WO2020113857A1 - 柔性有机发光二极管装置以及其形成方法 - Google Patents

柔性有机发光二极管装置以及其形成方法 Download PDF

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Publication number
WO2020113857A1
WO2020113857A1 PCT/CN2019/079241 CN2019079241W WO2020113857A1 WO 2020113857 A1 WO2020113857 A1 WO 2020113857A1 CN 2019079241 W CN2019079241 W CN 2019079241W WO 2020113857 A1 WO2020113857 A1 WO 2020113857A1
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Prior art keywords
layer
gate insulating
insulating layer
hole
light emitting
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PCT/CN2019/079241
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English (en)
French (fr)
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杨薇薇
杨程
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武汉华星光电半导体显示技术有限公司
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Priority to US16/349,291 priority Critical patent/US11094767B2/en
Publication of WO2020113857A1 publication Critical patent/WO2020113857A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the invention relates to the field of display technology, in particular to a flexible organic light-emitting diode (Organic Light-Emitting Diode, OLED) device and a method for forming the same.
  • a flexible organic light-emitting diode Organic Light-Emitting Diode, OLED
  • Organic light-emitting diode (Organic Light-Emitting Diode, OLED) due to its light weight, self-luminous, wide viewing angle, low drive voltage, high luminous efficiency, low power consumption, fast response speed and other advantages, the scope of application is getting wider and wider.
  • the flexible OLED display device has the characteristics of being bendable and easy to carry, and has become the main field of development in the field of display technology. Because the flexible OLED substrate can be bent to the back of the display screen, the frame can be shortened. However, because the flexible OLED substrate is currently designed with a circular arc, and the power signal in the Array structure is drawn from the active area, it will be routed on the first metal layer on the same layer as the source/drain.
  • the data signal is routed alternately with the dual gate layer GE1/GE2, and the power signal in the bending area of the flexible OLED panel must also be routed in the first metal layer. Therefore, this results in the frame of the flexible OLED substrate being too wide. Therefore, how to shorten the border is a technical problem to be solved.
  • the object of the present invention is to provide a flexible organic light emitting diode device and a method of forming the same to solve the problems of the prior art.
  • the technical solution of the present invention provides a flexible organic light emitting diode device including a display area and a non-display area.
  • the flexible organic light emitting diode device includes: a flexible substrate; an inorganic layer provided on the flexible substrate; a buffer layer provided A first gate insulating layer on the buffer layer is provided on the inorganic layer; a second gate insulating layer is provided on the first gate insulating layer; a dielectric layer is provided on the second A gate insulating layer; a flat layer, which is provided on the dielectric layer; a pixel definition layer, which is provided on the flat layer; a driving transistor, located in the display area, which includes a control electrode and an output electrode, To receive the data voltage and the driving voltage; the organic light emitting diode, located in the display area, includes an anode layer, a cathode layer and a light emitting layer, the light emitting layer is located between the anode layer and the cathode layer, Light is generated according to the voltage difference between the data
  • the driving transistor further includes an active layer, the active layer is disposed on the buffer layer, the control electrode is located on the first gate insulating layer, and the output electrode It is connected to the active layer through a third through hole penetrating the dielectric layer, the second gate insulating layer, and the first gate insulating layer.
  • the anode layer is connected to the output electrode through a fourth through hole penetrating the flat layer to receive the driving voltage.
  • the material of the flexible substrate is polyimide (PI).
  • the material of the inorganic layer may be selected from one of silicon oxide (SiOx) and silicon nitrogen compound (SiNx).
  • the technical solution of the present invention also provides a method of forming a flexible organic light emitting diode device, which includes: forming a flexible substrate; sequentially forming an inorganic layer and a buffer layer on the flexible substrate; and forming an active layer of a driving transistor on the Forming a first gate insulating layer on the buffer layer; forming a control electrode of the driving transistor on the first gate insulating layer; forming a second gate insulating layer on the first gate On the electrode insulating layer; etching the buffer layer, the first gate insulating layer and the second gate insulating layer to form a first through hole; etching the first metal layer to form a first segment of the driving voltage lead , Wherein the first section of the driving voltage lead is connected to the driving voltage terminal through the first through hole; forming a dielectric layer on the second gate insulating layer; etching the dielectric layer to form a second through hole And etch the first gate insulating layer, the second gate insulating layer and the dielectric layer to form
  • the step of forming an organic light emitting diode on the flat layer, wherein the anode layer of the organic light emitting diode is connected to the output electrode includes: etching the flat layer to form a fourth through hole Etching a third metal layer formed on the flat layer to form the anode layer, wherein the anode layer is connected to the output electrode through the fourth via hole; forming a pixel definition layer on the flat layer; Etching the pixel definition layer to form a fifth through hole; sequentially forming a light emitting layer and a cathode layer of the organic light emitting diode on the anode layer.
  • the step of etching the buffer layer, the first gate insulating layer, and the second gate insulating layer to form a first through hole includes:
  • the buffer layer is etched to form a first auxiliary through hole, wherein the first main through hole and the first auxiliary through hole constitute the first through hole.
  • the flexible organic light emitting diode device includes a display area and a non-display area, the driving transistor and the organic light emitting diode are located in the display area, and the driving voltage lead and the data voltage lead are located The non-display area.
  • the material of the flexible substrate is polyimide (PI).
  • the data voltage lead and the driving voltage lead of the flexible organic light emitting diode device of the present invention are respectively located in different layers in the bendable non-display area, so the layout space can be saved, and the beneficial effect of shortening the border .
  • FIG. 1 is a schematic diagram of the flexible organic light emitting diode device of the present invention.
  • FIG. 2 is a circuit diagram of the pixel circuit in the display area of FIG. 1.
  • FIG. 3 is a schematic structural diagram of the flexible OLED device provided by this embodiment.
  • FIG. 1 is a schematic diagram of an Organic Light-Emitting Diode (OLED) device 10 of the present invention.
  • FIG. 2 is a circuit diagram of the pixel circuit 110 in the display area 101 of FIG. 1.
  • the flexible OLED device 10 includes a display area (Active area) 101 and a non-display area 102.
  • the non-display area 102 includes a bendable area 1021 and a signal pad area 1022.
  • the bendable area 1021 of the flexible OLED device 10 can be bent so that the signal pad area 1022 is located on the back of the display screen, so the frame can be shortened.
  • the signal pad area 1022 is distributed with multiple data voltage leads 300, multiple driving voltage leads 302, 304, multiple data transmission pads 310, and multiple drive transmission pads 312, 314.
  • the plurality of data voltage leads 300 are connected one-to-one to the plurality of data transfer pads 310, and the plurality of drive voltage leads 302, 304 are connected one-to-one to the plurality of drive transfer pads 312, 314.
  • the display area 101 is provided with a plurality of pixel circuits 110, and each pixel circuit 110 is connected to a corresponding driving voltage lead 302, 304 and a data voltage lead 300.
  • the data transmission pad 310 is used to receive the data voltage Vdata transmitted by the image processor (not shown) and transmit the data voltage Vdata to the corresponding pixel circuit 110 via the data voltage lead 300.
  • the driving transmission pads 312 and 314 are used to transmit high/low level driving voltages Vdd/Vss, respectively, and transmit the driving voltages Vdd/Vss to the corresponding pixel circuits 110 via the driving voltage leads
  • the pixel circuit 110 includes a switching transistor T1, a driving transistor T2, a storage capacitor Cst, and an OLED 12.
  • the scan signal voltage is input through the scan terminal SCAN to turn on the switching transistor T1
  • the data voltage Vdata is sent out through the data terminal DATA and is transmitted to the gate of the driving transistor T2 through the switching transistor T1.
  • the organic light emitting diode 12 Since the light emitting brightness of the organic light emitting diode 12 is proportional to the on-current Id, the organic light emitting diode 12 adjusts the light emitting brightness according to the data voltage Vdata so that the corresponding pixels generate different gray levels. In addition, since the data voltage Vdata is stored in the storage capacitor Cst, the brightness on the pixel of the organic light emitting diode 12 can be retained during the screen change.
  • FIG. 3 illustrates a schematic structural diagram of the flexible OLED device 10 provided by this embodiment.
  • the flexible OLED device 10 includes a flexible substrate 120, an inorganic layer 130, a buffer layer 140, a first gate insulating layer 150, a second gate insulating layer 160, an inter layer dielectric (ILD) 170, and a flat layer (Passivation layer ) 180, pixel definition layer (Pixel definition layer) 190, driving transistor T2.
  • ILD inter layer dielectric
  • the flexible substrate 120 may be formed of a bendable insulating material, such as polyimide (PI), polycarbonate (PC), polyethersulfone (PES), polyethylene terephthalate (PET), poly It is formed of polymer materials such as ethylene naphthalate (PEN), polyarylate (PAR) or glass fiber reinforced plastic (FRP).
  • PI polyimide
  • PC polycarbonate
  • PES polyethersulfone
  • PET polyethylene terephthalate
  • PEN ethylene naphthalate
  • PAR polyarylate
  • FRP glass fiber reinforced plastic
  • the inorganic layer 130 and the buffer layer 140 may be inorganic materials such as silicon oxide (SiOx), silicon nitride (SiNx), silicon oxynitride (SiOxNy), aluminum oxide (AlOx), or aluminum nitride (AlNx).
  • the driving transistor T2 may be a thin film transistor, which is located on the buffer layer 140. In FIG. 3, a structure description is given by taking a top-gate thin film transistor as an example.
  • the driving transistor T2 includes a semiconductor active layer 200 on the buffer layer 140, a control electrode, an input electrode, and an output electrode.
  • the semiconductor active layer 200 includes a source region 200S and a drain region 200D formed by doping N-type impurity ions or P-type impurity ions.
  • the region between the source region 200S and the drain region 200D is a channel region 200C that is not doped with impurities.
  • the semiconductor active layer 200 can be formed by changing amorphous silicon to polycrystalline silicon by crystallization of amorphous silicon. Specifically, in order to crystallize amorphous silicon, rapid thermal annealing (RTA) process, excimer laser annealing (ELA) process, solid phase crystallization (SPC) process, metal induced crystallization (MIC) process, metal induced lateral crystallization ( MILC) process or continuous lateral curing (SLS) process.
  • RTA rapid thermal annealing
  • ESA excimer laser annealing
  • SPC solid phase crystallization
  • MILC metal induced lateral crystallization
  • MILC metal induced lateral crystallization
  • the first gate insulating layer 150 is provided on the semiconductor active layer 200, may be formed of an inorganic material such as silicon oxide, silicon nitride, or metal oxide, and may include a single layer or a plurality of film layers.
  • the gate 201 ie, the control electrode of the driving transistor T2 is located in a specific area on the first gate insulating layer 150.
  • the gate 201 may include a single layer or multiple layers of gold (Au), silver (Ag), copper (Cu), molybdenum (Mo), nickel (Ni), platinum (Pt), aluminum (Al), or chromium (Cr) , Or alloys such as aluminum (Al)/neodymium (Nd) alloy, molybdenum (Mo)/tungsten (W) alloy.
  • the second gate insulating layer 160 is located on the gate 201 and may be formed of an insulating inorganic material such as silicon oxide or silicon nitride.
  • the source electrode 202 and the drain electrode 204 are located on the second gate insulating layer 160, and are electrically connected to the source region 200S and the drain region 200D through the third through hole 403, respectively.
  • the third through hole 403 may be formed by removing the first gate insulating layer 150, the second gate insulating layer 160, and the dielectric layer 170.
  • the flat layer 180 is located on the source 202 and the drain 204.
  • the flat layer 180 may be formed of an organic material such as acrylic, polyimide (PI), or benzocyclobutene (BCB).
  • the organic light emitting diode 12 is formed on the transistor T2.
  • the organic light emitting diode 12 includes an anode layer 121, a light emitting layer 122, and a cathode layer 124.
  • the anode layer 121 is electrically connected to the source electrode 202 or the drain electrode 204 (that is, the output electrode of the driving transistor T2) through the fifth via hole.
  • the anode layer 121 may be formed as a transparent electrode or a reflective electrode according to its use.
  • the first electrode may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium oxide (In2O3), etc.
  • the reflective layer may be formed of Ag, magnesium (Mg), Al, Pt, Pd, Au, Ni, Nd, iridium (Ir), Cr, or a mixture thereof, and ITO, IZO, ZnO, In2O3, or the like may be formed on the reflective layer .
  • a pixel definition layer (PDL) 190 is located on the flat layer 180 and covers the edge of the anode layer 121.
  • the PDL 190 may be formed of organic materials such as polyimide (PI), polyamide, benzocyclobutene (BCB), acrylic resin, or phenolic resin.
  • PI polyimide
  • BCB benzocyclobutene
  • the light emitting layer 122 is located on the anode layer 121, and the portion of the light emitting layer 122 above the anode layer 121 is not covered by the PDL 190, that is, exposed.
  • the size of the light emitting layer 122 is the display area of the pixel.
  • the light emitting layer 122 may be formed by a vapor deposition process and may be formed of a low molecular weight organic material or a high molecular weight organic material, the light emitting layer 122 includes an organic emission layer, and may further include a hole injection layer (HIL) and a hole transport layer (HTL) , At least one of an electron transport layer (ETL) and an electron injection layer (EIL).
  • HIL hole injection layer
  • HTL hole transport layer
  • ETL electron transport layer
  • EIL electron injection layer
  • the cathode layer 124 is located on the light emitting layer 122. Similar to the anode layer 121, the cathode layer 124 may be formed as a transparent electrode or a reflective electrode.
  • the anode layer 121 and the cathode layer 124 are insulated from each other by the light-emitting layer 122.
  • the light emitting layer 122 emits visible light according to the voltage difference between the anode layer 121 and the cathode layer 124, thereby realizing an image that can be recognized by a user.
  • the cathode layer 124 may be formed as a transparent electrode or a reflective electrode.
  • the cathode layer 124 may be lithium (Li), calcium (Ca), lithium fluoride/calcium (LiF/Ca), lithium fluoride/aluminum (LiF/Al), aluminum (Al), magnesium ( Mg) or a combination of compounds and other materials, and can be initially deposited on the light-emitting layer by evaporation.
  • the cathode layer 124 is a reflective electrode, it may be Li, Ca, LiF/Ca, LiF/Al, Al, Mg, or a mixture thereof.
  • the data voltage lead 300 (simultaneously formed with the source 202 or the drain 204 by the second metal layer) is connected to the gate 201 of the driving transistor T2 for transmitting the data voltage Vdata. Within the range of the non-display area 102, the data voltage lead 300 is located on the dielectric layer 170.
  • the driving voltage lead 302 (formed by the first metal layer) is connected to the source 202 or the drain 204 (the output of the driving transistor T2) of the driving transistor T2 and the driving transmission pad 312 for receiving the driving voltage Vdd.
  • the driving voltage lead 302 passes through the first through hole 401 penetrating the second gate insulating layer 160, the first gate insulating layer 150, the inorganic layer 130 and the buffer layer 120 and passes through the dielectric layer
  • the second through hole 402 of 170 is connected to the driving transmission pad 312.
  • the data voltage lead 300 is located on the dielectric layer 170 in both the display area 101 and the non-display area 102, but the driving voltage lead 302 is extended and bent onto the flexible substrate 120 in the non-display area 102.
  • the driving voltage lead 302 and the data voltage lead 300 are provided on different layers.
  • the data voltage lead and the driving voltage lead must be arranged in the same layer in the range of the non-display area.
  • the data voltage lead and the driving voltage lead are arranged in different layers in the range of the non-display area. Therefore, the layout space can be saved, which has the beneficial effect of shortening the frame.
  • the driving transmission pad 312 is disposed on the flexible substrate 120 of the non-display area 102 and is a whole piece of metal, the driving voltage lead 302 connected to the driving transmission pad 312 can reduce the voltage drop (IR drop) Impact.
  • FIG. 4 to FIG. 17, illustrate a method of forming the flexible organic light emitting diode device 10 of FIG. 3.
  • the flexible substrate 120 is formed.
  • the inorganic layer 130 and the buffer layer 140 are sequentially formed on the flexible substrate 120.
  • the active layer 200 of the driving transistor T2 is formed on the buffer layer 140, wherein the active layer 200 includes a source region 200S, a drain region 200D, and a channel region 200C located therebetween.
  • a first gate insulating layer 150 is formed on the buffer layer 140.
  • the gate 201 (control gate) of the driving transistor T2 is formed on the first gate insulating layer 150.
  • FIG. 1 control gate
  • a second gate insulating layer 160 is formed on the first gate insulating layer 150.
  • the inorganic layer 130, the buffer layer 140, the first gate insulating layer 150 and the second gate insulating layer 160 are etched to form the first through hole 401.
  • the first gate insulating layer 150 and the second gate insulating layer 160 must be etched to form the first main via 4011 at the same time.
  • the inorganic layer 130 and the buffer layer 140 are etched to form a first auxiliary through hole 4012, wherein the first main through hole 4011 and the first auxiliary through hole 4012 constitute the first through hole 401.
  • the first metal layer M1 is etched to form the first section 3021 of the driving voltage lead 302 and the driving transmission pad 312.
  • the first section 3021 of the driving voltage lead 302 is connected to the driving transmission pad 312 through the first through hole 401.
  • an interlayer is formed
  • the dielectric 170 is on the second gate insulating layer 160.
  • the dielectric layer 170 is etched to form the second through hole 402, and the first gate insulating layer 150, the second gate insulating layer 160 and the dielectric layer 170 are etched to form the third through hole 403.
  • the insulating layer 195 is deposited, and the insulating layer 195 is etched so that the insulating layer 195 fills the first through hole 401.
  • the second metal layer M2 is etched to form the second segment 3022 of the driving voltage lead 302, the data voltage lead 300, and the source 202 and drain 204 (output) of the driving transistor T2, wherein the first The second section 3022 is connected to the first section 3021 through the second through hole 403, and the source electrode 202 is connected to the active layer 200 through the third through hole 403.
  • a flat layer 180 is formed on the dielectric layer 170, and the flat layer 170 is etched to form a fourth through hole 404.
  • the third metal layer M3 formed on the flat layer 180 is etched to form the anode layer 121, wherein the anode layer 121 is connected to the source electrode 202 through the fourth through hole 404.
  • the pixel definition layer 190 is formed on the flat layer 180, and then the pixel definition layer 190 is etched to form the fifth through hole 405. Then, the light-emitting layer 122 and the cathode layer 144 of the organic light-emitting diode 12 are sequentially formed on the anode layer 121.
  • the data voltage lead and the driving voltage lead of the flexible organic light emitting diode device of the present invention are respectively located in different layers in the bendable non-display area, so the layout space can be saved, and the beneficial effect of shortening the border .

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Abstract

一种柔性OLED装置（10），包含柔性基板(120)、缓冲层(140)、无机层(130)、第一栅极绝缘层(150)、第二栅极绝缘层(160)、介电层(170)、平坦层(180)、像素定义层(190)、驱动晶体管(T2)、有机发光二极管(12)、数据电压引线(300)及驱动电压引线(302, 304)。所述驱动电压(302, 304)引线通过贯穿所述第二栅极绝缘层(160)、所述第一栅极绝缘层(150)、所述无机层(130)和所述缓冲层(140)的第一通孔(401)并通过贯穿所述介电层(170)的第二通孔(402)而连接到所述驱动电压端。

Description

柔性有机发光二极管装置以及其形成方法 技术领域
本发明涉及显示技术领域，尤指一种柔性有机发光二极管(Organic Light-Emitting Diode，OLED)装置及其形成方法。
 背景技术
有机发光二极管（Organic Light-Emitting Diode，OLED）由于其重量轻、自发光、广视角、低驱动电压、高发光效率、低功耗、响应速度快等优点，应用范围越来越广泛。尤其是柔性OLED显示装置具有可弯折易携带的特点，成为显示技术领域开发的主要领域。因为柔性OLED基板可以弯折到显示屏的背面，因此可以缩短边框。但由于目前柔性OLED基板为圆弧设计，且数组(Array)结构中的电源信号从显示区(Active area)引出后会在与漏源极(Source/Drain)同层的第一金属层布线，数据信号则采用与双栅极层GE1/GE2交替走线方式布线，同时在柔性OLED面板弯折区域的电源信号也必须在该第一金属层布线。因此这导致柔性OLED基板的边框过宽。因此如何缩短边框，是有待解决的技术问题。
 技术问题
有鉴于此，本发明的目的是提供一种柔性有机发光二极管装置以及其形成方法，以解决现有技术的问题。
 技术解决方案
本发明的技术方案提供一种柔性有机发光二极管装置，其包含显示区以及非显示区，所述柔性有机发光二极管装置包含：柔性基板；无机层，设置于所述柔性基板上；缓冲层，设置于所述缓冲层上第一栅极绝缘层，设置于所述无机层上；第二栅极绝缘层，设置于所述第一栅极绝缘层上；介电层，设置于所述第二栅极绝缘层上；平坦层，设置于所述介电层上；像素定义层，设置于所述平坦层上；驱动晶体管，位于所述显示区之中，其包含控制极和输出极，用来接收数据电压和驱动电压；有机发光二极管，位于所述显示区之中，其包含阳极层、阴极层和发光层，所述发光层位于所述阳极层和所述阴极层之间，用来依据所述数据电压和所述驱动电压的电压差产生光线；数据电压引线，连接于所述驱动晶体管的控制极，其中在所述非显示区之中，所述数据电压引线位于所述介电层上；驱动电压引线，连接于所述驱动晶体管的输出极和驱动电压端，其中在所述非显示区之中，所述驱动电压引线通过贯穿所述第二栅极绝缘层、所述第一栅极绝缘层、所述无机层和所述缓冲层的第一通孔并通过贯穿所述介电层的第二通孔而连接到所述驱动电压端。
依据本发明的实施例，所述驱动晶体管另包含有源层，所述有源层设置于所述缓冲层之上，所述控制极位于所述第一栅极绝缘层上，所述输出极通过贯穿所述介电层、所述第二栅极绝缘层和所述第一栅极绝缘层的第三通孔，连接到所述有源层。
依据本发明的实施例，所述阳极层通过贯穿所述平坦层的第四通孔连接于所述输出极，用来接收所述驱动电压。
依据本发明的实施例，所述柔性基板的材质为聚酰亚胺(Polyimide，PI)。
依据本发明的实施例，所述无机层的材质可选自硅氧化合物(SiOx)、硅氮化合物(SiNx)的其中一种材料。
本发明的技术方案还提供一种形成柔性有机发光二极管装置的方法，其包含：形成柔性基板；依序形成无机层和缓冲层于所述柔性基板上；形成驱动晶体管的有源层于所述缓冲层上；形成第一栅极绝缘层于所述缓冲层上；形成所述驱动晶体管的控制极于所述第一栅极绝缘层上；形成第二栅极绝缘层于所述第一栅极绝缘层上；蚀刻所述缓冲层、所述第一栅极绝缘层和所述第二栅极绝缘层以形成第一通孔；通过蚀刻第一金属层以形成驱动电压引线的第一段，其中所述驱动电压引线的第一段通过所述第一通孔连接驱动电压端；形成介电层于所述第二栅极绝缘层上；蚀刻所述介电层以形成第二通孔，并蚀刻所述第一栅极绝缘层、所述第二栅极绝缘层和所述介电层以形成第三通孔；通过蚀刻第二金属层以形成所述驱动电压引线的第二段、数据电压引线以及所述驱动晶体管的输出极，其中所述驱动电压引线的第二段通过所述第二通孔连接所述第一段，所述输出极通过所述第三通孔连接所述有源层；形成平坦层于所述介电层上；形成有机发光二极管于所述平坦层上，其中所述有机发光二极管的阳极层通过连接于所述输出极。
依据本发明的实施例，所述形成有机发光二极管于所述平坦层上，其中所述有机发光二极管的阳极层连接于所述输出极的步骤包含：蚀刻所述平坦层以形成第四通孔；蚀刻形成于所述平坦层的第三金属层以形成所述阳极层，其中所述阳极层通过所述第四通孔连接于所述输出极；形成像素定义层于所述平坦层上；蚀刻所述像素定义层以形成第五通孔；依序形成所述有机发光二极管的发光层和阴极层于所述阳极层之上。
依据本发明的实施例，所述蚀刻所述缓冲层、所述第一栅极绝缘层和所述第二栅极绝缘层以形成第一通孔的步骤包含：
蚀刻所述第一栅极绝缘层和所述第二栅极绝缘层以同时形成第一主要通孔和所述第三通孔；及
蚀刻所述缓冲层以形成第一辅助通孔，其中所述第一主要通孔和所述第一辅助通孔组成所述第一通孔。
依据本发明的实施例，所述柔性有机发光二极管装置包含显示区以及非显示区，所述驱动晶体管和所述有机发光二极管位于所述显示区，所述驱动电压引线和所述数据电压引线位于所述非显示区。
依据本发明的实施例，所述柔性基板的材质为聚酰亚胺(Polyimide，PI)。
 有益效果
相较于现有技术，本发明柔性有机发光二极管装置的数据电压引线和驱动电压引线在可弯折非显示区分别位于不同层，因此可以节省步线(Layout)空间，具有缩短边框的有益效果。
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
 附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1绘示本发明柔性有机发光二极管装置的示意图。
图2绘示图1显示区内的像素电路的电路图。
图3绘示本实施例提供的柔性OLED装置的结构示意图。
图4-图17绘示形成图3柔性有机发光二极管装置的方法。
 本发明的实施方式
以下各实施例的说明是参考附加的图式，用以例示本发明可用以实施之特定实施例。本发明所提到的方向用语，例如“上”、“下”、“前”、“后”、“左”、“右”、“顶”、“底”、“水平”、“垂直”等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。
请参阅图1和图2，图1绘示本发明柔性有机发光二极管(Organic Light-Emitting Diode，OLED)装置10的示意图，图2绘示图1显示区101内的像素电路110的电路图。柔性OLED装置10包含显示区(Active area)101和非显示区102。非显示区102包含可弯折区1021和信号垫区1022。柔性OLED装置10的可弯折区1021可以弯折，使得信号垫区1022位于显示屏的背面，因此可以缩短边框。信号垫区1022则分布有多条数据电压引线300、多条驱动电压引线302、304、多个数据传输垫310和多个驱动传输垫312、314。多个数据电压引线300一对一连接到多个数据传输垫310，多条驱动电压引线302、304一对一连接到多个驱动传输垫312、314。显示区101设置多个像素电路110，每一像素电路110连接对应的驱动电压引线302、304以及数据电压引线300。数据传输垫310用来接收图像处理器(未图标)传送的数据电压Vdata，并将数据电压Vdata经由数据电压引线300传送至对应的像素电路110。驱动传输垫312、314分别用来传送高/低电平的驱动电压Vdd/Vss，并将驱动电压Vdd/Vss经由驱动电压引线302、304传送至对应的像素电路110。
像素电路110包括开关晶体管T1、驱动晶体管T2、存储电容Cst以及OLED12。当扫描信号电压经由扫描端SCAN传入而打开开关晶体管T1时，数据电压Vdata则会经由数据端DATA发出，经由开关晶体管T1传送至驱动晶体管T2的栅极。当驱动晶体管T2操作在饱和区(saturation regain)时，则驱动晶体管T2上导通电流Id即由跨于驱动晶体管T2的栅极和源极电压（Vsg=Vdd-Vdata）所决定，也就是说Id= K(Vsg-Vt) 2=K(Vdd-Vdata-Vt) 2。由于有机发光二极管12的发光亮度正比于导通电流Id，因此有机发光二极管12即依据数据电压Vdata来调整发光亮度使得对应之像素产生不同的灰阶。此外，由于数据电压Vdata会存储于存储电容Cst，因此有机发光二极管12像素上的亮度可以在画面变化期间保留。
请参阅图3，图3绘示本实施例提供的柔性OLED装置10的结构示意图。柔性OLED装置10包括柔性基板120、无机层130、缓冲层140、第一栅极绝缘层150、第二栅极绝缘层160、介电层( inter layer dielectric，ILD)170、平坦层(Passivation layer)180、像素定义层(Pixel definition layer)190、驱动晶体管T2。柔性基板120可为可弯折的绝缘材料形成，例如聚酰亚胺(PI)、聚碳酸酯(PC)、聚醚砜(PES)、聚对苯二甲酸乙二醇酯(PET)、聚萘二甲酸乙二醇酯(PEN)、多芳基化合物(PAR)或玻璃纤维增强塑料(FRP)等聚合物材料形成。在柔性基板120的表面覆盖有无机层130和缓冲层140，用于阻挡湿气或杂质，防止湿气或杂质通过柔性基板120扩散，并且为柔性基板120提供平坦的表面。在本实施例中，无机层130和缓冲层140可以为氧化硅(SiOx)、氮化硅(SiNx)、氮氧化硅(SiOxNy)、氧化铝(AlOx)或氮化铝(AlNx)等无机材料形成的膜层。驱动晶体管T2可以为薄膜晶体管，其位于缓冲层140上。图3中以顶栅型的薄膜晶体管为例进行的结构说明。驱动晶体管T2包括位于缓冲层140上的半导体有源层200、控制极、输入极和输出极。半导体有源层200包括通过掺杂N型杂质离子或P型杂质离子而形成的源极区域200S和漏极区域200D。在源极区域200S和漏极区域200D之间的区域为不掺杂杂质的沟道区域200C。半导体有源层200可以通过非晶硅的结晶使非晶硅改变为多晶硅而形成。具体的，为了使非晶硅结晶，可以利用快速热退火(RTA)制程、准分子激光退火(ELA)制程、固相结晶(SPC)制程、金属诱导结晶(MIC)制程、金属诱导横向结晶(MILC) 制程或连续横向固化(SLS)制程实现。第一栅极绝缘层150设置在半导体有源层200上，可以由氧化硅、氮化硅或金属氧化物等无机材料形成，并且可以包括单层或多个膜层。栅极201(亦即驱动晶体管T2的控制极)位于第一栅极绝缘层150上的特定区域中。栅极201可以包括金(Au)、银(Ag)、铜(Cu)、钼(Mo)、镍(Ni)、铂(Pt)、铝(Al)或铬(Cr)的单层或多层，或者诸如铝(Al)/钕(Nd)合金、钼(Mo)/钨(W)合金等合金。第二栅极绝缘层160位于栅极201上，且可以由氧化硅或氮化硅等的绝缘无机材料形成。源极202和漏极204(驱动晶体管T2的输出极和输入极)位于第二栅极绝缘层160上，分别通过第三通孔403电连接到源极区域200S和漏极区域200D。第三通孔403可以通过去除第一栅极绝缘层150、第二栅极绝缘层160和介电层170而形成。
平坦层180位于源极202和漏极204上，平坦层180可以通过压克力、聚酰亚胺(PI)或苯并环丁烯(BCB)等的有机材料形成。有机发光二极管12形成在晶体管T2上。有机发光二极管12包括阳极层121、发光层122和阴极层124。阳极层121通过第五通孔电连接到源极202或漏极204(亦即驱动晶体管T2的输出极)。阳极层121可以根据它的用途形成为透明电极或反射电极。当阳极层121为透明电极时，第一电极可以包括氧化铟锡(ITO)、氧化铟锌(IZO)、氧化锌(ZnO)或氧化铟(In2O3)等，当阳极层121为反射电极时，反射层可以由Ag、镁(Mg)、Al、Pt、Pd、Au、Ni、Nd、铱(Ir)、Cr或其混合物形成，并且ITO、IZO、ZnO或In2O3等可以形成在该反射层上。像素定义层(Pixel definition layer，PDL)190位于平坦层180上，覆盖阳极层121的边缘。PDL 190可以由诸如聚酰亚胺(PI)、聚酰胺、苯并环丁烯(BCB)、压克力树脂或酚醛树脂等有机材料形成。发光层122位于阳极层121上，且发光层122位于阳极层121上方的部分未被PDL 190覆盖，即被暴露出来。发光层122的尺寸就是像素的显示面积。发光层122可以通过气相沉积工艺形成并可以由低分子量有机材料或高分子量有机材料形成，发光层122包括有机发射层，并且还可以包括空穴注入层(HIL)、空穴传输层(HTL)、电子传输层(ETL)和电子注入层(EIL)中的至少一个。阴极层124位于发光层122上。与阳极层121相似，阴极层124可以形成为透明电极或反射电极。阳极层121和阴极层124通过发光层122彼此绝缘。发光层122依据阳极层121和阴极层124之间的电压差发射可见光，从而实现能被使用者识别的图像。具体的，阴极层124可以形成为透明电极或反射电极。当阴极层124为透明电极时，可以为锂(Li)、钙(Ca)、氟化锂/钙(LiF/Ca)、氟化锂/铝(LiF/Al)、铝(Al)、镁(Mg)或其组合的化合物等材料形成，并可以通过蒸发初始沉积在发光层上。当阴极层124为反射电极时，可以为Li、Ca、LiF/Ca、LiF/Al、Al、Mg或其混合物。
在本实施例中，数据电压引线300(与源极202或漏极204由第二金属层同时形成)连接于驱动晶体管T2的栅极201，用来传送数据电压Vdata。在非显示区102的范围内，数据电压引线300位于介电层170上。驱动电压引线302(由第一金属层形成)连接于驱动晶体管T2的源极202或漏极204(驱动晶体管T2的输出极)和驱动传输垫312，用来接收驱动电压Vdd。在非显示区120的范围内，驱动电压引线302通过贯穿第二栅极绝缘层160、第一栅极绝缘层150、无机层130和缓冲层120的第一通孔401并通过贯穿介电层170的第二通孔402而连接到驱动传输垫312。
请一并参考图1和图3。数据电压引线300在显示区101和非显示区102都是位于介电层170上，但是驱动电压引线302在非显示区102是延伸弯折至柔性基板120上。通过本实施例的配置，在非显示区102的范围内，驱动电压引线302和数据电压引线300设置于不同层。相比现有技术在非显示区的范围内必须将数据电压引线和驱动电压引线都设置在同一层，本发明在非显示区的范围内将数据电压引线和驱动电压引线都设置在不同层，因此可以减少节省布线(Layout)空间，具有缩短边框的有益效果。另一方面，由于驱动传输垫312是设置于非显示区102的柔性基板120之上，且为一整片金属片，因此驱动电压引线302连接到驱动传输垫312可以降低电压衰退(IR drop)的影响。
请参阅图4-图17，图4-图17绘示形成图3柔性有机发光二极管装置10的方法。如图4所示，形成柔性基板120。如图5所示，依序形成无机层130和缓冲层140于柔性基板120上。如图6所示，形成驱动晶体管T2的有源层200于缓冲层140上，其中有源层200包含源极区域200S、漏极区域200D以及位于两者之间的沟道区域200C。如图7所示，形成第一栅极绝缘层150于缓冲层140上。如图8所示，形成驱动晶体管T2的栅极201(控制极)于第一栅极绝缘层150上。如图9所示，形成第二栅极绝缘层160于第一栅极绝缘层150上。如图10所示，蚀刻无机层130、缓冲层140、第一栅极绝缘层150和第二栅极绝缘层160以形成第一通孔401。具体来说，此步骤须先蚀刻第一栅极绝缘层150和第二栅极绝缘层160以同时形成第一主要通孔4011。接下来，蚀刻无机层130和缓冲层140以形成第一辅助通孔4012，其中第一主要通孔4011和第一辅助通孔4012组成所述第一通孔401。如图11所示，通过蚀刻第一金属层M1以形成驱动电压引线302的第一段3021以及驱动传输垫312。驱动电压引线302的第一段3021通过第一通孔401连接驱动传输垫312。如图12所示，形成介电层(inter layer dielectric)170于第二栅极绝缘层160上。如图13所示，蚀刻介电层170以形成第二通孔402，并蚀刻第一栅极绝缘层150、第二栅极绝缘层160和介电层170以形成第三通孔403。如图14所示，沉积绝缘层195，并蚀刻绝缘层195，使得绝缘层195填满第一通孔401。接下来，通过蚀刻第二金属层M2以形成驱动电压引线302的第二段3022、数据电压引线300以及驱动晶体管T2的源极202和漏极204(输出极)，其中驱动电压引线302的第二段3022通过第二通孔403连接第一段3021，源极202通过第三通孔403连接有源层200。如图15所示，形成平坦层180于介电层170上，并蚀刻平坦层170以形成第四通孔404。如图16所示，蚀刻形成于平坦层180的第三金属层M3以形成阳极层121，其中阳极层121通过第四通孔404连接于源极202。如图17所示，形成像素定义层190于平坦层180上，接下来蚀刻像素定义层190以形成第五通孔405。接着依序形成有机发光二极管12的发光层122和阴极层144于阳极层121之上。
 工业实用性
相较于现有技术，本发明柔性有机发光二极管装置的数据电压引线和驱动电压引线在可弯折非显示区分别位于不同层，因此可以节省步线(Layout)空间，具有缩短边框的有益效果。
综上所述，虽然本发明已以较佳实施例揭露如上，但该较佳实施例并非用以限制本发明，该领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。

Claims (10)

  1. 一种柔性有机发光二极管装置，其包含显示区以及非显示区，其包含：
    柔性基板；
    缓冲层，设置于所述柔性基板上；
    无机层，设置于所述缓冲层上；
    第一栅极绝缘层，设置于所述无机层上；
    第二栅极绝缘层，设置于所述第一栅极绝缘层上；
    介电层，设置于所述第二栅极绝缘层上；
    平坦层，设置于所述介电层上；
    像素定义层，设置于所述平坦层上；
    驱动晶体管，位于所述显示区之中，其包含控制极和输出极，用来接收数据电压和驱动电压；
    有机发光二极管，位于所述显示区之中，其包含阳极层、阴极层和发光层，所述发光层位于所述阳极层和所述阴极层之间，用来依据所述数据电压和所述驱动电压的电压差产生光线；
    数据电压引线，连接于所述驱动晶体管的控制极，其中在所述非显示区之中，所述数据电压引线位于所述介电层上，所述数据电压引线在所述非显示区域的弯折区位于所述平坦层上；及
    驱动电压引线，连接于所述驱动晶体管的输出极和驱动电压端，其中在所述非显示区之中，所述驱动电压引线通过贯穿所述第二栅极绝缘层、所述第一栅极绝缘层、所述无机层和所述缓冲层的第一通孔并通过贯穿所述介电层的第二通孔而连接到所述驱动电压端。
  2. 如权利要求1所述的柔性有机发光二极管装置，其中所述驱动晶体管另包含有源层，所述有源层设置于所述缓冲层之上，所述控制极位于所述第一栅极绝缘层上，所述输出极通过贯穿所述介电层、所述第二栅极绝缘层和所述第一栅极绝缘层的第三通孔，连接到所述有源层。
  3. 如权利要求1所述的柔性有机发光二极管装置，其中所述阳极层通过贯穿所述平坦层的第四通孔连接于所述输出极，用来接收所述驱动电压。
  4. 如权利要求1所述的柔性有机发光二极管装置，其中所述柔性基板的材质为聚酰亚胺。
  5. 如权利要求1所述的柔性有机发光二极管装置，其中所述无机层的材质可选自硅氧化合物(SiOx)、硅氮化合物(SiNx)的其中一种材料。
  6. 一种形成柔性有机发光二极管装置的方法，其包含：
    形成柔性基板；
    依序形成无机层和缓冲层于所述柔性基板上；
    形成驱动晶体管的有源层于所述缓冲层上；
    形成第一栅极绝缘层于所述缓冲层上；
    形成所述驱动晶体管的控制极于所述第一栅极绝缘层上；
    形成第二栅极绝缘层于所述第一栅极绝缘层上；
    蚀刻所述缓冲层、所述第一栅极绝缘层和所述第二栅极绝缘层以形成第一通孔；
    通过蚀刻第一金属层以形成驱动电压引线的第一段，其中所述驱动电压引线的第一段通过所述第一通孔连接驱动电压端；
    形成介电层于所述第二栅极绝缘层上；
    蚀刻所述介电层以形成第二通孔，并蚀刻所述第一栅极绝缘层、所述第二栅极绝缘层和所述介电层以形成第三通孔；
    通过蚀刻第二金属层以形成所述驱动电压引线的第二段、数据电压引线以及所述驱动晶体管的输出极，其中所述驱动电压引线的第二段通过所述第二通孔连接所述第一段，所述输出极通过所述第三通孔连接所述有源层；
    形成平坦层于所述介电层上；及
    形成有机发光二极管于所述平坦层上，其中所述有机发光二极管的阳极层通过连接于所述输出极。
  7. 如权利要求6所述的方法，其中所述形成有机发光二极管于所述平坦层上，其中所述有机发光二极管的阳极层连接于所述输出极的步骤包含：
    蚀刻所述平坦层以形成第四通孔；
    蚀刻形成于所述平坦层的第三金属层以形成所述阳极层，其中所述阳极层通过所述第四通孔连接于所述输出极；
    形成像素定义层于所述平坦层上；
    蚀刻所述像素定义层以形成第五通孔；以及
    依序形成所述有机发光二极管的发光层和阴极层于所述阳极层之上。
  8. 如权利要求6所述的方法，其中所述蚀刻所述缓冲层、所述第一栅极绝缘层和所述第二栅极绝缘层以形成第一通孔的步骤包含：
    蚀刻所述第一栅极绝缘层和所述第二栅极绝缘层以形成第一主要通孔；及
    蚀刻所述缓冲层以形成第一辅助通孔，其中所述第一主要通孔和所述第一辅助通孔组成所述第一通孔。
  9. 如权利要求6所述的方法，其中所述柔性有机发光二极管装置包含显示区以及非显示区，所述驱动晶体管和所述有机发光二极管位于所述显示区，所述驱动电压引线和所述数据电压引线位于所述非显示区。
  10. 如权利要求6所述的方法，其中所述柔性基板的材质为聚酰亚胺。
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