WO2020108017A1 - 显示面板、显示装置及制作用于显示面板的基板的方法 - Google Patents

显示面板、显示装置及制作用于显示面板的基板的方法 Download PDF

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Publication number
WO2020108017A1
WO2020108017A1 PCT/CN2019/105984 CN2019105984W WO2020108017A1 WO 2020108017 A1 WO2020108017 A1 WO 2020108017A1 CN 2019105984 W CN2019105984 W CN 2019105984W WO 2020108017 A1 WO2020108017 A1 WO 2020108017A1
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Prior art keywords
inorganic film
film layer
display panel
layer
opening
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Ceased
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PCT/CN2019/105984
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English (en)
French (fr)
Inventor
毛祖攀
朱阳杰
高薇
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Kunshan Govisionox Optoelectronics Co Ltd
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Kunshan Govisionox Optoelectronics Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment

Definitions

  • the present application relates to the technical field of display devices, and in particular, to a display panel, a display device, and a method of manufacturing a substrate for the display panel.
  • Organic light emitting diode Organic Light Emitting Diode, OLED for short
  • OLED display devices have the advantages of self-luminescence, high luminous efficiency, short response time, high definition and high contrast, etc., and have become the display devices with the most development potential at present.
  • OLED display devices are mainly divided into active organic light emitting diodes (Active Matrix OLED, AMOLED for short) and passive organic light emitting diodes (Passive Matrix OLED, PMOLED for short).
  • active organic light emitting diodes Active Matrix OLED, AMOLED for short
  • Passive Matrix OLED, PMOLED for short passive organic light emitting diodes
  • due to AMOLED's low manufacturing cost and wide operating temperature range The advantages of being applicable to DC driving of portable equipment and being used as large-size display devices with high definition are increasingly recognized by people, and have become the mainstream development trend of OLED display devices. How to provide a better OLED display device has gradually become a research hotspot.
  • the present application provides a display panel, a display device, and a method of manufacturing a substrate for the display panel, to solve the problems of low reliability and poor flexibility of the display panel in the related art OLED display device.
  • the present application provides a display panel including a substrate, and the substrate includes an organic film layer, an inorganic film layer, and a metal layer stacked in sequence;
  • the substrate is divided into a display area and a bending area connected at least part of the edge of the display area;
  • An opening is formed on the metal layer in the bending zone, the opening extends into the inorganic film layer, and the opening divides the metal layer into a plurality of metal traces.
  • the present application also provides a display device including the display panel as described above.
  • the present application also provides a method of manufacturing a substrate for a display panel, including: forming an inorganic film layer on an organic film layer; forming a metal layer on the inorganic film layer; and opposing the metal layer located in a bending region An etching is performed to form an opening, and the opening divides the metal layer into a plurality of metal traces; the inorganic film layer corresponding to the position of the opening is removed by the opening.
  • the display panel, the display device and the method for manufacturing a substrate for a display panel provided by the present application, by providing a substrate, the substrate includes an organic film layer, an inorganic film layer and a metal layer that are sequentially stacked; the substrate is divided into a display area and connected to the display Bending zone at least part of the edge of the zone; an opening is formed in the metal layer in the bending zone, the opening extends into the inorganic film layer, and the opening divides the metal layer into multiple metal traces, avoiding the two sides of the opening
  • the metal traces are connected to each other to cause a short circuit, and the thickness of the inorganic film layer at the opening is reduced, the flexibility of the display panel is improved, cracks are prevented from expanding between the metal layers on both sides of the opening, and the display panel and display device are improved Reliability.
  • Figure 1 is a schematic diagram 1 of the overall structure of the display panel of the present application.
  • FIG. 2 is a schematic diagram 2 of the overall structure of the display panel of the present application.
  • Figure 3 is an expanded schematic view of Figure 2;
  • FIG. 4 is a schematic structural view of the bending area in FIG. 3;
  • FIG. 5 is a schematic diagram of the structure of the bending zone in FIG. 3;
  • Embodiment 1 of the display panel of the present application is a cross-sectional view of Embodiment 1 of the display panel of the present application.
  • Embodiment 7 is a cross-sectional view of Embodiment 2 of the display panel of the present application.
  • Embodiment 8 is a cross-sectional view of Embodiment 3 of the display panel of the present application.
  • Embodiment 4 of the display panel of the present application is a cross-sectional view of Embodiment 4 of the display panel of the present application.
  • Embodiment 10 is a cross-sectional view of Embodiment 5 of the display panel of the present application.
  • FIG. 11 is a schematic diagram of the structure of the bending area in FIG. 10;
  • FIG. 12 is a schematic diagram of the structure of the bending area in FIG. 10;
  • FIG. 13 is a schematic diagram of the structure of the bending area in FIG. 3.
  • FIG. 1 is a schematic diagram 1 of the overall structure of the display panel of the present application
  • FIG. 2 is a schematic diagram 2 of the overall structure of the display panel of the present application
  • FIG. 3 is an expanded schematic view of FIG. 2;
  • an embodiment of the present application provides a display panel including a substrate including an organic film layer 100, an inorganic film layer 200 and a metal layer 300 stacked in sequence; the substrate is divided into a display area 500 and connected to The bending area 600 at least part of the edge of the display area 500; an opening 400 is formed on the metal layer 300 in the bending area 600, the opening 400 extends into the inorganic film layer 200, and the opening 400 divides the metal layer 300 into a plurality of Metal trace 310.
  • the display panel may be an OLED display panel, and the display panel may have a substrate including an organic film layer 100, an inorganic film layer 200, and a metal layer 300 that are stacked in this order from bottom to top in FIG. 4.
  • the organic film layer 100 may be a film layer composed of organic materials such as polyimide, and the organic film layer 100 may have a certain flexibility, so that the display panel is easily bent.
  • the inorganic film layer 200 may be a film layer made of an inorganic material such as silicon oxide or silicon nitride.
  • an inorganic material such as silicon oxide or silicon nitride.
  • the metal layer 300 may be a film layer made of a conductive material such as silver, aluminum, silver aluminum alloy, or the like.
  • the metal layer 300 may be patterned to form a plurality of metal traces 310 to provide various signals for the display panel.
  • the patterning here may be the opening 400 described above.
  • Both the display area 500 and the bending area 600 are a certain area in the substrate. Therefore, both the display area 500 and the bending area 600 may include an organic film layer 100, an inorganic film layer 200, and a metal layer 300 that are sequentially stacked. A plurality of pixels can be arranged in an array on the display area 500, and each pixel can emit light independently, so that the display area 500 can display a preset picture.
  • the bending area 600 may be located at the edge of the display area 500, the display area 500 may be located at an intermediate position of the entire display device, and the bending area 600 may be connected to at least part of the edge of the display area 500.
  • the display area 500 may be a square structure, and the bending area 600 may be a ring structure surrounding all edge positions of the display area 500.
  • the bending area 600 may be disposed at one edge of the display area 500.
  • the bending area 600 needs to be bent at a certain angle during the processing of the display panel, so that a display device having a curved screen or a full screen can be formed.
  • An opening 400 is formed in the metal layer 300 in the bending region 600.
  • the opening 400 may penetrate the metal layer 300 and extend into the inorganic film layer 200, so that metal traces 310 may be formed on both sides of the opening 400.
  • the number of the openings 400 may be multiple, and the shapes thereof may also be multiple, so that the metal layer 300 forms a plurality of metal traces 310 with different shapes (for example, a fold line shape, a linear shape, etc.).
  • the organic film layer 100, the inorganic film layer 200, and the metal layer 300 may be formed in sequence, and then the metal layer 300 is etched through the patterning process to form the opening 400, and the corresponding opening 400 is etched away. ⁇ The inorganic film layer 200.
  • the opening 400 extends into the inorganic film layer 200, which can ensure that all the metal layer 300 in the opening 400 is removed, and the metal traces 310 on both sides of the opening 400 have no contact, so as to avoid short circuit between the metal traces 310.
  • the flexibility of the bending area 600 of the display panel can be improved, and the display panel can be prevented from being broken when being bent.
  • the inorganic film layer 200 at the opening 400 is relatively thin, if a crack is generated in the metal trace 310 on one side of the opening 400 when the display panel is bent, the crack is difficult to propagate through the inorganic film layer 200 to the other side of the opening 400 This prevents the metal trace 310 on the other side of the opening 400 from breaking, which improves the life of the display panel.
  • the substrate includes an organic film layer, an inorganic film layer, and a metal layer stacked in sequence; the substrate is divided into a display area and a bending area connected to at least a part of an edge of the display area;
  • An opening is formed in the metal layer in the bending zone, the opening extends into the inorganic film layer, and the opening divides the metal layer into a plurality of metal traces, avoiding the interconnection of the metal traces on both sides of the opening to cause short circuit and reduce
  • the thickness of the inorganic film layer at the position of the opening improves the flexibility of the display panel, prevents cracks from expanding between the metal layers on both sides of the opening, and improves the reliability of the display panel and the display device.
  • FIG. 5 is a schematic structural diagram of the bending region in FIG. 3; please refer to FIG. 5, the opening 400 penetrates the inorganic film layer 200 and stops at the organic film layer 100.
  • the inorganic film layers 200 in the position can also be removed, so that the inorganic film layers 200 on both sides of the opening 400 have no contact, completely avoiding cracks through the inorganic film
  • the layer 200 expands from one side of the opening 400 to the other side, and at the same time, the opening 400 is terminated by the organic film layer 100, which can avoid the etching of the organic film layer 100 and cause the problem of chamber contamination.
  • FIG. 6 is a cross-sectional view of Embodiment 1 of the display panel of the present application. Please refer to FIG. .
  • the area on the left side of the center line 610 is the display area 500
  • the area on the right side of the center line 610 is the bending area 600
  • the thickness may be a dimension perpendicular to the direction of the organic film layer 100, in FIG. 6
  • the thickness direction can be the up and down direction in the figure.
  • the thickness of the inorganic film layer 200 in the display area 500 may be greater than the thickness of the inorganic film layer 200 in the bending area 600.
  • the inorganic film layer 200 may be composed of the same material.
  • a whole layer of the inorganic film layer 200 covering the display area 500 and the bending area 600 may be formed on the organic film layer 100, and then engraved.
  • Embodiment 2 of the display panel of the present application is a cross-sectional view of Embodiment 2 of the display panel of the present application; please refer to FIG. 7, this embodiment is an improvement of the inorganic film layer 200 in the embodiment of FIG. 6, the inorganic film layer 200 includes a first inorganic layer stacked and contacted The film layer 210 and the second inorganic film layer 220, the first inorganic film layer 210 is located in the display area 500 and the bending area 600, and the second inorganic film layer 220 is located in the display area 500.
  • the inorganic film layer 200 may include a first inorganic film layer 210 and a second inorganic film layer 220, the second inorganic film layer 220 is disposed in contact with the first inorganic film layer 210, the first inorganic film layer 210 and the second inorganic
  • the film layer 220 may be composed of different inorganic materials, for example, the first inorganic film layer 210 may be silicon nitride, and the second inorganic film layer 220 may be silicon oxide.
  • a first inorganic film layer 210 may be formed on the organic film layer 100 first, and then a second inorganic film layer 220 may be formed on the first inorganic film layer 210. Both the first inorganic film layer 210 and the second inorganic film layer 220 cover the display area 500 and the bending area 600. Next, the second inorganic film layer 220 in the bending region 600 is etched away, so that only the first inorganic film layer 210 exists in the bending region 600.
  • the etching products of the two are different, and whether the first inorganic film layer 210 and the second inorganic film are etched can be judged by the change of the etching product
  • accurately grasp the interface between the first inorganic film layer 210 and the second inorganic film layer 220 thereby accurately grasping the etching curve, accurately controlling the etching thickness, and avoiding the organic film layer 100 being etched This leads to the problem of chamber contamination.
  • FIG. 8 is a cross-sectional view of Embodiment 3 of the display panel of the present application; please refer to FIG. 8.
  • the first inorganic film layer 210 includes a plurality of first sub-inorganic film layers 2111 and 2112 disposed in contact with each other, two adjacent first The materials of the sub-inorganic film layers 2111 and 2112 are different, and the opening 400 penetrates at least one first sub-inorganic film layer 2111.
  • the first inorganic film layer 210 may be formed by sequentially stacking a plurality of first sub-inorganic film layers 2111 and 2112 made of different materials, because two adjacent first sub-inorganic film layers, namely the first sub-inorganic film layer 2111
  • the first sub-inorganic film layer 2112 is composed of different materials, so that multiple interfaces for grabbing the etching end point can be provided.
  • the etching product can be analyzed to determine whether the two adjacent first sub-inorganic film layers 2111 and The interface of 2112 can further control the etching thickness to avoid etching to the organic film layer 100 and causing chamber contamination.
  • the first inorganic film layer 210 is formed by alternately setting two sub-layers of different materials.
  • the first inorganic film layer 210 may be formed by overlapping silicon oxide layers or silicon nitride layers, and each silicon oxide layer or each silicon nitride layer constitutes a first sub-inorganic film layer, thereby reducing processing cost.
  • FIG. 9 is a cross-sectional view of Embodiment 4 of the display panel of the present application; please refer to FIG.
  • the materials of the film layers 2211 and 2212 are different.
  • the second inorganic film layer 220 may also be formed by sequentially stacking a plurality of second sub-inorganic film layers 2211 and 2212 made of different materials, because two adjacent second sub-inorganic film layers, that is, the second sub-inorganic film layer 2211 and the second sub-inorganic film layer 2212 are made of different materials, which can provide multiple interfaces for grabbing the etching end point. At this time, it is possible to determine whether the two adjacent second sub-inorganic film layers are reached by analyzing the etching product The interface between 2211 and 2212 can further control the etching thickness to avoid etching into the organic film layer 100 and causing chamber contamination.
  • the second inorganic film layer 220 is formed by alternately setting two sub-layers of different materials.
  • the second inorganic film layer 220 may be formed by overlapping silicon oxide layers or silicon nitride layers, and each silicon oxide layer or each silicon nitride layer constitutes a second sub-inorganic film layer, thereby reducing processing cost.
  • the first inorganic film layer 210 is a film layer composed of a single material.
  • FIG. 10 is a cross-sectional view of Embodiment 5 of the display panel of the present application. Please refer to FIG. 10.
  • the first inorganic film layer 210 For a multilayer structure composed of multiple first sub-inorganic film layers (such as the first sub-inorganic film layer 2111 and the first sub-inorganic film layer 2112 shown in FIG. 10), the second inorganic film layer 220 is also composed of multiple The multilayer structure of the second sub-inorganic film layer composition (such as the second sub-inorganic film layer 2211 and the second sub-inorganic film layer 2212 shown in FIG.
  • the second sub-inorganic film layer closest to the organic film layer 100 (Ie, the second sub-inorganic film layer 2212) and the first sub-inorganic film layer farthest from the organic film layer 100 (ie, the first sub-inorganic film layer 2111) may be composed of different materials.
  • FIG. 11 is a schematic structural diagram of the bending region in FIG. 10 ;
  • the first sub-inorganic film layer in the figure may include two layers (2111 and 2112), and the opening 400 may only penetrate one layer of the first sub-inorganic film layer 2111, which ensures the metal traces on both sides of the opening 400 310 will not short circuit.
  • the flexibility of the bending area 600 of the display panel is improved to prevent the display panel from breaking when it is bent.
  • the cracks can be prevented from propagating from one side of the opening 400 to the other side, which improves the life of the display panel.
  • FIG. 12 is a schematic diagram of the structure of the bending area in FIG. 10.
  • the opening 400 may also penetrate all the first sub-inorganic film layers. That is, on the basis of FIG. 11, the first sub-inorganic film layer 2112 above the organic film layer 100 in FIG. 11 can also be etched away to form the structure of FIG. 12.
  • the thickness of the first sub-inorganic film layer is a certain value, and the materials of the plurality of first sub-inorganic film layers are different.
  • the thickness of the first sub-inorganic film layer remaining in the opening 400 can be determined, and the thickness is smaller than the thickness of the inorganic film layer in the related art, the etching error is smaller, the etching thickness is accurately controllable, and the inorganic thickness can be further reduced While the thickness of the film layer 200 is reduced, the probability of being etched into the organic film layer 100 is reduced to avoid chamber contamination.
  • an organic layer 700 is formed above the metal layer 300, and a part of the organic layer 700 is in the opening.
  • the organic layer 700 may be a film layer made of an organic material such as polyimide.
  • the neutral plane 800 refers to the plane 800 where the layer that is neither elongated nor shortened at the junction of the elongated layer 810 and the shortened layer 820 when the bending zone 600 is bent, for example, when the bending zone 600 occurs When bending, the layer at the boundary between the elongated layer 810 and the shortened layer 820 does not bend, and the plane on which it is located is the neutral plane 800 described above.
  • This embodiment also provides a display device, including a display panel.
  • the structure and function of the display panel are the same as those in the above-mentioned embodiment. For details, reference may be made to the above-mentioned embodiment, which will not be repeated here.
  • the substrate includes an organic film layer, an inorganic film layer, and a metal layer stacked in sequence; the substrate is divided into a display area and a bending area connected to at least a part of the edge of the display area;
  • An opening is formed in the metal layer in the folded area, the opening extends into the inorganic film layer, and the opening divides the metal layer into a plurality of metal traces, which avoids the metal traces on both sides of the opening being connected to each other to cause a short circuit, and reduces
  • the thickness of the inorganic film layer at the position of the opening improves the flexibility of the display panel, prevents cracks from expanding between the metal layers on both sides of the opening, and improves the reliability of the display panel and the display device.
  • This embodiment also provides a method of manufacturing a substrate for a display panel, including the following steps:
  • step 1 an inorganic film layer 200 is formed on the organic film layer 100.
  • step 2 a metal layer 300 is formed on the inorganic film layer 200.
  • Step 3 the metal layer 300 located in the bending region 600 is etched to form an opening 400, and the opening 400 divides the metal layer 300 into a plurality of metal traces 310.
  • step 4 the inorganic film layer 200 corresponding to the position of the opening 400 is removed by means of the opening 400.
  • the materials of the organic film layer 100, the inorganic film layer 200, and the metal layer 300 can refer to the above embodiments.
  • the organic film layer 100, the inorganic film layer 200, and the metal layer 300 can be commonly used in related technologies such as deposition, evaporation, or sputtering. Form of processing.
  • the substrate may be divided into a display area 500 and a bending area 600.
  • the metal layer 300 at the position of the opening 400 is over-etched, that is, not only the metal layer 300 is completely removed, but also The inorganic film layer 200 is partially etched to ensure that the metal traces 310 on both sides of the opening 400 will not short-circuit.
  • the flexibility of the display panel using the substrate is improved to prevent the display panel from breaking when it is bent.
  • step 1 may also include the following steps:
  • step 11 a first inorganic film layer 210 is formed on the organic film layer 100.
  • Step 12 forming a second inorganic film layer 220 on the first inorganic film layer 210; the first inorganic film layer 210 and the second inorganic film layer 220 constitute the inorganic film layer 200.
  • step 13 the second inorganic film layer 220 in the bending region 600 is removed by etching.
  • a first inorganic film layer 210 may be first formed on the organic film layer 100, and then a second inorganic film layer 220 may be formed on the first inorganic film layer 210. Both the inorganic film layer 210 and the second inorganic film layer 220 cover the display area 500 and the bending area 600, and then the second inorganic film layer 220 in the bending area 600 is etched away, so that only the first inorganic ⁇ 210 ⁇ The film layer 210.
  • the etching products of the two are different, and whether the first inorganic film layer 210 and the second inorganic film are etched can be judged by the change of the etching product
  • accurately grasp the interface between the first inorganic film layer 210 and the second inorganic film layer 220 thereby accurately grasping the etching end point, accurately controlling the etching thickness, and avoiding the organic film layer 100 being etched This leads to the problem of chamber contamination.
  • the first inorganic film layer 210 includes a plurality of first sub-inorganic film layers, two adjacent first sub-inorganic film layers (such as the first sub-inorganic film layers 2111 and 2112) have different materials, and the second inorganic film layer
  • the layer 220 includes a plurality of second sub-inorganic film layers, and materials of two adjacent second sub-inorganic film layers (such as the second sub-inorganic film layers 2211 and 2212) are different.
  • a plurality of first sub-inorganic film layers can be sequentially formed on the organic film layer 100, and then a plurality of second sub-inorganic film layers can be formed, so that multiple interfaces for grabbing the etching end point can be provided to avoid etching During the process, a certain interface is missed, which causes the organic film layer 100 to be etched to contaminate the chamber.
  • step 4 may further include: removing at least one first sub-inorganic film layer in the bending region 600 by means of the opening 400. Therefore, not only the metal layer 300 is completely removed, but also the inorganic film layer 200 under the metal layer 300 is partially etched, which ensures that the metal traces 310 on both sides of the opening 400 will not be short-circuited. At the same time, the flexibility of the display panel is improved to prevent the display panel from breaking when it is bent. In addition, the cracks can be prevented from propagating from one side of the opening 400 to the other side, which improves the life of the display panel.
  • step 4 can also remove all the first sub-inorganic film layers. Since the interface of the etching end point can be grasped, the etching error in this step is smaller, and the etching thickness can be controlled accurately, which can further reduce the inorganic film layer. At a thickness of 200, the probability of etching to the organic film layer 100 is reduced to avoid chamber contamination.

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Abstract

本申请提供一种显示面板、显示装置及制作用于显示面板的基板的方法。该显示面板包括基板，基板包括依次层叠设置的有机膜层、无机膜层以及金属层；基板划分为显示区以及连接在显示区的至少部分边缘处的弯折区；弯折区内的金属层上形成有开口，开口延伸至无机膜层内，并且开口将金属层划分成多条金属走线。本申请提供的显示面板、显示装置及制作用于显示面板的基板的方法，避免了开口两侧的金属走线相互连接而发生短路，并且降低了开口位置处的无机膜层的厚度，提高了显示面板柔性，避免了裂纹在开口两侧的金属层之间发生扩展，提高了显示面板及显示装置的可靠性。

Description

显示面板、显示装置及制作用于显示面板的基板的方法 技术领域
本申请涉及显示装置技术领域，尤其涉及一种显示面板、显示装置及制作用于显示面板的基板的方法。
背景技术
有机发光二极管(Organic Light Emitting Diode，简称OLED)显示装置因其具有自发光、发光效率高、响应时间短、高清晰度和高对比度等优点，成为当前最具发展潜力的显示装置。OLED显示装置主要分为主动式有机发光二极管(Active Matrix OLED，简称AMOLED)和被动式有机发光二极管(Passive Matrix OLED，简称PMOLED)两大类，其中，由于AMOLED具有制作成本低、工作温度范围大、可用于便携式设备的直流驱动、可用作高清晰度的大尺寸显示装置等优点，越来越被人们所认可，也成为OLED显示装置的主流发展趋势。如何提供一种更好的OLED显示装置逐渐成为研究的热点。
发明内容
本申请提供一种显示面板、显示装置及制作用于显示面板的基板的方法，以解决相关技术中OLED显示装置可靠性低、显示面板柔性差的问题。
本申请提供一种显示面板，包括基板，所述基板包括依次层叠设置的有机膜层、无机膜层以及金属层；
所述基板划分为显示区以及连接在所述显示区的至少部分边缘处的弯折区；
所述弯折区内的所述金属层上形成有开口，所述开口延伸至所述无机膜层内，并且所述开口将所述金属层划分成多条金属走线。
如上所述的显示面板，其中，所述开口贯穿所述无机膜层且中止于所述有机膜层。
如上所述的显示面板，其中，所述显示区内的所述无机膜层的厚度大 于所述弯折区内的所述无机膜层的厚度。
本申请还提供一种显示装置，包括如上所述的显示面板。
本申请还提供一种制作用于显示面板的基板的方法，包括：在有机膜层上形成无机膜层；在所述无机膜层上形成金属层；对位于弯折区内的所述金属层进行刻蚀以形成开口，并所述开口将所述金属层划分成多条金属走线；借助于所述开口去除对应于所述开口位置的无机膜层。
本申请提供的显示面板、显示装置及制作用于显示面板的基板的方法，通过设置基板，基板包括依次层叠设置的有机膜层、无机膜层以及金属层；基板划分为显示区以及连接在显示区的至少部分边缘处的弯折区；弯折区内的金属层上形成有开口，开口延伸至无机膜层内，并且开口将金属层划分成多条金属走线，避免了开口两侧的金属走线相互连接而发生短路，并且降低了开口位置处的无机膜层的厚度，提高了显示面板柔性，避免了裂纹在开口两侧的金属层之间发生扩展，提高了显示面板及显示装置的可靠性。
附图说明
以下结合附图对本申请的具体实施方式进行详细说明，应当理解的是，此处所描述的具体实施方式仅用于说明和解释本申请，本申请不局限于下述的具体实施方式。
图1为本申请显示面板的整体结构示意图一；
图2为本申请显示面板的整体结构示意图二；
图3为图2的展开示意图；
图4为图3中弯折区的结构示意图；
图5为图3中弯折区的结构示意图；
图6为本申请显示面板实施例一的剖视图；
图7为本申请显示面板实施例二的剖视图；
图8为本申请显示面板实施例三的剖视图；
图9为本申请显示面板实施例四的剖视图；
图10为本申请显示面板实施例五的剖视图；
图11为图10中弯折区的结构示意图；
图12为图10中弯折区的结构示意图；
图13为图3中弯折区的结构示意图。
具体实施方式
以下结合附图对本申请的具体实施方式进行详细说明，应当理解的是，此处所描述的具体实施方式仅用于说明和解释本申请，本申请不局限于下述的具体实施方式。
图1为本申请显示面板的整体结构示意图一；图2为本申请显示面板的整体结构示意图二；图3为图2的展开示意图；图4为图3中弯折区的结构示意图。
请参考图1至图4，本申请实施例提供一种显示面板，包括基板，基板包括依次层叠设置的有机膜层100、无机膜层200以及金属层300；基板划分为显示区500以及连接在显示区500的至少部分边缘处的弯折区600；弯折区600内的金属层300上形成有开口400，开口400延伸至无机膜层200内，并且开口400将金属层300划分成多条金属走线310。
具体地，显示面板可以为OLED显示面板，显示面板可以具有基板，基板包括图4中从下到上依次层叠设置的有机膜层100、无机膜层200和金属层300。
其中，有机膜层100可以是由有聚酰亚胺等有机材料构成的膜层，有机膜层100可以具有一定的柔性，使得显示面板易于弯折。
无机膜层200可以是由氧化硅或氮化硅等无机材料构成的膜层，通过设置无机膜层200且将金属层300形成在无机膜层200上，相比于金属层300直接形成在有机膜层100上，可以提高金属层300的附着力，避免显示面板弯曲时，金属层300与其他层发生分离或者剥离。
金属层300可以是由银、铝、银铝合金等导电材料构成的膜层。金属层300可以经过图案化处理形成多个金属走线310，从而为显示面板提供各种信号。这里的图案化可以为前文所述的开口400。
显示区500和弯折区600都是基板中的某一区域。因此，显示区500和弯折区600都可以包括依次层叠设置的有机膜层100、无机膜层200以及金属层300。显示区500上可以阵列状排布有多个像素，每个像素可以独立发光，从而使得显示区500可以显示预设的画面。
弯折区600可以位于显示区500的边缘，显示区500可以位于整个显示装置的中间位置，弯折区600可以连接在显示区500的至少部分边缘处。例如图1所示，显示区500可以为方形结构，弯折区600可以为环绕显示区500所有边缘位置的环形结构。又例如图2所示，弯折区600可以设置在显示区500的其中一个边缘处。弯折区600在显示面板加工过程中需要发生一定角度的弯折，从而可以形成具有曲面屏或全面屏的显示装置。
位于弯折区600内的金属层300形成有开口400，开口400可以贯穿金属层300，并延伸到无机膜层200中，从而可以使得开口400两侧形成金属走线310。开口400的数量可以为多个，其形状也可以有多种，从而使金属层300形成不同形状(例如折线形、直线型等)的多条金属走线310。
在制造显示面板过程中，可以先依次形成有机膜层100、无机膜层200和金属层300，然后通过图案化处理对金属层300进行刻蚀，以形成开口400，并刻蚀掉开口400对应位置的部分无机膜层200。开口400延伸到无机膜层200中，可以保证去除开口400内的全部金属层300，开口400两侧的金属走线310无接触，避免金属走线310之间发生短路现象。同时，去除部分无机膜层200，可以提高显示面板的弯折区600的柔性，避免显示面板在弯折时发生断裂。另外，由于开口400处的无机膜层200较薄，当显示面板弯曲时，如果开口400一侧的金属走线310中产生裂纹，裂纹难以借由无机膜层200扩展到开口400的另一侧，避免了开口400另一侧的金属走线310断裂，提高了显示面板的寿命。
本申请实施例提供的显示面板，通过设置基板，基板包括依次层叠设置的有机膜层、无机膜层以及金属层；基板划分为显示区以及连接在显示区的至少部分边缘处的弯折区；弯折区内的金属层上形成有开口，开口延伸至无机膜层内，并且开口将金属层划分成多条金属走线，避免了开口两侧的金属走线相互连接而发生短路，并且降低了开口位置处的无机膜层的厚度，提高了显示面板柔性，避免了裂纹在开口两侧的金属层之间发生扩展，提高了显示面板及显示装置的可靠性。
图5为图3中弯折区的结构示意图；请参考图5，开口400贯穿无机膜层200且中止于有机膜层100。
具体地，即刻蚀去除掉开口400对应位置的金属层300后，还可以去 除该位置内的所有无机膜层200，使得开口400两侧的无机膜层200无接触，彻底避免了裂纹经无机膜层200从开口400的一侧扩展到另一侧，同时，将开口400终止于有机膜层100，可避免刻蚀到有机膜层100而造成腔室污染问题。
图6为本申请显示面板实施例一的剖视图，请参考图6，在上述实施例的基础上，显示区500内的无机膜层200的厚度大于弯折区600内的无机膜层200的厚度。
具体地，图6中，中心线610左侧的区域为显示区500，中心线610右侧的区域为弯折区600，厚度可以为垂直于有机膜层100的方向上的尺寸，图6中厚度方向可以为图中的上下方向。显示区500内无机膜层200的厚度可以大于弯折区600内的无机膜层200的厚度。例如，无机膜层200可以由同一种材料构成，形成无机膜层200时，可以先在有机膜层100上形成覆盖显示区500和弯折区600的一整层的无机膜层200，然后刻蚀掉位于弯折区600内的部分无机膜层200，从而使得显示区500内无机膜层200的厚度可以大于弯折区600内的无机膜层200的厚度，发明人发现，通过降低弯折区600内的无机膜层200的厚度，可以避免弯折区600在弯折时发生断裂，进一步提高显示面板的寿命。
图7为本申请显示面板实施例二的剖视图；请参考图7，本实施例是对图6的实施例中的无机膜层200进行改进，无机膜层200包括层叠且接触设置的第一无机膜层210以及第二无机膜层220，第一无机膜层210位于显示区500及弯折区600内，第二无机膜层220位于显示区500内。
具体地，无机膜层200可以包括第一无机膜层210和第二无机膜层220，第二无机膜层220接触设置在第一无机膜层210上，第一无机膜层210和第二无机膜层220可以由不同的无机材料构成，例如第一无机膜层210可以为氮化硅，第二无机膜层220可以为氧化硅。
形成无机膜层200时，可以先在有机膜层100上形成一层第一无机膜层210，然后，在第一无机膜层210上形成一层第二无机膜层220。第一无机膜层210和第二无机膜层220都覆盖显示区500和弯折区600。接着刻蚀掉弯折区600内的第二无机膜层220，使得弯折区600中只存在第一无机膜层210。由于第一无机膜层210和第二无机膜层220为不同材质， 两者的刻蚀产物不同，可以通过刻蚀产物的改变来判断是否刻蚀到第一无机膜层210和第二无机膜层220的交界处，准确抓取第一无机膜层210和第二无机膜层220之间的界面，从而精确抓取刻蚀曲线，精确控制刻蚀厚度，避免出现有机膜层100被刻蚀而导致腔室污染的问题。
图8为本申请显示面板实施例三的剖视图；请参考图8，进一步地，第一无机膜层210包括层叠接触设置的多个第一子无机膜层2111和2112，相邻两个第一子无机膜层2111和2112的材质不同，开口400至少贯穿一个第一子无机膜层2111。
具体地，第一无机膜层210可以由多个不同材质构成的第一子无机膜层2111和2112依次层叠形成，由于相邻两个第一子无机膜层，即第一子无机膜层2111和第一子无机膜层2112由不同材质构成，从而可以提供多个抓取蚀刻终点的界面，这时由于可以通过分析刻蚀产物来判断是否到达相邻两个第一子无机膜层2111和2112的界面，进而实现控制刻蚀厚度，避免刻蚀到有机膜层100而造成腔室污染。
在一实施例中，第一无机膜层210由两种不同材质的子层交替设置而成。例如，第一无机膜层210可以由氧化硅层或氮化硅层交叠设置而成，每个氧化硅层或每个氮化硅层都构成一个第一子无机膜层，从而可以降低加工成本。
图9为本申请显示面板实施例四的剖视图；请结合图9，第二无机膜层220包括层叠且接触设置的多个第二子无机膜层2211和2212，相邻两个第二子无机膜层2211和2212的材质不同。
具体地，第二无机膜层220也可以由多个不同材质构成的第二子无机膜层2211和2212依次层叠形成，由于相邻两个第二子无机膜层，即第二子无机膜层2211和第二子无机膜层2212由不同材质构成，从而可以提供多个抓取刻蚀终点的界面，这时由于可以通过分析刻蚀产物来判断是否到达相邻两个第二子无机膜层2211和2212的界面，进而实现控制刻蚀厚度，避免刻蚀到有机膜层100而造成腔室污染。
在一实施例中，第二无机膜层220由两种不同材质的子层交替设置而成。例如，第二无机膜层220可以由氧化硅层或氮化硅层交叠设置而成，每个氧化硅层或每个氮化硅层都构成一个第二子无机膜层，从而可以降低 加工成本。
另外，图9中，第一无机膜层210为单一材料构成的膜层，图10为本申请显示面板实施例五的剖视图，请结合图10，在本实施例中，第一无机膜层210为由多个第一子无机膜层(比如图10中所示的第一子无机膜层2111和第一子无机膜层2112)构成的多层结构，第二无机膜层220也是由多个第二子无机膜层组成(比如图10中所示的第二子无机膜层2211和第二子无机膜层2212)的多层结构，与有机膜层100距离最近的第二子无机膜层(即第二子无机膜层2212)和与有机膜层100距离最远的第一子无机膜层(即第一子无机膜层2111)可以由不同的材质构成。
进一步地，当弯折区600内的无机膜层200包括多个第一子无机膜层时，开口400可以贯穿至少一个第一子无机膜层，图11为图10中弯折区的结构示意图；请参考图11，图中第一子无机膜层可以包括两层(2111和2112)，开口400可以只贯穿一层第一子无机膜层2111，既保证了开口400两侧的金属走线310不会发生短路现象。同时，又提高了显示面板弯折区600的柔性，避免显示面板在弯折时发生断裂。另外，还可以避免裂纹从开口400的一侧扩展到另一侧，提高了显示面板的寿命。
图12为图10中弯折区的结构示意图。请参考图12，开口400还可以贯穿所有的第一子无机膜层。即在图11的基础上，还可以刻蚀掉图11中有机膜层100上方的第一子无机膜层2112，形成图12的结构。
在本实施例中，第一子无机膜层的厚度为确定值，多个第一子无机膜层材质不同，当抓取到两个第一子无机膜层之间的刻蚀终点界面后，可以确定开口400内所剩余的第一子无机膜层的厚度，且该厚度小于相关技术中无机膜层的厚度，其刻蚀误差更小，刻蚀厚度精确可控，能够在进一步减小无机膜层200厚度的同时，降低刻蚀到有机膜层100的概率，避免腔室污染。
在上述实施例的基础上，如图13所示，在金属层300上方形成有有机层700，有机层700的一部分处于开口内。有机层700也可以是聚酰亚胺等有机材料构成的膜层。通过形成有机层700，可以将弯折区600在弯曲时的中性面(如图2中所示的中性面800)的位置调整到金属层300内，从而减小金属层300发生断裂的风险。其中，中性面800是指：在弯折区 600弯曲时，伸长层810与缩短层820交界处的既不伸长也不缩短的层所在的面800，比如，当弯折区600发生弯折时，伸长层810与缩短层820交界处的层并不发生弯折，其所在的面即为上述中性面800。
本实施例还提供一种显示装置，包括显示面板。显示面板的结构和功能与上述实施例相同，具体可以参考上述实施例，再此不再赘述。
本实施例提供的显示装置，通过设置基板，基板包括依次层叠设置的有机膜层、无机膜层以及金属层；基板划分为显示区以及连接在显示区的至少部分边缘处的弯折区；弯折区内的金属层上形成有开口，开口延伸至无机膜层内，并且开口将金属层划分成多条金属走线，避免了开口两侧的金属走线相互连接而发生短路，并且降低了开口位置处的无机膜层的厚度，提高了显示面板柔性，避免了裂纹在开口两侧的金属层之间发生扩展，提高了显示面板及显示装置的可靠性。
本实施例还提供一种制作用于显示面板的基板的方法，包括以下步骤：
骤1，在有机膜层100上形成无机膜层200。
步骤2，在无机膜层200上形成金属层300。
步骤3，对位于弯折区600内的金属层300进行刻蚀以形成开口400，开口400将金属层300划分成多条金属走线310。
步骤4，借助于开口400去除对应于开口400位置的无机膜层200。
其中，有机膜层100、无机膜层200以及金属层300的材质可以参考上述实施例，有机膜层100、无机膜层200以及金属层300可以通过沉积、蒸镀或溅射等相关技术中常见的加工方式形成。
基板可以划分为显示区500和弯折区600，在弯折区600形成开口400时，开口400位置处的金属层300进行过度蚀刻，即不仅完全去除金属层300，还对金属层300下方的无机膜层200进行了部分刻蚀，既保证了开口400两侧的金属走线310不会发生短路现象。同时，又提高了采用该基板的显示面板的柔性，避免显示面板在弯折时发生断裂。另外，还可以避免裂纹从开口400的一侧的金属走线310扩展到另一侧的金属走线310，提高了显示面板的寿命。
在一实施例中，步骤1还可以包括以下几个步骤：
步骤11，在有机膜层100上形成第一无机膜层210。
步骤12，在第一无机膜层210上形成第二无机膜层220；第一无机膜层210和第二无机膜层220构成无机膜层200。
步骤13，刻蚀去除弯折区600内的第二无机膜层220。
具体地，形成无机膜层200时，可以先在有机膜层100上形成一层第一无机膜层210，然后，在第一无机膜层210上形成一层第二无机膜层220，第一无机膜层210和第二无机膜层220都覆盖显示区500和弯折区600，接着刻蚀掉弯折区600内的第二无机膜层220，使得弯折区600中只存在第一无机膜层210。由于第一无机膜层210和第二无机膜层220为不同材质，两者的刻蚀产物不同，可以通过刻蚀产物的改变来判断是否刻蚀到第一无机膜层210和第二无机膜层220的交界处，准确抓取第一无机膜层210和第二无机膜层220之间的界面，从而精确抓取刻蚀终点，精确控制刻蚀厚度，避免出现有机膜层100被刻蚀而导致腔室污染的问题。
更进一步地，第一无机膜层210包括多个第一子无机膜层，相邻两个第一子无机膜层(如第一子无机膜层2111和2112)的材质不同，第二无机膜层220包括多个第二子无机膜层，相邻两个第二子无机膜层(如第二子无机膜层2211和2212)的材质不同。即可以在有机膜层100上依次形成多个第一子无机膜层，然后再形成多个第二子无机膜层，从而可以提供多个以供抓取刻蚀终点的界面，以避免刻蚀过程中错过某个界面而导致刻蚀到有机膜层100而污染腔室的问题发生。
另外，步骤4还可以包括：借助于开口400去除弯折区600内的至少一个第一子无机膜层。从而不仅完全去除金属层300，还对金属层300下方的无机膜层200进行了部分刻蚀，既保证了开口400两侧的金属走线310不会发生短路现象。同时，又提高了显示面板的柔性，避免显示面板在弯折时发生断裂。另外，还可以避免裂纹从开口400的一侧扩展到另一侧，提高了显示面板的寿命。
另外，步骤4还可以去除所有的第一子无机膜层，由于可以抓取刻蚀终点的界面，使得该步骤刻蚀误差更小，刻蚀厚度精确可控，能够在进一步减小无机膜层200厚度的同时，降低刻蚀到有机膜层100的概率，避免腔室污染。
最后应说明的是：以上各实施例仅用以说明本申请的技术方案，而非对 其限制；尽管参照前述各实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的范围。

Claims (17)

  1. 一种显示面板，包括基板，所述基板包括依次层叠设置的有机膜层、无机膜层以及金属层；
    所述基板包括显示区以及连接在所述显示区的至少部分边缘处的弯折区；
    所述弯折区内的所述金属层上形成有若干开口，所述开口延伸至所述无机膜层内，并且所述金属层通过所述若干开口被划分成多条金属走线。
  2. 根据权利要求1所述的显示面板，其中，所述开口贯穿所述无机膜层且延伸至所述有机膜层。
  3. 根据权利要求1所述的显示面板，其中，所述无机膜层在所述显示区内的厚度大于所述无机膜层在所述弯折区内的厚度。
  4. 根据权利要求1-3任一项所述的显示面板，其中，所述无机膜层包括层叠且接触设置的第一无机膜层以及第二无机膜层，所述第一无机膜层位于所述显示区及所述弯折区内，所述第二无机膜层位于所述显示区内。
  5. 根据权利要求4所述的显示面板，其中，所述第一无机膜层包括层叠且接触设置的多个第一子无机膜层，相邻两个所述第一子无机膜层的材质不同，所述开口至少贯穿一个所述第一子无机膜层。
  6. 根据权利要求5所述的显示面板，所述第一无机膜层由两种不同材质的所述第一子无机膜层交替设置而成。
  7. 根据权利要求4所述的显示面板，其中，所述第二无机膜层包括层叠且接触设置的多个第二子无机膜层，相邻两个所述第二子无机膜层的材质不同。
  8. 根据权利要求7所述的显示面板，其中，所述第二无机膜层由两种不同材质的所述第二子无机膜层交替设置而成。
  9. 根据权利要求1-3任一项所述的显示面板，其中，在所述金属层上方形成有有机层，所述有机层的一部分处于所述开口内。
  10. 根据权利要求1-3任一项所述的显示面板，其中，所述弯折区为环绕所述显示区的所有边缘位置处的环形结构。
  11. 根据权利要求1-3任一项所述的显示面板，其中，所述有机膜层是包含聚酰亚胺的膜层。
  12. 根据权利要求1-3任一项所述的显示面板，其中，所述无机膜层是包含氧化硅或氮化硅的膜层。
  13. 根据权利要求1-3任一项所述的显示面板，其中，所述弯折区在弯曲时的中性面的位置位于所述金属层内。
  14. 一种显示装置，其中，包括权利要求1-3任一项所述的显示面板。
  15. 一种制作用于显示面板的基板的方法，包括：
    在有机膜层上形成无机膜层；
    在所述无机膜层上形成金属层；
    对位于弯折区内的所述金属层进行刻蚀以形成开口，所述金属层通过所述开口被划分成多条金属走线；
    通过所述开口去除对应于所述开口位置的无机膜层。
  16. 根据权利要求15所述的方法，其中，在所述有机膜层上形成无机膜层包括：
    在所述有机膜层上形成第一无机膜层；
    在所述第一无机膜层上形成第二无机膜层；所述第一无机膜层和所述第二无机膜层构成所述无机膜层；
    刻蚀去除所述弯折区内的所述第二无机膜层；其中，所述第一无机膜层包括多个第一子无机膜层，相邻两个所述第一子无机膜层的材质不同，所述第二无机膜层包括多个第二子无机膜层，相邻两个所述第二子无机膜层的材质不同。
  17. 根据权利要求16所述的方法，其中，借助于所述开口去除对应于所述开口位置的无机膜层包括：
    通过所述开口去除所述弯折区内的至少一个所述第一子无机膜层。
PCT/CN2019/105984 2018-11-29 2019-09-16 显示面板、显示装置及制作用于显示面板的基板的方法 Ceased WO2020108017A1 (zh)

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