WO2020094068A1 - 彩膜基板及其制备方法、显示器件 - Google Patents

彩膜基板及其制备方法、显示器件 Download PDF

Info

Publication number
WO2020094068A1
WO2020094068A1 PCT/CN2019/116033 CN2019116033W WO2020094068A1 WO 2020094068 A1 WO2020094068 A1 WO 2020094068A1 CN 2019116033 W CN2019116033 W CN 2019116033W WO 2020094068 A1 WO2020094068 A1 WO 2020094068A1
Authority
WO
WIPO (PCT)
Prior art keywords
color
color filter
layer
light scattering
substrate
Prior art date
Application number
PCT/CN2019/116033
Other languages
English (en)
French (fr)
Inventor
史文
陈亚文
Original Assignee
广东聚华印刷显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 广东聚华印刷显示技术有限公司 filed Critical 广东聚华印刷显示技术有限公司
Priority to US17/290,498 priority Critical patent/US20230247893A1/en
Publication of WO2020094068A1 publication Critical patent/WO2020094068A1/zh

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/201—Filters in the form of arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/875—Arrangements for extracting light from the devices
    • H10K59/877—Arrangements for extracting light from the devices comprising scattering means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K59/8792—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. black layers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • the present application relates to the field of organic electroluminescence display, in particular to a color film substrate and its preparation method, a display device and its preparation method.
  • OLEDs Organic electroluminescent diodes
  • QLEDs Quantum dot light-emitting diodes
  • the OLED has an anode, an organic light-emitting material layer, and a cathode that are sequentially formed on the substrate.
  • the cathode of the OLED uses a thicker metal layer.
  • the light emitted by the organic light-emitting material layer needs to penetrate the flat layer (PLN) layer and the thin film transistor (TFT) layer under it, thereby reducing the luminous efficiency. Therefore, as the resolution increases, Bottom emission OLEDs are limited by the aperture ratio, making it difficult to achieve high resolution. More and more practitioners are turning to the development of top emission OLEDs to improve luminous efficiency and achieve high resolution display.
  • the present application provides a color filter substrate, which can increase the viewing angle of the display device and improve the display effect of the display.
  • a color filter substrate includes a color filter substrate, a plurality of black matrices on the color filter substrate, and a color filter layer, and the color filter layer is provided between two adjacent black matrices;
  • the color film layer includes color resist materials and light scattering particles.
  • the color film layer includes a light scattering film and a color resist layer that are stacked;
  • the light scattering film includes the light scattering particles
  • the color resist layer includes the color resist material
  • the light scattering film is located between the color resist layer and the color film substrate.
  • the light scattering film further includes a transparent polymer, and the transparent polymer includes at least one of polymethyl methacrylate resin and polystyrene resin.
  • the color resist material and the light scattering particles are mixed with each other in the color film layer.
  • the light scattering particles include at least one of titanium dioxide particles, magnesium dioxide particles, and zirconium dioxide particles.
  • the color film substrate is a rigid substrate or a flexible substrate.
  • the color film substrate is a glass substrate.
  • the black matrix is an organic photoresist black matrix; a plurality of grooves are formed between the plurality of black matrices and the color filter substrate.
  • the present application also provides a method for preparing a color film substrate.
  • a method for preparing a color film substrate includes the following steps:
  • a color film layer is formed between two adjacent black matrices; wherein the color film layer includes color resist material and light scattering particles.
  • the step of forming a color film layer between two adjacent black matrices includes:
  • the light scattering film includes the light scattering particles
  • the light scattering film is made of a raw material including the light scattering particles and a transparent polymer;
  • the transparent polymer includes at least one of polymethyl methacrylate resin and polystyrene resin Species.
  • the step of forming a color film layer between two adjacent black matrices includes:
  • the mixed material is deposited between two adjacent black matrices to form the color film layer.
  • the light scattering particles are selected from at least one of titanium dioxide particles, magnesium dioxide particles, and zirconium dioxide particles.
  • the application also provides a display device.
  • a display device including:
  • Packaging structure set on the display substrate
  • the plurality of black matrices and the color filter layer are disposed between the packaging structure and the color filter substrate.
  • the color film layer includes a light scattering film and a color resist layer that are stacked;
  • the light scattering film includes the light scattering particles
  • the color resist layer includes the color resist material
  • the light scattering film is located between the color resist layer and the color film substrate.
  • the color resist material and the light scattering particles are mixed with each other in the color film layer.
  • the display substrate includes a TFT driving array substrate and an OLED light emitting unit
  • the OLED light emitting unit is disposed on the TFT drive array substrate.
  • the OLED light emitting unit includes an R light emitting unit, a G light emitting unit, and a B light emitting unit.
  • the packaging structure is disposed on the TFT driving array substrate and encapsulates the OLED light emitting unit.
  • the encapsulation structure includes an encapsulation layer, the encapsulation layer is provided on the OLED light-emitting unit, and includes an oxide layer and an organic layer that are stacked, the oxide layer is provided on the organic layer Between the OLED light emitting units.
  • the oxide layer and the organic substance layer are formed by the deposited oxide and organic substance, respectively.
  • the color filter substrate of the color filter substrate of the present application is provided with a black matrix and a color filter layer, wherein the color filter layer is made of raw materials containing color resist materials and light scattering particles, and the light source passes through the light scattering particles to increase light scattering.
  • the color film layer containing the color resist material and the light scattering particles is located between two adjacent black matrices, and has a fixed boundary, which does not cause color mixing at the pixel boundary of the adjacent color, which is beneficial to the clear display of the displayed image.
  • the color resist material plays a role of reducing reaction, which can further improve the display effect of the display device.
  • FIGS. 1 to 3 are schematic diagrams of a preparation process of an embodiment of a color film substrate of the present application
  • FIG. 4 is a schematic structural diagram of an embodiment of a display substrate according to this application.
  • FIG. 5 is a schematic structural view of an embodiment of a display substrate provided with a packaging structure according to this application;
  • FIG. 6 is a schematic structural diagram of an embodiment of a display device according to this application.
  • FIG. 7 is a schematic structural diagram of another embodiment of a color filter substrate of the present application.
  • FIG. 8 is a schematic structural diagram of another embodiment of a display device of this application.
  • FIG. 9 is a schematic structural diagram of a comparative example of a display device of this application.
  • An embodiment of the present application provides a color filter substrate, including a color filter substrate, a plurality of black matrices on the color filter substrate, and a color filter layer, between which two adjacent black matrices are provided The color film layer;
  • the color film layer includes color filter (CF) material and light scattering particles.
  • CF color filter
  • the color filter substrate is used to support the color filter layer and the black matrix.
  • the color filter substrate may be a rigid substrate or a flexible substrate, and the rigid substrate may be selected from a glass substrate.
  • the black matrix is located on the color film substrate.
  • the material of the black matrix (BM) is a BM organic photoresist material.
  • the black matrix can be patterned by a photolithography process. It can be understood that the preparation process of the black matrix may be: depositing a BM organic photoresist material on the color film substrate, and then coating a layer of photoresist. The mask is exposed and developed to form an unexposed area and a fully exposed area of the photoresist, and then all the photoresist in the completely exposed area is removed to obtain a plurality of black matrices.
  • the black matrix is used to block light and prevent light leakage.
  • a plurality of mutually spaced black matrices and the color filter substrate form a plurality of grooves, the grooves correspond to the light source, and the color filter layer is located between two adjacent black matrices, that is, the color filter layer is disposed on In each groove, the color film layer corresponds to the light source.
  • the color film layer is made of raw materials including color resist materials and light scattering particles.
  • the light scattering particles may be selected from one of inorganic nanoparticles such as titanium dioxide, magnesium dioxide, or zirconium dioxide, or may be titanium dioxide, magnesium dioxide, and titanium dioxide.
  • the mixture of any two kinds of inorganic nanoparticles in zirconia may also be a mixture of three kinds of inorganic nanoparticles of titanium dioxide, magnesium dioxide and zirconium dioxide.
  • the color film layer can have different colors, such as red, green or blue.
  • the color resist material in a color film layer of a certain color can pass the light of that color, and filter or absorb the light of the other two colors.
  • the color film layer includes a light scattering film and a color resist layer that are stacked, the light scattering film is made of a raw material including the light scattering particles, and the color resist layer is made of a color resist material.
  • the material of the color resist layer includes a color resist material of a desired color
  • the color resist layer may be formed by patterning through a photolithography process.
  • the light-scattering film includes light-scattering particles, and may also include a transparent polymer.
  • the light-scattering film may also be formed by patterning using a photolithography process.
  • Transparent polymers include, but are not limited to, PMMA resin, PS resin, or a combination of PMMA resin and PS resin.
  • PMMA resin is polymethyl methacrylate resin
  • PS resin is polystyrene resin.
  • the light scattering film is located between the color resist layer and the color filter substrate, that is, the light scattering film is formed first, and then the color resist layer is formed.
  • the light source first passes through the light scattering film and then passes through the color resist layer.
  • the boundary of the pixel (pixel) is determined by the color resist layer, so there is no pixel edge color mixing .
  • the color film layer is made of a mixed material composed of a color resist material and light scattering particles of a desired color, including color resist materials and light scattering particles of a desired color mixed with each other.
  • a specific preparation method is as follows: first, the light scattering particles are dispersed in the color resist material to obtain a mixed material, and then the mixed material is deposited between two adjacent black matrices and obtained by patterning through a photolithography process.
  • the light scattering particles increase the scattering of light to achieve the purpose of increasing the viewing angle of the display device.
  • the color film layer containing the color resist material and the light scattering particles is located between several black matrices and has a fixed boundary, which does not cause color mixing at the pixel boundary of adjacent colors, which is beneficial to the clear display of the displayed image.
  • the color resist material plays a role of reducing the reaction, which can further improve the display effect of the display device.
  • An embodiment of the present application further provides a display device, including:
  • a packaging structure on the display substrate A packaging structure on the display substrate
  • the above color filter substrate is provided on the packaging structure.
  • the display substrate includes a TFT drive array substrate and an OLED light emitting unit; the OLED light emitting unit is disposed on the TFT drive array substrate.
  • the packaging structure is used for packaging an OLED light emitting unit.
  • the plurality of color film layers of the color film substrate correspond to the plurality of OLED light emitting units in a one-to-one manner, so that the light emitted by each OLED light emitting unit can pass through the color film layer corresponding thereto and then exit.
  • the surface of the color filter substrate away from the color filter substrate is disposed on the side close to the packaging structure, that is, the black matrix and color filter layer in the color filter substrate are disposed on the packaging structure and the color filter lining Between the bottom.
  • An embodiment of the present application also provides a method for manufacturing a display device, including the following steps:
  • the surface of the color film substrate away from the color film substrate is paired with the packaging structure on the display substrate to obtain a display device.
  • the display substrate is formed by vapor-depositing or printing an OLED light-emitting unit on a substrate having a TFT array.
  • the OLED light emitting unit includes a red (R) light emitting unit, a green (G) light emitting unit, and a blue (B) light emitting unit.
  • the R light-emitting unit, the G light-emitting unit and the B light-emitting unit in the OLED light-emitting unit respectively correspond to a color film layer containing color resist materials and light scattering particles of corresponding colors. After the light source passes through the color film layer, it can emit R, G or B, different colors of light.
  • the color resist material of a color film layer of a certain color can pass the light of that color, and absorb or block the light of the other two colors, so that the white light appears R, G or B color light.
  • the light scattering particles in the color film layer can receive the light first, increasing the scattering of light, so as to improve the viewing angle of the display device. The light scattered by the light scattering particles, after passing through the color boundary layer of the fixed boundary, will not cause the color mixture of the adjacent color pixel boundary, which is conducive to the clear display of the displayed image.
  • the encapsulation structure can be deposited by CVD / ALD, printing and other thin-film encapsulation methods, and oxides and organics are deposited on the OLED light-emitting unit, respectively, and the oxides and organics are stacked to form an encapsulation layer.
  • This embodiment provides a color film substrate and a display device.
  • the specific preparation method is as follows:
  • S12 Deposit a light-scattering material composed of titanium dioxide particles and a transparent polymer between two adjacent black matrices 120, and pattern by a photolithography process to form a light-scattering film 130, as shown in FIG. 2.
  • the transparent polymer includes polymethyl methacrylate (PMMA) resin or polystyrene (PS) resin.
  • S13. Coat a color resist material on the light scattering film 130, pattern by a photolithography process to form a color resist layer 140, and obtain a color film layer including the light scattering film 130 and the color resist layer 140, as shown in FIG. As shown in 3, the color filter substrate is obtained.
  • This embodiment provides a color film substrate and a display device.
  • the specific preparation method is as follows:
  • This comparative example provides a color film substrate and a display device, the specific preparation method is as follows:
  • the light source emitted by the OLED light emitting unit first passes through the light scattering particles, which increases the light scattering and can improve the viewing angle of the top scattering device.
  • the light scattered by the light-scattering particles passes through the color film layer with a fixed boundary, it will not cause the color mixture of the pixel boundary of the adjacent color, which is beneficial to the clear color development of the image.
  • the light scattered by the light-scattering particles is more scattered, and it is easy for color mixing to occur at the borders of sub-pixels of adjacent colors.

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Optical Filters (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种彩膜基板，包括彩膜衬底(110)、位于所述彩膜衬底(110)上的多个黑矩阵(120)，以及彩膜层；相邻的两个所述黑矩阵(120)之间设置有所述彩膜层；所述彩膜层包含色阻材料和光散射颗粒。上述彩膜基板可以提高显示器件的视角，进一步提高显示器的显示效果。

Description

彩膜基板及其制备方法、显示器件
相关申请的交叉引用
本申请要求于2018年11月6日提交中国专利局，申请号为201811312489.0，申请名称为“彩膜基板及其制备方法、显示器件及其制备方法”的中国专利申请的优先权,在此将其全文引入作为参考。
技术领域
本申请涉及有机电致发光显示领域，特别是涉及彩膜基板及其制备方法、显示器件及其制备方法。
背景技术
有机电致发光二极管(OLED)由于其具有自发光、反应快、视角广、亮度高、轻薄等优点，量子点发光二极管(QLED)由于其光色纯度高、发光量子效率高、发光颜色易调、使用寿命长等优点，是目前显示器件研究的两个主要方向。
OLED具有依次形成于基板上的阳极、有机发光材料层和阴极。在大尺寸OLED显示器的应用方向，市面上的产品大多采用底发射型(Bottom emission)结构，OLED的阴极采用较厚的金属层。采用该结构的OLED显示面板，有机发光材料层发出的光线需要穿透其下方的平坦层(PLN)层及薄膜晶体管(TFT)层，从而降低了发光效率，因此，随着分辨率的增长，底发射型OLED会受到开口率的限制，难以实现高分辨率，越来越多的从业者将精力转向顶发射型(Top emission)OLED的开发，以提高发光效率并实现高分辨率的显示。
但是在顶发射型OLED器件中，通常采用半透明的Mg：Ag合金作为阴极，存在较明显的微腔效应，导致视角变差。
发明内容
基于此，本申请提供一种彩膜基板，所述彩膜基板可以提高显示器件的视角，提高显示器的显示效果。
技术方案为：
一种彩膜基板，包括彩膜衬底、位于所述彩膜衬底上的多个黑矩阵，以及彩膜层，相邻的两个所述黑矩阵之间设置有所述彩膜层；
所述彩膜层包括色阻材料和光散射颗粒。
在其中一个实施例中，所述彩膜层包括层叠设置的光散射膜和色阻层；
所述光散射膜包括所述光散射颗粒；
所述色阻层包括所述色阻材料；
所述光散射膜位于所述色阻层与所述彩膜衬底之间。
在其中一个实施例中，所述光散射膜还包括透明聚合物，所述透明聚合物包括聚甲基丙烯酸甲酯树脂和聚苯乙烯树脂中的至少一种。
在其中一个实施例中，所述色阻材料和所述光散射颗粒在所述彩膜层中相互混合。
在其中一个实施例中，所述光散射颗粒包括二氧化钛颗粒、二氧化镁颗粒和二氧化锆颗粒中的至少一种。
在其中一个实施例中，所述彩膜衬底为刚性衬底或柔性衬底。
在其中一个实施例中，所述彩膜衬底为玻璃衬底。
在其中一个实施例中，所述黑矩阵为有机光阻黑矩阵；所述多个黑矩阵与所述彩膜衬底之间形成多个凹槽。
本申请还提供一种彩膜基板的制备方法。
技术方案为：
一种彩膜基板的制备方法，包括以下步骤：
在彩膜衬底上制作多个黑矩阵；
在相邻的两个所述黑矩阵之间形成彩膜层；其中，所述彩膜层包括色阻材料和光散射颗粒。
在其中一个实施例中，在相邻的两个所述黑矩阵之间均形成彩膜层的步骤包括：
在相邻的两个所述黑矩阵之间均形成光散射膜；所述光散射膜包括所述光散射颗粒；
在所述光散射膜上沉积所述色阻材料，形成色阻层。
在其中一个实施例中，所述光散射膜由包括所述光散射颗粒和透明聚合物的原料制成；所述透明聚合物包括聚甲基丙烯酸甲酯树脂和聚苯乙烯树脂中的至少一种。
在其中一个实施例中，在相邻的两个所述黑矩阵之间均形成彩膜层的步骤包括：
将所述光散射颗粒分散于所述色阻材料中，得到混合材料；
在相邻的两个所述黑矩阵之间均沉积所述混合材料，形成所述彩膜层。
在其中一个实施例中，所述光散射颗粒选自二氧化钛颗粒、二氧化镁颗粒和二氧化锆颗粒中的至少一种。
本申请还提供一种显示器件。
技术方案为：
一种显示器件，包括：
显示基板；
封装结构，设于显示基板上；
上述彩膜基板，所述多个黑矩阵和所述彩膜层设置在所述封装结构与所述彩膜衬底之间。
在其中一个实施例中，所述彩膜层包括层叠设置的光散射膜和色阻层；
所述光散射膜包括所述光散射颗粒；
所述色阻层包括所述色阻材料；
所述光散射膜位于所述色阻层与所述彩膜衬底之间。
在其中一个实施例中，所述色阻材料和所述光散射颗粒在所述彩膜层中相互混合。
在其中一个实施例中，所述显示基板包括TFT驱动阵列基板和OLED发光单元；
所述OLED发光单元设置于所述TFT驱动阵列基板上。
在其中一个实施例中，所述OLED发光单元包括R发光单元、G发光单元以及B发光单元。
在其中一个实施例中，所述封装结构设置于所述TFT驱动阵列基板上，封装所述OLED发光单元。
在其中一个实施例中，所述封装结构包括封装层，所述封装层设于OLED发光单元上，包括层叠设置的氧化物层和有机物层，所述氧化物层设于所述有机物层与所述OLED发光单元之间。所述氧化物层和所述有机物层分别通过沉积的氧化物和有机物形成。
与现有技术相比，本申请具有以下有益效果：
本申请彩膜基板的彩膜衬底上，设置有黑矩阵和彩膜层，其中，彩膜层由包含色阻材料和光散射颗粒的原料制成，光源经过光散射颗粒，增加光的散射，达到增加显示器件视角的目的。同时，包含色阻材料和光散射颗粒的彩膜层位于相邻的两个黑矩阵之间，具有固定边界，不会引起相邻颜色的像素边界出现混色，有利于显示图像的清晰显示。同时，色阻材料起减反作用，可进一步提高显示器件的显示效果。
附图说明
图1至图3为本申请彩膜基板的一实施例的制备过程示意图；
图4为本申请显示基板的一实施例的结构示意图；
图5为本申请设置有封装结构的显示基板的一实施例的结构示意图；
图6为本申请显示器件的一实施例的结构示意图；
图7为本申请彩膜基板的另一实施例的结构示意图；
图8为本申请显示器件的另一实施例的结构示意图；
图9为本申请显示器件的对比例的结构示意图。
具体实施方式
以下结合具体实施例对本申请的彩膜基板及其制备方法、显示器件及其制备方法作进一步详细的说明。本申请可以以许多不同的形式来实现，并不限于本文所描述的实施方式。相反地，提供这些实施方式的目的是使对本申请公开内容理解更加透彻全面。
除非另有定义，本文所使用的所有的技术和科学术语与属于本申请的技术领域的技术人员通常理解的含义相同。本文中在本申请的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本申请。本文所使用的术语“和/或”包括一个或多个相关的所列项目的任意的和所有的组合。
本申请实施例提供一种彩膜基板，包括彩膜衬底、位于所述彩膜衬底上的多个黑矩阵，以及彩膜层，相邻的两个所述黑矩阵之间均设置有所述彩膜层；
所述彩膜层包括色阻(color filter，CF)材料和光散射颗粒。
具体的，彩膜衬底用于支撑彩膜层和黑矩阵，彩膜衬底可以是刚性衬底或柔性衬底，刚性衬底可以选自玻璃衬底。
黑矩阵位于彩膜衬底上，黑矩阵(black matrix，BM)的材料为BM有机光阻材料，黑矩阵可通过光刻工艺图案化形成。可以理解的，黑矩阵的制备工艺可以为：在彩膜衬底上沉积BM有机光阻材料，再涂覆一层光刻胶。通过掩膜板曝光并进行显影处理，使光刻胶形成未曝光区域和完全曝光区域，然后将完全曝光区域的光刻胶全部除去，得多个黑矩阵。
黑矩阵用于遮挡光、防止漏光。相互间隔的多个黑矩阵与彩膜衬底形成多个凹槽，该凹槽与光源相对应，彩膜层位于相邻的两个所述黑矩阵之间，即彩膜层设置在上述多个凹槽里，即彩膜层与光源相对应。
彩膜层由包括色阻材料和光散射颗粒的原料制成，光散射颗粒可以选自二氧化钛、二氧化镁或二氧化锆等无机纳米颗粒中的一种，也可以是二氧化钛、二氧化镁和二氧化锆中任意两种无机纳米颗粒的混合，也可以是二氧化钛、二氧化镁和二氧化锆三种无机纳米颗 粒的混合。彩膜层可以具有不同颜色，如红色、绿色或蓝色。某一颜色的彩膜层中的色阻材料能够使该颜色的光通过，并过滤或吸收另外两种颜色的光。
在一实施例中，彩膜层包括层叠设置的光散射膜和色阻层，光散射膜由包括所述光散射颗粒的原料制成，色阻层由色阻材料制成。
具体的，色阻层的材料包括所需颜色的色阻材料，色阻层可通过光刻工艺图案化形成。光散射膜包括有光散射颗粒，还可以包括有透明聚合物，光散射膜也可通过光刻工艺图案化形成。透明聚合物包括但不限于PMMA树脂、PS树脂、或PMMA树脂和PS树脂的组合，PMMA树脂为聚甲基丙烯酸甲酯树脂；PS树脂为聚苯乙烯树脂。
在一实施例中，光散射膜位于色阻层与彩膜衬底之间，即先形成光散射膜，后形成色阻层。这种结构下，当上述彩膜基板用于显示器件中时，光源先通过光散射膜，再经过色阻层，pixel(像素)的边界由色阻层决定，因此不会存在pixel边缘混色现象。
在另一实施例中，彩膜层由所需颜色的色阻材料和光散射颗粒组成的混合材料制成，包括相互混合的所需颜色的色阻材料和光散射颗粒。具体的制备方法为：先将光散射颗粒分散于色阻材料中，得混合材料，再将混合材料沉积在相邻的两个所述黑矩阵之间，并通过光刻工艺图案化而得到。
当光源经过具有本申请实施例所述的彩膜层的彩膜基板时，通过光散射颗粒，增加光的散射，达到增加显示器件视角的目的。包含色阻材料和光散射颗粒的彩膜层位于若干个黑矩阵之间，具有固定边界，不会引起相邻颜色的像素边界出现混色，有利于显示图像的清晰显示。在一实施例中，色阻材料起减反作用，可进一步提高显示器件的显示效果。
本申请实施例还提供一种显示器件，包括：
显示基板；
封装结构，设于显示基板上；以及
上述的彩膜基板，设于所述封装结构上。
具体的，显示基板含有TFT驱动阵列基板和OLED发光单元；所述OLED发光单元设置于所述TFT驱动阵列基板上。所述封装结构用于封装OLED发光单元。所述彩膜基板的多个彩膜层与多个OLED发光单元一一对应，使得每个OLED发光单元发出的光可以经过与之对应的彩膜层后出射。彩膜基板中远离所述彩膜衬底的表面设置在靠近所述封装结构的一侧，即所述彩膜基板中的黑矩阵、彩膜层设置在所述封装结构与所述彩膜衬底之间。
本申请实施例还提供一种显示器件的制备方法，包括以下步骤：
在显示基板上制作封装结构；
采用上述方法制作彩膜基板；
将所述彩膜基板远离所述彩膜衬底的表面与所述显示基板上的所述封装结构对组，得到显示器件。
具体的，所述显示基板通过在具有TFT阵列的基板上蒸镀或打印OLED发光单元而形成。所述OLED发光单元包括红色(R)发光单元、绿色(G)发光单元以及蓝色(B)发光单元。进一步的，OLED发光单元中的R发光单元、G发光单元以及B发光单元分别对应一个包含对应颜色的色阻材料和光散射颗粒的彩膜层。光源通过彩膜层后，可发出R、G或B，不同颜色的光。更具体的，某一颜色的彩膜层的色阻材料可以使该颜色的光通过，并吸收或阻挡另两种颜色的光，从而使白光通过对应颜色的彩膜层后呈现R、G或B颜色光。当各个发光单元发出光后，彩膜层中的光散射颗粒可先接收光，增加光的散射，达到提高显示器件视角的目的。经过光散射颗粒散射后的光，经过固定边界的色阻层后，不会引起相邻颜色的像素边界出现混色，有利于显示图像的清晰显示。
封装结构可通过CVD/ALD以及印刷等薄膜封装的方法，在OLED发光单元上分别沉积氧化物和有机物，使氧化物和有机物层叠形成封装层。
可以理解的，将设有封装结构的显示基板与彩膜基板对组前，在两个即将对组的面涂上框胶，将含有粘接有框胶的两面对组后，经过烘烤完成显示器件的制作。
实施例1
本实施例提供一种彩膜基板和一种显示器件，具体制备方法如下：
S11、在彩膜衬底110上沉积BM有机光阻材料，通过光刻工艺图案化，形成若干个相互间隔的黑矩阵120，如图1所示，若干个黑矩阵120与彩膜衬底110之间形成若干个凹槽。
S12、在相邻的两个黑矩阵120之间沉积由二氧化钛颗粒和透明聚合物混合而成的光散射材料，并通过光刻工艺图案化，形成光散射膜130，如图2所示。其中，所述透明聚合物包括聚甲基丙烯酸甲酯(polymethyl methacrylate，PMMA)树脂或聚苯乙烯(polystyrene，PS)树脂。S13、在上述光散射膜130上涂布色阻材料，通过光刻工艺图案化，形成色阻层140，得到包括所述光散射膜130和所述色阻层140的彩膜层，如图3所示，即得到彩膜基板。
S14、在含有TFT驱动阵列的基板210上沉积OLED发光单元220，如图4所示，得到显示基板。
S15、将OLED发光单元220封装得到设置有封装结构230的显示基板，如图5所示。
S16、将图3中彩膜基板远离彩膜衬底110的表面与图5中的显示基板上的封装结构230对组，形成如图6所示的显示器件。
实施例2
本实施例提供一种彩膜基板和一种显示器件，具体制备方法如下：
S21、在彩膜衬底110上沉积BM有机光阻材料，通过光刻工艺图案化，形成若干个黑矩阵120，如图1所示，若干个黑矩阵120与彩膜衬底110之间形成若干个凹槽。
S22、将二氧化钛颗粒分散于所述色阻材料中，得混合材料，在相邻的两个黑矩阵120之间涂布所述混合材料，并通过光刻工艺图案化，形成彩膜层150，如图7所示，即得到彩膜基板。
S23、在含有TFT驱动阵列的基板210上沉积OLED发光单元220，如图4所示，得到显示基板。
S24、将OLED发光单元220封装，得到设置有封装结构230的显示基板，如图5所示。
S25、将图7中彩膜基板远离彩膜衬底110的表面与图5中的显示基板上的封装结构230对组，形成如图8所示的显示器件。
对比例
本对比例提供一种彩膜基板和一种显示器件，具体制备方法如下：
S31、在彩膜衬底110上沉积BM有机光阻材料，通过光刻工艺图案化，形成若干个黑矩阵120，如图1所示，若干个黑矩阵120与彩膜衬底110之间形成若干个凹槽。
S32、在相邻的两个黑矩阵120之间涂布色阻材料，通过光刻工艺图案化，形成色阻层140，即得到彩膜基板。
S33、在含有TFT驱动阵列的基板210上沉积OLED发光单元220，如图4所示，得到显示基板。
S34、将OLED发光单元封装，得设置有封装结构230的显示基板，如图5所示。
S35、将S32所述彩膜基板远离彩膜衬底110的表面与图5中的显示基板上的封装结构230对组，再在彩膜衬底110另一面上沉积由二氧化钛颗粒和PMMA混合而成的光散射材料，形成光散射膜130，得到如图9所示的显示器件。
实施例1和实施例2的显示器件中，OLED发光单元发出的光源，先经过光散射颗粒，增加了光的散射，可提高顶散射器件的视角。同时，经过光散射颗粒散射的光经过固定边界的彩膜层后，不会引起相邻颜色的像素边界出现混色，有利于图像的清晰显色。
对比例的显示器件中，经过光散射颗粒散射后的光更散乱，容易出现相邻颜色的子像素边界出现混色。显示面板的分辨率越高，混色越严重，散射薄膜越厚，混色也越严重，即显示图像不清晰。这些现象说明光散射颗粒的位置对显示器件的显示效果有较大影响。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本申请的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对本申请专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本申请构思的前提下，还可以做出若干变形和改进，这些都属于本申请的保护范围。因此，本申请专利的保护范围应以所附权利要求为准。

Claims (20)

  1. 一种彩膜基板，其特征在于，包括彩膜衬底、位于所述彩膜衬底上的多个黑矩阵，以及彩膜层；
    相邻的两个所述黑矩阵之间设置有所述彩膜层；
    所述彩膜层包括色阻材料和光散射颗粒。
  2. 根据权利要求1所述的彩膜基板，其特征在于，所述彩膜层包括层叠设置的光散射膜和色阻层；
    所述光散射膜包括所述光散射颗粒；
    所述色阻层包括所述色阻材料；
    所述光散射膜位于所述色阻层与所述彩膜衬底之间。
  3. 根据权利要求2所述的彩膜基板，其特征在于，所述光散射膜还包括透明聚合物；
    所述透明聚合物包括聚甲基丙烯酸甲酯树脂和聚苯乙烯树脂中的至少一种。
  4. 根据权利要求1所述的彩膜基板，其特征在于，所述色阻材料和所述光散射颗粒在所述彩膜层中相互混合。
  5. 根据权利要求1所述的彩膜基板，其特征在于，所述光散射颗粒包括二氧化钛颗粒、二氧化镁颗粒和二氧化锆颗粒中的至少一种。
  6. 根据权利要求1所述的彩膜基板，其特征在于，所述彩膜衬底为刚性衬底或柔性衬底。
  7. 根据权利要求1所述的彩膜基板，其特征在于，所述彩膜衬底为玻璃衬底。
  8. 根据权利要求1所述的彩膜基板，其特征在于，所述黑矩阵为有机光阻黑矩阵；所述多个黑矩阵与所述彩膜衬底之间形成多个凹槽。
  9. 一种彩膜基板的制备方法，其特征在于，包括以下步骤：
    在彩膜衬底上制作多个黑矩阵；
    在相邻的两个所述黑矩阵之间形成彩膜层；其中，所述彩膜层包括色阻材料和光散射颗粒。
  10. 根据权利要求9所述的彩膜基板的制备方法，其特征在于，在相邻的两个所述黑矩阵之间均形成彩膜层的步骤包括：
    在相邻的两个所述黑矩阵之间均形成光散射膜；所述光散射膜包括所述光散射颗粒；
    在所述光散射膜上沉积所述色阻材料，形成色阻层。
  11. 根据权利要求10所述的彩膜基板的制备方法，其特征在于，所述光散射膜还包括透明聚合物，所述透明聚合物包括聚甲基丙烯酸甲酯树脂和聚苯乙烯树脂中的至少一种。
  12. 根据权利要求9所述的彩膜基板的制备方法，其特征在于，在相邻的两个所述黑矩阵之间均形成彩膜层的步骤包括：
    将所述光散射颗粒分散于所述色阻材料中，得到混合材料；
    在相邻的两个所述黑矩阵之间均沉积所述混合材料，形成所述彩膜层。
  13. 根据权利要求9所述的彩膜基板的制备方法，其特征在于，所述光散射颗粒选自二氧化钛颗粒、二氧化镁颗粒和二氧化锆颗粒中的至少一种。
  14. 一种显示器件，其特征在于，包括：
    显示基板；
    封装结构，设于显示基板上；
    权利要求1所述的彩膜基板，所述多个黑矩阵和所述彩膜层设置在所述封装结构与所述彩膜衬底之间。
  15. 根据权利要求14所述的显示器件，其特征在于，所述彩膜层包括层叠设置的光散射膜和色阻层；
    所述光散射膜包括所述光散射颗粒；
    所述色阻层包括所述色阻材料；
    所述光散射膜位于所述色阻层与所述彩膜衬底之间。
  16. 根据权利要求14所述的显示器件，其特征在于，所述色阻材料和所述光散射颗粒在所述彩膜层中相互混合。
  17. 根据权利要求14所述的显示器件，其特征在于，所述显示基板包括TFT驱动阵列基板和OLED发光单元；
    所述OLED发光单元设置于所述TFT驱动阵列基板上。
  18. 根据权利要求17所述的显示器件，其特征在于，所述OLED发光单元包括R发光单元、G发光单元以及B发光单元。
  19. 根据权利要求15所述的显示器件，其特征在于，所述封装结构设置于所述TFT驱动阵列基板上，封装所述OLED发光单元。
  20. 根据权利要求19所述的显示器件，其特征在于，所述封装结构包括封装层，所述封装层设于OLED发光单元上，包括层叠设置的氧化物层和有机物层，所述氧化物层设于所述有机物层与所述OLED发光单元之间。
PCT/CN2019/116033 2018-11-06 2019-11-06 彩膜基板及其制备方法、显示器件 WO2020094068A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US17/290,498 US20230247893A1 (en) 2018-11-06 2019-11-06 Color film base plate and preparation method therefor, and display device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201811312489.0 2018-11-06
CN201811312489.0A CN111146353A (zh) 2018-11-06 2018-11-06 彩膜基板及其制备方法、显示器件及其制备方法

Publications (1)

Publication Number Publication Date
WO2020094068A1 true WO2020094068A1 (zh) 2020-05-14

Family

ID=70515931

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/116033 WO2020094068A1 (zh) 2018-11-06 2019-11-06 彩膜基板及其制备方法、显示器件

Country Status (3)

Country Link
US (1) US20230247893A1 (zh)
CN (1) CN111146353A (zh)
WO (1) WO2020094068A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115280232A (zh) * 2020-12-15 2022-11-01 京东方科技集团股份有限公司 显示基板、显示装置及显示基板的制作方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112015057B (zh) * 2020-09-21 2023-03-17 业成科技（成都）有限公司 像印设备及其制造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070153175A1 (en) * 2005-12-30 2007-07-05 Lg Philips Lcd Co., Ltd. Liquid crystal display device and method of fabricating the same
CN104880879A (zh) * 2015-06-19 2015-09-02 京东方科技集团股份有限公司 Coa阵列基板及其制造方法、显示装置
CN105161513A (zh) * 2015-08-03 2015-12-16 京东方科技集团股份有限公司 Oled显示装置及其制造方法、彩膜基板及其制造方法
CN205787482U (zh) * 2016-07-01 2016-12-07 上海天马微电子有限公司 一种半反半透型液晶显示面板及包含其的显示装置
CN107515488A (zh) * 2017-08-01 2017-12-26 惠科股份有限公司 一种显示面板
CN108303820A (zh) * 2017-12-26 2018-07-20 江西省平波电子有限公司 一种窄边框tft液晶显示模组
CN108363238A (zh) * 2018-04-25 2018-08-03 京东方科技集团股份有限公司 一种反射式液晶显示面板及其制备方法、显示装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101946391B1 (ko) * 2012-05-31 2019-02-12 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조방법
KR20140074495A (ko) * 2012-12-10 2014-06-18 삼성디스플레이 주식회사 포토루미네선트 패널, 이를 갖는 포토루미네선트 액정표시장치 및 이의 제조방법
CN104009062B (zh) * 2014-04-23 2015-04-29 京东方科技集团股份有限公司 彩膜基板及制备方法、有机电致发光显示面板、显示装置
US10018912B2 (en) * 2014-06-13 2018-07-10 Sharp Kabushiki Kaisha Photosensitive resin composition, wavelength conversion substrate and light emitting device
KR20160035680A (ko) * 2014-09-23 2016-04-01 삼성디스플레이 주식회사 회색 컬러필터를 포함하는 표시장치
KR102291493B1 (ko) * 2016-08-11 2021-08-20 삼성디스플레이 주식회사 컬러 필터 및 이를 포함하는 표시 장치
JP6595444B2 (ja) * 2016-08-31 2019-10-23 エルジー ディスプレイ カンパニー リミテッド 表示装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070153175A1 (en) * 2005-12-30 2007-07-05 Lg Philips Lcd Co., Ltd. Liquid crystal display device and method of fabricating the same
CN104880879A (zh) * 2015-06-19 2015-09-02 京东方科技集团股份有限公司 Coa阵列基板及其制造方法、显示装置
CN105161513A (zh) * 2015-08-03 2015-12-16 京东方科技集团股份有限公司 Oled显示装置及其制造方法、彩膜基板及其制造方法
CN205787482U (zh) * 2016-07-01 2016-12-07 上海天马微电子有限公司 一种半反半透型液晶显示面板及包含其的显示装置
CN107515488A (zh) * 2017-08-01 2017-12-26 惠科股份有限公司 一种显示面板
CN108303820A (zh) * 2017-12-26 2018-07-20 江西省平波电子有限公司 一种窄边框tft液晶显示模组
CN108363238A (zh) * 2018-04-25 2018-08-03 京东方科技集团股份有限公司 一种反射式液晶显示面板及其制备方法、显示装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115280232A (zh) * 2020-12-15 2022-11-01 京东方科技集团股份有限公司 显示基板、显示装置及显示基板的制作方法
CN115280232B (zh) * 2020-12-15 2023-11-17 京东方科技集团股份有限公司 显示基板、显示装置及显示基板的制作方法

Also Published As

Publication number Publication date
CN111146353A (zh) 2020-05-12
US20230247893A1 (en) 2023-08-03

Similar Documents

Publication Publication Date Title
TWI283549B (en) Organic electroluminescent display device with improved color saturation and method of fabricating the same
KR101317577B1 (ko) 유기 일렉트로루미네슨스 표시 장치
CN102577610B (zh) 有机电致发光显示装置
WO2015161624A1 (zh) 彩膜基板及制备方法、有机电致发光显示面板、显示装置
WO2019127790A1 (zh) 用于woled显示器的彩膜基板及woled显示器
WO2018232806A1 (zh) Oled显示面板及其制备方法、显示装置
US20210336096A1 (en) Display panel and manufacturing method thereof
WO2021228219A1 (zh) Oled显示基板及其制备方法、oled显示装置
US9660000B2 (en) Organic light emitting diode (OLED) array substrate and fabricating method thereof, display device
JPH11251059A (ja) カラー表示装置
WO2021174615A1 (zh) 量子点显示面板及其制备方法
WO2017173683A1 (zh) 电致光致混合发光显示器件及其制作方法
JP2001313172A (ja) 有機エレクトロルミネッセンス白色光源、及びその製造方法
CN108922914A (zh) 一种oled显示面板及显示装置
WO2020233284A1 (zh) 显示面板及其制作方法、显示装置
WO2020001061A1 (zh) 显示基板及制造方法、显示装置
CN103943661A (zh) 一种显示装置及其制作方法
WO2018120710A1 (zh) Oled显示面板及其制造方法、显示装置
US20200321560A1 (en) Organic light-emitting device and display device
JP2013120731A (ja) 表示装置
WO2021035957A1 (zh) 一种量子点oled显示面板
WO2021035943A1 (zh) 量子点oled显示面板
EP3203522A1 (en) Oled display substrate, oled display device and mask plate
TW201414032A (zh) 白光發光裝置、包含其之白光發光面板、製造白光發光面板之方法、及包含白光發光裝置之顯示設備
WO2020094068A1 (zh) 彩膜基板及其制备方法、显示器件

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19882855

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 23.08.2021)

122 Ep: pct application non-entry in european phase

Ref document number: 19882855

Country of ref document: EP

Kind code of ref document: A1