WO2020082634A1 - 一种掩模板及显示面板封装方法 - Google Patents

一种掩模板及显示面板封装方法 Download PDF

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Publication number
WO2020082634A1
WO2020082634A1 PCT/CN2019/072722 CN2019072722W WO2020082634A1 WO 2020082634 A1 WO2020082634 A1 WO 2020082634A1 CN 2019072722 W CN2019072722 W CN 2019072722W WO 2020082634 A1 WO2020082634 A1 WO 2020082634A1
Authority
WO
WIPO (PCT)
Prior art keywords
encapsulation layer
area
mask plate
baffle
mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/072722
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English (en)
French (fr)
Inventor
杜骁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to US16/463,572 priority Critical patent/US11309518B2/en
Publication of WO2020082634A1 publication Critical patent/WO2020082634A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to the field of display technology, in particular to a mask and a display panel packaging method.
  • the traditional display panel area uses glass frame glue or laser sintering packaging technology. It can be called a hard screen package, which cannot achieve flexible characteristics such as bending or bending in the panel area.
  • the flexible packaging of the display screen mainly depends on the thin film packaging technology (Thin Film Ecapsulation, referred to as TFE).
  • the thin film packaging technology currently applied in mass production is Barix packaging technology (inorganic-organic multi-layer packaging), in which the inorganic film is deposited by chemical vapor deposition (Chemical Vapor Deposition, CVD) or atomic layer deposition (Atomic Layer Deposition, ALD ) Process, the organic layer can be chemical vapor deposition or inkjet printing (Ink Jet Printing, IJP) production process.
  • Thin film packaging technology protective film must be limited to the display panel area when packaging the substrate to prevent the panel area from adhering (Panel The bonding and the test bar are covered by the thin film encapsulation film layer, resulting in the failure of subsequent processes and tests.
  • An object of the present invention is to provide a mask plate and a display panel packaging method to solve the existing technical problems that are prone to circuit damage and low substrate yield.
  • the present invention adopts the following technical solutions:
  • the invention provides a mask plate, which includes an opening area and a non-opening area, the opening area includes two long frames arranged opposite to each other; and a first short frame and a second short frame arranged opposite to each other; the non-opening
  • the area includes a plate body, and the opening area penetrates the plate body; a first baffle plate protruding from the middle of the first short bezel of an open area; .
  • first baffle is elongated, and an edge of the first baffle is parallel to the second short frame.
  • the second baffle protrudes from the middle of the second short bezel of the opening area; and / or, the second baffle is elongated and / or isosceles trapezoidal.
  • the second baffle protrudes from the junction of another short frame and a long frame of the opening area; and / or, the second baffle is a part of a circle, and the second baffle The connection with the opening area is an arc.
  • a mask plate frame is further included, and an edge of the plate body is fixedly connected to the mask plate frame.
  • the width of the first baffle is 3-15 mm; and / or the width of the second baffle is 3-15 mm.
  • Another object of the present invention is to provide a display panel packaging method to solve the technical problems that are prone to circuit damage and low substrate yield in the prior art.
  • the present invention also provides a display panel packaging method, which includes the following steps: a substrate evaporation step, an evaporation display substrate; a first mask plate installation step, the mask plate is attached in place Attached to the display substrate; the first inorganic encapsulation layer preparation step, forming the first inorganic encapsulation layer on the display substrate through the opening area of the mask plate; the first mask plate removal step, removing the The mask plate; the organic encapsulation layer preparation step, spraying an organic material on the display substrate, the organic material is cured under ultraviolet irradiation to form an organic encapsulation layer; the second mask plate installation step, the mask The film plate is attached to the display substrate in alignment; the second inorganic encapsulation layer preparation step, a second inorganic encapsulation layer is formed on the display substrate through the opening area of the mask plate; and the second mask plate is moved Except for the step, the mask plate is removed.
  • the display substrate includes a display area, including two oppositely arranged long sides and oppositely arranged first short sides and second short sides; a bonding area is provided at the middle of the first short side; and a notch The zone is located in the middle of the second short side or the junction of the second short side and a long side.
  • the display panel packaging method includes the following steps:
  • the opening area of the mask plate is disposed opposite to the display area of the display substrate; the first baffle of the mask plate and the The bonding area of the display substrate is relatively arranged; the second baffle of the mask plate is arranged opposite to the notch area of the display substrate.
  • the display panel packaging method includes the following steps:
  • the upper surface of the display area is completely covered by the first inorganic encapsulation layer; in the step of preparing the organic encapsulation layer, the upper surface of the first inorganic encapsulation layer is free of edges The portion outside the area is covered by the organic encapsulation layer; in the preparation step of the second inorganic encapsulation layer, the upper surface and side surfaces of the edge area of the organic encapsulation layer and the first inorganic encapsulation layer are covered by the second The inorganic encapsulation layer is completely covered.
  • the invention provides a mask plate and a display panel packaging method, which can be used for a variety of special-shaped flexible OLED panel film packaging, in addition to the traditional rectangular / rounded rectangular flexible OLED panel, it can also encapsulate a special-shaped flexible OLED Panel, optimize the position and scope of the thin film encapsulation layer.
  • the thin film encapsulation layer of the present invention extends from the traditional encapsulation process to the display area to the bonding area, and uses inkjet printing and plasma chemical vapor deposition or atomic deposition processes to form a "concave" type inorganic-organic hybrid encapsulation layer in the bonding area.
  • the invention can effectively prevent the occurrence of circuit damage and further improve the yield rate of the substrate.
  • FIG. 1 is a schematic structural diagram of a first mask in an embodiment of the present invention.
  • FIG. 2 is a schematic structural diagram of a second mask plate in an embodiment of the present invention.
  • FIG. 3 is a flowchart of a display panel packaging method according to an embodiment of the invention.
  • FIG. 4 is a schematic diagram of a display substrate packaging structure according to an embodiment of the present invention.
  • FIG. 5 is a schematic diagram of another display substrate packaging structure in an embodiment of the present invention.
  • FIG. 6 is a partial structural diagram of a bonding area of a display substrate in an embodiment of the present invention.
  • FIG. 7 is a schematic diagram of a partial structure of another display substrate bonding area in an embodiment of the present invention.
  • FIG. 8 is a schematic diagram of the structure of the bonding area according to an embodiment of the present invention.
  • FIG. 9 is a schematic structural view of the display substrate after being packaged according to an embodiment of the present invention.
  • Opening area 1 long frame 100, first short frame 110, second short frame 120, another short frame 130,
  • first baffle 210 first baffle 210, second baffle 220, non-opening area 3
  • mask frame 4 display substrate 5
  • display area 510 long side 5110, first short side 5120, second short side 5130 , Bonding area 520, WOA module 5201, Fanout module 5202, VSS module 5203, FPC module 5204, notch area 530, test area 6, first inorganic encapsulation layer 7, organic encapsulation layer 8, second inorganic encapsulation layer 9, blocking Structure 10, first barrier 101, second barrier 102.
  • a mask for a thin film packaging process of an OLED display panel with a screen notch.
  • the mask plate includes an opening area 1 and a non-opening area 3.
  • the opening area 1 includes two long frames 100 that are opposite to each other, and a first short frame 110 and a second short frame 120 that are opposite to each other;
  • the non-opening area 3 includes a plate 2 that penetrates the opening area 1 and the edges of the plate 2 are fixed Connected to the mask frame 4.
  • This embodiment further includes a first baffle 210 and a second baffle 220.
  • the first baffle 210 protrudes from the middle of the first short frame 110 in an opening area 1; the second baffle 220 protrudes from the opening area 1 Second short frame 120.
  • the entire opening area 1 is approximately a rounded rectangle.
  • a mask plate may include a plurality of opening areas 1, arranged in a matrix in two columns, and the interval of the long border 100 of each two opening areas 1 is 0.02 ⁇ 0.2mm.
  • the size of the mask plate is determined by Determined by the size of the display substrate 5 put into use, the thickness of the mask is 0.05 to 0.3 mm.
  • the first baffle 210 in the mask is elongated, and an edge of the first baffle 210 is parallel to the second short frame 120; the structure of the first mask is that the second baffle 220 protrudes from the opening area 1
  • the middle of the two short bezels 120 may be elongated or isosceles trapezoidal, one edge of the second baffle 220 is parallel to the first short bezel 110, and the second baffle 220 is opposite to the first baffle 210.
  • the second baffle 220 protrudes from the connection between the other short frame 130 of the opening area 1 and a long frame 100; the second baffle 220 is a part of a circle, and the second baffle 220 is The connection of the opening area 1 is an arc.
  • An embodiment of the present invention also provides a display panel packaging method.
  • the thickness of the first inorganic encapsulation layer 7 may be 0.3 um to 3 um
  • the thickness of the organic encapsulation layer 8 may be 3 um to 20 um
  • the thickness of the second inorganic encapsulation layer 9 may be 0.3 um to 3 um.
  • S1 performs a substrate evaporation step to vaporize a display substrate 5.
  • two first barrier members 101 and a second barrier member 102 are formed at a predetermined distance from the edge of the display substrate 5, and the first barrier member 101 and the second barrier member 102 together constitute the barrier structure 10, Both the first blocking member 101 and the second blocking member 102 can form a stepped structure, which can better block the organic material from crossing the blocking structure 10.
  • the display substrate 5 includes a display area 510, a bonding area 520, and a notch area 530 (not shown in FIG. 6).
  • the display area 510 includes two oppositely arranged long sides 5110 and oppositely arranged first short sides 5120 and second short sides 5130; the bonding area 520 is arranged in the middle of the first short side 5120, and the notch area 530 is arranged in the first The middle of the two short sides 5130 or the junction of the second short side 5130 and the long side 5110.
  • the bonding area 520 includes a WOA module 5201, a Fanout module 5202, a VSS module 5203, and an FPC module 5204.
  • the above modules are wiring diagrams for supplying power to the display substrate 5, which also includes a test area 6. The test area 6 is exposed, which can facilitate the maintenance and repair of technicians.
  • S2 performs the step of installing the first mask plate, introduces the first mask plate into the corresponding machine cavity, and the display substrate 5 is placed on the platform carrying the substrate to ensure that the edge of the display substrate 5 is completely stuck into the depression of the platform.
  • the first mask plate lifting device in the first cavity is lowered, and the CCD image sensor, that is, the charge-coupled element, is aligned with the display substrate 5 to attach the first mask plate to the display substrate 5, wherein the size of the first mask plate It is determined by the size of the display substrate 5 that is put into use, and the display substrate 5 of a corresponding size uses a mask of a corresponding size.
  • the opening area 1 of the mask plate is opposite to the display area 510 of the display substrate 5 .
  • the long frame 100 of the mask plate is arranged opposite to the long side 5110 of the display area 510
  • the first short frame 110 of the mask plate is arranged opposite to the first short side 5120 of the display area 510
  • the second short frame of the mask plate 120 is opposite to the second short side 5130 of the display area 510
  • the first baffle 210 of the mask plate protrudes from the middle of the first short bezel 110 of the opening area 1 and the middle of the first short side 5120 of the display area 510
  • the bonding area 520; the second baffle 220 of the mask plate protrudes from the middle of the second short bezel 120 of the opening area 1 and the middle of the second short side 5130 of the display area 510 opposite to the gap area 530 .
  • the first inorganic encapsulation layer 7 preparation step the first inorganic encapsulation layer 7 is formed on the display substrate 5 through the opening area 1 of the first mask plate, and the first inorganic encapsulation layer 7 can be processed by plasma enhanced chemical vapor deposition ( Plasma Enhanced Chemical Vapor Deposition (PECVD), Atomic Layer Deposition (ALD), Pulsed Laser Deposition (Pulsed Laser Deposition) or Sputter (Sputter) process, can be made of silicon nitride / silicon oxynitride or oxide Made of inorganic materials with waterproof properties such as aluminum film.
  • PECVD Plasma Enhanced Chemical Vapor Deposition
  • ALD Atomic Layer Deposition
  • Pulsed Laser Deposition Pulsed Laser Deposition
  • Sputter Sputter
  • the film layer structure may be a single-layer film or a multi-layer film, and its coverage range includes the display area 510 and the distribution area of the WOA module 5201 and the Fanout module 5202 in the bonding area 520, and the film forming range is 50 ⁇ 1000um, the pattern of the first inorganic encapsulation layer 7 is a special-shaped pattern that simultaneously covers the lines of the display area 510 and the bonding area 520.
  • the first mask removal step separates the display substrate 5 from the first mask.
  • FIG. 6 is a structural diagram of the first mask plate after the display substrate 5 is packaged.
  • S5 organic encapsulation layer 8 preparation step an organic material is sprayed on the display substrate 5 by an inkjet printing method, and the organic material is cured under ultraviolet irradiation to form an organic encapsulation layer 8, and the organic material for making the organic encapsulation layer 8 may be acrylic, Hexamethyldimethicone (HMDSO), polyacrylates, polycarbonates, polystyrene, etc.
  • the coverage area of the organic encapsulation layer 8 in the display area 510 is 30 ⁇ 300um shorter than that of the first inorganic encapsulation layer 7.
  • the organic encapsulation layer can cover the first inorganic encapsulation layer 7 while covering the WOA module 5201 of the bonding area 520 and Fanout5202 module distribution area.
  • the pattern of the organic encapsulation layer 8 is set according to the spraying prescription. In general, the set inkjet pattern is the same as the blocking structure 10 provided on the display substrate 5.
  • the second mask board is introduced into the corresponding second machine cavity, the display substrate 5 is placed on the platform carrying the substrate, to ensure that the edge of the display substrate 5 is completely stuck into the recess of the platform .
  • the second mask holding device in the cavity 1 descends, and the CCD image sensor, that is, the charge-coupled element, is aligned with the display substrate 5 to attach the second mask to the display substrate 5, wherein the size of the second mask It is determined by the size of the display substrate 5 that is put into use, and the display substrate 5 of a corresponding size uses a mask of a corresponding size.
  • the opening area 1 of the mask plate is opposite to the display area 510 of the display substrate 5 .
  • the long frame 100 of the mask plate is arranged opposite to the long side 5110 of the display area 510
  • the first short frame 110 of the mask plate is arranged opposite to the first short side 5120 of the display area 510
  • the other short frame of the mask plate 130 is opposite to the second short side 5130 of the display area 510
  • the first baffle 210 of the mask plate protrudes from the middle of the first short bezel 110 of the opening area 1 and the middle of the first short side 5120 of the display area 510
  • the bonding area 520; the second baffle 220 of the mask plate protrudes from the middle of the other short frame 130 of the opening area 1 and the connection between the second short side 5130 and a long side 5110 of the display area 510 is set Described notch area 530.
  • a second inorganic encapsulating layer 9 is formed on the display substrate 5 through the opening area 1 of the first mask plate, and the second inorganic encapsulating layer 9 may be subjected to plasma enhanced chemical vapor deposition ( Plasma Enhanced Chemical Vapor Deposition (PECVD), Atomic Layer Deposition (ALD), Pulsed Laser Deposition (Pulsed Laser Deposition) or Sputter (Sputter) process, can be made of silicon nitride / silicon oxynitride or oxide Made of inorganic materials with waterproof properties such as aluminum film.
  • the film layer structure may be a single-layer film or a multi-layer film.
  • the second inorganic film layer 9 needs to completely cover the organic encapsulation layer 8 to prevent water and oxygen from invading the bottom layer from the side of the organic encapsulation layer 8 Therefore, the film-forming area of the second inorganic encapsulation layer 9 is 50-500um outside the coverage of the organic encapsulation layer 8.
  • the second mask plate removing step separates the display substrate 5 from the second mask plate.
  • FIG. 7 is a structural diagram of the second mask plate after the display substrate 5 is packaged.
  • the packaged display substrate 5 is transferred to the AOI inspection machine to check the coating condition of the thin film package or directly enters the next process.
  • the metal masks used for the first inorganic encapsulation layer 7 and the second inorganic encapsulation layer 9 are transferred from the mask inventory using a robotic arm, and placed in the corresponding chemical vapor deposition or atomic deposition first
  • the machine table cavity and the second machine table cavity are provided with a mold lifting device for holding the mask plate.
  • the display substrate 5 will be transferred to the first chamber of plasma chemical vapor deposition or atomic deposition.
  • the display substrate 5 is placed on the platform carrying the substrate, and the edge of the display substrate 5 can be completely stuck into the platform depression .
  • the cavity of the first machine is provided with a CCD image sensor and the display substrate 5 for positioning, and the PIN opening on the first mask plate frame 4 can also be used for positioning with the display substrate 5, so that the first mask
  • the opening area 1 corresponds to the area of the display area 510 that needs to be coated, and the first mask plate is closely attached to the display substrate 5 by the gravity of the first mask plate or the pressure applied by the platform.
  • the first inorganic The package 7 is deposited, and the pattern forming the encapsulation layer is the same as that of the display area 510, and can completely cover the display area 510.
  • the display substrate 5 is separated from the first mask plate.
  • the display substrate 5 is transferred from the first cavity of chemical vapor deposition or atomic deposition to the inkjet printing machine, the ink is sprayed on the surface of the display substrate 5 according to a preset recipe, and cured under ultraviolet light irradiation to form the organic encapsulation layer 8 ,
  • the organic encapsulation layer 8 and the second inorganic encapsulation layer 9 cover the same pattern, but need to shrink a certain distance, while covering the bonding area 520 WOA module 5201 and Fanout5202 module distribution area, the pattern of the organic encapsulation layer 8 is shaped Graphics.
  • the display substrate 5 will be transferred to the first chamber of plasma chemical vapor deposition or atomic deposition, the display substrate 5 is placed on the platform carrying the substrate, and the edge of the display substrate 5 may be completely stuck in Platform depression.
  • the cavity of the second machine is provided with a CCD image sensor and a display substrate 5 for positioning, and a PIN opening on the mask frame 4 can also be used for positioning with the display substrate 5, thereby enabling the opening area 1 of the second mask to be displayed
  • the second mask plate is closely attached to the display substrate 5 by the gravity of the second mask plate or the pressure applied by the platform.
  • the second inorganic package 7 is deposited The inorganic thin film can completely cover and extend the organic encapsulation layer 8 to a certain extent, blocking water and oxygen from invading the display area 510 from the side of the encapsulation.
  • the display substrate 5 is separated from the second mask plate, and the display substrate 5 is transferred to the AOI inspection machine to check the coating condition of the thin film package, or enters the next process.
  • the invention provides a mask plate and a display panel packaging method, which can be used for a variety of special-shaped flexible OLED panel film packaging.
  • different masks are used according to different shapes of the display area 510.
  • the opening area 1 of the mask plate is opposite to the display area 510 of the display substrate 5;
  • a baffle 210 is disposed opposite to the bonding area 520 of the display substrate 5;
  • a second baffle 220 of the mask plate is disposed opposite to the notch area 530 of the display substrate 5.
  • the above-mentioned first baffle 210 means that the opening area 1 of the mask plate has an inwardly extending baffle in the bonding area 520 corresponding to the display substrate 5 and extends to the boundary of the notch area 530 at 100 to 500 um; the second baffle 220 means The opening area 1 of the mask plate corresponds to that there is a baffle extending inward on the top of the display substrate 5 and extending to the upper edge of the FPC module 5204 at a distance of 100 to 500 um.
  • the shape and extension of the first baffle 210 and the second baffle 220 are designed according to the size of the opening area 1, and the size of the opening area 1 is designed according to the size of the display substrate 5, the first baffle 210 and the second block
  • the width of the board 220 is 3 to 15 mm, and is on the same plane as the shading area.
  • the opening area 1 of the mask plate is compared with the display area 510, the two long frames 100 and the second short frame 120 of the opening area 1 of the mask plate are expanded by 100-500 mm, and the bonding area 520 corresponding to the opening area 1 It is 100 ⁇ 500um away from the upper edge of the test area 6, which can and further delay the entry of water vapor and oxygen into the film seal layer.
  • the mask plate is fixed on the mask plate frame 4 by laser welding, and the size and design of the frame are determined by the internal structure of the machine.
  • the mask is made of metal, with a thickness of 0.05 ⁇ 0.3mm, and the surface is covered with a corrosion-resistant protective film, such as aluminum oxide or polytetrafluoroethylene, used to protect the surface of the mask from damage.
  • a corrosion-resistant protective film such as aluminum oxide or polytetrafluoroethylene
  • the present invention provides a mask plate and a display panel packaging method that can be used for screen packages with various shaped designs.
  • the shaped design referred to herein is defined according to the graphics of the notch area 530.
  • Common display panel packaging methods cover the traditional rectangular / rounded rectangle improved to a special-shaped area, optimizing the location and scope of the thin-film packaging layer.
  • the thin film encapsulation layer of the present invention extends from the traditional packaging process to cover the display area 510 to the bonding area 520, and the FPC module 5204 and the test area 6 of the bonding area 520 are exposed.
  • the inkjet printing and plasma chemical vapor deposition or atomic deposition processes are used in Bang
  • the fixed area 520 forms a "concave" type inorganic-organic hybrid encapsulation layer to protect part of the fragile circuits in the bonding area 520 from damage during the flexible panel manufacturing process.
  • the invention can effectively prevent the occurrence of circuit damage and further improve the yield of the substrate 5.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
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Abstract

一种掩模板及显示面板封装方法。所述掩模板，用于对显示基板（5）进行封装，显示基板（5）包括显示区（510）、邦定区（520）及缺口区（530），掩模板包括开口区（1）及非开口区（3），掩模板的大小由所投入使用显示基板的大小决定，相应大小的显示基板（5）使用相应大小的掩模板。从而可以有效防止出现线路损伤的情况，进一步提升基板产出良率。

Description

一种掩模板及显示面板封装方法 技术领域
本发明涉及显示技术领域，尤其涉及一种掩模板及显示面板封装方法。
 背景技术
近年来，移动终端市场发展刺激新型显示技术进步，为配合移动终端大屏显示和高屏占比的需求，近两年手机行业引入全面屏概念，意在提高手机屏幕的屏占比。由于组装手机通话模块和摄像头模块需在手机屏一面预留相应的位置，所以很多新款全面屏手机均在屏幕顶端设置了开槽口（notch）部分放置通话和摄像头模块，如iphone X、华为P20系列等；对于窄边框全面屏设计面板区，OLED显示器件具有独有的优势，其中柔性OLED显示设备是当前中小尺寸面板区发展的主流方向，传统显示面板区采用玻璃框胶或激光烧结封装技术可称为硬屏封装，无法实现面板区弯曲或弯折等柔性特性，现阶段实现显示屏的柔性封装主要依靠薄膜封装技术（Thin Film Ecapsulation，简称TFE）。
现阶段量产应用的薄膜封装技术为Barix封装技术（无机-有机多膜层封装），其中无机膜层通过化学气相沉积（Chemical Vapor Deposition，简称CVD）或原子层沉积（Atomic Layer Deposition，简称ALD）制程制作，有机层可由化学气相沉积或喷墨印刷（Ink Jet Printing ，IJP）制程制作。薄膜封装技术保护膜对基板进行封装时需限定在显示面板区，防止面板区粘合区（Panel bonding）和测试棒（test bar）被薄膜封装膜层覆盖，导致后续制程和测试失效。
 技术问题
本发明一个目的在于，提供一种掩模板及显示面板封装方法，以解决现有技术中存在的容易出现线路损伤、基板产出良率低等技术问题。
 技术解决方案
为实现上述目的，本发明采用如下技术方案：
本发明提供一种掩膜板，包括开口区及非开口区，所述开口区包括彼此相对设置的两条长边框；以及彼此相对设置的第一短边框及第二短边框；所述非开口区包括板体，所述开口区贯穿所述板体；第一挡板，突出于一开口区的第一短边框的中部；以及第二挡板，突出于所述开口区的第二短边框。
进一步地，所述第一挡板为长条形，所述第一挡板的一边缘平行于所述第二短边框。
进一步地，所述第二挡板突出于所述开口区的第二短边框的中部；和/或，所述第二挡板为长条形和/或等腰梯形。
进一步地，所述第二挡板突出于所述开口区的另一短边框与一长边框的连接处；和/或，所述第二挡板为圆形的一部分，所述第二挡板与所述开口区连接处为一弧线。
进一步地，还包括掩膜板框架，所述板体的边缘固定连接至所述掩膜板框架。
进一步地，所述第一挡板的宽度为3~15mm；和/或所述第二挡板的宽度为3~15mm。
本发明另一目的在于，提供一种显示面板封装方法，以解决现有技术中存在的容易出现线路损伤、基板产出良率低等技术问题。
为实现上述目的，本发明还提供了一种显示面板封装方法，包括如下步骤：基板蒸镀步骤，蒸镀一显示基板；第一掩膜板安装步骤，将所述的掩膜板对位贴附至所述显示基板上方；第一无机封装层制备步骤，透过该掩膜板的开口区在所述显示基板上形成第一无机封装层；第一掩膜板移除步骤，移除所述的掩膜板；有机封装层制备步骤，在所述显示基板上喷涂有机材料，所述有机材料在紫外线照射下固化，形成有机封装层；第二掩膜板安装步骤，将所述的掩膜板对位贴附至所述显示基板上方；第二无机封装层制备步骤，透过该掩膜板的开口区在所述显示基板上形成第二无机封装层；以及第二掩膜板移除步骤，移除所述的掩膜板。
进一步地，所述显示基板包括显示区，包括两条相对设置的长边及相对设置的第一短边及第二短边；邦定区，设于所述第一短边的中部；以及缺口区，设于所述第二短边的中部或第二短边与一长边的连接处。
进一步地，所述的显示面板封装方法，包括如下步骤：
在第一掩膜板安装步骤或第二掩膜板安装步骤中，所述掩膜板的开口区与所述显示基板的显示区相对设置；所述掩膜板的第一挡板与所述显示基板的邦定区相对设置；所述掩膜板的第二挡板与所述显示基板的缺口区相对设置。
进一步地，所述的显示面板封装方法，包括如下步骤：
在所述第一无机封装层制备步骤中，所述显示区上表面被所述第一无机封装层全部覆盖；在所述有机封装层制备步骤中，所述第一无机封装层上表面除边缘区以外的部分被所述有机封装层覆盖；在所述第二无机封装层制备步骤中，所述有机封装层及所述第一无机封装层的边缘区的上表面及侧面被所述第二无机封装层全部覆盖。
 有益效果
本发明提供一种掩模板及一种显示面板封装方法，可以用于多种异形设计的柔性OLED面板薄膜封装，除传统的矩形/圆角矩形的柔性OLED面板外，还可以封装异形的柔性OLED面板，优化薄膜封装层的位置和范围。本发明的薄膜封装层由传统封装制程覆盖显示区扩展至邦定区，利用喷墨打印和等离子化学气相沉积或原子沉积制程在邦定区形成“凹”型的无机-有机杂化封装层，保护邦定区部分脆弱电路在柔性面板制程中不受损。本发明可以有效防止出现线路损伤的情况，进一步提升基板产出良率。
 附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本发明实施例中第一掩模板的结构示意图。
图2是本发明实施例中第二掩模板的结构示意图。
图3是本发明实施例所述显示面板封装方法的流程图。
图4是本发明实施例中一种显示基板封装结构示意图。
图5是本发明实施例中另一种显示基板封装结构示意图。
图6是本发明实施例中一种显示基板邦定区的局部结构示意图。
图7是本发明实施例中另一种显示基板邦定区的局部结构示意图。
图8是本发明实施例所述邦定区结构示意图。
图9是本发明实施例所述显示基板被封装后的结构示意图。
附图中部件标记如下：
开口区1，长边框100，第一短边框110，第二短边框120，另一短边框130，
板体2，第一挡板210，第二挡板220，非开口区3，掩膜板框架4，显示基板5，显示区510，长边5110，第一短边5120，第二短边5130，邦定区520，WOA模块5201，Fanout模块5202，VSS模块5203，FPC模块5204，缺口区530，测试区6，第一无机封装层7，有机封装层8，第二无机封装层9，阻挡结构10，第一阻挡件101，第二阻挡件102。
 本发明的实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
本发明的说明书和权利要求书以及上述附图中的术语“第一”、“第二”、“第三”等（如果存在）是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。应当理解，这样描述的对象在适当情况下可以互换。此外，术语“包括”和“具有”以及他们的任何变形，意图在于覆盖不排他的包含。
在本专利文档中，下文论述的附图以及用来描述本发明公开的原理的各实施例仅用于说明，而不应解释为限制本发明公开的范围。所属领域的技术人员将理解，本发明的原理可在任何适当布置的系统中实施。将详细说明示例性实施方式，在附图中示出了这些实施方式的实例。此外，将参考附图详细描述根据示例性实施例的终端。附图中的相同附图标号指代相同的元件。
本发明说明书中使用的术语仅用来描述特定实施方式，而并不意图显示本发明的概念。除非上下文中有明确不同的意义，否则，以单数形式使用的表达涵盖复数形式的表达。在本发明说明书中，应理解，诸如“包括”、“具有”以及“含有”等术语意图说明存在本发明说明书中揭示的特征、数字、步骤、动作或其组合的可能性，而并不意图排除可存在或可添加一个或多个其他特征、数字、步骤、动作或其组合的可能性。附图中的相同参考标号指代相同部分。
为更进一步阐述本发明为达成预定发明目的所采取的技术方式及功效，以下结合附图及实施例，对本发明的具体实施方式、结构、特征及其功效，详细说明如后。
本实施例中提供一种掩模板，用于具有屏幕开槽口（notch）的OLED显示面板的薄膜封装工艺。如图1所示，掩模板包括开口区1及非开口区3。开口区1包括彼此相对设置的两条长边框100以及彼此相对设置的第一短边框110及第二短边框120；非开口区3包括贯穿开口区1的板体2，板体2的边缘固定连接至掩膜板框架4。本实施例还包括第一挡板210以及第二挡板220，第一挡板210突出于一开口区1的第一短边框110的中部；第二挡板220突出于所述开口区1的第二短边框120。其中，开口区1整体近似为圆角矩形。
如图1、2所示，一个掩模板可以包括多个开口区1，分两列排成矩阵，每两个开口区1的长边框100的间隔为0.02~0.2mm，掩模板的大小由所投入使用显示基板5大小决定的，掩模板的厚度为0.05~0.3mm。在开口区1存在一定的椎角（taper corner），且掩膜版上有抗腐蚀保护膜，如氧化铝或聚四氟乙烯涂层等，防止化学气相沉积或原子沉积制程中导致模具受损。在掩模板中的第一挡板210为长条形，第一挡板210的一边缘平行于第二短边框120；第一掩模板的结构为第二挡板220突出于开口区1的第二短边框120的中部，形状可以为长条形或等腰梯形，第二挡板220的一边缘平行于第一短边框110，以及第二挡板220与第一挡板210相对设置。在第二掩模板结构中，第二挡板220突出于开口区1的另一短边框130与一长边框100的连接处；第二挡板220为圆形的一部分，第二挡板220与开口区1连接处为一弧线。
本发明的实施例还提供了一种显示面板封装方法，具体的显示面板封装方法步骤请参照图3。如图4所示，第一无机封装层7的厚度可为0.3um~3um；有机封装层8的厚度可为3um~20um；第二无机封装层9的厚度可为0.3um~3um。
在进行封装时，S1进行基板蒸镀步骤，蒸镀一显示基板5。如图5所示，显示基板5边缘形成有两个间隔预设距离的第一阻挡件101和第二阻挡件102，由第一阻挡件101和第二阻挡件102共同组成阻挡结构10，第一阻挡件101和第二阻挡件102都能够形成阶梯结构，这样能够更好地阻挡有机材料越过阻挡结构10。
如图6~7所示，显示基板5包括显示区510、邦定区520及缺口区530（图6未示）。其中，显示区510包括两条相对设置的长边5110及相对设置的第一短边5120及第二短边5130；邦定区520设置在第一短边5120的中部，缺口区530设置在第二短边5130的中部或第二短边5130与一长边5110的连接处。此外，如图8所示，邦定区520包括WOA模块5201、Fanout模块5202、VSS模块5203及FPC模块5204，以上模块是为显示基板5供电的布线图，其中还包括一测试区6，该测试区6外露，这样可以方便技术人员维护及检修。
S2进行第一掩膜板安装步骤，将第一掩膜板传入对应的机台腔体，显示基板5放置在承载基板的平台上，保证显示基板5的边缘完全卡进平台的凹陷处。第一腔体内的第一掩模板托举装置下降，通过CCD图像传感器即电荷耦合元件与显示基板5完成对位，使第一掩模板贴附至显示基板5上方，其中第一掩模板的大小是根据由所投入使用显示基板5大小决定，相应大小的显示基板5使用相应大小的掩模板。
如图1所示，在第一掩膜板安装步骤中，当第一掩膜板与显示基板5完成对位贴附时，掩膜板的开口区1与显示基板5的显示区510相对设置。具体地说，掩膜板的长边框100与显示区510的长边5110相对设置，掩模板的第一短边框110与显示区510的第一短边5120相对设置；掩模板的第二短边框120与显示区510的第二短边5130相对设置；掩模板的第一挡板210突出于开口区1的第一短边框110的中部与显示区510的第一短边5120的中部相对设置即所述的邦定区520；掩模板的第二挡板220突出于开口区1的第二短边框120的中部与显示区510的第二短边5130的中部相对设置即所述的缺口区530。
S3第一无机封装层7制备步骤，透过第一掩膜板的开口区1在显示基板5上形成第一无机封装层7，第一无机封装层7可通过等离子体增强化学气相沉积法(Plasma Enhanced Chemical Vapor Deposition，PECVD)、原子层沉积法(Atomic Layer Deposition，ALD)、脉冲激光沉积法(Pulsed Laser Deposition)或溅射法(Sputter)制程制备的，可由氮化硅/氮氧化硅或氧化铝膜等具有防水特性的无机材料制成。此外，膜层结构可为单层膜或多层膜，其覆盖范围包含显示区510以邦定区520的WOA模块5201及Fanout模块5202分布区，其成膜范围为显示区510外扩50~1000um，第一无机封装层7的图形为同时覆盖显示区510与邦定区520线路的异型图形。
S4第一掩膜板移除步骤，将显示基板5与第一掩膜板分离。
图6为第一掩膜板在显示基板5进行封装后的结构图。
S5有机封装层8制备步骤，在显示基板5上喷墨打印方法喷涂有机材料，有机材料在紫外线照射下固化形成有机封装层8，制作有机封装层8的有机材料可为丙烯酸类(Acrylic)、六甲基二甲硅醚(HMDSO)、聚丙烯酸酯类、聚碳酸脂类、聚苯乙烯等。有机封装层8在显示区510的覆盖范围较第一无机封装层7覆盖范围内缩30~300um，有机封装层可将第一无机封装层7覆盖，同时覆盖邦定区520的WOA模块5201及Fanout5202模块分布区。有机封装层8的图形会根据喷涂处方设定，一般情况下设定的喷墨图形跟显示基板5上设置的阻挡结构10相同。
S6第二掩膜板安装步骤，将第二掩膜板传入对应的第二机台腔体，显示基板5放置在承载基板的平台上，保证显示基板5的边缘完全卡进平台的凹陷处。腔体一内的第二掩模板托举装置下降，通过CCD图像传感器即电荷耦合元件与显示基板5完成对位，使第二掩模板贴附至显示基板5上方，其中第二掩模板的大小是根据由所投入使用显示基板5大小决定，相应大小的显示基板5使用相应大小的掩模板。
如图2所示，在第二掩膜板安装步骤中，当第二掩膜板与显示基板5完成对位贴附时，掩膜板的开口区1与显示基板5的显示区510相对设置。具体地说，掩膜板的长边框100与显示区510的长边5110相对设置，掩模板的第一短边框110与显示区510的第一短边5120相对设置；掩模板的另一短边框130与显示区510的第二短边5130相对设置；掩模板的第一挡板210突出于开口区1的第一短边框110的中部与显示区510的第一短边5120的中部相对设置即所述的邦定区520；掩模板的第二挡板220突出于开口区1的另一短边框130的中部与显示区510的第二短边5130与一长边5110的连接处相对设置即所述的缺口区530。
S7第二无机封装层9制备步骤，透过第一掩膜板的开口区1在显示基板5上形成第二无机封装层9，第二无机封装层9可通过等离子体增强化学气相沉积法(Plasma Enhanced Chemical Vapor Deposition，PECVD)、原子层沉积法(Atomic Layer Deposition，ALD)、脉冲激光沉积法(Pulsed Laser Deposition)或溅射法(Sputter)制程制备的，可由氮化硅/氮氧化硅或氧化铝膜等具有防水特性的无机材料制成。此外，膜层结构可为单层膜或多层膜，由于有机膜水氧阻隔能力不足，第二无机膜层9需将有机封装层8完全覆盖，防止水氧从有机封装层8侧面侵入底层，故第二无机封装层9成膜区域为有机封装层8覆盖范围外扩50~500um。
S8第二掩膜板移除步骤，将显示基板5与第二掩膜板分离。
图7为第二掩膜板在显示基板5进行封装后的结构图。
如图9所示，在完成上述步骤后，将封装好的显示基板5传送至AOI检查机上检查薄膜封装的镀膜状况或直接进入下一步制程。
本实施例中，第一无机封装层7及第二无机封装层9使用的金属掩模板是用机械手臂从掩模板库存中调出的，分别放置在对应的化学气相沉积或原子沉积的第一机台腔及第二机台腔体，机台腔体设有模具托举装置用来托举掩模板。
完成蒸镀制程的显示基板5会被传送到等离子化学气相沉积或原子沉积的第一腔体内，显示基板5被放置在承载基板的平台上，显示基板5的边缘可以完全地卡进平台凹陷处。
此时，第一机台腔体设有CCD图像传感器与显示基板5进行对位，还可以利用第一掩模板框架4上PIN开孔与显示基板5进行对位，进而使第一掩模板的开口区1与显示区510需要镀膜的区域相对应，利用第一掩模板自身的重力或平台施加的压力使第一掩模板与显示基板5紧密贴合，经过一系列的制程，完成第一无机封装7沉淀，形成封装层的图形与显示区510相同，并能将显示区510完全覆盖。
在完成第一无机封装层7后，显示基板5与第一掩模板分离。显示基板5从化学气相沉积或原子沉积的第一腔体传送到喷墨印刷机台，按照预设的配方，将墨水喷涂在显示基板5表面，并在紫外光照射下固化形成有机封装层8，有机封装层8与第二无机封装层9覆盖的图形相同，但需要内缩一定的距离，同时覆盖邦定区520的WOA模块5201及Fanout5202模块分布区，上述有机封装层8的图形为异型图形。
在完成有机封装层8后，显示基板5会被传送到等离子化学气相沉积或原子沉积的第一腔体内，显示基板5被放置在承载基板的平台上，显示基板5的边缘可以完全地卡进平台凹陷处。
第二机台腔体设有CCD图像传感器与显示基板5进行对位，还可以利用掩模板框架4上PIN开孔与显示基板5进行对位，进而使第二掩模板的开口区1与显示区510需要镀膜的区域相对应，利用第二掩模板自身的重力或平台施加的压力使第二掩模板与显示基板5紧密贴合，经过一系列的制程，完成第二无机封装7沉淀，形成的无机薄膜可将有机封装层8完全覆盖并外延一定的范围，阻挡水氧从封装侧面侵入显示区510。
在完成上述封装后，显示基板5与第二掩模板分离，显示基板5被传送至AOI检查机检查薄膜封装的镀膜情况，或进入下一步制程。
本发明提供一种掩模板及一种显示面板封装方法，可以用于多种异形设计的柔性OLED面板薄膜封装。在本实施例中，根据显示区510不同的形状采用不同的掩模板，当使用掩模板进行安装时，掩膜板的开口区1与显示基板5的显示区510相对设置；掩膜板的第一挡板210与显示基板5的邦定区520相对设置；掩膜板的第二挡板220与显示基板5的缺口区530相对设置。
上述第一挡板210是指掩模板的开口区1在对应显示基板5的邦定区520存在向内延伸的挡板，延伸至缺口区530边界100~500um处；第二挡板220是指掩模板的开口区1对应显示基板5的顶部存在向内延伸的挡板，延伸至FPC模块5204上沿100~500um处。第一挡板210和第二挡板220的形状及延伸量是根据开口区1的大小设计的，开口区1的大小是根据显示基板5的大小设计的，第一挡板210和第二挡板220的宽度都为3~15mm，且与遮光区位于同一平面上。当设计具有屏幕缺口区530的OLED显示面板的薄膜封装时，这样会更好地保护异型设计邦定区520线路避免在制程中的损伤，进一步提升基板5的产出良率。
在本实施例中，掩模板的开口区1与显示区510对比，掩模板的开口区1的两长边框100及第二短边框120外扩100~500mm，开口区1对应的邦定区520与测试区6上沿相距100~500um，这样可以并进一步延缓了水汽和氧气等进入薄膜封层。
进一步地，掩模板是通过激光焊接方法固定在掩模板框架4上，框架的大小和设计由机台内部结构决定。掩模板为金属，其厚度为0.05~0.3mm，表面覆盖着具有耐腐蚀性的保护膜，如氧化铝或聚四氟乙烯等，用来保护掩模板表面不受损，掩模板中存在多个开口区1，每个开口区1朝向显示基板5的边缘存在部分半刻蚀区域，防止掩模板的开口区1的边缘将显示基板5刮伤。
本发明提供一种掩模板及显示面板封装方法可以用于多种异形设计的屏幕封装，这里所指的异形设计根据缺口区530的图形进行定义的。常见的显示面板封装方法覆盖由传统的矩形/圆角矩形改进为异形区域，优化薄膜封装层的位置和范围。本发明的薄膜封装层由传统封装制程覆盖显示区510扩展至邦定区520，邦定区520的FPC模块5204和测试区6外露，利用喷墨打印和等离子化学气相沉积或原子沉积制程在邦定区520形成“凹”型的无机-有机杂化封装层，保护邦定区520部分脆弱电路在柔性面板制程中不受损。本发明可以有效防止出现线路损伤的情况，进一步提升基板5产出良率。
在描述本发明的概念的过程中使用了术语“一”和“所述”以及类似的词语(尤其是在所附的权利要求书中)，应该将这些术语解释为既涵盖单数又涵盖复数。此外，除非本文中另有说明，否则在本文中叙述数值范围时仅仅是通过快捷方法来指代属于相关范围的每个独立的值，而每个独立的值都并入本说明书中，就像这些值在本文中单独进行了陈述一样。另外，除非本文中另有指明或上下文有明确的相反提示，否则本文中所述的所有方法的步骤都可以按任何适当次序加以执行。本发明的改变并不限于描述的步骤顺序。除非另外主张，否则使用本文中所提供的任何以及所有实例或示例性语言(例如，“例如”)都仅仅为了更好地说明本发明的概念，而并非对本发明的概念的范围加以限制。在不脱离精神和范围的情况下，所属领域的技术人员将易于明白多种修改和适应。
以上对本发明实施例所提供一种掩模板及显示面板封装方法。应理解，本文所述的示例性实施方式应仅被认为是描述性的，用于帮助理解本发明的方法及其核心思想，而并不用于限制本发明。在每个示例性实施方式中对特征或方面的描述通常应被视作适用于其他示例性实施例中的类似特征或方面。尽管参考示例性实施例描述了本发明，但可建议所属领域的技术人员进行各种变化和更改。本发明意图涵盖所附权利要求书的范围内的这些变化和更改。

Claims (10)

  1. 一种掩膜板，包括开口区及非开口区，其中，
    所述开口区包括
    彼此相对设置的两条长边框；以及
    彼此相对设置的第一短边框及第二短边框；
    所述非开口区包括
    板体，所述开口区贯穿所述板体；
    第一挡板，突出于一开口区的第一短边框的中部；以及
    第二挡板，突出于所述开口区的第二短边框。
  2. 如权利要求1所述的掩模板，其中，
    所述第一挡板为长条形，
    所述第一挡板的一边缘平行于所述第二短边框。
  3. 如权利要求1所述的掩模板，其中，
    所述第二挡板突出于所述开口区的第二短边框的中部；和/或，
    所述第二挡板为长条形和/或等腰梯形。
  4. 如权利要求1所述的掩模板，其中，
    所述第二挡板突出于所述开口区的另一短边框与一长边框的连接处；和/或，
    所述第二挡板为圆形的一部分，所述第二挡板与所述开口区连接处为一弧线。
  5. 如权利要求1所述的掩模板，其中，还包括
    掩膜板框架，所述板体的边缘固定连接至所述掩膜板框架。
  6. 如权利要求1所述的掩模板，其中，
    所述第一挡板的宽度为3~15mm；和/或，
    所述第二挡板的宽度为3~15mm。
  7. 一种显示面板封装方法，其中，包括如下步骤：
    S1 基板蒸镀步骤，蒸镀一显示基板；
    S2 第一掩膜板安装步骤，将如权利要求3所述的掩膜板对位贴附至所述显示基板上方；
    S3 第一无机封装层制备步骤，透过该掩膜板的开口区在所述显示基板上形成第一无机封装层；
    S4 第一掩膜板移除步骤，移除如权利要求3所述的掩膜板；
    S5 有机封装层制备步骤，在所述显示基板上喷涂有机材料，所述有机材料在紫外线照射下固化，形成有机封装层；
    S6 第二掩膜板安装步骤，将如权利要求4所述的掩膜板对位贴附至所述显示基板上方；
    S7 第二无机封装层制备步骤，透过该掩膜板的开口区在所述显示基板上形成第二无机封装层；以及
    S8 第二掩膜板移除步骤，移除如权利要求4所述的掩膜板。
  8. 如权利要求7所述的显示面板封装方法，其中，
    所述显示基板包括
    显示区，包括两条相对设置的长边及相对设置的第一短边及第二短边；
    邦定区，设于所述第一短边的中部；以及
    缺口区，设于所述第二短边的中部或第二短边与一长边的连接处。
  9. 如权利要求8所述的显示面板封装方法，其中，包括如下步骤：
    在第一掩膜板安装步骤或第二掩膜板安装步骤中，
    所述掩膜板的开口区与所述显示基板的显示区相对设置；
    所述掩膜板的第一挡板与所述显示基板的邦定区相对设置；
    所述掩膜板的第二挡板与所述显示基板的缺口区相对设置。
  10. 如权利要求8所述的显示面板封装方法，其中，包括如下步骤：
    在所述第一无机封装层制备步骤中，所述显示区上表面被所述第一无机封装层全部覆盖；
    在所述有机封装层制备步骤中，所述第一无机封装层上表面除边缘区以外的部分被所述有机封装层覆盖；
    在所述第二无机封装层制备步骤中，
    所述有机封装层及所述第一无机封装层的边缘区的上表面及侧面被所述第二无机封装层全部覆盖。
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Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110649183A (zh) * 2019-09-02 2020-01-03 武汉华星光电半导体显示技术有限公司 一种显示面板的制作方法
CN110707242A (zh) 2019-09-02 2020-01-17 武汉华星光电半导体显示技术有限公司 一种显示面板的制作方法
EP4050121A4 (en) 2019-10-21 2024-04-17 Jiangsu Favored Nanotechnology Co., Ltd. Coating method and film layer thereof, and coating fixture and application thereof
CN110699662B (zh) * 2019-10-21 2022-05-27 江苏菲沃泰纳米科技股份有限公司 镀膜方法及其膜层
JP7485484B2 (ja) * 2019-12-11 2024-05-16 京東方科技集團股▲ふん▼有限公司 表示基板及びその製作方法並びに表示装置
JP7749925B2 (ja) * 2020-03-13 2025-10-07 大日本印刷株式会社 有機デバイスの製造装置の蒸着室の評価方法
CN111621742B (zh) * 2020-05-19 2021-07-23 武汉华星光电半导体显示技术有限公司 一种掩膜板及其应用方法、封装层的制备方法
CN112133798A (zh) * 2020-08-18 2020-12-25 聚灿光电科技（宿迁）有限公司 镂空掩膜版及使用镂空掩膜版制造led芯片的方法
KR102929156B1 (ko) * 2020-08-31 2026-02-24 삼성디스플레이 주식회사 마스크, 이의 제조 방법, 및 표시 패널 제조 방법
CN114134460B (zh) * 2021-11-29 2023-06-06 昆山国显光电有限公司 掩膜板
CN114381688B (zh) * 2021-12-30 2024-04-23 昆山工研院新型平板显示技术中心有限公司 掩膜版组件及掩膜版、蒸镀边界确认及蒸镀偏位校正方法
CN114574803A (zh) * 2022-02-28 2022-06-03 云谷（固安）科技有限公司 掩膜版、显示面板制造方法及显示面板

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107740040A (zh) * 2017-09-08 2018-02-27 上海天马有机发光显示技术有限公司 掩膜版组件及蒸镀装置
CN107994054A (zh) * 2017-11-07 2018-05-04 上海天马有机发光显示技术有限公司 一种有机电致发光显示面板、其制作方法及显示装置
CN108004521A (zh) * 2017-11-27 2018-05-08 武汉华星光电半导体显示技术有限公司 掩膜版及薄膜封装方法
CN108277473A (zh) * 2018-01-22 2018-07-13 京东方科技集团股份有限公司 一种掩膜装置、显示面板及其制作方法、显示装置
JP2018138698A (ja) * 2018-04-26 2018-09-06 堺ディスプレイプロダクト株式会社 蒸着マスクの製造方法、蒸着マスク、および有機半導体素子の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101934244B1 (ko) 2013-03-26 2018-12-31 다이니폰 인사츠 가부시키가이샤 증착 마스크, 증착 마스크 준비체, 증착 마스크의 제조 방법 및 유기 반도체 소자의 제조 방법
CN104157550B (zh) * 2014-07-28 2016-08-31 京东方科技集团股份有限公司 薄膜图形化方法及掩膜板
CN105803390A (zh) * 2016-05-20 2016-07-27 京东方科技集团股份有限公司 用于沉积膜层的掩膜板及膜层、阵列基板
CN106567052B (zh) * 2016-10-24 2018-11-23 武汉华星光电技术有限公司 掩膜板及oled器件的封装方法
CN107740065B (zh) * 2017-09-26 2020-03-31 京东方科技集团股份有限公司 一种掩模版及其成膜方法、成膜设备

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107740040A (zh) * 2017-09-08 2018-02-27 上海天马有机发光显示技术有限公司 掩膜版组件及蒸镀装置
CN107994054A (zh) * 2017-11-07 2018-05-04 上海天马有机发光显示技术有限公司 一种有机电致发光显示面板、其制作方法及显示装置
CN108004521A (zh) * 2017-11-27 2018-05-08 武汉华星光电半导体显示技术有限公司 掩膜版及薄膜封装方法
CN108277473A (zh) * 2018-01-22 2018-07-13 京东方科技集团股份有限公司 一种掩膜装置、显示面板及其制作方法、显示装置
JP2018138698A (ja) * 2018-04-26 2018-09-06 堺ディスプレイプロダクト株式会社 蒸着マスクの製造方法、蒸着マスク、および有機半導体素子の製造方法

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