WO2020129145A1

WO2020129145A1 - Plating apparatus and plating method

Info

Publication number: WO2020129145A1
Application number: PCT/JP2018/046486
Authority: WO
Inventors: 誠高徳; 哲朗江田; 村山　隆史
Original assignee: 株式会社Ｊｃｕ
Priority date: 2018-12-18
Filing date: 2018-12-18
Publication date: 2020-06-25
Also published as: JPWO2020129145A1; TW202024402A; CN113015824A; KR20210103460A

Abstract

[Problem] To provide a plating apparatus and plating method whereby plating treatment can be satisfactorily performed even when a long sheet as the material to be plated has a large electrical resistance, and also whereby adhesion of a metal thin film of copper or the like to the surface of the long sheet is enhanced, and a long sheet is obtained that is provided with a high-quality plating treatment and on which a nickel metal coating is formed. [Solution] A plating apparatus 10 for continuously conveying a long sheet 18 as a material to be plated between an unwinding-side roll 12 and a winding-side roll 14 via a hollow cathode roll 16, and supplying electricity to the long sheet 18 from the cathode roll 16 while conveying the long sheet 18 through a plating tank 24 in which an anode 22 submerged in a plating liquid 20 is provided, thereby performing an electroplating treatment on the long sheet 18, is furthermore configured so that the cathode roll 16 is provided upstream from the plating tank 24 in the conveyance direction of the long sheet 18, and so that the distance of the cathode roll 16 from an upstream-side entrance of the plating tank 24 is in the range of 150 mm or less.

Description

Plating apparatus and plating method

TECHNICAL FIELD The present invention relates to a plating apparatus for performing electrolytic plating while transporting a long sheet material, which is a material to be plated, in a predetermined treatment liquid, and a plating method using the plating apparatus, and particularly to a long sheet. A plating apparatus and a plating method using the plating apparatus capable of performing suitable electrolytic plating even when the electric resistance of the material is large.

Conventionally, a plating apparatus and a plating method for supplying electric power to a long sheet material by bringing it into contact with a power supply roll to perform electrolytic plating treatment on the long sheet material have been known. For example, in the technologies of Patent Document 1 and Patent Document 2, the material to be plated is transferred from an air-powered roll provided in front of the plating tank in the transfer direction with respect to the material to be plated in the plating solution in the plating tank. It is to feed electricity in the direction along the direction and perform electrolytic plating.

Further, as a conventional example, as in the plating apparatus shown in FIG. 6, a long sheet, which is a material to be plated, is placed between the unwinding side roll (not shown) and the winding side roll (not shown) in the air. It is said that when the long sheet is conveyed through the cathode roll 54 and passes through each of the plating tanks 50 provided in plural, the cathode roll 54 supplies power to the long sheet to perform electrolytic plating treatment. There is something.

This plating apparatus is provided with a transport roll and a cathode roll 54, each of which has a rotation axis extending in a direction perpendicular to the transport direction of the long sheet, while contacting the surface of the long sheet. The long sheet is conveyed in the conveying direction. Further, in this plating apparatus, each cathode roll 54 is connected to one conductor rod 52 (cathode) connected to a rectifier, and each anode 56 is connected to each corresponding rectifier.

JP-A-53-87941 JP-A-63-183192

However, it has been pointed out that the technologies disclosed in Patent Documents 1 and 2 above tend to cause defective plating when the electrical resistance of the material to be plated is large (for example, International Publication WO2016/143714). Further, since the conventional plating apparatus has a structure in which the cathode roll 54 is connected to one conductive rod 52 (cathode) in each plating tank, the electricity sent from each rectifier to the anode of each plating tank is However, the resistance on the downstream side tends to flow toward the lower side, and an electric bias is generated, and, for example, a problem arises in the adhesion of the metal thin film such as copper to the long sheet on which the nickel metal film is formed.

The present invention is for solving the above-mentioned problems. Even when the long sheet that is the material to be plated has a large electric resistance, it is possible to perform a suitable plating treatment, and further, to the surface of the long sheet. It is an object of the present invention to provide a plating apparatus and a plating method capable of improving the adhesion of a metal thin film such as copper and obtaining a long sheet having a nickel or nickel alloy film subjected to high-quality plating treatment.

According to the present invention, between the unwinding side roll and the winding side roll, the long sheet which is the material to be plated is maintained and conveyed via the cathode roll which is supported, and the long sheet is plated. Electrolytic plating treatment is performed on the long sheet by feeding power from the cathode roll to the long sheet while transporting in a plating tank in which an anode is provided in a state of being immersed in the liquid. A plating apparatus, wherein two or more plating tanks are provided, and each plating tank is provided with a power supply connected to the return wiring of the cathode roll and the anode. A device is provided.

According to the present invention, even if the electric resistance of the material to be plated is high, the plating process can be suitably performed. Further, the adhesion of the metal thin film to the surface of the long sheet on which the nickel or nickel alloy film is formed can be improved. Furthermore, it is possible to obtain a material to be plated that has been subjected to high-quality plating treatment.

Preferably, the cathode roll is provided on the upstream side in the long sheet transport direction with respect to the plating bath, and the distance from the upstream inlet of the plating bath is 150 mm or less. It is a plating device. Preferably, the cathode roll is a plating device having elasticity.

Preferably, the cathode roll supplies power to the long sheet in a predetermined range at both ends thereof. Preferably, the plating apparatus is provided with a pressing mechanism that increases the contact area between the long sheet and the cathode roll by pressing the long sheet against the cathode roll. Further, preferably, the pressing mechanism has a pressing roll for pressing the elongated sheet against the cathode roll, and the pressing roll is an elastic plating apparatus.

Preferably, the cathode roll is a plating apparatus that rotates with the conveyance of the long sheet due to resistance with the long sheet without giving a rotational driving force.

Further, preferably, a plating method is used in which a long sheet having a seed layer having a sheet resistance value of 1 Ω/sq or more is plated using the plating apparatus of the present invention. Preferably, it is a plating method in which a long sheet having a nickel or nickel alloy film with a thickness of 200 nm or less is plated using the plating apparatus of the present invention.

It is a front simplified view showing an embodiment of a plating apparatus according to the present invention. 1 is a view showing an embodiment of a plating apparatus according to the present invention, (a) is a simplified front view showing a structure including a cathode roll and the like in the vicinity of a plating tank for performing a copper strike plating treatment, (b) is a post-process FIG. 3 is a simplified front view showing a structure including a cathode roll and the like in the vicinity of a plating tank for performing the copper plating treatment of FIG. It is the plane simple figure which showed the cathode roll in embodiment of the plating apparatus which concerns on this invention. In the figure showing the appearance state of pinholes when electricity is supplied by the cathode roll, (a) is the appearance state of pinholes when electricity is supplied by a general cathode roll, (b) is the implementation of the plating apparatus according to the present invention. FIG. 3 shows the appearance of pinholes when power is supplied by the cathode roll in the embodiment. It is another front view of the plating apparatus which concerns on this invention, Comprising: It is the front simple figure which showed the structure containing the cathode roll of the plating tank vicinity which performs a copper strike plating process. It is the plane simple figure which showed the conventional plating apparatus.

Embodiments of a plating apparatus and a plating method according to the present invention will be described with reference to the drawings. FIG. 1 is a schematic front view showing an embodiment of a plating apparatus according to the present invention. FIG. 2 is a view showing an embodiment of a plating apparatus according to the present invention, (a) is a simplified front view showing a structure including a cathode roll and the like in the vicinity of a plating tank for performing a copper strike plating treatment, (b) [FIG. 4] is a simplified front view showing a structure including a cathode roll and the like in the vicinity of a plating tank for performing a copper plating treatment in a subsequent step.

FIG. 3 is a simplified plan view showing the cathode roll in the embodiment of the plating apparatus according to the present invention. Further, FIG. 4 is a diagram showing the appearance of pinholes when electricity is supplied by a cathode roll, (a) is the appearance of pinholes when electricity is supplied by a general cathode roll, and (b) is the present invention. FIG. 6 is a diagram showing the appearance of pinholes when power is supplied from the cathode roll in the embodiment of the plating apparatus according to FIG. Further, FIG. 5 shows another embodiment of the plating apparatus according to the present invention, and is a simplified front view showing a structure including a cathode roll and the like in the vicinity of a plating tank for performing a copper strike plating treatment.

And about the code|symbol, 10 is a plating device, 12 is an unwinding side roll, 14 is a winding side roll, 16 is a cathode roll, 18 is a long sheet, 20 is a plating solution, 22 is an anode, 24 is a plating tank. (Strike), 26 is a power source, 28 is a power supply range, 30 is a pressing mechanism, 32 is a drive type cathode roll, 34 is a post-process plating tank, 50 is a plating tank, 52 is a conductive rod, 54 is a cathode roll, and 56 is an anode 58 is a cylinder, and 60 is a pressing roll.

First, as shown in FIG. 1, the plating apparatus 10 according to the present embodiment has a long shape, which is a material to be plated, between the unwinding side roll 12 and the winding side roll 14 via a cathode roll 16 supported by a bearing. While the sheet 18 is maintained and conveyed, the elongated sheet 18 is conveyed in the plating tank (strike) 24 in which the anode 22 is provided in a state of being immersed in the plating solution 20, while the elongated sheet 18 is extended from the cathode roll 16. Electric power is supplied to the sheet 18 to perform electrolytic plating on the long sheet 18. Further, the cathode roll 16 conveys the long sheet 18 to the plating tank (strike) 24. The distance from the inlet on the upstream side of the plating tank (strike) 24 in the direction is 150 mm or less.

Next, the present embodiment will be described in detail. In the present embodiment, by electroless plating, nickel or nickel alloy film that is a conductive metal is plated in advance on the surface of a long-sized material to be plated, and a nickel or nickel alloy film as a conductive metal seed layer is formed. The generated long sheet 18 is prepared. In the electroless nickel plating treatment or the electroless nickel alloy plating treatment, a seed layer made of conductive nickel or nickel alloy having a thickness of about 10 to 300 nm is generally formed. Preferably. Further, the seed layer preferably has a sheet resistance value of 1 Ω/sq or more.

Next, the plating apparatus 10 in the present embodiment conveys the long sheet 18 via the cathode roll 16 which is horizontally supported between the unwinding side roll 12 and the winding side roll 14. .. When performing the copper strike plating treatment on the long sheet 18, the long sheet 18 is conveyed into the plating tank (strike) 24 in which the anode 22 is provided while being immersed in the plating solution 20. While doing so, the cathode roll 16 supplies power to the long sheet 18.

By doing so, copper strike plating treatment (electrolytic plating treatment) can be applied to the long sheet 18. In the plating apparatus 10 according to the present embodiment, as shown in FIG. 1, the cathode roll 16 is located upstream of the plating tank (strike) 24 in the transport direction of the long sheet 18, and the plating tank ( The distance from the upstream inlet of the strike 24 is set in the range of 150 mm or less (more preferably in the range of 50 mm to 120 mm).

In the configuration of a general plating apparatus, the cathode roll in the strike plating process is installed at a position of about 200 mm to 300 mm before the plating tank in view of workability and maintainability. If the setting is within a range of 150 mm or less (more preferably within a range of 50 mm to 120 mm), since the distance from the plating tank is shorter than usual, the long sheet 18 having a nickel metal film with high resistance is formed. Also, appropriate power supply can be performed. Moreover, it is not necessary to increase the power supply.

[Correction under Rule 91 20.01.2020]
The cathode roll 32 in the plating process (the range of Cu plating in FIG. 1) which is a post-process of this embodiment is installed at a position of about 200 mm before the plating tank 34. This is because it is not necessary to shorten the distance between the cathode roll 32 and the plating tank 34 because the resistance of the elongated sheet 18 on which the nickel metal film has been formed is reduced by the strike plating process in the previous step. is there. It should be noted that the configuration in the plating process in the subsequent step does not limit the present invention at all.

Further, in this embodiment, as shown in FIG. 1, two or more plating tanks (strikes) 24 are provided, and two or more post-process plating tanks 34 are also provided. Then, a power source 26 is arranged for each plating tank (strike) 24, and the return wiring of the cathode roll 16 and the anode 22 are connected. Further, a power source is arranged for each of the post-process plating baths 34, and the return wiring of the drive type cathode roll 32 and the anode are connected, but they are omitted in this figure. In the figure, the upstream cathode roll 16 of the two cathode rolls 16 is shown not to be connected to the power source 26, but it goes without saying that it is actually connected.

In the conventional plating apparatus, as shown in FIG. 6, the return wiring of the cathode roll 54 corresponding to each plating tank 50 is connected to one conductive rod 52 connected to an external rectifier (not shown). And each anode 56 is connected to a corresponding rectifier, respectively. In the case of such a configuration, the electricity sent from each rectifier to each anode 56 easily flows toward the lower resistance side on the downstream side, and the electricity is unevenly distributed, so that a nickel metal film is formed upstream. Various problems occur in the adhesion of copper to a long sheet.

On the other hand, as in the present embodiment, each plating tank (strike) 24 and the post-process plating tank 34 are individually connected to the return wiring of the cathode roll 16 and the anode 22 to each power supply 26. As a result, there is no bias in electricity, suitable power supply is possible, and the adhesion of copper to the elongated sheet 18 having the nickel metal film formed thereon is improved.

Next, as shown in FIG. 5, the plating apparatus 10 according to the present embodiment presses the long sheet 18 against the cathode roll 16 from above and below, respectively. A pressing mechanism 30 that increases the contact area of the cathode roll 16 is provided. By increasing the contact area between the long sheet 18 and the cathode roll 16, it is possible to more favorably supply power from the cathode roll 16.

More specifically, the pressing mechanism 30 includes a cylinder 58 and a pressing roll 60. In the cathode roll 16 on the upstream side, the long sheet 18 is pressed against the cathode roll 16 by the pressing roll 60 from above. The cylinder 58 is driven. Further, in the cathode roll 16 on the downstream side, the cylinder 58 is driven so that the long sheet 18 is pressed from the lower side to the cathode roll 16 by the pressing roll 60. Further, by providing the cathode roll 16 with elasticity, the contact area between the elongated sheet 18 and the cathode roll 16 can be increased, and the long sheet due to foreign matter trapping or rubbing during pressing can be obtained. The occurrence of scratches on the sheet 18 can be suppressed. Further, it is preferable that the pressing roll 60 also has elasticity.

Next, as shown in FIG. 2A, the plating apparatus 10 according to the present embodiment does not apply a rotational driving force to the cathode roll 16 and, due to the frictional resistance between the cathode roll 16 and the long sheet 18, The mechanism is such that it rotates as the long sheet 18 is conveyed. With such a configuration, even if the long thin sheet 18 is extremely thin, it is extremely unlikely that a defect occurs in the seed layer or the underlying metal film of the long sheet 18 during conveyance. In addition, in the plating process of the subsequent step of the present embodiment, as shown in FIG. 2B, a rotational driving force is applied to the drive-type cathode roll 32, which becomes one of the conveyance power of the long sheet 18. There is. It should be noted that the configuration in the plating process in the subsequent step does not limit the present invention at all.

Then, as shown in FIG. 3, the plating apparatus 10 in the present embodiment is configured such that the cathode roll 16 supplies power to the long sheet 18 in a predetermined range (power supply range 28) at both ends. There is. In a typical roll plating apparatus, sparks are generated when the long sheet separates from the cathode roll that is mostly configured in the power supply range, and many pinholes are generated on the surface of the long sheet. Resulting in.

However, as in the present embodiment, if power is supplied to the long sheet 18 only within a predetermined range (power supply range 28) at both ends, the spark is generated in an important portion of the long sheet 18. As a result, high quality long sheet 18 can be plated. In addition, in this embodiment, each of the power supply ranges 28 is a range of about 10 mm from the end. For reference, FIG. 4A shows the state of pinholes generated on the surface of the long sheet in the general roll plating apparatus, and FIG. 4B shows the surface of the long sheet in the plating apparatus of the present embodiment. The state of the pinhole that occurred in is shown below.

10 Plating Apparatus 12 Unwinding Side Roll 14 Winding Side Roll 16 Cathode Roll 18 Long Sheet 20 Plating Solution 22 Anode 24 Plating Tank (Strike)
26 Power Supply 28 Power Supply Range 30 Pressing Mechanism 32 Driven Cathode Roll 34 Post-Process Plating Tank 50 Plating Tank 52 Conductive Rod 54 Cathode Roll 56 Anode 58 Cylinder 60 Pressing Roll

Claims

A state in which the long sheet which is the material to be plated is maintained and conveyed between the unwinding side roll and the winding side roll via the cathode roll which is supported, and the long sheet is immersed in the plating solution. While being transported in the plating tank in which the anode is provided, by supplying power to the long sheet from the cathode roll, a plating apparatus for performing electrolytic plating treatment on the long sheet,
The plating apparatus is provided with two or more plating tanks, and each plating tank is provided with a power supply connected to the return wiring of the cathode roll and the anode.
The cathode roll is provided on the upstream side in the long sheet transport direction with respect to the plating tank, and the distance from the upstream inlet of the plating tank is provided within a range of 150 mm or less. The plating apparatus according to claim 1.
The plating apparatus according to claim 1 or 2, wherein the cathode roll has elasticity.
The plating apparatus according to any one of claims 1 to 3, wherein the cathode roll supplies electric power to the long sheet in a predetermined range at both ends thereof.
The pressing mechanism for increasing the contact area between the elongated sheet and the cathode roll by pressing the elongated sheet against the cathode roll is provided. The plating apparatus according to item 1.
6. The cathode roll rotates with the conveyance of the long sheet due to frictional resistance with the long sheet without applying a rotational driving force. The plating apparatus according to item 1.
Using the plating apparatus according to any one of claims 1 to 6, plating is performed on a long sheet on which a seed layer having a sheet resistance value of 1 Ω/sq or more is formed. Method.
A plating method, which comprises using the plating apparatus according to any one of claims 1 to 6 to perform plating treatment on a long sheet having a nickel or nickel alloy film of 200 nm or less formed thereon.