the present invention.
  • the external memory 20 Chip setting data is also stored.
  • the external device 30 For the computer.
  • the external memory 20 It is an electrically erasable programmable read-only memory.
  • the internal memory 12 For random access memory.
  • the reading chip 10 For system chip or zoom chip.
  • the external device 30 Includes hot-swappable signal cable 31 And reading unit 32 . Electrically connect external devices 30 Interface 13 Hot-swappable signal line 31 And hot plug detection unit 113 Electrical connection and reading unit 32 And transmission unit 112 Electrical connection.
  • the reading unit 32 And transmission unit 12 Can constitute I2C Master-slave structure to read the unit 32 As I2C Transmission unit 12 As I2C Slave, and then the transmission unit 12 able to pass I2C Bus and multiple interfaces 13 Electrical connection, reading unit 32 through I2C Bus and connecting external devices 30 Interface 13 Electrical connection.
  • the external memory 20 Can include independent first storage areas twenty one , The second storage area twenty two , The third storage area twenty three And the fourth storage area twenty four , The first storage area twenty one Used to store the first EDID , The second storage area twenty two Used to store the second EDID , The third storage area twenty three Used to store chip setting data, the fourth storage area twenty four Used to read the chip 10 Other data needed.
  • step S2 The control unit 111 From external storage 20 Read multiple EDID And store in internal memory 12 .
  • the steps S2 Before also including the reading chip 10 Power-on and read chip 10 Carry out the steps of initialization to ensure the normal operation of the system.
  • step S3 The hot plug detection unit 113 For multiple interfaces 13 Perform detection, identification and external equipment 30 Electrical connection interface 13 And generate electrical connection with external equipment 30 Interface 13 The corresponding sensing signal is transmitted to the control unit 111 .
  • the hot plug detection unit 113 For multiple interfaces 13 Detect to hot-plug the signal line 31 Perform detection, identify hot plug detection unit 113 With hot-swappable signal line 31 Electrical connection interface 13 As an electrical connection to external equipment 30 Interface 13 .
  • the steps S3 , The hot plug detection unit 113 for multiple interfaces 13 After detection, identify with external equipment 30 Electrical connection interface 13 First interface 131 , Produced with the first interface 131 The corresponding sensing signal is transmitted to the control unit 111 .
  • step S4 The control unit 111 From internal memory 12 Read and electrically connect external devices 30 Interface 13 corresponding EDID And transfer to the transmission unit 112 .
  • the transmission unit 112 Will be electrically connected to external equipment 30 Interface 13 corresponding EDID Connect external devices electrically 30 Interface 13 Transfer to external device 30 .
  • control unit 111 From internal memory 12 Read and first interface 131 corresponding EDID And transfer to the transmission unit 112 , Transmission unit 112 After receiving the first interface 131 corresponding EDID The first interface 131 corresponding EDID Via the first interface 131 Transfer to external device 30 .
  • the steps S4 In the transmission unit 12 After receiving the electrical connection with the external device 30 Interface 13 corresponding EDID Then connect the external device electrically 30 Interface 13 corresponding EDID Connect external devices electrically 30 Interface 13 Transfer to reading unit 32 .
  • each EDID Both include multiple subsections.
  • the steps S4 Specifically:
  • step S41 The control unit 111 From internal memory 12 Read electrical connections to external devices 30 Interface 13 corresponding EDID .
  • step S42 The control unit 111 Select electrical connection to external equipment 30 Interface 13 corresponding EDID One of the multiple sub-parts is the sub-part to be transmitted.
  • step S43 The control unit 111 Transfer the sub-part to be transferred to the transfer unit 112 .
  • step S44 The transmission unit 112 Cache the sub-part to be transmitted.
  • step S45 The transmission unit 112 Electrically connect the buffered sub-part to be transmitted to the external device 30 Interface 13 Transfer to external device 30 .
  • step S46 The transmission unit 112 To control unit 111 Transmission interrupt signal;
  • step S47 The control unit 111 Determine the electrical connection of external equipment 30 Interface 13 corresponding EDID Whether there are multiple sub-parts that have not been transmitted to the transmission unit 112 The sub-part of, if otherwise, end the transmission, if yes, select the untransmitted 112 One of the subsections is the subsection to be transmitted and return to step S43 .
  • each sub-part and the transmission unit 112 Match the cache capacity, which can be 1 Bytes ( byte ) Or more than one byte.
  • the EDID Reading method using external memory 20 Store multiple at the same time EDID
  • Using hot plug detection unit 113 for multiple interfaces 13 Perform detection, identification and external equipment 30 Electrical connection interface 13 And generate the interface 13
  • the corresponding sensing signal is transmitted to the control unit 111 ,control unit 111 From internal memory 12 Read the interface 13 corresponding EDID And transfer to the transmission unit 112 , Transmission unit 112 Will interface with that 13 corresponding EDID Via the interface 13 Transfer to external device 30
  • the present invention greatly reduces the number of memories, effectively improves product integration, and reduces product cost.
  • the reading system includes a reading chip, external memory and external equipment.
  • the reading chip includes a control module, an internal memory and multiple interfaces.
  • the control module includes a control unit, a transmission unit and a hot plug detection unit.
  • the control unit External memory read multiple EDID And stored in the internal memory, the hot plug detection unit detects multiple interfaces, identifies the interface that is electrically connected to the external device, and generates a sensing signal corresponding to the interface and transmits it to the control unit.
  • the control unit reads from the internal memory Take the one corresponding to the interface EDID And transmitted to the transmission unit, the transmission unit will correspond to the interface EDID It is transmitted to an external device through this interface, and there is no need to set multiple memories outside the reading chip, which effectively improves the integration level of the product and reduces the cost of the product.
  • EDID The reading method can improve the integration degree of the chip of the display device and reduce the product cost.

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Abstract

本发明提供一种EDID读取系统及EDID读取方法。本发明的EDID读取系统包括读取芯片、外部存储器及外部设备，读取芯片包括控制模块、内部存储器及多个接口，控制模块包括控制单元、传输单元及热插拔侦测单元，工作时，控制单元从外部存储器读取多个EDID并存入内部存储器，热插拔侦测单元对多个接口进行侦测，识别与外部设备电性连接的接口并产生与该接口对应的感测信号传输至控制单元，控制单元从内部存储器读取与该接口对应的EDID并传输至传输单元，传输单元将与该接口对应的EDID经该接口传输至外部设备，无需在读取芯片外部设置多个存储器，有效的提高了产品的集成度，并降低了产品的成本。

Description

EDID读取系统及EDID读取方法 技术领域
本发明涉及显示技术领域，尤其涉及一种EDID读取系统及EDID读取方法。
 背景技术
随着显示技术的发展，液晶显示器（Liquid Crystal Display，LCD）等平面显示装置因具有高画质、省电、机身薄及应用范围广等优点，已经逐步取代阴极射线管（Cathode Ray Tube，CRT）显示屏，被广泛的应用于手机、电视、个人数字助理、数字相机、笔记本电脑、台式计算机等各种消费性电子产品，成为显示装置中的主流。
现有市场上的液晶显示器大部分为背光型液晶显示器，其包括液晶显示面板及背光模组（backlight module）。液晶显示面板的工作原理是在薄膜晶体管阵列基板（Thin Film Transistor Array Substrate，TFT Array Substrate）与彩色滤光片（Color Filter，CF）基板之间灌入液晶分子，并在两片基板上施加驱动电压来控制液晶分子的旋转方向，以将背光模组的光线折射出来产生画面。
现有的液晶显示装置一般设置有一数据处理芯片，例如系统芯片（SoC）或缩放芯片（scaler），数据处理芯片接入外部传输的图像数据并对其进行处理后传输至显示装置的显示面板中。随着液晶显示技术朝着更高解析度和更高集成度的方向发展，其数据处理芯片也从之前的仅支持视频图形阵列接口（VGA）接收图像数据逐渐发展至支持高清晰多媒体接口（HDMI）接收图像数据，也有数据处理芯片同时支持视频图形阵列接口及高清晰多媒体接口，兼容性越来越高。显示装置通常通过设置与数据处理芯片电性连接的存储器记录显示装置的扩展显示识别数据 （Extended Display Identification Data Standard，EDID），显示装置的扩展显示识别数据描述了显示装置及其性能的基本参数，例如制造商识别码、产品识别码、制造时间、最大显示尺寸、色彩设置、频率限制和支持的分辨率等信息。当数据处理芯片与计算机等外部装置连接以接收图像数据时，外部装置通过数据处理芯片获取存储在存储器中的扩展显示识别数据以获取显示装置支持视频源的能力，以输出与该扩展显示识别数据匹配的图像数据给显示装置使其得以正常显示视频。同一显示装置在通过视频图形阵列接口及高清晰多媒体结构接收图像数据时，所对应的扩展显示识别数据是不同的，请参阅图1，现有的EDID读取系统中，同时设置有视频图形阵列接口110及高清晰多媒体接口120的数据处理芯片100需要设置两个互相独立且分别与视频图形阵列接口110及高清晰多媒体接口120连接的第一存储器200及第二存储器300，第一存储器200存储与视频图形阵列接口110对应的第一扩展显示识别数据，第二存储器300存储与高清晰多媒体结构120对应的第二扩展显示识别数据，如图1所示，当数据处理芯片100通过视频图形阵列接口110与外部输入设备400相连时，外部输入设备400直接读取第一存储器200中的第一扩展显示识别数据以输出与第一扩展显示识别数据匹配的图像数据至数据处理芯片100，同理，当数据处理芯片100通过高清晰多媒体接口120与外部输入设备400相连时，外部输入设备400直接读取第二存储器300中的第二扩展显示识别数据以输出与第二扩展显示识别数据匹配的图像数据出至数据处理芯片100。此种架构需要设置两个单独的存储器来存储不同的扩展显示识别数据，产品的集成度相对较低，产品成本较高。
 技术问题
本发明的目的在于提供一种EDID读取系统，集成度高，成本低。
本发明的另一目的在于提供一种EDID读取方法，能够提升显示装置的芯片的集成度，降低产品成本。
 技术解决方案
为实现上述目的，本发明首先提供一种EDID读取系统，包括读取芯片、外部存储器及外部设备；所述读取芯片包括控制模块、内部存储器及多个接口；所述控制模块包括控制单元、与控制单元电性连接的传输单元及与控制单元电性连接的热插拔侦测单元；所述控制单元分别电性连接外部存储器及内部存储器；所述传输单元电性连接多个接口；所述热插拔侦测单元分别电性连接多个接口；多个接口中的一个与外部设备电性连接；所述外部存储器内存储有分别与多个接口对应的多个EDID；
所述控制单元用于从外部存储器读取多个EDID并存入内部存储器；所述热插拔侦测单元用于对多个接口进行侦测，识别与外部设备电性连接的接口并产生与电性连接外部设备的接口对应的感测信号传输至控制单元，控制单元在接收到感测信号后从内部存储器读取与电性连接外部设备的接口对应的EDID并传输至传输单元，传输单元在接收到与电性连接外部设备的接口对应的EDID后将与电性连接外部设备的接口对应的EDID经电性连接外部设备的接口传输至外部设备。
多个接口包括第一接口及第二接口；所述多个EDID包括分别与第一接口及第二接口对应的第一EDID及第二EDID。
所述第一接口为视频图形阵列接口，所述第二接口为高清晰多媒体接口。
所述外部设备包括热插拔信号线及读取单元；电性连接外部设备的接口将热插拔信号线与热插拔侦测单元电性连接并将读取单元与传输单元电性连接；
所述热插拔侦测单元对多个接口进行侦测以对热插拔信号线进行侦测，识别将热插拔侦测单元与热插拔信号线电性连接的接口作为电性连接外部设备的接口，传输单元在接收到与电性连接外部设备的接口对应的EDID后将电性连接外部设备的接口对应的EDID经电性连接外部设备的接口传输至读取单元。
所述外部设备为计算机；
所述外部存储器为电可擦可编程只读存储器；所述内部存储器为随机存储器；
所述读取芯片为系统芯片或缩放芯片。
本发明还提供一种EDID读取方法，包括如下步骤：
步骤S1、提供EDID读取系统；
所述EDID读取系统包括读取芯片、外部存储器及外部设备；所述读取芯片包括控制模块、内部存储器及多个接口；所述控制模块包括控制单元、与控制单元电性连接的传输单元及与控制单元电性连接的热插拔侦测单元；所述控制单元分别电性连接外部存储器及内部存储器；所述传输单元电性连接多个接口；所述热插拔侦测单元分别电性连接多个接口；多个接口中的一个与外部设备电性连接；所述外部存储器内存储有分别与多个接口对应的多个EDID；
步骤S2、所述控制单元从外部存储器读取多个EDID并存入内部存储器；
步骤S3、所述热插拔侦测单元对多个接口进行侦测，识别与外部设备电性连接的接口并产生与电性连接外部设备的接口对应的感测信号传输至控制单元；
步骤S4、所述控制单元从内部存储器读取与电性连接外部设备的接口对应的EDID并传输至传输单元；所述传输单元将与电性连接外部设备的接口对应的EDID经电性连接外部设备的接口传输至外部设备。
多个接口包括第一接口及第二接口；所述多个EDID包括分别与第一接口及第二接口对应的第一EDID及第二EDID；
所述外部设备为计算机；
所述外部存储器为电可擦可编程只读存储器；所述内部存储器为随机存储器；
所述读取芯片为系统芯片或缩放芯片。
所述第一接口为视频图形阵列接口，所述第二接口为高清晰多媒体接口。
所述外部设备包括热插拔信号线及读取单元；所述热插拔信号线及读取单元均与多个接口中的同一个电性连接，从而使得外部设备与多个接口中的一个电性连接；
所述步骤S3中，所述热插拔侦测单元对多个接口进行侦测，识别与热插拔信号线电性连接的接口并产生与电性连接外部设备的接口对应的感测信号传输至控制单元，所述步骤S4中，所述传输单元将电性连接外部设备的接口对应的EDID经电性连接外部设备的接口传输至读取单元。
每一EDID均包括多个子部分；
所述步骤S4具体包括：
步骤S41、所述控制单元从内部存储器读取电性连接外部设备的接口对应的EDID；
步骤S42、所述控制单元选取电性连接外部设备的接口对应的EDID的多个子部分中的一个为待传输子部分；
步骤S43、所述控制单元将待传输子部分传输至传输单元；
步骤S44、所述传输单元对待传输子部分进行缓存；
步骤S45、所述传输单元将缓存的待传输子部分经电性连接外部设备的接口传输至外部设备；
步骤S46、所述传输单元向控制单元传输中断信号；
步骤S47、所述控制单元判定电性连接外部设备的接口对应的EDID的多个子部分中是否存在未传输至传输单元的子部分，若否则结束传输，若是则选取未传输至传输单元的子部分中的一个为待传输子部分并返回步骤S43。
 有益效果
本发明的有益效果：本发明提供的一种EDID读取系统包括读取芯片、外部存储器及外部设备，读取芯片包括控制模块、内部存储器及多个接口，控制模块包括控制单元、传输单元及热插拔侦测单元，工作时，控制单元从外部存储器读取多个EDID并存入内部存储器，热插拔侦测单元对多个接口进行侦测，识别与外部设备电性连接的接口并产生与该接口对应的感测信号传输至控制单元，控制单元从内部存储器读取与该接口对应的EDID并传输至传输单元，传输单元将与该接口对应的EDID经该接口传输至外部设备，无需在读取芯片外部设置多个存储器，有效的提高了产品的集成度，并降低了产品的成本。本发明提供的一种EDID读取方法能够提升显示装置的芯片的集成度，降低产品成本。
 附图说明
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图中，
图1为现有的一种EDID读取系统的结构示意图；
图2为本发明的EDID读取系统的结构示意图；
图3为本发明的EDID读取系统的外部存储器的结构示意图；
图4为本发明的EDID读取方法的流程图。
 本发明的实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图 2 ，本发明提供一种 EDID 读取系统，包括读取芯片 10 、外部存储器 20 及外部设备 30 。所述读取芯片 10 包括控制模块 11 、内部存储器 12 及多个接口 13 。所述控制模块 11 包括控制单元 111 、与控制单元 111 电性连接的传输单元 112 及与控制单元 111 电性连接的热插拔侦测单元 113 。所述控制单元 111 分别电性连接外部存储器 20 及内部存储器 12 。所述传输单元 112 电性连接多个接口 13 。所述热插拔侦测单元 113 分别电性连接多个接口 13 。多个接口 13 中的一个与外部设备 30 电性连接。所述外部存储器 20 内存储有分别与多个接口 13 对应的多个 EDID 。
所述控制单元 111 用于从外部存储器 20 读取多个 EDID 并存入内部存储器 12 。所述热插拔侦测单元 113 用于对多个接口 13 进行侦测，识别与外部设备 30 电性连接的接口 13 并产生与电性连接外部设备 30 的接口 13 对应的感测信号传输至控制单元 111 ，控制单元 111 在接收到感测信号后从内部存储器 12 读取与电性连接外部设备 30 的接口 13 对应的 EDID 并传输至传输单元 112 ，传输单元 112 在接收到与电性连接外部设备 30 的接口 13 对应的 EDID 后将与电性连接外部设备 30 的接口 13 对应的 EDID 经电性连接外部设备 30 的接口 13 传输至外部设备 30 。
具体地，所述外部存储器 20 还存储有芯片设定数据，所述控制单元 111 在将多个 EDID 存入内部存储器 12 后，还读取外部存储器 20 中存储的芯片设定数据并存储至内部存储器 12 中，用于读取芯片 10 的设定。
具体地，在图 2 所示的实施例中，多个接口 13 包括第一接口 131 及第二接口 132 ，也即接口 13 的数量为两个。所述多个 EDID 包括分别与第一接口 131 及第二接口 132 对应的第一 EDID 及第二 EDID 。当然，在本发明的其他实施例中，接口 13 的数量也可大于两个。
优选地，所述第一接口 131 为视频图形阵列接口，所述第二接口 132 为高清晰多媒体接口。当然，所述第一接口 131 及所述第二接口 132 也可以为其他现有技术中常用的接口，并不会影响本发明的实现。
具体地，请参阅图 2 ，所述外部设备 30 包括热插拔信号线 31 及读取单元 32 。电性连接外部设备 30 的接口 13 将热插拔信号线 31 与热插拔侦测单元 113 电性连接并将读取单元 32 与传输单元 112 电性连接。所述热插拔侦测单元 113 对多个接口 13 进行侦测以对热插拔信号线 31 进行侦测，识别将热插拔侦测单元 113 与热插拔信号线 31 电性连接的接口 13 作为电性连接外部设备 30 的接口，传输单元 12 在接收到与电性连接外部设备 30 的接口 13 对应的 EDID 后将电性连接外部设备 30 的接口 13 对应的 EDID 经电性连接外部设备 30 的接口 13 传输至读取单元 32 。
进一步地，所述读取单元 32 及传输单元 12 可以构成 I2C 主从结构，以读取单元 32 作为 I2C 主机并以传输单元 12 作为 I2C 从机，进而传输单元 12 可以通过 I2C 总线与多个接口 13 电性连接，读取单元 32 经 I2C 总线与连接外部设备 30 的接口 13 电性连接。
优选地，所述外部设备 30 为计算机。所述外部存储器 20 为电可擦可编程只读存储器。所述内部存储器 12 为随机存储器。所述读取芯片 10 为系统芯片或缩放芯片。
进一步地，在图 2 所示的实施例中，第一接口 131 与外部设备 30 电性连接，因此，图 2 所示的实施例在工作时，所述热插拔侦测单元 113 对多个接口 13 进行侦测后，识别与外部设备 30 电性连接的接口 13 为第一接口 131 ，产生与第一接口 131 对应的感测信号传输至控制单元 111 ，控制单元 111 在接收到感测信号后从内部存储器 12 读取与第一接口 131 对应的 EDID 并传输至传输单元 112 ，传输单元 112 在接收到与第一接口 131 对应的 EDID 后将与第一接口 131 对应的 EDID 经第一接口 131 传输至外部设备 30 。同理，若第二接口 132 与外部设备 30 电性连接，那么相应的实施例在工作时，所述热插拔侦测单元 113 对多个接口 13 进行侦测后，识别与外部设备 30 电性连接的接口 13 为第二接口 132 ，产生与第二接口 132 对应的感测信号传输至控制单元 111 ，控制单元 111 在接收到感测信号后从内部存储器 12 读取与第二接口 132 对应的 EDID 并传输至传输单元 112 ，传输单元 112 在接收到与第二接口 132 对应的 EDID 后将与第二接口 132 对应的 EDID 经第二接口 132 传输至外部设备 30 。
具体地，请参阅图 3 ，所述外部存储器 20 可包括互相独立的第一存储区 21 、第二存储区 22 、第三存储区 23 及第四存储区 24 ，该第一存储区 21 用于存储第一 EDID ，第二存储区 22 用于存储第二 EDID ，第三存储区 23 用于存储芯片设定数据，第四存储区 24 用于读取芯片 10 需要的其他数据。
优选地，每一 EDID 均包括多个子部分。所述控制单元 111 在接收到感测信号后从内部存储器 12 读取与电性连接外部设备 30 的接口 13 对应的 EDID 之后，控制单元 111 将与电性连接外部设备 30 的接口 13 对应的 EDID 传输至传输单元 112 以及传输单元 112 在接收到与电性连接外部设备 30 的接口 13 对应的 EDID 后将与电性连接外部设备 30 的接口 13 对应的 EDID 经电性连接外部设备 30 的接口 13 传输至外部设备 30 的具体过程为：首先，所述控制单元 111 选取电性连接外部设备 30 的接口 13 对应的 EDID 的多个子部分中的一个为待传输子部分并将待传输子部分传输至传输单元 112 ，而后所述传输单元 112 对待传输子部分进行缓存，之后所述传输单元 112 将缓存的待传输子部分经电性连接外部设备 30 的接口 13 传输至外部设备 30 ，完成传输后，传输单元 112 向控制单元 111 传输中断信号，控制单元 111 立刻判定电性连接外部设备 30 的接口 13 对应的 EDID 的多个子部分中是否存在未传输至传输单元 112 的子部分，若否则结束传输，若是则选取未传输至传输单元 112 的子部分中的一个为待传输子部分继续向传输单元 112 进行传输，如此循环直至电性连接外部设备 30 的接口 13 对应的 EDID 传输完成。
进一步地，每一个子部分的大小与传输单元 112 的缓存容量相匹配，可以为 1 个字节（ byte ）或大于一个字节。
具体地，在实际使用过程中，在控制单元 111 从外部存储器 20 中读取多个 EDID 之前还需要设置对读取芯片 10 进行上电及对读取芯片 10 进行初始化的步骤，以保证系统的正常运行。
需要说明的是，本发明的 EDID 读取系统，仅仅在读取芯片 10 的外部设置一个外部存储器 20 ，利用该外部存储器 20 同时存储多个 EDID ，工作时利用控制单元 111 从外部存储器 20 读取多个 EDID 并存入内部存储器 12 ，利用热插拔侦测单元 113 对多个接口 13 进行侦测，识别与外部设备 30 电性连接的接口 13 并产生与该接口 13 对应的感测信号传输至控制单元 111 ，控制单元 111 从内部存储器 12 读取与该接口 13 对应的 EDID 并传输至传输单元 112 ，传输单元 112 将与该接口 13 对应的 EDID 经该接口 13 传输至外部设备 30 ，相比于现有技术对应多个接口需要在芯片外设置多个存储器，本发明大大降低了存储器的数量，有效的提高了产品的集成度，并降低了产品的成本。
请参阅图 4 ，基于同一发明构思，本发明还提供一种 EDID 读取方法，包括如下步骤：
步骤 S1 、提供 EDID 读取系统。
所述 EDID 读取系统包括读取芯片 10 、外部存储器 20 及外部设备 30 。所述读取芯片 10 包括控制模块 11 、内部存储器 12 及多个接口 13 。所述控制模块 11 包括控制单元 111 、与控制单元 111 电性连接的传输单元 112 及与控制单元 111 电性连接的热插拔侦测单元 113 。所述控制单元 111 分别电性连接外部存储器 20 及内部存储器 12 。所述传输单元 112 电性连接多个接口 13 。所述热插拔侦测单元 113 分别电性连接多个接口 13 。多个接口 13 中的一个与外部设备 30 电性连接。所述外部存储器 20 内存储有分别与多个接口 13 对应的多个 EDID 。
具体地，在图 2 所示的实施例中，多个接口 13 包括第一接口 131 及第二接口 132 ，也即接口 13 的数量为两个。所述多个 EDID 包括分别与第一接口 131 及第二接口 132 对应的第一 EDID 及第二 EDID 。当然，在本发明的其他实施例中，接口 13 的数量也可大于两个。进一步地，在图 2 所示的实施例中，第一接口 131 与外部设备 30 电性连接，当然，在其他实施例中，也可以是第二接口 132 与外部设备 30 电性连接。
优选地，所述第一接口 131 为视频图形阵列接口，所述第二接口 132 为高清晰多媒体接口。当然，所述第一接口 131 及所述第二接口 132 也可以为其他现有技术中常用的接口，并不会影响本发明的实现。
具体地，所述外部存储器 20 还存储有芯片设定数据。
优选地，所述外部设备 30 为计算机。所述外部存储器 20 为电可擦可编程只读存储器。所述内部存储器 12 为随机存储器。所述读取芯片 10 为系统芯片或缩放芯片。
具体地，请参阅图 2 ，所述外部设备 30 包括热插拔信号线 31 及读取单元 32 。电性连接外部设备 30 的接口 13 将热插拔信号线 31 与热插拔侦测单元 113 电性连接并将读取单元 32 与传输单元 112 电性连接。
进一步地，所述读取单元 32 及传输单元 12 可以构成 I2C 主从结构，以读取单元 32 作为 I2C 主机并以传输单元 12 作为 I2C 从机，进而传输单元 12 可以通过 I2C 总线与多个接口 13 电性连接，读取单元 32 经 I2C 总线与连接外部设备 30 的接口 13 电性连接。
具体地，请参阅图 3 ，所述外部存储器 20 可包括互相独立的第一存储区 21 、第二存储区 22 、第三存储区 23 及第四存储区 24 ，该第一存储区 21 用于存储第一 EDID ，第二存储区 22 用于存储第二 EDID ，第三存储区 23 用于存储芯片设定数据，第四存储区 24 用于读取芯片 10 需要的其他数据。
步骤 S2 、所述控制单元 111 从外部存储器 20 读取多个 EDID 并存入内部存储器 12 。
具体地，所述步骤 S2 之前还包括对读取芯片 10 进行上电的及对读取芯片 10 进行初始化的步骤，以保证系统的正常运行。
具体地，所述步骤 S2 中，所述控制单元 111 在将多个 EDID 存入内部存储器 12 后，还读取外部存储器 20 中存储的芯片设定数据并存储至内部存储器 12 中，用于读取芯片 10 的设定。
步骤 S3 、所述热插拔侦测单元 113 对多个接口 13 进行侦测，识别与外部设备 30 电性连接的接口 13 并产生与电性连接外部设备 30 的接口 13 对应的感测信号传输至控制单元 111 。
具体地，所述步骤 S3 中，所述热插拔侦测单元 113 对多个接口 13 进行侦测以对热插拔信号线 31 进行侦测，识别将热插拔侦测单元 113 与热插拔信号线 31 电性连接的接口 13 作为电性连接外部设备 30 的接口 13 。
具体地，在图 2 所示的实施例中，所述步骤 S3 中，所述热插拔侦测单元 113 对多个接口 13 进行侦测后，识别与外部设备 30 电性连接的接口 13 为第一接口 131 ，产生与第一接口 131 对应的感测信号传输至控制单元 111 。
步骤 S4 、所述控制单元 111 从内部存储器 12 读取与电性连接外部设备 30 的接口 13 对应的 EDID 并传输至传输单元 112 。所述传输单元 112 将与电性连接外部设备 30 的接口 13 对应的 EDID 经电性连接外部设备 30 的接口 13 传输至外部设备 30 。
具体地，在图 2 所示的实施例中，控制单元 111 从内部存储器 12 读取与第一接口 131 对应的 EDID 并传输至传输单元 112 ，传输单元 112 在接收到与第一接口 131 对应的 EDID 后将与第一接口 131 对应的 EDID 经第一接口 131 传输至外部设备 30 。
具体地，所述步骤 S4 中，传输单元 12 在接收到与电性连接外部设备 30 的接口 13 对应的 EDID 后将电性连接外部设备 30 的接口 13 对应的 EDID 经电性连接外部设备 30 的接口 13 传输至读取单元 32 。
具体地，每一 EDID 均包括多个子部分。
所述步骤 S4 具体包括：
步骤 S41 、所述控制单元 111 从内部存储器 12 读取电性连接外部设备 30 的接口 13 对应的 EDID 。
步骤 S42 、所述控制单元 111 选取电性连接外部设备 30 的接口 13 对应的 EDID 的多个子部分中的一个为待传输子部分。
步骤 S43 、所述控制单元 111 将待传输子部分传输至传输单元 112 。
步骤 S44 、所述传输单元 112 对待传输子部分进行缓存。
步骤 S45 、所述传输单元 112 将缓存的待传输子部分经电性连接外部设备 30 的接口 13 传输至外部设备 30 。
步骤 S46 、所述传输单元 112 向控制单元 111 传输中断信号；
步骤 S47 、所述控制单元 111 判定电性连接外部设备 30 的接口 13 对应的 EDID 的多个子部分中是否存在未传输至传输单元 112 的子部分，若否则结束传输，若是则选取未传输至传输单元 112 的子部分中的一个为待传输子部分并返回步骤 S43 。
进一步地，每一个子部分的大小与传输单元 112 的缓存容量相匹配，可以为 1 个字节（ byte ）或大于一个字节。
需要说明的是，本发明的 EDID 读取方法，利用外部存储器 20 同时存储多个 EDID ，利用控制单元 111 从外部存储器 20 读取多个 EDID 并存入内部存储器 12 ，利用热插拔侦测单元 113 对多个接口 13 进行侦测，识别与外部设备 30 电性连接的接口 13 并产生与该接口 13 对应的感测信号传输至控制单元 111 ，控制单元 111 从内部存储器 12 读取与该接口 13 对应的 EDID 并传输至传输单元 112 ，传输单元 112 将与该接口 13 对应的 EDID 经该接口 13 传输至外部设备 30 ，相比于现有技术对应多个接口需要在芯片外设置多个存储器，本发明大大降低了存储器的数量，有效的提高了产品的集成度，并降低了产品的成本。
综上所述，本发明的 EDID 读取系统包括读取芯片、外部存储器及外部设备，读取芯片包括控制模块、内部存储器及多个接口，控制模块包括控制单元、传输单元及热插拔侦测单元，工作时，控制单元从外部存储器读取多个 EDID 并存入内部存储器，热插拔侦测单元对多个接口进行侦测，识别与外部设备电性连接的接口并产生与该接口对应的感测信号传输至控制单元，控制单元从内部存储器读取与该接口对应的 EDID 并传输至传输单元，传输单元将与该接口对应的 EDID 经该接口传输至外部设备，无需在读取芯片外部设置多个存储器，有效的提高了产品的集成度，并降低了产品的成本。本发明的 EDID 读取方法能够提升显示装置的芯片的集成度，降低产品成本。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的保护范围。

Claims (10)

  1. 一种EDID读取系统，包括读取芯片、外部存储器及外部设备；所述读取芯片包括控制模块、内部存储器及多个接口；所述控制模块包括控制单元、与控制单元电性连接的传输单元及与控制单元电性连接的热插拔侦测单元；所述控制单元分别电性连接外部存储器及内部存储器；所述传输单元电性连接多个接口；所述热插拔侦测单元分别电性连接多个接口；多个接口中的一个与外部设备电性连接；所述外部存储器内存储有分别与多个接口对应的多个EDID；
    所述控制单元用于从外部存储器读取多个EDID并存入内部存储器；所述热插拔侦测单元用于对多个接口进行侦测，识别与外部设备电性连接的接口并产生与电性连接外部设备的接口对应的感测信号传输至控制单元，控制单元在接收到感测信号后从内部存储器读取与电性连接外部设备的接口对应的EDID并传输至传输单元，传输单元在接收到与电性连接外部设备的接口对应的EDID后将与电性连接外部设备的接口对应的EDID经电性连接外部设备的接口传输至外部设备。
  2. 如权利要求1所述的EDID读取系统，其中，多个接口包括第一接口及第二接口；所述多个EDID包括分别与第一接口及第二接口对应的第一EDID及第二EDID。
  3. 如权利要求2所述的EDID读取系统，其中，所述第一接口为视频图形阵列接口，所述第二接口为高清晰多媒体接口。
  4. 如权利要求1所述的EDID读取系统，其中，所述外部设备包括热插拔信号线及读取单元；电性连接外部设备的接口将热插拔信号线与热插拔侦测单元电性连接并将读取单元与传输单元电性连接；
    所述热插拔侦测单元对多个接口进行侦测以对热插拔信号线进行侦测，识别将热插拔侦测单元与热插拔信号线电性连接的接口作为电性连接外部设备的接口，传输单元在接收到与电性连接外部设备的接口对应的EDID后将电性连接外部设备的接口对应的EDID经电性连接外部设备的接口传输至读取单元。
  5. 如权利要求1所述的EDID读取系统，其中，所述外部设备为计算机；
    所述外部存储器为电可擦可编程只读存储器；所述内部存储器为随机存储器；
    所述读取芯片为系统芯片或缩放芯片。
  6. 一种EDID读取方法，包括如下步骤：
    步骤S1、提供EDID读取系统；
    所述EDID读取系统包括读取芯片、外部存储器及外部设备；所述读取芯片包括控制模块、内部存储器及多个接口；所述控制模块包括控制单元、与控制单元电性连接的传输单元及与控制单元电性连接的热插拔侦测单元；所述控制单元分别电性连接外部存储器及内部存储器；所述传输单元电性连接多个接口；所述热插拔侦测单元分别电性连接多个接口；多个接口中的一个与外部设备电性连接；所述外部存储器内存储有分别与多个接口对应的多个EDID；
    步骤S2、所述控制单元从外部存储器读取多个EDID并存入内部存储器；
    步骤S3、所述热插拔侦测单元对多个接口进行侦测，识别与外部设备电性连接的接口并产生与电性连接外部设备的接口对应的感测信号传输至控制单元；
    步骤S4、所述控制单元从内部存储器读取与电性连接外部设备的接口对应的EDID并传输至传输单元；所述传输单元将与电性连接外部设备的接口对应的EDID经电性连接外部设备的接口传输至外部设备。
  7. 如权利要求6所述的EDID读取方法，其中，多个接口包括第一接口及第二接口；所述多个EDID包括分别与第一接口及第二接口对应的第一EDID及第二EDID；
    所述外部设备为计算机；
    所述外部存储器为电可擦可编程只读存储器；所述内部存储器为随机存储器；
    所述读取芯片为系统芯片或缩放芯片。
  8. 如权利要求7所述的EDID读取方法，其中，所述第一接口为视频图形阵列接口，所述第二接口为高清晰多媒体接口。
  9. 如权利要求6所述的EDID读取方法，其中，所述外部设备包括热插拔信号线及读取单元；电性连接外部设备的接口将热插拔信号线与热插拔侦测单元电性连接并将读取单元与传输单元电性连接；
    所述步骤S3中，所述热插拔侦测单元对多个接口进行侦测以对热插拔信号线进行侦测，识别将热插拔侦测单元与热插拔信号线电性连接的接口作为电性连接外部设备的接口；所述步骤S4中，传输单元在接收到与电性连接外部设备的接口对应的EDID后将电性连接外部设备的接口对应的EDID经电性连接外部设备的接口传输至读取单元。
  10. 如权利要求6所述的EDID读取方法，其中，每一EDID均包括多个子部分；
    所述步骤S4具体包括：
    步骤S41、所述控制单元从内部存储器读取电性连接外部设备的接口对应的EDID；
    步骤S42、所述控制单元选取电性连接外部设备的接口对应的EDID的多个子部分中的一个为待传输子部分；
    步骤S43、所述控制单元将待传输子部分传输至传输单元；
    步骤S44、所述传输单元对待传输子部分进行缓存；
    步骤S45、所述传输单元将缓存的待传输子部分经电性连接外部设备的接口传输至外部设备；
    步骤S46、所述传输单元向控制单元传输中断信号；
    步骤S47、所述控制单元判定电性连接外部设备的接口对应的EDID的多个子部分中是否存在未传输至传输单元的子部分，若否则结束传输，若是则选取未传输至传输单元的子部分中的一个为待传输子部分并返回步骤S43。
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