WO2020143204A1 - 一种校准工装、盲插连接器互配间隙的测量装置及方法 - Google Patents

一种校准工装、盲插连接器互配间隙的测量装置及方法 Download PDF

Info

Publication number
WO2020143204A1
WO2020143204A1 PCT/CN2019/096093 CN2019096093W WO2020143204A1 WO 2020143204 A1 WO2020143204 A1 WO 2020143204A1 CN 2019096093 W CN2019096093 W CN 2019096093W WO 2020143204 A1 WO2020143204 A1 WO 2020143204A1
Authority
WO
WIPO (PCT)
Prior art keywords
connector
displacement sensor
displacement
disk
machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/096093
Other languages
English (en)
French (fr)
Inventor
何丽平
周海
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fiberhome Telecommunication Technologies Co Ltd
Original Assignee
Fiberhome Telecommunication Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fiberhome Telecommunication Technologies Co Ltd filed Critical Fiberhome Telecommunication Technologies Co Ltd
Priority to BR112021007703-0A priority Critical patent/BR112021007703B1/pt
Publication of WO2020143204A1 publication Critical patent/WO2020143204A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/16—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring distance of clearance between spaced objects

Definitions

  • the invention relates to the field of measuring the interworking gap between the machine board and the backplane connector, in particular to a measuring device and method for the interworking gap of the blind plug connector.
  • the interworking gap (Demated value) between the chassis connector and the sub-frame backplane connector directly affects the reliability of the product. Many signal failures are related to this value being too large.
  • the Demated value is specifically shown in Figures 1 and 2.
  • the factors that affect the Demated value include the machining and assembly errors of the machine board, the machining and assembly errors of the sub-frame, and the deformation of the machine board after insertion and removal of the backplane. All the influencing factors are normally distributed. How to accurately and efficiently measure the Demated value has become an urgent problem to be solved in the design and manufacture of high-end equipment.
  • the Demated value mainly measures the distance from the machine panel to the backplane and the distance from the machine panel to the machine connector through a depth ruler, and calculates the interworking gap of the connector based on the thickness value of the backplane connector shell bottom.
  • the object of the present invention is to provide a measurement device for the gap of the blind mating connector, which can avoid the problem of poor measurement data consistency caused by multiple measurements and multiple calculations. It is not limited by the test conditions, the whole test tooling is simple and easy to operate, the test efficiency is high, and the test accuracy is high.
  • a measuring device for inter-matching gap of blind plug connectors including:
  • the calibration tooling is provided with a groove, and the depth S of the groove is the length of the part of the pin on the backplane connector for mating with the signal connector on the backplane connector plus the thickness of the bottom of the backplane connector shell;
  • Analog machine disk which includes,
  • At least one displacement sensor which is fixed on the disk body and is arranged adjacent to one of the machine disk connectors, and the portion of the displacement sensor extending from the disk body exceeds the length of the machine disk connector Slightly larger than the depth S;
  • the displacement sensor when the calibration tool is attached to the simulated machine disk, the displacement sensor can be extended into the groove, and at least one machine board connector can be held against The step surface of the groove.
  • the displacement tester is also used to clear the data read when the calibration tool is attached to the simulated machine disk.
  • the simulated machine disk includes three displacement sensors.
  • the measuring device further includes an operating platform for receiving the simulated machine disk.
  • another object of the present invention is to provide a calibration tooling, which can avoid the problem of poor measurement data consistency caused by multiple measurements and multiple calculations, and is not limited by the test conditions.
  • the entire test tooling Simple and easy to operate, high test efficiency and high test accuracy.
  • a calibration tool is used to assist in measuring the interworking gap between the machine disk connector and the backplane connector.
  • the calibration tool is provided with a groove, and the depth S of the groove is the signal pin on the backplane connector.
  • the pin length of the connector of the machine board connector is connected to the thickness of the bottom of the backplane connector shell.
  • another object of the present invention is to provide a calibration tooling, which can avoid the problem of poor measurement data consistency caused by multiple measurements and multiple calculations, and is not limited by the test conditions.
  • the entire test tooling Simple and easy to operate, high test efficiency and high test accuracy.
  • a method for measuring the inter-matching gap using the above measurement device includes the following steps:
  • the calibration tool is attached to the simulated machine disk so that the displacement sensor extends into the groove, and at least one machine disk connector is pressed against the step of the groove On the surface, the pre-compression amount t1 of the displacement sensor at this time is read by the displacement tester.
  • a displacement tester is used to clear the pre-compression amount t1 of the displacement sensor.
  • the simulated machine disk includes three displacement sensors, and the three displacement sensors are used to respectively measure the corresponding pre-compression amount t1 and displacement value t2.
  • the measurement device of the blind mating connector inter-matching gap of the present invention only requires fewer measurement calculations, and the consistency of the measurement data is better, because The S value is known in advance (the measurement is simple and convenient, and there is no limit to the test space).
  • the displacement sensor and displacement tester are needed to measure t1 and t2.
  • the entire test tooling is simple and easy to operate, and the test efficiency is high.
  • t1 is measured, which eliminates the nonlinear part of the front end of the displacement sensor, and adopts the measurement method of the combination of the displacement sensor and the displacement tester. Compared with the existing test method, it can only reach 0.1mm.
  • the measurement method in the present invention can It reaches 0.01mm, which can meet the measurement accuracy requirements.
  • the measuring device of the blind mating connector interworking gap of the present invention can flexibly select multiple test points by setting multiple displacement sensors to determine the position and trend of the worst DEMATED value, making the measurement results more reliable .
  • Figure 1 is a schematic plan view of the Demated value of the interworking gap
  • Figure 2 is a perspective schematic view of the Demated value of the interworking gap
  • Figure 3 is a schematic diagram of the relevant dimensions when measuring the Demated value with a depth ruler
  • FIG. 4 is a schematic structural diagram of a measurement device in an embodiment of the present invention.
  • FIG. 6 is a schematic structural diagram of a calibration tooling in an embodiment of the present invention.
  • FIG. 7 is a schematic diagram of calibration tooling and simulated machine board testing in an embodiment of the present invention.
  • FIG. 8 is a schematic diagram of t1 and t2 during the test process of the subrack to be tested in the embodiment of the present invention.
  • an embodiment of the present invention provides a measurement device for a blind mating connector inter-matching gap, which includes a calibration tool 1 and an analog machine board 2.
  • the calibration tool 1 is provided with a groove 11, and the depth S of the groove 11 is the length of the part of the pin used for butting the signal pin on the backplane connector and the chassis connector plus the thickness of the bottom of the backplane connector shell .
  • Analog machine board 2 which includes,
  • At least one displacement sensor 22 which is fixed on the disk body 21, and is arranged adjacent to one of the machine disk connectors, and the portion of the displacement sensor 22 that protrudes from the disk body 21 exceeds the machine disk
  • the length of the connector is slightly larger than the depth S;
  • the measurement device in this embodiment further includes an operation platform 3, which is mainly used to provide a test platform, and is used to hold the simulation machine board 2 in actual use.
  • This S value refers to the length of the part of the pin on the backplane connector that is used for the docking of the signal pin and the chassis connector plus the thickness of the bottom of the backplane connector shell.
  • the bottom of the connector shell is the boundary.
  • the part of the pin length on the backplane connector that is used for the docking of the signal pin with the chassis connector refers to the part located on the left side of the bottom of the backplane connector shell.
  • This S value can be measured in advance. After the S value is obtained, the calibration tool 1 can be made based on the S value, and the depth of the groove 11 of the calibration tool 1 is S.
  • the simulated machine board 2 refers to a machine board manufactured according to the structure size of the actual machine board, the model and the number of the machine board connectors, and can simulate the situation when the actual machine board is inserted.
  • the portion of the displacement sensor 22 that protrudes from the disk body 21 exceeds the length of the machine disk connector and is slightly larger than the depth S. The effect it has is that the displacement sensor 22 will be located in the groove 11 A little bit of pre-compression amount t1 is generated. This pre-compression amount t1 is mainly to eliminate the nonlinear part of the front end of the displacement sensor 22, and can be set reasonably according to the actual situation.
  • an embodiment of the present invention provides a measurement device for a blind mating connector inter-matching gap, which includes a calibration tool 1 and an analog machine board 2.
  • the calibration tool 1 is provided with a groove 11, and the depth S of the groove 11 is the length of the part of the pin used for butting the signal pin on the backplane connector and the chassis connector plus the thickness of the bottom of the backplane connector shell .
  • Analog machine board 2 which includes,
  • At least one displacement sensor 22 which is fixed on the disk body 21, and is arranged adjacent to one of the machine disk connectors, and the portion of the displacement sensor 22 that protrudes from the disk body 21 exceeds the machine disk
  • the length of the connector is slightly larger than the depth S;
  • the displacement sensor 22 can be extended into the groove 11 and at least one machine board connector can be held against The step surface of the groove 11 is described.
  • the two machine disk connectors adjacent to the displacement sensor 22 bear against the stepped surface of the groove 11 so that the measurement will be more accurate.
  • an embodiment of the present invention provides a measurement device for a blind mating connector inter-matching gap, which includes a calibration tool 1 and an analog machine board 2.
  • the calibration tool 1 is provided with a groove 11, and the depth S of the groove 11 is the length of the part of the pin used for butting the signal pin on the backplane connector and the chassis connector plus the thickness of the bottom of the backplane connector shell .
  • Analog machine board 2 which includes,
  • At least one displacement sensor 22 which is fixed on the disk body 21, and is arranged adjacent to one of the machine disk connectors, and the portion of the displacement sensor 22 that protrudes from the disk body 21 exceeds the machine disk
  • the length of the connector is slightly larger than the depth S;
  • displacement tester 23 is also used to clear the data read when the calibration tool 1 and the simulation machine plate 2 are attached.
  • the value of T can be directly obtained by reading the displacement value of the displacement sensor 22 (in this case, t2).
  • an embodiment of the present invention provides a measurement device for a blind mating connector inter-matching gap, which includes a calibration tool 1 and an analog machine board 2.
  • the calibration tooling 1 has
  • a groove 11, the depth S of the groove 11 is the length of a part of the pin used for butt connection between the signal pin on the backplane connector and the chassis connector plus the thickness of the bottom of the backplane connector shell.
  • Analog machine board 2 which includes,
  • At least one displacement sensor 22 which is fixed on the disk body 21, and is arranged adjacent to one of the machine disk connectors, and the portion of the displacement sensor 22 that protrudes from the disk body 21 exceeds the machine disk
  • the length of the connector is slightly larger than the depth S;
  • simulation machine board 2 includes three displacement sensors 22.
  • test points can be flexibly selected to determine the position and trend of the worst DEMATED value, making the measurement results more reliable.
  • an embodiment of the present invention provides a calibration tool 1 for assisting in measuring the interworking gap between a machine disk connector and a backplane connector.
  • the calibration tool 1 is provided with a groove 11.
  • the depth S of the groove 11 is the length of the part of the pin on the backplane connector used for butt connection between the signal pin and the chassis connector plus the thickness of the bottom of the backplane connector shell.
  • An embodiment of the present invention provides a method for measuring an interworking gap using the measurement device in Embodiment 1, the method includes the following steps:
  • An embodiment of the present invention provides a method for measuring an interworking gap using the measurement device in Embodiment 1, the method includes the following steps:
  • the calibration tool 1 is attached to the simulated machine board 2 so that the displacement sensor 22 extends into the groove 11 while at least one machine board connector is held against the step of the groove 11
  • the displacement tester 23 reads the pre-compression amount t1 of the displacement sensor 22 at this time.
  • the two machine disk connectors adjacent to the displacement sensor 22 bear against the stepped surface of the groove 11 so that the measurement will be more accurate.
  • the displacement tester 23 is used to clear the pre-compression amount t1 of the displacement sensor 22.
  • the value of T can be directly obtained by reading the displacement value of the displacement sensor 22 (in this case, t2).
  • An embodiment of the present invention provides a method for measuring an interworking gap using the measurement device in Embodiment 1, the method includes the following steps:
  • the simulated machine disk 2 includes three displacement sensors 22, and the three displacement sensors 22 are used to respectively measure the corresponding pre-compression amount t1 and displacement value t2.
  • test points can be flexibly selected to determine the position and trend of the worst DEMATED value, making the measurement results more reliable.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • A Measuring Device Byusing Mechanical Method (AREA)

Abstract

一种盲插连接器互配间隙的测量装置及方法，包括：校准工装（1），其上设有一个凹槽（11），凹槽（11）的深度S为背板连接器上信号针与机盘连接器对接用的部分针长加上背板连接器壳底的厚度；以及模拟机盘（2），其包括，盘体（21）；多个机盘连接器，其均固定在盘体（21）上；至少一个位移传感器（22），其固定在模拟机盘（2）上，并与一个机盘连接器相邻设置，且位移传感器（22）伸出模拟机盘（2）的部分超出机盘连接器的长度略大于深度S；位移测试仪（23），其与位移传感器（22）相连，用于读取位移传感器（22）的数据。盲插连接器互配间隙的测量装置能避免多次测量和多次计算带来的测量数据一致性较差的问题，且不受测试条件的限制，整个测试工装简单、易操作，测试效率高，测试精度高。

Description

一种校准工装、盲插连接器互配间隙的测量装置及方法 技术领域
本发明涉及机盘与背板连接器互配间隙测量领域，具体涉及一种盲插连接器互配间隙的测量装置及方法。
背景技术
机盘连接器与子框背板连接器的互配间隙(Demated值)直接影响到产品的可靠性，很多信号故障与该值偏大有关。Demated值具体参考图1和图2所示，影响Demated值的因素包括机盘的加工及装配误差、子框的加工及装配误差、机盘插拔背板受力后的变形等。所有影响因素处于正态分布状态，如何准确、高效测量Demated值，成为高端设备设计、制造迫切需要解决的问题。
由于机盘与背板处在互配状态下，几乎没有足够测试空间借助目前已有的设备和工具直接完成机盘与背板Demated值的测试。
目前Demated值主要通过深度尺测量机盘面板到背板的距离、机盘面板到机盘连接器的距离，结合背板连接器壳底的厚度值计算出连接器的互配间隙。
参见图3所示，深度尺测量Demated值具体过程如下：
(1)测量机盘面板到机盘连接器的距离T1；
(2)测量机盘面板到背板的距离T2；
(3)计算T＝T2-T1；
(4)测量背板连接器壳底的厚度H；
(5)计算Demated值：D＝T-H。
由上述过程可知，采用深度尺测量Demated值，需要两次测量后再经过计算得到。其不仅受测试条件的限制，而且测量数据的一致性太差，不能满足连接器的互配间隙的测量精度要求。
发明内容
针对现有技术中存在的缺陷，本发明的目的在于提供一种盲插连接器互配间隙的测量装置，其能避免多次测量和多次计算带来的测量数据一致性较差的问题，且不受测试条件的限制，整个测试工装简单、易操作，测试效率高，测试精度高。
为达到以上目的，本发明采取的技术方案是：
一种盲插连接器互配间隙的测量装置，包括：
校准工装，其上设有一个凹槽，所述凹槽的深度S为背板连接器上信号针与机盘连接器对接用的部分针长加上背板连接器壳底的厚度；以及
模拟机盘，其包括，
-盘体；
-多个机盘连接器，其均固定在所述盘体上；
-至少一个位移传感器，其固定在所述盘体上，并与一个所述机盘连接器相邻设置，且所述位移传感器伸出所述盘体的部分超出所述机盘连接器的长度略大于所述深度S；
-位移测试仪，其与所述位移传感器相连，用于读取所述位移传感器的数据。
在上述技术方案的基础上，当所述校准工装与所述模拟机盘贴合时，可使所述位移传感器伸入所述凹槽内，且使至少一个所述机盘连接器抵持在所述凹槽的台阶面上。
在上述技术方案的基础上，所述位移测试仪还用于将所述校准工 装与模拟机盘贴合时所读取的数据清零。
在上述技术方案的基础上，所述模拟机盘包括三个位移传感器。
在上述技术方案的基础上，所述测量装置还包括用于承放模拟机盘的操作台。
与此同时，本发明的另一个目的在于提供一种校准工装，其能避免多次测量和多次计算带来的测量数据一致性较差的问题，且不受测试条件的限制，整个测试工装简单、易操作，测试效率高，测试精度高。
一种校准工装，用于辅助测量机盘连接器与背板连接器的互配间隙，所述校准工装上设有一个凹槽，所述凹槽的深度S为背板连接器上信号针与机盘连接器对接用的部分针长加上背板连接器壳底的厚度。
与此同时，本发明的另一个目的在于提供一种校准工装，其能避免多次测量和多次计算带来的测量数据一致性较差的问题，且不受测试条件的限制，整个测试工装简单、易操作，测试效率高，测试精度高。
一种利用上述测量装置测量互配间隙的方法，该方法包括以下步骤：
将校准工装与模拟机盘贴合，利用校准工装上的凹槽以及模拟机盘，读取此时的位移传感器的预压缩量t1；
将模拟机盘插入待测子架，读取位移传感器的位移值t2；
计算机盘连接器实际插入背板连接器的行程T＝t2-t1；
计算互配间隙：Demated值＝S-T。
在上述技术方案的基础上，将校准工装与模拟机盘贴合，使所述位移传感器伸入所述凹槽内，同时使至少一个所述机盘连接器抵持在 所述凹槽的台阶面上，并由位移测试仪读取此时的位移传感器的预压缩量t1。
在上述技术方案的基础上，利用位移测试仪将位移传感器的预压缩量t1清零。
在上述技术方案的基础上，所述模拟机盘包括三个位移传感器，利用三个所述位移传感器分别测量对应的预压缩量t1和位移值t2。
与现有技术相比，本发明的优点在于：
(1)本发明的盲插连接器互配间隙的测量装置，和现有技术中深度尺测量Demated值相比，本申请仅需要测量计算的环节更少，测量数据的一致性较好，由于S值事先已知(其测量简单方便，没有测试空间的限制)，实际测量时只需要利用位移传感器和位移测试仪测量t1和t2即可，整个测试工装简单、易操作，测试效率高，由于在测量过程中测量了t1，其消除了位移传感器前端非线性部分，并且采用位移传感器和位移测试仪结合的测量方式，相比现有测试方法只能达到0.1mm，本发明中的测量方法可以达到0.01mm，从而能满足测量精度要求。
(2)本发明的盲插连接器互配间隙的测量装置，其可以通过设置多个位移传感器来灵活的选择多个测试点，确定DEMATED值最差的位置及趋势，使得测量结果更为可靠。
附图说明
图1为互配间隙Demated值的平面示意图；
图2为互配间隙Demated值的立体示意图；
图3为深度尺测量Demated值时相关尺寸示意图；
图4为本发明实施例中的测量装置的结构示意图；
图5为本发明实施例中S值的示意图；
图6为本发明实施例中校准工装的结构示意图；
图7为本发明实施例中校准工装与模拟机盘测试示意图；
图8为本发明实施例中待测子架测试过程中t1和t2的示意图。
图中：1-校准工装，11-凹槽，2-模拟机盘，21-盘体，22-位移传感器，23-位移测试仪，3-操作台，4-待测子架。
具体实施方式
以下结合附图及实施例对本发明作进一步详细说明。
实施例1：
参见图4至图8所示，本发明实施例提供一种盲插连接器互配间隙的测量装置，其包括校准工装1和模拟机盘2。
其中，校准工装1上设有一个凹槽11，所述凹槽11的深度S为背板连接器上信号针与机盘连接器对接用的部分针长加上背板连接器壳底的厚度。
模拟机盘2，其包括，
-盘体21；
-多个机盘连接器，其均固定在所述盘体21上；
-至少一个位移传感器22，其固定在所述盘体21上，并与一个所述机盘连接器相邻设置，且所述位移传感器22伸出所述盘体21的部分超出所述机盘连接器的长度略大于所述深度S；
-位移测试仪23，其与所述位移传感器22相连，用于读取所述位移传感器22的数据。
进一步地，本实施例中的测量装置还包括操作台3，操作台3主要是用来提供测试平台用的，实际使用过程中，是用来承放模拟机盘2的。
下面对本实施例中的测量装置的原理进行介绍：
参见图5所示，首先定义一个S值，这个S值指的是背板连接器上信号针与机盘连接器对接用的部分针长加上背板连接器壳底的厚度，以背板连接器壳底为边界，背板连接器上信号针与机盘连接器对接用的部分针长指的是位于背板连接器壳底左边的部分。这个S值可以事先测量出来，得到S值后，便可以以S值为基准，制作校准工装1，而校准工装1的凹槽11深度就是S。
然后将校准工装1和模拟机盘2对接，使位移传感器22位于凹槽11内。模拟机盘2指的是按照实际机盘结构尺寸、机盘连接器的型号和数量而制作的机盘，其能够模拟实际机盘插入时的情形。本实施例中的位移传感器22伸出所述盘体21的部分超出所述机盘连接器的长度略大于所述深度S，其所要起到的效果就是位移传感器22位于凹槽11内后会产生一点点预压缩量t1，这个预压缩量t1主要是为了消除位移传感器22前端非线性部分，可以根据实际情况合理设置。
然后，再将模拟机盘2插入到待测子架4中去实际测量互配间隙Demated值，通过读取位移传感器22的位移值t2，由t1和t2即可求得机盘连接器实际插入背板连接器的行程T＝t2-t1。从而便可以求得Demated值＝S-T。
综上所述，和现有技术中深度尺测量Demated值相比，本申请仅需要测量计算的环节更少，测量数据的一致性较好，由于S值事先已知其测量简单方便，没有测试空间的限制，实际测量时只需要利用位移传感器22和位移测试仪23测量t1和t2即可，整个测试工装简单、易操作，测试效率高，由于在测量过程中测量了t1，其消除了位移传感器22前端非线性部分，并且采用位移传感器22和位移测试仪23结合的测量方式，相比现有测试方法只能达到0.1mm，本实施例中的测量方法可以达到0.01mm，从而能满足测量精度要求。
实施例2：
参见图4至图8所示，本发明实施例提供一种盲插连接器互配间隙的测量装置，其包括校准工装1和模拟机盘2。
其中，校准工装1上设有一个凹槽11，所述凹槽11的深度S为背板连接器上信号针与机盘连接器对接用的部分针长加上背板连接器壳底的厚度。
模拟机盘2，其包括，
-盘体21；
-多个机盘连接器，其均固定在所述盘体21上；
-至少一个位移传感器22，其固定在所述盘体21上，并与一个所述机盘连接器相邻设置，且所述位移传感器22伸出所述盘体21的部分超出所述机盘连接器的长度略大于所述深度S；
-位移测试仪23，其与所述位移传感器22相连，用于读取所述位移传感器22的数据。
进一步地，当所述校准工装1与所述模拟机盘2贴合时，可使所述位移传感器22伸入所述凹槽11内，且使至少一个所述机盘连接器抵持在所述凹槽11的台阶面上。
优选地，与所述位移传感器22相邻的两个机盘连接器抵持在所述凹槽11的台阶面上，这样测量时会更准确。
实施例3：
参见图4至图8所示，本发明实施例提供一种盲插连接器互配间隙的测量装置，其包括校准工装1和模拟机盘2。
其中，校准工装1上设有一个凹槽11，所述凹槽11的深度S为背板连接器上信号针与机盘连接器对接用的部分针长加上背板连接器壳底的厚度。
模拟机盘2，其包括，
-盘体21；
-多个机盘连接器，其均固定在所述盘体21上；
-至少一个位移传感器22，其固定在所述盘体21上，并与一个所述机盘连接器相邻设置，且所述位移传感器22伸出所述盘体21的部分超出所述机盘连接器的长度略大于所述深度S；
-位移测试仪23，其与所述位移传感器22相连，用于读取所述位移传感器22的数据。
进一步地，所述位移测试仪23还用于将所述校准工装1与模拟机盘2贴合时所读取的数据清零。
这里所述的将所读取的数据清零，指的是将预压缩量t1清零，因为在测量机盘连接器实际插入背板连接器的行程T时，由于T＝t2-t1，将预压缩量t1清零可以让T读取更方便，在预压缩量t1被清零的情形下，T的值直接可以通过读取位移传感器22的位移值来得到(此时即为t2)。
实施例4：
参见图4至图8所示，本发明实施例提供一种盲插连接器互配间隙的测量装置，其包括校准工装1和模拟机盘2。
其中，校准工装1上设有
一个凹槽11，所述凹槽11的深度S为背板连接器上信号针与机盘连接器对接用的部分针长加上背板连接器壳底的厚度。
模拟机盘2，其包括，
-盘体21；
-多个机盘连接器，其均固定在所述盘体21上；
-至少一个位移传感器22，其固定在所述盘体21上，并与一个 所述机盘连接器相邻设置，且所述位移传感器22伸出所述盘体21的部分超出所述机盘连接器的长度略大于所述深度S；
-位移测试仪23，其与所述位移传感器22相连，用于读取所述位移传感器22的数据。
进一步地，所述模拟机盘2包括三个位移传感器22。
通过设置三个位移传感器22，从而可以灵活的选择多个测试点，确定DEMATED值最差的位置及趋势，使得测量结果更为可靠。
实施例5：
参见图5所示，本发明实施例提供一种校准工装1，用于辅助测量机盘连接器与背板连接器的互配间隙，所述校准工装1上设有一个凹槽11，所述凹槽11的深度S为背板连接器上信号针与机盘连接器对接用的部分针长加上背板连接器壳底的厚度。
实施例6：
本发明实施例提供一种利用实施例1中的测量装置测量互配间隙的方法，该方法包括以下步骤：
将校准工装1与模拟机盘2贴合，利用校准工装1上的凹槽11以及模拟机盘2，读取此时的位移传感器22的预压缩量t1；
将模拟机盘2插入待测子架4，读取位移传感器22的位移值t2；
计算机盘连接器实际插入背板连接器的行程T＝t2-t1；
计算互配间隙：Demated值＝S-T。
实施例7：
本发明实施例提供一种利用实施例1中的测量装置测量互配间隙的方法，该方法包括以下步骤：
将校准工装1与模拟机盘2贴合，利用校准工装1上的凹槽11以及模拟机盘2，读取此时的位移传感器22的预压缩量t1；
将模拟机盘2插入待测子架4，读取位移传感器22的位移值t2；
计算机盘连接器实际插入背板连接器的行程T＝t2-t1；
计算互配间隙：Demated值＝S-T。
进一步地，将校准工装1与模拟机盘2贴合，使所述位移传感器22伸入所述凹槽11内，同时使至少一个所述机盘连接器抵持在所述凹槽11的台阶面上，并由位移测试仪23读取此时的位移传感器22的预压缩量t1。优选地，与所述位移传感器22相邻的两个机盘连接器抵持在所述凹槽11的台阶面上，这样测量时会更准确。
进一步地，利用位移测试仪23将位移传感器22的预压缩量t1清零。
这里所述的将所读取的数据清零，指的是将预压缩量t1清零，因为在测量机盘连接器实际插入背板连接器的行程T时，由于T＝t2-t1，将预压缩量t1清零可以让T读取更方便，在预压缩量t1被清零的情形下，T的值直接可以通过读取位移传感器22的位移值来得到(此时即为t2)。
实施例8：
本发明实施例提供一种利用实施例1中的测量装置测量互配间隙的方法，该方法包括以下步骤：
将校准工装1与模拟机盘2贴合，利用校准工装1上的凹槽11以及模拟机盘2，读取此时的位移传感器22的预压缩量t1；
将模拟机盘2插入待测子架4，读取位移传感器22的位移值t2；
计算机盘连接器实际插入背板连接器的行程T＝t2-t1；
计算互配间隙：Demated值＝S-T。
进一步地，所述模拟机盘2包括三个位移传感器22，利用三个所述位移传感器22分别测量对应的预压缩量t1和位移值t2。
通过设置三个位移传感器22，从而可以灵活的选择多个测试点，确定DEMATED值最差的位置及趋势，使得测量结果更为可靠。
本发明不局限于上述实施方式，对于本技术领域的普通技术人员来说，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也视为本发明的保护范围之内。本说明书中未作详细描述的内容属于本领域专业技术人员公知的现有技术。

Claims (10)

  1. 一种盲插连接器互配间隙的测量装置，其特征在于，包括：
    校准工装(1)，其上设有一个凹槽(11)，所述凹槽(11)的深度S为背板连接器上信号针与机盘连接器对接用的部分针长加上背板连接器壳底的厚度；以及
    模拟机盘(2)，其包括，
    -盘体(21)；
    -多个机盘连接器，其均固定在所述盘体(21)上；
    -至少一个位移传感器(22)，其固定在所述盘体(21)上，并与一个所述机盘连接器相邻设置，且所述位移传感器(22)伸出所述盘体(21)的部分超出所述机盘连接器的长度略大于所述深度S；
    -位移测试仪(23)，其与所述位移传感器(22)相连，用于读取所述位移传感器(22)的数据。
  2. 如权利要求1所述的测量装置，其特征在于：当所述校准工装(1)与所述模拟机盘(2)贴合时，可使所述位移传感器(22)伸入所述凹槽(11)内，且使至少一个所述机盘连接器抵持在所述凹槽(11)的台阶面上。
  3. 如权利要求2所述的测量装置，其特征在于：所述位移测试仪(23)还用于将所述校准工装(1)与模拟机盘(2)贴合时所读取的数据清零。
  4. 如权利要求2所述的测量装置，其特征在于：所述模拟机盘(2)包括三个位移传感器(22)。
  5. 如权利要求1所述的测量装置，其特征在于：所述测量装置还包括用于承放模拟机盘(2)的操作台(3)。
  6. 一种校准工装(1)，用于辅助测量机盘连接器与背板连接器 的互配间隙，其特征在于：所述校准工装(1)上设有一个凹槽(11)，所述凹槽(11)的深度S为背板连接器上信号针与机盘连接器对接用的部分针长加上背板连接器壳底的厚度。
  7. 一种利用权利要求1所述的测量装置测量互配间隙的方法，其特征在于，该方法包括以下步骤：
    将校准工装(1)与模拟机盘(2)贴合，利用校准工装(1)上的凹槽(11)以及模拟机盘(2)，读取此时的位移传感器(22)的预压缩量t1；
    将模拟机盘(2)插入待测子架(4)，读取位移传感器(22)的位移值t2；
    计算机盘连接器实际插入背板连接器的行程T＝t2-t1；
    计算互配间隙：Demated值＝S-T。
  8. 如权利要求7所述的方法，其特征在于：将校准工装(1)与模拟机盘(2)贴合，使所述位移传感器(22)伸入所述凹槽(11)内，同时使至少一个所述机盘连接器抵持在所述凹槽(11)的台阶面上，并由位移测试仪(23)读取此时的位移传感器(22)的预压缩量t1。
  9. 如权利要求8所述的方法，其特征在于：利用位移测试仪(23)将位移传感器(22)的预压缩量t1清零。
  10. 如权利要求7所述的方法，其特征在于：所述模拟机盘(2)包括三个位移传感器(22)，利用三个所述位移传感器(22)分别测量对应的预压缩量t1和位移值t2。
PCT/CN2019/096093 2019-01-07 2019-07-16 一种校准工装、盲插连接器互配间隙的测量装置及方法 Ceased WO2020143204A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
BR112021007703-0A BR112021007703B1 (pt) 2019-01-07 2019-07-16 Dispositivo para medir um vão de interencaixe, e, ferramental de calibração

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910013448.X 2019-01-07
CN201910013448.XA CN109737911B (zh) 2019-01-07 2019-01-07 一种校准工装、盲插连接器互配间隙的测量装置及方法

Publications (1)

Publication Number Publication Date
WO2020143204A1 true WO2020143204A1 (zh) 2020-07-16

Family

ID=66363698

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/096093 Ceased WO2020143204A1 (zh) 2019-01-07 2019-07-16 一种校准工装、盲插连接器互配间隙的测量装置及方法

Country Status (2)

Country Link
CN (1) CN109737911B (zh)
WO (1) WO2020143204A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4235092A1 (en) * 2022-02-25 2023-08-30 Huawei Technologies Co., Ltd. Distance measurement method, apparatus, and device, and computer-readable storage medium

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109737911B (zh) * 2019-01-07 2020-08-14 烽火通信科技股份有限公司 一种校准工装、盲插连接器互配间隙的测量装置及方法
CN113340176B (zh) * 2021-07-14 2022-06-14 航天南湖电子信息技术股份有限公司 一种t/r组件插箱k值检测装置及检测方法
CN113640711B (zh) * 2021-10-14 2022-01-21 中兴通讯股份有限公司 连接器的非完全配合距离的测量装置
CN119375825A (zh) * 2023-07-27 2025-01-28 华为技术有限公司 一种测距的方法及装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106004450A (zh) * 2016-05-20 2016-10-12 安徽江淮汽车股份有限公司 高压连接器及其检测电路、检测方法
CN205748199U (zh) * 2016-07-05 2016-11-30 西安金百泽电路科技有限公司 一种光模块金手指插头位尺寸快速测量治具
US20170207593A1 (en) * 2016-01-19 2017-07-20 Cisco Technology, Inc. Method and apparatus for facilitating the separation of mated printed circuit board assemblies
CN207380171U (zh) * 2017-11-21 2018-05-18 惠州汇聚电线制品有限公司 一种连接器插座测试装置
CN108955469A (zh) * 2018-05-22 2018-12-07 烽火通信科技股份有限公司 机盘与背板互配时的接触行程测量方法
CN109737911A (zh) * 2019-01-07 2019-05-10 烽火通信科技股份有限公司 一种校准工装、盲插连接器互配间隙的测量装置及方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE8101596L (sv) * 1980-03-15 1981-09-16 Klingelnberg Sohne Lengdmetanordning med stort metomrade, speciellt for metning av kugghjul
DE19919299C1 (de) * 1999-04-28 2001-01-04 Frenco Verzahnungslehren Vorrichtung zur Prüfung und Anzeige der Maßhaltigkeit von zylindrischen Oberflächen und von Verzahnungen
US7215129B1 (en) * 2006-03-30 2007-05-08 General Electric Company Multi tip clearance measurement system and method of operation
CN203811091U (zh) * 2014-03-28 2014-09-03 苏州兆科电子有限公司 射频连接器端口测试装置
CN205748325U (zh) * 2015-12-16 2016-11-30 上海良基博方汽车发动机零部件制造股份有限公司 一种用于气压调节器衬套不同平面的测高装置
CN106199260B (zh) * 2016-06-30 2019-03-15 南京中车浦镇城轨车辆有限责任公司 一种电气连接器检测装置
CN107036509A (zh) * 2017-06-20 2017-08-11 长沙金诺自动化技术有限公司 一种射频同轴连接器尺寸检测装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170207593A1 (en) * 2016-01-19 2017-07-20 Cisco Technology, Inc. Method and apparatus for facilitating the separation of mated printed circuit board assemblies
CN106004450A (zh) * 2016-05-20 2016-10-12 安徽江淮汽车股份有限公司 高压连接器及其检测电路、检测方法
CN205748199U (zh) * 2016-07-05 2016-11-30 西安金百泽电路科技有限公司 一种光模块金手指插头位尺寸快速测量治具
CN207380171U (zh) * 2017-11-21 2018-05-18 惠州汇聚电线制品有限公司 一种连接器插座测试装置
CN108955469A (zh) * 2018-05-22 2018-12-07 烽火通信科技股份有限公司 机盘与背板互配时的接触行程测量方法
CN109737911A (zh) * 2019-01-07 2019-05-10 烽火通信科技股份有限公司 一种校准工装、盲插连接器互配间隙的测量装置及方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4235092A1 (en) * 2022-02-25 2023-08-30 Huawei Technologies Co., Ltd. Distance measurement method, apparatus, and device, and computer-readable storage medium

Also Published As

Publication number Publication date
CN109737911B (zh) 2020-08-14
BR112021007703A2 (pt) 2021-07-27
CN109737911A (zh) 2019-05-10

Similar Documents

Publication Publication Date Title
WO2020143204A1 (zh) 一种校准工装、盲插连接器互配间隙的测量装置及方法
CN109406839B (zh) 一种信号测试治具、系统及测试方法
CN113447798A (zh) Ic测试机台的校准方法、校准系统及ic测试装置
CN118687508B (zh) 一种萃取槽多孔组同轴、平行度测量方法
CN103592471A (zh) 一种电容测试夹具
CN216846015U (zh) 一种铆钉墩头尺寸检验工具
US10641818B2 (en) Shape conformable capacitive coupler
CN216977702U (zh) 一种涡轮叶片错齿测量装置
CN116499406A (zh) 一种零部件内螺纹孔全参数测量装置及测量方法
CN212364467U (zh) 一种阵列式元器件的测试装置
CN209927323U (zh) 一种用于确定lcm生产中acf绑定温度的治具
CN116697847A (zh) 引脚检查装置和引脚检查方法
CN210015206U (zh) 转接电路板以及相应的转接夹具架构
BR112021007703B1 (pt) Dispositivo para medir um vão de interencaixe, e, ferramental de calibração
CN108955469B (zh) 机盘与背板互配时的接触行程测量方法
CN107247186B (zh) 一种电阻多点测试仪及其检测方法
CN116518821B (zh) 应用lrm连接器的asaac模块尺寸测量装置及方法
CN223244689U (zh) 电压电流测试组合仪器
CN221924874U (zh) 一种连接器检测治具
CN219301448U (zh) 尺寸检验装置
CN223857233U (zh) 硬件测试夹具及系统
CN218481225U (zh) 一种光学镜头测试料盘
CN223272615U (zh) 一种用于封装器件的手动测试工装
CN116907300B (zh) 一种零件定位尺寸检测装置及方法
CN220120942U (zh) 一种超声发射芯片测试装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19908426

Country of ref document: EP

Kind code of ref document: A1

REG Reference to national code

Ref country code: BR

Ref legal event code: B01A

Ref document number: 112021007703

Country of ref document: BR

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 112021007703

Country of ref document: BR

Kind code of ref document: A2

Effective date: 20210422

122 Ep: pct application non-entry in european phase

Ref document number: 19908426

Country of ref document: EP

Kind code of ref document: A1