WO2020133770A1 - 背光模组及显示装置 - Google Patents

背光模组及显示装置 Download PDF

Info

Publication number
WO2020133770A1
WO2020133770A1 PCT/CN2019/080052 CN2019080052W WO2020133770A1 WO 2020133770 A1 WO2020133770 A1 WO 2020133770A1 CN 2019080052 W CN2019080052 W CN 2019080052W WO 2020133770 A1 WO2020133770 A1 WO 2020133770A1
Authority
WO
WIPO (PCT)
Prior art keywords
led chip
film layer
light
optical film
mini
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/080052
Other languages
English (en)
French (fr)
Inventor
肖士元
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Technology Co Ltd
Priority to US16/472,982 priority Critical patent/US11320581B2/en
Publication of WO2020133770A1 publication Critical patent/WO2020133770A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0073—Light emitting diode [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033—Means for improving the coupling-out of light from the light guide
    • G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
    • G02B6/0051—Diffusing sheet or layer
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0068—Arrangements of plural sources, e.g. multi-colour light sources
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133621—Illuminating devices providing coloured light
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
    • G02F1/133607—Direct backlight including a specially adapted diffusing, scattering or light controlling members the light controlling member including light directing or refracting elements, e.g. prisms or lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133613—Direct backlight characterized by the sequence of light sources
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133614—Illuminating devices using photoluminescence, e.g. phosphors illuminated by UV or blue light

Definitions

  • the present application relates to a display technology, in particular to a backlight module and a display device.
  • Mini LED Light Emitting Diode
  • LED surface light source has more and more application fields, and has also been more and more applications.
  • the basic structure of the Mini LED surface light source display device includes a display panel, an optical structure layer, and a Mini LED surface light source.
  • the LED surface light source includes frame sealant (containing yellow phosphor), Mini LED blue chip, and surface light source substrate.
  • the part of the single-color light emitted by this Mini LED surface light source needs to pass through the yellow phosphor to form stray light, resulting in a low color saturation.
  • Embodiments of the present application provide a backlight module and a display device to solve the technical problem that the existing Mini LED surface light source easily forms stray light when emitting a single color light, thereby reducing the color saturation.
  • An embodiment of the present application provides a backlight module, including:
  • Mini LED chips are used to emit light, and are arranged on the substrate, and the Mini LED chips are arranged at intervals, the Mini The LED chip includes a first LED chip, a second LED chip, a third LED chip, and a fourth LED chip, the first LED chip emits red light, the second LED chip emits green light, and the third LED chip emits light Blue light, the fourth LED chip emits yellow light;
  • Frame sealant which is transparent, is provided on the substrate and covers and encapsulates the Mini LED chip
  • the optical diaphragm structure is used for diffusing and brightening the light emitted by the Mini LED chip, and is arranged on the frame sealant;
  • a said first LED chip, a second LED chip, a third LED chip and a fourth LED chip are arranged side by side horizontally or vertically to form a repeating unit;
  • the optical film structure includes a first optical film layer, a second optical film layer and a third optical film layer arranged in this order, and the first optical film layer is arranged on the frame sealant;
  • the first optical film layer is a light diffusion film layer
  • the second optical film layer is a light enhancement film layer
  • the third optical film layer is a light diffusion film layer or a light diffusion film layer and a light enhancement film layer ⁇ The combined film layer.
  • a plurality of the repeating units are arranged in a matrix, and the third LED chip is disposed adjacent to one side of the fourth LED chip.
  • the light emitting area of the first LED chip is smaller than the light emitting area of the fourth LED chip, and the light emitting area of the fourth LED chip is smaller than the light emitting area of the second LED chip.
  • the light emitting area of the second LED chip is smaller than the light emitting area of the third LED chip.
  • An embodiment of the present application also provides a backlight module, which includes:
  • Mini LED chips are used to emit light, and are arranged on the substrate, and the Mini LED chips are arranged at intervals, the Mini The LED chip includes a first LED chip, a second LED chip, a third LED chip, and a fourth LED chip, the first LED chip emits red light, the second LED chip emits green light, and the third LED chip emits light Blue light, the fourth LED chip emits yellow light;
  • Frame sealant which is transparent, is provided on the substrate and covers and encapsulates the Mini LED chip
  • the optical diaphragm structure is used for diffusing and brightening the light emitted by the Mini LED chip, and is arranged on the frame sealant.
  • a first LED chip, a second LED chip, a third LED chip and a fourth LED chip are arranged side by side in a horizontal or vertical direction to form a repeating unit.
  • one of the first LED chip, a second LED chip, a third LED chip and a fourth LED chip are arranged side by side to form a repeating unit.
  • the repeating unit has a square shape.
  • a plurality of the repeating units are arranged in a matrix, and the third LED chip is disposed adjacent to one side of the fourth LED chip.
  • the light emitting area of the first LED chip is smaller than the light emitting area of the fourth LED chip, and the light emitting area of the fourth LED chip is smaller than the light emitting area of the second LED chip.
  • the light emitting area of the second LED chip is smaller than the light emitting area of the third LED chip.
  • the optical film structure includes a first optical film layer, a second optical film layer and a third optical film layer arranged in this order, the first optical film layer is disposed on the sealing frame Glue on
  • the first optical film layer is a light diffusion film layer
  • the second optical film layer is a light enhancement film layer
  • the third optical film layer is a light diffusion film layer or a light diffusion film layer and a light enhancement film layer ⁇ The combined film layer.
  • the present application also relates to a display device including a backlight module and a display panel provided on the backlight module, the backlight module includes:
  • a Mini LED chip is used to emit light and is arranged on the substrate.
  • the Mini LED chips are arranged at intervals.
  • the Mini LED chip includes a first LED chip, a second LED chip, a third LED chip and a fourth LED chip ,
  • the first LED chip emits red light
  • the second LED chip emits green light
  • the third LED chip emits blue light
  • the fourth LED chip emits yellow light
  • Frame sealant which is transparent, is provided on the substrate and covers and encapsulates the Mini LED chip
  • the optical diaphragm structure is used for diffusing and brightening the light emitted by the Mini LED chip, and is arranged on the frame sealant.
  • one of the first LED chip, a second LED chip, a third LED chip and a fourth LED chip are arranged side by side to form a repeating unit; a plurality of the repeating units form a matrix
  • the third LED chip is arranged adjacent to one side of the fourth LED chip.
  • the repeating unit has a square shape.
  • a first LED chip, a second LED chip, a third LED chip and a fourth LED chip are arranged side by side in a horizontal or vertical direction to form a repeating unit; a plurality of the repeating units are Arranged in a matrix, the third LED chip is disposed adjacent to one side of the fourth LED chip.
  • the light emitting area of the first LED chip is smaller than the light emitting area of the fourth LED chip
  • the light emitting area of the fourth LED chip is smaller than the light emitting area of the second LED chip
  • the The light emitting area of the second LED chip is smaller than the light emitting area of the third LED chip.
  • the optical film structure includes a first optical film layer, a second optical film layer and a third optical film layer arranged in this order, and the first optical film layer is disposed on the frame sealant on;
  • the first optical film layer is a light diffusion film layer
  • the second optical film layer is a light enhancement film layer
  • the third optical film layer is a light diffusion film layer or a light diffusion film layer and a light enhancement film layer ⁇ The combined film layer.
  • the backlight module and display device of the present application save the doping of yellow fluorescent light in the frame sealing glue by providing the first/second/third and fourth LED chips Pink steps.
  • the transparent sealant of the present application reduces the possibility of stray light, improves the color saturation, and has the function of switching the color saturation. This application solves the existing Mini
  • the LED surface light source easily forms stray light when emitting a single color light, thereby reducing the technical problem of the color saturation.
  • FIG. 1 is a schematic structural diagram of a conventional Mini LED surface light source display device
  • FIG. 2 is a schematic structural diagram of a backlight module according to the first embodiment of this application.
  • FIG. 5 is a schematic diagram of an arrangement structure of Mini LED chips of a display device according to an embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of a backlight module of the first embodiment of the present application
  • FIG. 3 is an arrangement of Mini (mini) LED chips of the backlight module of the first embodiment of the present application Schematic.
  • the backlight module 100 of the first embodiment includes a substrate 11, a Mini LED chip 12, a frame sealant 13 and an optical module structure 14.
  • the Mini LED chip 12 is used to emit light and is provided on the substrate 11. The interval between the Mini LED chips 12 is set.
  • the Mini LED chip 12 includes a first LED chip 121, a second LED chip 122, a third LED chip 123, and a fourth LED chip 124.
  • the first LED chip 121 emits red light.
  • the second LED chip 122 emits green light.
  • the third LED chip 123 emits blue light.
  • the fourth LED chip 124 emits yellow light.
  • the frame sealant 13 is transparent and is disposed on the substrate 11 and covers the packaged Mini LED chip 12.
  • the optical diaphragm structure 14 is used to diffuse and brighten the light emitted by the Mini LED chip 12.
  • the optical film structure 14 is disposed on the sealant 13.
  • the backlight module 100 of the present application saves the step of doping the yellow phosphor in the sealant 13 by providing the first/second/third and fourth LED chips (121, 122, 123, and 124).
  • the transparent sealant 13 can avoid the generation of stray light.
  • the blue light-emitting chip emits blue light and the yellow light emitted by the yellow phosphor in the sealant mixes to produce white light.
  • the yellow phosphor will also emit stray light of other colors.
  • the amount of yellow light emitted by the yellow phosphor is smaller than that of blue light, so that the light emitted after mixing the light is not pure white. Therefore, when the backlight module is applied to a display device, the color saturation displayed by the display device will be low.
  • the frame sealant 13 is transparent, which reduces the possibility of stray light.
  • the backlight module 100 can directly excite one of the four chips, and use a single chip to directly emit light to provide a light source for the display device, which improves the monochrome Color saturation.
  • the four chips in the backlight module 100 can be excited in a combination of different forms, and emit white light in the mixed light.
  • the third LED chip 123 and the fourth LED chip 124 can be excited to mix blue light and yellow light to form white light; the first LED chip 121, the second LED chip 122, and the third LED chip 123 can also be excited to make red light, Green light and blue light are mixed to form white light.
  • the amount of light emitted by different Mini LED chips 12 can also be controlled to adjust the color saturation.
  • a first LED chip 121, a second LED chip 122, a third LED chip 123 and a fourth LED chip 124 are arranged side by side in a horizontal or vertical direction to form a repeating unit 12a.
  • the four kinds of LED chips in the repeating unit 12a are arranged horizontally, and the order of arrangement is the first LED chip 121, the second LED chip 122, the third LED chip 123, and the fourth LED chip 124 may also be the second LED chip 122, the first LED chip 121, the third LED chip 123 and the fourth LED chip 124, or the fourth LED chip 124, the third LED chip 123, the first LED chip 121 and the second LED chip 122.
  • the first embodiment is described by taking the first arrangement method as an example, but it is not limited to this.
  • the multiple repeating units 12a are arranged in a matrix.
  • the third LED chip 123 is disposed adjacent to one side of the fourth LED chip 124.
  • the matrix arrangement makes the repeating units 12a uniformly arranged, which improves the uniformity of light output.
  • the third LED chip 123 is disposed adjacent to the fourth LED chip 124, so that the blue light and the yellow light can be mixed quickly, and the light extraction efficiency is improved. At the same time, placing the two close together facilitates the full mixing of blue light and yellow light to form a more pure white, which improves the color saturation of the display device.
  • the light emitting area of the first LED chip 121 is smaller than the light emitting area of the fourth LED chip 124.
  • the light emitting area of the fourth LED chip 124 is smaller than the light emitting area of the second LED chip 122.
  • the light emitting area of the second LED chip 122 is smaller than the light emitting area of the third LED chip 123.
  • the first LED chip 121 has a light emission brightness greater than that of the fourth LED chip 124
  • the fourth LED chip 124 has a light emission brightness greater than that of the second LED chip 122.
  • the light emission brightness is greater than that of the third LED chip 123. Therefore, in order to improve the uniformity of the light emitting luminance in the first embodiment of the backlight module 100, the light emitting area of the first LED chip 121 is set to be smaller than the light emitting area of the fourth LED chip 124.
  • the light emitting area of the fourth LED chip 124 is set smaller than the light emitting area of the second LED chip 122.
  • the light emitting area of the second LED chip 122 is set smaller than the light emitting area of the third LED chip 123.
  • the optical film structure 14 includes a first optical film layer 141, a second optical film layer 142, and a third optical film layer 143 that are sequentially arranged.
  • the first optical film layer 141 is disposed on the sealant 13.
  • the first optical film layer 141 is a light diffusion film layer.
  • the second optical film layer 142 is a light enhancement film layer.
  • the third optical film layer 143 is a light diffusion film layer or a combined film layer of a light diffusion film layer and a light enhancement film layer.
  • the first optical film layer 141 is used to diffuse the light emitted by the Mini LED chip 12 to expand the angle of light emission, and when the light is mixed, the light is mixed more fully, and the light mixing effect is improved.
  • the second optical film layer 142 is used to increase the brightness of the diffused light to improve the brightness of the backlight module 100.
  • the third optical film layer 143 is used for diffusing the brightened light again or performing diffusion and brightening treatment, so as to further expand the light emitting angle of the light and improve the light mixing effect, and can further increase the brightness of the overall light source.
  • the light emitting surfaces of the fourth LED chip 124 and the third LED chip 123 are concave surfaces. Such an arrangement expands the light emitting angle of the third/fourth LED chip and improves the light mixing effect.
  • the light exit surface of the first/second LED chip may also be a concave surface.
  • the concave surface of the Mini LED chip is a concave spherical surface, which makes the diffusion angle more balanced.
  • the concave surface of the Mini LED chip is a concave arc surface, so that the light emitted by the Mini LED chip mostly diffuses in the direction of the adjacent different LED chips, so as to achieve the purpose of improving the light mixing effect.
  • FIG. 4 is a schematic diagram of an arrangement structure of Mini LED chips of a backlight module according to a second embodiment of the present application.
  • this embodiment differs from the first embodiment in that a first LED chip 221, a second LED chip 222, a third LED chip 223, and a fourth LED
  • the chips 224 are arranged side by side to form a repeating unit 22a.
  • the repeating unit 22a has a square shape.
  • This setting reduces the distance between Mini LED chips and improves the light mixing effect.
  • FIG. 5 is a schematic diagram of an arrangement structure of Mini LED chips of a display device according to an embodiment of the present application.
  • the present application also relates to a display device 1000 including a backlight module 100 and a display panel 200 provided on the backlight module 100.
  • the backlight module 100 includes a substrate 11, a Mini LED chip 12, a frame sealant 13 and an optical module structure 14.
  • the Mini LED chip 12 is used to emit light and is provided on the substrate 11. The interval between the Mini LED chips 12 is set.
  • the Mini LED chip 12 includes a first LED chip 121, a second LED chip 122, a third LED chip 123, and a fourth LED chip 124.
  • the first LED chip 121 emits red light.
  • the second LED chip 122 emits green light.
  • the third LED chip 123 emits blue light.
  • the fourth LED chip 124 emits yellow light.
  • the frame sealant 13 is transparent and is disposed on the substrate 11 and covers the packaged Mini LED chip 12.
  • the optical diaphragm structure 14 is used to diffuse and brighten the light emitted by the Mini LED chip 12.
  • the optical film structure 14 is disposed on the sealant 13.
  • the backlight module 100 of the present application saves the step of doping the yellow phosphor in the sealant 13 by providing the first/second/third and fourth LED chips (121, 122, 123, and 124).
  • the transparent sealant 13 can avoid the generation of stray light.
  • the frame sealant 13 is transparent, which reduces the occurrence of stray light.
  • the backlight module 100 can directly excite one of the four chips, and use a single chip to directly emit light to provide a light source for the display device. Monochromatic color saturation.
  • the four chips in the backlight module 100 can be excited in a combination of different forms and emit white light in the mixed light.
  • the third LED chip 123 and the fourth LED chip 124 can be excited to mix blue light and yellow light to form white light; the first LED chip 121, the second LED chip 122, and the third LED chip 123 can also be excited to make red light, Green light and blue light are mixed to form white light.
  • the amount of light emitted by different Mini LED chips 12 can also be controlled to adjust the color saturation.
  • a first LED chip 121, a second LED chip 122, a third LED chip 123 and a fourth LED chip 124 are arranged side by side in a horizontal or vertical direction to form a repeating unit 12a.
  • the four kinds of LED chips in the repeating unit 12a are arranged laterally, and the order of arrangement is the first LED chip 121, the second LED chip 122, the third LED chip 123, and the fourth LED chip 124, It may also be the second LED chip 122, the first LED chip 121, the third LED chip 123, and the fourth LED chip 124, or the fourth LED chip 124, the third LED chip 123, the first LED chip 121, and the second LED chip 122.
  • This embodiment is described by taking the first arrangement method as an example, but it is not limited to this.
  • the multiple repeating units 12a are arranged in a matrix.
  • the third LED chip 123 is disposed adjacent to one side of the fourth LED chip 124.
  • the matrix arrangement makes the repeating units 12a uniformly arranged, which improves the uniformity of light output.
  • the third LED chip 123 is arranged adjacent to the fourth LED chip 124, so that the blue light and the yellow light can be quickly mixed to improve the light extraction efficiency, and the two are placed close to each other, which is convenient for the full mixing of the blue light and the yellow light, forming a more It is pure white. Furthermore, the color saturation of the display device is improved.
  • the light emitting area of the first LED chip 121 is smaller than the light emitting area of the fourth LED chip 124.
  • the light emitting area of the fourth LED chip 124 is smaller than the light emitting area of the second LED chip 122.
  • the light emitting area of the second LED chip 122 is smaller than the light emitting area of the third LED chip 123.
  • the first LED chip 121 emits light greater than the fourth LED chip 124
  • the fourth LED chip 124 emits light greater than the second LED chip 122
  • the second LED chip 122 The light emission brightness is greater than that of the third LED chip 123. Therefore, in order to improve the uniformity of the light emitting luminance in the first embodiment of the backlight module 100, the light emitting area of the first LED chip 121 is set to be smaller than the light emitting area of the fourth LED chip 124.
  • the light emitting area of the fourth LED chip 124 is set smaller than the light emitting area of the second LED chip 122.
  • the light emitting area of the second LED chip 122 is set to be smaller than the light emitting area of the third LED chip 123.
  • the optical film structure 14 includes a first optical film layer 141, a second optical film layer 142, and a third optical film layer 143 that are sequentially arranged.
  • the first optical film layer 141 is disposed on the sealant 13.
  • the first optical film layer 141 is a light diffusion film layer.
  • the second optical film layer 142 is a light enhancement film layer.
  • the third optical film layer 143 is a light diffusion film layer or a combined film layer of a light diffusion film layer and a light enhancement film layer.
  • the first optical film layer 141 is used to diffuse the light emitted by the Mini LED chip 12 to expand the angle of light emission, and when the light is mixed, the light is mixed more fully, and the light mixing effect is improved.
  • the second optical film layer 142 is used to increase the brightness of the diffused light to improve the brightness of the backlight module 100.
  • the third optical film layer 143 is used for diffusing the brightened light again or performing diffusion and brightening treatment, so as to further expand the light emitting angle of the light and improve the light mixing effect, and can further increase the brightness of the overall light source.
  • the light emitting surfaces of the fourth LED chip and the third LED chip are concave surfaces. Such an arrangement expands the light emitting angle of the third/fourth LED chip and improves the light mixing effect.
  • the light exit surface of the first/second LED chip may also be a concave surface.
  • the concave surface of the Mini LED chip is a concave spherical surface, which makes the diffusion angle more balanced.
  • the concave surface of the Mini LED chip is a concave arc surface, so that the light emitted by the Mini LED chip mostly diffuses in the direction of the adjacent different LED chips, so as to achieve the purpose of improving the light mixing effect.
  • the backlight module and the display device of the present application save the doping of yellow fluorescence in the frame sealant by setting the first/second/third and fourth LED chips Pink steps.
  • the transparent sealant of the present application reduces the possibility of stray light, improves the color saturation, and has the function of switching the color saturation. This application solves the existing Mini When the LED surface light source emits light of a single color, stray light is easily formed, thereby reducing the technical problem of saturation of the color.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Led Device Packages (AREA)
  • Planar Illumination Modules (AREA)

Abstract

一种背光模组(100)及显示装置，Mini LED芯片(12)设置在基板(11)上，Mini LED芯片(12)之间间隔设置，Mini LED芯片(12)包括第一LED芯片(121)、第二LED芯片(122)、第三LED芯片(123)和第四LED芯片(124)，第一LED芯片(121)发红光、第二LED芯片(122)发绿光、第三LED芯片(123)发蓝光和第四LED芯片(124)发黄光，封框胶(13)为透明状，其设置在基板(11)上并覆盖封装Mini LED芯片(12)，光学膜片结构(14)设置在封框胶(13)上。

Description

背光模组及显示装置 技术领域
本申请涉及一种显示技术，特别涉及一种背光模组及显示装置。
 背景技术
随着Mini 发光二极管（Light Emitting Diode ,LED）技术的发展，Mini LED面光源的应用领域越来越多，也得到了越来越多的应用。
现阶段Mini LED面光源显示装置基本架构（如图1）包括显示面板、光学结构层及Mini LED面光源，其中Mini LED面光源包括封框胶(含有黄色荧光粉)、Mini LED蓝光芯片、面光源基板。
但是，该种Mini LED面光源发出的单种颜色光的部分需要经过黄色荧光粉，形成杂光，导致其色彩饱和度较低。
 技术问题
本申请实施例提供一种背光模组及显示装置，以解决现有的Mini LED面光源发出单种颜色光时容易形成杂光，从而降低该颜色饱和度的技术问题。
 技术解决方案
本申请实施例提供一种背光模组，其包括：
基板；
Mini LED芯片，用于发光，设置在所述基板上，所述Mini LED芯片之间间隔设置，所述Mini LED芯片包括第一 LED芯片、第二 LED芯片、第三 LED芯片和第四 LED芯片，所述第一 LED芯片发红光，所述第二 LED芯片发绿光，所述第三LED芯片发蓝光，所述第四 LED芯片发黄光；
封框胶，为透明状，设置在所述基板上并覆盖封装所述Mini LED芯片；以及
光学膜片结构，用于将所述Mini LED芯片发出的光线进行扩散和增亮，设置在所述封框胶上；
一所述第一LED芯片、一第二LED芯片、一第三LED芯片和一第四LED芯片横向或纵向并排设置构成一重复单元；
所述光学膜片结构包括依次设置的第一光学膜层、第二光学膜层和第三光学膜层，所述第一光学膜层设置在所述封框胶上；
所述第一光学膜层为光扩散膜层，所述第二光学膜层为光增亮膜层，所述第三光学膜层为光扩散膜层或为光扩散膜层和光增亮膜层的组合膜层。
在本申请的背光模组中，多个所述重复单元呈矩阵式排布，所述第三LED芯片邻近设置在所述第四LED芯片的一侧。
在本申请的背光模组中，所述第一LED芯片的发光面积小于所述第四LED芯片的发光面积，所述第四LED芯片的发光面积小于所述第二LED芯片的发光面积，所述第二LED芯片的发光面积小于所述第三LED芯片的发光面积。
本申请实施例还提供一种背光模组，其包括：
基板；
Mini LED芯片，用于发光，设置在所述基板上，所述Mini LED芯片之间间隔设置，所述Mini LED芯片包括第一 LED芯片、第二 LED芯片、第三 LED芯片和第四 LED芯片，所述第一 LED芯片发红光，所述第二 LED芯片发绿光，所述第三 LED芯片发蓝光，所述第四 LED芯片发黄光；
封框胶，为透明状，设置在所述基板上并覆盖封装所述Mini LED芯片；以及
光学膜片结构，用于将所述Mini LED芯片发出的光线进行扩散和增亮，设置在所述封框胶上。
在本申请的背光模组中，一所述第一LED芯片、一第二LED芯片、一第三LED芯片和一第四LED芯片横向或纵向并排设置构成一重复单元。
在本申请的背光模组中，一所述第一LED芯片、一第二LED芯片、一第三LED芯片和一第四LED芯片两两并排设置构成一重复单元。
在本申请的背光模组中，所述重复单元呈正方形状。
在本申请的背光模组中，多个所述重复单元呈矩阵式排布，所述第三LED芯片邻近设置在所述第四LED芯片的一侧。
在本申请的背光模组中，所述第一LED芯片的发光面积小于所述第四LED芯片的发光面积，所述第四LED芯片的发光面积小于所述第二LED芯片的发光面积，所述第二LED芯片的发光面积小于所述第三LED芯片的发光面积。
在本申请的背光模组中，所述光学膜片结构包括依次设置的第一光学膜层、第二光学膜层和第三光学膜层，所述第一光学膜层设置在所述封框胶上；
所述第一光学膜层为光扩散膜层，所述第二光学膜层为光增亮膜层，所述第三光学膜层为光扩散膜层或为光扩散膜层和光增亮膜层的组合膜层。
本申请还涉及一种显示装置，包括背光模组和设置在所述背光模组上的显示面板，所述背光模组包括：
基板；
Mini LED芯片，用于发光，设置在所述基板上，所述Mini LED芯片之间间隔设置，所述Mini LED芯片包括第一 LED芯片、第二 LED芯片、第三 LED芯片和第四 LED芯片，所述第一 LED芯片发红光，所述第二 LED芯片发绿光，所述第三 LED芯片发蓝光，所述第四 LED芯片发黄光；
封框胶，为透明状，设置在所述基板上并覆盖封装所述Mini LED芯片；以及
光学膜片结构，用于将所述Mini LED芯片发出的光线进行扩散和增亮，设置在所述封框胶上。
在本申请的显示装置中，一所述第一LED芯片、一第二LED芯片、一第三LED芯片和一第四LED芯片两两并排设置构成一重复单元；多个所述重复单元呈矩阵式排布，所述第三LED芯片邻近设置在所述第四LED芯片的一侧。
在本申请的显示装置中，进一步的，所述重复单元呈正方形状。
在本申请的显示装置中，一所述第一LED芯片、一第二LED芯片、一第三LED芯片和一第四LED芯片横向或纵向并排设置构成一重复单元；多个所述重复单元呈矩阵式排布，所述第三LED芯片邻近设置在所述第四LED芯片的一侧。
在本申请的显示装置中，所述第一LED芯片的发光面积小于所述第四LED芯片的发光面积，所述第四LED芯片的发光面积小于所述第二LED芯片的发光面积，所述第二LED芯片的发光面积小于所述第三LED芯片的发光面积。
在本申请的显示装置中，所述光学膜片结构包括依次设置的第一光学膜层、第二光学膜层和第三光学膜层，所述第一光学膜层设置在所述封框胶上；
所述第一光学膜层为光扩散膜层，所述第二光学膜层为光增亮膜层，所述第三光学膜层为光扩散膜层或为光扩散膜层和光增亮膜层的组合膜层。
 有益效果
相较于现有技术的背光模组及显示装置，本申请的背光模组及显示装置通过设置第一/第二/第三和第四LED芯片，节省了在封框胶中掺杂黄色荧光粉的步骤。本申请的透明的封框胶降低了杂光产生的可能性，提高了色彩的饱和度，同时具有切换色彩饱和度的功能。本申请解决了现有的Mini LED面光源发出单种颜色光时容易形成杂光，从而降低该颜色饱和度的技术问题。
 附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面对实施例中所需要使用的附图作简单的介绍。下面描述中的附图仅为本申请的部分实施例，对于本领域普通技术人员而言，在不付出创造性劳动的前提下，还可以根据这些附图获取其他的附图。
图1为现有技术的Mini LED面光源显示装置的结构示意图；
图2为本申请的第一实施例的背光模组的结构示意图；
图3为本申请的第一实施例的背光模组的Mini LED芯片的排布结构示意图；
图4为本申请的第二实施例的背光模组的Mini LED芯片的排布结构示意图；
图5为本申请的实施例的显示装置的Mini LED芯片的排布结构示意图。
 本发明的实施方式
请参照附图中的图式，其中相同的组件符号代表相同的组件。以下的说明是基于所例示的本申请具体实施例，其不应被视为限制本申请未在此详述的其它具体实施例。
请参照图2和图3，图2为本申请的第一实施例的背光模组的结构示意图；图3为本申请的第一实施例的背光模组的Mini（微小） LED芯片的排布结构示意图。本第一实施例的背光模组100，其包括基板11、Mini LED芯片12、封框胶13和光学模组结构14。
Mini LED芯片12用于发光，设置在基板11上。Mini LED芯片12之间间隔设置。Mini LED芯片12包括第一 LED芯片121、第二 LED芯片122、第三 LED芯片123和第四 LED芯片124。第一 LED芯片121发红光。第二 LED芯片122发绿光。第三 LED芯片123发蓝光。第四 LED芯片124发黄光。
封框胶13为透明状，其设置在基板11上并覆盖封装Mini LED芯片12。
光学膜片结构14用于将Mini LED芯片12发出的光线进行扩散和增亮。光学膜片结构14设置在封框胶13上。
本申请的背光模组100通过设置第一/第二/第三和第四LED芯片（121、122、123和124），节省了在封框胶13中掺杂黄色荧光粉的步骤。透明的封框胶13能够避免杂光的产生。
因为在现有技术中，发蓝光的芯片发出蓝光和封框胶中的黄色荧光粉发出的黄光混合，从而产生白光。但是由于封框胶中黄色荧光粉的分布并不均匀，且由于材质的问题，黄色荧光粉还会发出其他颜色的杂光。另外黄色荧光粉发出的黄色光的光量较蓝光小，促使在混光后发出的光线并非纯白色。因此当该背光模组应用于显示装置时，会导致显示装置显示的色彩饱和度偏低。
而在本第一实施例中，封框胶13为透明状，降低了出现杂光的可能。当显示装置需要显示单色时，比如红/绿/蓝/黄，背光模组100可直接激发四种芯片的一种，利用单种芯片直接发光，为显示装置提供光源，提高了单色的色彩饱和度。
当显示装置需要显示多种色彩时，背光模组100中的四种芯片可以不同形式的组合激发，并在混光中发出白光。比如可以激发第三LED芯片123和第四LED芯片124，使蓝光和黄光进行混合形成白光；也可以激发第一LED芯片121、第二LED芯片122和第三LED芯片123，使红光、绿光和蓝光进行混合形成白光。
另外，还可以通过控制不同Mini LED芯片12的发光数量，以达到调节切换色彩饱和度的效果。
在背光模组100的第一实施例中，一第一LED芯片121、一第二LED芯片122、一第三LED芯片123和一第四LED芯片124横向或纵向并排设置构成一重复单元12a。
在本第一实施例中，重复单元12a中的四种LED芯片呈横向排布，排布的顺序依次为第一LED芯片121、第二LED芯片122、第三LED芯片123和第四LED芯片124，也可以是第二LED芯片122、第一LED芯片121、第三LED芯片123和第四LED芯片124，或第四LED芯片124、第三LED芯片123、第一LED芯片121和第二LED芯片122。本第一实施例以第一种排布方式为例进行说明，但并不限于此。
在背光模组100的第一实施例中，多个重复单元12a呈矩阵式排布。第三LED芯片123邻近设置在第四LED芯片124的一侧。矩阵式的排布，使得重复单元12a均匀的排布，提高了出光的均一性。另外，将第三LED芯片123邻近第四LED芯片124设置，使得蓝光和黄光可以快速的进行混光，提高出光效率。同时，将二者靠近设置，便于蓝光和黄光充分混合，形成更为纯粹的白色，提高了显示装置的色彩饱和度。
在背光模组100的第一实施例中，第一LED芯片121的发光面积小于第四LED芯片124的发光面积。第四LED芯片124的发光面积小于第二LED芯片122的发光面积。第二LED芯片122的发光面积小于第三LED芯片123的发光面积。
由于在相同面积的条件下，第一LED芯片121的发光亮度大于第四LED芯片124的发光亮度，第四LED芯片124的发光亮度大于第二LED芯片122的发光亮度，第二LED芯片122的发光亮度大于第三LED芯片123的发光亮度。因此为了提高背光模组100的第一实施例中发光亮度的均一性，将第一LED芯片121的发光面积设置为小于第四LED芯片124的发光面积。第四LED芯片124的发光面积设置为小于第二LED芯片122的发光面积。第二LED芯片122的发光面积设置为小于第三LED芯片123的发光面积。
在背光模组100的第一实施例中，光学膜片结构14包括依次设置的第一光学膜层141、第二光学膜层142和第三光学膜层143。第一光学膜层141设置在封框胶13上。
第一光学膜层141为光扩散膜层。第二光学膜层142为光增亮膜层。第三光学膜层143为光扩散膜层或为光扩散膜层和光增亮膜层的组合膜层。
第一光学膜层141用于将Mini LED芯片12发出的光线进行扩散处理，扩大了光线的发射角度，且在混光时，使得光线的混合更为充分，提高了混光效果。
第二光学膜层142用于将经过扩散处理的光线进行亮度提高处理，以提升背光模组100的发光亮度。
第三光学膜层143用于将增亮后的光线再次进行扩散或者进行扩散和增亮处理，以进一步扩大光线的发光角度和提高混光效果，还可进一步提高整体光源的亮度。
在一些实施例中，第四LED芯片124和第三LED芯片123的出光面为凹面。这样的设置，扩大第三/第四LED芯片的发光角度，提高了混光效果。当然第一/第二LED芯片的出光面也可以是凹面。
可选的，Mini LED芯片的凹面为凹球面，使得扩散的角度更为均衡。
可选的，Mini LED芯片的凹面为凹弧面，以使Mini LED芯片的发出光线大部分向相邻的不同LED芯片的方向扩散，以达到提高混光效果的目的。
请参照图4，图4为本申请的第二实施例的背光模组的Mini LED芯片的排布结构示意图。在第二实施例的背光模组中，本实施例和第一实施例的不同之处在于：一第一LED芯片221、一第二LED芯片222、一第三LED芯片223和一第四LED芯片224两两并排设置构成一重复单元22a。
进一步的，重复单元22a呈正方形状。
这样的设置，缩小了Mini LED芯片之间的距离，提高了混光效果。
请参照图5，图5为本申请的实施例的显示装置的Mini LED芯片的排布结构示意图。本申请还涉及一种显示装置1000，其包括背光模组100和设置在背光模组100上的显示面板200。背光模组100包括基板11、Mini LED芯片12、封框胶13和光学模组结构14。
Mini LED芯片12用于发光，设置在基板11上。Mini LED芯片12之间间隔设置。Mini LED芯片12包括第一 LED芯片121、第二 LED芯片122、第三 LED芯片123和第四 LED芯片124。第一 LED芯片121发红光。第二 LED芯片122发绿光。第三 LED芯片123发蓝光。第四 LED芯片124发黄光。
封框胶13为透明状，其设置在基板11上并覆盖封装Mini LED芯片12。
光学膜片结构14用于将Mini LED芯片12发出的光线进行扩散和增亮。光学膜片结构14设置在封框胶13上。
本申请的背光模组100通过设置第一/第二/第三和第四LED芯片（121、122、123和124），节省了在封框胶13中掺杂黄色荧光粉的步骤。透明的封框胶13能够避免杂光的产生。
在本实施例中，封框胶13为透明状，降低了出现杂光的情况。当显示装置1000需要显示单色时，比如红/绿/蓝/黄，则背光模组100便可直接激发四种芯片的一种，利用单种芯片直接发光，为显示装置提供光源，提高了单色的色彩饱和度。
当显示装置1000需要显示多种色彩时，背光模组100中的四种芯片可以不同形式的组合激发，并在混光中发出白光。比如可以激发第三LED芯片123和第四LED芯片124，使蓝光和黄光进行混合形成白光；也可以激发第一LED芯片121、第二LED芯片122和第三LED芯片123，使红光、绿光和蓝光进行混合形成白光。
另外，还可以通过控制不同Mini LED芯片12的发光数量，以达到调节切换色彩饱和度的效果。
在本实施例中，一第一LED芯片121、一第二LED芯片122、一第三LED芯片123和一第四LED芯片124横向或纵向并排设置构成一重复单元12a。
在本实施例中，重复单元12a中的四种LED芯片呈横向排布，排布的顺序依次为第一LED芯片121、第二LED芯片122、第三LED芯片123和第四LED芯片124，也可以是第二LED芯片122、第一LED芯片121、第三LED芯片123和第四LED芯片124，或第四LED芯片124、第三LED芯片123、第一LED芯片121和第二LED芯片122。本实施例以第一种排布方式为例进行说明，但并不限于此。
在显示装置1000的实施例中，多个重复单元12a呈矩阵式排布。第三LED芯片123邻近设置在第四LED芯片124的一侧。矩阵式的排布，使得重复单元12a均匀的排布，提高了出光的均一性。另外，将第三LED芯片123邻近第四LED芯片124设置，使得蓝光和黄光可以快速的进行混光，提高出光效率，而且将二者靠近设置，便于蓝光和黄光的充分混合，形成更为纯粹的白色。进而提高显示装置的色彩饱和度。
在显示装置1000的实施例中，第一LED芯片121的发光面积小于第四LED芯片124的发光面积。第四LED芯片124的发光面积小于第二LED芯片122的发光面积。第二LED芯片122的发光面积小于第三LED芯片123的发光面积。
由于在相同面积的条件下，第一LED芯片121的发光亮度大于第四LED芯片124的发光亮度，第四LED芯片124的发光亮度大于第二LED芯片122的发光亮度，第二LED芯片122的发光亮度大于第三LED芯片123的发光亮度。因此为了提高背光模组100的第一实施例中发光亮度的均一性，将第一LED芯片121的发光面积设置为小于第四LED芯片124的发光面积。第四LED芯片124的发光面积设置为小于第二LED芯片122的发光面积。第二LED芯片122的发光面积设置为小于第三LED芯片123的发光面积。
显示装置1000的实施例中，光学膜片结构14包括依次设置的第一光学膜层141、第二光学膜层142和第三光学膜层143。第一光学膜层141设置在封框胶13上。
第一光学膜层141为光扩散膜层。第二光学膜层142为光增亮膜层。第三光学膜层143为光扩散膜层或为光扩散膜层和光增亮膜层的组合膜层。
第一光学膜层141用于将Mini LED芯片12发出的光线进行扩散处理，扩大了光线的发射角度，且在混光时，使得光线的混合更为充分，提高了混光效果。
第二光学膜层142用于将经过扩散处理的光线进行亮度提高处理，以提升背光模组100的发光亮度。
第三光学膜层143用于将增亮后的光线再次进行扩散或者进行扩散和增亮处理，以进一步扩大光线的发光角度和提高混光效果，还可进一步提高整体光源的亮度。
在一些实施例中，第四LED芯片和第三LED芯片的出光面为凹面。这样的设置，扩大第三/第四LED芯片的发光角度，提高了混光效果。当然第一/第二LED芯片的出光面也可以是凹面。
可选的，Mini LED芯片的凹面为凹球面，使得扩散的角度更为均衡。
可选的，Mini LED芯片的凹面为凹弧面，以使Mini LED芯片的发出光线大部分向相邻的不同LED芯片的方向扩散，以达到提高混光效果的目的。
相较于现有技术的背光模组及显示装置，本申请的背光模组及显示装置通过设置第一/第二/第三和第四LED芯片，节省了在封框胶中掺杂黄色荧光粉的步骤。本申请的透明的封框胶降低了杂光产生的可能性，提高了色彩的饱和度，同时具有切换色彩饱和度的功能。本申请解决了现有的Mini LED面光源发出单种颜色光时容易形成杂光，从而降低该颜色饱和度的技术问题。
以上所述，对于本领域的普通技术人员来说，可以根据本申请的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本申请后附的权利要求的保护范围。

Claims (18)

  1. 一种背光模组，其包括：
    基板；
    Mini LED芯片，用于发光，设置在所述基板上，所述Mini LED芯片间隔设置，所述Mini LED芯片包括第一 LED芯片、第二 LED芯片、第三 LED芯片和第四 LED芯片，所述第一 LED芯片发红光，所述第二 LED芯片发绿光，所述第三 LED芯片发蓝光，所述第四 LED芯片发黄光；
    封框胶，为透明状，设置在所述基板上并覆盖封装所述Mini LED芯片；以及
    光学膜片结构，用于将所述Mini LED芯片发出的光线进行扩散和增亮，设置在所述封框胶上；
    所述一第一LED芯片、一第二LED芯片、一第三LED芯片和一第四LED芯片横向或纵向并排设置构成一重复单元；
    所述光学膜片结构包括依次设置的第一光学膜层、第二光学膜层和第三光学膜层，所述第一光学膜层设置在所述封框胶上；
    所述第一光学膜层为光扩散膜层，所述第二光学膜层为光增亮膜层，所述第三光学膜层为光扩散膜层或为光扩散膜层和光增亮膜层的组合膜层。
  2. 根据权利要求1所述的背光模组，其中，多个所述重复单元呈矩阵式排布，所述第三LED芯片设置在邻近所述第四LED芯片的一侧。
  3. 根据权利要求2所述的背光模组，其中，所述第一LED芯片的发光面积小于所述第四LED芯片的发光面积，所述第四LED芯片的发光面积小于所述第二LED芯片的发光面积，所述第二LED芯片的发光面积小于所述第三LED芯片的发光面积。
  4. 一种背光模组，其包括：
    基板；
    Mini LED芯片，用于发光，设置在所述基板上，所述Mini LED芯片之间间隔设置，所述Mini LED芯片包括第一 LED芯片、第二 LED芯片、第三 LED芯片和第四 LED芯片，所述第一 LED芯片发红光，所述第二 LED芯片发绿光，所述第三 LED芯片发蓝光，所述第四 LED芯片发黄光；
    封框胶，为透明状，设置在所述基板上并覆盖封装所述Mini LED芯片；以及
    光学膜片结构，用于将所述Mini LED芯片发出的光线进行扩散和增亮，设置在所述封框胶上。
  5. 根据权利要求4所述的背光模组，其中，一所述第一LED芯片、一第二LED芯片、一第三LED芯片和一第四LED芯片横向或纵向并排设置构成一重复单元。
  6. 根据权利要求4所述的背光模组，其中，一所述第一LED芯片、一第二LED芯片、一第三LED芯片和一第四LED芯片两两并排设置构成一重复单元。
  7. 根据权利要求5所述的背光模组，其中，多个所述重复单元呈矩阵式排布，所述第三LED芯片邻近设置在所述第四LED芯片的一侧。
  8. 根据权利要求6所述的背光模组，其中，多个所述重复单元呈矩阵式排布，所述第三LED芯片邻近设置在所述第四LED芯片的一侧。
  9. 根据权利要求7所述的背光模组，其中，所述第一LED芯片的发光面积小于所述第四LED芯片的发光面积，所述第四LED芯片的发光面积小于所述第二LED芯片的发光面积，所述第二LED芯片的发光面积小于所述第三LED芯片的发光面积。
  10. 根据权利要求6所述的背光模组，其中，所述重复单元呈正方形状。
  11. 根据权利要求4所述的背光模组，其中，所述光学膜片结构包括依次设置的第一光学膜层、第二光学膜层和第三光学膜层，所述第一光学膜层设置在所述封框胶上；
    所述第一光学膜层为光扩散膜层，所述第二光学膜层为光增亮膜层，所述第三光学膜层为光扩散膜层或为光扩散膜层和光增亮膜层的组合膜层。
  12. 一种显示装置，包括背光模组和设置在所述背光模组上的显示面板，其中，所述背光模组包括：
    基板；
    Mini LED芯片，用于发光，设置在所述基板上，所述Mini LED芯片之间间隔设置，所述Mini LED芯片包括第一 LED芯片、第二 LED芯片、第三 LED芯片和第四 LED芯片，所述第一 LED芯片发红光，所述第二 LED芯片发绿光，所述第三 LED芯片发蓝光，所述第四 LED芯片发黄光；
    封框胶，为透明状，设置在所述基板上并覆盖封装所述Mini LED芯片；以及
    光学膜片结构，用于将所述Mini LED芯片发出的光线进行扩散和增亮，设置在所述封框胶上。
  13. 根据权利要求12所述的显示装置，其中，一所述第一LED芯片、一第二LED芯片、一第三LED芯片和一第四LED芯片两两并排设置构成一重复单元；多个所述重复单元呈矩阵式排布，所述第三LED芯片邻近设置在所述第四LED芯片的一侧。
  14. 根据权利要求13所述的显示装置，其中，所述第一LED芯片的发光面积小于所述第四LED芯片的发光面积，所述第四LED芯片的发光面积小于所述第二LED芯片的发光面积，所述第二LED芯片的发光面积小于所述第三LED芯片的发光面积。
  15. 根据权利要求13所述的显示装置，其中，所述重复单元呈正方形状。
  16. 根据权利要求12所述的显示装置，其中，一所述第一LED芯片、一第二LED芯片、一第三LED芯片和一第四LED芯片横向或纵向并排设置构成一重复单元；多个所述重复单元呈矩阵式排布，所述第三LED芯片邻近设置在所述第四LED芯片的一侧。
  17. 根据权利要求16所述的显示装置，其中，所述第一LED芯片的发光面积小于所述第四LED芯片的发光面积，所述第四LED芯片的发光面积小于所述第二LED芯片的发光面积，所述第二LED芯片的发光面积小于所述第三LED芯片的发光面积。
  18. 根据权利要求12所述的显示装置，其中，所述光学膜片结构包括依次设置的第一光学膜层、第二光学膜层和第三光学膜层，所述第一光学膜层设置在所述封框胶上；
    所述第一光学膜层为光扩散膜层，所述第二光学膜层为光增亮膜层，所述第三光学膜层为光扩散膜层或为光扩散膜层和光增亮膜层的组合膜层。
PCT/CN2019/080052 2018-12-28 2019-03-28 背光模组及显示装置 Ceased WO2020133770A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US16/472,982 US11320581B2 (en) 2018-12-28 2019-03-28 Backlight module and display device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201811617722.6 2018-12-28
CN201811617722.6A CN109616011B (zh) 2018-12-28 2018-12-28 背光模组及显示装置

Publications (1)

Publication Number Publication Date
WO2020133770A1 true WO2020133770A1 (zh) 2020-07-02

Family

ID=66011604

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/080052 Ceased WO2020133770A1 (zh) 2018-12-28 2019-03-28 背光模组及显示装置

Country Status (3)

Country Link
US (1) US11320581B2 (zh)
CN (1) CN109616011B (zh)
WO (1) WO2020133770A1 (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110465883B (zh) * 2019-07-23 2021-09-14 康佳集团股份有限公司 一种led芯片的研磨结构、研磨方法及led芯片
CN210666266U (zh) * 2019-08-20 2020-06-02 海信视像科技股份有限公司 一种显示装置及背光模组
CN113625489B (zh) * 2019-09-20 2024-08-13 海信视像科技股份有限公司 一种显示装置
CN110806656A (zh) * 2019-10-29 2020-02-18 武汉华星光电技术有限公司 背光模组、显示装置
CN111505868A (zh) * 2020-05-11 2020-08-07 Tcl华星光电技术有限公司 背光模组和显示面板
US11221518B2 (en) 2020-05-20 2022-01-11 Tcl China Star Optoelectronics Technology Co., Ltd. Backlight module and display panel
CN112599512A (zh) * 2020-12-29 2021-04-02 南京工业大学 一种Mini LED背光模组及背光源
CN113655660A (zh) * 2021-08-18 2021-11-16 惠州视维新技术有限公司 背光模组、显示屏和背光模组的制作方法
CN113671754A (zh) * 2021-08-26 2021-11-19 苏州东山精密制造股份有限公司 一种带有蓝光裸晶片可实现蓝白光转换的Mini LED灯板及其加工工艺
CN113725346A (zh) * 2021-08-30 2021-11-30 广东晶科电子股份有限公司 Mini LED背光源、背光模组及其制作方法
TWI880062B (zh) * 2022-01-11 2025-04-11 隆達電子股份有限公司 無機發光二極體顯示器
CN114446941A (zh) * 2022-01-18 2022-05-06 广州华星光电半导体显示技术有限公司 发光器件及显示装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1755906A (zh) * 2004-09-28 2006-04-05 相互股份有限公司 适用集成电路及发光二极管的封装方法
CN102804243A (zh) * 2010-03-15 2012-11-28 夏普株式会社 显示设备和电视接收器
US20140176866A1 (en) * 2012-12-21 2014-06-26 Hon Hai Precision Industry Co., Ltd. Led device and liquid crystal display device
CN108445675A (zh) * 2018-03-27 2018-08-24 武汉华星光电技术有限公司 背光模组及显示装置
CN207883228U (zh) * 2017-12-29 2018-09-18 西安智盛锐芯半导体科技有限公司 基于四色led芯片的虚拟led显示模组

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011102185A1 (ja) * 2010-02-17 2011-08-25 シャープ株式会社 光源ユニット、照明装置、表示装置、テレビ受信装置
US8684547B2 (en) * 2010-08-18 2014-04-01 Lg Innotek Co., Ltd. Backlight unit and display apparatus using the same
CN102478187A (zh) * 2010-11-24 2012-05-30 宏腾光电股份有限公司 显示器背光模块与其制造方法
TWI526737B (zh) 2011-10-04 2016-03-21 友達光電股份有限公司 藍相液晶顯示裝置
CN102751275B (zh) * 2012-07-19 2015-02-04 广东威创视讯科技股份有限公司 一种发光二极管显示屏,及其制造方法
CN203967121U (zh) * 2014-06-26 2014-11-26 Tcl光电科技(惠州)有限公司 Led灯、背光模组与液晶显示装置
CN104633551A (zh) 2015-03-03 2015-05-20 深圳市华星光电技术有限公司 白光led、背光模块及液晶显示装置
TWI603507B (zh) * 2016-03-11 2017-10-21 柏友照明科技股份有限公司 混光式多晶片封裝結構
US10459289B2 (en) * 2016-11-02 2019-10-29 Innolux Corporation Display device
US10429569B2 (en) * 2017-03-30 2019-10-01 Innolux Corporation Display device
CN107219679A (zh) * 2017-05-22 2017-09-29 深圳市英唐光显技术有限公司 一种led液晶显示器的背光模组
CN109658817A (zh) * 2017-10-10 2019-04-19 群创光电股份有限公司 显示装置
CN108181763B (zh) * 2017-12-29 2023-05-26 深圳市莹狐科技有限公司 背光模组及液晶显示装置
US10824008B2 (en) * 2018-03-27 2020-11-03 Wuhan China Star Optoelectronics Technology Co., Ltd. Backlight module and display device
US20190331964A1 (en) 2018-04-25 2019-10-31 Wuhan China Star Optoelectronics Technology Co., Ltd. Backlight surface light source and liquid crystal display device
CN108563069B (zh) * 2018-04-25 2020-10-30 武汉华星光电技术有限公司 背光面光源及液晶显示装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1755906A (zh) * 2004-09-28 2006-04-05 相互股份有限公司 适用集成电路及发光二极管的封装方法
CN102804243A (zh) * 2010-03-15 2012-11-28 夏普株式会社 显示设备和电视接收器
US20140176866A1 (en) * 2012-12-21 2014-06-26 Hon Hai Precision Industry Co., Ltd. Led device and liquid crystal display device
CN207883228U (zh) * 2017-12-29 2018-09-18 西安智盛锐芯半导体科技有限公司 基于四色led芯片的虚拟led显示模组
CN108445675A (zh) * 2018-03-27 2018-08-24 武汉华星光电技术有限公司 背光模组及显示装置

Also Published As

Publication number Publication date
CN109616011B (zh) 2020-10-13
CN109616011A (zh) 2019-04-12
US20210356650A1 (en) 2021-11-18
US11320581B2 (en) 2022-05-03

Similar Documents

Publication Publication Date Title
WO2020133770A1 (zh) 背光模组及显示装置
US9893252B2 (en) White LED, backlight module and liquid crystal display device
US8109650B2 (en) Illuminant system using high color temperature light emitting diode and manufacture method thereof
CN101937911B (zh) 发光二极管封装构造及背光模块
CN104483778B (zh) 发光装置、背光模组及液晶显示装置
WO2016033848A1 (zh) 背光模组
WO2021227098A1 (zh) 背光模组和显示面板
JP2006108076A (ja) バックライトモジュール
KR20060006727A (ko) 발광 다이오드 및 발광 다이오드를 구비하는 백라이트 모듈
JP5460665B2 (ja) 発光ダイオードパッケージ
KR20090021912A (ko) 백라이트 유닛 및 이를 구비한 액정표시장치
US20210311363A1 (en) Backlight module, display device, method for driving display device, electronic apparatus, and computer-readable storage medium
US20180231830A1 (en) Array substrate and method of manufacturing the same, and display device
CN106990613A (zh) 一种背光源
WO2017156902A1 (zh) 量子点背光模组及液晶电视
CN207799291U (zh) 一种高色域发光模组
CN106501994A (zh) 一种量子点发光器件、背光模组及显示装置
US20120014091A1 (en) Led package assembly and backlight module
CN105700240A (zh) 一种背光模组及背光色温调节方法、显示装置
CN110456560A (zh) 一种显示面板及其显示装置
CN114171508A (zh) 拼接屏及其制备方法和显示装置
CN104793397B (zh) 液晶显示模组及液晶显示装置
KR20120133552A (ko) 백라이트 장치 및 이를 포함하는 디스플레이 장치
WO2017000323A1 (zh) 背光模组和液晶显示器
CN101294664A (zh) 高色温发光二极管光源系统及其制造方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19901895

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19901895

Country of ref document: EP

Kind code of ref document: A1