WO2020077639A1

WO2020077639A1 - Backing block of ultrasonic area-array probe, ultrasonic area-array probe, and ultrasonic diagnosis and imaging device

Info

Publication number: WO2020077639A1
Application number: PCT/CN2018/111096
Authority: WO
Inventors: 王金池; 吴飞
Original assignee: 深圳迈瑞生物医疗电子股份有限公司; 深圳迈瑞科技有限公司
Priority date: 2018-10-19
Filing date: 2018-10-19
Publication date: 2020-04-23

Abstract

Disclosed are a backing block (100) of an ultrasonic area-array probe, an ultrasonic area-array probe comprising the backing block (100), and an ultrasonic diagnosis and imaging device comprising the ultrasonic area-array probe. A connecting circuit (120) of the backing block (100) has multiple leads (121), wherein each of the leads (121) has a first connecting end (1211) located at an end face (1111) of a first end portion (111) of a backing block body (110), and has a second connecting end (1212) passing through the interior of the backing block body (110) and extending to an end face (1121) of a second end portion (112). In order to reduce the alignment difficulty in connecting the second connecting ends (1212) to an adapter circuit, for at least some adjacent leads (121) of the connecting circuit (120), the spacing between the second connecting ends (1212) is designed to be greater than the spacing between the first connecting ends (1211), such that the connecting circuit (120) can be distributed more widely on the end face (1121) of the second end portion (112) of the backing block body (110), and the distance between the adjacent second connecting ends (1212) is greater, thereby facilitating the alignment connection between the second connecting ends (1212) and the corresponding positions on the adapter circuit and reducing the manufacturing difficulty thereof.

Description

Backing block of ultrasonic area array probe, ultrasound area array probe and ultrasound diagnostic imaging equipment

Technical field

The application relates to an ultrasonic area array probe, in particular to a backing block structure of the ultrasound area array probe.

Background technique

Ultrasound probe is an important component of ultrasound equipment (such as ultrasound diagnostic imaging equipment). Its working principle is to use the piezoelectric effect to convert the excitation electrical pulse signal of the ultrasound machine into an ultrasound signal into the patient's body, and then reflect the ultrasound echo signal reflected by the tissue. Converted to electrical signals to enable detection of tissues.

Among them, the vibration element array of the ultrasound probe needs to be connected with the control circuit of the host, and how to make the circuit connection of the ultrasound probe array element array is a very important process technology for manufacturing the ultrasound probe. Especially for area array probes, it has been more difficult to achieve the circuit connection to the vibrator matrix by the traditional soldered wire method, and the circuit connection scheme of the multilayer FPC flexible circuit board is used, but this method has higher positioning requirements. , It will also have a greater impact on the acoustic performance of the ultrasound probe.

In order to solve the above-mentioned problems, there is currently a backing block solution with a circuit inside, but the circuit array inside the backing block has a high density and a small pitch, especially the one end of the circuit matching the connection circuit is particularly densely distributed. It will increase the difficulty of alignment with the connecting circuit in the subsequent process.

technical problem

The present application mainly provides a backing block of an ultrasonic area array probe to make it easier to realize docking and assembly with connecting circuits. The application also provides an ultrasonic area array probe using the backing block and an ultrasonic diagnostic imaging device using the ultrasound area array probe.

Technical solution

An embodiment provides a backing block of an ultrasonic area array probe, which includes a backing block body and a connection circuit installed in the backing block body, the backing block body has a structure for cooperating with the vibrator array And the second end for mating with the switching circuit, the connection circuit has a plurality of leads, the lead has a first connection end for connecting with the array of vibrating elements and A second connection end connected to the switching circuit, the first connection end is located on an end surface of the first end, the lead wire passes through the inside of the backing block body from the first end and extends to the second end So that the second connection end is located on the end surface of the second end, and the distance between the second connection ends of at least some adjacent leads is greater than the distance between the first connection ends.

In one embodiment, the spacing between adjacent leads gradually increases from the first connection end to the second connection end.

In one embodiment, the distance between the second connection ends of adjacent leads is less than or equal to 1.5 times the distance between the first connection ends.

In one embodiment, on the end surface of the first end, all adjacent leads have an equal spacing.

In one embodiment, on the end surface of the second end, all adjacent leads have an equal spacing.

In an embodiment, the end face of the first end is a first end face, the end face of the second end is a second end face, the first end face is parallel to the second end face, and is located on the first end face In any plane between the second end face and parallel to the first end face and the second end face, all adjacent leads have an equal spacing.

In one embodiment, all the leads are arranged in the same plane inside the backing block body.

In one embodiment, the leads are arranged in a rectangular array inside the backing block body.

In one embodiment, in the leads arranged in a rectangular array, the spacing between adjacent leads arranged in the row direction or column direction remains unchanged from the first connection end to the second connection end.

An embodiment provides an ultrasonic area array probe, including an array of vibrating elements and a switching circuit, characterized in that it further includes a backing block as described in any one of the above, and the array of vibrating elements is mounted on the back The first end of the pad is connected to the first connection end of the lead at the first end, and the switching circuit is installed at the second end of the backing block and is connected to the second end of the lead端连接。 End connection.

In one embodiment, the end surface of the first end is coated with glue, so that the first connecting end is bonded and fixed to the vibrator array.

An embodiment provides an ultrasound diagnostic imaging device, including the ultrasound area array probe as described in any one of the above.

Beneficial effect

According to the backing block of the above embodiment, the connecting circuit has a plurality of leads. The first connecting end of the lead is located on the end surface of the first end of the backing block body, and the second connecting end passes through the backing block body and Extend to the end face of the second end. In order to reduce the difficulty of aligning the second connection end and the switching circuit during connection, the connection circuit designs the distance between the second connection ends of at least some adjacent leads to be greater than the distance between its first connection ends, so The connection circuit can be distributed more widely on the end surface of the second end of the backing block body, and the distance between adjacent second connection terminals is larger, thereby facilitating the position corresponding to the second connection terminal and the switching circuit The alignment connection reduces the manufacturing difficulty.

BRIEF DESCRIPTION

1 is a schematic structural diagram of a backing block in an embodiment of the present application;

2 is a schematic structural diagram of a backing block in an embodiment of the present application;

3 is a schematic structural diagram of a backing block in an embodiment of the present application;

FIG. 4 is a schematic diagram of leads arranged in a rectangular array in an embodiment of the present application.

Embodiments of the invention

detailed description

The present invention will be further described in detail below through specific embodiments and drawings. Corresponding similar element labels are used for similar elements in different embodiments. In the following embodiments, many details are described so that the present application can be better understood. However, those skilled in the art can easily recognize that some of the features may be omitted in different situations, or may be replaced by other elements, materials, and methods. In some cases, some operations related to this application are not shown or described in the specification. This is to avoid the core part of this application being overwhelmed by too many descriptions. For those skilled in the art, describe these in detail Related operations are not necessary, they can fully understand related operations according to the description in the specification and general technical knowledge in the field.

In addition, the features, operations, or characteristics described in the specification may be combined in any appropriate manner to form various embodiments. At the same time, the steps or actions in the method description can also be exchanged or adjusted in sequence in a manner apparent to those skilled in the art. Therefore, the various orders in the description and drawings are only for clearly describing a certain embodiment, and are not meant to be a necessary order unless otherwise stated that a certain order must be followed.

The serial numbers themselves, such as "first", "second", etc., are used to distinguish the described objects, and do not have any order or technical meaning. The "connection" and "connection" mentioned in this application, unless otherwise specified, include direct and indirect connection (connection).

This embodiment provides a backing block for an ultrasonic area array probe. Please refer to FIGS. 1-3, the backing block 100 includes a backing block body 110 and a connecting circuit 120 mounted on the backing block body 110. In order to be able to see the connection circuit 120 clearly, each of FIGS. 1-3 shows the backing block body 110 as transparent.

The backing block body 110 is made of a common backing block material. On the one hand, it serves as a sound attenuating material to absorb the adverse ultrasonic waves propagated backward by the ultrasonic probe, and on the other hand, it serves as a structural support block to ensure the structural reliability of the ultrasonic probe vibrator array. The connection circuit 120 is used to connect the vibrator array, and connect the vibrator to the control circuit of the host, so that the control circuit drives the vibrator. The connection circuit 120 usually has a plurality of leads 121, and each lead 121 is independently arranged, so as to connect the corresponding vibrating element with the corresponding switching circuit.

Please continue to refer to FIGS. 1-3. The backing block body 110 has a first end 111 for cooperating with the vibrator array and a second end 112 for cooperating with the switching circuit. The lead 121 has a first connection terminal 1211 for connecting to the vibrator array and a second connection terminal 1212 for connecting to the switching circuit. The first connecting end 1211 is located on the end surface 1111 of the first end 111, which can facilitate the connection between the vibrator array and the lead 121. The lead 121 passes through the inside of the backing block body 110 from the first end 111 and extends to the second end 112, so that the second connection end 1212 is located on the end surface 1121 of the second end 112, thereby facilitating the transfer circuit and the second The connection of the connection end 1212. In order to reduce the difficulty of aligning the second connection end 1212 and the switching circuit during connection, the connection circuit 120 has designed the distance between the second connection ends 1212 of at least part of the adjacent leads 121 to be larger than that of the first connection ends 1211 The distance between them can make the connection circuit 120 more widely distributed on the end surface 1121 of the second end 112, and the distance between the adjacent second connection ends 1212 is larger, so that the second connection end 1212 and the The positions corresponding to the transfer circuits are connected in position to reduce the manufacturing difficulty.

In some embodiments, the distance between all the adjacent leads 121 between the second connection ends 1212 may be greater than the distance between the first connection ends 1211, or only part of the adjacent leads 121 may be located on the second connection ends 1212 The distance between them is larger than the distance between the first connecting ends 1211.

Please continue to FIGS. 1-3. In an embodiment, the distance between the adjacent leads 121 may be gradually increased from the first connection end 1211 to the second connection end 1212. Alternatively, the distance remains unchanged for a distance extending from the first connection end 1211 to the second connection end 1212, and then the closer to the second connection end 1212, the distance gradually increases.

Of course, in view of the compactness requirements of the ultrasonic area array probe and the size requirements of the backing block 100, in one embodiment, the distance between the second connection ends 1212 of the adjacent leads 121 is less than or equal to the first connection ends 1211 1.5 times the spacing between. That is, the distance between the second connection ends 1212 is 1-1.5 times the distance between the first connection ends 1211 (including 1.5 times, but not including 1 time), so that the distance between the second connection ends 1212 can be avoided If the distance is too large, the volume of the backing block 100 is too large, which is conducive to the miniaturization of the ultrasonic area array probe, and at the same time, it also facilitates the alignment and positioning during the subsequent assembly process of the circuit connection board.

In one embodiment, on the end surface 1111 of the first end 111, all adjacent leads 121 have an equal spacing. That is, on the end surface 1111 of the first end 111, all leads 121 are separated from the adjacent leads 121 by the same distance. Of course, in some embodiments, on the end surface 1111 of the first end 111, the spacing between certain leads 121 and their adjacent leads 121 can be selectively adjusted to be different.

In one embodiment, similarly, on the end surface 1121 of the second end 112, all adjacent leads 121 have an equal spacing. That is, on the end surface 1121 of the second end portion 112, all the lead wires 121 are separated from the adjacent lead wires 121 by the same distance. Similarly, in some embodiments, on the end surface 1121 of the second end portion 112, the distance between some leads 121 and the adjacent leads 121 can also be selectively adjusted to be different.

Preferably, in an embodiment, the end surface 1111 of the first end 111 is the first end surface, and the end surface 1121 of the second end 112 is the second end surface. The first end face is parallel to the second end face. In any plane between the first end face and the second end face and parallel to the first end face and the second end face, all adjacent leads 121 have an equal spacing. That is, the spacing between all adjacent leads 121 changes at the same increment. If a plane between the first end face and the second end face and parallel to the first end face and the second end face is used to cut off the leads, these leads The spacing in this plane (referring to the spacing between adjacent leads) is equal, which can ensure the consistency of the entire connecting circuit 120, which is conducive to the formation of a regular and Predicted positioning position, which can facilitate the connection of the connection terminals on the transfer circuit according to the position of the second connection terminal 1212, so that the connection terminals of the transfer circuit can be easily and accurately connected to the second connection terminal 1212 .

Please refer to FIG. 1. In one embodiment, the leads 121 are arranged in a rectangular array inside the backing block body 110. Please refer to FIG. 4, the rectangular array here refers to forming the first connection end 1211 and / or the second connection end 1212 of the lead 121 into a rectangular array, the direction indicated by a is the row of the rectangular array, and the b refers to The direction is the column of the rectangular array.

Alternatively, please refer to FIG. 2, in one embodiment, all the leads 121 are arranged in the same plane inside the backing block body 110.

In the leads 121 arranged in a rectangular array, the spacing between adjacent leads 121 arranged in the row direction or the column direction remains unchanged from the first connection end 1211 to the second connection end 1212. Please refer to FIG. 3, in this embodiment, the distance between two adjacent leads 121 in the horizontal direction (can be regarded as the row direction) in the figure gradually increases from the first connection end 1211 to the second connection end 1212, The distance between two adjacent leads 121 perpendicular to the horizontal direction (which can be regarded as the column direction) remains unchanged. This can reduce the difficulty of manufacturing the backing block 100, but at the same time, the backing block 100 with a larger spacing between the second connection ends 1212 can also be obtained, so as to facilitate the connection of the transfer circuit.

An embodiment provides an ultrasonic area array probe, which includes an array of vibrating elements, a switching circuit, and a backing block 100 as shown in any of the above embodiments. Of course, the ultrasonic area array probe will also include components such as acoustic windows, which will not be repeated here. The vibrator array is installed at the first end 111 of the backing block 100 and connected to the first connection end 1211 of the lead 121 at the first end 111. The switching circuit is installed at the second end 112 of the backing block 100 and connected to the second connection end 1212 of the lead 121. The switching circuit communicates with the control circuit of the host through a cable, and the vibrating element array can be connected to the control circuit of the host through the switching circuit and the connecting circuit 120 in the backing block 100.

In one embodiment, the end surface 1111 of the first end 111 is coated with glue, so that the first connection end 1211 is bonded and fixed to the vibrator array.

An embodiment provides an ultrasound diagnostic imaging device, such as an ultrasound diagnostic apparatus. The ultrasound diagnostic imaging device includes an ultrasound area array probe.

A

The above uses specific examples to explain this application, but it is only used to help understand this application, not to limit this application. For those of ordinary skill in the art, based on the ideas of the present application, the above-mentioned specific embodiments may be changed.

Claims

A backing block for an ultrasonic area array probe, characterized in that it includes a backing block body and a connection circuit installed in the backing block body, the backing block body has a One end and a second end for cooperating with the switching circuit, the connecting circuit has a plurality of leads, the lead has a first connecting end for connecting to the vibrator array, and for connecting with the switching A second connection end connected to the circuit, the first connection end is located on an end surface of the first end, the lead wire passes through the inside of the backing block body from the first end and extends to the second end so that The second connection end is located on the end surface of the second end, and the distance between the second connection ends of at least some adjacent leads is greater than the distance between the first connection ends.
The backing block of claim 1, wherein the spacing between adjacent leads gradually increases from the first connection end to the second connection end.
The backing block according to claim 1 or 2, wherein the spacing between the second connection ends of adjacent leads is less than or equal to 1.5 times the spacing between the first connection ends.
The backing block according to any one of claims 1 to 3, characterized in that, on the end surface of the first end, all adjacent leads have an equal spacing.
The backing block according to any one of claims 1 to 4, characterized in that, on the end surface of the second end, all adjacent leads have an equal spacing.
The backing block according to any one of claims 1 to 5, wherein the end face of the first end is a first end face, and the end face of the second end is a second end face, and the first The end face is parallel to the second end face, and in any plane between the first end face and the second end face and parallel to the first end face and the second end face, all adjacent leads have an equal spacing.
The backing block according to any one of claims 1-6, wherein all the leads are arranged in the same plane inside the backing block body.
The backing block according to any one of claims 1 to 6, wherein the leads are arranged in a rectangular array inside the backing block body.
The backing block according to claim 8, wherein in the leads arranged in a rectangular array, the spacing between adjacent leads arranged in the row direction or column direction is from the first connection end to the first The second connection end remains unchanged.
An ultrasonic area array probe includes an array of vibrating elements and a switching circuit, characterized in that it further comprises a backing block according to any one of claims 1-9, and the array of vibrating elements is mounted on the backing block Connected to the first connection end of the lead at the first end, the transition circuit is installed at the second end of the backing block, and connected to the second connection end of the lead .
The ultrasonic area array probe according to claim 10, wherein the end surface of the first end portion is coated with glue, so that the first connection end is bonded and fixed to the vibrator array.
An ultrasound diagnostic imaging device, characterized by comprising the ultrasound area array probe according to any one of claims 10-11.