WO2020107996A1

WO2020107996A1 - Imaging module and electronic device

Info

Publication number: WO2020107996A1
Application number: PCT/CN2019/104501
Authority: WO
Inventors: 韦怡; 陈嘉伟
Original assignee: Oppo广东移动通信有限公司
Priority date: 2018-11-26
Filing date: 2019-09-05
Publication date: 2020-06-04
Also published as: CN109327580A

Abstract

An imaging module (100) comprises a chip assembly (10), a lens assembly (20), an adjustable lens assembly (30) and a connection line (40). The chip assembly (10) comprises a substrate (11) and an image sensor (12). The image sensor (12) receives light. The adjustable lens assembly (30) comprises a piezoelectric actuator module (31) and an adjustable lens (32), and the piezoelectric actuator module (31) drives the adjustable lens (32) to deform.

Description

Imaging module and electronic device

Priority information

This application requests the priority and rights of the patent application with the patent application number 201811416241.9 filed with the State Intellectual Property Office of China on November 26, 2018, and the full text of which is hereby incorporated by reference.

Technical field

The present application relates to the technical field of imaging equipment, and more specifically, to an imaging module and an electronic device.

Background technique

At present, when the mobile phone lens module performs scene focusing, a voice coil motor is generally used to drive the lens to move. The voice coil motor drives the lens to move through the magnetic force, so that the lens is moved to a suitable position to achieve focusing.

Summary of the invention

Embodiments of the present application provide an imaging module and an electronic device.

The imaging module of the present application includes a chip component, a lens component, an adjustable lens component, and a connection line. The chip assembly includes a substrate and an image sensor disposed on the substrate. The lens assembly is provided on the chip assembly. The adjustable lens assembly is disposed on the lens assembly, and the image sensor is used to receive light passing through the adjustable lens assembly and the lens assembly. The adjustable lens assembly includes a piezoelectric actuator A module and an adjustable lens. The piezoelectric actuator module is used to drive the adjustable lens to deform under the action of an electrical signal to change the curvature of the refractive surface of the adjustable lens. The connection line is provided on the lens assembly and electrically connects the adjustable lens assembly and the substrate.

The electronic device of the present application includes a housing and the imaging module of the above embodiment, and the imaging module is disposed on the housing. The imaging module includes a chip component, a lens component, an adjustable lens component, and a connection line. The chip assembly includes a substrate and an image sensor disposed on the substrate. The lens assembly is provided on the chip assembly. The adjustable lens assembly is disposed on the lens assembly, and the image sensor is used to receive light passing through the adjustable lens assembly and the lens assembly. The adjustable lens assembly includes a piezoelectric actuator A module and an adjustable lens. The piezoelectric actuator module is used to drive the adjustable lens to deform under the action of an electrical signal to change the curvature of the refractive surface of the adjustable lens. The connection line is provided on the lens assembly and electrically connects the adjustable lens assembly and the substrate.

Additional aspects and advantages of the embodiments of the present application will be partially given in the following description, and some will become apparent from the following description, or be learned through practice of the embodiments of the present application.

BRIEF DESCRIPTION

The above and/or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

FIG. 1 is a schematic perspective view of an imaging module according to an embodiment of the present application.

FIG. 2 is an exploded perspective view of the imaging module according to the embodiment of the present application.

3 is a schematic cross-sectional view of the imaging module in FIG. 2 along line III-III.

4 and 5 are schematic structural diagrams of an adjustable lens assembly of an imaging module according to an embodiment of the present application.

6 is a schematic exploded perspective view of an adjustable lens assembly of an imaging module according to an embodiment of the present application.

7 is a schematic cross-sectional view of the adjustable lens assembly of the imaging module in FIG. 4 along the IIV-IIV line.

8 and 9 are schematic perspective structural views of an electronic device according to an embodiment of the present application.

detailed description

The embodiments of the present application will be further described below with reference to the drawings. The same or similar reference numerals in the drawings indicate the same or similar elements or the elements having the same or similar functions throughout. In addition, the embodiments of the present application described below with reference to the drawings are exemplary, and are only used to explain the embodiments of the present application, and cannot be construed as limiting the present application.

Please refer to FIGS. 1 to 3. The imaging module 100 of the present application includes a chip assembly 10, a lens assembly 20, an adjustable lens assembly 30 and a connection line 40. The chip assembly 10 includes a substrate 11 and an image sensor 12 disposed on the substrate 11. The lens assembly 20 is provided on the chip assembly 10. The adjustable lens assembly 30 is disposed on the lens assembly 20, and the image sensor 12 is used to receive light passing through the adjustable lens assembly 30 and the lens assembly 20. The adjustable lens assembly 30 includes a piezoelectric actuator module 31 and a The adjustable lens 32 and the piezoelectric actuator module 31 are used to drive the adjustable lens 32 to deform under the action of an electric signal to change the curvature of the refractive surface of the adjustable lens 32. The connection line 40 is disposed on the lens assembly 20 and electrically connects the adjustable lens assembly 30 and the substrate 10.

Please refer to FIGS. 1 and 2. In some embodiments, the lens assembly 20 includes a lens barrel 21 and a lens 22 disposed in the lens barrel 21. A wire groove 210 is formed in the lens barrel 21, and a connecting line 40 is formed in the wire groove 210. .

Please refer to FIG. 1 to FIG. 2. In some embodiments, the lens barrel 21 includes a lens barrel body 211 and a protrusion 212 extending from the outer peripheral surface of the lens barrel body 211. .

Referring to FIG. 2, in some embodiments, the protruding portion 212 includes a protruding portion side 2122 that is away from the lens barrel body 211. The protruding portion side 2122 is flat and parallel to the axis of the lens barrel body 211.

Please refer to FIGS. 1 and 2. In some embodiments, along the light entrance direction, the lens barrel body 211 includes a third body 215, a second body 214 and a first body 213 connected in sequence, and the protruding portion 212 is provided at the first On the second body 214 and the third body 215, the cross-sectional size of the second body 214 is smaller than the cross-sectional size of the first body 213 and larger than the cross-sectional size of the third body 215, and the protrusion 212 is disposed on the second body 214 and the second body On the three bodies 215, the connection line 40 is provided on the top surface 2131 and the side surface 2132 of the first body 213, and on the top surface 2121 and the side surface 2122 of the protrusion 212.

Please refer to FIGS. 1 and 2. In some embodiments, the adjustable lens assembly 30 further includes a pin 332, and the imaging module 100 further includes a conductive block 60. The conductive block 60 is disposed between the pin 332 and the lens assembly 20 The pin 332 is electrically connected to the connecting line 40 on the lens assembly 20.

Please refer to FIG. 1. In some embodiments, the imaging module 100 further includes a gasket 50. The gasket 50 is disposed between the adjustable lens assembly 30 and the lens assembly 20.

1 and 2, in some embodiments, the imaging module 100 further includes a bracket assembly 70. The bracket assembly 70 includes a hollow bracket 71 and a filter 72 installed in the bracket 71. The bracket assembly 70 is disposed in Between the chip assembly 10 and the lens assembly 20; the connection circuit 40 includes a first sub-circuit 41 and a second sub-circuit 42, the first sub-circuit 41 is disposed on the lens assembly 20 and is electrically connected to the adjustable lens assembly 30, the second sub-circuit The circuit 42 is disposed on the bracket 71, and the second sub-circuit 42 is electrically connected to the end of the first sub-circuit 41 away from the adjustable lens assembly 30 and the substrate 11.

Please refer to FIGS. 1 and 2. In some embodiments, the lens barrel 21 includes a lens barrel body 211. The lens barrel body 211 includes a first body 213 near an end of the bracket assembly 70. The cross-sectional size of the first body 213 is less than In the cross-sectional dimension of the bracket 71, the second sub-line 42 is provided on the upper surface 711 and the outer side surface 713 of the bracket 71.

Please refer to FIGS. 4 to 7. In some embodiments, the piezoelectric actuator module 31 is formed with an accommodating cavity 310, the adjustable lens 32 is disposed in the accommodating cavity 310, and the adjustable lens assembly 30 further includes:

The hollow support frame module 33 and the piezoelectric actuator module 31 are arranged in the support frame module 33;

A supporting substrate 34, which is arranged on the adjustable lens 32 and is accommodated in the accommodating cavity 310; and

An annular fixing plate 35 is provided on the piezoelectric actuator module 31 and the support frame module 33.

Please refer to FIG. 5. In some embodiments, the support frame module 33 includes a hollow support frame 331, a plurality of pins 332 and a plurality of connectors 333; one end of the pin 331 is disposed in the support frame 331, the pins The other end of 332 is provided outside the support frame 331 and suspended; the connecting piece 333 is provided on the inner wall of the support frame 331 and is located between the support frame 331 and the piezoelectric actuator module 31, and the connecting piece 333 is electrically connected to the pins 332及 piezoelectric actuator module 31.

Please refer to FIG. 7. In some embodiments, the piezoelectric actuator module 31 includes a ring-shaped substrate 311, a ring-shaped piezoelectric actuator 312 and a flexible film 313, and the substrate 311 surrounds the receiving cavity 310 The film 313 is disposed on the substrate 311 and closes one end of the containing cavity 310, and the piezoelectric actuator 312 is disposed on the side of the film 313 away from the substrate 311.

Referring to FIG. 7, the adjustable lens assembly 30 further includes a blocking film 36, which is disposed on the side of the fixing plate 35 away from the piezoelectric actuator module 31.

Please refer to FIGS. 1 to 3, 8 and 9, the electronic device 200 of the present application includes a housing 201 and an imaging module 100. The imaging module 100 is provided on the housing 201. The imaging module 100 includes a chip assembly 10, a lens assembly 20, an adjustable lens assembly 30, and a connection line 40. The chip assembly 10 includes a substrate 11 and an image sensor 12 disposed on the substrate 11. The lens assembly 20 is provided on the chip assembly 10. The adjustable lens assembly 30 is disposed on the lens assembly 20, and the image sensor 12 is used to receive light passing through the adjustable lens assembly 30 and the lens assembly 20. The adjustable lens assembly 30 includes a piezoelectric actuator module 31 and a The adjustable lens 32 and the piezoelectric actuator module 31 are used to drive the adjustable lens 32 to deform under the action of an electric signal to change the curvature of the refractive surface of the adjustable lens 32. The connection line 40 is disposed on the lens assembly 20 and electrically connects the adjustable lens assembly 30 and the substrate 10.

Please refer to FIG. 1 to FIG. 3, an embodiment of the present application provides an imaging module 100, which can be a visible light imaging module (including a color image imaging module and a black and white image imaging module) that relies on visible light imaging, It can also be an infrared imaging module that relies on infrared imaging. The imaging module 100 includes a chip assembly 10, a lens assembly 20, an adjustable lens assembly 30, and a connection line 40. The chip assembly 10 includes a substrate 11 and an image sensor 12 disposed on the substrate 11. The lens assembly 20 is provided on the chip assembly 10. The adjustable lens assembly 30 is disposed on the lens assembly 20, and the image sensor 12 is used to receive light passing through the adjustable lens assembly 30 and the lens assembly 20. The adjustable lens assembly 30 includes a piezoelectric actuator module 31 and a The adjustable lens 32 and the piezoelectric actuator module 31 are used to drive the adjustable lens 32 to deform under the action of an electric signal to change the curvature of the refractive surface of the adjustable lens 32. The connection line 40 is disposed on the lens assembly 20 and electrically connects the adjustable lens assembly 30 and the substrate 10.

Specifically, the refractive surface 321 of the adjustable lens 32 is a surface through which the light passes through the adjustable lens 32. When the light passes through the refractive surface 321, the light is refracted. When an electrical signal is applied to the piezoelectric actuator module 31, the piezoelectric actuator 31 deforms and drives the adjustable lens 32 to deform, and the adjustable lens 32 deforms to cause the refractive surface 321 of the adjustable lens 32 The curvature of. The curvature of the refractive surface 321 is related to the strength of the electrical signal received by the piezoelectric actuator module 31. For example, the greater the voltage applied to the piezoelectric actuator module 31, the greater the curvature of the refractive surface 321. The connecting line 40 electrically connects the adjustable lens assembly 30 and the circuit on the substrate 10. The circuit is used to provide an electrical signal to the adjustable lens assembly 30. Since the curvature of the refractive surface 321 of the adjustable lens 32 changes, the focal length of the imaging module 100 also changes, and the curvature of the refractive surface 321 is related to the strength of the electrical signal received by the piezoelectric actuator module 31, so The curvature of the refractive surface 321 can be changed to change the focal length of the imaging module 100 by changing the magnitude of the electric signal applied to the piezoelectric actuator module 31.

Since there is no need to drive the entire adjustable lens 32 and the lens assembly 20 to move to change the focal length, using the imaging module 100 has the following beneficial effects: (1) The adjustable lens assembly 30 consumes less power when changing the focal length, for example, changing the adjustable The focal length of the lens assembly 30 may only require 5 milliwatts of power consumption; (2) The adjustable lens assembly 30 will not cause different degrees of difficulty in driving the lens assembly 20 due to the different placement directions of the imaging module 100 , That is, it will not be affected by gravity when changing the focal length; (3) the adjustable lens 32 and the lens assembly 20 do not need to move, and there will be no light caused by the adjustable lens 32 and the lens assembly 20 shifting when moving The problem of shaft instability; (4) When testing and correcting the adjustable lens assembly 30, only one adjustable lens 32 needs to be tested and corrected, and no need for multiple lenses 22 on the lens assembly 20 Test and calibration to reduce the cost of testing and calibration; (5) The adjustable lens 32 will not cause hysteresis under the effect of electrical signals.

When the focal length of the imaging module 100 needs to be adjusted, an electrical signal of a corresponding size is applied to the piezoelectric actuator assembly 31 according to the size of the focal length to be adjusted, so that the piezoelectric actuator assembly 31 generates a corresponding deformation. The deformation of the actuator assembly 31 causes the adjustable lens 32 to be subjected to an external force, and the adjustable lens 32 generates a corresponding deformation, and finally achieves the purpose of adjusting the focal length. It can be understood that, during the entire process of adjusting the focal length, no conventional mechanical structure is required for driving, the adjustable lens assembly 30 does not generate noise during operation, and the time required for adjusting the focal length is shorter, which can achieve rapid focusing.

In addition, during the zooming process using the adjustable lens assembly 30, the distance between the adjustable lens 32 and the image sensor 12 will not change, and the field of view of the imaging module 100 will not change. The lens assembly 30 has the characteristics of rapid focusing, and multiple images of different object focal planes can be obtained in a short time. By synthesizing the multiple images, you can get a clear image of all objects in the field of view; or you can select the surface or depth range that needs to be imaged in the multiple images and then blur the background to use A single imaging module 100 realizes background blur.

In the imaging module 100 of the embodiment of the present application, the adjustable lens assembly 30 is provided on the lens assembly 20, and the adjustable lens assembly 30 is provided with a connection line 40 which electrically connects the adjustable lens assembly 30 and the substrate 11 so as to pass The connection line 40 transmits the electrical signal applied to the adjustable actuator assembly 31 to change the curvature of the refractive surface 321 of the adjustable lens 32, and can change the focal length of the imaging module 100 to achieve the focusing function of the imaging module 100; imaging When the module 100 is in focus, the adjustable lens assembly 30 only deforms and does not move relative to the chip assembly 10. Compared with the prior art center when the lens is moved by the voice coil motor, the presence of the voice coil motor greatly increases the lens The size of the module prevents the lens module from becoming smaller and thinner. At the same time, the voice coil motor drives the lens to move through magnetic force to complete the focus. The peripheral magnetic field generated by other electronic components can interfere with the normal work of the voice coil motor. Omitting additional driving devices such as a voice coil motor to reduce the volume of the imaging module 100; meanwhile, since the deformation of the adjustable lens assembly 30 is directly driven by an electric signal without being affected by the magnetic field, the adjustable lens assembly 30 When working, it will not be affected by the external magnetic field generated by other external electronic components, and the imaging module has strong anti-interference ability; further, the adjustable lens assembly 30 will not produce hysteresis under the effect of electrical signals, thereby The adjustable lens assembly 30 deforms faster under the action of the electric signal to achieve quick focusing.

Referring to FIG. 1, the imaging module 100 according to the embodiment of the present application includes a chip assembly 10, a lens assembly 20, an adjustable lens assembly 30, a connection line 40, a gasket 50 and a conductive block 60.

The chip assembly 10 includes a substrate 11 and an image sensor 12 disposed on the substrate 11. The substrate 11 may be a printed wiring board, a flexible wiring board, or a soft and hard wiring board. A circuit and electronic components such as transistors, capacitors, inductors, and connection terminals 111 on the circuit can also be formed on the substrate 11. The circuit can provide electrical signals for the adjustable lens assembly 30. The image sensor 12 is used to sense light entering from outside the imaging module 100 and convert the optical signal into an electrical signal to form an image. The image sensor 12 may be a charge-coupled device (Charge-coupled Device, CCD) or complementary metal oxide semiconductor (Complementary Metal Oxide Semiconductor) (CMOS) image sensor. The chip assembly 10 may be used to connect the imaging module 100 to the main board of the electronic device 200 (shown in FIG. 8 ), for example, to electrically connect the image sensor 12 and the adjustable lens assembly 30 to the main board, so that the imaging module 100 communicates with the main board of the electronic device 200.

Referring to FIG. 2, the lens assembly 20 is provided on the chip assembly 10. Specifically, the lens assembly 20 may be adhered to the chip assembly 10 by glue, and a gasket 50 may be provided between the chip assembly 10 and the lens assembly 20. The gasket 50 may be Made of an elastic material, for example, the gasket 50 may be a rubber gasket.

2 and 3, the lens assembly 20 includes a lens barrel 21 and a lens 22 disposed in the lens barrel 21. The lens barrel 21 includes a lens barrel body 211 and a protrusion 212 extending from the outer peripheral surface of the lens barrel body 211. Along the light incident direction of the lens barrel assembly 20, the lens barrel body 211 includes a third body 215, a second body 214, and a first body 213 connected in sequence. The cross-sectional dimension of the second body 214 is smaller than the cross-sectional dimension of the first body 213, and the cross-sectional dimension of the second body 214 is larger than the cross-sectional dimension of the third body 215, wherein the cross-sectional dimension is the outer outline dimension of the cross-section. The protruding portion 212 is provided on the outer peripheral surfaces of the second body 214 and the third body 215 and is connected to the top surface 2131 of the first body 213. The protruding portion 212 includes a protruding portion top surface 2121 and a protruding portion side surface 2122. The protruding portion top surface 2121 is located on the side of the protruding portion 211 away from the first body 213, and the protruding portion side surface 2122 is located away from the protruding portion 211 One side of the third body 215 is connected to the top surface 2121 of the protruding portion, the side surface 2122 of the protruding portion is parallel to the axis OO' of the lens barrel body 211, and the axis OO' of the lens barrel body 211 is parallel to the optical axis of the lens barrel assembly 20 .

The third body 215 of this embodiment is approximately rectangular in cross section. The third body 215 includes four third body sides 2151 connected in a ring shape in sequence. The number of the protrusions 212 is two, and both protrusions 212 are provided. On the same third body side 2151, and the two protrusions 212 are symmetrical about the symmetry plane P of the third body 215, the symmetry plane P of the third body 215 is parallel to the axis OO' and perpendicular to the two opposite thirds Body side 2151.

Referring to FIGS. 1 and 2, a wire groove 210 is defined in the lens barrel 21, and the wire groove 210 includes a first sub-wire groove 2100. In other words, the wire groove 210 defined in the lens barrel 21 is defined as the first sub-wire groove 2100. Specifically, the first sub-wire slot 2100 is opened on the top surface 2121 of the protruding portion, the side surface 2122 of the protruding portion, the top surface 2131 of the first body 213 (defined as the top surface 2131 of the first body) and the side surface 2132 of the first body 213 (Defined as the first body side 2132). The number of the first sub-line slots 2100 is two, and the two first sub-line slots 2100 are symmetrical with respect to the symmetry plane P. The first body 213 of this embodiment is approximately square ring-shaped, and the portions of the two first sub-wire grooves 2100 on the first body side 2132 are located at opposite ends of the same first body side 2132.

The number of lenses 22 may be one or more, and the lenses 22 may include one or more of refractive lenses, dustproof lenses, and filter lenses.

The connection line 40 includes first sub-lines 41. The number of the first sub-lines 41 is two. The two first sub-lines 41 are respectively disposed in the two first sub-line grooves 2100 formed by the lens assembly 20. The first sub-circuit 41 includes a first connecting end 411 and a second connecting end 412 opposite to each other. The first connection end 411 is disposed on the top surface 2121 of the protrusion, and the first connection end 411 may be a solder pad. The second connection end 412 can be a solder pad and is provided on the first body side 2132; or, the second connection end 412 can also be a pin, one end of the pin is provided on the first body side 2132, and the other end is from the first The side surface 2132 of the body extends outward and is suspended; alternatively, the second connecting end 412 may also be a spring piece. One end of the spring plate is disposed on the first body side 2132, and the other end extends outward from the first body side 2132 and is suspended. When the lens assembly 20 is disposed on the chip assembly 10, the second connection end 412 is aligned with the connection terminal 111 on the substrate 11 and electrically connected, specifically, when the second connection end 412 is a pad, the second connection end The 412 and the connection terminal 111 may be connected together by conductive glue. When the second connection end 412 is a pin or an elastic sheet, the second connection end 412 and the connection terminal 111 may be welded together, or may be connected together by conductive adhesive.

Referring to FIG. 2, the adjustable lens assembly 30 is disposed on the side of the lens assembly 20 away from the chip assembly 10. Specifically, the adjustable lens assembly 30 may be glued to the lens assembly 20 with glue, and a gasket 50 may also be provided between the adjustable lens assembly 30 and the lens assembly 20.

4 to 6, the adjustable lens assembly 30 is a packaged module, the adjustable lens assembly 30 includes a hollow support frame module 33, a fixed plate 35, a piezoelectric actuator module 31, a support substrate 34, Tune lens 32 and shielding film 36.

The support frame module 33 includes a hollow support frame 331, a plurality of pins 332, and a plurality of connecting pieces 333. The support frame 331 has an approximately square ring shape. One end of the pin 332 is disposed inside the support frame 331, and the other end of the pin 332 is disposed outside the support frame 331 and suspended.

The number of pins 332 in this embodiment is two, and the two pins 332 are disposed on the same side wall of the support frame 331 and extend out of the support frame 331 from the same side. The connecting piece 333 is provided on the inner wall of the support frame 331 and is electrically connected to the pins 332. The number of the connecting pieces 333 in this embodiment is four, and the four connecting pieces 333 are respectively provided on the four inner walls of the supporting frame 331. Two of the connecting pieces 333 are electrically connected to one pin 332, and the other two connecting pieces 333 are electrically connected to the other pin. In other embodiments, the number of the connecting members 333 may be two, and the two connecting members 333 are respectively connected to the two pins 332 correspondingly.

Referring to FIG. 7, the fixing plate 35 has a ring shape, and the fixing plate 35 is disposed on the end surface of the support frame 331. Specifically, the fixing plate 35 may be adhered to the end surface of the support plate 331 through glue.

The piezoelectric actuator module 31 is disposed in the support frame 331. At this time, the fixing plate 35 may be used to fix the piezoelectric actuator module 31 in the support frame 331 to prevent the piezoelectric actuator module 31 from The support frame 331 comes out. The piezoelectric actuator module 31 includes a substrate 311, a ring-shaped piezoelectric actuator 312, and a flexible film 313. The substrate 311 has a square ring shape and surrounds the receiving cavity 310. The substrate 311 is disposed on the fixing plate 35 and is located in the support frame 331. The connecting member 333 is located between the outer circumferential surface of the substrate 311 and the inner wall of the support frame 331. The film 313 is disposed on the side of the substrate 311 opposite to the fixing plate 35 and closes one end of the accommodating cavity 310. The film 313 may be a glass film. The piezoelectric actuator 312 is disposed on the side of the thin film 313 away from the substrate 311, the size of the inner ring of the piezoelectric actuator 312 is smaller than the size of the inner ring of the substrate 311, and the piezoelectric actuator 312 includes piezoelectric ceramic . The piezoelectric actuator 312 is electrically connected to the pin 332 through the connection member 333. In other embodiments, the piezoelectric actuator 312 can also be electrically connected to the pin 332 through the wire 37. The piezoelectric actuator module 31 of this embodiment has an integrated structure. For example, in the manufacturing process of the piezoelectric actuator module 31, a thin film 313 is first manufactured, and then a substrate 311 and a pressure are manufactured on both sides of the thin film 313, respectively. Electro actuator 312. In another embodiment, the piezoelectric actuator 312 (ceramic) can be embedded in the mold first, and then the thin film 313 (glass material) and the substrate 311 (silicon material) are integrally molded in the piezoelectric The actuator 312 is formed with a piezoelectric actuator module 31 of an integrated structure. In other embodiments, the piezoelectric actuator module 31 is formed by connecting three separate structures of a substrate 311, a piezoelectric actuator 312, and a thin film 313, and the thin film 313 and the substrate 311 may be bonded by glue Together, the film 313 and the piezoelectric actuator 312 may also be glued together.

The adjustable lens 32 may be made of a transparent flexible polymer. The adjustable lens 32 is easily deformed under the squeezing or pulling of external force to change the curvature of the outer surface (refractive surface 321) of the adjustable lens 32, and further Changing the magnitude of the refracting effect of the adjustable lens 32 on the light, that is, changing the focal length of the imaging module 100. The adjustable lens 32 is disposed on the film 313 and received in the accommodating cavity 310, and the refractive surface 321 of the adjustable lens 32 and the film 313 are bonded together. The adjustable lens 32 is spaced from the inner wall of the substrate 311 to provide the adjustable lens 32 with a deformation space.

The support substrate 34 is disposed on the side of the adjustable lens 32 away from the film 313 and is accommodated in the accommodating cavity 310. The support substrate 34 is bonded to the surface of the adjustable lens 32 opposite to the refractive surface 321. The support substrate 34 is made of a light-transmitting material, and the support substrate 34 includes a glass substrate. When the adjustable lens 32 is deformed, due to the limitation of the support substrate 34, the side where the adjustable lens 32 and the support substrate 34 are bonded may not be deformed, or the curvature of the side where the adjustable lens 32 and the support substrate 34 are bonded No change occurs, but the deformation amount is concentrated on the refractive surface 321. The shielding film 36 has a ring structure. The shielding film 36 is provided on the side of the fixing plate 35 away from the substrate 311. The blocking film 36 is made of an opaque material; or, the side of the blocking film 36 away from the fixing plate 35 is provided with a light blocking layer, which may be a black ink layer.

When the adjustable lens assembly 30 is disposed on the lens assembly 20, the two pins 332 are respectively opposed to the two first connection ends 411, and since the height difference between the pins 322 and the first connection end 411 forms a difference A conductive block 60 is provided between the leg 322 and the first connection end 411. The pin 322, the conductive block 60 and the first connection end 411 are welded together or connected together by conductive glue. In other embodiments, there is no difference in height between the pin 322 and the first connection end 411 or the height difference is not large, there is no need to additionally provide a conductive block 60, but the pin 322 and the first connection end 411 are directly soldered on Together or connected together by conductive glue.

6 and 7, when the light entering the imaging module 100 passes through the adjustable lens assembly 30, the light may sequentially pass through the first light-passing hole 361 on the blocking film 36 and the second light-passing hole on the fixing plate 35 The light hole 351, the support substrate 34, the adjustable lens 32, the thin film 313, and the third light hole 315 on the piezoelectric actuator 312.

When the piezoelectric actuator 312 deforms under the action of an electrical signal (voltage) and drives the thin film 313 and the adjustable lens 32 to deform, the curvature of the refractive surface 321 of the adjustable lens 32 changes, and the curvature of the refractive surface 321 and The strength of the electrical signal received by the piezoelectric actuator 312 is related. For example, the greater the voltage applied to the piezoelectric actuator 312, the greater the curvature of the refractive surface 321. When the curvature of the refractive surface 321 of the adjustable lens 32 changes, the focal length of the imaging module 100 also changes, so that the imaging module 100 can be changed by changing the magnitude of the electrical signal applied to the piezoelectric actuator module 31 Focal length. In other words, when the focal length of the imaging module 100 needs to be adjusted, it is only necessary to apply an electrical signal of a corresponding size to the piezoelectric actuator 312 according to the size of the focal length to be adjusted, so that the piezoelectric actuator 312 generates a corresponding Deformation, the deformation of the piezoelectric actuator 312 causes the adjustable lens 32 to be subjected to an external force, the adjustable lens 32 generates a corresponding deformation, and finally achieves the purpose of adjusting the focal length.

When the focal length of the imaging module 100 needs to be adjusted, an electrical signal of a corresponding size is applied to the piezoelectric actuator assembly 31 according to the size of the focal length to be adjusted, so that the piezoelectric actuator assembly 31 generates a corresponding deformation. The deformation of the actuator assembly 31 causes the adjustable lens 32 to be subjected to an external force, and the adjustable lens 32 generates a corresponding deformation, and finally achieves the purpose of adjusting the focal length. It can be understood that since the entire mechanical focus adjustment process does not require a conventional mechanical structure to drive, the adjustable lens assembly 30 does not generate noise during operation, and the time required to adjust the focal length is shorter, which enables fast focusing.

In the imaging module 100 of the embodiment of the present application, the adjustable lens assembly 30 is provided on the lens assembly 20, and the adjustable lens assembly 30 is provided with a connection line 40 which electrically connects the adjustable lens assembly 30 and the substrate 11 so as to pass The connection line 40 transmits the electrical signal applied to the adjustable actuator assembly 31 to change the curvature of the refractive surface 321 of the adjustable lens 32, and can change the focal length of the imaging module 100 to achieve the focusing function of the imaging module 100; imaging When the module 100 is in focus, the adjustable lens assembly 30 only deforms and does not move relative to the chip assembly 10, so that additional driving devices such as a voice coil motor can be omitted to reduce the volume of the imaging module 100; at the same time, The deformation of the adjustable lens assembly 30 is directly driven by an electric signal and is not affected by the magnetic field. Therefore, the adjustable lens assembly 30 will not be affected by the external magnetic field generated by other external electronic components during operation. Strong anti-interference ability; further, the adjustable lens assembly 30 does not produce hysteresis under the effect of electrical signals, so that the adjustable lens assembly 30 deforms faster under the effect of electrical signals to enable quick focusing .

The imaging module 100 of the embodiment of the present application also has the following beneficial effects: First, the lens barrel 21 is provided with a wire groove 210, and the connection line 40 is provided in the wire groove 210. The connection line 40 is not easily scratched by external foreign objects and affects its conductivity Performance, and the connecting line 40 is firmly fixed in the wire groove 210, not easy to come out; second, the lens barrel 21 is provided with a protruding portion 212 on the lens barrel body 211, thereby facilitating the opening of the wire groove 210 on the lens barrel 21; Third, the side surface 2122 of the protruding portion 212 is flat and parallel to the axis OO' of the lens barrel body 211, so as to facilitate the opening of the wire groove 210 on the protruding portion 212; third, the pins 332 of the imaging module 100 A conductive block 60 is provided between the connecting line 40 to facilitate the electrical connection between the pin 332 and the connecting line 40; the adjustable lens assembly 30 and the lens assembly 20 are provided with a gasket 50, which causes the imaging module 100 to vibrate under external force At this time, the vibration to which the adjustable lens assembly 30 is subjected can be reduced.

Please refer to FIG. 2. In some embodiments, the imaging module 100 may further include a bracket assembly 70. The bracket assembly 70 is disposed between the lens assembly 20 and the chip assembly 10. The bracket assembly 70 includes a hollow bracket 71 and a filter 72 installed in the bracket 71. The bracket 71 has an approximately rectangular ring-shaped structure. The bracket 71 includes an upper surface 711, a lower surface 712 and four outer sides 713. The upper surface 711 and the lower surface 712 are located on opposite sides of the holder 71, the upper surface 711 is located on the side of the holder 71 close to the lens assembly 20, and the lower surface 712 is located on the side of the holder 71 close to the chip assembly 10. The four outer sides 713 are sequentially connected in a ring shape, and the four outer sides 713 are all connected to the upper surface 711 and the lower surface 712. The cross-sectional dimension of the bracket 71 is larger than the cross-sectional dimension of the first body 213. The bracket 71 of this embodiment also defines a cable slot 210. The cable slot 210 formed on the bracket 71 is defined as a second cable slot 2101. At this time, the cable slot 210 includes a first sub-wire slot 2100 and a lens slot 20 The second sub-trough 2101 opened on the bracket 71. The second sub-trough 2101 is bent (for example, L-shaped) on the upper surface 711 and the outer side 713. The number of second sub-trough 2101 is two, two second sub-trough 2101 and two One sub-wire slot 2100 corresponds to each other, and two second sub-wire slots 2101 opened on the outer side 713 are located at opposite ends of the same outer side 713.

The connection line 40 further includes a second sub-line 42 corresponding to the second sub-line slot 2101. The second sub-line 42 is also bent (for example, L-shaped). The number of the second sub-line 42 is two, and two The two sub-lines 42 are respectively disposed in the two second sub-line slots 2101 and are electrically connected to the two first sub-line slots 42 respectively. The second sub-circuit 42 includes opposite third connection ends 421 and fourth connection ends 422. The third connection end 421 is disposed on the upper surface 711, and the third connection end 421 may be a pad. The fourth connection end 422 may be a solder pad and provided on the outer side 713; or, the fourth connection end 422 may also be a pin, one end of the pin is provided on the outer side 713, and the other end extends outward from the outer side 713 and is suspended Alternatively, the fourth connection end 422 may also be a shrapnel. One end of the shrapnel is provided on the outer side surface 713, and the other end extends outward from the outer side surface 713 and is suspended.

When the bracket assembly 70 is disposed on the chip assembly 10, the fourth connection end 422 is aligned with the connection terminal 111 on the substrate 11 and electrically connected, specifically, when the fourth connection end 422 is a pad, the fourth connection end The 422 and the connection terminal 111 may be connected together by conductive glue. When the fourth connection end 422 is a pin or an elastic sheet, the fourth connection end 422 and the connection terminal 111 may be welded together, or may be connected together by conductive adhesive.

When the lens assembly 20 is disposed on the bracket assembly 70, the second connection end 412 corresponds to the third connection end 421 and is electrically connected. Specifically, when both the second connection end 412 and the third connection end 421 are solder pads, the second connection end 412 and the third connection end 421 may be connected together by conductive adhesive, and when the second connection end 412 is a pin or In the case of shrapnel, the second connection end 412 and the third connection end 421 may be welded together or connected together by conductive adhesive. In other embodiments, the bracket 71 is provided with a through hole (not shown) penetrating through the upper surface 711 and the lower surface 712, the second sub-circuit 42 is inserted into the through hole, and the opposite ends of the second sub-circuit 42 (the third connection The end 421 and the fourth connection end 422) are exposed on the upper surface 711 and the lower surface 712, respectively. When the bracket assembly 70 is disposed on the chip assembly 10 and the lens assembly 20 is disposed on the bracket assembly 70, the third connection end 421 is electrically connected to the second connection end 412, and the fourth connection end 422 is electrically connected to the connection terminal 111. Specifically, when both the second connection end 412 and the third connection end 421 are solder pads, the second connection end 412 and the third connection end 421 may be connected together by conductive adhesive, and when the second connection end 412 is a pin or In the case of shrapnel, the second connection end 412 and the third connection end 421 can be welded together or can be connected together by conductive adhesive.

The filter 72 is disposed in the bracket 71, and the filter 72 may be used to filter out the interference light entering the imaging module 100. For example, when the imaging module 100 is a visible light imaging module, the filter 72 may be used to filter out Infrared light, in this case, the filter 72 can be blue glass to reduce the impact of infrared light on the imaging quality; when the imaging module 100 is the infrared imaging module 100, the filter 72 can be used to filter out visible light, Reduce the impact of visible light on imaging quality.

Please refer to FIGS. 8 and 9. The present application further provides an electronic device 200. The electronic device 200 includes a housing 201 and the imaging module 100 of any one of the above embodiments. The imaging module 100 is disposed on the housing 201.

The electronic device 200 can use the imaging module 100 to obtain images of the target scene, for example, for taking photos or recording videos of the scene. The electronic device 200 may specifically be a mobile phone, a tablet computer, a laptop computer, a surveillance camera, a head-mounted display device, a smart watch, a smart helmet, and other devices. The embodiments of the present application are described by taking the electronic device 200 as a mobile phone as an example. It can be understood that the specific form of the electronic device 200 is not limited to a mobile phone, but may also be other, which is not limited herein.

The case 201 may be a housing of the electronic device 200. The housing 201 can serve as a mounting carrier for the imaging module 100, and the housing 201 can provide the imaging module 100 with protection against water, dust, and falling. In one example, the housing 201 may be provided with a through hole. When the imaging module 100 is disposed on the housing 201, the light entrance hole of the imaging module 100 may be aligned with the through hole, and the through hole may be opened in the housing The front or back of the body 201. In another example, a display screen 204 is also installed on the housing 201, and the imaging module 100 may be disposed below the display screen 204, that is, after passing through the display screen 204, the imaging module 100 receives the imaging module 100 and uses it for imaging. In another example, when the imaging module 100 is not needed, the imaging module 100 is located below the display screen 204, and the display screen 204 blocks the imaging module 100; when the imaging module 100 is needed, the display screen 204 and the imaging are driven The relative movement of the module 100 (for example, driving the display screen 204 and the imaging module 100 to slide or rotate relatively), so that the display screen 204 no longer blocks the imaging module 100, so that the imaging module 100 receives ambient light.

In one example, please refer to FIG. 9, the imaging module 100 is accommodated in the housing 201 and can be extended from the housing 201, at this time, the housing 201 does not need to be opened to correspond to the direction of light entering and exiting the imaging module 100 For example, the housing 201 includes a main body 202 and a movable portion 203. The imaging module 100 is mounted on the movable portion 203. The movable portion 203 can move relative to the main body 202 under the driving of the driving device. The movable portion 203 It can slide relative to the body 202 to slide into or out of the body 202 (as shown in FIG. 8) (as shown in FIG. 9). When the imaging module 100 needs to be used, the movable portion 203 drives the imaging module 100 to extend from the housing 201 to the housing 201; when the imaging module 100 is not needed, the movable portion 203 drives the imaging module 100 It is accommodated in the case 201 from outside the case 201.

In the imaging module 100 of the electronic device 200 according to the embodiment of the present application, the adjustable lens assembly 30 is provided on the lens assembly 20, and the adjustable lens assembly 30 is provided with a connection line 40 electrically connecting the adjustable lens assembly 30 and the substrate 11 So that the electrical signal applied to the adjustable actuator assembly 31 can be transmitted through the connecting line 40 to change the curvature of the refractive surface 321 of the adjustable lens 32, and the focal length of the imaging module 100 can be changed to achieve the imaging module 100’s Focusing function; when the imaging module 100 is in focus, the adjustable lens assembly 30 only deforms and does not move relative to the chip assembly 10, so that additional driving devices such as a voice coil motor can be omitted to reduce the volume of the imaging module 100 At the same time, since the deformation of the adjustable lens assembly 30 is directly driven by the electrical signal and is not affected by the magnetic field, the adjustable lens assembly 30 will not be affected by the external magnetic field generated by other external electronic components during operation. The imaging module has strong anti-interference ability; further, the adjustable lens assembly 30 does not produce hysteresis under the effect of electrical signals, so that the adjustable lens assembly 30 deforms faster under the effect of electrical signals to be able to Focus quickly.

In the description of this specification, reference is made to the terms "some embodiments", "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples" The description means that the specific features, structures, materials, or characteristics described in connection with the embodiments or examples are included in at least one embodiment or example of the present application. In this specification, the schematic expression of the above-mentioned terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

In addition, the terms “first” and “second” are used for description purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first" and "second" may include at least one of the features explicitly or implicitly. In the description of this application, the meaning of "plurality" is at least two, for example, two or three, unless otherwise specifically defined.

Although the embodiments of the present application have been shown and described above, it can be understood that the above-mentioned embodiments are exemplary and cannot be construed as limitations to the present application. Those of ordinary skill in the art can The embodiments are changed, modified, replaced, and modified, and the scope of the present application is defined by the claims and their equivalents.

Claims

An imaging module is characterized by comprising:

A chip assembly, the chip assembly includes a substrate and an image sensor disposed on the substrate;

A lens assembly, the lens assembly is disposed on the chip assembly;

An adjustable lens assembly, the adjustable lens assembly is disposed on the lens assembly, the image sensor is used to receive light passing through the adjustable lens assembly and the lens assembly, the adjustable lens assembly includes A piezoelectric actuator module and an adjustable lens, the piezoelectric actuator module is used to drive the adjustable lens to deform under the action of an electric signal to change the curvature of the refractive surface of the adjustable lens; and

A connection line, which is provided on the lens assembly and electrically connects the adjustable lens assembly and the substrate.
The imaging module according to claim 1, wherein the lens assembly includes a lens barrel and a lens disposed in the lens barrel, a wire groove is formed in the lens barrel, and the connection line is formed in the Inside the wire channel.
The imaging module according to claim 2, wherein the lens barrel includes a lens barrel body and a protrusion extending from an outer peripheral surface of the lens barrel body, and the wire groove is opened in the protrusion Ministry.
The imaging module according to claim 3, wherein the protruding portion includes a side surface of the protruding portion away from the side of the lens barrel body, the side surface of the protruding portion is flat and parallel to the mirror The axis of the barrel body.
The imaging module according to claim 3, characterized in that, along the light entrance direction, the lens barrel body includes a third body, a second body, and a first body connected in sequence, and the protruding portion is provided on the On the second body and the third body, the cross-sectional size of the second body is smaller than the cross-sectional size of the first body and larger than the cross-sectional size of the third body, and the protrusion is provided on the On the second body and the third body, the connection line is provided on the top surface and side surface of the first body and on the top surface and side surface of the protrusion.
The imaging module according to claim 1, wherein the adjustable lens assembly further includes a pin, the imaging module further includes a conductive block, the conductive block is disposed between the pin and the lens The components are electrically connected to the pin and the connection line on the lens component.
The imaging module according to claim 1, wherein the imaging module further comprises a gasket, and the gasket is disposed between the adjustable lens assembly and the lens assembly.
The imaging module according to claim 1, wherein the imaging module further comprises a bracket assembly, the bracket assembly includes a hollow bracket and an optical filter installed in the bracket, the bracket assembly is provided Between the chip assembly and the lens assembly; the connection line includes a first sub-circuit and a second sub-circuit, the first sub-circuit is disposed on the lens assembly and electrically connects the adjustable lens In the assembly, the second sub-circuit is disposed on the bracket, and the second sub-circuit is electrically connected to an end of the first sub-circuit remote from the adjustable lens assembly and the substrate.
The imaging module according to claim 8, wherein the lens barrel includes a lens barrel body, the lens barrel body includes a first body near an end of the bracket assembly, and a cross section of the first body The size is smaller than the cross-sectional size of the bracket, and the second sub-line is provided on the upper surface and the outer side surface of the bracket.
The imaging module according to claim 1, wherein the piezoelectric actuator module is formed with an accommodating cavity, the adjustable lens is disposed in the accommodating cavity, and the adjustable lens assembly Also includes:

A hollow support frame module, the piezoelectric actuator module is arranged in the support frame module;

A supporting substrate, the supporting substrate is disposed on the adjustable lens and is accommodated in the accommodating cavity; and

An annular fixing plate is provided on the piezoelectric actuator module and the support frame module.
The imaging module according to claim 10, wherein the support frame module includes a hollow support frame, a plurality of pins, and a plurality of connectors; one end of the pins is disposed in the support frame , The other end of the pin is provided outside the support frame and suspended; the connecting member is provided on the inner wall of the support frame and is located between the support frame and the piezoelectric actuator module , The connector is electrically connected to the pin and the piezoelectric actuator module.
The imaging module according to claim 10, wherein the piezoelectric actuator module includes a ring-shaped substrate, a ring-shaped piezoelectric actuator, and a flexible film, and the substrate surrounds the In the accommodating cavity, the film is provided on the substrate and closes one end of the accommodating cavity, and the piezoelectric actuator is provided on the side of the film away from the substrate.
The imaging module according to claim 10, wherein the adjustable lens assembly further comprises a shielding film, the shielding film is disposed on a side of the fixing plate away from the piezoelectric actuator module .
An electronic device, characterized in that it includes:

Shell; and

An imaging module, the imaging module is disposed on the housing; the imaging module includes:

A chip assembly, the chip assembly includes a substrate and an image sensor disposed on the substrate;

A lens assembly, the lens assembly is disposed on the chip assembly;

An adjustable lens assembly, the adjustable lens assembly is disposed on the lens assembly, the image sensor is used to receive light passing through the adjustable lens assembly and the lens assembly, the adjustable lens assembly includes A piezoelectric actuator module and an adjustable lens, the piezoelectric actuator module is used to drive the adjustable lens to deform under the action of an electric signal to change the curvature of the refractive surface of the adjustable lens; and

A connection line, which is provided on the lens assembly and electrically connects the adjustable lens assembly and the substrate.
The electronic device according to claim 14, wherein the lens assembly includes a lens barrel and a lens disposed in the lens barrel, a wire groove is formed in the lens barrel, and the connection line is formed on the wire Inside the slot.
The electronic device according to claim 15, wherein the lens barrel includes a lens barrel body and a protrusion extending from an outer peripheral surface of the lens barrel body, and the wire groove is opened in the protrusion on.
The electronic device according to claim 14, wherein the adjustable lens assembly further includes a pin, and the imaging module further includes a conductive block, the conductive block being disposed between the pin and the lens assembly The pin is electrically connected to the connecting line on the lens assembly.
The electronic device according to claim 14, wherein the imaging module further comprises a gasket, and the gasket is disposed between the adjustable lens assembly and the lens assembly.
The electronic device according to claim 14, wherein the imaging module further comprises a bracket assembly, the bracket assembly includes a hollow bracket and an optical filter installed in the bracket, the bracket assembly is disposed at Between the chip assembly and the lens assembly; the connection circuit includes a first sub-circuit and a second sub-circuit, the first sub-circuit is disposed on the lens component and electrically connected to the adjustable lens component The second sub-circuit is disposed on the bracket, and the second sub-circuit is electrically connected to an end of the first sub-circuit remote from the adjustable lens assembly and the substrate.
The electronic device according to claim 14, wherein the piezoelectric actuator module is formed with an accommodating cavity, the adjustable lens is disposed in the accommodating cavity, and the adjustable lens assembly is further include:

A hollow support frame module, the piezoelectric actuator module is arranged in the support frame module;

A supporting substrate, the supporting substrate is disposed on the adjustable lens and is accommodated in the accommodating cavity; and

An annular fixing plate is provided on the piezoelectric actuator module and the support frame module.