WO2020087897A1 - Appareil de traitement d'images - Google Patents

Appareil de traitement d'images Download PDF

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Publication number
WO2020087897A1
WO2020087897A1 PCT/CN2019/085024 CN2019085024W WO2020087897A1 WO 2020087897 A1 WO2020087897 A1 WO 2020087897A1 CN 2019085024 W CN2019085024 W CN 2019085024W WO 2020087897 A1 WO2020087897 A1 WO 2020087897A1
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WIPO (PCT)
Prior art keywords
photoelectric conversion
image processing
image
light
accommodating cavity
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PCT/CN2019/085024
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English (en)
Chinese (zh)
Inventor
戚务昌
祁秀梅
姜利
韩晓伟
曲传伟
Original Assignee
威海华菱光电股份有限公司
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Publication of WO2020087897A1 publication Critical patent/WO2020087897A1/fr

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
    • H04N1/024—Details of scanning heads ; Means for illuminating the original
    • H04N1/028—Details of scanning heads ; Means for illuminating the original for picture information pick-up
    • H04N1/03—Details of scanning heads ; Means for illuminating the original for picture information pick-up with photodetectors arranged in a substantially linear array
    • H04N1/031—Details of scanning heads ; Means for illuminating the original for picture information pick-up with photodetectors arranged in a substantially linear array the photodetectors having a one-to-one and optically positive correspondence with the scanned picture elements, e.g. linear contact sensors

Definitions

  • the present application relates to the field of detection, specifically, to an image processing device.
  • contact image processing devices are widely used in fax machines, scanners, banknote sorting, and authentication. With the development of production technology and the needs of production, contact image processing devices have also been gradually applied to industrial production. Perform image recognition and defect identification.
  • the structure of the existing contact image processing device includes a photoelectric conversion chip.
  • the photoelectric conversion chip is used to receive external light to perform photoelectric conversion, and convert the optical signal into an electrical signal.
  • the photoelectric conversion chip has multiple light holes, and the light holes can be set to corresponding sizes according to the requirements of the resolution size.
  • the main method of improving the resolution of the contact image processing device is to reduce the area of the light hole and increase the density of the light hole, so that under the conditions of external light intensity and illumination time, the amount of light received by the light hole is reduced, and the generated charge is reduced. That is, the output voltage (sensitivity) is also reduced, and it is difficult to accurately identify the image; in addition, the resolution of the high-resolution photoelectric conversion chip requires the resolution of the optical lens to be used, but the resolution of the optical lens has reached the limit .
  • the main purpose of the present application is to provide an image processing device to solve the problem of a decrease in sensitivity caused by an increase in the resolution of an image processing device chip in the prior art.
  • an image processing device including: an image sensor including a plurality of identical photoelectric conversion chips arranged in a first direction, each of the above photoelectric conversion chips includes A plurality of photosensitive devices arranged in sequence along a second direction, the first direction is perpendicular to the second direction, each of the photosensitive devices includes a light receiving area, and any adjacent two of the light receiving areas in one of the photoelectric conversion chips The area is the same and there is a gap in the second direction, the width of any two of the gaps is the same, the center of any two adjacent photoelectric conversion chips has a second pitch in the second direction, the first direction and the first
  • the two directions are respectively perpendicular to the thickness direction of the photoelectric conversion chip;
  • the image processing unit is electrically connected to each of the photoelectric conversion chips, and the image processing unit is used to synthesize a plurality of original images output by the image sensor into a composite image.
  • the resolution of the image is at least the resolution of the above original image Times.
  • the projection shapes of any two light receiving regions on the first plane are the same, and the first plane is parallel to the first direction and the second direction, respectively.
  • the projection shape of the light receiving area on the first plane is selected from any one of a circle, a square, a rectangle, an ellipse, and a triangle.
  • the maximum width of each light receiving area in the second direction is X
  • the width of the second pitch is 1 / 3X to 2 / 3X.
  • the width of the second pitch is 1 / 2X.
  • the centers of any two adjacent photoelectric conversion chips have a first pitch in the first direction, the maximum width of each light receiving area in the first direction is Y, and the first pitch is greater than Y, preferably The above first pitch is 1 / 2Y + MY, where M is a natural number greater than 0.
  • the image sensor further includes: a frame body, including a first accommodating cavity, the photoelectric conversion chip is located in the first accommodating cavity; a circuit board is located in the first accommodating cavity, and the photoelectric conversion chip is located in the circuit board on the surface.
  • the frame body further has a second accommodating cavity, the second accommodating cavity communicates with the first accommodating cavity, the second accommodating cavity is located on a side of the photoelectric conversion chip away from the circuit board, and the image sensor further includes : Two light source devices spaced apart in the first direction, namely a first light source device and a second light source device, two of the light source devices are located in the second accommodating cavity; two optical devices spaced in the first direction
  • the lenses are a first optical lens and a second optical lens, respectively.
  • the two optical lenses are located in the second accommodating cavity and between the first light source device and the second light source device. For the light emitted by the optical lens, each of the light receiving areas of one photoelectric conversion chip is used for correspondingly receiving the light emitted by one of the optical lenses.
  • optical lens and the corresponding light-receiving area of the corresponding photoelectric conversion chip are directly arranged.
  • the second accommodating cavity has an opening on the side far away from the first accommodating cavity
  • the image sensor further includes: a transparent plate, which is erected on the side of the opening away from the second accommodating cavity and exits the transparent plate Light is incident on each of the aforementioned optical lenses.
  • the image sensor can output a plurality of original images with the same resolution, and the image processing unit distinguishes a plurality of the same
  • the original images at a high rate are combined to form a composite image with a resolution of at least twice the original image resolution, which makes the image processing device get a higher resolution.
  • a 600DPI photoelectric conversion chip is used, then After the image processing unit, a high-resolution image of 1200 DPI can be obtained, and the sensitivity of the image processing device does not decrease.
  • the scanning speed of the image sensor can be the scanning speed of a single photoelectric conversion chip, the scanning speed of the image sensor can be twice that of an image sensor with the same resolution and having one photoelectric conversion chip.
  • FIG. 1 shows a schematic structural diagram of an embodiment of an image sensor of an image processing device according to the present application
  • FIG. 2 shows a schematic diagram of a partial structure of an image sensor in an embodiment of the present application
  • FIG. 3 shows a schematic diagram of two images output by the image sensor
  • FIG. 4 shows a schematic diagram of a composite area including multiple grids of the present application
  • FIG. 5 shows a schematic diagram after the first sub-pixel is set in the synthesis grid
  • FIG. 6 shows a schematic diagram of forming a synthesized pixel after the first sub-pixel and the second sub-pixel are provided in the synthesized grid.
  • the present application proposes an image processing device.
  • an image processing device in a typical embodiment of the present application, includes an image sensor and an image processing unit.
  • the image sensor includes a plurality of the same photoelectric conversion chips arranged in the first direction.
  • each of the above photoelectric conversion chips includes a plurality of photosensitive devices sequentially arranged in the second direction.
  • the first direction and the first The two directions are perpendicular, and each of the above-mentioned photosensitive devices includes a light-receiving area. Any two adjacent light-receiving areas in the one photoelectric conversion chip have the same area and are spaced in the second direction, and the width of any two of the space Same, the center of any two adjacent photoelectric conversion chips has a second pitch in the second direction, if there are three or more photoelectric conversion chips, then any two photoelectric conversion chips in the second direction The second pitch may be the same or different.
  • the first direction and the second direction are perpendicular to the thickness direction of the photoelectric conversion chip, the image sensor outputs multiple original images, and one original image corresponds to one photoelectric conversion chip, that is One photoelectric conversion chip can output an original image, due to multiple photoelectric conversion cores
  • the center of the slice has a second pitch in the second direction, so that the detection points corresponding to the original images obtained by any two photoelectric conversion chips are different. Since any two photoelectric conversion chips are the same, the number of corresponding original pixels It should be the same, and the size of the original images obtained is the same, so that the detection points corresponding to the corresponding original pixels in the position are different, so that the gray values of the two original pixels corresponding to the position may be different.
  • FIG. 1 shows an image sensor including only two photoelectric conversion chips sequentially arranged in a first direction, which are a first photoelectric conversion chip 8 and a second photoelectric conversion chip 9, respectively. Since FIG. 1 is a cross-sectional view, the photoelectric conversion The arrangement of the chips in the second direction is not shown.
  • the image sensor can output a plurality of original images with the same resolution
  • the image processing unit synthesizes the plurality of original images with the same resolution to form A composite image with a resolution of at least twice the original image resolution, so that the image obtained by the image processing device has a higher resolution. For example, if a 600DPI photoelectric conversion chip is used, then 1200DPI can be obtained after passing through the image processing unit High resolution image.
  • the scanning speed of the image sensor can be the scanning speed of a single photoelectric conversion chip (600DPI)
  • the scanning speed of the image sensor can be the same resolution as that of an image sensor with a photoelectric conversion chip (1200DPI) Twice the speed.
  • any two photosensitive receiving areas of the present application may be the same or different, and the difference here includes different parts and all different, as long as the area is the same, those skilled in the art can set any photosensitive receiving area to be the same according to actual conditions Different shapes.
  • the projection shapes of any two of the above-mentioned photosensitive receiving areas on the first plane are the same.
  • One direction is parallel to the above-mentioned second direction.
  • the shape of the projection of the photosensitive receiving area of the present application on the first plane can be selected from any shape in the prior art, including any regular or irregular shapes, and those skilled in the art can set the photosensitive receiving area as appropriate according to the actual situation shape.
  • the projection shape of the photosensitive receiving area on the first plane is selected from any one of a circle, a square, a rectangle, an ellipse, and a triangle.
  • the projection shape of the photosensitive receiving area on the first plane is rectangular.
  • FIGS. 1 and 2 there are two photoelectric conversion chips.
  • the structure of such an image sensor is simpler, and the resolution of the synthesized image obtained by the image processing device can be guaranteed to be original. Twice the image.
  • the maximum width of each light receiving area in the second direction is X
  • the width of the second pitch is 1 / 3X to 2 / 3X.
  • the width of the above-mentioned second pitch is 1 / 2X.
  • the centers of any two adjacent photoelectric conversion chips have a first pitch in the first direction, and the maximum width of each light receiving area in the first direction is Y, The first pitch is greater than Y, so that the two rows of light receiving regions in the first direction do not overlap in structure.
  • the first pitch is 1 / 2Y + MY, where M is a natural number greater than 0.
  • the image sensor further includes a frame 1 and a circuit board 7, the frame 1 includes a first receiving cavity, and the photoelectric conversion chip is located in the first receiving cavity ;
  • the circuit board 7 is located in the first accommodating cavity, and the photoelectric conversion chip is located on the surface of the circuit board 7, the circuit board 7 is a conductive circuit board.
  • the frame body further has a second accommodating cavity, the second accommodating cavity communicates with the first accommodating cavity, and the second accommodating cavity is located on the photoelectric conversion chip
  • the image sensor further includes two light source devices and two optical lenses.
  • the two light source devices are a first light source device 5 and a second light source device 6, respectively.
  • the two light source devices are located on the first Two accommodating cavities; two optical lenses are a first optical lens 3 and a second optical lens 4 respectively, and the two optical lenses are located in the second accommodating cavity and located in the first light source device 5 and the second light source device 6
  • the photoelectric conversion chips receive the light emitted by the optical lens one by one, and each light receiving area of the photoelectric conversion chip is used to receive the light emitted by the optical lens.
  • the two light source devices and the two optical lenses are spaced apart along the first direction.
  • the light emitted by the light source device irradiates the object to be measured, the images and characters on the object to be generated generate reflected light and excitation light, and a part of the reflected light and the excitation light on the object to be scanned are scanned into the optical lens
  • the reflected light and excitation light from the other end of the optical lens are irradiated to the photoelectric conversion chip.
  • the photoelectric conversion chip converts the received optical signal into an electrical signal.
  • the object to be measured continuously moves, and the image and text information recorded on it It will be read continuously to complete the scanning process of the image information of the object to be measured.
  • the above light source, optical lens and photoelectric conversion chip correspond to each other, that is, the light emitted by a light source passes through the object to be tested and enters a corresponding optical lens, and the light emitted from the optical lens illuminates the corresponding photoelectric conversion chip, and this Part of the light needs to enter the light receiving area of the photoelectric conversion chip.
  • the light receiving area and the optical lens can be arranged up and down, that is, the light emitted by the optical lens directly irradiates the light receiving area.
  • the light receiving area and the optical lens can not be arranged up and down, so that the light from the optical lens It enters the light-receiving area after passing through the reflection device.
  • the optical lens and the corresponding light-receiving area of the corresponding photoelectric conversion chip are directly arranged.
  • the side of the second accommodating cavity away from the first accommodating cavity has an opening
  • the image sensor further includes a transparent plate 2 that is laid over the opening
  • the transparent plate can protect the structure in the frame; on the other hand, it can ensure that most of the light can pass through the transparent plate to reach the optical lens or the object to be measured.
  • the light emitted by the light source is irradiated to the object to be measured through the transparent plate
  • the images and characters on the object to be tested generate reflected light and excitation light, and scanning a part of the reflected light and the excitation light on the object to be tested enters the optical lens through the transparent plate.
  • the photoelectric conversion chip is also called an image sensor chip.
  • the image processing unit of the present application may be any unit in the prior art that can synthesize multiple original images, and those skilled in the art can select an appropriate image processing unit to synthesize the original images according to the actual situation.
  • the original image 10 includes a plurality of original pixels 100, and the original pixels of the plurality of original images 10 correspond to each other one by one, and the area corresponding to each of the original pixels is a composite area 230.
  • the above image synthesis unit includes a grid division module, a gray value assignment module, and a calculation module.
  • the grid division module is electrically connected to the image acquisition unit, and the grid division module is used to divide each synthesis area 230 into N rows and N columns of grids 200 according to the number of the original images 10, specifically, for example, When the image acquisition unit acquires two original images, the grid division module divides the composite area into a grid of 2 rows and 2 columns. When the image acquisition unit obtains three original images, the grid division module divides the composite area into 2 A grid with two rows and two columns, as shown in Figure 4;
  • the gray-scale assignment module is electrically connected to the grid division module.
  • the gray-scale assignment module is used to correspond to the gray-scale values of the plurality of original pixels corresponding to each other as the gray-scale values of the plurality of grids 200, forming multiple First sub-pixels 201, the arrangement direction of the plurality of first sub-pixels 201 is the same as the arrangement direction of the corresponding detection points, for example, when the two original images acquired are the first original image and the second The original image, where any one of the detection points of the first original image and the corresponding detection points of the second original image are arranged in the first direction, then, the original pixels on the two original images correspond to the two Arrangement order of the first sub-pixels in the first direction.
  • FIGS. 3 and 5 please refer to FIGS. 3 and 5.
  • P1 (i, j) in FIG. 5 is the original pixel on the first original image
  • P2 (i, j) is the original pixel on the second original image.
  • the first An original image is the original image on the upper left
  • the second original image is the image on the lower right, where the upper left and lower right are the directions determined by facing the paper or the computer screen, and the multiple first sub-pixels 201 Not in the same row and in the same column;
  • the calculation module is electrically connected to the gray value assignment module and the grid division module, respectively, and the calculation module is used to calculate other unvalued gray values according to the gray value of the first sub-pixel 201 in each of the synthesis regions 230
  • the gray values of the grid 200 form a plurality of second sub-pixels 202, and the synthesis regions 230 form a synthesis pixel 220 corresponding to each other, and the plurality of synthesis pixels 220 form the synthesis image. In this way, multiple low-resolution original images are combined into a high-resolution composite image.
  • the calculation module calculates the average value of the gray values of the plurality of first sub-pixels 201 adjacent to the grid 200 to which each gray value is not assigned in each of the synthesis regions 230 to obtain each The gray value of the grid 200 assigned the gray value.
  • the blank grid is a grid that has not been assigned a gray value, and the gray values of other grids that have been assigned are used to calculate the gray of these unassigned grids.
  • Degree value that is, the gray value corresponding to the grid to which no gray value is assigned is calculated by using the gray value of the first sub-pixel.
  • the specific calculation formula is
  • i the column order of the grid
  • j the row order of the grid
  • n the maximum number of pixels in the horizontal direction on the original image
  • m the maximum number of pixels in the vertical direction on the original graphic.
  • P (2i, 1) represents the gray value of the grid of even columns in the first row.
  • P (2n, 1) represents the gray value of the grid of the last even columns in the first row. .
  • P (1,2j) represents the gray value of the grid of even rows in the first column
  • P (1,2m) represents the gray value of the grid of the last even rows in the first column
  • P (2i-1, 2j) indicates the gray value corresponding to the grid in the penultimate column of the even row
  • P (2i, 2j-1) the gray value corresponding to the grid in the penultimate row of the even column
  • P (2n-1,2j ) Represents the gray value corresponding to the grid of the penultimate column of the even-numbered rows
  • P (2i, 2m-1) corresponds to the gray value of the grid of the penultimate row of the even-numbered columns.
  • the calculation module calculates all the first sub-adjacent adjacent to the grid 200 that is not assigned a gray value in each of the synthesis regions 230
  • the average value of the gradation values of the pixels 201 obtains the gradation values of the grid 200 without gradation values.
  • the gray values of all the first sub-pixels around an empty grid are used to calculate their corresponding gray values.
  • the image processing apparatus further includes a control unit, a program storage unit, and a display unit, the control unit is electrically connected to the image acquisition unit and the image synthesis unit, and the control unit is used to control at least the above The operation of the image acquisition unit and the image synthesis unit; the program storage unit is electrically connected to the control unit and the image synthesis unit, the program storage unit is used to store the program executed by the control unit and the image synthesis unit; the display unit and the above The image synthesis unit and the control unit are electrically connected respectively, and the display unit is used to display the image synthesized by the image synthesis unit.
  • the image processing device further includes an image storage unit, the image storage unit is electrically connected to the image synthesis unit and the control unit, and the image storage unit is used to store the image synthesized by the image synthesis unit. Composite image.
  • the above image processing device further includes a bus, and each unit is electrically connected through the bus, that is, signals are received and transmitted through the bus, and the bus is a signal line.
  • the image processing apparatus includes an image sensor, an image processing unit, a display unit, a program storage unit, an image storage unit, a control unit, and a bus.
  • the image sensor includes two photoelectric conversion chips arranged along the first direction, namely a first photoelectric conversion chip 8 and a second photoelectric conversion chip 9, each of which includes multiple photoelectric conversion chips.
  • Photosensitive devices arranged along the second direction, each photosensitive device includes a light receiving area, that is, each photoelectric conversion chip includes a plurality of light receiving areas arranged along the second direction, and the first photoelectric conversion chip 8 includes a plurality of A light receiving area 80, the second photoelectric conversion chip 9 includes a plurality of second light receiving areas 90.
  • Each of the light receiving areas is a rectangular receiving area, that is, the projection on the first plane is rectangular, the width in the second direction is X, the width in the first direction is Y, the center of the first photoelectric conversion chip and The width of the second pitch of the center of the second photoelectric conversion chip in the second direction is 1 / 2X, and the width of the first pitch in the first direction is 1 / 2Y + Y, that is, the two obtained by the two photoelectric conversion chips
  • the corresponding two original pixels 100 of the original image 10 are offset by 1 / 2Y + Y in the first direction and 1 / 2X in the second direction.
  • the two original images 10 obtained by the two photoelectric conversion chips are shown in FIG. 3 As shown.
  • the image sensor further includes a frame 1, a circuit board 7, two light source devices, two optical lenses, and a transparent board 2.
  • the frame body 1 includes a first accommodating cavity and a second accommodating cavity in communication
  • the photoelectric conversion chip is located in the first accommodating cavity
  • the second accommodating cavity is located on a side of the photoelectric conversion chip away from the circuit board 7, two
  • the optical lenses are located in the second accommodating cavity and between the first light source device 5 and the second light source device 6.
  • the side of the second accommodating cavity away from the first accommodating cavity has an opening
  • the transparent plate 2 is erected On the side of the opening remote from the second accommodating cavity, both optical lenses are spaced apart along the first direction.
  • the first light source device 5, the first optical lens 3, and the first photoelectric conversion chip 8 are correspondingly provided, and the second light source device 6, the second optical lens 4, and the second photoelectric conversion chip 9 are correspondingly provided.
  • the object to be measured When the image processing device is in operation, the object to be measured is placed above the transparent plate 2, the light emitted by the first light source device 5 is irradiated onto the object to be measured through the transparent plate, and the images and text on the object to be measured generate reflected light and Excitation light, scanning part of the reflected light and excitation light on the object to be tested enters the first optical lens 3 through the transparent plate 2, the reflected light and excitation light from the other end of the first optical lens 3 irradiate the first photoelectric conversion chip 8 The first photoelectric conversion chip 8 converts the received optical signal into an electrical signal.
  • the light emitted by the second light source device 6 is irradiated onto the object to be measured through the transparent plate 2, the images and characters on the object to be generated generate reflected light and excitation light, and a part of the reflected light and the excitation light on the object to be scanned are scanned through the transparent plate 2 Enter the second optical lens 4, the reflected light and excitation light from the other end of the second optical lens 4 irradiate the second photoelectric conversion chip 9, and the second photoelectric conversion chip 9 converts the received optical signal into an electrical signal.
  • the image processing unit synthesizes the original images obtained by the photoelectric conversion chip.
  • the resolution of the two original images is 600 DPI.
  • the image processing unit synthesizes the data of the two original images to obtain a composite image with a resolution of 1200 DPI.
  • the scanning speed of this image processing device is twice as fast as that of an equivalent high-resolution sensor.
  • the image processing unit includes a grid division module, a gray value assignment module, and a calculation module.
  • the grid division module is electrically connected to the image acquisition unit, and the grid division module divides the synthesis area into a grid 200 of 2 rows and 2 columns, as shown in FIG. 4;
  • the gray-scale assignment module is electrically connected to the grid division module.
  • the gray-scale assignment module is used to correspond to the gray-scale values of the two original pixels corresponding to each other as the gray-scale values of the two grids 200 to form Two first sub-pixels 201, as shown in FIG. 5, refer to FIGS. 3 and 5, P1 (i, j) in FIG. 5 is the original pixel on the first original image, and P2 (i, j) is the second Original pixels on the original image.
  • the first original image is the original image on the upper left
  • the second original image is the image on the lower right, where the upper left and lower right are judged by facing the paper or the computer screen
  • the calculation module is electrically connected to the gray value assignment module and the grid division module, respectively, and the calculation module is used to calculate other unvalued gray values according to the gray value of the first sub-pixel 201 in each of the synthesis regions 230
  • the gray value of the grid 200 specifically, the calculation module calculates the gray value of the first sub-pixel 201 adjacent to each of the grids 200 to which no gray value is assigned in each of the synthesis regions 230.
  • the average value is used to obtain the gray value of the grid 200 that is not assigned a gray value, and then a plurality of second sub-pixels 202 are formed, and then the synthesized regions 230 form a synthesized pixel 220 corresponding to each other, as shown in FIG. 6,
  • the plurality of synthesized pixels 220 form the synthesized image. In this way, multiple low-resolution original images are combined into a high-resolution composite image.
  • i the column order of the grid
  • j the row order of the grid
  • n the maximum number of pixels in the horizontal direction on the original image
  • m the maximum number of pixels in the vertical direction on the original graphic.
  • P (2i, 1) represents the gray value of the grid of even columns in the first row.
  • P (2n, 1) represents the gray value of the grid of the last even columns in the first row. .
  • P (1,2j) represents the gray value of the grid of even rows in the first column
  • P (1,2m) represents the gray value of the grid of the last even rows in the first column
  • P (2i-1, 2j) indicates the gray value corresponding to the grid in the penultimate column of the even row
  • P (2i, 2j-1) the gray value corresponding to the grid in the penultimate row of the even column
  • P (2n-1,2j ) Represents the gray value corresponding to the grid of the penultimate column of the even-numbered rows
  • P (2i, 2m-1) corresponds to the gray value of the grid of the penultimate row of the even-numbered columns.
  • the control unit is electrically connected to the image acquisition unit and the image processing unit respectively.
  • the control unit is used to control the operation of other units.
  • the program storage unit is electrically connected to the control unit and the image processing unit through a bus.
  • the program storage unit is For storing the programs executed by the control unit and the image processing unit; the display unit is electrically connected to the image processing unit and the control unit through the bus, the display unit is used to display the image synthesized by the image processing unit; the image storage unit is through the bus
  • the image processing unit and the control unit are electrically connected to each other, and the image storage unit is used to store the synthesized image synthesized by the image processing unit.
  • the image sensor by providing a plurality of photoelectric conversion chips in the first direction, the image sensor can output a plurality of original images with the same resolution, and the image processing unit synthesizes the plurality of original images with the same resolution, Form a composite image with a resolution of at least twice the original image resolution, so that the image obtained by the image processing device has a higher resolution.
  • the image processing unit can be the scanning speed of a single photoelectric conversion chip, the scanning speed of the image sensor can be twice that of an image sensor with the same resolution and having one photoelectric conversion chip.

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Abstract

La présente invention concerne un appareil de traitement d'images. L'appareil comprend un capteur d'image et une unité de traitement d'image; le capteur d'image comprend de multiples puces de conversion photoélectrique identiques disposées dans une première direction, chaque puce de conversion photoélectrique comprend de multiples dispositifs photosensibles agencés séquentiellement dans une seconde direction, la première direction étant perpendiculaire à la seconde direction, chaque dispositif photosensible comprend une région de réception de lumière, deux régions de réception de lumière adjacentes d'une puce de conversion photoélectrique ont la même surface et ont un intervalle dans la seconde direction, les largeurs de deux intervalles quelconques sont les mêmes, il y a une seconde distance entre les centres de deux puces de conversion photoélectrique adjacentes quelconques dans la seconde direction, et la première direction et la seconde direction sont séparément perpendiculaires à la direction d'épaisseur de la puce de conversion photoélectrique; l'unité de traitement d'image est électriquement connectée à chaque puce de conversion photoélectrique, l'unité de traitement d'image est utilisée pour synthétiser de multiples images originales délivrées par le capteur d'image en une image synthétique, et la résolution de l'image synthétique est au moins deux fois celle des images originales. L'appareil peut obtenir une image ayant une résolution élevée sans réduire la sensibilité.
PCT/CN2019/085024 2018-10-31 2019-04-29 Appareil de traitement d'images WO2020087897A1 (fr)

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Application Number Priority Date Filing Date Title
CN201811291656.8A CN109274906A (zh) 2018-10-31 2018-10-31 图像处理装置
CN201811291656.8 2018-10-31

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02248152A (ja) * 1989-03-22 1990-10-03 Matsushita Electric Ind Co Ltd 密着型イメージセンサ
US20050094222A1 (en) * 2003-10-29 2005-05-05 Tseng Hsin-Fu High resolution, high sensitivity image scanner having noise cancellation improvements
CN203072041U (zh) * 2013-03-08 2013-07-17 威海华菱光电股份有限公司 接触式图像传感器
DE102012024359A1 (de) * 2012-12-13 2014-06-18 Tichawa IP GmbH Sensoranordnung zur zeilenweisen optischen Abtastung
CN109218558A (zh) * 2018-10-31 2019-01-15 威海华菱光电股份有限公司 图像处理方法、图像处理装置、存储介质和处理器
CN109274906A (zh) * 2018-10-31 2019-01-25 威海华菱光电股份有限公司 图像处理装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108040187A (zh) * 2017-10-25 2018-05-15 威海华菱光电股份有限公司 接触式图像传感器
CN207909164U (zh) * 2017-11-30 2018-09-25 北京集创北方科技股份有限公司 光学检测装置及电子设备
CN209267691U (zh) * 2018-10-31 2019-08-16 威海华菱光电股份有限公司 图像处理装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02248152A (ja) * 1989-03-22 1990-10-03 Matsushita Electric Ind Co Ltd 密着型イメージセンサ
US20050094222A1 (en) * 2003-10-29 2005-05-05 Tseng Hsin-Fu High resolution, high sensitivity image scanner having noise cancellation improvements
DE102012024359A1 (de) * 2012-12-13 2014-06-18 Tichawa IP GmbH Sensoranordnung zur zeilenweisen optischen Abtastung
CN203072041U (zh) * 2013-03-08 2013-07-17 威海华菱光电股份有限公司 接触式图像传感器
CN109218558A (zh) * 2018-10-31 2019-01-15 威海华菱光电股份有限公司 图像处理方法、图像处理装置、存储介质和处理器
CN109274906A (zh) * 2018-10-31 2019-01-25 威海华菱光电股份有限公司 图像处理装置

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