WO2020143267A1 - Multi-carrier disk wafer transfer device, transfer system and transfer method - Google Patents

Multi-carrier disk wafer transfer device, transfer system and transfer method Download PDF

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WO2020143267A1
WO2020143267A1 PCT/CN2019/112167 CN2019112167W WO2020143267A1 WO 2020143267 A1 WO2020143267 A1 WO 2020143267A1 CN 2019112167 W CN2019112167 W CN 2019112167W WO 2020143267 A1 WO2020143267 A1 WO 2020143267A1
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groove
carrier
wafer
block
column
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PCT/CN2019/112167
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French (fr)
Chinese (zh)
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李婷
尹影
贾若雨
姚远
费玖海
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北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所)
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Priority to CN201910028558.3A priority Critical patent/CN109590884B/en
Priority to CN201910028558.3 priority
Application filed by 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) filed Critical 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所)
Publication of WO2020143267A1 publication Critical patent/WO2020143267A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/02Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/0023Other grinding machines or devices grinding machines with a plurality of working posts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/0069Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/005Feeding or manipulating devices specially adapted to grinding machines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/02Frames; Beds; Carriages
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/06Work supports, e.g. adjustable steadies

Abstract

A multi-carrier disk wafer transfer device, transfer system, and transfer method. In the multi-carrier disk wafer transfer device, a drive control mechanism (100) can drive and control a circular track (200) to sequentially transfer each wafer carrier disk (300) loaded at a cleaning station to one of polishing stations and enable the wafer carrier disk to stay at said polishing station and to complete unloading and loading at said polishing station; and said mechanism can also drive and control the circular track (200) to transfer each wafer carrier disk (300) loaded at the polishing station to the cleaning station, and enable the wafer carrier disk to stay at the cleaning station and to complete unloading. Such a transmission mode can support a multi-step complex process flow, achieving polishing of each wafer at the polishing station independently, and achieving high-efficiency transmission between different transfer stations. The multi-carrier disk wafer transfer system comprises the multi-carrier disk wafer transfer device. The multi-carrier disk wafer transfer method is based on the multi-carrier disk wafer transfer device.

Description

多载盘晶圆传送设备及传送系统及传送方法Multi-carrier disk wafer transfer equipment, transfer system and transfer method
相关申请的交叉引用Cross-reference of related applications
本申请要求于2019年01月11日提交中国专利局的申请号为201910028558.3、名称为“多载盘晶圆传送设备及传送系统”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。This application requires the priority of the Chinese patent application with the application number 201910028558.3 and the name "multi-carrier wafer transfer equipment and transfer system" submitted to the Chinese Patent Office on January 11, 2019, the entire content of which is incorporated herein by reference Applying.
技术领域Technical field
本申请涉及晶圆加工领域,具体而言,涉及多载盘晶圆传送设备及传送系统及传送方法。The present application relates to the field of wafer processing, and in particular, to a multi-carrier disk wafer transfer device, a transfer system, and a transfer method.
背景技术Background technique
目前,晶圆在不同传送工位之间的传动方式和缺点:At present, the transmission methods and disadvantages of wafers between different transfer stations:
1、利用抛光头旋转进行晶圆传动。传动与工艺绑定在一起,造成了抛光头与工作台之间多对多的工作模式,缺点是不同抛光台之间工艺转换容易带来沾污,以及抛光头之间的差异会最终体现在晶圆平坦化效果上。1. Use the rotation of the polishing head for wafer transmission. The transmission and the process are bound together, resulting in a many-to-many working mode between the polishing head and the worktable. The disadvantage is that the process conversion between different polishing tables is prone to contamination, and the differences between the polishing heads will eventually be reflected in Wafer flattening effect.
2、通过载台线性移动的方式进行晶圆传输。线性移动的设计令传动灵活性受限,此外,该设计不易维护,错误发生率高。2. Wafer transfer through linear movement of the stage. The linear movement design limits the flexibility of the transmission. In addition, the design is not easy to maintain and has a high incidence of errors.
申请内容Application content
本申请提供一种多载盘晶圆传送设备,以能够解决采用抛光头旋转和载台线性移动进行晶圆传输,不同抛光台之间工艺转换易带来沾污,线性移动的设计令传动灵活性受限,传输效率不高的问题中的至少一个。This application provides a multi-carrier wafer wafer transfer equipment to solve the problem of wafer transfer using polishing head rotation and linear movement of the stage. The process conversion between different polishing stations is prone to contamination, and the design of linear movement makes the transmission flexible At least one of the problems of limited performance and low transmission efficiency.
本申请提供一种具备上述多载盘晶圆传送设备的多载盘晶圆传送系统。The present application provides a multi-carrier wafer transfer system provided with the above-mentioned multi-carrier wafer transfer device.
本申请实施例提供的多载盘晶圆传送设备,The multi-carrier disk wafer transfer equipment provided in the embodiments of the present application,
包括圆形轨道,沿着圆形轨道的圆周方向依次等间隔设置的清洗工位、 多个抛光工位,以及多个依次等间隔设置于圆形轨道的多个晶圆载盘和驱动控制机构;It includes a circular track, a cleaning station, a plurality of polishing stations, and a plurality of polishing stations, which are sequentially arranged at equal intervals along the circumferential direction of the circular track, and a plurality of wafer carrier disks and a drive control mechanism, which are sequentially arranged at equal intervals on the circular track ;
驱动控制机构能够驱动控制圆形轨道将每个在清洗工位完成装载的晶圆载盘,依次传送停留至其中一个抛光工位,并在抛光工位完成卸载和完成装载;驱动控制机构能够驱动控制圆形轨道将每个在抛光工位完成装载的晶圆载盘传送停留至清洗工位,并完成卸载。The drive control mechanism can drive and control the circular track to transfer each wafer carrier that has been loaded in the cleaning station to one of the polishing stations in turn, and unload and complete the loading at the polishing station; the drive control mechanism can drive Control the circular track to transfer and stop each wafer carrier loaded in the polishing station to the cleaning station, and complete the unloading.
晶圆载盘与圆形轨道固定连接,圆形轨道绕着其圆心转动,带动晶圆载盘沿着圆形轨道所限定的环形轨迹移动。晶圆载盘的设置数量不受限制,可以根据实际需要设置数量。The wafer carrier is fixedly connected to a circular track, and the circular track rotates around its center, which drives the wafer carrier to move along the circular track defined by the circular track. There is no limit to the number of wafer carriers that can be set, and the number can be set according to actual needs.
可选地,晶圆载盘设置四个,四个晶圆载盘分别命名为第一载盘、第二载盘、第三载盘和第四载盘,圆形轨道转动,分别带动四个晶圆载盘转动至四个传送工作,包括一个清洗工位和三个抛光工位,其中清洗工位为第一工位,三个抛光工位分别为第二工位、第三工位和第四工位。Optionally, four wafer carriers are provided, and the four wafer carriers are named as first carrier, second carrier, third carrier and fourth carrier respectively, and the circular track rotates to drive four The wafer carrier rotates to four transfer jobs, including a cleaning station and three polishing stations, of which the cleaning station is the first station, and the three polishing stations are the second station, the third station and the The fourth station.
实际传送过程是这样的:The actual transmission process is like this:
(1)初始状态,第一载盘对应第一工位,将晶圆装载至对应第一工位的第一载盘;(1) In the initial state, the first carrier corresponds to the first station, and the wafer is loaded onto the first carrier corresponding to the first station;
(2)圆形轨道及晶圆载盘沿逆时针运动,其中第一载盘携带晶圆运动至第二工位,转动至第一工位的第二载盘装载晶圆;(2) The circular rail and the wafer carrier move counterclockwise, where the first carrier carries the wafer to the second station, and the second carrier rotating to the first station loads the wafer;
(3)圆形轨道及晶圆载盘沿逆时针运动,其中第一载盘携带晶圆运动至第三工位,第二载盘携带晶圆运动至第二工位,转动至第一工位的第三载盘装载晶圆;(3) The circular track and the wafer carrier move counterclockwise, where the first carrier carries the wafer to the third station, the second carrier carries the wafer to the second station, and rotates to the first station The third carrier is loaded with wafers;
(4)圆形轨道及晶圆载盘沿逆时针运动,其中第一载盘携带晶圆运动至第四工位,第二载盘携带晶圆运动至第三工位,第三载盘携带晶圆运动至第二工位,转动至第一工位的第四载盘装载晶圆;(4) The circular rail and the wafer carrier move counterclockwise, where the first carrier carries the wafer to the fourth station, the second carrier moves the wafer to the third station, and the third carrier The wafer moves to the second station, and the fourth carrier that rotates to the first station loads the wafer;
(5)圆形轨道及晶圆载盘沿逆时针运动,其中第一载盘卸载晶圆,重复(1)——(4)步骤。(5) The circular track and the wafer carrier move counterclockwise, where the first carrier unloads the wafer and repeat steps (1) to (4).
采用上述的传动方式可支持多步复杂工艺流程,实现晶圆在不同传送工位之间的高效传输。Using the above-mentioned transmission method can support multi-step complex process flow, and realize efficient transfer of wafers between different transfer stations.
可选地,圆形轨道沿着周向方向依次等间隔设置有多个安装工位,每个安装工位对应设置有一个晶圆载盘;Optionally, a plurality of installation stations are arranged at regular intervals along the circumferential direction of the circular track, and each installation station is correspondingly provided with a wafer carrier tray;
每个安装工位设置有第一连接件;每个晶圆载盘的底部设置有第二连接件,第一连接件和第二连接件可拆卸连接。Each installation station is provided with a first connector; the bottom of each wafer carrier is provided with a second connector, and the first connector and the second connector are detachably connected.
可选地,第一连接件设置有连接柱槽;Optionally, the first connecting piece is provided with a connecting column groove;
第二连接件设置有连接柱,连接柱嵌设于连接柱槽,连接柱和连接柱槽之间通过周向限位机构和轴向限位机构可拆卸连接。The second connecting piece is provided with a connecting column, the connecting column is embedded in the connecting column slot, and the connecting column and the connecting column slot are detachably connected by a circumferential limit mechanism and an axial limit mechanism.
可选地,周向限位机构包括沿着连接柱槽的轴向方向依次设置的第一轴向槽和第二轴向槽,第一轴向槽和第二轴向槽沿着连接柱槽的周向方向等间隔设置,第一轴向槽的顶端贯穿连接柱槽的顶端端部;Optionally, the circumferential limit mechanism includes a first axial groove and a second axial groove arranged in sequence along the axial direction of the connecting column groove, the first axial groove and the second axial groove are along the connecting column groove Is arranged at equal intervals in the circumferential direction, the top end of the first axial groove penetrates the top end of the connecting column groove;
轴向限位机构包括连通第一轴向槽的底端和第二轴向槽的顶端的周向延伸的弧形槽;The axial limit mechanism includes a circumferentially extending arc-shaped groove connecting the bottom end of the first axial groove and the top end of the second axial groove;
连接柱的外周壁设置有卡接块,卡接块能够依次滑动嵌设于第一轴向槽、弧形槽和第二轴向槽。The outer peripheral wall of the connecting column is provided with a clamping block, and the clamping block can be slidably embedded in the first axial groove, the arc-shaped groove and the second axial groove in this order.
可选地,周向限位机构包括沿着连接柱槽的轴向方向延伸设置的周向限位槽,周向限位槽的顶端贯穿连接柱槽的顶部端部;Optionally, the circumferential limit mechanism includes a circumferential limit slot extending along the axial direction of the connecting column slot, and the top end of the circumferential limit slot penetrates the top end of the connecting column slot;
轴向限位机构包括设置于周向限位槽且沿着连接柱槽的径向方向来回移动的弹性阻挡块;弹性阻挡块的一端为阻挡端且能够伸入连接柱槽;The axial limit mechanism includes an elastic blocking block provided in the circumferential limit slot and moving back and forth along the radial direction of the connecting column slot; one end of the elastic blocking block is a blocking end and can extend into the connecting column slot;
连接柱的外壁设置有配合块;配合块能够抵压越过弹性阻挡块,并卡入和退出弹性阻挡块和周向限位槽的底部之间。The outer wall of the connecting column is provided with a matching block; the matching block can press against the elastic blocking block and snap into and out of between the elastic blocking block and the bottom of the circumferential limit groove.
可选地,周向限位槽设置有沿着连接柱槽的径向方向延伸且一端贯穿周向限位槽的底壁的安装槽;Optionally, the circumferential limit groove is provided with a mounting groove extending along the radial direction of the connecting column groove and having one end penetrating the bottom wall of the circumferential limit groove;
安装槽内设置有压缩弹簧,弹性阻挡块的远离阻挡端的一端滑动嵌设于安装槽且抵压压缩弹簧。The installation groove is provided with a compression spring, and the end of the elastic blocking block away from the blocking end is slidably embedded in the installation groove and presses against the compression spring.
可选地,阻挡端的顶侧设置有上斜面,阻挡端的底侧设置有下斜面,配合块沿着周向限位槽作抵压上斜面和下斜面的移动时能够将弹性阻挡块抵压退回至安装槽内。Optionally, the top side of the blocking end is provided with an upper inclined surface, and the bottom side of the blocking end is provided with a lower inclined surface. When the matching block moves along the circumferential limit groove to press the upper and lower inclined surfaces, the elastic blocking block can be pressed back Into the installation slot.
可选地,晶圆载盘的顶部设置有阶梯放置槽;Optionally, a step placement groove is provided on the top of the wafer carrier;
阶梯放置槽沿着垂直于晶圆载盘的方向依次等间隔设置有多个环形凸缘,多个环形凸缘的外径从阶梯放置槽的底端到顶端逐渐增大;The step placement groove is provided with a plurality of annular flanges at regular intervals along the direction perpendicular to the wafer carrier, and the outer diameters of the plurality of ring flanges gradually increase from the bottom end to the top end of the step placement groove;
位于最顶端的环形凸缘的周面设置有倾斜导向面。The circumferential surface of the annular flange at the top end is provided with an inclined guide surface.
可选地,所述晶圆载盘与所述圆形轨道固定连接,所述圆形轨道绕着其圆心转动,配置成带动所述晶圆载盘沿着所述圆形轨道所限定的环形轨迹移动。Optionally, the wafer carrier is fixedly connected to the circular track, and the circular track rotates around its center, and is configured to drive the wafer carrier along the ring defined by the circular track The trajectory moves.
可选地,所述晶圆载盘包括第一载盘、第二载盘、第三载盘和第四载盘,所述圆形轨道转动以带动第一载盘、第二载盘、第三载盘和第四载盘转动至四个传送工位,四个传送工位包括一个清洗工位和三个抛光工位,其中,清洗工位为第一工位,三个抛光工位分别为第二工位、第三工位和第四工位。Optionally, the wafer carrier includes a first carrier, a second carrier, a third carrier, and a fourth carrier, and the circular track rotates to drive the first carrier, the second carrier, and the second carrier The three carrier and the fourth carrier rotate to four transfer stations. The four transfer stations include a cleaning station and three polishing stations. The cleaning station is the first station and the three polishing stations are respectively It is the second station, the third station and the fourth station.
一种多载盘晶圆传送系统,A multi-disc wafer transfer system,
多载盘晶圆传送系统包括装载总机构、卸载总机构、装载机构、卸载机构和多载盘晶圆传送设备;The multi-carrier disk wafer transfer system includes a loading general mechanism, an unloading general mechanism, a loading mechanism, an unloading mechanism and a multi-carrier disk wafer transfer equipment;
清洗工位对应设置有装载总机构和卸载总机构,每个抛光工位对应设置有装载机构和卸载机构。The cleaning station is correspondingly provided with a loading general mechanism and an unloading general mechanism, and each polishing station is correspondingly provided with a loading mechanism and an unloading mechanism.
本申请提供一种多载盘晶圆传送设备的传送方法,包括以下步骤:This application provides a method for transferring a multi-carrier disk wafer transfer device, including the following steps:
将晶圆装载至清洗工位上的晶圆载盘上;Load the wafer onto the wafer carrier on the cleaning station;
沿着圆周运动,将装载有晶圆的晶圆载盘运动至其中一个抛光工位处,并将运动至清洗工位的晶圆载盘上装载晶圆;Along the circular motion, move the wafer carrier loaded with wafers to one of the polishing stations, and move the wafer carrier to the cleaning station to load wafers;
将再次运动至清洗工位的晶圆载盘上的晶圆进行卸载。Unload the wafers on the wafer carrier that moved to the cleaning station again.
可选地,沿着圆周运动的方向为沿着逆时针方向。Optionally, the direction of motion along the circle is along the counterclockwise direction.
可选地,晶圆载盘与安装工位的安装步骤包括:每个晶圆载盘利用连接柱和连接柱槽的方式与安装工位可拆卸连接;Optionally, the installation steps of the wafer carrier and the installation station include: each wafer carrier is detachably connected to the installation station by means of a connecting column and a connecting column slot;
其中,连接柱和连接柱槽之间通过周向限位机构和轴向限位机构可拆卸连接。Among them, the connecting column and the connecting column groove are detachably connected by a circumferential limiting mechanism and an axial limiting mechanism.
可选地,还包括:每个连接柱和连接柱槽通过至少两个轴向槽和一个弧形槽进行卡接,每个连接柱通过转动的方式与连接柱槽连接。Optionally, the method further includes: each connecting post and the connecting post groove are clamped by at least two axial grooves and an arc-shaped groove, and each connecting post is connected to the connecting post groove by means of rotation.
可选地,每个连接柱通过转动的方式与连接柱槽连接的步骤包括:连接柱的外周壁设置有卡接块,卡接块能够依次滑动嵌设于连接柱槽的第一轴向槽、弧形槽和第二轴向槽;Optionally, the step of connecting each connecting column to the connecting column slot by means of rotation includes: the outer peripheral wall of the connecting column is provided with a clamping block, and the clamping block can be sequentially slidably embedded in the first axial slot of the connecting column slot , Arc groove and second axial groove;
可选地,卡接块依次滑动嵌设于连接柱槽的第一轴向槽、弧形槽和第二轴向槽的步骤包括:连接柱卡入连接柱槽内时,连接柱的卡接块从连接柱槽的第一轴向槽的顶端卡入,卡接块移动至第一轴向槽的底端后,周向转动连接柱,将卡接块卡入弧形槽,卡接块转动至第二轴向槽的顶端后,继续轴向移动卡接块,将卡接块卡入第二轴向槽的底端。Optionally, the step of the sliding engagement block slidingly embedded in the first axial groove, the arc-shaped groove and the second axial groove of the connecting column groove in turn includes: when the connecting column is snapped into the connecting column groove, the connecting column is clamped The block is snapped from the top of the first axial groove of the connecting column groove, and after the clamping block moves to the bottom end of the first axial groove, the connecting column is rotated circumferentially to snap the clamping block into the arc-shaped groove and the clamping block After rotating to the top of the second axial groove, continue to move the clamping block axially, and snap the clamping block into the bottom end of the second axial groove.
可选地,连接柱的外壁设置有配合块,配合块能够抵压越过轴向限位机构的弹性阻挡块,并卡入和退出弹性阻挡块和周向限位机构的周向限位槽的底部之间;Optionally, the outer wall of the connecting column is provided with a matching block, which can press against the elastic blocking block of the axial limiting mechanism, and snap into and out of the elastic blocking block and the circumferential limiting groove of the circumferential limiting mechanism Between the bottom
其中,配合块从周向限位槽的顶端开口卡入,在移动至弹性阻挡块处, 配合块抵压弹性阻拦块,将弹性阻拦块抵压缩回,配合块滑入弹性阻拦块和周向限位槽的底部之间,弹性阻拦块恢复原状,将配合块限位于弹性阻拦块和周向限位槽的底部之间。Among them, the mating block is stuck from the opening of the top of the circumferential limit groove, and when moving to the elastic blocking block, the mating block presses against the elastic blocking block and compresses the elastic blocking block back, the mating block slides into the elastic blocking block and the circumferential Between the bottom of the limiting groove, the elastic blocking block is restored to its original state, and the matching block is limited between the elastic blocking block and the bottom of the circumferential limiting groove.
可选地,周向限位槽设置有安装槽,安装槽内设置有压缩弹簧;Optionally, the circumferential limit groove is provided with an installation groove, and a compression spring is provided in the installation groove;
其中,配合块抵压阻挡端,阻挡端缩回的过程中按压弹簧,弹簧压缩,待配合块滑过弹性阻拦块,弹性阻拦块的阻挡端在弹簧的作用下弹出恢复原状。Wherein, the mating block presses against the blocking end, and the spring is compressed during the process of retracting the blocking end, and the spring is compressed. When the mating block slides over the elastic blocking block, the blocking end of the elastic blocking block pops back to its original shape under the action of the spring.
本申请的有益效果至少包括:多载盘晶圆传送设备,与利用抛光头旋转进行晶圆传动的传统方式相比,采用轨道与载盘在不同传送工位之间传送晶圆,分离了传动与工艺,每个晶圆能够分别独立在抛光工位完成抛光,有效减少抛光头被沾污的可能;每个对应抛光工位的晶圆的抛光由不同抛光头完成,降低了由于抛光头差异导致的晶圆平坦化效果差异的概率。与通过载台线性移动的方式进行晶圆传输的传统方法相比,圆形传动轨道与载盘固定,稳定性较高,可有效降低传动过程中出现错误的可能性,且设备更易维护。这种传动方式可支持多步复杂工艺流程,实现晶圆在不同传送工位之间的高效传输。The beneficial effects of the present application include at least: multi-carrier disk wafer transfer equipment. Compared with the traditional method of wafer transmission using polishing head rotation, the wafer is transferred between different transfer stations using rails and carrier disks, and the transmission is separated With the process, each wafer can be independently polished at the polishing station, effectively reducing the possibility of contamination of the polishing head; each wafer corresponding to the polishing station is polished by a different polishing head, reducing the difference due to the polishing head The probability of a difference in wafer flattening effect. Compared with the traditional method of wafer transfer by linear movement of the stage, the circular drive rail is fixed to the carrier plate and has higher stability, which can effectively reduce the possibility of errors in the transmission process and the equipment is easier to maintain. This transmission method can support multi-step complex process flow, and realize the efficient transfer of wafers between different transfer stations.
多载盘晶圆传送系统,在清洗工位利用装载总机构完成装载和利用卸载总机构完成卸载,在抛光工位利用卸载机构完成卸载和利用装载机构完成装载,再利用多载盘晶圆传送设备实现传送,显著提高晶圆在不同传送工位之间的传输效率。Multi-carrier disk wafer transfer system, use the loading general mechanism to complete loading in the cleaning station and use the unloading general mechanism to complete unloading, use the unloading mechanism to complete the unloading in the polishing station and use the loading mechanism to complete loading, and then use the multi-carrier disk wafer transfer The equipment realizes the transfer, which significantly improves the transfer efficiency of the wafer between different transfer stations.
附图说明BRIEF DESCRIPTION
为了更清楚地说明本申请实施例的技术方案,下面将对实施例中所需要使用的附图作简单地介绍,应当理解,以下附图仅示出了本申请的某些实施例,因此不应被看作是对范围的限定,对于本领域普通技术人员来讲, 在不付出创造性劳动的前提下,还可以根据这些附图获得其他相关的附图。In order to more clearly explain the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, so they are not It should be regarded as a limitation on the scope. For those of ordinary skill in the art, without paying any creative work, other related drawings can be obtained based on these drawings.
图1为本申请实施例提供的多载盘晶圆传送设备的第一种工作状态示意图;1 is a schematic diagram of a first working state of a multi-carrier disk wafer transfer device provided by an embodiment of the present application;
图2为本申请实施例提供的多载盘晶圆传送设备的主视图;2 is a front view of a multi-carrier disk wafer transfer device provided by an embodiment of the present application;
图3为本申请实施例提供的多载盘晶圆传送设备的第二种工作状态示意图;FIG. 3 is a schematic diagram of a second working state of a multi-carrier wafer transfer device provided by an embodiment of the present application;
图4为本申请实施例提供的多载盘晶圆传送设备的第三种工作状态示意图;4 is a schematic diagram of a third working state of a multi-carrier disk wafer transfer device provided by an embodiment of the present application;
图5为本申请实施例提供的多载盘晶圆传送设备的第四种工作状态示意图;FIG. 5 is a schematic diagram of a fourth working state of a multi-carrier wafer transfer device provided by an embodiment of the present application;
图6为本申请实施例提供的多载盘晶圆传送设备的第一种结构的结构示意图;FIG. 6 is a schematic structural diagram of a first structure of a multi-carrier wafer transfer device provided by an embodiment of the present application;
图7为本申请实施例图6中的A的局部放大图;7 is a partial enlarged view of A in FIG. 6 of an embodiment of the present application;
图8为本申请实施例提供的多载盘晶圆传送设备的第一种结构中晶圆载盘的结构示意图;8 is a schematic structural diagram of a wafer carrier disk in a first structure of a multi-carrier disk wafer transfer device according to an embodiment of the present application;
图9为本申请实施例提供的多载盘晶圆传送设备的第二种结构的结构示意图;9 is a schematic structural diagram of a second structure of a multi-carrier disk wafer transfer device provided by an embodiment of the present application;
图10为本申请实施例提供的图9中B的局部放大图;10 is a partial enlarged view of B in FIG. 9 provided by an embodiment of the present application;
图11为本申请实施例提供的多载盘晶圆传送设备的第二种结构中晶圆载盘的结构示意图;11 is a schematic structural diagram of a wafer carrier disk in a second structure of a multi-carrier disk wafer transfer device according to an embodiment of the present application;
图12为本申请实施例提供的晶圆载盘的第一种结构示意图。12 is a schematic diagram of a first structure of a wafer carrier provided by an embodiment of the present application.
图标:100-驱动控制机构;200-圆形轨道;210-安装工位;220-第一连接件;221-连接柱槽;300-晶圆载盘;310-第二连接件;311-连接柱;312-卡接块;313-配合块;320-阶梯放置槽;321-环形凸缘;322-倾斜导 向面;330-吸附软毛;400-周向限位机构;410-第一轴向槽;420-第二轴向槽;430-周向限位槽;500-轴向限位机构;510-弧形槽;520-弹性阻挡块;521-阻挡端;522-上斜面;523-下斜面;010-安装槽;020-弹簧;001-第一载盘;002-第二载盘;003-第三载盘;004-第四载盘;005-第一工位;006-第二工位;007-第三工位;008-第四工位。Icon: 100-drive control mechanism; 200-circular track; 210-installation station; 220-first connector; 221-connected column slot; 300-wafer carrier; 310-second connector; 311-connected Column; 312-clamping block; 313-fitting block; 320-step placement groove; 321-ring flange; 322-inclined guide surface; 330-absorbent soft hair; 400-circumferential limit mechanism; 410-first axis Groove; 420-second axial groove; 430-circumferential limit groove; 500-axial limit mechanism; 510-arc groove; 520-elastic blocking block; 521-blocking end; 522-upper slope; 523 -Lower slope; 010-mounting groove; 020-spring; 001-first carrier; 002-second carrier; 003-third carrier; 004-fourth carrier; 005-first station; 006- Second station; 007-third station; 008-fourth station.
具体实施方式detailed description
为使本申请实施例的目的、技术方案和优点更加清楚,下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例是本申请一部分实施例,而不是全部的实施例。通常在此处附图中描述和示出的本申请实施例的组件可以以各种不同的配置来布置和设计。To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments It is a part of the embodiments of this application, but not all the embodiments. The components of the embodiments of the present application generally described and illustrated in the drawings herein can be arranged and designed in various configurations.
因此,以下对在附图中提供的本申请的实施例的详细描述并非旨在限制要求保护的本申请的范围,而是仅仅表示本申请的选定实施例。基于本申请中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.
本发明的描述中若出现术语“水平”、“竖直”等术语并不表示要求部件绝对水平或悬垂,而是可以稍微倾斜。如“水平”仅仅是指其方向相对“竖直”而言更加水平,并不是表示该结构一定要完全水平,而是可以稍微倾斜。If the terms "horizontal" and "vertical" appear in the description of the present invention, it does not mean that the components are absolutely horizontal or overhanging, but may be slightly inclined. For example, "horizontal" only means that its direction is more horizontal than "vertical", it does not mean that the structure must be completely horizontal, but it can be slightly inclined.
在本发明的描述中,还需要说明的是,除非另有明确的规定和限定,若出现术语“设置”、“安装”、“相连”、“连接”应做广义理解,例如,“连接”可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通。对于本领域的普通技术人员而言,可以具体 情况理解上述术语在本发明中的具体含义。In the description of the present invention, it should also be noted that, unless otherwise clearly specified and limited, the terms “setup”, “installation”, “connected”, and “connected” should be broadly understood, for example, “connected” It can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or it can be indirectly connected through an intermediary, or it can be an internal connection between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood in specific situations.
参照图1至图12,本申请实施例提供多载盘晶圆传送设备,如图1和图2所示,包括圆形轨道200,沿着圆形轨道200的圆周方向依次等间隔设置的清洗工位、多个抛光工位,以及多个依次等间隔设置于圆形轨道200的多个晶圆载盘300和驱动控制机构100;Referring to FIGS. 1-12, an embodiment of the present application provides a multi-carrier wafer transfer equipment, as shown in FIGS. 1 and 2, including a circular track 200, which are sequentially disposed at regular intervals along the circumferential direction of the circular track 200. Work stations, multiple polishing stations, and multiple wafer carriers 300 and drive control mechanisms 100 that are sequentially arranged at equal intervals on the circular track 200;
驱动控制机构100能够驱动控制圆形轨道200将每个在清洗工位完成装载的晶圆载盘300,依次传送停留至其中一个抛光工位,并在抛光工位完成卸载和完成装载;驱动控制机构100能够驱动控制圆形轨道200将每个在抛光工位完成装载的晶圆载盘300传送停留至清洗工位,并完成卸载。The drive control mechanism 100 can drive and control the circular rail 200 to transfer each wafer carrier 300 that has been loaded at the cleaning station to one of the polishing stations in sequence, and unload and complete the loading at the polishing station; drive control The mechanism 100 can drive and control the circular rail 200 to transfer and stop each wafer carrier 300 that has been loaded at the polishing station to the cleaning station, and complete the unloading.
晶圆载盘300与圆形轨道200固定连接,圆形轨道200绕着其圆心转动,带动晶圆载盘300沿着圆形轨道200所限定的环形轨迹移动。晶圆载盘300的设置数量不受限制,可以根据实际需要设置数量。The wafer carrier 300 is fixedly connected to the circular rail 200. The circular rail 200 rotates around the center of the circle to drive the wafer carrier 300 to move along the circular trajectory defined by the circular rail 200. The number of wafer carriers 300 is not limited, and the number can be set according to actual needs.
本申请实施例提供一种多载盘晶圆传送设备的传送方法,包括以下步骤:将晶圆装载至清洗工位上的晶圆载盘300上;沿着圆周运动,将装载有晶圆的晶圆载盘300运动至其中一个抛光工位处,并将运动至清洗工位的晶圆载盘300上装载晶圆;将再次运动至清洗工位的晶圆载盘300上的晶圆进行卸载。An embodiment of the present application provides a transfer method for a multi-carrier disk wafer transfer device, including the following steps: loading wafers onto a wafer carrier 300 on a cleaning station; moving along a circular motion The wafer carrier 300 moves to one of the polishing stations, and the wafer is loaded on the wafer carrier 300 moved to the cleaning station; the wafer on the wafer carrier 300 moved to the cleaning station again is carried out Uninstall.
可选地,沿着圆周运动的方向为沿着逆时针方向。Optionally, the direction of motion along the circle is along the counterclockwise direction.
举例说明,在本实施例中,晶圆载盘300设置四个,四个晶圆载盘300分别命名为第一载盘001、第二载盘002、第三载盘003和第四载盘004,圆形轨道200转动,分别带动四个晶圆载盘300转动至四个传送工作,包括一个清洗工位和三个抛光工位,其中清洗工位为第一工位005,三个抛光工位分别为第二工位006、第三工位007和第四工位008。For example, in this embodiment, four wafer carriers 300 are provided, and the four wafer carriers 300 are named first carrier 001, second carrier 002, third carrier 003, and fourth carrier, respectively. 004, the circular track 200 rotates to drive the four wafer carriers 300 to four transfer jobs, including a cleaning station and three polishing stations, of which the cleaning station is the first station 005, three polishing The stations are the second station 006, the third station 007 and the fourth station 008.
实际传送过程是这样的:The actual transmission process is like this:
(1)如图1所示,初始状态,第一载盘001对应第一工位005,将晶圆装载至对应第一工位005的第一载盘001;(1) As shown in FIG. 1, in the initial state, the first carrier 001 corresponds to the first station 005, and the wafer is loaded onto the first carrier 001 corresponding to the first station 005;
(2)如图3所示,圆形轨道200及晶圆载盘300沿逆时针运动,其中第一载盘001携带晶圆运动至第二工位006,转动至第一工位005的第二载盘002装载晶圆;(2) As shown in FIG. 3, the circular rail 200 and the wafer carrier 300 move counterclockwise, where the first carrier 001 carries the wafer to the second station 006 and rotates to the first station 005 The second carrier 002 is loaded with wafers;
(3)如图4所示,圆形轨道200及晶圆载盘300沿逆时针运动,其中第一载盘001携带晶圆运动至第三工位007,第二载盘002携带晶圆运动至第二工位006,转动至第一工位005的第三载盘003装载晶圆;(3) As shown in FIG. 4, the circular rail 200 and the wafer carrier 300 move counterclockwise, wherein the first carrier 001 carries the wafer to the third station 007, and the second carrier 002 carries the wafer to move To the second station 006, the third carrier 003 rotating to the first station 005 loads the wafer;
(4)如图5所示,圆形轨道200及晶圆载盘300沿逆时针运动,其中第一载盘001携带晶圆运动至第四工位008,第二载盘002携带晶圆运动至第三工位007,第三载盘003携带晶圆运动至第二工位006,转动至第一工位005的第四载盘004装载晶圆;(4) As shown in FIG. 5, the circular rail 200 and the wafer carrier 300 move counterclockwise, wherein the first carrier 001 carries the wafer to the fourth station 008, and the second carrier 002 carries the wafer to move To the third station 007, the third carrier 003 carries the wafer to the second station 006 and rotates to the fourth carrier 004 of the first station 005 to load the wafer;
(5)圆形轨道200及晶圆载盘300沿逆时针运动,其中第一载盘001卸载晶圆,重复(1)——(4)步骤。(5) The circular rail 200 and the wafer carrier 300 move counterclockwise, wherein the first carrier 001 unloads the wafer, and repeat steps (1) to (4).
采用上述的传动方式可支持多步复杂工艺流程,实现晶圆在不同传送工位之间的高效传输。Using the above-mentioned transmission method can support multi-step complex process flow, and realize efficient transfer of wafers between different transfer stations.
可选地,如图6和图8所示,每个安装工位210设置有第一连接件220;Optionally, as shown in FIGS. 6 and 8, each installation station 210 is provided with a first connector 220;
每个晶圆载盘300的底部设置有第二连接件310,第一连接件220和第二连接件310可拆卸连接。A second connector 310 is provided at the bottom of each wafer carrier 300, and the first connector 220 and the second connector 310 are detachably connected.
晶圆载盘300和圆形轨道200通过第一连接件220和第二连接件310可拆卸连接,安装工位210设置数量不受限制,实际传送时,可以根据需求安装不同数量的晶圆载盘300,能够避免晶圆载盘300空转,减轻圆形轨道200的转动载荷。The wafer carrier 300 and the circular rail 200 are detachably connected through the first connector 220 and the second connector 310. The number of installation stations 210 is not limited. During actual transfer, different numbers of wafer carriers can be installed according to requirements The disk 300 can prevent the wafer carrier 300 from idling, and reduce the rotational load of the circular rail 200.
可选地,晶圆载盘300与安装工位的安装步骤包括:每个晶圆载盘300 利用连接柱331和连接柱槽221的方式与安装工位可拆卸连接;其中,连接柱331和连接柱槽221之间通过周向限位机构和轴向限位机构可拆卸连接。Optionally, the installation steps of the wafer carrier 300 and the installation station include: each wafer carrier 300 is detachably connected to the installation station by means of a connecting post 331 and a connecting post groove 221; wherein, the connecting post 331 and The connecting column groove 221 is detachably connected by a circumferential limiting mechanism and an axial limiting mechanism.
可选地,如图7所示,第一连接件220设置有连接柱槽221;Optionally, as shown in FIG. 7, the first connecting member 220 is provided with a connecting column groove 221;
第二连接件310设置有连接柱311,连接柱311嵌设于连接柱槽221,连接柱311和连接柱槽221之间通过周向限位机构400和轴向限位机构500可拆卸连接。The second connecting member 310 is provided with a connecting post 311, and the connecting post 311 is embedded in the connecting post groove 221, and the connecting post 311 and the connecting post groove 221 are detachably connected by a circumferential limiting mechanism 400 and an axial limiting mechanism 500.
第一连接件220和第二连接件310之间的连接采用连接柱311和连接柱槽221的方式连接。周向限位机构400配置成限制连接柱311和连接柱槽221之间的周向转动,轴向限位机构500配置成限制连接柱311和连接柱槽221的轴向移动,从而牢固地将连接柱311和连接柱槽221连接在一起。The connection between the first connection member 220 and the second connection member 310 is connected by a connection post 311 and a connection post groove 221. The circumferential limiting mechanism 400 is configured to restrict the circumferential rotation between the connecting post 311 and the connecting post groove 221, and the axial limiting mechanism 500 is configured to restrict the axial movement of the connecting post 311 and the connecting post groove 221, thereby firmly The connecting post 311 and the connecting post groove 221 are connected together.
可选地,如图6和图7所示,周向限位机构400包括沿着连接柱槽221的轴向方向依次设置的第一轴向槽410和第二轴向槽420,第一轴向槽410和第二轴向槽420沿着连接柱槽221的周向方向等间隔设置,第一轴向槽410的顶端贯穿连接柱槽221的顶端端部;Optionally, as shown in FIGS. 6 and 7, the circumferential limit mechanism 400 includes a first axial groove 410 and a second axial groove 420 that are sequentially arranged along the axial direction of the connecting column groove 221, the first axis The grooves 410 and the second axial grooves 420 are arranged at equal intervals along the circumferential direction of the connecting column groove 221, and the top end of the first axial groove 410 penetrates the top end of the connecting column groove 221;
轴向限位机构500包括连通第一轴向槽410的底端和第二轴向槽420的顶端的周向延伸的弧形槽510;The axial limiting mechanism 500 includes a circumferentially extending arc-shaped groove 510 connecting the bottom end of the first axial groove 410 and the top end of the second axial groove 420;
如图8所示,连接柱311的外周壁设置有卡接块312,卡接块312能够依次滑动嵌设于第一轴向槽410、弧形槽510和第二轴向槽420。As shown in FIG. 8, the outer peripheral wall of the connecting post 311 is provided with a clamping block 312, which can be slidably embedded in the first axial groove 410, the arc-shaped groove 510 and the second axial groove 420 in this order.
连接柱311卡入连接柱槽221,卡接块312从第一轴向槽410的顶端卡入,卡接块312移动至第一轴向槽410的底端后,周向转动连接柱311,将卡接块312卡入弧形槽510,卡接块312转动至第二轴向槽420的顶端后,继续轴向移动卡接块312,将卡接块312卡入第二轴向槽420的底端,即卡 入的过程是,依次卡入第一轴向槽410、弧形槽510和第二轴向槽420,而取出连接柱311的过程,即是卡接块312依次从第二轴向槽420、弧形槽510和第一轴向槽410退出。The connecting post 311 snaps into the connecting post groove 221, and the snap block 312 snaps in from the top of the first axial groove 410. After the snap block 312 moves to the bottom end of the first axial groove 410, the connecting post 311 is rotated circumferentially. Snap the clamping block 312 into the arc groove 510, after the clamping block 312 rotates to the top of the second axial groove 420, continue to move the clamping block 312 axially, and snap the clamping block 312 into the second axial groove 420 The bottom end, that is, the process of snapping is to sequentially snap into the first axial groove 410, the arc groove 510, and the second axial groove 420, and the process of taking out the connecting post 311, that is, the snap block 312 is sequentially The two axial grooves 420, the arc-shaped groove 510 and the first axial groove 410 exit.
第二轴向槽420限制了连接柱311和连接柱槽221的相对周向移动,弧形槽510限制了连接柱311相对于连接柱槽221的轴向移动,从而能够限制连接柱311和连接柱槽221的连接关系。The second axial groove 420 restricts the relative circumferential movement of the connecting post 311 and the connecting post groove 221, and the arc-shaped groove 510 restricts the axial movement of the connecting post 311 relative to the connecting post groove 221, thereby being able to restrict the connecting post 311 and the connection The connection relationship of the column groove 221.
可选地,如图9和图10所示,周向限位机构400包括沿着连接柱槽221的轴向方向延伸设置的周向限位槽430,周向限位槽430的顶端贯穿连接柱槽221的顶部端部;Optionally, as shown in FIGS. 9 and 10, the circumferential limit mechanism 400 includes a circumferential limit groove 430 extending along the axial direction of the connecting column groove 221, and the top end of the circumferential limit groove 430 is connected through The top end of the column groove 221;
轴向限位机构500包括设置于周向限位槽430且沿着连接柱槽221的径向方向来回移动的弹性阻挡块520;弹性阻挡块520的一端为阻挡端521且能够伸入连接柱槽221;The axial limiting mechanism 500 includes an elastic blocking block 520 disposed in the circumferential limiting groove 430 and moving back and forth along the radial direction of the connecting column groove 221; one end of the elastic blocking block 520 is the blocking end 521 and can extend into the connecting column Slot 221;
如图11所示,连接柱311的外壁设置有配合块313;配合块313能够抵压越过弹性阻挡块520,并卡入和退出弹性阻挡块520和周向限位槽430的底部之间。As shown in FIG. 11, the outer wall of the connecting post 311 is provided with a fitting block 313; the fitting block 313 can press against the elastic blocking block 520 and snap into and out of between the elastic blocking block 520 and the bottom of the circumferential limiting groove 430.
连接柱311卡入连接柱槽221,配合块313从周向限位槽430的顶端开口卡入,在移动至弹性阻挡块520处,配合块313抵压弹性阻拦块,将弹性阻拦块抵压缩回,配合块313滑入弹性阻拦块和周向限位槽430的底部之间,弹性阻拦块恢复原状,将配合块313限位于弹性阻拦块和周向限位槽430的底部之间;连接柱311取出连接柱槽221的过程,配合块313从弹性阻拦块的下侧抵压弹性阻拦块,将弹性阻拦块再次抵压缩回,配合块313滑过弹性阻拦块,弹性阻拦块恢复原状,连接柱311从连接柱槽221取出。The connecting post 311 is snapped into the connecting post groove 221, and the engaging block 313 is engaged from the top opening of the circumferential limiting groove 430. When moving to the elastic blocking block 520, the engaging block 313 presses against the elastic blocking block and compresses the elastic blocking block Back, the matching block 313 slides between the elastic blocking block and the bottom of the circumferential limiting groove 430, the elastic blocking block returns to its original shape, and the matching block 313 is limited between the elastic blocking block and the bottom of the circumferential limiting groove 430; When the column 311 is taken out of the connecting column groove 221, the matching block 313 presses the elastic blocking block from the lower side of the elastic blocking block to compress the elastic blocking block back again, the matching block 313 slides over the elastic blocking block, and the elastic blocking block returns to its original state. The connecting post 311 is taken out of the connecting post groove 221.
可选地,如图10所示,周向限位槽430设置有沿着连接柱槽221的径 向方向延伸且一端贯穿周向限位槽430的底壁的安装槽010;Optionally, as shown in FIG. 10, the circumferential limiting groove 430 is provided with a mounting groove 010 extending along the radial direction of the connecting column groove 221 and having one end penetrating the bottom wall of the circumferential limiting groove 430;
安装槽010内设置有压缩弹簧020,弹性阻挡块520的远离阻挡端521的一端滑动嵌设于安装槽010且抵压压缩弹簧020。A compression spring 020 is disposed in the mounting groove 010, and an end of the elastic blocking block 520 away from the blocking end 521 is slidably fitted into the mounting groove 010 and presses against the compression spring 020.
配合块313抵压阻挡端521,阻挡端521缩回的过程中按压弹簧020,弹簧020压缩,待配合块313滑过弹性阻拦块,弹性阻拦块的阻挡端521在弹簧020的作用下弹出恢复原状。The mating block 313 presses against the blocking end 521, and the spring 020 is compressed during the process of the blocking end 521 retracting. When the mating block 313 slides over the elastic blocking block, the blocking end 521 of the elastic blocking block pops up and recovers under the action of the spring 020 Undisturbed.
可选地,如图10所示,阻挡端521的顶侧设置有上斜面522,阻挡端521的底侧设置有下斜面523,配合块313沿着周向限位槽430作抵压上斜面522和下斜面523的移动时能够将弹性阻挡块520抵压退回至安装槽010内。Optionally, as shown in FIG. 10, the top side of the blocking end 521 is provided with an upper inclined surface 522, the bottom side of the blocking end 521 is provided with a lower inclined surface 523, and the matching block 313 acts as a pressing force against the upper inclined surface along the circumferential limiting groove 430 When the 522 and the lower inclined surface 523 move, the elastic blocking block 520 can be pressed back into the installation groove 010.
配合块313沿着周向限位槽430上下移动,作配置成上斜面522和下斜面523的过程中,对弹性阻拦块有沿连接柱槽221的径向方向的作用力,能够将弹性阻拦块抵压退回至安装槽010内,实现配合块313滑过弹性阻拦块。The mating block 313 moves up and down along the circumferential limiting groove 430, and is configured into the upper inclined surface 522 and the lower inclined surface 523, which acts on the elastic blocking block in the radial direction of the connecting column groove 221, which can block the elastic block The block is pressed back into the installation groove 010, so that the matching block 313 slides over the elastic blocking block.
可选地,如图12所示,晶圆载盘300的顶部设置有阶梯放置槽320;Optionally, as shown in FIG. 12, a step placement groove 320 is provided on the top of the wafer carrier 300;
阶梯放置槽320沿着垂直于晶圆载盘300的方向依次等间隔设置有多个环形凸缘321,多个环形凸缘321的外径从阶梯放置槽320的底端到顶端逐渐增大;The step placement groove 320 is provided with a plurality of annular flanges 321 at regular intervals along the direction perpendicular to the wafer carrier 300, and the outer diameters of the plurality of ring flanges 321 gradually increase from the bottom end to the top end of the step placement groove 320;
位于最顶端的环形凸缘321的周面设置有倾斜导向面322。。The circumferential surface of the annular flange 321 located at the top end is provided with an inclined guide surface 322. .
阶梯放置槽320能够放置不同直径大小的晶圆,便于传送不同类型的晶圆。设置倾斜导向面322,可以导向晶圆进入阶梯放置槽320内。The step placement groove 320 can place wafers of different diameters, which is convenient for transferring different types of wafers. The inclined guide surface 322 is provided to guide the wafer into the step placement groove 320.
本实施例提供了一种多载盘晶圆传送系统,多载盘晶圆传送系统包括装载总机构、卸载总机构、装载机构、卸载机构和多载盘晶圆传送设备;This embodiment provides a multi-carrier disk wafer transfer system. The multi-carrier disk wafer transfer system includes a loading general mechanism, an unloading general mechanism, a loading mechanism, an unloading mechanism, and a multi-carrier disk wafer transfer device;
清洗工位对应设置有装载总机构和卸载总机构,每个抛光工位对应设 置有装载机构和卸载机构。The washing station is correspondingly provided with a loading general mechanism and an unloading general mechanism, and each polishing station is correspondingly provided with a loading mechanism and an unloading mechanism.
圆形轨道200带动每个晶圆载盘300移动停留在清洗工位,装载总机构装载晶圆,然后圆形轨道200带动该晶圆从清洗工位传送至其中一个抛光工位并停留,在抛光工位,利用卸载机构卸载晶圆进行抛光,抛光完成后,利用装载机构完成晶圆装载,最后圆形轨道200带动该晶圆从抛光工位传送至清洗工位进行清洗,再利用卸载总机构完成卸载,完成晶圆的抛光加工。The circular track 200 drives each wafer carrier 300 to move and stay in the cleaning station, and the loading mechanism loads the wafer. Then, the circular track 200 drives the wafer from the cleaning station to one of the polishing stations and stays in In the polishing station, the wafer is unloaded for polishing by the unloading mechanism. After the polishing is completed, the wafer is loaded by the loading mechanism. Finally, the circular track 200 drives the wafer from the polishing station to the cleaning station for cleaning, and then uses the unloading The mechanism completes unloading and finishes wafer polishing.
每个抛光工位对应设置一个抛光头,移动至抛光工位的每个晶圆单独进行抛光,不易被相互玷污。Each polishing station is correspondingly provided with a polishing head, and each wafer moved to the polishing station is separately polished, which is not easy to be contaminated with each other.
以上所述仅为本申请的优选实施例而已,并不配置成限制本申请,对于本领域的技术人员来说,本申请可以有各种更改和变化。凡在本申请的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本申请的保护范围之内。The above are only preferred embodiments of the present application, and are not configured to limit the present application. For those skilled in the art, the present application may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. within the spirit and principle of this application shall be included in the scope of protection of this application.
工业实用性Industrial applicability
本申请实施例提供的多载盘晶圆传送设备,可支持多步复杂工艺流程,实现每个晶圆分别独立在抛光工位完成抛光,且在不同传送工位之间的高效传输。The multi-carrier disk wafer transfer equipment provided in the embodiments of the present application can support multi-step complex process flows, and realize that each wafer is independently polished at the polishing station and efficiently transferred between different transfer stations.

Claims (19)

  1. 一种多载盘晶圆传送设备,其特征在于:A multi-disc wafer transfer equipment, characterized by:
    包括圆形轨道,沿着所述圆形轨道的圆周方向依次等间隔设置的清洗工位、多个抛光工位,以及多个依次等间隔设置于所述圆形轨道的多个晶圆载盘和驱动控制机构;It includes a circular track, a cleaning station, a plurality of polishing stations that are arranged at equal intervals in sequence along the circumferential direction of the circular track, and a plurality of wafer carrier trays that are sequentially arranged at equal intervals on the circular track And drive control mechanism;
    所述驱动控制机构能够驱动控制所述圆形轨道将每个在所述清洗工位完成装载的所述晶圆载盘,依次传送停留至其中一个所述抛光工位,并在所述抛光工位完成卸载和完成装载;所述驱动控制机构能够驱动控制所述圆形轨道将每个在所述抛光工位完成装载的所述晶圆载盘传送停留至所述清洗工位,并完成卸载。The drive control mechanism can drive and control the circular track to transfer each wafer carrier that has been loaded at the cleaning station to one of the polishing stations in turn, and then to the polishing station Unloading and loading are completed; the drive control mechanism can drive and control the circular track to transfer and stop each wafer carrier that has been loaded at the polishing station to the cleaning station, and complete unloading .
  2. 根据权利要求1所述的多载盘晶圆传送设备,其特征在于:The multi-carrier wafer wafer transfer device according to claim 1, wherein:
    所述圆形轨道沿着周向方向依次等间隔设置有多个安装工位,每个所述安装工位对应设置有一个所述晶圆载盘;A plurality of installation stations are sequentially arranged at equal intervals along the circumferential direction of the circular track, and each of the installation stations is correspondingly provided with one wafer carrier tray;
    每个所述安装工位设置有第一连接件;每个所述晶圆载盘的底部设置有第二连接件,所述第一连接件和所述第二连接件可拆卸连接。Each of the installation stations is provided with a first connector; a bottom connector of each wafer carrier is provided with a second connector, and the first connector and the second connector are detachably connected.
  3. 根据权利要求2所述的多载盘晶圆传送设备,其特征在于:The multi-carrier disk wafer transfer device according to claim 2, wherein:
    所述第一连接件设置有连接柱槽;The first connecting piece is provided with a connecting column groove;
    所述第二连接件设置有连接柱,所述连接柱嵌设于所述连接柱槽,所述连接柱和所述连接柱槽之间通过周向限位机构和轴向限位机构可拆卸连接。The second connecting piece is provided with a connecting column, the connecting column is embedded in the connecting column slot, and the connecting column and the connecting column slot are detachable through a circumferential limit mechanism and an axial limit mechanism connection.
  4. 根据权利要求3所述的多载盘晶圆传送设备,其特征在于:The multi-carrier disk wafer transfer device according to claim 3, wherein:
    所述周向限位机构包括沿着所述连接柱槽的轴向方向依次设置的第一轴向槽和第二轴向槽,所述第一轴向槽和所述第二轴向槽沿着所述连接柱槽的周向方向等间隔设置,所述第一轴向槽的顶端贯穿所述连接柱槽的顶 端端部;The circumferential limit mechanism includes a first axial groove and a second axial groove arranged in sequence along the axial direction of the connecting column groove, the first axial groove and the second axial groove The connecting column grooves are arranged at equal intervals in the circumferential direction, and the top end of the first axial groove penetrates the top end of the connecting column groove;
    所述轴向限位机构包括连通所述第一轴向槽的底端和所述第二轴向槽的顶端的周向延伸的弧形槽;The axial limiting mechanism includes a circumferentially extending arc-shaped groove communicating the bottom end of the first axial groove and the top end of the second axial groove;
    所述连接柱的外周壁设置有卡接块,所述卡接块能够依次滑动嵌设于所述第一轴向槽、所述弧形槽和所述第二轴向槽。A clamping block is provided on the outer peripheral wall of the connecting column, and the clamping block can be slidably embedded in the first axial groove, the arc-shaped groove, and the second axial groove in this order.
  5. 根据权利要求3或4所述的多载盘晶圆传送设备,其特征在于:The multi-carrier wafer transfer equipment according to claim 3 or 4, wherein:
    所述周向限位机构包括沿着所述连接柱槽的轴向方向延伸设置的周向限位槽,所述周向限位槽的顶端贯穿所述连接柱槽的顶部端部;The circumferential limiting mechanism includes a circumferential limiting groove extending along the axial direction of the connecting column groove, and a top end of the circumferential limiting groove penetrates the top end of the connecting column groove;
    所述轴向限位机构包括设置于所述周向限位槽且沿着所述连接柱槽的径向方向来回移动的弹性阻挡块;所述弹性阻挡块的一端为阻挡端且能够伸入所述连接柱槽;The axial limiting mechanism includes an elastic blocking block provided in the circumferential limiting slot and moving back and forth along the radial direction of the connecting column slot; one end of the elastic blocking block is a blocking end and can extend into The connecting column slot;
    所述连接柱的外壁设置有配合块;所述配合块能够抵压越过所述弹性阻挡块,并卡入和退出所述弹性阻挡块和所述周向限位槽的底部之间。The outer wall of the connecting column is provided with a matching block; the matching block can press against the elastic blocking block and snap into and out of between the elastic blocking block and the bottom of the circumferential limiting groove.
  6. 根据权利要求5所述的多载盘晶圆传送设备,其特征在于:The multi-carrier wafer wafer transfer device according to claim 5, wherein:
    所述周向限位槽设置有沿着所述连接柱槽的径向方向延伸且一端贯穿所述周向限位槽的底壁的安装槽;The circumferential limiting groove is provided with a mounting groove extending along the radial direction of the connecting column groove and having one end penetrating the bottom wall of the circumferential limiting groove;
    所述安装槽内设置有压缩弹簧,所述弹性阻挡块的远离所述阻挡端的一端滑动嵌设于所述安装槽且抵压所述压缩弹簧。A compression spring is provided in the installation slot, and an end of the elastic blocking block away from the blocking end is slidably embedded in the installation slot and presses the compression spring.
  7. 根据权利要求6所述的多载盘晶圆传送设备,其特征在于:The multi-carrier wafer wafer transfer device according to claim 6, wherein:
    所述阻挡端的顶侧设置有上斜面,所述阻挡端的底侧设置有下斜面,所述配合块沿着所述周向限位槽作抵压所述上斜面和所述下斜面的移动时能够将所述弹性阻挡块抵压退回至所述安装槽内。The top side of the blocking end is provided with an upper inclined surface, the bottom side of the blocking end is provided with a lower inclined surface, and the matching block moves along the circumferential limit groove against the movement of the upper inclined surface and the lower inclined surface The elastic blocking block can be pressed back into the installation groove.
  8. 根据权利要求1-7任一项所述的多载盘晶圆传送设备,其特征在于:The multi-carrier wafer transfer equipment according to any one of claims 1-7, wherein:
    所述晶圆载盘的顶部设置有阶梯放置槽;The top of the wafer carrier is provided with a step placement groove;
    所述阶梯放置槽沿着垂直于所述晶圆载盘的方向依次等间隔设置有多个环形凸缘,多个所述环形凸缘的外径从所述阶梯放置槽的底端到顶端逐渐增大;The step placement groove is provided with a plurality of annular flanges at regular intervals along the direction perpendicular to the wafer carrier, and the outer diameters of the plurality of ring flanges gradually increase from the bottom end to the top end of the step placement groove Increase
    位于最顶端的所述环形凸缘的周面设置有倾斜导向面。The circumferential surface of the annular flange at the top end is provided with an inclined guide surface.
  9. 根据权利要求1-8任一项所述的多载盘晶圆传送设备,其特征在于:The multi-carrier wafer transfer equipment according to any one of claims 1-8, wherein:
    所述晶圆载盘与所述圆形轨道固定连接,所述圆形轨道绕着其圆心转动,配置成带动所述晶圆载盘沿着所述圆形轨道所限定的环形轨迹移动。The wafer carrier is fixedly connected to the circular track, and the circular track rotates around its center, and is configured to drive the wafer carrier to move along the circular track defined by the circular track.
  10. 根据权利要求1-9任一项所述的多载盘晶圆传送设备,其特征在于:所述晶圆载盘包括第一载盘、第二载盘、第三载盘和第四载盘,所述圆形轨道转动以带动第一载盘、第二载盘、第三载盘和第四载盘转动至四个传送工位,四个传送工位包括一个清洗工位和三个抛光工位,其中,清洗工位为第一工位,三个抛光工位分别为第二工位、第三工位和第四工位。The multi-carrier wafer transfer device according to any one of claims 1-9, wherein the wafer carrier includes a first carrier, a second carrier, a third carrier, and a fourth carrier , The circular track rotates to drive the first carrier, the second carrier, the third carrier and the fourth carrier to four transfer stations, the four transfer stations include a cleaning station and three polishing stations Work station, where the cleaning station is the first station, and the three polishing stations are the second station, the third station and the fourth station.
  11. 一种多载盘晶圆传送系统,其特征在于:A multi-disc wafer transfer system, characterized by:
    所述多载盘晶圆传送系统包括装载总机构、卸载总机构、装载机构、卸载机构和权利要求1-10任一项所述的多载盘晶圆传送设备;The multi-carrier disk wafer transfer system includes a loading general mechanism, an unloading general mechanism, a loading mechanism, an unloading mechanism, and the multi-carrier disk wafer transfer equipment according to any one of claims 1-10;
    所述清洗工位对应设置有所述装载总机构和所述卸载总机构,每个所述抛光工位对应设置有所述装载机构和所述卸载机构。The cleaning station is correspondingly provided with the loading general mechanism and the unloading general mechanism, and each polishing station is correspondingly provided with the loading mechanism and the unloading mechanism.
  12. 一种基于如权利要求1-10任一项所述的多载盘晶圆传送设备的传送方法,其特征在于:包括以下步骤:A transfer method based on the multi-carrier wafer transfer equipment according to any one of claims 1-10, characterized in that it includes the following steps:
    将晶圆装载至清洗工位上的晶圆载盘上;Load the wafer onto the wafer carrier on the cleaning station;
    沿着圆周运动,将装载有晶圆的晶圆载盘运动至其中一个抛光工位处,并将运动至清洗工位的晶圆载盘上装载晶圆;Along the circular motion, move the wafer carrier loaded with wafers to one of the polishing stations, and move the wafer carrier to the cleaning station to load wafers;
    将再次运动至清洗工位的晶圆载盘上的晶圆进行卸载。Unload the wafers on the wafer carrier that moved to the cleaning station again.
  13. 根据权利要求12所述的多载盘晶圆传送方法,其特征在于:沿着 圆周运动的方向为沿着逆时针方向。The multi-carrier wafer transfer method according to claim 12, wherein the direction of the circular movement is along the counterclockwise direction.
  14. 根据权利要求12或13所述的多载盘晶圆传送方法,其特征在于:晶圆载盘与安装工位的安装步骤包括:每个晶圆载盘利用连接柱和连接柱槽的方式与安装工位可拆卸连接;The multi-carriage wafer transfer method according to claim 12 or 13, wherein the step of installing the wafer carrier and the mounting station comprises: each wafer carrier is connected with a column and a groove Removable connection of installation station;
    其中,连接柱和连接柱槽之间通过周向限位机构和轴向限位机构可拆卸连接。Among them, the connecting column and the connecting column groove are detachably connected by a circumferential limiting mechanism and an axial limiting mechanism.
  15. 根据权利要求14所述的多载盘晶圆传送方法,其特征在于:还包括:每个连接柱和连接柱槽通过至少两个轴向槽和一个弧形槽进行卡接,每个连接柱通过转动的方式与连接柱槽连接。The multi-carrier wafer wafer transfer method according to claim 14, further comprising: each connecting post and the connecting post groove are clamped by at least two axial grooves and an arc-shaped groove, and each connecting post It is connected to the connecting column slot by turning.
  16. 根据权利要求15所述的多载盘晶圆传送方法,其特征在于:The multi-carrier wafer transfer method according to claim 15, wherein:
    每个连接柱通过转动的方式与连接柱槽连接的步骤包括:连接柱的外周壁设置有卡接块,卡接块能够依次滑动嵌设于连接柱槽的第一轴向槽、弧形槽和第二轴向槽;The steps of connecting each connecting column to the connecting column slot by rotating include: the outer peripheral wall of the connecting column is provided with a clamping block, and the clamping block can be sequentially slid and embedded in the first axial slot and the arc-shaped slot of the connecting column slot And the second axial groove;
  17. 根据权利要求16所述的多载盘晶圆传送方法,其特征在于:卡接块依次滑动嵌设于连接柱槽的第一轴向槽、弧形槽和第二轴向槽的步骤包括:连接柱卡入连接柱槽内时,连接柱的卡接块从连接柱槽的第一轴向槽的顶端卡入,卡接块移动至第一轴向槽的底端后,周向转动连接柱,将卡接块卡入弧形槽,卡接块转动至第二轴向槽的顶端后,继续轴向移动卡接块,将卡接块卡入第二轴向槽的底端。The multi-carrier wafer wafer transfer method according to claim 16, wherein the step of the sliding block sequentially slidingly embedded in the first axial groove, the arc-shaped groove and the second axial groove of the connecting column groove comprises: When the connecting post is snapped into the connecting post groove, the connecting block of the connecting post is snapped in from the top of the first axial groove of the connecting post groove, and after the moving of the connecting block to the bottom of the first axial groove, the connection is rotated in the circumferential direction The post engages the clamping block into the arc-shaped slot. After the clamping block rotates to the top of the second axial slot, it continues to move the clamping block axially and snaps the clamping block into the bottom end of the second axial slot.
  18. 根据权利要求17所述的多载盘晶圆传送方法,其特征在于:还包括:连接柱的外壁设置有配合块,配合块能够抵压越过轴向限位机构的弹性阻挡块,并卡入和退出弹性阻挡块和周向限位机构的周向限位槽的底部之间;The multi-carrier wafer wafer transfer method according to claim 17, further comprising: a coupling block is provided on an outer wall of the connecting column, the coupling block can press against the elastic blocking block that crosses the axial limit mechanism and snaps in Between the elastic stop block and the bottom of the circumferential limit slot of the circumferential limit mechanism;
    其中,配合块从周向限位槽的顶端开口卡入,在移动至弹性阻挡块处, 配合块抵压弹性阻拦块,将弹性阻拦块抵压缩回,配合块滑入弹性阻拦块和周向限位槽的底部之间,弹性阻拦块恢复原状,将配合块限位于弹性阻拦块和周向限位槽的底部之间。Among them, the mating block is stuck from the opening of the top of the circumferential limit groove, and when moving to the elastic blocking block, the mating block presses against the elastic blocking block and compresses the elastic blocking block back, the mating block slides into the elastic blocking block and the circumferential Between the bottom of the limiting groove, the elastic blocking block is restored to its original state, and the matching block is limited between the elastic blocking block and the bottom of the circumferential limiting groove.
  19. 根据权利要求18所述的多载盘晶圆传送方法,其特征在于:还包括:周向限位槽设置有安装槽,安装槽内设置有压缩弹簧;The multi-carrier disk wafer transfer method according to claim 18, further comprising: a mounting groove is provided in the circumferential limiting groove, and a compression spring is provided in the mounting groove;
    其中,配合块抵压阻挡端,阻挡端缩回的过程中按压弹簧,弹簧压缩,待配合块滑过弹性阻拦块,弹性阻拦块的阻挡端在弹簧的作用下弹出恢复原状。Wherein, the mating block presses against the blocking end, and the spring is compressed during the process of retracting the blocking end, and the spring is compressed. When the mating block slides over the elastic blocking block, the blocking end of the elastic blocking block pops back to its original shape under the action of the spring.
PCT/CN2019/112167 2019-01-11 2019-10-21 Multi-carrier disk wafer transfer device, transfer system and transfer method WO2020143267A1 (en)

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