WO2020137262A1 - Vibration device and optical detection device - Google Patents

Vibration device and optical detection device Download PDF

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Publication number
WO2020137262A1
WO2020137262A1 PCT/JP2019/045250 JP2019045250W WO2020137262A1 WO 2020137262 A1 WO2020137262 A1 WO 2020137262A1 JP 2019045250 W JP2019045250 W JP 2019045250W WO 2020137262 A1 WO2020137262 A1 WO 2020137262A1
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WO
WIPO (PCT)
Prior art keywords
body cover
vibration
vibrating
translucent body
holding member
Prior art date
Application number
PCT/JP2019/045250
Other languages
French (fr)
Japanese (ja)
Inventor
仁志 坂口
Original Assignee
株式会社村田製作所
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Filing date
Publication date
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Publication of WO2020137262A1 publication Critical patent/WO2020137262A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B15/00—Special procedures for taking photographs; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • G03B17/08—Waterproof bodies or housings
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/56—Accessories

Definitions

  • the present invention relates to a vibration device and an optical detection device capable of removing water drops and the like by mechanical vibration.
  • Japanese Patent Application Laid-Open No. 2004-242242 discloses a liquid droplet removing device in which a piezoelectric element is attached to a drip-proof cover arranged in front of an image sensor. By vibrating the drip-proof cover, water drops in the visual field of the image sensor are removed. The drip-proof cover is held by the support frame. The image pickup device is arranged in an internal space formed by the drip-proof cover and the support frame.
  • the piezoelectric element is directly attached to the drip-proof cover. Therefore, the part of the drip-proof cover outside the field of view of the image sensor vibrates, and the vibration efficiency may be significantly deteriorated. Further, since the portion outside the visual field of the drip-proof cover is held by the support frame, it is difficult to suppress damping of vibration.
  • An object of the present invention is to provide a vibrating device and an optical detection device that can efficiently vibrate a cover to which water drops and the like adhere.
  • the vibrating device is a translucent body cover, and a mass addition member that is directly or indirectly connected to the translucent body cover and is provided so as to form an internal space together with the translucent body cover.
  • a member and a piezoelectric element that vibrates the translucent cover are provided.
  • the optical detection device includes a vibrating device configured according to the present invention, and an optical detection element arranged so that the translucent body cover includes a detection region.
  • the present invention it is possible to provide a vibrating device and an optical detection device capable of efficiently vibrating a cover to which water droplets and the like adhere.
  • FIG. 1 is a front sectional view of a vibrating device according to a first embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of the vibration device according to the first embodiment of the present invention.
  • FIG. 3 is a diagram showing the relationship between the mass ratio M2/M1 and the magnitude of displacement at the center of the translucent body cover in the first embodiment of the present invention and the comparative example.
  • FIG. 4 is a vibration displacement diagram of the vibration device of the comparative example.
  • FIG. 5 is a vibration displacement diagram of the vibration device according to the first embodiment of the present invention in which the mass ratio M2/M1 is 1.7.
  • FIG. 6 is a vibration displacement diagram of the vibration device according to the first embodiment of the present invention in which the mass ratio M2/M1 is 2.2.
  • FIG. 7 is a front sectional view of a vibrating device according to a modification of the first embodiment of the present invention.
  • FIG. 8 is a front sectional view of a vibrating device according to a second embodiment of the present invention.
  • FIG. 9 is a vibration displacement diagram of the vibrating section according to the second embodiment of the present invention.
  • FIG. 10 is a figure which shows the relationship between the position in the axial direction, and the magnitude
  • FIG. 11 is a vibration displacement diagram of the vibration device according to the second embodiment of the present invention.
  • FIG. 12 is a vibration displacement diagram of the vibrating device according to the first modification of the second embodiment of the present invention.
  • FIG. 13 is a diagram showing the relationship between the position in the axial direction and the magnitude of displacement in the holding members of the second embodiment and the first modification of the present invention.
  • FIG. 14 is a diagram showing the relationship between the position in the axial direction and the magnitude of the radial component in the displacement in the holding members of the second embodiment and the first modified example of the present invention.
  • FIG. 15 is a figure which shows the relationship between the position in the axial direction and the magnitude
  • FIG. 16 is a figure which shows the relationship between the elastic energy ratio and the displacement of the bottom part in a holding member in the holding member of the 2nd Embodiment and 1st modification of this invention.
  • FIG. 17 is a vibration displacement diagram when the vibrating device according to the second embodiment of the present invention is externally fixed at the bottom of the holding member.
  • FIG. 18 is a front sectional view of a vibrating device according to a second modification of the second embodiment of the present invention.
  • FIG. 19 is a front sectional view of a vibrating device according to a third modification of the second embodiment of the present invention.
  • 20 is a front sectional view of a vibrating device according to a fourth modification of the second embodiment of the present invention.
  • FIG. 21 is a front sectional view of a vibrating device according to a fifth modification of the second embodiment of the present invention.
  • FIG. 22 is a front sectional view of a vibrating device according to a sixth modified example of the second embodiment of the present invention.
  • FIG. 18 is a front sectional view of a vibrating device according to a second modification of the second embodiment of the present invention.
  • FIG. 19 is a front sectional view of a vibrating device according to a
  • FIG. 23 is a front sectional view of a vibrating device according to a seventh modification of the second embodiment of the present invention.
  • FIG. 24 is a perspective view of an imaging device according to the third embodiment of the present invention.
  • FIG. 25 is a front sectional view of an imaging device according to the third embodiment of the present invention.
  • FIG. 1 is a front cross-sectional view of the vibration device according to the first embodiment.
  • FIG. 2 is an exploded perspective view of the vibration device according to the first embodiment.
  • a control circuit described later may be omitted.
  • the vibrating device 1 shown in FIG. 1 is a vibrating device that removes water droplets or foreign matter from the field of view of the image sensor by moving water droplets or foreign matter by vibration or atomizing water droplets or the like.
  • the vibrating device 1 includes a translucent body cover 2, a piezoelectric element 3, a mass addition member 6, and a control circuit 7 electrically connected to the piezoelectric element 3.
  • the translucent body cover 2, the piezoelectric element 3, and the mass addition member 6 constitute an internal space.
  • An optical detection element such as an image pickup element is arranged in this internal space.
  • the internal space is not limited to a sealed space, and a space partially open to the outside is also an internal space.
  • the internal space of the vibration device 1 is open to the outside on the side of the mass addition member 6.
  • the translucent body cover 2 has a dome shape.
  • the shape of the translucent body cover 2 in a plan view is circular.
  • the translucent body cover 2 has a bottom surface 2b.
  • the translucent body cover 2 has a flange portion 2c provided near the bottom surface 2b.
  • the flange portion 2c has a first surface 2d and a second surface facing each other.
  • the second surface of the flange portion 2c is included in the bottom surface 2b.
  • the shape of the translucent body cover 2 is not limited to the above, and may be, for example, a flat plate shape.
  • the shape of the translucent body cover 2 in plan view may be, for example, a polygon.
  • the translucent body cover 2 does not need to have the flange portion 2c.
  • the translucent cover 2 is made of soda lime glass.
  • the material of the translucent body cover 2 is not limited to the above, and for example, translucent plastic, glass such as quartz or boroic acid, or translucent ceramic can be used.
  • the light-transmitting property in this specification refers to a light-transmitting property through which at least an energy ray having a wavelength detected by an optical detection element such as the above-described image pickup element or light is transmitted.
  • the piezoelectric element 3 is attached to the bottom surface 2b of the translucent body cover 2.
  • the piezoelectric element 3 has an annular piezoelectric body 4.
  • the piezoelectric body 4 is made of PZT. It should be noted that the material of the piezoelectric body 4 is not limited to the above, and may be made of an appropriate piezoelectric ceramic such as PT or (K,Na)NbO 3 or an appropriate piezoelectric single crystal such as LiTaO 3 or LiNbO 3. Good.
  • the shape of the piezoelectric body 4 is not limited to the above.
  • the piezoelectric element 3 has a first electrode 5a provided on one main surface of the piezoelectric body 4 and a second electrode 5b provided on the other main surface.
  • the first electrode 5a and the second electrode 5b are annular and are provided so as to face each other.
  • the first electrode 5a and the second electrode 5b are electrically connected to the control circuit 7, respectively.
  • the control circuit 7 drives the piezoelectric element 3 in a resonance state.
  • the first electrode 5a and the second electrode 5b are made of 42Ni.
  • the first electrode 5a and the second electrode 5b may be made of a metal material other than 42Ni.
  • the first electrode 5a and the second electrode 5b may be electrodes made of a metal thin film such as Ag or Au formed by a sputtering method or the like.
  • one annular piezoelectric element 3 is provided, but the present invention is not limited to this.
  • a plurality of rectangular plate-shaped piezoelectric elements may be provided along the outer peripheral edge of the translucent body cover 2 in plan view.
  • the piezoelectric element 3 is attached to the translucent body cover 2 on the side of the first electrode 5a.
  • the mass adding member 6 is attached to the second electrode 5b side of the piezoelectric element 3.
  • the mass addition member 6 is indirectly connected to the translucent body cover 2 via the piezoelectric element 3.
  • the mass addition member 6 has a cylindrical shape.
  • the mass addition member 6 has a first opening end surface 6a and a second opening end surface 6b that face each other. Of the first opening end surface 6a and the second opening end surface 6b, the first opening end surface 6a is located on the light-transmitting body cover 2 side.
  • the piezoelectric element 3 is attached to the first opening end surface 6a.
  • a direction connecting the first opening end surface 6a and the second opening end surface 6b is defined as an axial direction Z
  • a direction orthogonal to the axial direction Z is defined as a radial direction X
  • the direction X may be described as the direction X orthogonal to the axial direction Z.
  • the mass addition member 6 has an outer side surface 6c located outside in the radial direction X and an inner side surface 6d located inside in the radial direction X.
  • the mass addition member 6 is provided so as to form an internal space together with the translucent body cover 2.
  • the mass addition member 6 is indirectly connected to the translucent body cover 2 over the entire circumferential direction.
  • the shape of the mass addition member 6 is not limited to a cylindrical shape, and may be, for example, a rectangular tube shape.
  • the mass addition member 6 is made of SUS420J2.
  • the material of the mass adding member 6 is not limited to the above, and may be a metal other than the above or an appropriate ceramic.
  • the mass addition member 6 may be used as the second electrode of the piezoelectric element 3. In this case, the second electrode 5b of the piezoelectric element 3 shown in FIGS. 1 and 2 may not be provided.
  • control circuit 7 drives the piezoelectric element 3 in the resonance state.
  • the vibration device 1 does not necessarily have to have the control circuit 7, and the piezoelectric element 3 may be driven by a signal from the outside.
  • the feature of this embodiment is that the mass addition member 6 is connected to the translucent body cover 2 so as to form an internal space together with the translucent body cover 2. As a result, it is possible to efficiently vibrate the translucent body cover 2 to which water drops and the like adhere. This will be described below by comparing the present embodiment with a comparative example.
  • the comparative example differs from the first embodiment in that the mass addition member 6 is not provided.
  • the mass of the translucent body cover 2 is M1
  • the total mass of the mass adding member 6 and the piezoelectric element 3 is M2.
  • a plurality of vibration devices 1 having the configuration of the first embodiment having different mass ratios M2/M1 were produced. Further, a vibration device of a comparative example was manufactured. In the plurality of vibration devices, the magnitude of displacement at the center of the light-transmitting body cover 2 was compared. When comparing the magnitudes of the displacements, the voltage applied to the piezoelectric element 3 was an AC voltage with an amplitude of 20 V, and the vibration frequency was around 60 kHz, which is the resonance frequency of the vibration device 1. The simulation was performed by the finite element method using a three-dimensional model.
  • FIG. 3 is a diagram showing the relationship between the mass ratio M2/M1 and the magnitude of displacement at the center of the translucent body cover 2 in the first embodiment and the comparative example.
  • the displacement ratio in FIG. 3 is a ratio based on the magnitude of displacement at the center of the translucent body cover 2 of the comparative example.
  • the black circle plots show the respective results of the first embodiment, and the white plots show the results of the comparative example.
  • the displacement ratio is larger than 1 in the first embodiment.
  • the displacement of the translucent body cover 2 in the first embodiment is larger than the displacement of the translucent body cover 2 in the comparative example.
  • the mass ratio M2/M1 is 0.9 or more and 1.9 or less
  • the displacement ratio is 1.5 or more, and it can be seen that the displacement is particularly large.
  • the translucent body cover 2 can be efficiently vibrated.
  • FIG. 4 is a vibration displacement diagram of the vibration device of the comparative example.
  • FIG. 5 is a vibration displacement diagram of the vibration device according to the first embodiment in which the mass ratio M2/M1 is 1.7.
  • FIG. 6 is a vibration displacement diagram of the vibration device according to the first embodiment in which the mass ratio M2/M1 is 2.2. 4 to 6, it is shown that the displacement is larger as the color is closer to white. The same applies to other vibration displacement diagrams.
  • the displacement on the bottom surface 2b side of the translucent body cover 2 is large, and the displacement at the center is small.
  • a portion A between the center of the translucent body cover 2 and the bottom surface 2b serves as a vibration node, and the bottom surface 2b side vibrates with the vibration node serving as a fulcrum.
  • the large displacement portions are dispersed, and the vibration efficiency of the central portion is low.
  • the mass addition member 6 is connected to the bottom surface 2b side of the translucent body cover 2. As described above, it is possible to suppress the dispersion of the portion having a large displacement, and it is possible to intensively vibrate the center of the translucent body cover 2. Therefore, the translucent body cover 2 can be efficiently vibrated.
  • the mass ratio M2/M1 is preferably 0.9 or more and 1.9 or less.
  • the center of the light-transmitting body cover 2 can be further concentrated and vibrated, and the light-transmitting body cover 2 can be vibrated more efficiently. ..
  • the arrangement of the piezoelectric element 3 is not limited between the translucent body cover 2 and the mass addition member 6.
  • the piezoelectric element 3 is provided on the flange portion 2c of the translucent body cover 2. More specifically, the piezoelectric element 3 is provided on the first surface 2d of the flange portion 2c that faces the bottom surface 2b.
  • the mass addition member 6 is directly connected to the translucent body cover 2. Also in this case, the light-transmitting body cover 2 can be efficiently vibrated as in the first embodiment.
  • FIG. 8 is a front sectional view of the vibration device according to the second embodiment.
  • the present embodiment is different from the first embodiment in that a holding member 18 that holds a vibrating portion including the translucent body cover 2, the piezoelectric element 3, and the mass addition member 6 is provided. Except for the above points, the vibration device 11 of the present embodiment has the same configuration as the vibration device 1 of the first embodiment.
  • the holding member 18 holds the mass addition member 6.
  • the holding member 18 has a connecting portion 18a connected to the outer side surface 6c of the mass adding member 6, a spring portion 18b connected to the connecting portion 18a, and a bottom portion 18c connected to the spring portion 18b.
  • the connecting portion 18a has an annular shape.
  • the spring portion 18b and the bottom portion 18c have a cylindrical shape extending in the axial direction Z.
  • the shape of each part of the holding member 18 is not limited to the above.
  • the connecting portion 18a may have, for example, a frame shape other than the annular shape.
  • the spring portion 18b and the bottom portion 18c may have a shape such as a rectangular tube shape, for example.
  • the cross section of the holding member 18 of the vibration device 11 along the axial direction Z has a substantially L-shape. More specifically, when the thickness of each portion of the holding member 18 is set to be the thickness along the direction orthogonal to the direction in which the respective portions of the holding member 18 extend, in the holding member 18, the thickness of the bottom portion 18c. Is thicker than the wall thickness of the spring portion 18b. Thereby, the spring portion 18b is more easily deformed than the bottom portion 18c.
  • the thickness of the bottom portion 18c of the holding member 18 increases from the spring portion 18b side toward the inside in the radial direction X.
  • the outer diameters of the spring portion 18b and the bottom portion 18c are the same, and the inner diameter of the bottom portion 18c is smaller than the inner diameter of the spring portion 18b.
  • the vibration device 11 can be downsized.
  • the bottom portion 18c may be thicker in the radial direction X from the spring portion 18b side.
  • the holding member 18 is made of SUS420J2.
  • the material of the holding member 18 is not limited to the above, and may be a metal other than the above or an appropriate ceramic.
  • the holding member 18 may be integrally formed, or each part may be separately formed.
  • the rigidity of the material of the bottom portion 18c is higher than the rigidity of the material of the spring portion 18b, so that the spring portion 18b may be more easily deformed than the bottom portion 18c.
  • the holding member 18 is connected to a portion other than the vibration node of the vibrating portion. This is shown with reference to FIGS. 9 and 10 below.
  • simulation was performed using a two-dimensional axisymmetric model. In the simulation, the voltage applied to the piezoelectric element 3 was 20 V, and the frequency of vibration was set to about 60 kHz which is the resonance frequency of the vibration device 11.
  • FIG. 9 is a vibration displacement diagram of the vibrating section in the second embodiment.
  • FIG. 10 is a diagram showing the relationship between the axial position and the magnitude of displacement in the mass adding member of the vibrating unit according to the second embodiment.
  • FIG. 9 shows a portion corresponding to half of the cross section shown in FIG.
  • Each vibration displacement diagram other than FIG. 9 below may show a portion corresponding to half of the cross section along the axial direction of the vibration device.
  • Position B in FIGS. 9 and 10 indicates the axial position of the first opening end face of the mass addition member, and position C indicates the axial position of the second opening end face.
  • the position B is 0 mm and the position C is 4 mm.
  • the solid line in FIG. 10 indicates the magnitude of the displacement
  • the broken line indicates the magnitude of the radial component X in the displacement
  • the alternate long and short dash line indicates the axial component in the displacement.
  • the mass addition member 6 is displaced by 0.7 ⁇ m to 2 ⁇ m. This displacement is about 4% to 12% of the maximum value of the displacement of the translucent body cover 2. It can be seen that in the mass addition member 6, there is no vibration node having a displacement magnitude of 0.
  • the holding member 18 is connected to the position shown by the chain double-dashed line in FIG. More specifically, the holding member 18 is connected to a portion where the position of the mass adding member 6 in the axial direction is 1 mm or more and 1.5 mm or less. In this way, the holding member 18 is connected to a portion other than the vibration node of the mass adding member 6 in the vibrating portion. However, when the mass adding member 6 of the vibrating portion has a vibration node, the holding member 18 may be connected to the vibration node portion.
  • the vibrating section in the present embodiment is indirectly fixed to the outside or the like via the holding member 18.
  • the vibration device 11 has the mass addition member 6 connected to the translucent body cover 2 as in the first embodiment.
  • damping can be effectively suppressed when the vibrating portion is fixed to the outside or the like. Therefore, it is possible to more efficiently vibrate the translucent body cover 2 to which water drops and the like adhere.
  • the details will be described below.
  • the effect of suppressing damping in the vibration device according to the first modification of the second embodiment is also shown.
  • the vibrating device of the first modified example is configured similarly to the vibrating device 11 of the second embodiment except that the spring portion and the bottom portion of the holding member have the same thickness.
  • FIG. 11 is a vibration displacement diagram of the vibration device according to the second embodiment.
  • FIG. 12 is a vibration displacement diagram of the vibrating device according to the first modification of the second embodiment.
  • Position D in FIGS. 11 and 12 indicates the axial position of the connecting portion of the holding member, and position E indicates the axial position of the second opening end face. The same applies to drawings other than FIGS. 11 and 12.
  • the bottom portion 18c of the holding member 18 is not substantially displaced. As shown in FIG. 12, the displacement is also suppressed in the bottom portion 28c of the holding member 28A in the first modified example.
  • FIG. 13 is a diagram showing the relationship between the position in the axial direction and the magnitude of displacement in the holding members of the second embodiment and the first modification.
  • FIG. 14 is a diagram showing the relationship between the position in the axial direction and the magnitude of the radial component in the displacement in the holding members of the second embodiment and the first modified example.
  • FIG. 15 is a diagram showing the relationship between the position in the axial direction and the magnitude of the axial component in the displacement in the holding members of the second embodiment and the first modified example.
  • the position D is 0 mm and the position E is 8 mm.
  • a portion having a position of 5 mm or more in the axial direction corresponds to the bottom portion. 13 to 15, the solid line shows the result of the second embodiment, and the broken line shows the result of the first modification.
  • the displacement of the connecting portion 18a of the holding member 28A indicated by the position D is about 1.6 ⁇ m.
  • the displacement becomes smaller as it gets closer to the bottom portion 28c from the connection portion 18a.
  • the displacement is about 0.4 ⁇ m or less at the bottom portion 28c where the position in the axial direction Z is 5 mm or more.
  • the displacement at the bottom portion 28c can be reduced by about 75% as compared with the displacement at the connection portion 18a.
  • the radial component of the vibration is absorbed by the spring property of the spring portion 18b, and the vibrating component near the position of 6.5 mm in the axial direction X. It can be seen that is 0 ⁇ m.
  • the component of the displacement in the axial direction Z is about 0.3 ⁇ m.
  • the above-mentioned absorption of vibration by the spring portion 18b means that most of the vibration propagated from the mass adding member 6 via the connecting portion 18a can be the vibration in the spring portion 18b. Thereby, it is possible to make it difficult for the vibration to leak to the bottom portion 28c.
  • the displacement can be suppressed to 0.03 ⁇ m at the bottom portion 18c whose position in the axial direction Z is 5 mm or more.
  • the vibration propagated from the mass adding member 6 via the connecting portion 18a can be reduced by about 98%.
  • both the X-direction component and the Z-direction component of the displacement can be suppressed to 0.02 ⁇ m.
  • vibration can be absorbed by the elasticity of the spring portion 18b as in the first modification, and the bottom portion 18c itself is less likely to be deformed.
  • the holding member 18 of the vibration device 11 has a spring portion 18b having a small elastic constant and easily deformed, and a bottom portion 18c having a large elastic constant and hard to deform. Thereby, most of the strain energy applied to the holding member 18 from the side of the mass addition member 6 can be converted into elastic energy in the spring portion 18b, and the bottom portion 18c can be made difficult to displace as described above. ..
  • damping can be effectively suppressed by providing a difference in elastic constant between the spring portion 18b and the bottom portion 18c of the holding member 18.
  • E1 be the elastic energy of the spring portion 18b and E2 be the elastic energy of the bottom portion 18c when an external force is applied to the holding member 18.
  • the elastic energy ratio E1/E2 of the holding member 18 was set to 46.
  • the displacement of the bottom portion 18c is changed. It was measured.
  • FIG. 16 is a diagram showing the relationship between the elastic energy ratio and the displacement of the bottom of the holding member in the holding members of the second embodiment and the first modification. Note that the displacement ratio in FIG. 16 is a ratio based on the displacement in the first modified example in which the spring portion and the bottom portion are uniformly configured.
  • the black circle plot shows the result of the second embodiment, and the white plot shows the result of the first modification.
  • the elastic energy ratio E1/E2 is 2 or more.
  • the displacement ratio based on the first modification is less than 1, and the displacement at the bottom portion 18c can be further suppressed.
  • the elastic energy ratio E1/E2 is preferably 2 or more.
  • the elastic energy ratio E1/E2 is more preferably 6 or more.
  • the displacement ratio can be about 0.5 or less. Therefore, the displacement of the bottom portion 18c can be suppressed more effectively, and the occurrence of vibration damping can be suppressed even more effectively when the bottom portion 18c is fixed to the outside or the like.
  • FIG. 17 is a vibration displacement diagram when the vibration device according to the second embodiment is externally fixed at the bottom of the holding member.
  • the bottom of the holding member was fixed to a member made of PPS-FG40 (polyphenylene sulfide-glass 40%) having a machine Q of 10.
  • the member is shown as the outer side F.
  • the vibration state is almost the same when the vibration device 11 is not fixed to the external F and when it is fixed to the external F at the bottom portion 18c of the holding member 18. You can see that it does not change. More specifically, when the vibration device 11 is not fixed to the outside F, the displacement of the center of the translucent body cover 2 was 18.6 ⁇ m. As shown in FIG. 17, when the vibrating device 11 was fixed to the outside F at the bottom portion 18c, the center displacement of the translucent body cover 2 was 18.6 ⁇ m. As described above, in the second embodiment, since damping can be effectively suppressed, it is understood that the vibration of the translucent body cover 2 is less likely to be attenuated due to being fixed to the outside. Therefore, the translucent body cover 2 can be vibrated more efficiently.
  • second to seventh modified examples of the second embodiment will be shown in which only the configuration of the holding member is different from that of the second embodiment. Also in the second to seventh modifications, damping can be suppressed as in the second embodiment, and the translucent body cover 2 can be vibrated more efficiently.
  • 18 to 23 described below are axially symmetric two-dimensional cross-sectional views along the axial direction Z of the vibration device.
  • the holding member 28B is connected to the translucent body cover 2. More specifically, the cross section of the connecting portion 28a of the holding member 28B along the axial direction Z has a substantially U-shape.
  • the connection portion 28a has a first connection surface 28d and a second connection surface 28e that face each other.
  • the connection portion 28a is provided so as to sandwich the flange portion 2c of the translucent body cover 2 between the first connection surface 28d and the second connection surface 28e.
  • the first connection surface 28d is connected to the first surface 2d of the flange portion 2c.
  • the second connection surface 28e is connected to the bottom surface 2b of the translucent body cover 2.
  • the thickness of the bottom portion 18c of the holding member 28C increases from the spring portion 18b side toward the outside in the radial direction X.
  • the inner diameters of the spring portion 18b and the bottom portion 18c are the same, and the outer diameter of the bottom portion 18c is larger than the outer diameter of the spring portion 18b.
  • the connecting portion 18a of the holding member 28D is connected to the inner side surface 6d of the mass adding member 6.
  • the wall thickness of the bottom portion 18c increases from the spring portion 18b side toward the outside in the radial direction X, similarly to the third modification.
  • the cross section of the spring portion 28b of the holding member 28E along the axial direction Z has a meandering shape.
  • the spring property of the spring portion 28b can further absorb the vibration, and the vibration from the side of the mass addition member 6 is less likely to leak to the bottom portion 18c.
  • the holding member 28F extends in the radial direction X.
  • the connecting portion 18a is located on the innermost side in the radial direction X of the holding member 28F, and the bottom portion 18c is located on the outermost side in the radial direction X.
  • the spring portion 28b is located between the connecting portion 18a and the bottom portion 18c.
  • the shape of the cross section of the spring portion 28b along the axial direction Z is a meandering shape, as in the fifth modification.
  • the holding member 28F is located inside the mass addition member 6 in the axial direction Z. As a result, the size of the vibration device along the axial direction Z can be reduced.
  • the material of the connecting portion 18a and the spring portion 18b of the holding member 28G and the material of the bottom portion 18c are different. More specifically, the spring constant of the material of the bottom portion 18c is higher than the spring constant of the material of the spring portion 18b.
  • FIG. 24 is a perspective view of an imaging device according to the third embodiment.
  • FIG. 25 is a front sectional view of the imaging device according to the third embodiment.
  • the imaging device 30 as an optical detection device includes a vibrating device 31 and an image pickup element 30A arranged in the internal space of the vibrating device 31.
  • the vibrating device 31 according to the present embodiment differs from the vibrating device 11 according to the second embodiment in that the vibrating device 31 includes the case member 32. Except for the points described above, the vibration device 31 of the present embodiment has the same configuration as the vibration device 11 of the second embodiment.
  • the case member 32 includes a first case part 33 having a substantially cylindrical shape, a second case part 34 having a substantially rectangular tube shape connected to the first case part 33, and a second case part 34. And a plate-shaped third case portion 35 connected to the case portion 34.
  • An external connection member 36 is connected to the third case portion 35 of the case member 32.
  • the second case portion 34 is located near the portion connected to the first case portion 33 and extends inward in the direction X orthogonal to the axial direction Z. Have.
  • the bottom portion 18c of the holding member 18 of the vibration device 31 is fixed to the fixing portion 34a.
  • the case member 32 indirectly holds the vibrating portion including the translucent body cover 2, the piezoelectric element 3, and the mass addition member 6 via the holding member 18.
  • the case member 32 may directly hold the vibrating portion.
  • the first case portion 33 has a top plate portion 33a including an opening 33c.
  • the top plate portion 33a is arranged so as to face the flange portion 2c of the translucent body cover 2.
  • the top plate portion 33a and the flange portion 2c overlap each other.
  • the top plate portion 33a and the flange portion 2c are not in contact with each other.
  • the vibration of the translucent body cover 2 is unlikely to be disturbed.
  • a part of the dome-shaped portion of the translucent body cover 2 projects outward from the opening 33c of the first case portion 33.
  • the third case portion 35 is arranged so as to seal the opening of the second case portion 34.
  • the case member 32 is made of resin.
  • the configuration and material of the case member 32 are not limited to the above, and may be any as long as they can form an internal space together with other portions of the vibrating device 31 and can arrange the image pickup device 30A in the internal space.
  • the first circuit board 37a and the second circuit board 37b facing each other are arranged in the internal space of the case member 32.
  • the first circuit board 37a and the second circuit board 37b are connected by a connection wiring 37c.
  • the first circuit board 37a is connected to the image sensor 30A.
  • the first circuit board 37a or the second circuit board 37b includes a circuit that drives the imaging element 30A.
  • the first circuit board 37a or the second circuit board 37b may include a control circuit 7 that drives the piezoelectric element 3 in a resonance state.
  • the wiring 38 extends from the external connection member 36 into the internal space of the case member 32.
  • the wiring 38 penetrates through the third case portion 35 and the second circuit board 37b.
  • the wiring 38 is electrically connected to the second circuit board 37b.
  • the image pickup device 30A, the first circuit board 37a, and the second circuit board 37b are electrically connected to the outside.
  • the image pickup device 30A can be, for example, a CMOS, a CCD, a bolometer, a thermopile, or the like that receives light of any wavelength in the visible region to the far infrared region.
  • Examples of the imaging device 30 include a camera, a Radar device, a LIDAR device, and the like.
  • an optical detection element that optically detects energy rays other than the image pickup element 30A may be arranged in the internal space of the vibration device 31.
  • the energy rays to be detected may be active energy rays such as electromagnetic waves and infrared rays.
  • the detection region of the optical detection element is included in the translucent body cover 2.
  • the light-transmitting body cover 2 includes the field of view of the image sensor 30A as a detection region.
  • the vibration device 31 of the present embodiment has the same vibrating section and holding member 18 as in the second embodiment. Further, as in the case shown in FIG. 17, the bottom portion 18c of the holding member 18 is fixed to the fixing portion 34a of the case member 32, and vibration damping is unlikely to occur. Since the imaging device 30 includes the vibrating device 31, it is possible to efficiently vibrate the translucent body cover 2 to which water droplets and the like adhere.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)

Abstract

Provided is a vibration device which can effectively vibrate a cover having water droplets, etc., deposited thereon.　A vibration device 1 according to the present invention comprises: a light transmissive body cover 2; a mass additive member 6 which is directly or indirectly linked to the light transmissive body cover 2, and is provided so as to form an inner space together with the light transmissive body cover 2; and a piezoelectric element 3 which vibrates the light transmissive body cover 2.

Description

振動装置及び光学検出装置Vibration device and optical detection device
　本発明は、機械的振動によって水滴などを除去することが可能な振動装置及び光学検出装置に関する。 The present invention relates to a vibration device and an optical detection device capable of removing water drops and the like by mechanical vibration.
　従来、監視装置として用いられるカメラなどのイメージングデバイスにおいては、その視野を常に明瞭にすることが求められている。特に、車載用途などの屋外で使用されるカメラにおいては、雨滴などの水滴を除去するための機構が種々提案されている。下記の特許文献１には、撮像素子の前方に配置される防滴カバーに、圧電素子が貼り付けられた液滴排除装置が開示されている。防滴カバーを振動させることにより、撮像素子の視野内の水滴を除去する。防滴カバーは支持枠に保持されている。防滴カバー及び支持枠により構成される内部空間内に、撮像素子が配置される。 Conventionally, in imaging devices such as cameras used as monitoring devices, it is required that the field of view is always clear. In particular, for cameras used outdoors such as in-vehicle applications, various mechanisms have been proposed for removing water droplets such as raindrops. Japanese Patent Application Laid-Open No. 2004-242242 discloses a liquid droplet removing device in which a piezoelectric element is attached to a drip-proof cover arranged in front of an image sensor. By vibrating the drip-proof cover, water drops in the visual field of the image sensor are removed. The drip-proof cover is held by the support frame. The image pickup device is arranged in an internal space formed by the drip-proof cover and the support frame.
特開２０１７－１７０３０３号公報JP, 2017-170303, A
　特許文献１に記載された液滴排除装置では、防滴カバーに圧電素子が直接的に貼り付けられている。そのため、防滴カバーにおける、撮像素子の視野外の部分までが振動することとなり、振動効率が大きく劣化するおそれがある。さらに、防滴カバーの上記視野外の部分が支持枠に保持されているため、振動のダンピングを抑制することは困難となる。 In the droplet removing device described in Patent Document 1, the piezoelectric element is directly attached to the drip-proof cover. Therefore, the part of the drip-proof cover outside the field of view of the image sensor vibrates, and the vibration efficiency may be significantly deteriorated. Further, since the portion outside the visual field of the drip-proof cover is held by the support frame, it is difficult to suppress damping of vibration.
　本発明の目的は、水滴などが付着するカバーを効率的に振動させることができる、振動装置及び光学検出装置を提供することにある。 An object of the present invention is to provide a vibrating device and an optical detection device that can efficiently vibrate a cover to which water drops and the like adhere.
　本発明に係る振動装置は、透光体カバーと、前記透光体カバーに直接的または間接的に連結されており、前記透光体カバーと共に内部空間を構成するように設けられている質量付加部材と、前記透光体カバーを振動させる圧電素子とを備える。 The vibrating device according to the present invention is a translucent body cover, and a mass addition member that is directly or indirectly connected to the translucent body cover and is provided so as to form an internal space together with the translucent body cover. A member and a piezoelectric element that vibrates the translucent cover are provided.
　本発明に係る光学検出装置は、本発明に従い構成された振動装置と、前記透光体カバーに検出領域が含まれるように配置されている光学検出素子とを備える。 The optical detection device according to the present invention includes a vibrating device configured according to the present invention, and an optical detection element arranged so that the translucent body cover includes a detection region.
　本発明によれば、水滴などが付着するカバーを効率的に振動させることができる、振動装置及び光学検出装置を提供することができる。 According to the present invention, it is possible to provide a vibrating device and an optical detection device capable of efficiently vibrating a cover to which water droplets and the like adhere.
図１は、本発明の第１の実施形態に係る振動装置の正面断面図である。FIG. 1 is a front sectional view of a vibrating device according to a first embodiment of the present invention. 図２は、本発明の第１の実施形態に係る振動装置の分解斜視図である。FIG. 2 is an exploded perspective view of the vibration device according to the first embodiment of the present invention. 図３は、本発明の第１の実施形態及び比較例においての、質量比Ｍ２／Ｍ１と、透光体カバーの中央における変位の大きさとの関係を示す図である。FIG. 3 is a diagram showing the relationship between the mass ratio M2/M1 and the magnitude of displacement at the center of the translucent body cover in the first embodiment of the present invention and the comparative example. 図４は、比較例の振動装置の振動変位図である。FIG. 4 is a vibration displacement diagram of the vibration device of the comparative example. 図５は、質量比Ｍ２／Ｍ１を１．７とした、本発明の第１の実施形態に係る振動装置の振動変位図である。FIG. 5 is a vibration displacement diagram of the vibration device according to the first embodiment of the present invention in which the mass ratio M2/M1 is 1.7. 図６は、質量比Ｍ２／Ｍ１を２．２とした、本発明の第１の実施形態に係る振動装置の振動変位図である。FIG. 6 is a vibration displacement diagram of the vibration device according to the first embodiment of the present invention in which the mass ratio M2/M1 is 2.2. 図７は、本発明の第１の実施形態の変形例に係る振動装置の正面断面図である。FIG. 7 is a front sectional view of a vibrating device according to a modification of the first embodiment of the present invention. 図８は、本発明の第２の実施形態に係る振動装置の正面断面図である。FIG. 8 is a front sectional view of a vibrating device according to a second embodiment of the present invention. 図９は、本発明の第２の実施形態における振動部の振動変位図である。FIG. 9 is a vibration displacement diagram of the vibrating section according to the second embodiment of the present invention. 図１０は、本発明の第２の実施形態における振動部の質量付加部材においての、軸方向における位置と変位の大きさとの関係を示す図である。FIG. 10: is a figure which shows the relationship between the position in the axial direction, and the magnitude|size of a displacement in the mass addition member of the vibration part in the 2nd Embodiment of this invention. 図１１は、本発明の第２の実施形態に係る振動装置の振動変位図である。FIG. 11 is a vibration displacement diagram of the vibration device according to the second embodiment of the present invention. 図１２は、本発明の第２の実施形態の第１の変形例に係る振動装置の振動変位図である。FIG. 12 is a vibration displacement diagram of the vibrating device according to the first modification of the second embodiment of the present invention. 図１３は、本発明の第２の実施形態及び第１の変形例の保持部材においての、軸方向における位置と、変位の大きさとの関係を示す図である。FIG. 13 is a diagram showing the relationship between the position in the axial direction and the magnitude of displacement in the holding members of the second embodiment and the first modification of the present invention. 図１４は、本発明の第２の実施形態及び第１の変形例の保持部材においての、軸方向における位置と、変位における径方向の成分の大きさとの関係を示す図である。FIG. 14 is a diagram showing the relationship between the position in the axial direction and the magnitude of the radial component in the displacement in the holding members of the second embodiment and the first modified example of the present invention. 図１５は、本発明の第２の実施形態及び第１の変形例の保持部材においての、軸方向における位置と、変位における軸方向の成分の大きさとの関係を示す図である。FIG. 15: is a figure which shows the relationship between the position in the axial direction and the magnitude|size of the axial component in a displacement in the holding member of the 2nd Embodiment and 1st modification of this invention. 図１６は、本発明の第２の実施形態及び第１の変形例の保持部材においての、弾性エネルギー比と保持部材における底部の変位との関係を示す図である。FIG. 16: is a figure which shows the relationship between the elastic energy ratio and the displacement of the bottom part in a holding member in the holding member of the 2nd Embodiment and 1st modification of this invention. 図１７は、本発明の第２の実施形態に係る振動装置を、保持部材の底部において外部に固定したときの振動変位図である。FIG. 17 is a vibration displacement diagram when the vibrating device according to the second embodiment of the present invention is externally fixed at the bottom of the holding member. 図１８は、本発明の第２の実施形態の第２の変形例に係る振動装置の正面断面図である。FIG. 18 is a front sectional view of a vibrating device according to a second modification of the second embodiment of the present invention. 図１９は、本発明の第２の実施形態の第３の変形例に係る振動装置の正面断面図である。FIG. 19 is a front sectional view of a vibrating device according to a third modification of the second embodiment of the present invention. 図２０は、本発明の第２の実施形態の第４の変形例に係る振動装置の正面断面図である。20 is a front sectional view of a vibrating device according to a fourth modification of the second embodiment of the present invention. 図２１は、本発明の第２の実施形態の第５の変形例に係る振動装置の正面断面図である。FIG. 21 is a front sectional view of a vibrating device according to a fifth modification of the second embodiment of the present invention. 図２２は、本発明の第２の実施形態の第６の変形例に係る振動装置の正面断面図である。FIG. 22 is a front sectional view of a vibrating device according to a sixth modified example of the second embodiment of the present invention. 図２３は、本発明の第２の実施形態の第７の変形例に係る振動装置の正面断面図である。FIG. 23 is a front sectional view of a vibrating device according to a seventh modification of the second embodiment of the present invention. 図２４は、本発明の第３の実施形態に係るイメージングデバイスの斜視図である。FIG. 24 is a perspective view of an imaging device according to the third embodiment of the present invention. 図２５は、本発明の第３の実施形態に係るイメージングデバイスの正面断面図である。FIG. 25 is a front sectional view of an imaging device according to the third embodiment of the present invention.
　以下、図面を参照しつつ、本発明の具体的な実施形態を説明することにより、本発明を明らかにする。 Hereinafter, the present invention will be clarified by describing specific embodiments of the present invention with reference to the drawings.
　なお、本明細書に記載の各実施形態は、例示的なものであり、異なる実施形態間において、構成の部分的な置換または組み合わせが可能であることを指摘しておく。 It should be pointed out that each embodiment described in the present specification is an exemplification, and a partial replacement or combination of the configurations is possible between different embodiments.
　図１は、第１の実施形態に係る振動装置の正面断面図である。図２は、第１の実施形態に係る振動装置の分解斜視図である。なお、図１以外の図面においては、後述する制御回路を省略することがある。 FIG. 1 is a front cross-sectional view of the vibration device according to the first embodiment. FIG. 2 is an exploded perspective view of the vibration device according to the first embodiment. In addition, in drawings other than FIG. 1, a control circuit described later may be omitted.
　図１に示す振動装置１は、振動により水滴や異物を移動させ、または水滴などを霧化させることにより、撮像素子の視野内から水滴や異物を除去する振動装置である。振動装置１は、透光体カバー２と、圧電素子３と、質量付加部材６と、圧電素子３に電気的に接続されている制御回路７とを有する。透光体カバー２、圧電素子３及び質量付加部材６により内部空間が構成されている。この内部空間内に、撮像素子などの光学検出素子が配置される。なお、本明細書において、内部空間は密閉された空間には限られず、一部が外部に開いた空間も内部空間とする。振動装置１における内部空間は、質量付加部材６側においては外部に開いている。 The vibrating device 1 shown in FIG. 1 is a vibrating device that removes water droplets or foreign matter from the field of view of the image sensor by moving water droplets or foreign matter by vibration or atomizing water droplets or the like. The vibrating device 1 includes a translucent body cover 2, a piezoelectric element 3, a mass addition member 6, and a control circuit 7 electrically connected to the piezoelectric element 3. The translucent body cover 2, the piezoelectric element 3, and the mass addition member 6 constitute an internal space. An optical detection element such as an image pickup element is arranged in this internal space. In addition, in the present specification, the internal space is not limited to a sealed space, and a space partially open to the outside is also an internal space. The internal space of the vibration device 1 is open to the outside on the side of the mass addition member 6.
　透光体カバー２はドーム状の形状を有する。透光体カバー２の平面視における形状は円形である。透光体カバー２は底面２ｂを有する。透光体カバー２は、底面２ｂ近傍に設けられたフランジ部２ｃを有する。フランジ部２ｃは対向し合う第１の面２ｄ及び第２の面を有する。本実施形態においては、フランジ部２ｃの第２の面は底面２ｂに含まれる。なお、透光体カバー２の形状は上記に限定されず、例えば、平板状であってもよい。透光体カバー２の平面視における形状は、例えば、多角形であってもよい。透光体カバー２はフランジ部２ｃを有していなくともよい。 The translucent body cover 2 has a dome shape. The shape of the translucent body cover 2 in a plan view is circular. The translucent body cover 2 has a bottom surface 2b. The translucent body cover 2 has a flange portion 2c provided near the bottom surface 2b. The flange portion 2c has a first surface 2d and a second surface facing each other. In the present embodiment, the second surface of the flange portion 2c is included in the bottom surface 2b. The shape of the translucent body cover 2 is not limited to the above, and may be, for example, a flat plate shape. The shape of the translucent body cover 2 in plan view may be, for example, a polygon. The translucent body cover 2 does not need to have the flange portion 2c.
　透光体カバー２はソーダライムガラスからなる。なお、透光体カバー２の材料は上記に限定されず、例えば、透光性のプラスチック、石英やホウ桂酸などのガラスまたは透光性のセラミックなどを用いることができる。本明細書における透光性とは、少なくとも上記撮像素子などの光学検出素子が検出する波長のエネルギー線や光が透過する透光性をいう。 The translucent cover 2 is made of soda lime glass. The material of the translucent body cover 2 is not limited to the above, and for example, translucent plastic, glass such as quartz or boroic acid, or translucent ceramic can be used. The light-transmitting property in this specification refers to a light-transmitting property through which at least an energy ray having a wavelength detected by an optical detection element such as the above-described image pickup element or light is transmitted.
　透光体カバー２の底面２ｂに圧電素子３が貼り付けられている。圧電素子３は、円環状の圧電体４を有する。圧電体４はＰＺＴからなる。なお、圧電体４の材料は上記に限定されず、例えば、ＰＴや（Ｋ，Ｎａ）ＮｂＯ３などの適宜の圧電セラミックスまたはＬｉＴａＯ３やＬｉＮｂＯ３などの適宜の圧電単結晶などからなっていてもよい。圧電体４の形状は上記に限定されない。 The piezoelectric element 3 is attached to the bottom surface 2b of the translucent body cover 2. The piezoelectric element 3 has an annular piezoelectric body 4. The piezoelectric body 4 is made of PZT. It should be noted that the material of the piezoelectric body 4 is not limited to the above, and may be made of an appropriate piezoelectric ceramic such as PT or (K,Na)NbO 3 or an appropriate piezoelectric single crystal such as LiTaO 3 or LiNbO 3. Good. The shape of the piezoelectric body 4 is not limited to the above.
　圧電素子３は、圧電体４の一方主面上に設けられている第１の電極５ａ及び他方主面上に設けられている第２の電極５ｂを有する。第１の電極５ａ及び第２の電極５ｂは円環状であり、互いに対向するように設けられている。第１の電極５ａ及び第２の電極５ｂは、それぞれ上記制御回路７に電気的に接続されている。制御回路７は、圧電素子３を共振状態において駆動する。第１の電極５ａ及び第２の電極５ｂは、４２Ｎｉからなる。なお、第１の電極５ａ及び第２の電極５ｂは、４２Ｎｉ以外の金属材料からなっていてもよい。例えば、第１の電極５ａ及び第２の電極５ｂは、スパッタリング法などにより形成される、ＡｇやＡｕなどの金属薄膜からなる電極でもよい。 The piezoelectric element 3 has a first electrode 5a provided on one main surface of the piezoelectric body 4 and a second electrode 5b provided on the other main surface. The first electrode 5a and the second electrode 5b are annular and are provided so as to face each other. The first electrode 5a and the second electrode 5b are electrically connected to the control circuit 7, respectively. The control circuit 7 drives the piezoelectric element 3 in a resonance state. The first electrode 5a and the second electrode 5b are made of 42Ni. The first electrode 5a and the second electrode 5b may be made of a metal material other than 42Ni. For example, the first electrode 5a and the second electrode 5b may be electrodes made of a metal thin film such as Ag or Au formed by a sputtering method or the like.
　なお、本実施形態では円環状の１つの圧電素子３が設けられているが、これに限定されない。例えば、複数の矩形板状の圧電素子が、平面視における透光体カバー２の外周縁に沿って設けられていてもよい。 In the present embodiment, one annular piezoelectric element 3 is provided, but the present invention is not limited to this. For example, a plurality of rectangular plate-shaped piezoelectric elements may be provided along the outer peripheral edge of the translucent body cover 2 in plan view.
　圧電素子３は、第１の電極５ａ側において透光体カバー２に貼り付けられている。一方で、圧電素子３の第２の電極５ｂ側には、上記質量付加部材６が貼り付けられている。本実施形態では、質量付加部材６は、透光体カバー２に圧電素子３を介して間接的に連結されている。質量付加部材６は円筒状である。質量付加部材６は、対向し合う第１の開口端面６ａ及び第２の開口端面６ｂを有する。第１の開口端面６ａ及び第２の開口端面６ｂのうち第１の開口端面６ａが透光体カバー２側に位置する。第１の開口端面６ａに上記圧電素子３が貼り付けられている。 The piezoelectric element 3 is attached to the translucent body cover 2 on the side of the first electrode 5a. On the other hand, the mass adding member 6 is attached to the second electrode 5b side of the piezoelectric element 3. In the present embodiment, the mass addition member 6 is indirectly connected to the translucent body cover 2 via the piezoelectric element 3. The mass addition member 6 has a cylindrical shape. The mass addition member 6 has a first opening end surface 6a and a second opening end surface 6b that face each other. Of the first opening end surface 6a and the second opening end surface 6b, the first opening end surface 6a is located on the light-transmitting body cover 2 side. The piezoelectric element 3 is attached to the first opening end surface 6a.
　ここで、第１の開口端面６ａ及び第２の開口端面６ｂを結ぶ方向を軸方向Ｚとし、軸方向Ｚに直交する方向を径方向Ｘとする。なお、本明細書においては、方向Ｘを軸方向Ｚに直交する方向Ｘとして記載することがある。質量付加部材６は、径方向Ｘ外側に位置する外側面６ｃと、径方向Ｘ内側に位置する内側面６ｄとを有する。 Here, a direction connecting the first opening end surface 6a and the second opening end surface 6b is defined as an axial direction Z, and a direction orthogonal to the axial direction Z is defined as a radial direction X. In addition, in this specification, the direction X may be described as the direction X orthogonal to the axial direction Z. The mass addition member 6 has an outer side surface 6c located outside in the radial direction X and an inner side surface 6d located inside in the radial direction X.
　質量付加部材６は、透光体カバー２と共に内部空間を構成するように設けられている。平面視における、透光体カバー２の外周縁に沿う方向を周回方向としたときに、質量付加部材６は、周回方向の全体にわたり、透光体カバー２に間接的に連結されている。なお、質量付加部材６の形状は円筒状には限定されず、例えば、角筒状などであってもよい。 The mass addition member 6 is provided so as to form an internal space together with the translucent body cover 2. When the direction along the outer peripheral edge of the translucent body cover 2 in the plan view is defined as the circumferential direction, the mass addition member 6 is indirectly connected to the translucent body cover 2 over the entire circumferential direction. The shape of the mass addition member 6 is not limited to a cylindrical shape, and may be, for example, a rectangular tube shape.
　質量付加部材６はＳＵＳ４２０Ｊ２からなる。なお、質量付加部材６の材料は上記に限定されず、上記以外の金属または適宜のセラミックなどであってもよい。本実施形態のように、質量付加部材６が金属からなる場合には、質量付加部材６を圧電素子３の第２の電極として用いてもよい。この場合には、図１及び図２に示す、圧電素子３の第２の電極５ｂは設けられていなくともよい。 The mass addition member 6 is made of SUS420J2. The material of the mass adding member 6 is not limited to the above, and may be a metal other than the above or an appropriate ceramic. When the mass addition member 6 is made of metal as in the present embodiment, the mass addition member 6 may be used as the second electrode of the piezoelectric element 3. In this case, the second electrode 5b of the piezoelectric element 3 shown in FIGS. 1 and 2 may not be provided.
　上述したように、制御回路７は圧電素子３を共振状態において駆動する。なお、振動装置１は必ずしも制御回路７を有していなくともよく、外部からの信号により圧電素子３が駆動されるものであってもよい。 As described above, the control circuit 7 drives the piezoelectric element 3 in the resonance state. The vibration device 1 does not necessarily have to have the control circuit 7, and the piezoelectric element 3 may be driven by a signal from the outside.
　本実施形態の特徴は、質量付加部材６が、透光体カバー２と共に内部空間を構成するように、透光体カバー２に連結されていることにある。それによって、水滴などが付着する透光体カバー２を効率的に振動させることができる。これを、本実施形態と比較例とを比較することにより、以下において説明する。 The feature of this embodiment is that the mass addition member 6 is connected to the translucent body cover 2 so as to form an internal space together with the translucent body cover 2. As a result, it is possible to efficiently vibrate the translucent body cover 2 to which water drops and the like adhere. This will be described below by comparing the present embodiment with a comparative example.
　比較例は、質量付加部材６を有しない点において第１の実施形態と異なる。ここで、透光体カバー２の質量をＭ１とし、質量付加部材６及び圧電素子３の質量の合計をＭ２とする。質量比Ｍ２／Ｍ１がそれぞれ異なる、第１の実施形態の構成を有する複数の振動装置１を作製した。さらに、比較例の振動装置を作製した。上記複数の振動装置において、透光体カバー２の中央における変位の大きさを比較した。なお、変位の大きさの比較に際し、圧電素子３に印加する電圧を２０Ｖの振幅の交流電圧とし、振動の周波数を振動装置１の共振周波数である６０ｋＨｚ付近とした。シミュレーションは、３次元モデルにて、有限要素法で実施した。 The comparative example differs from the first embodiment in that the mass addition member 6 is not provided. Here, the mass of the translucent body cover 2 is M1, and the total mass of the mass adding member 6 and the piezoelectric element 3 is M2. A plurality of vibration devices 1 having the configuration of the first embodiment having different mass ratios M2/M1 were produced. Further, a vibration device of a comparative example was manufactured. In the plurality of vibration devices, the magnitude of displacement at the center of the light-transmitting body cover 2 was compared. When comparing the magnitudes of the displacements, the voltage applied to the piezoelectric element 3 was an AC voltage with an amplitude of 20 V, and the vibration frequency was around 60 kHz, which is the resonance frequency of the vibration device 1. The simulation was performed by the finite element method using a three-dimensional model.
　図３は、第１の実施形態及び比較例においての、質量比Ｍ２／Ｍ１と、透光体カバー２の中央における変位の大きさとの関係を示す図である。なお、図３における変位比とは、比較例の透光体カバー２の中央における変位の大きさを基準とする比である。黒色の円形のプロットは第１の実施形態のそれぞれの結果を示し、白色のプロットは比較例の結果を示す。 FIG. 3 is a diagram showing the relationship between the mass ratio M2/M1 and the magnitude of displacement at the center of the translucent body cover 2 in the first embodiment and the comparative example. The displacement ratio in FIG. 3 is a ratio based on the magnitude of displacement at the center of the translucent body cover 2 of the comparative example. The black circle plots show the respective results of the first embodiment, and the white plots show the results of the comparative example.
　図３に示すように、第１の実施形態においては変位比が１よりも大きい。このように、第１の実施形態における透光体カバー２の変位が、比較例における透光体カバー２の変位よりも大きいことがわかる。さらに、第１の実施形態において、質量比Ｍ２／Ｍ１が０．９以上、１．９以下の場合には変位比が１．５以上となっており、変位が特に大きいことがわかる。このように、第１の実施形態においては、透光体カバー２を効率的に振動させることができる。 As shown in FIG. 3, the displacement ratio is larger than 1 in the first embodiment. Thus, it can be seen that the displacement of the translucent body cover 2 in the first embodiment is larger than the displacement of the translucent body cover 2 in the comparative example. Further, in the first embodiment, when the mass ratio M2/M1 is 0.9 or more and 1.9 or less, the displacement ratio is 1.5 or more, and it can be seen that the displacement is particularly large. As described above, in the first embodiment, the translucent body cover 2 can be efficiently vibrated.
　図４は、比較例の振動装置の振動変位図である。図５は、質量比Ｍ２／Ｍ１を１．７とした、第１の実施形態に係る振動装置の振動変位図である。図６は、質量比Ｍ２／Ｍ１を２．２とした、第１の実施形態に係る振動装置の振動変位図である。図４～図６においては、白色に近い程変位が大きいことを示す。他の振動変位図においても同様である。 FIG. 4 is a vibration displacement diagram of the vibration device of the comparative example. FIG. 5 is a vibration displacement diagram of the vibration device according to the first embodiment in which the mass ratio M2/M1 is 1.7. FIG. 6 is a vibration displacement diagram of the vibration device according to the first embodiment in which the mass ratio M2/M1 is 2.2. 4 to 6, it is shown that the displacement is larger as the color is closer to white. The same applies to other vibration displacement diagrams.
　図４に示すように、比較例においては透光体カバー２の底面２ｂ側の変位が大きくなっており、中央における変位は小さくなっている。透光体カバー２の中央と底面２ｂとの間の部分Ａが振動の節となっており、この振動の節を支点として底面２ｂ側が振動している。このように、透光体カバー２において変位が大きい部分が分散されており、中央部の振動の効率が低くなっている。 As shown in FIG. 4, in the comparative example, the displacement on the bottom surface 2b side of the translucent body cover 2 is large, and the displacement at the center is small. A portion A between the center of the translucent body cover 2 and the bottom surface 2b serves as a vibration node, and the bottom surface 2b side vibrates with the vibration node serving as a fulcrum. As described above, in the light-transmitting body cover 2, the large displacement portions are dispersed, and the vibration efficiency of the central portion is low.
　これに対して、図５及び図６に示すように、第１の実施形態においては、透光体カバー２の底面２ｂ側の振動が抑制されており、中央の変位が大きいことがわかる。第１の実施形態では、透光体カバー２の底面２ｂ側に質量付加部材６が連結されている。このように、変位が大きい部分が分散することを抑制することができ、透光体カバー２の中央を集中的に振動させることができる。従って、透光体カバー２を効率的に振動させることができる。 On the other hand, as shown in FIGS. 5 and 6, in the first embodiment, it can be seen that the vibration on the bottom surface 2b side of the translucent body cover 2 is suppressed and the central displacement is large. In the first embodiment, the mass addition member 6 is connected to the bottom surface 2b side of the translucent body cover 2. As described above, it is possible to suppress the dispersion of the portion having a large displacement, and it is possible to intensively vibrate the center of the translucent body cover 2. Therefore, the translucent body cover 2 can be efficiently vibrated.
　なお、図６に示すように、質量付加部材６の質量が大きく、質量比Ｍ２／Ｍ１が２．２の場合には、振動装置１の振動の形態は、質量付加部材６がわずかに変位するものとなっている。これに対して、図５に示すように、質量比Ｍ２／Ｍ１が１．７の場合には、質量付加部材６の変位は非常に小さい。よって、透光体カバー２の中央をより一層集中して振動させることができる。 As shown in FIG. 6, when the mass of the mass addition member 6 is large and the mass ratio M2/M1 is 2.2, the vibration mode of the vibration device 1 is such that the mass addition member 6 is slightly displaced. It has become a thing. On the other hand, as shown in FIG. 5, when the mass ratio M2/M1 is 1.7, the displacement of the mass addition member 6 is very small. Therefore, the center of the translucent body cover 2 can be further concentrated and vibrated.
　質量比Ｍ２／Ｍ１は、０．９以上、１．９以下であることが好ましい。この場合には、図５に示した場合と同様に、透光体カバー２の中央をより一層集中して振動させることができ、透光体カバー２をより一層効率的に振動させることができる。 The mass ratio M2/M1 is preferably 0.9 or more and 1.9 or less. In this case, similarly to the case shown in FIG. 5, the center of the light-transmitting body cover 2 can be further concentrated and vibrated, and the light-transmitting body cover 2 can be vibrated more efficiently. ..
　ところで、圧電素子３の配置は、透光体カバー２と質量付加部材６との間には限定されない。図７に示す第１の実施形態の変形例においては、圧電素子３は透光体カバー２のフランジ部２ｃ上に設けられている。より具体的には、底面２ｂに対向するフランジ部２ｃの第１の面２ｄ上に圧電素子３が設けられている。なお、質量付加部材６は、透光体カバー２に直接的に連結されている。この場合においても、第１の実施形態と同様に、透光体カバー２を効率的に振動させることができる。 By the way, the arrangement of the piezoelectric element 3 is not limited between the translucent body cover 2 and the mass addition member 6. In the modification of the first embodiment shown in FIG. 7, the piezoelectric element 3 is provided on the flange portion 2c of the translucent body cover 2. More specifically, the piezoelectric element 3 is provided on the first surface 2d of the flange portion 2c that faces the bottom surface 2b. The mass addition member 6 is directly connected to the translucent body cover 2. Also in this case, the light-transmitting body cover 2 can be efficiently vibrated as in the first embodiment.
　図８は、第２の実施形態に係る振動装置の正面断面図である。 FIG. 8 is a front sectional view of the vibration device according to the second embodiment.
　本実施形態は、透光体カバー２、圧電素子３及び質量付加部材６を含む振動部を保持している保持部材１８が設けられている点において、第１の実施形態と異なる。上記の点以外においては、本実施形態の振動装置１１は第１の実施形態の振動装置１と同様の構成を有する。 The present embodiment is different from the first embodiment in that a holding member 18 that holds a vibrating portion including the translucent body cover 2, the piezoelectric element 3, and the mass addition member 6 is provided. Except for the above points, the vibration device 11 of the present embodiment has the same configuration as the vibration device 1 of the first embodiment.
　より具体的には、保持部材１８は質量付加部材６を保持している。保持部材１８は、質量付加部材６の外側面６ｃに接続されている接続部１８ａと、接続部１８ａに連ねられているバネ部１８ｂと、バネ部１８ｂに連ねられている底部１８ｃとを有する。接続部１８ａは円環状である。バネ部１８ｂ及び底部１８ｃは、軸方向Ｚに延びる円筒状の形状を有する。なお、保持部材１８のそれぞれの部分の形状は上記に限定されない。接続部１８ａは、例えば、円環状以外の枠状の形状を有していてもよい。バネ部１８ｂ及び底部１８ｃは、例えば、角筒状などの形状を有していてもよい。 More specifically, the holding member 18 holds the mass addition member 6. The holding member 18 has a connecting portion 18a connected to the outer side surface 6c of the mass adding member 6, a spring portion 18b connected to the connecting portion 18a, and a bottom portion 18c connected to the spring portion 18b. The connecting portion 18a has an annular shape. The spring portion 18b and the bottom portion 18c have a cylindrical shape extending in the axial direction Z. The shape of each part of the holding member 18 is not limited to the above. The connecting portion 18a may have, for example, a frame shape other than the annular shape. The spring portion 18b and the bottom portion 18c may have a shape such as a rectangular tube shape, for example.
　図８に示すように、振動装置１１の保持部材１８の軸方向Ｚに沿う断面は略Ｌ字形の形状を有する。より具体的には、保持部材１８のそれぞれの部分が延びる方向に直交する方向に沿う厚みを保持部材１８のそれぞれの部分の肉厚としたときに、保持部材１８においては、底部１８ｃの肉厚がバネ部１８ｂの肉厚よりも厚い。それによって、バネ部１８ｂは底部１８ｃよりも変形し易い。 As shown in FIG. 8, the cross section of the holding member 18 of the vibration device 11 along the axial direction Z has a substantially L-shape. More specifically, when the thickness of each portion of the holding member 18 is set to be the thickness along the direction orthogonal to the direction in which the respective portions of the holding member 18 extend, in the holding member 18, the thickness of the bottom portion 18c. Is thicker than the wall thickness of the spring portion 18b. Thereby, the spring portion 18b is more easily deformed than the bottom portion 18c.
　なお、保持部材１８の底部１８ｃの肉厚は、バネ部１８ｂ側から径方向Ｘ内側に向かい厚くなっている。バネ部１８ｂ及び底部１８ｃの外径は同じであり、バネ部１８ｂの内径よりも底部１８ｃの内径は小さい。それによって、振動装置１１を小型にすることができる。もっとも、底部１８ｃは、バネ部１８ｂ側から径方向Ｘ外側に向かい肉厚が厚くなっていてもよい。 Note that the thickness of the bottom portion 18c of the holding member 18 increases from the spring portion 18b side toward the inside in the radial direction X. The outer diameters of the spring portion 18b and the bottom portion 18c are the same, and the inner diameter of the bottom portion 18c is smaller than the inner diameter of the spring portion 18b. Thereby, the vibration device 11 can be downsized. However, the bottom portion 18c may be thicker in the radial direction X from the spring portion 18b side.
　本実施形態では、保持部材１８はＳＵＳ４２０Ｊ２からなる。なお、保持部材１８の材料は上記に限定されず、上記以外の金属または適宜のセラミックなどであってもよい。保持部材１８は一体として形成されていてもよく、あるいは、それぞれの部分が別体として形成されていてもよい。例えば、底部１８ｃの材料の剛性がバネ部１８ｂの材料の剛性よりも高いことにより、バネ部１８ｂが底部１８ｃよりも変形し易くなっていてもよい。 In this embodiment, the holding member 18 is made of SUS420J2. The material of the holding member 18 is not limited to the above, and may be a metal other than the above or an appropriate ceramic. The holding member 18 may be integrally formed, or each part may be separately formed. For example, the rigidity of the material of the bottom portion 18c is higher than the rigidity of the material of the spring portion 18b, so that the spring portion 18b may be more easily deformed than the bottom portion 18c.
　ところで、本実施形態においては、保持部材１８は、上記振動部の振動の節以外の部分に接続されている。これを、下記の図９及び図１０を参照して示す。なお、図９及び図１０に示す変位分布を求めるに際し、２次元の軸対称モデルによるシミュレーションを行った。該シミュレーションにおいて、圧電素子３に印加した電圧は２０Ｖであり、振動の周波数を振動装置１１の共振周波数である６０ｋＨｚ付近とした。 By the way, in the present embodiment, the holding member 18 is connected to a portion other than the vibration node of the vibrating portion. This is shown with reference to FIGS. 9 and 10 below. When obtaining the displacement distributions shown in FIGS. 9 and 10, simulation was performed using a two-dimensional axisymmetric model. In the simulation, the voltage applied to the piezoelectric element 3 was 20 V, and the frequency of vibration was set to about 60 kHz which is the resonance frequency of the vibration device 11.
　図９は、第２の実施形態における振動部の振動変位図である。図１０は、第２の実施形態における振動部の質量付加部材においての、軸方向における位置と変位の大きさとの関係を示す図である。図９は、図８に示す断面の半分に相当する部分を示す。下記の図９以外の各振動変位図も、振動装置の軸方向に沿う断面の半分に相当する部分を示すことがある。図９及び図１０中の位置Ｂは、質量付加部材の第１の開口端面の軸方向における位置を示し、位置Ｃは、第２の開口端面の軸方向における位置を示す。なお、位置Ｂは０ｍｍであり、位置Ｃは４ｍｍである。図１０中の実線は変位の大きさを示し、破線は変位における径方向Ｘの成分の大きさを示し、一点鎖線は変位における軸方向の成分を示す。 FIG. 9 is a vibration displacement diagram of the vibrating section in the second embodiment. FIG. 10 is a diagram showing the relationship between the axial position and the magnitude of displacement in the mass adding member of the vibrating unit according to the second embodiment. FIG. 9 shows a portion corresponding to half of the cross section shown in FIG. Each vibration displacement diagram other than FIG. 9 below may show a portion corresponding to half of the cross section along the axial direction of the vibration device. Position B in FIGS. 9 and 10 indicates the axial position of the first opening end face of the mass addition member, and position C indicates the axial position of the second opening end face. The position B is 0 mm and the position C is 4 mm. The solid line in FIG. 10 indicates the magnitude of the displacement, the broken line indicates the magnitude of the radial component X in the displacement, and the alternate long and short dash line indicates the axial component in the displacement.
　図９及び図１０に示すように、質量付加部材６においては、０．７μｍ～２μｍの変位が生じている。なお、この変位は、透光体カバー２の変位の最大値の４％～１２％程度である。質量付加部材６においては、変位の大きさが０である振動の節は存在しないことがわかる。本実施形態においては、図１０中の二点鎖線で示す位置に保持部材１８が接続されている。より具体的には、質量付加部材６の軸方向における位置が１ｍｍ以上、１．５ｍｍ以下の範囲内の部分に、保持部材１８が接続されている。このように、保持部材１８は、振動部における質量付加部材６の振動の節以外の部分に接続されている。もっとも、振動部の質量付加部材６などが振動の節を有する場合には、振動の節の部分に保持部材１８が接続されていてもよい。本実施形態における振動部は、保持部材１８を介して間接的に外部などに固定される。 As shown in FIGS. 9 and 10, the mass addition member 6 is displaced by 0.7 μm to 2 μm. This displacement is about 4% to 12% of the maximum value of the displacement of the translucent body cover 2. It can be seen that in the mass addition member 6, there is no vibration node having a displacement magnitude of 0. In the present embodiment, the holding member 18 is connected to the position shown by the chain double-dashed line in FIG. More specifically, the holding member 18 is connected to a portion where the position of the mass adding member 6 in the axial direction is 1 mm or more and 1.5 mm or less. In this way, the holding member 18 is connected to a portion other than the vibration node of the mass adding member 6 in the vibrating portion. However, when the mass adding member 6 of the vibrating portion has a vibration node, the holding member 18 may be connected to the vibration node portion. The vibrating section in the present embodiment is indirectly fixed to the outside or the like via the holding member 18.
　振動装置１１は、第１の実施形態と同様に、透光体カバー２に連結された質量付加部材６を有する。加えて、振動部が外部などに固定された場合において、ダンピングを効果的に抑制することができる。従って、水滴などが付着する透光体カバー２をより一層効率的に振動させることができる。この詳細を以下において説明する。なお、第２の実施形態の第１の変形例に係る振動装置におけるダンピングの抑制の効果も併せて示す。第１の変形例の振動装置は、保持部材のバネ部及び底部の肉厚が同じである点以外においては、第２の実施形態の振動装置１１と同様に構成されている。 The vibration device 11 has the mass addition member 6 connected to the translucent body cover 2 as in the first embodiment. In addition, damping can be effectively suppressed when the vibrating portion is fixed to the outside or the like. Therefore, it is possible to more efficiently vibrate the translucent body cover 2 to which water drops and the like adhere. The details will be described below. The effect of suppressing damping in the vibration device according to the first modification of the second embodiment is also shown. The vibrating device of the first modified example is configured similarly to the vibrating device 11 of the second embodiment except that the spring portion and the bottom portion of the holding member have the same thickness.
　下記の図１１～図１５に示す変位を求めるに際し、第２の実施形態及び第１の変形例の振動装置においては、質量付加部材の第１の開口端面から第２の開口端面側に１．２５ｍｍ離れた部分に保持部材を接続した。 When obtaining the displacements shown in FIGS. 11 to 15 below, in the vibrating device of the second embodiment and the first modified example, 1. From the first opening end face of the mass adding member to the second opening end face side. The holding member was connected to the part 25 mm apart.
　図１１は、第２の実施形態に係る振動装置の振動変位図である。図１２は、第２の実施形態の第１の変形例に係る振動装置の振動変位図である。図１１及び図１２中の位置Ｄは、保持部材の接続部の軸方向における位置を示し、位置Ｅは、第２の開口端面の軸方向における位置を示す。図１１及び図１２以外の図面においても同様である。 FIG. 11 is a vibration displacement diagram of the vibration device according to the second embodiment. FIG. 12 is a vibration displacement diagram of the vibrating device according to the first modification of the second embodiment. Position D in FIGS. 11 and 12 indicates the axial position of the connecting portion of the holding member, and position E indicates the axial position of the second opening end face. The same applies to drawings other than FIGS. 11 and 12.
　図１１に示すように、第２の実施形態では、保持部材１８の底部１８ｃにおいてはほぼ変位していないことがわかる。図１２に示すように、第１の変形例における保持部材２８Ａの底部２８ｃにおいても、変位が抑制されている。 As shown in FIG. 11, it can be seen that in the second embodiment, the bottom portion 18c of the holding member 18 is not substantially displaced. As shown in FIG. 12, the displacement is also suppressed in the bottom portion 28c of the holding member 28A in the first modified example.
　図１３は、第２の実施形態及び第１の変形例の保持部材においての、軸方向における位置と、変位の大きさとの関係を示す図である。図１４は、第２の実施形態及び第１の変形例の保持部材においての、軸方向における位置と、変位における径方向の成分の大きさとの関係を示す図である。図１５は、第２の実施形態及び第１の変形例の保持部材においての、軸方向における位置と、変位における軸方向の成分の大きさとの関係を示す図である。なお、位置Ｄは０ｍｍであり、位置Ｅは８ｍｍである。軸方向における位置が５ｍｍ以上の部分が底部に相当する。図１３～図１５中の実線は第２の実施形態の結果を示し、破線は第１の変形例の結果を示す。 FIG. 13 is a diagram showing the relationship between the position in the axial direction and the magnitude of displacement in the holding members of the second embodiment and the first modification. FIG. 14 is a diagram showing the relationship between the position in the axial direction and the magnitude of the radial component in the displacement in the holding members of the second embodiment and the first modified example. FIG. 15 is a diagram showing the relationship between the position in the axial direction and the magnitude of the axial component in the displacement in the holding members of the second embodiment and the first modified example. The position D is 0 mm and the position E is 8 mm. A portion having a position of 5 mm or more in the axial direction corresponds to the bottom portion. 13 to 15, the solid line shows the result of the second embodiment, and the broken line shows the result of the first modification.
　図１３に示すように、第２の実施形態及び第１の変形例において、位置Ｄが示す保持部材２８Ａの接続部１８ａの変位は１．６μｍ程度である。第１の変形例においては、接続部１８ａから底部２８ｃに近づくほど、変位が小さくなっていることがわかる。軸方向Ｚにおける位置が５ｍｍ以上の部分である底部２８ｃにおいては、変位は０．４μｍ以下程度となっている。このように、バネ部１８ｂのバネ性により振動を吸収することによって、底部２８ｃにおける変位を低減することができている。より具体的には、底部２８ｃにおける変位を、接続部１８ａにおける変位と比較して７５％程度低減することができている。 As shown in FIG. 13, in the second embodiment and the first modification, the displacement of the connecting portion 18a of the holding member 28A indicated by the position D is about 1.6 μm. In the first modified example, it can be seen that the displacement becomes smaller as it gets closer to the bottom portion 28c from the connection portion 18a. The displacement is about 0.4 μm or less at the bottom portion 28c where the position in the axial direction Z is 5 mm or more. In this way, by absorbing the vibration due to the elasticity of the spring portion 18b, the displacement of the bottom portion 28c can be reduced. More specifically, the displacement at the bottom portion 28c can be reduced by about 75% as compared with the displacement at the connection portion 18a.
　より詳細には、図１４に示すように、第１の変形例においては、振動の径方向Ｘの成分は、バネ部１８ｂのバネ性により吸収され、軸方向Ｘにおける６．５ｍｍの位置付近においては０μｍとなっていることがわかる。図１５に示すように、第１の変形例においては、軸方向Ｚにおける位置が５ｍｍ以上である底部２８ｃにおいては、変位の軸方向Ｚの成分は０．３μｍ程度となっている。 More specifically, as shown in FIG. 14, in the first modification, the radial component of the vibration is absorbed by the spring property of the spring portion 18b, and the vibrating component near the position of 6.5 mm in the axial direction X. It can be seen that is 0 μm. As shown in FIG. 15, in the first modified example, in the bottom portion 28c whose position in the axial direction Z is 5 mm or more, the component of the displacement in the axial direction Z is about 0.3 μm.
　なお、上記のバネ部１８ｂによる振動の吸収とは、質量付加部材６から接続部１８ａを経て伝搬した振動の大部分をバネ部１８ｂにおける振動とすることができることをいう。これにより、振動を底部２８ｃまで漏洩し難くすることができる。 Note that the above-mentioned absorption of vibration by the spring portion 18b means that most of the vibration propagated from the mass adding member 6 via the connecting portion 18a can be the vibration in the spring portion 18b. Thereby, it is possible to make it difficult for the vibration to leak to the bottom portion 28c.
　一方で、第２の実施形態においては、図１３に示すように、軸方向Ｚにおける位置が５ｍｍ以上である底部１８ｃにおいて、変位は０．０３μｍまで抑制することができている。このように、質量付加部材６から接続部１８ａを経て伝搬した振動を９８％程度低減することができている。より詳細には、図１４及び図１５に示すように、変位のＸ方向の成分及びＺ方向の成分を両方とも０．０２μｍまで抑制することができている。第２の実施形態においては、第１の変形例と同様にバネ部１８ｂのバネ性により振動を吸収することができ、さらに、底部１８ｃ自体が変形し難い。よって、保持部材１８が振動の節以外の部分に接続されていても、保持部材１８の底部１８ｃへの振動漏洩を効果的に抑制することができる。従って、底部１８ｃが外部などに固定された場合において、振動ダンピングの発生を抑制できる。 On the other hand, in the second embodiment, as shown in FIG. 13, the displacement can be suppressed to 0.03 μm at the bottom portion 18c whose position in the axial direction Z is 5 mm or more. In this way, the vibration propagated from the mass adding member 6 via the connecting portion 18a can be reduced by about 98%. More specifically, as shown in FIGS. 14 and 15, both the X-direction component and the Z-direction component of the displacement can be suppressed to 0.02 μm. In the second embodiment, vibration can be absorbed by the elasticity of the spring portion 18b as in the first modification, and the bottom portion 18c itself is less likely to be deformed. Therefore, even if the holding member 18 is connected to a portion other than the node of vibration, vibration leakage to the bottom portion 18c of the holding member 18 can be effectively suppressed. Therefore, when the bottom portion 18c is fixed to the outside or the like, it is possible to suppress the occurrence of vibration damping.
　振動装置１１の保持部材１８は、弾性定数が小さく変形し易いバネ部１８ｂと、弾性定数が大きく変形し難い底部１８ｃとを有する。それによって、保持部材１８に質量付加部材６側から加えられたひずみエネルギーの大部分を、バネ部１８ｂにおける弾性エネルギーに変換することができ、上記のように底部１８ｃを変位し難くすることができる。以下において、保持部材１８のバネ部１８ｂと底部１８ｃとにおいて弾性定数に差が設けられていることにより、ダンピングを効果的に抑制できることを、より詳細に説明する。 The holding member 18 of the vibration device 11 has a spring portion 18b having a small elastic constant and easily deformed, and a bottom portion 18c having a large elastic constant and hard to deform. Thereby, most of the strain energy applied to the holding member 18 from the side of the mass addition member 6 can be converted into elastic energy in the spring portion 18b, and the bottom portion 18c can be made difficult to displace as described above. .. Hereinafter, it will be described in more detail that damping can be effectively suppressed by providing a difference in elastic constant between the spring portion 18b and the bottom portion 18c of the holding member 18.
　保持部材１８に外力が加えられたときの、バネ部１８ｂの弾性エネルギーをＥ１とし、底部１８ｃの弾性エネルギーをＥ２とする。弾性エネルギーＥ１は、バネ部１８ｂの弾性定数をＫ１、変位をｘ１としたときに、Ｅ１＝（１／２）×Ｋ１×ｘ１ ２により表される。弾性エネルギーＥ２は、底部１８ｃの弾性定数をＫ２、変位をｘ２としたときに、Ｅ２＝（１／２）×Ｋ２×ｘ２ ２により表される。図１３～図１５に示す変位を求めるに際し、保持部材１８における弾性エネルギー比Ｅ１／Ｅ２は４６としていた。 Let E1 be the elastic energy of the spring portion 18b and E2 be the elastic energy of the bottom portion 18c when an external force is applied to the holding member 18. Elastic energy E1 is the elastic constant K 1 of the spring portion 18b, the displacement when the x 1, represented by E1 = (1/2) × K 1 × x 1 2. Elastic energy E2 is the elastic constant of the bottom 18c K 2, a displacement when a x 2, represented by E2 = (1/2) × K 2 × x 2 2. When obtaining the displacements shown in FIGS. 13 to 15, the elastic energy ratio E1/E2 of the holding member 18 was set to 46.
　さらに、保持部材１８の底部１８ｃにおける弾性定数Ｋ２を変化させることによって弾性エネルギー比Ｅ１／Ｅ２を変化させた、第２の実施形態の構成を有する複数の振動装置１１において、底部１８ｃの変位を測定した。 Further, in the plurality of vibration devices 11 having the configuration of the second embodiment in which the elastic energy ratio E1/E2 is changed by changing the elastic constant K 2 at the bottom portion 18c of the holding member 18, the displacement of the bottom portion 18c is changed. It was measured.
　図１６は、第２の実施形態及び第１の変形例の保持部材においての、弾性エネルギー比と保持部材における底部の変位との関係を示す図である。なお、図１６における変位比とは、バネ部及び底部が一様に構成された上記第１の変形例における変位を基準とする比である。黒色の円形のプロットは第２の実施形態の結果を示し、白色のプロットは第１の変形例の結果を示す。 FIG. 16 is a diagram showing the relationship between the elastic energy ratio and the displacement of the bottom of the holding member in the holding members of the second embodiment and the first modification. Note that the displacement ratio in FIG. 16 is a ratio based on the displacement in the first modified example in which the spring portion and the bottom portion are uniformly configured. The black circle plot shows the result of the second embodiment, and the white plot shows the result of the first modification.
　図１６に示すように、弾性エネルギー比Ｅ１／Ｅ２が２以上の場合には、第１の変形例を基準とした変位比が１未満となっており、底部１８ｃにおける変位をより一層抑制できることがわかる。このように、弾性エネルギー比Ｅ１／Ｅ２は２以上であることが好ましい。それによって、底部１８ｃが外部などに固定された場合において、振動のダンピングをより一層抑制することができる。弾性エネルギー比Ｅ１／Ｅ２は６以上であることがより好ましい。この場合には、変位比を約０．５以下とすることができる。よって、底部１８ｃにおける変位をより一層効果的に抑制することができ、底部１８ｃが外部などに固定された場合において、振動ダンピングの発生をより一層効果的に抑制することができる。 As shown in FIG. 16, when the elastic energy ratio E1/E2 is 2 or more, the displacement ratio based on the first modification is less than 1, and the displacement at the bottom portion 18c can be further suppressed. Recognize. Thus, the elastic energy ratio E1/E2 is preferably 2 or more. Thereby, when the bottom portion 18c is fixed to the outside or the like, vibration damping can be further suppressed. The elastic energy ratio E1/E2 is more preferably 6 or more. In this case, the displacement ratio can be about 0.5 or less. Therefore, the displacement of the bottom portion 18c can be suppressed more effectively, and the occurrence of vibration damping can be suppressed even more effectively when the bottom portion 18c is fixed to the outside or the like.
　図１７は、第２の実施形態に係る振動装置を、保持部材の底部において外部に固定したときの振動変位図である。なお、図１７に示す変位を求めるに際し、保持部材の底部を、機械Ｑが１０であるＰＰＳ－ＦＧ４０（ポリフェニレンサルファイド－ガラス４０％）からなる部材に固定した。図１７においては、該部材を外部Ｆとして示している。 FIG. 17 is a vibration displacement diagram when the vibration device according to the second embodiment is externally fixed at the bottom of the holding member. When obtaining the displacement shown in FIG. 17, the bottom of the holding member was fixed to a member made of PPS-FG40 (polyphenylene sulfide-glass 40%) having a machine Q of 10. In FIG. 17, the member is shown as the outer side F.
　図１１及び図１７を比較してわかるように、振動装置１１が外部Ｆに固定されていない場合と、保持部材１８の底部１８ｃにおいて外部Ｆに固定されている場合とにおいて、振動の状態はほぼ変わらないことがわかる。より具体的には、振動装置１１が外部Ｆに固定されていない場合においては、透光体カバー２の中央の変位は１８．６μｍであった。図１７に示すように、振動装置１１が外部Ｆに、底部１８ｃにおいて固定されている状態においては、透光体カバー２の中央の変位は１８．６μｍであった。このように、第２の実施形態においては、ダンピングを効果的に抑制することができるため、外部に固定されたことによる透光体カバー２の振動の減衰が生じ難いことがわかる。従って、透光体カバー２をより一層効率的に振動させることができる。 As can be seen by comparing FIGS. 11 and 17, the vibration state is almost the same when the vibration device 11 is not fixed to the external F and when it is fixed to the external F at the bottom portion 18c of the holding member 18. You can see that it does not change. More specifically, when the vibration device 11 is not fixed to the outside F, the displacement of the center of the translucent body cover 2 was 18.6 μm. As shown in FIG. 17, when the vibrating device 11 was fixed to the outside F at the bottom portion 18c, the center displacement of the translucent body cover 2 was 18.6 μm. As described above, in the second embodiment, since damping can be effectively suppressed, it is understood that the vibration of the translucent body cover 2 is less likely to be attenuated due to being fixed to the outside. Therefore, the translucent body cover 2 can be vibrated more efficiently.
　以下において、保持部材の構成のみが第２の実施形態と異なる、第２の実施形態の第２～第７の変形例を示す。第２～第７の変形例においても、第２の実施形態と同様にダンピングを抑制することができ、透光体カバー２をより一層効率的に振動させることができる。なお、下記の図１８～図２３は、振動装置の軸方向Ｚに沿う軸対称の２次元断面図である。 In the following, second to seventh modified examples of the second embodiment will be shown in which only the configuration of the holding member is different from that of the second embodiment. Also in the second to seventh modifications, damping can be suppressed as in the second embodiment, and the translucent body cover 2 can be vibrated more efficiently. 18 to 23 described below are axially symmetric two-dimensional cross-sectional views along the axial direction Z of the vibration device.
　図１８に示す第２の変形例においては、保持部材２８Ｂは透光体カバー２に接続されている。より具体的には、保持部材２８Ｂの接続部２８ａの軸方向Ｚに沿う断面は、略コの字形の形状を有する。接続部２８ａは、対向し合う第１の接続面２８ｄ及び第２の接続面２８ｅを有する。接続部２８ａは、透光体カバー２のフランジ部２ｃを、第１の接続面２８ｄ及び第２の接続面２８ｅにより挟むように設けられている。第１の接続面２８ｄはフランジ部２ｃの第１の面２ｄに接続されている。第２の接続面２８ｅは透光体カバー２の底面２ｂに接続されている。 In the second modification shown in FIG. 18, the holding member 28B is connected to the translucent body cover 2. More specifically, the cross section of the connecting portion 28a of the holding member 28B along the axial direction Z has a substantially U-shape. The connection portion 28a has a first connection surface 28d and a second connection surface 28e that face each other. The connection portion 28a is provided so as to sandwich the flange portion 2c of the translucent body cover 2 between the first connection surface 28d and the second connection surface 28e. The first connection surface 28d is connected to the first surface 2d of the flange portion 2c. The second connection surface 28e is connected to the bottom surface 2b of the translucent body cover 2.
　図１９に示す第３の変形例においては、保持部材２８Ｃの底部１８ｃの肉厚は、バネ部１８ｂ側から径方向Ｘ外側に向かい厚くなっている。バネ部１８ｂ及び底部１８ｃの内径は同じであり、バネ部１８ｂの外径よりも底部１８ｃの外径は大きい。 In the third modification shown in FIG. 19, the thickness of the bottom portion 18c of the holding member 28C increases from the spring portion 18b side toward the outside in the radial direction X. The inner diameters of the spring portion 18b and the bottom portion 18c are the same, and the outer diameter of the bottom portion 18c is larger than the outer diameter of the spring portion 18b.
　図２０に示す第４の変形例においては、保持部材２８Ｄの接続部１８ａは質量付加部材６の内側面６ｄに接続されている。なお、底部１８ｃの肉厚は、第３の変形例と同様に、バネ部１８ｂ側から径方向Ｘ外側に向かい厚くなっている。 In the fourth modification shown in FIG. 20, the connecting portion 18a of the holding member 28D is connected to the inner side surface 6d of the mass adding member 6. The wall thickness of the bottom portion 18c increases from the spring portion 18b side toward the outside in the radial direction X, similarly to the third modification.
　図２１に示す第５の変形例においては、保持部材２８Ｅのバネ部２８ｂの軸方向Ｚに沿う断面の形状はメアンダ状である。この場合には、バネ部２８ｂのバネ性によってより一層振動を吸収することができ、質量付加部材６側からの振動が底部１８ｃまでより一層漏洩し難い。 In the fifth modification shown in FIG. 21, the cross section of the spring portion 28b of the holding member 28E along the axial direction Z has a meandering shape. In this case, the spring property of the spring portion 28b can further absorb the vibration, and the vibration from the side of the mass addition member 6 is less likely to leak to the bottom portion 18c.
　図２２に示す第６の変形例においては、保持部材２８Ｆは径方向Ｘに延びている。保持部材２８Ｆにおける径方向Ｘの最も内側に接続部１８ａが位置し、径方向Ｘの最も外側に底部１８ｃが位置する。接続部１８ａと底部１８ｃとの間にバネ部２８ｂが位置する。バネ部２８ｂの軸方向Ｚに沿う断面の形状は、第５の変形例と同様に、メアンダ状である。保持部材２８Ｆは、軸方向Ｚにおいて、質量付加部材６の内側に位置する。それによって、振動装置の軸方向Ｚに沿う寸法を小さくすることができる。 In the sixth modification shown in FIG. 22, the holding member 28F extends in the radial direction X. The connecting portion 18a is located on the innermost side in the radial direction X of the holding member 28F, and the bottom portion 18c is located on the outermost side in the radial direction X. The spring portion 28b is located between the connecting portion 18a and the bottom portion 18c. The shape of the cross section of the spring portion 28b along the axial direction Z is a meandering shape, as in the fifth modification. The holding member 28F is located inside the mass addition member 6 in the axial direction Z. As a result, the size of the vibration device along the axial direction Z can be reduced.
　図２３に示す第７の変形例においては、保持部材２８Ｇにおける接続部１８ａ及びバネ部１８ｂの材料と、底部１８ｃの材料とが異なる。より具体的には、底部１８ｃの材料のバネ定数がバネ部１８ｂの材料のバネ定数よりも高い。 In the seventh modification shown in FIG. 23, the material of the connecting portion 18a and the spring portion 18b of the holding member 28G and the material of the bottom portion 18c are different. More specifically, the spring constant of the material of the bottom portion 18c is higher than the spring constant of the material of the spring portion 18b.
　図２４は、第３の実施形態に係るイメージングデバイスの斜視図である。図２５は、第３の実施形態に係るイメージングデバイスの正面断面図である。 FIG. 24 is a perspective view of an imaging device according to the third embodiment. FIG. 25 is a front sectional view of the imaging device according to the third embodiment.
　図２５に示すように、光学検出装置としてのイメージングデバイス３０は、振動装置３１と、振動装置３１の内部空間内に配置された撮像素子３０Ａとを有する。なお、本実施形態における振動装置３１は、ケース部材３２を有する点において第２の実施形態の振動装置１１と異なる。上記の点以外においては、本実施形態の振動装置３１は第２の実施形態の振動装置１１と同様の構成を有する。 As shown in FIG. 25, the imaging device 30 as an optical detection device includes a vibrating device 31 and an image pickup element 30A arranged in the internal space of the vibrating device 31. The vibrating device 31 according to the present embodiment differs from the vibrating device 11 according to the second embodiment in that the vibrating device 31 includes the case member 32. Except for the points described above, the vibration device 31 of the present embodiment has the same configuration as the vibration device 11 of the second embodiment.
　図２４に示すように、ケース部材３２は、略円筒状の第１のケース部３３と、第１のケース部３３に接続されている略角筒状の第２のケース部３４と、第２のケース部３４に接続されている板状の第３のケース部３５とを有する。ケース部材３２の第３のケース部３５には、外部接続部材３６が接続されている。 As shown in FIG. 24, the case member 32 includes a first case part 33 having a substantially cylindrical shape, a second case part 34 having a substantially rectangular tube shape connected to the first case part 33, and a second case part 34. And a plate-shaped third case portion 35 connected to the case portion 34. An external connection member 36 is connected to the third case portion 35 of the case member 32.
　図２５に示すように、第２のケース部３４は、第１のケース部３３に接続されている部分付近に位置しており、軸方向Ｚに直行する方向Ｘ内側に延びている固定部３４ａを有する。固定部３４ａに振動装置３１の保持部材１８の底部１８ｃが固定されている。本実施形態においては、ケース部材３２は、透光体カバー２、圧電素子３及び質量付加部材６を含む振動部を、保持部材１８を介して間接的に保持している。なお、振動装置３１が保持部材１８を有しない場合などにおいて、ケース部材３２が振動部を直接的に保持する構成であってもよい。 As shown in FIG. 25, the second case portion 34 is located near the portion connected to the first case portion 33 and extends inward in the direction X orthogonal to the axial direction Z. Have. The bottom portion 18c of the holding member 18 of the vibration device 31 is fixed to the fixing portion 34a. In the present embodiment, the case member 32 indirectly holds the vibrating portion including the translucent body cover 2, the piezoelectric element 3, and the mass addition member 6 via the holding member 18. When the vibrating device 31 does not have the holding member 18, the case member 32 may directly hold the vibrating portion.
　第１のケース部３３は、開口部３３ｃを含む天板部３３ａを有する。天板部３３ａは、透光体カバー２のフランジ部２ｃに対向するように配置されている。軸方向Ｚ側から見て、天板部３３ａとフランジ部２ｃとは重なっている。それによって、水滴などが内部に侵入し難い。なお、天板部３３ａとフランジ部２ｃとは接していない。これにより、透光体カバー２の振動が阻害され難い。第１のケース部３３の開口部３３ｃから、透光体カバー２におけるドーム状の部分の一部が外側に突出している。 The first case portion 33 has a top plate portion 33a including an opening 33c. The top plate portion 33a is arranged so as to face the flange portion 2c of the translucent body cover 2. When viewed from the axial Z side, the top plate portion 33a and the flange portion 2c overlap each other. As a result, it is difficult for water drops to enter the inside. The top plate portion 33a and the flange portion 2c are not in contact with each other. As a result, the vibration of the translucent body cover 2 is unlikely to be disturbed. A part of the dome-shaped portion of the translucent body cover 2 projects outward from the opening 33c of the first case portion 33.
　第３のケース部３５は、第２のケース部３４の開口部を封止するように配置されている。ケース部材３２は樹脂からなる。なお、ケース部材３２の構成及び材料は上記に限定されず、振動装置３１における他の部分と共に内部空間を構成し、該内部空間内に撮像素子３０Ａを配置することができるものであればよい。 The third case portion 35 is arranged so as to seal the opening of the second case portion 34. The case member 32 is made of resin. The configuration and material of the case member 32 are not limited to the above, and may be any as long as they can form an internal space together with other portions of the vibrating device 31 and can arrange the image pickup device 30A in the internal space.
　ケース部材３２の内部空間内には、対向し合う第１の回路基板３７ａ及び第２の回路基板３７ｂが配置されている。第１の回路基板３７ａ及び第２の回路基板３７ｂは接続配線３７ｃにより接続されている。第１の回路基板３７ａは、撮像素子３０Ａに接続されている。第１の回路基板３７ａまたは第２の回路基板３７ｂは、撮像素子３０Ａを駆動する回路を含む。第１の回路基板３７ａまたは第２の回路基板３７ｂは、圧電素子３を共振状態において駆動する制御回路７を含んでいてもよい。 The first circuit board 37a and the second circuit board 37b facing each other are arranged in the internal space of the case member 32. The first circuit board 37a and the second circuit board 37b are connected by a connection wiring 37c. The first circuit board 37a is connected to the image sensor 30A. The first circuit board 37a or the second circuit board 37b includes a circuit that drives the imaging element 30A. The first circuit board 37a or the second circuit board 37b may include a control circuit 7 that drives the piezoelectric element 3 in a resonance state.
　外部接続部材３６から、ケース部材３２の内部空間内に配線３８が延びている。配線３８は、第３のケース部３５及び第２の回路基板３７ｂを貫通している。なお、配線３８は、第２の回路基板３７ｂに電気的に接続されている。これにより、撮像素子３０Ａ、第１の回路基板３７ａ及び第２の回路基板３７ｂは外部に電気的に接続される。 The wiring 38 extends from the external connection member 36 into the internal space of the case member 32. The wiring 38 penetrates through the third case portion 35 and the second circuit board 37b. The wiring 38 is electrically connected to the second circuit board 37b. As a result, the image pickup device 30A, the first circuit board 37a, and the second circuit board 37b are electrically connected to the outside.
　撮像素子３０Ａとしては、例えば、可視領域から遠赤外領域のいずれかの波長の光を受光する、ＣＭＯＳ、ＣＣＤ、ボロメーターやサーモパイルなどを挙げることができる。イメージングデバイス３０としては、例えば、カメラ、ＲａｄａｒやＬＩＤＡＲデバイスなどを挙げることができる。 The image pickup device 30A can be, for example, a CMOS, a CCD, a bolometer, a thermopile, or the like that receives light of any wavelength in the visible region to the far infrared region. Examples of the imaging device 30 include a camera, a Radar device, a LIDAR device, and the like.
　なお、振動装置３１の内部空間内には、撮像素子３０Ａ以外の、エネルギー線を光学的に検出する光学検出素子が配置されていてもよい。検出するエネルギー線としては、例えば、電磁波や赤外線などの活性エネルギー線であってもよい。光学検出素子の検出領域は、透光体カバー２に含まれる。図２４及び図２５に示すイメージングデバイス３０においては、検出領域としての、撮像素子３０Ａの視野が透光体カバー２に含まれる。 Note that an optical detection element that optically detects energy rays other than the image pickup element 30A may be arranged in the internal space of the vibration device 31. The energy rays to be detected may be active energy rays such as electromagnetic waves and infrared rays. The detection region of the optical detection element is included in the translucent body cover 2. In the imaging device 30 shown in FIGS. 24 and 25, the light-transmitting body cover 2 includes the field of view of the image sensor 30A as a detection region.
　本実施形態の振動装置３１は、第２の実施形態と同様の振動部及び保持部材１８を有する。さらに、図１７に示した場合と同様に、保持部材１８の底部１８ｃがケース部材３２の固定部３４ａに固定されており、振動のダンピングが生じ難い。イメージングデバイス３０は、この振動装置３１を有するため、水滴などが付着する透光体カバー２を効率的に振動させることができる。 The vibration device 31 of the present embodiment has the same vibrating section and holding member 18 as in the second embodiment. Further, as in the case shown in FIG. 17, the bottom portion 18c of the holding member 18 is fixed to the fixing portion 34a of the case member 32, and vibration damping is unlikely to occur. Since the imaging device 30 includes the vibrating device 31, it is possible to efficiently vibrate the translucent body cover 2 to which water droplets and the like adhere.
１…振動装置
２…透光体カバー
２ｂ…底面
２ｃ…フランジ部
２ｄ…第１の面
３…圧電素子
４…圧電体
５ａ，５ｂ…第１，第２の電極
６…質量付加部材
６ａ，６ｂ…第１，第２の開口端面
６ｃ…外側面
６ｄ…内側面
７…制御回路
１１…振動装置
１８…保持部材
１８ａ…接続部
１８ｂ…バネ部
１８ｃ…底部
２８Ａ～２８Ｇ…保持部材
２８ａ…接続部
２８ｂ…バネ部
２８ｃ…底部
２８ｄ，２８ｅ…第１，第２の接続面
３０…イメージングデバイス
３０Ａ…撮像素子
３１…振動装置
３２…ケース部材
３３…第１のケース部
３３ａ…天板部
３３ｃ…開口部
３４…第２のケース部
３４ａ…固定部
３５…第３のケース部
３６…外部接続部材
３７ａ，３７ｂ…第１，第２の回路基板
３７ｃ…接続配線
３８…配線 DESCRIPTION OF SYMBOLS 1... Vibration device 2... Translucent body cover 2b... Bottom surface 2c... Flange part 2d... 1st surface 3... Piezoelectric element 4... Piezoelectric bodies 5a, 5b... 1st, 2nd electrode 6... Mass addition members 6a, 6b ...First and second opening end surfaces 6c...outer surface 6d...inner surface 7...control circuit 11...vibration device 18...holding member 18a...connecting portion 18b...spring portion 18c...bottom portions 28A to 28G...holding member 28a...connecting portion 28b... Spring part 28c... Bottom parts 28d, 28e... First and second connection surfaces 30... Imaging device 30A... Imaging element 31... Vibration device 32... Case member 33... First case part 33a... Top plate part 33c... Opening Part 34... Second case part 34a... Fixing part 35... Third case part 36... External connection members 37a, 37b... First and second circuit boards 37c... Connection wiring 38... Wiring

Claims (16)

  1. 　透光体カバーと、
    　前記透光体カバーに直接的または間接的に連結されており、前記透光体カバーと共に内部空間を構成するように設けられている質量付加部材と、
    　前記透光体カバーを振動させる圧電素子と、
    を備える、振動装置。     A translucent cover,
    A mass addition member that is directly or indirectly connected to the translucent body cover and that is provided so as to form an internal space together with the translucent body cover;
    A piezoelectric element for vibrating the light-transmitting body cover;
    A vibrating device.
  2. 　前記質量付加部材が筒状の形状を有し、
    　平面視における、前記透光体カバーの外周縁に沿う方向の全体にわたり、前記透光体カバーに直接的または間接的に前記質量付加部材が連結されている、請求項１に記載の振動装置。     The mass addition member has a cylindrical shape,
    The vibrating device according to claim 1, wherein the mass addition member is directly or indirectly coupled to the translucent body cover over the entire direction along the outer peripheral edge of the translucent body cover in a plan view.
  3. 　前記透光体カバーが底面を有し、前記透光体カバーの前記底面側に前記圧電素子及び前記質量付加部材が配置されており、
    　前記透光体カバーの質量をＭ１とし、前記質量付加部材及び前記圧電素子の質量の合計をＭ２としたときに、質量比Ｍ２／Ｍ１が０．９以上、１．９以下である、請求項１または２に記載の振動装置。     The translucent body cover has a bottom surface, the piezoelectric element and the mass addition member is disposed on the bottom surface side of the translucent body cover,
    The mass ratio M2/M1 is 0.9 or more and 1.9 or less, where M1 is the mass of the translucent body cover and M2 is the total mass of the mass adding member and the piezoelectric element. The vibrating device according to 1 or 2.
  4. 　前記透光体カバーの形状がドーム状である、請求項１～３のいずれか１項に記載の振動装置。 The vibrating device according to any one of claims 1 to 3, wherein the translucent body cover has a dome shape.
  5. 　前記透光体カバーがフランジ部を有する、請求項１～４のいずれか１項に記載の振動装置。 The vibration device according to any one of claims 1 to 4, wherein the translucent body cover has a flange portion.
  6. 　前記圧電素子が前記透光体カバーと前記質量付加部材との間に設けられている、請求項１～５のいずれか１項に記載の振動装置。 The vibration device according to any one of claims 1 to 5, wherein the piezoelectric element is provided between the translucent body cover and the mass addition member.
  7. 　前記透光体カバー、前記圧電素子及び前記質量付加部材を含む振動部を保持している保持部材をさらに備え、
    　前記保持部材が、前記振動部に接続されている接続部と、底部と、前記接続部及び前記底部の間に位置しているバネ部と、を有する、請求項１～６のいずれか１項に記載の振動装置。     Further comprising a holding member holding a vibrating portion including the light-transmitting body cover, the piezoelectric element, and the mass addition member,
    7. The holding member includes a connecting portion connected to the vibrating portion, a bottom portion, and a spring portion located between the connecting portion and the bottom portion. The vibration device according to.
  8. 　前記保持部材において、前記バネ部が前記底部よりも変形し易い、請求項７に記載の振動装置。 The vibration device according to claim 7, wherein in the holding member, the spring portion is more easily deformed than the bottom portion.
  9. 　前記保持部材が、前記振動部の振動の節以外の部分に接続されている、請求項７または８に記載の振動装置。 The vibrating device according to claim 7 or 8, wherein the holding member is connected to a portion other than a vibration node of the vibrating portion.
  10. 　前記保持部材に外力が加えられたときの、前記バネ部の弾性エネルギーをＥ１とし、前記底部の弾性エネルギーをＥ２としたときに、弾性エネルギー比Ｅ１／Ｅ２が２以上である、請求項８または９に記載の振動装置。 The elastic energy ratio E1/E2 is 2 or more, where E1 is the elastic energy of the spring portion and E2 is the elastic energy of the bottom portion when an external force is applied to the holding member. 9. The vibration device according to item 9.
  11. 　前記保持部材のそれぞれの部分が延びる方向に直交する方向に沿う厚みを前記保持部材のそれぞれの部分の肉厚としたときに、前記保持部材において、前記底部の肉厚が前記バネ部の肉厚よりも厚い、請求項８～１０のいずれか１項に記載の振動装置。 When the thickness along the direction orthogonal to the direction in which each of the holding members extends is the wall thickness of each of the holding members, in the holding member, the thickness of the bottom portion is the thickness of the spring portion. The vibrating device according to any one of claims 8 to 10, which is thicker than the vibrating device.
  12. 　前記透光体カバー、前記圧電素子及び前記質量付加部材を含む振動部を、直接的にまたは間接的に保持しているケース部材をさらに備える、請求項１～１１のいずれか１項に記載の振動装置。 12. The case member according to claim 1, further comprising a case member that directly or indirectly holds a vibrating portion including the light-transmitting body cover, the piezoelectric element, and the mass addition member. Vibration device.
  13. 　前記振動部を、前記保持部材を介して間接的に保持しているケース部材をさらに備える、請求項７～１１のいずれか１項に記載の振動装置。 The vibrating device according to any one of claims 7 to 11, further comprising a case member that indirectly holds the vibrating portion via the holding member.
  14. 　前記圧電素子を共振状態において駆動する制御回路が、前記圧電素子に電気的に接続されている、請求項１～１３のいずれか１項に記載の振動装置。 The vibration device according to any one of claims 1 to 13, wherein a control circuit that drives the piezoelectric element in a resonance state is electrically connected to the piezoelectric element.
  15. 　請求項１～１４のいずれか１項に記載の振動装置と、
    　前記透光体カバーに検出領域が含まれるように配置されている光学検出素子と、
    を備える、光学検出装置。     A vibration device according to any one of claims 1 to 14,
    An optical detection element arranged so that the translucent body cover includes a detection region,
    An optical detection device comprising:
  16. 　前記光学検出素子が撮像素子であり、前記検出領域が視野である、請求項１５に記載の光学検出装置。 The optical detection device according to claim 15, wherein the optical detection element is an imaging element, and the detection region is a visual field.
PCT/JP2019/045250 2018-12-28 2019-11-19 Vibration device and optical detection device WO2020137262A1 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012140967A1 (en) * 2011-04-11 2012-10-18 株式会社村田製作所 Actuator-support structure and pump device
WO2017110563A1 (en) * 2015-12-24 2017-06-29 株式会社村田製作所 Vibration device, method for driving same, and camera
WO2017149933A1 (en) * 2016-03-03 2017-09-08 株式会社村田製作所 Vibrating device, method for driving same, and camera

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012140967A1 (en) * 2011-04-11 2012-10-18 株式会社村田製作所 Actuator-support structure and pump device
WO2017110563A1 (en) * 2015-12-24 2017-06-29 株式会社村田製作所 Vibration device, method for driving same, and camera
WO2017149933A1 (en) * 2016-03-03 2017-09-08 株式会社村田製作所 Vibrating device, method for driving same, and camera

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