WO2020134449A1 - 麦克风 - Google Patents

麦克风 Download PDF

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Publication number
WO2020134449A1
WO2020134449A1 PCT/CN2019/113282 CN2019113282W WO2020134449A1 WO 2020134449 A1 WO2020134449 A1 WO 2020134449A1 CN 2019113282 W CN2019113282 W CN 2019113282W WO 2020134449 A1 WO2020134449 A1 WO 2020134449A1
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WIPO (PCT)
Prior art keywords
control circuit
housing
microphone
sound hole
dustproof device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/113282
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English (en)
French (fr)
Inventor
曾鹏
王天娇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AAC Technologies Holdings Shenzhen Co Ltd
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AAC Acoustic Technologies Shenzhen Co Ltd
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Publication date
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Publication of WO2020134449A1 publication Critical patent/WO2020134449A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/08—Mouthpieces; Microphones; Attachments therefor

Definitions

  • the utility model relates to the technical field of acoustic equipment, in particular to a microphone.
  • the utility model aims to solve one of the technical problems existing in the prior art, and provides a new microphone problem solution
  • the present invention provides a microphone
  • the microphone includes a housing with a receiving cavity, and a micro-electromechanical system chip and a control circuit chip received in the receiving cavity, the housing An acoustic hole is provided through the thickness and communicates with the accommodating cavity, the microphone further includes an electric dustproof device that at least completely covers the acoustic hole, the electric dustproof device is electrically connected to the control circuit chip, the The electric dustproof device can open the sound hole when receiving the power-on signal of the control circuit chip and close the sound hole when not receiving the power-on signal of the control circuit chip.
  • the housing includes a housing and a circuit board connected to the housing to form the accommodating cavity, and the micro-electromechanical chip and the control circuit chip are both electrically connected to the circuit board.
  • the sound hole is provided on the circuit board.
  • the sound hole corresponds to the position of the MEMS chip, and the electric dustproof device is interposed between the circuit board and the MEMS chip.
  • the housing includes a housing and a circuit board connected to the housing to form the accommodating cavity, and both the micro-electromechanical chip and the control circuit chip are electrically connected to the circuit board. The sound hole is provided on the housing.
  • the sound hole corresponds to the position of the control circuit chip
  • the electric dustproof device is located between the bottom wall of the housing and the control circuit chip.
  • the electric dustproof device includes a fixed dustproof part and a movable dustproof part detachably connected to the fixed dustproof part, the movable dustproof part is electrically connected to the control circuit chip Connection, the movable dustproof part opens the sound hole when receiving the power-on signal and closes the sound hole when the power-on signal is not received.
  • the electric dustproof device is a semiconductor material electric dustproof device.
  • the electric dustproof device is one of semiconductor material/polytetrafluoroethylene hybrid material or polytetrafluoroethylene material.
  • the electric dustproof device is a silicon electric dustproof device.
  • the microphone of the present invention includes a housing with a receiving cavity, and a micro-electromechanical system chip and a control circuit chip received in the receiving cavity, the housing An acoustic hole is provided through the thickness and communicates with the accommodating cavity, the microphone further includes an electric dustproof device that at least completely covers the acoustic hole, the electric dustproof device is electrically connected to the control circuit chip, the The electric dustproof device can open the sound hole when receiving the power-on signal of the control circuit chip and close the sound hole when the power-on signal of the control circuit chip is not received, which can effectively improve the microphone during transportation , Assembly, SMT or when not in use, the pollution problem in the process of the most easy to enter the dust will not affect the acoustic performance.
  • FIG. 1 is a cross-sectional view of the first embodiment of the present invention when the microphone is not powered on;
  • FIG. 2 is a cross-sectional view of the first embodiment of the present invention when the microphone is powered on;
  • FIG. 3 is a cross-sectional view of the second embodiment of the present invention when the microphone is not powered on;
  • FIG. 4 is a cross-sectional view of the second embodiment of the present invention when the microphone is powered on.
  • Embodiment 1 is a diagrammatic representation of Embodiment 1:
  • this embodiment relates to a microphone 100, and the microphone 100 includes a housing 110.
  • a circuit board 120 forming an accommodating cavity S, and a micro-electro-mechanical system chip 130 and a control circuit chip 140 accommodated in the accommodating cavity S, the micro-electro-mechanical chip 130 and the control circuit chip U0 Both are electrically connected to the circuit board 120.
  • the circuit board 120 is provided with a sound hole K penetrating through the thickness thereof and communicating with the accommodating cavity S.
  • the microphone 100 further includes an electric dustproof device 150 that at least completely covers the soundhole K.
  • the electric dustproof device 150 is electrically connected to the control circuit chip 140, and the electric dustproof device 150 can open the sound hole K when the power-on signal of the control circuit chip 140 is received and when the control circuit chip 140 is not received The sound hole K is closed when the power-on signal is turned on.
  • the sound hole K may correspond to the position of the microelectromechanical system chip 130, and the electric dustproof device 150 is interposed between the circuit board 120 and the micro Between the electromechanical system chips 130.
  • the sound hole K may also correspond to the position of the control circuit chip 140.
  • the electric dustproof device 150 is interposed between the circuit board 120 and the control circuit chip 140.
  • the control circuit chip 140 does not emit a power-up signal, at this time, the electric dustproof device 150 completely covers the sound hole K, so that the microphone dustproof function can be achieved .
  • the electric dustproof device 150 can open the sound hole K under the action of the power-up signal, so that the sound hole K can communicate with the outside and the accommodating cavity S, and then realize functions such as microphone pickup.
  • the microphone 100 in this embodiment includes, in addition to the general structure of the microphone 100, an electric dustproof device 150 covering at least the sound hole K, the electric dustproof device 150 and the control circuit
  • the chip 140 is electrically connected, and the electric dustproof device 150 can open the sound hole K when receiving the power-on signal of the control circuit chip 140 and close when the power-on signal of the control circuit chip 140 is not received
  • the sound hole K Therefore, the microphone 100 in this embodiment can effectively improve the pollution problem of the microphone 100 during the most dust-laden process during transportation, assembly, SMT, or when not in use, without affecting the acoustics Performance.
  • the specific structure of the electric dustproof device 100 is not limited, as long as it can meet the power-on signal (for example, a high-level signal) can be opened sound hole K, not received
  • the power-on signal for example, a low-level signal
  • the power-on signal can close the sound hole K.
  • the electric dustproof device 150 may include a fixed dustproof part 151 and a movable dustproof part 152 detachably connected to the fixed dustproof part 151, the fixed dustproof The dust part 151 is interposed between the MEMS chip 130 and the circuit board 120, the movable dustproof part 152 is electrically connected to the control circuit chip 140, and the movable dustproof part 152 The sound hole K is opened when the power-on signal is received and the sound hole K is closed when the power-on signal is not received.
  • the electric dustproof device 150 when the electric dustproof device 150 receives the power-on signal, not the entire electric dustproof device 150 responds to the power-on signal, only the electric dustproof device corresponding to the K portion of the sound hole It suffices that 150 responds to the power-on signal, that is, the movable dustproof part 152 responds to the power-on signal to open or close the sound hole K, so that the structure of the electric dustproof device 150 can be simplified.
  • the electric dustproof device 150 may be a semiconductor material electric dustproof device, for example, preferably, the electric dustproof device 150 is a silicon material electric dustproof device; in addition, The electric dustproof device 150 may also be one of semiconductor material/polytetrafluoroethylene hybrid material or polytetrafluoroethylene material. You can also choose other semiconductor materials or other polymer materials, which can be determined according to actual needs.
  • the sound hole K is provided on the housing 110, and the electric dustproof device 150 is located between the bottom wall of the housing 110 and the control circuit chip 140.
  • the control circuit chip 140 does not emit a power-up signal.
  • the electric dustproof device 150 completely covers the sound hole K, so that the dustproof function of the microphone can be achieved.
  • the electric dustproof device 150 can open the sound hole K under the action of the power-up signal, so that the sound hole K can communicate with the outside world and the accommodating cavity S, and then realize functions such as microphone pickup.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

一种麦克风，所述麦克风包括具有容纳腔的壳体以及收容于所述容纳腔内的微机电系统芯片及控制电路芯片，所述壳体上设置有贯穿其厚度且连通所述容纳腔的声孔，所述麦克风还包括至少完全覆盖住所述声孔的电动防尘装置，所述电动防尘装置与所述控制电路芯片电连接，所述电动防尘装置能够在接收到所述控制电路芯片的上电信号时开启所述声孔以及在未接收到所述控制电路芯片的上电信号时关闭所述声孔，可以有效改善麦克风在运输、装配、SMT或者未使用时等最容易进尘的过程中的污染问题，又不会影响声学性能。

Description

i
麦克风 技术领域
[0001] 本实用新型涉及声学设备技术领域， 具体涉及一种麦克风。
背景技术
[0002] 传统地， 为了使得麦克风能够防尘， 往往需要在在麦克风的声孔位置贴上固定 防尘膜， 但是， 固定防尘膜需要开防尘孔， 因此， 总有比防尘孔小的异物有一 定概率会进入到该防尘孔内， 此外， 最大的缺点是由于声孔加了防尘网， 阻尼 变大， 麦克风的声学性能会变差。
[0003] 因而有必要研究一种具有新结构的麦克风。
发明概述
技术问题
[0004] 本实用新型旨在解决现有技术中存在的技术问题之一， 而提供一种新型麦克风 问题的解决方案
技术解决方案
[0005] 为实现上述目的， 本实用新型提供了一种麦克风， 所述麦克风包括具有容纳腔 的壳体以及收容于所述容纳腔内的微机电系统芯片及控制电路芯片， 所述壳体 上设置有贯穿其厚度且连通所述容纳腔的声孔， 所述麦克风还包括至少完全覆 盖住所述声孔的电动防尘装置， 所述电动防尘装置与所述控制电路芯片电连接 ， 所述电动防尘装置能够在接收到所述控制电路芯片的上电信号时开启所述声 孔以及在未接收到所述控制电路芯片的上电信号时关闭所述声孔。
[0006] 可选地， 所述壳体包括外壳以及与所述外壳盖接形成所述容纳腔的线路板， 所 述微机电芯片与所述控制电路芯片均与所述线路板电连接， 所述线路板上设置 有所述声孔。
[0007] 可选地， 所述声孔与所述微机电系统芯片的位置相对应， 所述电动防尘装置夹 设在所述线路板与所述微机电系统芯片之间。 [0008] 可选地， 所述壳体包括外壳以及与所述外壳盖接形成所述容纳腔的线路板， 所 述微机电芯片与所述控制电路芯片均与所述线路板电连接， 所述外壳上设置有 所述声孔。
[0009] 可选地， 所述声孔与所述控制电路芯片的位置相对应， 所述电动防尘装置位于 所述外壳的底壁与所述控制电路芯片之间。
[0010] 可选地， 所述电动防尘装置包括固定防尘部以及与所述固定防尘部可拆卸连接 的可动防尘部， 所述可动防尘部与所述控制电路芯片电连接， 所述可动防尘部 在接收到所述上电信号时开启所述声孔以及在未接收到所述上电信号时关闭所 述声孔。
[0011] 可选地， 所述电动防尘装置为半导体材质电动防尘装置。
[0012] 可选地， 所述电动防尘装置为半导体材质 /聚四氟乙烯混合材质或聚四氟乙烯 材质中的一种。
[0013] 可选地， 所述电动防尘装置为硅材质电动防尘装置。
发明的有益效果
有益效果
[0014] 本实用新型的有益效果是： 本实用新型的麦克风， 所述麦克风包括具有容纳腔 的壳体以及收容于所述容纳腔内的微机电系统芯片及控制电路芯片， 所述壳体 上设置有贯穿其厚度且连通所述容纳腔的声孔， 所述麦克风还包括至少完全覆 盖住所述声孔的电动防尘装置， 所述电动防尘装置与所述控制电路芯片电连接 ， 所述电动防尘装置能够在接收到所述控制电路芯片的上电信号时开启所述声 孔以及在未接收到所述控制电路芯片的上电信号时关闭所述声孔， 可以有效改 善麦克风在运输、 装配、 SMT或者未使用时等最容易进尘的过程中的污染问题 ， 又不会影响声学性能。
对附图的简要说明
附图说明
[0015] 图 1是本实用新型第一实施例中麦克风未上电时的剖视图；
[0016] 图 2是本实用新型第一实施例中麦克风上电时的剖视图；
[0017] 图 3是本实用新型第二实施例中麦克风未上电时的剖视图； [0018] 图 4是本实用新型第二实施例中麦克风上电时的剖视图。
发明实施例
具体实施方式
[0019] 下面结合图 1至图 4对本实用新型作详细描述。
[0020] 实施例 1 :
[0021] 如图 1和图 2所示， 本实施例涉及一种麦克风 100， 所述麦克风 100包括外壳 110
、 与所述外壳 110盖接形成容纳腔 S的线路板 120以及收容于所述容纳腔 S内的微 机电系统芯片 130及控制电路芯片 140， 所述微机电芯片 130与所述控制电路芯片 U0均与所述线路板 120电连接。 所述线路板 120上设置有贯穿其厚度且连通所述 容纳腔 S的声孔 K， 所述麦克风 100还包括至少完全覆盖住所述声孔 K的电动防尘 装置 150， 所述电动防尘装置 150与所述控制电路芯片 140电连接， 所述电动防尘 装置 150能够在接收到所述控制电路芯片 140的上电信号时开启所述声孔 K以及在 未接收到所述控制电路芯片 140的上电信号时关闭所述声孔 K。
[0022] 如图 1和图 2所示， 所述声孔 K可以与所述微机电系统芯片 130的位置相对应， 所 述电动防尘装置 150夹设在所述线路板 120与所述微机电系统芯片 130之间。 当然 ， 除此以外， 声孔 K也可以与所述控制电路芯片 140的位置相对应， 此时， 该电 动防尘装置 150夹设在线路板 120与控制电路芯片 140之间。
[0023] 具体地， 如图 1所示， 此时， 控制电路芯片 140并未发出上电信号， 此时， 电动 防尘装置 150完全覆盖住所述声孔 K， 从而可以实现麦克风的防尘功能。 反之， 如图 2所示， 当控制电路芯片 140发出上电信号时， 在上电信号的作用下， 电动 防尘装置 150可以将声孔 K打开， 从而可以使得声孔 K连通外界与容纳腔 S， 进而 实现麦克风的拾音等功能。
[0024] 本实施例中的麦克风 100， 其除了包括麦克风 100所具有的一般结构外， 还包括 至少覆盖住声孔 K的电动防尘装置 150, 所述电动防尘装置 150与所述控制电路芯 片 140电连接， 所述电动防尘装置 150能够在接收到所述控制电路芯片 140的上电 信号时开启所述声孔 K以及在未接收到所述控制电路芯片 140的上电信号时关闭 所述声孔 K。 因此， 本实施例中的麦克风 100, 可以有效改善麦克风 100在运输、 装配、 SMT或者未使用时等最容易进尘的过程中的污染问题， 又不会影响声学 性能。
[0025] 需要说明的是， 对于电动防尘装置 100的具体结构并没有作出限定， 其只要能 够满足在接收到上电信号 （例如， 高电平信号） 可以开启声孔 K， 在未接收到上 电信号 （例如， 低电平信号） 关闭声孔 K即可。
[0026] 如图 1和图 2所示， 所述电动防尘装置 150可以包括固定防尘部 151以及与所述固 定防尘部 151可拆卸连接的可动防尘部 152, 所述固定防尘部 151夹设在所述微机 电系统芯片 130与所述线路板 120之间， 所述可动防尘部 152与所述控制电路芯片 140电连接， 并且， 所述可动防尘部 152在接收到所述上电信号时开启所述声孔 K 以及在未接收到所述上电信号时关闭所述声孔 K。 也就是说， 在本实施例中， 电 动防尘装置 150在接收到上电信号时， 并不是整个电动防尘装置 150均响应该上 电信号， 只有对应于声孔 K部分的电动防尘装置 150响应该上电信号即可， 即可 动防尘部 152响应上电信号以开启或关闭所述声孔 K， 从而可以简化电动防尘装 置 150的结构。
[0027] 在本实施例中， 所述电动防尘装置 150可以为半导体材质电动防尘装置， 例如 ， 优选地， 该电动防尘装置 150为硅材质电动防尘装置； 除此之外， 所述电动防 尘装置 150还可以为半导体材质 /聚四氟乙烯混合材质或聚四氟乙烯材质中的一种 。 还可以选择其他一些半导体材料或者其他高分子材料， 具体可以根据实际需 要确定。
[0028] 实施例 2:
[0029] 与实施例 1不同的是， 如图 3和图 4所示， 声孔 K设置在外壳 110上， 电动防尘装 置 150位于外壳 110的底壁与控制电路芯片 140之间， 此时， 如图 3所示， 控制电 路芯片 140并未发出上电信号， 此时， 电动防尘装置 150完全覆盖住所述声孔 K， 从而可以实现麦克风的防尘功能。 反之， 如图 4所示， 当控制电路芯片 140发出 上电信号时， 在上电信号的作用下， 电动防尘装置 150可以将声孔 K打开， 从而 可以使得声孔 K连通外界与容纳腔 S， 进而实现麦克风的拾音等功能。
[0030] 本实施例中的其余结构可以参考实施例 1中记载的相关内容， 在此并不做赘述
[0031] 以上所述的仅是本实用新型的实施方式， 在此应当指出， 对于本领域的普通技 术人员来说， 在不脱离本实用新型创造构思的前提下， 还可以做出改进， 但这 些均属于本实用新型的保护范围。

Claims

权利要求书
[权利要求 1] 一种麦克风， 所述麦克风包括具有容纳腔的壳体以及收容于所述容纳 腔内的微机电系统芯片及控制电路芯片， 所述壳体上设置有贯穿其厚 度且连通所述容纳腔的声孔， 其特征在于， 所述麦克风还包括至少完 全覆盖住所述声孔的电动防尘装置， 所述电动防尘装置与所述控制电 路芯片电连接， 所述电动防尘装置能够在接收到所述控制电路芯片的 上电信号时开启所述声孔以及在未接收到所述控制电路芯片的上电信 号时关闭所述声孔。
[权利要求 2] 根据权利要求 1所述的麦克风， 其特征在于， 所述壳体包括外壳以及 与所述外壳盖接形成所述容纳腔的线路板， 所述微机电芯片与所述控 制电路芯片均与所述线路板电连接， 所述线路板上设置有所述声孔。
[权利要求 3] 根据权利要求 2所述的麦克风， 其特征在于， 所述声孔与所述微机电 系统芯片的位置相对应， 所述电动防尘装置夹设在所述线路板与所述 微机电系统芯片之间。
[权利要求 4] 根据权利要求 1所述的麦克风， 其特征在于， 所述壳体包括外壳以及 与所述外壳盖接形成所述容纳腔的线路板， 所述微机电芯片与所述控 制电路芯片均与所述线路板电连接， 所述外壳上设置有所述声孔。
[权利要求 5] 根据权利要求 4所述的麦克风， 其特征在于， 所述声孔与所述控制电 路芯片的位置相对应， 所述电动防尘装置位于所述外壳的底壁与所述 控制电路芯片之间。
[权利要求 6] 根据权利要求 2至 5中任意一项所述的麦克风， 其特征在于， 所述电动 防尘装置包括固定防尘部以及与所述固定防尘部可拆卸连接的可动防 尘部， 所述可动防尘部与所述控制电路芯片电连接， 所述可动防尘部 在接收到所述上电信号时开启所述声孔以及在未接收到所述上电信号 时关闭所述声孔。
[权利要求 7] 根据权利要求 1至 5中任意一项所述的麦克风， 其特征在于， 所述电动 防尘装置为半导体材质。
[权利要求 8] 根据权利要求 1至 5中任意一项所述的麦克风， 其特征在于， 所述电动 防尘装置为半导体材质 /聚四氟乙烯混合材质或聚四氟乙烯材质中的 一种。
[权利要求 9] 根据权利要求 7所述的麦克风， 其特征在于， 所述电动防尘装置为硅 材质电动防尘装置。
PCT/CN2019/113282 2018-12-28 2019-10-25 麦克风 Ceased WO2020134449A1 (zh)

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