WO2020124833A1 - 。用于显示面板的接合装置以及显示面板的接合方法 - Google Patents

。用于显示面板的接合装置以及显示面板的接合方法 Download PDF

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Publication number
WO2020124833A1
WO2020124833A1 PCT/CN2019/078900 CN2019078900W WO2020124833A1 WO 2020124833 A1 WO2020124833 A1 WO 2020124833A1 CN 2019078900 W CN2019078900 W CN 2019078900W WO 2020124833 A1 WO2020124833 A1 WO 2020124833A1
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Prior art keywords
display panel
bonding
supporting
carrier
platform
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PCT/CN2019/078900
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English (en)
French (fr)
Inventor
张定伟
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to US16/472,909 priority Critical patent/US20200201086A1/en
Publication of WO2020124833A1 publication Critical patent/WO2020124833A1/zh
Anticipated expiration legal-status Critical
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303Apparatus specially adapted to the manufacture of LCDs

Definitions

  • the present disclosure relates to the field of display technology, and in particular, to a bonding apparatus for a display panel and a bonding method of a display panel.
  • the support table and the carrier are independent mechanisms, and the current bonding process, the operation process is as follows: the panel is placed on the support table by the mechanical arm, and then the support table moves to the bonding area (the carrier) Directly above), and then lowered to the bearing seat, the indenter lowered to press the panel. Because the height position of the support table may change with the operation or the switch model, there are the following risks during the operation:
  • Integrated circuit (IC) bonding the height of the support table is too low or too high (at the level of 100 ⁇ m), causing the panel to hang or buckle, and the panel may be damaged when the indenter is pressed down.
  • Chip on film COF
  • flexible circuit board flexible printed circuit, FPC
  • FPC flexible printed circuit
  • the support table and the bearing base are independent mechanisms, and the current bonding process has the following risks:
  • Integrated circuit (IC) bonding the height of the support table is too low or too high (at the level of 100 ⁇ m), causing the panel to hang or buckle, and the panel may be damaged when the indenter is pressed down.
  • Chip on film COF
  • flexible circuit board flexible printed circuit, FPC
  • FPC flexible printed circuit
  • the joining device includes a support table and a bearing seat.
  • the bearing seat is integrated on the support platform.
  • the first surface of the supporting platform and the first surface of the supporting base are used to carry the display panel and are located on the same horizontal plane.
  • the second surface of the bearing base is disposed on the second surface of the support platform.
  • the second surface of the support platform and the second surface of the carrier are on the same horizontal plane.
  • the distance between the first surface of the support table and the second surface of the support table is equal to the height of the carrier.
  • the relative positions of the support platform and the bearing base are fixed.
  • the joining device further includes an indenter disposed above the support platform and the bearing seat, and the load-bearing capacity of the support platform is greater than the pressing pressure of the indenter, The bearing capacity of the bearing seat is greater than the pressing pressure of the indenter.
  • the joining device further includes a vacuum suction device, which is disposed on one end of the carrier.
  • the present disclosure also provides a bonding device for a display panel.
  • the joining device includes a support table and a bearing seat.
  • the bearing seat is integrated on the support platform.
  • the first surface of the supporting platform and the first surface of the supporting base are used to carry the display panel and are located on the same horizontal plane.
  • the second surface of the supporting base is disposed on the second surface of the supporting base, and the second surface of the supporting base and the second surface of the supporting base are located On the same level.
  • the distance between the first surface of the support platform and the second surface of the support platform is equal to the height of the carrier.
  • the relative positions of the supporting platform and the bearing base are fixed.
  • the joining device further includes a pressure head disposed above the support platform and the carrier.
  • the bearing capacity of the support platform is greater than the pressing pressure of the indenter.
  • the bearing capacity of the bearing base is greater than the pressing pressure of the indenter.
  • the joining device further includes a vacuum suction device, which is disposed on one end of the carrier.
  • the present disclosure also provides a bonding method of the display panel.
  • the display panel bonding method includes bonding the display panel using a bonding device for the display panel.
  • the joining device includes a support table and a bearing seat.
  • the bearing seat is integrated on the support platform.
  • the first surface of the supporting platform and the first surface of the supporting base are used to carry the display panel and are located on the same horizontal plane.
  • the method for joining display panels further includes placing the display panel on the first surface of the support platform and the first surface of the carrier, Moving the bearing base carrying the display panel to just below the pressing head, and pressing the display panel placed on the first surface of the bearing base with the pressing head.
  • the second surface of the supporting base is disposed on the second surface of the supporting base, and the second surface of the supporting base and the second surface of the supporting base are located On the same level.
  • the distance between the first surface of the support platform and the second surface of the support platform is equal to the height of the carrier.
  • the relative positions of the supporting platform and the bearing base are fixed.
  • the joining device further includes a pressure head disposed above the support platform and the carrier.
  • the bearing capacity of the support platform is greater than the pressing pressure of the indenter.
  • the bearing capacity of the bearing base is greater than the pressing pressure of the indenter.
  • the joining device further includes a vacuum suction device, which is disposed on one end of the carrier.
  • the carrier is integrated on the support platform, and the support
  • the first surface of the stage and the first surface of the carrier are used to carry the display panel and are located on the same horizontal plane, thus simplifying the joining action of the joining device, improving the takt time, reducing the corresponding mechanism and/or reducing the cost.
  • FIG. 1 shows a schematic structural view of a bonding device for a display panel according to an embodiment of the present disclosure
  • FIG. 2 shows a schematic structural view of a bonding apparatus for a display panel according to an embodiment of the present disclosure
  • FIG. 3 shows a flow block diagram of a method for bonding a display panel according to an embodiment of the disclosure.
  • FIG. 1-2 shows a schematic structural view of a bonding apparatus for a display panel according to an embodiment of the present disclosure.
  • the bonding apparatus 10 of the exemplary embodiment of the present disclosure includes a support table 110 and a carrier 120.
  • the bearing base 120 is integrated on the supporting platform 110.
  • the first surface 112 of the supporting table 110 and the first surface 122 of the supporting base 120 are used to carry the display panel 20 and are located on the same horizontal plane.
  • the embodiments of the present disclosure structurally design the mechanism of the support table 110 and the carrier 120, which simplifies the joining action of the joining device 10, raises the tact time, reduces the corresponding mechanism and/or Reduce the cost.
  • the second surface 124 of the supporting base 120 is disposed on the second surface 114 of the supporting base 110, the second surface 114 of the supporting base 110 and the second surface 124 of the supporting base 120 Located on the same level.
  • the distance between the first surface 112 of the support base 110 and the second surface 112 of the support base 110 is equal to the height of the carrier 120.
  • the mechanism of the supporting platform 110 and the supporting base 120 is an integrated design, that is, the supporting platform 120 is integrated on the supporting platform 110, and the supporting platform 110 and the supporting platform 120 are opposite to each other.
  • the location is fixed. Therefore, before the display panel 20 is pressed, it can be placed on the supporting platform 110 and the supporting base 120 by the movement of the mechanical arm, which reduces the movement of the conventional supporting platform to the position of the supporting base.
  • the height of the table 110 and the bearing base 120 is mechanical, and will not be changed due to the switching of models, which improves the shortcomings of the conventional design, and the embodiments of the present disclosure do not require the support table 110 and the bearing base 120 There is a position movement in the Z-axis direction, so the Z-axis motor mechanism of the support table 110 can be reduced, and the cost of the joining device 10 can be reduced.
  • the bonding device 10 of the exemplary embodiment of the present disclosure further includes a pressure head 130 and a vacuum suction device 140 (refer to FIG. 2 ).
  • the indenter 130 is disposed above the support table 110 and the bearing base 120.
  • the bearing capacity of the supporting table 110 is greater than the pressing pressure of the indenter 130.
  • the bearing capacity of the bearing base 120 is greater than the pressing pressure of the indenter 130.
  • the vacuum adsorption device 140 is disposed on one end of the carrying base 120, for example, the front end of the carrying base 120.
  • the length of the supporting platform 110 is greater than the length of the bearing base 120.
  • the width of the supporting table 110 is equal to the width of the supporting base 120.
  • the support platform 110 and the bearing base 120 are designed on a mechanism base, the relative positions of the support platform 110 and the bearing base 120 are fixed, and the support platform 110 There will be no positional movement in the Z-axis direction with the carrier 120, the support table 110 and the carrier 120 are on the same horizontal plane, and the display panel 20 is placed on the support table 110 and the On the bearing base 120, the mechanism base moves below the indenter 130, and the indenter 130 presses against the display panel 20, to avoid interference abnormality caused by the height difference between the supporting platform and the bearing base in the conventional technology.
  • the bearing capacity of the support table 110 and the bearing base 120 is greater than the pressing pressure of the indenter 130 (for example, within 1KN), so The supporting platform 110 and the bearing base 120 are on the same horizontal plane, and are regularly inspected (such as monthly maintenance using a micrometer for measurement), and an additional position adjustment mechanism can be added for subsequent position adjustment.
  • the vacuum suction device 140 may be added to the front end of the carrier 120 to ensure a chip on film of the display panel 20 COF) 22, flexible printed circuit (flexible printed circuit, FPC) 24 or other flexible materials and other flexible materials such as smooth absorption.
  • COF chip on film of the display panel 20 COF
  • FPC flexible printed circuit
  • the embodiment of the present disclosure achieves a fixed position of the support platform 110 and the bearing base 120 through an integrated design of the support platform 110 and the bearing base 120, a unified action, simplifies the joining action, and is beneficial to reduce The bad risk of this engagement action can increase the takt time and reduce the cost of the organization.
  • FIG. 3 shows a flow block diagram of a method for bonding a display panel according to an embodiment of the disclosure.
  • the display panel bonding method 300 of this embodiment includes bonding the display panel 20 using the bonding device 10.
  • the bonding method 300 includes a block 310 to place the display panel 20 on the first surface 112 of the supporting table 110 and the first of the carrier 120 On the surface 122, a block 320 moves the carrier 120 carrying the display panel 20 directly below the indenter 130, and a block 330, the pair of the indenter 130 is placed on the carrier 120 The display panel 20 on the first surface 122 is pressed together.
  • the mechanism of the supporting platform 110 and the supporting base 120 is an integrated design, that is, the supporting platform 120 is integrated on the supporting platform 110, and the supporting platform 110 and the supporting platform 120 are opposite to each other.
  • the location is fixed. Therefore, before the display panel 20 is pressed, it can be placed on the supporting platform 110 and the supporting base 120 by the movement of the mechanical arm, which reduces the movement of the conventional supporting platform to the position of the supporting base.
  • the height of the table 110 and the bearing base 120 is mechanical, and will not be changed due to the switching of models, which improves the shortcomings of the conventional design, and the embodiments of the present disclosure do not require the support table 110 and the bearing base 120 There is a position movement in the Z-axis direction, so the Z-axis motor mechanism of the support table 110 can be reduced, and the cost of the joining device 10 can be reduced.
  • the carrier is integrated on the support platform, and the first surface of the support platform and the first One surface is used to carry the display panel and is located on the same horizontal plane, thus simplifying the joining action of the joining device, improving the takt time, reducing the corresponding mechanism and/or reducing the cost.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

用于显示面板(20)的接合装置(10)以及显示面板(20)的接合方法。所述用于显示面板(20)的接合装置(10)包括支撑台(110)以及承载座(120)。所述承载座(120)集成设置于所述支撑台(110)上。所述支撑台(110)的第一表面(112)与所述承载座(120)的第一表面(122)用于承载显示面板(20)且位于同一水平面上。

Description

。用于显示面板的接合装置以及显示面板的接合方法 技术领域
本揭示涉及显示技术领域,特别涉及一种用于显示面板的接合装置以及显示面板的接合方法。
背景技术
在目前的有机发光显示装置和液晶显示器的模组工艺中,接合(bonding)为重要的工艺。目前用于显示面板的接合装置中,支撑台与承载座是独立的机构,且目前的接合工艺,作业过程如下:面板由机械手臂放置在支撑台上,接着支撑台移动至接合区域(承载座正上方),然后再下降至承载座上,压头下降进行压合面板。由于,支撑台的高度位置可能随着作业或者切换型号有变更,在作业过程中有以下风险:
1、集成电路(Integrated circuit, IC )接合:支撑台的高度过低或过高(在100μm级别),造成面板悬空或者翘起,压头下压时可能造成面板破损。
2、覆晶薄膜(chip on film, COF)、柔性电路板(flexible printed circuit, FPC)或其他柔性材料进行接合,因柔性需求,目前的材料越来越薄,容易发生弯曲,如果支撑台的高度偏低,加上FPC和COF的弯曲严重(部分超过1cm),可能会干涉承载座,造成FPC和COF漏接合,如果支撑台的过高,可能会发生接合Y向偏移。
故,有需要提供一种用于显示面板的接合装置以及显示面板的接合方法,以解决现有技术存在的问题。
技术问题
目前用于显示面板的接合装置中,支撑台与承载座是独立的机构,且目前的接合工艺,有以下风险:
1、集成电路(Integrated circuit, IC )接合:支撑台的高度过低或过高(在100μm级别),造成面板悬空或者翘起,压头下压时可能造成面板破损。
2、覆晶薄膜(chip on film, COF)、柔性电路板(flexible printed circuit, FPC)或其他柔性材料进行接合,因柔性需求,目前的材料越来越薄,容易发生弯曲,如果支撑台的高度偏低,加上FPC和COF的弯曲严重(部分超过1cm),可能会干涉承载座,造成FPC和COF漏接合,如果支撑台的过高,可能会发生接合Y向偏移。
技术解决方案
为解决上述技术问题,本揭示提供用于显示面板的接合装置。所述接合装置包括支撑台以及承载座。所述承载座集成设置于所述支撑台上。所述支撑台的第一表面与所述承载座的第一表面用于承载显示面板且位于同一水平面上。所述承载座的第二表面设置于所述支撑台的第二表面上。所述支撑台的所述第二表面与所述承载座的第二表面位于同一水平面上。所述支撑台的所述第一表面和所述支撑台的所述第二表面之间的距离等于所述承载座的高度。所述支撑台和所述承载座的相对位置固定。
于本揭示其中的一实施例中,所述接合装置还包括压头,设置于所述支撑台和所述承载座的上方,所述支撑台的承重能力大于所述压头的压合压力,所述承载座的承重能力大于所述压头的压合压力。
于本揭示其中的一实施例中,所述接合装置还包括真空吸附装置,设置于所述承载座的一端上。
本揭示还提供用于显示面板的接合装置。所述接合装置包括支撑台以及承载座。所述承载座集成设置于所述支撑台上。所述支撑台的第一表面与所述承载座的第一表面用于承载显示面板且位于同一水平面上。
于本揭示其中的一实施例中,所述承载座的第二表面设置于所述支撑台的第二表面上,所述支撑台的所述第二表面与所述承载座的第二表面位于同一水平面上。
于本揭示其中的一实施例中,所述支撑台的所述第一表面和所述支撑台的所述第二表面之间的距离等于所述承载座的高度。
于本揭示其中的一实施例中,所述支撑台和所述承载座的相对位置固定。
于本揭示其中的一实施例中,所述接合装置还包括压头,设置于所述支撑台和所述承载座的上方。
于本揭示其中的一实施例中,所述支撑台的承重能力大于所述压头的压合压力。
于本揭示其中的一实施例中,所述承载座的承重能力大于所述压头的压合压力。
于本揭示其中的一实施例中,所述接合装置还包括真空吸附装置,设置于所述承载座的一端上。
本揭示还提供显示面板的接合方法。所述显示面板的接合方法包括使用用于显示面板的接合装置对所述显示面板进行接合。所述接合装置包括支撑台以及承载座。所述承载座集成设置于所述支撑台上。所述支撑台的第一表面与所述承载座的第一表面用于承载显示面板且位于同一水平面上。
于本揭示其中的一实施例中,所述的显示面板的接合方法还包括将所述显示面板放置于所述支撑台的所述第一表面与所述承载座的所述第一表面上,将承载所述显示面板的所述承载座移动至所述压头的正下方,以及以所述压头对放置于所述承载座的所述第一表面上的所述显示面板进行压合。
于本揭示其中的一实施例中,所述承载座的第二表面设置于所述支撑台的第二表面上,所述支撑台的所述第二表面与所述承载座的第二表面位于同一水平面上。
于本揭示其中的一实施例中,所述支撑台的所述第一表面和所述支撑台的所述第二表面之间的距离等于所述承载座的高度。
于本揭示其中的一实施例中,所述支撑台和所述承载座的相对位置固定。
于本揭示其中的一实施例中,所述接合装置还包括压头,设置于所述支撑台和所述承载座的上方。
于本揭示其中的一实施例中,所述支撑台的承重能力大于所述压头的压合压力。
于本揭示其中的一实施例中,所述承载座的承重能力大于所述压头的压合压力。
于本揭示其中的一实施例中,所述接合装置还包括真空吸附装置,设置于所述承载座的一端上。
有益效果
相较于现有技术,为解决上述技术问题,本揭示的实施例的用于显示面板的接合装置以及显示面板的接合方法中,所述承载座集成设置于所述支撑台上,所述支撑台的第一表面与所述承载座的第一表面用于承载显示面板且位于同一水平面上,因此简化了接合装置的接合动作、提升节拍时间、减少相应的机构及/或减少成本。
附图说明
图1显示根据本揭示的一实施例的用于显示面板的接合装置的结构示意图;
图2显示根据本揭示的一实施例的用于显示面板的接合装置的结构示意图;以及
图3显示根据本揭示的一实施例的显示面板的接合方法的流程方块图。
本发明的最佳实施方式
以下各实施例的说明是参考附加的图式,用以例示本揭示可用以实施的特定实施例。
为了让本揭示的上述及其他目的、特征、优点能更明显易懂,下文将特举本揭示优选实施例,并配合所附图式,作详细说明如下。再者,本揭示所提到的方向用语,例如上、下、顶、底、前、后、左、右、内、外、侧层、周围、中央、水平、横向、垂直、纵向、轴向、径向、最上层或最下层等,仅是参考附加图式的方向。因此,使用的方向用语是用以说明及理解本揭示,而非用以限制本揭示。
在图中,结构相似的单元是以相同标号表示。
图1-2显示根据本揭示的一实施例的用于显示面板的接合装置的结构示意图。
参照图1-2,本揭示的示例性实施例的接合装置10包括支撑台110以及承载座120。所述承载座120集成设置于所述支撑台110上。所述支撑台110的第一表面112与所述承载座120的第一表面122用于承载显示面板20且位于同一水平面上。本揭示的实施例从结构上一体化设计了所述支撑台110以及所述承载座120的机构,简化了接合装置10的接合动作、提升节拍时间(tact time)、减少相应的机构及/或减少成本。
具体地,所述承载座120的第二表面124设置于所述支撑台110的第二表面114上,所述支撑台110的所述第二表面114与所述承载座120的第二表面124位于同一水平面上。所述支撑台110的所述第一表面112和所述支撑台110的所述第二表面112之间的距离等于所述承载座120的高度。
具体地,所述支撑台110与所述承载座120的机构为一体化设计,即所述承载座120集成设置于所述支撑台110上,所述支撑台110和所述承载座120的相对位置固定。因此,所述显示面板20在压合前,可通过机械手臂移动而放置在所述支撑台110与所述承载座120,减少了习知支撑台移动到承载座位置等动作,由于所述支撑台110和所述承载座120的高度为机械性的,不会因切换型号发生变更,改善了习知设计的缺点,并且本揭示的实施例不需要所述支撑台110与所述承载座120有Z轴方向进行位置移动,故而可以减少所述支撑台110的Z轴马达机构,可降低所述接合装置10的成本。
本揭示的示例性实施例的接合装置10还包括压头130和真空吸附装置140(参照图2)。所述压头130设置于所述支撑台110和所述承载座120的上方。
具体地,所述支撑台110的承重能力大于所述压头130的压合压力。所述承载座120的承重能力大于所述压头130的压合压力。所述真空吸附装置140设置于所述承载座120的一端上,例如所述承载座120的前端。
具体地,所述支撑台110的长度大于所述承载座120的长度。所述支撑台110的宽度等于所述承载座120的宽度。
于本揭示其中的一实施例中,所述支撑台110与所述承载座120设计在一个机构基座上,所述支撑台110和所述承载座120的相对位置固定,所述支撑台110与所述承载座120于Z轴方向不会进行位置移动,所述支撑台110和所述承载座120在同一水平面上,作业时,所述显示面板20放置于所述支撑台110与所述承载座120上,所述机构基座移动至所述压头130下方,所述压头130压合所述显示面板20,避免习知技术因支撑台和承载座高度落差问题,发生干涉异常。
具体地,本揭示其中的一实施例中,在机构制作上,需保证所述支撑台110与所述承载座120的承重能力大于所述压头130的压合压力(例如1KN以内),所述支撑台110与所述承载座120在同一水平面上,并且定期进行点检(比如月保养使用千分尺进行测量),可额外增加位置调整机构,以备后续进行位置调整。
具体地,本揭示其中的一实施例中,可在所述承载座120的前端增加所述真空吸附装置140,保证所述显示面板20的覆晶薄膜(chip on film, COF)22、柔性电路板(flexible printed circuit, FPC)24或其他柔性材料等柔性材料的吸附平整。
本揭示的实施例通过对所述支撑台110与所述承载座120进行一体化设计,达到所述支撑台110与所述承载座120的位置固定,动作统一,简化了接合动作,有利于减少此接合动作产生的不良风险,并且可提升节拍时间,降低机构成本。
图3显示根据本揭示的一实施例的显示面板的接合方法的流程方块图。
本实施例的显示面板的接合方法300包括使用所述接合装置10对所述显示面板20进行接合。
于本揭示其中的一实施例中,所述接合方法300包括方块310,将所述显示面板20放置于所述支撑台110的所述第一表面112与所述承载座120的所述第一表面122上,方块320,将承载所述显示面板20的所述承载座120移动至所述压头130的正下方,以及方块330,以所述压头130对放置于所述承载座120的所述第一表面122上的所述显示面板20进行压合。
具体地,所述支撑台110与所述承载座120的机构为一体化设计,即所述承载座120集成设置于所述支撑台110上,所述支撑台110和所述承载座120的相对位置固定。因此,所述显示面板20在压合前,可通过机械手臂移动而放置在所述支撑台110与所述承载座120,减少了习知支撑台移动到承载座位置等动作,由于所述支撑台110和所述承载座120的高度为机械性的,不会因切换型号发生变更,改善了习知设计的缺点,并且本揭示的实施例不需要所述支撑台110与所述承载座120有Z轴方向进行位置移动,故而可以减少所述支撑台110的Z轴马达机构,可降低所述接合装置10的成本。
由于本揭示的实施例的用于显示面板的接合装置以及显示面板的接合方法中,所述承载座集成设置于所述支撑台上,所述支撑台的第一表面与所述承载座的第一表面用于承载显示面板且位于同一水平面上,因此简化了接合装置的接合动作、提升节拍时间、减少相应的机构及/或减少成本。
尽管已经相对于一个或多个实现方式示出并描述了本揭示,但是本领域技术人员基于对本说明书和附图的阅读和理解将会想到等价变型和修改。本揭示包括所有这样的修改和变型,并且仅由所附权利要求的范围限制。特别地关于由上述组件执行的各种功能,用于描述这样的组件的术语旨在对应于执行所述组件的指定功能(例如其在功能上是等价的)的任意组件(除非另外指示),即使在结构上与执行本文所示的本说明书的示范性实现方式中的功能的公开结构不等同。此外,尽管本说明书的特定特征已经相对于若干实现方式中的仅一个被公开,但是这种特征可以与如可以对给定或特定应用而言是期望和有利的其他实现方式的一个或多个其他特征组合。而且,就术语“包括”、“具有”、“含有”或其变形被用在具体实施方式或权利要求中而言,这样的术语旨在以与术语“包含”相似的方式包括。
以上仅是本揭示的优选实施方式,应当指出,对于本领域普通技术人员,在不脱离本揭示原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也应视为本揭示的保护范围。

Claims (20)

  1. 一种用于显示面板的接合装置,包括:
    支撑台;以及
    承载座,集成设置于所述支撑台上;
    其中所述支撑台的第一表面与所述承载座的第一表面用于承载显示面板且位于同一水平面上;
    其中所述承载座的第二表面设置于所述支撑台的第二表面上,所述支撑台的所述第二表面与所述承载座的第二表面位于同一水平面上;
    其中所述支撑台的所述第一表面和所述支撑台的所述第二表面之间的距离等于所述承载座的高度;以及
    其中所述支撑台和所述承载座的相对位置固定。
  2. 如权利要求1所述的用于显示面板的接合装置,还包括压头,设置于所述支撑台和所述承载座的上方,其中所述支撑台的承重能力大于所述压头的压合压力,所述承载座的承重能力大于所述压头的压合压力。
  3. 如权利要求1所述的用于显示面板的接合装置,还包括真空吸附装置,设置于所述承载座的一端上。
  4. 一种用于显示面板的接合装置,包括:
    支撑台;以及
    承载座,集成设置于所述支撑台上;
    其中所述支撑台的第一表面与所述承载座的第一表面用于承载显示面板且位于同一水平面上。
  5. 如权利要求4所述的用于显示面板的接合装置,其中所述承载座的第二表面设置于所述支撑台的第二表面上,所述支撑台的所述第二表面与所述承载座的第二表面位于同一水平面上。
  6. 如权利要求5所述的用于显示面板的接合装置,其中所述支撑台的所述第一表面和所述支撑台的所述第二表面之间的距离等于所述承载座的高度。
  7. 如权利要求4所述的用于显示面板的接合装置,其中所述支撑台和所述承载座的相对位置固定。
  8. 如权利要求4所述的用于显示面板的接合装置,还包括压头,设置于所述支撑台和所述承载座的上方。
  9. 如权利要8所述的用于显示面板的接合装置,其中所述支撑台的承重能力大于所述压头的压合压力。
  10. 如权利要8所述的用于显示面板的接合装置,其中所述承载座的承重能力大于所述压头的压合压力。
  11. 如权利要求4所述的用于显示面板的接合装置,还包括真空吸附装置,设置于所述承载座的一端上。
  12.     一种显示面板的接合方法,包括:
    使用用于显示面板的接合装置对所述显示面板进行接合;
    其中所述接合装置包括:
    支撑台;以及
    承载座,集成设置于所述支撑台上;
    其中所述支撑台的第一表面与所述承载座的第一表面用于承载所述显示面板且位于同一水平面上。
  13. 如权利要求12所述的显示面板的接合方法,还包括:
    将所述显示面板放置于所述支撑台的所述第一表面与所述承载座的所述第一表面上;
    将承载所述显示面板的所述承载座移动至所述压头的正下方;以及
    以所述压头对放置于所述承载座的所述第一表面上的所述显示面板进行压合。
  14. 如权利要求12所述的显示面板的接合方法,其中所述承载座的第二表面设置于所述支撑台的第二表面上,所述支撑台的所述第二表面与所述承载座的第二表面位于同一水平面上。
  15. 如权利要求14所述的显示面板的接合方法,其中所述支撑台的所述第一表面和所述支撑台的所述第二表面之间的距离等于所述承载座的高度。
  16. 如权利要求12所述的显示面板的接合方法,其中所述支撑台和所述承载座的相对位置固定。
  17. 如权利要求12所述的显示面板的接合方法,其中所述接合装置还包括压头,设置于所述支撑台和所述承载座的上方。
  18. 如权利要17所述的显示面板的接合方法,其中所述支撑台的承重能力大于所述压头的压合压力。
  19. 如权利要17所述的显示面板的接合方法,其中所述承载座的承重能力大于所述压头的压合压力。
  20. 如权利要求12所述的显示面板的接合方法,其中所述接合装置还包括真空吸附装置,设置于所述承载座的一端上。
PCT/CN2019/078900 2018-12-19 2019-03-20 。用于显示面板的接合装置以及显示面板的接合方法 Ceased WO2020124833A1 (zh)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0870013A (ja) * 1994-08-30 1996-03-12 Casio Comput Co Ltd ボンディング方法及びその装置
JPH08211401A (ja) * 1995-02-06 1996-08-20 Nippondenso Co Ltd 液晶セルの端子部熱圧着方法
JP2006210832A (ja) * 2005-01-31 2006-08-10 Optrex Corp 表示パネルとフレキシブル回路基板との接続方法および接続装置
CN103345086A (zh) * 2013-07-19 2013-10-09 深圳市华星光电技术有限公司 用于向面板贴附覆晶膜的装置及其使用方法
US20160225736A1 (en) * 2015-01-30 2016-08-04 Hydis Technologies Co., Ltd. Fog Bonding Device and Method Thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07130795A (ja) * 1993-11-04 1995-05-19 Matsushita Electric Ind Co Ltd 半導体素子接続方法および半導体素子接続装置
JP3743424B2 (ja) * 2003-01-10 2006-02-08 松下電器産業株式会社 電子部品圧着装置および電子部品圧着方法
KR100740762B1 (ko) * 2005-02-10 2007-07-19 오므론 가부시키가이샤 접합 방법 및 접합 장치
JP5026220B2 (ja) * 2007-10-17 2012-09-12 パナソニック株式会社 部品実装方法及び装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0870013A (ja) * 1994-08-30 1996-03-12 Casio Comput Co Ltd ボンディング方法及びその装置
JPH08211401A (ja) * 1995-02-06 1996-08-20 Nippondenso Co Ltd 液晶セルの端子部熱圧着方法
JP2006210832A (ja) * 2005-01-31 2006-08-10 Optrex Corp 表示パネルとフレキシブル回路基板との接続方法および接続装置
CN103345086A (zh) * 2013-07-19 2013-10-09 深圳市华星光电技术有限公司 用于向面板贴附覆晶膜的装置及其使用方法
US20160225736A1 (en) * 2015-01-30 2016-08-04 Hydis Technologies Co., Ltd. Fog Bonding Device and Method Thereof

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