WO2020161915A1

WO2020161915A1 - Circuit forming device and circuit forming method

Info

Publication number: WO2020161915A1
Application number: PCT/JP2019/004732
Authority: WO
Inventors: 重義稲垣
Original assignee: 株式会社Ｆｕｊｉ
Priority date: 2019-02-08
Filing date: 2019-02-08
Publication date: 2020-08-13
Also published as: JPWO2020161915A1; JP7062795B2

Abstract

Provided is a circuit forming device which comprises: a resin layer forming device that forms a resin layer on a base from a curable resin; a wiring forming device that forms wiring on the base from a metal-containing liquid including fine metal particles; a housing that accommodates the resin layer forming device and the wiring forming device therein; and a conveyance device that conveys the base inside the housing and extends outside the housing to convey the base to a working area which is provided outside the housing.

Description

Circuit forming apparatus and circuit forming method

The present invention relates to a circuit forming device provided with a resin layer forming device for forming a resin layer with a curable resin and a wiring forming device for forming wiring with a metal-containing liquid containing fine metal particles, and a circuit forming method.

In recent years, using a technique described in the following patent documents, a device for forming a circuit by forming a resin layer with a curable resin and forming a wiring with a metal-containing liquid containing metal fine particles has been developed. Has been done.

Japanese Patent Publication No. 2018-530457 International Publication No. 2016/042610

-The challenge is to properly form a circuit including at least a resin layer and wiring.

In order to solve the above problems, the present specification describes a resin layer forming apparatus for forming a resin layer on a base with a curable resin, and forming a wiring on the base with a metal-containing liquid containing metal fine particles. A wiring forming device, a housing that encloses the resin layer forming device and the wiring forming device, and a base that conveys the base inside the housing, extends to the outside of the housing, and is provided outside the housing. Disclosed is a circuit forming device including a transfer device that transfers the base to a work area.

Further, in order to solve the above problems, the present specification describes a resin layer forming device that forms a resin layer on a base with a curable resin, and wiring on the base with a metal-containing liquid containing metal fine particles. A circuit forming method for forming a circuit using a circuit forming device including a wiring forming device to be formed, comprising a first forming step of forming at least one of the resin layer and the wiring by the circuit forming device. A first transfer step of transferring, by a transfer device, the base on which at least one of the resin layer and the wiring is formed in the first forming step to a mounting work machine provided outside the circuit forming device, A mounting step of mounting a component by the mounting work machine on the base transported in the first transporting step, and transporting the base on which the component is mounted in the mounting step to the circuit forming apparatus by the transporting device. Disclosed is a circuit forming method including two transfer steps and a second forming step of forming at least one of the resin layer and the wiring by the circuit forming device on the base transferred in the second transfer step.

According to the present disclosure, for example, a base is transported between a circuit forming device and a work area provided outside the circuit forming device. Therefore, in the circuit forming device, it is possible to form the resin layer and the wiring on the base and perform various works on the base in the work area. This makes it possible to properly form the circuit.

It is a figure which shows the circuit formation system of 1st Example. It is a block diagram which shows the control apparatus of 1st Example. It is sectional drawing which shows the resin laminated body which has a cavity. It is sectional drawing which shows the circuit in the state where the electronic component was mounted in the inside of a cavity. It is sectional drawing which shows the circuit in the state in which the resin laminated body was formed between the cavity and the electronic component. It is sectional drawing which shows the circuit in the state in which wiring was formed in the upper surface of a resin laminated body and an electronic component. It is a figure which shows the circuit formation system of 2nd Example. It is a block diagram which shows the control apparatus of 2nd Example.

FIG. 1 shows a circuit forming system 10 of the first embodiment. The circuit forming system 10 includes a circuit forming device 12 and a mounting work machine 14. The circuit forming device 12 includes a carrying device 20, a first modeling unit 22, a second modeling unit 24, and a controller (see FIG. 2) 26. The transport device 20, the first modeling unit 22, and the second modeling unit 24 are arranged inside the housing 28 of the circuit forming device 12. However, the carrier device 20 extends from the inside of the housing 28 toward the outside.

The transfer device 20 includes a slide rail 30, a stage 32, and a linear motor (see FIG. 2) 34. The slide rail 30 has a generally rod-like shape, is arranged in the housing 28 so as to extend in a generally horizontal direction, and has one end extending outside the housing 28. In the following description, the direction in which the slide rail 30 extends is the X-axis direction, the horizontal direction orthogonal to the X-axis direction is the Y-axis direction, and the direction orthogonal to both the X-axis direction and the Y-axis direction is the Z-axis direction. Will be described. The stage 32 is held by a slide rail 30 so as to be slidable in the X-axis direction. Then, the stage 32 is slid to an arbitrary position in the X-axis direction by driving the linear motor 34.

The stage 32 has a base 50, a holding device 52, and a lifting device 54. The base 50 is formed in a flat plate shape, and the substrate is placed on the upper surface. The holding devices 52 are provided on both sides of the base 50 in the X-axis direction. Then, both edges of the substrate placed on the base 50 in the X-axis direction are sandwiched by the holding device 52, so that the substrate is fixedly held. The elevating device 54 is arranged below the base 50 and moves the base 50 up and down.

The first modeling unit 22 is arranged above the slide rail 30 on which the stage 32 moves, and is wired on the substrate (see FIG. 3) 70 placed on the base 50 of the stage 32 that has moved downward. To model. The first modeling unit 22 includes an inkjet head (see FIG. 2) 72, a laser irradiation device (see FIG. 2) 76, and a moving device (see FIG. 2) 78. The inkjet head 72 ejects the metal ink. The metal ink is one in which fine metal particles are dispersed in a solvent. The inkjet head 72 ejects the metal ink from a plurality of nozzles by a piezo method using a piezoelectric element, for example.

The moving device 78 also moves the inkjet head 72 to an arbitrary position in the Y-axis direction. Therefore, by the operation of the transfer device 20 and the moving device 78, the substrate 70 mounted on the base 50 and the inkjet head 72 relatively move in the X-axis direction and the Y-axis direction, and thus the inkjet head 72. Discharges the metal ink to an arbitrary position on the substrate 70.

Also, the laser irradiation device 76 is a galvano type irradiation device and can irradiate the laser at an arbitrary position. Therefore, the laser irradiation device 76 irradiates the metal ink ejected onto the substrate 70 with a laser, so that the metal ink irradiated with the laser is fired to form a wiring. Note that the baking of the metal ink is a phenomenon in which conductivity is increased by applying energy to evaporate the solvent, decompose the metal fine particle protective film, etc., and cause the metal fine particles to come into contact with or fuse with each other. is there. Then, the metal wiring is formed by baking the metal ink.

The second modeling unit 24 is arranged next to the first modeling unit 22 above the slide rail 30 on which the stage 32 moves, and the substrate 70 placed on the base 50 of the stage 32 moved downward. A resin layer is formed on top of. The second modeling unit 24 includes an inkjet head (see FIG. 2) 82, an irradiation device (see FIG. 2) 86, and a moving device (see FIG. 2) 88. The inkjet head 82 discharges the ultraviolet curable resin. The ultraviolet curable resin is a resin that is cured by irradiation with ultraviolet rays. The inkjet head 82 may be, for example, a piezo system using a piezoelectric element, or a thermal system in which a resin is heated to generate bubbles and ejected from a plurality of nozzles.

The moving device 88 also moves the inkjet head 82 to an arbitrary position in the Y-axis direction. Therefore, by the operation of the transfer device 20 and the moving device 88, the substrate 70 placed on the base 50 and the inkjet head 82 relatively move in the X-axis direction and the Y-axis direction, so that the inkjet head 82. Discharges the ultraviolet curable resin to an arbitrary position on the substrate 70.

Further, the irradiation device 86 is equipped with a mercury lamp or an LED as a light source, and irradiates the discharged ultraviolet curing resin with ultraviolet rays. The irradiation device 86 irradiates the entire substrate 70 placed on the base 50 of the stage 32, which has moved below the second modeling unit 24, with ultraviolet rays. As a result, the ultraviolet curable resin discharged onto the substrate 70 is cured and a resin layer is formed.

The controller 26 also includes a controller 90 and a plurality of drive circuits 92, as shown in FIG. The plurality of drive circuits 92 are connected to the linear motor 34, the holding device 52, the elevating device 54, the inkjet head 72, the laser irradiation device 76, the moving device 78, the inkjet head 82, the irradiation device 86, and the moving device 88. The controller 90 includes a CPU, a ROM, a RAM, etc., is mainly a computer, and is connected to a plurality of drive circuits 92. As a result, the operations of the transport device 20, the first modeling unit 22, and the second modeling unit 24 are controlled by the controller 90.

Further, the mounting work machine 14 includes a mounting unit 100 and a control device (see FIG. 2) 102, as shown in FIG. The mounting work machine 14 is arranged side by side with the circuit forming device 12 in the X-axis direction, and one end of the slide rail 30 extending from the housing 28 of the circuit forming device 12 has a housing 104 of the mounting work machine 14. It has entered inside. Therefore, the operation of the transfer device 20 moves the stage 32 not only inside the housing 28 of the circuit forming device 12 but also inside the housing 104 of the mounting work machine 14. Further, the mounting unit 100 is arranged inside the housing 104 of the mounting work machine 14.

The mounting unit 100 is disposed above the slide rail 30 that extends into the housing 104 of the mounting work machine 14, and is mounted on the substrate 70 mounted on the base 50 of the stage 32 that has moved downward. The component (see FIG. 4) 106 is mounted. The mounting unit 100 has a tape feeder (see FIG. 2) 110, a mounting head (see FIG. 2) 112, and a moving device (see FIG. 2) 114. The tape feeder 110 is a tape-type supply device that sends out the taped electronic component 106, and supplies the electronic component 106 at the supply position. The mounting unit 100 is not limited to the tape feeder 110, and may be a tray-type supply device that picks up and supplies the electronic component 106 from the tray. Further, the mounting unit 100 may be configured to include both a tape type and a tray type, or a supply device other than that.

The mounting head 112 also has a suction nozzle (see FIG. 4) 118 for suction-holding the electronic component 106. The suction nozzle 118 suctions and holds the electronic component 106 by sucking air when negative pressure is supplied from a positive/negative pressure supply device (not shown). Then, a slight positive pressure is supplied from the positive/negative pressure supply device, so that the electronic component 106 is separated. Further, the moving device 114 moves the mounting head 112 between the supply position of the electronic component 106 by the tape feeder 110 and the substrate 70 placed on the base 50. As a result, in the mounting unit 100, the electronic component 106 supplied from the tape feeder 110 is held by the suction nozzle 118, and the electronic component 106 held by the suction nozzle 118 is mounted on the substrate 70.

Further, the control device 102 includes a controller 120 and a plurality of drive circuits 122, as shown in FIG. The plurality of drive circuits 122 are connected to the tape feeder 110, the mounting head 112, and the moving device 114. The controller 120 includes a CPU, a ROM, a RAM, etc., is mainly a computer, and is connected to a plurality of drive circuits 122. As a result, the operation of the mounting unit 100 is controlled by the controller 120.

In the circuit forming system 10, the circuit is formed by mounting the electronic component 106 on the substrate 70 and forming the wiring with the above-described configuration. Specifically, the substrate 70 is set on the base 50 of the stage 32, and the stage is moved below the second modeling unit 24 inside the circuit forming device 12 by the operation of the transfer device 20. Then, in the second modeling unit 24, as shown in FIG. 3, the resin laminated body 130 is formed on the substrate 70. The resin laminated body 130 has a cavity 132 for mounting the electronic component 106, and discharges the ultraviolet curable resin from the inkjet head 82 and irradiates the discharged ultraviolet curable resin with ultraviolet rays by the irradiation device 86. Is formed by repeating the above.

Specifically, in the second modeling unit 24, the inkjet head 82 discharges the ultraviolet curable resin in the form of a thin film on the upper surface of the substrate 70. At this time, the inkjet head 82 discharges the ultraviolet curable resin so that a predetermined portion of the upper surface of the substrate 70 is exposed in a generally rectangular shape. Subsequently, when the ultraviolet curable resin is discharged in a thin film form, the irradiation device 86 irradiates the thin film ultraviolet curable resin with ultraviolet light. As a result, the thin resin layer 133 is formed on the substrate 70.

Subsequently, the inkjet head 82 ejects the ultraviolet curable resin in a thin film only on the portion above the thin film resin layer 133. That is, the inkjet head 82 ejects the ultraviolet curable resin in a thin film shape on the thin film resin layer 133 so that a predetermined portion of the upper surface of the substrate 70 is exposed in a generally rectangular shape. Then, the irradiation device 86 irradiates the ultraviolet curable resin discharged in a thin film with ultraviolet rays, so that the thin film resin layer 133 is laminated on the thin film resin layer 133. In this way, the discharge of the ultraviolet curable resin and the irradiation of the ultraviolet ray onto the thin film-shaped resin layer 133 excluding the generally rectangular portion on the upper surface of the substrate 70 are repeated, and the plurality of resin layers 133 are laminated. As a result, the resin laminate 130 having the cavity 132 is formed.

When the resin laminate 130 is formed in the circuit forming device 12 by the procedure described above, the stage 32 is carried out of the circuit forming device 12 and carried into the mounting work machine 14 by the operation of the carrying device 20. .. At this time, the stage 32 is moved below the mounting unit 100 of the mounting work machine 14. In the mounting unit 100, the electronic component 106 is supplied by the tape feeder 110, and the electronic component 106 is held by the suction nozzle 118 of the mounting head 112. Then, the mounting head 112 is moved above the substrate 70, and the electronic component 106 held by the suction nozzle 118 is placed inside the cavity 132 of the resin laminate 130 as shown in FIG. At this time, the electronic component 106 is placed inside the cavity 132 with the electrode 140 facing upward.

Subsequently, in the mounting work machine 14, when the electronic component 106 is mounted inside the cavity 132 of the resin laminated body 130, the stage 32 is carried out of the mounting work machine 14 by the operation of the transfer device 20, and the circuit forming apparatus. It is carried into the inside of 12. At this time, the stage 32 is moved below the second modeling unit 24 of the circuit forming device 12. In the second molding unit 24, as shown in FIG. 5, the resin laminate 150 is formed between the gap between the cavities 132, that is, between the inner wall surface defining the cavity 132 and the electronic component 106. Note that the resin laminated body 150 is formed by repeating the discharge of the ultraviolet curable resin by the inkjet head 82 and the irradiation of the ultraviolet rays by the irradiation device 86, similarly to the resin laminated body 130.

Next, when the resin laminated body 150 is formed in the gap of the cavity 132, the stage 32 is moved below the first modeling unit 22 inside the circuit forming device 12 by the operation of the transfer device 20. Then, in the first modeling unit 22, the inkjet head 72 ejects the metal ink linearly on the resin laminates 130 and 150 according to the circuit pattern. At this time, as shown in FIG. 6, the metal ink 160 is linearly ejected so as to connect the electrode 140 of the electronic component 106 and the electrode of another electronic component (not shown). Then, the ejected metal ink 160 is irradiated with a laser by the laser irradiation device 76. As a result, the metal ink 160 is baked, and the wiring 166 that connects the electrodes is formed.

As described above, in the circuit forming system 10, after the resin laminate 130 is formed in the circuit forming device 12, the transfer device 20 that transfers the stage 32 between the circuit forming device 12 and the mounting work machine 14 causes The substrate 70 on which the resin laminate 130 is formed is conveyed to the mounting work machine 14. Next, in the mounting work machine 14, after the electronic component 106 is mounted in the cavity 132 of the resin laminate 130, the substrate 70 on which the electronic component 106 is mounted is transported to the circuit forming device 12 by the transport device 20. It Then, in the circuit forming device 12, the resin laminated body 150 is formed in the gap of the cavity 132, and the wiring 166 for electrically connecting the electronic component 106 is formed. As described above, in the circuit forming system 10, the resin laminated

bodies

130 and 150 and the wiring 166 are formed by the circuit forming device 12, and the electronic component 106 is mounted by the mounting work machine 14. The mounting work machine 14 is a so-called mounter and is distributed as a manufacturing work machine. Therefore, the circuit forming system 10 can use an existing manufacturing work machine. As a result, it is possible to reduce the development time, the development cost, and the like of the circuit forming system 10 and suppress the manufacturing cost.

Further, in the circuit forming system 10 of the first embodiment, the circuit forming device 12 and the mounting work machine 14 are arranged side by side in the X-axis direction, but as shown in FIG. 7, the circuit of the second embodiment is used. In the forming system 190, the circuit forming device 192 and the mounting work machine 14 are arranged side by side in the Y-axis direction. The mounting work machine 14 of the circuit forming system 190 is the same as the mounting work machine 14 of the circuit forming system 10. Further, the circuit forming device 192 of the circuit forming system 190 includes a carrying device 196, a first modeling unit 22, a second modeling unit 24, and a control device 26, and except for the carrying device 196, the circuit is formed. It is the same as the circuit forming device 12 of the forming system 10. Therefore, regarding the configuration of the circuit forming system 190, only the carrying device 196 will be described.

The transfer device 196 includes an X-axis slide rail 200, a Y-axis slide rail 202, a linear motor (see FIG. 8) 204, a linear motor (see FIG. 8) 206, a transfer device (see FIG. 8) 208, and a stage 32. ing. The X-axis slide rail 200 has a generally rod shape, and is arranged inside the housing 210 of the circuit forming device 192 so as to extend in the X-axis direction. The stage 32 is held by an X-axis slide rail 200 so as to be slidable in the X-axis direction. Then, the stage 32 is slid to an arbitrary position in the X-axis direction by driving the linear motor 204.

The Y-axis slide rail 202 is generally rod-shaped, and is arranged inside the housing 210 of the circuit forming device 192 so as to extend in the Y-axis direction while intersecting with the X-axis slide rail 200. However, one end of the Y-axis slide rail 202 extends to the outside of the housing 210, and has entered into the inside of the housing 104 of the mounting work machine 14 arranged next to the circuit forming device 192.

Further, the transfer device 208 is capable of transferring the stage 32 between the X-axis slide rail 200 and the Y-axis slide rail 202, and the Y-axis slide rail 202 moves the stage 32 in the Y-axis direction. It is possible to hold it in a slidable state. Then, the stage 32 is slid to an arbitrary position in the Y-axis direction by being driven by the linear motor 206 while being held by the Y-axis slide rail 202. That is, the stage 32 is transferred to the X-axis slide rail 200 by the transfer device 208, and is conveyed in the X-axis direction inside the circuit forming device 192 while being held by the X-axis slide rail 200. Further, the stage 32 is transferred to the Y-axis slide rail 202 by the transfer device 208 and is held in the Y-axis slide rail 202 in the Y-axis direction between the circuit forming device 192 and the mounting work machine 14. Be transported.

With such a structure, a circuit can be formed in the circuit forming system 190 as in the circuit forming system 10. The circuit forming method of the circuit forming system 190 and the circuit forming method of the circuit forming system 10 are substantially the same except for the operation of the transfer device 196, and thus will be briefly described. First, in the circuit forming system 190, in the circuit forming device 192, as shown in FIG. 3, the resin laminated body 130 is formed on the substrate 70. At this time, the stage 32 is held by the X-axis slide rail 200. Next, when the resin laminate 130 is formed, the stage 32 is transferred by the transfer device 208 from the X-axis slide rail 200 to the Y-axis slide rail 202, and is conveyed from the circuit forming device 192 to the mounting work machine 14. It Then, in the mounting work machine 14, as shown in FIG. 4, the electronic component 106 is mounted in the cavity 132 of the resin laminate 130. After that, the stage 32 is transported from the mounting work machine 14 to the circuit forming device 192. Then, in the circuit forming device 192, the transfer device 208 transfers the Y-axis slide rail 202 to the X-axis slide rail 200 to form the resin laminate 150 and the wiring 166 as shown in FIGS. 5 and 6. .. In this way, also in the circuit forming system 190, a circuit is formed similarly to the circuit forming system 10. In the circuit forming system 190, since the circuit forming device 192 and the mounting work machine 14 are arranged side by side in the Y-axis direction, even if the space in the X-axis direction is small, the circuit forming system is not provided. 190 can be provided.

In addition, the controller 90 of the control device 26 of the circuit forming apparatus 12, as shown in FIGS. 2 and 8, has a first forming unit 170, a first conveying unit 172, a second conveying unit 174, and a second forming unit. 176 and. Further, the controller 120 of the control device 102 of the mounting work machine 14 has a mounting portion 178. The first forming unit 170 is a functional unit for forming the resin laminated body 130 in the circuit forming device 12. The first transport unit 172 is a functional unit for transporting the substrate 70 on which the resin laminate 130 is formed from the circuit forming device 12 to the mounting work machine 14. The mounting unit 178 is a functional unit for mounting the electronic component 106 in the cavity 132 of the resin laminate 130 in the mounting work machine 14. The second transport unit 174 is a functional unit for transporting the board 70 on which the electronic component 106 is mounted from the mounting work machine 14 to the circuit forming apparatus 12. The second forming portion 176 is a functional portion for forming the resin laminated body 150 and the wiring 166 in the circuit forming device 12.

Further, in the above embodiment, the circuit forming device 12 is an example of the circuit forming device. The mounting work machine 14 is an example of a work area and a mounting work machine. The carrier device 20 is an example of a carrier device. The first modeling unit 22 is an example of a wiring forming device. The 2nd modeling unit 24 is an example of a resin layered product forming device. The housing 28 is an example of a housing. The linear motor 34 is an example of a linear motor. The substrate 70 is an example of a base. The resin laminated

bodies

130 and 150 are examples of resin layers. The wiring 166 is an example of wiring. The circuit forming device 192 is an example of a circuit forming device. The transport device 196 is an example of a transport device. The linear motor 204 and the linear motor 206 are examples of linear motors. The housing 210 is an example of a housing. The process performed by the first forming unit 170 is an example of the first forming process. The process performed by the first transport unit 172 is an example of the first transport process. The process performed by the second transport unit 174 is an example of the second transport process. The process performed by the second forming unit 176 is an example of the second forming process. The process executed by the mounting unit 178 is an example of the mounting process.

It should be noted that the present invention is not limited to the above-described embodiments, and can be carried out in various modes with various changes and improvements based on the knowledge of those skilled in the art. For example, in the above embodiment, the mounting work machine 14 is used as the work area, but a work machine that performs a work different from the mounting work may be used. For example, work including at least one device used for forming a circuit such as a dispenser for discharging a viscous fluid, a printing machine for printing solder, an inspection device, a heating furnace for heating a viscous fluid, solder, etc. A machine may be employed. Further, instead of the work machine, a simple workbench may be adopted as the work area. That is, the stage 32 may be carried out from the

circuit forming devices

12 and 192 into a predetermined space, and an operator may work on the substrate 70 placed on the stage 32 in the space.

Further, in the above embodiment, the stage 32 is transported between one working machine and the

circuit forming devices

12 and 192, but the stage 32 is transported between a plurality of working machines and the

circuit forming devices

12 and 192. May be done. That is, the circuit forming system may be configured by the plurality of working machines and the

circuit forming devices

12 and 192.

12: Circuit forming device 14: Mounting work device (work area) 20: Transfer device 22: First molding unit (wiring forming device) 24: Second molding unit (resin layer forming device) 28: Housing 34: Linear motor 70: Substrate (base) 130: Resin laminate 150: Resin laminate 166: Wiring 192: Circuit forming device 196: Transfer device 204: Linear motor 206: Linear motor 210: Housing 170: 1st forming part (1st forming process) 172 : First transfer section (first transfer step) 174: Second transfer section (second transfer step) 176: Second forming section (second forming step) 178: Mounting section (mounting step)

Claims

A resin layer forming device for forming a resin layer on a base with a curable resin;
A wiring forming device for forming wiring on the base with a metal-containing liquid containing metal fine particles,
A housing containing the resin layer forming device and the wiring forming device;
A circuit forming device, which carries the base inside the housing, extends to the outside of the housing, and carries the base to a work area provided outside the housing.
The carrier is
The said base is conveyed along a predetermined direction inside the said housing, it extends to the exterior of the said housing in the same direction as the said predetermined direction, and the said base is conveyed to the said work area. Circuit forming device.
The carrier is
The said base is conveyed along a predetermined direction inside the said housing, while extending in the direction different from the said predetermined direction to the exterior of the said housing, the said base is conveyed to the said work area. Circuit forming device.
The work area is provided inside a mounting work machine for mounting parts,
The carrier is
4. The circuit forming device according to claim 1, wherein the base is transported inside the housing, extends out of the housing, and transports the base to the inside of the mounting work machine. ..
The circuit forming device according to any one of claims 1 to 4, wherein the transfer device transfers the base using a linear motor as a drive source.
A circuit forming device provided with a resin layer forming device for forming a resin layer on a base with a curable resin and a wiring forming device for forming wiring on the base with a metal-containing liquid containing fine metal particles. A circuit forming method for forming a circuit, comprising:
A first forming step of forming at least one of the resin layer and the wiring by the circuit forming device;
A first transfer step of transferring a base on which at least one of the resin layer and the wiring is formed in the first forming step to a mounting work machine provided outside the circuit forming device by a transfer device;
A mounting step of mounting a component on the base transported in the first transporting step by the mounting work machine;
A second transfer step of transferring the base on which the components are mounted in the mounting step to the circuit forming apparatus by the transfer device;
A second forming step of forming at least one of the resin layer and the wiring by the circuit forming device on the base transferred in the second transferring step.