WO2020135118A1 - 一种元素、缺陷与残余应力同时检测的方法及装置 - Google Patents

一种元素、缺陷与残余应力同时检测的方法及装置 Download PDF

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WO2020135118A1
WO2020135118A1 PCT/CN2019/125482 CN2019125482W WO2020135118A1 WO 2020135118 A1 WO2020135118 A1 WO 2020135118A1 CN 2019125482 W CN2019125482 W CN 2019125482W WO 2020135118 A1 WO2020135118 A1 WO 2020135118A1
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ultrasonic
sample
spectrometer
residual stress
detection
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PCT/CN2019/125482
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English (en)
French (fr)
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郭连波
马浴阳
罗为
胡桢麟
熊伟
盛子千
万青
曾晓雁
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华中科技大学
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Priority to US17/289,241 priority Critical patent/US20210396652A1/en
Publication of WO2020135118A1 publication Critical patent/WO2020135118A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/71—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light thermally excited
    • G01N21/718—Laser microanalysis, i.e. with formation of sample plasma
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D21/00—Measuring or testing not otherwise provided for
    • G01D21/02—Measuring two or more variables by means not covered by a single other subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/1702—Systems in which incident light is modified in accordance with the properties of the material investigated with opto-acoustic detection, e.g. for gases or analysing solids
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/07—Analysing solids by measuring propagation velocity or propagation time of acoustic waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G01N29/2418—Probes using optoacoustic interaction with the material, e.g. laser radiation, photoacoustics
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
    • G01N29/4409—Processing the detected response signal, e.g. electronic circuits specially adapted therefor by comparison
    • G01N29/4436—Processing the detected response signal, e.g. electronic circuits specially adapted therefor by comparison with a reference signal
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
    • G01N29/4472—Mathematical theories or simulation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/1702—Systems in which incident light is modified in accordance with the properties of the material investigated with opto-acoustic detection, e.g. for gases or analysing solids
    • G01N2021/1706—Systems in which incident light is modified in accordance with the properties of the material investigated with opto-acoustic detection, e.g. for gases or analysing solids in solids
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/028—Material parameters
    • G01N2291/0289—Internal structure, e.g. defects, grain size, texture
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/04—Wave modes and trajectories
    • G01N2291/042—Wave modes
    • G01N2291/0423—Surface waves, e.g. Rayleigh waves, Love waves

Definitions

  • the invention belongs to the field of laser material detection, in particular to a multifunctional laser photoacoustic detection and signal analysis method and device using element composition, defects and residual stress distribution excited by pulse laser, mainly by pulse laser to generate light after material excitation , Acoustic signal detection and analysis to achieve simultaneous detection of target elements, defects and residual stress.
  • the LIBS technology is a new type of atomic emission spectrometry. Its basic principle is to focus on the surface of the sample by pulse laser ablation to generate plasma, and collect the radiation spectrum of the plasma to perform element qualitative and quantitative analysis on the sample to obtain Its element type and content information. Because LIBS technology has the characteristics of multi-element simultaneous real-time analysis, simple or no sample pretreatment, fast and micro-destructive testing, it has a wide range of application prospects in metallurgy, aerospace, defense industry, nuclear industry and other fields.
  • RT radiographic testing
  • MT magnetic particle testing
  • ET eddy current testing
  • PT liquid penetration testing
  • UT ultrasonic testing
  • RT, MT, ET, and PT technologies have relatively high requirements on the detection environment, and the samples to be tested need to be pretreated, and there are limitations in their use.
  • ultrasonic testing can break through the limitations of the above methods, it is currently the most advantageous testing technology in the industrial field.
  • Laser ultrasonic testing technology is a kind of ultrasonic testing technology, which has the advantages of non-destructive, non-contact, high precision and so on.
  • Lossy methods mainly include slicing method, contour method, blind hole method and strip cutting method, etc.
  • Non-destructive methods mainly include magnetic method, X-ray method, neutron diffraction method and ultrasonic method.
  • the ultrasonic method has the characteristics of high resolution, high penetration ability and harmless to human body, and is one of the most potential technologies in the development direction of residual stress detection.
  • element detection can use XRF technology
  • defect detection can use ultrasonic method
  • residual stress detection can use blind hole method
  • the detection methods currently used can only perform a single index test on one aspect of the material, therefore, to perform a comprehensive and systematic test on metal samples, it is necessary to use multiple equipment for multiple tests, which takes a long time, High cost and complicated operation.
  • different testing methods require different sample preparation methods, which may not only cause serious damage to the sample, but also make it difficult to obtain multiple information about the sample in situ.
  • the limitations of the detection technology have seriously hindered the promotion and application of materials.
  • the present invention provides a method for simultaneously detecting the elements, defects and residual stress of the material, which overcomes the fact that the prior art cannot obtain the elements by measuring at the same time or at the same time. Defects and defects of residual stress.
  • a method for simultaneously detecting elements, defects, and residual stress includes the following steps:
  • S1 The surface of the target material is ablated by high-energy pulse laser to form a plasma, the plasma expands, a back stamping is generated on the surface of the target to excite the ultrasonic wave, and the plasma spectrum is released at the same time.
  • S2 Collect ultrasonic signals and spectral signals. Specifically, collect ultrasonic signals in a wide frequency range through an ultrasonic detector, collect plasma emission spectra through a collection probe, and transmit them to the spectrometer and ICCD through optical fibers.
  • Aiming at the optical radiation signal of the plasma it is split with a high-resolution spectrometer, and then the photoelectric conversion and analysis of the split signal are performed by a highly sensitive ICCD to obtain an atom-induced breakdown spectrum, and the wavelength information of the spectrum characterizes the element type of the substance .
  • the principle is that the surface of the target material is ablated by a high-energy pulse laser.
  • the material at the ablation vaporizes.
  • the atoms and molecules in the vaporized substance absorb energy to release ions.
  • the ions continue to absorb energy to form atoms, molecules, ions and free electrons.
  • the plasma plume absorbs the laser energy and expands outward, creating a shock wave.
  • the shock wave rapidly expands and propagates to the surface of the sample, exciting the phonon vibration in the sample, generating high-frequency ultrasonic waves.
  • the particles in the plasma absorb the laser energy to produce an electronic transition, and radiate photons at a specific wavelength that reflect the information of the substance.
  • the ultrasound signal is collected in a wide frequency domain by a high-sensitivity ultrasonic detector in a wide frequency domain.
  • wavelet analysis is used to denoise the signal and correct the waveform distortion, improve the signal-to-noise ratio, and then extract the amplitude of the ultrasonic signal head wave to determine whether there is a defect at the detection location.
  • the ultrasonic signal head wave and primary echo waveform By identifying the ultrasonic signal head wave and primary echo waveform, calculating the time of flight of the ultrasonic wave, and then measuring the thickness of the sample, the size of the sound velocity can be calculated, based on the theory of acoustic elasticity:
  • the stress of matter Size and rate of change of sound velocity Correlation by comparing the stress sound velocity (V lz ) and the unstressed sound velocity (V lo ) at the measurement location, the rate of change of sound velocity can be obtained, and the acoustic elasticity coefficient (K) can be measured by stretching the sample, so by measuring the sound velocity can be obtained Material stress.
  • a high-resolution spectrometer is used to split it, and then the photoelectric conversion and imaging of the split signal are performed by high-sensitivity ICCD to obtain a laser-induced breakdown plasma spectrogram.
  • denoise the spectrogram through algorithms such as wavelet, and secondly, calibrate the spectral line shift and self-absorption of the spectral line caused by self-absorption to obtain the accurate wavelength information of the spectrum, so as to analyze the element type of the substance; Combine to get the accurate spectral intensity, and finally establish the model by calibration curve to correspond to the content of the element at the excitation.
  • the surface of the sample is scanned, and the element content of each detection point, the amplitude of the ultrasonic signal and the residual stress are formed into an array, respectively, to obtain the element distribution map, ultrasonic flaw detection map and residual stress map at the scan point.
  • a laser photoacoustic composite inspection system for simultaneously measuring elements, defects and residual stress, which includes an excitation unit, a spectrum detection unit, an ultrasonic detection unit and an analysis control unit.
  • the analysis control unit includes a digital delay, a computer and a sample stage.
  • the digital delay is connected to the computer to be controlled by the computer.
  • the sample stage includes a high-precision 3D displacement platform and a sample fixture. The sample fixture is used to place the sample to be measured and fixed On the high-precision 3D displacement platform, the high-precision 3D displacement platform can move in the X, Y, and Z directions, so as to adjust the position of the sample to be analyzed in the three-dimensional direction.
  • the high-precision 3D displacement platform is electrically connected to the digital delay .
  • the computer is integrated with an element analysis module, a defect analysis module and a stress analysis module.
  • the element analysis module is used to collect and process the spectral signal to obtain the spectral intensity of the target element. According to the relationship between the element content and the spectral intensity, the element content is obtained
  • the information is also used to compose the image of the element information of the collection point according to the spatial position to obtain the element distribution map.
  • the defect analysis module is used to collect and process the ultrasonic signal, filter and optimize the signal, and obtain the ultrasonic amplitude at the collection point
  • the value is also used to compose an image of the signal amplitude of the acquisition point according to the spatial position to obtain a defect distribution map.
  • the stress analysis module is used to collect and process the ultrasound signal, filter and optimize the signal, and extract the flight time of the ultrasound.
  • the ultrasonic sound velocity is obtained according to the flight time
  • the residual stress is obtained according to the ultrasonic sound velocity. It is also used to compose an image of the residual stress at the acquisition point according to the spatial position to obtain a residual stress distribution map.
  • the excitation unit includes a pulse laser and a series of optical path systems.
  • the pulse laser is used to emit a pulsed laser.
  • the pulse laser is used to excite the sample to generate plasma and ultrasonic waves at the same time.
  • the optical path system includes several mirrors and focusing mirrors and other optical devices for After the pulsed laser is shaped and filtered, it is incident on the sample to be measured, and the plasma light is incident on the spectrum acquisition probe.
  • the ultrasonic detection unit is used to detect ultrasonic waves to obtain information about defects and residual stress in the sample to be tested.
  • the spectrum detection unit is used to detect the spectrum emitted by the plasma flame to obtain information about the elements in the sample to be measured.
  • the excitation unit, spectrum detection unit, ultrasonic detection unit and analysis control unit jointly realize the function of scanning the element distribution, structural defects and residual stress distribution of the sample.
  • the results obtained from the detection include a multi-dimensional graph of element distribution, material defects and residual stress distribution information.
  • the excitation unit includes a pulsed laser, a total reflection mirror, a half mirror, and a focusing objective lens.
  • the half mirror and the focusing objective are located on the horizontal light path, the transmission surface of the half mirror is at an angle of 45° to the horizontal light path, and the total reflection mirror is installed above the half mirror and at 90° to the half mirror angle.
  • the light exit of the pulse laser and the total reflection mirror are on the same horizontal optical path, forming an angle of 45°.
  • the spectrum detection unit includes a spectrometer detection head, a spectrometer detection head focusing mirror, a spectrometer, and an enhanced charge-coupled device.
  • the detection head of the spectrometer, the focusing lens of the detection head, and the focusing objective lens and the half mirror are on the same horizontal optical path.
  • the spectrometer acquisition probe and the spectrometer are connected through an optical fiber, and the enhanced charge-coupled device is installed on the spectrometer, and the spectrometer is electrically connected with the computer.
  • the ultrasonic detection unit includes an ultrasonic detector and a collection card, the ultrasonic detector is electrically connected to the collection card, and the collection card is connected to the computer and the digital delay device at the same time.
  • the pulse laser and the spectrometer are electrically connected to the digital delay at the same time.
  • the ultrasonic probe includes contact type and non-contact type, and the placement position is selected according to the detection target.
  • the digital delay generator is used to control the pulse laser to emit light at the set time, the spectrometer to perform the collection work at the set time, and also to control the acquisition card to perform the detection work at the set time.
  • the digital delay generator is mainly used for timing control, so that the pulse laser, spectrometer, and acquisition card electrically connected to it can perform work at the set time, optimize the collection efficiency, and do not conflict with each other.
  • the computer controlled high-precision 3D displacement platform can realize the three-dimensional movement of the analyzed sample, and the automatic acquisition movement can be completed by the digital delayer and computer control in the analysis control unit.
  • the excitation unit and the spectrum detection unit share the same optical path.
  • the plasma light excited by the excitation unit is received by the spectrum detection unit and transmitted to the computer for analysis and imaging to obtain the atomic emission spectrum at the laser ablation site.
  • the acquisition time is controlled by a digital delay generator, and the pulse laser and the acquisition card also control its opening sequence and delay through the digital delay generator.
  • the ultrasonic detector adjusts the placement position according to the detection requirements.
  • This laser photoacoustic composite detection system for elements, defects and residual stress uses a single excitation light source to simultaneously excite spectral information and ultrasonic information. Through the collection and processing of spectral detection equipment and ultrasonic detection equipment, the elements of the measured object can be obtained at the same time , Defects and residual stress information. This technology enables the exploration of the corresponding relationship between element composition, structural defects and residual stress distribution, and can be used for qualitative and quantitative composite analysis of element content, structural defects and residual stress of various materials.
  • the second outstanding feature of the present invention is that multi-dimensional detection results can be obtained.
  • the optical signal and ultrasonic signal are obtained by high-precision laser scanning of the sample to be tested. Through signal processing and analysis, the distribution of surface elements, surface/internal defect distribution and surface/internal residual stress of the sample can be obtained.
  • the distribution map can intuitively carry out multi-functional composite characterization of the tested sample to realize the visualization of material detection and analysis.
  • the sample preparation of the present invention is simple or even without sample preparation, without destroying the sample, without pollution to the human body and the environment, can be used in the industrial environment, can be integrated to replace the existing element analysis and ultrasonic detection system, in aerospace, machinery manufacturing, metallurgy Chemical industry and other fields have wide application prospects.
  • FIG. 1 is a schematic diagram of a photoacoustic signal processing method in an embodiment of the present invention.
  • FIG. 2 is a schematic diagram of laser excitation and detection in an embodiment of the present invention.
  • FIG. 3 is a schematic structural diagram of a laser photoacoustic composite detection system of an element, defect and residual stress in an embodiment of the present invention
  • the present invention proposes a photoacoustic composite detection technology using laser as a light source to achieve simultaneous detection of element composition, structural defects and residual stress distribution.
  • the method for simultaneously detecting elements, defects and residual stress provided by the present invention includes the following steps:
  • S2 collecting ultrasonic signals and plasma signals, specifically, collecting ultrasonic signals in a wide frequency range through an ultrasonic detector
  • Aiming at the optical radiation signal of the plasma it is split with a high-resolution spectrometer, and then the photoelectric conversion and analysis of the split signal are performed by a highly sensitive ICCD to obtain an atom-induced breakdown spectrum, and the wavelength information of the spectrum characterizes the element type of the substance .
  • the principle is that the surface of the target material is ablated by a high-energy pulse laser.
  • the material at the ablation vaporizes.
  • the atoms and molecules in the vaporized substance absorb energy to release ions.
  • the ions continue to absorb energy to form atoms, molecules, ions and free electrons.
  • High temperature and high density plasma plume The plasma plume absorbs the laser energy and expands outward, generating a shock wave.
  • the shock wave rapidly expands and propagates to the surface of the sample, exciting the phonon vibration in the sample, generating high-frequency ultrasonic waves.
  • the particles in the plasma absorb the laser energy to produce an electronic transition, and radiate photons at a specific wavelength that reflect the information of the substance.
  • FIG. 1 is a schematic diagram of a photoacoustic signal processing method in an embodiment of the present invention
  • FIG. 2 is a schematic diagram of laser excitation and detection in an embodiment of the present invention.
  • a high-sensitivity ultrasonic detector in a wide frequency domain has a wide frequency range.
  • wavelet analysis is used to denoise the signal and correct the waveform distortion, improve the signal-to-noise ratio, and then extract the amplitude of the ultrasonic signal head wave to determine whether there is a defect at the detection location.
  • the ultrasonic signal head wave and primary echo waveform calculating the time of flight of the ultrasonic wave, and then measuring the thickness of the sample, the size of the sound velocity can be calculated, based on the theory of acoustic elasticity:
  • the stress of matter Size and rate of change of sound velocity Correlation by comparing the stress sound velocity (V lz ) and the unstressed sound velocity (V lo ) at the measurement location, the rate of change of sound velocity can be obtained, and the acoustic elasticity coefficient (K) can be measured by stretching the sample, so by measuring the sound velocity can be obtained Material stress.
  • the high-resolution spectrometer is used to split the optical radiation signal of the plasma, and then the split signal is photoelectrically converted and imaged by a highly sensitive ICCD to obtain a laser-induced breakdown plasma spectrum Figure.
  • denoise the spectrogram through algorithms such as wavelet, and secondly, calibrate the spectral line shift and self-absorption of the spectral line caused by self-absorption to obtain the accurate wavelength information of the spectrum, so as to analyze the element type of the substance; Combine to get the accurate spectral intensity, and finally establish the model by calibration curve to correspond to the content of the element at the excitation.
  • FIG. 3 is a schematic structural diagram of a laser photoacoustic composite detection system for an element, a defect and a residual stress in an embodiment of the present invention.
  • the focusing objective lens 14, the semi-transparent mirror 13, and the spectrometer detection head focusing mirror 12 are in this order Located on the same horizontal optical path, the transmission surface of the transflective mirror 13 forms an angle of 45° with the substrate, and also forms an angle of 45° with the horizontal optical path.
  • the light exit of the pulse laser 6 and the total reflection mirror 10 are located on the reflection optical path of the half mirror 13 in sequence, and the total reflection mirror 10 and the half mirror 13 are perpendicular to each other.
  • the distance between the total reflection mirror 10, the transflective mirror 13, the focusing objective lens 14, and the spectrometer detection head focusing mirror 12 can be adjusted horizontally and vertically by connecting the screw rod and the guide rail.
  • the spectrometer acquisition probe 11 is located on the right side of the spectrometer probe focusing mirror 12 and is connected to the spectrometer 9 through an optical fiber.
  • An enhanced charge coupled device (ICCD) 8 is installed on the spectrometer 9, which is connected to the computer 1 through a cable.
  • the high-precision 3D displacement platform 4 can realize precise movement in the horizontal X and Y directions by driving the screw and the guide rail in the horizontal direction, and can realize precise movement in the vertical Z direction by driving the screw and the guide rail in the vertical direction. It acts at the same time as the vertical motor to form an xyz three-dimensional motion system.
  • the sample 7 to be tested is placed on the sample holder 15, and the sample holder 15 is fixed on the high-precision 3D displacement platform 4.
  • the high-precision 3D displacement platform 4 is connected to the computer 1 through a control cable to precisely control its position by the computer.
  • the ultrasonic detector 3 and the pulsed laser are separated on two sides of the sample or placed on the same side.
  • the ultrasonic detector 3 is connected to the acquisition card 2 through a connecting line, and the acquisition card 2 is connected to the computer 1 through a cable.
  • the digital delay generator 5 is mainly used to control the pulse laser 6 to emit light, the spectrometer 9 to collect, and the acquisition card 2 to collect ultrasonic waveforms.
  • the digital delay generator 5 is connected to the pulse laser 6, the spectrometer 9, the acquisition card 2 and the computer 1 by cables.
  • the main function of the pulse laser 6 is to emit a pulse laser beam to ablate the surface of the sample 7 to be excited to excite plasma and ultrasonic waves, and the function of the half mirror 13 is to reflect the pulsed laser beam and penetrate the plasma excited by the sample 7 to be tested The resulting radiation spectrum.
  • the function of the total reflection mirror 10 is to form an optical path reflection structure with the transflective mirror 13, and the pulse path is totally reflected to adjust the optical path, which is convenient for collecting information.
  • the spectrometer collection probe 11 is located on the right side of the spectrometer collection probe focusing mirror 12 and is focused and collected by adjusting the position in the space and the pulsed laser beam.
  • the spectrometer collection probe 11 adopts coaxial collection, which greatly improves the stability of collecting spectral information.
  • the collected information is transmitted to the spectrometer 9 through fiber coupling.
  • the main function of the enhanced charge-coupled device (ICCD) 8 is to form a spectroscopic system and a detector of the sample together with the spectrometer 9 for collecting the emission line signal generated by the plasma on the surface of the measured object, and to decompose the plasma of the spectrometer 9 Spectral line imaging of various elements obtained by body radiation allows qualitative and quantitative analysis of sample elements.
  • ICCD enhanced charge-coupled device
  • the role of the high-precision 3D displacement platform 4 is to control the motors in the horizontal X and Y directions and the motors in the vertical Z direction by receiving control signals transmitted by the control cables.
  • the motor that adjusts the horizontal Y direction rotates forward and reverse, and controls the platform to move left and right.
  • Coordinate with focusing objective lens 14 to adjust the defocus amount; adjust the vertical Z direction motor forward and reverse, control the platform up and down; adjust the horizontal X direction motor forward and reverse, control the platform forward and backward translation; platform Z direction and X direction are common
  • the movement can realize the surface scanning collection of the sample 7 to be tested.
  • the function of the ultrasonic detector 3 is to detect the ultrasonic signal excited by the sample 7 to be tested, and convert the acoustic wave signal into an electrical signal, which is transmitted to the acquisition card 2 through the cable.
  • the acquisition card 2 transmits the electrical signal to the computer 1 through the cable for real-time imaging and analysis processing.
  • the computer 1 may be a desktop computer or a notebook computer, and is connected to the digital delay generator 5, the spectrometer 9, the high-precision 3D displacement platform 4, and the acquisition card 2 through a USB interface, a cable or a network cable.
  • the software of the computer has the functions of automatic scanning, searching for the peak of the atomic spectrum, qualitative identification, quantitative conversion calculation, and acoustic information processing conversion model.
  • An element analysis module, a defect analysis module, and a stress analysis module are integrated in the computer.
  • the element analysis module is used to collect and process the spectral signal to obtain the spectral intensity of the target element. According to the relationship between the element content and the spectral intensity, the element content information is obtained. It is also used to compose the image of the element information of the collection point according to the spatial position to obtain the element distribution map.
  • the defect analysis module is used to collect and process the ultrasonic signal, filter and optimize the signal to obtain the ultrasonic amplitude at the collection point, It is also used to compose an image of the signal amplitude of the acquisition point according to the spatial position to obtain a defect distribution map.
  • the stress analysis module is used to collect and process the ultrasonic signal, filter and optimize the signal, extract the ultrasonic flight time, and then according to the flight
  • the ultrasonic sound velocity is obtained in time, and the residual stress is obtained according to the ultrasonic sound velocity. It is also used to compose an image of the residual stress at the acquisition point according to the spatial position to obtain a residual stress distribution map.
  • the laser photoacoustic composite detection method of elements, defects and residual stress using the above system is as follows: the laser is used as the excitation source to excite the sample to be tested to generate ultrasound and plasma at the same time, and the sound and light signals are collected to obtain the material at the same time Elements, defects and residual stress information.
  • the laser is used to perform line and surface scan analysis on the sample, and the element, defect and residual stress distribution of the measured object can be obtained at the same time under the premise of micro-destructive or even non-destructive sample.
  • the pulse laser 6 uses an Nd:YAG Q-switched laser, with an emission wavelength of 532 nm, a pulse width of 8 ns, and an adjusted pulse energy of about 50 mJ.
  • the ultrasonic probe 3 uses a water-immersed ultrasonic probe, and the center frequency is 20 MHz.
  • the model of digital delay generator 5 is DG535, and its delay resolution is 5ps.
  • the ultrasonic detector 3 is placed on the back of the sample for measurement, and a coupling agent is used on the detection surface to couple with the back of the welded sample, so that it has detection conditions and a fixed position.
  • the computer 1 After the scanning area of the welding sample is aligned and locked, the computer 1 is used to control the digital delay generator 5 and the high-precision 3D displacement platform 4, the three devices controlled by the digital delay generator 5 and the computer-controlled high-precision 3D
  • the displacement platform starts to work in sequence, in the order of pulse laser 6, spectrometer 9, acquisition card 3, and high-precision 3D displacement platform 4.
  • the pulse laser 6 is started and emits a pulsed laser beam.
  • the pulsed laser beam changes the direction of the optical path downward through the total reflection mirror 10, then changes the direction of the optical path to the left through the semi-transparent mirror 13 and then focuses to the object to be measured through the focusing objective lens 14
  • Sample 7 was ablated on the detection surface.
  • the detected material absorbs energy, evaporates and vaporizes, and a large amount of material is converted into a plasma state.
  • the plasma generates an energy level transition and emits an optical signal.
  • the optical signal passes through the focusing objective lens 14 ⁇ transflective mirror 13 ⁇ spectroscopy collection probe
  • the coaxial collection optical path of the mirror 12 is collected by the spectrometer collection probe 11.
  • the transflective mirror 13 is a totally-reflected pulsed laser, which totally radiates light through the plasma.
  • the spectrometer 9 detects and analyzes the laser-excited atom and ion spectra, transmits the detected spectrum signal to the enhanced charge coupled device (ICCD) 8, receives the timing signal controlled by the digital delay generator 5, and turns on its spectrum acquisition switch The ideal delayed signal acquisition is performed on the spectral signal, and the acquired spectral signal is amplified and converted into an electrical signal and transmitted to the computer 1, and finally the plasma spectral map is obtained.
  • ICCD enhanced charge coupled device
  • ultrasonic waves are generated inside the sample 7 to be tested due to pulsed laser excitation.
  • the ultrasonic waves propagate inside the object and are collected by the ultrasonic detector 3 coupled to the other side of the welding sample to collect the ultrasonic information. It is converted into an electrical signal and transmitted to the corresponding module of the computer 1 through the acquisition card 2 for processing to obtain the defect and residual stress information of the welding sample.
  • the high-precision 3D displacement platform 4 moves to the next acquisition position, and the above steps are repeated until all acquisition points are collected.
  • the spectral information of the collection points is mapped to the coordinates of the scanning surface one by one through the processing module of the computer 1, and the quantitative analysis of the content of the set elements is carried out, and the color distribution is used to form the distribution map of the scanning element content
  • the surface scan defect distribution map and residual stress distribution map are formed, and finally the distribution map containing the detected object elements, defects and residual stress is obtained.
  • the accurate qualitative and accurate quantitative analysis of component plane scanning and structural defects and residual stress distribution based on LIBS and laser ultrasonic technology are completed.
  • the x, y, z three-axis linkage control is used to re-lock the scanning plane to complete the comprehensive scanning analysis of different parts of the sample.
  • the scanning plane and the scanning path of the pulse laser should be defined according to the surface shape of the sample and the testing requirements.
  • the timing coordination of each functional unit should be controlled by the digital delay generator 5 to obtain the best Collection effect.
  • the laser photoacoustic composite detection system for material elements, defects and residual stress proposed by the present invention uses a single pulse laser as an excitation light source to ablate the sample to be tested, and generates plasma and ultrasonic waves by excitation.
  • the spectrometer is used to collect the emission spectrum of the plasma;
  • the ultrasonic detector is used to simultaneously detect the ultrasonic waves generated by the laser excitation; thus to simultaneously detect and analyze the elements, defects and residual stress of the sample,

Abstract

一种元素、缺陷与残余应力的多功能激光光声检测方法及装置，属于激光材料检测领域，其利用脉冲激光器(6)入射到待测样品(7)表面产生等离子体和超声波，能同时检测与分析样品元素组成、结构缺陷和残余应力。该检测装置包括激发单元、光谱探测单元、超声波探测单元以及分析控制单元，数字延时器(5)与计算机(1)相连，高精度3D位移平台(4)与数字延时器(5)相电连接，脉冲激光器(6)发射出的脉冲激光通过光路系统调制聚焦入射至待测样品(7)表面以同时产生等离子体和超声波，超声波探测单元用于对超声波进行探测，光谱探测单元用于对等离子体火焰发射的可见光光谱进行探测。

Description

一种元素、缺陷与残余应力同时检测的方法及装置 [技术领域]
本发明属于激光材料检测领域，具体为一种采用脉冲激光激发的元素组成、缺陷与残余应力分布的多功能激光光声检测及信号分析方法及装置，主要通过脉冲激光对材料激发后产生的光、声信号进行探测与分析，实现对靶材的元素、缺陷与残余应力的同时检测。
[背景技术]
新材料的出现是推动行业发展的重要动力，而材料所制造的构件质量检测则是保证构件安全可靠性及其推广应用的重要保证，因此，材料构件的高精度、快速检测是制造行业的迫切需求。目前，在材料构件检测领域，元素含量、结构缺陷与残余应力分布是材料物理化学性质检测的三个重要方面，而元素、缺陷和应力的检测方法众多。
(1)在元素分析方面，传统的检测手段包括化学法、ICP-OES、XRF、SEM-EDS等。然而，上述方法存在破坏样品、耗时长、环境要求苛刻等缺点，无法满足现代元素含量检测的原位、快速、微损甚至无损等需求，所以一种新的元素检测技术——激光诱导击穿光谱(Laser Induced Breakdown Spectroscopy，简称LIBS)技术应运而生。
LIBS技术是一种新型的原子发射光谱分析技术，其基本原理是通过脉冲激光聚焦到样品表面烧蚀激发产生等离子体，并采集等离子体的辐射光谱来对样品进行元素定性与定量分析，以获得其元素种类与含量信息。由于LIBS技术具有多元素同步实时分析、简单或者无需样品预处理、快速与微损检测等特点，因此在金属冶金、航空航天、国防工业、核工业等领域具有广泛的应用前景。中国专利文献《一种基于激光诱导击穿光谱的在线检测系统》(公告为CN207850927U，公告日为2018年9月11日)公开了一种基于激光诱导击穿光 谱的在线检测系统，该专利申请能够实时、快速、精确地检测出样品中特定元素的含量，获取样品特性，从而及时指导配料生产。
(2)在结构缺陷无损检测方面，主要包括射线照相检测(RT)、磁粉检测(MT)、涡流检测(ET)、液体渗透检测(PT)与超声波检测(UT)等技术。其中RT、MT、ET、PT技术对检测环境要求比较高，需对待测样品进行预处理，并且存在使用的局限性。由于超声波检测可以突破上述方法的限制，是目前工业领域中最具优势的检测技术。激光超声波检测技术是超声波检测技术的一种，具有无损、非接触、精度高等优点。
中国专利文献《一种基于材料内部缺陷检测的激光超声检测系统及其方法》公开了一种基于材料内部缺陷检测的激光超声检测系统及其方法，该专利可通过激光激发超声波确定内部缺陷的位置及选取该时刻的纵波传播图像，实现对材料内部缺陷的可视化检测。
(3)在残余应力检测方面，主要分为有损法和无损法。有损法主要有切片法、轮廓法、盲孔法和切条法等，无损法主要包括磁性法、X射线法、中子衍射法与和超声波法等。其中，超声波法同时具有高分辨率、高渗透能力和对人体无害的特点，是残余应力检测发展方向上最具潜力的技术之一。
中国发明专利文献《一种基于激光超声的工件表面残余应力测量装置及其方法》(公告为CN108168747 A，公告日为2018年6月18日)公开了一种基于激光超声的工件表面残余应力测量装置及其方法，该方法将聚焦成点源的脉冲激光通过振镜扫描在工件表面产生表面波，通过压电传感器对表面波信号接收和计算，从而实现无损快速检测工件表面的残余应力。
综上所述，在检测领域，虽然对于元素、缺陷、残余应力检测方面均有较为成熟的技术手段，例如元素检测可采用XRF技术，缺陷检测可采用超声波法，残余应力检测可采用盲孔法，但是由于目前所采用的检测方法均只能对材料进行一个方面的单一指标检测，因此，若要对金属样品进行全面、系统性检测，则需要采用多种设备进行多次检测，耗时长，成本高，操作复杂。特别需要指出的是，不同检测手段制样要求各异，不仅可能对样品造成严重破坏，而且很 难原位获得样品的多重信息，检测技术的限制，严重阻碍了材料的推广及应用。
[发明内容]
针对现有技术的缺陷或改进需求，本发明提供一种对材料的元素、缺陷与残余应力三者同时进行检测的方法，克服了现有技术中无法同时测量或者一次性测量即可获得元素、缺陷与残余应力的缺陷。
按照本发明的一个方面，提供一种元素、缺陷与残余应力同时检测的方法，其包括如下步骤：
S1：采用高能脉冲激光烧蚀靶材表面，形成等离子体，等离子体膨胀，在靶材表面产生反冲压激发出超声波，同时释放出等离子体光谱，
S2：采集超声波信号和光谱信号，具体的，通过超声探测器，在宽频域范围内采集超声信号，通过采集探头采集等离子体发射光谱，通过光纤传送至光谱仪和ICCD，
S3：分析超声波信号中信号头波的幅值大小，可以判断探测处是否有缺陷，有缺陷处的信号幅值较低，以此作为探伤的依据，
通过计算超声波的传播时间，可以得到声速大小，基于声弹性理论可知：
Figure PCTCN2019125482-appb-000001
物质的应力
Figure PCTCN2019125482-appb-000002
大小与声速变化率
Figure PCTCN2019125482-appb-000003
相关，通过比较测量处的应力声速V lz与无应力声速V lo,可以得到声速变化率，声弹性系数K可以通过拉伸试样测得，通过测量声速以得到材料的应力，
针对等离子体的光辐射信号，采用高分辨光谱仪对其进行分光，再通过高灵敏ICCD对分光后的信号进行光电转换和分析，得到原子诱导击穿光谱图，光谱的波长信息表征物质的元素种类。
其原理在于，采用高能脉冲激光烧蚀靶材表面，烧蚀处的材料汽化，汽化物质中的原子、分子等粒子吸收能量释放离子，离子继续吸收能量，形成包含原子、分子、离子和自由电子的高温高密度的等离子体羽。等离子体羽吸收激 光能量向外膨胀，产生冲击波。冲击波迅速膨胀传播至样品表面，激发样品中的声子振动，产生高频超声波。同时等离子体内的粒子吸收激光能量会产生电子跃迁，并且辐射出特定波长、反映物质信息的光子。
更具体的，通过高灵敏宽频域的超声探测器，在宽频域范围内采集超声信号。获得超声信号后，利用小波分析对信号进行去噪和波形畸变矫正，提高信噪比，再提取超声信号头波的幅值大小，即可以判断探测处是否有缺陷。通过辨识超声信号头波和一次回波波形，计算超声波的飞行时间，再测量样品厚度，即可计算得到声速大小，基于声弹性理论：
Figure PCTCN2019125482-appb-000004
可知，物质的应力
Figure PCTCN2019125482-appb-000005
大小与声速变化率
Figure PCTCN2019125482-appb-000006
相关，通过比较测量处的应力声速(V lz)与无应力声速(V lo),可以得到声速变化率，声弹性系数(K)可以通过拉伸试样测得，因此通过测量声速可以的得到材料的应力。
针对等离子体的光辐射信号，采用高分辨光谱仪对其进行分光，再通过高灵敏ICCD对分光后的信号进行光电转换和成像，得到激光诱导击穿等离子体光谱图。首先通过小波等算法对光谱图进行去噪，其次对谱线的波长偏移和自吸收导致的谱线自蚀进行校准，得到光谱的准确波长信息，从而分析物质的元素种类；通过谱线拟合得到准确的光谱强度，最后通过定标曲线方式建立模型对应激发处元素的含量。
进一步的，对样品进行面扫描，分别将每个检测点的元素含量、超声信号幅值与残余应力组成阵列，即可得到扫描处的元素分布图、超声探伤图和残余应力图。
按照本发明的第二个方面，还提供了一种同时测量元素、缺陷与残余应力的激光光声复合检测系统，其包括激发单元、光谱探测单元、超声波探测单元以及分析控制单元。其中，分析控制单元包括数字延时器、计算机和样品台，数字延时器与计算机相连以受计算机控制，样品台包括高精度3D位移平台和样品夹具，样品夹具用于放置待测样品，固定在高精度3D位移平台上，高精度3D 位移平台能沿X向、Y向以及Z向移动，从而实现对待分析样品在三维方向的位置调节，高精度3D位移平台与数字延时器相电连接。所述计算机中集成有元素分析模块、缺陷分析模块和应力分析模块，所述元素分析模块用于采集并且处理光谱信号，得到目标元素的光谱强度，根据元素含量和光谱强度的关系，得到元素含量信息，还用于对采集点的元素信息按照空间位置组成图像，就得到了元素分布图，所述缺陷分析模块用于采集并且处理超声信号，对信号进行滤波和优化，得到采集处的超声幅值，还用于对采集点的信号幅值按照空间位置组成图像，获得缺陷分布图，所述应力分析模块用于采集并处理超声信号，对信号进行滤波和优化，提取超声波的飞行时间，进而根据飞行时间获得超声声速，并根据超声声速得到残余应力，还用于对采集点的残余应力按照空间位置组成图像，获得残余应力分布图。激发单元包括脉冲激光器和一系列的光路系统，脉冲激光器用于发射出脉冲激光，该脉冲激光用于激发样品同时产生等离子体和超声波，光路系统包括若干反射镜和聚焦镜等光学器件，用于对脉冲激光进行整形滤波后入射至待测样品上，并将等离子体光入射至光谱采集探头。超声波探测单元用于对超声波进行探测，以获得关于待测样品中缺陷与残余应力的信息。光谱探测单元用于对等离子体火焰发射的光谱进行探测，以获得关于待测样品中元素的信息。激发单元、光谱探测单元、超声波探测单元以及分析控制单元共同实现了对样品的元素分布、结构缺陷与残余应力分布扫描的功能。探测得到的结果包含元素分布、物质缺陷与残余应力分布信息的多维图。
进一步的，激发单元包括脉冲激光器、全反射镜、半透半反镜和聚焦物镜。半透半反镜与聚焦物镜位于水平光路上，半透半反镜的透射面与水平光路成45°角，全反射镜安装于半透半反镜上方，与半透半反镜成90°角。脉冲激光器的出光口与全反射镜在同一水平光路上，成45°角。
进一步的，光谱探测单元包括光谱仪探测头、光谱仪探测头聚焦镜、光谱仪以及增强电荷耦合器件。其中，光谱仪探测头、探测头聚焦镜、与聚焦物镜、半透半反镜位于同一水平光路上。光谱仪采集探头与光谱仪通过光纤连接，增强电荷耦合器件安装在光谱仪上，光谱仪与计算机电连接。
进一步的，超声波探测单元包括超声波探测器和采集卡，超声波探测器与采集卡电连接，采集卡同时连接计算机和数字延时器。
进一步的，所述脉冲激光器和所述光谱仪同时与数字延时器电连接。
进一步的，所述超声波探测器包含接触式和非接触式两类，根据检测目标选择放置位置。
进一步的，数字延时发生器用于控制脉冲激光器在设定时间出光、光谱仪在设定时间执行采集工作，还用于控制采集卡在设定时间执行探测工作。数字延时发生器主要用于时序控制，使得与之相电连接受其控制的脉冲激光器、光谱仪、采集卡能在设定的时间执行工作，优化采集效率，相互之间前后不冲突。
本发明中，使用计算机控制高精度3D位移平台可以实现被分析样品的三维移动，通过分析控制单元中的数字延时器和计算机控制，可以完成自动采集运动。
本发明中，激发单元与光谱探测单元共用同一光路。激发单元激发的等离子体光由光谱探测单元接收，并传输至计算机进行分析和成像，得到激光烧蚀处的原子发射光谱图。采集时间由数字延时发生器控制，且脉冲激光器、采集卡也是通过数字延时发生器控制其开启顺序及延时。超声波探测器根据检测要求调整放置位置。这种元素、缺陷与残余应力的激光光声复合检测系统使用单一激发光源，同时激发出光谱信息和超声波信息，通过光谱探测设备和超声波探测设备的采集和处理，能够同时得到被测物体的元素、缺陷与残余应力信息。这种技术实现了对元素组成、结构缺陷与残余应力分布对应关系的探索，可用于各种材料元素含量、结构缺陷与残余应力定性定量的复合分析。
总体而言，通过本发明所构思的以上技术方案与现有技术相比，能够取得下列有益效果：
(1)目前行业内，对制造构件的元素成分、冶金缺陷和应力形变都是单独送检，只能做到单一指标检测，本发明最突出的特点是填补了这一空白，通过一束激光激发样品，采集光信号和声信号综合分析，以同时得到材料元素、缺陷和残余应力的综合检测结果。不仅克服了单一检测耗时、过程复杂和样品需 要不同处理等缺点，也为材料的原位、快速、多参数和多功能同时快速检测提供了一种全新的方法。
(2)本发明的第二个突出特点是可以得到多维度的检测结果。通过对被测样品进行高精度的激光扫描获得其光信号和超声波信号，通过对信号处理和分析，可得到被测样品表面元素分布图、表面/内部的缺陷分布图和表面/内部的残余应力分布图，最终可直观的对被测样品进行多功能复合表征，实现材料检测分析的可视化。
(3)本发明制样简单甚至无需制样，无需破坏样品，对人体和环境无污染，可用于工业环境，可整合替代现有的元素分析和超声波检测系统，在航空航天、机械制造、冶金化工等诸多领域具有广泛的应用前景。
[附图说明]
图1为本发明实施例中光声信号的处理方法示意图。
图2为本发明实施例中激光激发与检测示意图。
图3为本发明实施例中的一种元素、缺陷与残余应力的激光光声复合检测系统的结构示意图；
其中，1.计算机；2.采集卡；3.超声波探测器；4.3D位移平台；5.数字延时发生器；6.脉冲激光器；7.待测样品；8.增强电荷耦合器件(ICCD)；9.光谱仪；10.全反射镜聚焦物镜；11.光谱仪采集探头；12.光谱仪采集探头聚焦镜；13.半透半反镜；14.聚焦物镜；15.样品夹具。
[具体实施方式]
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅用以解释本发明，并不用于限定本发明。此外，下面所描述的本发明各个实施方式中所涉及到的技术特征只要彼此之间未构成冲突就可以相互组合。
本发明提出一种采用激光作为光源的光声复合检测的技术，以实现对元素组成、结构缺陷与残余应力分布的同时检测。
本发明提供的一种元素、缺陷与残余应力同时检测的方法，其包括如下步骤：
S1：采用高能脉冲激光烧蚀靶材表面，形成超声波和等离子体，
S2：采集超声波信号和等离子体信号，具体的，通过超声探测器，在宽频域范围内采集超声信号，
S3：分析超声波信号中信号头波的幅值大小，可以判断探测处是否有缺陷，有缺陷处的信号幅值较低，以此作为探伤的依据，
通过计算超声波的传播时间，可以得到声速大小，基于声弹性理论可知：
Figure PCTCN2019125482-appb-000007
物质的应力
Figure PCTCN2019125482-appb-000008
大小与声速变化率
Figure PCTCN2019125482-appb-000009
相关，通过比较测量处的应力声速V lz与无应力声速V lo,可以得到声速变化率，声弹性系数K可以通过拉伸试样测得，通过测量声速以得到材料的应力，
针对等离子体的光辐射信号，采用高分辨光谱仪对其进行分光，再通过高灵敏ICCD对分光后的信号进行光电转换和分析，得到原子诱导击穿光谱图，光谱的波长信息表征物质的元素种类。
其原理在于，采用高能脉冲激光烧蚀靶材表面，烧蚀处的材料汽化，汽化物质中的原子、分子等粒子吸收能量释放离子，离子继续吸收能量，形成包含原子、分子、离子和自由电子的高温高密度的等离子体羽。等离子体羽吸收激光能量向外膨胀，产生冲击波。冲击波迅速膨胀传播至样品表面，激发样品中的声子振动，产生高频超声波。同时等离子体内的粒子吸收激光能量会产生电子跃迁，并且辐射出特定波长、反映物质信息的光子。
图1为本发明实施例中光声信号的处理方法示意图，图2为本发明实施例中激光激发与检测示意图，由以上两图可知，通过高灵敏宽频域的超声探测器，在宽频域范围内采集超声信号。获得超声信号后，利用小波分析对信号进行去噪和波形畸变矫正，提高信噪比，再提取超声信号头波的幅值大小，即可以判断探测处是否有缺陷。通过辨识超声信号头波和一次回波波形，计算超声波的 飞行时间，再测量样品厚度，即可计算得到声速大小，基于声弹性理论：
Figure PCTCN2019125482-appb-000010
可知，物质的应力
Figure PCTCN2019125482-appb-000011
大小与声速变化率
Figure PCTCN2019125482-appb-000012
相关，通过比较测量处的应力声速(V lz)与无应力声速(V lo),可以得到声速变化率，声弹性系数(K)可以通过拉伸试样测得，因此通过测量声速可以的得到材料的应力。
进一步由图1和图2可知，针对等离子体的光辐射信号，采用高分辨光谱仪对其进行分光，再通过高灵敏ICCD对分光后的信号进行光电转换和成像，得到激光诱导击穿等离子体光谱图。首先通过小波等算法对光谱图进行去噪，其次对谱线的波长偏移和自吸收导致的谱线自蚀进行校准，得到光谱的准确波长信息，从而分析物质的元素种类；通过谱线拟合得到准确的光谱强度，最后通过定标曲线方式建立模型对应激发处元素的含量。
图3为本发明实施例中的一种元素、缺陷与残余应力的激光光声复合检测系统的结构示意图，由图可知，聚焦物镜14、半透半反镜13、光谱仪探测头聚焦镜12依次位于同一水平光路上，半透半反镜13的透射面与基板的夹角成45°，同时也与水平光路成45°角。脉冲激光器6的出光口、全反射镜10依次位于半透半反镜13的反射光路上，全反射镜10与半透半反镜13互相垂直。全反射镜10、半透半反镜13、聚焦物镜14、光谱仪探测头聚焦镜12相互之间的距离可以通过连接丝杆与导轨实现水平和竖直调节。
光谱仪采集探头11位于光谱仪探测头聚焦镜12的右侧，通过光纤与光谱仪9连接。增强电荷耦合器件(ICCD)8安装在光谱仪9上，光谱仪9通过线缆与计算机1连接。高精度3D位移平台4通过水平方向的电机驱动丝杆与导轨可以实现水平X、Y方向的精密移动，通过竖直方向的电机驱动丝杆与导轨可以实现竖直Z方向的精密移动，水平电机与竖直电机同时作用，构成x-y-z三维运动系统。待测样品7放置在样品夹具15上，样品夹具15固定在高精度3D位移平台4上。高精度3D位移平台4通过控制线缆连接到计算机1上，以受计算机精密控制其位置。
超声波探测器3与脉冲激光分居样品的两侧或放置于同侧，超声波探测器3通过连接线连接到采集卡2上，采集卡2通过线缆连接计算机1。
数字延时发生器5主要用于控制脉冲激光器6出光、光谱仪9采集以及采集卡2采集超声波波形。数字延时发生器5与脉冲激光器6、光谱仪9、采集卡2和计算机1中间皆有线缆连接。
脉冲激光器6的主要作用是发射脉冲激光束烧蚀待测样品7表面以激发出等离子体和超声波，半透半反镜13的作用是反射脉冲激光束、透过待测样品7激发的等离子体产生的辐射光谱。全反射镜10的作用是与半透半反镜13组成光路反射结构，将脉冲激光束进行全反射来调整光路，方便采集信息。
光谱仪采集探头11位于光谱仪采集探头聚焦镜12的正右侧，通过调整空间中的位置与脉冲激光束聚焦采集。光谱仪采集探头11采用同轴采集，大大提高了采集光谱信息的稳定性。采集到的信息通过光纤耦合传输到光谱仪9。
所述增强电荷耦合器件(ICCD)8的主要作用为：和光谱仪9一起构成样品的分光系统和检测器，用于收集被测物体表面等离子体产生的发射谱线信号，并将光谱仪9分解等离子体辐射光得到的各种元素的光谱线成像，从而对样品元素进行定性和定量分析。
高精度3D位移平台4的作用是通过接收控制线缆传递的控制信号，控制水平X、Y方向的电机与竖直Z方向的电机协同运作。具体而言，调节水平Y方向的电机正转反转，控制平台左右移动。配合聚焦物镜14调节离焦量；调节竖直Z方向的电机正转、反转，控制平台升降；调节水平X方向的电机正转、反转，控制平台前后平移；平台Z方向和X方向共同运动可以实现待测样品7的面扫描采集。
超声波探测器3的作用是探测待测样品7激发的超声波信号，并将声波信号转化为电信号，通过线缆传递到采集卡2。采集卡2将电信号通过线缆传递到计算机1进行实时成像与分析处理。
计算机1可以采用台式计算机或者笔记本电脑，通过USB接口、线缆或者网线与数字延时发生器5、光谱仪9、高精度3D位移平台4、采集卡2进行连接。 计算机的软件具有自动扫描、寻找原子光谱峰值、定性识别、定量转化计算和声波信息处理转化模型等功能。
计算机中集成有元素分析模块、缺陷分析模块和应力分析模块，所述元素分析模块用于采集并且处理光谱信号，得到目标元素的光谱强度，根据元素含量和光谱强度的关系，得到元素含量信息，还用于对采集点的元素信息按照空间位置组成图像，就得到了元素分布图，所述缺陷分析模块用于采集并且处理超声信号，对信号进行滤波和优化，得到采集处的超声幅值，还用于对采集点的信号幅值按照空间位置组成图像，获得缺陷分布图，所述应力分析模块用于采集并处理超声信号，对信号进行滤波和优化，提取超声波的飞行时间，进而根据飞行时间获得超声声速，并根据超声声速得到残余应力，还用于对采集点的残余应力按照空间位置组成图像，获得残余应力分布图。
应用以上系统进行元素、缺陷与残余应力的激光光声复合检测方法如下：采用激光作为激发源来激发待测样品，以同时产生超声波和等离子体，通过采集声、光信号，从而同时获得材料的元素、缺陷与残余应力信息。在实际使用时，通过激光对样品进行线、面扫描分析，可在微损甚至无损样品的前提下，同时获得被测物体的元素、缺陷与残余应力分布。
下面结合具体实施例对本发明装置进行进一步详细的说明。
实施例1：
现以检测电弧增材制造样品为例来说明本发明所述激光光声复合检测系统的使用流程，具体操作步骤如下：
(1)脉冲激光器6采用Nd:YAG调Q激光器，其发射波长为532nm，脉冲宽度为8ns，调节脉冲能量约为50mJ。超声波探测器3使用水浸式超声波探头，中心频率为20MHz。数字延时发生器5型号为DG535，其延迟分辨率为5ps。
(2)将焊接样品置于样品夹具15上。扫描面正对激光出光口，调整3D位移平台4在Y轴方向的位置和聚焦物镜14的位置，使脉冲激光束聚焦在焦点位置；调整高精度3D位移平台4在X-Z轴上的位置到待扫描区的初始点。
适当调整光谱仪采集探头11与光谱仪采集探头聚焦镜12的距离，使其具有最佳的采集条件。超声波探测器3放置于样品背测，在探测面使用耦合剂，与焊接样品的背面耦合，使其具备探测条件，并且固定位置。
当焊接样品的扫描区域对准并锁定后，使用计算机1控制数字延时发生器5与高精度3D位移平台4，受数字延时发生器5控制的3个设备与受计算机控制的高精度3D位移平台依次启动工作，工作顺序为脉冲激光器6、光谱仪9、采集卡3、高精度3D位移平台4。
(3)脉冲激光器6启动，发出脉冲激光束，脉冲激光束经全反射镜10改变光路方向向下，然后经半透半反镜13改变光路方向向左后，经聚焦物镜14聚焦到待测样品7探测面上进行烧蚀。
在聚焦烧蚀处被探测物质吸收能量蒸发汽化，大量的物质转化为等离子体状态，等离子体发生能级跃迁发出光信号，光信号经过聚焦物镜14→半透半反镜13→光谱仪采集探头聚焦镜12的同轴采集光路被光谱仪采集探头11采集到。其中，半透半反镜13为全反射脉冲激光，全透过等离子体辐射光。
光谱仪9对激光激发的原子和离子光谱进行探测、分析，将所检测出的光谱信号传输至增强电荷耦合器件(ICCD)8，接收数字延时发生器5控制的时序信号，开启其光谱采集开关对光谱信号进行理想的延时信号采集，并把采集到的光谱信号进行放大处理并转化为电信号传输到计算机1，最后处理得到等离子体的光谱图。
激光烧蚀产生等离子体的同时，在待测样品7的内部也由于脉冲激光激发产生了超声波，超声波在物体内部传播，被耦合在焊接样品另一侧的超声波探测器3采集到，将超声波信息转化为电信号，通过采集卡2传输到计算机1的对应模块处理，得到焊接样品的缺陷与残余应力信息。
(4)对一个采集点完成采集后，高精度3D位移平台4运动到下一个采集位置，重复上述步骤，直到所有采集点全部采集完毕。
所有采集点采集完毕后，通过计算机1的处理模块，将采集点的光谱信息一一对应到扫描面的坐标，对设定元素的含量进行定量分析，通过颜色区别， 形成面扫描元素含量分布图；同时结合探测到的超声波幅度与速度信息，形成面扫描缺陷分布图与残余应力分布图，最终得到包含被检测物体元素、缺陷与残余应力的分布图。
通过上述步骤，就完成了基于LIBS和激光超声波技术的成分面扫描和结构缺陷、残余应力分布的准确定性与精确定量分析。当需要对样品其他位置进行探测时，通过x、y、z三轴联动控制，重新锁定扫描平面，完成对样品不同部位的综合扫描分析。
对样品进行检测时，首先应该根据试样的表面形貌和检测要求划定扫描平面和编制脉冲激光的扫描路径，应该通过数字延时发生器5控制各个功能单元的时序协调，获得最佳的采集效果。
本发明提出的一种针对材料元素、缺陷与残余应力的激光光声复合检测系统，通过采用单一脉冲激光作为激发光源来烧蚀被测样品，激发产生等离子体与超声波。一方面，采用光谱仪对等离子体的发射光谱进行采集；另一方面，同步采用超声波探测器对伴随激光激发产生的超声波进行探测；从而实现对样品的元素、缺陷与残余应力同时进行检测与分析，
本领域的技术人员容易理解，以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。

Claims (7)

  1. 一种同时测量元素、缺陷与残余应力的方法，其特征在于，其包括如下步骤：
    S1：采用高能脉冲激光烧蚀靶材表面，形成超声波和等离子体，
    S2：采集超声波信号和等离子体信号，具体的，通过超声探测器，在宽频域范围内采集超声信号，
    S3：分析超声波信号中信号头波的幅值大小，能判断探测处是否有缺陷，有缺陷处的信号幅值较低，以此作为探伤的依据，
    通过计算超声波的传播时间，可以得到声速大小，基于声弹性理论有：
    Figure PCTCN2019125482-appb-100001
    物质的应力
    Figure PCTCN2019125482-appb-100002
    大小与声速变化率
    Figure PCTCN2019125482-appb-100003
    相关，通过比较测量处的应力声速V lz与无应力声速V lo,可以得到声速变化率，声弹性系数K通过拉伸试样测得，通过测量声速以得到材料的应力，
    针对等离子体的光辐射信号，采用光谱仪对其进行分光，再通过ICCD对分光后的信号进行光电转换和分析，得到原子诱导击穿光谱图，光谱的波长信息表征物质的元素种类。
  2. 如权利要求1所述的一种同时测量元素、缺陷与残余应力的方法，其特征在于，还包括步骤S4：对样品进行面扫描，分别将每个检测点的元素含量、超声信号幅值与残余应力组成阵列，得到扫描处的元素分布图、超声探伤图和残余应力图。
  3. 一种实现如权利要求1-2之一所述方法的装置，其特征在于，其包括激发单元、光谱探测单元、超声波探测单元以及分析控制单元，其中，
    分析控制单元包括数字延时器、计算机和样品台，数字延时器与计算机相连以受计算机控制，样品台包括高精度3D位移平台和样品夹具，样品夹具用于放置待测样品，样品夹具固定在高精度3D位移平台上，高精度3D位移平台能沿X向、Y向以及Z向移动，从而实现对待分析样品在三维方向的位置调节，高精度3D位移平台与数字延时器相电连接，
    所述计算机中集成有元素分析模块、缺陷分析模块和应力分析模块，
    所述元素分析模块用于采集并且处理光谱信号，得到目标元素的光谱强度，根据元素含量和光谱强度的关系，得到元素含量信息，还用于对采集点的元素信息按照空间位置组成图像，得到了元素分布图，
    所述缺陷分析模块用于采集并且处理超声信号，对信号进行滤波和优化，得到采集处的超声幅值，还用于对采集点的信号幅值按照空间位置组成图像，获得缺陷分布图，
    所述应力分析模块用于采集并处理超声信号，对信号进行滤波和优化，提取超声波的飞行时间，进而根据飞行时间获得超声声速，并根据超声声速得到残余应力，还用于对采集点的残余应力按照空间位置组成图像，获得残余应力分布图，
    激发单元包括脉冲激光器和光路系统，脉冲激光器用于发射出脉冲激光，该脉冲激光用于激发样品同时产生等离子体和超声波，光路系统包括多个反射镜和聚焦镜，用于对脉冲激光进行整形滤波后入射至待测样品上，并将等离子体光入射至光谱采集探头
    超声波探测单元用于对超声波进行探测，以获得关于待测样品中缺陷与残余应力的信息，
    光谱探测单元用于对等离子体火焰发射的光谱进行探测，以获得关于待测样品中元素的信息。
  4. 如权利要求3所述的装置，其特征在于，所述光路系统包括全反射镜、半透半反镜和聚焦物镜，半透半反镜与聚焦物镜位于水平光路上，半 透半反镜的透射面与水平光路成45°夹角，全反射镜安装于半透半反镜上方，与半透半反镜成90°角夹角，脉冲激光器的出光口与全反射镜在同一水平光路上，成45°角夹角。
  5. 如权利要求4所述的装置，其特征在于，光谱探测单元包括光谱仪探测头、光谱仪探测头聚焦镜、光谱仪以及增强电荷耦合器件，其中，光谱仪探测头、探测头聚焦镜、与聚焦物镜、半透半反镜位于同一水平光路上，光谱仪采集探头与光谱仪通过光纤连接，增强电荷耦合器件安装在光谱仪上，光谱仪与计算机电连接。
  6. 如权利要求5所述的装置，其特征在于，超声波探测单元包括超声波探测器和采集卡，超声波探测器与采集卡电连接，采集卡同时连接计算机和数字延时器，
    所述脉冲激光器和所述光谱仪同时与数字延时器电连接，
    所述超声波探测器包含接触式和非接触式两类。
  7. 如权利要求6所述的装置，其特征在于，数字延时发生器用于控制脉冲激光器在设定时间出光、光谱仪在设定时间执行采集工作，还用于控制采集卡在设定时间执行探测工作，数字延时发生器主要用于时序控制，使得与之相电连接受其控制的脉冲激光器、光谱仪、采集卡能在设定的时间执行工作，相互之间前后不冲突。
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