WO2020162067A1 - Résistance de détection de sulfuration - Google Patents

Résistance de détection de sulfuration Download PDF

Info

Publication number
WO2020162067A1
WO2020162067A1 PCT/JP2019/050684 JP2019050684W WO2020162067A1 WO 2020162067 A1 WO2020162067 A1 WO 2020162067A1 JP 2019050684 W JP2019050684 W JP 2019050684W WO 2020162067 A1 WO2020162067 A1 WO 2020162067A1
Authority
WO
WIPO (PCT)
Prior art keywords
sulfurization
detection
resistor
sulfuration
conductor
Prior art date
Application number
PCT/JP2019/050684
Other languages
English (en)
Japanese (ja)
Inventor
松本　健太郎
太郎 木村
Original Assignee
Koa株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koa株式会社 filed Critical Koa株式会社
Publication of WO2020162067A1 publication Critical patent/WO2020162067A1/fr

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N17/00—Investigating resistance of materials to the weather, to corrosion, or to light
    • G01N17/04—Corrosion probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance

Definitions

  • the present invention relates to a sulfurization detection resistor for detecting the cumulative amount of sulfurization in a corrosive environment.
  • an Ag (silver)-based electrode material having a low specific resistance is used as an internal electrode of an electronic component such as a chip resistor, but silver becomes silver sulfide when exposed to a sulfide gas, and silver sulfide becomes Since it is an insulator, there is a problem that the electronic component is disconnected. Therefore, in recent years, sulfuration countermeasures have been taken such as adding Pd (palladium) or Au (gold) to Ag to form an electrode that is less likely to be sulfurized, or making the electrode a structure in which sulfurized gas does not easily reach.
  • Patent Document 1 it is possible to detect the cumulative degree of sulfidation of an electronic component and detect the risk before the electronic component fails due to a sulfidation disconnection or the like. Detection sensors have been proposed.
  • a sulfurization detection body mainly composed of Ag is formed on an insulating substrate, and a transparent protective film having sulfur gas permeability is formed so as to cover the sulfurization detection body.
  • the end surface electrodes connected to the sulfuration detector are formed on both ends of the insulating substrate.
  • the color of the sulfide detector changes according to the concentration of the sulfide gas and the elapsed time. This allows the color change of the sulfuration detector to be viewed through the protective film, the reflected light from the sulfurization detector of the light irradiated on the upper surface of the sulfurization detector to be detected, or the resistance value of the sulfuration detector to be detected.
  • the degree of sulfurization is detected by detecting the change in.
  • the sulfurization detector is a conductor mainly composed of Ag having a low specific resistance, the change in the resistance value of the sulfurization detector due to the cumulative amount of sulfurization is very small, and Ag has an extremely high temperature characteristic (TCR). Since the resistance value changes greatly with temperature, it is difficult to accurately detect the degree of sulfurization based on the change in the resistance value of the sulfuration detector.
  • the present invention has been made in view of the actual situation of the prior art as described above, and an object thereof is to provide a sulfidation detection resistor capable of accurately and easily detecting the degree of sulfidation.
  • the sulfuration detection resistor of the present invention is a rectangular parallelepiped insulating substrate, a pair of front electrodes formed at both ends of the main surface of the insulating substrate, and one of the front electrodes.
  • a plurality of sulfurization detection conductors containing copper as a main component connected in parallel, a plurality of resistors connected between the other front electrode and the sulfurization detection conductor, the entire resistor and the sulfurization detection A protective film formed so as to cover a part of the conductor, wherein the sulfurization detection conductor has a sulfurization detection portion facing each other with a predetermined gap, without being covered by the protection film. It is characterized in that the gap formed in the sulfurization detecting conductor is conducted at different timings due to cumulative sulfurization of the sulfurization detecting portion.
  • each pair of sulfurization detection conductors has a predetermined structure. It has a sulfur detection part facing each other across a gap, and the copper sulfide crystals generated by exposure to the sulfur gas expand and straddle the gap so that the sulfur detection conductors of each set conduct at different times.
  • the resistance value change between the pair of front electrodes gradually changes, and the degree of sulfidation can be accurately and easily detected.
  • the sulfuration detection resistor having the above structure if the plurality of sulfurization detection conductors are formed of materials having different copper contents, even if the gaps of the sulfurization detection conductors have the same gap, The timing at which the detection conductors conduct can be different.
  • each sulfurization detection conductor has gaps with different intervals, even if each sulfurization detection conductor is made of a material having the same composition, each pair of sulfurization detection conductors is detected.
  • the timing at which the conductors conduct can be different.
  • the sulfuration detection resistor having the above structure when the protective film is formed so as to cover the connection between the plurality of sulfurization detection conductors and one of the front electrodes, the front electrode and the sulfurization detection unit are separated by the protective film. Therefore, it is possible to prevent the sulfuration detection portion from being covered with the solder when the sulfuration detection resistor is mounted on the circuit board by soldering. Further, when the front electrode is made of Ag or the like, it is possible to prevent unexpected conduction of the sulfurization detecting portion due to migration to the sulfurization detecting conductor side.
  • the strip-shaped protective film covers the widthwise edge side of the sulfuration detection portion.
  • the conduction ensuring circuit section is arranged in parallel with the sulfuration detecting conductor between the pair of front electrodes, and the conduction ensuring circuit section is composed of a resistor and a conductor connected in series.
  • the conduction ensuring circuit section can secure conduction between both surface electrodes in the initial state before the plural sulfurization detection sections are conducted. it can.
  • the resistance value of the resistance element of the conduction ensuring circuit is set lower than the resistance values of the other resistance elements connected to the sulfurization detection conductor, when the sulfurization detection conductor becomes conductive, Since a large amount of current flows in the circuit for ensuring continuity that has a resistor with a low resistance value, the load will be reduced if the copper sulfide crystal slightly contacts between the sulfurization detection parts of the sulfurization detection conductor, and unnecessary overload disconnection will occur. Etc. can be prevented.
  • the sulfuration detecting resistor having the above-mentioned configuration, among the resistor and the sulfurization detecting conductor which are continuously formed between the pair of front electrodes, a trimming groove is formed in the resistor and both end portions of the resistor are formed. If the sulfurization detection conductor and the measurement conductor are connected to, when trimming the resistance values of the resistors in each set, attach a probe to the sulfurization detection conductor and the measurement conductor connected to both ends of each resistor. Trimming can be performed while abutting.
  • the sulfuration detection resistor having the above-mentioned configuration if the gap existing between the sulfurization detection portions of the sulfurization detection conductor has a meandering shape, it is possible to interpose a long-length gap within the limited width dimension of the sulfurization detection conductor. Therefore, the range for detecting the continuity becomes longer, and the detection accuracy can be improved.
  • FIG. 2 is a sectional view taken along the line II-II in FIG. 1. It is a top view which shows the manufacturing process of this sulfurization detection resistor. It is sectional drawing which shows the manufacturing process of this sulfurization detection resistor. It is explanatory drawing which shows the relationship between the cumulative sulfurization amount and resistance value in this sulfurization detection resistor. It is a top view of a sulfurization detection resistor concerning the example of a 2nd embodiment of the present invention. It is a top view of a sulfurization detection resistor concerning the example of a 3rd embodiment of the present invention.
  • FIG. 1 is a plan view of a sulfuration detection resistor according to a first embodiment of the present invention
  • FIG. 2 is a cross section taken along line II-II of FIG. It is a figure.
  • the sulfurization detection resistor 10 includes a rectangular parallelepiped insulating substrate 1 and a first front electrode provided on both ends of the surface of the insulating substrate 1 in the longitudinal direction. 2 and the second front electrode 3, a plurality of (three in the present embodiment) sulfurization detection conductors 4 connected in parallel to the first front electrode 2, and between each sulfurization detection conductor 4 and the second front electrode 3.
  • the insulating substrate 1 is a large-sized substrate, which will be described later, divided along vertical and horizontal dividing grooves to obtain a large number, and the large-sized substrate is mainly made of alumina and is a ceramics substrate.
  • the first front electrode 2 and the second front electrode 3 are formed by screen-printing a Cu-based paste containing copper as a main component, followed by drying and firing, and the first front electrode 2 and the second front electrode 3 are arranged at predetermined intervals.
  • the insulating substrate 1 is formed at both ends in the longitudinal direction so as to be opposed to each other.
  • the pair of back electrodes 7 are also made by screen-printing a Cu-based paste containing copper as a main component, and drying and firing the back electrodes 7. These back electrodes 7 are the first front electrode 2 and the second front electrode on the front surface side of the insulating substrate 1. It is formed at a position corresponding to 3.
  • the three sulfurization detection conductors 4 connected in parallel to the first front electrode 2 were screen-printed with a Cu-based paste containing copper as a main component, dried and fired.
  • the content of nickel) is different.
  • the sulfurization detection conductor 4 located in the upper part of FIG. 1 is made of Cu paste containing no Ni
  • the sulfurization detection conductor 4 located in the middle part of FIG. 1 is made of Cu—Ni paste containing 5% of Ni.
  • the sulfurization detection conductor 4 located in the lower part of FIG. 1 is made of Cu—Ni paste containing 10% Ni.
  • a slit-shaped gap G extending along the width direction is formed in the central portion of the sulfurization detecting conductor 4, and the gap G is set to the same size in each sulfurization detecting conductor 4.
  • the plurality of resistors 5 are made by screen-printing a resistor paste such as Cu-Ni and drying and firing. Both ends of the resistor 5 are connected to the sulfurization detection conductor 4 and the second front electrode 3, and a series circuit portion of the pair of sulfurization detection conductor 4 and the resistor 5 is connected to the first front electrode 2 and the second front electrode 3. And 3 sets are connected in parallel.
  • the protective film 6 has a two-layer structure of an undercoat layer and an overcoat layer, of which the undercoat layer is a screen-printed glass paste which is dried and baked, and the overcoat layer is a screen-printed epoxy resin paste. Then, it is cured by heating.
  • the protective film 6 is formed so as to cover the entire portion of each resistor 5 and the portion excluding the central portion of each sulfurization detecting conductor 4, and the central portion of each sulfurating detection conductor 4 exposed from the protective film 6 to the outside is The pair of sulfurization detection portions 4a are opposed to each other with a gap G therebetween.
  • one (left side in the drawing) protective film 6 extends to a position covering the connection portion between the first front electrode 2 and each sulfurization detecting conductor 4.
  • the other protective film 6 (on the right side in the drawing) extends to a position that covers the connection between the second front electrode 3 and each resistor 5.
  • the pair of end face electrodes 8 are formed by sputtering Ni/Cr on the end faces of the insulating substrate 1 or by applying an Ag-based paste and heating and curing the end faces electrodes 8 and the corresponding first front electrode 2 and back face.
  • the electrodes 7 and the second front electrode 3 and the back electrode 7 are electrically connected to each other.
  • the pair of external electrodes 9 has a two-layer structure of a barrier layer and an external connection layer, of which the barrier layer is a Ni plating layer formed by electrolytic plating, and the external connection layer is a Sn plating layer formed by electrolytic plating. ..
  • the surfaces of the first front electrode 2 and the second front electrode 3 exposed from the protective film 6 and the surfaces of the back electrode 7 and the end face electrode 8 are covered with these external electrodes 9, respectively.
  • FIGS. 3A to 3F are plan views of a large-sized substrate used in this manufacturing process as seen from the surface, and FIGS. 4A to 4F are A of FIGS. 3A to 3F. Each of the cross-sectional views corresponding to one chip along the line -A is shown.
  • a large-sized board from which a large number of insulating boards 1 can be taken.
  • the large-sized substrate is preliminarily provided with primary dividing grooves and secondary dividing grooves in a grid pattern, and each of the cells divided by the dividing grooves serves as a chip region for one piece.
  • a large-sized substrate 10A corresponding to one chip area is shown as a representative, but in reality, each large-sized substrate corresponding to a large number of chip areas is subjected to the steps described below collectively. Is done.
  • a Cu-based paste containing copper as a main component is screen-printed on the surface of the large-sized substrate 10A and dried and baked to form a gap G.
  • the three sulfurization detection conductors 4 connected to the first front electrode 2 are formed. These three sulfurization detection conductors 4 are different in the content of Ni contained in Cu.
  • the reference symbols 4A, 4B, and 4C are added to the respective sulfurization detection conductors 4 in the drawing in order from the top.
  • 4A is made of Cu containing no Ni at all
  • the sulfurized detection conductor 4B is made of Cu-Ni containing 5% of Ni
  • the sulfurized detection conductor 4C is made of Cu-Ni containing 10% of Ni.
  • a resistor paste such as Cu-Ni is screen-printed, dried and fired, so that both ends are sulfurized detection conductors 4 (4A, 4B) as shown in FIGS. 3(c) and 4(c). , 4C) and three resistor bodies 5 connected to the second front electrode 3 are formed.
  • the glass paste is dried and fired to form an undercoat layer.
  • a trimming groove (not shown) is formed to adjust the resistance value.
  • an epoxy resin paste is screen-printed on the undercoat layer and heat-cured to remove each of the sulfurization detection conductors 4A, 4B, and 4C as shown in FIGS. 3(d) and 4(d).
  • a protective film 6 having a two-layer structure is formed so as to cover a part and the whole of each resistor 5.
  • the central portion of each of the sulfurization detecting conductors 4A, 4B, and 4C is exposed from the protective film 6, and this exposed portion becomes the sulfurization detecting portion 4a facing each other through the gap G.
  • the connection portion between the first front electrode 2 and each of the sulfurization detection conductors 4A, 4B, 4C is covered with the protective film 6, and the connection portion between the second front electrode 3 and each resistor 5 is also covered with the protective film 6.
  • the sulfuration detection portions 4a of the sulfurization detection conductors 4A, 4B, and 4C are covered with a masking (not shown) made of a soluble material or the like, and in this state, the large-sized substrate 10A is primary-coated on the strip-shaped substrate 10B along the primary dividing grooves.
  • Ni/Cr is sputtered on the division surface of the strip-shaped substrate 10B so that the first front electrode 2 and the back electrode 7 and the second front electrode 7 and the back electrode 7 are separated from each other as shown in FIGS. 3(e) and 4(e).
  • An end face electrode 8 connecting the front electrode 3 and the back electrode 7 is formed.
  • the end face electrode 8 may be formed by applying an Ag-based paste and curing it by heating.
  • the strip-shaped substrate 10B is secondarily divided into a plurality of chip-shaped substrates 10C along the secondary dividing grooves, and these chip-shaped substrates 10C are subjected to electrolytic plating to form a Ni—Sn plated layer.
  • the masking described above is removed using a solvent.
  • the external electrodes 9 are formed on the surfaces of the first front electrode 2, the second front electrode 3, the back electrode 7, and the end face electrode 8. , 2 is completed.
  • FIG. 5 is an explanatory diagram showing the relationship between the cumulative sulfurization amount and the resistance value when the sulfurization detection resistor 10 according to the present embodiment is arranged in a sulfurization gas atmosphere.
  • the three sulfurization detection conductors 4 that are arranged in parallel between the first front electrode 2 and the second front electrode 3 ( Since the gap G is formed in 4A, 4B, 4C), the initial resistance value of the sulfuration detection resistor 10 is in the open state.
  • this sulfurization detecting resistor 10 When this sulfurization detecting resistor 10 is placed in an atmosphere containing a sulfurization gas, the sulfurization detecting portions 4a of the sulfurization detecting conductors 4 come into contact with the sulfurization gas, so that the copper sulfide crystals generated in the sulfurization detecting portion 4a form the gap G. It gradually expands inward.
  • the three sulfurization detection conductors 4 are formed of materials having different copper contents, and in the case of the present embodiment example, the sulfurization detection conductors 4 (4A) on the upper side of FIG. Since the content is the largest, the gap G existing between the sulfurization detection portions 4a of the sulfurization detection conductor 4 is short-circuited via the copper sulfide as the cumulative sulfurization amount increases.
  • the first front electrode 2 and the second front electrode 3 are electrically connected to each other through the sulfurization detection conductor 4 (4A) on the upper stage side and the resistor 5 connected thereto, and the resistance value of each resistor 5 is, for example, R. Then, the resistance value R of one resistor 5 is detected from the sulfurization detection resistor 10.
  • the gap G existing between the sulfurization detection portions 4a of the sulfurization detection conductor 4 (4C) on the lower side having the third highest copper content is also short-circuited via the copper sulfide.
  • the first front electrode 2 and the second front electrode 3 are electrically connected via the upper, middle, and lower sulfurization detection conductors 4 (4A, 4B, 4C) connected in parallel and the resistor 5 connected to them. Since the state is brought into the state, the resistance value R/3 corresponding to the three resistors 5 connected in parallel is detected from the sulfurization detection resistor 10.
  • each set of the sulfidation detecting conductors 4 has a sulfidation detecting portion 4a facing each other through a predetermined gap G, and the copper sulfide crystals generated by being exposed to the sulfiding gas are extended to form the gap G.
  • the sulfurization detection conductors 4 of each set are brought into conduction at different timings, so that the resistance value change between the pair of front electrodes 2 and 3 gradually changes to accurately and accurately determine the degree of sulfurization. It can be easily detected.
  • the set of the sulfuration detection conductor 4 and the resistor 5 connected in parallel between the first front electrode 2 and the second front electrode 3 is not limited to three sets as in the present embodiment, but two sets or four sets. It may be more.
  • each sulfurization detection conductor 4 has a different copper content as a means for making the timing of conduction between the sulfurization detection portions 4a of the plurality of sulfurization detection conductors 4 different. Since it is formed by using a Cu-based paste having a different Ni content, the sulfurization detection conductor 4 suitable for the application can be obtained by adjusting the Ni content added to Cu. It can be easily formed. Moreover, since the sulfurization detecting portions 4a facing the plurality of sulfurization detecting conductors 4 via the gap G are formed, and these sulfurization detecting portions 4a are exposed from the protective film 6 in the same surface area, a plurality of sulfurization gases can be detected. It is possible to act on the sulfidation detecting portion 4a under the same condition, and it is possible to appropriately vary the conduction timing of the gap G formed in each sulfidation detecting conductor 4.
  • the timings at which the gaps G of the sulfurization detecting conductors 4 are electrically connected instead of forming the sulfurization detecting conductors 4 with materials having different copper contents, a film made of a material having the same copper content is used. The thickness may be different for each sulfurization detection conductor 4. In that case, since the larger the thickness of the sulfurization detection conductor 4 is, the more copper sulfide is generated, the gap G between the thickness of the sulfurization detection conductor 4 is increased. Conducts at an early timing.
  • the protective film 6 is formed up to the position where the connection portion between each sulfurization detection conductor 4 and the first front electrode 2 is covered. Since the electrode 2 and the sulfuration detection unit 4a are separated, it is possible to prevent the sulfuration detection unit 4a from being covered with solder when the sulfurization detection resistor 10 is mounted on the circuit board by soldering. Further, when the front electrodes 2 and 3 are formed by using Ag or the like, it is possible to prevent unexpected conduction of the sulfurization detecting portion 4a due to migration to the sulfurization detecting conductor 4 side.
  • FIG. 6 is a plan view of the sulfuration detection resistor 20 according to the second embodiment of the present invention, and the portions corresponding to those in FIG.
  • the gaps G of the plurality of sulfurization detection conductors 4 are made different from each other, so that the sulfurization detection portions 4a of the sulfurization detection conductors 4 are separated from each other.
  • the gaps G1, G2, G3 are set to G1 ⁇ G2 ⁇ G3.
  • the sulfurization detection resistor 20 when the sulfurization detection resistor 20 is arranged in an atmosphere containing a sulfurization gas, first, the sulfurization detection conductor 4 on the upper stage side in which the gap G1 is the smallest is conductive. Then, the middle sulfide detection conductor 4 having the narrow gap G2 is brought into conduction, and finally the lower sulfide detection conductor 4 having the wide gap G3 is brought into conduction. Therefore, similarly to the above-described first embodiment, the resistance value change between the pair of front electrodes 2 and 3 gradually changes, and the degree of sulfidation can be accurately and easily detected.
  • the gaps G1, G2, G3 formed in the sulfurization detection conductors 4 are made different so that each sulfurization detection is performed with an increase in the cumulative sulfurization amount. Since the conductors 4 become conductive at different timings, it is possible to form the sulfurization detection conductors 4 in the same step using a material having the same composition (for example, Cu100%). Further, at this time, each of the sulfurization detection conductors 4 may be formed of the material having the same composition as the first front electrode 2 and the second front electrode 3 in the same process, or the material having the same composition (for example, Ni of 30%). It is also possible to form each sulfide detection conductor 4 by using the contained Cu) in the same step as the resistor 5.
  • each of the sulfurization detection conductors 4 is formed with a material having a different copper content, and in that case, the sulfurization detection conductors 4 with the narrowest gap interval are set. It is preferable to use a material having the highest copper content.
  • FIG. 7 is a plan view of a sulfurization detection resistor 30 according to the third embodiment of the present invention
  • FIG. 8 is a plan view of a sulfurization detection resistor 40 according to the fourth embodiment of the present invention, which corresponds to FIG.
  • the duplicated description will be omitted by giving the same reference numerals to the portions to be performed.
  • the protection film 6 has a band-shaped protection film 6a located between the sulfurization detection portions 4a of the respective sulfurization detection conductors 4,
  • the other configurations are basically the same as those of the sulfuration detection resistor 20 according to the second embodiment.
  • the sulfurization detection portion 4a of each sulfurization detection conductor 4 arranged in parallel between the first front electrode 2 and the second front electrode 3 Even if the distance between the adjacent ones becomes narrower, an unexpected short circuit between the adjacent sulfurization detection portions 4a can be suppressed by the strip-shaped protective film 6a.
  • the width dimension of the band-shaped protective film 6a may be narrower than the interval between the adjacent sulfurization detection portions 4a, but like the sulfurization detection resistor 40 according to the fourth embodiment shown in FIG. If the width dimension of the sulfide is formed wider than the interval between the adjacent sulfurization detecting portions 4a and the band-shaped protective film 6a covers the widthwise edge side of the sulfurization detecting portions 4a, unexpected short circuit can be suppressed more effectively. be able to.
  • the sulfurization detection portions 4a having different gaps G are formed in each sulfurization detection conductor 4, and the band-shaped protective film is provided between the sulfurization detection portions 4a.
  • the band-shaped protective film 6a is applied to the sulfuration detection resistor 10 according to the first embodiment, and the sulfuration detection section 4a having the same gap G is set.
  • the band-shaped protective film 6a may be formed.
  • FIG. 9 is a plan view of a sulfurization detection resistor 50 according to the fifth embodiment of the present invention, and the portions corresponding to those in FIG.
  • the sulfuration detection resistor 50 includes a plurality of sets of sulfurization detection conductors 4 and resistors 5 connected in parallel between the first front electrode 2 and the second front electrode 3.
  • the sulfurization detecting portion 4a exposed from the protective film 6 is formed only in the upper and middle sulfurization detecting conductors 4 in the figure, and the lower sulfurization detecting conductor 4 covered with the protective film 6 is exposed to the outside. It does not have a sulfurization detector.
  • a gap G1 is formed in the upper sulfide detection section 4a, and a gap G2 having a wider gap than the gap G1 is formed in the middle sulfide detection section 4a. No gap is formed in the sulfuration detecting conductor 4.
  • the lower sulfurization detection conductor 4 and the resistor 5 connected to the lower sulfurization detection conductor constitute a circuit for ensuring continuity, and other configurations are basically the same as those of the sulfurization detection resistor 10 according to the first embodiment. Is.
  • FIG. 10 is an explanatory diagram showing the relationship between the cumulative sulfurization amount and the resistance value when the sulfurization detection resistor 50 according to the fifth embodiment is arranged in a sulfurization gas atmosphere.
  • the sulfuration detection conductor 4 of the circuit for ensuring continuity covered by the protective film 6 and the resistor 5 connected to the conductor 4 are connected via the resistor 5. Since the two front electrodes 2 and 3 are electrically connected to each other, assuming that the resistance value of each resistor 5 is, for example, R, the resistance value R of one resistor 5 is detected as the initial resistance value of the sulfuration detection resistor 50. To be done.
  • the sulfurization detecting conductor 4 on the upper stage side in which the gap G1 having a narrow interval is formed is brought into conduction, and at this time, the upper stage side.
  • the resistance value R/2 for two resistors 5 connected in parallel to the resistor 5 connected to the sulfurization detection conductor 4 and the resistor 5 connected to the sulfurization detection conductor 4 in the conduction ensuring circuit portion is detected.
  • the middle-side sulfurization detection conductor 4 in which the wide gap G2 is formed becomes conductive, and at this time, the resistor connected to the upper/middle-side sulfurization detection conductor 4 is connected.
  • the resistance value R/3 for three resistors 5 connected in parallel with the resistor 5 connected to the sulfurization detection conductor 4 of the circuit for ensuring continuity is detected. Therefore, similarly to the above-described first to fourth embodiments, the resistance value change between the pair of front electrodes 2 and 3 gradually changes, and the degree of sulfidation can be accurately and easily detected. ..
  • the resistance value of the resistor 5 in the conduction ensuring circuit portion is lower than the resistance values of the other resistors 5 connected to the respective sulfurization detection conductors 4 exposed from the protective film 6. If the value is set low, a large amount of current will flow through the conduction ensuring circuit section having the resistor 5 having a low resistance value when the sulfurization detection conductor 4 becomes conductive as the cumulative amount of sulfurization increases, so that a crystal of copper sulfide is formed. When a slight contact occurs between the sulfurization detecting portions 4a of the sulfurization detecting conductor 4, the load is reduced, and unnecessary overload disconnection or the like can be prevented.
  • the sulfurization detection conductor 4 of the conduction ensuring circuit portion does not participate in the detection of the sulfurization gas, and therefore extends from the first front electrode 2 toward the second front electrode 3. It is also possible to integrally form the protruding portion and use this protruding portion as the sulfuration detecting conductor 4 of the circuit for ensuring conduction. Further, the gaps G formed in the plurality of sulfurization detecting conductors 4 exposed from the protective film 6 may have the same intervals. In that case, each sulfurization detecting conductor 4 is formed of a material having a different copper content. Alternatively, the film thickness of a material having the same copper content may be different for each sulfurization detection conductor 4.
  • FIG. 11 is a plan view of a sulfurization detection resistor 60 according to a sixth embodiment of the present invention, and the portions corresponding to those in FIG.
  • the sulfuration detection resistor 60 has three sulfurization detection conductors 4 connected to the first front electrode 2 and three sulfurization detection conductors 4 connected to the second front electrode 3.
  • the measurement conductors 11 are connected in parallel, the resistors 5 are connected in series between the corresponding sulfurization detection conductors 4 and the measurement conductors 11, and the resistance values are trimmed in the trimming grooves 5a. Is formed, and the other structure is basically the same as the sulfuration detection resistor 20 according to the second embodiment.
  • one sulfurization detection portion 4a of the sulfurization detection conductor 4 and the measurement conductor 11 are provided at both ends of each resistor 5 arranged in parallel. Therefore, when trimming the resistance values of the resistors 5 of each set, while abutting the probes on the sulfurization detection portions 4a and the measurement conductors 11 connected to both ends of each resistor 5, Trimming can be done.
  • the measurement conductors 11 are connected not only to one end of the resistor 5 but also to both ends thereof, and the measurement conductors 11 are connected to the second surface electrode 3 and the sulfurization detection.
  • the conductor 4 may be connected to one of the sulfurization detection portions 4a.
  • the gap G existing between the sulfurization detecting portions 4a of the sulfurization detecting conductors 4 has a shape that extends linearly along the lateral direction of the insulating substrate 1.
  • a meandering shape such as a dogleg shape, a crank shape, a sawtooth shape, a corrugated shape, or a spiral shape can be formed, a gap G having a long overall length can be interposed between the pair of sulfurization detection portions 4a, and therefore, a range for detecting conduction Is longer and the detection accuracy is improved.
  • Sulfidation detection resistor 1 Insulating substrate 2 First table electrode 3 Second table electrode 4, 4A, 4B, 4C Sulfidation detection conductor 4a Sulfidation detection part 5 Resistor 6 Protective film 6a Band Protective film 7 Back electrode 8 End surface electrode 9 External electrode 10A Large-sized substrate 10B Strip substrate 10c Chip substrate 11 Conductor for measurement G, G1, G2, G3 Gap

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Immunology (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Biodiversity & Conservation Biology (AREA)
  • Ecology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Environmental Sciences (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Testing Resistance To Weather, Investigating Materials By Mechanical Methods (AREA)

Abstract

L'invention concerne une résistance de détection de sulfuration capable de détecter avec précision et simplement un degré de sulfuration. Une résistance de détection de sulfuration 10 comprend un substrat isolant 1 parallélépipède rectangulaire ; une première électrode de surface 2 et une seconde électrode de surface 3 formées sur les deux parties d'extrémité d'une surface principale du substrat isolant 1 ; une pluralité de conducteurs de détection de sulfuration 4 connectés en parallèle à la première électrode de surface 2 ; une pluralité de résistances 5 connectées entre chaque conducteur de détection de sulfuration 4 et la seconde électrode de surface 3 ; et un film de protection 6 formé de manière à recouvrir une partie des conducteurs de détection de sulfuration 4 et la totalité des résistances 5. Chacun des conducteurs de détection de sulfuration 4 comprend une section de détection de sulfuration 4a qui n'est pas recouverte par le film de protection 6 et qui fait face à une autre section de détection de sulfuration sur un espace G prédéterminé. Chacun des conducteurs de détection de sulfuration 4 est formé à partir d'un matériau ayant un contenu en cuivre différent, et les espaces G formés entre les conducteurs de détection de sulfuration 4 sont configurés pour conduire à des instants différents en fonction de l'augmentation de la quantité cumulative de sulfuration.
PCT/JP2019/050684 2019-02-04 2019-12-24 Résistance de détection de sulfuration WO2020162067A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019018198A JP7166183B2 (ja) 2019-02-04 2019-02-04 硫化検出抵抗器
JP2019-018198 2019-02-04

Publications (1)

Publication Number Publication Date
WO2020162067A1 true WO2020162067A1 (fr) 2020-08-13

Family

ID=71948181

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2019/050684 WO2020162067A1 (fr) 2019-02-04 2019-12-24 Résistance de détection de sulfuration

Country Status (2)

Country Link
JP (1) JP7166183B2 (fr)
WO (1) WO2020162067A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117355738A (zh) * 2021-06-09 2024-01-05 三菱电机株式会社 传感器及具有该传感器的电气设备

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6258253B1 (en) * 1999-04-15 2001-07-10 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Vapor corrosion cell and method of using same
JP2009250611A (ja) * 2008-04-01 2009-10-29 Taiyosha Electric Co Ltd 硫化検出センサ、硫化検出回路及び硫化検出センサの製造方法
US20100059375A1 (en) * 2006-11-08 2010-03-11 Weiller Bruce H Metal salt hydrogen sulfide sensor
US20140152449A1 (en) * 2012-12-05 2014-06-05 International Business Machines Corporation Early Detection of Environmental Conditions That Will Lead to Creep Corrosion on Printed Circuit Boards in Data Centers
JP2014153089A (ja) * 2013-02-05 2014-08-25 Mitsubishi Electric Corp 金属の腐食検知方法、腐食検知装置、および、その製造方法
JP2015230922A (ja) * 2014-06-03 2015-12-21 Koa株式会社 チップ抵抗器の製造方法
US20160011142A1 (en) * 2014-07-09 2016-01-14 Honeywell Romania S. R. L. Hydrogen sulfide sensor and method
JP2017003285A (ja) * 2015-06-04 2017-01-05 ファナック株式会社 基板の腐食検出回路及びそれを具備したモータ駆動装置
JP2017009360A (ja) * 2015-06-19 2017-01-12 日新電機株式会社 異常検出装置及び故障防止装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6258253B1 (en) * 1999-04-15 2001-07-10 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Vapor corrosion cell and method of using same
US20100059375A1 (en) * 2006-11-08 2010-03-11 Weiller Bruce H Metal salt hydrogen sulfide sensor
JP2009250611A (ja) * 2008-04-01 2009-10-29 Taiyosha Electric Co Ltd 硫化検出センサ、硫化検出回路及び硫化検出センサの製造方法
US20140152449A1 (en) * 2012-12-05 2014-06-05 International Business Machines Corporation Early Detection of Environmental Conditions That Will Lead to Creep Corrosion on Printed Circuit Boards in Data Centers
JP2014153089A (ja) * 2013-02-05 2014-08-25 Mitsubishi Electric Corp 金属の腐食検知方法、腐食検知装置、および、その製造方法
JP2015230922A (ja) * 2014-06-03 2015-12-21 Koa株式会社 チップ抵抗器の製造方法
US20160011142A1 (en) * 2014-07-09 2016-01-14 Honeywell Romania S. R. L. Hydrogen sulfide sensor and method
JP2017003285A (ja) * 2015-06-04 2017-01-05 ファナック株式会社 基板の腐食検出回路及びそれを具備したモータ駆動装置
JP2017009360A (ja) * 2015-06-19 2017-01-12 日新電機株式会社 異常検出装置及び故障防止装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117355738A (zh) * 2021-06-09 2024-01-05 三菱电机株式会社 传感器及具有该传感器的电气设备

Also Published As

Publication number Publication date
JP2020125966A (ja) 2020-08-20
JP7166183B2 (ja) 2022-11-07

Similar Documents

Publication Publication Date Title
WO2020153084A1 (fr) Résistance à détection de sulfuration et son procédé de fabrication
US11506594B2 (en) Sulfurization detection resistor
WO2020246253A1 (fr) Détecteur de sulfuration
WO2020162067A1 (fr) Résistance de détection de sulfuration
WO2020213243A1 (fr) Procédé de production d'un capteur de détection de sulfuration
JP7256085B2 (ja) 硫化検出センサおよび硫化検出センサの製造方法
WO2020202815A1 (fr) Capteur de détection de sulfurisation, procédé de fabrication de capteur de détection de sulfurisation et procédé de montage de capteur de détection de sulfurisation
WO2020208931A1 (fr) Résistance de détection de sulfuration
JP7359714B2 (ja) 硫化検出センサ
JP7197393B2 (ja) 硫化検出センサおよびその製造方法
JP2021012067A (ja) 硫化検出センサ
JP7454443B2 (ja) 硫化検出センサ
JP2022154283A (ja) 硫化検出センサおよび硫化検出センサの製造方法
JP2007073755A (ja) チップ抵抗器の製造方法
JP2003297670A (ja) チップ型複合部品
JP2023004230A (ja) 硫化検出センサ
JP2021181931A (ja) 硫化検出センサおよび硫化検出センサの製造方法
JP2021067463A (ja) 硫化検出センサおよび硫化検出センサの実装構造
JP2021012066A (ja) 硫化検出センサ

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19914323

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19914323

Country of ref document: EP

Kind code of ref document: A1