WO2020093819A1 - 成像模组、摄像头组件及电子装置 - Google Patents

成像模组、摄像头组件及电子装置 Download PDF

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Publication number
WO2020093819A1
WO2020093819A1 PCT/CN2019/109361 CN2019109361W WO2020093819A1 WO 2020093819 A1 WO2020093819 A1 WO 2020093819A1 CN 2019109361 W CN2019109361 W CN 2019109361W WO 2020093819 A1 WO2020093819 A1 WO 2020093819A1
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WO
WIPO (PCT)
Prior art keywords
imaging module
circuit board
module
light
imaging
Prior art date
Application number
PCT/CN2019/109361
Other languages
English (en)
French (fr)
Inventor
张弓
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Priority to EP19881923.7A priority Critical patent/EP3869772B1/en
Publication of WO2020093819A1 publication Critical patent/WO2020093819A1/zh
Priority to US17/307,543 priority patent/US11533418B2/en

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/67—Focus control based on electronic image sensor signals
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
    • H04N23/682—Vibration or motion blur correction
    • H04N23/685—Vibration or motion blur correction performed by mechanical compensation
    • H04N23/687—Vibration or motion blur correction performed by mechanical compensation by shifting the lens or sensor position
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0206—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings
    • H04M1/0208—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings characterized by the relative motions of the body parts
    • H04M1/0235—Slidable or telescopic telephones, i.e. with a relative translation movement of the body parts; Telephones using a combination of translation and other relative motions of the body parts
    • H04M1/0237—Sliding mechanism with one degree of freedom

Definitions

  • the present application relates to the field of electronic devices, in particular to an imaging module, a camera assembly and an electronic device.
  • the camera of the mobile phone uses a periscope lens.
  • the periscope camera can perform three times the optical focal length to obtain a higher quality image.
  • the iron shell of the camera motor needs to be grounded.
  • the iron shell is grounded by means of conductive cloth, copper foil, etc.
  • the overall module size is larger, and the stack size of the whole machine is more crowded. Usually there is not enough space to ground the iron shell by adding a conductive cloth.
  • the application provides an imaging module, a camera assembly and an electronic device.
  • the housing has a light inlet, and the reflective element is used to turn the incident light incident from the light inlet and pass the lens assembly to the image sensor so that the image sensor senses the imaging The incident light outside the module;
  • the driving mechanism is used to drive the moving element located between the reflective element and the image sensor to move along the optical axis of the lens assembly so that the lens assembly fixed on the moving element is in the Focus imaging on the image sensor;
  • the imaging module further includes a module circuit board, the module circuit board is fixed on the housing, the module circuit board includes a reinforcement board, and the ground of the reinforcement board and the module circuit board The pins are connected to ground the housing.
  • the camera assembly of the embodiment of the present application includes a first imaging module, a second imaging module, and a third imaging module.
  • the first imaging module is the imaging module described above, and the third imaging module
  • the angle of view is larger than the angle of view of the first imaging module and smaller than the angle of view of the second imaging module.
  • An electronic device includes a body and a sliding module for sliding between a first position accommodated in the body and a second position exposed from the body, the sliding module is provided There are the camera components described above.
  • the module circuit board is fixed on the housing.
  • the module circuit board is used.
  • the reinforced board serves as a bridge, connecting the grounding pin of the module circuit board and the shell, to achieve the grounding treatment of the shell.
  • FIG. 1 is a schematic diagram of a state of an electronic device according to an embodiment of the present application.
  • FIG. 2 is a schematic diagram of another state of an electronic device according to an embodiment of the present application.
  • FIG. 3 is a schematic perspective view of a camera assembly according to an embodiment of the present application.
  • FIG. 4 is a schematic perspective view of a first imaging module according to an embodiment of the present application.
  • FIG. 5 is an exploded schematic view of the first imaging module of the embodiment of the present application.
  • FIG. 6 is a perspective schematic view of a module circuit board according to an embodiment of the present application.
  • FIG. 7 is a perspective schematic view of the first imaging module part of the embodiment of the present application.
  • FIG. 8 is a schematic cross-sectional view of a first imaging module according to an embodiment of the present application.
  • FIG. 9 is a schematic partial cross-sectional view of a first imaging module according to an embodiment of the present application.
  • FIG. 10 is a schematic cross-sectional view of a first imaging module according to another embodiment of the present application.
  • FIG. 11 is a schematic perspective view of a reflective element according to an embodiment of the present application.
  • FIG. 12 is a schematic diagram of light reflection imaging of an imaging module in the related art
  • FIG. 13 is a schematic diagram of light reflection imaging of a first imaging module according to an embodiment of the present application.
  • FIG. 14 is a schematic structural diagram of an imaging module in the related art
  • FIG. 15 is a schematic structural diagram of a first imaging module according to an embodiment of the present application.
  • 16 is a schematic cross-sectional view of a second imaging module according to an embodiment of the present application.
  • Electronic device 1000 body 110, sliding module 200, gyroscope 120;
  • Camera assembly 100 first imaging module 20, housing 21, light inlet 211, groove 212, top wall 213, side wall 214, escape hole 215, reflective element 22, light incident surface 222, backlight surface 224, light incident Surface 226, light exit surface 228, mounting base 23, curved surface 231, first lens assembly 24, lens 241, moving element 25, clip 222, first image sensor 26, driving mechanism 27, first limiting structure 271, Drive device 28, curved guide rail 281, central axis 282, module circuit board 29, reinforcing plate 291, second limit structure 2911, connecting portion 292, positioning portion 293, chip circuit board 201, mounting portion 2011, third Limit structure 2012, connecting portion 2022, driving chip 202, sensor circuit board 203, shielding cover 204, second imaging module 30, second lens assembly 31, second image sensor 32, third imaging module 40, bracket 50 .
  • the reflective element in the periscope camera is susceptible to positional deviation when the periscope camera is dropped, and the reflective element cannot accurately turn the light to the image sensor, causing the image sensor to not accurately sense the periscope Object images outside the camera cannot be used normally.
  • the imaging module includes a PCB circuit board with a driver chip.
  • the size of the shaking imaging module is larger than the ordinary imaging module and cannot be reduced.
  • the electronic device 1000 includes a body 110 and a sliding module 200.
  • the sliding module 200 is used to slide between a first position accommodated in the body 110 and a second position exposed from the body 110.
  • the sliding module 200 is provided with a camera assembly 100 and a gyroscope 120, and the camera assembly 100 and the gyroscope 120 are separated Settings.
  • the electronic device 1000 may be used to control the camera assembly 100 to operate according to the feedback data of the gyroscope 120 to achieve optical image stabilization shooting.
  • the camera assembly 100 and the gyroscope 120 are provided separately, which reduces the components in the camera assembly 100, so that the volume of the camera assembly 100 can be reduced.
  • the camera assembly 100 and the gyroscope 120 are both disposed in the sliding module 200, so that the gyroscope 120 is closer to the camera assembly 100, and the gyroscope 120 can accurately detect the jitter of the camera assembly 100, thereby improving the anti-shake effect of the camera assembly 100 .
  • the electronic device 1000 may be any one of various types of computer system equipment that is mobile or portable and performs wireless communication (only one form is exemplarily shown in FIG. 1).
  • the electronic device 1000 may be a mobile phone or a smart phone (for example, an iPhone based on TM, an Android-based phone), a portable game device (for example, Nintendo DS, TM, PlayStation Portable TM, Gameboy Advance TM, iPhone TM), laptop Computers, PDAs, portable Internet devices, music players and data storage devices, other handheld devices and such as watches, earphones, pendants, headphones, etc.
  • the electronic device 100 can also be other wearable devices (eg, Head-mounted devices (HMD) such as electronic glasses, electronic clothes, electronic bracelets, electronic necklaces, electronic tattoos, electronic devices or smart watches).
  • HMD Head-mounted devices
  • the electronic device 1000 may also be any one of a plurality of electronic devices including, but not limited to, cellular phones, smart phones, other wireless communication devices, personal digital assistants, audio players, other media players, music recorders , Video recorders, cameras, other media recorders, radios, medical equipment, vehicle transportation instruments, calculators, programmable remote controls, pagers, laptop computers, desktop computers, printers, netbook computers, personal digital assistants (PDAs), portable Multimedia players (PMP), Moving Picture Experts Group (MPEG-1 or MPEG-2) audio layer 3 (MP3) players, portable medical equipment and digital cameras and their combinations.
  • PDAs personal digital assistants
  • PMP portable Multimedia players
  • MPEG-1 or MPEG-2 Moving Picture Experts Group
  • MP3 audio layer 3
  • the electronic device 1000 may perform various functions (eg, play music, display videos, store pictures, and receive and send phone calls). If desired, the electronic device 1000 may be a portable device such as a cellular phone, a media player, other handheld devices, a wrist watch device, a pendant device, an earpiece device, or other compact portable devices.
  • a portable device such as a cellular phone, a media player, other handheld devices, a wrist watch device, a pendant device, an earpiece device, or other compact portable devices.
  • the gyroscope 120 can be used to detect the linear motion of the electronic device 1000 in the axial direction, and can measure the motion of rotation and deflection. For example, the gyroscope 120 can detect the vertical or horizontal state of the electronic device 1000, and then the central processor of the electronic device 1000 can control the display screen to rotate according to the acquired detection data.
  • the gyroscopes 120 of the electronic device 1000 are all disposed at positions other than the camera assembly 100, thereby saving the space for installing an independent gyroscope and a driving chip in the camera assembly 100.
  • the size of the camera assembly 100 is similar to that of an ordinary camera assembly, and the optical image stabilization can be achieved by using the gyroscope 120 of the electronic device 1000, which effectively reduces the size of the camera assembly 100 while retaining the image stabilization function.
  • the body 110 further includes a top end surface 1002 and a bottom end surface 1003 disposed opposite to the top end surface 1002.
  • the top end surface 1002 and the bottom end surface 1003 can extend along the width direction of the body 110. That is, the top end surface 1002 and the bottom end surface 1003 are the short sides of the electronic device 1000.
  • the bottom end surface 1003 is used to arrange connectors, microphones, speakers, etc. of the electronic device 1000.
  • a receiving slot 1004 is formed on the top of the body 110, and the receiving slot 1004 is recessed from the top of the body 110 toward the inside of the body 110.
  • the receiving groove 1004 may penetrate the side of the body 110.
  • the sliding module 200 is slidingly connected to the body 110 in the receiving slot 1004. In other words, the sliding module 200 slides the connecting body 110 to extend or retract the receiving slot 1004.
  • the sliding module 200 includes a top surface 2003. When the sliding module 200 is in the first position, the top surface is substantially flush with the top surface 1002.
  • the sliding module 200 can be connected to a screw mechanism, and the screw mechanism can drive the sliding module 200 to slide between a first position and a second position.
  • the camera assembly 100 includes a first imaging module 20, a second imaging module 30, a third imaging module 40, and a bracket 50.
  • the first imaging module 20, the second imaging module 30, and the third imaging module 40 are all disposed in the bracket 50 and fixedly connected to the bracket 50.
  • the bracket 50 can reduce the impact of the first imaging module 20, the second imaging module 30 and the third imaging module 40, and improve the lifespan of the first imaging module 20, the second imaging module 30 and the third imaging module 40 .
  • the field of view FOV3 of the third imaging module 40 is greater than the field of view FOV1 of the first imaging module 20 and smaller than the field of view FOV2 of the second imaging module 30, that is, FOV1 ⁇ FOV3 ⁇ FOV2.
  • FOV1 ⁇ FOV3 ⁇ FOV2 the field of view FOV2 of the second imaging module 30.
  • the FOV1 of the first imaging module 20 is 10-30 degrees
  • the FOV2 of the second imaging module 30 is 110-130 degrees
  • the FOV3 of the third imaging module 40 is FOV3 80-110 degrees.
  • the field of view FOV1 of the first imaging module 20 is 10 degrees, 12 degrees, 15 degrees, 20 degrees, 26 degrees, or 30 degrees.
  • the field of view FOV2 of the second imaging module 30 is 110 degrees, 112 degrees, 118 degrees, 120 degrees, 125 degrees, or 130 degrees.
  • the field of view FOV3 of the third imaging module 40 is 80 degrees, 85 degrees, 90 degrees, 100 degrees, 105 degrees, or 110 degrees.
  • the field of view FOV1 of the first imaging module 20 is small, it can be understood that the focal length of the first imaging module 20 is large. Therefore, the first imaging module 20 can be used to shoot a distant view, thereby obtaining a clear image of the distant view .
  • the field of view FOV2 of the second imaging module 30 is relatively large. It can be understood that the focal length of the second imaging module 30 is relatively short. Therefore, the second imaging module 30 can be used to shoot a close-up view to obtain a partial close-up image of an object.
  • the third imaging module 40 can be used to photograph objects normally.
  • the first imaging module 20, the second imaging module 30, and the third imaging module 40 are arranged side by side.
  • the first imaging module 20, the second imaging module 30, and the third imaging module 40 are arranged in a line.
  • the second imaging module 30 is located between the first imaging module 20 and the third imaging module 40.
  • the first imaging module 20 and the third imaging module 40 may be equipped with an optical anti-shake device, and the optical anti-shake device is generally configured with more magnetic elements. Therefore, the first imaging module 20 and the third imaging module 40 may generate a magnetic field.
  • the second imaging module 30 is located between the first imaging module 20 and the third imaging module 40, so that the first imaging module 20 and the third imaging module 40 can be far away, preventing the first imaging
  • the magnetic field formed by the module 20 and the magnetic field formed by the third imaging module 40 interfere with each other and affect the normal use of the first imaging module 20 and the third imaging module 40.
  • the first imaging module 20, the second imaging module 30, and the third imaging module 40 may be arranged in an L-shape.
  • the first imaging module 20, the second imaging module 30, and the third imaging module 40 may be arranged at intervals, and two adjacent imaging modules may also abut each other.
  • any one of the imaging modules may be a black-and-white camera, an RGB camera, or an infrared camera.
  • the processing chip of the electronic device 1000 is used to control the operation of the first imaging module 20 according to the feedback data of the gyroscope 120 to realize optical anti-shake shooting.
  • the first imaging module 20 includes a housing 21, a reflective element 22, a mounting base 23, a first lens assembly 24, a moving element 25, a first image sensor 26, and a driving mechanism 27.
  • the reflective element 22, the mounting base 23, the first lens assembly 24, and the moving element 25 are all disposed in the housing 21.
  • the reflective element 22 is disposed on the mounting base 23, and the first lens assembly 24 is fixed on the moving element 25.
  • the moving element 25 is provided on the first image sensor 26 side. Further, the moving element 25 is located between the reflective element 22 and the first image sensor 26.
  • the driving mechanism 27 connects the moving element 25 and the housing 21. After the incident light enters the housing 21, it passes through the reflective element 22, and then passes through the first lens assembly 24 to reach the first image sensor 26, so that the first image sensor 26 obtains an external image. It can be understood that the driving mechanism 27 is used to drive the moving element 25 to move along the optical axis of the first lens assembly 24.
  • the housing 21 has a substantially square shape.
  • the housing 21 has a light inlet 211 from which incident light enters the first imaging module 20. That is to say, the reflective element 22 is used to redirect the incident light incident from the light entrance 211 and pass through the first lens assembly 24 to the first image sensor 26 so that the first image sensor 26 senses the first imaging module 20 incident light outside.
  • the housing 21 may be made of a metal material, for example, an iron shell, so as to provide effective support for the first imaging module 20 and ensure the effective strength of the module.
  • the first imaging module 20 is a periscope lens module.
  • the height of the periscope lens module is smaller, so that the overall thickness of the electronic device 1000 can be reduced.
  • the vertical lens module refers to that the optical axis of the lens module is a straight line, or that incident light is transmitted to the photosensitive device of the lens module along the direction of the linear optical axis.
  • the light inlet 211 is exposed through the through hole 11 so that external light passes through the through hole 11 and enters the first imaging module 20 from the light inlet 211.
  • the housing 21 includes a top wall 213 and a side wall 214.
  • the side wall 214 extends from the side 2131 of the top wall 213.
  • the top wall 213 includes two opposite sides 2131, the number of the side walls 214 is two, and each side wall 214 extends from a corresponding side 2131, or the side walls 214 are respectively connected to the top wall 213 On both sides.
  • the light inlet 211 is formed on the top wall 213.
  • the reflective element 22 is a prism or a plane mirror.
  • the prism may be a triangular prism, and the cross-section of the prism is a right triangle, where light is incident from one of the right sides of the right triangle, after being reflected by the hypotenuse, the other right angle Side shot. It can be understood that, of course, the incident light can be refracted by the prism and exit without reflection.
  • the prism can be made of glass, plastic and other materials with better light transmission.
  • a reflective material such as silver may be coated on one surface of the prism to reflect incident light.
  • the reflective element 22 is a plane mirror
  • the plane mirror reflects the incident light so as to achieve the turning of the incident light.
  • the reflective element 22 has a light incident surface 222, a backlight surface 224, a reflective surface 226 and a light exit surface 228.
  • the light incident surface 222 approaches and faces the light entrance 211.
  • the backlight surface 224 is away from the light entrance 211 and opposite to the light entrance surface 222.
  • the reflective surface 226 is connected to the light incident surface 222 and the backlight surface 224.
  • the light exit surface 228 is connected to the light entrance surface 222 and the backlight surface 224.
  • the reflective surface 226 is inclined relative to the light incident surface 222.
  • the light emitting surface 228 is opposite to the light reflecting surface 226.
  • the light passes through the light inlet 211 and enters the light reflecting element 22 from the light incident surface 222, then reflects through the light reflecting surface 226, and finally reflects the light reflecting element 22 from the light emitting surface 228 to complete the light conversion
  • the backlight surface 224 and the mounting base 23 are fixedly arranged, so that the reflective element 22 remains stable.
  • the reflective surface 226a of the reflective element 22a is inclined with respect to the horizontal direction, and the reflective element 22a is an asymmetric structure in the light reflection direction, so the reflective element 22a
  • the actual optical area below is smaller than that above the reflective element 22a, and it can be understood that the part of the reflective surface 226a away from the light entrance is less or cannot reflect light.
  • the reflective element 22 cuts off the corner away from the light entrance relative to the reflective element 22 a in the related art, which not only does not affect the reflected light effect of the reflective element 22, but also reduces the reflective The overall thickness of the element 22.
  • the angle ⁇ of the reflective surface 226 relative to the light incident surface 222 is inclined at 45 degrees.
  • the incident light is better reflected and converted, and has a better light conversion effect.
  • the reflective element 22 may be made of glass, plastic, or other materials with relatively good light transmittance.
  • a reflective material such as silver may be coated on one surface of the reflective element 22 to reflect incident light.
  • the light incident surface 222 is disposed parallel to the backlight surface 224.
  • the reflective element 22 can be kept stable, and the light incident surface 222 also appears as a flat surface.
  • the conversion process of the incident light in the reflective element 22 also forms a regular optical path, which Conversion efficiency is better.
  • the cross section of the reflective element 22 is substantially trapezoidal, or the reflective element 22 is substantially trapezoidal.
  • both the light incident surface 222 and the backlight surface 224 are perpendicular to the light exit surface 228.
  • a relatively regular reflective element 22 can be formed, so that the optical path of the incident light is relatively straight, and the conversion efficiency of the light is improved.
  • the distance between the light incident surface 222 and the backlight surface 224 ranges from 4.8 to 5.0 mm.
  • the distance between the light incident surface 222 and the backlight surface 224 may be 4.85 mm, 4.9 mm, 4.95 mm, or the like.
  • the distance between the light incident surface 222 and the backlight surface 224 can be understood as that the height of the reflective element 22 is 4.8-5.0 mm.
  • the reflective element 22 formed by the light incident surface 222 and the backlight surface 224 in the above distance range has a moderate volume, and can be better integrated into the first imaging module 20 to form a more compact and compact first imaging module 20.
  • the camera assembly 100 and the electronic device 1000 meet more consumer demands.
  • the light incident surface 222, the backlight surface 224, the reflective surface 226, and the light exit surface 228 are all hardened to form a hardened layer.
  • the material of the reflective element 22 is relatively brittle.
  • the light incident surface 222, the backlight surface 224, the reflective surface 226 and the light emitting surface of the reflective element 22 228 hardening treatment can be hardened on all surfaces of the reflective element to further improve the strength of the reflective element.
  • Hardening treatments such as infiltration of lithium ions, filming the above surfaces without affecting the conversion of light by the reflective element 22, etc.
  • the reflective element 22 turns the incident light incident from the light inlet 211 at an angle of 90 degrees.
  • the incident angle of incident light on the emission surface of the reflective element 22 is 45 degrees, and the reflection angle is also 45 degrees.
  • the angle at which the reflective element 22 turns the incident light may be other angles, such as 80 degrees, 100 degrees, etc., as long as the incident light can be turned to reach the first image sensor 26.
  • the number of reflective elements 22 is one. At this time, the incident light is transmitted to the first image sensor 26 after being turned once. In other embodiments, the number of the light-reflecting elements 22 is multiple. At this time, the incident light is transmitted to the first image sensor 26 after being turned at least twice.
  • the mounting base 23 is used to mount the reflective element 22, or the mounting base 23 is a carrier of the reflective element 22, and the reflective element 22 is fixed on the mounting base 23. This allows the position of the reflective element 22 to be determined, which is advantageous for the reflective element 22 to reflect or refract incident light.
  • the reflective element 22 may be fixed on the mounting base 23 by viscose to achieve a fixed connection with the mounting base 23.
  • the mounting base 23 can be movably disposed in the housing 21, and the mounting base 23 can rotate relative to the housing 21 to adjust the direction in which the reflective element 22 turns the incident light.
  • the mounting base 23 can drive the reflective element 22 to rotate toward the opposite direction of the shaking of the first imaging module 20, thereby compensating the incident deviation of the incident light of the light inlet 211, and achieving the effect of optical anti-shake.
  • the first lens assembly 24 is accommodated in the moving element 25. Further, the first lens assembly 24 is disposed between the reflective element 22 and the first image sensor 26. The first lens assembly 24 is used to image incident light on the first image sensor 26. This allows the first image sensor 26 to obtain an image with better quality.
  • the first lens assembly 24 When the first lens assembly 24 moves integrally along its optical axis, it can image on the first image sensor 26, so that the first imaging module 20 can focus.
  • the first lens assembly 24 includes a plurality of lenses 241. When at least one lens 241 moves, the overall focal length of the first lens assembly 24 changes, thereby achieving the zooming function of the first imaging module 20. More, driven by the driving mechanism 27 The moving element 25 moves in the housing 21 to achieve zooming.
  • the moving element 25 is cylindrical, and the plurality of lenses 241 in the first lens assembly 24 are fixed in the moving element 25 along the axial interval of the moving element 25.
  • the moving element 25 includes two clips 252 that sandwich the lens 241 between the two clips 252.
  • the moving element 25 is used to fix a plurality of lenses 241, the length of the required moving element 25 is large, and the moving element 25 can be cylindrical, square, etc., having a shape of a certain cavity, so moving The element 25 is arranged in a tube, so that a plurality of lenses 241 can be better arranged, and the lens 241 can be better protected in the cavity, so that the lens 241 is less likely to shake.
  • the moving element 25 sandwiches the plurality of lenses 241 between the two clips 252, which not only has a certain stability, but also reduces the weight of the moving element 25, and can reduce the driving mechanism 27.
  • the power required by the moving element 25, and the design difficulty of the moving element 25 is also relatively low, and the lens 241 is also easier to set on the moving element 25.
  • the moving element 25 is not limited to the cylindrical shape and the two clips 252 mentioned above.
  • the moving element 25 may include three or four clips 252 to form a more stable structure. , Or a simpler structure such as a clip 252; or a rectangular body, a circular body, etc. having a cavity to accommodate various regular or irregular shapes of the lens 241.
  • specific selection is sufficient.
  • the first image sensor 26 may use a complementary metal oxide semiconductor (CMOS, Complementary Metal Oxide Semiconductor) photosensitive element or a charge-coupled element (CCD, Charge-coupled Device) photosensitive element.
  • CMOS complementary metal oxide semiconductor
  • CCD Charge-coupled Device
  • the driving mechanism 27 is an electromagnetic driving mechanism, a piezoelectric driving mechanism, or a memory alloy driving mechanism.
  • the electromagnetic drive mechanism includes a magnetic field and a conductor. If the magnetic field moves relative to the conductor, an induced current is generated in the conductor. The induced current causes the conductor to be subjected to an ampere force, which causes the conductor to move.
  • the part of the drive mechanism that drives the moving element 25; the piezoelectric drive mechanism is based on the inverse piezoelectric effect of the piezoelectric ceramic material: if a voltage is applied to the piezoelectric material, mechanical stress is generated, that is, electrical energy and mechanical energy are converted, through Controlling its mechanical deformation to produce rotation or linear motion has the advantages of simple structure and low speed.
  • the drive of the memory alloy drive mechanism is based on the characteristics of the shape memory alloy: the shape memory alloy is a special alloy. Once it remembers any shape, even if it deforms, it can be restored to a certain temperature when heated The shape before deformation, in order to achieve the purpose of driving, has the characteristics of rapid displacement and free direction.
  • the first imaging module 20 further includes a module circuit board 29.
  • the module circuit board is used to connect with the main board of the electronic device 1000 through the connector to supply power to the first imaging module 20.
  • the module circuit board 29 is fixed on the housing 21, which can save the space position of the first imaging module 20 in the width direction. And because the overall thickness of the circuit board is relatively thin, the first imaging module 20 has a more compact structure by being fixed on the housing 21.
  • the module circuit board 29 includes a reinforcement board 291 that communicates with the ground pin of the module circuit board 29.
  • the reinforcing plate 291 may be made of a metal material to support the module circuit board 29, and the reinforcing plate 291 may be fixedly connected to the module circuit board 29 by welding, bonding, or the like. Further, the reinforcing plate 291 and the housing 21 are pasted through conductive adhesive, so that the module circuit board 29 and the housing 21 are fixedly connected. In this way, the reinforcing plate 291 functions as a bridge.
  • One of the two opposite sides of the reinforcing plate 291 communicates with the ground pin of the module circuit 29, and the other side is fixed to the housing 21, so that the housing 21 is grounded. And because the thickness of the reinforcing plate is thin, the volume of the first imaging module 20 is not significantly increased while grounding the housing 21.
  • the first imaging module 20 further includes a driving device 28.
  • the driving device 28 is used to drive the mounting base 23 with the reflective element 22 to rotate around the rotation axis 29.
  • the driving device 28 is used to drive the mounting base 23 to move in the axial direction of the rotation axis 29.
  • the rotation axis 29 is perpendicular to the optical axis of the light inlet 211 and the photosensitive direction of the first image sensor 26, so that the first imaging module 20 realizes optical image stabilization in the optical axis of the light inlet 211 and the axis of the rotation axis 29 .
  • the driving device 28 drives the mounting base 23 to move in two directions, which not only can realize the optical image stabilization effect of the first imaging module 20 in two directions, but The volume of the first imaging module 20 is smaller.
  • the width direction of the first imaging module 20 is defined as the X direction
  • the height direction is defined as the Y direction
  • the length direction is defined as the Z direction.
  • the optical axis of the light inlet 211 is in the Y direction
  • the light receiving direction of the first image sensor 26 is in the Z direction
  • the axial direction of the rotation axis 29 is in the X direction.
  • the driving device 28 drives the mounting base 23 to rotate, so that the reflective element 22 rotates around the X direction, so that the first imaging module 20 realizes the Y-direction optical image stabilization effect.
  • the driving device 28 drives the mounting base 23 to move in the axial direction of the rotation axis 29, so that the first imaging module 20 realizes the X-direction optical image stabilization effect.
  • the first lens assembly 24 may be along the Z direction to enable the first lens assembly 24 to focus on the first image sensor 26.
  • the reflective element 22 rotates in the X direction
  • the light reflected by the reflective element 22 moves in the Y direction
  • the first image sensor 26 forms a different image in the Y direction to achieve the anti-shake effect in the Y direction.
  • the reflective element 22 moves in the X direction
  • the light reflected by the reflective element 22 moves in the X direction, so that the first image sensor 26 forms a different image in the X direction to achieve the anti-shake effect in the X direction.
  • the driving device 28 is formed with an arc-shaped guide rail 281, and the drive device 28 is used to drive the mounting base 23 to rotate along the arc-shaped guide rail 281 about the central axis 282 of the arc-shaped guide rail 281 and the axis along the central axis 282 Moving toward, the central axis 2282 coincides with the rotation axis 29.
  • the driving device 28 is used to drive the mounting base 23 to rotate along the arc guide rail 281 about the central axis 282 of the arc guide rail 281 and move axially along the central axis 282.
  • the driving device 28 uses the curved guide rail 281 to drive the mounting base 23 with the reflective element 22 to rotate together, the friction between the driving device 28 and the mounting base 23 is small, which is conducive to the smooth rotation of the mounting base 23 , The optical image stabilization effect of the first imaging module 20 is improved.
  • the mounting base (not shown) is rotatably connected to the rotating shaft 23 a, and the mounting base rotates around the rotating shaft 23 a to drive the reflective element 22 a to rotate together.
  • the friction force is f1
  • the radius of the rotating shaft 23a is R1
  • the thrust force is F1
  • the radius of rotation is A.
  • the reflective element 22a Since the reflective element 22a only needs to rotate slightly when performing anti-shake, if F1 is too large, the rotation amplitude of the reflective element 22a is too large, and the anti-shake function will not be realized, so F1 cannot be too large; The size of the reflective element 22a cannot be too large, so the space for the enlargement of A is also limited, so that the influence of friction cannot be further eliminated.
  • the mounting base 23 rotates along an arc-shaped guide 281.
  • the arc-shaped guide 281 may be formed by a plurality of rolling bodies 2811.
  • the radius of the rolling body 2811 is R2, and the turning radius of the reflective element 22 For B.
  • f1 is not significantly changed compared to f2
  • R1 is compared to R2
  • F1 is compared to F2
  • B can not be limited by the size of the reflective element 22, and can even be several times more than A. Therefore, in this case, the influence of friction on the rotation of the reflective element 22 can be greatly reduced (the size of K2 is reduced), thereby improving the rotational accuracy of the reflective element 22, making the optical image stabilization effect of the first imaging module 20 more good.
  • the mounting base 23 includes an arc-shaped surface 231.
  • the arc-shaped surface 231 is concentrically arranged with the arc-shaped guide rail 281 and cooperates with the arc-shaped guide rail 281.
  • the center of the curved surface 231 coincides with the center of the curved guide 281. This makes the mounting base 23 and the driving device 28 more compact.
  • the central axis 282 is located outside the first imaging module 20. In this way, the radius R2 of the arc-shaped guide rail 281 is large, which can reduce the adverse effect of friction on the rotation of the mounting base 23.
  • the drive device 28 is located at the bottom of the housing 21. In other words, the driving device 28 and the housing 21 have an integral structure. In this way, the structure of the first imaging module 20 is more compact.
  • the driving device 28 electromagnetically drives the mounting base 23 to rotate.
  • the driving device 28 is provided with a coil, and an electromagnetic sheet is fixed on the mounting base 23. After the coil is energized, the coil can generate a magnetic field to drive the movement of the electromagnetic sheet, thereby driving the mounting base 23 and the reflective element to rotate together.
  • the driving device 28 may drive the mounting base 23 in a piezoelectric driving manner or a memory alloy driving manner.
  • a piezoelectric driving method and the memory alloy driving method please refer to the above description, which will not be repeated here.
  • the first imaging module 20 further includes a chip circuit board 201 and a driving chip 202.
  • the chip circuit board 201 is fixed on the side of the driving mechanism 27, and the driving chip 202 is fixed on the chip circuit board 201 and the driving mechanism.
  • the driving chip 202 is electrically connected to the first image sensor 26 through the chip circuit board 201.
  • the driving chip 202 is fixed to the side of the driving mechanism 27 through the chip circuit board 201, and is electrically connected to the first image sensor 26 through the chip circuit board 201, which makes the structure between the driving chip 202 and the driving mechanism 27 more compact. It is beneficial to reduce the volume of the first imaging module 20.
  • the driving chip 202 is used to control the driving mechanism 27 to drive the moving element 25 to move along the optical axis of the first lens assembly 24, so that the first lens assembly 24 is focused and imaged on the first image sensor 26.
  • the driving chip 202 is used to control the driving device 28 according to the feedback data of the gyroscope 120 to drive the mounting base 23 with the reflective element 22 to rotate around the rotation axis 29.
  • the driving chip 202 is also used to control the driving device 28 to drive the mounting base 23 to move along the axis of the rotation axis 29 according to the feedback data of the gyroscope 120.
  • the driving chip 202 is also used to control the driving device 28 according to the feedback data of the gyroscope 120 to drive the mounting base 23 to rotate along the arc guide rail 281 about the central axis 282 of the arc guide rail 281 and move axially along the central axis 282.
  • the first imaging module 20 includes a sensor circuit board 203
  • the first image sensor 26 is fixed to the sensor circuit board 203
  • the chip circuit board 201 includes a mounting portion 2011 and a connecting portion 2022
  • the mounting portion 2011 is fixed to the drive
  • the drive chip 202 is fixed to the mounting portion 2011, and the connecting portion 2022 connects the mounting portion 2011 and the sensor circuit board 203.
  • the driving chip 202 can be electrically connected to the first image sensor 26 through the sensor circuit board 203.
  • the connecting portion 2022 may be fixedly connected to the sensor circuit board 203 by soldering.
  • the driving chip 202 when assembling the first imaging module 20, the driving chip 202 may be fixed on the chip circuit board 201 first, and then the chip circuit board 201 with the driving chip 202 and the sensor circuit board 203 may be soldered Finally, the chip circuit board 201 with the driving chip 202 is fixed on the side of the driving mechanism 27.
  • the chip circuit board 201 may be fixedly connected to the driving mechanism 27 by soldering, bonding, or the like.
  • fixing the chip circuit board 201 on the side of the driving mechanism 27 may mean that the chip circuit board 201 is in contact with and fixed to the side of the driving mechanism 27, or may mean that the chip circuit board 201 is fixedly connected to the side of the driving mechanism 27 through other components.
  • the mounting portion 2011 is a rigid circuit board
  • the connecting portion 2022 is a flexible circuit board
  • the mounting portion 2011 is attached to the side surface of the drive mechanism 27.
  • the mounting portion 2011 is a rigid circuit board so that the mounting portion 2011 has good rigidity and is not easily deformed, which is beneficial to the fixed connection between the mounting portion 2011 and the side surface of the driving mechanism 27.
  • the mounting portion 2011 can be attached to the side surface of the drive mechanism 27 by adhesion.
  • the connection portion 2022 is a flexible circuit board so that the chip circuit board 201 is easily deformed, so that the chip circuit board 201 is easily mounted on the side of the driving mechanism 27.
  • the mounting portion 2011 may also be a flexible circuit board.
  • the module circuit board 29 further includes a connecting portion 292 and a positioning portion 293.
  • the connecting portion 292 connects the sensor circuit board 203 and the positioning portion 293.
  • the connecting portion 292 may be a flexible circuit board, and the positioning portion 293 is a rigid circuit board
  • the reinforcing plate 291 is attached to the side of the positioning portion 293 facing the housing 21.
  • the module circuit board 29 needs to communicate with other circuit boards and connect with the main board of the electronic device 1000 to transmit electrical signals.
  • the connecting portion 292 may use a flexible circuit board.
  • the positioning portion 293 may use a rigid circuit board.
  • the reinforcing plate 291 can be attached to the positioning portion 293 and face the housing 21 so that the module circuit board 29 can be fixedly connected to the housing 21 through the rigid reinforcing plate 291.
  • the side of the driving mechanism 27 includes a first limit structure 271
  • the reinforcing plate 291 includes a second limit structure 2911
  • the housing 21 is formed with an escape hole 215
  • the first limit structure 271 is located in the escape hole 215 And cooperate with the second limiting structure 2911 to fix the module circuit board 29 on the housing 21.
  • the first limiting structure 271 may be a limiting column, and the first limiting structure 271 may be integrally formed with the side of the driving structure 27, or may be formed separately and fixed on the side of the driving structure.
  • the second limiting structure 2911 can be a limiting hole or a limiting groove, so that the first limiting structure 271 can cooperate with the second limiting structure 2911 to limit the module circuit board 29,
  • the reinforcing plate 291 and the housing 21 are bonded and reinforced by conductive adhesive.
  • the length of the first limiting structure 271 protruding from the avoidance hole 215 should be the same as the depth of the second limiting structure 2911 and the The total thickness is equivalent.
  • the chip circuit board 201 includes a third limiting structure 2012 that cooperates with the first limiting structure 271 to fix the chip circuit board 201 on the side of the driving mechanism 27.
  • the first limiting structure 271 may be a limiting column
  • the third limiting structure 2011 may be a limiting hole.
  • the chip circuit board 201 may cooperate with the first limiting structure 271 through the third limiting structure 2011 It is limited to the side of the driving mechanism 271, and further strengthened and fixed by means such as lamination.
  • the driving chip 202 is located in the escape hole 215 so as to be exposed to the housing 21. In this way, the driving chip 202 penetrates the casing 21 so that there is an overlap between the driving chip 202 and the casing 21, which makes the structure between the driving chip 202 and the casing 21 more compact, which can further reduce the volume of the first imaging module 20 .
  • the driving chip 202 is partially located in the escape hole 215 in the width direction.
  • the shape and size of the escape hole 215 are matched with the shape and size of the driving chip 202, respectively.
  • the size of the avoiding hole 215 is slightly larger than the size of the driving chip 202, and the shape of the avoiding hole 215 is the same as the shape of the driving chip 202.
  • the escape hole 215 is formed on the side wall 214 of the housing 21. It can be understood that the escape hole 215 penetrates the inside and outside of the side wall 214. Of course, in other embodiments, the escape hole 215 may be formed on the top wall 213 of the housing 21.
  • the first imaging module 20 further includes a shielding cover 204 that is fixed to the chip circuit board 201 and covers the driving chip 202.
  • the shielding cover 204 can protect the driving chip 202 and prevent the driving chip 202 from being physically impacted.
  • the shielding cover 204 can also reduce the electromagnetic influence on the driving chip 202.
  • the shield 204 can be made of metal material.
  • the material of the shield 204 is stainless steel.
  • the chip circuit board 201 is fixed to the mounting portion 2011.
  • the mounting portion 2011 is preferably a rigid circuit board or a plate material combining a flexible circuit board and a reinforcement board.
  • the second imaging module 30 is a vertical lens module.
  • the second imaging module 30 may also be a periscope lens module.
  • the second imaging module 30 may be a fixed-focus lens module. Therefore, there are fewer lenses 241 of the second lens assembly 31, so that the height of the second imaging module 30 is lower, which is beneficial to reducing electronic devices 1000 thickness.
  • the type of the second image sensor 32 may be the same as the type of the first image sensor 26, which will not be repeated here.
  • the structure of the third imaging module 40 is similar to the structure of the second imaging module 30.
  • the third imaging module 40 is also a vertical lens module. Therefore, for the characteristics of the third imaging module 40, please refer to the characteristics of the second imaging module 40, which is not repeated here.
  • the first imaging module 20 includes a housing 21, a reflective element 22, a first lens assembly 24, a moving element 25, a first image sensor 26, and a driving mechanism 27.
  • the reflective element 22, the first lens assembly 24, the moving element 25, the first image sensor 26, and the driving mechanism 27 are all disposed in the housing 21.
  • the moving element 25 is located between the reflective element 22 and the first image sensor 26.
  • the first lens assembly 24 is fixed on the moving element 25.
  • the housing 21 has a light inlet 211.
  • the reflective element 22 is used to divert the incident light incident from the light entrance 211 and pass through the first lens assembly 24 to the first image sensor 26 so that the first image sensor 26 senses the incidence outside the first imaging module 20 Light.
  • the first imaging module 20 also includes a module circuit board 29.
  • the module circuit board is used to connect with the main board of the electronic device 1000 through the connector to supply power to the first imaging module 20.
  • the module circuit board 29 is fixed on the housing 21, which can save the space position of the first imaging module 20 in the width direction. And because the overall thickness of the circuit board is relatively thin, the first imaging module 20 has a more compact structure by being fixed on the housing 21.
  • the module circuit board 29 includes a reinforcement board 291 that communicates with the ground pin of the module circuit board 29.
  • the reinforcing plate 29 may be made of a metal material to support the module circuit board 29, and the reinforcing plate 291 may be fixedly connected to the module circuit board 29 by welding, bonding, or the like. Further, the reinforcing plate 291 and the housing 21 are pasted through conductive adhesive, so that the module circuit board 29 and the housing 21 are fixedly connected. In this way, the reinforcing plate 291 functions as a bridge.
  • One of the two opposite sides of the reinforcing plate 291 communicates with the ground pin of the module circuit 29, and the other side is fixed to the housing 21, so that the housing 21 is grounded. And because the thickness of the reinforcing plate is thin, the volume of the first imaging module 20 is not significantly increased while grounding the housing 21.

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Abstract

一种成像模组(20)、摄像头组件(100)及电子装置(1000)。成像模组(20)包括外壳(21)和均设置在外壳(21)内的反光元件(22)、图像传感器(26)、镜片组件(24)、运动元件(25)和驱动机构(27)。成像模组(20)还包括模组电路板(29)，模组电路板(29)固定在外壳(21)上，模组电路板(29)包括补强板(291)，补强板(291)与模组电路板(29)的接地引脚连通以使外壳(21)接地。

Description

成像模组、摄像头组件及电子装置
优先权信息
本申请请求2018年11月06日向中国国家知识产权局提交的、专利申请号为201811311116.1的专利申请的优先权和权益，并且通过参照将其全文并入此处。
技术领域
本申请涉及电子装置领域，尤其涉及一种成像模组、摄像头组件及电子装置。
背景技术
为了提高手机的拍照效果，手机的摄像头采用潜望式镜头，潜望式摄像头例如可以进行三倍光学焦距以获取品质更加的图像。考虑到静电防护和手机整机内部与天线之间的干扰问题，摄像头马达的铁壳需要做接地处理，相关技术中，通过采用导电布、铜箔等方式对铁壳进行接地，而对于潜望式模组来说，有整体模组尺寸较大，整机堆叠尺寸较为拥挤，通常没有足够的空间通过增加导电布的方式对铁壳进行接地处理。
发明内容
本申请提供一种成像模组、摄像头组件及电子装置。
本申请实施方式的成像模组，包括：
外壳；和
均设置在所述外壳内的反光元件、图像传感器、镜片组件、运动元件和驱动机构；
所述外壳具有进光口，所述反光元件用于将从所述进光口入射的入射光转向并经过所述镜片组件后传至所述图像传感器以使所述图像传感器感测所述成像模组外部的所述入射光；
所述驱动机构用于驱动位于所述反光元件及所述图像传感器之间的所述运动元件沿所述镜片组件的光轴移动以使固定在所述运动元件上的所述镜片组件在所述图像传感器上对焦成像；
所述成像模组还包括模组电路板，所述模组电路板固定在所述外壳上，所述模组电路板包括补强板，所述补强板与所述模组电路板的接地引脚连通以使所述外壳接地。
本申请实施方式的摄像头组件包括第一成像模组、第二成像模组和第三成像模组，所述第一成像模组为以上所述的成像模组，所述第三成像模组的视场角大于所述第一成像模组的视场角且小于所述第二成像模组的视场角。
本申请实施方式的电子装置包括本体和滑动模块，所述滑动模块用于在收容于所述本体内的第一位置和自所述本体露出的第二位置之间滑动，所述滑动模块内设置有以上所述的摄像头组件。
本申请实施方式的成像模组、摄像头组件及电子装置中，模组电路板固定在外壳上，在成像模组体积受限，没有空间增加导电布进行接地处理时，利用设置在模组电路板的补强板作为桥梁，连通模组电路板的接地引脚与外壳，实现外壳的接地处理。
本申请的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本申请的实践了解到。
附图说明
本申请的上述和/或附加的方面和优点从结合下面附图对实施方式的描述中将变得明显和容易理解，其中：
图1是本申请实施方式的电子装置的状态示意图；
图2是本申请实施方式的电子装置的另一个状态示意图；
图3是本申请实施方式的摄像头组件的立体示意图；
图4是本申请实施方式的第一成像模组的立体示意图；
图5是本申请实施方式的第一成像模组的分解示意图；
图6是本申请实施方式的模组电路板的立体示意图；
图7是本申请实施方式的第一成像模组部分的立体示意图；
图8是本申请实施方式的第一成像模组的剖面示意图；
图9是本申请实施方式的第一成像模组的部分剖面示意图；
图10是本申请另一实施方式的第一成像模组的剖面示意图；
图11是本申请实施方式的反光元件的立体示意图。
图12是相关技术中的成像模组的光线反射成像示意图；
图13是本申请实施方式的第一成像模组的光线反射成像示意图；
图14是相关技术中的成像模组的结构示意图；
图15是本申请实施方式的第一成像模组的结构示意图；
图16是本申请实施方式的第二成像模组的剖面示意图。
主要元件符号说明：
电子装置1000、本体110、滑动模块200、陀螺仪120；
摄像头组件100、第一成像模组20、外壳21、进光口211、凹槽212、顶壁213、侧壁214、避让孔215、反光元件22、入光面222、背光面224、入光面226、出光面228、安装座23、弧形面231、第一镜片组件24、镜片241、运动元件25、夹片222、第一图像传感器26、驱动机构27、第一限位结构271、驱动装置28、弧形导轨281、中心轴线282、模组电路板29、补强板291、第二限位结构2911、连接部292、定位部293、芯片电路板201、安装部2011、第三限位结构2012、连接部2022、驱动芯片202、传感器电路板203、屏蔽罩204、第二成像模组30、第二镜片组件31、第二图像传感器32、第三成像模组40、支架50。
具体实施方式
下面详细描述本申请的实施方式，所述实施方式的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的，仅用于解释本申请，而不能理解为对本申请的限制。
下文的公开提供了许多不同的实施方式或例子用来实现本申请的不同结构。为了简化本申请的公开，下文中对特定例子的部件和设置进行描述。当然，它们仅仅为示例，并且目的不在于限制本申请。此外，本申请可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。此外，本申请提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
潜望式摄像头内的反光元件在潜望式摄像头跌落等情况下，反光元件容易受到发生位置偏移，反光元件无法准确地将光线转向至图像传感器，造成图像传感器无法准确地感测潜望式摄像头外的物体图像，无法正常使用。
现有的光学防抖方法，通常要在成像模组内设置单独的摄像头陀螺仪，用于检测摄像头的抖动，同时，成像模组内包括设置驱动芯片的PCB电路板，如此，导致具有光学防抖的成像模组的尺寸大于普通的成像模组，并且无法缩小。
请参阅图1及图2，本申请实施方式的电子装置1000包括本体110和滑动模块200。滑动模块200用于在收容于本体110内的第一位置和自本体110露出的第二位置之间滑动，滑动模块200内设置有摄像头组件100和陀螺仪120，摄像头组件100和陀螺仪120分离设置。电子装置1000可用于根据陀螺仪120的反馈数据控制摄像头组件100工作以实现光学防抖拍摄。
上述电子装置中，摄像头组件100与陀螺仪120分离设置，减少了摄像头组件100内的器件，从而可以减小摄像头组件100的体积。另外，摄像头组件100和陀螺仪120均设置在滑动模块200内，使得陀螺仪120比较靠近摄像头组件100，陀螺仪120可以准确地检测摄像头组件100的抖动情况，提高了摄像头组件100的防抖效果。
示例性的，电子装置1000可以为移动或便携式并执行无线通信的各种类型的计算机系统设备中的任何一种(图1中只示例性的示出了一种形态)。具体的，电子装置1000可以为移动电话或智能电话(例如，基于iPhone TM，基于Android TM的电话)，便携式游戏设备(例如Nintendo DS TM，PlayStation Portable TM，Gameboy Advance TM，iPhone TM)、膝上型电脑、PDA、便携式互联网设备、音乐播 放器以及数据存储设备，其他手持设备以及诸如手表、入耳式耳机、吊坠、头戴式耳机等，电子装置100还可以为其他的可穿戴设备(例如，诸如电子眼镜、电子衣服、电子手镯、电子项链、电子纹身、电子设备或智能手表的头戴式设备(HMD))。
电子装置1000还可以是多个电子设备中的任何一个，多个电子设备包括但不限于蜂窝电话、智能电话、其他无线通信设备、个人数字助理、音频播放器、其他媒体播放器、音乐记录器、录像机、照相机、其他媒体记录器、收音机、医疗设备、车辆运输仪器、计算器、可编程遥控器、寻呼机、膝上型计算机、台式计算机、打印机、上网本电脑、个人数字助理(PDA)、便携式多媒体播放器(PMP)、运动图像专家组(MPEG-1或MPEG-2)音频层3(MP3)播放器，便携式医疗设备以及数码相机及其组合。
在一些情况下，电子装置1000可以执行多种功能(例如，播放音乐，显示视频，存储图片以及接收和发送电话呼叫)。如果需要，电子装置1000可以是诸如蜂窝电话、媒体播放器、其他手持设备、腕表设备、吊坠设备、听筒设备或其他紧凑型便携式设备的便携式设备。
陀螺仪120作为一种典型的传感器，可用于检测电子装置1000轴向的线性动作，能对转动和偏转的动作做出测量。例如，陀螺仪120可以检测电子装置1000的竖置或横放的状态，进而可以由电子装置1000的中央处理器根据获取的检测数据控制显示画面转动。
在本实施方式中，在成像时，利用电子装置1000的陀螺仪120来检测摄像头组件100产生的微小抖动，陀螺仪120将检测到的抖动数据，例如由于摄像头组件100抖动导致的倾斜角度，由倾斜产生的偏移，发送至电子装置1000的处理芯片，处理芯片例如为下文所述的驱动芯片。处理芯片根据接收到的陀螺仪120的反馈数据控制成像模组内的组件相对于摄像头组件100产生的组件进行相对移动从而实现防抖。
可以理解，电子装置1000的陀螺仪120均设置在摄像头组件100以外的其他位置，从而节省了摄像头组件100内设置独立陀螺仪与驱动芯片的空间。如此，摄像头组件100的尺寸与普通摄像头组件相近，并可利用电子装置1000的陀螺仪120实现光学防抖，在保留防抖功能的同时有效减小了摄像头组件100的尺寸。
具体地，请参阅图1及图2，本体110还包括顶端面1002和与顶端面1002相背设置的底端面1003。一般的，顶端面1002和底端面1003可沿本体110的宽度方向延伸。也即顶端面1002和底端面1003为电子装置1000的短边。底端面1003用于排布电子装置1000的连接器、麦克风、扬声器等。
本体110的顶部上开设有容纳槽1004，容纳槽1004自本体110的顶部向本体110内部凹陷。容纳槽1004可以贯穿本体110的侧面。滑动模块200于容纳槽1004中与本体110滑动连接。换言之，滑动模块200滑动连接本体110，以伸出或缩回容纳槽1004。
滑动模块200包括顶面2003，滑动模块200位于第一位置时，顶面与顶端面1002大致平齐。滑动模块200可以与丝杆机构连接，丝杆机构可以驱动滑动模块200在第一位置及第二位置之间滑动。
可以理解，滑动模块200伸出容纳槽1004时，摄像头组件100露出在本体110外，此时，摄像头组件100可以正常拍摄。
请结合图3，摄像头组件100包括第一成像模组20、第二成像模组30、第三成像模组40和支架50。
第一成像模组20、第二成像模组30和第三成像模组40均设置在支架50内并与支架50固定连接。支架50可以减少第一成像模组20、第二成像模组30和第三成像模组40受到的冲击，提高第一成像模组20、第二成像模组30和第三成像模组40寿命。
本实施方式中，第三成像模组40的视场角FOV3大于第一成像模组20的视场角FOV1且小于第二成像模组30的视场角FOV2，也即是说，FOV1＜FOV3＜FOV2。如此，不同视场角的三个成像模组使得摄像头组件100可以满足不同场景下的拍摄需求。
在一个例子中，第一成像模组20的视场角FOV1为10-30度，第二成像模组30的视场角FOV2为110-130度，第三成像模组40的视场角FOV3为80-110度。
例如，第一成像模组20视场角FOV1为10度、12度、15度、20度、26度或30度等角度。第二成像模组30视场角FOV2为110度、112度、118度、120度、125度或130度等角度。第三成像模组40视场角FOV3为80度、85度、90度、100度、105度或110度等角度。
由于第一成像模组20的视场角FOV1较小，可以理解，第一成像模组20的焦距较大，因此，第一成像模组20可以用于拍摄拍摄远景，从而获得远景清晰的图像。第二成像模组30的视场角FOV2较大， 可以理解，第二成像模组30的焦距较短，因此，第二成像模组30可以用于拍摄近景，从而获得物体的局部特写图像。第三成像模组40可以用于正常拍摄物体。
如此，通过第一成像模组20、第二成像模组30和第三成像模组40的结合，可以获得背景虚化、图片局部锐化等图像效果。
第一成像模组20、第二成像模组30和第三成像模组40并列排布。本实施方式中，第一成像模组20、第二成像模组30和第三成像模组40呈一字型排布。进一步地，第二成像模组30位于第一成像模组20和第三成像模组40之间。
由于第一成像模组20和第三成像模组40的视场角因素，为了使得第一成像模组20和第三成像模组40获得品质较佳的图像，第一成像模组20和第三成像模组40可以配置有光学防抖装置，而光学防抖装置一般配置有较多的磁性元件，因此，第一成像模组20和第三成像模组40可以产生磁场。
本实施方式中，将第二成像模组30位于第一成像模组20和第三成像模组40之间，使得第一成像模组20和第三成像模组40可以远离，防止第一成像模组20形成的磁场与第三成像模组40形成的磁场相互干扰而影响第一成像模组20及第三成像模组40的正常使用。
在其他实施方式中，第一成像模组20、第二成像模组30和第三成像模组40可以排列成L型。
第一成像模组20、第二成像模组30和第三成像模组40可以间隔设置，相邻的两个成像模组也可以相互抵靠在一起。
在第一成像模组20、第二成像模组30和第三成像模组30中，任意一个成像模组可以为黑白摄像头、RGB摄像头或红外摄像头。
电子装置1000的处理芯片用于根据所述陀螺仪120的反馈数据控制所述第一成像模组20工作以实现光学防抖拍摄。
请参阅图4-6，本实施方式中，第一成像模组20包括外壳21、反光元件22、安装座23、第一镜片组件24、运动元件25、第一图像传感器26和驱动机构27。
反光元件22、安装座23、第一镜片组件24、运动元件25均设置在外壳21内。反光元件22设置在安装座23上，第一镜片组件24固定在运动元件25上。运动元件25设置在第一图像传感器26一侧。进一步地，运动元件25位于反光元件22及第一图像传感器26之间。
驱动机构27连接运动元件25与外壳21。入射光进入外壳21后，经过反光元件22转向，然后透过第一镜片组件24到达第一图像传感器26，从而使得第一图像传感器26获得外界图像。可以理解，驱动机构27用于驱动运动元件25沿第一镜片组件24的光轴移动。
外壳21大致呈方块形，外壳21具有进光口211，入射光从进光口211进入第一成像模组20内。也就是说，反光元件22用于将从进光口211入射的入射光转向后并经第一镜片组件24后传至第一图像传感器26以使第一图像传感器26感测第一成像模组20外部的入射光。外壳21可采用金属材质制成，例如可以是铁壳，从而为第一成像模组20提供有效的支撑，保证模组的有效强度。
因此可以理解，第一成像模组20为潜望式镜头模组，相较于立式镜头模组，潜望式镜头模组的高度较小，从而可以降低电子装置1000的整体厚度。立式镜头模组指的是镜头模组的光轴为一条直线，或者说，入射光沿着一直线光轴的方向传导至镜头模组的感光器件上。
可以理解，进光口211通过通孔11露出以使外界光线经过通孔11后从进光口211进入第一成像模组20内。
具体地，请参图5，外壳21包括顶壁213和侧壁214。侧壁214自顶壁213的侧边2131延伸形成。顶壁213包括相背的两个侧边2131，侧壁214的数量为两个，每个侧壁214自对应的一个侧边2131延伸，或者说，侧壁214分别连接顶壁213相背的两侧。进光口211形成于顶壁213。
反光元件22为棱镜或平面镜。在一个例子中，当反光元件22为棱镜时，棱镜可以为三角棱镜，棱镜的截面为直角三角形，其中，光线从直角三角形中的其中一个直角边入射，经过斜边的反射后从而另一个直角边出射。可以理解，当然，入射光可以经过棱镜折射后出射，而不经过反射。棱镜可以采用玻璃、塑料等透光性比较好的材料制成。在一个实施方式中，可以在棱镜的其中一个表面涂布银等反光材料以反射入射光。
可以理解，当反光元件22为平面镜时，平面镜将入射光反射从而实现入射光转向。
更多的，请参阅图8与图11，反光元件22具有入光面222、背光面224、反光面226和出光面228。 入光面222靠近且朝向进光口211。背光面224远离进光口211且与入光面222相背。反光面226连接入光面222及背光面224。出光面228连接入光面222及背光面224。反光面226相对于入光面222倾斜设置。出光面228与反光面226相背设置。
具体的，光线的转换过程中，光线穿过进光口211并由入光面222进入反光元件22中，再经由反光面226反射，最后从出光面228反射出反光元件22，完成光线转换的过程，而背光面224与安装座23固定设置，以使反光元件22在保持稳定。
如图12所示，在相关技术中，由于反射入射光线的需要，反光元件22a的反光面226a相对于水平方向倾斜，且在光线的反射方向上反光元件22a为非对称结构，因而反光元件22a的下方相对反光元件22a上方的实际光学面积较小，可以理解为，远离进光口的部分反光面226a较少或无法反射光线。
因此，请参图13，本申请实施方式的反光元件22相对于相关技术中的反光元件22a切除了远离进光口的棱角，这样不仅没有影响反光元件22的反射光线的效果，还降低了反光元件22的整体厚度。
请参阅图8，在某些实施方式中，反光面226相对于入光面222的角度α呈45度倾斜。
如此，使入射的光线更好的反射与转换，具备较好的光线转换效果。
反光元件22可以采用玻璃、塑料等透光性比较好的材料制成。在一个实施方式中，可以在反光元件22的其中一个表面涂布银等反光材料以反射入射光。
在某些实施方式中，入光面222与背光面224平行设置。
如此，将背光面224与安装座23固定设置时，可使反光元件22保持平稳，入光面222也呈现为平面，入射的光线在反光元件22的转换过程也形成规则的光路，使光线的转换效率较好。具体的，沿进光口211的入光方向，反光元件22的截面大致呈梯形，或者说，反光元件22大致呈梯形体。
在某些实施方式中，入光面222和背光面224均垂直于出光面228。
如此，可形成较为规则的反光元件22，使入射光线的光路较为平直，提高光线的转换效率。
在某些实施方式中，入光面222与背光面224的距离范围为4.8-5.0mm。
具体的，入光面222与背光面224之间的距离可以为4.85mm、4.9mm、4.95mm等。或者说，入光面222与背光面224的距离范围可以理解为，反光元件22的高度为4.8-5.0mm。以上距离范围的入光面222与背光面224所形成的反光元件22体积适中，可较好的切合入第一成像模组20中，形成更紧凑性与小型化的第一成像模组20、摄像头组件100与电子装置1000，满足消费者更多的需求。
在某些实施方式中，入光面222、背光面224、反光面226和出光面228均硬化处理形成有硬化层。
反光元件22由玻璃等材质制成时，反光元件22本身的材质较脆，为了提高反光元件22的强度，可在对反光元件22的入光面222、背光面224、反光面226和出光面228做硬化处理，更多的，可对反光元件的所有表面做硬化处理，以进一步提高反光元件的强度。硬化处理如渗入锂离子、在不影响反光元件22转换光线的前提下给以上各个表面贴膜等。
在一个例子中，反光元件22将从进光口211入射的入射光转向的角度为90度。例如，入射光在反光元件22的发射面上的入射角为45度，反射角也为45度。当然，反光元件22将入射光转向的角度也可为其他角度，例如为80度、100度等，只要能将入射光转向后到达第一图像传感器26即可。
本实施方式中，反光元件22的数量为一个，此时，入射光经过一次转向后传至第一图像传感器26。在其他实施方式中，反光元件22的数量为多个，此时，入射光经过至少两次转向后传至第一图像传感器26。
安装座23用于安装反光元件22，或者说，安装座23为反光元件22的载体，反光元件22固定在安装座23上。这样使得反光元件22的位置可以确定，有利于反光元件22反射或折射入射光。反光元件22可以采用粘胶粘接固定在安装座23上以实现与安装座23固定连接。
请参再次参阅图5，在一个例子中，安装座23可活动设置在外壳21内，安装座23能够相对于外壳21转动以调整反光元件22将入射光转向的方向。
安装座23可以带动反光元件22一起朝向第一成像模组20的抖动的反方向转动，从而补偿进光口211的入射光的入射偏差，实现光学防抖的效果。
第一镜片组件24收容于运动元件25内，进一步地，第一镜片组件24设置在反光元件22和第一图像传感器26之间。第一镜片组件24用于将入射光成像在第一图像传感器26上。这样使得第一图像传感器26可以获得品质较佳的图像。
第一镜片组件24沿着其光轴整体移动时可以在第一图像传感器26上成像，从而实现第一成像模组20对焦。第一镜片组件24包括多个镜片241，当至少一个镜片241移动时，第一镜片组件24的整体焦距改变，从而实现第一成像模组20变焦的功能，更多的，由驱动机构27驱动运动元件25在外壳21中运动以达到变焦目的。
在图8的示例中，在某些实施方式中，运动元件25呈筒状，第一镜片组件24中的多个镜片241沿运动元件25的轴向间隔固定在运动元件25内。如图10的示例中,运动元件25包括两个夹片252，两个夹片252将镜片241夹设在两个夹片252之间。
可以理解，由于运动元件25用于固定设置多个镜片241，所需运动元件25的长度尺寸较大，运动元件25可以为圆筒状、方筒状等具备较一定腔体的形状，如此运动元件25呈筒装可更好的设置多个镜片241，并且可更好的保护镜片241于腔体内，使镜片241不易发生晃动。
另外，在图10的示例中，运动元件25将多个镜片241夹持于两个夹片252之间，既具备一定的稳定性，也可降低运动元件25的重量，可以降低驱动机构27驱动运动元件25所需的功率，并且运动元件25的设计难度也较低，镜片241也较易设置于运动元件25上。
当然，运动元件25不限于上述提到的筒状与两个夹片252，在其他的实施方式中，运动元件25如可包括三片、四片等更多的夹片252形成更稳固的结构，或一片夹片252这样更为简单的结构；抑或为矩形体、圆形体等具备腔体以容置镜片241的各种规则或不规则的形状。在保证成像模组10正常成像和运行的前提下，具体选择即可。
第一图像传感器26可以采用互补金属氧化物半导体(CMOS，Complementary Metal Oxide Semiconductor)感光元件或者电荷耦合元件(CCD，Charge-coupled Device)感光元件。
在某些实施方式中，驱动机构27为电磁驱动机构、压电驱动机构或记忆合金驱动机构。
具体地，电磁驱动机构中包括磁场与导体，如果磁场相对于导体运动，在导体中会产生感应电流，感应电流使导体受到安培力的作用，安培力使导体运动起来，此处的导体为电磁驱动机构中带动运动元件25移动的部分；压电驱动机构，基于压电陶瓷材料的逆压电效应：如果对压电材料施加电压，则产生机械应力，即电能与机械能之间发生转换，通过控制其机械变形产生旋转或直线运动，具有结构简单、低速的优点。
记忆合金驱动机构的驱动基于形状记忆合金的特性：形状记忆合金是一种特殊的合金，一旦使它记忆了任何形状，即使产生变形，但当加热到某一适当温度时，它就能恢复到变形前的形状，以此达到驱动的目的，具有变位迅速、方向自由的特点。
在本实施方式中，第一成像模组20还包括模组电路板29。模组电路板用于通过连接器与电子装置1000的主板进行连接，以对第一成像模组20进行供电。模组电路板29固定在外壳21上，可以节省第一成像模组20在宽度方向上的空间位置。并且由于电路板的整体厚度较薄，固定在外壳21上使得第一成像模组20结构更加紧凑。
模组电路板29包括补强板291，补强板291与模组电路板29的接地引脚连通。补强板291可以采用金属材料制成，对模组电路板29起到支撑，补强板291可以通过焊接、粘接等方式与模组电路板29固定连接。进一步地，补强板291与外壳21通过导电胶贴合，使得模组电路板29与外壳21固定连接。如此，补强板291起到桥梁作用，补强板291相对的两侧中的一侧与模组电路29的接地引脚连通，另一侧与外壳21固定，从而实现外壳21的接地。并且由于补强板的厚度较薄，在实现对外壳21接地处理的同时，第一成像模组20的体积并未明显增大。
请再次参阅图8，进一步地，第一成像模组20还包括驱动装置28，驱动装置28用于驱动带有反光元件22的安装座23绕转动轴线29转动。驱动装置28用于驱动安装座23沿转动轴线29的轴向移动。转动轴线29垂直于进光口211的光轴及第一图像传感器26的感光方向，从而使得第一成像模组20实现进光口211的光轴及转动轴线29的轴向上的光学防抖。
如此，由于反光元件22的体积较镜筒的较小，驱动装置28驱动安装座23在两个方向上运动，不仅可以实现第一成像模组20在两个方向的光学防抖效果，还可以使得第一成像模组20的体积较小。
请参图5和图8，为了方便描述，将第一成像模组20的宽度方向定义为X向，高度方向定义为Y向，长度方向定义为Z向。由此，进光口211的光轴为Y向，第一图像传感器26的感光方向为Z向，转动轴线29的轴向为X向。
驱动装置28驱动安装座23转动，从而使得反光元件22绕X向转动，以使第一成像模组20实现Y向光学防抖的效果。另外，驱动装置28驱动安装座23沿转动轴线29的轴向移动，从而使得第一成像模组20实现X向光学防抖的效果。另外，第一镜片组件24可以沿着Z向以实现第一镜片组件24在第一图像传感器26上对焦。
具体地，反光元件22绕X向转动时，反光元件22反射的光线在Y向上移动，从而使得第一图像传感器26在Y向上形成不同的图像以实现Y向的防抖效果。反光元件22沿着X向移动时，反光元件22反射的光线在X向上移动，从而使得第一图像传感器26在X向上形成不同的图像以实现X向的防抖效果。
在某些实施方式中，驱动装置28形成有弧形导轨281，驱动装置28用于驱动安装座23沿着弧形导轨281绕弧形导轨281的中心轴线282转动及沿着中心轴线282的轴向移动，中心轴线2282与转动轴线29重合。
可以理解，驱动装置28用于驱动安装座23沿着弧形导轨281绕弧形导轨281的中心轴线282转动及沿着中心轴线282的轴向移动。
如此，由于驱动装置28采用弧形导轨281的方式驱动带有反光元件22的安装座23一并转动，使得驱动装置28与安装座23之间的摩擦力较小，有利于安装座23转动平稳，提高了第一成像模组20的光学防抖效果。
具体地，请参图14，在相关技术中，安装座(图未示)与转轴23a转动连接，安装座绕着转轴23a转动以带动反光元件22a一并转动。假定摩擦力为f1，转轴23a半径为R1，推力为F1，转动半径为A。那么摩擦力转矩与推力转矩比值K1为K1＝f1R1/F1A。由于反光元件22a在进行防抖时仅需要轻微转动，若F1过大导致反光元件22a的转动幅度过大，将无法实现防抖功能，故而F1不能过大；而成像模组本身需要轻薄短小导致反光元件22a尺寸不能太大，因此A的变大空间也有限，从而导致摩擦力的影响无法进一步消除。
请参图15，而本申请中，安装座23沿着弧形导轨281转动，弧形导轨281可以由多个滚动体2811排列而成，滚动体2811的半径为R2，反光元件22的转动半径为B。此时，摩擦力转矩和转动转矩的比例K2为K2＝f2R2/F2B，在f1相较于f2、R1相较于R2、F1相较于F2均不发生大幅变化的情况下，由于采用轨道式的摆动方式进行转动，对应的转动半径变成B，而B可以不受反光元件22尺寸的限制，甚至做到A的数倍以上。故在这种情况下，摩擦力对反光元件22转动的影响可以极大的降低(K2的大小降低)，从而改善反光元件22的转动精度，使得第一成像模组20的光学防抖效果较佳。
请参图8，在某些实施方式中，安装座23包括弧形面231，弧形面231与弧形导轨281同心设置且与弧形导轨281配合。或者说，弧形面231的中心与弧形导轨281的中心重合。这样使得安装座23与驱动装置28配合的更加紧凑。
在某些实施方式中，中心轴线282位于第一成像模组20外。如此，弧形导轨281的半径R2较大，这样可以减小摩擦力对安装座23转动的不良影响。
在某些实施方式中，驱动装置28位于外壳21的底部。或者说，驱动装置28与外壳21为一体结构。如此，第一成像模组20的结构更加紧凑。
在某些实施方式中，驱动装置28通过电磁的方式驱动安装座23转动。在一个例子中，驱动装置28设置有线圈，安装座23上固定有电磁片，在线圈通电后，线圈可以产生磁场以驱动电磁片运动，从而带动安装座23及反光元件一起转动。
当然，在其他实施方式中，驱动装置28可以通过压电驱动的方式或记忆合金驱动的方式驱动安装座23运动。压电驱动的方式和记忆合金驱动的方式请参上述描述，在此不再赘述。
请再次参阅图4-图9，第一成像模组20还包括芯片电路板201和驱动芯片202，芯片电路板201固定在驱动机构27的侧面，驱动芯片202固定在芯片电路板201与驱动机构27相背的一面，驱动芯片202通过芯片电路板201与第一图像传感器26电性连接。
如此，驱动芯片202通过芯片电路板201固定在驱动机构27的侧面，并且通过芯片电路板201与第一图像传感器26电性连接，这样使得驱动芯片202与驱动机构27之间的结构更加紧凑，有利于降低第一成像模组20的体积。
具体地，驱动芯片202用于控制驱动机构27驱动运动元件25沿第一镜片组件24的光轴移动，以 使第一镜片组件24在第一图像传感器26上对焦成像。驱动芯片202用于根据所述陀螺仪120的反馈数据控制驱动装置28驱动带有反光元件22的安装座23绕转动轴线29转动。驱动芯片202还用于根据所述陀螺仪120的反馈数据控制驱动装置28驱动安装座23沿转动轴线29的轴向移动。
驱动芯片202还用于根据所述陀螺仪120的反馈数据控制驱动装置28驱动安装座23沿着弧形导轨281绕弧形导轨281的中心轴线282转动及沿着中心轴线282的轴向移动。
在某些实施方式中，第一成像模组20包括传感器电路板203，第一图像传感器26固定在传感器电路板203，芯片电路板201包括安装部2011和连接部2022，安装部2011固定在驱动机构27的侧面，驱动芯片202固定在安装部2011，连接部2022连接安装部2011及传感器电路板203。
如此，驱动芯片202可以通过传感器电路板203与第一图像传感器26电性连接。具体地，连接部2022可以通过焊接的方式与传感器电路板203固定连接。
在一个例子中，在组装第一成像模组20时，可以先将驱动芯片202固定在芯片电路板201上，然后将带有驱动芯片202的芯片电路板201与传感器电路板203通过焊接的方式连接，最后将带有驱动芯片202的芯片电路板201固定在驱动机构27的侧面。
芯片电路板201可以通过焊接、粘接等方式与驱动机构27固定连接。
需要指出的是，芯片电路板201固定在驱动机构27的侧面可以指芯片电路板201与驱动机构27的侧面接触固定，也可以指芯片电路板201通过其他元件与驱动机构27的侧面固定连接。
本实施方式中，安装部2011为刚性电路板，连接部2022为柔性电路板，安装部2011贴合在驱动机构27的侧面。
如此，安装部2011为刚性电路板使得安装部2011具有较好的刚度，不易变形，有利于安装部2011与驱动机构27的侧面固定连接。安装部2011可以通过粘接的方式贴合在驱动机构27的侧面。另外，连接部2022为柔性电路板使得芯片电路板201容易变形，使得芯片电路板201容易安装在驱动机构27的侧面。
当然，在其他实施方式中，安装部2011也可以为柔性电路板。
在本实施方式中，模组电路板29还包括连接部292和定位部293，连接部292连接传感器电路板203与定位部293，连接部292可以是柔性电路板，定位部293为刚性电路板，补强板291贴合在定位部293朝向外壳21的一侧。
可以理解地，模组电路板29需要与其他电路板进行连通并与电子装置1000的主板连接以进行电信号的传输。为节省空间连接部292可采用柔性电路板，由传感器电路板203向侧壁214弯折后为保证能够模组电路板29能够紧贴外壳21，定位部293可采用刚性电路板。补强板291可贴合在定位部293上，并朝向外壳21以使得模组电路版29可通过刚性补强板291与外壳21固定连接。
在某些实施方式中，驱动机构27的侧面包括第一限位结构271，补强板291包括第二限位结构2911，外壳21形成有避让孔215，第一限位结构271位于避让孔215中，并与第二限位结构2911相配合以将模组电路板29固定在外壳21上。
在本实施方式中，第一限位结构271可以是限位柱，第一限位结构271可以与驱动结构27的侧面一体成型，也可以是分体成型后固定在驱动结构的侧面，具体不做限制。相对应的，第二限位结构2911可以是限位孔或限位槽，如此，第一限位结构271可与第二限位结构2911相配合，从而对模组电路板29进行限位，并进一步地通过导电胶将补强板291与外壳21贴合加强固定。可以理解地，为保证模组电路板29与外壳贴合后外壳侧壁的平整，第一限位结构271自避让孔215伸出的长度应当和第二限位结构2911的深度与外壳21的厚度的总和相当。
在某些实施方式中，芯片电路板201包括第三限位结构2012，第三限位结构2012与第一限位结构271相配合以将芯片电路板201固定在驱动机构27的侧面。
具体地，第一限位结构271可以是限位柱，第三限位结构2011可以是限位孔，如此，芯片电路板201可以通过第三限位结构2011和第一限位结构271相配合以限定在驱动机构271的侧面，并进一步通过贴合等方式加强固定。
在某些实施方式中，驱动芯片202位于避让孔215中，从而露出于外壳21。如此，驱动芯片202穿设外壳21使得驱动芯片202与外壳21之间存在重叠的部分，这样使得驱动芯片202与外壳21之间的结构更加紧凑，可以进一步减小第一成像模组20的体积。
可以理解，当驱动机构27的侧面与外壳21之间具有间隙时，在宽度方向上，驱动芯片202部分位于避让孔215中。
具体地，较佳地，避让孔215的形状、尺寸分别与驱动芯片202的形状、尺寸配合。例如，避让孔215的尺寸略大于驱动芯片202的尺寸，避让孔215的形状与驱动芯片202的形状相同。
本实施方式中，避让孔215形成于外壳21的侧壁214。可以理解，避让孔215贯穿侧壁214的内外侧。当然，在其他实施方式中，避让孔215也可以形成于外壳21的顶壁213。
在一个实施方式中，第一成像模组20还包括屏蔽罩204，屏蔽罩204固定在芯片电路板201且罩设驱动芯片202。如此，屏蔽罩204可以保护驱动芯片202，防止驱动芯片202受到物理冲击。另外，屏蔽罩204还可以减少驱动芯片202受到的电磁影响。
屏蔽罩204可以采用金属材料制成。例如，屏蔽罩204的材料为不锈钢。本实施方式中，芯片电路板201固定在安装部2011，此时，安装部2011较佳地为刚性电路板或为柔性电路板与补强板结合的板材。
请参阅图16，本实施方式中，第二成像模组30为立式镜头模组，当然，在其他实施方式中，第二成像模组30也可以潜望式镜头模组。
第二成像模组30包括第二镜片组件31和第二图像传感器32，第二镜片组件31用于将光线在第二图像传感器32上成像，第二成像模组30的入射光轴与第二镜片组件31的光轴重合。
本实施方式中，第二成像模组30可以为定焦镜头模组，因此，第二镜片组件31的镜片241较少，以使第二成像模组30高度较低，有利于减小电子装置1000的厚度。
第二图像传感器32的类型可与第一图像传感器26的类型一样，在此不再赘述。
第三成像模组40的结构与第二成像模组30的结构类似，例如，第三成像模组40也为立式镜头模组。因此，第三成像模组40的特征请参考第二成像模组40的特征，在此不在赘述。
综上，第一成像模组20包括外壳21、反光元件22、第一镜片组件24、运动元件25、第一图像传感器26和驱动机构27。反光元件22、第一镜片组件24、运动元件25、第一图像传感器26和驱动机构27均设置在外壳21内。运动元件25位于反光元件22及第一图像传感器26之间。第一镜片组件24固定在运动元件25上。
外壳21具有进光口211。反光元件22用于将从进光口211入射的入射光转向后并经第一镜片组件24后传至第一图像传感器26以使第一图像传感器26感测第一成像模组20外部的入射光。
第一成像模组20还包括模组电路板29。模组电路板用于通过连接器与电子装置1000的主板进行连接，以对第一成像模组20进行供电。模组电路板29固定在外壳21上，可以节省第一成像模组20在宽度方向上的空间位置。并且由于电路板的整体厚度较薄，固定在外壳21上使得第一成像模组20结构更加紧凑。
模组电路板29包括补强板291，补强板291与模组电路板29的接地引脚连通。补强板29可以采用金属材料制成，对模组电路板29起到支撑，补强板291可以通过焊接、粘接等方式与模组电路板29固定连接。进一步地，补强板291与外壳21通过导电胶贴合，使得模组电路板29与外壳21固定连接。如此，补强板291起到桥梁作用，补强板291相对的两侧中的一侧与模组电路29的接地引脚连通，另一侧与外壳21固定，从而实现外壳21的接地。并且由于补强板的厚度较薄，在实现对外壳21接地处理的同时，第一成像模组20的体积并未明显增大。
在本说明书的描述中，参考术语“一个实施方式”、“某些实施方式”、“示意性实施方式”、“示例”、“具体示例”、或“一些示例”等的描述意指结合所述实施方式或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施方式或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。
尽管已经示出和描述了本申请的实施方式，本领域的普通技术人员可以理解：在不脱离本申请的原理和宗旨的情况下可以对这些实施方式进行多种变化、修改、替换和变型，本申请的范围由权利要求及其等同物限定。

Claims (20)

  1. 一种成像模组，其特征在于，包括：
    外壳；和
    均设置在所述外壳内的反光元件、图像传感器、镜片组件、运动元件和驱动机构；
    所述外壳具有进光口，所述反光元件用于将从所述进光口入射的入射光转向并经过所述镜片组件后传至所述图像传感器以使所述图像传感器感测所述成像模组外部的所述入射光；
    所述驱动机构用于驱动位于所述反光元件及所述图像传感器之间的所述运动元件沿所述镜片组件的光轴移动以使固定在所述运动元件上的所述镜片组件在所述图像传感器上对焦成像；
    所述成像模组还包括模组电路板，所述模组电路板固定在所述外壳上，所述模组电路板包括补强板，所述补强板与所述模组电路板的接地引脚连通以使所述外壳接地。
  2. 如权利要求1所述的成像模组，其特征在于，所述成像模组还包括芯片电路板和驱动芯片，所述芯片电路板固定在所述驱动机构的侧面，所述驱动芯片固定在所述芯片电路板与所述驱动机构相背的一侧。
  3. 如权利要求2所述的成像模组，其特征在于，所述驱动机构的侧面包括第一限位结构，所述补强板包括第二限位结构，所述外壳形成有避让孔，所述第一限位结构位于所述避让孔中，并与所述第二限位结构相配合以将所述模组电路板固定在外壳上。
  4. 如权利要求3所述的成像模组，其特征在于，所述芯片电路板包括第三限位结构，所述第三限位结构与所述第一限位结构相配合以将所述芯片电路板固定在所述驱动机构的侧面。
  5. 如权利要求3所述的成像模组，其特征在于，所述外壳包括顶壁和侧壁，所述侧壁自所述顶壁的侧边延伸形成，所述避让孔形成于所述侧壁。
  6. 如权利要求5所述的成像模组，其特征在于，所述成像模组还包括固定在所述芯片电路板且罩设所述驱动芯片的屏蔽罩。
  7. 如权利要求1所述的成像模组，其特征在于，所述成像模组包括传感器电路板，所述图像传感器固定在所述传感器电路板上，所述模组电路板包括连接部和定位部，所述连接部为柔性电路板，所述连接部连接所述传感器电路板与所述定位部，所述定位部为刚性电路板，所述补强板贴合在所述定位部朝向所述外壳的一侧。
  8. 如权利要求1所述的成像模组，其特征在于，所述成像模组包括设置在所述外壳内的安装座和驱动装置，所述反光元件固定在所述安装座上，所述驱动装置用于驱动带有所述反光元件的所述安装座绕转动轴线转动，以实现在所述进光口的光轴方向上的光学防抖，所述转动轴线垂直于所述进光口的光轴。
  9. 如权利要求8所述的成像模组，其特征在于，所述驱动装置形成有弧形导轨，所述驱动装置用于驱动所述安装座沿着所述弧形导轨绕所述弧形导轨的中心轴线转动，所述中心轴线与所述转动轴线重合。
  10. 如权利要求9所述的成像模组，其特征在于，所述驱动装置用于驱动所述安装座沿着所述中心轴线的轴向移动。
  11. 如权利要求9所述的成像模组，其特征在于，所述安装座包括与所述弧形导轨同心设置且与所述弧形导轨配合的弧形面。
  12. 如权利要求1所述的成像模组，其特征在于，所述反光元件具有入光面、背光面、反光面和出光面，所述入光面靠近且朝向所述进光口，所述背光面远离所述进光口且与所述入光面相背，所述反光面连接所述入光面及所述背光面，所述出光面连接所述入光面及所述背光面，所述反光面相对于所述入光面倾斜设置，所述出光面与所述反光面相背设置。
  13. 如权利要求12所述的成像模组，其特征在于，所述入光面与所述背光面平行设置。
  14. 如权利要求12所述的成像模组，其特征在于，所述入光面、所述背光面、所述反光面和所述出光面均硬化处理形成有硬化层。
  15. 一种摄像头组件，其特征在于，包括第一成像模组、第二成像模组和第三成像模组，所述第一成像模组为权利要求1-14任一项所述的成像模组，所述第三成像模组的视场角大于所述第一成像模组的视场角且小于所述第二成像模组的视场角。
  16. 如权利要求15所述的摄像头组件，其特征在于，所述第一成像模组、所述第二成像模组和所述 第三成像模组呈一字型排布，所述第二成像模组位于所述第一成像模组和所述第三成像模组之间。
  17. 如权利要求15所述的摄像头组件，其特征在于，所述摄像头组件包括支架，所述第一摄像头模组和所述第二摄像头模组均设置在所述支架内并与所述支架固定连接。
  18. 如权利要求15所述的摄像头组件，其特征在于，所述第一摄像头模组和所述第二摄像头模组间隔设置。
  19. 一种电子装置，其特征在于，包括：
    本体；
    滑动模块，所述滑动模块用于在收容于所述本体内的第一位置和自所述本体露出的第二位置之间滑动，所述滑动模块内设置有权利要求15-18任一项所述的摄像头组件。
  20. 如权利要求19所述的电子装置，其特征在于，所述滑动模块内设置有陀螺仪，所述摄像头组件与所述陀螺仪分离设置，所述陀螺仪用于检测所述滑动模块的抖动情况并反馈相应的数据。
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