WO2020125304A1 - 成像方法、成像装置、电子装置及介质 - Google Patents

成像方法、成像装置、电子装置及介质 Download PDF

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Publication number
WO2020125304A1
WO2020125304A1 PCT/CN2019/119183 CN2019119183W WO2020125304A1 WO 2020125304 A1 WO2020125304 A1 WO 2020125304A1 CN 2019119183 W CN2019119183 W CN 2019119183W WO 2020125304 A1 WO2020125304 A1 WO 2020125304A1
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WO
WIPO (PCT)
Prior art keywords
image
area
images
field
preprocessed
Prior art date
Application number
PCT/CN2019/119183
Other languages
English (en)
French (fr)
Inventor
张弓
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2020125304A1 publication Critical patent/WO2020125304A1/zh

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00—Details of television systems
    • H04N5/222—Studio circuitry; Studio devices; Studio equipment
    • H04N5/262—Studio circuits, e.g. for mixing, switching-over, change of character of image, other special effects ; Cameras specially adapted for the electronic generation of special effects
    • H04N5/265—Mixing
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/95—Computational photography systems, e.g. light-field imaging systems
    • H04N23/951—Computational photography systems, e.g. light-field imaging systems by using two or more images to influence resolution, frame rate or aspect ratio
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M2250/00—Details of telephonic subscriber devices
    • H04M2250/52—Details of telephonic subscriber devices including functional features of a camera

Definitions

  • the present application relates to the field of imaging technology, and in particular, to an imaging method, imaging device, electronic device, and medium.
  • the present application provides an imaging method, imaging device, electronic device, and medium.
  • An imaging method is used in an electronic device.
  • the electronic device includes a wide-angle camera and a plurality of telephoto cameras.
  • the imaging method includes:
  • the reference image including an intermediate area and an edge area
  • the imaging device in the embodiments of the present application is used in an electronic device, and the imaging device includes:
  • the first acquisition module is used to acquire the image collected by the wide-angle camera as a reference image, and the reference image includes an intermediate region and an edge region;
  • the second acquisition module is used to acquire images respectively collected by multiple telephoto cameras as preprocessed images, wherein the field of view area of the multiple preprocessed images includes the field of view area of the edge area, and the viewfield of the multiple preprocessed images
  • the field area has an overlapping area in the field of view area in the middle area, and the focus position of the preprocessed image is located in the overlapping area;
  • the synthesis module is used to synthesize the reference image and multiple preprocessed images to obtain the target image.
  • An electronic device includes a wide-angle camera, multiple telephoto cameras, and a processor.
  • the processor is used to acquire an image collected by the wide-angle camera as a reference image, and the reference image includes an intermediate region and an edge region;
  • the images collected by the focal camera are used as preprocessed images, where the field of view of the multiple preprocessed images includes the field of view of the edge area, and the field of view of the multiple preprocessed images has an overlapping area in the field of view of the middle area ,
  • the focus position of the preprocessed image is located in the overlapping area; and it is used to synthesize the reference image and multiple preprocessed images to obtain the target image.
  • One or more non-volatile computer-readable storage media containing computer-executable instructions when the computer-executable instructions are executed by one or more processors, cause the processors to perform the above imaging method.
  • the preprocessed image captured by the telephoto camera can compensate for the sharpness of the edge area of the reference image captured by the wide-angle camera.
  • the focus position of the preprocessed image is located in the overlapping area, so that the focus positions of the multiple preprocessed images are approximately the same, the consistency of the target image obtained by synthesis is better, and the quality of the target image is improved. Additional aspects and advantages of the present application will be partially given in the following description, and some will become apparent from the following description, or be learned through practice of the present application.
  • FIG. 1 is a schematic plan view of an electronic device according to an embodiment of the present application.
  • FIG. 2 is a schematic perspective view of a first telephoto camera according to an embodiment of the present application.
  • FIG. 3 is an exploded schematic diagram of the first telephoto camera according to an embodiment of the present application.
  • FIG. 4 is a schematic cross-sectional view of a first telephoto camera according to an embodiment of the present application.
  • FIG. 5 is a partial cross-sectional schematic diagram of a first telephoto camera according to an embodiment of the present application.
  • FIG. 6 is a schematic cross-sectional view of a first telephoto camera according to another embodiment of the present application.
  • FIG. 7 is a schematic perspective view of a reflective element according to an embodiment of the present application.
  • FIG. 8 is a schematic diagram of light reflection imaging of a first telephoto camera according to an embodiment of the present application.
  • FIG. 9 is a schematic structural diagram of an imaging module in the related art.
  • FIG. 10 is a schematic structural diagram of a first telephoto camera according to an embodiment of the present application.
  • FIG. 11 is a schematic cross-sectional view of a wide-angle camera according to an embodiment of the present application.
  • FIG. 12 is a schematic flowchart of an imaging method according to an embodiment of the present application.
  • FIG. 13 is a schematic diagram of an imaging method according to an embodiment of the present application.
  • FIG. 14 is a schematic block diagram of an imaging device according to an embodiment of the present application.
  • 15 is a schematic block diagram of an electronic device according to an embodiment of the present application.
  • 16 is a schematic flowchart of an imaging method according to an embodiment of the present application.
  • FIG. 17 is a schematic flowchart of an imaging method according to an embodiment of the present application.
  • FIG. 18 is a schematic diagram of an imaging method according to an embodiment of the present application.
  • FIG. 19 is a schematic diagram of an imaging method according to an embodiment of the present application.
  • the electronic device 1000 includes a casing 200 and a camera assembly 100.
  • the camera assembly 100 is exposed through the casing 200.
  • the electronic device 1000 may be any of various types of computer system devices that are mobile or portable and perform wireless communication (only one form is exemplarily shown in FIG. 1 ).
  • the electronic device 1000 may be a mobile phone or a smart phone (for example, a phone based on iPhone system (Apple system), a phone based on Android system (Android system)), a portable game device (for example, iPhone (Apple phone)), a laptop Computers, PDAs, portable Internet devices, music players and data storage devices, other handheld devices and such as watches, earphones, pendants, headphones, etc.
  • the electronic device 100 can also be other Wearable devices (for example, head mounted devices (HMD) such as electronic glasses, electronic clothes, electronic bracelets, electronic necklaces, electronic tattoos, electronic devices, or smart watches).
  • HMD head mounted devices
  • the camera assembly 100 includes a telephoto camera 20 and a wide-angle camera 30.
  • the number of telephoto cameras 20 is plural.
  • the number of telephoto cameras 20 is 2, 3, 4 and so on.
  • the number of telephoto cameras 20 is 4 as an example.
  • the number of wide-angle cameras 30 is one.
  • the angle of view of the wide-angle camera 30 is greater than that of the telephoto camera 20.
  • the wide-angle camera 30 has a viewing angle range of 80-110 degrees, while the telephoto camera 20 has a viewing angle range of 10-40 degrees.
  • the field of view area of the wide-angle camera 30 is large, and the field of view area of the telephoto camera 20 is small. Therefore, the telephoto camera 20 has a better advantage for shooting the local position of the scene.
  • a plurality of telephoto cameras 20 and a wide-angle camera 30 are arranged in a matrix, as shown in FIG. 1.
  • the multiple telephoto cameras 20 and the wide-angle camera 30 may be arranged in any shape.
  • the telephoto cameras 20 may all be vertical cameras, or may be periscope cameras, and the wide-angle camera 30 may be a vertical camera.
  • the vertical lens module refers to that the optical axis of the lens module is a straight line, or that incident light is transmitted to the photosensitive device of the lens module along the direction of the linear optical axis.
  • the telephoto camera 20 is a periscope camera as an example for further description.
  • the telephoto camera 20 includes a housing 21, a reflective element 22, a mounting base 23, a first lens assembly 24, a moving element 25, a first image sensor 26, and a driving mechanism 27.
  • the reflective element 22, the mount 23, the first lens assembly 24, and the moving element 25 are all disposed in the housing 21.
  • the reflective element 22 is disposed on the mounting base 23, and the first lens assembly 24 is fixed on the moving element 25.
  • the moving element 25 is provided on the first image sensor 26 side. Further, the moving element 25 is located between the reflective element 22 and the first image sensor 26.
  • the driving mechanism 27 connects the moving element 25 and the housing 21. After the incident light enters the housing 21, it is turned by the reflective element 22, and then reaches the first image sensor 26 through the first lens assembly 24, so that the first image sensor 26 obtains an external image.
  • the driving mechanism 27 is used to drive the moving element 25 to move along the optical axis of the first lens assembly 24.
  • the housing 21 has a substantially square shape, and the housing 21 has a light inlet 211 from which incident light enters the telephoto camera 20.
  • the reflective element 22 is used to divert the incident light incident from the light entrance 211 and pass through the first lens assembly 24 to the first image sensor 26 so that the first image sensor 26 senses the exterior of the telephoto camera 20 Incident light.
  • the light inlet 211 is exposed through the through hole 11 so that external light passes through the through hole 11 and enters the telephoto camera 20 from the light inlet 211.
  • the housing 21 includes a top wall 213 and a side wall 214.
  • the side wall 214 extends from the side 2131 of the top wall 213.
  • the top wall 213 includes two opposite sides 2131, and the number of side walls 214 is two.
  • Each side wall 214 extends from a corresponding side 2131, or the side walls 214 are respectively connected to the top wall 213 On both sides.
  • the light inlet 211 is formed on the top wall 213.
  • the reflective element 22 is a prism or a plane mirror. For more details, please refer to FIGS. 4 and 7.
  • the reflective element 22 has a light incident surface 222, a backlight surface 224, a reflective surface 226 and a light exit surface 228.
  • the light incident surface 222 approaches and faces the light entrance 211.
  • the backlight surface 224 is away from the light entrance 211 and opposite to the light entrance surface 222.
  • the reflective surface 226 is connected to the light incident surface 222 and the backlight surface 224.
  • the light exit surface 228 is connected to the light entrance surface 222 and the backlight surface 224.
  • the light exit surface 228 faces the first image sensor 26.
  • the reflective surface 226 is inclined relative to the light incident surface 222.
  • the light emitting surface 228 is opposite to the light reflecting surface 226.
  • the light passes through the light inlet 211 and enters the light reflecting element 22 from the light incident surface 222, then reflects through the light reflecting surface 226, and finally reflects the light reflecting element 22 from the light emitting surface 228 to complete the light conversion
  • the backlight surface 224 and the mounting base 23 are fixedly arranged, so that the reflective element 22 remains stable.
  • the reflective element 22 of the embodiment of the present application cuts off the corner away from the light entrance relative to the reflective element in the related art, which not only does not affect the reflected light effect of the reflective element 22, but also reduces the reflective element The overall thickness of 22.
  • the angle ⁇ of the reflective surface 226 relative to the light incident surface 222 is inclined at 45 degrees. In this way, the incident light is better reflected and converted, and has a better light conversion effect.
  • the reflective element 22 can be made of glass, plastic, or other materials with relatively good light transmittance.
  • a reflective material such as silver may be coated on one surface of the reflective element 22 to reflect incident light.
  • the mounting base 23 is used for mounting the reflective element 22, or the mounting base 23 is a carrier of the reflective element 22, and the reflective element 22 is fixed on the mounting base 23. This allows the position of the reflective element 22 to be determined, which is advantageous for the reflective element 22 to reflect or refract incident light.
  • the reflective element 22 may be fixed on the mounting base 23 by viscose to achieve a fixed connection with the mounting base 23.
  • the mounting base 23 is provided with a limiting structure 232, and the limiting structure 232 is connected to the reflective element 22 to limit the position of the reflective element 22 on the mounting base 23.
  • the position-limiting structure 232 restricts the position of the reflective element 22 on the mounting base 23, so that the reflective element 22 will not be displaced in the event of an impact, which is beneficial to the normal use of the telephoto camera 20.
  • the reflective element 22 is fixed on the mounting base 23 by means of bonding. If the limit structure 232 is omitted, then, when the telephoto camera 20 is impacted, if the reflective element 2222 and the mounting base 23 The adhesive force is insufficient, and the reflective element 22 is easily detached from the mount 23.
  • the mounting base 23 is formed with a mounting groove 233
  • the reflective element 22 is disposed in the mounting groove 233
  • the limiting structure 232 is disposed at the edge of the mounting groove 233 and abuts against the reflective element 22.
  • the mounting groove 233 can make the reflective element 22 easily mounted on the mounting base 23.
  • the limiting structure 232 is disposed at the edge of the mounting groove 233 and abuts the edge of the reflective element 22, which not only restricts the position of the reflective element 22 but also prevents the reflective element 22 from emitting incident light to the first image sensor 26.
  • the limiting structure 232 includes a protrusion 234 protruding from the edge of the mounting groove 233, and the protrusion 234 abuts the edge of the light emitting surface 228. Since the reflective element 22 is mounted on the mounting base 23 through the reflective surface 226, the light exit surface 228 is disposed opposite to the reflective surface 226. Therefore, when the light reflecting element 22 is impacted, it is more likely that the light generating surface 228 is located on the side where the light emitting surface 228 is located. In this embodiment, the limit structure 232 abuts against the edge of the light emitting surface 228 can not only prevent the reflective element 22 from shifting to the light emitting surface 228 side, but also ensure that the light exits the light emitting surface 228 normally.
  • the limiting structure 232 may include other structures as long as the position of the reflective element 22 can be limited.
  • the limiting structure 232 is formed with a clamping slot, and the reflective element 22 forms a limiting column, and the limiting column is engaged in the clamping slot to limit the position of the reflective element 22.
  • the protrusion 234 is strip-shaped and extends along the edge of the light exit surface 228. In this way, the contact area between the protrusion 234 and the edge of the light exit surface 228 is large, so that the reflective element 22 can be more firmly located on the mounting base 23.
  • the protrusion 234 may also have a block-like structure.
  • the mounting base 23 can be movably disposed in the housing 21, and the mounting base 23 can rotate relative to the housing 21 to adjust the direction in which the reflective element 22 turns the incident light.
  • the mounting base 23 can drive the reflective element 22 to rotate in the opposite direction of the shake of the telephoto camera 20 together, so as to compensate the incident deviation of the incident light of the light inlet 211 and achieve the effect of optical anti-shake.
  • the first lens assembly 24 is accommodated in the moving element 25. Further, the first lens assembly 24 is disposed between the reflective element 22 and the first image sensor 26. The first lens assembly 24 is used to image incident light on the first image sensor 26. This allows the first image sensor 26 to obtain an image with better quality.
  • the first lens assembly 24 When the first lens assembly 24 moves integrally along its optical axis, it can image on the first image sensor 26, so that the telephoto camera 20 can focus.
  • the first lens assembly 24 includes a plurality of lenses 241. When at least one lens 241 moves, the overall focal length of the first lens assembly 24 changes, thereby realizing the zoom function of the telephoto camera 20. More, the driving mechanism 27 drives the moving element 25 moves in the housing 21 for zooming purposes.
  • the moving element 25 is cylindrical, and the plurality of lenses 241 in the first lens assembly 24 are fixed in the moving element 25 along the axial interval of the moving element 25.
  • the moving element 25 includes two clips 252 that sandwich the lens 241 between the two clips 252.
  • the moving element 25 is used to fix a plurality of lenses 241, the length of the required moving element 25 is large, and the moving element 25 may be cylindrical, square, etc., having a shape of a certain cavity.
  • the element 25 is arranged in a tube, so that a plurality of lenses 241 can be better arranged, and the lens 241 can be better protected in the cavity, so that the lens 241 is less likely to shake.
  • the moving element 25 sandwiches the plurality of lenses 241 between the two clips 252, which not only has a certain stability, but also reduces the weight of the moving element 25, and can reduce the driving of the driving mechanism 27.
  • the power required by the moving element 25, and the design difficulty of the moving element 25 is also relatively low, and the lens 241 is also easier to set on the moving element 25.
  • the moving element 25 is not limited to the cylindrical shape and the two clips 252 mentioned above.
  • the moving element 25 may include three or four clips 252 to form a more stable structure. , Or a simpler structure such as a clip 252; or a rectangular body, a circular body, etc. having a cavity to accommodate various regular or irregular shapes of the lens 241.
  • specific selection is sufficient.
  • the first image sensor 26 may use a complementary metal oxide semiconductor (CMOS) photosensitive element or a charge-coupled device (charge-coupled device, CCD) photosensitive element.
  • CMOS complementary metal oxide semiconductor
  • CCD charge-coupled device
  • the driving mechanism 27 is an electromagnetic driving mechanism, a piezoelectric driving mechanism, or a memory alloy driving mechanism.
  • the electromagnetic drive mechanism includes a magnetic field and a conductor. If the magnetic field moves relative to the conductor, an induced current is generated in the conductor. The induced current causes the conductor to be subjected to an ampere force, which causes the conductor to move.
  • the conductor here is electromagnetic.
  • the part of the drive mechanism that moves the moving element 25; the piezoelectric drive mechanism is based on the inverse piezoelectric effect of the piezoelectric ceramic material: if a voltage is applied to the piezoelectric material, mechanical stress is generated, that is, electrical energy and mechanical energy are converted, through Controlling its mechanical deformation to produce rotation or linear motion has the advantages of simple structure and low speed.
  • the drive of the memory alloy drive mechanism is based on the characteristics of the shape memory alloy: the shape memory alloy is a special alloy. Once it remembers any shape, even if it is deformed, it can be restored to a certain temperature when heated The shape before deformation, in order to achieve the purpose of driving, has the characteristics of rapid displacement and free direction.
  • the telephoto camera 20 further includes a driving device 28.
  • the driving device 28 is used to drive the mounting base 23 with the reflective element 22 to rotate around the rotation axis 29.
  • the driving device 28 is used to drive the mounting base 23 to move in the axial direction of the rotation axis 29.
  • the rotation axis 29 is perpendicular to the optical axis of the light inlet 211 and the photosensitive direction of the first image sensor 26, so that the telephoto camera 20 realizes optical image stabilization in the optical axis of the light inlet 211 and the axial direction of the rotation axis 29.
  • the driving device 28 drives the mounting base 23 to move in two directions, which not only can realize the optical anti-shake effect of the telephoto camera 20 in two directions, but also can make the long
  • the focal camera 20 has a small volume.
  • the width direction of the telephoto camera 20 is defined as the X direction
  • the height direction is defined as the Y direction
  • the length direction is defined as the Z direction.
  • the optical axis of the light inlet 211 is in the Y direction
  • the light receiving direction of the first image sensor 26 is in the Z direction
  • the axial direction of the rotation axis 29 is in the X direction.
  • the driving device 28 drives the mounting base 23 to rotate, so that the reflective element 22 rotates around the X direction, so that the telephoto camera 20 realizes the Y-direction optical image stabilization effect.
  • the driving device 28 drives the mounting base 23 to move in the axial direction of the rotation axis 29, so that the telephoto camera 20 achieves the X-direction optical image stabilization effect.
  • the first lens assembly 24 may be along the Z direction to enable the first lens assembly 24 to focus on the first image sensor 26.
  • the reflective element 22 rotates in the X direction
  • the light reflected by the reflective element 22 moves in the Y direction
  • the first image sensor 26 forms a different image in the Y direction to achieve the anti-shake effect in the Y direction.
  • the reflective element 22 moves in the X direction
  • the light reflected by the reflective element 22 moves in the X direction, so that the first image sensor 26 forms a different image in the X direction to achieve the anti-shake effect in the X direction.
  • the driving device 28 is formed with an arc-shaped guide rail 281, and the drive device 28 is used to drive the mounting base 23 to rotate along the arc-shaped guide rail 281 about the central axis 282 of the arc-shaped guide rail 281 and the axis along the central axis 282 Moving toward, the central axis 2282 coincides with the rotation axis 29.
  • the driving device 28 is used to drive the mounting base 23 to rotate along the arc guide rail 281 about the central axis 282 of the arc guide rail 281 and move axially along the central axis 282.
  • the driving device 28 uses the curved guide rail 281 to drive the mounting base 23 with the reflective element 22 to rotate together, the friction between the driving device 28 and the mounting base 23 is small, which is conducive to the smooth rotation of the mounting base 23 , The optical image stabilization effect of the telephoto camera 20 is improved.
  • the mounting base (not shown) is rotatably connected to the rotating shaft 23 a, and the mounting base rotates around the rotating shaft 23 a to drive the reflective element 22 a to rotate together.
  • the friction force is f1
  • the radius of the rotating shaft 23a is R1
  • the thrust force is F1
  • the radius of rotation is A.
  • the reflective element 22a only needs to rotate slightly when performing anti-shake, F1 cannot be too large, because the excessive rotation of F1 will cause the rotation of the reflective element 22a to be too large to achieve the anti-shake function; and the imaging module itself needs to be light and short to cause reflective
  • the size of the element 22a cannot be too large, so the space for the enlargement of A is also limited, so that the influence of friction cannot be further eliminated.
  • the mounting base 23 rotates along an arc-shaped guide rail 281, and the arc-shaped guide rail 281 may be formed by arranging a plurality of rolling bodies 2811.
  • the radius of the rolling element 2811 is R2.
  • f1 is not significantly changed compared to f2
  • R1 is compared to R2
  • F1 is compared to F2
  • B can not be limited by the size of the reflective element 22, and can even be more than a multiple of A. Therefore, in this case, the influence of friction on the rotation of the reflective element 22 can be greatly reduced (the size of K2 is reduced), thereby improving the rotational accuracy of the reflective element 22, and making the optical anti-shake effect of the first telephoto camera 20 more effective good.
  • the mounting base 23 includes an arc-shaped surface 231.
  • the arc-shaped surface 231 is concentrically arranged with the arc-shaped guide rail 281 and cooperates with the arc-shaped guide rail 281. In other words, the center of the curved surface 231 coincides with the center of the curved guide 281. This makes the mounting base 23 and the driving device 28 more compact.
  • the central axis 282 is located outside the telephoto camera 20. In this way, the radius R2 of the arc-shaped guide 281 is large, which can reduce the adverse effect of friction on the rotation of the mounting base 23.
  • the driving device 28 electromagnetically drives the mounting base 23 to rotate.
  • the driving device 28 is provided with a coil, and an electromagnetic sheet is fixed on the mounting base 23. After the coil is energized, the coil can generate a magnetic field to drive the movement of the electromagnetic sheet, thereby driving the mounting base 23 and the reflective element to rotate together.
  • the driving device 28 may drive the mounting base 23 by piezoelectric driving or memory alloy driving.
  • piezoelectric driving method and the memory alloy driving method please refer to the above description, which will not be repeated here.
  • the telephoto camera 20 further includes a chip circuit board 201 and a driving chip 202.
  • the chip circuit board 201 is fixed on the side of the driving mechanism 27, and the driving chip 202 is fixed on the chip circuit board 201 and the driving mechanism 27.
  • the driving chip 202 is electrically connected to the driving mechanism 27 through the chip circuit board 201.
  • the driving chip 202 is fixed to the side of the driving mechanism 27 through the chip circuit board 201, and is electrically connected to the driving mechanism 27 through the chip circuit board 201, which makes the structure between the driving chip 202 and the driving mechanism 27 more compact, which is beneficial to Reduce the volume of the telephoto camera 20.
  • the driving chip 202 is used to control the driving mechanism 27 to drive the moving element 25 to move along the optical axis of the first lens assembly 24, so that the first lens assembly 24 is focused and imaged on the first image sensor 26.
  • the driving chip 202 is used to control the driving device 28 according to the feedback data of the gyroscope 120 to drive the mounting base 23 with the reflective element 22 to rotate around the rotation axis 29.
  • the driving chip 202 is also used to control the driving device 28 to drive the mounting base 23 to move along the axis of the rotation axis 29 according to the feedback data of the gyroscope 120.
  • the driving chip 202 is also used to control the driving device 28 according to the feedback data of the gyroscope 120 to drive the mounting base 23 to rotate around the central axis 282 of the arc guide 281 along the arc guide 281 and move axially along the center axis 282.
  • the telephoto camera 20 includes a sensor circuit board 203
  • the first image sensor 26 is fixed to the sensor circuit board 203
  • the chip circuit board 201 includes a mounting portion 2011 and a connecting portion 2022
  • the mounting portion 2011 is fixed to the driving mechanism 27
  • the driving chip 202 is fixed to the mounting portion 2011, and the connecting portion 2022 connects the mounting portion 2011 and the sensor circuit board 203.
  • the driving chip 202 can be electrically connected to the first image sensor 26 through the sensor circuit board 203.
  • the connecting portion 2022 may be fixedly connected to the sensor circuit board 203 by soldering.
  • the driver chip 202 when assembling the telephoto camera 20, the driver chip 202 may be first fixed on the chip circuit board 201, and then the chip circuit board 201 with the driver chip 202 and the sensor circuit board 203 may be connected by soldering. Finally, the chip circuit board 201 with the driving chip 202 is fixed on the side of the driving mechanism 27.
  • the chip circuit board 201 may be fixedly connected to the driving mechanism 27 by soldering, bonding, or the like.
  • fixing the chip circuit board 201 on the side of the driving mechanism 27 may mean that the chip circuit board 201 is in contact with and fixed to the side of the driving mechanism 27, or may mean that the chip circuit board 201 is fixedly connected to the side of the driving mechanism 27 through other components.
  • the mounting portion 2011 is a rigid circuit board
  • the connecting portion 2022 is a flexible circuit board
  • the mounting portion 2011 is attached to the side surface of the drive mechanism 27.
  • the mounting portion 2011 is a rigid circuit board so that the mounting portion 2011 has good rigidity and is not easily deformed, which is beneficial to the fixed connection between the mounting portion 2011 and the side surface of the driving mechanism 27.
  • the mounting portion 2011 can be attached to the side surface of the drive mechanism 27 by adhesion.
  • the connection portion 2022 is a flexible circuit board so that the chip circuit board 201 is easily deformed, so that the chip circuit board 201 is easily mounted on the side of the driving mechanism 27.
  • the mounting portion 2011 may also be a flexible circuit board.
  • the housing 21 is formed with an escape hole 215, and the driving chip 202 is at least partially located in the escape hole 215 so as to be exposed to the housing 21.
  • the driving chip 202 penetrates the housing 21 so that there is an overlapping portion between the driving chip 202 and the housing 21, which makes the structure between the driving chip 202 and the housing 21 more compact, which can further reduce the volume of the telephoto camera 20.
  • the shape and size of the avoidance hole 215 match the shape and size of the driving chip 202 respectively.
  • the size of the avoidance hole 215 is slightly larger than the size of the driving chip 202, and the shape of the avoidance hole 215 is the same as the shape of the driving chip 202.
  • the escape hole 215 is formed on the side wall 214 of the housing 21. It can be understood that the escape hole 215 penetrates the inside and outside of the side wall 214. Of course, in other embodiments, the escape hole 215 may also be formed on the top wall 213 of the housing 21.
  • the telephoto camera 20 further includes a shielding cover 204 that is fixed to the chip circuit board 201 and covers the driving chip 202.
  • the shielding cover 204 can protect the driving chip 202 and prevent the driving chip 202 from being physically impacted.
  • the shielding cover 204 can also reduce the electromagnetic influence on the driving chip 202.
  • the shield 204 may be made of metal material.
  • the material of the shield 204 is stainless steel.
  • the chip circuit board 201 is fixed to the mounting portion 2011.
  • the mounting portion 2011 is preferably a rigid circuit board or a plate material combining a flexible circuit board and a reinforcement board.
  • the wide-angle camera 30 is a vertical lens module.
  • the wide-angle camera 30 may also be a periscope lens module.
  • the wide-angle camera 30 includes a second lens assembly 31 and a second image sensor 32.
  • the second lens assembly 31 is used to image light on the second image sensor 32.
  • the incident optical axis of the wide-angle camera 30 and the optical axis of the second lens assembly 31 coincide.
  • the wide-angle camera 30 may be a fixed-focus lens module. Therefore, the second lens assembly 31 has fewer lenses 241, so that the height of the wide-angle camera 30 is lower, which is beneficial to reducing the thickness of the electronic device 1000.
  • the type of the second image sensor 32 may be the same as the type of the first image sensor 26, which will not be repeated here.
  • the imaging method according to the embodiment of the present application may be used in the above electronic device 1000. Specifically, the imaging method includes the following steps:
  • the reference image P1 includes an intermediate region P11 and an edge region P12;
  • the imaging device 300 includes a first acquisition module 310, a second acquisition module 320, and a synthesis module 330.
  • step S10 may be performed by the first acquisition module 310
  • step S20 may be performed by the second acquisition module 320
  • step S30 may be performed by the synthesis module 330.
  • the first obtaining module 310 is used to obtain the image collected by the wide-angle camera 30 as the reference image P1.
  • the second acquisition module 320 is used to acquire images respectively acquired by the multiple telephoto cameras 20 as the preprocessed image P2.
  • the synthesis module 330 is used to synthesize the reference image P1 and the multiple pre-processed images P2 to obtain the target image P3.
  • the electronic device 1000 further includes a processor 10, which is used to obtain an image collected by the wide-angle camera 30 as a reference image P1; and used to obtain multiple telephoto cameras 20 to collect separately Is used as the pre-processed image P2; and used to synthesize the reference image P1 and multiple pre-processed images P2 to obtain the target image P3.
  • a processor 10 which is used to obtain an image collected by the wide-angle camera 30 as a reference image P1; and used to obtain multiple telephoto cameras 20 to collect separately Is used as the pre-processed image P2; and used to synthesize the reference image P1 and multiple pre-processed images P2 to obtain the target image P3.
  • the preprocessed image P2 captured by the telephoto camera 20 can compensate for the sharpness of the edge area P12 of the reference image P1 captured by the wide-angle camera 30.
  • the focus position P22 of the preprocessed image P2 is located in the overlapping area P21, so that the focus positions P22 of the plurality of preprocessed images P2 are approximately the same, the consistency of the synthesized target image P3 is better, and the quality of the target image P3 is improved.
  • the middle area P11 of the reference image P1 refers to the area located at the center of the reference image P1 (as shown in FIG. 13 within the dotted frame in the reference image P1), and the edge area P12 refers to the reference The area of the image P1 excluding the intermediate area P11 (the portion other than the dotted frame in FIG. 13).
  • the reference image P1 has a center point
  • the middle area P11 is an area distributed around the center point.
  • the area of the middle area P11 is 1/5-2/3 of the total area of the reference image P1.
  • the area of the intermediate area P11 is 1/5, 1/4, 1/3, or 2/3 of the total area of the reference image P1.
  • the reference image P1 is captured by the wide-angle camera 30
  • the image in the middle area P11 has higher definition and better quality
  • the image quality in the edge area P12 is worse than the image quality in the middle area P11.
  • the field of view area refers to the range of the field of view acquired by the camera corresponding to the image.
  • the size of a scene is 4*6m
  • the size of the target object in the scene is 2*3m. If the wide-angle camera 30 can capture an image of a scene, and the telephoto camera 20 can only capture an image of a target object, then the field of view area of the scene image includes the field of view area of the target object.
  • the field of view area of the plurality of preprocessed images P2 including the edge area P12 means that the field of view area of the plurality of preprocessed images P2 may cover the field of view area of the edge area P12, or The field of view areas of the edge area P12 coincide.
  • the image content after the stitching of the plurality of preprocessed images P2 includes the image content of the edge area P12 of the reference image P1. That is to say, the image after splicing a plurality of pre-processed images P2 has an image of the same shape as the image of the edge area P12.
  • the edge area P12 of the reference image P1 may include a human head image.
  • the image after the stitching of the multiple pre-processed images P2 includes a human head image, and may further include a human chest image.
  • the number of telephoto cameras 20 is four, so the number of preprocessed images P2 is also four.
  • the field of view areas of the four preprocessed images P2 extend from one of the corner positions of the field of view of the reference image P1 to the middle position of the field of view of the reference image P1.
  • the ratio of the area of the field of view area to the area of the field of view of the reference image P1 is [1/2, 2/3].
  • the ratio is, for example, 1/2, 3/5, or 2/3.
  • the ratio of the area of the field of view of each preprocessed image P2 to the area of the field of view of the reference image is 2/3.
  • the field of view areas of the four preprocessed images P2 are respectively located in the upper left area, the upper right area, the lower left area, and the lower right area of the field of view of the reference image P1.
  • the stitched image content of the four preprocessed images P2 not only has the image content of the edge area P12 of the reference image P1, but also has the image content of the middle area P11 of the reference image P1.
  • a plurality of telephoto cameras 20 can be set to face different shooting directions, so as to obtain preprocessed images P2 in different fields of view.
  • the focus position P22 of the preprocessed image P2 is located in the overlapping area P21.
  • the focus position P22 of the preprocessed image P2 has better quality such as sharpness, and each preprocessed image P2 is centered on the focus position P22
  • the image clarity and other qualities of the surrounding area are approximately the same, so that the consistency of the target image P3 obtained after synthesis is good.
  • the focus position P22 of the preprocessed image P2 is located at the position of the circle area. It should be noted that, for ease of understanding, the overlapping area P21 and the focus position P22 are shown in the processed image P2.
  • step S30 the obtained target image P3 has a high-definition quality.
  • the number of preprocessed images P2 is four
  • the images of the upper left, upper right, lower left, and lower right areas of the target image P3 are acquired by different telephoto cameras 20 respectively. Therefore, these four The image quality of the area is better, so that the quality of the target image P3 is better.
  • the image content of the target image P3 includes the background image P1 and the preprocessed image P2.
  • step S20 includes:
  • the step of controlling multiple telephoto cameras 20 to simultaneously acquire images to obtain a preprocessed image P2 may be implemented by the processor 10, or in other words, the processor 10 is used to control multiple telephoto cameras 20 to simultaneously acquire images The preprocessed image P2 is obtained.
  • multiple pre-processed images P2 can be acquired at the same time, so that images of the object at the same time can be photographed, which is convenient for post-processing such as image stitching to obtain a target image P3 with better quality.
  • the reference image P1 and the multiple pre-processed images P2 are collected simultaneously.
  • the wide-angle camera 30 and the telephoto camera 20 can be controlled to be exposed at the same time to simultaneously acquire the reference image P1 and the multiple pre-processed images P2.
  • step S20 includes:
  • step S21 and step S22 may be implemented by the processor 10.
  • the processor 10 is used to control the multiple telephoto cameras 20 to focus at the same position, and to control the multiple telephoto cameras 20 to separately acquire images to obtain the preprocessed image P2.
  • the quality of the obtained pre-processed image P2 such as sharpness is substantially the same, which is beneficial to improve the quality of the synthesized target image P3.
  • step S30 includes:
  • the processor 10 is used to synthesize a plurality of pre-processed images P2 according to the images of the overlapping area P21 to form a to-be-processed image P23; and to synthesize the to-be-processed image P23 and the reference image P1 to obtain the target image P3.
  • a plurality of pre-processed images P2 are synthesized based on the images of the overlapping area P21, so that any two pre-processed images P2 have more feature points when they are synthesized, so that the boundary portions of the two pre-processed images P2 can be better synthesized to obtain
  • the to-be-processed image P23 with better quality can further obtain the target image P3 with better quality.
  • step S31 includes:
  • a plurality of pre-processed images P2 are sequentially spliced in a predetermined direction according to the image of the overlapping area P21 to form an image to be processed P23.
  • the processor 10 is configured to sequentially splice a plurality of pre-processed images P2 in a predetermined direction according to the images of the overlapping area P21 to form a to-be-processed image P23.
  • the predetermined direction is, for example, a clockwise direction, a counterclockwise direction, or other directions.
  • four pre-processed images P2P2 are sequentially stitched in a clockwise direction to obtain a to-be-processed image P23.
  • four pre-processed images P2P2 are stitched in order from left to right to obtain an image P23 to be processed.
  • Embodiments of the present application also provide a computer-readable storage medium.
  • One or more non-volatile computer-readable storage media containing computer-executable instructions when the computer-executable instructions are executed by one or more processors 10, cause the processor 10 to execute the control method of any of the above embodiments.
  • the electronic device 1000 includes a processor 10 and a memory 60 (for example, a non-volatile storage medium) connected through a system bus 50.
  • the memory 60 stores an operating system and computer readable instructions.
  • the computer readable instructions can be executed by the processor 10 to implement the control method of any one of the above embodiments.
  • the processor 10 can be used to provide computing and control capabilities to support the operation of the entire electronic device 1000.
  • the internal memory 60 of the electronic device 1000 provides an environment for the execution of computer-readable instructions in the memory 60.
  • Any process or method description in a flowchart or otherwise described herein may be understood as representing a module, segment, or portion of code that includes one or more executable instructions for implementing specific logical functions or steps of a process , And the scope of the preferred embodiments of the present application includes additional implementations, in which the functions shown may not be in the order shown or discussed, including performing the functions in a substantially simultaneous manner or in reverse order according to the functions involved, which shall It is understood by those skilled in the art to which the embodiments of the present application belong.
  • the storage medium mentioned above may be a read-only memory, a magnetic disk or an optical disk.

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Abstract

一种成像方法，包括：获取广角摄像头(30)采集的图像作为参考图像，参考图像包括中间区域和边缘区域；获取多个长焦摄像头(20)分别采集的图像作为预处理图像，其中，多个预处理图像的视场区域包括边缘区域的视场区域，多个预处理图像的视场区域在中间区域的视场区域内具有重叠区域，预处理图像的对焦位置位于重叠区域内；合成参考图像及多个预处理图像以得到目标图像。

Description

成像方法、成像装置、电子装置及介质
优先权信息
本申请请求2018年12月20日向中国国家知识产权局提交的、专利申请号为201811563540.5的专利申请的优先权和权益，并且通过参照将其全文并入此处。
技术领域
本申请涉及成像技术领域，特别涉及一种成像方法、成像装置、电子装置及介质。
背景技术
随着手机技术的不断发展，人们对手机摄像头的要求日益提高。从最开始的单摄像头，发展到后来的双摄像头、三摄像头甚至多摄像头方案。如何利用更多的摄像头来满足更高的摄像头拍照需求，是摄像头模组研发的重要方向之一。
发明内容
本申请提供一种成像方法、成像装置、电子装置及介质。
本申请实施方式的成像方法用于电子装置，所述电子装置包括广角摄像头和多个长焦摄像头，所述成像方法包括：
获取广角摄像头采集的图像作为参考图像，所述参考图像包括中间区域和边缘区域；
获取多个长焦摄像头分别采集的图像作为预处理图像，其中，多个预处理图像的视场区域包括边缘区域的视场区域，多个预处理图像的视场区域在中间区域的视场区域内具有重叠区域，预处理图像的对焦位置位于重叠区域内；
合成参考图像及多个所述预处理图像以得到目标图像。
本申请实施方式中的成像装置用于电子装置，所述成像装置包括：
第一获取模块，用于获取广角摄像头采集的图像作为参考图像，参考图像包括中间区域和边缘区域；
第二获取模块，用于获取多个长焦摄像头分别采集的图像作为预处理图像，其中，多个预处理图像的视场区域包括所述边缘区域的视场区域，多个预处理图像的视场区域在中间区域的视场区域内具有重叠区域，预处理图像的对焦位置位于重叠区域内；
合成模块，用于合成参考图像及多个预处理图像以得到目标图像。
本申请实施方式的电子装置包括一个广角摄像头、多个长焦摄像头和处理器，处理器用于获取广角摄像头采集的图像作为参考图像，参考图像包括中间区域和边缘区域；及用于获取多个长焦摄像头分别采集的图像作为预处理图像，其中，多个预处理图像的视场区域包括边缘区域的视场区域，多个预处理图像的视场区域在中间区域的视场区域内具有重叠区域，预处理图像的对焦位置位于所述重叠区域内；以及用于合成参考图像及多个预处理图像以得到目标图像。
一个或多个包含计算机可执行指令的非易失性计算机可读存储介质，当计算机可执行指令被一个或多个处理器执行时，使得处理器执行以上成像方法。
本申请实施方式的成像方法、成像装置、电子装置及介质中，长焦摄像头拍摄的预处理图像可以补偿广角摄像头拍摄的参考图像的边缘区域的清晰度。另外，预处理图像的对焦位置位于重叠区域内，使得多个预处理图像的对焦位置大致相同，合成得到的目标图像的一致性较好，提高了目标图像的品质。本申请的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本申请的实践了解到。
附图说明
本申请的上述和/或附加的方面和优点从结合下面附图对实施方式的描述中将变得明显和容易理解，其中：
图1是本申请实施方式的电子装置的平面示意图；
图2是本申请实施方式的第一长焦摄像头的立体示意图；
图3是本申请实施方式的第一长焦摄像头的分解示意图；
图4是本申请实施方式的第一长焦摄像头的剖面示意图；
图5是本申请实施方式的第一长焦摄像头的部分剖面示意图；
图6是本申请另一实施方式的第一长焦摄像头的剖面示意图；
图7是本申请实施方式的反光元件的立体示意图。
图8是本申请实施方式的第一长焦摄像头的光线反射成像示意图；
图9是相关技术中的成像模组的结构示意图；
图10是本申请实施方式的第一长焦摄像头的结构示意图；
图11是本申请实施方式的广角摄像头的剖面示意图；
图12本申请实施方式的成像方法的流程示意图；
图13是本申请实施方式的成像方法的场景示意图；
图14是本申请实施方式的成像装置的模块示意图；
图15是本申请实施方式的电子装置的模块示意图；
图16本申请实施方式的成像方法的流程示意图；
图17本申请实施方式的成像方法的流程示意图；
图18是本申请实施方式的成像方法的场景示意图。
图19是本申请实施方式的成像方法的场景示意图。
具体实施方式
下面详细描述本申请的实施方式，所述实施方式的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的，仅用于解释本申请，而不能理解为对本申请的限制。
在相关技术中，手机等便携式电子装置配置有摄像头，摄像头的成像原理都是基于凸透镜原理。由于凸透镜成像原理本身的限制，所成的影像中心效果最好，其效果沿着自影像中心向四周逐渐变差。
请参阅图1，本申请实施方式的电子装置1000包括机壳200和摄像头组件100。摄像头组件100通过机壳200露出。
示例性的，电子装置1000可以为移动或便携式并执行无线通信的各种类型的计算机系统设备中的任何一种(图1中只示例性的示出了一种形态)。具体的，电子装置1000可以为移动电话或智能电话(例如，基于iPhone system(苹果系统)，基于Android system(安卓系统)的电话)，便携式游戏设备(例如iPhone(苹果手机))、膝上型电脑、掌上电脑(personal digital assistant，PDA)、便携式互联网设备、音乐播放器以及数据存储设备，其他手持设备以及诸如手表、入耳式耳机、吊坠、头戴式耳机等，电子装置100还可以为其他的可穿戴设备(例如，诸如电子眼镜、电子衣服、电子手镯、电子项链、电子纹身、电子设备或智能手表的头戴式设备(head mount display，HMD))。
摄像头组件100包括长焦摄像头20和广角摄像头30。长焦摄像头20的数量为多个。例如，长焦摄像头20的数量为2个、3个、4个等。本实施方式中，以长焦摄像头20的数量为4个作为示例进行描述。广角摄像头30的数量为一个。
可以理解，广角摄像头30的视场角大于长焦摄像头20的视场角。例如，广角摄像头30的视场角范围为80-110度，而长焦摄像头20的视场角范围均为10-40度。
因此，广角摄像头30的视场区域较大，而长焦摄像头20的视场区域较小。因此，长焦摄像头20对于景物的局部位置拍摄具有较佳的优势。
本实施方式中，多个长焦摄像头20和广角摄像头30呈行列式排布，如图1所示。当然，在其他实施方式中，多个长焦摄像头20和广角摄像头30可以呈任意形状排布。
长焦摄像头20可以均为立式摄像头，也可以为潜望式摄像头，广角摄像头30可以为立式摄像头。立式镜头模组指的是镜头模组的光轴为一条直线，或者说，入射光沿着一直线光轴的方向传导至镜头模组的感光器件上。本实施方式中，以长焦摄像头20为潜望式摄像头为例做进一步描述。
请参阅图2-4，本实施方式中，长焦摄像头20包括外壳21、反光元件22、安装座23、第一镜片组件24、运动元件25、第一图像传感器26和驱动机构27。
反光元件22、安装座23、第一镜片组件24、运动元件25均设置在外壳21内。反光元件22设置 在安装座23上，第一镜片组件24固定在运动元件25上。运动元件25设置在第一图像传感器26一侧。进一步地，运动元件25位于反光元件22及第一图像传感器26之间。
驱动机构27连接运动元件25与外壳21。入射光进入外壳21后，经过反光元件22转向，然后透过第一镜片组件24到达第一图像传感器26，从而使得第一图像传感器26获得外界图像。驱动机构27用于驱动运动元件25沿第一镜片组件24的光轴移动。
外壳21大致呈方块形，外壳21具有进光口211，入射光从进光口211进入长焦摄像头20内。也就是说，反光元件22用于将从进光口211入射的入射光转向后并经第一镜片组件24后传至第一图像传感器26以使第一图像传感器26感测长焦摄像头20外部的入射光。
可以理解，进光口211通过通孔11露出以使外界光线经过通孔11后从进光口211进入长焦摄像头20内。
具体地，请参图3，外壳21包括顶壁213和侧壁214。侧壁214自顶壁213的侧边2131延伸形成。顶壁213包括相背的两个侧边2131，侧壁214的数量为两个，每个侧壁214自对应的一个侧边2131延伸，或者说，侧壁214分别连接顶壁213相背的两侧。进光口211形成于顶壁213。
反光元件22为棱镜或平面镜。更多的，请参阅图4与图7，反光元件22具有入光面222、背光面224、反光面226和出光面228。入光面222靠近且朝向进光口211。背光面224远离进光口211且与入光面222相背。反光面226连接入光面222及背光面224。出光面228连接入光面222及背光面224。出光面228朝向第一图像传感器26。反光面226相对于入光面222倾斜设置。出光面228与反光面226相背设置。
具体的，光线的转换过程中，光线穿过进光口211并由入光面222进入反光元件22中，再经由反光面226反射，最后从出光面228反射出反光元件22，完成光线转换的过程，而背光面224与安装座23固定设置，以使反光元件22在保持稳定。
因此，请参图8，本申请实施方式的反光元件22相对于相关技术中的反光元件切除了远离进光口的棱角，这样不仅没有影响反光元件22的反射光线的效果，还降低了反光元件22的整体厚度。
请参阅图4，在某些实施方式中，反光面226相对于入光面222的角度α呈45度倾斜。如此，使入射的光线更好的反射与转换，具备较好的光线转换效果。
反光元件22可以采用玻璃、塑料等透光性比较好的材料制成。在一个实施方式中，可以在反光元件22的其中一个表面涂布银等反光材料以反射入射光。
安装座23用于安装反光元件22，或者说，安装座23为反光元件22的载体，反光元件22固定在安装座23上。这样使得反光元件22的位置可以确定，有利于反光元件22反射或折射入射光。反光元件22可以采用粘胶粘接固定在安装座23上以实现与安装座23固定连接。
具体地，本实施方式中，安装座23设置有限位结构232，限位结构232连接反光元件22以限制反光元件22在安装座23上的位置。
如此，限位结构232限制反光元件22在安装座23上的位置，使得反光元件22在受到撞击的情况下不会发生位置偏移，有利于长焦摄像头20正常使用。
可以理解，在一个例子中，反光元件22通过粘接的方式固定在安装座23上，如果省略限位结构232，那么，长焦摄像头20受到冲击时，如果反光元件2222与安装座23之间的粘接力不足，反光元件22容易从安装座23上脱落。
本实施方式中，安装座23形成有安装槽233，反光元件22设置在安装槽233中，限位结构232设置在安装槽233的边缘并抵靠反光元件22。
如此，安装槽233可以使得反光元件22容易安装在安装座23上。限位结构232设置在安装槽233的边缘并抵靠反光元件22的边缘，这样不仅可以限制反光元件22的位置，还不会妨碍反光元件22将入射光发射至第一图像传感器26。
进一步地，限位结构232包括自安装槽233的边缘凸出的凸起234，凸起234抵靠出光面228的边缘。由于反光元件22通过反光面226安装在安装座23上，而出光面228与反光面226相背设置。因此，反光元件22在受到冲击时更加容易朝向出光面228的一侧发生位置。而本实施方式中，如此，限位结构232抵靠出光面228的边缘不仅可以防止反光元件22向出光面228一侧位移，还可以保证光线从出光面228正常出光。
当然，在其他实施方式中，限位结构232可以包括其他结构，只要能够限制反光元件22的位置即可。例如，限位结构232形成有卡槽，反光元件22形成有限位柱，所述限位柱卡合在卡槽中从而限制反光元件22的位置。
在某些实施方式中，凸起234呈条状并沿出光面228的边缘延伸。如此，凸起234与出光面228的边缘的接触面积大，使得反光元件22可以更加稳固地位于安装座23。
当然，在其他实施方式中，凸起234也可以呈块状等其他结构。
请参再次参阅图3，在一个例子中，安装座23可活动设置在外壳21内，安装座23能够相对于外壳21转动以调整反光元件22将入射光转向的方向。
安装座23可以带动反光元件22一起朝向长焦摄像头20的抖动的反方向转动，从而补偿进光口211的入射光的入射偏差，实现光学防抖的效果。
第一镜片组件24收容于运动元件25内，进一步地，第一镜片组件24设置在反光元件22和第一图像传感器26之间。第一镜片组件24用于将入射光成像在第一图像传感器26上。这样使得第一图像传感器26可以获得品质较佳的图像。
第一镜片组件24沿着其光轴整体移动时可以在第一图像传感器26上成像，从而实现长焦摄像头20对焦。第一镜片组件24包括多个镜片241，当至少一个镜片241移动时，第一镜片组件24的整体焦距改变，从而实现长焦摄像头20变焦的功能，更多的，由驱动机构27驱动运动元件25在外壳21中运动以达到变焦目的。
在图4的示例中，在某些实施方式中，运动元件25呈筒状，第一镜片组件24中的多个镜片241沿运动元件25的轴向间隔固定在运动元件25内。如图6的示例中,运动元件25包括两个夹片252，两个夹片252将镜片241夹设在两个夹片252之间。
可以理解，由于运动元件25用于固定设置多个镜片241，所需运动元件25的长度尺寸较大，运动元件25可以为圆筒状、方筒状等具备较一定腔体的形状，如此运动元件25呈筒装可更好的设置多个镜片241，并且可更好的保护镜片241于腔体内，使镜片241不易发生晃动。
另外，在图6的示例中，运动元件25将多个镜片241夹持于两个夹片252之间，既具备一定的稳定性，也可降低运动元件25的重量，可以降低驱动机构27驱动运动元件25所需的功率，并且运动元件25的设计难度也较低，镜片241也较易设置于运动元件25上。
当然，运动元件25不限于上述提到的筒状与两个夹片252，在其他的实施方式中，运动元件25如可包括三片、四片等更多的夹片252形成更稳固的结构，或一片夹片252这样更为简单的结构；抑或为矩形体、圆形体等具备腔体以容置镜片241的各种规则或不规则的形状。在保证成像模组10正常成像和运行的前提下，具体选择即可。
第一图像传感器26可以采用互补金属氧化物半导体(complementary metal oxide semiconductor，CMOS)感光元件或者电荷耦合元件(charge-coupled device，CCD)感光元件。
在某些实施方式中，驱动机构27为电磁驱动机构、压电驱动机构或记忆合金驱动机构。
具体地，电磁驱动机构中包括磁场与导体，如果磁场相对于导体运动，在导体中会产生感应电流，感应电流使导体受到安培力的作用，安培力使导体运动起来，此处的导体为电磁驱动机构中带动运动元件25移动的部分；压电驱动机构，基于压电陶瓷材料的逆压电效应：如果对压电材料施加电压，则产生机械应力，即电能与机械能之间发生转换，通过控制其机械变形产生旋转或直线运动，具有结构简单、低速的优点。
记忆合金驱动机构的驱动基于形状记忆合金的特性：形状记忆合金是一种特殊的合金，一旦使它记忆了任何形状，即使产生变形，但当加热到某一适当温度时，它就能恢复到变形前的形状，以此达到驱动的目的，具有变位迅速、方向自由的特点。
请再次参阅图4，进一步地，长焦摄像头20还包括驱动装置28，驱动装置28用于驱动带有反光元件22的安装座23绕转动轴线29转动。驱动装置28用于驱动安装座23沿转动轴线29的轴向移动。转动轴线29垂直于进光口211的光轴及第一图像传感器26的感光方向，从而使得长焦摄像头20实现进光口211的光轴及转动轴线29的轴向上的光学防抖。
如此，由于反光元件22的体积较镜筒的较小，驱动装置28驱动安装座23在两个方向上运动，不仅可以实现长焦摄像头20在两个方向的光学防抖效果，还可以使得长焦摄像头20的体积较小。
请参图3-图4，为了方便描述，将长焦摄像头20的宽度方向定义为X向，高度方向定义为Y向，长度方向定义为Z向。由此，进光口211的光轴为Y向，第一图像传感器26的感光方向为Z向，转动轴线29的轴向为X向。
驱动装置28驱动安装座23转动，从而使得反光元件22绕X向转动，以使长焦摄像头20实现Y向光学防抖的效果。另外，驱动装置28驱动安装座23沿转动轴线29的轴向移动，从而使得长焦摄像头20实现X向光学防抖的效果。另外，第一镜片组件24可以沿着Z向以实现第一镜片组件24在第一图像传感器26上对焦。
具体地，反光元件22绕X向转动时，反光元件22反射的光线在Y向上移动，从而使得第一图像传感器26在Y向上形成不同的图像以实现Y向的防抖效果。反光元件22沿着X向移动时，反光元件22反射的光线在X向上移动，从而使得第一图像传感器26在X向上形成不同的图像以实现X向的防抖效果。
在某些实施方式中，驱动装置28形成有弧形导轨281，驱动装置28用于驱动安装座23沿着弧形导轨281绕弧形导轨281的中心轴线282转动及沿着中心轴线282的轴向移动，中心轴线2282与转动轴线29重合。
可以理解，驱动装置28用于驱动安装座23沿着弧形导轨281绕弧形导轨281的中心轴线282转动及沿着中心轴线282的轴向移动。
如此，由于驱动装置28采用弧形导轨281的方式驱动带有反光元件22的安装座23一并转动，使得驱动装置28与安装座23之间的摩擦力较小，有利于安装座23转动平稳，提高了长焦摄像头20的光学防抖效果。
具体地，请参图9，在相关技术中，安装座(图未示)与转轴23a转动连接，安装座绕着转轴23a转动以带动反光元件22a一并转动。假定摩擦力为f1，转轴23a半径为R1，推力为F1，转动半径为A。那么摩擦力转矩与推力转矩比值K1为K1＝f1R1/F1A。由于反光元件22a在进行防抖时仅需要轻微转动，故F1不能过大，因为F1过大会导致反光元件22a的转动幅度过大，无法实现防抖功能；而成像模组本身需要轻薄短小导致反光元件22a尺寸不能太大，因此A的变大空间也有限，从而导致摩擦力的影响无法进一步消除。
请参图10，而本申请中，安装座23沿着弧形导轨281转动，弧形导轨281可以由多个滚动体2811排列形成。滚动体2811的半径为R2。此时，摩擦力转矩和转动转矩的比例K2为K2＝f2R2/F2B，在f1相较于f2、R1相较于R2、F1相较于F2均不发生大幅变化的情况下，由于采用轨道式的摆动方式进行转动，对应的转动半径变成B，而B可以不受反光元件22尺寸的限制，甚至做到A的数倍以上。故在这种情况下，摩擦力对反光元件22转动的影响可以极大的降低(K2的大小降低)，从而改善反光元件22的转动精度，使得第一长焦摄像头20的光学防抖效果较佳。
请参图4，在某些实施方式中，安装座23包括弧形面231，弧形面231与弧形导轨281同心设置且与弧形导轨281配合。或者说，弧形面231的中心与弧形导轨281的中心重合。这样使得安装座23与驱动装置28配合的更加紧凑。
在某些实施方式中，中心轴线282位于长焦摄像头20外。如此，弧形导轨281的半径R2较大，这样可以减小摩擦力对安装座23转动的不良影响。
在某些实施方式中，驱动装置28通过电磁的方式驱动安装座23转动。在一个例子中，驱动装置28设置有线圈，安装座23上固定有电磁片，在线圈通电后，线圈可以产生磁场以驱动电磁片运动，从而带动安装座23及反光元件一起转动。
当然，在其他实施方式中，驱动装置28可以通过压电驱动的方式或记忆合金驱动的方式驱动安装座23运动。压电驱动的方式和记忆合金驱动的方式请参上述描述，在此不再赘述。
请再次参阅图2-图5，长焦摄像头20还包括芯片电路板201和驱动芯片202，芯片电路板201固定在驱动机构27的侧面，驱动芯片202固定在芯片电路板201与驱动机构27相背的一面，驱动芯片202通过芯片电路板201与驱动机构27电性连接。
如此，驱动芯片202通过芯片电路板201固定在驱动机构27的侧面，并且通过芯片电路板201与驱动机构27电性连接，这样使得驱动芯片202与驱动机构27之间的结构更加紧凑，有利于降低长焦摄像头20的体积。
具体地，驱动芯片202用于控制驱动机构27驱动运动元件25沿第一镜片组件24的光轴移动，以使第一镜片组件24在第一图像传感器26上对焦成像。驱动芯片202用于根据所述陀螺仪120的反馈数据控制驱动装置28驱动带有反光元件22的安装座23绕转动轴线29转动。驱动芯片202还用于根据所述陀螺仪120的反馈数据控制驱动装置28驱动安装座23沿转动轴线29的轴向移动。
驱动芯片202还用于根据所述陀螺仪120的反馈数据控制驱动装置28驱动安装座23沿着弧形导轨281绕弧形导轨281的中心轴线282转动及沿着中心轴线282的轴向移动。
在某些实施方式中，长焦摄像头20包括传感器电路板203，第一图像传感器26固定在传感器电路板203，芯片电路板201包括安装部2011和连接部2022，安装部2011固定在驱动机构27的侧面，驱动芯片202固定在安装部2011，连接部2022连接安装部2011及传感器电路板203。
如此，驱动芯片202可以通过传感器电路板203与第一图像传感器26电性连接。具体地，连接部2022可以通过焊接的方式与传感器电路板203固定连接。
在一个例子中，在组装长焦摄像头20时，可以先将驱动芯片202固定在芯片电路板201上，然后将带有驱动芯片202的芯片电路板201与传感器电路板203通过焊接的方式连接，最后将带有驱动芯片202的芯片电路板201固定在驱动机构27的侧面。
芯片电路板201可以通过焊接、粘接等方式与驱动机构27固定连接。
需要指出的是，芯片电路板201固定在驱动机构27的侧面可以指芯片电路板201与驱动机构27的侧面接触固定，也可以指芯片电路板201通过其他元件与驱动机构27的侧面固定连接。
本实施方式中，安装部2011为刚性电路板，连接部2022为柔性电路板，安装部2011贴合在驱动机构27的侧面。
如此，安装部2011为刚性电路板使得安装部2011具有较好的刚度，不易变形，有利于安装部2011与驱动机构27的侧面固定连接。安装部2011可以通过粘接的方式贴合在驱动机构27的侧面。另外，连接部2022为柔性电路板使得芯片电路板201容易变形，使得芯片电路板201容易安装在驱动机构27的侧面。
当然，在其他实施方式中，安装部2011也可以为柔性电路板。
在某些实施方式中，外壳21形成有避让孔215，驱动芯片202至少部分位于避让孔215中，从而露出于外壳21。如此，驱动芯片202穿设外壳21使得驱动芯片202与外壳21之间存在重叠的部分，这样使得驱动芯片202与外壳21之间的结构更加紧凑，可以进一步减小长焦摄像头20的体积。
可以理解，当驱动机构27的侧面与外壳21之间具有间隙时，驱动芯片202部分位于避让孔215中。
较佳地，避让孔215的形状、尺寸分别与驱动芯片202的形状、尺寸配合。例如，避让孔215的尺寸略大于驱动芯片202的尺寸，避让孔215的形状与驱动芯片202的形状相同。
本实施方式中，避让孔215形成于外壳21的侧壁214。可以理解，避让孔215贯穿侧壁214的内外侧。当然，在其他实施方式中，避让孔215也可以形成于外壳21的顶壁213。
在一个实施方式中，长焦摄像头20还包括屏蔽罩204，屏蔽罩204固定在芯片电路板201且罩设驱动芯片202。如此，屏蔽罩204可以保护驱动芯片202，防止驱动芯片202受到物理冲击。另外，屏蔽罩204还可以减少驱动芯片202受到的电磁影响。
屏蔽罩204可以采用金属材料制成。例如，屏蔽罩204的材料为不锈钢。本实施方式中，芯片电路板201固定在安装部2011，此时，安装部2011较佳地为刚性电路板或为柔性电路板与补强板结合的板材。
请参阅图11，本实施方式中，广角摄像头30为立式镜头模组，当然，在其他实施方式中，广角摄像头30也可以潜望式镜头模组。
广角摄像头30包括第二镜片组件31和第二图像传感器32，第二镜片组件31用于将光线在第二图像传感器32上成像，广角摄像头30的入射光轴与第二镜片组件31的光轴重合。
本实施方式中，广角摄像头30可以为定焦镜头模组，因此，第二镜片组件31的镜片241较少，以使广角摄像头30高度较低，有利于减小电子装置1000的厚度。第二图像传感器32的类型可与第一图像传感器26的类型一样，在此不再赘述。
请参阅图12及图13，本申请实施方式的成像方法可用于以上的电子装置1000，具体地，成像方法包括以下步骤：
S10，获取广角摄像头30采集的图像作为参考图像P1，参考图像P1包括中间区域P11和边缘区域P12；
S20，获取多个长焦摄像头20分别采集的图像作为预处理图像P2，其中，多个预处理图像P2的视场区域包括边缘区域P12的视场区域，多个预处理图像P2的视场区域在中间区域P11的视场区域内具有重叠区域P21(例如图13中预处理图像P2中虚线方框所示的区域)，预处理图像的对焦位置P22位于重叠区域P21内；
S30，合成参考图像P1及多个预处理图像P2以得到目标图像P3。
请参阅图14，本申请公开了一种成像装置300，成像装置300包括第一获取模块310、第二获取模块320和合成模块330。以上成像方法中的步骤S10可以有第一获取模块310执行，步骤S20可以有第二获取模块320执行，步骤S30可以由合成模块330执行。
或者说，第一获取模块310用于获取广角摄像头30采集的图像作为参考图像P1。第二获取模块320用于获取多个长焦摄像头20分别采集的图像作为预处理图像P2。合成模块330用于合成参考图像P1及多个预处理图像P2以得到目标图像P3。
请结合图15，在某些实施方式中，电子装置1000还包括处理器10，处理器10用于获取广角摄像头30采集的图像作为参考图像P1；及用于获取多个长焦摄像头20分别采集的图像作为预处理图像P2；及用于合成参考图像P1及多个预处理图像P2以得到目标图像P3。
本申请实施方式的成像方法、成像装置300及电子装置1000中，长焦摄像头20拍摄的预处理图像P2可以补偿广角摄像头30拍摄的参考图像P1的边缘区域P12的清晰度。另外，预处理图像P2的对焦位置P22位于重叠区域P21内，使得多个预处理图像P2的对焦位置P22大致相同，合成得到的目标图像P3的一致性较好，提高了目标图像P3的品质。
具体地，在步骤S10中，参考图像P1的中间区域P11指的是位于参考图像P1中央位置的区域(如图13中参考图像P1中的虚线框以内的部分)，边缘区域P12指的是参考图像P1除中间区域P11外的区域(图13中虚线框以外的部分)。在一个例子中，参考图像P1具有中心点，中间区域P11为以中心点为中心向四周分布的区域。中间区域P11的面积为参考图像P1的总面积的1/5-2/3。例如，中间区域P11的面积为参考图像P1的总面积的1/5、1/4、1/3或2/3等。
由于参考图像P1由广角摄像头30拍摄获取，因此，中间区域P11的图像的清晰度较高，品质较佳，而边缘区域P12的图像品质差于中间区域P11的图像品质。
在步骤S20中，视场区域指的是与图像对应的摄像头获取的视场范围。例如，一个景物的尺寸为4*6m，景物中的目标物体的尺寸为2*3m。如果广角摄像头30可以拍摄景物的图像，而长焦摄像头20只能拍摄目标物体的图像，那么，景物的图像的视场区域包括目标物体的图像的视场区域。
本实施方式中，多个预处理图像P2的视场区域包括边缘区域P12的视场区域指的是，多个预处理图像P2的视场区域可以覆盖边缘区域P12的视场区域，也可以与边缘区域P12的视场区域重合。由此，多个预处理图像P2拼接后的图像内容包括参考图像P1的边缘区域P12的图像内容。也即是说，多个预处理图像P2拼接后的图像具有与边缘区域P12的图像相同形状的图像。
例如，参考图像P1包括人体图像时，参考图像P1的边缘区域P12可包括人体头部图像，此时，多个预处理图像P2拼接后的图像包括人体头部图像，进一步可以包括人体胸部图像。
本实施方式中，长焦摄像头20的数量为4个，因此，预处理图像P2的数量也为四个。在一个例子中，四个预处理图像P2的视场区域分别自参考图像P1的视场区域的其中一个边角位置向参考图像P1的视场区域的中间位置延伸，每个预处理图像P2的视场区域的面积与参考图像P1的视场区域的面积的比值范围为[1/2,2/3]。比值例如1/2、3/5或2/3等。本实施方式中，每个预处理图像P2的视场区域的面积与参考图像的视场区域的面积的比值为2/3。
本实施方式中，四个预处理图像P2的视场区域分别位于参考图像P1的视场区域的左上区域、右上区域、左下区域及右下区域。此时，四个预处理图像P2的拼接后的图像内容不仅具有参考图像P1的边缘区域P12的图像内容，还具有参考图像P1的中间区域P11的图像内容。
在步骤S20中，可以通过设置多个长焦摄像头20分别朝向不同的拍摄方向，从而得到不同视场区域的预处理图像P2。预处理图像P2的对焦位置P22位于重叠区域P21内，此时，可以理解，预处理图像P2的对焦位置P22的清晰度等品质较佳，并且每个预处理图像P2以对焦位置P22为中心的周围区 域的图像清晰度等品质大致相同，从而使得合成后得到目标图像P3的一致性较好。
如图13的示例中，预处理图像P2的对焦位置P22位于圆圈区域的位置。需要指出的是，为了方便理解，重叠区域P21、对焦位置P22均在处理图像P2中示出。
在步骤S30中，得到的目标图像P3具有清晰度较高的品质。在一个例子中，预处理图像P2的数量为四个时，目标图像P3的左上、右上、左下以及右下这四个区域的图像由于分别由不同的长焦摄像头20获取，因此，这四个区域的图像品质较佳，从而使得目标图像P3的品质较佳。
需要指出的是，目标图像P3的图像内容包括背景图像P1及预处理图像P2。
在某些实施方式中，步骤S20包括：
控制多个长焦摄像头20同时采集图像以得到预处理图像P2。
在某些实施方式中，步骤控制多个长焦摄像头20同时采集图像以得到预处理图像P2可以由处理器10实现，或者说，处理器10用于控制多个长焦摄像头20同时采集图像以得到预处理图像P2。
如此，多个预处理图像P2可以同时获取，从而可以拍摄物体在同一时刻形态下的图像，方便后期图像拼接等处理以获取品质较佳的目标图像P3。进一步地，较佳地，参考图像P1以及多个预处理图像P2同时采集。或者说，可以控制广角摄像头30及长焦摄像头20同时曝光以同时采集得到参考图像P1及多个预处理图像P2。
请参阅图16，在某些实施方式中，步骤S20包括：
S21，控制多个长焦摄像头20在同一位置对焦；
S22，控制多个长焦摄像头20分别采集图像以得到预处理图像P2。
在某些实施方式中，步骤S21及步骤S22可以由处理器10实现。或者说，处理器10用于控制多个长焦摄像头20在同一位置对焦，以及用于控制多个长焦摄像头20分别采集图像以得到预处理图像P2。
如此，获得的预处理图像P2的清晰度等品质大致相同，有利于提高合成得到的目标图像P3的品质。
请参阅图17，在某些实施方式中，步骤S30包括：
S31，根据重叠区域P21的图像合成多个预处理图像P2以形成待处理图像P23；
S32，合成待处理图像P23及参考图像P1以得到目标图像P3。
在某些实施方式中，处理器10用于根据重叠区域P21的图像合成多个预处理图像P2以形成待处理图像P23；以及用于合成待处理图像P23及参考图像P1以得到目标图像P3。
如此，根据重叠区域P21的图像合成多个预处理图像P2，使得任意的两个预处理图像P2合成时的特征点较多，这样可以较好地合成两个预处理图像P2的边界部分，得到品质较佳的待处理图像P23，进而可以获得品质较佳的目标图像P3。
在某些实施方式中，步骤S31包括：
根据重叠区域P21的图像按预定方向依次拼接多个预处理图像P2以形成待处理图像P23。
在某些实施方式中，处理器10用于根据重叠区域P21的图像按预定方向依次拼接多个预处理图像P2以形成待处理图像P23。
具体地，预定方向例如为顺时针方向、逆时针方向或者其他方向。如图18的示例中，四个预处理图像P2P2沿顺时针的方向依次拼接得到待处理图像P23。在图19的示例中，四个预处理图像P2P2从左向右依次拼接以得到待处理图像P23。
如此，待处理图像P23的处理效率较高，可以降低电子装置1000的功耗。
本申请实施方式还提供了一种计算机可读存储介质。一个或多个包含计算机可执行指令的非易失性计算机可读存储介质，当计算机可执行指令被一个或多个处理器10执行时，使得处理器10执行上述任一实施方式的控制方法。
如图15所示，电子装置1000包括通过系统总线50连接的处理器10和存储器60(例如为非易失性存储介质)。其中，存储器60存储有操作系统和计算机可读指令。该计算机可读指令可被处理器10执行，以实现上述任意一项实施方式的控制方法。处理器10可用于提供计算和控制能力，支撑整个电子装置1000的运行。电子装置1000的内存储器60为存储器60中的计算机可读指令运行提供环境。
在本说明书的描述中，参考术语“一个实施方式”、“某些实施方式”、“示意性实施方式”、“示例”、“具体示例”、或“一些示例”等的描述意指结合所述实施方式或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施方式或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同 的实施方式或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。
流程图中或在此以其他方式描述的任何过程或方法描述可以被理解为，表示包括一个或更多个用于实现特定逻辑功能或过程的步骤的可执行指令的代码的模块、片段或部分，并且本申请的优选实施方式的范围包括另外的实现，其中可以不按所示出或讨论的顺序，包括根据所涉及的功能按基本同时的方式或按相反的顺序，来执行功能，这应被本申请的实施例所属技术领域的技术人员所理解。
本技术领域的普通技术人员可以理解实现上述实施例方法携带的全部或部分步骤是可以通过程序来指令相关的硬件完成，所述的程序可以存储于一种计算机可读存储介质中，该程序在执行时，包括方法实施例的步骤之一或其组合。
上述提到的存储介质可以是只读存储器，磁盘或光盘等。
尽管已经示出和描述了本申请的实施方式，本领域的普通技术人员可以理解：在不脱离本申请的原理和宗旨的情况下可以对这些实施方式进行多种变化、修改、替换和变型，本申请的范围由权利要求及其等同物限定。

Claims (20)

  1. 一种成像方法，用于电子装置，所述电子装置包括广角摄像头和多个长焦摄像头，其特征在于，所述成像方法包括：
    获取所述广角摄像头采集的图像作为参考图像，所述参考图像包括中间区域和边缘区域；
    获取所述多个长焦摄像头分别采集的图像作为预处理图像，其中，多个所述预处理图像的视场区域包括所述边缘区域的视场区域，多个所述预处理图像的视场区域在所述中间区域的视场区域内具有重叠区域，所述预处理图像的对焦位置位于所述重叠区域内；
    合成所述参考图像及多个所述预处理图像以得到目标图像。
  2. 如权利要求1所述的成像方法，其特征在于，所述预处理图像的数量为四个，四个所述预处理图像的视场区域分别自所述参考图像的视场区域的其中一个边角位置向所述参考图像的视场区域的中间位置延伸，每个所述预处理图像的视场区域的面积与所述参考图像的视场区域的面积的比值范围为1/2-2/3。
  3. 如权利要求1所述的成像方法，其特征在于，所述获取多个长焦摄像头分别采集的图像作为预处理图像，包括：
    控制多个长焦摄像头在同一位置对焦；
    控制所述多个长焦摄像头分别采集图像以得到所述预处理图像。
  4. 如权利要求1所述的成像方法，其特征在于，所述获取多个长焦摄像头分别采集的图像作为预处理图像，包括：
    控制多个长焦摄像头同时采集图像以得到所述预处理图像。
  5. 如权利要求1所述的成像方法，其特征在于，所述合成所述参考图像及多个所述预处理图像以得到目标图像，包括：
    根据所述重叠区域的图像合成多个所述预处理图像以形成待处理图像；
    合成所述待处理图像及所述参考图像以得到所述目标图像。
  6. 如权利要求5所述的成像方法，其特征在于，所述根据所述重叠区域的图像合成多个所述预处理图像以形成待处理图像，包括：
    根据所述重叠区域的图像按预定方向依次拼接多个所述预处理图像以形成所述待处理图像。
  7. 如权利要求1所述的成像方法，其特征在于，所述中间区域的面积为所述参考图像的总面积的1/5-2/3。
  8. 一种成像装置，用于电子装置，其特征在于，所述成像装置包括：
    第一获取模块，用于获取广角摄像头采集的图像作为参考图像，所述参考图像包括中间区域和边缘区域；
    第二获取模块，用于获取多个长焦摄像头分别采集的图像作为预处理图像，其中，多个所述预处理图像的视场区域包括所述边缘区域的视场区域，多个所述预处理图像的视场区域在所述中间区域的视场区域内具有重叠区域，所述预处理图像的对焦位置位于所述重叠区域内；
    合成模块，用于合成所述参考图像及多个所述预处理图像以得到目标图像。
  9. 一种电子装置，其特征在于，包括一个广角摄像头、多个长焦摄像头和处理器，所述处理器用于用于获取广角摄像头采集的图像作为参考图像，所述参考图像包括中间区域和边缘区域；及用于获取多个长焦摄像头分别采集的图像作为预处理图像，其中，多个所述预处理图像的视场区域包括所述边缘区域的视场区域，多个所述预处理图像的视场区域在所述中间区域的视场区域内具有重叠区域，所述预处理图像的对焦位置位于所述重叠区域内；以及用于合成所述参考图像及多个所述预处理图像以得到目标图像。
  10. 如权利要求9所述的电子装置，其特征在于，所述预处理图像的数量为四个，四个所述预处理图像的视场区域分别自所述参考图像的视场区域的其中一个边角位置向所述参考图像的视场区域的中间位置延伸，每个所述预处理图像的视场区域的面积与所述参考图像的视场区域的面积的比值范围为1/2-2/3。
  11. 如权利要求9所述的电子装置，其特征在于，所述处理器用于控制多个长焦摄像头在同一位置对焦；及用于控制所述多个长焦摄像头分别采集图像以得到所述预处理图像。
  12. 如权利要求9所述的电子装置，其特征在于，所述处理器用于控制多个长焦摄像头同时采集图像以得到所述预处理图像。
  13. 如权利要求9所述的电子装置，其特征在于，所述处理器用于根据所述重叠区域的图像合成多个所述预处理图像以形成待处理图像，以及用于合成所述待处理图像及所述参考图像以得到所述目标图像。
  14. 如权利要求13所述的电子装置，其特征在于，所述处理器用于根据所述重叠区域的图像按预定方向依次拼接多个所述预处理图像以形成所述待处理图像。
  15. 如权利要求9所述的电子装置，其特征在于，所述中间区域的面积为所述参考图像的总面积的1/5-2/3。
  16. 如权利要求8所述的电子装置，其特征在于，所述第一长焦摄像头的数量为4个。
  17. 如权利要求8所述的电子装置，其特征在于，所述第一长焦摄像头包括：
    外壳，所述外壳具有进光口；和
    均设置在所述外壳内的反光元件、安装座和图像传感器，所述反光元件用于将从所述进光口入射的入射光转向后传至所述图像传感器以使所述图像传感器感测所述成像模组外部的所述入射光；
    所述反光元件设置在所述安装座上，所述安装座设置有限位结构，所述限位结构连接所述反光元件以限制所述反光元件在所述安装座上的位置。
  18. 如权利要求17所述的电子装置，其特征在于，所述安装座形成有安装槽，所述反光元件设置在所述安装槽中，所述限位结构设置在所述安装槽的边缘并抵靠所述反光元件的边缘。
  19. 如权利要求18所述的电子装置，其特征在于，所述反光元件具有朝向所述进光口的入光面和连接所述入光面的出光面，所述出光面朝向所述图像传感器，所述限位结构包括自所述安装槽的边缘凸出的凸起，所述凸起抵靠所述出光面的边缘。
  20. 一个或多个包含计算机可执行指令的非易失性计算机可读存储介质，当所述计算机可执行指令被一个或多个处理器执行时，使得所述处理器执行权利要求1-7中任一项所述成像方法。
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