CN108926362A - A kind of ultra-high density arrays energy converter - Google Patents

A kind of ultra-high density arrays energy converter Download PDF

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Publication number
CN108926362A
CN108926362A CN201810854702.4A CN201810854702A CN108926362A CN 108926362 A CN108926362 A CN 108926362A CN 201810854702 A CN201810854702 A CN 201810854702A CN 108926362 A CN108926362 A CN 108926362A
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CN
China
Prior art keywords
earthing block
lead
several
electrode
signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810854702.4A
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Chinese (zh)
Inventor
张梦悦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHENZHEN JIARUI ELECTRONICS TECHNOLOGY Co Ltd
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SHENZHEN JIARUI ELECTRONICS TECHNOLOGY Co Ltd
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Priority to CN201810854702.4A priority Critical patent/CN108926362A/en
Publication of CN108926362A publication Critical patent/CN108926362A/en
Pending legal-status Critical Current

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Classifications

    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4483Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
    • A61B8/4488Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer the transducer being a phased array
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4483Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
    • A61B8/4494Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer characterised by the arrangement of the transducer elements

Abstract

A kind of ultra-high density arrays energy converter, flexible printed circuit board include front surface, rear surface;Front surface is equipped with preceding ground lead, front signal lead;Rear surface is equipped with rear ground lead, rear signal lead;Piezoelectric material layer includes left earthing block, several piezoelectric vibrators, right earthing block;The top surface of each piezoelectric vibrator is equipped with oscillator ground electrode, and bottom surface is equipped with signal electrode;The bottom surface of matching material layer is conductive, and matching material layer is fixed on the top surface of left earthing block, several piezoelectric vibrators, right earthing block;The oscillator ground electrode of the left side ground electrode of matching material layer and left earthing block, the right side ground electrode of right earthing block and several piezoelectric vibrator top surfaces all realizes circuit connection;The odd number signal electrode of number and several rear signal leads realize circuit connection from left to right, and the even number signal electrode of number and several front signal leads realize circuit connection from left to right.The present invention does not need welding lead and lead is arranged in oscillator ground electrode.

Description

A kind of ultra-high density arrays energy converter
Technical field
The present invention relates to a kind of ultrasonic transducers of medical field, medical super more specifically to a kind of ultra high density Sonic transducer.
Background technique
In modern medical service practice, ultrasonic image diagnosis equipment is widely used in heart, abdomen, urological department and gynemetrics Medical diagnosis.Ultrasonic probe is the critical component of ultrasonic image diagnosis equipment, it and human contact, be responsible for transmitting ultrasonic wave and The echo with tissue information returned from human body is received, and ultrasound system mainframe is returned by cable transmission, is closed calculating Screen terminal is shown at the image that rear formation can be observed intuitively.
In general, ultrasonic probe (Ultrasound probe) includes ultrasonic transducer (Ultrasound Transduce), shell and cable.Typical ultrasonic transducer includes lens material layer, matching materials on material composition Layer, piezoelectric material layer and sound-absorbing material layer.Wherein piezoelectric material layer plays crucial electroacoustic transformation, it drives received electricity The ultrasonic wave output that dynamic signal is converted to mechanical oscillation is emitted to human body, and inversely reflected ultrasonic wave can be converted For measurable electric flux.
From the theoretical model of acoustics design, a piece of whole piezoelectric material needs to cut as by one-dimensional in the fabrication process The piezoelectric vibrator of array or two-dimensional array regular distribution, by the driving for controlling the one or more oscillators being sent in array Electric signal, to obtain the ideal sound field on room and time.Wherein have a design standard be oscillator and oscillator center away from From the half that should be equal to or less than wavelength, to avoid there is undesirable sound field graing lobe.Therefore, more high-frequency transducing is made Device, the spacing of layered transducer elements is with regard to smaller, that is to say, that array density is higher.
Any kind of energy converter, all has how electrode draws.Several hundred a oscillators of array energy transducer, it is each The signal electrode and ground electrode of a oscillator are required to be reliably connected and can be worked normally, and wherein signal electrode needs independent separate Connection, it is not possible to be shorted.Density is higher, the more array energy transducer of array number, and the difficulty of Manufacturing Techniques is bigger.Therefore, Electrode connection is a ring the most key in high-performance array energy transducer manufacturing process.
In the various methods that electrode is drawn, welding lead method is that industry quotes relatively broad method.Using this side Method, each oscillator require independent welding electrode lead, when oscillator quantity is up to several hundred a, the extremely time-consuming consumption of welding Power.And when oscilaltor density is very high, when oscillator width very little, to become extremely difficult in oscillator surface welding lead.Moreover, welding There are a drawback, the high temperature of welding to be easy to cause the depolarization of piezoelectric material, piezoelectric property is caused to lose for method.This method is Through the needs for being unable to satisfy the development of energy converter manufacturing technology level.
For example, in one embodiment of the invention, the one-dimensional array energy converter of centre frequency 15MHz, oscillator distribution Spacing is 0.1mm, and oscillator quantity is 256.Because oscillator width is minimum, and there are many oscillator quantity, therefore using traditional The method of welding lead cannot achieve.
And if FPC uses single sided lead, lead center spacing is equal to oscillator center spacing, i.e. 0.1mm, in this way FPC the limitation of current FPC technology working ability can not be produced.
Summary of the invention
The technical problem to be solved in the present invention is that: when overcoming existing ultra-high density arrays energy converter oscillator quantity more, Welding lead extremely takes time and effort, and in the very difficult defect of oscillator surface welding lead, proposes that a kind of ultra-high density arrays change The signal electricity of whole piezoelectric vibrators can conveniently and reliably be connected using a piece of flexible printed circuit board (i.e. FPC) for energy device Pole and oscillator ground electrode, do not need welding lead, do not need that lead is in addition arranged in oscillator ground electrode, so as to realize height yet The quick industrialized production of density array energy converter batch.
In order to solve the above-mentioned technical problem, the present invention proposes a kind of following technical proposal: ultra-high density arrays energy converter, packet Include flexible printed circuit board, piezoelectric material layer, matching material layer;
Flexible printed circuit board includes front surface, rear surface;
Left and right both ends in front surface are located at left and right both ends in front surface respectively at least provided with a preceding ground lead Several front signal leads are abreast equipped between preceding ground lead;
Left and right both ends in rear surface are located at left and right both ends in rear surface respectively at least provided with ground lead after one Several rear signal leads are abreast equipped between ground lead afterwards;
Preceding ground lead, front signal lead, rear ground lead, rear signal lead top be all located at flexible printed circuit board Top surface on;
Piezoelectric material layer includes left earthing block, several piezoelectric vibrators, right earthing block;
Left earthing block, several piezoelectric vibrators, right earthing block from left to right along it is arranged in a straight line and be fixed on flexible printing electricity On the top surface of road plate;
There are certain intervals between left earthing block and a leftmost piezoelectric vibrator;
It has fallen fillet between the top and bottom of left earthing block, has all been wrapped at the top surface of left earthing block, bottom surface and rounded corner It is covered with conduction bound edge made of conductive material, conductive bound edge is used as left side ground electrode;
There are certain intervals between two adjacent piezoelectric vibrators;
The top surface of each piezoelectric vibrator is equipped with oscillator ground electrode, and bottom surface is equipped with signal electrode;
There are certain intervals between right earthing block and a piezoelectric vibrator of rightmost;
It has fallen fillet between the top and bottom of right earthing block, has all been wrapped at the top surface of right earthing block, bottom surface and rounded corner It is covered with conduction bound edge made of conductive material, conductive bound edge is used as right side ground electrode;
The bottom surface of matching material layer is conductive, and matching material layer is fixed on left earthing block, the vibration of several piezoelectricity On the top surface of sub, right earthing block;
The left side ground electrode of matching material layer and left earthing block, the right side ground electrode of right earthing block and several piezoelectricity shake The oscillator ground electrode of sub- top surface all realizes circuit connection;
The left side ground electrode and flexible printed circuit board of left earthing block are located at the preceding ground lead and rear ground lead of left end Realize circuit connection;
The right side ground electrode and flexible printed circuit board of right earthing block are located at the preceding ground lead and rear ground lead of right end Realize circuit connection;
The odd number signal electrode of number and several rear signal leads realize circuit connection from left to right, count from left to right Even number signal electrode and several front signal leads realize circuit connection;Or the even number signal counted from left to right Electrode and several rear signal leads realize circuit connection, from left to right the odd number signal electrode and several front signals of number Lead realizes circuit connection.
The above technical solution is further limited in that the left and right both ends in front surface be respectively provided with one it is above-mentioned before Ground lead, the left and right both ends in rear surface are respectively provided with an above-mentioned rear ground lead.
Compared with prior art, the present invention has following the utility model has the advantages that ultra-high density arrays energy converter of the present invention, uses one Piece flexible printed circuit board (i.e. FPC) is electric signal electrode and the oscillator of whole piezoelectric vibrators can conveniently and reliably be connected Pole, does not need welding lead, does not need that lead is in addition arranged in oscillator ground electrode yet, so as to realize high density arrays transducing The quick industrialized production of device batch.
Detailed description of the invention
Fig. 1 is the perspective view of ultra-high density arrays energy converter (part-structure) of the present invention.
Fig. 2 is the perspective view of the piezoelectric vibrator of single of the present invention.
Fig. 3 is the partial enlarged view of Fig. 1.
Fig. 4 is the partial enlarged view (indicating electrode) of Fig. 1.
Specific embodiment
A kind of ultra-high density arrays energy converter referring to FIG. 1 to FIG. 4, comprising flexible printed circuit board (FPC) 1, Piezoelectric material layer 2, matching material layer 3.
Flexible printed circuit board 1 includes front surface 12, rear surface 14.
Left and right both ends in front surface 12 are respectively provided with a preceding ground lead 121.
It is located between two preceding ground leads 121 in front surface 12 and is abreast equipped with several front signal leads 123.
Ground lead 141 after left and right both ends in rear surface 14 are respectively provided with one.
Several rear signal leads 143 are abreast equipped with after being located at two in rear surface 14 between ground lead 141.
Preceding ground lead 121, front signal lead 123, rear ground lead 141, rear signal lead 143 top be all located at it is soft On the top surface of property printed circuit board 1.
Piezoelectric material layer 2 includes left earthing block 22, several piezoelectric vibrators 24, right earthing block 26.
Left earthing block 22, several piezoelectric vibrators 24, right earthing block 26 are from left to right along arranged in a straight line and be fixed on flexibility On the top surface of printed circuit board 1.
There are certain intervals between left earthing block 22 and a leftmost piezoelectric vibrator 24.
Fillet is fallen between the top and bottom of left earthing block 22.
It is all coated with conduction bound edge 221 made of conductive material at the top surface of left earthing block 22, bottom surface and rounded corner, is led Electric bound edge 221 is used as left side ground electrode 223.
There are certain intervals between two adjacent piezoelectric vibrators 24.
The top surface of each piezoelectric vibrator 24 is equipped with oscillator ground electrode 241, and bottom surface is equipped with signal electrode 243.
There are certain intervals between right earthing block 26 and a piezoelectric vibrator 24 of rightmost.
Fillet is fallen between the top and bottom of right earthing block 26, at the top surface of right earthing block 26, bottom surface and rounded corner It is all coated with conduction bound edge 261 made of conductive material, conductive bound edge 261 is used as right side ground electrode 263.
The bottom surface of matching material layer 3 is conductive.
Matching material layer 3 is fixed on the top surface of left earthing block 22, several piezoelectric vibrators 24, right earthing block 26.
The left side ground electrode 223 of matching material layer 3 and left earthing block 22, the right side ground electrode 263 of right earthing block 26 and The oscillator ground electrode 241 of several 24 top surfaces of piezoelectric vibrator all realizes circuit connection.
From left to right number odd number signal electrode 243 (i.e. from left to right the 1st signal electrode 243 of number, the 3rd letter Number electrode 243, the 5th signal electrode 243 ...) with several rear signal leads 143 realize circuit connections.It counts from left to right Even number signal electrode 243 (i.e. the 2nd signal electrode 243 of number, the 4th signal electrode 243, the 6th signal electricity from left to right Pole 243 ...) and several front signal leads 123 realization circuit connection.Therefore, the front surface 12 of flexible printed circuit board 1 is drawn Count signal corresponding to all odd number signal electrodes 243, the rear surface 14 of flexible printed circuit board 1 from left to right out Extraction counts signal corresponding to all even number signal electrodes 243 from left to right.
The left side ground electrode 223 of left earthing block 22 and flexible printed circuit board 1 be located at left end preceding ground lead 121 and after Ground lead 141 realizes circuit connection.
The right side ground electrode 263 of right earthing block 26 and flexible printed circuit board 1 be located at right end preceding ground lead 121 and after Ground lead 141 realizes circuit connection.
Therefore, matching material layer 3, left side ground electrode 223, right side ground electrode 263 and several 24 top surfaces of piezoelectric vibrator Oscillator ground electrode 241 and flexible printed circuit board 1 realize circuit connection.
The present invention have it is following the utility model has the advantages that
1, the signal electrode 243 that the wherein side of flexible printed circuit board 1 is used to draw on odd ordinal positions is corresponding Signal, the other side are used to draw the corresponding signal of signal electrode 243 on even ordinal positions.Because of flexible printed circuit board 1 Using the scheme of two sides lead, then two adjacent front signal leads 123 and two phases on flexible printed circuit board 1 Spacing between adjacent rear signal lead 143 is twice of center-spaced of two adjacent piezoelectric vibrators 24, therefore can be made Make the transducer array of ultra high density.Such as: in the present invention, the one-dimensional array energy converter of centre frequency 15MHz, piezoelectric vibrator 24 distribution spacing is 0.1mm, then the center spacing of the front signal lead 123 of its flexible printed circuit board 1 and rear signal The center spacing of lead 143 is all 0.2mm, this is easy to accomplish in FPC production technology.
2, left earthing block 22, the right earthing block 26 at the left and right both ends of piezoelectric material layer 2 have rounded corner, left earthing block 22, the right side The surface of earthing block 26 is all coated with conduction bound edge 221,261 made of conductive material and is used as left side ground electrode 223, right side Electrode 263 can guarantee left earthing block 22, the top and bottom of right earthing block 26 are realized and conducted, the oscillator of piezoelectric vibrator 24 Electrode 241 is connected to flexible printed circuit board by the conductive rounded corner of matching material layer 3 and left earthing block 22, right earthing block 26 1 preceding ground lead 121 and rear ground lead 141.

Claims (2)

1. a kind of ultra-high density arrays energy converter, which is characterized in that its include flexible printed circuit board, piezoelectric material layer, With material layer;
Flexible printed circuit board includes front surface, rear surface;
Left and right both ends in front surface connect before being located at left and right both ends in front surface respectively at least provided with a preceding ground lead Several front signal leads are abreast equipped between ground lead;
Left and right both ends in rear surface are located at being followed by for left and right both ends in rear surface respectively at least provided with ground lead after one Several rear signal leads are abreast equipped between ground lead;
Preceding ground lead, front signal lead, rear ground lead, rear signal lead top be all located at the top of flexible printed circuit board On face;
Piezoelectric material layer includes left earthing block, several piezoelectric vibrators, right earthing block;
Left earthing block, several piezoelectric vibrators, right earthing block are from left to right along arranged in a straight line and be fixed on flexible printed circuit board Top surface on;
There are certain intervals between left earthing block and a leftmost piezoelectric vibrator;
It has fallen fillet between the top and bottom of left earthing block, has all been coated at the top surface of left earthing block, bottom surface and rounded corner Conduction bound edge made of conductive material, conductive bound edge are used as left side ground electrode;
There are certain intervals between two adjacent piezoelectric vibrators;
The top surface of each piezoelectric vibrator is equipped with oscillator ground electrode, and bottom surface is equipped with signal electrode;
There are certain intervals between right earthing block and a piezoelectric vibrator of rightmost;
It has fallen fillet between the top and bottom of right earthing block, has all been coated at the top surface of right earthing block, bottom surface and rounded corner Conduction bound edge made of conductive material, conductive bound edge are used as right side ground electrode;
The bottom surface of matching material layer is conductive, and matching material layer is fixed on left earthing block, several piezoelectric vibrators, the right side On the top surface of earthing block;
The left side ground electrode of matching material layer and left earthing block, the right side ground electrode of right earthing block and several piezoelectric vibrator tops The oscillator ground electrode in face all realizes circuit connection;
The left side ground electrode and flexible printed circuit board of left earthing block are located at the preceding ground lead of left end and rear ground lead is realized Circuit connection;
The right side ground electrode and flexible printed circuit board of right earthing block are located at the preceding ground lead of right end and rear ground lead is realized Circuit connection;
The odd number signal electrode of number and several rear signal leads realize circuit connections from left to right, from left to right the of number Even number signal electrode and several front signal leads realize circuit connection;Or the even number signal electrode counted from left to right Circuit connection is realized with several rear signal leads, from left to right the odd number signal electrode and several front signal leads of number Realize circuit connection.
2. a kind of ultra-high density arrays energy converter according to claim 1, which is characterized in that left and right two in front surface End is respectively provided with an above-mentioned preceding ground lead, and the left and right both ends in rear surface are respectively provided with an above-mentioned rear grounding lead Line.
CN201810854702.4A 2018-07-30 2018-07-30 A kind of ultra-high density arrays energy converter Pending CN108926362A (en)

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Application Number Priority Date Filing Date Title
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Publications (1)

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CN108926362A true CN108926362A (en) 2018-12-04

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112162168A (en) * 2020-09-29 2021-01-01 上海船舶电子设备研究所(中国船舶重工集团公司第七二六研究所) Signal extraction method and system of multi-channel high-frequency receiving transducer array

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JPH07131895A (en) * 1993-11-08 1995-05-19 Toshiba Corp Two-dimensional array type ultrasonic probe and its production
JP2001309493A (en) * 2000-04-19 2001-11-02 Toshiba Corp Two-dimensional array ultrasound probe and manufacturing method therefor
JP2005012426A (en) * 2003-06-18 2005-01-13 Toshiba Corp Ultrasonic probe and manufacturing method thereof
JP2007036884A (en) * 2005-07-28 2007-02-08 Olympus Medical Systems Corp Array type ultrasonic transducer and manufacturing method thereof
CN103430394A (en) * 2011-04-18 2013-12-04 日本航空电子工业株式会社 Connector
CN104586430A (en) * 2015-01-19 2015-05-06 深圳市理邦精密仪器股份有限公司 Ultrasonic probe and manufacturing method for ultrasonic probe
CN105640588A (en) * 2014-12-03 2016-06-08 中国科学院深圳先进技术研究院 Deep brain-stimulated and nerve-regulated large-scale area array ultrasonic probe and preparation method for same
CN107107113A (en) * 2014-03-15 2017-08-29 赛威医疗公司 Thin and wearable ultrasound phased array devices
CN209252920U (en) * 2018-07-30 2019-08-16 深圳嘉瑞电子科技有限公司 A kind of ultra-high density arrays energy converter

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07131895A (en) * 1993-11-08 1995-05-19 Toshiba Corp Two-dimensional array type ultrasonic probe and its production
JP2001309493A (en) * 2000-04-19 2001-11-02 Toshiba Corp Two-dimensional array ultrasound probe and manufacturing method therefor
JP2005012426A (en) * 2003-06-18 2005-01-13 Toshiba Corp Ultrasonic probe and manufacturing method thereof
JP2007036884A (en) * 2005-07-28 2007-02-08 Olympus Medical Systems Corp Array type ultrasonic transducer and manufacturing method thereof
CN103430394A (en) * 2011-04-18 2013-12-04 日本航空电子工业株式会社 Connector
CN107107113A (en) * 2014-03-15 2017-08-29 赛威医疗公司 Thin and wearable ultrasound phased array devices
CN105640588A (en) * 2014-12-03 2016-06-08 中国科学院深圳先进技术研究院 Deep brain-stimulated and nerve-regulated large-scale area array ultrasonic probe and preparation method for same
CN104586430A (en) * 2015-01-19 2015-05-06 深圳市理邦精密仪器股份有限公司 Ultrasonic probe and manufacturing method for ultrasonic probe
CN209252920U (en) * 2018-07-30 2019-08-16 深圳嘉瑞电子科技有限公司 A kind of ultra-high density arrays energy converter

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112162168A (en) * 2020-09-29 2021-01-01 上海船舶电子设备研究所(中国船舶重工集团公司第七二六研究所) Signal extraction method and system of multi-channel high-frequency receiving transducer array

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