Classifications

• • A—HUMAN NECESSITIES
  • A43—FOOTWEAR
  • A43B—CHARACTERISTIC FEATURES OF FOOTWEAR; PARTS OF FOOTWEAR
  • A43B7/00—Footwear with health or hygienic arrangements
  • A43B7/14—Footwear with health or hygienic arrangements with foot-supporting parts
  • A43B7/1405—Footwear with health or hygienic arrangements with foot-supporting parts with pads or holes on one or more locations, or having an anatomical or curved form
  • A43B7/1415—Footwear with health or hygienic arrangements with foot-supporting parts with pads or holes on one or more locations, or having an anatomical or curved form characterised by the location under the foot
  • A43B7/142—Footwear with health or hygienic arrangements with foot-supporting parts with pads or holes on one or more locations, or having an anatomical or curved form characterised by the location under the foot situated under the medial arch, i.e. under the navicular or cuneiform bones
• • A—HUMAN NECESSITIES
  • A43—FOOTWEAR
  • A43B—CHARACTERISTIC FEATURES OF FOOTWEAR; PARTS OF FOOTWEAR
  • A43B17/00—Insoles for insertion, e.g. footbeds or inlays, for attachment to the shoe after the upper has been joined
  • A43B17/003—Insoles for insertion, e.g. footbeds or inlays, for attachment to the shoe after the upper has been joined characterised by the material
  • A43B17/006—Insoles for insertion, e.g. footbeds or inlays, for attachment to the shoe after the upper has been joined characterised by the material multilayered
• • A—HUMAN NECESSITIES
  • A43—FOOTWEAR
  • A43B—CHARACTERISTIC FEATURES OF FOOTWEAR; PARTS OF FOOTWEAR
  • A43B7/00—Footwear with health or hygienic arrangements
  • A43B7/02—Footwear with health or hygienic arrangements with heating arrangements 

Definitions

• the present invention relates to an insole for a footwear.
• an insole for correcting foot pronation a biomedical foot support, a foot orthotic, etc.
• Insoles or foot orthotics are used to correct pronated (over pronation) or supinated (under pronation) feet.
• pronated feet When a person has pronated feet, the stresses to the body due to the pronation can lead to injuries in the long term.
• Such insoles are inserted between the feet and footwear to support the arch during walking or running to correct the pronation.
• the insoles may be used to correct flat foot, diabetic foot and other foot disorders.
• the insoles may be used for runners, bikers, and other athletes.
• Footwear may include shoes, slippers, sandals, etc.
• insoles are moldable to assume the shape of the sole of the foot for comfort and precise fit.
• insoles may be flattened and therefore distorted during the molding of the insoles.
• excess pressure is applied to the insoles during the molding process, the insole may be flattened.
• the insoles are distorted, the insoles would not be able to fulfil the purpose of correcting the pronation, thus reducing the effectiveness of the insole.
• insoles that can be molded when heated.
• the insoles can be soaked in boiling water to soften them. While the boiling water method may be the effective for even heat distribution around the insoles, the method does not provide a consistent temperature distribution throughout the insoles. There is also the issue of the temperature of the insoles dropping rapidly once the insoles are removed from the boiling water, even before the molding can happen.
• insoles that can be heated in convection ovens and by heat guns. However, such methods often lead to over heating and denaturing of the material or underheating resulting in inadequate molding and correction.
• an insole for a footwear includes a non-moldable base layer having an arch supporting portion adapted to support an arch of a foot; and a moldable layer overlaying the non-moldable base layer, such that the moldable layer is adapted to be molded to conform to the arch of the foot.
• the moldable layer may be configured to transform between a deformable state to be molded to conform to the arch of the foot and a non-deformable state to cease the molding.
• the moldable layer may have a uniformed thickness throughout its length.
• FIG. 1 shows a sectional view of an exemplary embodiment of an insole for a footwear.
• Fig. 7 shows a top view of an exemplary embodiment of the heating layer having the heating element.
• Fig. 8 shows a top view of an exemplary embodiment of the heating layer.
• FIG. 1 shows a sectional view of an exemplary embodiment of an insole 100 for a footwear.
• Insole 100 has a non-moldable base layer 110 with an arch supporting portion 112 adapted to support an arch of a foot (not shown in Fig. 1) and a moldable layer 130 overlaying the non-moldable base layer 110, such that the moldable layer 130 is adapted to be molded to conform to the arch of the foot.
• Insole 100 may include a covering layer 150 overlaying the moldable layer 130.
• the non-moldable base layer 110 has a heel portion 114 at one end 110A of the non-moldable base layer 110, a toe portion 116 at another end 110B opposite the one end 110A.
• Arch supporting portion 112 may be disposed between the heel portion 114 and the toe portion 116.
• Heel portion 114 may be the portion of the non-moldable base layer 110 that supports the heel of the foot.
• Toe portion 116 may be the portion of the non- moldable base layer 110 that supports the toes of the foot.
• Arch supporting portion 112 may be the portion of the non-moldable base layer 110 that supports the arch of the foot.
• Moldable layer 130 may span across the width of the non-moldable base layer 110. Moldable layer 130 may span the width and length of the heel portion 114 and arch supporting portion 112 of the non-moldable base layer 110. Non- moldable base layer 110 may be a support layer adapted to support the moldable layer 130.
• Fig. 1 shows an example of the insole 100 in an initial profile.
• Initial profile may be the profile before the insole 100 is being molded.
• Initial profile may be the least corrected profile, or a profile of a least molded profile where the foot profile requires minimal or no correction.
• Fig. 2 shows a sectional view of an example of the insole 100 in a molded profile.
• Molded profile may be the profile of the moldable layer 130 when molding has ceased.
• the moldable layer 130 may be molded to substantially the top profile of the non-moldable base layer 110.
• Non-moldable base layer 110 may have a most corrected profile or a profile for the foot that requires maximum correction. It can be appreciated that the moldable layer 130 may be molded to any intermediate profile between the least corrected profile and the most corrected profile.
• Insole 100 may allow the optimal correction of the pronation condition.
• Moldable layer 100 when moldable, may be deformed with the applied pressure by the foot, e.g. when a person stands on the insole 100.
• Moldable layer 130 may mold and wrap onto the arch supporting portion 112 as the foot descends and may conform more towards the non- moldable base layer 110 with more applied pressure.
• the moldable layer 130 may not be molded further if the foot is kept in talar neutral position. In this way, the moldable layer 130 is able to be fit to the foot properly and correction to the foot is optimised.
• the insole 100 mitigates risks of under or over correcting.
• Non-moldable base layer 110 may be in an extreme correction profile, i.e. the apex 112A of the arch supporting portion 112 is highest from its base where the heel portion 114 and the toe portion 116 are connected thereto.
• the extreme molded profile may be formed where the height difference between the centre portion 130C and the proximal portion 130P and/or distal portion 130D of the moldable layer 130 is at its maximum.
• the moldable layer 130 may be pressed to substantially the profile of the non-moldable base layer 110.
• the moldable layer 130 corresponds with the profile of the non- moldable base layer 110. Once molded, the moldable layer 130 may not expand thereafter. It can be appreciated that the moldable layer 130 can be molded to suit a variety of foot profiles, e.g. over or under pronation. In this way, the insole 100 may easily be customised to suit a wide range of pronation conditions, e.g. over-pronation to under-pronation, and be able to biomedically correct the pronation of the foot. Furthermore, the insole 100 may be suitable for varying flat foot conditions, from a rigid flat foot that requires slight arch support to a flexible flat foot that requires high arch support.
• the moldable layer 130 may include a top side 130T that contacts the foot and an underside 130U opposite the top side 130T where the underside 130U may be in contact with and supported by the non-moldable base layer 110.
• the moldable layer 130 may be molded under the weight of the foot where the top side 130T may conform to the foot profile.
• the top side 130T may be pressed towards the non-moldable base layer 110.
• Moldable layer 130 remains in the molded profile and the top side 130T remains in the correcting profile or molded profile.
• Moldable layer 230 may be a moldable foam, e.g. memory foam, that may be molded to the foot profile without the heating layer 260.
• FIG. 3 shows a sectional view an exemplary embodiment of the insole 200 having a heating layer 260 adapted to heat the moldable layer 230.
• Heating layer 260 may be embedded within the moldable layer 230.
• Heating layer 260 may be consistently spaced from the top side 230T of the moldable layer 230 along the length of the moldable layer 230.
• Heating layer 260 may be spaced at an interval from the top side 230T such that the heat from the heating layer 260 would not bum the foot during the molding process.
• Insole 200 may include the covering layer 250 as shown in Fig. 1 to provide further thermal insulation.
• the moldable layer 230 may be transformed from a deformable state to a non- deformable state.
• Moldable layer 230 may be heated to the deformable state so that the moldable layer 230 may conform to the foot profile and cooled to the non-deformable state to prevent further deformation so as to support the arch of the foot.
• Insole 100 may include one or more vents (not shown in Fig. 3) for excess material of the moldable layer 130 to be released during the molding.
• Fig. 4 shows a sectional view of another exemplary embodiment of the insole 300. Similar to the earlier embodiment, the insole 300 has the non-moldable base layer 310 with the arch supporting portion 312 adapted to support an arch of a foot (not shown in Fig.
• Insole 300 may include the covering layer 350 overlaying the moldable layer 330.
• Insole 300 may include at least one of a first cavity 322 and a second cavity 324 between the non-moldable base layer 310 and the moldable layer 330.
• First cavity 322 and the second cavity 324 may be adapted to receive the moldable layer 330 therein.
• First cavity 322 may be disposed under the proximal portion 330P of the moldable layer 330.
• Second cavity 324 may be disposed under the distal portion 330D of the moldable layer 330.
• the moldable layer 330 may have a uniformed thickness throughout its length, e.g. 10mm-15mm, preferably l lmm-14mm, preferably 12mm. Thickness of the moldable layer 330 may vary according to the weight of the user.
• First cavity 322 and the second cavity 324 of the moldable layer 330 may allow displacement of the relevant portions of the moldable layer 330 thereinto.
• the moldable layer 330 When the moldable layer 330 is in the deformable state, as the foot is pressed down onto the insole 300, the distal portion 330D may be pressed or displaced into the second cavity 324 and the proximal portion 330P may be pressed or displaced into the first cavity 322. Centre portion 330C of the moldable layer 330, being supported by the arch supporting portion 312, is not displaced downwards.
• the moldable layer 330 may conform to foot profile.
• Insole 300 may include one or more vents (not shown in Fig.
• First cavity 322 and the second cavity 324 may be disposed within the non-moldable base layer 310.
• Arch supporting portion 312 may include a rearward side 312R facing the heel portion 314 and a forward side 312F facing the toe portion, such that the first cavity 322 may be disposed along the heel portion 314 and the rearward side 312R of the arch supporting portion 312 and the second cavity 324 may be disposed along the forward side 312F of the arch supporting portion 312.
• Moldable layer 330 may be stretchable to accommodate the depression of the moldable layer 330 into the first cavity 322 and/or second cavity 324.
• the moldable layer 330 may include an adhesive side 330A facing the non-moldable base layer 310, such that the moldable layer 330 is adapted to adhere to the non-moldable base layer 310 when the moldable layer 330 is being molded into the at least one of the first cavity 322 and the second cavity 324.
• Underside 330U of the moldable layer 330 may be the adhesive side 330A such that when the moldable layer 330 is wrapped onto the arch supporting portion 312 when it is pressed against the non-moldable base layer 310 during the deformable stage, the underside 330U may be adhered to the non-moldable base layer 310 at the arch supporting portion 312.
• Non-moldable base layer 310 may be coated with a precursor to adhesion to better adhere the moldable layer 330 to the non-moldable base layer 310 during the molding of the moldable layer 330.
• the bottom side 360B of the heating layer 360 i.e. the side facing away from the moldable layer 330, may be part of the adhesive side 330A so that the moldable layer 330 may wrap onto and adhere to the arch supporting portion 312 of the non-moldable base layer 310.
• the heating layer 360 may be displaced into the first cavity 322 and/or the second cavity 324.
• Heating layer 360 may be made from an adhesive material.
• the heating layer 360 may compose of a derivative of EVA, e.g. a sticky EVA, which allows the heating layer 360 to adhere to the moldable layer 330 and the non-moldable base layer 310 thus bonding them together.
• Covering layer 150,250,350 as shown in any one of the embodiments may extend from the one end 210A to the another end 210B of the non-moldable base layer and may span the width of the non-moldable base layer.
• Covering layer 250 may be made from a compression molded EVA foam, blown EVA or similar material. Covering layer 250 may be flexible to conform to the molded profile of the moldable layer 230. Covering layer 250 may be adapted to provide an additional thermal barrier to the foot while molding and may add comfort, durability and aesthetics to the insole 200.
• Fig. 5 shows a top view of the moldable layer 330 in Fig. 4 on the non-moldable base layer 310.
• Moldable layer 330 may be bonded to the non-moldable base layer 310 along the perimeter edge of the moldable layer 330 and the non-moldable base layer 310 forming a bonded border 330B around the perimeter of the moldable layer 330.
• the moldable layer 330 may be bonded to the non-moldable base layer 310 at any area where the moldable layer 330 may not deform or has minimal deformation during the deformable stage, e.g.
• Non-moldable base layer 310 may be bonded to the moldable layer 330 using suitable glue or other glue activation methods commonly used to bond EVA.
• the heating layer 360 may extend from the first end 330F of the moldable layer 330 to the second end 330S opposite the first end 330F. Heating layer 360 may span the width of the moldable layer 330. Heating layer 360 may be disposed at the heel portion (not shown in Fig. 6) and arch supporting portion (not shown in Fig. 6) of the non- moldable base layer 310. Heating layer 360 may extend to the toe portion 316 of the non- moldable base layer 310. Heating layer 360 may cover the area within the border 330B to provide a well distributed heat source throughout the moldable layer 330 so that the moldable layer 330 may be molded evenly.
• FIG. 7 shows a top view of an exemplary embodiment of the heating layer 360 having the heating element 362.
• Heating layer 360 may include a heating element 362 i.e. heated electrically.
• Heating element 362 may be heated chemically, i.e. heating element 362 may be a chemical heating element.
• Heating layer 360 may be connected to an electrical source (not shown in Fig. 7). Electrical source may be turned on to activate the heating layer 360.
• Heating element 362 may extend along the length of the heating layer 360. Heating element 362 may span the width of the heating layer 360.
• the heating element 362 may include a resistance wire. Heating element 362 may weave back and forth longitudinally along the width of the heating layer 360. Referring to Fig.
• Heating element 362 may include other forms, e.g. a heating plate, rods, strips, etc. As the molding process of the insole 300 is relatively fast, the insole 300 is suitable for children who are not able to sit down for long period of time.
• Fig. 8 shows a top view of an exemplary embodiment of the heating layer 360.
• Insole 300 may include a connector 370 connected to the heating layer 360 and disposed at the non- moldable base layer 310 for connecting to a power source (not shown in Fig. 8), e.g. wall power socket, a battery pack.
• Connector 370 may be connected to the input portion 362S and the output portion 362P of the heating element 362.
• Insole 300 may be connectable to the power source.
• the temperature of the heating layer 360 is high enough to burn the user’s foot, the heat is insulated from the user’s foot by the moldable layer 330 and the covering layer (not shown in Fig. 8).
• the temperature experienced by the user may be about 40°C or slightly warmer than the user’s body temperature.
• the insole allows a relatively light pressure to be exerted on the insole to mold the insole and obtain an optimal correcting configuration for the user, unlike conventional insoles which require a heavy pressure to mold the insole. Conventional insoles then to distort under the heavy pressure thus does not provide an optimal correcting configuration.

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• Health & Medical Sciences (AREA)
• Epidemiology (AREA)
• General Health & Medical Sciences (AREA)
• Public Health (AREA)
• Life Sciences & Earth Sciences (AREA)
• Chemical & Material Sciences (AREA)
• Engineering & Computer Science (AREA)
• Materials Engineering (AREA)
• Wood Science & Technology (AREA)
• Footwear And Its Accessory, Manufacturing Method And Apparatuses (AREA)

Priority Applications (8)

Applications Claiming Priority (2)

Publications (1)

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Family Applications (1)

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Citations (4)

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• 2019
  • 2019-11-04 AU AU2019426676A patent/AU2019426676A1/en active Pending
  • 2019-11-04 WO PCT/IB2019/059424 patent/WO2020157549A1/en active Application Filing
  • 2019-11-04 SG SG11202107801XA patent/SG11202107801XA/en unknown
  • 2019-11-04 CN CN201980090400.7A patent/CN113438909B/zh active Active
  • 2019-11-04 CA CA3126892A patent/CA3126892A1/en active Pending

Patent Citations (4)

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