WO2020177162A1 - Led支架、led器件及侧入式背光模组 - Google Patents

Led支架、led器件及侧入式背光模组 Download PDF

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Publication number
WO2020177162A1
WO2020177162A1 PCT/CN2019/079440 CN2019079440W WO2020177162A1 WO 2020177162 A1 WO2020177162 A1 WO 2020177162A1 CN 2019079440 W CN2019079440 W CN 2019079440W WO 2020177162 A1 WO2020177162 A1 WO 2020177162A1
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WIPO (PCT)
Prior art keywords
led
insulating support
chip
positive electrode
negative
Prior art date
Application number
PCT/CN2019/079440
Other languages
English (en)
French (fr)
Inventor
林悦霞
熊充
Original Assignee
深圳市华星光电半导体显示技术有限公司
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Application filed by 深圳市华星光电半导体显示技术有限公司 filed Critical 深圳市华星光电半导体显示技术有限公司
Priority to US16/492,412 priority Critical patent/US20210335760A1/en
Publication of WO2020177162A1 publication Critical patent/WO2020177162A1/zh

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    • H—ELECTRICITY
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    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0073—Light emitting diode [LED]
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    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
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    • G02B6/0068—Arrangements of plural sources, e.g. multi-colour light sources
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    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
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Definitions

  • the present invention relates to the technical field of liquid crystal display, in particular to an LED bracket, an LED device and an edge-type backlight module.
  • liquid crystal display devices have become the mainstream of current displays because they can truly reproduce colors in nature.
  • Most of the liquid crystal display devices on the existing market are backlit liquid crystal display devices, which include liquid crystal panels, and Backlight module Module).
  • the structure of a liquid crystal panel is composed of a color filter (CF) substrate and a thin film transistor (Thin Film Transistor). Transistor Array Substrate (TFT) array substrate and a liquid crystal layer arranged between the two substrates. Its working principle is to control the rotation of the liquid crystal molecules of the liquid crystal layer by applying a driving voltage on the two glass substrates, and the backlight module The light is refracted to produce a picture.
  • CF color filter
  • TFT Transistor Array Substrate
  • the backlight module becomes one of the key components of the liquid crystal display device.
  • the backlight modules used in LCDs at this stage can be roughly divided into direct-type backlight modules and edge-type backlight modules according to different light incident methods.
  • the direct type backlight module uses a light source such as CCFL (Cold Cathode Fluorescent Lamp) or LED (Light Emitting Diode light-emitting diodes are arranged behind the LCD panel, which is cumbersome in design and wiring, uses more light-emitting sources, and is costly.
  • the side-type backlight module has the LED light bar (light bar) placed on the edge of the back panel, and With the light guide plate, the light source from the LED light bar enters the light guide plate from the light entrance surface on one side of the light guide plate, and exits from the light guide plate light exit surface after reflection and diffusion to form a surface light source for the liquid crystal panel. Because the edge-type backlight module has the advantages of low cost, low power consumption, environmental protection, etc., it has been widely used and has become the mainstream of portable display devices.
  • the LED device mainly includes an LED bracket, an LED chip mounted on the LED bracket, and a phosphor containing phosphor powder covered on the LED chip.
  • Figure 1 is a schematic diagram of an LED bracket in an existing side-lit backlight module.
  • the bracket includes a white plastic 1 and two positive and negative conductive pins embedded in the white plastic 1.
  • the metal pads of the two conductive pins are on the white plastic 1.
  • the upper surface of the two pads is exposed, and the two pads are asymmetrically designed, the large pad 2 and the small pad 3.
  • the LED chip 50 when the LED chip 50 is placed on the large pad 2, the intensity of blue light emitted above the large pad 2 will be greater than that of the small pad 2. After the phosphor is coated, the blue light excites the phosphor to generate yellow light. It is mixed with yellow light to generate white light. Since the blue light intensity of the small pad 3 is small, it cannot be fully mixed with yellow light to form white light, resulting in a yellowish light emission phenomenon, that is, there will be color difference in the light emitted by the LED device. In addition, the LED chip 50 is placed on the large pad 2. The size of the LED chip 50 is limited by the size of the large pad 2, and the small pad 3 is not fully utilized in terms of die bonding and cannot accommodate a larger size LED chip.
  • the purpose of the present invention is to provide an LED bracket that uses the design of symmetrical metal pads to solve the color difference problem of LED devices, improve the stability of LED devices, and realize large-size chip packaging, high-efficiency flip chip packaging and high-voltage LED packaging.
  • Another object of the present invention is to provide an LED device, which can effectively solve the problem of color difference of the LED device and improve the stability of the LED device by using the above-mentioned LED bracket.
  • Another object of the present invention is to provide an edge-lit backlight module, which adopts the above-mentioned LED device, which can effectively solve the color difference problem of the LED device and improve the stability of the LED device.
  • the present invention first provides an LED support, including an insulating support and opposite positive and negative conductive pins embedded in the insulating support;
  • the positive conductive pin includes a positive electrode pad exposed from the upper surface of the insulating support;
  • the negative conductive pin includes a negative pad exposed from the upper surface of the insulating support
  • the positive electrode pads and the negative electrode pads are symmetrically arranged on the insulating support.
  • the material of the insulating support is white plastic.
  • the insulating support has a rectangular shape, and the positive electrode pads and the negative electrode pads are symmetrically arranged in the length direction of the insulating support.
  • the insulating support has a rectangular shape, and the positive electrode pads and the negative electrode pads are symmetrically arranged in the width direction of the insulating support.
  • the insulating support includes a spacer bar located between the positive electrode pad and the negative electrode pad, and an insulating seat connected to the spacer bar to form a containing cavity above the positive electrode pad, the negative electrode pad and the spacer bar.
  • the present invention also provides an LED device, including the above-mentioned LED support and two or more LED chips symmetrically mounted on the LED support.
  • the LED chip is a flip-chip LED chip, and two electrodes of the flip-chip LED chip are directly electrically connected to the positive electrode pad and the negative electrode pad, respectively.
  • the LED chip is a front-mounted LED chip, and two electrodes of the front-mounted LED chip are electrically connected to the positive electrode pad and the negative electrode pad through gold wires.
  • the high-reliability LED device also includes a fluorescent glue covering the LED chip.
  • the present invention also provides a side-lit backlight module, which includes a light guide plate and an LED light source arranged on the light incident side of the light guide plate;
  • the LED light source includes a bar-shaped base and the above-mentioned LED device arranged on the bar-shaped base.
  • the LED support provided by the present invention includes an insulating support and opposite positive conductive pins and negative conductive pins embedded in the insulating support.
  • the positive conductive pins and the negative conductive pins respectively include the insulating support.
  • the positive electrode pads and the negative electrode pads exposed on the upper surface of the support, the positive electrode pads and the negative electrode pads are symmetrically arranged on the insulating support, the present invention uses the symmetrical metal pad design, which can effectively solve the color difference problem of the LED device , Improve the luminous efficiency and stability of LED devices, and realize large-size chip packaging, high-efficiency flip chip packaging and high-voltage LED packaging.
  • the LED device of the present invention adopts the above-mentioned LED bracket, which can effectively solve the problem of color difference of the LED device and improve the luminous efficiency and stability of the LED device.
  • the edge-lit backlight module of the present invention adopts the above-mentioned LED device, which can effectively solve the color difference problem of the LED device and improve the luminous efficiency and stability of the LED device.
  • Figure 1 is a schematic diagram of the structure of an existing LED bracket
  • Figure 2 is a schematic diagram of the structure of an existing LED device
  • FIG. 3 is a schematic diagram of the positive electrode pads and the negative electrode pads in the LED support of the present invention are symmetrically arranged in the length direction of the insulating support;
  • FIG. 4 is a schematic diagram of the positive electrode pads and the negative electrode pads in the LED support of the present invention are symmetrically arranged in the length direction of the insulating support;
  • FIG. 5 is a schematic diagram of the LED bracket of the present invention used for realizing large-size chip packaging
  • FIG. 6 is a schematic diagram of the LED bracket of the present invention used to realize high-efficiency flip chip packaging
  • FIG. 7 is a schematic diagram of the LED bracket of the present invention used to realize high-voltage LED packaging
  • FIG. 8 is a schematic top view of the side-lit backlight module of the present invention.
  • the present invention first provides a led Support, including insulating support 10 And relatively embedded in the insulating support 10 Positive conductive pin 20 And negative conductive pin 30 .
  • the positive conductive pin 20 Included from the insulated support 10 Positive electrode pad exposed on the upper surface twenty one And the positive pad twenty one Connected from the insulated support 10 The protruding positive metal pin (not shown).
  • the negative conductive pin 30 Included from the insulated support 10 The negative electrode pad exposed on the upper surface 31 And the negative pad 31 Connected from the insulated support 10 The extended negative metal pin (not shown).
  • the insulating support 10 Including the positive pad twenty one And negative pad 31 Spacer bar 11 And the spacer 11 Connected surrounding the positive pad twenty one , Negative pad 31 And spacer 11 And on the positive pad twenty one , Negative pad 31 And spacer 11 Forming a cavity above 15 Insulating seat 12 .
  • the receiving cavity 15 Used to accommodate led Chip and fluorescent glue.
  • the insulating support 10 The material is white plastic.
  • the insulating support 10 It is rectangular with two opposite short sides and two opposite long sides connected with the short sides.
  • the positive electrode pad twenty one And negative pad 31 Also available on the insulated support 10 Symmetrically arranged in the width direction, the spacer 11 With the insulating support 10 The long sides are parallel.
  • the led Bracket applied led The device can be used to achieve large-size chip packaging, as shown in the figure 5 As shown, it can be implemented in the following manner, so that the positive electrode pad twenty one And negative pad 31 In insulated support 10 Arrange symmetrically along the length of the two led chip 5 Placed on the positive pad twenty one And negative pad 31 On so that the whole led The device emits light symmetrically, so led chip 5 After encapsulating the fluorescent glue, the light can be evenly mixed, which can improve the existing led The chromatic aberration phenomenon of the device.
  • Figure 4 middle led The bracket belongs to 4014 Bracket, two led chip 5 In insulated support 10 Arranged symmetrically on top, with the picture 2 Existing as shown led Two in the device led
  • the chips are installed in ordinary 4014LED Compared with the large pad of the bracket, the present invention led chip 5
  • the available pad area is the positive pad twenty one And negative pad 31
  • the available pad area of the chip of the holder is limited to the large pad.
  • the led The bracket can make full use of the positive pad twenty one And negative pad 31 Area to achieve large-size chip packaging, thereby increasing a single chip led The luminous intensity.
  • the led Bracket applied led The device can also be used to achieve high-efficiency flip chip packaging, as shown in the figure 6 As shown, it can be implemented in the following manner, so that the positive electrode pad twenty one And negative pad 31 In the insulated bracket 10 Arrange symmetrically in the width direction, and flip more than two LED Chip led chip 5 Directly bond to the positive electrode pad by conductive silver glue twenty one And negative pad 31 On, the flip LED The two electrodes of the chip are directly connected to the positive electrode pad twenty one And negative pad 31 Electrical connection, diagram 5 Shown led In the device, multiple flip chips are on the positive pad twenty one And negative pad 31 The upper symmetrical arrangement can realize the symmetrical and uniform light output and solve the existing led The chromatic aberration problem of the device is converted from two large-size chips into multiple small-size chips. Under the same power conditions, a single chip led chip 5 The power is reduced, the use temperature is reduced, which is beneficial to increase led chip 5 Luminous efficiency and reliability, thereby improving led The performance of the device.
  • the led Bracket applied led It can also be used to achieve high voltage led Package, as shown 7 As shown, it can be implemented in the following manner, so that the positive electrode pad twenty one And negative pad 31 In the insulated bracket 10 Symmetrically arranged in the width direction of the led chip 5 Through the gold thread 6 Series bonding on the positive electrode pad twenty one And negative pad 31 Can achieve symmetrical and uniform light output, solving the existing led The chromatic aberration problem of the device, while using multiple small-sized formal led chip 5 , To ensure that under the same power condition, the current is small, the voltage is high, and the high voltage is achieved led Package, which can be applied to high dynamic range images ( HDR ) Product design.
  • HDR high dynamic range images
  • led Bracket using symmetrical metal pad design, can effectively solve led The chromatic aberration problem of the device, improve led The luminous efficiency and stability of the device can realize large-size chip packaging, high-efficiency flip-chip packaging and high voltage led Package.
  • the invention also provides a led Device. As shown 5 As shown, the present invention led The first embodiment of the device includes the above led Bracket, installed in the led Two on the bracket led chip 5 And filled in the containing cavity 15 The inner cover is set in the LED chip 5 Fluorescent glue on the top (not shown).
  • the led Positive pad of the bracket twenty one And negative pad 31 In insulated support 10 Symmetrically arranged in the length direction, two led chip 5 Placed on the positive pad twenty one And negative pad 31 On, and the two led chip 5 Through the gold thread 6 Connected in series.
  • the led The other technical features of the stent are the same as the above led
  • the embodiments of the stent are the same, and will not be repeated here.
  • the present invention led The second embodiment of the device is similar to the above led Compared with the first embodiment of the device, the difference is that the led Positive pad of the bracket twenty one And negative pad 31 In insulated support 10 Symmetrically arranged in the width direction, the led chip 5 For flip led Chip and the number is more than two, the multiple flip LED The two electrodes of the chip are directly connected to the positive electrode pad twenty one And negative pad 31 Electrically connected, and the multiple flip LED Chip on positive pad twenty one And negative pad 31
  • the upper symmetrical arrangement can realize the symmetrical and uniform light output and solve the existing led
  • the chromatic aberration problem of the device is converted from two large-size chips into multiple small-size chips.
  • the present invention led The third embodiment of the device is similar to the above led Compared with the second embodiment of the device, the difference is that the led chip 5 For formal wear led Chip, and the multiple formal led chip 5 At the positive pad twenty one And negative pad 31 Arrange symmetrically on top and pass the gold wire 6 Connected in series. Other technical features are the same as above led
  • the second embodiment of the device is the same and will not be repeated here.
  • led Device used led In the bracket, the positive pad twenty one And negative pad 31 In insulated support 10 Symmetrical arrangement on the top, can effectively solve led The chromatic aberration problem of the device, improve led The luminous efficiency and stability of the device.
  • the present invention also provides a backlight module including a light guide plate 9 , Set on the light guide plate 9 On the light side led light source 8 .
  • Said led light source 8 Including strip base 81 And set on the strip base 81 Multiple side by side LED Device 7 .
  • Said LED Device 7 Including the above led Bracket, installed in the led Two or more on the bracket led chip 5 And fill in the led Stent cavity 15 The inner cover is set in the LED chip 5 On the fluorescent glue.
  • the led chip 5 in led Arranged symmetrically on the bracket, the led
  • the technical characteristics of the stent are the same as the above led
  • the embodiments of the stent are the same, and will not be repeated here.
  • the backlight module of the present invention adopts led Positive electrode pad in bracket twenty one And negative pad 31 In insulated support 10 Symmetrical arrangement on the top, can effectively solve led The chromatic aberration problem of the device, improve led The luminous efficiency and stability of the device.
  • the present invention provides led
  • the support includes an insulating support and opposite positive and negative conductive pins embedded in the insulating support.
  • the positive and negative conductive pins respectively include a positive electrode pad and a negative electrode exposed from the upper surface of the insulating support Disk, the positive electrode pads and the negative electrode pads are symmetrically arranged on the insulating support.
  • the present invention uses the design of symmetrical metal pads to effectively solve led The chromatic aberration problem of the device, improve led The luminous efficiency and stability of the device can realize large-size chip packaging, high-efficiency flip-chip packaging and high voltage led Package.
  • led Device using the above led Bracket, can effectively solve led The chromatic aberration problem of the device, improve led The luminous efficiency and stability of the device.
  • the edge type backlight module of the present invention adopts the above led Device, can effectively solve led The chromatic aberration problem of the device, improve led The luminous efficiency and stability of the device.

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Abstract

本发明提供一种LED支架、LED器件及侧入式背光模组。本发明的LED支架包括绝缘支架及相对的嵌入所述绝缘支架的正导电引脚和负导电引脚，所述正导电引脚和负导电引脚分别包括从绝缘支架上表面露出的正极焊盘和负极焊盘，所述正极焊盘和负极焊盘在所述绝缘支架上对称排布，本发明利用对称金属焊盘的设计，可有效解决LED器件的色差问题，提升LED器件的发光效率和稳定性，实现大尺寸芯片封装、高效倒装芯片封装和高压LED封装。

Description

LED支架、LED器件及侧入式背光模组 技术领域
本发明涉及液晶显示技术领域，尤其涉及一种LED支架、LED器件及侧入式背光模组。
 背景技术
近年来，液晶显示装置（Liquid Crystal Display，LCD）由于能够真实再现自然界中的色彩成为目前显示器的主流，现有市场上的液晶显示装置大部分为背光型液晶显示装置，其包括液晶面板、及背光模组(Backlight Module)。通常，液晶面板的结构是由一彩色滤光片（Color Filter，CF）基板、一薄膜晶体管（Thin Film Transistor Array Substrate，TFT）阵列基板、以及一配置于两基板间的液晶层所构成，其工作原理是通过在两片玻璃基板上施加驱动电压来控制液晶层的液晶分子的旋转，将背光模组的光线折射出来产生画面。
由于液晶面板本身不发光，需要借由背光模组提供的光源来正常显示影像，因此，背光模组成为液晶显示装置的关键组件之一。现阶段的LCD所使用的背光模组，根据入光方式的不同可大致分为直下式背光模组和侧入式背光模组。其中，直下式背光模组是将发光光源例如CCFL（Cold Cathode Fluorescent Lamp阴极萤光灯管）或LED（Light Emitting Diode发光二极管）配置在液晶面板后方，设计和布线较繁琐，使用发光光源较多，成本高等缺点，而侧入式背光模组是将LED灯条（light bar）设于背板的边缘，并搭配导光板，LED灯条发出的光源从导光板一侧的入光面进入导光板，经反射和扩散后从导光板出光面出射，以形成面光源提供给液晶面板。由于侧入式背光模组具有成本低、功耗低、环保等优点而获得了广泛的应用，成为目前便携式显示装置的主流。
随着LED背光源广泛应用于中、大尺寸的背光模组上，LED背光源对LED器件的发光强度、发光均匀性和可靠性相应提出了更高的要求。LED器件主要包括LED支架、安装在LED支架上的LED芯片及罩设在LED芯片上的包含荧光粉的荧光胶。图1为现有侧入式背光模组中LED支架的示意图，该支架包括白色塑胶1和嵌入白色塑胶1的正负两个导电引脚，两个导电引脚的金属焊盘在白色塑胶1的上表面露出，两个焊盘为一大一小不对称设计，分别为大焊盘2和小焊盘3。如图2所示，LED芯片50放置于大焊盘2上，会造成大焊盘2上方蓝光出光强度比小焊盘2大，涂敷上荧光粉后，蓝光激发荧光粉生成黄光，蓝光与黄光混合生成白光，由于小焊盘3的蓝光强度小，无法与黄光充分混合成白光，导致出光会有偏黄现象，即LED器件出光会存在色差。另外，LED芯片50放置在大焊盘2上，LED芯片50尺寸受限于大焊盘2的尺寸，而小焊盘3在固晶方面没有得到充分利用，无法容纳更大尺寸的LED芯片。
 技术问题
本发明的目的在于提供一种LED支架，利用对称金属焊盘的设计解决LED器件的色差问题，提高LED器件的稳定性，实现大尺寸芯片封装、高效倒装芯片封装和高压LED封装。
本发明的另一目的在于提供一种LED器件，采用上述的LED支架，可有效解决LED器件的色差问题，提高LED器件的稳定性。
本发明的又一目的在于提供一种侧入式背光模组，采用上述的LED器件，可有效解决LED器件的色差问题，提高LED器件的稳定性。
 技术解决方案
为实现上述目的，本发明首先提供一种LED支架，包括绝缘支架及相对的嵌入所述绝缘支架的正导电引脚和负导电引脚；
所述正导电引脚包括从绝缘支架上表面露出的正极焊盘；
所述负导电引脚包括从绝缘支架上表面露出的负极焊盘；
所述正极焊盘和负极焊盘在所述绝缘支架上对称排布。
所述绝缘支架的材料为白色塑胶。
所述绝缘支架呈长方形，所述正极焊盘和负极焊盘在所述绝缘支架的长度方向上对称排布。
所述绝缘支架呈长方形，所述正极焊盘和负极焊盘在所述绝缘支架的宽度方向上对称排布。
所述绝缘支架包括位于正极焊盘和负极焊盘之间的间隔条及与所述间隔条连接的在所述正极焊盘、负极焊盘及间隔条上方形成容纳腔的绝缘座。
本发明还提供一种LED器件，包括如上所述的LED支架及对称安装在所述LED支架上的两个或两个以上的LED芯片。
所述 LED 芯片为倒装 LED 芯片，所述倒装 LED 芯片的两电极分别直接与所述正极焊盘和负极焊盘电连接。
所述 LED 芯片为正装 LED 芯片，所述正装 LED 芯片的两电极分别与所述正极焊盘和负极焊盘通过金线电连接。
所述的高可靠性 LED 器件还包括罩设在所述LED 芯片上的荧光胶。
本发明还提供一种侧入式背光模组，包括导光板、设置在所述导光板入光侧的LED光源；
所述LED光源包括条状基座以及设置在所述条状基座上的如上所述的LED 器件。
 有益效果
本发明的有益效果：本发明提供的LED支架，包括绝缘支架及相对的嵌入所述绝缘支架的正导电引脚和负导电引脚，所述正导电引脚和负导电引脚分别包括从绝缘支架上表面露出的正极焊盘和负极焊盘，所述正极焊盘和负极焊盘在所述绝缘支架上对称排布，本发明利用对称金属焊盘的设计，可有效解决LED器件的色差问题，提升LED器件的发光效率和稳定性，实现大尺寸芯片封装、高效倒装芯片封装和高压LED封装。本发明的LED器件，采用上述的LED支架，可有效解决LED器件的色差问题，提升LED器件的发光效率和稳定性。本发明的侧入式背光模组，采用上述的LED器件，可有效解决LED器件的色差问题，提升LED器件的发光效率和稳定性。
 附图说明
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图中，
图1为现有一种LED支架的结构示意图；
图2为现有一种LED器件的结构示意图；
图3为本发明的LED支架中正极焊盘和负极焊盘在绝缘支架的长度方向上对称排布的示意图；
图4为本发明的LED支架中正极焊盘和负极焊盘在绝缘支架的长度方向上对称排布的示意图；
图5为本发明的LED支架用于实现大尺寸芯片封装的示意图；
图6为本发明的LED支架用于实现高效倒装芯片封装的示意图；
图7为本发明的LED支架用于实现高压LED封装的示意图；
图8为本发明的侧入式背光模组的俯视结构示意图。
 本发明的实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图 3-4 ，本发明首先提供一种 LED 支架，包括绝缘支架 10 及相对的嵌入所述绝缘支架 10 的正导电引脚 20 和负导电引脚 30 。
所述正导电引脚 20 包括从绝缘支架 10 上表面露出的正极焊盘 21 及与所述正极焊盘 21 连接的从所述绝缘支架 10 伸出的正极金属管脚（未图示）。
所述负导电引脚 30 包括从绝缘支架 10 上表面露出的负极焊盘 31 及与所述负极焊盘 31 连接的从所述绝缘支架 10 伸出的负极金属管脚（未图示）。
所述绝缘支架 10 包括位于正极焊盘 21 和负极焊盘 31 之间的间隔条 11 及与所述间隔条 11 连接的包围所述正极焊盘 21 、负极焊盘 31 及间隔条 11 并在所述正极焊盘 21 、负极焊盘 31 及间隔条 11 上方形成容纳腔 15 的绝缘座 12 。所述容纳腔 15 用于容纳 LED 芯片及荧光胶。
具体地，所述正极焊盘 21 和负极焊盘 31 在所述间隔条 11 两侧的绝缘支架 10 上对称排布。
具体地，所述绝缘支架 10 的材料为白色塑胶。
具体地，所述绝缘支架 10 呈长方形，具有相对的两短边及与短边连接的相对的两长边。
具体地，如图 3 所示，所述正极焊盘 21 和负极焊盘 31 可在所述绝缘支架 10 的长度方向上对称排布，所述间隔条 11 与所述绝缘支架 10 的短边平行。
或者，如图 4 所示，所述正极焊盘 21 和负极焊盘 31 也可在所述绝缘支架 10 的宽度方向上对称排布，所述间隔条 11 与所述绝缘支架 10 的长边平行。
具体地，本发明的 LED 支架应用于 LED 器件，可以用于实现大尺寸芯片封装，如图 5 所示，具体可采用如下方式实现，使所述正极焊盘 21 和负极焊盘 31 在绝缘支架 10 的长度方向上对称排布，并将两个 LED 芯片 5 分别放置在正极焊盘 21 和负极焊盘 31 上，从而使整个 LED 器件对称出光，故在 LED 芯片 5 上封装荧光胶后，使混光均匀，可以改善现有 LED 器件的色差现象。图 4 中的 LED 支架属于 4014 支架，两个 LED 芯片 5 在绝缘支架 10 上对称排布，与图 2 所示的现有 LED 器件中两个 LED 芯片均安装在普通 4014LED 支架的大焊盘上相比，本发明中 LED 芯片 5 可用的焊盘面积是正极焊盘 21 和负极焊盘 31 两个焊盘面积之和，而现有 LED 支架的芯片可用的焊盘面积只限于大焊盘，相比之下，本发明的 LED 支架可以充分利用正极焊盘 21 和负极焊盘 31 的面积实现大尺寸芯片封装，从而增大单颗 LED 的发光强度。
具体地，本发明的 LED 支架应用于 LED 器件，还可以用于实现高效倒装芯片封装，如图 6 所示，具体可采用如下方式实现，使所述正极焊盘 21 和负极焊盘 31 在所述绝缘支架 10 的宽度方向上对称排布，将两个以上的多个倒装 LED 芯片的 LED 芯片 5 通过导电银胶直接固晶在正极焊盘 21 和负极焊盘 31 上，所述倒装 LED 芯片的两电极分别直接与所述正极焊盘 21 和负极焊盘 31 电连接，图 5 所示的 LED 器件中，多个倒装芯片在正极焊盘 21 和负极焊盘 31 上对称排布，可实现出光对称均匀，解决现有 LED 器件的色差问题，且由两颗大尺寸芯片转换成多颗小尺寸芯片，在功率相同的条件下，单颗 LED 芯片 5 的功率降低，使用温度随之降低，有利于提高 LED 芯片 5 的发光效率和可靠性，从而提高 LED 器件的性能。
具体地，本发明的 LED 支架应用于 LED 器件时，还可以用于实现高压 LED 封装，如图 7 所示，具体可采用如下方式实现，使所述正极焊盘 21 和负极焊盘 31 在所述绝缘支架 10 的宽度方向上对称排布，将多个正装的 LED 芯片 5 通过金线 6 串联固晶在正极焊盘 21 和负极焊盘 31 上，可实现出光对称均匀，解决现有 LED 器件的色差问题，同时采用多颗小尺寸的正装的 LED 芯片 5 ，确保在同样功率条件下，电流小，电压高，实现了高压 LED 封装，从而可应用于高动态范围图像（ HDR ）的产品设计。
本发明的 LED 支架，采用对称金属焊盘的设计，可有效解决 LED 器件的色差问题，提升 LED 器件的发光效率和稳定性，实现大尺寸芯片封装、高效倒装芯片封装和高压 LED 封装。
基于上述的 LED 支架，本发明还提供一种 LED 器件。如图 5 所示，本发明的 LED 器件的第一实施例，包括如上所述的 LED 支架、安装在所述 LED 支架上的两个 LED 芯片 5 及填充于所述容纳腔 15 内的罩设在所述 LED 芯片 5 上的荧光胶（未图示）。
具体地，在本实施例中，所述 LED 支架的正极焊盘 21 和负极焊盘 31 在绝缘支架 10 的长度方向上对称排布，两个 LED 芯片 5 分别放置在正极焊盘 21 和负极焊盘 31 上，且该两个 LED 芯片 5 通过金线 6 串联连接。其中，所述 LED 支架的其他技术特征均与上述 LED 支架的实施例相同，在此不再赘述。
如图 6 所示，本发明的 LED 器件的第二实施例，与上述 LED 器件的第一实施例相比，其区别在于，所述 LED 支架的正极焊盘 21 和负极焊盘 31 在绝缘支架 10 的宽度方向上对称排布，所述 LED 芯片 5 为倒装 LED 芯片且数量为两个以上，该多个倒装 LED 芯片的两电极分别直接与所述正极焊盘 21 和负极焊盘 31 电连接，且该多个倒装 LED 芯片在正极焊盘 21 和负极焊盘 31 上对称排布，可实现出光对称均匀，解决现有 LED 器件的色差问题，且由两颗大尺寸芯片转换成多颗小尺寸芯片，在功率相同的条件下，单颗 LED 芯片 5 的功率降低，使用温度随之降低，有利于提高 LED 芯片 5 的发光效率和可靠性，从而提高 LED 器件的性能。其他技术特征均与上述 LED 器件的第一实施例相同，在此不再赘述。
如图 7 所示，本发明的 LED 器件的第三实施例，与上述 LED 器件的第二实施例相比，其区别在于，所述 LED 芯片 5 为正装 LED 芯片，且该多个正装的 LED 芯片 5 在正极焊盘 21 和负极焊盘 31 上对称排布并通过金线 6 串联连接。其他技术特征均与上述 LED 器件的第二实施例相同，在此不再赘述。
本发明的 LED 器件，所采用的 LED 支架中，正极焊盘 21 和负极焊盘 31 在绝缘支架 10 上对称排布，可有效解决 LED 器件的色差问题，提升 LED 器件的发光效率和稳定性。
请参阅图 8 ，基于上述的 LED 器件，本发明还提供一种背光模组，包括导光板 9 、设置在所述导光板 9 入光侧的 LED 光源 8 。
所述 LED 光源 8 包括条状基座 81 以及设置在所述条状基座 81 上的多个并列的 LED 器件 7 。所述 LED 器件 7 包括如上所述的 LED 支架、安装在所述 LED 支架上的两个或两个以上的 LED 芯片 5 及填充于所述 LED 支架的容纳腔 15 内的罩设在所述 LED 芯片 5 上的荧光胶。其中，所述 LED 芯片 5 在 LED 支架上对称排布，所述 LED 支架的技术特征均与上述 LED 支架的实施例相同，在此不再赘述。
本发明的背光模组，所采用的 LED 支架中正极焊盘 21 和负极焊盘 31 在绝缘支架 10 上对称排布，可有效解决 LED 器件的色差问题，提升 LED 器件的发光效率和稳定性。
综上所述，本发明提供的 LED 支架，包括绝缘支架及相对的嵌入所述绝缘支架的正导电引脚和负导电引脚，所述正导电引脚和负导电引脚分别包括从绝缘支架上表面露出的正极焊盘和负极焊盘，所述正极焊盘和负极焊盘在所述绝缘支架上对称排布，本发明利用对称金属焊盘的设计，可有效解决 LED 器件的色差问题，提升 LED 器件的发光效率和稳定性，实现大尺寸芯片封装、高效倒装芯片封装和高压 LED 封装。本发明的 LED 器件，采用上述的 LED 支架，可有效解决 LED 器件的色差问题，提升 LED 器件的发光效率和稳定性。本发明的侧入式背光模组，采用上述的 LED 器件，可有效解决 LED 器件的色差问题，提升 LED 器件的发光效率和稳定性。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明后附的权利要求的保护范围。

Claims (20)

  1. 一种LED支架，包括绝缘支架及相对的嵌入所述绝缘支架的正导电引脚和负导电引脚；
    所述正导电引脚包括从绝缘支架上表面露出的正极焊盘；
    所述负导电引脚包括从绝缘支架上表面露出的负极焊盘；
    所述正极焊盘和负极焊盘在所述绝缘支架上对称排布。
  2. 如权利要求1所述的LED支架，其中，所述绝缘支架的材料为白色塑胶。
  3. 如权利要求1所述的LED支架，其中，所述绝缘支架呈长方形，所述正极焊盘和负极焊盘在所述绝缘支架的长度方向上对称排布。
  4. 如权利要求1所述的LED支架，其中，所述绝缘支架呈长方形，所述正极焊盘和负极焊盘在所述绝缘支架的宽度方向上对称排布。
  5. 如权利要求1所述的LED支架，其中，所述绝缘支架包括位于正极焊盘和负极焊盘之间的间隔条及与所述间隔条连接的在所述正极焊盘、负极焊盘及间隔条上方形成容纳腔的绝缘座。
  6. 一种LED器件，包括LED支架及对称安装在所述LED支架上的两个或两个以上的LED芯片；
    所述LED支架包括绝缘支架及相对的嵌入所述绝缘支架的正导电引脚和负导电引脚；
    所述正导电引脚包括从绝缘支架上表面露出的正极焊盘；
    所述负导电引脚包括从绝缘支架上表面露出的负极焊盘；
    所述正极焊盘和负极焊盘在所述绝缘支架上对称排布。
  7. 如权利要求 6所述的 LED 器件，其中，所述 LED 芯片为倒装 LED 芯片，所述倒装 LED 芯片的两电极分别直接与所述正极焊盘和负极焊盘电连接。
  8. 如权利要求 6所述的 LED 器件，其中，所述 LED 芯片为正装 LED 芯片，所述正装 LED 芯片的两电极分别与所述正极焊盘和负极焊盘通过金线电连接。
  9. 如权利要求 6所述的LED 器件，还包括罩设在所述LED 芯片上的荧光胶。
  10. 如权利要求6所述的LED器件，其中，所述绝缘支架的材料为白色塑胶。
  11. 如权利要求6 所述的LED 器件，其中，所述绝缘支架呈长方形，所述正极焊盘和负极焊盘在所述绝缘支架的长度方向上对称排布。
  12. 如权利要求6 所述的LED 器件，其中，所述绝缘支架呈长方形，所述正极焊盘和负极焊盘在所述绝缘支架的宽度方向上对称排布。
  13. 如权利要求6 所述的LED 器件，其中，所述绝缘支架包括位于正极焊盘和负极焊盘之间的间隔条及与所述间隔条连接的在所述正极焊盘、负极焊盘及间隔条上方形成容纳腔的绝缘座。
  14. 一种侧入式背光模组，包括导光板、设置在所述导光板入光侧的LED 光源；
    所述LED 光源包括条状基座以及设置在所述条状基座上的LED 器件；
    所述LED 器件包括LED 支架及对称安装在所述LED 支架上的两个或两个以上的LED 芯片；
    所述LED 支架包括绝缘支架及相对的嵌入所述绝缘支架的正导电引脚和负导电引脚；
    所述正导电引脚包括从绝缘支架上表面露出的正极焊盘；
    所述负导电引脚包括从绝缘支架上表面露出的负极焊盘；
    所述正极焊盘和负极焊盘在所述绝缘支架上对称排布。
  15. 如权利要求14 所述的侧入式背光模组，其中，所述 LED 芯片为倒装 LED 芯片，所述倒装 LED 芯片的两电极分别直接与所述正极焊盘和负极焊盘电连接。
  16. 如权利要求14 所述的侧入式背光模组，其中，所述 LED 芯片为正装 LED 芯片，所述正装 LED 芯片的两电极分别与所述正极焊盘和负极焊盘通过金线电连接。
  17. 如权利要求 14 所述的侧入式背光模组，其中，所述LED 器件还包括罩设在所述LED 芯片上的荧光胶。
  18. 如权利要求14 所述的侧入式背光模组，其中，所述绝缘支架的材料为白色塑胶。
  19. 如权利要求14 所述的侧入式背光模组，其中，所述绝缘支架呈长方形，所述正极焊盘和负极焊盘在所述绝缘支架的长度或宽度方向上对称排布。
  20. 如权利要求14 所述的侧入式背光模组，其中，所述绝缘支架包括位于正极焊盘和负极焊盘之间的间隔条及与所述间隔条连接的在所述正极焊盘、负极焊盘及间隔条上方形成容纳腔的绝缘座。
PCT/CN2019/079440 2019-03-07 2019-03-25 Led支架、led器件及侧入式背光模组 WO2020177162A1 (zh)

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