WO2020155551A1 - Copper detergent - Google Patents

Copper detergent Download PDF

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Publication number
WO2020155551A1
WO2020155551A1 PCT/CN2019/094141 CN2019094141W WO2020155551A1 WO 2020155551 A1 WO2020155551 A1 WO 2020155551A1 CN 2019094141 W CN2019094141 W CN 2019094141W WO 2020155551 A1 WO2020155551 A1 WO 2020155551A1
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Prior art keywords
weight
parts
cleaning agent
copper cleaning
copper
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PCT/CN2019/094141
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French (fr)
Chinese (zh)
Inventor
李金城
吴豪旭
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深圳市华星光电技术有限公司
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Publication of WO2020155551A1 publication Critical patent/WO2020155551A1/en

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/14—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions
    • C23G1/16—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions using inhibitors
    • C23G1/18—Organic inhibitors
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/14—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions
    • C23G1/20—Other heavy metals

Definitions

  • the invention relates to a copper cleaning agent, in particular to a copper cleaning agent capable of removing polymer composite products.
  • the object of the present invention is to provide a copper cleaning agent, which can remove copper, combined with photoresist and dry etching gas to form a composite product, and achieve the purpose of improving product yield.
  • the present invention provides a copper cleaning agent based on 100 parts by weight of the copper cleaning agent, comprising: 40 to 65 parts by weight of deionized water; 25 to 35 parts by weight of acetone glycidol; 0.001 ⁇ 2 parts by weight of surfactant; and 0.01 ⁇ 2 parts by weight of corrosion inhibitor.
  • the copper cleaning agent has a pH value of 8-10.
  • the surfactant includes an amide compound
  • the amide compound includes but is not limited to at least one of the following: glycolamide, monoethanolamide, and polyoxyethylene alkanolamide.
  • the surfactant includes a quaternary ammonium salt compound
  • the quaternary ammonium salt compound includes but is not limited to at least one of the following: benzyltriethylammonium chloride, butanetetrayl hydrogen sulfate Ammonium, dodecyl trimethyl ammonium chloride, dodecyl dimethyl benzyl ammonium chloride, octadecyl dimethyl hydroxyethyl ammonium sulfate, and octadecyl dimethyl hydroxy ethyl Ammonium perchlorate.
  • the corrosion inhibitor includes an azole compound
  • the azole compound includes but is not limited to at least one of the following: benzotriazole, 1H-imidazole, 1H-tetrazole, 5- Phenyl-1H-tetrazole, 5-amino-1H-tetrazole, 3-amino-1H-triazole, and 5-carboxybenzotriazole.
  • the copper cleaning agent based on 100 parts by weight of the copper cleaning agent, includes: 60 ⁇ 65 parts by weight of deionized water; 28 ⁇ 32.5 parts by weight of acetone glycidol; 0.5 ⁇ 1.5 parts by weight surface active agent; and 0.5 to 1 parts by weight corrosion inhibitor.
  • the copper cleaning agent based on 100 parts by weight of the copper cleaning agent, includes: 65 parts by weight of deionized water; 32.5 parts by weight of acetone glycidol; and 1.5 parts by weight of surfactant ; And 1 part by weight of corrosion inhibitor.
  • the copper cleaning agent provided by the present invention can remove copper, combined with photoresist and dry etching gas to form a composite product, and achieve the purpose of improving product yield.
  • the invention provides a copper cleaning agent, which can remove copper and combine with photoresist and dry etching gas to form a composite product, thereby achieving the purpose of improving product yield.
  • the copper cleaning agent of the present invention uses neutral solvents such as acetone glycidol and deionized water as main solvents, and adds certain amine and salt corrosion inhibitors to remove polymer composite products.
  • the copper cleaning of the present invention may include: 40 ⁇ 65 parts by weight of deionized water; 25 ⁇ 35 parts by weight Acetone glycidol; 0.001 ⁇ 2 parts by weight of surfactant; and 0.01 ⁇ 2 parts by weight of corrosion inhibitor; preferably including: 60 ⁇ 65 parts by weight of deionized water; 28 ⁇ 32.5 parts by weight of acetone glycidol; 0.5 ⁇ 1.5 parts by weight of surfactant; and 0.5 to 1 part by weight of corrosion inhibitor; more preferably including: 65 parts by weight of deionized water; 32.5 parts by weight of acetone glycidol; 1.5 parts by weight of surfactant; and 1 part by weight of corrosion inhibitor Agent.
  • the pH value of the copper cleaning agent may be 8-10.
  • the surfactant may include an amide compound, and the amide compound includes but is not limited to at least one of the following: glycolamide, monoethanolamide, and polyoxyethylene alkanolamide .
  • the surfactant includes a quaternary ammonium salt compound
  • the quaternary ammonium salt compound may include, but is not limited to, at least one of the following: benzyltriethylammonium chloride, tetrabutylammonium hydrogen sulfate Base ammonium, dodecyl trimethyl ammonium chloride, dodecyl dimethyl benzyl ammonium chloride, octadecyl dimethyl hydroxyethyl ammonium sulfate, and octadecyl dimethyl hydroxy ethyl Base ammonium perchlorate.
  • the corrosion inhibitor shields the metal ions generated after etching and reduces the corrosion to the copper surface.
  • the corrosion inhibitor may include an azole compound, and the azole compound includes but is not limited to at least one of the following: benzotriazole, 1H-imidazole, 1H-tetrazole, 5 -Phenyl-1H-tetrazole, 5-amino-1H-tetrazole, 3-amino-1H-triazole, and 5-carboxybenzotriazole.
  • the present invention provides a copper cleaning agent, which can remove copper combined with photoresist and dry etching gas to form a composite product, thereby achieving the purpose of improving product yield.

Abstract

Disclosed is a copper detergent, comprising, based on 100 parts by weight, 40-65 parts by weight of deionized water, 25-35 parts by weight of solketal, 0.001-2 parts by weight of a surfactant, and 0.01-2 parts by weight of a corrosion inhibitor.

Description

铜清洗剂Copper cleaning agent 技术领域Technical field
本发明涉及一种铜清洗剂，尤其涉及一种可去除高分子复合产物的铜清洗剂。The invention relates to a copper cleaning agent, in particular to a copper cleaning agent capable of removing polymer composite products.
背景技术Background technique
既有大尺寸TFT-LCD显示器普遍应用铜制程工艺，当前在4道光罩技术中，背沟道蚀刻时，易受到一些铜、光阻及干蚀刻气体结合生成的高分子副产物影响，导致金属表面变色或电性偏移。一般清洗制程，使用超纯水或去离子水，对于高分子副产物去除能力有限。目前，有应用光阻剥离剂进行清洗，但无法根本解决金属表面污染问题。Existing large-size TFT-LCD displays generally use copper process technology. In the current 4-pass photomask technology, the back channel etching is susceptible to some by-products of copper, photoresist, and dry etching gas. Surface discoloration or electrical deviation. Generally, the cleaning process uses ultrapure water or deionized water, which has limited removal capacity for polymer by-products. Currently, photoresist strippers are used for cleaning, but they cannot completely solve the problem of metal surface contamination.
为了解决现有技术所存在的问题，亟需一种铜清洗剂，可去除铜与光阻及干蚀刻气体结合生成复合产物，以提升产品良率。In order to solve the problems existing in the prior art, there is an urgent need for a copper cleaning agent that can remove copper and combine with photoresist and dry etching gas to form a composite product to improve product yield.
技术问题technical problem
基于上述，本发明的目的在于提供了一种铜清洗剂，可去除铜与光阻及干蚀刻气体结合生成复合产物，达到提升产品良率的目的。Based on the above, the object of the present invention is to provide a copper cleaning agent, which can remove copper, combined with photoresist and dry etching gas to form a composite product, and achieve the purpose of improving product yield.
技术解决方案Technical solutions
为了实现上述目的，本发明提供一种铜清洗剂，以所述铜清洗剂为100重量份为基础，包括：40~65重量份的去离子水；25~35重量份的丙酮缩甘油；0.001~2重量份的表面活性剂；以及0.01~2重量份的缓蚀剂。In order to achieve the above objective, the present invention provides a copper cleaning agent based on 100 parts by weight of the copper cleaning agent, comprising: 40 to 65 parts by weight of deionized water; 25 to 35 parts by weight of acetone glycidol; 0.001 ~2 parts by weight of surfactant; and 0.01~2 parts by weight of corrosion inhibitor.
依据本发明的一实施例，所述的铜清洗剂，其pH值为8~10。According to an embodiment of the present invention, the copper cleaning agent has a pH value of 8-10.
依据本发明的一实施例，所述表面活性剂包括一酰胺类化合物，所述酰胺类化合物包括但不限于下列至少一者：乙二醇酰胺、单乙醇酰胺、以及聚氧乙烯烷醇酰胺。According to an embodiment of the present invention, the surfactant includes an amide compound, and the amide compound includes but is not limited to at least one of the following: glycolamide, monoethanolamide, and polyoxyethylene alkanolamide.
依据本发明的一实施例，所述表面活性剂包括一季铵盐类化合物，所述季铵盐类化合物包括但不限于下列至少一者：氯化苄基三乙基铵、硫酸氢丁四基铵、十二烷基三甲基氯化铵、十二烷基二甲基苄基氯化铵、十八烷基二甲基羟乙基硫酸铵、以及十八烷基二甲基羟乙基过氯酸铵。According to an embodiment of the present invention, the surfactant includes a quaternary ammonium salt compound, and the quaternary ammonium salt compound includes but is not limited to at least one of the following: benzyltriethylammonium chloride, butanetetrayl hydrogen sulfate Ammonium, dodecyl trimethyl ammonium chloride, dodecyl dimethyl benzyl ammonium chloride, octadecyl dimethyl hydroxyethyl ammonium sulfate, and octadecyl dimethyl hydroxy ethyl Ammonium perchlorate.
依据本发明的一实施例，所述缓蚀剂包括一唑类化合物，所述唑类化合物包括但不限于下列至少一者：苯并三氮唑、1H-咪唑、1H-四唑、5-苯基-1H-四唑、5-氨基-1H-四唑、3-氨基-1H-三唑、以及5-羧基苯并三氮唑。According to an embodiment of the present invention, the corrosion inhibitor includes an azole compound, and the azole compound includes but is not limited to at least one of the following: benzotriazole, 1H-imidazole, 1H-tetrazole, 5- Phenyl-1H-tetrazole, 5-amino-1H-tetrazole, 3-amino-1H-triazole, and 5-carboxybenzotriazole.
依据本发明的一实施例，以所述铜清洗剂为100重量份为基础，所述铜清洗剂包括：60~65重量份的去离子水；28~32.5重量份的丙酮缩甘油；0.5~1.5重量份表面活性剂；以及0.5~1重量份缓蚀剂。According to an embodiment of the present invention, based on 100 parts by weight of the copper cleaning agent, the copper cleaning agent includes: 60~65 parts by weight of deionized water; 28~32.5 parts by weight of acetone glycidol; 0.5~ 1.5 parts by weight surface active agent; and 0.5 to 1 parts by weight corrosion inhibitor.
依据本发明的一实施例，以所述铜清洗剂为100重量份为基础，所述铜清洗剂包括：65重量份的去离子水；32.5重量份的丙酮缩甘油；1.5重量份表面活性剂；以及1重量份缓蚀剂。According to an embodiment of the present invention, based on 100 parts by weight of the copper cleaning agent, the copper cleaning agent includes: 65 parts by weight of deionized water; 32.5 parts by weight of acetone glycidol; and 1.5 parts by weight of surfactant ; And 1 part by weight of corrosion inhibitor.
有益效果Beneficial effect
本发明所提供的铜清洗剂，可去除铜与光阻及干蚀刻气体结合生成复合产物，达到提升产品良率的目的。The copper cleaning agent provided by the present invention can remove copper, combined with photoresist and dry etching gas to form a composite product, and achieve the purpose of improving product yield.
附图说明Description of the drawings
无。no.
本发明的最佳实施方式The best mode of the invention
在本文中提及“实施例”意味着，结合实施例描述的特定特征、结构或特性可以包含在本发明的至少一个实施例中。在说明书中的各个位置出现该短语并不一定均是指相同的实施例，也不是与其它实施例互斥的独立的或备选的实施例。本领域技术人员显式地和隐式地理解的是，本文所描述的实施例可以与其它实施例相结合。The reference to "embodiment" herein means that a specific feature, structure or characteristic described in conjunction with the embodiment may be included in at least one embodiment of the present invention. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art clearly and implicitly understand that the embodiments described herein can be combined with other embodiments.
本发明提供了一种铜清洗剂，可去除铜与光阻及干蚀刻气体结合生成复合产物，达到提升产品良率的目的。The invention provides a copper cleaning agent, which can remove copper and combine with photoresist and dry etching gas to form a composite product, thereby achieving the purpose of improving product yield.
本发明之铜清洗剂，以中性溶剂丙酮缩甘油及去离子水为主要溶剂，添加一定胺类及盐类腐蚀抑制剂，用以去除高分子复合产物。The copper cleaning agent of the present invention uses neutral solvents such as acetone glycidol and deionized water as main solvents, and adds certain amine and salt corrosion inhibitors to remove polymer composite products.
具体而言，在本发明的实施例中，本发明之铜清洗，以所述铜清洗剂为100重量份为基础，可包括：40~65重量份的去离子水；25~35重量份的丙酮缩甘油；0.001~2重量份的表面活性剂；以及0.01~2重量份的缓蚀剂；优选包括：60~65重量份的去离子水；28~32.5重量份的丙酮缩甘油；0.5~1.5重量份表面活性剂；以及0.5~1重量份缓蚀剂；更优选包括：65重量份的去离子水；32.5重量份的丙酮缩甘油；1.5重量份表面活性剂；以及1重量份缓蚀剂。Specifically, in the embodiment of the present invention, the copper cleaning of the present invention, based on 100 parts by weight of the copper cleaning agent, may include: 40~65 parts by weight of deionized water; 25~35 parts by weight Acetone glycidol; 0.001~2 parts by weight of surfactant; and 0.01~2 parts by weight of corrosion inhibitor; preferably including: 60~65 parts by weight of deionized water; 28~32.5 parts by weight of acetone glycidol; 0.5~ 1.5 parts by weight of surfactant; and 0.5 to 1 part by weight of corrosion inhibitor; more preferably including: 65 parts by weight of deionized water; 32.5 parts by weight of acetone glycidol; 1.5 parts by weight of surfactant; and 1 part by weight of corrosion inhibitor Agent.
依据本发明的一实施例，所述的铜清洗剂的pH值可为8~10。According to an embodiment of the present invention, the pH value of the copper cleaning agent may be 8-10.
在本发明中，优良的表面活性剂可以有效提高表面活性。依据本发明的一实施例，所述表面活性剂可包括一酰胺类化合物，所述酰胺类化合物包括但不限于下列至少一者：乙二醇酰胺、单乙醇酰胺、以及聚氧乙烯烷醇酰胺。In the present invention, an excellent surfactant can effectively increase the surface activity. According to an embodiment of the present invention, the surfactant may include an amide compound, and the amide compound includes but is not limited to at least one of the following: glycolamide, monoethanolamide, and polyoxyethylene alkanolamide .
依据本发明的一实施例，所述表面活性剂包括一季铵盐类化合物，所述季铵盐类化合物可包括但不限于下列至少一者：氯化苄基三乙基铵、硫酸氢丁四基铵、十二烷基三甲基氯化铵、十二烷基二甲基苄基氯化铵、十八烷基二甲基羟乙基硫酸铵、以及十八烷基二甲基羟乙基过氯酸铵。According to an embodiment of the present invention, the surfactant includes a quaternary ammonium salt compound, and the quaternary ammonium salt compound may include, but is not limited to, at least one of the following: benzyltriethylammonium chloride, tetrabutylammonium hydrogen sulfate Base ammonium, dodecyl trimethyl ammonium chloride, dodecyl dimethyl benzyl ammonium chloride, octadecyl dimethyl hydroxyethyl ammonium sulfate, and octadecyl dimethyl hydroxy ethyl Base ammonium perchlorate.
在本发明中，所述的缓蚀剂屏蔽了蚀刻后产生的金属离子，减少对铜表面的侵蚀。依据本发明的一实施例，所述缓蚀剂可包括一唑类化合物，所述唑类化合物包括但不限于下列至少一者：苯并三氮唑、1H-咪唑、1H-四唑、5-苯基-1H-四唑、5-氨基-1H-四唑、3-氨基-1H-三唑、以及5-羧基苯并三氮唑。In the present invention, the corrosion inhibitor shields the metal ions generated after etching and reduces the corrosion to the copper surface. According to an embodiment of the present invention, the corrosion inhibitor may include an azole compound, and the azole compound includes but is not limited to at least one of the following: benzotriazole, 1H-imidazole, 1H-tetrazole, 5 -Phenyl-1H-tetrazole, 5-amino-1H-tetrazole, 3-amino-1H-triazole, and 5-carboxybenzotriazole.
据此，本发明提供了一种铜清洗剂，可去除铜与光阻及干蚀刻气体结合生成复合产物，达到提升产品良率的目的。Accordingly, the present invention provides a copper cleaning agent, which can remove copper combined with photoresist and dry etching gas to form a composite product, thereby achieving the purpose of improving product yield.
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。In summary, although the present invention has been disclosed as above in preferred embodiments, the above-mentioned preferred embodiments are not intended to limit the present invention. Those of ordinary skill in the art can make various modifications without departing from the spirit and scope of the present invention. Such changes and modifications, therefore, the protection scope of the present invention is subject to the scope defined by the claims.

Claims (15)

  1. 一种铜清洗剂，以所述铜清洗剂为100重量份为基础，包括：A copper cleaning agent, based on 100 parts by weight of the copper cleaning agent, comprising:
    40~65重量份的去离子水；40~65 parts by weight of deionized water;
    25~35重量份的丙酮缩甘油；25~35 parts by weight of acetone glycidol;
    0.001~2重量份的表面活性剂；以及0.001~2 parts by weight of surfactant; and
    0.01~2重量份的缓蚀剂，0.01~2 parts by weight of corrosion inhibitor,
    其中所述表面活性剂包括一酰胺类化合物，以及所述缓蚀剂包括一唑类化合物。The surface active agent includes an amide compound, and the corrosion inhibitor includes an azole compound.
  2. 根据权利要求1所述的铜清洗剂，其中所述酰胺类化合物包括下列至少一者：乙二醇酰胺、单乙醇酰胺、以及聚氧乙烯烷醇酰胺。The copper cleaning agent according to claim 1, wherein the amide compound includes at least one of the following: glycolamide, monoethanolamide, and polyoxyethylene alkanolamide.
  3. 根据权利要求1所述的铜清洗剂，其中所述唑类化合物包括下列至少一者：苯并三氮唑、1H-咪唑、1H-四唑、5-苯基-1H-四唑、5-氨基-1H-四唑、3-氨基-1H-三唑、以及5-羧基苯并三氮唑。The copper cleaning agent according to claim 1, wherein the azole compound comprises at least one of the following: benzotriazole, 1H-imidazole, 1H-tetrazole, 5-phenyl-1H-tetrazole, 5- Amino-1H-tetrazole, 3-amino-1H-triazole, and 5-carboxybenzotriazole.
  4. 根据权利要求1所述的铜清洗剂，其中以所述铜清洗剂为100重量份为基础，所述铜清洗剂包括：The copper cleaning agent according to claim 1, wherein based on 100 parts by weight of the copper cleaning agent, the copper cleaning agent comprises:
    60~65重量份的去离子水；60~65 parts by weight of deionized water;
    28~32.5重量份的丙酮缩甘油；28~32.5 parts by weight of acetone glycidol;
    0.5~1.5重量份表面活性剂；以及0.5 to 1.5 parts by weight of surfactant; and
    0.5~1重量份缓蚀剂。0.5~1 parts by weight of corrosion inhibitor.
  5. 根据权利要求1所述的铜清洗剂，其中以所述铜清洗剂为100重量份为基础，所述铜清洗剂包括：65重量份的去离子水；32.5重量份的丙酮缩甘油；1.5重量份表面活性剂；以及1重量份缓蚀剂。The copper cleaning agent according to claim 1, wherein based on 100 parts by weight of the copper cleaning agent, the copper cleaning agent comprises: 65 parts by weight of deionized water; 32.5 parts by weight of acetone glycidol; 1.5 parts by weight Parts surface active agent; and 1 part by weight corrosion inhibitor.
  6. 一种铜清洗剂，以所述铜清洗剂为100重量份为基础，包括：A copper cleaning agent, based on 100 parts by weight of the copper cleaning agent, comprising:
    40~65重量份的去离子水；40~65 parts by weight of deionized water;
    25~35重量份的丙酮缩甘油；25~35 parts by weight of acetone glycidol;
    0.001~2重量份的表面活性剂；以及0.001~2 parts by weight of surfactant; and
    0.01~2重量份的缓蚀剂。0.01~2 parts by weight of corrosion inhibitor.
  7. 根据权利要求6所述的铜清洗剂，其pH值为8~10。The copper cleaning agent according to claim 6, having a pH value of 8-10.
  8. 根据权利要求6所述的铜清洗剂，其中所述表面活性剂包括一酰胺类化合物。The copper cleaning agent according to claim 6, wherein the surfactant includes an amide compound.
  9. 根据权利要求6所述的铜清洗剂，其中所述表面活性剂包括下列至少一者：乙二醇酰胺、单乙醇酰胺、以及聚氧乙烯烷醇酰胺。The copper cleaning agent according to claim 6, wherein the surfactant comprises at least one of the following: glycolamide, monoethanolamide, and polyoxyethylene alkanolamide.
  10. 根据权利要求6所述的铜清洗剂，其中所述表面活性剂包括一季铵盐类化合物。The copper cleaning agent according to claim 6, wherein the surfactant includes a quaternary ammonium compound.
  11. 根据权利要求6所述的铜清洗剂，其中所述表面活性剂包括下列至少一者：氯化苄基三乙基铵、硫酸氢丁四基铵、十二烷基三甲基氯化铵、十二烷基二甲基苄基氯化铵、十八烷基二甲基羟乙基硫酸铵、以及十八烷基二甲基羟乙基过氯酸铵。The copper cleaning agent according to claim 6, wherein the surfactant includes at least one of the following: benzyltriethylammonium chloride, tetrabutylammonium hydrogen sulfate, dodecyltrimethylammonium chloride, Dodecyl dimethyl benzyl ammonium chloride, octadecyl dimethyl hydroxyethyl ammonium sulfate, and octadecyl dimethyl hydroxyethyl ammonium perchlorate.
  12. 根据权利要求6所述的铜清洗剂，其中所述缓蚀剂包括一唑类化合物。The copper cleaning agent according to claim 6, wherein the corrosion inhibitor comprises an azole compound.
  13. 根据权利要求6所述的铜清洗剂，其中所述缓蚀剂包括下列至少一者：苯并三氮唑、1H-咪唑、1H-四唑、5-苯基-1H-四唑、5-氨基-1H-四唑、3-氨基-1H-三唑、以及5-羧基苯并三氮唑。The copper cleaning agent according to claim 6, wherein the corrosion inhibitor comprises at least one of the following: benzotriazole, 1H-imidazole, 1H-tetrazole, 5-phenyl-1H-tetrazole, 5- Amino-1H-tetrazole, 3-amino-1H-triazole, and 5-carboxybenzotriazole.
  14. 根据权利要求6所述的铜清洗剂，其中以所述铜清洗剂为100重量份为基础，所述铜清洗剂包括：The copper cleaning agent according to claim 6, wherein based on 100 parts by weight of the copper cleaning agent, the copper cleaning agent comprises:
    60~65重量份的去离子水；60~65 parts by weight of deionized water;
    28~32.5重量份的丙酮缩甘油；28~32.5 parts by weight of acetone glycidol;
    0.5~1.5重量份表面活性剂；以及0.5 to 1.5 parts by weight of surfactant; and
    0.5~1重量份缓蚀剂。0.5~1 parts by weight of corrosion inhibitor.
  15. 根据权利要求6所述的铜清洗剂，其中以所述铜清洗剂为100重量份为基础，所述铜清洗剂包括：65重量份的去离子水；32.5重量份的丙酮缩甘油；1.5重量份表面活性剂；以及1重量份缓蚀剂。The copper cleaning agent according to claim 6, wherein based on 100 parts by weight of the copper cleaning agent, the copper cleaning agent comprises: 65 parts by weight of deionized water; 32.5 parts by weight of acetone glycidol; 1.5 parts by weight Parts surface active agent; and 1 part by weight corrosion inhibitor.
PCT/CN2019/094141 2019-01-31 2019-07-01 Copper detergent WO2020155551A1 (en)

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CN110129807A (en) * 2019-05-23 2019-08-16 电子科技大学 It is a kind of for copper/iron-based material restrainer and pickling solution
CN110760863B (en) * 2019-11-18 2021-10-29 黄山学院 Corrosion inhibitor suitable for dynamic strong alkaline washing of metal workpiece and preparation method thereof

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