WO2020166754A1 - Method for manufacturing plastic card having metal decoration inserted thereinto and plastic card having metal decoration inserted thereinto - Google Patents

Method for manufacturing plastic card having metal decoration inserted thereinto and plastic card having metal decoration inserted thereinto Download PDF

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Publication number
WO2020166754A1
WO2020166754A1 PCT/KR2019/002340 KR2019002340W WO2020166754A1 WO 2020166754 A1 WO2020166754 A1 WO 2020166754A1 KR 2019002340 W KR2019002340 W KR 2019002340W WO 2020166754 A1 WO2020166754 A1 WO 2020166754A1
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WO
WIPO (PCT)
Prior art keywords
metal decoration
plastic card
sheet
layer
metal
Prior art date
Application number
PCT/KR2019/002340
Other languages
French (fr)
Korean (ko)
Inventor
김한선
이재희
김기수
Original Assignee
코나아이 주식회사
코나엠 주식회사
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Application filed by 코나아이 주식회사, 코나엠 주식회사 filed Critical 코나아이 주식회사
Publication of WO2020166754A1 publication Critical patent/WO2020166754A1/en

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772Physical layout of the record carrier
    • G06K19/07728Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • B05D3/061Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
    • B05D3/065After-treatment
    • B05D3/067Curing or cross-linking the coating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/14Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B44DECORATIVE ARTS
    • B44CPRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C5/00Processes for producing special ornamental bodies
    • B44C5/04Ornamental plaques, e.g. decorative panels, decorative veneers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B44DECORATIVE ARTS
    • B44CPRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C5/00Processes for producing special ornamental bodies
    • B44C5/04Ornamental plaques, e.g. decorative panels, decorative veneers
    • B44C5/0415Ornamental plaques, e.g. decorative panels, decorative veneers containing metallic elements
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier

Definitions

  • the present invention relates to a method of manufacturing a plastic card in which a metal decoration is inserted, and to a plastic card in which a metal decoration is inserted, and more particularly, to provide a plastic card in which a metal decoration is inserted, but prevents distortion by dissimilar materials, and
  • the present invention relates to a card manufacturing method and a plastic card capable of preventing the three-dimensional pattern on the decorative surface from being worn or the metal decoration from being deteriorated.
  • credit cards can be used instead of cash, and in recent years, they have been developed as smart cards with built-in IC chips capable of storing large amounts of information, and are actively used not only for payment but also for various membership cards.
  • smart card market special cards using various materials are being developed.
  • differentiated metal credit cards have been developed for VIP customers, and metal cards have been provided to special customers by implementing high-quality credit cards with metallic luster.
  • the conventional decorative card is used by simply attaching a sheet of another material, the effect of allowing a three-dimensional pattern to be projected to the outside to feel a more peculiar three-dimensional effect could not be expected.
  • the present invention is an invention devised to solve the above problems, the present invention implements a solid attachment by inserting a metal decoration on the plastic card, and prevents the phenomenon that the plastic card is bent or the sheets are separated by providing a warp prevention layer, It is an object of the present invention to provide a method of manufacturing a plastic card with a metal decoration and a plastic card with a metal decoration that can prevent the three-dimensional pattern of the metal decoration surface from being worn or the metal decoration from being deteriorated.
  • a method of manufacturing a plastic card in which a metal decoration is inserted includes: preparing a warp prevention layer; Forming a plastic card sheet by laminating a laminated sheet in which a plurality of sheets are stacked including an inlay sheet on which an antenna coil is printed on the upper surface of the warp prevention layer; Forming a groove such that a portion of the warp prevention layer is exposed from an upper surface of the plastic card sheet; Inserting a metal ornament into the groove; And forming a UV cured layer by irradiating UV after applying a UV solution on the upper portion of the metal decoration.
  • the forming of the UV curing layer may include applying the UV solution so that the UV solution fills the irregularities caused by the negative and positive angles (three-dimensional patterns) formed on the metal decoration to make the upper surface of the UV cured layer flat.
  • the amount of forming and applying the UV solution may be determined based on the volume of the intaglio formed on the surface of the metal decoration or the amount of change in the weight of the metal decoration changed by the intaglio.
  • the material and thickness of the warp prevention layer may be determined according to the component and thickness of the metal decoration.
  • the step of inserting the metal decoration into the groove may include attaching the metal decoration to the groove using an adhesive in a region where the metal decoration meets the groove, and the adhesive may be provided as an epoxy bond for metal. I can.
  • the forming of the plastic card sheet includes forming the inlay sheet on the upper surface of the warp prevention layer, forming an upper print sheet on the upper surface of the inlay sheet, and coating the upper surface of the upper print sheet.
  • a middle coating layer may be formed, a lower print sheet printed on a lower surface of the warp prevention layer may be formed, and a lower coating layer coated on a lower surface of the lower print sheet may be formed.
  • the step of forming the UV cured layer cutting the plastic card sheet along a plurality of individual card outlines to generate individual cards including the laminated sheet, the UV cured layer, and an upper coating layer, Forming a COB insertion region by milling a portion of the remaining region of the individual card except for a portion facing the metal decoration, contacting the antenna coil and the COB pulled upward through the COB insertion region, and It may include; inserting the COB into the COB insertion region.
  • a plastic card into which a metal decoration is inserted may include a plastic card sheet formed by laminating a laminated sheet obtained by laminating a plurality of sheets including an inlay sheet printed with an antenna coil on an upper surface of the warp prevention layer; A metal decoration inserted into the groove formed from the upper surface of the plastic card sheet to a part of the warp prevention layer; And a UV cured layer formed on top of the metal decoration.
  • the UV cured layer is formed with a flat top surface of the UV cured layer by irradiating with UV after applying a UV solution to fill the irregularities caused by the yin and Yang (three-dimensional pattern) formed on the metal decoration,
  • the amount of applying the UV solution may be determined based on the volume of the intaglio formed on the surface of the metal decoration or the amount of change in the weight of the metal decoration changed by the intaglio.
  • the material and thickness of the anti-warping layer may be determined according to the component and thickness of the metal decoration.
  • the warping prevention layer is made of epoxy resin with a thickness of 0.05 mm to 0.15 mm It can be equipped with.
  • the inlay sheet is formed on an upper surface of the warp prevention layer, an upper print sheet is formed on the upper surface of the inlay sheet, and a middle coating layer coated on the upper surface of the upper print sheet is formed. Then, a printed lower print sheet may be formed on a lower surface of the warp prevention layer, and a coated lower coating layer may be formed on a lower surface of the lower print sheet.
  • the external of the plastic card it can increase competitiveness.
  • a UV cured layer is formed on the upper surface of the metal decoration inserted in the plastic card sheet to fill the irregularities caused by the three-dimensional pattern of the metal decoration to smooth the surface of the card.
  • the card can be manufactured while maintaining the flat state of the sheets of a large area by providing a warp prevention layer to prevent the phenomenon that the sheets are distorted as the metal decoration is inserted. And even if the card is used for a long period of time, it can prevent its shape from being distorted.
  • FIG. 1 is an exploded perspective view of a plastic card into which a metal decoration is inserted according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view illustrating a method of manufacturing a plastic card into which a metal decoration is inserted according to an embodiment of the present invention.
  • FIG. 3 is a cross-sectional view for explaining a method of manufacturing a COB in a plastic card into which a metal decoration is inserted according to an embodiment of the present invention.
  • FIG. 4 is a flowchart illustrating a method of manufacturing a plastic card with a metal decoration inserted according to an embodiment of the present invention.
  • FIG. 5 shows an example of a front surface of a plastic card into which a metal decoration is inserted according to an embodiment of the present invention.
  • FIG. 6 is a flowchart illustrating a method of manufacturing a plastic card into which a metal decoration is inserted according to an embodiment of the present invention.
  • FIG. 7 is a view showing an inlay sheet according to another embodiment of the present invention.
  • the plastic card 100 may include one or more sheets or layers (layers).
  • the plastic card 100 may include a warp prevention layer 130, an inlay sheet 140, a metal decoration 170, and a UV curing layer 180, and according to the embodiment, the lower coating layer 110 ), a lower print sheet 120, an upper print sheet 150, a middle coating layer 160, and an upper coating layer 190, and the like.
  • Components of the plastic card 100 according to an embodiment of the present invention are not limited thereto, and other components such as COB 101 for implementing the plastic card 100 may be further added, and additional functions For this, a display unit and a biometric sensor unit may be additionally included.
  • the plastic card 100 according to an embodiment of the present invention may be manufactured according to a standard size and thickness according to a predefined standard, and the size and thickness of each sheet are optimal for the operation of the plastic card and the sensitivity of wireless communication. It can be implemented to be combined by determining the thickness of.
  • the sheets constituting the plastic card 100 according to an embodiment of the present invention are not a sheet for making one card, but may be composed of a large sheet having a size including a plurality of cards to enable mass production. .
  • the metal decoration 170 inserted into the plastic card 100 is a decorative sheet expressing a material peculiar to metal and a three-dimensional pattern engraved on the metal, and may be formed of a metal component.
  • the metal component may be provided with, for example, pure gold, silver, copper, SUS (steel use stainless, stainless steel), alloy, or the like.
  • the metal decoration 170 may be a gold bar formed of pure gold.
  • the metal decoration 170 may include a three-dimensional pattern by embossing or engraving on the surface exposed from the plastic card 100.
  • a warp prevention layer 130 may be provided.
  • the anti-torsion layer 130 may be formed of a special synthetic resin.
  • the anti-warping layer 130 provided with an epoxy resin is resistant to heat, has high strength, and may not cause contraction or expansion at any temperature.
  • the anti-torsion layer 130 is provided in an organic relationship with the metal decoration 170, and the material and thickness of the anti-torsion layer 130 may be determined according to the composition and thickness of the metal decoration 170.
  • the anti-warping layer 130 is an epoxy resin. It can be provided with a thickness of 0.05mm ⁇ 0.15mm.
  • the inlay sheet 140 is a sheet including a radio frequency (RF) antenna coil, and the antenna coil included in the inlay sheet 140 is turned of the coil to show an optimized sensitivity through an RF communication (eg, NFC) sensitivity test. (Turn) number is determined.
  • the antenna coil may be implemented to be directly connected to a Chip-On-Board (COB) 101.
  • COB Chip-On-Board
  • the lower print sheet 120 and the upper print sheet 150 are sheets that print and display card information, and the lower print sheet 120 is under the warp prevention layer 130 and the upper print sheet 150 is an inlay sheet. (140) It may be formed on the top.
  • the above-described components 110 to 160 may be laminated as shown in FIG. 1 and then processed to form one plastic card body through a lamination process.
  • the lower coating layer 110, the middle coating layer 160, and the upper coating layer 190 to be described later may be formed of a transparent PVC sheet.
  • the thickness of the lower coating layer 110 and the middle coating layer 160 may be 0.06 mm, and the thickness of the lower print sheet 120, the upper print sheet 150, and the upper coating layer 190 may be 0.1 mm.
  • the thickness of the inlay sheet 140 may be 0.15 mm.
  • the groove (210 of FIG. 2) is a groove formed to insert the metal decoration 170, and may be formed to expose a part of the anti-torsion layer 130 from a part of the upper surface of the plastic card sheet.
  • the size of the groove 210 may be determined according to the area and thickness of the metal decoration 170.
  • the groove 210 penetrates the middle coating layer 160, the upper print sheet 150, and the inlay sheet 140, and the anti-torsion layer 130 may be formed in a recessed form leaving a predetermined height. For example, it can be formed through a grooving operation using a drill.
  • the metal decoration 170 may be attached to a region where the groove 210 meets the groove 210 through an adhesive (230 in FIG. 2), and for example, the adhesive 230 may be provided as an epoxy bond for metal.
  • the adhesive 230 may be provided as a hot melt sheet. Hot melt is melted by heating, and a material such as a thermoplastic resin has a characteristic that it solidifies when cooled after heating and melting, and such a material can be used as a film-type hot melt adhesive.
  • the UV curing layer 180 applies a UV (Ultraviolet) solution on the plastic card sheet into which the metal decoration 170 is inserted to fill the irregularities caused by the three-dimensional pattern formed on the metal decoration 170, and then an upper coating layer ( 190) may be attached and then irradiated with UV to cure the UV solution. Accordingly, the upper coating layer 190 may be adhered to the UV curing layer 180, and the upper surface of the UV curing layer 180 may be formed smoothly and flat.
  • a UV (Ultraviolet) solution on the plastic card sheet into which the metal decoration 170 is inserted to fill the irregularities caused by the three-dimensional pattern formed on the metal decoration 170, and then an upper coating layer ( 190) may be attached and then irradiated with UV to cure the UV solution. Accordingly, the upper coating layer 190 may be adhered to the UV curing layer 180, and the upper surface of the UV curing layer 180 may be formed smoothly and flat.
  • the thickness of the metal decoration 170 may be formed from 0.1mm to 0.55mm
  • the depth of the intaglio 172 formed on the surface of the metal decoration 170 may be formed from 0.001mm to 0.15mm
  • UV The cured layer 180 may have a thickness of 0.05 mm to 0.15 mm.
  • the metal decoration 170 may be coated with a transparent primer or the like on the surface to increase adhesion to the UV solution.
  • the plastic card 100 into which the metal decoration is inserted covers the metal decoration 170 by using a UV solution and is instantaneously dried, so that workability is improved and the plate of the card is horizontal. , Even if the uneven pattern engraved on the metal decoration 170, such as a gold bar, is embedded in the synthetic resin, it effectively expresses the unique glossiness of the metal decoration 170 to differentiate it from the general synthetic resin card.
  • FIG. 2 is a cross-sectional view for explaining a method of manufacturing a plastic card with a metal decoration inserted according to an embodiment of the present invention
  • FIG. 4 is a method of manufacturing a plastic card with a metal decoration inserted according to an embodiment of the present invention. This is a flow chart for explanation.
  • plastic card sheets 110 to 160 including a warp prevention layer may be prepared (S410 in FIG. 4 ).
  • the plastic card sheet is coated on the upper surface of the inlay sheet 140 with the antenna coil printed on the upper surface of the warp prevention layer 130, the upper print sheet 150 printed on the upper surface of the inlay sheet 140, and the upper print sheet 150 A laminated sheet in which the lower print sheet 120 printed on the lower surface of the middle coating layer 160, the anti-torsion layer 130, and the lower coating layer 110 coated on the lower surface of the lower print sheet 120 are laminated by heat and pressure. It can be formed into a single plastic card body by performing a laminate process.
  • the groove 210 so that a part of the warp prevention layer 130 is exposed from a part of the upper surface of the plastic card sheet It can be formed (S420 of FIG. 4).
  • the groove 210 may penetrate the middle coating layer 160, the upper print sheet 150, and the inlay sheet 140, and the anti-torsion layer 130 may be formed in a recessed shape leaving a predetermined height.
  • the depth D2 of the groove 210 formed in the warp prevention layer 130 may be smaller than the thickness D1 of the warp prevention layer 130.
  • the groove 210 may be formed through a grooving operation using a drill, and a construction method used for forming the groove 210 may be variously changed.
  • the adhesive 230 may be applied to at least a portion of the area where the metal decoration 170 meets the groove 210.
  • the adhesive 230 may be an epoxy bond for metal or a hot melt sheet.
  • the metal decoration 170 into the groove 210 (S430 of Figure 4).
  • the lower part of the metal decoration 170 may be adhered by an adhesive 230.
  • the metal decoration 170 may be a metal thin film cut into a specific pattern, and the area of the metal decoration 170 may be smaller than the area of the plastic card sheet. Since the metal decoration 170 is inserted into the groove 210 formed in a part of the plastic card sheet, even if the metal decoration 170 is inserted into the groove 210, the thickness of the entire card is not increased.
  • the metal decoration 170 may be provided in a shape such as a circle or a polygon, for example, as shown in FIG. 5 as a shape cut into a square, including a three-dimensional pattern by intaglio or embossing on the surface. can do.
  • 2D shows a cross section 172 of an intaglio engraved on the surface of the metal decoration 170.
  • the UV solution on the plastic card sheet into which the metal decoration 170 is inserted to fill the irregularities 172 due to the three-dimensional pattern formed on the surface of the metal decoration 170
  • the upper coating layer 190 is attached thereon and irradiated with UV to cure the UV solution (S440 of FIG. 4).
  • the anti-warping layer 130 is The epoxy resin may be provided with a thickness of 0.05 mm to 0.15 mm, and when the depth of the intaglio 172 formed on the surface of the metal decoration 170 is 0.001 mm to 0.15 mm, the thickness of the UV cured layer 180 It can be formed from 0.05mm to 0.15mm.
  • the amount of the UV solution applied to form the UV cured layer 180 depends on the volume of the intaglio 172 formed on the surface of the metal decoration 170 or the weight change of the metal decoration 170 reduced by the intaglio 172 It can be determined on the basis of.
  • the UV solution fills the intaglio 172
  • the surface of the UV curing layer 180 may be flat without being too thick or thin.
  • the plastic card 100 into which the metal decoration is inserted according to an embodiment of the present invention is cut into a specific pattern and a metal decoration 170 including a three-dimensional pattern is disposed on the surface, but the UV curing layer 180 and the upper
  • the metal decoration 170 is prevented from being worn by external contact or deteriorated or discolored due to oxidation in the air. Can be prevented.
  • the three-dimensional pattern and gloss of the metal decoration 170 inserted into the flat plastic card pass through the UV curing layer 180 and the upper coating layer 190, the three-dimensional effect of the metal decoration 170 may be expressed.
  • the appearance reflected from the outside is more beautiful and the dignity of the card can be improved.
  • the plastic card 100 into which the metal decoration is inserted according to an embodiment of the present invention has the advantage that the metal decoration 170 is embedded in the UV cured layer 180 and the upper coating layer 190 so that it is not easily removed or damaged.
  • a groove 210 is formed up to a part of the warp prevention layer 130 so that the metal decoration 170 is combined with the warp prevention layer 130, The plastic card 100 may be prevented from being distorted by the metal decoration 170 of a different material.
  • FIG. 3 is a cross-sectional view for explaining a method of manufacturing a COB in a plastic card into which a metal decoration is inserted according to an embodiment of the present invention.
  • the cross-section shown in FIG. 3 is a cross-section of a portion in which the COB 101 is formed, and may be a different position from the cross-section shown in FIG. 2.
  • the plastic card sheet is cut along the outlines of a plurality of individual cards as shown in (a) of FIG. 3, and the anti-warping layer ( 130), an inlay sheet 140, print sheets 120 and 150, a UV curing layer 180, and an upper coating layer 190 may be formed.
  • the COB 101 can be inserted into the COB insertion region while contacting the antenna coil 240 and the COB 101 pulled up through the COB insertion region. have.
  • the contact point between the antenna coil 240 and the COB 101 pulled upward may be contacted by a spot welding method.
  • the COB 101 may be fixed by applying an adhesive to the area where the rear surface of the COB 101 and the COB insertion area meet.
  • the antenna coil 240 connected to the back of the COB 101 is disposed at a predetermined distance so as not to directly contact the laminated plastic card sheet, or between the plastic card sheet and the COB 101 An additional process may be performed to form an insulating film.
  • the COB 101 may be selectively formed on the front or rear surface of the plastic card 100.
  • FIG. 6 is a flowchart illustrating a method of manufacturing a plastic card into which a metal decoration is inserted according to an embodiment of the present invention.
  • a metal decoration 170 is inserted, and a process related thereto is mainly described.
  • the inlay sheet 140 on which the antenna coil is printed on the upper surface of the anti-torsion layer 130, the upper print sheet 150, and the middle coating layer 160 are sequentially stacked, and the lower print sheet 120 is formed as the lower surface of the anti-torsion layer 130.
  • the lower coating layer 110 may be sequentially stacked to form a laminated sheet (S610).
  • a single plastic card sheet may be formed by performing a lamination process by heat and pressure (S620).
  • a groove 210 may be formed so that a part of the anti-torsion layer 130 is exposed from a part of the upper surface of the plastic card sheet (S630). Specifically, the groove 210 penetrates the middle coating layer 160, the upper print sheet 150, and the inlay sheet 140, and the anti-torsion layer 130 may be formed in a recessed form leaving a predetermined height. For example, it can be formed through a grooving operation using a drill.
  • the metal decoration 170 may be inserted into the groove 210 (S640).
  • the adhesive 230 may be applied to at least a portion of the area where the metal decoration 170 meets the groove 210.
  • the adhesive 230 may be provided as an epoxy bond for metal, or may be a hot melt sheet.
  • the metal decoration 170 may be a metal thin film cut into a specific pattern, and the area of the metal decoration 170 may be smaller than that of a plastic card sheet. Since the metal decoration 170 is inserted into the groove formed in a part of the plastic card sheet, it is not necessary to consider the limit on the thickness of the entire card due to the increase in thickness by the metal decoration 170.
  • the metal decoration 170 may be provided in a shape such as a circle or a polygon, and FIG. 5 is an example in which the metal decoration 170 is cut into a square, and the surface of the metal decoration 170 is embossed or engraved It may include a three-dimensional pattern by.
  • UV irradiation to cure the UV solution.
  • the anti-warping layer 130 is The epoxy resin may be provided with a thickness of 0.05 mm to 0.15 mm, and when the depth of the intaglio 172 formed on the surface of the metal decoration 170 is 0.001 mm to 0.15 mm, the thickness of the UV cured layer 180 It can be formed from 0.05mm to 0.15mm.
  • the amount of the UV solution applied to form the UV cured layer 180 depends on the volume of the intaglio 172 formed on the surface of the metal decoration 170 or the weight change of the metal decoration 170 reduced by the intaglio 172 It can be determined on the basis of.
  • the UV solution fills the intaglio 172
  • the surface of the UV curing layer 180 may be flat without being too thick or thin.
  • the upper coating layer 190 may be formed by coating the upper surface of the UV curing layer 180.
  • the plastic card sheet is cut along the outline of a plurality of individual cards, and the anti-warping layer 130, the inlay sheet 140, the print sheets 120 and 150, the UV curing layer 180, and the upper coating layer 190 It is possible to create an individual card including a (S660).
  • a part of the remaining area of the individual card except the part facing the metal decoration 170 is milled to form a COB insertion area, and the antenna coil is pulled upward through the COB insertion area, and the The COB 101 may be inserted into the COB insertion region while the antenna coil and the COB 101 are in contact (S670).
  • FIG. 7 is a view showing an inlay sheet according to another embodiment of the present invention.
  • the antenna coil 240 may be wound multiple times along the edge area of the inlay sheet 140, and the central portion on both sides of the short side of the inlay sheet 140 for connection with the COB 101 It can be extended and arranged.
  • the antenna coil 240 extends in the center of the inlay sheet 140 in the long axis direction to form a metal decoration ( The antenna coil 240 may not be disposed in the portion where 170 is formed.
  • the present invention is not limited thereto, and other elements such as a biometric sensor and a display unit for implementing a plastic card with a metal decoration inserted therein may be further added.
  • the plastic card 100 into which the metal decoration is inserted according to an embodiment of the present invention may be manufactured to fit a standard size and thickness according to a predefined standard, and the size and thickness of each sheet are determined by the operation of the metal card and It can be implemented to be combined by determining the optimum thickness suitable for communication sensitivity.
  • the sheets constituting the plastic card 100 into which the metal decoration is inserted is not a sheet for making one card, but a large sheet having a size including a plurality of cards to enable mass production. It can be composed of, and can be produced into multiple cards through cutting processing.

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  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Plasma & Fusion (AREA)
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  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
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  • Life Sciences & Earth Sciences (AREA)
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  • Credit Cards Or The Like (AREA)
  • Laminated Bodies (AREA)

Abstract

The present invention relates to a method for manufacturing a plastic card having a metal decoration inserted thereinto and a plastic card having a metal decoration inserted thereinto. The method for manufacturing a plastic card having a metal decoration inserted thereinto may comprise the steps of: preparing an anti-warping layer; laminating stacked sheets, formed by stacking, on the upper surface of the anti-warping layer, a plurality of sheets including an inlay sheet on which an antenna coil is printed, to form a plastic card sheet; forming a groove such that a portion of the anti-warping layer is exposed through the upper surface of the plastic card sheet; inserting a metal decoration into the groove; and applying a UV solution onto the metal decoration and then irradiating same with UV to form a UV-cured layer.

Description

금속 장식이 삽입된 플라스틱 카드의 제조방법 및 금속 장식이 삽입된 플라스틱 카드Manufacturing method of plastic card with metal decoration and plastic card with metal decoration
본 발명은 금속 장식이 삽입된 플라스틱 카드의 제조방법 및 금속 장식이 삽입된 플라스틱 카드에 관한 것으로서, 더욱 상세하게는 금속 장식이 삽입된 플라스틱 카드를 제공하되, 이종재질에 의한 뒤틀림을 방지하고, 금속 장식 표면의 입체무늬가 마모되거나 금속 장식이 변질되는 것을 방지할 수 있는 카드 제조 방법 및 플라스틱 카드에 관한 것이다.The present invention relates to a method of manufacturing a plastic card in which a metal decoration is inserted, and to a plastic card in which a metal decoration is inserted, and more particularly, to provide a plastic card in which a metal decoration is inserted, but prevents distortion by dissimilar materials, and The present invention relates to a card manufacturing method and a plastic card capable of preventing the three-dimensional pattern on the decorative surface from being worn or the metal decoration from being deteriorated.
일반적으로 신용카드는 현금을 대신하여 사용할 수 있을 뿐 아니라 근래에는 대용량의 정보를 수록할 수 있는 IC 칩들이 내장된 스마트 카드로 개발되어 결제뿐만 아니라 각종 멤버십 카드 등으로 적극 활용되고 있다. 이러한 스마트 카드 시장에서, 다양한 재질을 이용한 특수 카드들이 개발되고 있다. 특히, VIP 고객을 위하여 차별화된 금속재질의 신용카드가 개발되어 있고, 금속카드는 금속광택이 표출되는 고품위의 신용카드를 구현하여 특수 고객들에 제공되었다.In general, credit cards can be used instead of cash, and in recent years, they have been developed as smart cards with built-in IC chips capable of storing large amounts of information, and are actively used not only for payment but also for various membership cards. In this smart card market, special cards using various materials are being developed. In particular, differentiated metal credit cards have been developed for VIP customers, and metal cards have been provided to special customers by implementing high-quality credit cards with metallic luster.
종래의 금속카드는 재질이 서로 다른 금속편을 합성수지 시트에 부착하는 것이므로 재질의 이질감에 의하여 견고한 부착을 이룰 수 없었고, 접착강도가 현저히 저하되었으므로 플라스틱 카드가 휘어지면서 변형되거나 습기가 부여되면 시트들이 서로 분리되는 등의 문제가 발생하였다.In the conventional metal card, since metal pieces of different materials are attached to the synthetic resin sheet, a solid attachment could not be achieved due to the heterogeneity of the material, and the adhesive strength was significantly lowered. There was a problem such as a problem.
특히, 종래의 장식카드는 단순하게 다른 재질의 시트를 부착하여 사용하는 것이므로 입체무늬가 외부로 투영되어 보다 특이한 입체감을 느낄 수 있도록 하는 효과는 기대할 수 없었다.In particular, since the conventional decorative card is used by simply attaching a sheet of another material, the effect of allowing a three-dimensional pattern to be projected to the outside to feel a more peculiar three-dimensional effect could not be expected.
본 발명은 상기한 문제점을 해결하기 위해 고안된 발명으로서, 본 발명은 플라스틱 카드에 금속 장식을 삽입함으로써 견고한 부착을 구현하고, 뒤틀림 방지층을 구비함으로써 플라스틱 카드가 휘어지거나 시트들이 분리되는 현상을 방지하며, 금속 장식 표면의 입체무늬가 마모되거나 금속 장식이 변질되는 것을 방지할 수 있는 금속 장식이 삽입된 플라스틱 카드 제조 방법 및 금속 장식이 삽입된 플라스틱 카드를 제공하는 것을 목적으로 한다.The present invention is an invention devised to solve the above problems, the present invention implements a solid attachment by inserting a metal decoration on the plastic card, and prevents the phenomenon that the plastic card is bent or the sheets are separated by providing a warp prevention layer, It is an object of the present invention to provide a method of manufacturing a plastic card with a metal decoration and a plastic card with a metal decoration that can prevent the three-dimensional pattern of the metal decoration surface from being worn or the metal decoration from being deteriorated.
본 발명의 일 실시예에 따르면, 금속 장식이 삽입된 플라스틱 카드 제조 방법은, 뒤틀림 방지층을 준비하는 단계; 상기 뒤틀림 방지층의 상면에 안테나 코일이 인쇄된 인레이 시트를 포함하여 복수의 시트를 적층한 적층시트를 라미네이팅하여 플라스틱 카드시트를 형성하는 단계; 상기 플라스틱 카드시트의 상면으로부터 상기 뒤틀림 방지층의 일부가 노출되도록 홈을 형성하는 단계; 상기 홈에 금속 장식을 삽입하는 단계; 및 상기 금속 장식 상위에 UV 용액을 도포한 후, UV를 조사시켜 UV 경화층을 형성하는 단계;를 포함할 수 있다.According to an embodiment of the present invention, a method of manufacturing a plastic card in which a metal decoration is inserted includes: preparing a warp prevention layer; Forming a plastic card sheet by laminating a laminated sheet in which a plurality of sheets are stacked including an inlay sheet on which an antenna coil is printed on the upper surface of the warp prevention layer; Forming a groove such that a portion of the warp prevention layer is exposed from an upper surface of the plastic card sheet; Inserting a metal ornament into the groove; And forming a UV cured layer by irradiating UV after applying a UV solution on the upper portion of the metal decoration.
일 실시예로서, 상기 UV 경화층을 형성하는 단계는, 상기 UV 용액이 상기 금속 장식에 형성된 음양각(입체무늬)에 의한 요철을 메우도록 상기 UV 용액을 도포하여 상기 UV 경화층의 상면을 평탄하게 형성하고, 상기 UV 용액을 도포하는 양은 상기 금속 장식의 표면에 형성된 음각의 부피 또는 음각에 의해 변화된 상기 금속 장식의 중량 변화량에 기초하여 결정될 수 있다.In one embodiment, the forming of the UV curing layer may include applying the UV solution so that the UV solution fills the irregularities caused by the negative and positive angles (three-dimensional patterns) formed on the metal decoration to make the upper surface of the UV cured layer flat. The amount of forming and applying the UV solution may be determined based on the volume of the intaglio formed on the surface of the metal decoration or the amount of change in the weight of the metal decoration changed by the intaglio.
일 실시예로서, 상기 뒤틀림 방지층을 준비하는 단계는, 상기 금속 장식의 성분과 두께에 따라 상기 뒤틀림 방지층의 재질과 두께를 결정할 수 있다.As an example, in preparing the warp prevention layer, the material and thickness of the warp prevention layer may be determined according to the component and thickness of the metal decoration.
일 실시예로서, 상기 홈에 금속 장식을 삽입하는 단계는, 상기 금속 장식이 상기 홈과 만나는 영역에 접착제를 이용하여 상기 금속 장식을 상기 홈에 부착시키고, 상기 접착제는 메탈용 에폭시 본드로 구비될 수 있다.As an embodiment, the step of inserting the metal decoration into the groove may include attaching the metal decoration to the groove using an adhesive in a region where the metal decoration meets the groove, and the adhesive may be provided as an epoxy bond for metal. I can.
일 실시예로서, 상기 플라스틱 카드시트를 형성하는 단계는, 상기 뒤틀림 방지층의 상면에 상기 인레이 시트를 형성하고, 상기 인레이 시트의 상면에 상부 프린트 시트를 형성하며, 상기 상부 프린트 시트의 상면에 코팅된 중부 코팅층을 형성하고, 상기 뒤틀림 방지층의 하면에 인쇄된 하부 프린트 시트를 형성하며, 상기 하부 프린트 시트의 하면에 코팅된 하부 코팅층을 형성할 수 있다.As an embodiment, the forming of the plastic card sheet includes forming the inlay sheet on the upper surface of the warp prevention layer, forming an upper print sheet on the upper surface of the inlay sheet, and coating the upper surface of the upper print sheet. A middle coating layer may be formed, a lower print sheet printed on a lower surface of the warp prevention layer may be formed, and a lower coating layer coated on a lower surface of the lower print sheet may be formed.
일 실시예로서, 상기 UV 경화층을 형성하는 단계 이후, 상기 플라스틱 카드시트를 복수 개의 개별카드 외곽선을 따라 절삭하여, 상기 적층시트, UV 경화층 및 상부 코팅층을 포함하는 개별 카드를 생성하는 단계, 상기 개별 카드 중에서 상기 금속 장식과 마주하는 부분을 제외한 나머지 영역의 일부를 밀링하여 COB 삽입 영역을 형성하는 단계, 상기 COB 삽입 영역을 통해 상 방향으로 뽑아 올린 상기 안테나 코일과 COB를 접촉시키는 단계, 및 상기 COB 삽입 영역에 COB를 삽입하는 단계;를 포함할 수 있다.As an embodiment, after the step of forming the UV cured layer, cutting the plastic card sheet along a plurality of individual card outlines to generate individual cards including the laminated sheet, the UV cured layer, and an upper coating layer, Forming a COB insertion region by milling a portion of the remaining region of the individual card except for a portion facing the metal decoration, contacting the antenna coil and the COB pulled upward through the COB insertion region, and It may include; inserting the COB into the COB insertion region.
본 발명의 다른 실시예에 따르면, 금속 장식이 삽입된 플라스틱 카드는 뒤틀림 방지층의 상면에 안테나 코일이 인쇄된 인레이 시트를 포함한 복수의 시트를 적층한 적층시트를 라미네이팅하여 형성된 플라스틱 카드시트; 상기 플라스틱 카드시트의 상면으로부터 상기 뒤틀림 방지층의 일부까지 형성된 홈에 삽입된 금속 장식; 및 상기 금속 장식 상위에 형성된 UV 경화층;을 포함할 수 있다.According to another embodiment of the present invention, a plastic card into which a metal decoration is inserted may include a plastic card sheet formed by laminating a laminated sheet obtained by laminating a plurality of sheets including an inlay sheet printed with an antenna coil on an upper surface of the warp prevention layer; A metal decoration inserted into the groove formed from the upper surface of the plastic card sheet to a part of the warp prevention layer; And a UV cured layer formed on top of the metal decoration.
일 실시예로서, 상기 UV 경화층은, 상기 금속 장식에 형성된 음양각(입체무늬)에 의한 요철을 메우도록 UV 용액을 도포한 후, UV를 조사하여 상기 UV 경화층의 상면이 평탄하게 형성되며, 상기 UV 용액을 도포하는 양은 상기 금속 장식의 표면에 형성된 음각의 부피 또는 음각에 의해 변화된 상기 금속 장식의 중량 변화량에 기초하여 결정될 수 있다.In one embodiment, the UV cured layer is formed with a flat top surface of the UV cured layer by irradiating with UV after applying a UV solution to fill the irregularities caused by the yin and Yang (three-dimensional pattern) formed on the metal decoration, The amount of applying the UV solution may be determined based on the volume of the intaglio formed on the surface of the metal decoration or the amount of change in the weight of the metal decoration changed by the intaglio.
일 실시예로서, 상기 뒤틀림 방지층은, 상기 금속 장식의 성분과 두께에 따라 상기 뒤틀림 방지층의 재질과 두께가 결정될 수 있다.In one embodiment, the material and thickness of the anti-warping layer may be determined according to the component and thickness of the metal decoration.
일 실시예로서, 상기 뒤틀림 방지층은, 상기 금속 장식이 금 99.9%의 중량 3.75g의 재질로 두께가 0.1㎜ 내지 0.55㎜로 구비될 경우, 상기 뒤틀림 방지층은 에폭시 레진으로 0.05㎜ 내지 0.15㎜의 두께로 구비될 수 있다.As an embodiment, when the metal decoration is provided with a material having a weight of 3.75 g of 99.9% gold and a thickness of 0.1 mm to 0.55 mm, the warping prevention layer is made of epoxy resin with a thickness of 0.05 mm to 0.15 mm It can be equipped with.
일 실시예로서, 상기 플라스틱 카드시트는, 상기 뒤틀림 방지층의 상면에 상기 인레이 시트가 형성되고, 상기 인레이 시트의 상면에 상부 프린트 시트가 형성되며, 상기 상부 프린트 시트의 상면에 코팅된 중부 코팅층이 형성되고, 상기 뒤틀림 방지층의 하면에 인쇄된 하부 프린트 시트가 형성되며, 상기 하부 프린트 시트의 하면에 코팅된 하부 코팅층이 형성될 수 있다.As an embodiment, in the plastic card sheet, the inlay sheet is formed on an upper surface of the warp prevention layer, an upper print sheet is formed on the upper surface of the inlay sheet, and a middle coating layer coated on the upper surface of the upper print sheet is formed. Then, a printed lower print sheet may be formed on a lower surface of the warp prevention layer, and a coated lower coating layer may be formed on a lower surface of the lower print sheet.
본 발명에 따른 금속 장식이 삽입된 플라스틱 카드에 의하면, 플라스틱 카드에 삽입된 금속 장식으로부터 발산되는 광택과 금속 장식에 새겨진 입체무늬에 의해 보다 고품위를 느낄 수 있는 플라스틱 카드를 구현함으로써, 플라스틱 카드의 대외 경쟁력을 높여줄 수 있다.According to the plastic card in which the metal decoration is inserted according to the present invention, by implementing a plastic card that can feel a higher quality by the gloss emitted from the metal decoration inserted in the plastic card and the three-dimensional pattern engraved on the metal decoration, the external of the plastic card It can increase competitiveness.
또한, 본 발명에 따른 금속 장식이 삽입된 플라스틱 카드에 의하면, 플라스틱 카드 시트에 삽입된 금속 장식의 상면에 UV 경화층을 형성하여 금속 장식의 입체무늬에 의한 요철을 메워 카드의 표면을 매끈하게 하고, UV 경화층 상면에 코팅층을 접착함으로써, 카드를 장기간 사용하더라도 금속 장식이 외부 접촉에 의해 마모되거나 공기 중의 산화 등에 의해 변질 또는 변색되는 것을 방지할 수 있다.In addition, according to the plastic card into which the metal decoration is inserted according to the present invention, a UV cured layer is formed on the upper surface of the metal decoration inserted in the plastic card sheet to fill the irregularities caused by the three-dimensional pattern of the metal decoration to smooth the surface of the card. , By adhering the coating layer on the upper surface of the UV curing layer, even if the card is used for a long period of time, it is possible to prevent the metal decoration from being worn out by external contact or deteriorated or discolored due to oxidation in the air.
본 발명에 따른 금속 장식이 삽입된 플라스틱 카드 제조 방법에 의하면, 금속 장식을 삽입함에 따라 시트들이 뒤틀리는 현상을 방지하기 위하여 뒤틀림 방지층을 구비함에 따라 대면적의 시트들의 평면 상태를 유지하면서 카드를 제조할 수 있고, 카드를 장기간 사용하더라도 형태가 틀어지는 것을 방지할 수 있다.According to the method of manufacturing a plastic card with a metal decoration inserted according to the present invention, the card can be manufactured while maintaining the flat state of the sheets of a large area by providing a warp prevention layer to prevent the phenomenon that the sheets are distorted as the metal decoration is inserted. And even if the card is used for a long period of time, it can prevent its shape from being distorted.
도 1은 본 발명의 일 실시예에 따른 금속 장식이 삽입된 플라스틱 카드의 분해 사시도를 도시한 것이다.1 is an exploded perspective view of a plastic card into which a metal decoration is inserted according to an embodiment of the present invention.
도 2는 본 발명의 일 실시예에 따른 금속 장식이 삽입된 플라스틱 카드의 제조방법을 설명하기 위한 단면도이다.2 is a cross-sectional view illustrating a method of manufacturing a plastic card into which a metal decoration is inserted according to an embodiment of the present invention.
도 3은 본 발명의 일 실시예에 따른 금속 장식이 삽입된 플라스틱 카드에 COB를 구비하는 제조방법을 설명하기 위한 단면도이다. 3 is a cross-sectional view for explaining a method of manufacturing a COB in a plastic card into which a metal decoration is inserted according to an embodiment of the present invention.
도 4는 본 발명의 일 실시예에 따른 금속 장식이 삽입된 플라스틱 카드의 제조방법을 설명하기 위한 순서도이다. 4 is a flowchart illustrating a method of manufacturing a plastic card with a metal decoration inserted according to an embodiment of the present invention.
도 5는 본 발명의 일 실시예에 따른 금속 장식이 삽입된 플라스틱 카드의 전면의 일 예를 도시한다.5 shows an example of a front surface of a plastic card into which a metal decoration is inserted according to an embodiment of the present invention.
도 6은 본 발명의 일 실시예에 따른 금속 장식이 삽입된 플라스틱 카드의 제조 방법을 설명하기 위한 순서도이다.6 is a flowchart illustrating a method of manufacturing a plastic card into which a metal decoration is inserted according to an embodiment of the present invention.
도 7은 본 발명의 다른 실시예에 따른 인레이 시트를 나타내는 도면이다.7 is a view showing an inlay sheet according to another embodiment of the present invention.
이하에서는 첨부한 도면을 참조하여 본 발명을 설명하기로 한다. 그러나 본 발명은 여러 가지 상이한 형태로 구현될 수 있으며, 따라서 여기에서 설명하는 실시예로 한정되는 것은 아니다. 그리고 도면에서 본 발명을 명확하게 설명하기 위해서 설명과 관계없는 부분은 생략하였으며, 명세서 전체를 통하여 유사한 부분에 대해서는 유사한 도면 부호를 붙였다.Hereinafter, the present invention will be described with reference to the accompanying drawings. However, the present invention may be implemented in various different forms, and therefore is not limited to the embodiments described herein. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and similar reference numerals are assigned to similar parts throughout the specification.
명세서 전체에서, 어떤 부분이 다른 부분과 "연결"되어 있다고 할 때, 이는 "직접적으로 연결"되어 있는 경우뿐 아니라, 그 중간에 다른 부재를 사이에 두고 "간접적으로 연결"되어 있는 경우도 포함한다. 또한 어떤 부분이 어떤 구성요소를 "포함"한다고 할 때, 이는 특별히 반대되는 기재가 없는 한 다른 구성요소를 제외하는 것이 아니라 다른 구성요소를 더 구비할 수 있다는 것을 의미한다.Throughout the specification, when a part is said to be "connected" with another part, this includes not only "directly connected" but also "indirectly connected" with another member interposed therebetween. . In addition, when a part "includes" a certain component, it means that other components may be further provided, rather than excluding other components unless specifically stated to the contrary.
이하 첨부된 도면을 참고하여 본 발명의 실시예를 상세히 설명하기로 한다.Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도 1은 본 발명의 일 실시예에 따른 금속 장식이 삽입된 플라스틱 카드(100)의 분해 사시도를 도시한 것이다. 플라스틱 카드(100)는 하나 이상의 시트 또는 레이어(층)을 포함할 수 있다. 일 실시예로서, 플라스틱 카드(100)는 뒤틀림 방지층(130), 인레이 시트(140), 금속 장식(170) 및 UV 경화층(180)을 포함할 수 있으며, 실시예에 따라, 하부 코팅층(110), 하부 프린트 시트(120), 상부 프린트 시트(150), 중부 코팅층(160) 및 상부 코팅층(190) 등의 구성을 더 포함할 수 있다. 본 발명의 일 실시예에 따른 플라스틱 카드(100)의 구성요소들은 이에 한정되는 것은 아니며, 플라스틱 카드(100)의 구현을 위한 COB(101) 등의 다른 구성요소들이 더 추가될 수 있고, 부가 기능을 위해 디스플레이부, 생체 센서부 등이 추가로 포함될 수 있다. 1 is an exploded perspective view of a plastic card 100 into which a metal decoration is inserted according to an embodiment of the present invention. The plastic card 100 may include one or more sheets or layers (layers). As an embodiment, the plastic card 100 may include a warp prevention layer 130, an inlay sheet 140, a metal decoration 170, and a UV curing layer 180, and according to the embodiment, the lower coating layer 110 ), a lower print sheet 120, an upper print sheet 150, a middle coating layer 160, and an upper coating layer 190, and the like. Components of the plastic card 100 according to an embodiment of the present invention are not limited thereto, and other components such as COB 101 for implementing the plastic card 100 may be further added, and additional functions For this, a display unit and a biometric sensor unit may be additionally included.
또한 본 발명의 일 실시예에 따른 플라스틱 카드(100)는 미리 정의된 기준에 따른 규격 사이즈와 두께에 맞게 제조될 수 있고, 각 시트의 사이즈와 두께는 플라스틱 카드의 동작과 무선 통신 감도 등에 맞는 최적의 두께로 결정되어 결합되도록 구현될 수 있다. 나아가, 본 발명의 일 실시예에 따른 플라스틱 카드(100)를 구성하는 시트들은 하나의 카드를 만들기 위한 시트가 아니라, 대량생산이 가능하도록 복수 개의 카드를 포함하는 크기의 대형 시트로 구성될 수 있다.In addition, the plastic card 100 according to an embodiment of the present invention may be manufactured according to a standard size and thickness according to a predefined standard, and the size and thickness of each sheet are optimal for the operation of the plastic card and the sensitivity of wireless communication. It can be implemented to be combined by determining the thickness of. Further, the sheets constituting the plastic card 100 according to an embodiment of the present invention are not a sheet for making one card, but may be composed of a large sheet having a size including a plurality of cards to enable mass production. .
플라스틱 카드(100)에 삽입되는 금속 장식(170)은 금속 특유의 재질과 금속에 새겨진 입체 무늬를 표현하는 장식 시트로서, 금속 성분으로 형성될 수 있다. 금속 성분은 예를 들어, 순금, 은, 동, SUS(steel use stainless, 스테인리스 강), 합금 등으로 구비될 수 있다. 바람직하게는, 상기 금속 장식(170)은 순금으로 형성된 골드바일 수 있다. 금속 장식(170)은 플라스틱 카드(100)로부터 노출되는 표면에 양각 또는 음각에 의한 입체문양을 포함할 수 있다. The metal decoration 170 inserted into the plastic card 100 is a decorative sheet expressing a material peculiar to metal and a three-dimensional pattern engraved on the metal, and may be formed of a metal component. The metal component may be provided with, for example, pure gold, silver, copper, SUS (steel use stainless, stainless steel), alloy, or the like. Preferably, the metal decoration 170 may be a gold bar formed of pure gold. The metal decoration 170 may include a three-dimensional pattern by embossing or engraving on the surface exposed from the plastic card 100.
플라스틱 카드(100)에 금속 장식(170)을 삽입하면 이종재질에 의해 플라스틱 카드(100)가 뒤틀릴 염려가 있다. 특히 도 1에 도시된 바와 같이 금속 장식(170)이 플라스틱 카드(100)의 전체 면적보다 작게 일부에만 형성되는 경우 플라스틱 카드(100)가 뒤틀릴 염려가 있기 때문에 본 발명에서는 이와 같은 문제를 방지하기 위해 뒤틀림 방지층(130)을 구비할 수 있다. 뒤틀림 방지층(130)은 특수 합성 수지로 형성될 수 있다. 일 실시예로서, 에폭시 레진으로 구비된 뒤틀림 방지층(130)은 열에 강하고, 강도가 높으며 어떠한 온도에도 수축이나 팽창이 발생되지 않을 수 있다. 이와 같은 뒤틀림 방지층(130)은 금속 장식(170)과 유기적인 관계로 구비되는 구성으로서, 금속 장식(170)의 성분과 두께에 따라 뒤틀림 방지층(130)의 재질과 두께가 결정될 수 있다. When the metal decoration 170 is inserted into the plastic card 100, there is a fear that the plastic card 100 may be distorted by a different material. In particular, as shown in FIG. 1, when the metal decoration 170 is formed only in a part smaller than the total area of the plastic card 100, the plastic card 100 may be distorted. Therefore, the present invention prevents such a problem. For this purpose, a warp prevention layer 130 may be provided. The anti-torsion layer 130 may be formed of a special synthetic resin. As an embodiment, the anti-warping layer 130 provided with an epoxy resin is resistant to heat, has high strength, and may not cause contraction or expansion at any temperature. The anti-torsion layer 130 is provided in an organic relationship with the metal decoration 170, and the material and thickness of the anti-torsion layer 130 may be determined according to the composition and thickness of the metal decoration 170.
일반적인 카드의 규격 사이즈로서 전체 두께가 0.82㎜ 내외라고 할 때, 금속 장식(170)이 금 99.9%의 중량 3.75g으로 두께가 0.1㎜ ~ 0.55㎜로 형성될 경우, 뒤틀림 방지층(130)은 에폭시 레진으로 0.05㎜ ~ 0.15㎜의 두께로 구비될 수 있다.As a standard size of a general card, when the total thickness is around 0.82 mm, when the metal decoration 170 is formed with a thickness of 0.1 mm to 0.55 mm with a weight of 3.75 g of 99.9% gold, the anti-warping layer 130 is an epoxy resin. It can be provided with a thickness of 0.05mm ~ 0.15mm.
인레이 시트(140)는 무선 주파수(RF) 안테나 코일을 포함하는 시트로서, 인레이 시트(140) 내에 포함된 안테나 코일은 RF 통신(예컨대, NFC) 감도 시험을 통해 최적화된 감도를 나타내도록 코일의 턴(Turn) 수가 결정된다. 안테나 코일은 COB(Chip-On-Board, 101)와 직접 연결되도록 구현될 수 있다.The inlay sheet 140 is a sheet including a radio frequency (RF) antenna coil, and the antenna coil included in the inlay sheet 140 is turned of the coil to show an optimized sensitivity through an RF communication (eg, NFC) sensitivity test. (Turn) number is determined. The antenna coil may be implemented to be directly connected to a Chip-On-Board (COB) 101.
하부 프린트 시트(120) 및 상부 프린트 시트(150)는 카드의 정보를 프린트하여 표시하는 시트로서, 하부 프린트 시트(120)는 뒤틀림 방지층(130)의 하부에, 상부 프린트 시트(150)는 인레이 시트(140) 상부에 형성될 수 있다. The lower print sheet 120 and the upper print sheet 150 are sheets that print and display card information, and the lower print sheet 120 is under the warp prevention layer 130 and the upper print sheet 150 is an inlay sheet. (140) It may be formed on the top.
뒤틀림 방지층(130)의 상면에 안테나 코일이 인쇄된 인레이 시트(140), 인레이 시트(140)의 상면에 인쇄된 상부 프린트 시트(150), 상부 프린트 시트(150)의 상면에 코팅된 중부 코팅층(160), 뒤틀림 방지층(130)의 하면에 인쇄된 하부 프린트 시트(120) 및 하부 프린트 시트(120)의 하면에 코팅된 하부 코팅층(110)을 적층한 적층시트를 라미네이트(Laminate) 공정 처리하여 플라스틱 카드시트를 형성할 수 있다. 다시 설명하면, 상술한 구성요소들(110 내지 160)은 도 1에 도시된 바와 같이 적층된 후, 라미네이트 공정을 통해 하나의 플라스틱 카드 몸체를 형성하도록 가공될 수 있다. 일례로서, 상기 하부 코팅층(110), 중부 코팅층(160) 및 후술하는 상부 코팅층(190)은 투명한 PVC 시트 등으로 형성될 수 있다.The inlay sheet 140 with the antenna coil printed on the upper surface of the anti-torsion layer 130, the upper print sheet 150 printed on the upper surface of the inlay sheet 140, the middle coating layer coated on the upper surface of the upper print sheet 150 ( 160), a laminated sheet obtained by laminating the lower print sheet 120 printed on the lower surface of the anti-warping layer 130 and the lower coating layer 110 coated on the lower surface of the lower print sheet 120 is subjected to a lamination process to process plastic Card sheets can be formed. In other words, the above-described components 110 to 160 may be laminated as shown in FIG. 1 and then processed to form one plastic card body through a lamination process. As an example, the lower coating layer 110, the middle coating layer 160, and the upper coating layer 190 to be described later may be formed of a transparent PVC sheet.
일례로서, 상기 하부 코팅층(110) 및 중부 코팅층(160)의 두께는 0.06㎜일 수 있고, 하부 프린트 시트(120), 상부 프린트 시트(150) 및 상부 코팅층(190)의 두께는 0.1㎜일 수 있으며, 인레이 시트(140)의 두께는 0.15㎜일 수 있다.As an example, the thickness of the lower coating layer 110 and the middle coating layer 160 may be 0.06 mm, and the thickness of the lower print sheet 120, the upper print sheet 150, and the upper coating layer 190 may be 0.1 mm. In addition, the thickness of the inlay sheet 140 may be 0.15 mm.
홈(도 2의 210)은 금속 장식(170)을 삽입하기 위해 형성된 홈으로서, 플라스틱 카드시트 상면의 일부로부터 뒤틀림 방지층(130)의 일부가 노출되도록 형성될 수 있다. 홈(210)의 사이즈는 금속 장식(170)의 면적 및 두께에 따라 결정될 수 있다. 구체적으로, 홈(210)은 중부 코팅층(160), 상부 프린트 시트(150) 및 인레이 시트(140)를 관통하고, 뒤틀림 방지층(130)은 소정 높이를 남겨두고 패인 형태로 형성될 수 있고, 예를 들어 드릴을 이용한 홈파기 작업을 통해 형성될 수 있다. The groove (210 of FIG. 2) is a groove formed to insert the metal decoration 170, and may be formed to expose a part of the anti-torsion layer 130 from a part of the upper surface of the plastic card sheet. The size of the groove 210 may be determined according to the area and thickness of the metal decoration 170. Specifically, the groove 210 penetrates the middle coating layer 160, the upper print sheet 150, and the inlay sheet 140, and the anti-torsion layer 130 may be formed in a recessed form leaving a predetermined height. For example, it can be formed through a grooving operation using a drill.
금속 장식(170)은 홈(210)과 만나는 영역에 접착제(도 2의 230)를 통해 부착될 수 있고, 예를 들어 상기 접착제(230)는 메탈용 에폭시 본드로 구비될 수 있다. 또는, 상기 접착제(230)는 핫멜트(Hot melt) 시트로 구비될 수도 있다. 핫멜트는 가열에 의해 용융되는 것으로, 열가소성 수지와 같은 소재는 가열 용융시킨 후 냉각하면 고화되는 특징이 있어, 이러한 소재를 필름형 핫멜트 접착제로 사용할 수 있다. The metal decoration 170 may be attached to a region where the groove 210 meets the groove 210 through an adhesive (230 in FIG. 2), and for example, the adhesive 230 may be provided as an epoxy bond for metal. Alternatively, the adhesive 230 may be provided as a hot melt sheet. Hot melt is melted by heating, and a material such as a thermoplastic resin has a characteristic that it solidifies when cooled after heating and melting, and such a material can be used as a film-type hot melt adhesive.
UV 경화층(180)은 금속 장식(170)에 형성된 입체무늬에 의한 요철을 메우도록 금속 장식(170)이 삽입된 플라스틱 카드시트 상에 UV(Ultraviolet) 용액을 도포한 후, 그 위에 상부 코팅층(190)을 부착한 후 UV를 조사하여 상기 UV 용액을 경화시킬 수 있다. 이에 따라, 상부 코팅층(190)이 UV 경화층(180) 위에 접착될 수 있고, UV 경화층(180)의 상면이 매끈하고 평탄하게 형성될 수 있다. 일례로서, 금속 장식(170)의 두께는 0.1㎜ ~ 0.55㎜로 형성될 수 있고, 금속 장식(170)의 표면에 형성된 음각(172)의 깊이는 0.001㎜ ~ 0.15㎜로 형성될 수 있으며, UV 경화층(180)의 두께는 0.05㎜ ~ 0.15㎜로 형성될 수 있다. The UV curing layer 180 applies a UV (Ultraviolet) solution on the plastic card sheet into which the metal decoration 170 is inserted to fill the irregularities caused by the three-dimensional pattern formed on the metal decoration 170, and then an upper coating layer ( 190) may be attached and then irradiated with UV to cure the UV solution. Accordingly, the upper coating layer 190 may be adhered to the UV curing layer 180, and the upper surface of the UV curing layer 180 may be formed smoothly and flat. As an example, the thickness of the metal decoration 170 may be formed from 0.1mm to 0.55mm, the depth of the intaglio 172 formed on the surface of the metal decoration 170 may be formed from 0.001mm to 0.15mm, UV The cured layer 180 may have a thickness of 0.05 mm to 0.15 mm.
실시예에 따라, 상기 금속 장식(170)은 UV 용액과의 접착력을 높이기 위하여 표면에 투명 프라이머 등을 코팅할 수 있다.Depending on the embodiment, the metal decoration 170 may be coated with a transparent primer or the like on the surface to increase adhesion to the UV solution.
본 발명의 일 실시예에 따른 금속 장식이 삽입된 플라스틱 카드(100)는 UV 용액을 이용하여 금속 장식(170)을 덮고 순간적으로 건조시키므로 작업성이 향상되고 카드의 플레이트가 수평이 되는 효과가 있고, 골드바와 같은 금속 장식(170)에 새겨진 요철 무늬가 합성수지에 매립되어도 금속 장식(170) 고유의 광택을 효과적으로 표현하여 일반 합성수지카드와 차별화되는 효과가 있다.The plastic card 100 into which the metal decoration is inserted according to an embodiment of the present invention covers the metal decoration 170 by using a UV solution and is instantaneously dried, so that workability is improved and the plate of the card is horizontal. , Even if the uneven pattern engraved on the metal decoration 170, such as a gold bar, is embedded in the synthetic resin, it effectively expresses the unique glossiness of the metal decoration 170 to differentiate it from the general synthetic resin card.
이하에서는, 도 2 및 도 4를 참조하여, 본 발명의 일 실시예에 의한 플라스틱 카드에 금속 장식을 삽입하는 방법에 대해 설명하도록 한다.Hereinafter, a method of inserting a metal decoration into a plastic card according to an embodiment of the present invention will be described with reference to FIGS. 2 and 4.
도 2는 본 발명의 일 실시예에 따른 금속 장식이 삽입된 플라스틱 카드의 제조방법을 설명하기 위한 단면도이고, 도 4는 본 발명의 일 실시예에 따른 금속 장식이 삽입된 플라스틱 카드의 제조방법을 설명하기 위한 순서도이다. 2 is a cross-sectional view for explaining a method of manufacturing a plastic card with a metal decoration inserted according to an embodiment of the present invention, and FIG. 4 is a method of manufacturing a plastic card with a metal decoration inserted according to an embodiment of the present invention. This is a flow chart for explanation.
도 2의 (a)를 참조하면 먼저, 뒤틀림 방지층을 포함하는 플라스틱 카드시트(110 내지 160)를 준비할 수 있다(도 4의 S410). 플라스틱 카드시트는 뒤틀림 방지층(130)의 상면에 안테나 코일이 인쇄된 인레이 시트(140), 인레이 시트(140)의 상면에 인쇄된 상부 프린트 시트(150), 상부 프린트 시트(150)의 상면에 코팅된 중부 코팅층(160), 뒤틀림 방지층(130)의 하면에 인쇄된 하부 프린트 시트(120) 및 하부 프린트 시트(120)의 하면에 코팅된 하부 코팅층(110)을 적층한 적층시트를 열과 압력에 의한 라미네이트(Laminate) 공정 처리하여 하나의 플라스틱 카드 몸체로 형성될 수 있다.Referring to FIG. 2A, first, plastic card sheets 110 to 160 including a warp prevention layer may be prepared (S410 in FIG. 4 ). The plastic card sheet is coated on the upper surface of the inlay sheet 140 with the antenna coil printed on the upper surface of the warp prevention layer 130, the upper print sheet 150 printed on the upper surface of the inlay sheet 140, and the upper print sheet 150 A laminated sheet in which the lower print sheet 120 printed on the lower surface of the middle coating layer 160, the anti-torsion layer 130, and the lower coating layer 110 coated on the lower surface of the lower print sheet 120 are laminated by heat and pressure. It can be formed into a single plastic card body by performing a laminate process.
다음으로, 도 2의 (b)에 도시된 바와 같이, 금속 장식(170)을 삽입하기 위해 형성된 홈으로서, 플라스틱 카드시트 상면의 일부로부터 뒤틀림 방지층(130)의 일부가 노출되도록 홈(210)이 형성될 수 있다(도 4의 S420). 구체적으로, 홈(210)은 중부 코팅층(160), 상부 프린트 시트(150) 및 인레이 시트(140)를 관통하고, 뒤틀림 방지층(130)은 소정 높이를 남겨두고 패인 형태로 형성될 수 있다. 도 2의 (b)에 도시된 바와 같이, 뒤틀림 방지층(130)의 두께(D1)보다 뒤틀림 방지층(130)에 형성된 홈(210)의 깊이(D2)가 작을 수 있다. 예를 들어 상기 홈(210)은 드릴을 이용한 홈파기 작업을 통해 형성될 수 있으며, 홈(210) 형성 작업에 사용되는 공법은 다양하게 변경될 수 있다. Next, as shown in (b) of Figure 2, as a groove formed to insert the metal decoration 170, the groove 210 so that a part of the warp prevention layer 130 is exposed from a part of the upper surface of the plastic card sheet It can be formed (S420 of FIG. 4). Specifically, the groove 210 may penetrate the middle coating layer 160, the upper print sheet 150, and the inlay sheet 140, and the anti-torsion layer 130 may be formed in a recessed shape leaving a predetermined height. As shown in (b) of FIG. 2, the depth D2 of the groove 210 formed in the warp prevention layer 130 may be smaller than the thickness D1 of the warp prevention layer 130. For example, the groove 210 may be formed through a grooving operation using a drill, and a construction method used for forming the groove 210 may be variously changed.
다음으로, 도 2의 (c)에 도시된 바와 같이, 금속 장식(170)이 홈(210)과 만나는 영역의 적어도 일부에 접착제(230)를 도포할 수 있다. 예를 들어 상기 접착제(230)는 메탈용 에폭시 본드일 수 있으며, 핫멜트(Hot melt) 시트일 수도 있다.Next, as shown in (c) of FIG. 2, the adhesive 230 may be applied to at least a portion of the area where the metal decoration 170 meets the groove 210. For example, the adhesive 230 may be an epoxy bond for metal or a hot melt sheet.
다음으로, 도 2의 (d)에 도시된 바와 같이, 금속 장식(170)을 홈(210)에 삽입할 수 있다(도 4의 S430). 금속 장식(170)의 하부는 접착제(230)에 의해 접착될 수 있다. 금속 장식(170)은 특정 도안 형태로 절단된 금속박막일 수 있고, 금속 장식(170)의 면적은 플라스틱 카드시트의 면적보다 작을 수 있다. 금속 장식(170)을 플라스틱 카드시트의 일부에 형성된 홈(210)에 삽입하기 때문에 금속 장식(170)을 홈(210)에 삽입하더라도 카드 전체의 두께가 증가되지는 않는다. Next, as shown in (d) of Figure 2, it is possible to insert the metal decoration 170 into the groove 210 (S430 of Figure 4). The lower part of the metal decoration 170 may be adhered by an adhesive 230. The metal decoration 170 may be a metal thin film cut into a specific pattern, and the area of the metal decoration 170 may be smaller than the area of the plastic card sheet. Since the metal decoration 170 is inserted into the groove 210 formed in a part of the plastic card sheet, even if the metal decoration 170 is inserted into the groove 210, the thickness of the entire card is not increased.
일 실시예로, 금속 장식(170)은 원형이나 다각형 등의 형태로 구비될 수 있고, 일 예로 도 5에 도시된 바와 같이 사각형으로 절단된 형태로서, 표면에 음각 또는 양각에 의한 입체무늬를 포함할 수 있다. 도 2의 (d)는 금속 장식(170)의 표면에 새겨진 음각의 단면(172)을 도시한다.In one embodiment, the metal decoration 170 may be provided in a shape such as a circle or a polygon, for example, as shown in FIG. 5 as a shape cut into a square, including a three-dimensional pattern by intaglio or embossing on the surface. can do. 2D shows a cross section 172 of an intaglio engraved on the surface of the metal decoration 170.
다음으로, 도 2의 (e)에 도시된 바와 같이, 금속 장식(170)의 표면에 형성된 입체무늬에 의한 요철(172)을 메우도록 금속 장식(170)이 삽입된 플라스틱 카드시트 상에 UV 용액을 도포한 후, 도 2의 (f)에 도시된 바와 같이, 그 위에 상부 코팅층(190)을 부착하고 UV를 조사하여 상기 UV 용액을 경화시킬 수 있다(도 4의 S440).Next, as shown in (e) of Figure 2, the UV solution on the plastic card sheet into which the metal decoration 170 is inserted to fill the irregularities 172 due to the three-dimensional pattern formed on the surface of the metal decoration 170 After applying, as shown in (f) of FIG. 2, the upper coating layer 190 is attached thereon and irradiated with UV to cure the UV solution (S440 of FIG. 4).
일 실시예로서, 카드 전체 두께의 규격 사이즈가 0.82㎜ 내외라고 할 때, 금속 장식(170)이 금 99.9%의 중량 3.75g으로 두께가 0.1㎜ ~ 0.55㎜로 형성된 경우, 뒤틀림 방지층(130)은 에폭시 레진으로 0.05㎜ ~ 0.15㎜의 두께로 구비될 수 있고, 금속 장식(170)의 표면에 형성된 음각(172)의 깊이가 0.001㎜ ~ 0.15㎜로 형성된 경우, UV 경화층(180)의 두께는 0.05㎜ ~ 0.15㎜로 형성될 수 있다. As an embodiment, when the standard size of the total thickness of the card is 0.82 mm or less, when the metal decoration 170 is formed with a thickness of 0.1 mm to 0.55 mm with a weight of 3.75 g of 99.9% gold, the anti-warping layer 130 is The epoxy resin may be provided with a thickness of 0.05 mm to 0.15 mm, and when the depth of the intaglio 172 formed on the surface of the metal decoration 170 is 0.001 mm to 0.15 mm, the thickness of the UV cured layer 180 It can be formed from 0.05mm to 0.15mm.
여기서, UV 경화층(180)을 형성하기 위해 도포하는 UV 용액의 양은 금속 장식(170)의 표면에 형성된 음각(172)의 부피 또는 음각(172)에 의해 줄어든 금속 장식(170)의 중량 변화에 기초하여 결정될 수 있다. Here, the amount of the UV solution applied to form the UV cured layer 180 depends on the volume of the intaglio 172 formed on the surface of the metal decoration 170 or the weight change of the metal decoration 170 reduced by the intaglio 172 It can be determined on the basis of.
일 실시예로, 음각(172)의 부피 또는 음각(172)에 의해 줄어든 금속 장식(170)의 중량 변화량에 비례하도록 UV 용액의 양을 결정하여 도포함으로써, UV 용액이 음각(172)을 메우고도 UV 경화층(180)이 너무 두껍거나 얇지 않으면서 표면이 평탄하도록 할 수 있다.In one embodiment, by determining and applying the amount of the UV solution in proportion to the volume of the intaglio 172 or the weight change amount of the metal decoration 170 reduced by the intaglio 172, the UV solution fills the intaglio 172 The surface of the UV curing layer 180 may be flat without being too thick or thin.
이와 같이 본 발명의 일 실시예에 따른 금속 장식이 삽입된 플라스틱 카드(100)는 특정 도안으로 절단되고 표면에 입체무늬를 포함하는 금속 장식(170)을 배치하되, UV 경화층(180) 및 상부 코팅층(190)을 통해 금속 장식(170)을 보호함과 동시에 카드 표면을 매끈하게 함으로써, 카드를 장기간 사용하더라도 금속 장식(170)이 외부 접촉에 의해 마모되거나 공기 중의 산화 등에 의해 변질 또는 변색되는 것을 방지할 수 있다. 아울러, 평평한 플라스틱 카드의 내부에 삽입된 금속 장식(170)의 입체무늬와 광택이 UV 경화층(180) 및 상부 코팅층(190)을 투과하면서 금속 장식(170)의 입체감이 표현될 수 있고, 이에 외부에 비춰지는 모습이 보다 미려하여 카드의 품위를 향상시킬 수 있다. 본 발명의 일 실시예에 따른 금속 장식이 삽입된 플라스틱 카드(100)는 금속 장식(170)이 UV 경화층(180) 및 상부 코팅층(190) 안에 매립되므로 쉽게 빠지거나 파손되지 않는 장점이 있다. 본 발명의 일 실시예에 따른 금속 장식이 삽입된 플라스틱 카드(100)는, 뒤틀림 방지층(130)의 일부까지 홈(210)이 형성되어 금속 장식(170)이 뒤틀림 방지층(130)과 결합되므로, 이종재질인 금속 장식(170)에 의해 플라스틱 카드(100)가 뒤틀리는 현상을 방지할 수 있다.In this way, the plastic card 100 into which the metal decoration is inserted according to an embodiment of the present invention is cut into a specific pattern and a metal decoration 170 including a three-dimensional pattern is disposed on the surface, but the UV curing layer 180 and the upper By protecting the metal decoration 170 through the coating layer 190 and smoothing the card surface at the same time, even if the card is used for a long time, the metal decoration 170 is prevented from being worn by external contact or deteriorated or discolored due to oxidation in the air. Can be prevented. In addition, while the three-dimensional pattern and gloss of the metal decoration 170 inserted into the flat plastic card pass through the UV curing layer 180 and the upper coating layer 190, the three-dimensional effect of the metal decoration 170 may be expressed. The appearance reflected from the outside is more beautiful and the dignity of the card can be improved. The plastic card 100 into which the metal decoration is inserted according to an embodiment of the present invention has the advantage that the metal decoration 170 is embedded in the UV cured layer 180 and the upper coating layer 190 so that it is not easily removed or damaged. In the plastic card 100 into which a metal decoration is inserted according to an embodiment of the present invention, a groove 210 is formed up to a part of the warp prevention layer 130 so that the metal decoration 170 is combined with the warp prevention layer 130, The plastic card 100 may be prevented from being distorted by the metal decoration 170 of a different material.
이하에서는, 도 3을 참조하여, 본 발명의 일 실시예에 의한 COB(101)를 구비하는 방법에 대해 설명하도록 한다.Hereinafter, with reference to FIG. 3, a method of providing the COB 101 according to an embodiment of the present invention will be described.
도 3은 본 발명의 일 실시예에 따른 금속 장식이 삽입된 플라스틱 카드에 COB를 구비하는 제조방법을 설명하기 위한 단면도이다. 도 3에 도시된 단면은 COB(101)가 형성되는 부분의 단면으로서 도 2에 도시된 단면과 다른 위치일 수 있다.3 is a cross-sectional view for explaining a method of manufacturing a COB in a plastic card into which a metal decoration is inserted according to an embodiment of the present invention. The cross-section shown in FIG. 3 is a cross-section of a portion in which the COB 101 is formed, and may be a different position from the cross-section shown in FIG. 2.
먼저, 앞서 도 2를 참조하여 전술한 바와 같이 상부 코팅층(190)까지 형성한 이후, 도 3의 (a)에 도시된 바와 같이 플라스틱 카드시트를 복수 개의 개별카드 외곽선을 따라 절삭하여, 뒤틀림 방지층(130), 인레이 시트(140), 프린트 시트들(120, 150), UV 경화층(180) 및 상부 코팅층(190)을 포함하는 개별 카드를 생성할 수 있다.First, after forming the upper coating layer 190 as described above with reference to FIG. 2, the plastic card sheet is cut along the outlines of a plurality of individual cards as shown in (a) of FIG. 3, and the anti-warping layer ( 130), an inlay sheet 140, print sheets 120 and 150, a UV curing layer 180, and an upper coating layer 190 may be formed.
다음으로, 도 3의 (b)에 도시된 바와 같이, 개별 카드 중에서 금속 장식(170)과 마주하는 부분을 제외한 나머지 영역의 일부를 밀링(milling)하여 COB 삽입 영역을 형성하고, COB 삽입 영역을 통해 안테나 코일(240)을 상 방향으로 뽑아 올릴 수 있다. Next, as shown in (b) of FIG. 3, a portion of the remaining area of the individual card except for the portion facing the metal decoration 170 is milled to form a COB insertion area, and the COB insertion area is Through it, the antenna coil 240 can be pulled upward.
다음으로, 도 3의 (c)에 도시된 바와 같이, COB 삽입 영역을 통해 뽑아 올려진 상기 안테나 코일(240)과 COB(101)를 접촉시키면서 상기 COB 삽입 영역에 COB(101)를 삽입할 수 있다.Next, as shown in (c) of FIG. 3, the COB 101 can be inserted into the COB insertion region while contacting the antenna coil 240 and the COB 101 pulled up through the COB insertion region. have.
일 실시예로, 상 방향으로 뽑아올린 안테나 코일(240)과 COB(101)의 접점을 Spot Welding 방식으로 접촉할 수 있다. 이때, COB(101)의 후면과 COB 삽입영역이 만나는 영역에 접착제를 발라 COB(101)가 고정되도록 할 수 있다.In one embodiment, the contact point between the antenna coil 240 and the COB 101 pulled upward may be contacted by a spot welding method. At this time, the COB 101 may be fixed by applying an adhesive to the area where the rear surface of the COB 101 and the COB insertion area meet.
일 실시예로서, COB(101) 후면에 연결된 안테나 코일(240)은 적층된 플라스틱 카드시트와 직접 접촉되지 않도록 소정의 거리를 두고 이격된 상태로 배치되거나, 플라스틱 카드시트와 COB(101) 사이에 절연막이 형성되도록 추가 공정을 실시할 수 있다.As an embodiment, the antenna coil 240 connected to the back of the COB 101 is disposed at a predetermined distance so as not to directly contact the laminated plastic card sheet, or between the plastic card sheet and the COB 101 An additional process may be performed to form an insulating film.
실시예에 따라, 상기 COB(101)는 플라스틱 카드(100)의 전면 또는 후면에 선택적으로 형성될 수 있다.Depending on the embodiment, the COB 101 may be selectively formed on the front or rear surface of the plastic card 100.
도 6은 본 발명의 일 실시예에 따른 금속 장식이 삽입된 플라스틱 카드의 제조 방법을 설명하기 위한 순서도이다. 본 도면을 참조하여 설명하는 실시예는, 플라스틱 카드의 제조 방법 중, 금속 장식(170)을 삽입하고, 이에 관련된 공정을 위주로 설명한다. 6 is a flowchart illustrating a method of manufacturing a plastic card into which a metal decoration is inserted according to an embodiment of the present invention. In the embodiment described with reference to the drawings, in a method of manufacturing a plastic card, a metal decoration 170 is inserted, and a process related thereto is mainly described.
뒤틀림 방지층(130)의 상면으로 안테나 코일이 인쇄된 인레이 시트(140), 상부 프린트 시트(150) 및 중부 코팅층(160)을 차례로 적층하고, 뒤틀림 방지층(130)의 하면으로 하부 프린트 시트(120) 및 하부 코팅층(110)을 차례로 적층하여, 적층시트를 형성할 수 있다(S610).The inlay sheet 140 on which the antenna coil is printed on the upper surface of the anti-torsion layer 130, the upper print sheet 150, and the middle coating layer 160 are sequentially stacked, and the lower print sheet 120 is formed as the lower surface of the anti-torsion layer 130. And the lower coating layer 110 may be sequentially stacked to form a laminated sheet (S610).
다음으로, 적층시트를 열과 압력에 의한 라미네이트(Laminate) 공정 처리하여 하나의 플라스틱 카드시트를 형성할 수 있다(S620).Next, a single plastic card sheet may be formed by performing a lamination process by heat and pressure (S620).
다음으로, 플라스틱 카드시트 상면의 일부로부터 뒤틀림 방지층(130)의 일부가 노출되도록 홈(210)을 형성할 수 있다(S630). 구체적으로, 홈(210)은 중부 코팅층(160), 상부 프린트 시트(150) 및 인레이 시트(140)를 관통하고, 뒤틀림 방지층(130)은 소정 높이를 남겨두고 패인 형태로 형성될 수 있고, 예를 들어 드릴을 이용한 홈파기 작업을 통해 형성될 수 있다. Next, a groove 210 may be formed so that a part of the anti-torsion layer 130 is exposed from a part of the upper surface of the plastic card sheet (S630). Specifically, the groove 210 penetrates the middle coating layer 160, the upper print sheet 150, and the inlay sheet 140, and the anti-torsion layer 130 may be formed in a recessed form leaving a predetermined height. For example, it can be formed through a grooving operation using a drill.
다음으로, 금속 장식(170)을 홈(210)에 삽입할 수 있다(S640). 이를 위해, 홈(210)에 금속 장식(170)을 삽입하는 때에 금속 장식(170)이 홈(210)과 만나는 영역의 적어도 일부에 접착제(230)를 도포할 수 있다. 예를 들어 상기 접착제(230)는 메탈용 에폭시 본드로 구비일 수 있으며, 핫멜트(Hot melt) 시트일 수도 있다. Next, the metal decoration 170 may be inserted into the groove 210 (S640). To this end, when inserting the metal decoration 170 into the groove 210, the adhesive 230 may be applied to at least a portion of the area where the metal decoration 170 meets the groove 210. For example, the adhesive 230 may be provided as an epoxy bond for metal, or may be a hot melt sheet.
금속 장식(170)은 특정 도안 형태로 절단된 금속박막일 수 있고, 금속 장식(170)의 면적은 플라스틱 카드시트보다 작을 수 있다. 금속 장식(170)을 플라스틱 카드시트의 일부에 형성된 홈에 삽입하기 때문에 금속 장식(170)에 의해 두께 증가에 의한 카드 전체의 두께에 대한 한계는 고려할 필요가 없다. 일 실시예로, 금속 장식(170)은 원형이나 다각형 등의 형태로 구비될 수 있고 도 5는 금속 장식(170)을 사각형으로 절단한 일 예로서, 금속 장식(170)의 표면은 양각 또는 음각에 의한 입체무늬를 포함할 수 있다. The metal decoration 170 may be a metal thin film cut into a specific pattern, and the area of the metal decoration 170 may be smaller than that of a plastic card sheet. Since the metal decoration 170 is inserted into the groove formed in a part of the plastic card sheet, it is not necessary to consider the limit on the thickness of the entire card due to the increase in thickness by the metal decoration 170. In one embodiment, the metal decoration 170 may be provided in a shape such as a circle or a polygon, and FIG. 5 is an example in which the metal decoration 170 is cut into a square, and the surface of the metal decoration 170 is embossed or engraved It may include a three-dimensional pattern by.
다음으로, 금속 장식(170)의 표면에 형성된 입체무늬에 의한 요철을 메우도록 금속 장식(170)이 삽입된 플라스틱 카드시트 상에 UV 용액을 도포한 후, UV를 조사하여 상기 UV 용액을 경화시킬 수 있다(S650). Next, after applying the UV solution on the plastic card sheet into which the metal decoration 170 is inserted to fill the irregularities caused by the three-dimensional pattern formed on the surface of the metal decoration 170, UV irradiation to cure the UV solution. Can be (S650).
일 실시예로, 카드 전체 두께의 규격 사이즈가 0.82㎜ 내외라고 할 때, 금속 장식(170)이 금 99.9%의 중량 3.75g으로 두께가 0.1㎜ ~ 0.55㎜로 형성된 경우, 뒤틀림 방지층(130)은 에폭시 레진으로 0.05㎜ ~ 0.15㎜의 두께로 구비될 수 있고, 금속 장식(170)의 표면에 형성된 음각(172)의 깊이가 0.001㎜ ~ 0.15㎜로 형성된 경우, UV 경화층(180)의 두께는 0.05㎜ ~ 0.15㎜로 형성될 수 있다. In one embodiment, when the standard size of the total thickness of the card is around 0.82 mm, when the metal decoration 170 is formed with a thickness of 0.1 mm to 0.55 mm with a weight of 3.75 g of 99.9% gold, the anti-warping layer 130 is The epoxy resin may be provided with a thickness of 0.05 mm to 0.15 mm, and when the depth of the intaglio 172 formed on the surface of the metal decoration 170 is 0.001 mm to 0.15 mm, the thickness of the UV cured layer 180 It can be formed from 0.05mm to 0.15mm.
여기서, UV 경화층(180)을 형성하기 위해 도포하는 UV 용액의 양은 금속 장식(170)의 표면에 형성된 음각(172)의 부피 또는 음각(172)에 의해 줄어든 금속 장식(170)의 중량 변화에 기초하여 결정될 수 있다. Here, the amount of the UV solution applied to form the UV cured layer 180 depends on the volume of the intaglio 172 formed on the surface of the metal decoration 170 or the weight change of the metal decoration 170 reduced by the intaglio 172 It can be determined on the basis of.
일 실시예로, 음각(172)의 부피 또는 음각(172)에 의해 줄어든 금속 장식(170)의 중량 변화량에 비례하도록 UV 용액의 양을 결정하여 도포함으로써, UV 용액이 음각(172)을 메우고도 UV 경화층(180)이 너무 두껍거나 얇지 않으면서 표면이 평탄하도록 할 수 있다.In one embodiment, by determining and applying the amount of the UV solution in proportion to the volume of the intaglio 172 or the weight change amount of the metal decoration 170 reduced by the intaglio 172, the UV solution fills the intaglio 172 The surface of the UV curing layer 180 may be flat without being too thick or thin.
그리고, UV 경화층(180)의 상면을 코팅하여 상부 코팅층(190)을 형성할 수 있다.In addition, the upper coating layer 190 may be formed by coating the upper surface of the UV curing layer 180.
다음으로, 플라스틱 카드시트를 복수 개의 개별카드 외곽선을 따라 절삭하여, 뒤틀림 방지층(130), 인레이 시트(140), 프린트 시트들(120, 150), UV 경화층(180) 및 상부 코팅층(190)을 포함하는 개별 카드를 생성할 수 있다(S660).Next, the plastic card sheet is cut along the outline of a plurality of individual cards, and the anti-warping layer 130, the inlay sheet 140, the print sheets 120 and 150, the UV curing layer 180, and the upper coating layer 190 It is possible to create an individual card including a (S660).
다음으로, 개별 카드 중에서 상기 금속 장식(170)과 마주하는 부분을 제외한 나머지 영역의 일부를 밀링(milling)하여 COB 삽입 영역을 형성하고, COB 삽입 영역을 통해 안테나 코일을 상 방향으로 뽑아 올려, 상기 안테나 코일과 COB(101)를 접촉시키면서 상기 COB 삽입 영역에 COB(101)를 삽입할 수 있다(S670).Next, a part of the remaining area of the individual card except the part facing the metal decoration 170 is milled to form a COB insertion area, and the antenna coil is pulled upward through the COB insertion area, and the The COB 101 may be inserted into the COB insertion region while the antenna coil and the COB 101 are in contact (S670).
도 7은 본 발명의 다른 실시예에 따른 인레이 시트를 나타내는 도면이다.7 is a view showing an inlay sheet according to another embodiment of the present invention.
도 7에 도시된 바와 같이, 안테나 코일(240)은 인레이 시트(140)의 테두리 영역을 따라 복수 회 감길 수 있고, COB(101)와의 연결을 위해 인레이 시트(140)의 짧은 변 양측에서 중앙 부위로 연장되어 배치될 수 있다. 안테나 코일(240)이 도 5에 도시된 바와 같은 금속 장식(170)과 접촉되는 것을 방지하기 위하여, 안테나 코일(240)은 인레이 시트(140)의 장축 방향으로 중앙 부위에 연장 형성되어 금속 장식(170)이 형성되는 부분에는 안테나 코일(240)이 배치되지 않을 수 있다.As shown in FIG. 7, the antenna coil 240 may be wound multiple times along the edge area of the inlay sheet 140, and the central portion on both sides of the short side of the inlay sheet 140 for connection with the COB 101 It can be extended and arranged. In order to prevent the antenna coil 240 from contacting the metal decoration 170 as shown in FIG. 5, the antenna coil 240 extends in the center of the inlay sheet 140 in the long axis direction to form a metal decoration ( The antenna coil 240 may not be disposed in the portion where 170 is formed.
본 도면에서는, 상술한 구성요소들만을 기재하였으나, 이에 한정되는 것은 아니며, 금속 장식이 삽입된 플라스틱 카드의 구현을 위한 생체 센서, 디스플레이부 등의 다른 구성요소들이 더 추가될 수 있다. 또한 본 발명의 일 실시예에 따른 금속 장식이 삽입된 플라스틱 카드(100)는 미리 정의된 기준에 따른 규격 사이즈와 두께에 맞게 제조될 수 있고, 각 시트의 사이즈와 두께는 메탈 카드의 동작과 무선 통신 감도 등에 맞는 최적의 두께로 결정되어 결합되도록 구현될 수 있다. In this drawing, only the above-described elements are described, but the present invention is not limited thereto, and other elements such as a biometric sensor and a display unit for implementing a plastic card with a metal decoration inserted therein may be further added. In addition, the plastic card 100 into which the metal decoration is inserted according to an embodiment of the present invention may be manufactured to fit a standard size and thickness according to a predefined standard, and the size and thickness of each sheet are determined by the operation of the metal card and It can be implemented to be combined by determining the optimum thickness suitable for communication sensitivity.
나아가, 본 발명의 일 실시예에 따른 금속 장식이 삽입된 플라스틱 카드(100)를 구성하는 시트들은 하나의 카드를 만들기 위한 시트가 아니라, 대량생산이 가능하도록 복수 개의 카드를 포함하는 크기의 대형 시트로 구성될 수 있고, 절삭 가공을 통해 여러 장의 카드로 생산해낼 수 있다. Furthermore, the sheets constituting the plastic card 100 into which the metal decoration is inserted according to an embodiment of the present invention is not a sheet for making one card, but a large sheet having a size including a plurality of cards to enable mass production. It can be composed of, and can be produced into multiple cards through cutting processing.
전술한 본 발명의 설명은 예시를 위한 것이며, 본 발명이 속하는 기술분야의 통상의 지식을 가진 자는 본 발명의 기술적 사상이나 필수적인 특징을 변경하지 않고서 다른 구체적인 형태로 쉽게 변형이 가능하다는 것을 이해할 수 있을 것이다. 그러므로 이상에서 기술한 실시예들은 모든 면에서 예시적인 것이며 한정적이 아닌 것으로 이해해야만 한다. 예를 들어, 단일형으로 설명되어 있는 각 구성 요소는 분산되어 실시될 수도 있으며, 마찬가지로 분산된 것으로 설명되어 있는 구성 요소들도 결합된 형태로 실시될 수 있다.The above description of the present invention is for illustrative purposes only, and those of ordinary skill in the art to which the present invention pertains will be able to understand that it can be easily modified into other specific forms without changing the technical spirit or essential features of the present invention. will be. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not limiting. For example, each component described as a single type may be implemented in a distributed manner, and similarly, components described as being distributed may also be implemented in a combined form.
본 발명의 범위는 후술하는 특허청구범위에 의하여 나타내어지며, 특허청구범위의 의미 및 범위 그리고 그 균등 개념으로부터 도출되는 모든 변경 또는 변형된 형태가 본 발명의 범위에 포함되는 것으로 해석되어야 한다.The scope of the present invention is indicated by the claims to be described later, and all changes or modified forms derived from the meaning and scope of the claims and their equivalent concepts should be interpreted as being included in the scope of the present invention.

Claims (11)

  1. 금속 장식이 삽입된 플라스틱 카드 제조 방법으로서,As a method of manufacturing a plastic card with a metal decoration inserted,
    뒤틀림 방지층을 준비하는 단계;Preparing an anti-torsion layer;
    상기 뒤틀림 방지층의 상면에 안테나 코일이 인쇄된 인레이 시트를 포함하여 복수의 시트를 적층한 적층시트를 라미네이팅하여 플라스틱 카드시트를 형성하는 단계; Forming a plastic card sheet by laminating a laminated sheet in which a plurality of sheets are stacked including an inlay sheet on which an antenna coil is printed on the upper surface of the warp prevention layer;
    상기 플라스틱 카드시트의 상면으로부터 상기 뒤틀림 방지층의 일부가 노출되도록 홈을 형성하는 단계;Forming a groove such that a portion of the warp prevention layer is exposed from an upper surface of the plastic card sheet;
    상기 홈에 금속 장식을 삽입하는 단계; 및Inserting a metal ornament into the groove; And
    상기 금속 장식 상위에 UV 용액을 도포한 후, UV를 조사시켜 UV 경화층을 형성하는 단계;를 포함하는, 금속 장식이 삽입된 플라스틱 카드 제조 방법.After applying a UV solution on the top of the metal decoration, the step of forming a UV cured layer by irradiation with UV; containing, a method for manufacturing a plastic card with a metal decoration inserted.
  2. 제 1 항에 있어서,The method of claim 1,
    상기 UV 경화층을 형성하는 단계는,Forming the UV cured layer,
    상기 UV 용액이 상기 금속 장식에 형성된 음양각에 의한 요철을 메우도록 상기 UV 용액을 도포하여 상기 UV 경화층의 상면을 평탄하게 형성하고,Applying the UV solution so that the UV solution fills the irregularities caused by the negative and positive angles formed on the metal decoration to form a flat upper surface of the UV cured layer,
    상기 UV 용액을 도포하는 양은 상기 금속 장식의 표면에 형성된 음각의 부피 또는 음각에 의해 변화된 상기 금속 장식의 중량 변화량에 기초하여 결정되는, 금속 장식이 삽입된 플라스틱 카드 제조 방법.The amount of applying the UV solution is determined based on the volume of the intaglio formed on the surface of the metal decoration or the weight change amount of the metal decoration changed by the intaglio.
  3. 제 1 항에 있어서,The method of claim 1,
    상기 뒤틀림 방지층을 준비하는 단계는,Preparing the warp prevention layer,
    상기 금속 장식의 성분과 두께에 따라 상기 뒤틀림 방지층의 재질과 두께를 결정하는, 금속 장식이 삽입된 플라스틱 카드 제조 방법.A method of manufacturing a plastic card with a metal decoration inserted to determine the material and thickness of the warp prevention layer according to the composition and thickness of the metal decoration.
  4. 제 1 항에 있어서,The method of claim 1,
    상기 홈에 금속 장식을 삽입하는 단계는,Inserting the metal decoration into the groove,
    상기 금속 장식이 상기 홈과 만나는 영역에 접착제를 이용하여 상기 금속 장식을 상기 홈에 부착시키고,Attaching the metal decoration to the groove by using an adhesive in a region where the metal decoration meets the groove,
    상기 접착제는 메탈용 에폭시 본드로 구비되는, 금속 장식이 삽입된 플라스틱 카드 제조 방법.The adhesive is provided with an epoxy bond for metal, a method of manufacturing a plastic card in which a metal decoration is inserted.
  5. 제 1 항에 있어서,The method of claim 1,
    상기 플라스틱 카드시트를 형성하는 단계는,The step of forming the plastic card sheet,
    상기 뒤틀림 방지층의 상면에 상기 인레이 시트를 형성하고, 상기 인레이 시트의 상면에 상부 프린트 시트를 형성하며, 상기 상부 프린트 시트의 상면에 코팅된 중부 코팅층을 형성하고, 상기 뒤틀림 방지층의 하면에 인쇄된 하부 프린트 시트를 형성하며, 상기 하부 프린트 시트의 하면에 코팅된 하부 코팅층을 형성하는, 금속 장식이 삽입된 플라스틱 카드 제조 방법.The inlay sheet is formed on the upper surface of the warp prevention layer, the upper print sheet is formed on the upper surface of the inlay sheet, the middle coating layer coated on the upper surface of the upper print sheet is formed, and the lower printed on the lower surface of the warp prevention layer Forming a print sheet, forming a lower coating layer coated on a lower surface of the lower print sheet, a method of manufacturing a plastic card with a metal decoration inserted.
  6. 제 1 항에 있어서,The method of claim 1,
    상기 UV 경화층을 형성하는 단계 이후,After the step of forming the UV cured layer,
    상기 플라스틱 카드시트를 복수 개의 개별카드 외곽선을 따라 절삭하여, 상기 적층시트, UV 경화층 및 상부 코팅층을 포함하는 개별 카드를 생성하는 단계;Cutting the plastic card sheet along an outline of a plurality of individual cards to generate individual cards including the laminated sheet, a UV cured layer, and an upper coating layer;
    상기 개별 카드 중에서 상기 금속 장식과 마주하는 부분을 제외한 나머지 영역의 일부를 밀링하여 COB 삽입 영역을 형성하는 단계;Forming a COB insertion region by milling a portion of the remaining regions of the individual cards except for the portion facing the metal decoration;
    상기 COB 삽입 영역을 통해 상 방향으로 뽑아 올린 상기 안테나 코일과 COB를 접촉시키는 단계; 및Contacting the COB with the antenna coil pulled up through the COB insertion region; And
    상기 COB 삽입 영역에 COB를 삽입하는 단계;를 포함하는, 금속 장식이 삽입된 플라스틱 카드 제조 방법.Inserting a COB into the COB insertion region; Containing, a method of manufacturing a plastic card with a metal decoration inserted.
  7. 뒤틀림 방지층의 상면에 안테나 코일이 인쇄된 인레이 시트를 포함한 복수의 시트를 적층한 적층시트를 라미네이팅하여 형성된 플라스틱 카드시트;A plastic card sheet formed by laminating a laminated sheet obtained by laminating a plurality of sheets including an inlay sheet on which an antenna coil is printed on an upper surface of the warp prevention layer;
    상기 플라스틱 카드시트의 상면으로부터 상기 뒤틀림 방지층의 일부까지 형성된 홈에 삽입된 금속 장식; 및A metal decoration inserted into the groove formed from the upper surface of the plastic card sheet to a part of the warp prevention layer; And
    상기 금속 장식 상위에 형성된 UV 경화층;을 포함하는, 금속 장식이 삽입된 플라스틱 카드.Including, a plastic card with a metal decoration inserted; UV cured layer formed on the top of the metal decoration.
  8. 제 7 항에 있어서,The method of claim 7,
    상기 UV 경화층은, The UV cured layer,
    상기 금속 장식에 형성된 음양각에 의한 요철을 메우도록 UV 용액을 도포한 후, UV를 조사하여 상기 UV 경화층의 상면이 평탄하게 형성되며, 상기 UV 용액을 도포하는 양은 상기 금속 장식의 표면에 형성된 음각의 부피 또는 음각에 의해 변화된 상기 금속 장식의 중량 변화량에 기초하여 결정되는, 금속 장식이 삽입된 플라스틱 카드.After applying a UV solution to fill the irregularities caused by the intaglio formed on the metal decoration, the upper surface of the UV-cured layer is formed flat by irradiating with UV, and the amount of applying the UV solution is an intaglio formed on the surface of the metal decoration The plastic card in which the metal decoration is inserted, which is determined based on the amount of change in the weight of the metal decoration changed by the volume or intaglio.
  9. 제 7 항에 있어서,The method of claim 7,
    상기 뒤틀림 방지층은,The anti-torsion layer,
    상기 금속 장식의 성분과 두께에 따라 상기 뒤틀림 방지층의 재질과 두께가 결정되는, 금속 장식이 삽입된 플라스틱 카드.The material and thickness of the anti-warping layer are determined according to the composition and thickness of the metal decoration, and the plastic card in which the metal decoration is inserted.
  10. 제 9 항에 있어서,The method of claim 9,
    상기 뒤틀림 방지층은,The anti-torsion layer,
    상기 금속 장식이 금 99.9%의 중량 3.75g의 재질로 두께가 0.1㎜ 내지 0.55㎜로 구비될 경우, 상기 뒤틀림 방지층은 에폭시 레진으로 0.05㎜ 내지 0.15㎜의 두께로 구비되는, 금속 장식이 삽입된 플라스틱 카드.When the metal decoration is provided with a thickness of 0.1 mm to 0.55 mm with a material having a weight of 99.9% gold and a thickness of 0.1 mm to 0.55 mm, the anti-warping layer is an epoxy resin with a thickness of 0.05 mm to 0.15 mm Card.
  11. 제 7 항에 있어서, The method of claim 7,
    상기 플라스틱 카드시트는,The plastic card sheet,
    상기 뒤틀림 방지층의 상면에 상기 인레이 시트가 형성되고, 상기 인레이 시트의 상면에 상부 프린트 시트가 형성되며, 상기 상부 프린트 시트의 상면에 코팅된 중부 코팅층이 형성되고, 상기 뒤틀림 방지층의 하면에 인쇄된 하부 프린트 시트가 형성되며, 상기 하부 프린트 시트의 하면에 코팅된 하부 코팅층이 형성되는, 금속 장식이 삽입된 플라스틱 카드.The inlay sheet is formed on the upper surface of the warp prevention layer, the upper print sheet is formed on the upper surface of the inlay sheet, the middle coating layer coated on the upper surface of the upper print sheet is formed, and the lower printed on the lower surface of the warp prevention layer A print sheet is formed, and a lower coating layer coated on a lower surface of the lower print sheet is formed.
PCT/KR2019/002340 2019-02-11 2019-02-27 Method for manufacturing plastic card having metal decoration inserted thereinto and plastic card having metal decoration inserted thereinto WO2020166754A1 (en)

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JPS62287450A (en) * 1986-06-06 1987-12-14 Dainippon Printing Co Ltd Production of optical card
JP2002001821A (en) * 2000-06-23 2002-01-08 Kyodo Printing Co Ltd Method for manufacturing plastic card
KR20050063870A (en) * 2003-12-23 2005-06-29 (주)이.씨테크날리지 Plastic card with inserted decoration and manufacturing method thereof
WO2008105577A1 (en) * 2007-02-27 2008-09-04 Gk Power Co., Ltd. Plastic card having a metal decoration
KR20130127061A (en) * 2012-05-14 2013-11-22 (주)바이오스마트 Pure gold thin film piece, card having the pure gold thin film piece, and manufacturing method therefor

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JPS62287450A (en) * 1986-06-06 1987-12-14 Dainippon Printing Co Ltd Production of optical card
JP2002001821A (en) * 2000-06-23 2002-01-08 Kyodo Printing Co Ltd Method for manufacturing plastic card
KR20050063870A (en) * 2003-12-23 2005-06-29 (주)이.씨테크날리지 Plastic card with inserted decoration and manufacturing method thereof
WO2008105577A1 (en) * 2007-02-27 2008-09-04 Gk Power Co., Ltd. Plastic card having a metal decoration
KR20130127061A (en) * 2012-05-14 2013-11-22 (주)바이오스마트 Pure gold thin film piece, card having the pure gold thin film piece, and manufacturing method therefor

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