WO2020177032A1 - 指纹识别装置和电子设备 - Google Patents

指纹识别装置和电子设备 Download PDF

Info

Publication number
WO2020177032A1
WO2020177032A1 PCT/CN2019/076760 CN2019076760W WO2020177032A1 WO 2020177032 A1 WO2020177032 A1 WO 2020177032A1 CN 2019076760 W CN2019076760 W CN 2019076760W WO 2020177032 A1 WO2020177032 A1 WO 2020177032A1
Authority
WO
WIPO (PCT)
Prior art keywords
fingerprint
sensor chip
identification device
fingerprint sensor
fingerprint identification
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/076760
Other languages
English (en)
French (fr)
Inventor
郭益平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Goodix Technology Co Ltd
Original Assignee
Shenzhen Goodix Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Goodix Technology Co Ltd filed Critical Shenzhen Goodix Technology Co Ltd
Priority to CN201980000286.4A priority Critical patent/CN110036396B/zh
Priority to PCT/CN2019/076760 priority patent/WO2020177032A1/zh
Publication of WO2020177032A1 publication Critical patent/WO2020177032A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing

Definitions

  • the embodiments of the present invention relate to the field of electronics, and more specifically, to fingerprint identification devices and electronic equipment.
  • the under-screen fingerprint recognition solution refers to attaching the optical or ultrasonic fingerprint recognition module to the bottom of the Organic Light-Emitting Diode (OLED) screen, that is, regardless of the optical fingerprint recognition module or the ultrasonic fingerprint recognition module Both need to be tightly bonded to the light-emitting layer at the bottom of the screen.
  • OLED Organic Light-Emitting Diode
  • the OLED screen is very costly and fragile, it is easy to damage the OLED screen when the fingerprint recognition module is directly attached to the OLED screen.
  • the fingerprint recognition module and the OLED screen are completely glued together, if the fingerprint recognition module is damaged, it is easy to damage the OLED screen when the fingerprint recognition module is removed.
  • the bonding process for directly bonding the fingerprint recognition module to the OLED screen is also complicated.
  • a fingerprint identification device and electronic equipment are provided, which can reduce the cost and complexity of the electronic equipment and improve the maintainability. Especially for the scenario of multiple fingerprint sensor chips, the cost and complexity of the electronic device can be effectively reduced, and the maintainability is greatly improved.
  • a fingerprint identification device which is applied to an electronic device with a display screen, and the fingerprint identification device includes:
  • At least one fingerprint sensor chip the at least one fingerprint sensor chip is arranged above the circuit board;
  • the at least one fingerprint sensor chip is connected to the circuit board;
  • the circuit board is configured to be installed below the display screen, so that the at least one fingerprint sensor chip is located below the display screen, and the at least one fingerprint sensor chip is configured to receive The fingerprint detection signal returned by the reflection or scattering of the human finger, and the fingerprint detection signal is used to detect the fingerprint information of the finger.
  • the at least one fingerprint sensor chip after the at least one fingerprint sensor chip is fixedly mounted on the circuit board, the at least one fingerprint sensor chip can be fixedly mounted under the display screen of the electronic device through the circuit board, which avoids The at least one fingerprint sensor chip is directly attached to the display screen of the electronic device, which can reduce the installation difficulty and complexity of the at least one fingerprint sensor chip and improve the maintainability.
  • the at least one fingerprint sensor chip includes multiple chips, the multiple chips can be fixedly installed below the display screen at one time, which can reduce installation complexity and improve installation efficiency.
  • the circuit board is provided with at least one mounting member at a peripheral position of the at least one fingerprint sensor chip, and the mounting member is used to fix the circuit board under the display screen.
  • the thickness of the mounting member is such that the distance between the at least one fingerprint sensor chip and the lower surface of the light emitting layer of the display screen is less than or equal to 600 um.
  • the mounting member is an adhesive tape.
  • the fingerprint identification device further includes:
  • At least a part of the circuit board is arranged between the at least one fingerprint sensor chip and the support plate.
  • the at least one fingerprint sensor chip is fixedly connected to the support plate.
  • the support plate is a metal reinforcement plate, and/or the surface roughness of the support plate is greater than 0.25 um, and/or the thickness of the support plate ranges from 0.15 mm to 0.3 mm.
  • the fingerprint identification device further includes:
  • Both ends of the bent portion are respectively used to connect the display screen and the circuit board, so that the circuit board is arranged in parallel under the display screen.
  • the bending portion includes:
  • the driving integrated circuit IC chip of the display screen, and the COF layer is used to fix the IC chip to the circuit board.
  • the bending portion further includes:
  • the shielding layer of the COF layer is the shielding layer of the COF layer
  • the shielding layer is arranged on the outer side of the COF layer, and the IC chip is arranged at a position close to the circuit board between the COF layer and the shielding layer.
  • the bending portion further includes:
  • the fixing member is arranged at a position of the COF layer close to the IC chip, and the fixing member is used to fix one end of the COF layer used for connecting the circuit board under the display screen.
  • the at least one fingerprint sensor chip includes a plurality of optical fingerprint sensor chips, and the plurality of optical fingerprint sensor chips are arranged side by side on the upper surface of the support plate to form an optical fingerprint sensor. Chip components.
  • a microlens array is provided above the at least one fingerprint sensor chip.
  • the fingerprint identification device further includes:
  • the optical filter is arranged above the at least one fingerprint sensor chip.
  • the light entrance surface of the filter is provided with an optical inorganic coating or an organic black coating.
  • the optical filter and the at least one fingerprint sensor chip are glued and fixed in the non-sensitive area of the at least one fingerprint sensor chip, and the optical filter and the at least one fingerprint There are gaps between the photosensitive areas of the sensor chip; or the lower surface of the filter is fixed on the upper surface of the at least one fingerprint sensor chip by glue with a refractive index lower than a preset refractive index.
  • glue dispensing is performed between the periphery of the filter and the circuit board.
  • the circuit board is connected to the at least one fingerprint sensor chip through a gold wire, and the height of the gold wire and the height of the sealing compound of the gold wire are respectively lower than those of the filter. height.
  • the fingerprint identification device further includes:
  • the connector is connected to the circuit board, the connector includes at least one pin, and the at least one pin includes a pin of the fingerprint identification device.
  • an electronic device including:
  • the fingerprint identification device is arranged below the display screen to realize under-screen fingerprint detection.
  • the display screen includes:
  • a light-shielding layer is arranged below the display component, the light-shielding layer is provided with an opening, and the fingerprint identification device receives the light emitted by the display component after being reflected by a human finger through the opening Signal, the optical signal is used for fingerprint identification;
  • At least one fingerprint sensor chip in the fingerprint identification device is in contact with the lower surface of the display assembly, or there is a gap between the at least one fingerprint sensor chip and the lower surface of the display assembly.
  • the electronic equipment of the embodiment of the present application can not only reduce the installation difficulty and complexity of at least one fingerprint sensor chip in the fingerprint identification device, but also improve maintainability.
  • the at least one fingerprint sensor chip includes multiple chips
  • the multiple chips can be fixedly installed below the display screen at one time, which can reduce installation complexity and improve installation efficiency.
  • Figure 1 is a schematic plan view of an electronic device to which this application can be applied.
  • Fig. 2 is a schematic side sectional view of the electronic device shown in Fig. 1.
  • FIG. 3 is a schematic structural diagram of the display screen of the electronic device and the fingerprint identification device of the embodiment of the present application before assembly.
  • Fig. 4 is a schematic structural diagram of a bending portion of the electronic device shown in Fig. 3.
  • FIG. 5 is a schematic structural diagram of the fingerprint identification device of the electronic equipment shown in FIG. 3.
  • FIG. 6 is a schematic structural diagram of the display screen of the electronic device and the fingerprint identification device of the embodiment of the present application after being assembled.
  • portable or mobile computing devices such as smartphones, notebook computers, tablet computers, and gaming devices, as well as other electronic devices such as electronic databases, automobiles, and bank automated teller machines (ATM).
  • ATM bank automated teller machines
  • the embodiments of the present application are not limited thereto.
  • biometric recognition technology includes but is not limited to fingerprint recognition, palmprint recognition, iris recognition, face recognition, and living body recognition.
  • fingerprint recognition technology includes but is not limited to fingerprint recognition, palmprint recognition, iris recognition, face recognition, and living body recognition.
  • fingerprint recognition technology uses fingerprint recognition technology as an example.
  • the under-screen fingerprint recognition technology refers to the installation of the fingerprint recognition module below the display screen, so as to realize the fingerprint recognition operation in the display area of the display screen. There is no need to set a fingerprint collection area on the front of the electronic device except for the display area.
  • the fingerprint recognition module uses the light returned from the top surface of the display assembly of the electronic device to perform fingerprint sensing and other sensing operations. This returned light carries information about objects (for example, fingers) in contact with the top surface of the display assembly, and the fingerprint recognition module located below the display assembly collects and detects this returned light to realize fingerprint recognition under the screen.
  • the fingerprint recognition module can be designed to achieve desired optical imaging by appropriately configuring optical elements for collecting and detecting the returned light.
  • in-display fingerprint recognition technology refers to the installation of fingerprint recognition modules or part of fingerprint recognition modules inside the display screen, so as to realize fingerprint recognition operations in the display area of the display screen without the need for electronic
  • the fingerprint collection area is set on the front of the device except the display area.
  • FIG. 1 and 2 show schematic diagrams of an electronic device 100 to which under-screen fingerprint recognition technology can be applied.
  • FIG. 1 is a front schematic diagram of the electronic device 100
  • FIG. 2 is a partial cross-sectional structure diagram of the electronic device 100 shown in FIG.
  • the electronic device 100 may include a display screen 120 and a fingerprint recognition module 140.
  • the display screen 120 may be a self-luminous display, which uses a self-luminous display unit as display pixels.
  • the display screen 120 may be an Organic Light-Emitting Diode (OLED) display screen or a Micro-LED (Micro-LED) display screen.
  • the display screen 120 may also be a liquid crystal display (LCD) or other passive light-emitting display, which is not limited in the embodiment of the present application.
  • the display screen 120 may also be specifically a touch-sensitive display screen, which can not only perform screen display, but also detect a user's touch or pressing operation, so as to provide a user with a human-computer interaction interface.
  • the electronic device 100 may include a touch sensor, and the touch sensor may specifically be a touch panel (TP), which may be provided on the surface of the display screen 120, or may be partially integrated or The whole is integrated into the display screen 120 to form the touch display screen.
  • TP touch panel
  • the fingerprint recognition module 140 may be an optical fingerprint recognition module, such as an optical fingerprint sensor.
  • the fingerprint identification module 140 may include a fingerprint sensor chip with an optical sensing array (hereinafter also referred to as an optical fingerprint sensor).
  • the optical sensing array includes multiple optical sensing units, and each optical sensing unit may specifically include a photodetector or a photoelectric sensor.
  • the fingerprint identification module 140 may include a photodetector array (or called a photodetector array, a photodetector array), which includes a plurality of photodetectors distributed in an array.
  • the fingerprint recognition module 140 may be arranged in a partial area below the display screen 120, so that the fingerprint collection area (or detection area) 130 of the fingerprint recognition module 140 is at least partially located on the display screen 120. ⁇ display area 102.
  • the fingerprint identification module 140 can also be arranged in other positions, such as the side of the display screen 120 or the non-transparent area of the edge of the electronic device 100.
  • the optical signal of at least part of the display area of the display screen 120 can be guided to the fingerprint recognition module 140 through the optical path design, so that the fingerprint collection area 130 is actually located in the display area of the display screen 120 .
  • the fingerprint recognition module 140 may include only one fingerprint sensor chip. At this time, the fingerprint collection area 130 of the fingerprint recognition module 140 has a small area and a fixed position. Therefore, the user needs to input fingerprints. Press the finger to a specific position of the fingerprint collection area 130, otherwise the fingerprint recognition module 140 may not be able to collect the fingerprint image, resulting in poor user experience.
  • the fingerprint identification module 140 may specifically include a plurality of fingerprint sensor chips; the plurality of fingerprint sensor chips may be arranged side by side under the display screen 120 in a splicing manner, and the plurality of fingerprint sensor chips The sensing areas of the two fingerprint sensor chips together constitute the fingerprint collection area 130 of the fingerprint identification module 140.
  • the fingerprint collection area 130 of the fingerprint identification module 140 may include multiple sub-areas, and each sub-area corresponds to the sensing area of one of the fingerprint sensor chips, so that the fingerprint of the optical fingerprint module 130 is collected
  • the area 130 can be extended to the main area of the lower half of the display screen, that is, to the area where the finger is habitually pressed, so as to realize the blind fingerprint input operation.
  • the fingerprint detection area 130 can also be extended to half of the display area or even the entire display area, thereby realizing half-screen or full-screen fingerprint detection.
  • the multiple fingerprint sensor chips may be individually packaged fingerprint sensor chips, or multiple chips (Die) packaged in the same chip package.
  • the multiple fingerprint sensor chips can also be fabricated on different regions of the same chip (Die) through a semiconductor process.
  • the area or light sensing range of the optical sensing array of the fingerprint identification module 140 corresponds to the fingerprint collection area 130 of the fingerprint identification module 140.
  • the fingerprint collection area 130 of the fingerprint recognition module 140 may be equal to or not equal to the area or the light sensing range of the optical sensing array of the fingerprint recognition module 140, which is not specifically limited in the embodiment of the present application.
  • the fingerprint collection area 130 of the fingerprint identification module 140 can be designed to be substantially the same as the area of the sensing array of the fingerprint identification module 140.
  • the area of the fingerprint collection area 130 of the fingerprint recognition module 140 can be larger than the area of the fingerprint recognition module 140 sensing array through the design of the light path of convergent light or the design of the light path of reflected light.
  • the optical path design of the fingerprint identification module 140 is exemplified below.
  • the optical collimator may be specifically a collimator layer made on a semiconductor silicon wafer. , It has a plurality of collimating units or micro-holes.
  • the collimating unit may be specifically a small hole.
  • the reflected light reflected from the finger the light that is perpendicularly incident on the collimating unit can pass through and be
  • the fingerprint sensor chip receives, and the light whose incident angle is too large is attenuated by multiple reflections inside the collimating unit. Therefore, each fingerprint sensor chip can basically only receive the reflected light reflected by the fingerprint lines directly above it. It can effectively improve the image resolution, thereby improving the fingerprint recognition effect.
  • a collimating unit may be configured for one optical sensor unit in the optical sensor array of each fingerprint sensor chip, and the collimating unit may be attached to the corresponding optical sensor.
  • the multiple optical sensing units can also share one collimating unit, that is, the one collimating unit has an aperture large enough to cover the multiple optical sensing units. Since one collimating unit can correspond to multiple optical sensing units, the correspondence between the spatial period of the display screen 120 and the spatial period of the fingerprint sensor chip is destroyed.
  • the spatial structure of the light-emitting display array of the display screen 120 and the fingerprint sensor chip are The spatial structure of the optical sensor array is similar, and it can also effectively prevent the fingerprint identification module 140 from using the light signal passing through the display screen 120 to perform fingerprint imaging to generate moiré fringes, which effectively improves the fingerprint identification effect of the fingerprint identification module 140.
  • the optical lens may include an optical lens (Lens) layer, which has one or more lens units, such as one or more aspheric lenses.
  • the lens group is used to converge the reflected light reflected from the finger to the sensing array of the fingerprint sensor chip below it, so that the sensing array can perform imaging based on the reflected light, thereby obtaining a fingerprint image of the finger.
  • the optical lens layer may also be formed with a pinhole in the optical path of the lens unit, and the pinhole may cooperate with the optical lens layer to expand the field of view of the fingerprint recognition module 140 to improve the fingerprint recognition module 140 Fingerprint imaging effect.
  • each fingerprint sensor chip can be equipped with an optical lens for fingerprint imaging, or multiple fingerprint sensor chips can be equipped with an optical lens to realize light convergence and fingerprint imaging.
  • the fingerprint sensor chip can also be equipped with two or more optical lenses to cooperate with the two sensors. The array or multiple sensing arrays perform optical imaging, thereby reducing the imaging distance and enhancing the imaging effect.
  • the micro-lens layer may have a micro-lens array formed by a plurality of micro-lenses, which may be obtained through a semiconductor growth process or other The process is formed above the sensing array of the fingerprint sensor chip, and each microlens can correspond to one of the sensing units of the sensing array.
  • Other optical film layers may be formed between the microlens layer and the sensing unit, such as a dielectric layer or a passivation layer. More specifically, the microlens layer and the sensing unit may also include micropores.
  • the light blocking layer wherein the micro-hole is formed between the corresponding micro lens and the sensing unit, the light blocking layer can block the optical interference between the adjacent micro lens and the sensing unit, and allow light to pass through the micro
  • the lens is converged into the microhole and is transmitted to the sensing unit corresponding to the microlens through the microhole to perform optical fingerprint imaging.
  • a microlens layer can be further provided under the collimator layer or the optical lens layer.
  • the collimator layer or the optical lens layer is used in combination with the microlens layer, its specific laminated structure or optical path may need to be adjusted according to actual needs.
  • the fingerprint identification module 140 can be used to collect user fingerprint information (such as fingerprint image information).
  • the display screen 120 can adopt a display screen with a self-luminous display unit, such as an organic light-emitting diode (Organic Light-Emitting Diode, OLED) display or a micro-LED (Micro-LED) display Screen.
  • the fingerprint recognition module 140 can use the display unit (ie, the OLED light source) of the OLED display screen located in the fingerprint collection area 130 as the excitation light source for optical fingerprint detection.
  • the display screen 120 When a finger touches, presses, or approaches (for ease of description, collectively referred to as pressing in this application) in the fingerprint collection area 130, the display screen 120 emits a beam of light to the finger above the fingerprint collection area 130. The surface is reflected to form reflected light or is scattered inside the finger to form scattered light. In related patent applications, for ease of description, the above-mentioned reflected light and scattered light are collectively referred to as reflected light. Since the ridge and valley of the fingerprint have different light reflection capabilities, the reflected light from the fingerprint ridge and the fingerprint ridge have different light intensities.
  • the fingerprint sensor chip in the identification module 140 receives and converts it into a corresponding electrical signal, that is, a fingerprint detection signal; fingerprint image data can be obtained based on the fingerprint detection signal, and fingerprint matching verification can be further performed, so that the electronic The device 100 implements an optical fingerprint recognition function.
  • the electronic device 100 adopting the above structure does not need to reserve a special space on the front of the fingerprint button (such as the Home button), so a full screen solution can be adopted. Therefore, the display area 102 of the display screen 120 can be substantially extended to the entire front surface of the electronic device 100.
  • the fingerprint identification module 140 may also use a built-in light source or an external light source to provide an optical signal for fingerprint detection and identification.
  • the fingerprint identification module 140 can be applied not only to self-luminous displays such as OLED displays, but also to non-self-luminous displays, such as liquid crystal displays or other passive light-emitting displays.
  • the optical fingerprint system of the electronic device 100 may also include an excitation light source for optical fingerprint detection.
  • the light source may specifically be an infrared light source or a light source of non-visible light of a specific wavelength, which may be arranged under the backlight module of the liquid crystal display or in the edge area under the protective cover of the electronic device 100, and the fingerprint recognition module 140 may
  • the liquid crystal panel or the protective cover is arranged under the edge area and guided by the light path so that the fingerprint detection light can reach the fingerprint identification module 140; or, the fingerprint identification module 140 can also be arranged under the backlight module, and
  • the backlight module is designed to allow the fingerprint detection light to pass through the liquid crystal panel and the backlight module and reach the fingerprint recognition module 140 by opening holes or other optical designs on the film layers such as the diffusion sheet, the brightness enhancement sheet, and the reflection sheet.
  • the fingerprint identification module 140 adopts a built-in light source or
  • the electronic device 100 may further include a protective cover 110.
  • the cover 110 may be specifically a transparent cover, such as a glass cover or a sapphire cover, which is located above the display screen 120 and covers the front of the electronic device 100, and the surface of the cover 110 may also be provided with a protective layer. Therefore, in the embodiment of the present application, the so-called finger pressing the display screen 120 may actually refer to the finger pressing the cover 110 above the display 120 or covering the surface of the protective layer of the cover 110.
  • a circuit board 150 such as a flexible printed circuit (FPC) (Flexible Printed Circuit, FPC), may also be provided under the fingerprint identification module 140.
  • FPC Flexible Printed Circuit
  • the fingerprint recognition module 140 can be soldered to the circuit board 150 through pads, and realize electrical interconnection and signal transmission with other peripheral circuits or other components of the electronic device 100 through the circuit board 150.
  • the fingerprint recognition module 140 can receive the control signal of the processing unit of the electronic device 100 through the circuit board 150, and can also output the fingerprint detection signal from the fingerprint recognition module 140 to the processing unit of the electronic device 100 through the circuit board 150. Control unit, etc.
  • the fingerprint identification device 140 may be directly fixed and attached to the lower surface of the display screen 120.
  • the display screen 120 is expensive and fragile, it is easy to damage the display screen 120 when the fingerprint identification module 140 is directly attached to the display screen 120.
  • the fingerprint identification module 140 and the display screen 120 are completely glued together, if the fingerprint identification module 140 is damaged, the display screen 120 is easily damaged when the fingerprint identification module 140 is removed.
  • the bonding process of directly bonding the fingerprint identification module 140 to the display screen 120 is also complicated.
  • the present application provides a fingerprint identification device, which can reduce the cost and complexity of the electronic device 100 and improve maintainability.
  • the fingerprint identification device 200 and the electronic device 300 of the embodiment of the present application will be described in detail below with reference to FIGS. 3 to 6. It should be noted that, for ease of description, in the embodiments of the present application, the same reference numerals are used to denote the same components, and for brevity, detailed descriptions of the same components are omitted in different embodiments.
  • FIG. 3 is a schematic structural diagram of the display screen of the electronic device and the fingerprint identification device of the embodiment of the present application before assembly.
  • the electronic equipment and fingerprint identification device of the embodiments of the present application will be described below with reference to the accompanying drawings.
  • the electronic device 200 includes a display screen 210 and a fingerprint identification device 220.
  • the fingerprint identification device 220 includes the circuit board 240 and a fingerprint sensor chip 221.
  • the fingerprint sensor chip 221 is arranged above the circuit board 240; the fingerprint sensor chip 221 is connected to the circuit board 240.
  • the fingerprint sensor chip 221 may include one or more optical fingerprint sensor chips. Each optical fingerprint sensor chip may include one or more optical fingerprint sensors or optical fingerprint sensor arrays.
  • the fingerprint sensor chip 221 includes a plurality of optical fingerprint sensor chips
  • the plurality of optical fingerprint sensor chips may be arranged side by side on the upper surface of the circuit board 240 to form an optical fingerprint sensor chip assembly.
  • the circuit board 240 is used to be installed under the display screen 210 so that the fingerprint sensor chip 221 is located under the display screen 210.
  • the fingerprint sensor chip 221 is used to receive a fingerprint detection signal returned by reflection or scattering of a human finger above the display 210, and the fingerprint detection signal is used to detect fingerprint information of the finger.
  • the circuit board 240 may be a circuit board of any component, for example, a circuit board of the display screen 210 or a circuit board of the fingerprint sensor chip 221.
  • the circuit board 240 is a common circuit board for the display screen and the fingerprint sensor chip 221 to simplify the structure of the electronic device.
  • the fingerprint sensor chip 221 may be arranged under the middle area of the display 210 of the electronic device 200 through the circuit board 240 to conform to the user's usage habits and facilitate the user to hold.
  • the circuit board 240 is arranged between the display screen 210 and the fingerprint sensor chip 221.
  • the fingerprint sensor chip 221 is arranged between the circuit board 240 and the display screen 210.
  • the fingerprint sensor 221 is disposed under the display screen 210 in a non-contact manner.
  • the fingerprint sensor chip 221 after the fingerprint sensor chip 221 is fixedly installed on the circuit board 240, the fingerprint sensor chip 221 can be fixedly installed under the display 210 of the electronic device through the circuit board 240, which avoids By directly attaching the fingerprint sensor chip 221 to the display screen 210, the installation difficulty and complexity of the fingerprint sensor chip 221 can be reduced, and the maintainability can be improved.
  • the multiple chips can be fixedly installed below the display screen 210 at one time, which can reduce installation complexity and improve installation efficiency.
  • a micro lens array may be provided above the fingerprint sensor chip 221.
  • the fingerprint sensor chip 221 receives the fingerprint detection signal emitted by the display screen 210 through the microlens array and returned by the reflection or scattering of the human finger above the display screen 210, and can collect the fingerprint detection at a large angle. Signal to improve fingerprint recognition efficiency.
  • the fingerprint sensor chip 211 shown in FIG. 3 may be the fingerprint sensor chip 210 in the fingerprint identification device 140 shown in FIGS. 1 and 2, and the circuit board 240 may be the circuit board 150 shown in FIGS. 1 and 2.
  • the related function and structure description please refer to the aforementioned related description. For brevity, it will not be repeated here.
  • FIG. 3 is only an example of this application and should not be construed as a limitation to this application.
  • the fingerprint sensor chip 211 and the circuit board may be arranged side by side on the support plate.
  • the fingerprint sensor chip 211 may also be fixed on the middle frame, back cover, or battery of the electronic device, so that the fingerprint sensor chip 211 is disposed on the electronic device. Below the display.
  • the fingerprint identification device 220 further includes a bent portion.
  • the two ends of the bent portion are respectively used to connect the display screen 210 and the circuit board 240 so that the circuit board 240 is arranged in parallel under the display screen 210.
  • the shape of the bent portion may be U-shaped or U-shaped deformation. Taking the shape of the bending part as a U-shape as an example, the two ends of the bending part are parallel to each other, so that the two ends of the bending part are respectively used to connect the display screen 210 and the circuit board At 240, it can be ensured that the circuit board 240 is arranged in parallel under the display screen 210.
  • Fig. 4 is a schematic structural diagram of a bending portion of the electronic device shown in Fig. 3.
  • the bending portion may include a chip on film (FPC, COF) layer 231 and a driver integrated circuit (IC) chip 234 of the display screen 210.
  • FPC chip on film
  • COF driver integrated circuit
  • the COF layer 231 can be used to fix the IC chip 234 to the circuit board 240.
  • the bent portion can use the COF layer 231 as a carrier to directly package the IC chip 234 on the COF layer 231 to form a chip package product. That is, the COF layer 231 can be used to carry the IC chip 234.
  • the COF layer 231 may also be referred to as a COF flexible packaging substrate.
  • the COF flexible packaging substrate refers to a packaged flexible substrate without chips and components installed, and it is an important component of a printed circuit board (PCB).
  • the COF layer 231 can also be used to electrically connect the IC chip 234 to the circuit board 240. That is, through the COF layer 231, the IC chip 234 can be joined to the circuit board 240, so that the IC chip can communicate with the circuit board 240.
  • the bent portion may be used as a part of the circuit board 240.
  • the fingerprint sensor chip 221 can be fixedly arranged under the display screen 210.
  • the bent circuit board 240 can be attached to the bottom of the display screen 210 through tape.
  • the fingerprint sensor chip 221 is installed under the display screen 210 through a circuit board, which has low installation cost and complexity, and improves its maintainability.
  • the bent portion may further include a shielding layer 232 of the COF layer.
  • the shielding layer 232 is used to support the IC chip 234 and to insulate the IC chip 234 from other components of the electronic device 200.
  • the shielding layer 232 may be disposed on the outside of the COF layer 231, and the IC chip 234 may be disposed between the COF layer 231 and the shielding layer 232 near the circuit board 240.
  • the shielding layer 232 may be disposed on the COF layer 231 close to the IC chip 234, that is, the shielding layer 232 may be disposed on a part of the outer side of the COF layer 231, or on The shielding layer 232 is provided on the entire outer side of the COF layer.
  • the embodiments of the present application do not specifically limit this.
  • the bending portion may further include a fixing member 233.
  • the fixing member 233 may be disposed at a position of the COF layer 231 close to the IC chip 234, and the fixing member 233 is used to fix one end of the COF layer 231 used to connect the circuit board 240 to the Below the display screen 210.
  • the fixing member 233 can ensure that the degree of bending of the bent portion remains unchanged, thereby ensuring that the position of the fingerprint sensor chip 221 relative to the display screen is fixed. As a result, the position of the fingerprint sensor chip 221 is prevented from changing during use, and the fingerprint recognition effect can be improved.
  • the fixing member 233 may include one or more parts for fixing.
  • the fixing member 233 can fix the end of the COF layer 231 for connecting the circuit board 240 under the display screen 210 by snapping or pasting.
  • the fixing member 233 may be fixed on the protective layer 217 of the display screen 210, or may be fixed on other components such as the middle frame or the battery of the electronic device 200, which is not specifically limited in the embodiment of the present application. .
  • the display screen 210 may include a display component 215 and a light shielding layer 216.
  • the light-shielding layer 216 is disposed under the display component 215, and the light-shielding layer 216 is provided with a window.
  • the fingerprint identification device 220 receives the display component 215 through the window and is reflected by a human finger. The optical signal is used for fingerprint identification.
  • the fingerprint sensor 221 in the fingerprint identification device 220 is in contact with the bottom surface of the display component 215, or there is a gap between the fingerprint sensor 221 and the bottom surface of the display component 215.
  • the gap can be an air gap that is not filled with any auxiliary materials, which can ensure that the fingerprint sensor 221 does not touch the bottom surface of the display when the display is pressed or the electronic device falls or collides. The stability and performance of fingerprint recognition by the fingerprint sensor 221 will not be affected.
  • the display component 215 may be a light-emitting layer of the display screen 210.
  • the display component 215 may be an OLED organic light-emitting panel made by low temperature poly-silicon (LTPS) technology, which has an ultra-thin thickness. , Light weight, low power consumption, can be used to provide clearer images.
  • LTPS low temperature poly-silicon
  • the gap may be less than or equal to a preset threshold, and the preset threshold includes but is not limited to 600um.
  • the light-shielding layer 216 can also be used as a screen print layer or an embossing layer.
  • the screen print layer can have graphics and text, and the graphics and text can be used as logos such as trademark patterns.
  • the light shielding layer 216 may be a black sheet layer or a printed layer for shielding light.
  • the display screen 210 may further include a protective layer 217 for protecting the display screen 210. Similar to the light-shielding layer 216, the protective layer 217 is also provided with a window through which the fingerprint identification device 220 receives the light signal emitted by the display assembly 215 and reflected by a human finger. The light signal is used for fingerprint recognition.
  • the protective layer 217 may also be referred to as a cushion layer or a back panel, or the light shielding layer 216 and the protective layer 217 may be integrally formed.
  • the protective layer 217 may also include a heat dissipation layer.
  • the protection layer 217 may include at least a part of the heat dissipation layer formed of a metal material.
  • the display screen 210 may further include a wiring layer 214, which may include wiring for electrical connection of the fingerprint sensor chip 221 and/or the display screen 210.
  • the display screen 210 may also include a polarizer (Polarizer, POL) 213.
  • Polarizers can also be called polarizers and are used to generate polarized light. The polarized light is used for optical signal imaging.
  • the display screen 210 may further include a cover glass 211, and the cover glass 211 is used to protect the display screen 210.
  • the cover glass 211 and the polarizing plate 213 may be bonded together by optically clear adhesive (OCA) 212.
  • OCA optically clear adhesive
  • the OCA 212 can be a double-sided adhesive tape without a substrate formed by making optical acrylic adhesive without a substrate, and then attaching a release film to the upper and lower bottom layers.
  • the OCA 212 can be a layer of double-sided adhesive without substrate with optical transparency.
  • the OCA 212 can be any adhesive used to bond transparent optical elements (such as lenses, etc.), as long as it is colorless and transparent, and has a light transmittance greater than a certain threshold (for example, above 90%) , Good bonding strength, can be cured at room temperature or medium temperature, and has the characteristics of small curing shrinkage.
  • a certain threshold for example, above 90%
  • the OCA 212 may be replaced by optically transparent resin (OCR).
  • the fingerprint identification device shown in FIG. 3 will be described in detail below.
  • FIG. 5 is a schematic structural diagram of the fingerprint identification device 220 of the electronic device shown in FIG. 3.
  • the circuit board 240 is provided with at least one mounting member 227 at the peripheral position of the fingerprint sensor chip 221, and the mounting member 227 is used to fix the circuit board 240 on the display screen 210.
  • the mounting member 227 is used to fix the circuit board 240 on the display screen 210.
  • the mounting member 227 is an adhesive tape.
  • the thickness of the mounting member 227 is such that the distance between the fingerprint sensor chip 221 and the lower surface of the light-emitting layer of the display screen 210 is less than or equal to 600 um.
  • the fingerprint identification device 220 may further include a supporting plate 229.
  • At least a part of the circuit board 240 is arranged between the fingerprint sensor chip 221 and the support plate 229. That is, the fingerprint sensor chip 221 may be arranged on the upper surface of the circuit board 240.
  • the fingerprint sensor chip 221 may be attached to the upper surface of the circuit board 240 through a die attach film (DAF) 222.
  • DAF die attach film
  • the supporting board 229 and the circuit board 240 are bonded together by an electroconductive adhesive 228.
  • the DAF 222 may be any ultra-thin thin film adhesive used to connect the semiconductor chip and the packaging substrate, and the chip and the chip in the semiconductor packaging process, so as to package the fingerprint sensor chip 221 in a layered and thin manner.
  • the conductive adhesive 228 may be an adhesive that has certain conductivity after curing or drying.
  • the fingerprint sensor chip 221 may also be fixedly connected to the support plate 229.
  • the circuit board 240 may be provided with a through hole, and the fingerprint sensor chip 221 is fixedly connected to the support plate 229 through the through hole.
  • the fingerprint sensor chip 221 may bypass the circuit board 240 and be fixedly connected to the support board 229.
  • the supporting plate 229 includes but is not limited to a metal reinforcing plate, and the thickness of the supporting plate 229 may range from 0.075 mm to 0.3 mm.
  • the metal reinforcement plate may be a rigid reinforcement plate, and the thickness of the support plate 229 ranges from 0.15 mm to 0.3 mm to control the thickness of the fingerprint identification device 220.
  • the surface roughness (Ra) of the support plate 229 is greater than a certain threshold, such as 0.25um, to improve the imaging effect; specifically, when the surface roughness of the support plate 229 is greater than a certain threshold, its surface can scatter light signals, It can effectively reduce the light signal emitted by the display screen 210 and reflected inside the fingerprint identification device 220, thereby avoiding the influence of light reflection on imaging; in addition, when the surface roughness of the support plate 229 is greater than a certain threshold, the The reliability of the connection between the support plate 229 and other components. For example, the reliability of the connection between the support plate 229 and the fingerprint sensor chip 221 and the circuit board 240 and the reliability of the connection between the support plate 229 and the components for fixing the support plate 229.
  • a certain threshold such as 0.25um
  • the color of the supporting plate 229 may be dark to increase the light absorption effect of the supporting plate 229, thereby preventing the light reflected upward by the supporting plate 229 from interfering with the light received by the fingerprint sensor chip 221. Such as black or dark brown.
  • the fingerprint identification device 220 further includes:
  • the optical filter 223 is arranged above the fingerprint sensor chip 221.
  • the filter 223 may include one or more optical filters, and the one or more optical filters may be configured as, for example, band-pass filters to allow the transmission of light emitted by the OLED screen, while blocking infrared light in sunlight, etc. Other light components. When the under-screen fingerprint identification device 220 is used outdoors, this kind of optical filtering can effectively reduce the background light caused by sunlight.
  • One or more optical filters may be implemented as, for example, an optical filter coating formed on one or more continuous interfaces, or may be implemented as one or more discrete interfaces. It should be understood that the filter 223 can be fabricated on the surface of any optical component, or along the optical path from the reflected light formed by the reflection of the finger to the fingerprint sensor chip 221.
  • the filter 223 is used to reduce undesired ambient light in fingerprint sensing, so as to improve the optical sensing of the fingerprint sensor chip 221 to the received light.
  • the filter 223 may be specifically used to filter out light of a specific wavelength, for example, near-infrared light and part of red light. For example, human fingers absorb most of the energy of light with a wavelength below 580nm. If one or more optical filters or optical filter layers are designed to filter light with wavelengths from 580nm to infrared, it can greatly reduce the impact of ambient light on fingerprints. The influence of optical detection in induction.
  • the light entrance surface of the filter 223 may be provided with an optical inorganic coating or an organic blackened coating, so that the reflectance of the light entrance surface of the filter 223 is lower than a first threshold, such as 1%, so that It is ensured that the fingerprint sensor chip 221 can receive enough light signals, thereby improving the fingerprint recognition effect.
  • a first threshold such as 1%
  • the filter 223 and the fingerprint sensor chip 221 are glued and fixed on the non-photosensitive area of the fingerprint sensor chip 221, and there is a gap between the filter 223 and the photosensitive area of the fingerprint sensor chip 221 .
  • the lower surface of the filter 223 is fixed on the upper surface of the fingerprint sensor chip 221 by glue with a refractive index lower than a predetermined refractive index.
  • the predetermined refractive index includes but is not limited to 1.3.
  • the periphery of the filter 223 and the circuit board 240 are glued and fixed.
  • the filter 223 when the filter 223 is filled and attached to the upper surface of the fingerprint sensor chip 221 with optical glue, once the upper surface of the fingerprint sensor chip 221 is covered with an uneven glue thickness, there will be a Newton ring phenomenon, which affects fingerprint recognition. effect.
  • the filter 223 can be attached to the upper surface of the fingerprint sensor chip 221 in an overhead manner, thereby ensuring that there is an air layer between the fingerprint sensor chip 221 and avoiding the Newton ring problem. To improve the fingerprint recognition effect.
  • the circuit board 240 is connected to the fingerprint sensor chip 221 through a gold wire 226, and the height of the gold wire 226 and the height of the sealing compound 225 of the gold wire 226 are respectively lower than The height of the filter 223.
  • the gold wire 226 is used to realize the communication between the fingerprint sensor chip 221 and the circuit board 240, and realizes the communication with other peripheral circuits or the electronic device shown in FIG. 1 or FIG. 2 through the circuit board 220.
  • the fingerprint sensor chip 221 may receive the control signal of the processing unit of the electronic device through the gold wire 226, and may also output a fingerprint detection signal (for example, a fingerprint image) to the fingerprint identification device through the gold wire 226 220 image processor or electronic device 300 processor.
  • the gold wire 226 is encapsulated by the sealant 225, which can effectively ensure the reliability of the connection between the circuit board 240 and the fingerprint sensor chip 221.
  • FIG. 6 is a schematic structural diagram of the display screen of the electronic device and the fingerprint identification device of the embodiment of the present application after being assembled.
  • the display screen 210 may be a soft screen or a hard screen, and the display screen may include a screen print layer 216 and a protective layer. 217 and other stacked layers.
  • the OLED screen will leak light downwards after opening the holes in the above-mentioned layers.
  • the filter 223 located below the OLED screen can be used to filter out infrared signal components in the leaked light. Since the fingerprint is a diffuse reflector, the light signal formed by the reflection or diffusion of the finger will exist in all directions.
  • a microlens array (Microlens Array) provided between the bottom of the OLED screen and the fingerprint sensor chip 221 can collect the light signals leaking from the top of the OLED screen. Therefore, the fingerprint sensor chip 221 performs imaging of a fingerprint image by receiving a light signal that filters out red light.
  • the light signals leaking from the top of the OLED screen include fingerprint signals and internal structure signals of the screen, and the internal structure signals of the screen will affect the imaging of the fingerprint image, for example, moiré fringes are generated when imaging the fingerprint image.
  • the size of the fingerprint sensor chip 221 and the OLED screen (for example, the lower surface of the display assembly 215) and the size of each part are controlled by controlling the mounting part 227 (for example, the glue for bonding the fingerprint recognition device) ) Is within 600um, which further blurs the imaging of the screen structure, but the imaging of the fingerprint structure is not affected. Since the smaller the distance between the fingerprint sensor chip 221 and the OLED screen, the better the fingerprint recognition performance. Therefore, under the premise of reliability and process capability, the gap between the fingerprint sensor chip 221 and the OLED screen can be minimized as much as possible. distance.
  • the fingerprint identification device 220 further includes a connector 250 of the display screen 210; the connector 250 is connected to the circuit board 240, and the connector 250 includes at least one tube.
  • the at least one pin includes the pin of the fingerprint identification device 220.
  • FIG. 3 to FIG. 6 are only examples of the present application, and should not be construed as limiting the present application.
  • the fingerprint identification device 220 may further include an image processor, and the image processor may be disposed on the circuit board 240.
  • the image processor may be specifically a microprocessor (Micro Processing Unit, MCU), which is used to receive fingerprint detection signals (such as fingerprint images) sent from the fingerprint sensor chip 221 through the circuit board 240, and perform fingerprint detection based on fingerprint detection signals. Signal fingerprint recognition.
  • MCU Micro Processing Unit
  • the fingerprint sensor chip 221 first receives the reflected light reflected from the user’s finger and performs imaging based on the received light signal to generate a fingerprint image; then, the fingerprint image is sent to the image processor through the circuit board 240, So that the image processor can process the image and get the fingerprint signal; finally, the fingerprint signal is fingerprinted through the algorithm.
  • the fingerprint identification device 220 may further include at least one capacitor, and the at least one capacitor may be disposed on the circuit board 220 for optimizing the fingerprint detection signal collected by the fingerprint sensor chip 221.
  • the at least one capacitor is used to filter the fingerprint detection signal collected by the fingerprint sensor chip 221.
  • the units can be implemented by electronic hardware, computer software, or a combination of both, in order to clearly illustrate the interchangeability of hardware and software.
  • the composition and steps of each example have been described generally in terms of function. Whether these functions are executed by hardware or software depends on the specific application and design constraint conditions of the technical solution. Professionals and technicians can use different methods for each specific application to implement the described functions, but such implementation should not be considered beyond the scope of this application.
  • the disclosed system and device may be implemented in other ways.
  • the device embodiments described above are only illustrative.
  • the division of the units is only a logical function division, and there may be other divisions in actual implementation, for example, multiple units or components can be combined or It can be integrated into another system, or some features can be ignored or not implemented.
  • the displayed or discussed mutual coupling or direct coupling or communication connection may be indirect coupling or communication connection through some interfaces, devices or units, and may also be electrical, mechanical or other forms of connection.
  • the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the objectives of the solutions of the embodiments of the present application.
  • the functional units in the various embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units may be integrated into one unit.
  • the above-mentioned integrated unit can be implemented in the form of hardware or software functional unit.
  • the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer readable storage medium.
  • the technical solution of the present application is essentially or the part that contributes to the existing technology, or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a
  • the storage medium includes several instructions to enable a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present application.
  • the aforementioned storage media include: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), magnetic disk or optical disk and other media that can store program code .

Landscapes

  • Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Image Input (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)

Abstract

提供了一种指纹识别装置和电子设备，指纹识别装置应用在具有显示屏的电子设备，所述指纹识别装置包括：电路板；至少一个指纹传感器芯片，所述至少一个指纹传感器芯片设置在所述电路板的上方；所述至少一个指纹传感器芯片和所述电路板相连；其中，所述电路板用于安装在所述显示屏的下方，以使所述至少一个指纹传感器芯片位于所述显示屏的下方。本申请实施例中，通过所述电路板能够降低所述至少一个指纹传感器芯片的安装成本和复杂度，并提高了其可维修性。特别地针对多个指纹传感器芯片的场景下，能够有效降低安装复杂度，并提高指纹传感器芯片的安装效率。

Description

指纹识别装置和电子设备 技术领域
本发明实施例涉及电子领域，并且更具体地，涉及指纹识别装置和电子设备。
背景技术
目前，屏下指纹识别方案是指将光学或超声波指纹识别模组贴合在有机发光二极管(Organic Light-Emitting Diode，OLED)屏幕的底部，也就是不管光学指纹识别模组还是超声波指纹识别模组都需要和屏幕底部发光层紧密粘结在一起。
但是，由于OLED屏幕成本很高，且很脆弱，因此将指纹识别模组直接贴合至OLED屏幕时很容易弄坏OLED屏幕。此外，由于指纹识别模组和OLED屏幕完全粘在一起，如出现指纹识别模组损坏，在拆卸指纹识别模组时很容易损坏OLED屏幕。而且，将指纹识别模组直接贴合到OLED屏幕的贴合工艺也比较复杂。
由于以上问题，大大增加了电子设备的成本和复杂度，可维修性低。
发明内容
提供了一种指纹识别装置和电子设备，能够降低电子设备的成本和复杂度，提高了可维修性。特别地针对多个指纹传感器芯片的场景下，能够有效降低电子设备的成本和复杂度，大大提高了可维修性。
第一方面，提供了一种指纹识别装置，应用在具有显示屏的电子设备，所述指纹识别装置包括：
电路板；
至少一个指纹传感器芯片，所述至少一个指纹传感器芯片设置在所述电路板的上方；
所述至少一个指纹传感器芯片和所述电路板相连；
其中，所述电路板用于安装在所述显示屏的下方，以使所述至少一个指纹传感器芯片位于所述显示屏的下方，所述至少一个指纹传感器芯片用于接收经由所述显示屏上方的人体手指反射或散射而返回的指纹检测信号，所述 指纹检测信号用来检测所述手指的指纹信息。
本申请实施例中，所述至少一个指纹传感器芯片固定安装于所述电路板后，可以通过所述电路板将所述至少一个指纹传感器芯片固定安装于电子设备的显示屏的下方，避免了将所述至少一个指纹传感器芯片直接贴合在所述电子设备的显示屏上，能够降低所述至少一个指纹传感器芯片的安装难度和复杂度，并提高可维修性。此外，针对所述至少一个指纹传感器芯片包括多个芯片的场景下，可以将所述多个芯片一次性固定安装于显示屏的下方，能够降低安装复杂度，并提高安装效率。
在一些可能的实现方式中，所述电路板在所述至少一个指纹传感器芯片的周边位置设置有至少一个安装件，所述安装件用于将所述电路板固定安装在所述显示屏的下方。
在一些可能的实现方式中，所述安装件的厚度使得所述至少一个指纹传感器芯片距离所述显示屏的发光层的下表面之间的距离小于或等于600um。
在一些可能的实现方式中，所述安装件为胶带。
在一些可能的实现方式中，所述指纹识别装置还包括：
支撑板；
所述电路板的至少一部分设置在所述至少一个指纹传感器芯片和所述支撑板之间。
在一些可能的实现方式中，所述至少一个指纹传感器芯片与所述支撑板固定连接。
在一些可能的实现方式中，所述支撑板为金属补强板，和/或所述支撑板的表面粗糙度大于0.25um，和/或所述支撑板的厚度范围为0.15mm～0.3mm。
在一些可能的实现方式中，所述所述指纹识别装置还包括：
折弯部；
所述折弯部的两端分别用于连接所述显示屏和所述电路板，以使所述电路板平行设置在所述显示屏的下方。
在一些可能的实现方式中，所述折弯部包括：
覆晶薄膜COF层；
所述显示屏的驱动集成电路IC芯片，所述COF层用于将所述IC芯片固定至所述电路板。
在一些可能的实现方式中，所述折弯部还包括：
所述COF层的屏蔽层；
所述屏蔽层设置在所述COF层的外侧，所述IC芯片设置在所述COF层和所述屏蔽层之间靠近所述电路板的位置。
在一些可能的实现方式中，所述弯折部还包括：
固定件；
所述固定件设置在所述COF层的靠近所述IC芯片的位置，所述固定件用于将所述COF层的用于连接所述电路板的一端固定在所述显示屏的下方。
在一些可能的实现方式中，所述固定件和所述驱动IC芯片之间存在间隔。
在一些可能的实现方式中，所述至少一个指纹传感器芯片包括多个光学指纹传感器芯片，所述多个光学指纹传感器芯片通过并排设置在所述支撑板的上表面，以拼接成一个光学指纹传感器芯片组件。
在一些可能的实现方式中，所述至少一个指纹传感器芯片的上方设置有微透镜阵列。
在一些可能的实现方式中，所述指纹识别装置还包括：
滤光片，所述滤光片设置在所述至少一个指纹传感器芯片的上方。
在一些可能的实现方式中，所述滤光片的进光面设置有光学无机镀膜或有机黑化涂层。
在一些可能的实现方式中，所述滤光片和所述至少一个指纹传感器芯片在所述至少一个指纹传感器芯片的非感光区域进行点胶固定，且所述滤光片和所述至少一个指纹传感器芯片的感光区域之间存在间隙；或者所述滤光片的下表面通过折射率低于预设折射率的胶水固定在所述至少一个指纹传感器芯片的上表面。
在一些可能的实现方式中，所述滤光片的周边和所述电路板之间进行点胶固定。
在一些可能的实现方式中，所述电路板通过金线与所述至少一个指纹传感器芯片相连，所述金线的高度和所述金线的封胶的高度分别低于所述滤光片的高度。
在一些可能的实现方式中，所述指纹识别装置还包括：
所述显示屏的连接器；
所述连接器与所述电路板相连，所述连接器包括至少一个管脚，所述至 少一个管脚包括所述指纹识别装置的管脚。
第二方面，提供了一种电子设备，包括：
第一方面或所述第一方面中的可能的实现方式中所述的指纹识别装置和显示屏；
其中，所述指纹识别装置设置在所述显示屏的下方以实现屏下指纹检测。
在一些可能的实现方式中，所述显示屏包括：
显示组件；
遮光层，所述遮光层设置于所述显示组件的下方，所述遮光层设置有开窗，所述指纹识别装置通过所述开窗接收所述显示组件发出的经由人体手指反射后形成的光信号，所述光信号用于指纹识别；
其中，所述指纹识别装置中的至少一个指纹传感器芯片接触于所述显示组件的下表面，或者，所述至少一个指纹传感器芯片和所述显示组件的下表面存在间隙。
本申请实施例的电子设备，不仅能够降低所述指纹识别装置中的至少一个指纹传感器芯片的安装难度和复杂度，而且能够提高可维修性。此外，针对所述至少一个指纹传感器芯片包括多个芯片的场景下，可以将所述多个芯片一次性固定安装于显示屏的下方，能够降低安装复杂度，并提高安装效率。
附图说明
图1是本申请可以适用的电子设备的平面示意图。
图2是图1所示的电子设备的侧剖面示意图。
图3是本申请实施例的电子设备的显示屏与指纹识别装置装配前的示意性结构图。
图4是图3所示的电子设备的弯折部的示意性结构图。
图5是图3所示的电子设备的指纹识别装置的示意性结构图。
图6是本申请实施例的电子设备的显示屏与指纹识别装置装配后的示意性结构图。
具体实施方式
下面将结合附图，对本申请实施例中的技术方案进行描述。
本申请实施例的技术方案可以应用于各种电子设备。
例如，智能手机、笔记本电脑、平板电脑、游戏设备等便携式或移动计算设备，以及电子数据库、汽车、银行自动柜员机(Automated Teller Machine，ATM)等其他电子设备。但本申请实施例对此并不限定。
本申请实施例的技术方案可以用于生物特征识别技术。其中，生物特征识别技术包括但不限于指纹识别、掌纹识别、虹膜识别、人脸识别以及活体识别等识别技术。为了便于说明，下文以指纹识别技术为例进行说明。
本申请实施例的技术方案可以用于屏下指纹识别技术和屏内指纹识别技术。
屏下指纹识别技术是指将指纹识别模组安装在显示屏下方，从而实现在显示屏的显示区域内进行指纹识别操作，不需要在电子设备正面除显示区域外的区域设置指纹采集区域。具体地，指纹识别模组使用从电子设备的显示组件的顶面返回的光来进行指纹感应和其他感应操作。这种返回的光携带与显示组件的顶面接触的物体(例如手指)的信息，位于显示组件下方的指纹识别模组通过采集和检测这种返回的光以实现屏下指纹识别。其中，指纹识别模组的设计可以为通过恰当地配置用于采集和检测返回的光的光学元件来实现期望的光学成像。
相应的，屏内(In-display)指纹识别技术是指将指纹识别模组或者部分指纹识别模组安装在显示屏内部，从而实现在显示屏的显示区域内进行指纹识别操作，不需要在电子设备正面除显示区域外的区域设置指纹采集区域。
图1和图2示出了屏下指纹识别技术可以适用的电子设备100的示意图，其中图1为电子设备100的正面示意图，图2为图1所示的电子设备100的部分剖面结构示意图。
如图1和图2所示，电子设备100可以包括显示屏120和指纹识别模组140。
显示屏120可以为自发光显示屏，其采用具有自发光的显示单元作为显示像素。比如显示屏120可以为有机发光二极管(Organic Light-Emitting Diode，OLED)显示屏或者微型发光二极管(Micro-LED)显示屏。在其他可替代实施例中，显示屏120也可以为液晶显示屏(Liquid Crystal Display,LCD)或者其他被动发光显示屏，本申请实施例对此不做限制。
此外，显示屏120还可以具体为触控显示屏，其不仅可以进行画面显示， 还可以检测用户的触摸或者按压操作，从而为用户提供一个人机交互界面。比如，在一种实施例中，电子设备100可以包括触摸传感器，所述触摸传感器可以具体为触控面板(Touch Panel,TP)，其可以设置在所述显示屏120表面，也可以部分集成或者整体集成到所述显示屏120内部，从而形成所述触控显示屏。
指纹识别模组140可以为光学指纹识别模组，比如光学指纹传感器。
具体来说，指纹识别模组140可以包括具有光学感应阵列的指纹传感器芯片(后面也称为光学指纹传感器)。其中，光学感应阵列包括多个光学感应单元，每个光学感应单元可以具体包括光探测器或者光电传感器。或者说，指纹识别模组140可以包括光探测器(Photo detector)阵列(或称为光电探测器阵列、光电传感器阵列)，其包括多个呈阵列式分布的光探测器。
如图1所示，指纹识别模组140可以设置在所述显示屏120的下方的局部区域，从而使得指纹识别模组140的指纹采集区域(或检测区域)130至少部分位于所述显示屏120的显示区域102内。
当然，在其他可替代实施例中，指纹识别模组140也可以设置在其他位置，比如显示屏120的侧面或者电子设备100的边缘非透光区域。这种情况下，可以通过光路设计将显示屏120的至少部分显示区域的光信号导引到指纹识别模组140，从而使得所述指纹采集区域130实际上位于所述显示屏120的显示区域内。
在本申请的一些实施例中，指纹识别模组140可以仅包括一个指纹传感器芯片，此时指纹识别模组140的指纹采集区域130的面积较小且位置固定，因此用户在进行指纹输入时需要将手指按压到所述指纹采集区域130的特定位置，否则指纹识别模组140可能无法采集到指纹图像而造成用户体验不佳。
在本申请的另一些实施例中，指纹识别模组140可以具体包括多个指纹传感器芯片；所述多个指纹传感器芯片可以通过拼接方式并排设置在所述显示屏120的下方，且所述多个指纹传感器芯片的感应区域共同构成所述指纹识别模组140的指纹采集区域130。也即是说，所述指纹识别模组140的指纹采集区域130可以包括多个子区域，每个子区域分别对应于其中一个指纹传感器芯片的感应区域，从而将所述光学指纹模组130的指纹采集区域130可以扩展到所述显示屏的下半部分的主要区域，即扩展到手指惯常按压区域，从而实现盲按式指纹输入操作。可替代地，当所述指纹传感器芯片数量 足够时，所述指纹检测区域130还可以扩展到半个显示区域甚至整个显示区域，从而实现半屏或者全屏指纹检测。
应理解，本申请实施例对所述多个指纹传感器芯片的具体形式不做限定。
例如，所述多个指纹传感器芯片可以分别是独立封装的指纹传感器芯片，也可以是封装在同一个芯片封装体内的多个芯片(Die)。
又例如，还可以通过半导体工艺在同一个芯片(Die)的不同区域上制作形成所述多个指纹传感器芯片。
如图2所示，指纹识别模组140的光学感应阵列的所在区域或者光感应范围对应所述指纹识别模组140的指纹采集区域130。其中，指纹识别模组140的指纹采集区域130可以等于或不等于指纹识别模组140的光学感应阵列的所在区域的面积或者光感应范围，本申请实施例对此不做具体限定。
例如，通过光线准直的光路设计，指纹识别模组140的指纹采集区域130可以设计成与所述指纹识别模组140的感应阵列的面积基本一致。
又例如，通过汇聚光线的光路设计或者反射光线的光路设计，可以使得所述指纹识别模组140的指纹采集区域130的面积大于所述指纹识别模组140感应阵列的面积。
下面对指纹识别模组140的光路设计进行示例性说明。
以指纹识别模组140的光路设计采用具有高深宽比的通孔阵列的光学准直器为例，所述光学准直器可以具体为在半导体硅片制作而成的准直器(Collimator)层，其具有多个准直单元或者微孔，所述准直单元可以具体为小孔，从手指反射回来的反射光中，垂直入射到所述准直单元的光线可以穿过并被其下方的指纹传感器芯片接收，而入射角度过大的光线在所述准直单元内部经过多次反射被衰减掉，因此每一个指纹传感器芯片基本只能接收到其正上方的指纹纹路反射回来的反射光，能够有效提高图像分辨率，进而提高指纹识别效果。
进一步地，当指纹识别模组140包括多个指纹传感器芯片时，可以为每个指纹传感器芯片的光学感应阵列中的一个光学感应单元配置一个准直单元，并贴合设置在其对应的光学感应单元的上方。当然，所述多个光学感应单元也可以共享一个准直单元，即所述一个准直单元具有足够大的孔径以覆盖多个光学感应单元。由于一个准直单元可以对应多个光学感应单元，破坏 了显示屏120的空间周期和指纹传感器芯片的空间周期的对应性，因此，即使显示屏120的发光显示阵列的空间结构和指纹传感器芯片的光学感应阵列的空间结构类似，也能够有效避免指纹识别模组140利用经过显示屏120的光信号进行指纹成像生成莫尔条纹，有效提高了指纹识别模组140的指纹识别效果。
以指纹识别模组140的光路设计采用光学镜头的光路设计为例，所述光学镜头可以包括光学透镜(Lens)层，其具有一个或多个透镜单元，比如一个或多个非球面透镜组成的透镜组，其用于将从手指反射回来的反射光汇聚到其下方的指纹传感器芯片的感应阵列，以使得所述感应阵列可以基于所述反射光进行成像，从而得到所述手指的指纹图像。所述光学透镜层在所述透镜单元的光路中还可以形成有针孔，所述针孔可以配合所述光学透镜层扩大指纹识别模组140的视场，以提高所述指纹识别模组140的指纹成像效果。
进一步地，当指纹识别模组140包括多个指纹传感器芯片时，可以为每一个指纹传感器芯片配置一个光学镜头进行指纹成像，或者为多个指纹传感器芯片配置一个光学镜头来实现光线汇聚和指纹成像。甚至于，当一个指纹传感器芯片具有两个感应阵列(Dual Array)或多个感应阵列(Multi-Array)时，也可以为这个指纹传感器芯片配置两个或多个光学镜头配合所述两个感应阵列或多个感应阵列进行光学成像，从而减小成像距离并增强成像效果。
以指纹识别模组140的光路设计采用微透镜(Micro-Lens)层的光路设计为例，所述微透镜层可以具有由多个微透镜形成的微透镜阵列，其可以通过半导体生长工艺或者其他工艺形成在所述指纹传感器芯片的感应阵列上方，并且每一个微透镜可以分别对应于所述感应阵列的其中一个感应单元。所述微透镜层和所述感应单元之间还可以形成其他光学膜层，比如介质层或者钝化层，更具体地，所述微透镜层和所述感应单元之间还可以包括具有微孔的挡光层，其中所述微孔形成在其对应的微透镜和感应单元之间，所述挡光层可以阻挡相邻微透镜和感应单元之间的光学干扰，并使光线通过所述微透镜汇聚到所述微孔内部并经由所述微孔传输到所述微透镜对应的感应单元，以进行光学指纹成像。
应当理解，上述光路引导结构的几种实现方案可以单独使用也可以结合使用，比如，可以在所述准直器层或者所述光学透镜层下方进一步设置微透镜层。当然，在所述准直器层或者所述光学透镜层与所述微透镜层结合使用 时，其具体叠层结构或者光路可能需要按照实际需要进行调整。
指纹识别模组140可以用于采集用户的指纹信息(比如指纹图像信息)。
以显示屏120采用OLED显示屏为例，显示屏120可以采用具有自发光显示单元的显示屏，比如有机发光二极管(Organic Light-Emitting Diode，OLED)显示屏或者微型发光二极管(Micro-LED)显示屏。指纹识别模组140可以利用OLED显示屏的位于指纹采集区域130的显示单元(即OLED光源)来作为光学指纹检测的激励光源。
当手指触摸、按压或者接近(为便于描述，在本申请中统称为按压)在指纹采集区域130时，显示屏120向指纹采集区域130上方的手指发出一束光，这一束光在手指的表面发生反射形成反射光或者经过手指的内部散射后而形成散射光，在相关专利申请中，为便于描述，上述反射光和散射光统称为反射光。由于指纹的嵴(ridge)与峪(vally)对于光的反射能力不同，因此，来自指纹嵴的反射光和来自指纹峪的发生过具有不同的光强，反射光经过显示屏120后，被指纹识别模组140中的指纹传感器芯片所接收并转换为相应的电信号，即指纹检测信号；基于所述指纹检测信号便可以获得指纹图像数据，并且可以进一步进行指纹匹配验证，从而在所述电子设备100实现光学指纹识别功能。
由此可见，用户需要对电子设备100进行指纹解锁或者其他指纹验证的时候，只需要将手指按压在位于显示屏120的指纹采集区域130，便可以实现指纹特征的输入操作。由于指纹特征的采集可以在显示屏120的显示区域102的内部实现，采用上述结构的电子设备100无需其正面专门预留空间来设置指纹按键(比如Home键)，因而可以采用全面屏方案。因此，所述显示屏120的显示区域102可以基本扩展到所述电子设备100的整个正面。
当然，在其他替代方案中，指纹识别模组140也可以采用内置光源或者外置光源来提供用于进行指纹检测识别的光信号。在这种情况下，指纹识别模组140不仅可以适用于如OLED显示屏等自发光显示屏，还可以适用于非自发光显示屏，比如液晶显示屏或者其他的被动发光显示屏。
以应用在具有背光模组和液晶面板的液晶显示屏为例，为支持液晶显示屏的屏下指纹检测，电子设备100的光学指纹系统还可以包括用于光学指纹检测的激励光源，所述激励光源可以具体为红外光源或者特定波长非可见光的光源，其可以设置在所述液晶显示屏的背光模组下方或者设置在电子设备 100的保护盖板下方的边缘区域，而指纹识别模组140可以设置液晶面板或者保护盖板的边缘区域下方并通过光路引导以使得指纹检测光可以到达所述指纹识别模组140；或者，指纹识别模组140也可以设置在所述背光模组下方，且所述背光模组通过对扩散片、增亮片、反射片等膜层进行开孔或者其他光学设计以允许指纹检测光穿过液晶面板和背光模组并到达指纹识别模组140。当采用所述指纹识别模组140采用内置光源或者外置光源来提供用于进行指纹检测的光信号时，其检测原理可以相同。
如图1所示，电子设备100还可以包括保护盖板110。
盖板110可以具体为透明盖板，比如玻璃盖板或者蓝宝石盖板，其位于显示屏120的上方并覆盖所述电子设备100的正面，且盖板110表面还可以设置有保护层。因此，本申请实施例中，所谓的手指按压显示屏120实际上可以是指手指按压在显示屏120上方的盖板110或者覆盖所述盖板110的保护层表面。
如图1所示，指纹识别模组140的下方还可以设置有电路板150，比如软性电路板(Flexible Printed Circuit，FPC)。
指纹识别模组140可以通过焊盘焊接到电路板150，并通过电路板150实现与其他外围电路或者电子设备100的其他元件的电性互连和信号传输。比如，指纹识别模组140可以通过电路板150接收电子设备100的处理单元的控制信号，并且还可以通过电路板150将来自指纹识别模组140的指纹检测信号输出给电子设备100的处理单元或者控制单元等。
在某些实施例中，指纹识别装置140可以直接固定贴合在显示屏120的下表面。
但是，由于显示屏120成本很高，且很脆弱，因此将指纹识别模组140直接贴合至显示屏120时很容易弄坏显示屏120。
此外，由于指纹识别模组140和显示屏120完全粘在一起，如出现指纹识别模组140损坏，在拆卸指纹识别模组140时很容易损坏显示屏120。
并且，将指纹识别模组140直接贴合到显示屏120的贴合工艺也比较复杂。
由于以上问题，大大增加了电子设备100的成本和复杂度，可维修性低。
本申请提供了一种指纹识别装置，能够降低电子设备100的成本和复杂度，提高了可维修性。
下面结合图3至图6详细说明本申请实施例的指纹识别装置200以及电子设备300。需要说明的是，为便于说明，在本申请实施例中，相同的附图标记用于表示相同的部件，并且为了简洁，在不同实施例中，省略对相同部件的详细说明。
图3是本申请实施例的电子设备的显示屏与指纹识别装置装配前的示意性结构图。下面结合附图对本申请实施例的电子设备和指纹识别装置进行说明。
如图3所示，所述电子设备200包括显示屏210和指纹识别装置220。所述指纹识别装置220包括所述电路板240和指纹传感器芯片221。所述指纹传感器芯片221设置在所述电路板240的上方；所述指纹传感器芯片221和所述电路板240相连。
所述指纹传感器芯片221可以包括一个或者多个光学指纹传感器芯片。每个光学指纹传感器芯片可以包括一个或者多个光学指纹传感器或者光学指纹传感器阵列。
所述指纹传感器芯片221包括多个光学指纹传感器芯片时，所述多个光学指纹传感器芯片可以通过并排设置的方式在所述电路板240的上表面，以拼接成一个光学指纹传感器芯片组件。
其中，所述电路板240用于安装在所述显示屏210的下方，以使所述指纹传感器芯片221位于所述显示屏210的下方。所述指纹传感器芯片221用于接收经由所述显示屏210上方的人体手指反射或散射而返回的指纹检测信号，所述指纹检测信号用来检测所述手指的指纹信息。所述电路板240可以是任意部件的电路板，例如，所述显示屏210的电路板或者所述指纹传感器芯片221的电路板。又例如，所述电路板240为显示屏和所述指纹传感器芯片221共用电路板，以简化所述电子设备的结构。
例如，所述指纹传感器芯片221可以通过所述电路板240设置在电子设备200的显示屏210的中间区域的下方，以符合用户的使用习惯，便于用户握持。
例如，所述电路板240设置在所述显示屏210和所述指纹传感器芯片221之间。又例如，所述指纹传感器芯片221设置在所述电路板240和所述显示屏210之间。
可选地，所述指纹传感器221非接触式的设置在所述显示屏210的下方。
本申请实施例中，所述指纹传感器芯片221固定安装于所述电路板240后，可以通过所述电路板240将所述指纹传感器芯片221固定安装于电子设备的显示屏210的下方，避免了将所述指纹传感器芯片221直接贴合在所述显示屏210上，能够降低所述指纹传感器芯片221的安装难度和复杂度，并提高可维修性。
此外，针对所述指纹传感器芯片221包括多个芯片的场景下，可以将所述多个芯片一次性固定安装于显示屏210的下方，能够降低安装复杂度，并提高安装效率。
可选地，在本申请的一些实施例中，所述指纹传感器芯片221的上方可以设置有微透镜阵列。所述指纹传感器芯片221通过所述微透镜阵列接收所述显示屏210发出的并经由所述显示屏210上方的人体手指反射或散射而返回的指纹检测信号，能够收集大角度的所述指纹检测信号，进而提高指纹识别效率。
应理解，图3所示的指纹传感器芯片211可以是图1和图2所示的指纹识别装置140中的指纹传感器芯片210，电路板240可以是图1和图2所示的电路板150，其相关功能和结构说明可以参考前述相关描述，为了简洁，在此不再赘述。
还应理解，图3仅为本申请的一种示例，不应理解为对本申请的限制。
例如，在其他可替代实施例中，所述指纹传感器芯片211和所述电路板可以并排设置在支撑板上。
又例如，在其他可替代实施例中，所述指纹传感器芯片211还可以通过固定在电子设备的中框、后盖或电池等其它部件上，使得所述指纹传感器芯片211设置在所述电子设备的显示屏的下方。
可选地，所述指纹识别装置220还包括折弯部。
所述折弯部的两端分别用于连接所述显示屏210和所述电路板240，以使所述电路板240平行设置在所述显示屏210的下方。所述弯折部的形状可以是U形或者U形的变形。以所述弯折部的形状为U形为例，所述折弯部的两端相互平行，由此，所述弯折部的两端分别用于连接所述显示屏210和所述电路板240时，能够保证所述电路板240平行设置在所述显示屏210的下方。
图4是图3所示的电子设备的弯折部的示意性结构图。
如图4所示，所述折弯部可以包括覆晶薄膜(Chip On FPC，COF)层231和所述显示屏210的驱动集成电路(Integrated Circuit，IC)芯片234。
所述COF层231可以用于将所述IC芯片234固定至所述电路板240。
或者说，所述弯折部是可以利用所述COF层231作载体，将所述IC芯片234直接封装在所述COF层231上以形成芯片封装产品。即所述COF层231可以用于承载所述IC芯片234。其中，所述COF层231也可以称为COF柔性封装基板，COF柔性封装基板指未安装芯片、元器件的封装型柔性基板，其作为印刷电路板(Printed circuit board，PCB)的重要组成部分。
此外，在芯片封装过程中，所述COF层231还可以用于将所述IC芯片234电连接至所述电路板240。即通过所述COF层231可以使得所述IC芯片234接合到所述电路板240，以使所述IC芯片能够与所述电路板240进行通信。
本申请中，可以将所述弯折部作为所述电路板240的一部分。
即将所述指纹传感器芯片221固定设置在所述电路板240上后，通过弯折所述电路板240，使得所述指纹传感器芯片221能够固定设置在所述显示屏210的下方。例如，可以通过胶带将弯折后的所述电路板240贴合在所述显示屏210的下方。本申请实施例中，通过电路板将所述指纹传感器芯片221安装在所述显示屏210的下方，其安装成本和复杂度低，并提高了其可维修性。
可选地，如图4所示，所述折弯部还可以包括所述COF层的屏蔽层232。所述屏蔽层232用于支撑所述IC芯片234，以及使得所述IC芯片234与所述电子设备200的其它部件绝缘。
此时，所述屏蔽层232可以设置在所述COF层231的外侧，所述IC芯片234可以设置在所述COF层231和所述屏蔽层232之间靠近所述电路板240的位置。
应理解，所述屏蔽层232可以设置在所述COF层231的靠近所述IC芯片234的位置，即所述屏蔽层232可以设置在所述COF层231的外侧的部分位置上，也可以在所述COF层的整个外侧均设置所述屏蔽层232。本申请实施例对此不做具体限定。
可选地，如图4所示，所述弯折部还可以包括固定件233。
所述固定件233可以设置在所述COF层231的靠近所述IC芯片234的 位置，所述固定件233用于将所述COF层231的用于连接所述电路板240的一端固定在所述显示屏210的下方。
在安装过程中或者安装完成后，通过所述固定件233，能够保证所述折弯部的弯折程度保持不变，进而保证了所述指纹传感器芯片221相对所述显示屏的位置固定。由此，避免了所述指纹传感器芯片221在使用过程中位置发生变化，能够提高指纹识别效果。
可选地，所述固定件233和所述驱动IC芯片234之间存在间隔。所述固定件233可以包括一个或者多个用于固定的部件。所述固定件233可以通过卡扣或者粘贴的方式将所述COF层231的用于连接所述电路板240的一端固定在所述显示屏210的下方。例如，所述固定件233可以固定在所述显示屏210的保护层217上，也可以固定在所述电子设备200的中框或电池等其他部件上，本申请实施例对此不做具体限定。
下面结合图4对本申请实施例的显示屏210的具体结构进行详细说明。
如图4所示，所述显示屏210可以包括显示组件215和遮光层216。
所述遮光层216设置于所述显示组件215的下方，所述遮光层216设置有开窗，所述指纹识别装置220通过所述开窗接收所述显示组件215发出的经由人体手指反射后形成的光信号，所述光信号用于指纹识别。
其中，所述指纹识别装置220中的指纹传感器221接触于所述显示组件215的下表面，或者，所述指纹传感器221和所述显示组件215的下表面存在间隙。其间隙可以是不填充任何辅助材料的空气间隙(air gap)，其可保证在当显示屏受到按压或者电子设备出现跌落或碰撞时均不会出现指纹传感器221接触到显示屏的下表面，也不会影响指纹传感器221的指纹识别的稳定性和性能。
所述显示组件215可以是所述显示屏210的发光层，例如，所述显示组件215可以是采用低温多晶硅技术(Low Temperature Poly-silicon，LTPS)制成的OLED有机发光面板，其厚度超薄、重量轻、低耗电，可以用于提供较为清晰的影像。所述指纹传感器芯片221和所述显示组件215之间存在间隙时，所述间隙可以小于或等于预设阈值，所述预设阈值包括但不限于600um。
所述遮光层216还可以用作屏幕印刷(screen print)层或压花层，所述屏幕印刷层可以带有图文，所述图文可以用作商标图案等标识。所述遮光层 216可以是用于遮蔽光的黑色片状层或者印刷层。
可选地，如图5所示，所述显示屏210还可以包括保护层217，用于保护所述显示屏210。类似于所述遮光层216，所述保护层217也设置有开窗，所述指纹识别装置220通过所述开窗接收所述显示组件215发出的经由人体手指反射后形成的光信号，所述光信号用于指纹识别。在其他实施例中，所述保护层217还可以称为缓冲(cushion)层或者后面板，或者可以一体化形成所述遮光层216和所述保护层217。
所述保护层217还可以包括散热层。例如，所述保护层217可以包括至少一部分由金属材料形成的所述散热层。
可选地，如图4所示，所述显示屏210还可以包括布线层214，其可以包括用于所述指纹传感器芯片221和/或所述显示屏210的电气连接的布线。
可选地，如图4所示，所述显示屏210还可以包括是偏光片(Polarizer，POL)213。偏光片也可以称为偏振光片，用于产生偏振光。所述偏振光用于光信号成像。
可选地，如图4所示，所述显示屏210还可以包括盖板玻璃211，所述盖板玻璃211用于保护所述显示屏210。
可选地，如图4所示，所述盖板玻璃211和所述偏振片213之间可以通过光学透明胶(Optically Clear Adhesive，OCA)212进行贴合。所述OCA 212可以是将光学亚克力胶做成无基材，然后在上下底层各贴合一层离型薄膜后形成的一种无基体材料的双面贴合胶带，简而言之，所述OCA 212可以是具有光学透明性质的一层无基材双面胶。
可替代地，所述OCA 212可以是任一种用于胶结透明光学元件(如镜头等)的粘胶剂，其只要具有无色透明、光透过率大于一定阈值(例如在90％以上)、胶结强度良好，可在室温或中温下固化，且有固化收缩小等特点即可。例如，所述OCA 212可替代为光学透明树脂(OCR)。
下面对图3的所示的指纹识别装置进行详细说明。
图5是图3所示的电子设备的指纹识别装置220的示意性结构图。
如图5所示，所述电路板240在所述指纹传感器芯片221的周边位置设置有至少一个安装件227，所述安装件227用于将所述电路板240固定安装在所述显示屏210的下方。
例如，所述安装件227为胶带。
所述安装件227的厚度使得所述指纹传感器芯片221距离所述显示屏210的发光层的下表面之间的距离小于或等于600um。
可选地，如图5所示，所述指纹识别装置220还可以包括支撑板229。
所述电路板240的至少一部分设置在所述指纹传感器芯片221和所述支撑板229之间。即所述指纹传感器芯片221可以设置在所述电路板240的上表面。
可选地，如图5所示，所述指纹传感器芯片221可以通过芯片粘结薄膜(Die Attach Film，DAF)222粘贴在所述电路板240的上表面。所述支撑板229和所述电路板240之间通过导电胶(electroconductive adhesive)228进行贴合。
所述DAF 222可以是在半导体封装工序中用于连接半导体芯片与封装基板、芯片与芯片的任一超薄型薄膜黏合剂，以积层化、薄型化封装所述指纹传感器芯片221。所述导电胶228可以是一种固化或干燥后具有一定导电性的胶粘剂。
可选地，在本实施例中，所述指纹传感器芯片221还可以与所述支撑板229固定连接。
例如，所述电路板240可以设置有通孔，所述指纹传感器芯片221通过所述通孔与所述支撑板229固定相连。又例如，所述指纹传感器芯片221可以绕过所述电路板240与所述支撑板229固定连接。
所述支撑板229包括但不限于金属补强板，所述支撑板229的厚度范围可以为0.075mm～0.3mm。例如，所述金属补强板可以为刚性补强板，所述支撑板229的厚度范围为0.15mm～0.3mm，以控制所述指纹识别装置220的厚度。
支撑板229的表面粗糙度(Ra)大于某一阈值，比如0.25um，以提高成像效果；具体而言，支撑板229的表面粗糙度大于某一阈值时，其表面可以将光信号进行散射，能够有效减少显示屏210发出的并在指纹识别装置220的内部发生反射的光信号，进而避免光反射对成像造成影响；此外，支撑板229的表面粗糙度大于某一阈值时，可以增加所述支撑板229与其他部件之间的连接可靠度。比如所述支撑板229与所述指纹传感器芯片221和所述电路板240之间的连接可靠度以及所述支撑板229与用于固定所述支撑板229的部件之间的连接可靠度。
支撑板229的颜色可以为深色，以增加所述支撑板229的吸光效果，进而避免所述支撑板229向上反射的光线对所述指纹传感器芯片221接收到的光线产生干扰。比如黑色或深棕色。
可选地，如图5所示，所述指纹识别装置220还包括：
滤光片223，所述滤光片223设置在所述指纹传感器芯片221的上方。
所述滤光片223可以包括一个或多个光学过滤器，一个或多个光学过滤器可以配置为例如带通过滤器，以允许OLED屏发射的光的传输，同时阻挡太阳光中的红外光等其他光组分。当在室外使用屏下所述指纹识别装置220时，这种光学过滤可以有效地减少由太阳光造成的背景光。一个或多个光学过滤器可以实现为例如光学过滤涂层，光学过滤涂层形成在一个或多个连续界面上，或可以实现为一个或多个离散的界面上。应理解，滤光片223可以制作在任何光学部件的表面上，或者沿着到经由手指反射形成的反射光至成所述指纹传感器芯片221的光学路径上。
本申请实施例中，滤光片223用于来减少指纹感应中的不期望的环境光，以提高所述指纹传感器芯片221对接收到的光的光学感应。滤光片223具体可以用于过滤掉特定波长的光，例如，近红外光和部分的红光等。例如，人类手指吸收波长低于580nm的光的能量中的大部分，如果一个或多个光学过滤器或光学过滤层被设计为过滤波长从580nm至红外的光，则可以大大减少环境光对指纹感应中的光学检测的影响。
此外，所述滤光片223的进光面可以设置有光学无机镀膜或有机黑化涂层，以使得滤光片223的进光面的反射率低于第一阈值，例如1％，从而能够保证所述指纹传感器芯片221能够接收到足够的光信号，进而提升指纹识别效果。
所述滤光片223和所述指纹传感器芯片221在所述指纹传感器芯片221的非感光区域进行点胶固定，且所述滤光片223和所述指纹传感器芯片221的感光区域之间存在间隙。或者所述滤光片223的下表面通过折射率低于预设折射率的胶水固定在所述指纹传感器芯片221的上表面，例如，所述预设折射率包括但不限于1.3。或者所述滤光片223的周边和所述电路板240之间进行点胶固定。
需要注意的是，滤光片223通过光学胶填充贴合在指纹传感器芯片221的上表面时，一旦指纹传感器芯片221的上表面覆盖的胶厚不均匀，会存在 牛顿环现象，从而影响指纹识别效果。本申请实施例中，所述滤光片223可以通过架空的方式贴合在所述指纹传感器芯片221的上表面，进而能够确保与指纹传感器芯片221之间是空气层，避免出现牛顿环问题，以提高指纹识别效果。
可选地，如图5所示，所述电路板240通过金线226与所述指纹传感器芯片221相连，所述金线226的高度和所述金线226的封胶225的高度分别低于所述滤光片223的高度。
具体而言，所述金线226用于实现所述指纹传感器芯片221和电路板240之间的通信，并通过电路板220实现与其他外围电路或者如图1或图2所示的电子设备中的其他元件的电性互连和信号传输。比如，所述指纹传感器芯片221可以通过所述金线226接收电子设备的处理单元的控制信号，并且还可以通过所述金线226将指纹检测信号(例如指纹图像)输出给所述指纹识别装置220的图像处理器或者电子设备300的处理器。
本实施例中，通过所述封胶225封装所述金线226，能够有效保证所述电路板240和所述指纹传感器芯片221之间的连接可靠度。
图6是本申请实施例的电子设备的显示屏与指纹识别装置装配后的示意性结构图。
如图6所示，以所述显示屏210为OLED屏为例，所述显示屏210可以是软屏也可以是硬屏，所述显示屏可以包括屏幕印刷(screen print)层216、保护层217等叠层。上述各个叠层开孔后，OLED屏会朝下方泄露光。当手指放于亮屏的OLED屏上方，手指就会反射OLED屏发出的光，此反射光会穿透OLED屏直到OLED屏下方。位于OLED屏下方的滤波片223能够用于将漏光中的红外信号成分滤除。由于指纹是一个漫反射体，因此，经由手指反射或漫射形成的光信号在各方向都会存在。在OLED屏下方和指纹传感器芯片221之间设置的微透镜阵列(Micro lens Array)，能够收集OLED屏上方漏下来的光信号。由此，所述指纹传感器芯片221通过接收滤除红色光的光信号，进行指纹图像的成像。
需要注意的是，OLED屏上方漏下来的光信号包括指纹信号和屏内部结构信号，而屏内结构信号会对指纹图像的成像产生影响，例如，在进行指纹图像的成像时产生摩尔条纹。本实施例中，通过控制安装件227(例如用于贴合指纹识别装置的贴合胶)及各零件尺寸，使得所述指纹传感器芯片221 和OLED屏(例如，所述显示组件215的下表面)的距离在600um以内，进而使的屏结构的成像模糊，但指纹的结构的成像不受影响。由于所述指纹传感器芯片221和OLED屏之间的距离越小，指纹识别性能越好，因此在可靠性和制程能力允许的前提下，可以尽量缩小所述指纹传感器芯片221和OLED屏之间的距离。
可选地，如图6所示，所述指纹识别装置220还包括所述显示屏210的连接器250；所述连接器250与所述电路板240相连，所述连接器250包括至少一个管脚，所述至少一个管脚包括所述指纹识别装置220的管脚。由此，能够有效减少电子设备内部的连接器的数量，进而简化了所述电子设备的内部结构。
应理解，图3至图6仅为本申请的示例，不应理解为对本申请的限制。
例如，在其他可替代实施例中，所述指纹识别装置220还可以包括包括图像处理器，所述图像处理器可以设置于电路板240上。所述图像处理器可以具体为微处理器(Micro Processing Unit，MCU)，用于接收来自所述指纹传感器芯片221通过所述电路板240发送的指纹检测信号(例如指纹图像)，并基于指纹检测信号进行指纹识别。
具体地，所述指纹传感器芯片221首先接收从用户手指反射回来的反射光并基于接收的光信号进行成像，以生成指纹图像；然后，将指纹图像通过所述电路板240发送给图像处理器，以便图像处理器进行图像处理并得到指纹信号；最后，通过算法对指纹信号进行指纹识别。
又例如，所述指纹识别装置220还可以包括至少一个电容器，所述至少一个电容器可以设置在所述电路板220上，用于优化所述指纹传感器芯片221采集的指纹检测信号。例如，所述至少一个电容器用于对所述指纹传感器芯片221采集的指纹检测信号进行滤波处理。
应理解，本申请实施例中的具体的例子只是为了帮助本领域技术人员更好地理解本申请实施例，而非限制本申请实施例的范围。
应理解，在本申请实施例和所附权利要求书中使用的术语是仅仅出于描述特定实施例的目的，而非旨在限制本申请实施例。例如，在本申请实施例和所附权利要求书中所使用的单数形式的“一种”、“上述”和“所述”也旨在包括多数形式，除非上下文清楚地表示其他含义。
本领域普通技术人员可以意识到，结合本文中所公开的实施例描述的各 示例的单元，能够以电子硬件、计算机软件或者二者的结合来实现，为了清楚地说明硬件和软件的可互换性，在上述说明中已经按照功能一般性地描述了各示例的组成及步骤。这些功能究竟以硬件还是软件方式来执行，取决于技术方案的特定应用和设计约束条件。专业技术人员可以对每个特定的应用来使用不同方法来实现所描述的功能，但是这种实现不应认为超出本申请的范围。
在本申请所提供的几个实施例中，应所述理解到，所揭露的系统、装置，可以通过其它的方式实现。例如，以上所描述的装置实施例仅仅是示意性的，例如，所述单元的划分，仅仅为一种逻辑功能划分，实际实现时可以有另外的划分方式，例如多个单元或组件可以结合或者可以集成到另一个系统，或一些特征可以忽略，或不执行。另外，所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口、装置或单元的间接耦合或通信连接，也可以是电的，机械的或其它的形式连接。
所述作为分离部件说明的单元可以是或者也可以不是物理上分开的，作为单元显示的部件可以是或者也可以不是物理单元，即可以位于一个地方，或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部单元来实现本申请实施例方案的目的。
另外，在本申请各个实施例中的各功能单元可以集成在一个处理单元中，也可以是各个单元单独物理存在，也可以是两个或两个以上单元集成在一个单元中。上述集成的单元既可以采用硬件的形式实现，也可以采用软件功能单元的形式实现。
所述集成的单元如果以软件功能单元的形式实现并作为独立的产品销售或使用时，可以存储在一个计算机可读取存储介质中。基于这样的理解，本申请的技术方案本质上或者说对现有技术做出贡献的部分，或者所述技术方案的全部或部分可以以软件产品的形式体现出来，所述计算机软件产品存储在一个存储介质中，包括若干指令用以使得一台计算机设备(可以是个人计算机，服务器，或者网络设备等)执行本申请各个实施例所述方法的全部或部分步骤。而前述的存储介质包括：U盘、移动硬盘、只读存储器(ROM，Read-Only Memory)、随机存取存储器(RAM，Random Access Memory)、磁碟或者光盘等各种可以存储程序代码的介质。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限 于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到各种等效的修改或替换，这些修改或替换都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (22)

  1. 一种指纹识别装置，应用在具有显示屏的电子设备，其特征在于，所述指纹识别装置包括：
    电路板；
    至少一个指纹传感器芯片，所述至少一个指纹传感器芯片设置在所述电路板的上方；
    所述至少一个指纹传感器芯片和所述电路板相连；
    其中，所述电路板用于安装在所述显示屏的下方，以使所述至少一个指纹传感器芯片位于所述显示屏的下方，所述至少一个指纹传感器芯片用于接收经由所述显示屏上方的人体手指反射或散射而返回的指纹检测信号，所述指纹检测信号用来检测所述手指的指纹信息。
  2. 根据权利要求1所述的指纹识别装置，其特征在于，所述电路板在所述至少一个指纹传感器芯片的周边位置设置有至少一个安装件，所述安装件用于将所述电路板固定安装在所述显示屏的下方。
  3. 根据权利要求2所述的指纹识别装置，其特征在于，所述安装件的厚度使得所述至少一个指纹传感器芯片距离所述显示屏的发光层的下表面之间的距离小于或等于600um。
  4. 根据权利要求2所述的指纹识别装置，其特征在于，所述安装件为胶带。
  5. 根据权利要求1至4中任一项所述的指纹识别装置，其特征在于，所述指纹识别装置还包括：
    支撑板；
    所述电路板的至少一部分设置在所述至少一个指纹传感器芯片和所述支撑板之间。
  6. 根据权利要求5所述的指纹识别装置，其特征在于，所述至少一个指纹传感器芯片与所述支撑板固定连接。
  7. 根据权利要求5所述的指纹识别装置，其特征在于，所述支撑板为金属补强板，和/或所述支撑板的表面粗糙度大于0.25um，和/或所述支撑板的厚度范围为0.15mm～0.3mm。
  8. 根据权利要求1至7中任一项所述的指纹识别装置，其特征在于，所 述所述指纹识别装置还包括：
    折弯部；
    所述折弯部的两端分别用于连接所述显示屏和所述电路板，以使所述电路板平行设置在所述显示屏的下方。
  9. 根据权利要求8所述的指纹识别装置，其特征在于，所述折弯部包括：
    覆晶薄膜COF层；
    所述显示屏的驱动集成电路IC芯片，所述COF层用于将所述IC芯片固定至所述电路板。
  10. 根据权利要求9所述的指纹识别装置，其特征在于，所述折弯部还包括：
    所述COF层的屏蔽层；
    所述屏蔽层设置在所述COF层的外侧，所述IC芯片设置在所述COF层和所述屏蔽层之间靠近所述电路板的位置。
  11. 根据权利要求9所述的指纹识别装置，其特征在于，所述弯折部还包括：
    固定件；
    所述固定件设置在所述COF层的靠近所述IC芯片的位置，所述固定件用于将所述COF层的用于连接所述电路板的一端固定在所述显示屏的下方。
  12. 根据权利要求11所述的指纹识别装置，其特征在于，所述固定件和所述驱动IC芯片之间存在间隔。
  13. 根据权利要求1至12中任一项所述的指纹识别装置，其特征在于，所述至少一个指纹传感器芯片包括多个光学指纹传感器芯片，所述多个光学指纹传感器芯片通过并排设置在所述支撑板的上表面，以拼接成一个光学指纹传感器芯片组件。
  14. 根据权利要求1至13中任一项所述的指纹识别装置，其特征在于，所述至少一个指纹传感器芯片的上方设置有微透镜阵列。
  15. 根据权利要求1至14中任一项所述的指纹识别装置，其特征在于，所述指纹识别装置还包括：
    滤光片，所述滤光片设置在所述至少一个指纹传感器芯片的上方。
  16. 根据权利要求15所述的指纹识别装置，其特征在于，所述滤光片的进光面设置有光学无机镀膜或有机黑化涂层。
  17. 根据权利要求15所述的指纹识别装置，其特征在于，所述滤光片和所述至少一个指纹传感器芯片在所述至少一个指纹传感器芯片的非感光区域进行点胶固定，且所述滤光片和所述至少一个指纹传感器芯片的感光区域之间存在间隙；或者所述滤光片的下表面通过折射率低于预设折射率的胶水固定在所述至少一个指纹传感器芯片的上表面。
  18. 根据权利要求15所述的指纹识别装置，其特征在于，所述滤光片的周边和所述电路板之间进行点胶固定。
  19. 根据权利要求1至18中任一项所述的指纹识别装置，其特征在于，所述电路板通过金线与所述至少一个指纹传感器芯片相连，所述金线的高度和所述金线的封胶的高度分别低于所述滤光片的高度。
  20. 根据权利要求1至19中任一项所述的指纹识别装置，其特征在于，所述指纹识别装置还包括：
    所述显示屏的连接器；
    所述连接器与所述电路板相连，所述连接器包括至少一个管脚，所述至少一个管脚包括所述指纹识别装置的管脚。
  21. 一种电子设备，其特征在于，包括：
    权利要求1至20中任一项所述的指纹识别装置和显示屏；
    其中，所述指纹识别装置设置在所述显示屏的下方以实现屏下指纹检测。
  22. 如权利要求21所述的电子设备，其特征在于，所述显示屏包括：
    显示组件；
    遮光层，所述遮光层设置于所述显示组件的下方，所述遮光层设置有开窗，所述指纹识别装置通过所述开窗接收所述显示组件发出的经由人体手指反射后形成的光信号，所述光信号用于指纹识别；
    其中，所述指纹识别装置中的至少一个指纹传感器芯片接触于所述显示组件的下表面，或者，所述至少一个指纹传感器芯片和所述显示组件的下表面存在间隙。
PCT/CN2019/076760 2019-03-01 2019-03-01 指纹识别装置和电子设备 Ceased WO2020177032A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201980000286.4A CN110036396B (zh) 2019-03-01 2019-03-01 指纹识别装置和电子设备
PCT/CN2019/076760 WO2020177032A1 (zh) 2019-03-01 2019-03-01 指纹识别装置和电子设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2019/076760 WO2020177032A1 (zh) 2019-03-01 2019-03-01 指纹识别装置和电子设备

Publications (1)

Publication Number Publication Date
WO2020177032A1 true WO2020177032A1 (zh) 2020-09-10

Family

ID=67243938

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/076760 Ceased WO2020177032A1 (zh) 2019-03-01 2019-03-01 指纹识别装置和电子设备

Country Status (2)

Country Link
CN (1) CN110036396B (zh)
WO (1) WO2020177032A1 (zh)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112995373A (zh) * 2021-02-05 2021-06-18 维沃移动通信有限公司 显示屏组件和电子设备
CN113095250A (zh) * 2021-04-19 2021-07-09 业泓科技(成都)有限公司 触控显示模组及其屏下指纹辨识模组
CN114464659A (zh) * 2022-02-09 2022-05-10 京东方科技集团股份有限公司 一种oled显示模组以及电子设备
CN114497164A (zh) * 2022-02-09 2022-05-13 京东方科技集团股份有限公司 一种显示模组及其制备方法
EP4273744A4 (en) * 2020-12-31 2024-07-03 Vivo Mobile Communication Co., Ltd. FINGERPRINT MODULE AND ELECTRONIC DEVICE
US12153245B2 (en) 2020-09-18 2024-11-26 3M Innovative Properties Company Optical construction

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111095271B (zh) * 2019-09-20 2023-09-12 深圳市汇顶科技股份有限公司 指纹检测的装置、显示屏和电子设备
TWM594198U (zh) * 2019-09-22 2020-04-21 神盾股份有限公司 指紋感測模組與電子裝置
CN112804379B (zh) * 2019-11-14 2022-04-12 华为技术有限公司 一种具有补强板的终端
CN111259856B (zh) * 2020-02-11 2025-07-25 昆山丘钛生物识别科技有限公司 光学指纹解锁模组、显示屏及电子设备
CN115104139B (zh) * 2020-06-12 2025-04-04 深圳市汇顶科技股份有限公司 指纹检测装置和电子设备
CN113095245A (zh) * 2021-04-19 2021-07-09 业泓科技(成都)有限公司 触控显示模组及其屏幕下指纹辨识模组
CN117501849A (zh) 2022-05-30 2024-02-02 京东方科技集团股份有限公司 纹路识别模组以及显示装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160110025A1 (en) * 2013-06-12 2016-04-21 Dan Hossu Method for optically detecting a fingerprint or an object, and device with at least one screen
CN108008778A (zh) * 2016-04-19 2018-05-08 三星电子株式会社 支持指纹验证的电子装置及其操作方法
CN108549499A (zh) * 2018-03-30 2018-09-18 武汉天马微电子有限公司 一种显示面板及显示装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102220783B1 (ko) * 2014-10-10 2021-02-26 엘지디스플레이 주식회사 지문 인식 소자를 포함한 표시 장치 및 그의 구동 방법
JP6770082B2 (ja) * 2018-02-06 2020-10-14 シェンチェン グディックス テクノロジー カンパニー，リミテッド アンダースクリーンバイオメトリクス認証装置、バイオメトリクス認証ユニット及び端末装置
CN208283964U (zh) * 2018-04-04 2018-12-25 维沃移动通信有限公司 一种光学指纹模组、显示屏和终端设备
CN109075141B (zh) * 2018-07-26 2020-02-07 深圳市汇顶科技股份有限公司 芯片封装结构、方法和终端设备

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160110025A1 (en) * 2013-06-12 2016-04-21 Dan Hossu Method for optically detecting a fingerprint or an object, and device with at least one screen
CN108008778A (zh) * 2016-04-19 2018-05-08 三星电子株式会社 支持指纹验证的电子装置及其操作方法
CN108549499A (zh) * 2018-03-30 2018-09-18 武汉天马微电子有限公司 一种显示面板及显示装置

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12153245B2 (en) 2020-09-18 2024-11-26 3M Innovative Properties Company Optical construction
EP4273744A4 (en) * 2020-12-31 2024-07-03 Vivo Mobile Communication Co., Ltd. FINGERPRINT MODULE AND ELECTRONIC DEVICE
US12125309B2 (en) 2020-12-31 2024-10-22 Vivo Mobile Communication Co., Ltd. Fingerprint module and electronic device
CN112995373A (zh) * 2021-02-05 2021-06-18 维沃移动通信有限公司 显示屏组件和电子设备
CN112995373B (zh) * 2021-02-05 2023-07-07 维沃移动通信有限公司 显示屏组件和电子设备
CN113095250A (zh) * 2021-04-19 2021-07-09 业泓科技(成都)有限公司 触控显示模组及其屏下指纹辨识模组
CN114464659A (zh) * 2022-02-09 2022-05-10 京东方科技集团股份有限公司 一种oled显示模组以及电子设备
CN114497164A (zh) * 2022-02-09 2022-05-13 京东方科技集团股份有限公司 一种显示模组及其制备方法
CN114464659B (zh) * 2022-02-09 2025-08-05 京东方科技集团股份有限公司 一种oled显示模组以及电子设备
CN114497164B (zh) * 2022-02-09 2026-01-23 京东方科技集团股份有限公司 一种显示模组及其制备方法

Also Published As

Publication number Publication date
CN110036396A (zh) 2019-07-19
CN110036396B (zh) 2021-04-02

Similar Documents

Publication Publication Date Title
CN211349388U (zh) 指纹识别装置和电子设备
CN212135452U (zh) 指纹识别装置和电子设备
CN110036396B (zh) 指纹识别装置和电子设备
CN210605745U (zh) 指纹识别装置和电子设备
CN212135453U (zh) 指纹检测装置和电子设备
CN109791610B (zh) 指纹识别装置和电子设备
WO2021087695A1 (zh) 光学指纹装置和电子设备
CN109863507B (zh) 指纹识别装置和电子设备
WO2020215187A1 (zh) 指纹识别的装置和电子设备
CN110770750A (zh) 指纹识别的装置和电子设备
WO2021051737A1 (zh) 指纹识别装置、背光模组、液晶显示屏和电子设备
CN111801685B (zh) 指纹检测装置和电子设备
CN211087274U (zh) 指纹检测装置和电子设备
CN209911987U (zh) 指纹识别装置和电子设备
WO2021248496A1 (zh) 指纹检测装置和电子设备
CN111788576A (zh) 指纹检测装置和电子设备
WO2021248497A1 (zh) 指纹检测装置和电子设备
WO2021138781A1 (zh) 指纹检测装置和电子设备

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19918397

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19918397

Country of ref document: EP

Kind code of ref document: A1