WO2020175848A1 - 전기자동차용 전력반도체 냉각모듈 - Google Patents

전기자동차용 전력반도체 냉각모듈 Download PDF

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Publication number
WO2020175848A1
WO2020175848A1 PCT/KR2020/002445 KR2020002445W WO2020175848A1 WO 2020175848 A1 WO2020175848 A1 WO 2020175848A1 KR 2020002445 W KR2020002445 W KR 2020002445W WO 2020175848 A1 WO2020175848 A1 WO 2020175848A1
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WO
WIPO (PCT)
Prior art keywords
heat
unit
power semiconductor
cooling module
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2020/002445
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English (en)
French (fr)
Inventor
황승재
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Amogreentech Co Ltd
Original Assignee
Amogreentech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020200020269A external-priority patent/KR102778495B1/ko
Application filed by Amogreentech Co Ltd filed Critical Amogreentech Co Ltd
Priority to CN202080014595.XA priority Critical patent/CN113439492B/zh
Priority to US17/433,057 priority patent/US11758698B2/en
Publication of WO2020175848A1 publication Critical patent/WO2020175848A1/ko
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure

Definitions

  • This invention relates to power semiconductor cooling modules for electric vehicles.
  • Types of eco-friendly vehicles include hybrid vehicles (HEV), electric vehicles (EV), and plug-in hybrids (PHEV) that combine the advantages of the two.
  • HEV hybrid vehicles
  • EV electric vehicles
  • PHEV plug-in hybrids
  • Eco-friendly cars need an inverter that converts the DC voltage provided by a high-voltage battery into an AC (alternating current) three-phase voltage to drive the motor.
  • a low DC-DC converter LDC
  • These inverters and LDCs can be combined to be called a power converter.
  • Such a power conversion device is a PCU (Power Control Unit) or a power module (eg IGBT (Insulated Insulated Unit)) that regulates and supplies a high voltage (eg 300V) of a driving battery to the motor gate bipolar transistor) module).
  • a power module eg IGBT (Insulated Insulated Unit)
  • a high voltage eg 300V
  • the power module is used for power devices such as inverters, smoothing capacitors, and converters.
  • It includes a power semiconductor that is a power conversion device. Since the power device or power semiconductor generates heat according to the supply of electricity, a separate cooling means is required.
  • Cooling performance can be an important factor, especially in the design of parts such as power semiconductors of power converters. That is, if these parts are constantly receiving heat, their performance will degrade and in severe cases will be damaged. The durability life is also reduced.
  • These power modules are electrically connected via a motor and a bus bar.
  • copper is used for the bus bar, but copper has both electrical and thermal conductivity due to the nature of the material. Accordingly, the heat generated when the motor is driven back flows through the bus bar to the power module side, and the power module is caused by the heat flowing back through the bus bar. There is a problem that its performance is degraded.
  • Its purpose is to provide a power semiconductor cooling module for electric vehicles that can solve the problem of heat flowing back from the motor to the power device.
  • the present invention is 2020/175848 1»(:1 ⁇ 1 ⁇ 2020/002445, a housing unit having an inner space; a power device unit disposed in the inner space and electrically connected to the motor via at least one bus bar; A heat radiating unit disposed in the inner space so as to be in contact with the power device unit to cool heat generated from the power device unit; And disposed to cover at least a portion of the total length of the bus bar, and contact the radiating unit It provides a power semiconductor cooling module for electric vehicles including;
  • the heat dissipation unit may include a heat sink disposed to be in contact with the power device unit, and a cooling unit that cools the heat sink.
  • the heat sink includes a plate-shaped heat dissipation plate having a predetermined area, and the
  • It may include a plurality of heat radiation fins protruding on one surface of the heat radiation plate.
  • the cooling unit is the body of the body to accommodate the heat sink.
  • It may include a receiving groove that is formed depressed by a certain depth from one side, the
  • the rim side can directly contact the body.
  • the cooling unit is the cooling water supplied from the outside is received inside
  • a body and an inlet and an outlet provided on one side of the body to allow the cooling water to flow in or out may be included, and the heat sink may be cooled through heat exchange with the cooling water.
  • the heat backflow preventing member is disposed so that at least one surface is in an interview with one surface of the cooling unit so that it can be cooled directly by the cooling unit.
  • the thermal backflow prevention member is made of a plastic material having heat dissipation and insulation properties.
  • Heat transfer material may be interposed.
  • the bus bar may include a first end electrically connected to the power device unit and a second end exposed to the outside through a through hole of the housing unit, and the thermal backflow prevention member includes the first It can be arranged to be located between the end and the second end. Through this, the heat backflow preventing member may block heat from moving from the first end to the second end through heat exchange with the heat dissipating part.
  • FIG. 2 is a view showing a state in which the housing is removed in FIG. 1;
  • Figure 3 is an exploded view of Figure 1
  • Figure 4 is a plan view of a state in which the cover plate is removed in Figure 1, And,
  • FIG. 5 is a cross-sectional view in the show-show direction of FIG. 1.
  • the power semiconductor cooling module 100 for an electric vehicle includes a housing part 0, a power device part 120, and a heat dissipation part 140, 150 as shown in FIGS. 1 to 3 ) And a heat backflow prevention member 160.
  • the housing part 0 may be formed in a shape of an enclosure having an internal space (3 ⁇ 4.
  • the housing part 1 10 is the power device part 120, the heat dissipation part 140, 150) and
  • Heat backflow prevention member 160, etc. can be accommodated in the inner space (3 ⁇ 4.
  • the housing part (0) may include a case 111 in the shape of a case having an open upper part (3 ⁇ 4) and a cover plate 112 covering the open upper part of the case 111 have.
  • the housing part (0) may be made of a material having heat dissipation.
  • the housing part 0 may be made of a metal material such as aluminum.
  • the material of the housing part (0) is not limited to this, and it has heat dissipation property 0249381
  • the housing part (0) may be made of not only a metal material, but also a known heat-dissipating plastic material that has heat-dissipating properties, and it is composed of a combination of metal material and heat-radiating plastic material. It could be.
  • the power device unit 120 may include a known insulating gate bipolar transistor, and may include a power device such as an inverter, a smoothing capacitor, and a converter, or a power semiconductor that is a power conversion device. In addition, The power device unit 120 may play a role of changing a voltage for driving a motor.
  • Such a power device unit 120 is generally applied to eco-friendly vehicles including hybrid vehicles, electric vehicles, and plug-in hybrid vehicles, so detailed descriptions will be omitted.
  • the power device unit 120 is at least one bus bar 130 as a medium
  • bus bar 130 is, as shown in Figs.
  • It may be connected to the power device unit 120, and the other end may be exposed to the outside of the housing unit (0).
  • the at least one bus bar 130 may be formed as a plate-like member having a predetermined length, and may have a shape bent at least one or more times.
  • Such a bus bar 130 is disposed in the inner space 1) of the housing unit 110
  • one end may be connected to the power device unit 120 and the other end may be exposed to the outside of the housing unit 0.
  • the bus bar 130 has a predetermined length, and the first end 131 and
  • It may be a plate-shaped member including a second end portion 132.
  • the first end 131 may be connected to the power device unit 120
  • the second end portion 132 is formed through the one side of the case 111
  • bus bar 130 electrically connects the power device unit 120 and the motor.
  • the bus bar 130 may be made of a material having conductivity so that it can be connected.
  • the bus bar 130 may be made of a metal material including copper, aluminum, and the like.
  • the heat dissipation parts 140 and 150 may be disposed in the inner space so as to be in contact with the power device part 120.
  • the heat generated from the power device unit 120 may be transferred and cooled.
  • the heat dissipation unit (140, 150) may include a heat sink (140) and a cooling unit (150).
  • the heat sink 140 is a device for operating the power device unit 120
  • the heat generated by the power device unit 120 may be transferred and discharged to the outside or may be transferred to other parts.
  • the heat sink 140 may be made of a metal material having excellent thermal conductivity.
  • the heat sink 140 has an overall weight.
  • the material of the heat sink 140 is not limited thereto, and the material of the heat sink 140 is not limited thereto, and any material having excellent heat dissipation and/or thermal conductivity can be used without limitation.
  • the heat sink 140 may be disposed so as to at least partially contact the power device unit 120 in the inner space.
  • the heat sink 140 has one side of the power device Part 120 can be interviewed.
  • the heat sink 140 is a plate having a predetermined area
  • It may include a heat dissipation plate 141, the upper surface of the heat dissipation plate 141 may be interviewed with the lower surface of the power device unit 120.
  • the heat dissipation plate 141 is in surface contact with the power element unit 120 to increase the heat exchange area so that the heat generated from the power element unit 120 can be smoothly transferred.
  • the heat sink 140 can increase heat dissipation by increasing the heat exchange area.
  • At least one heat dissipation fin 142 may be further included. That is, the heat sink 140 is also
  • it may include a plurality of heat dissipation fins 142 protruding a certain length on one surface of the heat dissipation plate 141.
  • the cooling unit 150 may forcibly cool the heat generated from the power device unit 120 and then transferred to the heat sink 140. Through this, the cooling unit 150 is the heat sink. By rapidly cooling the heat transferred to 140, the cooling unit 150 is the heat sink.
  • the temperature of the power device unit 120 can be maintained at an appropriate temperature.
  • the cooling unit 150 may cool the power device unit 120 by forcibly lowering the temperature of the heat sink 140 disposed to come into contact with one surface of the power device unit 120.
  • the cooling unit 150 is at least partially added to the heat sink 140 and
  • the cooling unit 150 can quickly cool the heat transferred from the power device unit 120 to the heat sink 140 using cooling water supplied from the outside.
  • the cooling unit 150 is the cooling water supplied from the outside
  • It may include a body 151 to be accommodated, and an inlet 153 and an outlet 154 provided respectively on one side of the body 151 to allow the cooling water to flow in and out.
  • the inlet 153 and the outlet 154 may be disposed to be exposed to the outside of the housing unit 0.
  • the body 151 is the cooling water supplied through the inlet 153
  • a plurality of channels may be formed inside so that they can flow in a zigzag manner, but this is not limited and may be formed as a single space.
  • the receiving groove 152 may be formed depressed by a certain depth from one surface of the body 151.
  • the body 151 is inwardly on the upper surface
  • It may include a receiving groove 152 that is retracted to a certain depth, and the receiving groove 152 may have approximately the same size as the heat sink 140.
  • the heat sink 140 can be inserted into the receiving groove 152 side, and the heat sink 140 is inserted into the receiving groove 152 while the body 151 and 2020/175848 1»(:1 ⁇ 1 ⁇ 2020/002445 At least some parts can be in direct contact.
  • the heat sink 140 is the receiving groove 152 so that the rim side of the heat dissipation plate 141 is in direct contact with the body 151 as shown in FIGS. 4 and 5 Can be inserted into
  • the heat sink 140 has a heat exchange area with the cooling unit 150
  • the thermal backflow prevention member 160 is from the motor through the bus bar 130
  • Heat flowing back can be induced to be discharged to the cooling unit 150 side. Through this, the heat backflow preventing member 160 prevents heat flowing back from the motor from being transferred to the power device unit 120
  • the power device unit 120 can maintain a set appropriate temperature, thereby preventing performance degradation and damage of the power device unit 120 due to heat in advance.
  • the thermal backflow prevention member 160 is of the total length of the bus bar 130
  • It may be disposed to wrap at least a portion of the length, and at least a portion may be disposed in the inner space (3 ⁇ 4) so as to be in contact with the cooling unit 150.
  • the thermal backflow prevention member 160 may be disposed to wrap the entire length disposed in the inner space) of the total length of the bus bar 130, but among the total length disposed in the inner space) It may be arranged to cover only some length.
  • the thermal backflow prevention member 160 may be disposed to cover the remaining length of the bus bar 130 except for the first end 131 and the second end 132, and the It may be arranged to be located between the first end 131 and the second end 132.
  • thermal backflow prevention member 160 includes the heat dissipation unit (140, 150)
  • the cooling unit 150 can be arranged to be in direct contact, and the heat backflow preventing member 160 is formed on one side of the cooling unit 150 so as to increase the heat exchange area.
  • the heat flowing back toward the bus bar 130 may be cooled by moving toward the cooling unit 150 through the heat backflow preventing member 160. Through this, the heat flowing back to the bus bar 130 may be cooled. 2020/175848 1»(:1 ⁇ 1 ⁇ 2020/002445
  • the heat backflow prevention member 160 can block the heat flowing back from the motor from being transferred to the power element unit 120, namely.
  • It may be made of a material having heat dissipation and insulation so that heat flowing back from the motor to the bus bar 130 side can be smoothly transferred to the cooling unit 150 side while preventing an electrical short circuit.
  • the heat backflow prevention member 160 may be made of a plastic material having heat dissipation and insulation properties. Through this, heat flowing back through the bus bar 130 is transferred to the cooling unit 150 and then quickly cools down. Can be
  • the power semiconductor for an electric vehicle according to an embodiment of the present invention
  • the cooling module 100 is smoothly transferred to the cooling unit 150 through a heat backflow prevention member 160 made of a plastic material having heat dissipation and insulation, even if heat flows back from the motor through the bus bar 130. It can be quickly discharged through the coolant supplied to the unit 150.
  • the embodiment is a measurement temperature at a position corresponding to the first end 131 and the second end 132 of the bus bar 130 in the power semiconductor cooling module 100 for an electric vehicle of the type shown in FIGS. 1 to 5 ,Comparative examples are in the positions corresponding to the first end 131 and the second end 132 of the bus bar 130 in the general type electric vehicle power semiconductor cooling module in which the thermal backflow prevention member is removed in the above embodiment.
  • the thermal backflow prevention member 160 is made of a material having a thermal conductivity of 3 /1111.
  • the temperature of the cooling water flowing into the cooling unit 150 was 25 ⁇ (:).
  • the cooling module 100 is cooled by the cooling unit 150, so that the amount of heat flowing back to the power element unit 120 is insignificant or a heat backflow prevention member ( It may be guided to the cooling unit 150 through 160 and lost.
  • the cooling module 100 has thermal conductivity of heat generated from the motor.
  • the cooling module 100 transmits heat generated from the motor through the bus bar 130.
  • the heat backflow prevention member 160 that can be applied to the power semiconductor cooling module 100 for an electric vehicle according to an embodiment of the present invention has heat dissipation and insulation
  • It may be an injection product formed of a resin-forming composition, and may be formed integrally with the bus bar 130 through insert molding.
  • the heat backflow preventing member 160 may be a plastic having heat dissipation and insulation properties in which an insulating heat dissipation filler is dispersed in a polymer matrix.
  • the polymer matrix can be used without limitation if it is implemented as a polymer compound that can be formed into a thread without impairing the dispersibility of the heat-radiating filler.
  • the polymer matrix may be a known thermoplastic polymer compound, and the thermoplastic polymer compound is polyamide, polyester, polyketone, liquid crystal polymer,
  • ,It may be one compound selected from the group consisting of polyetherimide ( ⁇ ) and polyimide, or a mixture or copolymer of two or more.
  • the insulating heat-dissipating filler may be used without limitation as long as it has both insulating and heat-dissipating properties.
  • the insulating heat-dissipating filler is magnesium oxide, titanium dioxide, aluminum nitride, silicon nitride, boron nitride, aluminum oxide, and It may contain one or more selected from the group consisting of silica, zinc oxide, barium titanate, strontium titanate, beryllium oxide, silicon carbide and manganese oxide.
  • the insulating heat-dissipating filler may be porous or non-porous, and a known conductive heat-dissipating filler such as carbon or metal is used as the core, and the insulating component is the core.
  • the surface may be modified with functional groups such as silane groups, amino groups, amine groups, hydroxyl groups, and carboxyl groups to improve the interfacial bonding strength with the polymer matrix.
  • functional groups such as silane groups, amino groups, amine groups, hydroxyl groups, and carboxyl groups to improve the interfacial bonding strength with the polymer matrix.
  • plastics having insulation and heat dissipation properties that can be used in the present invention are not limited thereto, and that any plastics having both insulation and heat dissipation properties can be used without limitation.
  • the power semiconductor cooling module 100 for an electric vehicle has a heat transfer material 170 on one surface of the heat backflow preventing member 160 in contact with each other and on one surface of the cooling unit 150 Can be deployed.
  • Such a heat transfer material (170) has thermal conductivity and
  • One side of the heat backflow preventing member 160 and one side of the heat backflow preventing member 160 facing each other so as to be able to interview each side of the cooling unit 150 and one side of the cooling unit 150 may be interposed.
  • the heat transfer material 170 may smoothly transfer heat from the heat backflow preventing member 160 to the cooling unit 150 side.
  • the heat transfer material 170 is a heat-dissipating composition including at least one of a thermally conductive filler and a phase change material, and may be in the form of a heated pad.
  • the heat transfer material 170 is a heat-dissipating composition comprising at least one of a phase shift compound and a thermally conductive filler on one surface of the heat backflow prevention member 160 is directly applied to a predetermined thickness to solidify the sheet It can also be a form.
  • the heat transfer material 170 is a heat backflow preventing member facing each other as shown in FIG. 4, as well as between one surface of the heat backflow preventing member 160 and one surface of the cooling unit 150 facing each other ( It may be interposed between one side of 160) and the bottom of the case 111.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Inverter Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Electric Propulsion And Braking For Vehicles (AREA)

Abstract

전기자동차용 전력반도체 냉각모듈이 제공된다. 본 발명의 예시적인 실시예에 따른 전기자동차용 전력반도체 냉각모듈은 모터와 전기적으로 연결되는 것으로서, 내부공간을 갖는 함체형상의 하우징부; 상기 내부공간에 배치되고 적어도 하나의 버스바를 매개로 상기 모터와 전기적으로 연결되는 파워소자부; 상기 파워소자부와 접하도록 상기 내부공간에 배치되어 상기 파워소자부에서 발생된 열을 냉각시키기 위한 방열부; 및 상기 버스바의 전체길이 중 적어도 일부의 길이를 감싸도록 배치되고 상기 방열부와 접촉되도록 배치되는 열역류방지부재;를 포함한다.

Description

2020/175848 1»（：1/10公020/002445 명세서
발명의명칭:전기자동차용전력반도체냉각모듈 기술분야
[1] 본발명은전기자동차용전력반도체냉각모듈에관한것이다.
배경기술
[2] 친환경자동차의종류로는하이브리드자동차 (HEV),전기차 (EV)를비롯하여이 둘의장점을결합한플러그인하이브리드 (PHEV)등이 있다.
[3] 이러한친환경차들은모터가교류 (AC) 3상전압으로구동된다.따라서,
친환경차들은고전압배터리에서제공되는직류전압을모터를구동하기위한 AC (교류) 3상전압으로변환하는인버터가필요하며,전조등,와이퍼,펌프, 제어보드등과같은자동차의부품들에 12V의전압을공급하기위하여고전압 배터리를 12V저전압의배터리로변환하기위한 LDC(Low DC-DC Converter)가 필요하다.이러한인버터및 LDC를합쳐서전력변환장치라고부를수있다.
[4] 이와같은전력변환장치는구동용배터리의높은전압 (예 : 300V)을모터에 적합한상태로조절하여공급하기위한 PCU (파워제어유닛 ; Power Control Unit) 또는파워모듈 (예 : IGBT(Insulated gate bipolar transistor)모듈)을포함한다.
[5] 파워모듈은인버터,평활콘덴서및컨버터등의파워소자또는
전력변환장치인전력반도체를포함한다.상기파워소자또는전력반도체는 전력 (electricity)의공급에따라열을발생하기때문에,반드시별도의냉각수단이 요구된다.
[6] 특히전력변환장치의전력반도체등과같은부품의설계에서는냉각성능이 중요한인자일수있다.즉,이러한부품이열을지속적으로받으면성능이 저하되고심한경우파손되며,냉각성능이떨어지면그만큼부품의내구수명도 줄어든다.
[7] 이와같은파워모듈은모터와버스바 (bus bar)를통해전기적으로연결된다. 통상적으로버스바는구리가사용되는데구리는재질의특성상전기전도성과 열전도성을모두가진다.이에따라,모터의구동시발생된열이버스바를통해 파워모듈측으로역류함으로써버스바를통해역류된열에의해파워모듈의 성능이저하되는문제가있다.
발명의상세한설명
기술적과제
[8] 본발명은상기와같은점을감안하여안출한것으로,버스바를통해
모터로부터파워소자부로열이역류하는문제를해결할수있는전기자동차용 전력반도체냉각모듈을제공하는데그목적이 있다.
과제해결수단
[9] 상술한과제를해결하기위하여 ,본발명은모터와전기적으로연결되는 2020/175848 1»（：1^1{2020/002445 것으로서,내부공간을갖는함체형상의하우징부;상기 내부공간에 배치되고 적어도하나의버스바를매개로상기모터와전기적으로연결되는파워소자부; 상기 파워소자부와접하도록상기내부공간에 배치되어상기 파워소자부에서 발생된열을냉각시키기 위한방열부;및상기 버스바의 전체길이중적어도 일부의 길이를감싸도록배치되고상기 방열부와접촉되도록배치되는 열역류방지부재 ;를포함하는전기자동차용전력반도체냉각모듈을제공한다.
[1이 또한,상기방열부는,상기 파워소자부와접하도록배치되는히트싱크와,상기 히트싱크를냉각시키는냉각유닛을포함할수있다.
[11] 또한,상기히트싱크는소정의면적을갖는판상의 방열플레이트와,상기
방열플레이트의 일면에돌출형성되는복수개의 방열핀을포함할수있다.
[12] 또한,상기 냉각유닛은상기히트싱크를수용할수있도록몸체의
일면으로부터 일정깊이함몰형성되는수용홈을포함할수있고,상기
히트싱크는상기수용홈에삽입된상태에서 테두리측이상기몸체와직접 접촉할수있다.
[13] 또한,상기 냉각유닛은외부로부터공급되는냉각수가내부에수용되는
몸체와,상기 냉각수가유입또는유출될수있도록상기몸체의 일측에 구비되는유입구및유출구를포함할수있고,상기 히트싱크는상기 냉각수와의 열교환을통해냉각될수있다.
[14] 또한,상기 열역류방지부재는적어도일면이상기 냉각유닛의 일면과서로 면접되도록배치되어상기 냉각유닛에의해직접 냉각될수있다.
[15] 또한,상기 열역류방지부재는방열성 및절연성을갖는플라스틱 재질로
이루어질수있다.
[16] 또한,서로대면하는열역류방지부재의 일면과냉각유닛의 일면사이에는
열전달물질이 개재될수있다.
[17] 또한,상기버스바는상기파워소자부와전기적으로연결되는제 1단부와상기 하우징부의통과공을통해외부로노출되는제 2단부를포함할수있고,상기 열역류방지부재는상기제 1단부및제 2단부사이에위치하도록배치될수있다. 이를통해,상기 열역류방지부재는상기방열부와의 열교환을통해상기 제 1단부로부터상기제 2단부측으로열이 이동하는것을차단할수있다.
발명의효과
[18] 본발명에 의하면,모터로부터발생된열이버스바를통해파워소자부측으로 역류하더라도역류된열이 열역류방지부재를통해 냉각유닛측으로방출될수 있다.이를통해,파워소자부는모터로부터 역류된열에 의한과열이
방지됨으로써 역류된열에 의한파워소자부의성능저하가미연에 방지될수 있다.
도면의간단한설명
[19] 도 1은본발명의 일실시예에 따른전기자동차용전력반도체냉각모듈을 2020/175848 1»（：1/10公020/002445 나타낸도면,
도 2는도 1에서하우징이제거된상태를나타낸도면,
도 3은도 1의분리도,
도 4는도 1에서덮개판이제거된상태의평면도,그리고,
도 5는도 1의쇼-쇼방향단면도이다.
발명의실시를위한형태
이하,첨부한도면을참고로하여본발명의실시예에대하여본발명이속하는 기술분야에서통상의지식을가진자가용이하게실시할수있도록상세히 설명한다.본발명은여러가지상이한형태로구현될수있으며여기에서 설명하는실시예에한정되지않는다.도면에서본발명을명확하게설명하기 위해서설명과관계없는부분은생략하였으며,명세서전체를통하여동일또는 유사한구성요소에대해서는동일한참조부호를부가한다.
[25] 본발명의일실시예에따른전기자동차용전력반도체냉각모듈 (100)은도 1 내지도 3에도시된바와같이하우징부 ( 0),파워소자부 (120),방열부 (140, 150) 및열역류방지부재 (160)를포함한다.
상기하우징부 ( 0)는내부공간 (¾을갖는함체형상으로형성될수있다.이를 통해,상기하우징부 ( 1 10)는상기파워소자부 (120),방열부 (140, 150)및
열역류방지부재 (160)등을상기내부공간 (¾에수용할수있다.
[27] 일례로,상기하우징부 ( 0)는상부가개방된내부공간 (¾을갖는함체형상의 케이스 (111)와상기케이스 (111)의개방된상부를덮는덮개판 (112)을포함할수 있다.
이때,상기하우징부 ( 0)는방열성을가지는재질로이루어질수있다.
일례로,상기하우징부 ( 0)는알루미늄과같은금속재질로이루어질수있다.
] ] ] ] ] ] ] 그러나상기하우징부 ( 0)의재질을이에한정하는것은아니며,방열성을갖는 0249381
2222222236 재질이라면공지의다양한재질이사용될수있다.즉,상기하우징부 ( 0)는 금속재질뿐만아니라방열성을갖는공지의방열플라스틱재질로이루어질 수도있으며,금속재질과방열플라스틱재질이조합된형태로구성될수도 있다.
30] 상기파워소자부 (120)는공지의절연게이트바이폴러트랜지스터 (汉^刀를 포함할수있으며,인버터,평활콘덴서및컨버터등과같은파워소자또는 전력변환장치인전력반도체를포함할수있다.또한,상기파워소자부 (120)는 모터를구동하기위한전압을변동시키는역할을수행할수있다.
이와같은파워소자부 (120)는하이브리드자동차 전기차田\0및 플러그인하이브리드 ( 正 자동차등을포함하는친환경차에통상적으로 적용되는내용이므로상세한설명은생략하기로한다.
32] 이때,상기파워소자부 (120)는적어도하나의버스바 (130)를매개로상기
친환경차를구동하기위한모터 (미도시)와전기적으로연결될수있다. 2020/175848 1»（：1^1{2020/002445
[33] 즉,상기버스바 (130)는도 2내지도 4에도시된바와같이일단부가상기
파워소자부 (120)와연결될수있으며,타단부가상기하우징부 ( 0)의외부로 노줄될수있다.
[34] 구체적으로,상기적어도하나의버스바 (130)는소정의길이를갖는판상의 부재로형성될수있으며,적어도 1회이상절곡된형상을가질수있다.
[35] 이와같은버스바 (130)는상기하우징부 (110)의내부공간 1)에배치된
상태에서일단부가상기파워소자부 (120)에연결될수있으며타단부가상기 하우징부 ( 0)의외부로노출될수있다.
[36] 일례로,상기버스바 (130)는소정의길이를갖추고제 1단부 (131)와
제 2단부 (132)를포함하는판상의부재일수있다.
[37] 이와같은경우,상기제 1단부 (131)는상기파워소자부 (120)에연결될수
있으며,상기제 2단부 (132)는상기케이스 (111)의일측에관통형성된
통과공 (111 을통해외부로노출될수있다.
[38] 여기서,상기버스바 (130)는상기파워소자부 (120)와모터를전기적으로
연결할수있도록도전성을가지는재질로이루어질수있다.일례로,상기 버스바 (130)는구리,알루미늄등을포함하는금속재질로이루어질수있다.
[39] 상기방열부 (140, 150)는상기파워소자부 (120)와접하도록상기내부공간 (幻에 배치될수있다.
[4이 이와같은방열부 (140, 150)는상기파워소자부 (120)의작동시상기
파워소자부 (120)에서발생된열을전달받아냉각시킬수있다.
[41] 일례로,상기방열부 (140, 150)는히트싱크 (140)와냉각유닛 (150)을포함할수 있다.
[42] 상기히트싱크 (140)는상기파워소자부 (120)의작동시상기
파워소자부 (120)에서발생된열을전달받아외부로방출하거나다른부품 측으로전달할수있다.
[43] 이를위해,상기히트싱크 (140)는열전도도가우수한금속재질로이루어질수 있다.비제한적인일례로써 ,상기히트싱크 (140)는전체적인무게를
경감하면서도열전도도가우수한알루미늄을포함하는금속재질로이루어질수 있다.그러나상기히트싱크 (140)의재질을이에한정하는것은아니며,방열성 및/또는열전도성이우수한재질이라면제한없이사용될수있다.
[44] 이때 ,상기히트싱크 (140)는상기내부공간 (幻에서상기파워소자부 (120)와 적어도일부가접하도록배치될수있다.일례로,상기히트싱크 (140)는일면이 상기파워소자부 (120)의일면과면접될수있다.
[45] 구체적으로,상기히트싱크 (140)는소정의면적을갖는판상의
방열플레이트 (141)를포함할수있으며,상기방열플레이트 (141)는상면이상기 파워소자부 (120)의하부면과면접할수있다.
[46] 이에따라,상기방열플레이트 (141)는상기파워소자부 (120)와면접촉됨으로써 열교환면적을넓혀상기파워소자부 (120)로부터발생된열이원활하게전달될 2020/175848 1»（：1^1{2020/002445 수있다.
[47] 이때 ,상기히트싱크 ( 140)는열교환면적을넓혀방열성을높일수있도록
적어도하나의방열핀 (142)을더포함할수있다.즉,상기히트싱크 (140)는도
3에도시된바와같이상기방열플레이트 (141)의일면에일정길이돌출형성되는 복수개의방열핀 (142)을포함할수있다.
[48] 상기냉각유닛 (150)은상기파워소자부 (120)에서발생된후상기히트싱크 (140) 측으로전달된열을강제로냉각시킬수있다.이를통해,상기냉각유닛 (150)은 상기히트싱크 (140)로전달된열을빠르게냉각시킴으로써상기
파워소자부 (120)의온도를적정온도로유지할수있다.
[49] 즉,상기냉각유닛 (150)은상기파워소자부 (120)의일면에접하도록배치되는 히트싱크 (140)의온도를강제로낮춰줌으로써상기파워소자부 (120)를냉각시킬 수있다.
[5이 이를위해,상기냉각유닛 (150)은적어도일부가상기히트싱크 (140)와
접하도록배치될수있으며,상기냉각유닛 (150)은외부로부터공급되는 냉각수를이용하여상기파워소자부 (120)로부터히트싱크 (140)로전달된열을 빠르게냉각시킬수있다.
[51] 구체적으로,상기냉각유닛 (150)은외부로부터공급되는냉각수가내부에
수용되는몸체 (151)와,상기냉각수가유,출입될수있도록상기몸체 (151)의 일측에각각구비되는유입구 (153)및유출구 (154)를포함할수있다.
[52] 이와같은경우,상기유입구 (153)및유출구 (154)는하우징부 ( 0)의외부로 노출되도록배치될수있다.
[53] 이를통해,외부로부터상기몸체 (151)의내부로공급된냉각수는상기
히트싱크 (140)와의열교환을통해상기히트싱크 (140)를냉각시킬수있으며, 상기파워소자부 (120)에서발생된열은냉각수를통해냉각되는히트싱크 (140) 측으로빠르게전달될수있다.이를통해,상기파워소자부 (120)는작동시열이 발생하더라도적정온도를유지할수있다.
[54] 여기서,상기몸체 (151)는상기유입구 (153)를통해공급된냉각수가
지그재그방식으로유동될수있도록내부에복수개의채널 (미도시)이형성될수 있으나이에한정하는것은아니며하나의공간으로형성될수도있다.
[55] 이때,상기냉각유닛 (150)은상기히트싱크 (140)를수용하면서상기
히트싱크 (140)와의접촉면적을넓힐수있도록수용홈 (152)을포함할수있다. 즉,상기수용홈 (152)은상기몸체 (151)의일면으로부터일정깊이함몰형성될수 있다.
[56] 일례로,도 3에도시된바와같이상기몸체 (151)는상부면에내측으로
일정깊이인입형성되는수용홈 (152)을포함할수있으며,상기수용홈 (152)은 상기히트싱크 (140)와대략동일한크기를가질수있다.
[57] 이를통해,상기히트싱크 (140)는상기수용홈 (152)측에삽입될수있으며 , 상기히트싱크 (140)는상기수용홈 (152)에삽입된상태에서상기몸체 (151)와 2020/175848 1»（：1^1{2020/002445 적어도일부가직접 접촉할수있다.
[58] 비제한적인일례로써 ,상기 히트싱크 (140)는도 4및도 5에도시된바와같이 상기 방열플레이트 (141)의 테두리측이상기몸체 (151)와직접접촉되도록상기 수용홈 (152)에삽입될수있다.
[59] 이에따라,상기 히트싱크 (140)는상기 냉각유닛 (150)과의 열교환면적이
증가될수있음으로써 냉각수와의 열교환을통해빠르게방열될수있다.
[6이 상기 열역류방지부재 (160)는상기모터로부터발생된열이 열전도성을가지는 버스바 (130)를통해파워소자부 (120)측으로역류하더라도역류된열이상기 파워소자부 (120)에 영향을끼치는것을방지할수있다.
[61] 즉,상기 열역류방지부재 (160)는상기 버스바 (130)를통해모터로부터
역류하는열이상기 냉각유닛 (150)측으로방출될수있도록유도할수있다. 이를통해,상기 열역류방지부재 (160)는모터로부터 역류하는열이상기 파워소자부 (120)측으로전달되는것을차단함으로써 열에 의한
파워소자부 (120)의성능저하및파손을미연에방지할수있다.
[62] 이에따라,상술한바와같이상기파워소자부 (120)의작동시
파워소자부 (120)에서발생된열은히트싱크 (140)측으로전달된후
냉각유닛 (150)을통해 냉각될수있으며,모터로부터버스바 (130)를통해 역류하는열은열역류방지부재 (160)를통해 냉각유닛 (150)측으로유도된후 냉각될수있다.
[63] 이로인해,상기 파워소자부 (120)는설정된적정온도를유지할수있음으로써 열에 의한파워소자부 (120)의성능저하및파손을미연에방지할수있다.
[64] 이를위해,상기 열역류방지부재 (160)는상기버스바 (130)의 전체길이중
적어도일부의길이를감싸도록배치될수있으며 ,적어도일부가상기 냉각유닛 (150)과접촉되도록상기내부공간 (¾에 배치될수있다.
[65] 여기서,상기 열역류방지부재 (160)는상기 버스바 (130)의 전체길이중상기 내부공간 )에 배치되는전체길이를감싸도록배치될수도있으나,상기 내부공간 )에 배치되는전체길이중일부의 길이만을감싸도록배치될수도 있다.
[66] 구체적으로,상기 열역류방지부재 (160)는상기 버스바 (130)의 전체길이중 제 1단부 (131)및제 2단부 (132)를제외한나머지길이부분을감싸도록배치될수 있으며,상기 제 1단부 (131)및제 2단부 (132)사이에위치하도록배치될수있다.
[67] 더불어,상기 열역류방지부재 (160)는상기 방열부 (140, 150)중상기
냉각유닛 (150)과직접 접촉하도록배치될수있으며,열역류방지부재 (160)는 열교환면적을넓힐수있도록일면이상기 냉각유닛 (150)을구성하는
몸체 (151)의 일면과면접하도록배치될수있다.
[68] 이에따라,상기모터로부터상기 버스바 (130)측으로역류하더라도상기
버스바 (130)측으로역류하는열은상기 열역류방지부재 (160)를통해상기 냉각유닛 (150)측으로이동하여 냉각될수있다.이를통해,상기 2020/175848 1»（：1^1{2020/002445 열역류방지부재 (160)는모터로부터 역류하는열이상기파워소자부 (120)즉으로 전달되는것을차단할수있다.
69] 이때,상기 열역류방지부재 (160)는상기 버스바 (130)와냉각유닛 (150)의
전기적인단락을방지하면서도상기모터로부터 버스바 (130)측으로역류하는 열을상기 냉각유닛 (150)측으로열을원활하게 전달할수있도록방열성 및 절연성을갖는재질로이루어질수있다.
일례로,상기 열역류방지부재 (160)는방열성 및절연성을갖는플라스틱 재질로이루어질수있다.이를통해,상기 버스바 (130)를통해 역류하는열은 상기 냉각유닛 (150)측으로전달된후빠르게 냉각될수있다.
이에따라,본발명의 일실시예에따른전기자동차용전력반도체
냉각모듈 (100)은상기 버스바 (130)를통해모터로부터 열이 역류하더라도 방열성 및절연성을갖는플라스틱 재질로이루어진열역류방지부재 (160)를 통해 냉각유닛 (150)측으로원활하게 전달된후상기 냉각유닛 (150)으로 공급되는냉각수를통해신속하게방출될수있다.
이는,하기표 1로부터확인할수있다.
실시예는도 1내지도 5에도시된형태의 전기자동차용전력반도체 냉각모듈 (100)에서버스바 (130)의 제 1단부 (131)및제 2단부 (132)에 해당하는 위치에서의측정온도이고,비교예는위의실시예에서 열역류방지부재가제거된 일반적인형태의 전기자동차용전력반도체냉각모듈에서 버스바 (130)의 제 1단부 (131)및제 2단부 (132)에해당하는위치에서의측정온도이다.또한, 실시예에서 열역류방지부재 (160)는열전도율이 3 /1111인재질을
사용하였으며,냉각유닛 (150)으로유입되는냉각수의온도는 25ᄋ (:의 냉각수를 사용하였다.
스 [표 1]
버스바의 위치별온도
Figure imgf000009_0001
[75] 위의표 1에서확인할수있듯이,본발명의 일실시예에따른전기자동차용 전력반도체 냉각모듈 (100)에서모터와연결되는제 2단부 (132)의온도가 비교예와동일하더라도상기 파워소자부 (120)와연결되는제 1단부 (131)에서의 온도는약 12.4 더낮은것을확인할수있다.
또한,상기 열역류방지부재 (160)가설치된부분에서의버스바 (130)의온도는 실시예가비교예보다 29.4 더낮은것을확인할수있다. 2020/175848 1»（：1^1{2020/002445 7] 위의결과로부터,실시예의경우상기제 2단부 (132)로부터제 1단부 (131)
측으로열이역류하더라도역류된열이제 1단부 (131)측으로이동하는과정에서 열역류방지부재 (160)를통해냉각유닛 (150)측으로전달되어냉각된다는것을 의미할수있다.
8] 이를통해,본발명의일실시에에따른전기자동차용전력반도체
냉각모듈 (100)은모터로부터버스바 (130)를통해열이역류하더라도역류된 열이냉각유닛 (150)을통해냉각됨으로써파워소자부 (120)측으로역류하는 열의양이미미하거나열역류방지부재 (160)를통해냉각유닛 (150)측으로 유도되어손실될수있다.
9] 이로인해,본발명의일실시에에따른전기자동차용전력반도체
냉각모듈 (100)은상기모터로부터발생된열이열전도성을가지는
버스바 (130)를통해파워소자부 (120)측으로역류하더라도역류된열이상기 파워소자부 (120)에미치는영향을최소화할수있다.
[8이 이를통해,본발명의일실시에에따른전기자동차용전력반도체
냉각모듈 (100)은상기모터로부터발생된열이버스바 (130)를통해
파워소자부 (120)측으로역류하더라도역류된열에의한파워소자부 (120)의 열적손상및성능저하를미연에방지할수있다.
[81] 한편,본발명의일실시예에따른전기자동차용전력반도체냉각모듈 (100)에 적용될수있는열역류방지부재 (160)는방열성및절연성을갖는
수지형성조성물로형성된사출물일수있으며,인서트몰딩을통해상기 버스바 (130)와일체로형성될수있다.
[82] 비제한적인일례로써,상기열역류방지부재 (160)는방열성및절연성을갖는 플라스틱은고분자매트릭스에절연성방열필러가분산된형태일수있다.
[83] 여기서 ,상기고분자매트릭스는방열필러의분산성을저해하지않으면서도 사줄성형이가능한고분자화합물로구현된경우제한없이사용될수있다. 구체적인일례로써,상기고분자매트릭스는공지된열가소성고분자화합물일 수있으며,상기열가소성고분자화합물은폴리아미드,폴리에스테르,폴리케톤, 액정고분자,
Figure imgf000010_0001
폴리에테르에테르케 폴리페닐렌옥사이드 汉)),
Figure imgf000010_0002
，폴리에테르이미드 班)및폴리이미드로이루어진 군에서선택된 1종의화합물,또는 2종이상의혼합물또는코폴리머일수있다.
[84] 또한,상기절연성방열필러는절연성및방열성을동시에가지는것이라면 제한없이모두사용될수있다.구체적인일례로써,상기절연성방열필러는 산화마그네슘,이산화티타늄,질화알루미늄,질화규소,질화붕소,산화알루미늄, 실리카,산화아연,티탄산바륨,티탄산스트론튬,산화베릴륨,실리콘카바이드및 산화망간으로이루어진군에서선택된 1종이상을포함할수있다.
[85] 더불어,상기절연성방열필러는다공질이거나비다공질일수있으며,카본계, 금속등의공지된전도성방열필러를코어로하고절연성성분이상기코어를 2020/175848 1»（：1^1{2020/002445 둘러싸는코어쉘타입의 필러일수도있다.
[86] 더하여,상기절연성 방열필러의경우젖음성등을향상시켜
고분자매트릭스와의 계면접합력을향상시킬수있도록표면이실란기, 아미노기,아민기,히드록시기,카르복실기등의관능기로개질된것일수도 있다.
[87] 그러나본발명에사용될수있는절연성 및방열성을갖는플라스틱을이에 한정하는것은아니며 절연성과방열성을동시에갖는플라스틱이라면 제한없이모두사용될수있음을밝혀둔다.
[88] 한편,본발명의 일실시예에 따른전기자동차용전력반도체냉각모듈 (100)은 서로접촉하는열역류방지부재 (160)의 일면과냉각유닛 (150)의 일면에 열전달물질 (170)이 배치될수있다.
[89] 이와같은열전달물질 (170)은열전도성을갖추고양면이각각
열역류방지부재 (160)의 일면과냉각유닛 (150)의 일면에 각각면접할수있도록 서로대면하는열역류방지부재 (160)의 일면과냉각유닛 (150)의 일면에 개재될 수있다.이를통해,상기 열전달물질 (170)은상기 열역류방지부재 (160)로부터 냉각유닛 (150)측으로열을원활하게 전달할수있다.
[9이 일례로써,상기 열전달물질 (170)은열전도성 필러 및상변이화합물 (Phase change materials)중어느하나이상을포함하는방열형성조성물이고화된패드 형태일수있다.
[91] 또한,상기 열전달물질 (170)은상기 열역류방지부재 (160)의 일면에상변이 화합물및열전도성 필러중어느하나이상을포함하는방열형성조성물이 소정의두께로직접도포되어고화된시트형태일수도있다.
[92] 여기서,상기 열전달물질 (170)은서로대면하는열역류방지부재 (160)의 일면과 냉각유닛 (150)의 일면사이와더불어도 4에도시된바와같이서로대면하는 열역류방지부재 (160)의 일면과케이스 (111)의바닥면사이에도개재될수있다.
[93] 이상에서본발명의 일실시예에 대하여 설명하였으나,본발명의사상은본 명세서에 제시되는실시 예에제한되지 아니하며 ,본발명의사상을이해하는 당업자는동일한사상의 범위내에서,구성요소의부가,변경,삭제 ,추가등에 의해서다른실시 예를용이하게제안할수있을것이나,이또한본발명의 사상범위 내에든다고할것이다.

Claims

2020/175848 1»（：1/10公020/002445 청구범위
[청구항 1] 모터와전기적으로연결되는전력반도체냉각모듈로서,
내부공간을갖는함체형상의하우징부;
상기내부공간에배치되고적어도하나의버스바를매개로상기모터와 전기적으로연결되는파워소자부;
상기파워소자부와접하도록상기내부공간에배치되어상기
파워소자부에서발생된열을냉각시키기위한방열부;및 상기버스바의전체길이중적어도일부의길이를감싸도록배치되고 상기방열부와접촉되도록배치되는열역류방지부재;를포함하는 전기자동차용전력반도체냉각모듈.
[청구항 2] 제 1항에 있어서,
상기방열부는,상기파워소자부와접하도록배치되는히트싱크와,상기 히트싱크를냉각시키는냉각유닛을포함하는전기자동차용전력반도체 냉각모듈.
[청구항 3] 제 2항에 있어서,
상기히트싱크는소정의면적을갖는판상의방열플레이트와,상기 방열플레이트의일면에돌출형성되는복수개의방열핀을포함하는 전기자동차용전력반도체냉각모듈.
[청구항 4] 제 2항에 있어서,
상기냉각유닛은상기히트싱크를수용할수있도록몸체의 일면으로부터일정깊이함몰형성되는수용홈을포함하고, 상기히트싱크는상기수용홈에삽입된상태에서테두리측이상기 몸체와직접접촉하는전기자동차용전력반도체냉각모듈.
[청구항 5] 제 2항에 있어서,
상기냉각유닛은외부로부터공급되는냉각수가내부에수용되는 몸체와,상기냉각수가유입또는유출될수있도록상기몸체의일측에 구비되는유입구및유출구를포함하고,
상기히트싱크는상기냉각수와의열교환을통해냉각되는전기자동차용 전력반도체냉각모듈.
[청구항 6] 제 2항에 있어서,
상기열역류방지부재는적어도일면이상기냉각유닛의일면과서로 면접되도록배치되어상기냉각유닛에의해직접냉각되는전기자동차용 전력반도체냉각모듈.
[청구항 7] 제 1항에 있어서,
상기열역류방지부재는방열성및절연성을갖는플라스틱재질로 이루어지는전기자동차용전력반도체냉각모듈.
[청구항 8] 제 1항에 있어서, 2020/175848 1»（：1^1{2020/002445 서로대면하는열역류방지부재의일면과냉각유닛의일면사이에는 열전달물질이개재되는전기자동차용전력반도체냉각모듈.
[청구항 9] 제 1항에있어서,
상기버스바는상기파워소자부와전기적으로연결되는제 1단부와상기 하우징부의통과공을통해외부로노출되는제 2단부를포함하고, 상기열역류방지부재는상기제 1단부및제 2단부사이에위치하도록 배치되는전기자동차용전력반도체냉각모듈.
[청구항 10] 제 9항에있어서,
상기열역류방지부재는상기방열부와의열교환을통해상기 제 1단부로부터상기제 2단부측으로열이이동하는것을차단하는 전기자동차용전력반도체냉각모듈.
PCT/KR2020/002445 2019-02-25 2020-02-20 전기자동차용 전력반도체 냉각모듈 Ceased WO2020175848A1 (ko)

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