WO2020093683A1 - 印刷电路板及包含该印刷电路板的显示器的连接结构 - Google Patents

印刷电路板及包含该印刷电路板的显示器的连接结构 Download PDF

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Publication number
WO2020093683A1
WO2020093683A1 PCT/CN2019/088367 CN2019088367W WO2020093683A1 WO 2020093683 A1 WO2020093683 A1 WO 2020093683A1 CN 2019088367 W CN2019088367 W CN 2019088367W WO 2020093683 A1 WO2020093683 A1 WO 2020093683A1
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area
printed circuit
switch
circuit board
connection
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English (en)
French (fr)
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黄笑宇
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Chongqing HKC Optoelectronics Technology Co Ltd
Chongqing Advance Display Technology Research
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Chongqing HKC Optoelectronics Technology Co Ltd
Chongqing Advance Display Technology Research
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Priority to US17/272,655 priority Critical patent/US11792934B2/en
Publication of WO2020093683A1 publication Critical patent/WO2020093683A1/zh
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13458—Terminal pads
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136286—Wiring, e.g. gate line, drain line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H05K1/0259—Electrostatic discharge [ESD] protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/073—High voltage adaptations
    • H05K2201/0738—Use of voltage responsive materials, e.g. voltage switchable dielectric or varistor materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09409—Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10053—Switch
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10174—Diode

Definitions

  • the present application relates to a printed circuit board, in particular to a connection structure of a printed circuit board and a display including the printed circuit board.
  • TFT-LCD Thin Film Transistor Liquid Crystal
  • INF information technology industry
  • COF chip on Film
  • the fanout Fanout design involved in the current PCB design is mainly implemented by PCB engineers manually, which makes even the same packaged device PCB design engineers also need to manually complete the corresponding Fanout design one by one, and, for a PCB design
  • the fanout fanout design form designed by the engineer When the engineer designs another PCB, the fanout fanout design form originally designed can be used to meet the demand, and it also needs to be redesigned. Therefore, there is no fanout fanout design sharing mechanism.
  • the fan-out fanout design involved in the PCB design will have a lower efficiency, which in turn will cause the efficiency of the entire PCB design to be greatly reduced.
  • the purpose of the present application is to provide a printed circuit board, in particular to provide a connection structure between the printed circuit board and the display, so that the gold finger area on the existing printed circuit board (PCB) is connected to the connection pad Combine.
  • This method can avoid the disadvantages of the need to additionally set a contact pad (Contact Pad) area in the existing design, save the area of the printed circuit board (PCB), and thereby reduce the product cost.
  • the application further includes the arrangement of diodes and switches (MOS), which can avoid the electrostatic discharge (ESD) of the fanout area (Fanout Area) from damaging the components on the printed circuit board (PCB), so as to improve the yield of the product.
  • MOS diodes and switches
  • a printed circuit board includes: several bonding pad areas for electrically connecting to a display; and several dummy pad areas located in the several bonding areas for grounding; There is a connection pad area between the dummy pad areas, which is electrically connected to the bonding pad areas.
  • Another object of the present application is to provide a display connection structure, including: a display area including a fanout area (Fanout Area); a printed circuit board for electrically connecting the fanout area (Fanout Area); The printed circuit board includes: a plurality of bonding pad areas for electrically connecting to the fanout area (Fanout Area); a plurality of dummy pad areas (Dummy Pad areas) located in the plurality of bonding pad areas for Grounding; there is a connection pad area between the several dummy pad areas, which is electrically connected to the several bonding pad areas.
  • connection pad area includes a plurality of connection pads for electrically connecting an external input connector, and the width of the connection pads is 0.3 mm.
  • connection pad area includes a plurality of connection pads for electrically connecting an external input connector, and the distance between the connection pads is 0.2 mm.
  • connection pad area includes several connection pads, and the length of the connection pad is the same as the length of a bonding pad in the bonding pad area.
  • the fanout area includes an opening voltage and a closing voltage electrically connected to a first switch and a second switch to control the first switch and the second switch When the two switches are turned on or off, the first switch and the second switch are electrically connected to the bonding pad area of the printed circuit board.
  • a resistance is included between the turn-on voltage and the turn-off voltage, and the resistance is greater than 100K ⁇ .
  • the fanout area includes a first Schottky diode electrically connected between the first switch and the ground, and a second Schottky diode electrically connected Between the second switch and ground.
  • the present application can avoid the disadvantages of the need to additionally set the contact pad (Contact Pad) area in the existing design, save the area of the printed circuit board (PCB), and thereby reduce the product cost. And prevent the static electricity (ESD) in the fanout area (Fanout Area) from damaging the components on the printed circuit board (PCB) to improve the yield of the product.
  • Contact Pad contact pad
  • ESD static electricity
  • Figure 1 is a schematic view of an exemplary display and printed circuit board (PCB);
  • FIG. 2 is a schematic view of an example printed circuit board (PCB) gold finger
  • FIG 3 is a schematic view of a display connection structure according to an embodiment of the application.
  • connection structure of a printed circuit board and a display according to this application in conjunction with the drawings and optional embodiments.
  • the structure, features and functions are explained in detail as follows.
  • the system motherboard passes R / G / B compressed signals, control signals and power through wires and printed circuit boards ( The connectors on the PCB are connected, and the data is processed by the TCON (Timing Controller) IC on the printed circuit board (PCB) 10, and then through the printed circuit board (PCB) through the S-COF (Source -Chip on Film, source chip on film 20 and G-COF (Gate-Chip on Film, gate chip on film) are connected to the display area, so that the LCD can obtain the required power and signal.
  • TCON Transmission Controller
  • S-COF Source -Chip on Film
  • source chip on film 20 and G-COF Gate-Chip on Film, gate chip on film
  • the factory production line has introduced an automatic contact (Auto Contact) system, which was originally input into the printed circuit board through the connector (PCB) R / G / B compressed signal, control signal and power supply are directly input to the test point on the printed circuit board (PCB) through the metal probe.
  • Auto Contact automatic contact
  • the connection between the printed circuit board (PCB) 10 and the S-COF (Source-Chip on Film) 20 is through the gold finger area 11 on the printed circuit board (PCB) 10
  • the bonding pads of the pad area are connected, and the gold finger area is composed of the bonding pad area 111 and the dummy pad area 112.
  • the area where the S-COF (Source-Chip Film, the source chip on the film) and the printed circuit board (PCB) are connected is the bonding pad area 111; the dummy pad area 112 has only gold fingers The function of grounding.
  • the printed circuit board (PCB) structure needs to be additionally provided with a contact pad (Contact Pad) area, which occupies a large area, and the fanout area (ESD) of the existing structure on the printed circuit Components on the board are susceptible to damage.
  • Contact Pad contact pad
  • ESD fanout area
  • FIG. 3 is a schematic view of a display connection structure according to an embodiment of the present application. It includes a printed circuit board with a gold finger area 11, the gold finger area 11 includes: a plurality of bonding pad areas 111 for electrically connecting to the fan-out area (Fanout Area) 30; a plurality of dummy pad areas 112, Located in the bonding pad areas 111 for grounding; there is a connection pad area 113 between the dummy pad areas 112, which is electrically connected to the bonding pad areas 111.
  • connection pad area 113 includes a plurality of connection pads 1131 for electrically connecting an external input connector (not shown), and the width W of the connection pads 1131 is 0.3 mm .
  • connection pad area 113 includes a plurality of connection pads 1131 for electrically connecting external input connectors, and the distance D between the connection pads 1131 is 0.2 mm.
  • connection pad area 113 includes a plurality of connection pads 1131, the length of the connection pad 1131 is the same as the length of a bonding pad 1111 in the bonding pad area 111, the connection pad The length of 1131 may be the same as the length of a dummy pad 1121 in the dummy pad area 112.
  • the present application provides a display connection structure, including: a display including a fanout area (Fanout Area) 30; and the printed circuit board described above, the printed circuit board has a gold finger area 11, so
  • the gold finger area 11 includes: a plurality of bonding pad areas 111 for electrically connecting to the fanout area (Fanout Area) 30; and a plurality of dummy pad areas 112 located in the plurality of bonding pad areas 111 for Grounding; There is a connection pad area 113 between the several dummy pad areas 112, which is electrically connected to the bonding pad area 111.
  • connection pad area 113 includes a plurality of connection pads 1131 for electrically connecting an external input connector (not shown), and the width W of the connection pads 1131 is 0.3 mm .
  • connection pad area 113 includes a plurality of connection pads 1131 for electrically connecting external input connectors, and the distance D between the connection pads 1131 is 0.2 mm.
  • connection pad area 113 includes a plurality of connection pads 1131, the length of the connection pad 1131 is the same as the length of a bonding pad 1111 in the bonding pad area 111, the connection pad The length of 1131 may be the same as the length of a dummy pad 1121 in the dummy pad area 112.
  • the fanout area 30 includes an opening voltage VDD and a closing voltage GND to electrically connect a first switch M1 and a second switch M2 to control the first A switch M1 and the second switch M2 are turned on or off, the first switch M1 and the second switch M2 are MOS (gold oxide half field effect diode) switches; wherein, the first switch M1 and the The second switch M2 is electrically connected to the bonding pad area 111 of the printed circuit board 10, in detail, the first switch M1 and the second switch M2 are electrically connected to the gold finger area 11 of the printed circuit board The bonding pad 1111 of the bonding pad area 111.
  • MOS gold oxide half field effect diode
  • connection pad area 113 is electrically connected to the bonding pad area 111 through the printed circuit board PCB traces, and is electrically connected to the fan-out area (Fanout Area) through S-COF (Source-Chip on Film). ) 30, after passing through the first switch M1, the first diode D1 or the second switch M2, the second diode D2, and then pass back through S-COF (Source-Chip on Film) To the PCB end of the printed circuit board, as the input of the required signals on the PCB.
  • S-COF Source-Chip on Film
  • a resistance R is included between the turn-on voltage VDD and the turn-off voltage GND, and the resistance R is greater than 100K ⁇ .
  • the fanout area (Fanout Area) 30 includes a first Schottky diode D3 electrically connected between the first switch M1 and the ground GND, and a second Schott The base diode D4 is electrically connected between the second switch M2 and the ground GND.
  • ESD static electricity
  • the first Schottky diode D3 and the second Schottky diode D4 can resist static electricity (ESD) ) For absorption.
  • the Auto Contact machine uses a metal probe to input the R / G / B compression signal, control signal and power supply originally input to the PCB board through the external connector, and directly inputs it to the connection pad of the connection pad area 113 1131.
  • the power signal is directly connected to the PCB through the connection pad 1131 to generate a voltage such as the turn-on voltage VDD; and the R / G / B compression signal and the control signal are directly connected to the control IC, and the anti-static (ESD) ability is weak.
  • the disadvantage of the need to separately set the connection pad area in the existing design is avoided, the PCB area of the printed circuit board is saved, and the product cost is reduced. Moreover, it can avoid the damage caused by the static electricity (ESD) in the fanout area (Fanout Area) to the components on the printed circuit board PCB, and improve the yield of the product. Therefore, it has industrial applicability.
  • ESD static electricity

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)

Abstract

本申请是有关于一种印刷电路板及包含该印刷电路板的显示器的连接结构，其中所述印刷电路板包括：数个接合垫区，用以电连接至一显示器；数个假垫区，位于所述数个接合垫区中，用以接地；在所述数个假垫区之间具有一连接垫区，其电连接所述数个接合垫区；所述连接垫区中，包括数个连接垫，其用以电连接一外部输入连接器；所述数个连接垫的宽度为0.3毫米；所述数个连接垫之间的间距为0.2毫米；所述连接垫的长度与所述接合垫区中的一接合垫长度相同。

Description

印刷电路板及包含该印刷电路板的显示器的连接结构 技术领域
本申请涉及一种印刷电路板，特别是涉及一种印刷电路板及包含该印刷电路板的显示器的连接结构。
背景技术
TFT-LCD(Thin Film Transistor Liquid Crystal Display，薄膜晶体管液晶显示器)是当前平板显示的主要品种之一，已经成为了现代信息科技产业(IT产业)、视讯产品中重要的显示平台，为了实施窄边框设计，并响应电子产品朝轻薄短小、功能好及速度快发展，驱动芯片封装的技术也朝向厚度更薄、面积更小的趋势发展，栅极芯片及源极芯片都采用了薄膜上芯片(Chip on Film，COF)型封装方式。
在目前的PCB设计中涉及的扇出Fanout设计的实现主要是PCB工程师手工完成，这就使得即使相同的封装器件PCB设计工程师也同样需要手工逐个完成相应的Fanout设计，而且，对于一位PCB设计工程师设计出的扇出Fanout设计形式，在该工程师设计另外一块PCB时，即采用原来设计的扇出Fanout设计形式便可以满足需求，也同样需要重新设计一遍，因此，没有扇出Fanout设计共享机制将导致PCB设计中涉及的扇出Fanout设计效率较低，进而导致整个PCB设计的效率均大大降低。
发明内容
为了解决上述现象，本申请的目的在于，提供一种印刷电路板，特别是提供一种印刷电路板与显示器的连接结构，使得现有的印刷电路板(PCB)上金手指区域与连接垫相结合。此方式可以避免现有设计中需要额外单独设置连接垫(Contact Pad)区的弊端，节省了印刷电路板(PCB)面积，进而降低了产品成本。
本申请更包括二极管及开关(MOS)的设置，可以避免扇出区域(Fanout Area)的静电(ESD)对印刷电路板(PCB)上的组件造成损伤，以提升产品的良率。
本申请的目的及解决其技术缺陷是采用以下技术方案来实现的。依据本申请提出的一种印刷电路板，包括：数个接合垫区，用以电连接至一显示器；数个假垫(Dummy Pad)区，位于所述数个接合区中，用以接地；在所述数个假垫(Dummy Pad)区之间具有一连接垫区，其电连接所述数个接合垫区。
本申请的另一目的为提供一种显示器连接结构，包括：一显示区，其包括一扇出区域(Fanout Area)；一印刷电路板，用以电连接所述扇出区域(Fanout Area)；所述印刷电路板包括： 数个接合垫区，用以电连接至所述扇出区域(Fanout Area)；数个假垫(Dummy Pad)区，位于所述数个接合垫区中，用以接地；在所述数个假垫(Dummy Pad)区之间具有一连接垫区，其电连接所述数个接合垫区。
本申请的目的及解决其技术缺陷还可采用以下技术措施进一步实现。
在本申请的一实施例中，所述连接垫区中，包括数个连接垫，其用以电连接一外部输入连接器，所述数个连接垫的宽度为0.3毫米。
在本申请的一实施例中，所述连接垫区中，包括数个连接垫，其用以电连接外部输入连接器，所述数个连接垫之间的间距为0.2毫米。
在本申请的一实施例中，所述连接垫区中，包括数个连接垫，所述连接垫的长度与所述接合垫区中的一接合垫长度相同。
在本申请的一实施例中，所述扇出区域(Fanout Area)中，包括一开启电压与一关闭电压电连接一第一开关及一第二开关以控制所述第一开关及所述第二开关的开启或关闭，所述第一开关及所述第二开关电连接所述印刷电路板的所述接合垫区。
在本申请的一实施例中，所述扇出区域(Fanout Area)中，所述开启电压与所述关闭电压之间包括一电阻，所述电阻大于100KΩ。
在本申请的一实施例中，所述扇出区域(Fanout Area)中，包括一第一肖特基二极管电连接所述第一开关与接地之间，及一第二肖特基二极管电连接所述第二开关与接地之间。
本申请可以避免现有设计中需要额外单独设置连接垫(Contact Pad)区域的弊端，节省了印刷电路板(PCB)面积，进而降低了产品成本。并防止扇出区域(Fanout Area)的静电(ESD)对印刷电路板(PCB)上的组件造成损伤，以提升产品的良率。
附图说明
图1是范例的显示器与印刷电路板(PCB)的视意图；
图2是范例的印刷电路板(PCB)的金手指的视意图；
图3是本申请一实施例的一种显示器连接结构视意图。
具体实施方式
以下各实施例的说明是参考附加的图式，用以例示本申请可用以实施的特定实施例。本申请所提到的方向用语，例如「上」、「下」、「前」、「后」、「左」、「右」、「内」、「外」、「侧面」等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本申请，而非用以限制本申请。
附图和说明被认为在本质上是示出性的，而不是限制性的。在图中，结构相似的单元是以相同标号表示。另外，为了理解和便于描述，附图中示出的每个组件的尺寸和厚度是任意 示出的，但是本申请不限于此。
在附图中，为了清晰起见，夸大了层、膜、面板、区域等的厚度。在附图中，为了理解和便于描述，夸大了一些层和区域的厚度。将理解的是，当例如层、膜、区域或基底的组件被称作“在”另一组件“上”时，所述组件可以直接在所述另一组件上，或者也可以存在中间组件。
另外，在说明书中，除非明确地描述为相反的，否则词语“包括”将被理解为意指包括所述组件，但是不排除任何其它组件。此外，在说明书中，“在......上”意指位于目标组件上方或者下方，而不意指必须位于基于重力方向的顶部上。
为更进一步阐述本申请为达成预定申请目的所采取的技术手段及功效，以下结合附图及可选实施例，对依据本申请提出的一种印刷电路板及显示器的连接结构其具体实施方式、结构、特征及其功效，详细说明如后。
请参阅图1至图2，TFT-LCD(Thin Film Transistor Liquid Crystal Display，薄膜晶体管液晶显示器)主要驱动原理，系统主板将R/G/B压缩信号、控制信号及电源通过线材与印刷电路板(PCB)上的连接器(connector)相连接，数据经过印刷电路板(PCB)10上的TCON(Timing Controller，时序控制器)IC处理后，经印刷电路板(PCB)，通过S-COF(Source-Chip on Film，薄膜上源极芯片)20和G-COF(Gate-Chip on Film，薄膜上栅极芯片)与显示区连接，从而使得LCD获得所需的电源、信号。
其中，为避免日常使用中人工插拔对连接器造成的损坏，并且提升工厂的生产自动化程度及效率，工厂产线有导入自动连接(Auto Contact)系统，将原本通过连接器Connector输入印刷电路板(PCB)的R/G/B压缩信号、控制信号及电源，通过金属探针，直接输入至印刷电路板(PCB)上的测试点。
现有设计中，印刷电路板(PCB)10与S-COF(Source-Chip on Film，薄膜上源极芯片)20的连接，是通过印刷电路板(PCB)10上的金手指区域11上接合垫区的接合垫(Bonding Pad)进行连接，金手指区域由接合垫区111和假垫区(Dummy Pad)112组成。其中S-COF(Source-Chip on Film，薄膜上源极芯片)与印刷电路板(PCB)连接的区域为接合垫(Bonding Pad)区111；假垫(Dummy Pad)区112的金手指仅有接地的功能。
然而上述中，所述印刷电路板(PCB)结构需额外单独设置连接垫(Contact Pad)区域，占用面积较大，且现有结构中扇出区域(Fanout Area)的静电(ESD)对印刷电路板上的组件容易造成的损伤。
请参阅图3，图3是本申请一实施例的一种显示器连接结构视意图。其中包括一印刷电路板具有金手指区11，所述金手指区11包括：数个接合垫区111，用以电连接至所述扇出 区域(Fanout Area)30；数个假垫区112，位于所述数个接合垫区111中，用以接地；在所述数个假垫(Dummy Pad)区112之间具有一连接垫区113，其电连接所述数个接合垫区111。
在本申请的一实施例中，所述连接垫区113中，包括数个连接垫1131用以电连接外部输入连接器(未图示)，所述数个连接垫1131的宽度W为0.3毫米。
在本申请的一实施例中，所述连接垫区113中，包括数个连接垫1131，其用以电连接外部输入连接器，所述数个连接垫1131之间的间距D为0.2毫米。
在本申请的一实施例中，所述连接垫区113中，包括数个连接垫1131，所述连接垫1131长度与所述接合垫区111中的一接合垫1111长度相同，所述连接垫1131长度可与所述假垫(Dummy Pad)区112中的一假垫(Dummy Pad)1121长度相同。
如同上述，本申请提供一种显示器连接结构,包括：一显示器，所述显示器包括一扇出区域(Fanout Area)30；及上述所述的印刷电路板，印刷电路板具有金手指区11，所述金手指区11包括：数个接合垫区111，用以电连接至所述扇出区域(Fanout Area)30；数个假垫区112，位于所述数个接合垫区111中，用以接地；在所述数个假垫(Dummy Pad)区112之间具有一连接垫区113，其电连接所述接合垫区111。
在本申请的一实施例中，所述连接垫区113中，包括数个连接垫1131用以电连接外部输入连接器(未图示)，所述数个连接垫1131的宽度W为0.3毫米。
在本申请的一实施例中，所述连接垫区113中，包括数个连接垫1131，其用以电连接外部输入连接器，所述数个连接垫1131之间的间距D为0.2毫米。
在本申请的一实施例中，所述连接垫区113中，包括数个连接垫1131，所述连接垫1131长度与所述接合垫区111中的一接合垫1111长度相同，所述连接垫1131长度可与所述假垫(Dummy Pad)区112中的一假垫(Dummy Pad)1121长度相同。
在本申请的一实施例中，所述扇出区域(Fanout Area)30中，包括一开启电压VDD与一关闭电压GND以电连接一第一开关M1及一第二开关M2以控制所述第一开关M1及所述第二开关M2的开启或关闭，所述第一开关M1及所述第二开关M2为MOS(金氧半场效二极管)开关；其中，所述第一开关M1及所述第二开关M2电连接所述印刷电路板10的所述接合垫区111，详细而言，所述第一开关M1及所述第二开关M2电连接所述印刷电路板的金手指区11的所述接合垫区111的接合垫1111。
由上述可知，连接垫区113通过印刷电路板PCB走线与接合垫区111电连接，并通过S-COF(Source-Chip on Film，薄膜上源极芯片)电连接至扇出区域(Fanout Area)30，再经过第一开关M1、第一二极管D1或第二开关M2、第二二极管D2后，再通过S-COF(Source-Chip on Film，薄膜上源极芯片)回传至印刷电路板PCB端，作为PCB上所需各信号的输入。
在本申请的一实施例中，所述扇出区域(Fanout Area)30中，所述开启电压VDD与所述关闭电压GND之间包括一电阻R，所述电阻R大于100KΩ。
在本申请的一实施例中，所述扇出区域(Fanout Area)30中，包括一第一肖特基二极管D3电连接所述第一开关M1与接地GND之间，及一第二肖特基二极管D4电连接所述第二开关M2与接地GND之间，当外界有静电(ESD)时，所述第一肖特基二极管D3、所述第二肖特基二极管D4可以对静电(ESD)进行吸收。
实际应用中，自动连接(Auto Contact)机台利用金属探针，将原本通过外部连接器输入PCB板的R/G/B压缩信号、控制信号及电源，直接输入至连接垫区113的连接垫1131。其中，电源信号直接通过连接垫1131连接至PCB内，以产生开启电压VDD等电压；而R/G/B压缩信号、控制信号因为与控制类IC直接连接，抗静电(ESD)能力较弱，则此类信号先通过开关MOS(金氧半场效二极管)及二极管传输至扇出区域(Fanout Area)，在经过第一肖特基二极管D3、所述第二肖特基二极管D4等静电(ESD)防护器件后，再接入印刷电路板PCB板。
综上所述，避免现有设计中需要单独设置连接垫区的弊端，节省了印刷电路板PCB面积，进而降低了产品成本。且可以避免扇出区域(Fanout Area)的静电(ESD)对印刷电路板PCB上的元器件造成的损伤，提升产品的良率。因此，具有工业实用性。
“在一些实施例中”及“在各种实施例中”等用语被重复地使用。所述用语通常不是指相同的实施例；但它也可以是指相同的实施例。“包含”、“具有”及“包括”等用词是同义词，除非其前后文意显示出其它意思。
以上所述，仅是本申请的可选实施例而已，并非对本申请作任何形式上的限制，虽然本申请已以可选实施例揭露如上，然而并非用以限定本申请，任何熟悉本专业的技术人员，在不脱离本申请技术方案范围内，当可利用上述揭示的技术内容作出些许更动或修饰为等同变化的等效实施例，但凡是未脱离本申请技术方案的内容，依据本申请的技术实质对以上实施例所作的任何简单修改、等同变化与修饰，均仍属于本申请技术方案的范围内。

Claims (20)

  1. 一种印刷电路板，其中，包括：
    数个接合垫区，用以电连接至一显示器；
    数个假垫区，位于所述数个接合垫区中，用以接地；
    在所述数个假垫区之间具有一连接垫区，其电连接所述数个接合垫区。
  2. 如权利要求1所述的印刷电路板，其中，所述连接垫区中，包括数个连接垫，其用以电连接一外部输入连接器，所述数个连接垫的宽度为0.3毫米。
  3. 如权利要求1所述的印刷电路板，其中，所述连接垫区中，包括数个连接垫，其用以电连接外部输入连接器，所述数个连接垫之间的间距为0.2毫米。
  4. 如权利要求1所述的印刷电路板，其中，所述连接垫区中，包括数个连接垫，所述连接垫的长度与所述接合垫区中的一接合垫长度相同。
  5. 如权利要求1所述的印刷电路板，其中，还包括金手指区。
  6. 一种显示器连接结构，其中，包括：
    一显示区，其包括一扇出区域；
    一印刷电路板，用以电连接所述扇出区域；所述印刷电路板包括：
    数个接合垫区，用以电连接至所述扇出区域；
    数个假垫区，位于所述数个数个接合垫区中，用以接地；
    在所述数个假垫区之间具有一连接垫区，其电连接所述数个接合垫区。
  7. 如权利要求6所述的显示器连接结构，其中，所述连接垫区中，包括数个连接垫，其用以电连接一外部输入连接器，所述数个连接垫的宽度为0.3毫米。
  8. 如权利要求6所述的显示器连接结构，其中，所述连接垫区中，包括数个连接垫，其用以电连接外部输入连接器，所述数个连接垫之间的间距为0.2毫米。
  9. 如权利要求6所述的显示器连接结构，其中，所述连接垫区中，包括数个连接垫，所述连接垫的长度与所述接合垫区中的一接合垫长度相同。
  10. 如权利要求6所述的显示器连接结构，其中，所述扇出区域中，包括一开启电压与一关闭电压以电连接一第一开关及一第二开关以控制所述第一开关及所述第二开关的开启或关闭。
  11. 如权利要求6所述的显示器连接结构，其中，所述第一开关及所述第二开关电连接所述印刷电路板的所述接合垫区。
  12. 如权利要求10所述的显示器连接结构，其中，所述扇出区域中，所述开启电压与所述关闭电压之间包括一电阻，所述电阻大于100KΩ。
  13. 如权利要求6所述的显示器连接结构，其中，所述扇出区域中，包括一第一肖特基二极管电连接所述第一开关与接地之间，及一第二肖特基二极管电连接所述第二开关与接地之间。
  14. 如权利要求6所述的显示器连接结构，其中，所述第一开关及所述第二开关为金氧半场效二极管开关。
  15. 如权利要求13所述的显示器连接结构，其中，当外界有静电时，所述第一肖特基二极管、所述第二肖特基二极管能够对静电进行吸收。
  16. 一种显示器连接结构，其中，包括：
    一显示区，其包括一扇出区域；
    一印刷电路板，用以电连接所述扇出区域；所述印刷电路板包括：
    数个接合垫区，用以电连接至所述扇出区域；
    数个假垫区，位于所述数个接合垫区中，用以接地；
    在所述数个假垫区之间具有一连接垫区，其电连接所述数个接合垫区；
    其中，所述扇出区域中，包括一开启电压与一关闭电压以电连接一第一开关及一第二开关以控制所述第一开关及所述第二开关的开启或关闭；
    其中，所述第一开关及所述第二开关电连接所述印刷电路板的所述接合垫区，所述开启电压与所述关闭电压之间包括一电阻，所述电阻大于100KΩ；
    其中，所述扇出区域中，包括一第一肖特基二极管电连接所述第一开关与接地之间，及一第二肖特基二极管电连接所述第二开关与接地之间。
  17. 如权利要求16所述的显示器连接结构，其中，所述连接垫区中，包括数个连接垫，其用以电连接一外部输入连接器，所述数个连接垫的宽度为0.3毫米。
  18. 如权利要求16所述的显示器连接结构，其中，所述连接垫区中，包括数个连接垫，其用以电连接外部输入连接器，所述数个连接垫之间的间距为0.2毫米。
  19. 如权利要求16所述的显示器连接结构，其中，所述印刷电路板具有金手指区。
  20. 如权利要求19所述的显示器连接结构，其中，所述金手指区包括：所述数个接合垫区和所述数个假垫区。
PCT/CN2019/088367 2018-11-09 2019-05-24 印刷电路板及包含该印刷电路板的显示器的连接结构 Ceased WO2020093683A1 (zh)

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