WO2020093620A1 - 激光切割装置及激光切割方法 - Google Patents
激光切割装置及激光切割方法 Download PDFInfo
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- WO2020093620A1 WO2020093620A1 PCT/CN2019/075636 CN2019075636W WO2020093620A1 WO 2020093620 A1 WO2020093620 A1 WO 2020093620A1 CN 2019075636 W CN2019075636 W CN 2019075636W WO 2020093620 A1 WO2020093620 A1 WO 2020093620A1
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- laser
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- gun
- mask plate
- cutting device
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Definitions
- the invention relates to the technical field of display, and in particular to a laser cutting device and a laser cutting method for cutting a mask plate.
- Organic Light Emitting Diode (Organic Light Emitting Diode, OLED) is a promising flat panel display technology, it has very excellent display performance, especially self-luminous, simple structure, ultra-thin, fast response, wide
- the characteristics of viewing angle, low power consumption and flexible display can be hailed as "dream display", and its investment in production equipment is much smaller than that of TFT-LCD, which has been favored by major display manufacturers and has become the first in the field of display technology
- OLED is already on the eve of mass production. With the deepening of research and the continuous emergence of new technologies, OLED display devices will surely have a breakthrough development.
- the OLED has an anode, an organic light-emitting layer, and a cathode that are sequentially formed on the substrate.
- each layer of material in the OLED needs to be evaporated onto the array substrate through an evaporation process, and in the evaporation process, a corresponding fine metal mask (FMM) needs to be used Through the openings on the FMM, the OLED material is evaporated to the designed position. Specifically, by heating the OLED material, the OLED material slowly becomes gaseous sublimation, and then deposited through the FMM openings on the substrate surface to form a thin film.
- FMM fine metal mask
- the OLED display devices for color display currently put into commercial production mainly include RGB three-color OLED display devices and white light OLED display devices with color filters (CF).
- RGB three-color OLED display device is currently widely used in mobile display equipment, and its FMM technology is a decisive factor in the resolution of the display device.
- FIG. 1 is a schematic structural diagram of a conventional FMM.
- a strip-shaped fine mask 200 having a plurality of pixel openings 210 is aligned with a metal frame 100 by a mask tension Afterwards, they are welded together by laser, and then the integrated FMM is applied to the evaporation process.
- the FMM Tension process the FMM After the sheet is netted, the original fine mask 200 is all stored in the scrap 205, and then the excess scrap 205 needs to be cut by laser cutting.
- the scraps of FMM Sheet do not exist in a fixed area, and the scraps of different products exist in different areas, so the operator needs to set the recipe for the area with scraps, and then set it on the laser cutting machine (Laser Trimmer) )
- the equipment cuts the specific areas containing scraps according to the set recipe. Due to the cumbersome process of setting the recipe, it is easy to make mistakes. If an error occurs, it will cause product abnormalities and waste of materials.
- the object of the present invention is to provide a laser cutting device that uses a laser gun and a laser positioner in combination, so that the process of setting different cutting recipes according to different products before cutting can be omitted, thereby effectively avoiding abnormal quality and material waste.
- the object of the present invention is also to provide a laser cutting method using the above laser cutting device, which eliminates the process of setting different cutting recipes according to different products before cutting, thereby effectively avoiding abnormal quality and material waste.
- the present invention provides a laser cutting device for cutting and removing scrap on a mask plate, including a laser gun and a laser positioner arranged in parallel;
- the laser positioner can sense whether there is scrap, and the laser gun can cut and remove the scrap according to the sensing result of the laser positioner.
- the laser positioner has an induction port
- the laser positioner can emit laser light to the mask plate, and the induction port can receive the laser light reflected by the mask plate, thereby measuring the distance between the induction port and the mask plate, by Compare the measured distance with the set value to detect whether there is scrap.
- the relative positional relationship between the laser gun and the laser positioner is fixed.
- the energy density of the laser light emitted by the laser positioner is less than the energy density of the laser light emitted by the laser gun.
- the laser cutting device further includes a control system that controls the activation and deactivation of the laser gun and laser positioner.
- the invention also provides a laser cutting method for cutting and removing the scrap on the mask plate, which includes the following steps:
- Step S1 Provide a mask plate to be cut and a laser cutting device
- the mask plate has scraps to be removed;
- the laser cutting device includes a laser gun and a laser positioner arranged side by side;
- Step S2. Place the mask plate under the laser gun and the laser positioner, turn on the laser positioner, and detect whether there is scraps through the laser positioner, the laser gun according to the laser positioner
- the sensing result cuts and removes the scraps, that is, the laser gun emits laser light for the areas where the scraps are present, and stops emitting lasers for the areas where the scraps are not present.
- the laser positioner has an induction port
- the laser positioner emits laser light to the mask plate, and the induction port receives the laser light reflected by the mask plate, thereby measuring between the induction port and the mask plate By comparing the measured distance with the set value to detect the presence of scrap.
- step S2 the relative positional relationship between the laser gun and the laser positioner is fixed.
- step S2 the energy density of the laser light emitted by the laser positioner is less than the energy density of the laser light emitted by the laser gun.
- the laser cutting device provided in the step S1 further includes a control system that controls the startup and shutdown of the laser gun and the laser positioner;
- the step S1 further includes setting a moving path of the laser positioner in the control system of the laser cutting device.
- the laser positioner senses whether there is scrap on the moving path.
- the laser cutting device of the present invention is used to cut and remove the scraps on the mask plate, including a laser gun and a laser positioner; when in use, the laser shifter senses whether there are scraps There is, the laser gun cuts and removes the scrap according to the perception result of the laser positioner, that is, the laser gun emits laser for the area where the scrap is present, and stops emitting the laser for the area where there is no scrap; the present invention will
- the laser gun and laser positioner are used in combination, so that the process of setting different cutting recipes according to different products before cutting can be omitted, thereby avoiding the error-prone matters during the setting of the recipe and avoiding that the editing errors caused by the recipe should be removed
- the laser cutting method of the present invention adopts the above-mentioned laser cutting device, eliminating the process of setting different cutting recipes according to different products before cutting, thereby avoiding the error-prone matters in the setting of the recipe and avoiding the errors caused by editing errors
- the place where it should be cut is not cut, and the place that should not be cut is damaged or even down due to the irradiation of the laser gun, thereby avoiding abnormal quality and waste of materials.
- Figure 1 is a schematic diagram of the structure of the fine mask plate after the net-opening process
- FIG. 2 is a schematic side view of the laser cutting device of the present invention
- FIG. 3 is a schematic structural view of the top view of the laser cutting device of the present invention.
- FIG. 4 is a schematic diagram of the laser cutting device of the present invention on the perception process of scraps
- FIG. 5 is a schematic diagram of a laser cutting device of the present invention on the cutting process of scraps
- FIG. 6 is a schematic flowchart of the laser cutting method of the present invention.
- the present invention first provides a laser cutting device for masking 90 Leftovers 95 Cut and remove, as shown 2-3
- the laser cutting device includes laser guns arranged side by side ( Laser Gun ) 10 And laser positioner ( Laser Displacement ) 20 , Located in the laser gun 10 And laser positioner 20 Working platform (not shown) below and controlling the laser gun 10 And laser positioner 20 Start-up and shut-down control system 30 ;
- the laser positioner 20 Used to sense whether there are scraps on its moving path 95 The presence of the laser gun 10 According to the laser positioner 20 Of the perception results on the scraps 95 Cut and remove; when in use, as shown 4-5 As shown, through the laser positioner 20 Perceive whether there are scraps on its moving path 95 The presence of the laser gun 10 According to the laser positioner 20 Of the perception results on the scraps 95 Cutting and removing, ie the laser gun 10 For the presence of scrap 95 Laser cutting is performed in the area where there is no scrap 95 The area stops emitting laser light.
- the laser gun 10 for Nd Yag
- the laser which is a solid-state laser, emits 1064nm Laser for cutting metal materials.
- the laser positioner 20 Is a laser positioner with a laser wavelength of 655nm .
- the laser positioner 20 With induction port twenty one ;
- the laser positioner 20 Emits laser light to the mask plate, the induction port twenty one Received by the mask 90
- the reflected laser light measures the sensing port twenty one With the mask 90 The distance between them, by comparing the measured distance with the set value twenty one With mask 90 Compare the distance between them to detect whether there is leftover 95 The presence.
- the laser positioner 20 The energy density of the emitted laser is less than the laser gun 10 The energy density of the emitted laser.
- the laser gun 10 And laser positioner 20 The relative positional relationship is fixed. Then, during the debugging process of the laser cutting device, the laser gun can be obtained through testing 10 And laser positioner 20 The relative position between the laser gun 10 And laser positioner 20 The horizontal distance between DX , Laser gun 10 And laser positioner 20 The longitudinal distance between DY , And then get the test results DX with DY Control system input to the laser cutting device 30 among. Then in the laser gun 10 According to the laser positioner 20 Of the perception results on the scraps 95 When cutting and removing, the control system 30 According to the input DX with DY Come on laser gun 10 The cutting path is revised, and all subsequent products can directly use this setting.
- the laser cutting device of the invention is used for masking 90 Leftovers 95 Cut and remove, including laser gun 10 And laser positioner 20 ; When in use, through the laser positioner 20 Perceive whether there are leftovers 95 The presence of the laser gun 10 According to the laser positioner 20 Of the perception results on the scraps 95 Cutting and removing, ie the laser gun 10 For the presence of scrap 95 Laser cutting is performed in the area where there is no scrap 95 The area stops emitting laser light; the invention uses a laser gun 10 And laser positioner 20 Combined use, which can save different cutting according to different products before cutting Recipe Process to avoid setting Recipe Error-prone matters in the process Recipe The place that should be removed due to editing errors is not removed, and the place that should not be removed is laser 10 The phenomenon of glass breakage or even downtime caused by irradiation occurs, thereby avoiding abnormal quality and waste of materials.
- the present invention also provides a laser cutting method for mask plate 90 Leftovers 95 For cutting and removing, the laser cutting method includes the following steps:
- step S1 ⁇ Provide the mask plate to be cut 90 And laser cutting device.
- the laser cutting device includes laser guns arranged side by side 10 And laser positioner 20 , Located in the laser gun 10 And laser positioner 20 Working platform (not shown) below and controlling the laser gun 10 And laser positioner 20 Start-up and shut-down control system 30 .
- steps S1 Also included in the control system of the laser cutting device 30 Set laser positioner 20 Moving path.
- step S2 The mask 90 Placed in a laser gun 10 And laser positioner 20 On the working platform below, open the laser positioner 20 , Through the laser positioner 20 Perceive whether there are scraps on its moving path 95 The presence of the laser gun 10 According to the laser positioner 20 Of the perception results on the scraps 95 Cutting and removing, ie the laser gun 10 For the presence of scrap 95 Laser cutting is performed in the area where there is no scrap 95 The area stops emitting laser light.
- the laser positioner 20 The moving path of is not set according to the product category, the moving path can be shared by different products, so there is no need to re-set it when changing products. Compared with the existing process, it is necessary to set a specific cut for each product Recipe In terms of saving manpower and material resources.
- the laser positioner 20 With induction port twenty one ;
- the steps S2 The laser positioner 20 Emits laser light to the mask plate, the induction port twenty one Received by the mask 90
- the reflected laser light measures the sensing port twenty one With the mask 90 The distance between, by comparing the measured distance with the set value to detect whether there is scrap 95 The presence.
- the laser gun 10 And laser positioner 20 The relative positional relationship is fixed. Then, during the debugging process of the laser cutting device, the laser gun can be obtained through testing 10 And laser positioner 20 The relative position between the laser gun 10 And laser positioner 20 The horizontal distance between DX , Laser gun 10 And laser positioner 20 The longitudinal distance between DY , And then get the test results DX with DY Control system input to the laser cutting device 30 among. Then in the laser gun 10 According to the laser positioner 20 Of the perception results on the scraps 95 When cutting and removing, the control system 30 According to the input DX with DY Come on laser gun 10 The cutting path is revised, and all subsequent products can directly use this setting.
- the steps S2 , The laser positioner 20 The energy density of the emitted laser is less than the laser gun 10 The energy density of the emitted laser.
- the laser cutting method of the present invention uses the laser cutting device described above, eliminating the need to set different cuttings according to different products before cutting Recipe Process to avoid setting Recipe Error-prone matters in the process Recipe
- the place that should be removed due to editing errors is not removed, and the place that should not be removed is laser 10
- the phenomenon of glass breakage or even downtime caused by irradiation occurs, thereby avoiding abnormal quality and waste of materials.
- the laser cutting device of the present invention is used to cut and remove the scraps on the mask plate, including a laser gun and a laser positioner; when in use, the laser shifter senses the presence of scraps , The laser gun cuts and removes the scrap according to the perception result of the laser positioner, that is, the laser gun emits laser light to the area where the scrap is present, and stops emitting the laser to the area where the scrap is not present;
- the combination of gun and laser positioner can save different cutting settings according to different products before cutting Recipe Process to avoid setting Recipe Error-prone matters in the process Recipe
- the phenomenon that the place that should be cut is not cut due to editing errors, and the place that should not be cut is damaged or even down due to the irradiation of the laser gun, to avoid abnormal quality and waste of materials.
- the laser cutting method of the present invention uses the laser cutting device described above, eliminating the need to set different cuttings according to different products before cutting Recipe Process to avoid setting Recipe Error-prone matters in the process Recipe
- the phenomenon that the place that should be cut is not cut due to editing errors, and the place that should not be cut is damaged or even down due to the irradiation of the laser gun, to avoid abnormal quality and waste of materials.
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Abstract
一种激光切割装置，包括激光枪（10）及激光变位器（20），用于对掩膜板（90）上的边角料（95）进行切割去除。激光变位器（20）感知是否有边角料（95）的存在，根据感知结果，激光枪（10）对存在边角料的区域发出激光进行切割，对不存在边角料的区域停止发出激光。还涉及一种激光切割方法。将激光枪和激光变位器组合使用，省去切割之前根据不同产品设定不同切割的自动化过程，避免设定自动化过程中的易出错问题，避免由自动化编辑错误所导致的应该被切除的地方没有切除、不应被切除的地方被激光枪照射的现象，避免了玻璃破损甚至宕机的现象发生，进而避免品质异常和材料浪费。
Description
本发明涉及显示技术领域，尤其涉及一种对掩膜板进行切割的激光切割装置及激光切割方法。
有机发光二级管显示器（Organic Light Emitting Diode，OLED）是一种极具发展前景的平板显示技术，它具有十分优异的显示性能，特别是自发光、结构简单、超轻薄、响应速度快、宽视角、低功耗及可实现柔性显示等特性，被誉为“梦幻显示器”，再加上其生产设备投资远小于TFT-LCD，得到了各大显示器厂家的青睐，已成为显示技术领域中第三代显示器件的主力军。目前OLED已处于大规模量产的前夜，随着研究的进一步深入，新技术的不断涌现，OLED显示器件必将有一个突破性的发展。
OLED具有依次形成于基板上的阳极、有机发光层和阴极。在制备OLED显示器件时，需要将OLED中的各层材料通过蒸镀工艺蒸镀到阵列基板上，而且在蒸镀过程中，需要使用到相应的精细金属掩膜板（Fine Metal Mask，FMM），通过FMM上的开孔使OLED材料蒸镀到设计的位置，具体地，通过加热OLED材料，使得OLED材料慢慢变成气态升华，然后穿过FMM的开孔沉积在基板表面形成薄膜。当前投入商业化生产的进行彩色显示的OLED显示器件主要有RGB三色OLED显示器件和白光OLED搭配彩色滤光片（color filter，CF）的显示器件。其中，RGB三色OLED显示器件当前广泛应用于移动显示设备，其FMM技术是显示器件解析度的决定因素。
通常掩膜板（Mask）由掩膜框架（Mask Frame）和通过激光点焊固定在掩膜框架上的掩膜（Mask Sheet）所组成。传统FMM 的掩膜（FMM Sheet）主要使用因瓦合金（Invar）材料，经过双面光刻、蚀刻工艺制造而成。图1为传统FMM的结构示意图，如图1 所示，现有技术中通过张网机（mask tension）将条状的具有多个像素开孔210的精细掩膜200 与一个金属框架100 对位后，通过激光焊接在一起，然后构成一整体的FMM再应用于蒸镀工艺。在FMM Tension工艺过程中，在进行完FMM
Sheet张网之后，原始的精细掩膜200都是存在边角料205的，这时需要采用激光切割的方式把多余的边角料205切割掉。
而FMM Sheet的边角料不是在固定区域存在，不同产品的边角料的存在区域并不相同，那么就需要操作人员对有边角料的区域进行设定切割食谱（Recipe），然后设置在激光切割机（Laser Trimmer）设备的系统中，设备按照设定好的Recipe对特定含有边角料的区域进行切割，由于设定Recipe的过程繁琐，容易出错，若是出现错误则会导致产品异常和材料浪费。
因此，有必要设计一种新的激光切割机结构及激光切割方法，以解决上述问题。
本发明的目的在于提供一种激光切割装置，将激光枪和激光变位器组合使用，这样可以省去切割之前根据不同产品设定不同切割Recipe的过程，进而可有效避免品质异常和材料浪费。
本发明的目的还在于提供一种激光切割方法，采用上述的激光切割装置，省去了切割之前根据不同产品设定不同切割Recipe的过程，进而可有效避免品质异常和材料浪费。
为实现上述目的，本发明提供一种激光切割装置，用于对掩膜板上的边角料进行切割去除，包括并列设置的激光枪及激光变位器；
所述激光变位器能感知是否有边角料的存在，所述激光枪能根据激光变位器的感知结果对所述边角料进行切割去除。
所述激光变位器具有感应端口；
所述激光变位器能向所述掩膜板发出激光，所述感应端口能接收由所述掩膜板反射回来的激光，从而测量出感应端口与所述掩膜板之间的距离，通过将该测量距离与设定值进行对比来感知是否有边角料的存在。
所述激光枪和激光变位器的相对位置关系是固定的。
所述激光变位器所发出激光的能量密度小于所述激光枪所发出激光的能量密度。
所述的激光切割装置还包括控制系统，所述控制系统控制所述激光枪及激光变位器的启动与关闭。
本发明还提供一种激光切割方法，用于对掩膜板上的边角料进行切割去除，包括如下步骤：
步骤S1、提供待切割的掩膜板及激光切割装置；
所述掩膜板上具有待切割去除的边角料；激光切割装置包括并列设置的激光枪及激光变位器；
步骤S2、将所述掩膜板放置于激光枪及激光变位器的下方，打开激光变位器，通过所述激光变位器感知是否有边角料的存在，所述激光枪根据激光变位器的感知结果对所述边角料进行切割去除，即所述激光枪对于存在边角料的区域发出激光进行切割，对于不存在边角料的区域停止发出激光。
所述激光变位器具有感应端口；
所述步骤S2中，所述激光变位器向所述掩膜板发出激光，所述感应端口接收由所述掩膜板反射回来的激光，从而测量出感应端口与所述掩膜板之间的距离，通过将该测量距离与设定值进行对比来感知是否有边角料的存在。
所述步骤S2中，所述激光枪和激光变位器的相对位置关系是固定的。
所述步骤S2中，所述激光变位器所发出激光的能量密度小于所述激光枪所发出激光的能量密度。
所述步骤S1中提供的激光切割装置还包括控制系统，所述控制系统控制所述激光枪及激光变位器的启动与关闭；
所述步骤S1还包括在所述激光切割装置的控制系统中设置激光变位器的移动路径，所述步骤S2中，所述激光变位器感知移动路径上是否有边角料的存在。
本发明的有益效果：本发明的激光切割装置，用于对掩膜板上的边角料进行切割去除，包括激光枪及激光变位器；使用时，通过所述激光变位器感知是否有边角料的存在，所述激光枪根据激光变位器的感知结果对所述边角料进行切割去除，即所述激光枪对于存在边角料的区域发出激光进行切割，对于不存在边角料的区域停止发出激光；本发明将激光枪和激光变位器组合使用，这样可以省去切割之前根据不同产品设定不同切割Recipe的过程，从而避免设定Recipe过程中的易出错事项，避免由Recipe编辑错误所导致的应该被切除的地方没有切除、不应被切除的地方被激光枪照射所产生的玻璃破损甚至宕机的现象发生，进而避免品质异常和材料浪费。本发明的激光切割方法，采用上述的激光切割装置，省去了切割之前根据不同产品设定不同切割Recipe的过程，从而避免设定Recipe过程中的易出错事项，避免由Recipe编辑错误所导致的应该被切除的地方没有切除、不应被切除的地方被激光枪照射所产生的玻璃破损甚至宕机的现象发生，进而避免品质异常和材料浪费。
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
下面结合附图，通过对本发明的具体实施方式详细描述，将使本发明的技术方案及其它有益效果显而易见。
附图中，
图1为经张网工艺后的精细掩膜板的结构示意图；
图2为本发明的激光切割装置的侧视结构示意图；
图3为本发明的激光切割装置的俯视结构示意图；
图4为本发明的激光切割装置对边角料的感知过程示意图；
图5为本发明的激光切割装置对边角料的切割过程示意图；
图6为本发明的激光切割方法的流程示意图。
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
本发明首先提供一种激光切割装置，用于对掩膜板
90
上的边角料
95
进行切割去除，如图
2-3
所示，该激光切割装置包括并列设置的激光枪（
Laser Gun
）
10
及激光变位器（
Laser
Displacement
）
20
、设于所述激光枪
10
和激光变位器
20
下方的工作平台（未图示）以及控制所述激光枪
10
及激光变位器
20
的启动与关闭的控制系统
30
；
所述激光变位器
20
用于感知其移动路径上是否有边角料
95
的存在，所述激光枪
10
能根据激光变位器
20
的感知结果对所述边角料
95
进行切割去除；使用时，如图
4-5
所示，通过所述激光变位器
20
感知其移动路径上是否有边角料
95
的存在，所述激光枪
10
根据激光变位器
20
的感知结果对所述边角料
95
进行切割去除，即所述激光枪
10
对于存在边角料
95
的区域发出激光进行切割，对于不存在边角料
95
的区域停止发出激光。
具体地，所述激光枪
10
为
Nd:Yag
激光器，是一种固体激光器，发出
1064nm
的激光，用于对金属材料进行切割。
具体地，所述激光变位器
20
为镭射变位器，其发出激光波长为
655nm
。
具体地，所述激光变位器
20
具有感应端口
21
；使用时，所述激光变位器
20
向所述掩膜板发出激光，所述感应端口
21
接收由所述掩膜板
90
反射回来的激光，从而测量出感应端口
21
与所述掩膜板
90
之间的距离，通过将该测量距离与设定值进行对比，例如将测量距离与不存在边角料时感应端口
21
与掩膜板
90
之间的距离进行对比，来感知是否有边角料
95
的存在。
具体地，所述激光变位器
20
所发出激光的能量密度小于所述激光枪
10
所发出激光的能量密度。
具体地，所述激光枪
10
和激光变位器
20
的相对位置关系是固定的。那么，在激光切割装置的调试过程中，可以通过测试得到所述激光枪
10
及激光变位器
20
之间的相对位置，设激光枪
10
及激光变位器
20
之间的横向距离为
DX
，激光枪
10
及激光变位器
20
之间的纵向距离为
DY
，然后把测试得到的
DX
和
DY
输入到激光切割装置的控制系统
30
当中。那么在激光枪
10
根据激光变位器
20
的感知结果对所述边角料
95
进行切割去除时，控制系统
30
会根据输入的
DX
和
DY
来对激光枪
10
的切割路径进行修订，且后续的所有产品直接沿用此次设定即可。
本发明的激光切割装置，用于对掩膜板
90
上的边角料
95
进行切割去除，包括激光枪
10
及激光变位器
20
；使用时，通过所述激光变位器
20
感知是否有边角料
95
的存在，所述激光枪
10
根据激光变位器
20
的感知结果对所述边角料
95
进行切割去除，即所述激光枪
10
对于存在边角料
95
的区域发出激光进行切割，对于不存在边角料
95
的区域停止发出激光；本发明将激光枪
10
和激光变位器
20
组合使用，这样可以省去切割之前根据不同产品设定不同切割
Recipe
的过程，从而避免设定
Recipe
过程中的易出错事项，避免由
Recipe
编辑错误所导致的应该被切除的地方没有切除、不应被切除的地方被激光枪
10
照射所产生的玻璃破损甚至宕机的现象发生，进而避免品质异常和材料浪费。
请参阅图
6
，基于上述的激光切割装置，本发明还提供一种激光切割方法，用于对掩膜板
90
上的边角料
95
进行切割去除，该激光切割方法包括如下步骤：
步骤
S1
、提供待切割的掩膜板
90
及激光切割装置。
具体地，所述掩膜板
90
上具有待切割去除的边角料
95
；该激光切割装置包括并列设置的激光枪
10
及激光变位器
20
、设于所述激光枪
10
和激光变位器
20
下方的工作平台（未图示）以及控制所述激光枪
10
及激光变位器
20
的启动与关闭的控制系统
30
。
具体，所述步骤
S1
还包括在所述激光切割装置的控制系统
30
中设置激光变位器
20
的移动路径。
步骤
S2
、将所述掩膜板
90
放置于激光枪
10
及激光变位器
20
的下方的工作平台上，打开激光变位器
20
，通过所述激光变位器
20
感知其移动路径上是否有边角料
95
的存在，所述激光枪
10
根据激光变位器
20
的感知结果对所述边角料
95
进行切割去除，即所述激光枪
10
对于存在边角料
95
的区域发出激光进行切割，对于不存在边角料
95
的区域停止发出激光。
需要说明的是，所述激光变位器
20
的移动路径不是因产品类别而设置，该移动路径可以被不同产品所共用，因此不用在更换产品时重新设置，相对于现有工艺需要对每种产品设置特定的切割
Recipe
而言，节省了人力物力。
具体地，所述激光变位器
20
具有感应端口
21
；所述步骤
S2
中，所述激光变位器
20
向所述掩膜板发出激光，所述感应端口
21
接收由所述掩膜板
90
反射回来的激光，从而测量出感应端口
21
与所述掩膜板
90
之间的距离，通过将该测量距离与设定值进行对比来感知是否有边角料
95
的存在。
具体地，在所述步骤
S2
中，所述激光枪
10
和激光变位器
20
的相对位置关系是固定的。那么，在激光切割装置的调试过程中，可以通过测试得到所述激光枪
10
及激光变位器
20
之间的相对位置，设激光枪
10
及激光变位器
20
之间的横向距离为
DX
，激光枪
10
及激光变位器
20
之间的纵向距离为
DY
，然后把测试得到的
DX
和
DY
输入到激光切割装置的控制系统
30
当中。那么在激光枪
10
根据激光变位器
20
的感知结果对所述边角料
95
进行切割去除时，控制系统
30
会根据输入的
DX
和
DY
来对激光枪
10
的切割路径进行修订，且后续的所有产品直接沿用此次设定即可。
具体地，所述步骤
S2
中，所述激光变位器
20
所发出激光的能量密度小于所述激光枪
10
所发出激光的能量密度。
本发明的激光切割方法，采用上述的激光切割装置，省去了切割之前根据不同产品设定不同切割
Recipe
的过程，从而避免设定
Recipe
过程中的易出错事项，避免由
Recipe
编辑错误所导致的应该被切除的地方没有切除、不应被切除的地方被激光枪
10
照射所产生的玻璃破损甚至宕机的现象发生，进而避免品质异常和材料浪费。
综上所述，本发明的激光切割装置，用于对掩膜板上的边角料进行切割去除，包括激光枪及激光变位器；使用时，通过所述激光变位器感知是否有边角料的存在，所述激光枪根据激光变位器的感知结果对所述边角料进行切割去除，即所述激光枪对于存在边角料的区域发出激光进行切割，对于不存在边角料的区域停止发出激光；本发明将激光枪和激光变位器组合使用，这样可以省去切割之前根据不同产品设定不同切割
Recipe
的过程，从而避免设定
Recipe
过程中的易出错事项，避免由
Recipe
编辑错误所导致的应该被切除的地方没有切除、不应被切除的地方被激光枪照射所产生的玻璃破损甚至宕机的现象发生，进而避免品质异常和材料浪费。本发明的激光切割方法，采用上述的激光切割装置，省去了切割之前根据不同产品设定不同切割
Recipe
的过程，从而避免设定
Recipe
过程中的易出错事项，避免由
Recipe
编辑错误所导致的应该被切除的地方没有切除、不应被切除的地方被激光枪照射所产生的玻璃破损甚至宕机的现象发生，进而避免品质异常和材料浪费。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的保护范围。
Claims (10)
- 一种激光切割装置，用于对掩膜板上的边角料进行切割去除，该激光切割装置包括并列设置的激光枪及激光变位器；所述激光变位器能感知是否有边角料的存在，所述激光枪能根据激光变位器的感知结果对所述边角料进行切割去除。
- 如权利要求1所述的激光切割装置，其中，所述激光变位器具有感应端口；所述激光变位器能向所述掩膜板发出激光，所述感应端口能接收由所述掩膜板反射回来的激光，从而测量出感应端口与所述掩膜板之间的距离，通过将该测量距离与设定值进行对比来感知是否有边角料的存在。
- 如权利要求1所述的激光切割装置，其中，所述激光枪和激光变位器的相对位置关系是固定的。
- 如权利要求1所述的激光切割装置，其中，所述激光变位器所发出激光的能量密度小于所述激光枪所发出激光的能量密度。
- 如权利要求1所述的激光切割装置，还包括控制系统，所述控制系统控制所述激光枪及激光变位器的启动与关闭。
- 一种激光切割方法，用于对掩膜板上的边角料进行切割去除，该激光切割方法包括如下步骤：步骤S1、提供待切割的掩膜板及激光切割装置；所述掩膜板上具有待切割去除的边角料；激光切割装置包括并列设置的激光枪及激光变位器；步骤S2、将所述掩膜板放置于激光枪及激光变位器的下方，打开激光变位器，通过所述激光变位器感知是否有边角料的存在，所述激光枪根据激光变位器的感知结果对所述边角料进行切割去除，即所述激光枪对于存在边角料的区域发出激光进行切割，对于不存在边角料的区域停止发出激光。
- 如权利要求6所述的激光切割方法，其中，所述激光变位器具有感应端口；所述步骤S2中，所述激光变位器向所述掩膜板发出激光，所述感应端口接收由所述掩膜板反射回来的激光，从而测量出感应端口与所述掩膜板之间的距离，通过将该测量距离与设定值进行对比来感知是否有边角料的存在。
- 如权利要求6所述的激光切割方法，其中，所述步骤S2中，所述激光枪和激光变位器的相对位置关系是固定的。
- 如权利要求6所述的激光切割方法，其中，所述步骤S2中，所述激光变位器所发出激光的能量密度小于所述激光枪所发出激光的能量密度。
- 如权利要求6所述的激光切割方法，其中，所述步骤S1中提供的激光切割装置还包括控制系统，所述控制系统控制所述激光枪及激光变位器的启动与关闭；所述步骤S1还包括在所述激光切割装置的控制系统中设置激光变位器的移动路径；所述步骤S2中，所述激光变位器感知其移动路径上是否有边角料的存在。
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| CN108274113A (zh) * | 2018-01-19 | 2018-07-13 | 上海维宏电子科技股份有限公司 | 具有温度补偿的带有距离感应功能的激光头装置 |
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| CN104107982A (zh) * | 2013-04-19 | 2014-10-22 | 鸿富锦精密工业（深圳）有限公司 | 切割设备及切割方法 |
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| CN207629412U (zh) * | 2017-12-01 | 2018-07-20 | 广州市莱塞激光设备有限公司 | 一种移动式激光切割机 |
| CN108526729A (zh) * | 2018-04-13 | 2018-09-14 | 武汉华星光电半导体显示技术有限公司 | 激光切割装置以及蒸镀掩膜版的制备方法 |
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- 2019-02-21 US US16/481,584 patent/US20210402521A1/en not_active Abandoned
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| CN108274113A (zh) * | 2018-01-19 | 2018-07-13 | 上海维宏电子科技股份有限公司 | 具有温度补偿的带有距离感应功能的激光头装置 |
| CN108480840A (zh) * | 2018-03-13 | 2018-09-04 | 广州市艾派克智能激光科技有限公司 | 激光重复蚀刻去重实时自动调节焦点位置的装置与方法 |
| CN109352186A (zh) * | 2018-11-07 | 2019-02-19 | 武汉华星光电半导体显示技术有限公司 | 激光切割装置及激光切割方法 |
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| US20210402521A1 (en) | 2021-12-30 |
| CN109352186A (zh) | 2019-02-19 |
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