TWI733201B - Multi-disk wafer transfer equipment and transfer system - Google Patents

Abstract

The present invention provides a multi-disk wafer transfer equipment and a transfer system. In the disk-loaded wafer transfer equipment, a drive control mechanism can drive and control a circular track to transfer each wafer carrier that has been loaded in a cleaning station in turn. One of the polishing stations completes unloading and loading at the polishing station; it can also drive and control the circular track to transfer each wafer carrier that has been loaded at the polishing station to the cleaning station and complete the unloading. This transmission method can support multi-step complex process flow, realize that each wafer is independently polished at the polishing station, and efficient transmission between different transfer stations. The multi-carrier wafer transfer system includes a multi-carrier wafer transfer equipment.

Description

Multi-carrier wafer transfer equipment and transfer system

The present invention relates to the field of wafer processing, in particular, to multi-carrier wafer transfer equipment and transfer systems.

At present, the transmission methods and shortcomings of wafers between different transfer stations are as follows.

1. Use the polishing head to rotate for wafer transmission. The transmission and the process are bound together, resulting in a many-to-many working mode between the polishing head and the worktable. The disadvantage is that the process conversion between different polishing tables is prone to contamination, and the differences between the polishing heads will eventually be reflected in the The wafer planarization effect.

2. The wafer transfer is carried out by linear movement of the overload stage. The linear movement design limits the flexibility of the transmission. In addition, the design is not easy to maintain and has a high error rate.

The present invention aims to provide a multi-carrier wafer transfer device to solve the problem of using polishing head rotation and linear movement of the carrier for wafer transfer. The process conversion between different polishing tables is likely to cause contamination, and the linear movement design makes the transmission flexible The problem of limited performance and low transmission efficiency.

Another object of the present invention is to provide a multi-carrier wafer transfer system equipped with the above-mentioned multi-carrier wafer transfer equipment.

The embodiment of the present invention is implemented as follows: The multi-carrier wafer transfer device provided by the embodiment of the present invention, Including a circular track, a cleaning station, a plurality of polishing stations, and a plurality of wafer carriers and a drive control mechanism arranged in the circular track at equal intervals in sequence along the circumferential direction of the circular track; The drive control mechanism can drive and control the circular track to transfer each wafer carrier that is loaded in the cleaning station to one of the polishing stations in turn, and complete the unloading and complete loading at the polishing station; the drive control mechanism can drive and control The circular track transports each wafer carrier that has been loaded at the polishing station to the cleaning station and completes the unloading.

The wafer carrier is fixedly connected with the circular track, and the circular track rotates around its center to drive the wafer carrier to move along the circular track defined by the circular track. The number of wafer carriers is not limited, and the number can be set according to actual needs.

In this embodiment, there are four wafer carrier disks, and the four wafer carrier disks are named the first carrier disk, the second carrier disk, the third carrier disk, and the fourth carrier disk. The circular orbit rotates and drives the four wafer carriers respectively. The wafer carrier rotates to four transfer jobs, including a cleaning station and three polishing stations. The cleaning station is the first station, and the three polishing stations are the second station, the third station, and the third station. Four stations.

The actual transmission process is like this: (1) In the initial state, the first carrier plate corresponds to the first station, and the wafer is loaded to the first carrier plate corresponding to the first station; (2) The circular track and the wafer carrier move counterclockwise, where the first carrier moves the wafer to the second station, and the second carrier rotates to the first station to load the wafer; (3) The circular track and the wafer carrier move counterclockwise, where the first carrier moves the wafer to the third station, and the second carrier moves the wafer to the second station, and then rotates to the first station. The third carrier tray is loaded with wafers; (4) The circular orbit and the wafer carrier move counterclockwise, where the first carrier plate carries the wafer to move to the fourth station, the second carrier plate carries the wafer to move to the third station, and the third carrier plate carries the wafer. Circularly move to the second station, and rotate to the fourth carrier of the first station to load wafers; (5) The circular track and the wafer carrier move counterclockwise, where the first carrier unloads the wafer, and steps (1) to (4) are repeated.

Using the above-mentioned transmission method can support a multi-step complex process flow, and realize the efficient transfer of wafers between different transfer stations.

In an implementation of this embodiment: The circular track is provided with a plurality of installation stations in sequence along the circumferential direction at equal intervals, and each installation station is correspondingly provided with a wafer carrier; Each installation station is provided with a first connecting piece; the bottom of each wafer carrier is provided with a second connecting piece, and the first connecting piece and the second connecting piece are detachably connected.

In an implementation of this embodiment: The first connecting piece is provided with a connecting column slot; The second connecting piece is provided with a connecting column, the connecting column is embedded in the connecting column slot, and the connecting column and the connecting column slot are detachably connected by a circumferential limiting mechanism and an axial limiting mechanism.

In an implementation of this embodiment: The circumferential limit mechanism includes a first axial groove and a second axial groove sequentially arranged along the axial direction of the connecting column groove, the first axial groove and the second axial groove are along the circumferential direction of the connecting column groove Are arranged at equal intervals, and the top end of the first axial groove penetrates the top end of the connecting column groove; The axial limiting mechanism includes a circumferentially extending arc-shaped groove connecting the bottom end of the first axial groove and the top end of the second axial groove; The outer peripheral wall of the connecting column is provided with a clamping block, and the clamping block can be slidably embedded in the first axial groove, the arc groove and the second axial groove in sequence.

In an implementation of this embodiment: The circumferential limiting mechanism includes a circumferential limiting groove extending along the axial direction of the connecting column groove, and the top end of the circumferential limiting groove penetrates the top end of the connecting column groove; The axial limiting mechanism includes an elastic blocking block arranged in the circumferential limiting groove and moving back and forth along the radial direction of the connecting column groove; one end of the elastic blocking block is a blocking end and can extend into the connecting column groove; The outer wall of the connecting column is provided with a matching block; the matching block can press over the elastic blocking block, and be inserted and exited between the elastic blocking block and the bottom of the circumferential limiting groove.

In an implementation of this embodiment: The circumferential limit groove is provided with a mounting groove extending along the radial direction of the connecting column groove and one end penetrates the bottom wall of the circumferential limit groove; A compression spring is arranged in the installation groove, and one end of the elastic blocking block away from the blocking end is slidably embedded in the installation groove and presses the compression spring.

In an implementation of this embodiment: The top side of the blocking end is provided with an upper slope, and the bottom side of the blocking end is provided with a lower slope. When the mating block moves along the circumferential limit groove against the upper slope and the lower slope, the elastic blocking block can be pushed back into the installation groove .

In an implementation of this embodiment: A stepped placement groove is provided on the top of the wafer carrier; The step placement groove is provided with a plurality of annular flanges at equal intervals in sequence along the direction perpendicular to the wafer carrier, and the outer diameters of the plurality of annular flanges gradually increase from the bottom end to the top end of the step placement groove; The circumferential surface of the ring flange located at the top end is provided with an inclined guide surface.

A multi-carrier wafer transfer system, The multi-carrier wafer transfer system includes a general loading mechanism, a general unloading mechanism, a loading mechanism, an unloading mechanism and a multi-carrier wafer transfer equipment; The cleaning station is correspondingly provided with a loading mechanism and an unloading mechanism, and each polishing station is correspondingly provided with a loading mechanism and an unloading mechanism.

The beneficial effects of the present invention are: Compared with the traditional method of wafer transmission using the rotation of the polishing head, the multi-carrier wafer transfer equipment adopts the track and the carrier to transfer the wafers between different transfer stations. The transmission and the process are separated, and each wafer can be Polishing is completed in the polishing station separately, which effectively reduces the possibility of polishing head being contaminated; the polishing of each corresponding polishing station is completed by different polishing heads, which reduces the difference in wafer flattening effect caused by the difference in polishing heads The probability. Compared with the traditional method of wafer transfer by linear movement of the overload stage, the circular transmission track is fixed with the carrier plate, and the stability is higher, which can effectively reduce the possibility of errors during the transmission process, and the equipment is easier to maintain. This kind of transmission method can support multi-step complex process flow and realize the efficient transfer of wafers between different transfer stations.

The multi-tray wafer transfer system uses the loading mechanism to complete the loading and unloading mechanism at the cleaning station, and the unloading mechanism to complete the unloading and the loading mechanism to complete the loading at the polishing station, and then use the multi-tray wafer transfer The equipment realizes the transfer, which significantly improves the transfer efficiency of wafers between different transfer stations.

In order to make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments These are a part of the embodiments of the present invention, but not all of the embodiments. The elements of the embodiments of the present invention generally described and illustrated in the drawings herein may be arranged and designed in various different configurations.

Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

It should be noted that similar numbers and letters indicate similar items in the following figures. Therefore, once a certain item is defined in a figure, there is no need to further define and explain it in the following figures.

In the description of the present invention, it should be noted that if the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" appear "" and other indications are based on the position or position relationship shown in the diagram, or the position or position relationship usually placed when the product of the invention is used, and is only for the convenience of describing the invention and simplifying the description, rather than indicating It may also imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, if the terms "first", "second", etc. appear in the description of the present invention, they are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

In addition, if the terms "horizontal", "vertical" and other terms appear in the description of the present invention, it does not mean that the component is required to be absolutely horizontal or overhanging, but may be slightly inclined. For example, "horizontal" only means that its direction is more horizontal than "vertical", and it does not mean that the structure must be completely horizontal, but can be slightly inclined.

In the description of the present invention, it should also be noted that, unless otherwise clearly defined and limited, the terms "set", "installation", "connected", and "connected" should be interpreted broadly, for example, "connected" It can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication between the two components. For those of ordinary skill in the art, the specific meanings of the above-mentioned terms in the present invention can be understood in specific situations.

For an embodiment, refer to FIGS. 1 to 12.

The embodiment of the present invention provides a multi-carrier wafer transfer device.

As shown in Figures 1 and 2, it includes a circular track 200, cleaning stations, a plurality of polishing stations, and a plurality of cleaning stations arranged at equal intervals in sequence along the circumferential direction of the circular track 200, and a plurality of cleaning stations are arranged at equal intervals in sequence on the circular track. A plurality of 200 wafer carriers 300 and a drive control mechanism 100.

The drive control mechanism 100 can drive and control the circular track 200 to transfer each wafer carrier 300 that has been loaded at the cleaning station to one of the polishing stations in turn, and complete unloading and loading at the polishing station; drive control mechanism 100 can drive and control the circular track 200 to transfer each wafer carrier 300 that has been loaded in the polishing station to the cleaning station and complete the unloading.

The wafer carrier 300 is fixedly connected to the circular track 200, and the circular track 200 rotates around its center to drive the wafer carrier 300 to move along the circular track defined by the circular track 200. The number of wafer carrier 300 is not limited, and the number can be set according to actual needs.

In this embodiment, four wafer carrier plates 300 are provided, and the four wafer carrier plates 300 are respectively named first carrier plate 001, second carrier plate 002, third carrier plate 003, and fourth carrier plate 004, with a circular track 200 rotation, respectively driving the four wafer carrier 300 to rotate to four transfer jobs, including a cleaning station and three polishing stations, of which the cleaning station is the first station 005, and the three polishing stations are respectively the second Station 006, the third station 007 and the fourth station 008.

The actual transmission process is like this: (1) As shown in Figure 1, in the initial state, the first carrier 001 corresponds to the first station 005, and the wafer is loaded to the first carrier 001 corresponding to the first station 005; (2) As shown in FIG. 3, the circular track 200 and the wafer carrier 300 move counterclockwise, wherein the first carrier 001 carries the wafer to move to the second station 006, and rotates to the second station of the first station 005 Carrier tray 002 loads wafers; (3) As shown in Figure 4, the circular track 200 and the wafer carrier 300 move counterclockwise. The first carrier 001 carries the wafer to the third station 007, and the second carrier 002 carries the wafer to the third station. The second station 006 rotates to the third carrier 003 of the first station 005 to load wafers; (4) As shown in FIG. 5, the circular track 200 and the wafer carrier 300 move counterclockwise, wherein the first carrier 001 carries the wafer to move to the fourth station 008, and the second carrier 002 carries the wafer to move to The third station 007, the third carrier plate 003 moves the wafer to the second station 006, and rotates to the fourth carrier plate 004 of the first station 005 to load the wafer; (5) The circular track 200 and the wafer carrier 300 move counterclockwise, wherein the first carrier 001 unloads the wafer, and steps (1) to (4) are repeated.

Using the above-mentioned transmission method can support a multi-step complex process flow, and realize the efficient transfer of wafers between different transfer stations.

In an implementation of this embodiment: As shown in Figures 6 and 8, each installation station 210 is provided with a first connecting piece 220; A second connector 310 is provided at the bottom of each wafer carrier 300, and the first connector 220 and the second connector 310 are detachably connected.

The wafer carrier 300 and the circular track 200 are detachably connected through the first connector 220 and the second connector 310. The number of installation stations 210 is not limited. During actual transmission, different numbers of wafer carrier 300 can be installed according to the requirements. Therefore, the idling of the wafer carrier 300 can be avoided, and the rotation load of the circular track 200 can be reduced.

In an implementation of this embodiment: As shown in FIG. 7, the first connecting member 220 is provided with a connecting column groove 221; The second connecting member 310 is provided with a connecting column 311 embedded in the connecting column slot 221, and the connecting column 311 and the connecting column slot 221 are detachably connected by the circumferential limiting mechanism 400 and the axial limiting mechanism 500.

The connection between the first connecting member 220 and the second connecting member 310 is connected in the manner of a connecting column 311 and a connecting column groove 221. The circumferential limiting mechanism 400 is used to limit the circumferential rotation between the connecting column 311 and the connecting column groove 221, and the axial limiting mechanism 500 is used to limit the axial movement of the connecting column 311 and the connecting column groove 221, thereby firmly holding The connecting column 311 and the connecting column groove 221 are connected together.

In an implementation of this embodiment: As shown in Figures 6 and 7, the circumferential limiting mechanism 400 includes a first axial groove 410 and a second axial groove 420 sequentially arranged along the axial direction of the connecting column groove 221, the first axial groove 410 and The second axial grooves 420 are arranged at equal intervals along the circumferential direction of the connecting column groove 221, and the top end of the first axial groove 410 penetrates the top end of the connecting column groove 221; The axial limiting mechanism 500 includes a circumferentially extending arc-shaped groove 510 connecting the bottom end of the first axial groove 410 and the top end of the second axial groove 420; As shown in FIG. 8, the outer peripheral wall of the connecting column 311 is provided with a clamping block 312, and the clamping block 312 can be slidably embedded in the first axial groove 410, the arc groove 510 and the second axial groove 420 in sequence.

The connecting column 311 is clamped into the connecting column groove 221, and the clamping block 312 is clamped from the top end of the first axial groove 410. After the clamping block 312 moves to the bottom end of the first axial groove 410, the connecting column 311 is rotated in the circumferential direction. Clamp the clamping block 312 into the arc-shaped groove 510, after the clamping block 312 is rotated to the top of the second axial groove 420, continue to move the clamping block 312 axially, and clamp the clamping block 312 into the second axial groove 420 The bottom end, that is, the clamping process is to sequentially clamp into the first axial groove 410, the arc-shaped groove 510 and the second axial groove 420, and the process of taking out the connecting column 311, that is, the clamping block 312 is sequentially moved from the first axial groove 410 to the second axial groove 420. The two axial grooves 420, the arc-shaped groove 510 and the first axial groove 410 exit.

The second axial groove 420 limits the relative circumferential movement of the connecting column 311 and the connecting column groove 221, and the arc-shaped groove 510 limits the axial movement of the connecting column 311 with respect to the connecting column groove 221, so as to limit the connecting column 311 and the connecting column. The connection relationship of the column slot 221.

In an implementation of this embodiment: As shown in FIGS. 9 and 10, the circumferential limiting mechanism 400 includes a circumferential limiting groove 430 extending along the axial direction of the connecting column groove 221, and the top end of the circumferential limiting groove 430 penetrates through the connecting column groove 221 Top end The axial limiting mechanism 500 includes an elastic blocking block 520 arranged in the circumferential limiting groove 430 and moving back and forth along the radial direction of the connecting column groove 221; one end of the elastic blocking block 520 is a blocking end 521 and can extend into the connecting column Slot 221; As shown in FIG. 11, the outer wall of the connecting column 311 is provided with a mating block 313; the mating block 313 can press over the elastic blocking block 520, and snap into and out of the elastic blocking block 520 and the bottom of the circumferential limiting groove 430.

The connecting column 311 is clamped into the connecting column groove 221, and the matching block 313 is clamped in from the top opening of the circumferential limiting groove 430. When moving to the elastic blocking block 520, the matching block 313 presses the elastic blocking block to compress the elastic blocking block. Back, the matching block 313 slides between the elastic blocking block and the bottom of the circumferential limiting groove 430, the elastic blocking block returns to its original shape, and the matching block 313 is limited between the elastic blocking block and the bottom of the circumferential limiting groove 430; When the column 311 is taken out of the connecting column slot 221, the matching block 313 presses the elastic stop block from the lower side of the elastic stop block to compress the elastic stop block again, the matching block 313 slides over the elastic stop block, and the elastic stop block returns to its original shape. The connecting column 311 is taken out from the connecting column groove 221.

In an implementation of this embodiment: As shown in FIG. 10, the circumferential limiting groove 430 is provided with a mounting groove 010 extending along the radial direction of the connecting column groove 221 and one end penetrates the bottom wall of the circumferential limiting groove 430; A compression spring 020 is arranged in the installation groove 010, and an end of the elastic blocking block 520 away from the blocking end 521 is slidably embedded in the installation groove 010 and presses the compression spring 020.

The mating block 313 presses against the blocking end 521, and the spring 020 is pressed during the retracting process of the blocking end 521, and the spring 020 is compressed. When the mating block 313 slides over the elastic blocking block, the blocking end 521 of the elastic blocking block pops up and recovers under the action of the spring 020. Undisturbed.

In an implementation of this embodiment: As shown in Figure 10, the top side of the blocking end 521 is provided with an upper slope 522, and the bottom side of the blocking end 521 is provided with a lower slope 523. The mating block 313 presses the upper slope 522 and the lower slope along the circumferential limit groove 430. During the movement of the 523, the elastic blocking block 520 can be pressed and retracted into the installation groove 010.

The mating block 313 moves up and down along the circumferential limit groove 430, and in the process of acting on the upper inclined surface 522 and the lower inclined surface 523, it exerts a force on the elastic blocking block in the radial direction of the connecting column groove 221, which can hold the elastic blocking block The pressure retreats into the installation groove 010, so that the mating block 313 slides over the elastic blocking block.

In an implementation of this embodiment: As shown in FIG. 12, a stepped placement groove 320 is provided on the top of the wafer carrier 300; A plurality of annular flanges 321 are sequentially arranged at equal intervals in the step placement groove 320 along a direction perpendicular to the wafer carrier 300, and the outer diameters of the plurality of annular flanges 321 gradually increase from the bottom end to the top end of the step placement groove 320; The circumferential surface of the ring flange 321 located at the top end is provided with an inclined guide surface 322. .

The step placement groove 320 can place wafers of different diameters and sizes, which facilitates the transfer of different types of wafers. The inclined guide surface 322 is provided to guide the wafer into the step placement groove 320.

This embodiment also provides a multi-carrier wafer transfer system, The multi-carrier wafer transfer system includes a general loading mechanism, a general unloading mechanism, a loading mechanism, an unloading mechanism and a multi-carrier wafer transfer equipment; The cleaning station is correspondingly provided with a loading mechanism and an unloading mechanism, and each polishing station is correspondingly provided with a loading mechanism and an unloading mechanism.

The circular track 200 drives each wafer carrier 300 to move and stay at the cleaning station, the loading mechanism loads wafers, and then the circular track 200 drives the wafer to be transported from the cleaning station to one of the polishing stations and stays at the polishing station. Station, use the unloading mechanism to unload the wafer for polishing. After the polishing is completed, use the loading mechanism to complete the wafer loading. Finally, the circular track 200 drives the wafer from the polishing station to the cleaning station for cleaning, and then uses the general unloading mechanism The unloading is completed, and the polishing of the wafer is completed.

Each polishing station is provided with a polishing head, and each wafer moved to the polishing station is polished separately, so that it is not easy to be contaminated with each other.

The above descriptions are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

001: first carrier 002: second carrier 003: Third Carrier 004: The fourth carrier 005: First station 006: second station 007: third station 008: fourth station 010: installation slot 020: Spring 100: Drive control mechanism 200: circular orbit 210: installation station 220: The first connector 221: connecting column slot 300: Wafer carrier 310: The second connecting piece 311: connecting column 312: Card connection block 313: match block 320: Ladder Placement Slot 321: Ring flange 322: Inclined guide surface 330: Absorb fur 400: Circumferential limit mechanism 410: first axial groove 420: second axial groove 430: Circumferential limit slot 500: Axial limit mechanism 510: curved slot 520: Elastic blocking block 521: blocking end 522: upper slope 523: lower slope

In order to explain the technical solutions of the embodiments of the present invention more clearly, the following will briefly introduce the drawings that need to be used in the embodiments. It should be understood that the following drawings only show certain embodiments of the present invention, and therefore do not It should be regarded as a limitation of the scope. For those of ordinary skill in the art, without creative work, other related schemas can be obtained based on these schemas.

FIG. 1 is a schematic diagram of a first working state of a multi-carrier wafer transfer device provided by an embodiment of the present invention.

FIG. 2 is a front view of a multi-carrier wafer transfer device provided by an embodiment of the present invention.

3 is a schematic diagram of a second working state of the multi-carrier wafer transfer device provided by the embodiment of the present invention.

4 is a schematic diagram of a third working state of the multi-carrier wafer transfer device provided by the embodiment of the present invention.

FIG. 5 is a schematic diagram of a fourth working state of the multi-carrier wafer transfer device provided by the embodiment of the present invention.

FIG. 6 is a schematic structural diagram of a first structure of a multi-carrier wafer transfer device according to an embodiment of the present invention.

Fig. 7 is a partial enlarged view of A in Fig. 6 according to the embodiment of the present invention.

FIG. 8 is a schematic diagram of the structure of the wafer carrier in the first structure of the multi-carrier wafer transfer device provided by the embodiment of the present invention.

FIG. 9 is a schematic structural diagram of a second structure of a multi-carrier wafer transfer device provided by an embodiment of the present invention.

Fig. 10 is a partial enlarged view of B in Fig. 9 provided by an embodiment of the present invention.

FIG. 11 is a schematic structural diagram of a wafer carrier in a second structure of a multi-carrier wafer transfer device according to an embodiment of the present invention.

FIG. 12 is a schematic diagram of a first structure of a wafer carrier provided by an embodiment of the present invention.

001: first carrier

002: second carrier

003: Third Carrier

004: The fourth carrier

005: First station

006: second station

007: third station

008: fourth station

200: circular orbit

Claims (7)

A multi-tray wafer transfer equipment, comprising a circular track, cleaning stations arranged at equal intervals in sequence along the circumferential direction of the circular track; a plurality of polishing stations; and a plurality of cleaning stations arranged at equal intervals in sequence in the circle A plurality of wafer carrier disks and a drive control mechanism with a circular track; the drive control mechanism can drive and control the circular track to transfer each wafer carrier that has been loaded at the cleaning station to one of them in turn The polishing station, unloading and loading are completed at the polishing station; the drive control mechanism can drive and control the circular track to transfer each wafer carrier that has been loaded at the polishing station Stay at the cleaning station and complete the unloading; the circular track is sequentially provided with a plurality of installation stations at equal intervals along the circumferential direction, and each of the installation stations is provided with a corresponding wafer carrier; Each of the installation stations is provided with a first connecting piece; the bottom of each of the wafer carriers is provided with a second connecting piece, and the first connecting piece and the second connecting piece are detachably connected; A connecting piece is provided with a connecting column groove; the second connecting piece is provided with a connecting column, the connecting column is embedded in the connecting column groove, and the connecting column and the connecting column groove are limited by a circumferential direction The mechanism and the axial limit mechanism can be detachably connected. The multi-carrier wafer transfer device according to claim 1, wherein the circumferential limit mechanism includes a first axial groove and a second axial groove sequentially arranged along the axial direction of the connecting column groove, The first axial groove and the second axial groove are arranged at equal intervals along the circumferential direction of the connecting column groove, and the top end of the first axial groove penetrates the top end of the connecting column groove; The axial limiting mechanism includes a circumferentially extending arc-shaped groove connecting the bottom end of the first axial groove and the top end of the second axial groove; the outer peripheral wall of the connecting column is provided with a clamping block The clamping block can be slidably embedded in the first axial groove, the arc-shaped groove and the second axial groove in sequence. The multi-carrier wafer transfer equipment according to claim 1, wherein the circumferential limit mechanism includes a circumferential limit groove extending along the axial direction of the connecting column groove, and the circumferential limit The top end of the slot penetrates the top end of the connecting column slot; the axial limiting mechanism includes an elastic blocking block arranged in the circumferential limiting slot and moving back and forth along the radial direction of the connecting column slot; One end of the elastic blocking block is a blocking end and can extend into the connecting column groove; the outer wall of the connecting column is provided with a matching block; the matching block can be pressed over the elastic blocking block, and can be locked in and out Between the elastic blocking block and the bottom of the circumferential limiting groove. The multi-carrier wafer transfer equipment according to claim 3, wherein the circumferential limit groove is provided with a bottom wall extending along the radial direction of the connecting column groove and one end penetrates the circumferential limit groove The installation groove; the installation groove is provided with a compression spring, and the end of the elastic blocking block away from the blocking end is slidably embedded in the installation groove and presses the compression spring. The multi-carrier wafer transfer equipment according to claim 4, wherein the top side of the blocking end is provided with an upper slope, the bottom side of the blocking end is provided with a lower slope, and the matching block is limited along the circumferential direction When the groove moves against the upper inclined surface and the lower inclined surface, the elastic blocking block can be pushed back into the installation groove. The multi-carrier wafer transfer equipment according to claim 1, wherein a stepped placement groove is provided on the top of the wafer carrier; the stepped placement grooves are sequentially spaced along a direction perpendicular to the wafer carrier A plurality of annular flanges are arranged at intervals, and the outer diameters of the plurality of annular flanges gradually increase from the bottom end to the top end of the step placement groove; the circumferential surface of the annular flange located at the top end is provided with an inclined guide noodle. A multi-carrier wafer transfer system, comprising a general loading mechanism; a general unloading mechanism; a loading mechanism; an unloading mechanism; and the multi-carrier wafer transfer equipment according to any one of claims 1 to 6; the cleaning station The loading mechanism and the unloading mechanism are correspondingly provided, and each polishing station is correspondingly provided with the loading mechanism and the unloading mechanism.

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