CN215600347U - Bearing device and semiconductor processing equipment - Google Patents

Abstract

The application provides a bearing device and semiconductor processing equipment. The bearing device comprises a bearing platform and a pressing component. The carrying platform comprises a plurality of annular carrying pieces, the carrying pieces are sequentially sleeved, each carrying piece comprises a carrying surface and encloses an accommodating cavity, the carrying surfaces of the carrying pieces are used for carrying workpieces with different sizes, the carrying surfaces of the carrying pieces are different in height, and the heights of the carrying surfaces are gradually increased from the center to the edge of the carrying platform; the pressing assembly is arranged on the bearing piece and comprises a pressing piece and a driving piece connected with the pressing piece, the pressing piece is used for pressing a first area of the workpiece on the bearing surface, the accommodating cavity corresponds to a second area of the workpiece, and the driving piece is used for driving the pressing piece to rotate relative to the carrier platform so as to selectively press or release the first area of the workpiece. In the bearing device of this application, the second region that holds the chamber and work piece of bearing piece corresponds, avoids second region and the contact of bearing piece.

Description

Bearing device and semiconductor processing equipment

Technical Field

The present application relates to the field of semiconductor inspection technologies, and more particularly, to a carrier and a semiconductor processing apparatus.

Background

The detection requirement for the piece to be detected on the market is higher and higher, and the defects on the front side and the back side of the piece to be detected need to be detected. However, most of the current bearing devices for the to-be-detected pieces are flat surfaces, and the to-be-detected pieces are directly placed on the flat surfaces, so that one surface of the to-be-detected pieces is inevitably in physical contact with the flat surfaces, and further, the contact surface between the central part of the to-be-detected pieces and the flat surfaces is polluted and defective.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a bearing device and semiconductor processing equipment.

The bearing device of the embodiment of the application comprises a carrier and a pressing assembly. The carrying platform comprises a plurality of annular carrying pieces, the carrying pieces are sequentially sleeved, each carrying piece comprises a carrying surface and encloses an accommodating cavity, the carrying surface of each carrying piece is used for carrying workpieces with different sizes, the carrying surfaces of the carrying pieces are different in height, and the heights of the carrying surfaces are gradually increased from the center to the edge of the carrying platform; the pressing assembly is arranged on the bearing piece and comprises a pressing piece and a driving piece connected with the pressing piece, the pressing piece is used for pressing a first area of the workpiece on the bearing surface, the accommodating cavity corresponds to a second area of the workpiece, and the driving piece is used for driving the pressing piece to rotate relative to the carrier platform so as to selectively press or release the first area of the workpiece.

In some embodiments, the carriers include sides, and the sides of each carrier are provided with the pressing assembly.

In some embodiments, a plurality of the pressing assemblies are disposed on a side surface of each of the carriers, and the plurality of the pressing assemblies are uniformly distributed around the center of the carrier in a circumferential manner.

In certain embodiments, each of the pressing assemblies further comprises a holder. The fixing seat is mounted on the bearing part and extends out of the side face, the driving part is mounted on the fixing seat, the pressing part comprises a connecting end and a pressing end which are back to back, the connecting end is connected with an output shaft of the driving part, and the pressing face of the pressing end is used for pressing the first area of the workpiece on the bearing surface.

In some embodiments, when the output shaft of the driving member rotates in a first direction, the pressing end rotates along with the output shaft in the first direction, and the pressing surface is far away from the bearing surface; when the output shaft of the driving piece rotates along a second direction, the pressing end rotates along the second direction along with the output shaft, the pressing surface is close to the bearing surface, and the first direction is opposite to the second direction.

In certain embodiments, the drive member comprises a cylinder or a motor.

In some embodiments, the carrying device further includes a limiting assembly, a plurality of limiting assemblies are disposed on a side surface of each carrying member, and the plurality of limiting assemblies are commonly used for limiting the workpiece.

In some embodiments, each of the limiting assemblies comprises a protrusion and a limiting member. The protrusion extends from a side of the carrier; the limiting part is arranged on the protruding part and is higher than the bearing surface, the limiting part comprises an arc-shaped limiting surface, and the limiting surface is used for abutting against the workpiece to limit the workpiece.

In certain embodiments, the carrier further comprises a connection assembly. The side of two adjacent carriers is all connected by one the coupling assembling, every the coupling assembling includes a plurality of mutual spaced connecting pieces, a plurality of the interval between the connecting piece is used for holding press the subassembly.

In some embodiments, the other carriers except the innermost ring of the carriers are opened with an opening for a robot to pass through to place the workpiece on the carrying surface.

In some embodiments, the stage comprises a mount at the bottom of the carrier at the innermost ring, and the carrier further comprises a rotation axis. The rotating shaft is installed on one side, far away from the bearing surface, of the installation piece and used for driving the carrying platform to rotate.

The semiconductor processing equipment of the embodiment of the application comprises a processing device and the bearing device of any one of the above embodiments, wherein the processing device corresponds to the bearing device and is used for processing the workpiece borne on the bearing device.

In the bearing device and the semiconductor processing equipment in this application, a plurality of bearing parts are arranged in an annular shape, and are sequentially sleeved to form a bearing platform, the bearing surface of each bearing part is used for bearing a first area of workpieces with different sizes, the first area of the workpieces is compressed by the driving part driving pressing part, meanwhile, the accommodating cavity of each bearing part corresponds to the second area of the workpieces, the second area of the workpieces is prevented from contacting with the bearing part, and the workpieces borne on the bearing parts are guaranteed not to be polluted or damaged to cause defects.

Additional aspects and advantages of embodiments of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a perspective view of a load bearing device according to certain embodiments of the present disclosure;

FIG. 2 is a schematic perspective sectional view of the carrier of FIG. 1 taken along line II-II;

FIG. 3 is a perspective view of another perspective of a carrier according to certain embodiments of the present disclosure;

FIG. 4 is an exploded perspective view of a press assembly of the carrier of certain embodiments of the present application;

fig. 5 is a schematic block diagram of a semiconductor processing apparatus according to some embodiments of the present application.

Detailed Description

Embodiments of the present application will be further described below with reference to the accompanying drawings. The same or similar reference numbers in the drawings identify the same or similar elements or elements having the same or similar functionality throughout.

In addition, the embodiments of the present application described below in conjunction with the accompanying drawings are exemplary and are only for the purpose of explaining the embodiments of the present application, and are not to be construed as limiting the present application.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

Referring to fig. 1 and fig. 3, a carrying device 100 of the present application includes a carrier 10 and a pressing assembly 30. The carrier 10 includes a plurality of annular carriers 11, the plurality of carriers 11 are sequentially sleeved, each carrier 11 includes a carrier surface 111 and encloses an accommodation cavity 113, the carrier surface 111 of each carrier 11 is used for carrying workpieces 200 with different sizes, the carrier surfaces 111 of the plurality of carriers 11 have different heights, and the heights of the plurality of carrier surfaces 111 are gradually increased from the center to the edge of the carrier 10; the pressing assembly 30 is mounted on the carrier 11, the pressing assembly 30 includes a pressing member 31 and a driving member 33 connected to the pressing member 31, the pressing member 31 is configured to press the first area 201 of the workpiece 200 on the carrying surface 111, the receiving cavity 113 corresponds to the second area 203 of the workpiece 200, and the driving member 33 is configured to drive the pressing member 31 to rotate relative to the stage 10 to selectively press or release the first area 201 of the workpiece 200.

The detection requirement of a piece (workpiece) to be detected on the market is higher and higher, and the defects on the front side and the back side of the piece to be detected need to be detected. However, most of the current bearing devices for the to-be-detected pieces are flat surfaces, and the to-be-detected pieces are directly placed on the flat surfaces, so that one surface of the to-be-detected pieces is inevitably in physical contact with the flat surfaces, and further, the contact surfaces of the central parts of the to-be-detected pieces and the flat surfaces are polluted and defective.

Referring to fig. 1 and 3, in the carrying device 100 of the present application, when the workpiece 200 is placed on the carrying element 11, the driving element 33 drives the pressing element 31 to rotate in a direction away from the carrying surface 111 to make room for the workpiece 200 to be carried on the carrying surface 111, at this time, the first region 201 of the workpiece 200 is placed on the carrying surface 111, the receiving cavity 113 corresponds to the second region 203 of the workpiece 200, and then the driving element 33 drives the pressing element 31 to rotate in a direction close to the carrying surface 111 to press the first region 201 of the workpiece 200 on the carrying surface 111, so as to fix the workpiece 200 and prevent the workpiece 200 from shifting on the carrying element 11. When the workpiece 200 is loaded on the carrier 11, the receiving cavity 113 of the carrier 11 corresponds to the second region 203 (i.e., the middle portion) of the workpiece 200, so that the second region 203 of the workpiece 200 is spaced from other physical surfaces, thereby preventing the second region 203 of the workpiece 200 from contacting the carrier 11 to cause contamination and defects on the contact surface, and preventing the second region 203 of the workpiece 200 from being damaged to cause defects. Meanwhile, the number of the carriers 11 includes a plurality of carriers 11, each carrier 11 is annularly distributed around the center of the carrier 10, and each carrier surface 111 respectively carries the workpieces 200 with different sizes, so that the carrier device 100 is suitable for the workpieces with different sizes, and the compatibility of the carrier device 100 is better. In a direction from the center to the edge of the carrier 10, the heights of the plurality of supporting surfaces 111 from the bottom 13 of the carrier 10 are gradually increased, so that the supporting device 100 can simultaneously support a plurality of workpieces 200 with different sizes on the supporting surfaces 111 with different heights for subsequent processing.

In the carrying device 100 of the present application, the plurality of carriers 11 are annularly disposed and sequentially sleeved to form the carrying platform 10, the carrying surface 111 of each carrier 11 is used for carrying the first areas 201 of the workpieces 200 with different sizes, and the driving member 33 drives the pressing member 31 to press the first areas 201 of the workpieces 200, and meanwhile, the second areas 203 of the workpieces 200 correspond to the accommodating cavities 113 of the carriers 11, so as to prevent the second areas 203 of the workpieces 200 from contacting the carriers 11, and ensure that the workpieces 200 carried on the carriers 11 are not damaged. Meanwhile, the ring-shaped carrier 11 allows the carrier 100 to simultaneously carry a plurality of workpieces 200 with different sizes, thereby improving the compatibility of the carrier 100.

In the carrying device 100, the carrying component 11 can be used to carry various workpieces 200 for processing by the semiconductor processing apparatus 1000 (shown in fig. 5), wherein the workpieces 200 include, but are not limited to, wafers, chips, display screen panels, front covers of mobile phones, rear covers of mobile phones, VR glasses, AR glasses, smart watch covers, glasses, lenses, wood, iron plates, housings of any devices (e.g., mobile phone housings), and other elements. The first region 201 of the workpiece 200 is an edge portion of the workpiece 200, and the edge portion generally does not contain important information (such as a pattern), while the second region 203 of the workpiece 200 is the other portion of the workpiece 200 except the edge portion, the first region 201 of the workpiece 200 surrounds the second region 203 of the workpiece 200, i.e., the surface of the workpiece 200 contains important information, and the size of the second region 203 is related to the manufacturing process and requirements of the workpiece 200. When the workpiece 200 is a wafer, the first area 201 of the workpiece 200 has no pattern (or no dies are distributed), and the second area 203 of the workpiece 200 has a pattern (with dies distributed).

Referring to fig. 2 and 3, in one embodiment, the number of the carriers 11 may be two, the carrier 11a near the center of the carrier 10 may be suitable for a workpiece 200 with a size of 8 inches, and the corresponding pressing assembly 30 presses the first area 201 of the workpiece 200 to fix the workpiece 200; the carrier 11b away from the center of the stage 10 is applicable to a workpiece 200 having a size of 12 inches, and the corresponding pressing member 30 presses the first region 201 of the workpiece 200 to fix the workpiece 200. The sizes of the carrier 11 are not limited to 8 inches, 12 inches and 16 inches, but may be 17 inches, 15 inches, 14 inches, 13 inches, 11 inches, 7 inches, 6 inches, 5 inches, 4 inches, 3 inches, 2 inches, 1 inch and the like, and the sizes of the carrier may be set according to the actual sizes of the workpieces 200.

When the two carriers 11 simultaneously carry workpieces 200 with different sizes, the height from the carrying surface 111b of the carrier 11b to the bottom 15 of the carrier 10 is greater than the height from which the pressing piece 31 corresponding to the carrier 11a is lifted away from the carrying surface 111a of the carrier 11a, so that the carriers 11a and the carriers 11b can simultaneously carry workpieces 200 with different sizes, the placing time of the workpieces 200 is effectively shortened, and the processing efficiency of the workpieces 200 is effectively improved. In other embodiments, the number of carriers 11 may also be 3, 4, 5 or more.

Referring to fig. 3, in an embodiment, each of the carriers 11 further includes a side 115, and the side 115 of each of the carriers 11 is provided with the pressing assembly 30. Specifically, the side surface 115 facing the center of the stage 10 is an inner side surface, and the side opposite to the outer side surface is an inner side surface. The pressing members 30 may be disposed on the outer side of the bearing member 11, so that when the driving member 30 drives the pressing member 31 to rotate, the driving member 30 is prevented from colliding with the workpiece 200 on the bearing surface 111 to shift or damage the workpiece 200, and the integrity of the workpiece 200 on the bearing surface 111 is ensured. When workpieces 200 with different sizes are loaded, the corresponding driving assemblies 30 press the first areas 201 of the workpieces 200 to fix the workpieces 200 on the loading surfaces 111 with the corresponding sizes, and compared with the fixation of the workpieces 200 with different sizes by one pressing assembly 30, the arrangement of the pressing assembly 30 in the application can shorten the placement time of the workpieces 200, thereby improving the processing efficiency of the workpieces 200.

In one embodiment, the side 115 of each carrier 11 is provided with a plurality of pressing assemblies 30, and the plurality of pressing assemblies 30 are uniformly distributed circumferentially around the center of the carrier 10. For example, the side 115 of each carrier 11 includes two, three or more pressing assemblies 30, and the plurality of pressing assemblies 30 uniformly distributed on the circumference can press a circumference of the first region 201 of the workpiece 200, so that the first region 201 of the workpiece 200 is uniformly stressed to fix the workpiece 200 on the carrying surface 111 smoothly. Preferably, three pressing assemblies 30 are disposed on the side surface 115 of each carrier 11, the three pressing assemblies 30 are uniformly distributed around the center of the carrier 10, when the workpiece 200 is carried on the carrying surface 111, the three driving members 33 can simultaneously drive the corresponding pressing members 33 to press the first region 201 of the workpiece 200, so as to stably fix the workpiece 200 on the carrier 11, and at the same time, compared with the case where more pressing assemblies 30 are disposed, the three pressing assemblies 30 can reduce the interference of mounting each other.

In other embodiments, a plurality of pressing assemblies 30 are disposed on the side 115 of each carrier 11, the plurality of pressing assemblies 30 may be spaced around the center of the stage 10, and the plurality of pressing assemblies 30 spaced apart fix the first region 201 of the workpiece 200 on the carrying surface 111.

Referring to fig. 3 and 4, the pressing assembly 30 may further include a fixing base 35 and a buffering member 37. The fixing base 35 is mounted on an end of the carrier 11 opposite to the carrying surface 111 and extends outward toward a side surface 115 of the carrier 11, where the outward extension is relative to the center of the carrier 10. The outward extending portion of the fixing seat 35 is used for installing the driving member 33, and is used for fixing the pressing assembly 30 on the outer side surface of the carrier 11, when the driving member 33 drives the pressing member 31 to rotate to press the first region 201 of the workpiece 200, the pressing assembly 30 does not collide with the workpiece 200 carried on the carrying surface 111 when rotating, and it is ensured that the workpiece 200 is not damaged.

The buffer member 37 is installed between the driving member 33 and the pressing member 31, and is used for buffering friction of the driving member 33 when the pressing member 31 rotates, thereby prolonging the service life of the pressing member 31 and the driving member 33. The buffer member 37 may be made of rubber, sponge, or the like.

Referring to fig. 3 and fig. 4, the pressing element 31 includes a connecting end 311 and a pressing end 312 opposite to each other. The driving member 33 includes an output shaft 331, the connecting end 311 is rotatably connected to the output shaft 331, and the pressing end 312 is provided with a pressing portion 313. When the pressing member 31 rotates to press the first region 201 of the workpiece 200, the pressing surface 3131 of the pressing portion 313 contacts the first region 201 of the workpiece 200, so that the workpiece 200 is fixed on the bearing surface 111.

Specifically, the connecting end 311 is provided with a first through hole 3111 and a second through hole 3112, and the pressing end 312 is provided with a third through hole 3121; one end of the driving member 33 is provided with a first mounting hole 332; the fixing base 35 is provided with a first fixing hole 351 and a first connecting hole 352; the cushion member 37 is provided with a through hole 371, a second mounting hole 372 and a second connecting hole 373. One end of the pressing portion 313 remote from the pressing surface 313 is engaged with the third through hole 3121 to fix the pressing portion 313 at the pressing end 312, and when the pressing piece 31 presses the first region 201 of the workpiece 200, the pressing is achieved by the pressing surface 3131 of the pressing portion 313 contacting the first region 201 of the workpiece 200. One end of the output shaft 331 extending out of the driving member 33 sequentially passes through the through hole 371 of the buffering member 37 and the first through hole 3111 of the connecting end 311, and the fixing member 39 passes through a fixing hole (not shown) of the bottom 3112 of the connecting end 311 and abuts against the output shaft 331, so that a rotation fulcrum is provided when the output shaft 331 drives the connecting end 311 to rotate together, and the rotation of the pressing member 31 is realized. The buffer member 37 is matched with the first mounting hole 332 and the second mounting hole 372 and fixed on the driving member 33 by adopting a screw fixing mode; the pressing piece 31, the driving piece 33 and the buffer piece 37 are fixed on the fixed seat 35 by matching the first connecting hole 352 and the second connecting hole 373 and adopting a screw fixing mode; finally, the pressing assembly 30 is fixed on the outer side surface of the carrier 11 by means of screw fixation through the first fixing hole 351 of the fixing seat 35 and a second fixing hole (not shown) at the end of the carrier 11 opposite to the bearing surface 111. The connection mode can facilitate replacement of any one or more of the pressing piece 31, the driving piece 35, the fixed seat 35 and the buffer piece 37 after long-term use.

With continued reference to fig. 3 and 4, in one embodiment, the output shaft 331 is driven by the driving member 33 to rotate in the first direction a1 or the second direction a2, so as to drive the pressing member 31 to release or press the workpiece 200. Wherein the first direction a1 and the second direction a2 are opposite in direction. For example, when the workpiece 200 is placed on the carrier 11, the driving member 33 drives the output shaft 331 to rotate along the first direction a1 (the first direction a1 is clockwise in fig. 3), the pressing end 312 follows the output shaft 331 to rotate along the first direction a1, the pressing surface 3131 is far away from the carrying surface 111, the robot is convenient to carry the workpiece 200 onto the carrying surface 111, then, when the driving element 33 drives the output shaft 331 to rotate along the second direction a2 (the second direction is counterclockwise in fig. 3), the pressing end 312 rotates along the second direction along with the output shaft 331, the pressing surface 3131 gradually approaches toward the bearing surface 111 until the pressing surface 3131 presses against the first region 201 of the workpiece 200, the second region 203 of the workpiece 200 is spaced from the bottom of the receiving cavity 113 of the carrier 11, so as to avoid the second region 203 of the workpiece 200 contacting the bottom of the receiving cavity 113 to cause contamination and defects on the contact surface, and prevent the second region 203 of the workpiece 200 from being damaged. In the process of placing the workpieces 200 on the carrier 11, the plurality of driving members 33 simultaneously drive the pressing members 31 to rotate, so that the time for placing the workpieces 200 and fixing the workpieces 200 can be shortened.

The driving member 33 may include a cylinder, a motor, and other driving components, for example, a swing cylinder, a cushion cylinder, a double-acting cylinder, and other cylinders capable of rotating; or a servo motor, a stepping motor, a torque motor, a direct current brushless motor and the like which can realize rotation. Of course, the type of the driving member 33 is not limited to the cylinder and the motor, and other components with the same function can be used, and is not limited herein.

Referring to fig. 1 and 3, the supporting device 100 may further include a position-limiting assembly 50. The side 115 of each bearing member 11 is provided with a plurality of limiting assemblies 50, and the limiting assemblies 50 are commonly used for limiting the workpiece 200 borne on the bearing member 11, so as to prevent the workpiece 200 from being thrown out of the bearing member 11 to damage the workpiece 200 when the workpiece 200 borne on the bearing surface 111 is subjected to translation or rotation detection.

In one embodiment, two, three, or more than three limiting assemblies 50 are disposed on the side surface 115 of each carrier 11, and the limiting assemblies 50 are uniformly distributed around the center of the carrier 10 in a circumferential manner, or are distributed at intervals around the center of the carrier 10, so as to limit the workpiece 200 loaded on the loading surface 111. Preferably, three limiting assemblies 50 are arranged on the side surface 115 of each carrier 11, and the three limiting assemblies 50 are uniformly distributed around the center of the carrier 10 in a circumferential manner, so that when the workpiece 200 is fixed on the bearing surface 111 by the pressing member 31, a certain gap can exist between the three limiting assemblies 50 and the outer edge of the workpiece 200, and the edge of the workpiece 200 is prevented from contacting the limiting assemblies 50. When the semiconductor processing apparatus 1000 (shown in fig. 5) performs the translation detection on the workpiece 200 carried on the carrying device 100, since the carrying device 100 does not rotate at a high speed, the workpiece 200 pressed on the carrying surface 111 by the pressing piece 31 is not displaced, and the gap between the limiting assembly 50 and the outer edge of the workpiece 200 can effectively prevent the outer edge of the workpiece 200 from contacting the limiting assembly 50 to cause contamination.

With continued reference to fig. 1 and 3, in one embodiment, each limiting element 50 may include a protrusion 51 and a limiting element 53. The protrusion 51 extends outward from the side surface 115 of the carrier 11, so that the limiting member 53 is disposed on the protrusion 51, and the limiting member 51 is prevented from obstructing the workpiece 200 from being placed on the bearing surface 111, thereby avoiding the workpiece 200. The limiting member 53 is higher than the bearing surface 111, the limiting member 53 includes an arc-shaped limiting surface 531, and the limiting surface 531 is used for abutting against the workpiece 200 to limit the workpiece 200, so as to prevent the workpiece 200 from being thrown out of the bearing range of the bearing member 11 during the translation or rotation detection, and limit the workpiece 200.

Referring to fig. 1, specifically, the protruding portion 51 is provided with two first threaded holes (not shown), the limiting member 53 is also provided with two second threaded holes 532, and the first threaded holes and the second threaded holes 532 are matched and the limiting member 53 is mounted on the protruding portion 51 by a screw fixing method, so as to prevent the limiting member 53 from being disengaged during the movement of the bearing device 100.

In one example, the limiting surface 531 of the limiting member 53 protrudes from a surface of the limiting member 53 facing the center of the stage 10 toward the center of the stage 10. In general, the workpieces 200 carried on the carrier 11 are fixed by the pressing member 31 and do not collide with the limiting surface 531 of the limiting member 53, and when the carrier 100 rotates at a high speed, the workpieces 200 may be thrown out of the carrier 11, and at this time, the limiting surface 531 of the limiting member 53 provided on the periphery of the carrier 11 is in point contact with the outer edge of the workpieces 200, so that the contact between the workpieces 200 and the limiting surface 531 is reduced, and the contamination of the outer edge of the workpieces 200 is effectively prevented.

Referring to fig. 3, the supporting device 100 may further include a connecting assembly 70, the side surfaces 115 of two adjacent supporting members 11 are connected by one connecting assembly 70, each connecting assembly 70 includes a plurality of connecting members 71 spaced from each other, and the spaces 73 between the plurality of connecting members 71 are used for accommodating the pressing assemblies 30.

In one embodiment, the number of the connecting members 70 is the same as the number of the pressing members 30, so that the pressing members 30 can be accommodated in the gaps 73 of the connecting members 70, and the pressing members 30 can rotate to release or press the workpiece 200 without touching the workpiece 200, thereby effectively protecting the workpiece 200. For example, the number of the carriers 11 is two, the number of the pressing units 30 is three, and the number of the connecting units 70 is three, the carriers 11 of the inner ring and the carriers 11 of the outer ring are fixedly connected by the three connecting members 71, so that the two carriers 11 can be effectively fixed on the stage 10, and at the same time, compared with the embodiment of the two pressing units 30, the three pressing units 30 are respectively accommodated in the three gaps 73, and the workpiece 200 can be more stably fixed on the carrying surface 111 by the three pressing units 30.

In one embodiment, the protrusion 51 and the connector 71 are reusable, i.e., the protrusion 51 and the connector 71 can be one piece, which is more compact and easier to manufacture; or the protruding portion 51 and the connecting member 71 are two structures independent from each other and can be spaced apart from each other, which is more flexible in design and facilitates the layout of other components (such as the pressing assembly 30) in the carrying device 100.

Referring to fig. 3, the other carriers 11 except the carrier 11 of the innermost ring are all provided with openings 117, and the openings 117 are used for the robot to pass through to place the workpiece 200 on the corresponding carrying surface 111. When the number of the carriers 11 is more than three, the openings 117 of the other carriers 11 except the innermost ring of carriers 11 are arranged on the same straight line from the center to the edge of the stage 10, and when the workpiece 200 needs to be placed on the inner ring of carriers 11, the openings 117 of the outer ring on the same straight line facilitate the robot to extend into the position where the carrying surfaces 111 corresponding to the inner ring of carriers 11 are located, so as to place the workpiece 200 on the carrying surfaces 111 of the inner ring of carriers 11.

Referring to fig. 2, the carrier 10 may further include a mounting member 15, and the supporting device 100 may further include a rotating shaft 90. A mounting 15 is located at the bottom 13 of the innermost ring of carriers 11, the mounting 15 serving to connect the rotation axis 90 and the stage 10. The rotating shaft 90 is installed on a side of the bottom 13 away from the carrying surface 111, and is used for driving the stage 10 to rotate under the driving of an external device, so as to implement rotation detection on the workpiece 200.

Referring to fig. 5, the present application further provides a semiconductor processing apparatus 1000. The semiconductor processing apparatus 1000 includes a processing device 300 and the carrier device 100 of any of the above embodiments, wherein the processing device 300 corresponds to the carrier device 100 and is used for processing the workpiece 200 carried on the carrier device 100.

In the present application, the processing apparatus 300 includes an optical inspection apparatus, an etching apparatus, a plating apparatus, a cutting apparatus, and a cleaning apparatus. For example, the processing apparatus 300 may be an optical inspection apparatus for inspecting surface features or defects of the workpiece 200 carried on the carrying surface 111, and the second region 203 of the workpiece 200 is spaced from the receiving cavity 113 of the carrier 11, so as to prevent the workpiece 200 from being secondarily contaminated, and effectively improve the yield of the workpiece 200. For another example, the processing device 300 may be a laser processing device for etching the workpiece 200 carried on the carrier 11. Also for example, the processing device 300 may be a coating device, which may be used to perform evaporation, sputtering, or the like on the workpiece 200 carried on the carrier 11. Also for example, the processing device 300 may also be a cutting device that may be used to cut, etc., the workpieces 200 carried on the carrier 11. For another example, the processing device 300 may also be a cleaning device for cleaning the workpiece 200 carried on the carrier 11. The processing device 300 may be of other types, which are not listed here, and all fall within the scope of the present application.

Referring to fig. 1, in the carrying device 100 and the semiconductor processing apparatus 1000 of the present application, the plurality of carrying elements 11 are disposed in a ring shape and sequentially sleeved to form the carrier 10, the carrying surface 111 of each carrying element 11 is used for carrying the first areas 201 of the workpieces 200 with different sizes, the driving member 33 drives the pressing member 31 to press the first areas 201 of the workpieces 200, and meanwhile, the accommodating cavities 113 of the carrying elements 11 correspond to the second areas 203 of the workpieces 200, so as to prevent the second areas 203 of the workpieces 200 from contacting the carrying elements 11, and ensure that the workpieces 200 carried on the carrying elements 11 are not contaminated or damaged to cause defects.

In the description herein, reference to the description of the terms "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present application, "a plurality" means at least two, e.g., two, three, unless specifically limited otherwise.

Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations of the above embodiments may be made by those of ordinary skill in the art within the scope of the present application, which is defined by the claims and their equivalents.

Claims (12)

1. A carrier, comprising:

the bearing surfaces of the bearing parts are different in height, and the heights of the bearing surfaces are gradually increased from the center to the edge of the platform deck; and

the pressing assembly is arranged on the bearing piece and comprises a pressing piece and a driving piece connected with the pressing piece, the pressing piece is used for pressing a first area of the workpiece on the bearing surface, the accommodating cavity corresponds to a second area of the workpiece, and the driving piece is used for driving the pressing piece to rotate relative to the carrier platform so as to selectively press or release the first area of the workpiece.

2. The carrier device of claim 1, wherein the carriers include sides, each of the sides of the carriers being provided with the pressing assembly.

3. The carrying device according to claim 1, wherein a plurality of the pressing assemblies are arranged on the side surface of each carrying member, and are uniformly distributed around the center of the carrying platform in a circumferential manner.

4. The carrier device of claim 1, wherein each of the pressing assemblies further comprises:

the fixing seat is mounted on the bearing part and extends out of the side face of the bearing part, the driving part is mounted on the fixing seat, the pressing part comprises a connecting end and a pressing end which are opposite to each other, the connecting end is connected with the output shaft of the driving part, and the pressing surface of the pressing end is used for pressing the first area of the workpiece on the bearing surface.

5. The carrying device as claimed in claim 4, wherein when the output shaft of the driving member rotates in a first direction, the pressing end follows the output shaft to rotate in the first direction, and the pressing surface is far away from the carrying surface; when the output shaft of the driving piece rotates along a second direction, the pressing end rotates along the second direction along with the output shaft, the pressing surface is close to the bearing surface, and the first direction is opposite to the second direction.

6. The carrier as claimed in claim 1 wherein the drive member comprises a pneumatic cylinder or an electric motor.

7. The carrying device according to claim 1, further comprising a limiting component, wherein a plurality of limiting components are arranged on the side surface of each carrying component, and the plurality of limiting components are used for limiting the workpiece together.

8. The carrier in accordance with claim 7 wherein each of said stop assemblies comprises:

a protrusion extending from a side of the carrier; and

the limiting part is arranged on the protruding part and is higher than the bearing surface, the limiting part comprises an arc-shaped limiting surface, and the limiting surface is used for abutting against the workpiece to limit the workpiece.

9. The carrier as claimed in any one of claims 1-8, further comprising:

the side of two adjacent carriers is all connected by one connecting assembly, every connecting assembly includes a plurality of spaced connecting pieces each other, and a plurality of the interval between the connecting piece is used for holding press the subassembly.

10. The carrier apparatus according to any one of claims 1-8, wherein the other carriers except the innermost ring of the carriers have openings for a robot to pass through to place the workpiece on the carrying surface.

11. The carrier as claimed in claim 1 wherein the stage includes a mount at the carrier bottom of the innermost ring, the carrier further comprising:

the rotating shaft is installed on one side, far away from the bearing surface, of the mounting piece and used for driving the carrying platform to rotate.

12. A semiconductor processing apparatus, comprising:

a processing device; and

the carrier of any of claims 1-11, wherein the processing device corresponds to the carrier and is configured to process a workpiece carried on the carrier.

Images