WO2020078778A1 - Ensemble de composant semi-conducteur, procédé pour sa fabrication ainsi que dispositif de dissipation de chaleur - Google Patents

Ensemble de composant semi-conducteur, procédé pour sa fabrication ainsi que dispositif de dissipation de chaleur Download PDF

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Publication number
WO2020078778A1
WO2020078778A1 PCT/EP2019/077255 EP2019077255W WO2020078778A1 WO 2020078778 A1 WO2020078778 A1 WO 2020078778A1 EP 2019077255 W EP2019077255 W EP 2019077255W WO 2020078778 A1 WO2020078778 A1 WO 2020078778A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal block
circuit board
metal
semiconductor component
face
Prior art date
Application number
PCT/EP2019/077255
Other languages
German (de)
English (en)
Inventor
Detlev Bagung
Christina QUEST-MATT
Thomas Riepl
Daniela Wolf
Original Assignee
Vitesco Technologies GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vitesco Technologies GmbH filed Critical Vitesco Technologies GmbH
Priority to CN201980068203.5A priority Critical patent/CN112805828A/zh
Priority to US17/285,295 priority patent/US20220115290A1/en
Priority to EP19789603.8A priority patent/EP3867949A1/fr
Publication of WO2020078778A1 publication Critical patent/WO2020078778A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Definitions

  • the present disclosure relates to a semiconductor component arrangement, a method for its production and a heat dissipation device
  • Semiconductor components especially power semiconductor components, such as power metal oxide semiconductor field effect transistors (so-called.
  • Power MOSFETs are often used as components in housings
  • Cooling surfaces (so-called “heatslug”, “exposed pad”) supplied.
  • housing designs for example designs known under the names TO220, D2PAK or DPAK.
  • Power semiconductor components are intended for surface mounting and are also referred to as surface-mounted components (so-called surface-mount device / SMD). Power semiconductor components heat up during operation, so that the heat generated must be dissipated. In the surface mounting (so-called SMD mounting) of a power semiconductor component on a printed circuit board, this generally serves as a heat sink (so-called heatsink).
  • the above Heatslug which is usually located on a metal plate of the power semiconductor component, is a metallic one on the circuit board for SMD assembly
  • Attachment area (so-called footprint) assigned, the area of the footprint on the printed circuit board corresponding approximately to the heatslug area of the semiconductor component.
  • the heat is transferred from the circuit board via thermal holes, ie via metallized holes (also known as thermal vias) and via Thermal grease (thermal interface material) on a device housing
  • Thermal vias can be placed under the heatslug or, for example, in the immediate vicinity in the circuit board. Since thermal vias generally extend perpendicular to the circuit board level, the heat can be dissipated in a short way, for example to a device housing.
  • Such semiconductor components built into a component housing are also used, for example, in charging devices for electromobility. Very high power losses occur during operation, making the cooling special
  • thermal vias In some applications, the use of thermal vias is not permitted due to electrical insulation regulations. On the other hand,
  • PCBs printed circuit boards
  • the present disclosure is based on the object of advantageously further developing a semiconductor component arrangement or a method for producing a semiconductor component arrangement or a cooling device for a semiconductor component arrangement.
  • the aim is to be able to overcome at least some or all of the disadvantages mentioned above.
  • Heat buffering can be created to cushion short-term power peaks associated with an increase in temperature.
  • a semiconductor component arrangement which has at least one semiconductor component and a printed circuit board is specified.
  • an electrical circuit is specified that has the semiconductor component arrangement.
  • the semiconductor component arrangement has an - in particular first - metal block which is arranged between the semiconductor component and the printed circuit board, which is connected to an - in particular first - electrical connection of the semiconductor component by means of a soldered connection and which is connected to at least one conductor track of the printed circuit board by means of a further one Solder connection is connected.
  • the metal block is exposed
  • the mounting surface - in particular for producing the further solder connection - is uncovered by solder mask.
  • the mounting surface is covered in particular in places or completely with solder and covered by the first metal block.
  • the conductor track is completely or partially formed by an etched copper layer, which is in particular attached to an insulating carrier of the circuit board.
  • the metal block has an extension in the direction away from the printed circuit board and towards the semiconductor component which is at least as large as the extension of the semiconductor component in this direction, measured from the first electrical connection in the direction away from the printed circuit board. If the semiconductor component is arranged in a housing, the extent of the semiconductor component is expanded
  • the semiconductor component arrangement has a metal body which is embedded in the printed circuit board.
  • the metal block is connected to the metal body by means of the further solder connection.
  • the metal body has the exposed mounting surface.
  • the metal body represents a section of the conductor track, which is formed, in particular, from the etched copper layer.
  • a surface of the conductor track facing away from a base body of the printed circuit board including a surface of the metal body facing away from the base body of the printed circuit board, is arranged entirely in a single plane.
  • the metal body is prefabricated and subsequently attached to the base body of the printed circuit board.
  • a first heat spread can also be achieved here at the connection of the electrical connection to the metal block.
  • a second heat spread can take place at the connection to a metal body embedded in the printed circuit board.
  • metal bodies can even achieve additive heat spreading.
  • Another advantage is that the metal block and the metal body, if present, also have a heat buffer effect, so that it can also be effective as a heat sink.
  • By increasing the mass of the thermally conductive materials and their spatial expansion improves the spread of heat in the various deeper layers and thus more effectively dissipates heat into a housing or to another heat sink.
  • brief temperature increases caused by power peaks can be buffered by the increased thermal mass in the line path.
  • the semiconductor component has at least one further electrical connection — preferably a plurality of further electrical connections.
  • the semiconductor component arrangement contains at least one metal block group which has the first metal block and at least one further metal block - preferably a plurality of further metal blocks - wherein in particular each further metal block is assigned to one of the further electrical connections.
  • the number of further metal blocks belonging to the metal block group preferably corresponds to the number of further electrical connections.
  • the or each further metal block of the metal block group is by means of a respective solder connection between the or a respective further electrical connection of the semiconductor component and the printed circuit board
  • each of the further metal blocks is soldered to one of the further electrical connections on one side and soldered to a further conductor track of the printed circuit board on an opposite side.
  • each electrical connection can be assigned a metal block for electrically and thermally conductive connection to a printed circuit board.
  • the semiconductor component is installed in a housing, the first electrical connection of the semi-conductor element being connected to a first metal plate fastened to the housing.
  • Such metal plates have an exposed surface on the housing and are known as a so-called heatslug.
  • the semiconductor component has a housing and the first electrical connection is formed by a surface of the first metal plate that is exposed on the housing. The dimensioning of the exposed surface primarily follows the requirements for heat dissipation; as a rule, the free surface is at least one square millimeter.
  • Semiconductor device connected to a third metal plate attached to the housing - i.e. in particular formed by an exposed surface of the third metal plate - and in particular a fourth electrical connection of the semiconductor component with a fourth metal plate attached to the housing - i.e. in particular formed by an exposed surface of the fourth metal plate - be connected.
  • the second electrical connection and any further electrical connections of the semiconductor component protrude from the housing as a pin of the connection concerned.
  • the first metal block has a first end face and a second end face facing it is connected on its first end face by means of the soldered connection to a plate surface - this is in particular the exposed surface - of the first metal plate and on its second end face by means of the further soldered connection connected to the conductor track of the circuit board. Accordingly, each of the further metal blocks - in particular the second, third or fourth metal block - can each have a first
  • Be connected semiconductor device and be connected at its second end face to a respective further conductor track of the circuit board by means of a solder connection.
  • Such embodiments are particularly good for
  • soldered connection on the first end face and / or the soldered connection on the second end face of the respective metal block can preferably be by means of
  • the conductor track which is connected to a metal block by means of a solder connection is part of an outer layer of the circuit board, or that each conductor track which is connected to a metal block by means of a solder connection is part of an outer layer of the circuit board.
  • all of the first end faces of the metal blocks of the metal block group extend - these are in particular the first metal block and the further metal block or the further metal blocks, e.g. the second metal block or the second and third metal block or the second, third and fourth metal block - in a first plane and all second end faces of the metal blocks of the
  • Metal block group in a second plane the first plane and the second plane being in particular parallel to one another.
  • the metal blocks are of the metal block group
  • the metal blocks are preferably in a plan view of a main extension plane of the
  • the metal blocks of the metal block group are partially or completely encased on their lateral lateral surfaces by an electrically insulating jacket common to them.
  • the shroud is
  • the casing is a plastic body with which the metal blocks are, for example, extrusion-coated.
  • the metal block group is prefabricated.
  • the metal blocks of the metal block group are fixed in place relative to one another by the sheathing, the fixed fixing preferably being in place before the connection — in particular before the soldering — of the sheathed Metal block group with the circuit board.
  • the printed circuit board can be particularly easily populated with the encased metal block group and the component.
  • Metal blocks to one another and to the conductor tracks of the printed circuit board or the electrical connections of the component can be achieved in this way.
  • a simple and therefore inexpensive shaping can be achieved in that the metal block or that a respective metal block has a uniform cross section assigned to it in each plane parallel to the first plane and / or to the second plane.
  • the metal blocks are cuboid and in particular have sides parallel to the first and second planes.
  • the cross section of the first metal block can be larger, at least several times larger, than the cross section of the further metal block or as the cross section of each further metal block.
  • the first end face of the first metal block is larger than the plate area of the first metal plate.
  • the soldered connection between the first metal plate and the first metal block extends in the entire region in which the plate surface overlaps the first end face (16) of the first metal block.
  • Particularly good heat spreading can be achieved in this way.
  • the first metal block protrudes laterally beyond the first metal plate.
  • An edge length of the metal block in the direction in which it protrudes laterally beyond the metal plate is preferably at least 30% larger than that
  • each solder connection has one
  • the respective first end face and the respective second end face have a passivation suitable for a soldering process.
  • the first metal block has a first end face and a second end face facing it, is connected at its first end face to a plate surface of the first metal plate by means of the solder connection and at its second end face by means of the further solder connection to the first one embedded in the printed circuit board Connected metal body.
  • the second metal block has a first end face and a second end face pointing opposite, is on its first end face by means of a solder connection to the second electrical connection of the
  • the third metal block can have a first end face and a second end face pointing opposite thereto, on its first end face by means of a
  • a fourth metal block has a first end face and a second end face facing opposite, on its first end face by means of a solder connection with a fourth electrical connection of the
  • Semiconductor component is connected and is connected at its second end face to a fourth metal body embedded in the printed circuit board.
  • the exposed mounting surface of the conductor track, on which the first metal block is soldered, or the first metal body embedded in the circuit board has a larger surface area than the first metal block in relation to the main plane of extent.
  • the surface of the metal body or the mounting surface is in
  • a pin is a second electrical
  • Semiconductor component is soldered onto respective further conductor tracks of the printed circuit board and / or onto further metal bodies embedded in the printed circuit board or alternatively soldered to further respective conductor tracks of the printed circuit board and / or onto further metal bodies inserted into the printed circuit board by means of push-through assembly.
  • the arrangement can have, for example, only the first metal block - and no metal block group with further metal blocks.
  • solder there is a layer of solder on a respective metal block on its respective first end face and on its respective second end face in the area of the soldered connection and / or that there is between a respective pin and a conductor track soldered to the pin ( 8) there is a layer of solder in the area of the solder connection.
  • the metal block consists of copper and / or the at least one further metal block consists of copper. Copper has both good electrical conductivity and good thermal thermal conductivity and also a heat storage capacity suitable for the invention. Other alloys containing copper in one embodiment are also conceivable for the metal block and / or the at least one further metal block. In view of the heat storage, which is also desirable, it is preferred that the metal block or that a respective metal block perpendicular to its first end face has a thickness which corresponds to a multiple of the thickness of the conductor tracks of the printed circuit board. In another embodiment, the one embedded in the circuit board
  • the metal body and / or the further metal body (s) consist of copper.
  • the or each metal body embedded in the circuit board can serve as a further heat sink (s) in addition to the metal block or the metal blocks and provide heat buffers in order to cushion short-term power peaks of the semiconductor component as the temperature rises.
  • the semiconductor component is one
  • Power metal oxide semiconductor field effect transistor can be a semiconductor component that generates a power loss of 2 watts or more when operated as intended and / or that heats up by at least 10 degrees Celsius when it is operated as intended.
  • it can be a semiconductor component that generates a power loss of 2 watts or more when operated as intended and / or that heats up by at least 10 degrees Celsius when it is operated as intended.
  • it can be a semiconductor component that generates a power loss of 2 watts or more when operated as intended and / or that heats up by at least 10 degrees Celsius when it is operated as intended.
  • it can be a semiconductor component that generates a power loss of 2 watts or more when operated as intended and / or that heats up by at least 10 degrees Celsius when it is operated as intended.
  • it can be a semiconductor component that generates a power loss of 2 watts or more when operated as intended and / or that heats up by at least 10 degrees Celsius when it is operated as intended.
  • it can be a semiconductor component that
  • Act semiconductor device that is designed for operation at 24 V with a current of at least 1 ampere or at 48 V with a current of 0.5 ampere, for example.
  • circuit board it is preferred that it is a
  • the circuit board is a printed circuit.
  • the circuit board is a printed circuit.
  • Printed circuit board has two outer copper layers and between them three prepregs with a thickness of at least 0.4 millimeters or the printed circuit board has four copper layers and between two adjacent copper layers each has at least one prepreg, in an expedient embodiment three prepregs, in particular with a thickness of at least 0 , 4 millimeters.
  • three prepregs with a thickness of at least 0.4 millimeters in particular understood that the three prepregs together have a total thickness of at least 0.4 millimeters.”
  • Prepregs are understood in particular to mean plates which are reinforced with glass fabric (epoxy) resin, for example that under material known as FR-4.
  • the prepregs are semi-finished textile fiber matrix pre-impregnated with reactive resins
  • Fier ein the circuit board preferably under temperature and / or
  • circuit boards are available as standard circuit boards.
  • the circuit board is on its from that
  • the circuit board also known as the substrate, which provides the basic electrical insulation required by the standards, which also creates a thermal barrier and which is located in the heat flow between the
  • Semiconductor device and the heat sink is located, according to a single or multiple heat spread in a large cross section of heat
  • a heat sink can also be a device housing.
  • metal block or blocks There is extensive freedom of design with regard to the metal block or blocks.
  • Arrangement is particularly advantageous for all such electronic modules that have a high power loss and that meet the requirements of Insulation coordination standards are sufficient, and these requirements can advantageously be met according to the present disclosure with a standard printed circuit board.
  • the electrical circuit is a circuit of a charger (in particular a so-called onboard charger), a (power) output stage, a motor controller or a circuit of another device for the electrification of motor vehicles.
  • a charger in particular a so-called onboard charger
  • a (power) output stage in particular a so-called onboard charger
  • a motor controller in particular a so-called motor controller
  • the semiconductor component arrangement enables effective heat dissipation of power semiconductor components that generate heat loss.
  • Semiconductor component which has at least a first electrical connection, and at least one metal block provided.
  • the prefabricated, encased metal block group with the first and the at least one further metal block and the casing is provided.
  • the first electrical contact is made with a first end face of the first metal block by means of a solder connection and, in particular subsequently, a second end face of the first metal block, which lies on the side of the first metal block opposite the first end face, by means of a solder connection with a Conductor of the circuit board or, if a first metal body is embedded in the circuit board, connected by means of the metal body integrated in the circuit board.
  • Prefabricated, sheathed metal block group is particularly in a further process step - preferably at the same time with the production of the soldered connection between the conductor track or the metal body and the second end face of the first metal block and / or at the same time with the production of the soldered connection between the first electrical contact and the first end face of the first metal block - the further metal block (32, 33, 34) of the prefabricated, encased metal block group by means of a solder connection (14) between the another electrical connection (22, 23, 24) and the circuit board (5) interposed.
  • the first electrical connection with a metal plate is one
  • Component housing of the semiconductor component connected and / or the metal plate is by means of a surface mounting process (so-called.
  • the heat removal device has a plurality of metal blocks which are arranged laterally to one another and which are encased on their lateral jacket surfaces by an electrically insulating jacket that is common to them.
  • the metal blocks are preferably made of copper.
  • the casing is made in particular of plastic;
  • the metal blocks are extrusion-coated with the plastic sheathing.
  • the cooling device with the encased metal blocks is preferably provided for soldering to a printed circuit board.
  • the metal blocks are extrusion-coated with the plastic sheathing.
  • each metal block has one across it
  • Shell surface extending first end face and a transverse to its
  • a second end surface extending on the lateral surface, a layer of solder being applied to each first end surface and every second end surface.
  • Fig. 1 shows schematically a side view of an inventive
  • Cooling device according to a preferred embodiment
  • FIG. 2 shows an end view of the cooling device shown in FIG. 1 in the viewing direction II there;
  • FIG. 3 shows an end view of a heat removal device according to the invention in accordance with a second preferred exemplary embodiment
  • Flalbleiter component arrangement according to a first preferred
  • Flalbleiter component arrangement according to a second preferred
  • Flalbleiter component arrangement according to a third preferred
  • Fig. 6b is a top view of that shown in Fig. 6a
  • the flat conductor component arrangement 1 shown in FIG. 4 comprises the cooling device 2 shown in FIGS. 1 and 2, so that the description in context.
  • the semiconductor component arrangement 1 comprises a semiconductor component 3 which is installed in a housing 4 and which is therefore not shown in more detail in the figures.
  • the example is a so-called power MOSFET, ie one
  • the semiconductor component 3 is connected by means of the heat-dissipation device 2 to a printed circuit board 5, which in the example is three, one electrically and thermally in the illustration
  • Isolating intermediate layer 6 has summarized so-called prepregs, and two outer copper layers 7.
  • Figure 4 shows schematically that the upper copper layer 7 comprises a plurality of conductor tracks 8 made of copper, which have the same reference numerals for simplification.
  • the copper layer 7 in the present exemplary embodiment comprises at least four conductor tracks 8, of which one conductor track is located on the left in FIG which are the three other conductor tracks 8 on the right side of the gap 9 and in turn from each other by means of another, in the
  • the circuit board 5 is connected by means of a so-called thermal interface 10 to a heat sink 11, through which a coolant (for example water) flows through a coolant circuit, not shown, for heat dissipation.
  • a coolant for example water
  • the semiconductor component 3 has a first electrical connection 21, which is covered by the housing 4, a second electrical connection 22, a third electrical connection 23 and a fourth electrical connection 24, the third and fourth connections 23, 24 in FIG second connection 22 are covered.
  • the heat removal device 2 comprises a comparatively large first metal block 31, a comparatively smaller one in FIG
  • the four metal blocks 31, 32, 33 and 34 functionally form a prefabricated metal block group for connecting the semiconductor component 3 to the printed circuit board 5.
  • the first metal block 31 is arranged between the semiconductor components 3 located in the housing 4 and the printed circuit board 5, and the Metal blocks 32, 33 and 34 are arranged between each of the electrical connections 22, 23 and 24 and the printed circuit board 5.
  • the first electrical connection 21 is metallically connected to a first metal plate 13 (so-called heatslug) fastened to the housing 4.
  • the metal plate 13 and thereby the first electrical connection 21 is electrically conductively connected to the first metal block 31 by means of a solder connection 14 which has the solder layer 15 cut in FIG. It can be seen from FIG. 1 that the solder layer 15 is applied to a first end face 16 of the first metal block 31.
  • the first end face 16 of the first metal block 31 lies in a common first plane 18 together with a first
  • a second end face 17 of the first metal block 31 lies on the opposite side in a second plane 20 together with a second end face 17 of the second metal block 32, with a second end face 17 of the third metal block 33 and with a second end face 17 of the fourth Metal block 34.
  • a solder tin layer 15 is applied to each first end face 16 and on every second end face 17 in the example.
  • the first metal block 31 is connected in an electrically conductive manner to the conductor track 8 of the printed circuit board 5, which is provided on its second end face 17, by solder layer 15.
  • all layers of solder are uniformly designated by 15 for an overview, and all solder connections formed from one layer of solder 15 are uniformly designated by reference numeral 14 for an overview.
  • FIGS. 1 and 2 show in the sectional view a plate surface 19 of the first metal plate 13, which was connected to the solder layer 15.
  • the metal blocks 31, 32, 33, 34 are arranged laterally to one another.
  • Figure 2 shows their in relation to the
  • the three metal blocks 32, 33, 34 have dimensions which are identical to one another and, with respect to a transverse direction Q of the heat removal device 2, are each the same
  • the metal block 31 which is larger in comparison, is spaced apart therefrom in a longitudinal direction L perpendicular to the transverse direction Q.
  • Figure 1 shows that the lateral lateral surfaces 25 of the metal blocks
  • the metal block group with the coated metal blocks 31-34 is applied as one component to the circuit board and subsequently soldered to the conductor tracks 8 and / or the electrical connections 21-24.
  • cross section of the first metal block 31 is in each case larger than the cross section of the others
  • FIG. 4 shows that the first end face 16 of the first metal block 31 and the areal expansion of the solder layer 15 formed thereon are larger than the adjacent plate surface 19 of the metal plate 13, which is fastened to the housing 4 as a so-called heatslug.
  • metal block 32 is soldered. In its opposite end face 17, the metal block 32 is soldered by means of the solder layer 15 applied there on the conductor track 8 also shown in FIG. 4 and running to the right of the gap 9. In the exemplary embodiment it is provided that all metal blocks 31, 32, 33, 34 consist of copper.
  • the embodiment with a second, third and fourth electrical connection 22, 23, 24 in addition to the first electrical connection 21 is selected only as an example. If the semiconductor component 3 is, for example, a MOSFET, it usually has only the first 21 and two further electrical connections 22, 23. Accordingly, in addition to the first metal block 31, the cooling device in this case expediently has only two further metal blocks 32, 33. Embodiments with a larger number of further electrical connections and others
  • Metal blocks - e.g. five - are also conceivable.
  • Figure 3 shows a second preferred embodiment of a
  • Heat removal device 2 To connect two semiconductor components 3 to a printed circuit board 5, two metal block groups, each of which comprises the four metal blocks 31-34 shown in FIGS. 1 and 2, are encased by a common insulating jacket 26.
  • the semiconductor component arrangement 1 differs from the embodiment in FIG. 4 in that only the first metal block 31 is present.
  • the metal blocks 32-34 and the casing 26 are not present.
  • the metal block 31 is soldered between the metal plate 13 (heatslug) of the housing 4 and a conductor 8 by means of the two solder connections 14, each formed by a layer of solder 15, and thereby in the thermal path between them
  • a pin 22 'of the second electrical connection 22 of the semiconductor component 3 was in the
  • FIG. 4 Compared to the embodiment of FIG. 4, it is extended and is soldered to its free, again angled longitudinal end by means of a solder connection 14 formed by a solder layer 15 on a conductor 8, which is electrically connected by means of the gap 9 from the conductor 8 electrically connected to the first electrical connection 21 is decoupled.
  • a pin 23 'of a third electrical connection 23 and a pin 24' of a fourth electrical connection 24 of the semiconductor component is covered by pin 22 ', but, like pin 22', is soldered to other conductor tracks 8 in a corresponding manner.
  • FIGS. 6a and 6b show a third preferred exemplary embodiment of a semiconductor component arrangement 1 according to the invention, again corresponding or comparable details to the preceding embodiments being identified by the same reference numerals.
  • a first metal body 27 is inserted into the printed circuit board 5, a second metal body 28 is spaced laterally and a third metal body 29 is spaced in the direction of view from FIG. 6a, so that the respective exposed metal surface in the example is flush with an upper side of the printed circuit board 5.
  • a semiconductor component 3 which is a power semiconductor component and is accommodated in a housing 4, is in turn soldered onto the opposite surface of the metal body 31 by means of a further solder connection 14 formed by a solder layer 15.
  • a first electrical contact 22 of the semiconductor component 3 is in turn connected to the metal plate 13 which adjoins the solder tin layer 15.
  • the thermal cross section of the first metal plate 31 is larger than that of the metal plate 13 (heatslug), and the thermal cross section of the first metal body 27 is larger than the thermal cross section of the first metal block 31.
  • the first metal body 27 can be formed in the associated cavity of the printed circuit board 5, for example using masks, from a plurality of copper layers applied to one another.
  • the semiconductor component 3 also has a second electrical connection 2 and a third electrical connection 23, each of which pins 22 ′, 23 ′ lead out of the housing 4.
  • Pins 22 'and 23' are angled. The pin 22 'runs through the angled section in the second metal body 28 introduced through hole, with the
  • Metal body 27-29 is considerably larger than the thickness of the conductor tracks 8.
  • the first metal body 27 and / or the second metal body 28 and / or the third metal body 29 can be electrically connected to a respective conductor track 8 of the printed circuit board 5 (not shown in FIG. 6) be connected.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Geometry (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un ensemble de composant semi-conducteur (1), qui comprend au moins un composant semi-conducteur (3), qui comprend un premier raccord électrique (21) et au moins un autre raccord électrique (22, 23, 24), une carte de circuit imprimé (5) et un groupe de blocs métalliques préfabriqué. Le groupe de blocs métalliques comprend un premier bloc métallique (31), qui est disposé entre le composant semi-conducteur (3) et la carte de circuit imprimé (5), qui est connecté à un premier raccord électrique (21) du composant semi-conducteur (3) au moyen d'une connexion soudée (14) et qui est connecté à au moins une piste conductrice (8) de la carte de circuit imprimé (5) au moyen d'une autre connexion soudée (14). Le groupe de blocs métalliques comprend au moins un autre bloc métallique (32, 33, 34), qui est intercalé au moyen d'une connexion soudée (14) entre l'autre raccord électrique (22, 23, 24) et la carte de circuit imprimé (5). Les blocs métalliques (31, 32, 33, 34) du groupe de blocs métalliques préfabriqué sont disposés latéralement l'un par rapport à l'autre et enveloppés partiellement ou complètement par une enveloppe (26) électriquement isolante, commune sur leurs surfaces enveloppantes latérales (25). L'invention concerne en outre un circuit électrique, un procédé pour la fabrication d'un ensemble de composant semi-conducteur (1) et un dispositif de dissipation de chaleur (2).
PCT/EP2019/077255 2018-10-15 2019-10-08 Ensemble de composant semi-conducteur, procédé pour sa fabrication ainsi que dispositif de dissipation de chaleur WO2020078778A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201980068203.5A CN112805828A (zh) 2018-10-15 2019-10-08 半导体部件布置、制造半导体部件布置的方法和散热装置
US17/285,295 US20220115290A1 (en) 2018-10-15 2019-10-08 Semiconductor component arrangement, method for fabrication thereof and heat dissipation device
EP19789603.8A EP3867949A1 (fr) 2018-10-15 2019-10-08 Ensemble de composant semi-conducteur, procédé pour sa fabrication ainsi que dispositif de dissipation de chaleur

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018217607.8 2018-10-15
DE102018217607.8A DE102018217607A1 (de) 2018-10-15 2018-10-15 Halbleiterbauelement-Anordnung, Verfahren zu deren Herstellung sowie Entwärmungseinrichtung

Publications (1)

Publication Number Publication Date
WO2020078778A1 true WO2020078778A1 (fr) 2020-04-23

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US (1) US20220115290A1 (fr)
EP (1) EP3867949A1 (fr)
CN (1) CN112805828A (fr)
DE (1) DE102018217607A1 (fr)
WO (1) WO2020078778A1 (fr)

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CN113330825A (zh) * 2020-06-24 2021-08-31 华为技术有限公司 汽车及车载充电机

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US20110089529A1 (en) * 2009-10-16 2011-04-21 Infineon Technologies North America Corp. Open Cavity Leadless Surface Mountable Package for High Power RF Applications
DE112015005760T5 (de) * 2014-12-24 2017-10-05 Autonetworks Technologies, Ltd. Schaltungsanordnung und Verfahren zur Herstellung derselben

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JP2005340684A (ja) * 2004-05-31 2005-12-08 Calsonic Kansei Corp 基板への電子素子の取付構造
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FR2984679B1 (fr) * 2011-12-15 2015-03-06 Valeo Sys Controle Moteur Sas Liaison thermiquement conductrice et electriquement isolante entre au moins un composant electronique et un radiateur en tout ou partie metallique
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US6226183B1 (en) * 1997-08-25 2001-05-01 Robert Bosch Gmbh Arrangement including a substrate for power components and a heat sink, and a method for manufacturing the arrangement
US20110089529A1 (en) * 2009-10-16 2011-04-21 Infineon Technologies North America Corp. Open Cavity Leadless Surface Mountable Package for High Power RF Applications
DE112015005760T5 (de) * 2014-12-24 2017-10-05 Autonetworks Technologies, Ltd. Schaltungsanordnung und Verfahren zur Herstellung derselben

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Publication number Priority date Publication date Assignee Title
CN113330825A (zh) * 2020-06-24 2021-08-31 华为技术有限公司 汽车及车载充电机

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CN112805828A (zh) 2021-05-14
US20220115290A1 (en) 2022-04-14
DE102018217607A1 (de) 2020-04-16
EP3867949A1 (fr) 2021-08-25

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