WO2020177600A1 - Substrat d'affichage et son procédé de fabrication, panneau d'affichage et dispositif d'affichage - Google Patents
Substrat d'affichage et son procédé de fabrication, panneau d'affichage et dispositif d'affichage Download PDFInfo
- Publication number
- WO2020177600A1 WO2020177600A1 PCT/CN2020/076827 CN2020076827W WO2020177600A1 WO 2020177600 A1 WO2020177600 A1 WO 2020177600A1 CN 2020076827 W CN2020076827 W CN 2020076827W WO 2020177600 A1 WO2020177600 A1 WO 2020177600A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- area
- display
- hydrophobic
- packaging
- substrate
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 194
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 230000002209 hydrophobic effect Effects 0.000 claims abstract description 184
- 238000005538 encapsulation Methods 0.000 claims abstract description 53
- 239000000853 adhesive Substances 0.000 claims abstract description 11
- 230000001070 adhesive effect Effects 0.000 claims abstract description 11
- 238000004806 packaging method and process Methods 0.000 claims description 111
- 239000010410 layer Substances 0.000 claims description 91
- 238000000034 method Methods 0.000 claims description 85
- 230000008569 process Effects 0.000 claims description 55
- 239000000463 material Substances 0.000 claims description 51
- 239000003292 glue Substances 0.000 claims description 33
- 238000007641 inkjet printing Methods 0.000 claims description 28
- 239000002346 layers by function Substances 0.000 claims description 20
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 19
- 238000000059 patterning Methods 0.000 claims description 14
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 12
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 9
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 7
- 239000008393 encapsulating agent Substances 0.000 claims description 7
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 239000010703 silicon Substances 0.000 claims description 7
- 235000012239 silicon dioxide Nutrition 0.000 claims description 7
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- 239000004408 titanium dioxide Substances 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 9
- 238000000151 deposition Methods 0.000 description 28
- 230000008021 deposition Effects 0.000 description 28
- 229920002120 photoresistant polymer Polymers 0.000 description 12
- 238000010586 diagram Methods 0.000 description 10
- 239000000243 solution Substances 0.000 description 10
- 238000002347 injection Methods 0.000 description 9
- 239000007924 injection Substances 0.000 description 9
- 230000004888 barrier function Effects 0.000 description 7
- 230000006870 function Effects 0.000 description 7
- 229910052814 silicon oxide Inorganic materials 0.000 description 6
- 230000005525 hole transport Effects 0.000 description 5
- 238000000576 coating method Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000007738 vacuum evaporation Methods 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000002096 quantum dot Substances 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 150000003384 small molecules Chemical class 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000002207 thermal evaporation Methods 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
Definitions
- the base substrate further has an edge area
- the packaging area is located between the display area and the edge area
- the method further includes:
- FIG. 6 is a schematic diagram of bonding a packaging glue and a packaging area provided by an embodiment of the present application.
- the material of the hydrophobic structure 012 includes at least one of silicon dioxide, silicon nitride, silicon oxynitride, aluminum oxide, and titanium dioxide. Since silicon dioxide, silicon nitride, silicon oxynitride, aluminum oxide and titanium dioxide are all inorganic materials with good hydrophobic properties, silicon dioxide, silicon nitride, silicon oxynitride, aluminum oxide and titanium dioxide are used At least one of the preparations of the hydrophobic structure 012 can ensure the hydrophobic effect of the hydrophobic structure 012.
- Step 701 Provide a base substrate.
- the base substrate has a display area and a packaging area, and the packaging area surrounds the display area.
- the base substrate 011 may be a rigid substrate made of a certain robust material such as glass, quartz or transparent resin, for example, the base substrate 011 is a glass substrate, or the base substrate 011 may be polyimide. (English: Polyimide; abbreviation: PI) and other flexible materials made of flexible substrates, when the base substrate 011 is a flexible substrate, the base substrate 011 can be provided through a rigid substrate (that is, the base substrate 011 is set on the rigid substrate Provided above).
- PI Polyimide
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
L'invention concerne un substrat d'affichage et son procédé de fabrication, un panneau d'affichage et un dispositif d'affichage. Le substrat d'affichage (01) comprend : un substrat de base (011) ayant une région d'affichage (A1) et une région d'encapsulation (A2) entourant la région d'affichage (A1) ; et une structure hydrophobe (012) disposée dans la région d'encapsulation (A2), la structure hydrophobe (012) ayant un canal d'adhérence (S) pour faire adhérer un adhésif d'encapsulation à la région d'encapsulation (A2). Le substrat d'affichage (01) empêche l'encre d'affecter les performances adhésives de l'adhésif d'encapsulation, et améliore les effets d'encapsulation du substrat d'affichage (01) appliqués à des panneaux d'affichage de forme spéciale.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910164574.5A CN109920933B (zh) | 2019-03-05 | 2019-03-05 | 显示基板及其制造方法，显示面板、显示装置 |
| CN201910164574.5 | 2019-03-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2020177600A1 true WO2020177600A1 (fr) | 2020-09-10 |
Family
ID=66963433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2020/076827 WO2020177600A1 (fr) | 2019-03-05 | 2020-02-26 | Substrat d'affichage et son procédé de fabrication, panneau d'affichage et dispositif d'affichage |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109920933B (fr) |
| WO (1) | WO2020177600A1 (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114628480A (zh) * | 2022-03-22 | 2022-06-14 | 武汉华星光电半导体显示技术有限公司 | 一种显示面板及显示设备 |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109920933B (zh) * | 2019-03-05 | 2021-02-09 | 京东方科技集团股份有限公司 | 显示基板及其制造方法，显示面板、显示装置 |
| CN110444692B (zh) * | 2019-08-30 | 2023-07-14 | 京东方科技集团股份有限公司 | 显示基板及其制备方法、显示装置 |
| CN110854300B (zh) * | 2019-11-27 | 2024-09-13 | 京东方科技集团股份有限公司 | 显示装置、显示面板及其制造方法 |
| TWI739259B (zh) * | 2019-12-30 | 2021-09-11 | 財團法人工業技術研究院 | 封裝結構 |
| CN111628106B (zh) * | 2020-06-04 | 2023-04-18 | 京东方科技集团股份有限公司 | 显示面板、封装方法及显示装置 |
| CN112670422B (zh) * | 2020-12-04 | 2022-04-15 | 昆山国显光电有限公司 | 显示面板及显示面板的蒸镀方法 |
| CN113314685A (zh) * | 2021-06-24 | 2021-08-27 | 京东方科技集团股份有限公司 | 显示面板、显示基板及其制备方法 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104201295A (zh) * | 2014-09-16 | 2014-12-10 | 深圳市华星光电技术有限公司 | Oled的封装方法及oled结构 |
| JP2016206258A (ja) * | 2015-04-16 | 2016-12-08 | Jsr株式会社 | 表示装置 |
| CN207116481U (zh) * | 2017-08-31 | 2018-03-16 | 京东方科技集团股份有限公司 | 显示基板、显示装置 |
| CN109037289A (zh) * | 2018-08-01 | 2018-12-18 | 京东方科技集团股份有限公司 | 显示基板及其制备方法、显示面板 |
| CN109103220A (zh) * | 2018-08-15 | 2018-12-28 | 武汉华星光电半导体显示技术有限公司 | Oled显示面板 |
| CN109920933A (zh) * | 2019-03-05 | 2019-06-21 | 京东方科技集团股份有限公司 | 显示基板及其制造方法，显示面板、显示装置 |
-
2019
- 2019-03-05 CN CN201910164574.5A patent/CN109920933B/zh active Active
-
2020
- 2020-02-26 WO PCT/CN2020/076827 patent/WO2020177600A1/fr active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104201295A (zh) * | 2014-09-16 | 2014-12-10 | 深圳市华星光电技术有限公司 | Oled的封装方法及oled结构 |
| JP2016206258A (ja) * | 2015-04-16 | 2016-12-08 | Jsr株式会社 | 表示装置 |
| CN207116481U (zh) * | 2017-08-31 | 2018-03-16 | 京东方科技集团股份有限公司 | 显示基板、显示装置 |
| CN109037289A (zh) * | 2018-08-01 | 2018-12-18 | 京东方科技集团股份有限公司 | 显示基板及其制备方法、显示面板 |
| CN109103220A (zh) * | 2018-08-15 | 2018-12-28 | 武汉华星光电半导体显示技术有限公司 | Oled显示面板 |
| CN109920933A (zh) * | 2019-03-05 | 2019-06-21 | 京东方科技集团股份有限公司 | 显示基板及其制造方法，显示面板、显示装置 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114628480A (zh) * | 2022-03-22 | 2022-06-14 | 武汉华星光电半导体显示技术有限公司 | 一种显示面板及显示设备 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109920933B (zh) | 2021-02-09 |
| CN109920933A (zh) | 2019-06-21 |
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