WO2020143267A1

WO2020143267A1 - Multi-carrier disk wafer transfer device, transfer system and transfer method

Info

Publication number: WO2020143267A1
Application number: PCT/CN2019/112167
Authority: WO
Inventors: 李婷; 尹影; 贾若雨; 姚远; 费玖海
Original assignee: 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所）
Priority date: 2019-01-11
Filing date: 2019-10-21
Publication date: 2020-07-16
Also published as: TWI733201B; CN109590884B; CN109590884A; TW202041322A

Abstract

A multi-carrier disk wafer transfer device, transfer system, and transfer method. In the multi-carrier disk wafer transfer device, a drive control mechanism (100) can drive and control a circular track (200) to sequentially transfer each wafer carrier disk (300) loaded at a cleaning station to one of polishing stations and enable the wafer carrier disk to stay at said polishing station and to complete unloading and loading at said polishing station; and said mechanism can also drive and control the circular track (200) to transfer each wafer carrier disk (300) loaded at the polishing station to the cleaning station, and enable the wafer carrier disk to stay at the cleaning station and to complete unloading. Such a transmission mode can support a multi-step complex process flow, achieving polishing of each wafer at the polishing station independently, and achieving high-efficiency transmission between different transfer stations. The multi-carrier disk wafer transfer system comprises the multi-carrier disk wafer transfer device. The multi-carrier disk wafer transfer method is based on the multi-carrier disk wafer transfer device.

Description

Multi-carrier disk wafer transfer equipment, transfer system and transfer method

Cross-reference of related applications

This application requires the priority of the Chinese patent application with the application number 201910028558.3 and the name "multi-carrier wafer transfer equipment and transfer system" submitted to the Chinese Patent Office on January 11, 2019, the entire content of which is incorporated herein by reference Applying.

Technical field

The present application relates to the field of wafer processing, and in particular, to a multi-carrier disk wafer transfer device, a transfer system, and a transfer method.

Background technique

At present, the transmission methods and disadvantages of wafers between different transfer stations:

1. Use the rotation of the polishing head for wafer transmission. The transmission and the process are bound together, resulting in a many-to-many working mode between the polishing head and the worktable. The disadvantage is that the process conversion between different polishing tables is prone to contamination, and the differences between the polishing heads will eventually be reflected in Wafer flattening effect.

2. Wafer transfer through linear movement of the stage. The linear movement design limits the flexibility of the transmission. In addition, the design is not easy to maintain and has a high incidence of errors.

Application content

This application provides a multi-carrier wafer wafer transfer equipment to solve the problem of wafer transfer using polishing head rotation and linear movement of the stage. The process conversion between different polishing stations is prone to contamination, and the design of linear movement makes the transmission flexible At least one of the problems of limited performance and low transmission efficiency.

The present application provides a multi-carrier wafer transfer system provided with the above-mentioned multi-carrier wafer transfer device.

The multi-carrier disk wafer transfer equipment provided in the embodiments of the present application,

It includes a circular track, a cleaning station, a plurality of polishing stations, and a plurality of polishing stations, which are sequentially arranged at equal intervals along the circumferential direction of the circular track, and a plurality of wafer carrier disks and a drive control mechanism, which are sequentially arranged at equal intervals on the circular track ;

The drive control mechanism can drive and control the circular track to transfer each wafer carrier that has been loaded in the cleaning station to one of the polishing stations in turn, and unload and complete the loading at the polishing station; the drive control mechanism can drive Control the circular track to transfer and stop each wafer carrier loaded in the polishing station to the cleaning station, and complete the unloading.

The wafer carrier is fixedly connected to a circular track, and the circular track rotates around its center, which drives the wafer carrier to move along the circular track defined by the circular track. There is no limit to the number of wafer carriers that can be set, and the number can be set according to actual needs.

Optionally, four wafer carriers are provided, and the four wafer carriers are named as first carrier, second carrier, third carrier and fourth carrier respectively, and the circular track rotates to drive four The wafer carrier rotates to four transfer jobs, including a cleaning station and three polishing stations, of which the cleaning station is the first station, and the three polishing stations are the second station, the third station and the The fourth station.

The actual transmission process is like this:

(1) In the initial state, the first carrier corresponds to the first station, and the wafer is loaded onto the first carrier corresponding to the first station;

(2) The circular rail and the wafer carrier move counterclockwise, where the first carrier carries the wafer to the second station, and the second carrier rotating to the first station loads the wafer;

(3) The circular track and the wafer carrier move counterclockwise, where the first carrier carries the wafer to the third station, the second carrier carries the wafer to the second station, and rotates to the first station The third carrier is loaded with wafers;

(4) The circular rail and the wafer carrier move counterclockwise, where the first carrier carries the wafer to the fourth station, the second carrier moves the wafer to the third station, and the third carrier The wafer moves to the second station, and the fourth carrier that rotates to the first station loads the wafer;

(5) The circular track and the wafer carrier move counterclockwise, where the first carrier unloads the wafer and repeat steps (1) to (4).

Using the above-mentioned transmission method can support multi-step complex process flow, and realize efficient transfer of wafers between different transfer stations.

Optionally, a plurality of installation stations are arranged at regular intervals along the circumferential direction of the circular track, and each installation station is correspondingly provided with a wafer carrier tray;

Each installation station is provided with a first connector; the bottom of each wafer carrier is provided with a second connector, and the first connector and the second connector are detachably connected.

Optionally, the first connecting piece is provided with a connecting column groove;

The second connecting piece is provided with a connecting column, the connecting column is embedded in the connecting column slot, and the connecting column and the connecting column slot are detachably connected by a circumferential limit mechanism and an axial limit mechanism.

Optionally, the circumferential limit mechanism includes a first axial groove and a second axial groove arranged in sequence along the axial direction of the connecting column groove, the first axial groove and the second axial groove are along the connecting column groove Is arranged at equal intervals in the circumferential direction, the top end of the first axial groove penetrates the top end of the connecting column groove;

The axial limit mechanism includes a circumferentially extending arc-shaped groove connecting the bottom end of the first axial groove and the top end of the second axial groove;

The outer peripheral wall of the connecting column is provided with a clamping block, and the clamping block can be slidably embedded in the first axial groove, the arc-shaped groove and the second axial groove in this order.

Optionally, the circumferential limit mechanism includes a circumferential limit slot extending along the axial direction of the connecting column slot, and the top end of the circumferential limit slot penetrates the top end of the connecting column slot;

The axial limit mechanism includes an elastic blocking block provided in the circumferential limit slot and moving back and forth along the radial direction of the connecting column slot; one end of the elastic blocking block is a blocking end and can extend into the connecting column slot;

The outer wall of the connecting column is provided with a matching block; the matching block can press against the elastic blocking block and snap into and out of between the elastic blocking block and the bottom of the circumferential limit groove.

Optionally, the circumferential limit groove is provided with a mounting groove extending along the radial direction of the connecting column groove and having one end penetrating the bottom wall of the circumferential limit groove;

The installation groove is provided with a compression spring, and the end of the elastic blocking block away from the blocking end is slidably embedded in the installation groove and presses against the compression spring.

Optionally, the top side of the blocking end is provided with an upper inclined surface, and the bottom side of the blocking end is provided with a lower inclined surface. When the matching block moves along the circumferential limit groove to press the upper and lower inclined surfaces, the elastic blocking block can be pressed back Into the installation slot.

Optionally, a step placement groove is provided on the top of the wafer carrier;

The step placement groove is provided with a plurality of annular flanges at regular intervals along the direction perpendicular to the wafer carrier, and the outer diameters of the plurality of ring flanges gradually increase from the bottom end to the top end of the step placement groove;

The circumferential surface of the annular flange at the top end is provided with an inclined guide surface.

Optionally, the wafer carrier is fixedly connected to the circular track, and the circular track rotates around its center, and is configured to drive the wafer carrier along the ring defined by the circular track The trajectory moves.

Optionally, the wafer carrier includes a first carrier, a second carrier, a third carrier, and a fourth carrier, and the circular track rotates to drive the first carrier, the second carrier, and the second carrier The three carrier and the fourth carrier rotate to four transfer stations. The four transfer stations include a cleaning station and three polishing stations. The cleaning station is the first station and the three polishing stations are respectively It is the second station, the third station and the fourth station.

A multi-disc wafer transfer system,

The multi-carrier disk wafer transfer system includes a loading general mechanism, an unloading general mechanism, a loading mechanism, an unloading mechanism and a multi-carrier disk wafer transfer equipment;

The cleaning station is correspondingly provided with a loading general mechanism and an unloading general mechanism, and each polishing station is correspondingly provided with a loading mechanism and an unloading mechanism.

This application provides a method for transferring a multi-carrier disk wafer transfer device, including the following steps:

Load the wafer onto the wafer carrier on the cleaning station;

Along the circular motion, move the wafer carrier loaded with wafers to one of the polishing stations, and move the wafer carrier to the cleaning station to load wafers;

Unload the wafers on the wafer carrier that moved to the cleaning station again.

Optionally, the direction of motion along the circle is along the counterclockwise direction.

Optionally, the installation steps of the wafer carrier and the installation station include: each wafer carrier is detachably connected to the installation station by means of a connecting column and a connecting column slot;

Among them, the connecting column and the connecting column groove are detachably connected by a circumferential limiting mechanism and an axial limiting mechanism.

Optionally, the method further includes: each connecting post and the connecting post groove are clamped by at least two axial grooves and an arc-shaped groove, and each connecting post is connected to the connecting post groove by means of rotation.

Optionally, the step of connecting each connecting column to the connecting column slot by means of rotation includes: the outer peripheral wall of the connecting column is provided with a clamping block, and the clamping block can be sequentially slidably embedded in the first axial slot of the connecting column slot , Arc groove and second axial groove;

Optionally, the step of the sliding engagement block slidingly embedded in the first axial groove, the arc-shaped groove and the second axial groove of the connecting column groove in turn includes: when the connecting column is snapped into the connecting column groove, the connecting column is clamped The block is snapped from the top of the first axial groove of the connecting column groove, and after the clamping block moves to the bottom end of the first axial groove, the connecting column is rotated circumferentially to snap the clamping block into the arc-shaped groove and the clamping block After rotating to the top of the second axial groove, continue to move the clamping block axially, and snap the clamping block into the bottom end of the second axial groove.

Optionally, the outer wall of the connecting column is provided with a matching block, which can press against the elastic blocking block of the axial limiting mechanism, and snap into and out of the elastic blocking block and the circumferential limiting groove of the circumferential limiting mechanism Between the bottom

Among them, the mating block is stuck from the opening of the top of the circumferential limit groove, and when moving to the elastic blocking block, the mating block presses against the elastic blocking block and compresses the elastic blocking block back, the mating block slides into the elastic blocking block and the circumferential Between the bottom of the limiting groove, the elastic blocking block is restored to its original state, and the matching block is limited between the elastic blocking block and the bottom of the circumferential limiting groove.

Optionally, the circumferential limit groove is provided with an installation groove, and a compression spring is provided in the installation groove;

Wherein, the mating block presses against the blocking end, and the spring is compressed during the process of retracting the blocking end, and the spring is compressed. When the mating block slides over the elastic blocking block, the blocking end of the elastic blocking block pops back to its original shape under the action of the spring.

The beneficial effects of the present application include at least: multi-carrier disk wafer transfer equipment. Compared with the traditional method of wafer transmission using polishing head rotation, the wafer is transferred between different transfer stations using rails and carrier disks, and the transmission is separated With the process, each wafer can be independently polished at the polishing station, effectively reducing the possibility of contamination of the polishing head; each wafer corresponding to the polishing station is polished by a different polishing head, reducing the difference due to the polishing head The probability of a difference in wafer flattening effect. Compared with the traditional method of wafer transfer by linear movement of the stage, the circular drive rail is fixed to the carrier plate and has higher stability, which can effectively reduce the possibility of errors in the transmission process and the equipment is easier to maintain. This transmission method can support multi-step complex process flow, and realize the efficient transfer of wafers between different transfer stations.

Multi-carrier disk wafer transfer system, use the loading general mechanism to complete loading in the cleaning station and use the unloading general mechanism to complete unloading, use the unloading mechanism to complete the unloading in the polishing station and use the loading mechanism to complete loading, and then use the multi-carrier disk wafer transfer The equipment realizes the transfer, which significantly improves the transfer efficiency of the wafer between different transfer stations.

BRIEF DESCRIPTION

In order to more clearly explain the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, so they are not It should be regarded as a limitation on the scope. For those of ordinary skill in the art, without paying any creative work, other related drawings can be obtained based on these drawings.

1 is a schematic diagram of a first working state of a multi-carrier disk wafer transfer device provided by an embodiment of the present application;

2 is a front view of a multi-carrier disk wafer transfer device provided by an embodiment of the present application;

FIG. 3 is a schematic diagram of a second working state of a multi-carrier wafer transfer device provided by an embodiment of the present application;

4 is a schematic diagram of a third working state of a multi-carrier disk wafer transfer device provided by an embodiment of the present application;

FIG. 5 is a schematic diagram of a fourth working state of a multi-carrier wafer transfer device provided by an embodiment of the present application;

FIG. 6 is a schematic structural diagram of a first structure of a multi-carrier wafer transfer device provided by an embodiment of the present application;

7 is a partial enlarged view of A in FIG. 6 of an embodiment of the present application;

8 is a schematic structural diagram of a wafer carrier disk in a first structure of a multi-carrier disk wafer transfer device according to an embodiment of the present application;

9 is a schematic structural diagram of a second structure of a multi-carrier disk wafer transfer device provided by an embodiment of the present application;

10 is a partial enlarged view of B in FIG. 9 provided by an embodiment of the present application;

11 is a schematic structural diagram of a wafer carrier disk in a second structure of a multi-carrier disk wafer transfer device according to an embodiment of the present application;

12 is a schematic diagram of a first structure of a wafer carrier provided by an embodiment of the present application.

Icon: 100-drive control mechanism; 200-circular track; 210-installation station; 220-first connector; 221-connected column slot; 300-wafer carrier; 310-second connector; 311-connected Column; 312-clamping block; 313-fitting block; 320-step placement groove; 321-ring flange; 322-inclined guide surface; 330-absorbent soft hair; 400-circumferential limit mechanism; 410-first axis Groove; 420-second axial groove; 430-circumferential limit groove; 500-axial limit mechanism; 510-arc groove; 520-elastic blocking block; 521-blocking end; 522-upper slope; 523 -Lower slope; 010-mounting groove; 020-spring; 001-first carrier; 002-second carrier; 003-third carrier; 004-fourth carrier; 005-first station; 006- Second station; 007-third station; 008-fourth station.

detailed description

To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments It is a part of the embodiments of this application, but not all the embodiments. The components of the embodiments of the present application generally described and illustrated in the drawings herein can be arranged and designed in various configurations.

Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

If the terms "horizontal" and "vertical" appear in the description of the present invention, it does not mean that the components are absolutely horizontal or overhanging, but may be slightly inclined. For example, "horizontal" only means that its direction is more horizontal than "vertical", it does not mean that the structure must be completely horizontal, but it can be slightly inclined.

In the description of the present invention, it should also be noted that, unless otherwise clearly specified and limited, the terms “setup”, “installation”, “connected”, and “connected” should be broadly understood, for example, “connected” It can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or it can be indirectly connected through an intermediary, or it can be an internal connection between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood in specific situations.

Referring to FIGS. 1-12, an embodiment of the present application provides a multi-carrier wafer transfer equipment, as shown in FIGS. 1 and 2, including a circular track 200, which are sequentially disposed at regular intervals along the circumferential direction of the circular track 200. Work stations, multiple polishing stations, and multiple wafer carriers 300 and drive control mechanisms 100 that are sequentially arranged at equal intervals on the circular track 200;

The drive control mechanism 100 can drive and control the circular rail 200 to transfer each wafer carrier 300 that has been loaded at the cleaning station to one of the polishing stations in sequence, and unload and complete the loading at the polishing station; drive control The mechanism 100 can drive and control the circular rail 200 to transfer and stop each wafer carrier 300 that has been loaded at the polishing station to the cleaning station, and complete the unloading.

The wafer carrier 300 is fixedly connected to the circular rail 200. The circular rail 200 rotates around the center of the circle to drive the wafer carrier 300 to move along the circular trajectory defined by the circular rail 200. The number of wafer carriers 300 is not limited, and the number can be set according to actual needs.

An embodiment of the present application provides a transfer method for a multi-carrier disk wafer transfer device, including the following steps: loading wafers onto a wafer carrier 300 on a cleaning station; moving along a circular motion The wafer carrier 300 moves to one of the polishing stations, and the wafer is loaded on the wafer carrier 300 moved to the cleaning station; the wafer on the wafer carrier 300 moved to the cleaning station again is carried out Uninstall.

For example, in this embodiment, four wafer carriers 300 are provided, and the four wafer carriers 300 are named first carrier 001, second carrier 002, third carrier 003, and fourth carrier, respectively. 004, the circular track 200 rotates to drive the four wafer carriers 300 to four transfer jobs, including a cleaning station and three polishing stations, of which the cleaning station is the first station 005, three polishing The stations are the second station 006, the third station 007 and the fourth station 008.

The actual transmission process is like this:

(1) As shown in FIG. 1, in the initial state, the first carrier 001 corresponds to the first station 005, and the wafer is loaded onto the first carrier 001 corresponding to the first station 005;

(2) As shown in FIG. 3, the circular rail 200 and the wafer carrier 300 move counterclockwise, where the first carrier 001 carries the wafer to the second station 006 and rotates to the first station 005 The second carrier 002 is loaded with wafers;

(3) As shown in FIG. 4, the circular rail 200 and the wafer carrier 300 move counterclockwise, wherein the first carrier 001 carries the wafer to the third station 007, and the second carrier 002 carries the wafer to move To the second station 006, the third carrier 003 rotating to the first station 005 loads the wafer;

(4) As shown in FIG. 5, the circular rail 200 and the wafer carrier 300 move counterclockwise, wherein the first carrier 001 carries the wafer to the fourth station 008, and the second carrier 002 carries the wafer to move To the third station 007, the third carrier 003 carries the wafer to the second station 006 and rotates to the fourth carrier 004 of the first station 005 to load the wafer;

(5) The circular rail 200 and the wafer carrier 300 move counterclockwise, wherein the first carrier 001 unloads the wafer, and repeat steps (1) to (4).

Optionally, as shown in FIGS. 6 and 8, each installation station 210 is provided with a first connector 220;

A second connector 310 is provided at the bottom of each wafer carrier 300, and the first connector 220 and the second connector 310 are detachably connected.

The wafer carrier 300 and the circular rail 200 are detachably connected through the first connector 220 and the second connector 310. The number of installation stations 210 is not limited. During actual transfer, different numbers of wafer carriers can be installed according to requirements The disk 300 can prevent the wafer carrier 300 from idling, and reduce the rotational load of the circular rail 200.

Optionally, the installation steps of the wafer carrier 300 and the installation station include: each wafer carrier 300 is detachably connected to the installation station by means of a connecting post 331 and a connecting post groove 221; wherein, the connecting post 331 and The connecting column groove 221 is detachably connected by a circumferential limiting mechanism and an axial limiting mechanism.

Optionally, as shown in FIG. 7, the first connecting member 220 is provided with a connecting column groove 221;

The second connecting member 310 is provided with a connecting post 311, and the connecting post 311 is embedded in the connecting post groove 221, and the connecting post 311 and the connecting post groove 221 are detachably connected by a circumferential limiting mechanism 400 and an axial limiting mechanism 500.

The connection between the first connection member 220 and the second connection member 310 is connected by a connection post 311 and a connection post groove 221. The circumferential limiting mechanism 400 is configured to restrict the circumferential rotation between the connecting post 311 and the connecting post groove 221, and the axial limiting mechanism 500 is configured to restrict the axial movement of the connecting post 311 and the connecting post groove 221, thereby firmly The connecting post 311 and the connecting post groove 221 are connected together.

Optionally, as shown in FIGS. 6 and 7, the circumferential limit mechanism 400 includes a first axial groove 410 and a second axial groove 420 that are sequentially arranged along the axial direction of the connecting column groove 221, the first axis The grooves 410 and the second axial grooves 420 are arranged at equal intervals along the circumferential direction of the connecting column groove 221, and the top end of the first axial groove 410 penetrates the top end of the connecting column groove 221;

The axial limiting mechanism 500 includes a circumferentially extending arc-shaped groove 510 connecting the bottom end of the first axial groove 410 and the top end of the second axial groove 420;

As shown in FIG. 8, the outer peripheral wall of the connecting post 311 is provided with a clamping block 312, which can be slidably embedded in the first axial groove 410, the arc-shaped groove 510 and the second axial groove 420 in this order.

The connecting post 311 snaps into the connecting post groove 221, and the snap block 312 snaps in from the top of the first axial groove 410. After the snap block 312 moves to the bottom end of the first axial groove 410, the connecting post 311 is rotated circumferentially. Snap the clamping block 312 into the arc groove 510, after the clamping block 312 rotates to the top of the second axial groove 420, continue to move the clamping block 312 axially, and snap the clamping block 312 into the second axial groove 420 The bottom end, that is, the process of snapping is to sequentially snap into the first axial groove 410, the arc groove 510, and the second axial groove 420, and the process of taking out the connecting post 311, that is, the snap block 312 is sequentially The two axial grooves 420, the arc-shaped groove 510 and the first axial groove 410 exit.

The second axial groove 420 restricts the relative circumferential movement of the connecting post 311 and the connecting post groove 221, and the arc-shaped groove 510 restricts the axial movement of the connecting post 311 relative to the connecting post groove 221, thereby being able to restrict the connecting post 311 and the connection The connection relationship of the column groove 221.

Optionally, as shown in FIGS. 9 and 10, the circumferential limit mechanism 400 includes a circumferential limit groove 430 extending along the axial direction of the connecting column groove 221, and the top end of the circumferential limit groove 430 is connected through The top end of the column groove 221;

The axial limiting mechanism 500 includes an elastic blocking block 520 disposed in the circumferential limiting groove 430 and moving back and forth along the radial direction of the connecting column groove 221; one end of the elastic blocking block 520 is the blocking end 521 and can extend into the connecting column Slot 221;

As shown in FIG. 11, the outer wall of the connecting post 311 is provided with a fitting block 313; the fitting block 313 can press against the elastic blocking block 520 and snap into and out of between the elastic blocking block 520 and the bottom of the circumferential limiting groove 430.

The connecting post 311 is snapped into the connecting post groove 221, and the engaging block 313 is engaged from the top opening of the circumferential limiting groove 430. When moving to the elastic blocking block 520, the engaging block 313 presses against the elastic blocking block and compresses the elastic blocking block Back, the matching block 313 slides between the elastic blocking block and the bottom of the circumferential limiting groove 430, the elastic blocking block returns to its original shape, and the matching block 313 is limited between the elastic blocking block and the bottom of the circumferential limiting groove 430; When the column 311 is taken out of the connecting column groove 221, the matching block 313 presses the elastic blocking block from the lower side of the elastic blocking block to compress the elastic blocking block back again, the matching block 313 slides over the elastic blocking block, and the elastic blocking block returns to its original state. The connecting post 311 is taken out of the connecting post groove 221.

Optionally, as shown in FIG. 10, the circumferential limiting groove 430 is provided with a mounting groove 010 extending along the radial direction of the connecting column groove 221 and having one end penetrating the bottom wall of the circumferential limiting groove 430;

A compression spring 020 is disposed in the mounting groove 010, and an end of the elastic blocking block 520 away from the blocking end 521 is slidably fitted into the mounting groove 010 and presses against the compression spring 020.

The mating block 313 presses against the blocking end 521, and the spring 020 is compressed during the process of the blocking end 521 retracting. When the mating block 313 slides over the elastic blocking block, the blocking end 521 of the elastic blocking block pops up and recovers under the action of the spring 020 Undisturbed.

Optionally, as shown in FIG. 10, the top side of the blocking end 521 is provided with an upper inclined surface 522, the bottom side of the blocking end 521 is provided with a lower inclined surface 523, and the matching block 313 acts as a pressing force against the upper inclined surface along the circumferential limiting groove 430 When the 522 and the lower inclined surface 523 move, the elastic blocking block 520 can be pressed back into the installation groove 010.

The mating block 313 moves up and down along the circumferential limiting groove 430, and is configured into the upper inclined surface 522 and the lower inclined surface 523, which acts on the elastic blocking block in the radial direction of the connecting column groove 221, which can block the elastic block The block is pressed back into the installation groove 010, so that the matching block 313 slides over the elastic blocking block.

Optionally, as shown in FIG. 12, a step placement groove 320 is provided on the top of the wafer carrier 300;

The step placement groove 320 is provided with a plurality of annular flanges 321 at regular intervals along the direction perpendicular to the wafer carrier 300, and the outer diameters of the plurality of ring flanges 321 gradually increase from the bottom end to the top end of the step placement groove 320;

The circumferential surface of the annular flange 321 located at the top end is provided with an inclined guide surface 322. .

The step placement groove 320 can place wafers of different diameters, which is convenient for transferring different types of wafers. The inclined guide surface 322 is provided to guide the wafer into the step placement groove 320.

This embodiment provides a multi-carrier disk wafer transfer system. The multi-carrier disk wafer transfer system includes a loading general mechanism, an unloading general mechanism, a loading mechanism, an unloading mechanism, and a multi-carrier disk wafer transfer device;

The washing station is correspondingly provided with a loading general mechanism and an unloading general mechanism, and each polishing station is correspondingly provided with a loading mechanism and an unloading mechanism.

The circular track 200 drives each wafer carrier 300 to move and stay in the cleaning station, and the loading mechanism loads the wafer. Then, the circular track 200 drives the wafer from the cleaning station to one of the polishing stations and stays in In the polishing station, the wafer is unloaded for polishing by the unloading mechanism. After the polishing is completed, the wafer is loaded by the loading mechanism. Finally, the circular track 200 drives the wafer from the polishing station to the cleaning station for cleaning, and then uses the unloading The mechanism completes unloading and finishes wafer polishing.

Each polishing station is correspondingly provided with a polishing head, and each wafer moved to the polishing station is separately polished, which is not easy to be contaminated with each other.

The above are only preferred embodiments of the present application, and are not configured to limit the present application. For those skilled in the art, the present application may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. within the spirit and principle of this application shall be included in the scope of protection of this application.

Industrial applicability

The multi-carrier disk wafer transfer equipment provided in the embodiments of the present application can support multi-step complex process flows, and realize that each wafer is independently polished at the polishing station and efficiently transferred between different transfer stations.

Claims

A multi-disc wafer transfer equipment, characterized by:

It includes a circular track, a cleaning station, a plurality of polishing stations that are arranged at equal intervals in sequence along the circumferential direction of the circular track, and a plurality of wafer carrier trays that are sequentially arranged at equal intervals on the circular track And drive control mechanism;

The drive control mechanism can drive and control the circular track to transfer each wafer carrier that has been loaded at the cleaning station to one of the polishing stations in turn, and then to the polishing station Unloading and loading are completed; the drive control mechanism can drive and control the circular track to transfer and stop each wafer carrier that has been loaded at the polishing station to the cleaning station, and complete unloading .
The multi-carrier wafer wafer transfer device according to claim 1, wherein:

A plurality of installation stations are sequentially arranged at equal intervals along the circumferential direction of the circular track, and each of the installation stations is correspondingly provided with one wafer carrier tray;

Each of the installation stations is provided with a first connector; a bottom connector of each wafer carrier is provided with a second connector, and the first connector and the second connector are detachably connected.
The multi-carrier disk wafer transfer device according to claim 2, wherein:

The first connecting piece is provided with a connecting column groove;

The second connecting piece is provided with a connecting column, the connecting column is embedded in the connecting column slot, and the connecting column and the connecting column slot are detachable through a circumferential limit mechanism and an axial limit mechanism connection.
The multi-carrier disk wafer transfer device according to claim 3, wherein:

The circumferential limit mechanism includes a first axial groove and a second axial groove arranged in sequence along the axial direction of the connecting column groove, the first axial groove and the second axial groove The connecting column grooves are arranged at equal intervals in the circumferential direction, and the top end of the first axial groove penetrates the top end of the connecting column groove;

The axial limiting mechanism includes a circumferentially extending arc-shaped groove communicating the bottom end of the first axial groove and the top end of the second axial groove;

A clamping block is provided on the outer peripheral wall of the connecting column, and the clamping block can be slidably embedded in the first axial groove, the arc-shaped groove, and the second axial groove in this order.
The multi-carrier wafer transfer equipment according to claim 3 or 4, wherein:

The circumferential limiting mechanism includes a circumferential limiting groove extending along the axial direction of the connecting column groove, and a top end of the circumferential limiting groove penetrates the top end of the connecting column groove;

The axial limiting mechanism includes an elastic blocking block provided in the circumferential limiting slot and moving back and forth along the radial direction of the connecting column slot; one end of the elastic blocking block is a blocking end and can extend into The connecting column slot;

The outer wall of the connecting column is provided with a matching block; the matching block can press against the elastic blocking block and snap into and out of between the elastic blocking block and the bottom of the circumferential limiting groove.
The multi-carrier wafer wafer transfer device according to claim 5, wherein:

The circumferential limiting groove is provided with a mounting groove extending along the radial direction of the connecting column groove and having one end penetrating the bottom wall of the circumferential limiting groove;

A compression spring is provided in the installation slot, and an end of the elastic blocking block away from the blocking end is slidably embedded in the installation slot and presses the compression spring.
The multi-carrier wafer wafer transfer device according to claim 6, wherein:

The top side of the blocking end is provided with an upper inclined surface, the bottom side of the blocking end is provided with a lower inclined surface, and the matching block moves along the circumferential limit groove against the movement of the upper inclined surface and the lower inclined surface The elastic blocking block can be pressed back into the installation groove.
The multi-carrier wafer transfer equipment according to any one of claims 1-7, wherein:

The top of the wafer carrier is provided with a step placement groove;

The step placement groove is provided with a plurality of annular flanges at regular intervals along the direction perpendicular to the wafer carrier, and the outer diameters of the plurality of ring flanges gradually increase from the bottom end to the top end of the step placement groove Increase

The circumferential surface of the annular flange at the top end is provided with an inclined guide surface.
The multi-carrier wafer transfer equipment according to any one of claims 1-8, wherein:

The wafer carrier is fixedly connected to the circular track, and the circular track rotates around its center, and is configured to drive the wafer carrier to move along the circular track defined by the circular track.
The multi-carrier wafer transfer device according to any one of claims 1-9, wherein the wafer carrier includes a first carrier, a second carrier, a third carrier, and a fourth carrier , The circular track rotates to drive the first carrier, the second carrier, the third carrier and the fourth carrier to four transfer stations, the four transfer stations include a cleaning station and three polishing stations Work station, where the cleaning station is the first station, and the three polishing stations are the second station, the third station and the fourth station.
A multi-disc wafer transfer system, characterized by:

The multi-carrier disk wafer transfer system includes a loading general mechanism, an unloading general mechanism, a loading mechanism, an unloading mechanism, and the multi-carrier disk wafer transfer equipment according to any one of claims 1-10;

The cleaning station is correspondingly provided with the loading general mechanism and the unloading general mechanism, and each polishing station is correspondingly provided with the loading mechanism and the unloading mechanism.
A transfer method based on the multi-carrier wafer transfer equipment according to any one of claims 1-10, characterized in that it includes the following steps:

Load the wafer onto the wafer carrier on the cleaning station;

Along the circular motion, move the wafer carrier loaded with wafers to one of the polishing stations, and move the wafer carrier to the cleaning station to load wafers;

Unload the wafers on the wafer carrier that moved to the cleaning station again.
The multi-carrier wafer transfer method according to claim 12, wherein the direction of the circular movement is along the counterclockwise direction.
The multi-carriage wafer transfer method according to claim 12 or 13, wherein the step of installing the wafer carrier and the mounting station comprises: each wafer carrier is connected with a column and a groove Removable connection of installation station;

Among them, the connecting column and the connecting column groove are detachably connected by a circumferential limiting mechanism and an axial limiting mechanism.
The multi-carrier wafer wafer transfer method according to claim 14, further comprising: each connecting post and the connecting post groove are clamped by at least two axial grooves and an arc-shaped groove, and each connecting post It is connected to the connecting column slot by turning.
The multi-carrier wafer transfer method according to claim 15, wherein:

The steps of connecting each connecting column to the connecting column slot by rotating include: the outer peripheral wall of the connecting column is provided with a clamping block, and the clamping block can be sequentially slid and embedded in the first axial slot and the arc-shaped slot of the connecting column slot And the second axial groove;
The multi-carrier wafer wafer transfer method according to claim 16, wherein the step of the sliding block sequentially slidingly embedded in the first axial groove, the arc-shaped groove and the second axial groove of the connecting column groove comprises: When the connecting post is snapped into the connecting post groove, the connecting block of the connecting post is snapped in from the top of the first axial groove of the connecting post groove, and after the moving of the connecting block to the bottom of the first axial groove, the connection is rotated in the circumferential direction The post engages the clamping block into the arc-shaped slot. After the clamping block rotates to the top of the second axial slot, it continues to move the clamping block axially and snaps the clamping block into the bottom end of the second axial slot.
The multi-carrier wafer wafer transfer method according to claim 17, further comprising: a coupling block is provided on an outer wall of the connecting column, the coupling block can press against the elastic blocking block that crosses the axial limit mechanism and snaps in Between the elastic stop block and the bottom of the circumferential limit slot of the circumferential limit mechanism;

Among them, the mating block is stuck from the opening of the top of the circumferential limit groove, and when moving to the elastic blocking block, the mating block presses against the elastic blocking block and compresses the elastic blocking block back, the mating block slides into the elastic blocking block and the circumferential Between the bottom of the limiting groove, the elastic blocking block is restored to its original state, and the matching block is limited between the elastic blocking block and the bottom of the circumferential limiting groove.
The multi-carrier disk wafer transfer method according to claim 18, further comprising: a mounting groove is provided in the circumferential limiting groove, and a compression spring is provided in the mounting groove;

Wherein, the mating block presses against the blocking end, and the spring is compressed during the process of retracting the blocking end, and the spring is compressed. When the mating block slides over the elastic blocking block, the blocking end of the elastic blocking block pops back to its original shape under the action of the spring.