WO2020155885A1 - 覆晶薄膜及显示装置 - Google Patents

覆晶薄膜及显示装置 Download PDF

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Publication number
WO2020155885A1
WO2020155885A1 PCT/CN2019/125170 CN2019125170W WO2020155885A1 WO 2020155885 A1 WO2020155885 A1 WO 2020155885A1 CN 2019125170 W CN2019125170 W CN 2019125170W WO 2020155885 A1 WO2020155885 A1 WO 2020155885A1
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WIPO (PCT)
Prior art keywords
area
chip
film
display panel
display device
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PCT/CN2019/125170
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English (en)
French (fr)
Inventor
王凯文
辛武根
吴小君
乔玄玄
桑艾霞
张强
韩振宇
Original Assignee
京东方科技集团股份有限公司
合肥鑫晟光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 合肥鑫晟光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/959,359 priority Critical patent/US11355425B2/en
Publication of WO2020155885A1 publication Critical patent/WO2020155885A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/562—Protection against mechanical damage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details

Definitions

  • the present disclosure relates to the field of display technology, and in particular to a chip on film and a display device including the chip on film.
  • the outer frame of the system needs to be flush with the edge of the panel.
  • This structure causes the chip-on-chip film to be too close to the outer frame, and the chip-on-chip film is relatively squeezed.
  • the flip chip film will inevitably be subjected to certain forces.
  • the bonding area of the chip on film is in a pulling state. Under the action of long-term tensile stress, the bonding area is easy to pull and peel off, which in turn produces bright lines of COF cracks.
  • the present disclosure provides a chip-on-chip film, including a body and an insulating protective film provided on the body,
  • the body includes a first area, a first binding area and a first bendable area, the first binding area is set to be bound and connected to the back of the display panel, and the first bendable area is located at the Between the first area and the first binding area and capable of being bent in a first direction;
  • the insulation protection film includes a first connection area, a second connection area and a second bendable area.
  • the first connection area is connected to the first area of the body, and the second connection area is arranged to be connected to The back of the display panel and the second bendable area are located between the first connection area and the second connection area and can be bent in a second direction opposite to the first direction.
  • the insulating protective film is made of a flexible insulating material.
  • the flexible insulating material includes PT08B and XPHM15B2-3830.
  • the thickness of the insulation protection film is 0.05 mm to 0.1 mm.
  • the first connection area and the first area are connected by insulating glue.
  • the first bendable area is bent so that the first area and the first binding area form an angle of about 90°.
  • the second bendable area is bent so that the first connection area and the second connection area form an angle of about 90°.
  • the first binding area is directly bonded and connected to the back of the display panel or bonded and connected by insulating glue.
  • the present disclosure also provides a display device including a display panel and the above-mentioned flip chip film.
  • a second binding area and a third connection area are sequentially arranged along the direction from the center of the display panel to the edge of the display panel, and the first binding area of the main body
  • the predetermined area is connected to the second binding area
  • the second connection area of the insulation protection film is connected to the third connection area.
  • the length of the second connection area in the direction from the second binding area to the third connection area is 0.5 mm to 0.8 mm.
  • the display device further includes a main circuit board
  • the chip-on-chip film further includes a third binding area bonded and connected to the main circuit board.
  • the first end of the body includes the first area, the first bendable area, and the first binding area, and the first end of the body is disposed opposite to the first end.
  • the two ends include a third bendable area and the third binding area.
  • the display device further includes a frame, and an outer surface of the frame in a direction perpendicular to the display surface of the display device is flat with an outer surface of the display panel in a direction perpendicular to the display surface of the display device.
  • the display panel includes an array substrate and a color filter substrate, and the array substrate is disposed on the light exit side of the display panel relative to the color filter substrate.
  • FIG. 1 is a schematic diagram of the structure of a display device in the related art
  • FIG. 2 is a schematic diagram of the structure of the bonding area of the flip chip film in the peeling state in the related art
  • FIG. 3 is a schematic diagram of the structure of the flip chip film and the panel after assembly of the embodiment of the present disclosure
  • FIG. 4 is a schematic structural diagram of a display device of an embodiment of the present disclosure.
  • the array substrate 1 is located above the color filter substrate 2, and the outer side of the border 3 is flush with the outer side of the edge of the display panel.
  • the binding area of the film 4 is bonded and connected to the side of the array substrate 1 facing the color filter substrate 2, that is, the chip on film 4 is in a reflexed state.
  • the chip-on-chip film 4 is prone to stress, which makes the bonding area easy to fall off, thereby causing the problem of defective cracks.
  • FIG. 2 shows a state where the chip-on-chip film 4 has cracks due to continuous stress. It can be clearly seen from FIG. 2 that a crack 10 is formed between the array substrate 1 and the flip chip film.
  • the arrows in FIG. 2 indicate the force direction of the chip on film 4.
  • the present disclosure provides a chip-on-chip film and a display device using the chip-on-chip film, which solves the problem that the chip-on-chip film is prone to cracks in the bonding area due to force.
  • the present disclosure provides a chip-on-chip film, including a body and an insulating protective film provided on the body,
  • the body includes a first area, a first binding area and a first bendable area, the first binding area is set to be bound and connected to the back of the display panel, and the first bendable area Located between the first area and the first binding area and capable of being bent in a first direction;
  • the insulation protection film includes a first connection area, a second connection area and a second bendable area, the first connection area is connected to the first area of the body, and the second connection area is provided Connected to the back of the display panel, and the second bendable area is located between the first connection area and the second connection area and can be bent in a second direction opposite to the first direction.
  • the “back surface of the display panel” in the present disclosure refers to the surface of the display panel facing away from the display surface (or light-emitting surface) of the display panel or the surface opposite to the display surface (or light-emitting surface) of the display panel.
  • the chip-on-chip film described in the embodiments of the present disclosure can produce the following beneficial technical effects: by providing an insulating protective film, the body of the chip-on-chip film is protected from falling off due to external forces, thereby preventing or improving the problem of defective cracks.
  • the chip on film includes a main body 41 and an insulating protective film 42 disposed on the main body 41.
  • the body 41 includes a first area 411, a first binding area 413 for binding and connecting to the back of the display panel, and a first binding area 413 located between the first area 411 and the first binding area 413, The first bendable area 412 bent in the first direction.
  • the insulation protection film 42 includes a first connection area 421 attached to or connected to the first area 411 of the body, a second connection area 423 for connecting to the back of the display panel, and a first connection area Between the area 421 and the second connecting area 423, a second bendable area 422 that can be bent in a second direction opposite to the first direction.
  • the first bendable area is bent so that the first area and the first binding area form an angle of about 90°.
  • it may be an angle of 88° to 92°.
  • the second bendable area is bent so that the first connection area and the second connection area form an angle of about 90°.
  • it may be an angle of 88° to 92°.
  • the chip-on-chip film according to the embodiments of the present disclosure has the following beneficial technical effects: due to the addition of an insulating protective film on the chip-on film, the insulating protective film 42 serves The function of protecting the body 41 of the chip on film; the bending directions of the first bendable area 412 and the second bendable area 422 are opposite, so that the insulating protective film 42 and the body 41 form a back-to-back When the chip-on-chip film is squeezed by external force, the insulating protective film 42 will bear this part of the force; for example, when the chip-on-chip film is subjected to a force in the direction indicated by the hollow arrow in FIG.
  • the The force has a tendency to pull and peel off the main body 41, but there is no obvious tendency to pull and peel off the insulating protective film 42, so the insulating protective film 42 protects the main body 41 from being peeled off by external force.
  • the role of. Therefore, the chip on film of the embodiment of the present disclosure has strong operability, and the bonding connection structure of the chip on film in the frameless full-screen product has an obvious effect of preventing or improving the chip on film crack (COF Crack).
  • the insulating protective film 42 is made of a flexible insulating material.
  • the flexible insulating material makes the insulating protective film 42 bendable and insulating, thereby avoiding short circuits on the main body 41.
  • the flexible insulating material includes but is not limited to PT08B and XPHM15B2-3830.
  • XPHM15B2-3830 is a flexible insulating material produced by Dongguan Hanpin Electronics Co., Ltd., which includes a transparent polyester film, a black acrylic adhesive and an isolation film laminated in sequence;
  • PT08B is produced by Kunshan Kairen Company , Black high-gloss PET (polyethylene terephthalate) as the base material, coated with acrylic copolymer, made of black high-gloss PET single-sided tape, with good temperature resistance and excellent mechanical properties And electrical insulation performance.
  • the thickness of the insulating protective film 42 is 0.05 mm to 0.1 mm, but it is not limited thereto.
  • the thickness of the insulation protection film 42 may also be 0.01 mm to 0.5 mm, or even 0.02 mm to 0.08 mm.
  • the thickness of the insulating protective film 42 can be set according to actual needs.
  • the thickness of the insulating protective film 42 should not be too thick, so as not to increase the thickness of the product, but its strength needs to be ensured enough to protect the main body 41.
  • the thickness of the insulating protective film 42 is 0.05 mm.
  • the thickness of the body 41 is 0.05 mm to 0.2 mm, and may even be 0.08 mm to 0.12 mm.
  • the thickness of the body 41 may be 0.1 mm.
  • the first connection area 421 and the first area 411 are connected by insulating glue.
  • the insulating glue further ensures insulation between the main body 41 and the insulating protective film 42.
  • the present disclosure also relates to a display device including a display panel and the above-mentioned chip on film.
  • second bindings are sequentially arranged on the back of the display panel.
  • Fixed area 131 and third connection area 132 the first binding area 413 of the body is bonded and connected to the second binding area 131, and the second connection area 423 of the insulating protective film is connected to the third The connection area 132 is connected.
  • a display device includes a display panel and the above-mentioned chip on film.
  • a second binding area and a third connection area are sequentially arranged on the back of the display panel, and the first binding The area 413 is bound and connected to the second binding area, and the second connection area 423 is connected to the third connection area.
  • the display panel includes an array substrate 1 and a color filter substrate 2.
  • the array substrate 1 is located above the color filter substrate 2, that is, the side of the array substrate 1 away from the color filter substrate 2 is the display of the display panel. Side (or light-emitting side).
  • the second bonding connection area and the third connection area are both disposed on the array substrate 1 and located on the side of the array substrate 1 facing the color filter substrate 2.
  • the insulating protective film 42 plays a role of protecting the body 41 of the chip on film. Moreover, the bending directions of the first bendable area 412 and the second bendable area 422 are opposite, so that the insulating protective film 42 and the body 41 form a back-to-back structure. Therefore, when the chip on film is squeezed by an external force, the insulating protective film 42 will bear this part of the force. For example, when subjected to a force in the direction shown by the hollow arrow in FIG. 3, the force has a tendency to pull and peel off the main body 41, but there is no obvious tendency to pull and peel off the insulating protective film 42, so The insulating protective film 42 plays a role of protecting the main body 41 from falling off by external force.
  • the chip-on-chip film according to the present disclosure has strong operability, and the bonding connection structure of the chip-on-film in a borderless full-screen product has a significant effect of preventing and improving COF cracks.
  • the length a of the second connecting region 423 is 0.1 mm to 1.0 mm, and can be optionally 0.5 mm to 0.8 mm.
  • the second connection area 423 is connected to the third connection area. As shown in FIG. 4, since the side end surface 311 of the frame 3 of the display device is flush with the end surface 111 on the same side of the display panel, in order to avoid interference between the insulating protective film 42 and the frame 3, The second connection area 423 is located between the second binding area and the frame 3 of the display device. That is, in the direction from the center of the display surface of the display panel to the edge of the display surface (or in the third direction), the length of the second connection area 423 cannot be too long. In an optional embodiment of the present disclosure, the length of the second connection area 423 in the third direction is 0.1 mm to 1.0 mm, and optionally 0.5 mm to 0.8 mm. This length range ensures the stability of the connection between the second connection area 423 and the third connection area.
  • the length of the second connection area 423 in the third direction is not limited to the above-mentioned length range. In actual use, the length can be specifically set according to the actual size between the second binding area and the frame 3 of the display device.
  • the display device further includes a main circuit board 6, and the flip chip film further includes a third binding area 414 bonded and connected to the main circuit board 6.
  • the first end of the body 41 includes the first area 411, the first bendable area 412, and the first binding area 413.
  • the second end opposite to the first end includes a third bendable area 415 and the third binding area 414.
  • the display device further includes a frame 3, a light guide plate 5, a back plate 8, a main circuit board 6 (PCB) and a cover plate 7 (PCB cover) And the side end surface 311 of the frame 3 is flush with the end surface 111 on the same side of the display panel. If the side end surface 311 of the frame 3 and the end surface 111 on the same side of the display panel are curved surfaces, the tangent alignment of the top ends of the curved surfaces shall prevail.
  • the technical solution that the outer side surface 311 of the frame 3 is flush with the outer side surface 111 of the display panel achieves a full-screen display effect without the frame 3.
  • the display panel includes an array substrate (TFT substrate) and a color filter substrate (CF substrate), and the array substrate is disposed on the light emitting side or outside of the display panel relative to the color filter substrate.
  • TFT substrate array substrate
  • CF substrate color filter substrate
  • the display device may be any product or component with a display function, such as an LCD TV, a liquid crystal display, a digital photo frame, a mobile phone, a tablet computer, etc.
  • the display device also includes a flexible circuit board, a printed circuit board, and a backplane, which has application value in the currently developed AR (Augmented Reality)/VR (Virtual Reality) fields.

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Abstract

一种覆晶薄膜和显示装置。覆晶薄膜包括本体（41）和设置于本体（41）上的绝缘保护膜片（42），其中，本体（41）包括第一区域（411）、用于绑定连接于显示面板的背面的第一绑定区域（413）和位于第一区域（411）和第一绑定区域（413）之间的且能够沿第一方向弯折的第一可弯折区域（412）；并且绝缘保护膜片（42）包括连接于第一区域（411）的第一连接区域（421）、用于连接于显示面板的背面的第二连接区域（423），以及位于第一连接区域（421）和第二连接区域（423）之间且能够沿与第一方向相反的第二方向弯折的第二可弯折区域（422）。

Description

覆晶薄膜及显示装置
相关申请的交叉参考
本公开主张在2019年1月29日在中国提交的中国专利申请号201920154341.2的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及显示技术领域，具体涉及一种覆晶薄膜以及包含该覆晶薄膜的显示装置。
背景技术
随着时代和科技的发展，高端显示器产品倾向于使用全面屏。要想实现全面屏，则面板(panel)需打破传统的彩膜基板(CF substrate)在上的束缚，而让尺寸更大的阵列基板(TFT substrate)在上。在该全面屏中，覆晶薄膜绑定(COF Bonding)为反折状态。
为了保证全面屏的外周边无边框的效果，系统的外框需与面板边缘齐平。该结构导致覆晶薄膜与外框距离过近，覆晶薄膜受挤压力相对大。尤其是在产品运输过程中，覆晶薄膜难免会受到一定力的作用。当覆晶薄膜受力时，覆晶薄膜的绑定区(Bonding area)处于拉扯状态。在长期拉应力的作用下，绑定区易拉扯出现脱落(peel off)，进而产生覆晶薄膜裂缝(COF Crack)亮线。
发明内容
一方面，本公开提供一种覆晶薄膜，包括本体和设置于所述本体上的绝缘保护膜片，
其中，所述本体包括第一区域、第一绑定区域和第一可弯折区域，所述第一绑定区域被设置绑定连接于显示面板的背面，以及第一可弯折区域位于所述第一区域和所述第一绑定区域之间并且能够沿第一方向弯折；
所述绝缘保护膜片包括第一连接区域、第二连接区域和第二可弯折区域， 所述第一连接区域连接于所述本体的第一区域，所述第二连接区域被设置连接于显示面板的背面，以及第二可弯折区域位于所述第一连接区域和第二连接区域之间并且能够沿与所述第一方向相反的第二方向弯折。
可选地，所述绝缘保护膜片由柔性绝缘材料制成。
可选地，所述柔性绝缘材料包括PT08B和XPHM15B2-3830。
可选地，所述绝缘保护膜片的厚度为0.05mm～0.1mm。
可选地，所述第一连接区域与所述第一区域之间采用绝缘胶连接。
可选地，使第一可弯折区域弯折为所述第一区域与所述第一绑定区域呈约90°夹角。
可选地，使第二可弯折区域弯折为所述第一连接区域与所述第二连接区域呈约90°夹角。
可选地，所述第一绑定区域与所述显示面板背面直接绑定连接或通过绝缘胶绑定连接。
另一方面，本公开还提供一种显示装置，包括显示面板以及上述的覆晶薄膜。
可选地，在所述显示面板的背面上，沿所述显示面板的中心到所述显示面板的边缘的方向依次设置有第二绑定区域和第三连接区域，所述本体的第一绑定区域与所述第二绑定区域连接，所述绝缘保护膜片的第二连接区域与所述第三连接区域连接。
可选地，所述第二连接区域在从第二绑定区域至第三连接区域的方向上的长度为0.5mm～0.8mm。
可选地，所述显示装置还包括主电路板，并且所述覆晶薄膜还包括与所述主电路板绑定连接的第三绑定区域。
可选地，所述本体的第一端包括所述第一区域、所述第一可弯折区域和所述第一绑定区域，并且所述本体的与所述第一端相对设置的第二端包括第三可弯折区域和所述第三绑定区域。
可选地，所述显示装置还包括边框，并且所述边框在垂直于显示装置的显示面的方向上的外侧面与所述显示面板在垂直于显示装置的显示面的方向 上的外侧面平齐。
可选地，所述显示面板包括阵列基板和彩膜基板，并且所述阵列基板相对于彩膜基板被设置在所述显示面板的出光侧。
附图说明
图1是相关技术中显示装置的结构示意图；
图2是相关技术中覆晶薄膜的绑定区脱落状态的结构示意图；
图3是本公开的实施例的覆晶薄膜与面板组装后的结构示意图；
图4是本公开实施例的显示装置的结构示意图。
具体实施方式
为使本公开的实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例的附图，对本公开实施例的技术方案进行清楚且完整地描述。显然地，所描述的实施例是本公开的一部分实施例，而不是全部的实施例。基于所描述的本公开的实施例，本领域普通技术人员所获得的所有其他实施例，都属于本公开保护的范围。
如图1和图2所示的，在相关的无边框全面屏的产品中，阵列基板1位于彩膜基板2的上方，边框3的外侧面与显示面板的边缘的外侧面平齐，覆晶薄膜4的绑定区绑定连接于阵列基板1朝向彩膜基板2的一侧，即覆晶薄膜4处于反折状态。在该相关产品中，覆晶薄膜4容易受力而使得其绑定区容易脱落，由此产生裂缝不良的问题。图2显示了覆晶薄膜4由于持续受力而产生裂缝不良的状态。由图2可以明显地看出：阵列基板1和覆晶薄膜之间形成了裂缝10。图2中的箭头表示覆晶薄膜4的受力方向。
为了解决上述技术问题，本公开提供一种覆晶薄膜以及使用该覆晶薄膜的显示装置，其解决了覆晶薄膜容易因受力作用而使得绑定区出现裂缝不良的问题。
一方面，本公开提供了一种覆晶薄膜，包括本体和设置于所述本体上的绝缘保护膜片，
其中，所述本体包括第一区域、第一绑定区域和第一可弯折区域，所述 第一绑定区域被设置绑定连接于显示面板的背面，以及所述第一可弯折区域位于所述第一区域和所述第一绑定区域之间并且能够沿第一方向弯折；
其中，所述绝缘保护膜片包括第一连接区域、第二连接区域和第二可弯折区域，所述第一连接区域连接于所述本体的第一区域，所述第二连接区域被设置连接于显示面板的背面，以及所述第二可弯折区域位于所述第一连接区域和第二连接区域之间并且能够沿与所述第一方向相反的第二方向弯折。
在本公开中所述的“显示面板的背面”是指显示面板的背离该显示面板的显示面(或出光面)的表面、或者与该显示面板的显示面(或出光面)相对的表面。
本公开实施例所述的覆晶薄膜可以产生如下有益的技术效果：通过设置绝缘保护膜片，保护覆晶薄膜本体不受外力作用而脱落，由此预防或改善了裂缝不良的问题。
具体地，如图3所示的，所述覆晶薄膜包括本体41和设置于所述本体41上的绝缘保护膜片42。所述本体41包括第一区域411、用于绑定连接于显示面板的背面的第一绑定区域413和位于所述第一区域411和所述第一绑定区域413之间的、能够沿第一方向弯折的第一可弯折区域412。所述绝缘保护膜片42包括贴合或连接于所述本体的第一区域411的第一连接区域421、用于连接于显示面板的背面的第二连接区域423，以及位于所述第一连接区域421和第二连接区域423之间、能够沿与所述第一方向相反的第二方向弯折的第二可弯折区域422。
可选地，使第一可弯折区域弯折为所述第一区域与所述第一绑定区域呈约90°夹角。例如，可以为88°至92°的夹角。
可选地，使第二可弯折区域弯折为所述第一连接区域与所述第二连接区域呈约90°夹角。例如，可以为88°至92°的夹角。
与相关技术中的覆晶薄膜相比，根据本公开实施例的覆晶薄膜产生了如下有益的技术效果：由于在覆晶薄膜上增设了绝缘保护膜片，所述绝缘保护膜片42起到保护覆晶薄膜的本体41的作用；所述第一可弯折区域412和所述第二可弯折区域422的弯折方向相反，使得所述绝缘保护膜片42和所述本体41形成背靠背的结构形式，由此外力挤压覆晶薄膜时，所述绝缘保护膜片 42会承担此部分受力；例如，在覆晶薄膜受到图3中的空心箭头所示方向的作用力时，该作用力对所述本体41有拉扯剥离的趋势，但是对所述绝缘保护膜片42没有明显的拉扯剥离的趋势，所以所述绝缘保护膜片42起到保护所述本体41不受外力而脱落的作用。因此，本公开实施例的覆晶薄膜的可操作性强，针对无边框全面屏的产品中覆晶薄膜绑定连接结构有明显地预防或改善覆晶薄膜裂纹(COF Crack)的效果。
在本公开的可选实施例中，所述绝缘保护膜片42采用柔性绝缘材料制成。柔性绝缘材料使得所述绝缘保护膜片42可弯曲且绝缘，由此避免造成所述本体41上的线路短路。
在本公开的可选实施例中，所述柔性绝缘材料包括但不限于PT08B和XPHM15B2-3830。需要说明的是，XPHM15B2-3830为东莞市汉品电子有限公司生产的柔性绝缘材料，其包括依次层叠设置的透明聚酯薄膜、黑色丙烯酸粘合剂和隔离膜；PT08B是昆山凯仁公司生产的，以黑色高亮PET(聚对苯二甲酸乙二醇酯)为基材，涂布丙烯酸系共聚物制作而成的黑色高亮PET单面胶带，具有良好的耐温性能、优异的机械性能和电气绝缘性能。
在本公开的可选实施例中，所述绝缘保护膜片42的厚度为0.05mm～0.1mm，但并不以此为限。例如，所述绝缘保护膜片42的厚度还可选为0.01mm～0.5mm，甚至可以为0.02mm～0.08mm。所述绝缘保护膜片42的厚度可根据实际需要设定。所述绝缘保护膜片42的厚度不能太厚，以免增加产品的厚度，但是需要保证其强度以足以起到保护所述本体41的作用。在本公开的可选实施例中，所述绝缘保护膜片42的厚度为0.05mm。
在本公开的可选实施例中，所述本体41的厚度为0.05mm～0.2mm，甚至可以为0.08mm～0.12mm。例如，所述本体41的厚度可以为0.1mm。
在本公开的可选实施例中，所述第一连接区域421与所述第一区域411之间采用绝缘胶连接。所述绝缘胶进一步保证所述本体41和所述绝缘保护膜片42之间绝缘。
另一方面，本公开还涉及一种显示装置，包括显示面板和上述的覆晶薄膜。
在本公开的可选实施例中，如图3所示的，沿所述显示面板的显示面中 心到所述显示面的边缘的方向，在所述显示面板的背面上依次设置有第二绑定区域131和第三连接区域132，所述本体的第一绑定区域413与所述第二绑定区域131绑定连接，所述绝缘保护膜片的第二连接区域423与所述第三连接区域132连接。
具体地，如图4所示的，根据本公开实施例的显示装置包括显示面板以及上述的覆晶薄膜。
可选地，沿所述显示面板的显示面中心到所述显示面边缘的方向，在所述显示面板的背面上依次设置有第二绑定区域和第三连接区域，所述第一绑定区域413与所述第二绑定区域绑定连接，所述第二连接区域423与所述第三连接区域连接。
所述显示面板包括阵列基板1和彩膜基板2，所述阵列基板1位于所述彩膜基板2的上方，即所述阵列基板1远离所述彩膜基板2的一侧为显示面板的显示侧(或出光侧)。所述第二绑定连接区域和所述第三连接区域均设置于所述阵列基板1上，且位于所述阵列基板1朝向所述彩膜基板2的一侧。
所述绝缘保护膜片42起到保护覆晶薄膜的本体41的作用。而且，所述第一可弯折区域412和所述第二可弯折区域422的弯折方向相反，使得所述绝缘保护膜片42和所述本体41形成背靠背的结构形式。因此，在外力挤压覆晶薄膜时，所述绝缘保护膜片42会承担此部分受力。例如，在受到图3中的空心箭头所示方向的作用力时，该作用力对所述本体41有拉扯剥离的趋势，但是对所述绝缘保护膜片42没有明显的拉扯剥离的趋势，所以所述绝缘保护膜片42起到保护所述本体41不受外力而脱落的作用。根据本公开的覆晶薄膜的可操作性强，针对无边框全面屏的产品中覆晶薄膜绑定连接结构有明显预防改善覆晶薄膜裂纹(COF Crack)的效果。
在本公开的可选实施例中，如图3所示的，在从第二绑定区域至第三连接区域的方向(以下称为第三方向，如图3中实心箭头所示的方向)上，所述第二连接区域423的长度a为0.1mm～1.0mm，可选为0.5mm～0.8mm。
所述第二连接区域423连接于所述第三连接区域。如图4所示的，由于所述显示装置的边框3的的侧端面311与所述显示面板的同一侧的端面111平齐，为了避免所述绝缘保护膜片42与边框3产生干涉，所述第二连接区域 423位于所述第二绑定区域和所述显示装置的边框3之间。即，在沿所述显示面板的显示面中心到所述显示面的边缘的方向(或者在第三方向)上，所述第二连接区域423的长度不能过长。在本公开的可选实施例中，所述第二连接区域423在所述第三方向上的长度为0.1mm～1.0mm，可选为0.5mm～0.8mm。该长度范围保证了所述第二连接区域423与所述第三连接区域之间的连接稳定性。
需要说明的是，所述第二连接区域423在所述第三方向上的长度并不限于上述长度范围。在实际使用中，可根据所述第二绑定区域和所述显示装置的边框3之间实际大小具体设定所述长度。
在本公开的可选实施例中，所述显示装置还包括主电路板6，并且所述覆晶薄膜还包括与所述主电路板6绑定连接的第三绑定区域414。
如图3和4所示的，所述本体41的第一端包括所述第一区域411、所述第一可弯折区域412和所述第一绑定区域413，所述本体41的与所述第一端相对设置的第二端包括第三可弯折区域415和所述第三绑定区域414。
在本公开的可选实施例中，如图4所示的，所述显示装置还包括边框3、导光板5、背板8、主电路板6(PCB)及其盖板7(PCB cover)，并且所述边框3的侧端面311与所述显示面板的同一侧的端面111平齐。如果边框3的侧端面311和显示面板的同一侧的端面111为曲面时，则以各曲面的顶端切线对齐为准。所述边框3外侧面311与所述显示面板的外侧面111平齐的技术方案实现了无边框3全面屏的显示效果。进一步地，所述显示面板包括阵列基板(TFT基板)和彩膜基板(CF基板)，并且所述阵列基板相对于彩膜基板被设置在所述显示面板的出光侧或外侧。
所述显示装置可选为：液晶电视、液晶显示器、数码相框、手机、平板电脑等任何具有显示功能的产品或部件。所述显示装置还包括柔性电路板、印刷电路板和背板，其在目前开发的AR(增强现实，Augmented Reality)/VR(虚拟实境，Virtual Reality)等领域具有应用价值。
以上所述为本公开的可选实施例。需要说明的是，对于本领域普通技术人员来说，在不脱离本公开所述原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本公开保护范围。

Claims (15)

  1. 一种覆晶薄膜，包括本体和设置于所述本体上的绝缘保护膜片，
    其中，所述本体包括第一区域、第一绑定区域和第一可弯折区域，所述第一绑定区域被设置绑定连接于显示面板的背面，以及所述第一可弯折区域位于所述第一区域和所述第一绑定区域之间的并且能够沿第一方向弯折；
    其中，所述绝缘保护膜片包括第一连接区域、第二连接区域以及第二可弯折区域，所述第一连接区域连接于所述本体的第一区域，所述第二连接区域被设置连接于显示面板的背面，以及第二可弯折区域位于所述第一连接区域和第二连接区域之间并且能够沿与所述第一方向相反的第二方向弯折。
  2. 根据权利要求1所述的覆晶薄膜，其中，所述绝缘保护膜片由柔性绝缘材料制成。
  3. 根据权利要求2所述的覆晶薄膜，其中，所述柔性绝缘材料包括PT08B和XPHM15B2-3830。
  4. 根据权利要求1所述的覆晶薄膜，其中，所述绝缘保护膜片的厚度为0.05mm～0.1mm。
  5. 根据权利要求1所述的覆晶薄膜，其中，所述第一连接区域与所述第一区域之间采用绝缘胶连接。
  6. 根据权利要求1所述的覆晶薄膜，其中，使第一可弯折区域弯折为所述第一区域与所述第一绑定区域呈约90°夹角。
  7. 根据权利要求1所述的覆晶薄膜，其中，使第二可弯折区域弯折为所述第一连接区域与所述第二连接区域呈约90°夹角。
  8. 根据权利要求1所述的覆晶薄膜，其中，所述第一绑定区域与所述显示面板的背面直接绑定连接或通过绝缘胶绑定连接。
  9. 一种显示装置，包括显示面板以及权利要求1-8任一项所述的覆晶薄膜。
  10. 根据权利要求9所述的显示装置，其中，在所述显示面板的背面上，沿所述显示面板的中心到所述显示面板的边缘的方向依次设置有第二绑定区域和第三连接区域，所述本体的第一绑定区域与所述第二绑定区域连接，所 述绝缘保护膜片的第二连接区域与所述第三连接区域连接。
  11. 根据权利要求10所述的显示装置，其中，所述第二连接区域在从第二绑定区域至第三连接区域的方向上的长度为0.5mm～0.8mm。
  12. 根据权利要求9-11中任一项所述的显示装置，其中，所述显示装置还包括主电路板，并且所述覆晶薄膜还包括与所述主电路板绑定连接的第三绑定区域。
  13. 根据权利要求9-12中任一项所述的显示装置，其中，所述本体的第一端包括所述第一区域、所述第一可弯折区域和所述第一绑定区域，并且所述本体的与所述第一端相对设置的第二端包括第三可弯折区域和所述第三绑定区域。
  14. 根据权利要求9-13中任一项所述的显示装置，其中，所述显示装置还包括边框，并且所述边框在垂直于显示装置的显示面的方向上的外侧面与所述显示面板在垂直于显示装置的显示面的方向上的外侧面平齐。
  15. 根据权利要求9-14中任一项所述的显示装置，其中，所述显示面板包括阵列基板和彩膜基板，并且所述阵列基板相对于彩膜基板被设置在所述显示面板的出光侧。
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