WO2020116219A1 - Dissipateur thermique - Google Patents

Dissipateur thermique Download PDF

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Publication number
WO2020116219A1
WO2020116219A1 PCT/JP2019/045892 JP2019045892W WO2020116219A1 WO 2020116219 A1 WO2020116219 A1 WO 2020116219A1 JP 2019045892 W JP2019045892 W JP 2019045892W WO 2020116219 A1 WO2020116219 A1 WO 2020116219A1
Authority
WO
WIPO (PCT)
Prior art keywords
flange body
heat sink
sealing surface
flux
brazing
Prior art date
Application number
PCT/JP2019/045892
Other languages
English (en)
Japanese (ja)
Inventor
小野　純
坂井　耐事
大久保　厚
卓也 文後
Original Assignee
株式会社ティラド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ティラド filed Critical 株式会社ティラド
Priority to JP2020559931A priority Critical patent/JP7282803B2/ja
Publication of WO2020116219A1 publication Critical patent/WO2020116219A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids

Definitions

  • Flux is applied to the patch plate 7 in advance. In that state, each component is integrally brazed and fixed in a high temperature furnace.
  • a refrigerant pipe (not shown) is connected to each of the pair of flange bodies 6, and the refrigerant flows through the core 1 arranged inside the heat sink. The refrigerant flowing through the core 1 absorbs heat generated from the heating element.
  • the inclination angle ⁇ formed by the vertical surface 9 and the inclined surface 10 of the stepped portion 8 is formed to be an obtuse angle. Since the inclination angle ⁇ of each step of the stepped portion 8 is inclined at an obtuse angle, the flux is easily trapped at the root of each step of the stepped portion 8 and the flux reaches the surface of the sealing surface 5 effectively. Can be suppressed. Further, by making the inclination angle ⁇ obtuse, the accumulated flux can be easily removed by the blasting process, so that the appearance around the flange body 6 is not spoiled.
  • an annular protruding wall portion 11 is formed on the outer peripheral edge of the sealing surface 5 of the flange body 6, and the protruding wall portion 11 is orthogonal to the sealing surface 5.
  • the flux is applied to the patch plate 7 interposed between the neck portion 4 and the communication hole 3 during the brazing process, and the contact portions of the respective parts are integrated in a high temperature furnace in a state where the flux is applied. Brazed.
  • the brazing posture is such that the neck portion 4 is located above in the gravity direction.
  • the presence of the stepped portion 8 of the flange body 6 makes it possible to make the distance to the sealing surface 5 of the flange body 6 longer than that of the flange body 6 having no stepped portion, and the surface tension increases.

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un dissipateur thermique permettant d'inhiber une élévation du flux et de protéger la surface d'étanchéité du corps de bride lors du brasage d'un boîtier et d'un corps de bride à l'aide d'un flux. Dans le présent dissipateur thermique dans lequel un corps de bride cylindrique 6 est fixé à une paire de trous de communication 3 ménagés dans un boîtier 2 par l'intermédiaire d'une plaque de lot de brasage 7, et ces composants sont brasés d'une seule pièce, une extrémité du corps de bride 6 comporte une section de col 4 reliée aux trous de communication 3 et l'autre extrémité comporte une surface d'étanchéité annulaire 5, et une pluralité de sections étagées 8 sont formées dans la périphérie externe du corps de bride 6, les sections étagées 8 ayant des formes étagées inversées et allant en augmentant du diamètre externe de la section de col 4 à la surface d'étanchéité 5. Ainsi, pendant le brasage, le flux peut être piégé au niveau des sections étagées 8 et la surface d'étanchéité du corps de bride peut être protégée.
PCT/JP2019/045892 2018-12-07 2019-11-19 Dissipateur thermique WO2020116219A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2020559931A JP7282803B2 (ja) 2018-12-07 2019-11-19 ヒートシンク

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018230452 2018-12-07
JP2018-230452 2018-12-07

Publications (1)

Publication Number Publication Date
WO2020116219A1 true WO2020116219A1 (fr) 2020-06-11

Family

ID=70973737

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2019/045892 WO2020116219A1 (fr) 2018-12-07 2019-11-19 Dissipateur thermique

Country Status (2)

Country Link
JP (1) JP7282803B2 (fr)
WO (1) WO2020116219A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05318098A (ja) * 1992-05-22 1993-12-03 Showa Alum Corp 熱交換器
JP2012238456A (ja) * 2011-05-11 2012-12-06 Daiichi Seiko Co Ltd スイッチ付同軸コネクタ
JP2013157524A (ja) * 2012-01-31 2013-08-15 Mitsubishi Materials Corp ヒートシンク付パワーモジュール用基板の製造方法およびパワーモジュール用基板
JP2013239666A (ja) * 2012-05-17 2013-11-28 T Rad Co Ltd ヒートシンク
JP2015192122A (ja) * 2014-03-28 2015-11-02 三菱マテリアル株式会社 パワーモジュール用基板及びヒートシンク付パワーモジュール用基板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8593099B2 (en) 2008-05-28 2013-11-26 Sanden Corporation Electric compressor

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05318098A (ja) * 1992-05-22 1993-12-03 Showa Alum Corp 熱交換器
JP2012238456A (ja) * 2011-05-11 2012-12-06 Daiichi Seiko Co Ltd スイッチ付同軸コネクタ
JP2013157524A (ja) * 2012-01-31 2013-08-15 Mitsubishi Materials Corp ヒートシンク付パワーモジュール用基板の製造方法およびパワーモジュール用基板
JP2013239666A (ja) * 2012-05-17 2013-11-28 T Rad Co Ltd ヒートシンク
JP2015192122A (ja) * 2014-03-28 2015-11-02 三菱マテリアル株式会社 パワーモジュール用基板及びヒートシンク付パワーモジュール用基板

Also Published As

Publication number Publication date
JPWO2020116219A1 (ja) 2021-10-21
JP7282803B2 (ja) 2023-05-29

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