WO2020177032A1 - Appareil de reconnaissance d'empreintes digitales et dispositif électronique - Google Patents

Appareil de reconnaissance d'empreintes digitales et dispositif électronique Download PDF

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Publication number
WO2020177032A1
WO2020177032A1 PCT/CN2019/076760 CN2019076760W WO2020177032A1 WO 2020177032 A1 WO2020177032 A1 WO 2020177032A1 CN 2019076760 W CN2019076760 W CN 2019076760W WO 2020177032 A1 WO2020177032 A1 WO 2020177032A1
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WO
WIPO (PCT)
Prior art keywords
fingerprint
sensor chip
identification device
fingerprint sensor
fingerprint identification
Prior art date
Application number
PCT/CN2019/076760
Other languages
English (en)
Chinese (zh)
Inventor
郭益平
Original Assignee
深圳市汇顶科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市汇顶科技股份有限公司 filed Critical 深圳市汇顶科技股份有限公司
Priority to CN201980000286.4A priority Critical patent/CN110036396B/zh
Priority to PCT/CN2019/076760 priority patent/WO2020177032A1/fr
Publication of WO2020177032A1 publication Critical patent/WO2020177032A1/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing

Definitions

  • the embodiments of the present invention relate to the field of electronics, and more specifically, to fingerprint identification devices and electronic equipment.
  • the under-screen fingerprint recognition solution refers to attaching the optical or ultrasonic fingerprint recognition module to the bottom of the Organic Light-Emitting Diode (OLED) screen, that is, regardless of the optical fingerprint recognition module or the ultrasonic fingerprint recognition module Both need to be tightly bonded to the light-emitting layer at the bottom of the screen.
  • OLED Organic Light-Emitting Diode
  • the OLED screen is very costly and fragile, it is easy to damage the OLED screen when the fingerprint recognition module is directly attached to the OLED screen.
  • the fingerprint recognition module and the OLED screen are completely glued together, if the fingerprint recognition module is damaged, it is easy to damage the OLED screen when the fingerprint recognition module is removed.
  • the bonding process for directly bonding the fingerprint recognition module to the OLED screen is also complicated.
  • a fingerprint identification device and electronic equipment are provided, which can reduce the cost and complexity of the electronic equipment and improve the maintainability. Especially for the scenario of multiple fingerprint sensor chips, the cost and complexity of the electronic device can be effectively reduced, and the maintainability is greatly improved.
  • a fingerprint identification device which is applied to an electronic device with a display screen, and the fingerprint identification device includes:
  • At least one fingerprint sensor chip the at least one fingerprint sensor chip is arranged above the circuit board;
  • the at least one fingerprint sensor chip is connected to the circuit board;
  • the circuit board is configured to be installed below the display screen, so that the at least one fingerprint sensor chip is located below the display screen, and the at least one fingerprint sensor chip is configured to receive The fingerprint detection signal returned by the reflection or scattering of the human finger, and the fingerprint detection signal is used to detect the fingerprint information of the finger.
  • the at least one fingerprint sensor chip after the at least one fingerprint sensor chip is fixedly mounted on the circuit board, the at least one fingerprint sensor chip can be fixedly mounted under the display screen of the electronic device through the circuit board, which avoids The at least one fingerprint sensor chip is directly attached to the display screen of the electronic device, which can reduce the installation difficulty and complexity of the at least one fingerprint sensor chip and improve the maintainability.
  • the at least one fingerprint sensor chip includes multiple chips, the multiple chips can be fixedly installed below the display screen at one time, which can reduce installation complexity and improve installation efficiency.
  • the circuit board is provided with at least one mounting member at a peripheral position of the at least one fingerprint sensor chip, and the mounting member is used to fix the circuit board under the display screen.
  • the thickness of the mounting member is such that the distance between the at least one fingerprint sensor chip and the lower surface of the light emitting layer of the display screen is less than or equal to 600 um.
  • the mounting member is an adhesive tape.
  • the fingerprint identification device further includes:
  • At least a part of the circuit board is arranged between the at least one fingerprint sensor chip and the support plate.
  • the at least one fingerprint sensor chip is fixedly connected to the support plate.
  • the support plate is a metal reinforcement plate, and/or the surface roughness of the support plate is greater than 0.25 um, and/or the thickness of the support plate ranges from 0.15 mm to 0.3 mm.
  • the fingerprint identification device further includes:
  • Both ends of the bent portion are respectively used to connect the display screen and the circuit board, so that the circuit board is arranged in parallel under the display screen.
  • the bending portion includes:
  • the driving integrated circuit IC chip of the display screen, and the COF layer is used to fix the IC chip to the circuit board.
  • the bending portion further includes:
  • the shielding layer of the COF layer is the shielding layer of the COF layer
  • the shielding layer is arranged on the outer side of the COF layer, and the IC chip is arranged at a position close to the circuit board between the COF layer and the shielding layer.
  • the bending portion further includes:
  • the fixing member is arranged at a position of the COF layer close to the IC chip, and the fixing member is used to fix one end of the COF layer used for connecting the circuit board under the display screen.
  • the at least one fingerprint sensor chip includes a plurality of optical fingerprint sensor chips, and the plurality of optical fingerprint sensor chips are arranged side by side on the upper surface of the support plate to form an optical fingerprint sensor. Chip components.
  • a microlens array is provided above the at least one fingerprint sensor chip.
  • the fingerprint identification device further includes:
  • the optical filter is arranged above the at least one fingerprint sensor chip.
  • the light entrance surface of the filter is provided with an optical inorganic coating or an organic black coating.
  • the optical filter and the at least one fingerprint sensor chip are glued and fixed in the non-sensitive area of the at least one fingerprint sensor chip, and the optical filter and the at least one fingerprint There are gaps between the photosensitive areas of the sensor chip; or the lower surface of the filter is fixed on the upper surface of the at least one fingerprint sensor chip by glue with a refractive index lower than a preset refractive index.
  • glue dispensing is performed between the periphery of the filter and the circuit board.
  • the circuit board is connected to the at least one fingerprint sensor chip through a gold wire, and the height of the gold wire and the height of the sealing compound of the gold wire are respectively lower than those of the filter. height.
  • the fingerprint identification device further includes:
  • the connector is connected to the circuit board, the connector includes at least one pin, and the at least one pin includes a pin of the fingerprint identification device.
  • an electronic device including:
  • the fingerprint identification device is arranged below the display screen to realize under-screen fingerprint detection.
  • the display screen includes:
  • a light-shielding layer is arranged below the display component, the light-shielding layer is provided with an opening, and the fingerprint identification device receives the light emitted by the display component after being reflected by a human finger through the opening Signal, the optical signal is used for fingerprint identification;
  • At least one fingerprint sensor chip in the fingerprint identification device is in contact with the lower surface of the display assembly, or there is a gap between the at least one fingerprint sensor chip and the lower surface of the display assembly.
  • the electronic equipment of the embodiment of the present application can not only reduce the installation difficulty and complexity of at least one fingerprint sensor chip in the fingerprint identification device, but also improve maintainability.
  • the at least one fingerprint sensor chip includes multiple chips
  • the multiple chips can be fixedly installed below the display screen at one time, which can reduce installation complexity and improve installation efficiency.
  • Figure 1 is a schematic plan view of an electronic device to which this application can be applied.
  • Fig. 2 is a schematic side sectional view of the electronic device shown in Fig. 1.
  • FIG. 3 is a schematic structural diagram of the display screen of the electronic device and the fingerprint identification device of the embodiment of the present application before assembly.
  • Fig. 4 is a schematic structural diagram of a bending portion of the electronic device shown in Fig. 3.
  • FIG. 5 is a schematic structural diagram of the fingerprint identification device of the electronic equipment shown in FIG. 3.
  • FIG. 6 is a schematic structural diagram of the display screen of the electronic device and the fingerprint identification device of the embodiment of the present application after being assembled.
  • portable or mobile computing devices such as smartphones, notebook computers, tablet computers, and gaming devices, as well as other electronic devices such as electronic databases, automobiles, and bank automated teller machines (ATM).
  • ATM bank automated teller machines
  • the embodiments of the present application are not limited thereto.
  • biometric recognition technology includes but is not limited to fingerprint recognition, palmprint recognition, iris recognition, face recognition, and living body recognition.
  • fingerprint recognition technology includes but is not limited to fingerprint recognition, palmprint recognition, iris recognition, face recognition, and living body recognition.
  • fingerprint recognition technology uses fingerprint recognition technology as an example.
  • the under-screen fingerprint recognition technology refers to the installation of the fingerprint recognition module below the display screen, so as to realize the fingerprint recognition operation in the display area of the display screen. There is no need to set a fingerprint collection area on the front of the electronic device except for the display area.
  • the fingerprint recognition module uses the light returned from the top surface of the display assembly of the electronic device to perform fingerprint sensing and other sensing operations. This returned light carries information about objects (for example, fingers) in contact with the top surface of the display assembly, and the fingerprint recognition module located below the display assembly collects and detects this returned light to realize fingerprint recognition under the screen.
  • the fingerprint recognition module can be designed to achieve desired optical imaging by appropriately configuring optical elements for collecting and detecting the returned light.
  • in-display fingerprint recognition technology refers to the installation of fingerprint recognition modules or part of fingerprint recognition modules inside the display screen, so as to realize fingerprint recognition operations in the display area of the display screen without the need for electronic
  • the fingerprint collection area is set on the front of the device except the display area.
  • FIG. 1 and 2 show schematic diagrams of an electronic device 100 to which under-screen fingerprint recognition technology can be applied.
  • FIG. 1 is a front schematic diagram of the electronic device 100
  • FIG. 2 is a partial cross-sectional structure diagram of the electronic device 100 shown in FIG.
  • the electronic device 100 may include a display screen 120 and a fingerprint recognition module 140.
  • the display screen 120 may be a self-luminous display, which uses a self-luminous display unit as display pixels.
  • the display screen 120 may be an Organic Light-Emitting Diode (OLED) display screen or a Micro-LED (Micro-LED) display screen.
  • the display screen 120 may also be a liquid crystal display (LCD) or other passive light-emitting display, which is not limited in the embodiment of the present application.
  • the display screen 120 may also be specifically a touch-sensitive display screen, which can not only perform screen display, but also detect a user's touch or pressing operation, so as to provide a user with a human-computer interaction interface.
  • the electronic device 100 may include a touch sensor, and the touch sensor may specifically be a touch panel (TP), which may be provided on the surface of the display screen 120, or may be partially integrated or The whole is integrated into the display screen 120 to form the touch display screen.
  • TP touch panel
  • the fingerprint recognition module 140 may be an optical fingerprint recognition module, such as an optical fingerprint sensor.
  • the fingerprint identification module 140 may include a fingerprint sensor chip with an optical sensing array (hereinafter also referred to as an optical fingerprint sensor).
  • the optical sensing array includes multiple optical sensing units, and each optical sensing unit may specifically include a photodetector or a photoelectric sensor.
  • the fingerprint identification module 140 may include a photodetector array (or called a photodetector array, a photodetector array), which includes a plurality of photodetectors distributed in an array.
  • the fingerprint recognition module 140 may be arranged in a partial area below the display screen 120, so that the fingerprint collection area (or detection area) 130 of the fingerprint recognition module 140 is at least partially located on the display screen 120. ⁇ display area 102.
  • the fingerprint identification module 140 can also be arranged in other positions, such as the side of the display screen 120 or the non-transparent area of the edge of the electronic device 100.
  • the optical signal of at least part of the display area of the display screen 120 can be guided to the fingerprint recognition module 140 through the optical path design, so that the fingerprint collection area 130 is actually located in the display area of the display screen 120 .
  • the fingerprint recognition module 140 may include only one fingerprint sensor chip. At this time, the fingerprint collection area 130 of the fingerprint recognition module 140 has a small area and a fixed position. Therefore, the user needs to input fingerprints. Press the finger to a specific position of the fingerprint collection area 130, otherwise the fingerprint recognition module 140 may not be able to collect the fingerprint image, resulting in poor user experience.
  • the fingerprint identification module 140 may specifically include a plurality of fingerprint sensor chips; the plurality of fingerprint sensor chips may be arranged side by side under the display screen 120 in a splicing manner, and the plurality of fingerprint sensor chips The sensing areas of the two fingerprint sensor chips together constitute the fingerprint collection area 130 of the fingerprint identification module 140.
  • the fingerprint collection area 130 of the fingerprint identification module 140 may include multiple sub-areas, and each sub-area corresponds to the sensing area of one of the fingerprint sensor chips, so that the fingerprint of the optical fingerprint module 130 is collected
  • the area 130 can be extended to the main area of the lower half of the display screen, that is, to the area where the finger is habitually pressed, so as to realize the blind fingerprint input operation.
  • the fingerprint detection area 130 can also be extended to half of the display area or even the entire display area, thereby realizing half-screen or full-screen fingerprint detection.
  • the multiple fingerprint sensor chips may be individually packaged fingerprint sensor chips, or multiple chips (Die) packaged in the same chip package.
  • the multiple fingerprint sensor chips can also be fabricated on different regions of the same chip (Die) through a semiconductor process.
  • the area or light sensing range of the optical sensing array of the fingerprint identification module 140 corresponds to the fingerprint collection area 130 of the fingerprint identification module 140.
  • the fingerprint collection area 130 of the fingerprint recognition module 140 may be equal to or not equal to the area or the light sensing range of the optical sensing array of the fingerprint recognition module 140, which is not specifically limited in the embodiment of the present application.
  • the fingerprint collection area 130 of the fingerprint identification module 140 can be designed to be substantially the same as the area of the sensing array of the fingerprint identification module 140.
  • the area of the fingerprint collection area 130 of the fingerprint recognition module 140 can be larger than the area of the fingerprint recognition module 140 sensing array through the design of the light path of convergent light or the design of the light path of reflected light.
  • the optical path design of the fingerprint identification module 140 is exemplified below.
  • the optical collimator may be specifically a collimator layer made on a semiconductor silicon wafer. , It has a plurality of collimating units or micro-holes.
  • the collimating unit may be specifically a small hole.
  • the reflected light reflected from the finger the light that is perpendicularly incident on the collimating unit can pass through and be
  • the fingerprint sensor chip receives, and the light whose incident angle is too large is attenuated by multiple reflections inside the collimating unit. Therefore, each fingerprint sensor chip can basically only receive the reflected light reflected by the fingerprint lines directly above it. It can effectively improve the image resolution, thereby improving the fingerprint recognition effect.
  • a collimating unit may be configured for one optical sensor unit in the optical sensor array of each fingerprint sensor chip, and the collimating unit may be attached to the corresponding optical sensor.
  • the multiple optical sensing units can also share one collimating unit, that is, the one collimating unit has an aperture large enough to cover the multiple optical sensing units. Since one collimating unit can correspond to multiple optical sensing units, the correspondence between the spatial period of the display screen 120 and the spatial period of the fingerprint sensor chip is destroyed.
  • the spatial structure of the light-emitting display array of the display screen 120 and the fingerprint sensor chip are The spatial structure of the optical sensor array is similar, and it can also effectively prevent the fingerprint identification module 140 from using the light signal passing through the display screen 120 to perform fingerprint imaging to generate moiré fringes, which effectively improves the fingerprint identification effect of the fingerprint identification module 140.
  • the optical lens may include an optical lens (Lens) layer, which has one or more lens units, such as one or more aspheric lenses.
  • the lens group is used to converge the reflected light reflected from the finger to the sensing array of the fingerprint sensor chip below it, so that the sensing array can perform imaging based on the reflected light, thereby obtaining a fingerprint image of the finger.
  • the optical lens layer may also be formed with a pinhole in the optical path of the lens unit, and the pinhole may cooperate with the optical lens layer to expand the field of view of the fingerprint recognition module 140 to improve the fingerprint recognition module 140 Fingerprint imaging effect.
  • each fingerprint sensor chip can be equipped with an optical lens for fingerprint imaging, or multiple fingerprint sensor chips can be equipped with an optical lens to realize light convergence and fingerprint imaging.
  • the fingerprint sensor chip can also be equipped with two or more optical lenses to cooperate with the two sensors. The array or multiple sensing arrays perform optical imaging, thereby reducing the imaging distance and enhancing the imaging effect.
  • the micro-lens layer may have a micro-lens array formed by a plurality of micro-lenses, which may be obtained through a semiconductor growth process or other The process is formed above the sensing array of the fingerprint sensor chip, and each microlens can correspond to one of the sensing units of the sensing array.
  • Other optical film layers may be formed between the microlens layer and the sensing unit, such as a dielectric layer or a passivation layer. More specifically, the microlens layer and the sensing unit may also include micropores.
  • the light blocking layer wherein the micro-hole is formed between the corresponding micro lens and the sensing unit, the light blocking layer can block the optical interference between the adjacent micro lens and the sensing unit, and allow light to pass through the micro
  • the lens is converged into the microhole and is transmitted to the sensing unit corresponding to the microlens through the microhole to perform optical fingerprint imaging.
  • a microlens layer can be further provided under the collimator layer or the optical lens layer.
  • the collimator layer or the optical lens layer is used in combination with the microlens layer, its specific laminated structure or optical path may need to be adjusted according to actual needs.
  • the fingerprint identification module 140 can be used to collect user fingerprint information (such as fingerprint image information).
  • the display screen 120 can adopt a display screen with a self-luminous display unit, such as an organic light-emitting diode (Organic Light-Emitting Diode, OLED) display or a micro-LED (Micro-LED) display Screen.
  • the fingerprint recognition module 140 can use the display unit (ie, the OLED light source) of the OLED display screen located in the fingerprint collection area 130 as the excitation light source for optical fingerprint detection.
  • the display screen 120 When a finger touches, presses, or approaches (for ease of description, collectively referred to as pressing in this application) in the fingerprint collection area 130, the display screen 120 emits a beam of light to the finger above the fingerprint collection area 130. The surface is reflected to form reflected light or is scattered inside the finger to form scattered light. In related patent applications, for ease of description, the above-mentioned reflected light and scattered light are collectively referred to as reflected light. Since the ridge and valley of the fingerprint have different light reflection capabilities, the reflected light from the fingerprint ridge and the fingerprint ridge have different light intensities.
  • the fingerprint sensor chip in the identification module 140 receives and converts it into a corresponding electrical signal, that is, a fingerprint detection signal; fingerprint image data can be obtained based on the fingerprint detection signal, and fingerprint matching verification can be further performed, so that the electronic The device 100 implements an optical fingerprint recognition function.
  • the electronic device 100 adopting the above structure does not need to reserve a special space on the front of the fingerprint button (such as the Home button), so a full screen solution can be adopted. Therefore, the display area 102 of the display screen 120 can be substantially extended to the entire front surface of the electronic device 100.
  • the fingerprint identification module 140 may also use a built-in light source or an external light source to provide an optical signal for fingerprint detection and identification.
  • the fingerprint identification module 140 can be applied not only to self-luminous displays such as OLED displays, but also to non-self-luminous displays, such as liquid crystal displays or other passive light-emitting displays.
  • the optical fingerprint system of the electronic device 100 may also include an excitation light source for optical fingerprint detection.
  • the light source may specifically be an infrared light source or a light source of non-visible light of a specific wavelength, which may be arranged under the backlight module of the liquid crystal display or in the edge area under the protective cover of the electronic device 100, and the fingerprint recognition module 140 may
  • the liquid crystal panel or the protective cover is arranged under the edge area and guided by the light path so that the fingerprint detection light can reach the fingerprint identification module 140; or, the fingerprint identification module 140 can also be arranged under the backlight module, and
  • the backlight module is designed to allow the fingerprint detection light to pass through the liquid crystal panel and the backlight module and reach the fingerprint recognition module 140 by opening holes or other optical designs on the film layers such as the diffusion sheet, the brightness enhancement sheet, and the reflection sheet.
  • the fingerprint identification module 140 adopts a built-in light source or
  • the electronic device 100 may further include a protective cover 110.
  • the cover 110 may be specifically a transparent cover, such as a glass cover or a sapphire cover, which is located above the display screen 120 and covers the front of the electronic device 100, and the surface of the cover 110 may also be provided with a protective layer. Therefore, in the embodiment of the present application, the so-called finger pressing the display screen 120 may actually refer to the finger pressing the cover 110 above the display 120 or covering the surface of the protective layer of the cover 110.
  • a circuit board 150 such as a flexible printed circuit (FPC) (Flexible Printed Circuit, FPC), may also be provided under the fingerprint identification module 140.
  • FPC Flexible Printed Circuit
  • the fingerprint recognition module 140 can be soldered to the circuit board 150 through pads, and realize electrical interconnection and signal transmission with other peripheral circuits or other components of the electronic device 100 through the circuit board 150.
  • the fingerprint recognition module 140 can receive the control signal of the processing unit of the electronic device 100 through the circuit board 150, and can also output the fingerprint detection signal from the fingerprint recognition module 140 to the processing unit of the electronic device 100 through the circuit board 150. Control unit, etc.
  • the fingerprint identification device 140 may be directly fixed and attached to the lower surface of the display screen 120.
  • the display screen 120 is expensive and fragile, it is easy to damage the display screen 120 when the fingerprint identification module 140 is directly attached to the display screen 120.
  • the fingerprint identification module 140 and the display screen 120 are completely glued together, if the fingerprint identification module 140 is damaged, the display screen 120 is easily damaged when the fingerprint identification module 140 is removed.
  • the bonding process of directly bonding the fingerprint identification module 140 to the display screen 120 is also complicated.
  • the present application provides a fingerprint identification device, which can reduce the cost and complexity of the electronic device 100 and improve maintainability.
  • the fingerprint identification device 200 and the electronic device 300 of the embodiment of the present application will be described in detail below with reference to FIGS. 3 to 6. It should be noted that, for ease of description, in the embodiments of the present application, the same reference numerals are used to denote the same components, and for brevity, detailed descriptions of the same components are omitted in different embodiments.
  • FIG. 3 is a schematic structural diagram of the display screen of the electronic device and the fingerprint identification device of the embodiment of the present application before assembly.
  • the electronic equipment and fingerprint identification device of the embodiments of the present application will be described below with reference to the accompanying drawings.
  • the electronic device 200 includes a display screen 210 and a fingerprint identification device 220.
  • the fingerprint identification device 220 includes the circuit board 240 and a fingerprint sensor chip 221.
  • the fingerprint sensor chip 221 is arranged above the circuit board 240; the fingerprint sensor chip 221 is connected to the circuit board 240.
  • the fingerprint sensor chip 221 may include one or more optical fingerprint sensor chips. Each optical fingerprint sensor chip may include one or more optical fingerprint sensors or optical fingerprint sensor arrays.
  • the fingerprint sensor chip 221 includes a plurality of optical fingerprint sensor chips
  • the plurality of optical fingerprint sensor chips may be arranged side by side on the upper surface of the circuit board 240 to form an optical fingerprint sensor chip assembly.
  • the circuit board 240 is used to be installed under the display screen 210 so that the fingerprint sensor chip 221 is located under the display screen 210.
  • the fingerprint sensor chip 221 is used to receive a fingerprint detection signal returned by reflection or scattering of a human finger above the display 210, and the fingerprint detection signal is used to detect fingerprint information of the finger.
  • the circuit board 240 may be a circuit board of any component, for example, a circuit board of the display screen 210 or a circuit board of the fingerprint sensor chip 221.
  • the circuit board 240 is a common circuit board for the display screen and the fingerprint sensor chip 221 to simplify the structure of the electronic device.
  • the fingerprint sensor chip 221 may be arranged under the middle area of the display 210 of the electronic device 200 through the circuit board 240 to conform to the user's usage habits and facilitate the user to hold.
  • the circuit board 240 is arranged between the display screen 210 and the fingerprint sensor chip 221.
  • the fingerprint sensor chip 221 is arranged between the circuit board 240 and the display screen 210.
  • the fingerprint sensor 221 is disposed under the display screen 210 in a non-contact manner.
  • the fingerprint sensor chip 221 after the fingerprint sensor chip 221 is fixedly installed on the circuit board 240, the fingerprint sensor chip 221 can be fixedly installed under the display 210 of the electronic device through the circuit board 240, which avoids By directly attaching the fingerprint sensor chip 221 to the display screen 210, the installation difficulty and complexity of the fingerprint sensor chip 221 can be reduced, and the maintainability can be improved.
  • the multiple chips can be fixedly installed below the display screen 210 at one time, which can reduce installation complexity and improve installation efficiency.
  • a micro lens array may be provided above the fingerprint sensor chip 221.
  • the fingerprint sensor chip 221 receives the fingerprint detection signal emitted by the display screen 210 through the microlens array and returned by the reflection or scattering of the human finger above the display screen 210, and can collect the fingerprint detection at a large angle. Signal to improve fingerprint recognition efficiency.
  • the fingerprint sensor chip 211 shown in FIG. 3 may be the fingerprint sensor chip 210 in the fingerprint identification device 140 shown in FIGS. 1 and 2, and the circuit board 240 may be the circuit board 150 shown in FIGS. 1 and 2.
  • the related function and structure description please refer to the aforementioned related description. For brevity, it will not be repeated here.
  • FIG. 3 is only an example of this application and should not be construed as a limitation to this application.
  • the fingerprint sensor chip 211 and the circuit board may be arranged side by side on the support plate.
  • the fingerprint sensor chip 211 may also be fixed on the middle frame, back cover, or battery of the electronic device, so that the fingerprint sensor chip 211 is disposed on the electronic device. Below the display.
  • the fingerprint identification device 220 further includes a bent portion.
  • the two ends of the bent portion are respectively used to connect the display screen 210 and the circuit board 240 so that the circuit board 240 is arranged in parallel under the display screen 210.
  • the shape of the bent portion may be U-shaped or U-shaped deformation. Taking the shape of the bending part as a U-shape as an example, the two ends of the bending part are parallel to each other, so that the two ends of the bending part are respectively used to connect the display screen 210 and the circuit board At 240, it can be ensured that the circuit board 240 is arranged in parallel under the display screen 210.
  • Fig. 4 is a schematic structural diagram of a bending portion of the electronic device shown in Fig. 3.
  • the bending portion may include a chip on film (FPC, COF) layer 231 and a driver integrated circuit (IC) chip 234 of the display screen 210.
  • FPC chip on film
  • COF driver integrated circuit
  • the COF layer 231 can be used to fix the IC chip 234 to the circuit board 240.
  • the bent portion can use the COF layer 231 as a carrier to directly package the IC chip 234 on the COF layer 231 to form a chip package product. That is, the COF layer 231 can be used to carry the IC chip 234.
  • the COF layer 231 may also be referred to as a COF flexible packaging substrate.
  • the COF flexible packaging substrate refers to a packaged flexible substrate without chips and components installed, and it is an important component of a printed circuit board (PCB).
  • the COF layer 231 can also be used to electrically connect the IC chip 234 to the circuit board 240. That is, through the COF layer 231, the IC chip 234 can be joined to the circuit board 240, so that the IC chip can communicate with the circuit board 240.
  • the bent portion may be used as a part of the circuit board 240.
  • the fingerprint sensor chip 221 can be fixedly arranged under the display screen 210.
  • the bent circuit board 240 can be attached to the bottom of the display screen 210 through tape.
  • the fingerprint sensor chip 221 is installed under the display screen 210 through a circuit board, which has low installation cost and complexity, and improves its maintainability.
  • the bent portion may further include a shielding layer 232 of the COF layer.
  • the shielding layer 232 is used to support the IC chip 234 and to insulate the IC chip 234 from other components of the electronic device 200.
  • the shielding layer 232 may be disposed on the outside of the COF layer 231, and the IC chip 234 may be disposed between the COF layer 231 and the shielding layer 232 near the circuit board 240.
  • the shielding layer 232 may be disposed on the COF layer 231 close to the IC chip 234, that is, the shielding layer 232 may be disposed on a part of the outer side of the COF layer 231, or on The shielding layer 232 is provided on the entire outer side of the COF layer.
  • the embodiments of the present application do not specifically limit this.
  • the bending portion may further include a fixing member 233.
  • the fixing member 233 may be disposed at a position of the COF layer 231 close to the IC chip 234, and the fixing member 233 is used to fix one end of the COF layer 231 used to connect the circuit board 240 to the Below the display screen 210.
  • the fixing member 233 can ensure that the degree of bending of the bent portion remains unchanged, thereby ensuring that the position of the fingerprint sensor chip 221 relative to the display screen is fixed. As a result, the position of the fingerprint sensor chip 221 is prevented from changing during use, and the fingerprint recognition effect can be improved.
  • the fixing member 233 may include one or more parts for fixing.
  • the fixing member 233 can fix the end of the COF layer 231 for connecting the circuit board 240 under the display screen 210 by snapping or pasting.
  • the fixing member 233 may be fixed on the protective layer 217 of the display screen 210, or may be fixed on other components such as the middle frame or the battery of the electronic device 200, which is not specifically limited in the embodiment of the present application. .
  • the display screen 210 may include a display component 215 and a light shielding layer 216.
  • the light-shielding layer 216 is disposed under the display component 215, and the light-shielding layer 216 is provided with a window.
  • the fingerprint identification device 220 receives the display component 215 through the window and is reflected by a human finger. The optical signal is used for fingerprint identification.
  • the fingerprint sensor 221 in the fingerprint identification device 220 is in contact with the bottom surface of the display component 215, or there is a gap between the fingerprint sensor 221 and the bottom surface of the display component 215.
  • the gap can be an air gap that is not filled with any auxiliary materials, which can ensure that the fingerprint sensor 221 does not touch the bottom surface of the display when the display is pressed or the electronic device falls or collides. The stability and performance of fingerprint recognition by the fingerprint sensor 221 will not be affected.
  • the display component 215 may be a light-emitting layer of the display screen 210.
  • the display component 215 may be an OLED organic light-emitting panel made by low temperature poly-silicon (LTPS) technology, which has an ultra-thin thickness. , Light weight, low power consumption, can be used to provide clearer images.
  • LTPS low temperature poly-silicon
  • the gap may be less than or equal to a preset threshold, and the preset threshold includes but is not limited to 600um.
  • the light-shielding layer 216 can also be used as a screen print layer or an embossing layer.
  • the screen print layer can have graphics and text, and the graphics and text can be used as logos such as trademark patterns.
  • the light shielding layer 216 may be a black sheet layer or a printed layer for shielding light.
  • the display screen 210 may further include a protective layer 217 for protecting the display screen 210. Similar to the light-shielding layer 216, the protective layer 217 is also provided with a window through which the fingerprint identification device 220 receives the light signal emitted by the display assembly 215 and reflected by a human finger. The light signal is used for fingerprint recognition.
  • the protective layer 217 may also be referred to as a cushion layer or a back panel, or the light shielding layer 216 and the protective layer 217 may be integrally formed.
  • the protective layer 217 may also include a heat dissipation layer.
  • the protection layer 217 may include at least a part of the heat dissipation layer formed of a metal material.
  • the display screen 210 may further include a wiring layer 214, which may include wiring for electrical connection of the fingerprint sensor chip 221 and/or the display screen 210.
  • the display screen 210 may also include a polarizer (Polarizer, POL) 213.
  • Polarizers can also be called polarizers and are used to generate polarized light. The polarized light is used for optical signal imaging.
  • the display screen 210 may further include a cover glass 211, and the cover glass 211 is used to protect the display screen 210.
  • the cover glass 211 and the polarizing plate 213 may be bonded together by optically clear adhesive (OCA) 212.
  • OCA optically clear adhesive
  • the OCA 212 can be a double-sided adhesive tape without a substrate formed by making optical acrylic adhesive without a substrate, and then attaching a release film to the upper and lower bottom layers.
  • the OCA 212 can be a layer of double-sided adhesive without substrate with optical transparency.
  • the OCA 212 can be any adhesive used to bond transparent optical elements (such as lenses, etc.), as long as it is colorless and transparent, and has a light transmittance greater than a certain threshold (for example, above 90%) , Good bonding strength, can be cured at room temperature or medium temperature, and has the characteristics of small curing shrinkage.
  • a certain threshold for example, above 90%
  • the OCA 212 may be replaced by optically transparent resin (OCR).
  • the fingerprint identification device shown in FIG. 3 will be described in detail below.
  • FIG. 5 is a schematic structural diagram of the fingerprint identification device 220 of the electronic device shown in FIG. 3.
  • the circuit board 240 is provided with at least one mounting member 227 at the peripheral position of the fingerprint sensor chip 221, and the mounting member 227 is used to fix the circuit board 240 on the display screen 210.
  • the mounting member 227 is used to fix the circuit board 240 on the display screen 210.
  • the mounting member 227 is an adhesive tape.
  • the thickness of the mounting member 227 is such that the distance between the fingerprint sensor chip 221 and the lower surface of the light-emitting layer of the display screen 210 is less than or equal to 600 um.
  • the fingerprint identification device 220 may further include a supporting plate 229.
  • At least a part of the circuit board 240 is arranged between the fingerprint sensor chip 221 and the support plate 229. That is, the fingerprint sensor chip 221 may be arranged on the upper surface of the circuit board 240.
  • the fingerprint sensor chip 221 may be attached to the upper surface of the circuit board 240 through a die attach film (DAF) 222.
  • DAF die attach film
  • the supporting board 229 and the circuit board 240 are bonded together by an electroconductive adhesive 228.
  • the DAF 222 may be any ultra-thin thin film adhesive used to connect the semiconductor chip and the packaging substrate, and the chip and the chip in the semiconductor packaging process, so as to package the fingerprint sensor chip 221 in a layered and thin manner.
  • the conductive adhesive 228 may be an adhesive that has certain conductivity after curing or drying.
  • the fingerprint sensor chip 221 may also be fixedly connected to the support plate 229.
  • the circuit board 240 may be provided with a through hole, and the fingerprint sensor chip 221 is fixedly connected to the support plate 229 through the through hole.
  • the fingerprint sensor chip 221 may bypass the circuit board 240 and be fixedly connected to the support board 229.
  • the supporting plate 229 includes but is not limited to a metal reinforcing plate, and the thickness of the supporting plate 229 may range from 0.075 mm to 0.3 mm.
  • the metal reinforcement plate may be a rigid reinforcement plate, and the thickness of the support plate 229 ranges from 0.15 mm to 0.3 mm to control the thickness of the fingerprint identification device 220.
  • the surface roughness (Ra) of the support plate 229 is greater than a certain threshold, such as 0.25um, to improve the imaging effect; specifically, when the surface roughness of the support plate 229 is greater than a certain threshold, its surface can scatter light signals, It can effectively reduce the light signal emitted by the display screen 210 and reflected inside the fingerprint identification device 220, thereby avoiding the influence of light reflection on imaging; in addition, when the surface roughness of the support plate 229 is greater than a certain threshold, the The reliability of the connection between the support plate 229 and other components. For example, the reliability of the connection between the support plate 229 and the fingerprint sensor chip 221 and the circuit board 240 and the reliability of the connection between the support plate 229 and the components for fixing the support plate 229.
  • a certain threshold such as 0.25um
  • the color of the supporting plate 229 may be dark to increase the light absorption effect of the supporting plate 229, thereby preventing the light reflected upward by the supporting plate 229 from interfering with the light received by the fingerprint sensor chip 221. Such as black or dark brown.
  • the fingerprint identification device 220 further includes:
  • the optical filter 223 is arranged above the fingerprint sensor chip 221.
  • the filter 223 may include one or more optical filters, and the one or more optical filters may be configured as, for example, band-pass filters to allow the transmission of light emitted by the OLED screen, while blocking infrared light in sunlight, etc. Other light components. When the under-screen fingerprint identification device 220 is used outdoors, this kind of optical filtering can effectively reduce the background light caused by sunlight.
  • One or more optical filters may be implemented as, for example, an optical filter coating formed on one or more continuous interfaces, or may be implemented as one or more discrete interfaces. It should be understood that the filter 223 can be fabricated on the surface of any optical component, or along the optical path from the reflected light formed by the reflection of the finger to the fingerprint sensor chip 221.
  • the filter 223 is used to reduce undesired ambient light in fingerprint sensing, so as to improve the optical sensing of the fingerprint sensor chip 221 to the received light.
  • the filter 223 may be specifically used to filter out light of a specific wavelength, for example, near-infrared light and part of red light. For example, human fingers absorb most of the energy of light with a wavelength below 580nm. If one or more optical filters or optical filter layers are designed to filter light with wavelengths from 580nm to infrared, it can greatly reduce the impact of ambient light on fingerprints. The influence of optical detection in induction.
  • the light entrance surface of the filter 223 may be provided with an optical inorganic coating or an organic blackened coating, so that the reflectance of the light entrance surface of the filter 223 is lower than a first threshold, such as 1%, so that It is ensured that the fingerprint sensor chip 221 can receive enough light signals, thereby improving the fingerprint recognition effect.
  • a first threshold such as 1%
  • the filter 223 and the fingerprint sensor chip 221 are glued and fixed on the non-photosensitive area of the fingerprint sensor chip 221, and there is a gap between the filter 223 and the photosensitive area of the fingerprint sensor chip 221 .
  • the lower surface of the filter 223 is fixed on the upper surface of the fingerprint sensor chip 221 by glue with a refractive index lower than a predetermined refractive index.
  • the predetermined refractive index includes but is not limited to 1.3.
  • the periphery of the filter 223 and the circuit board 240 are glued and fixed.
  • the filter 223 when the filter 223 is filled and attached to the upper surface of the fingerprint sensor chip 221 with optical glue, once the upper surface of the fingerprint sensor chip 221 is covered with an uneven glue thickness, there will be a Newton ring phenomenon, which affects fingerprint recognition. effect.
  • the filter 223 can be attached to the upper surface of the fingerprint sensor chip 221 in an overhead manner, thereby ensuring that there is an air layer between the fingerprint sensor chip 221 and avoiding the Newton ring problem. To improve the fingerprint recognition effect.
  • the circuit board 240 is connected to the fingerprint sensor chip 221 through a gold wire 226, and the height of the gold wire 226 and the height of the sealing compound 225 of the gold wire 226 are respectively lower than The height of the filter 223.
  • the gold wire 226 is used to realize the communication between the fingerprint sensor chip 221 and the circuit board 240, and realizes the communication with other peripheral circuits or the electronic device shown in FIG. 1 or FIG. 2 through the circuit board 220.
  • the fingerprint sensor chip 221 may receive the control signal of the processing unit of the electronic device through the gold wire 226, and may also output a fingerprint detection signal (for example, a fingerprint image) to the fingerprint identification device through the gold wire 226 220 image processor or electronic device 300 processor.
  • the gold wire 226 is encapsulated by the sealant 225, which can effectively ensure the reliability of the connection between the circuit board 240 and the fingerprint sensor chip 221.
  • FIG. 6 is a schematic structural diagram of the display screen of the electronic device and the fingerprint identification device of the embodiment of the present application after being assembled.
  • the display screen 210 may be a soft screen or a hard screen, and the display screen may include a screen print layer 216 and a protective layer. 217 and other stacked layers.
  • the OLED screen will leak light downwards after opening the holes in the above-mentioned layers.
  • the filter 223 located below the OLED screen can be used to filter out infrared signal components in the leaked light. Since the fingerprint is a diffuse reflector, the light signal formed by the reflection or diffusion of the finger will exist in all directions.
  • a microlens array (Microlens Array) provided between the bottom of the OLED screen and the fingerprint sensor chip 221 can collect the light signals leaking from the top of the OLED screen. Therefore, the fingerprint sensor chip 221 performs imaging of a fingerprint image by receiving a light signal that filters out red light.
  • the light signals leaking from the top of the OLED screen include fingerprint signals and internal structure signals of the screen, and the internal structure signals of the screen will affect the imaging of the fingerprint image, for example, moiré fringes are generated when imaging the fingerprint image.
  • the size of the fingerprint sensor chip 221 and the OLED screen (for example, the lower surface of the display assembly 215) and the size of each part are controlled by controlling the mounting part 227 (for example, the glue for bonding the fingerprint recognition device) ) Is within 600um, which further blurs the imaging of the screen structure, but the imaging of the fingerprint structure is not affected. Since the smaller the distance between the fingerprint sensor chip 221 and the OLED screen, the better the fingerprint recognition performance. Therefore, under the premise of reliability and process capability, the gap between the fingerprint sensor chip 221 and the OLED screen can be minimized as much as possible. distance.
  • the fingerprint identification device 220 further includes a connector 250 of the display screen 210; the connector 250 is connected to the circuit board 240, and the connector 250 includes at least one tube.
  • the at least one pin includes the pin of the fingerprint identification device 220.
  • FIG. 3 to FIG. 6 are only examples of the present application, and should not be construed as limiting the present application.
  • the fingerprint identification device 220 may further include an image processor, and the image processor may be disposed on the circuit board 240.
  • the image processor may be specifically a microprocessor (Micro Processing Unit, MCU), which is used to receive fingerprint detection signals (such as fingerprint images) sent from the fingerprint sensor chip 221 through the circuit board 240, and perform fingerprint detection based on fingerprint detection signals. Signal fingerprint recognition.
  • MCU Micro Processing Unit
  • the fingerprint sensor chip 221 first receives the reflected light reflected from the user’s finger and performs imaging based on the received light signal to generate a fingerprint image; then, the fingerprint image is sent to the image processor through the circuit board 240, So that the image processor can process the image and get the fingerprint signal; finally, the fingerprint signal is fingerprinted through the algorithm.
  • the fingerprint identification device 220 may further include at least one capacitor, and the at least one capacitor may be disposed on the circuit board 220 for optimizing the fingerprint detection signal collected by the fingerprint sensor chip 221.
  • the at least one capacitor is used to filter the fingerprint detection signal collected by the fingerprint sensor chip 221.
  • the units can be implemented by electronic hardware, computer software, or a combination of both, in order to clearly illustrate the interchangeability of hardware and software.
  • the composition and steps of each example have been described generally in terms of function. Whether these functions are executed by hardware or software depends on the specific application and design constraint conditions of the technical solution. Professionals and technicians can use different methods for each specific application to implement the described functions, but such implementation should not be considered beyond the scope of this application.
  • the disclosed system and device may be implemented in other ways.
  • the device embodiments described above are only illustrative.
  • the division of the units is only a logical function division, and there may be other divisions in actual implementation, for example, multiple units or components can be combined or It can be integrated into another system, or some features can be ignored or not implemented.
  • the displayed or discussed mutual coupling or direct coupling or communication connection may be indirect coupling or communication connection through some interfaces, devices or units, and may also be electrical, mechanical or other forms of connection.
  • the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the objectives of the solutions of the embodiments of the present application.
  • the functional units in the various embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units may be integrated into one unit.
  • the above-mentioned integrated unit can be implemented in the form of hardware or software functional unit.
  • the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer readable storage medium.
  • the technical solution of the present application is essentially or the part that contributes to the existing technology, or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a
  • the storage medium includes several instructions to enable a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present application.
  • the aforementioned storage media include: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), magnetic disk or optical disk and other media that can store program code .

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
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  • Theoretical Computer Science (AREA)
  • Image Input (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)

Abstract

L'invention concerne un appareil de reconnaissance d'empreintes digitales et un dispositif électronique, l'appareil de reconnaissance d'empreintes digitales étant utilisé dans un dispositif électronique ayant un écran d'affichage, et l'appareil de reconnaissance d'empreintes digitales comprenant : une carte de circuit ; au moins une puce de capteur d'empreintes digitales, la ou les puces de capteur d'empreintes digitales étant disposées sur la carte de circuit ; la ou les puces de capteur d'empreintes digitales étant connectées à la carte de circuit ; la carte de circuit étant montée sous l'écran d'affichage, de façon à amener la ou les puces de capteur d'empreintes digitales à être disposées au-dessous de l'écran d'affichage. Dans des modes de réalisation de la présente invention, il est possible de réduire les coûts d'installation et la complexité de la ou des puces de capteur d'empreintes digitales au moyen de la carte de circuit, tout en augmentant la réparabilité. En particulier, pour le scénario d'une pluralité de puces de capteur d'empreintes digitales, la complexité de montage peut être efficacement réduite, et l'efficacité de montage des puces de capteur d'empreintes digitales peut être améliorée.
PCT/CN2019/076760 2019-03-01 2019-03-01 Appareil de reconnaissance d'empreintes digitales et dispositif électronique WO2020177032A1 (fr)

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PCT/CN2019/076760 WO2020177032A1 (fr) 2019-03-01 2019-03-01 Appareil de reconnaissance d'empreintes digitales et dispositif électronique

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CN110969151A (zh) * 2019-09-22 2020-04-07 神盾股份有限公司 指纹感测模块与电子装置
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